TWI789634B - Fabrication method of laminated structure, laminated structure and touch sensor - Google Patents

Abstract

A method for preparing a laminated structure, comprising: providing a base material; applying a flexographic printing technique to print a nano silver wire layer on the base material; and applying a flexographic printing technique to print a metal layer On the base material and the silver nano wire layer, wherein the metal layer comprises: a metal grid, which at least partially covers the base material and the silver nano wire layer; and a metal wire, which is connected with the metal grid grid connection. A laminated structure, comprising: a base material; a nano-silver wire layer; and a metal layer. The preparation method and the above-mentioned stacked structure can be applied to touch sensors.

Description

Fabrication method of laminated structure, laminated structure and touch sensor

The present invention relates to a method for preparing a laminated structure, in particular to a method for preparing a laminated structure using flexographic printing technology. The present invention also relates to a stack structure, especially a stack structure comprising a metal layer with a metal grid. The present invention also relates to a touch sensor, in particular to a touch sensor comprising the above-mentioned stacked structure.

The stacked structure including silver nanowires and metal layers can be applied to touch sensors. The preparation method of the stacked structure in the prior art is to define the routing area TA and the visible area VA through yellow light development combined with a one-time etching process of copper and nano-silver. The stacked structure of the prior art formed by the above-mentioned preparation method of the stacked structure is shown in FIG. 1 , FIG. 2 and FIG. 3 . Referring to Fig. 1 and Fig. 2, the laminated structure 10 of prior art comprises: a base material 11; A nano silver wire layer 12, it is arranged on this base material 11; And a metal layer 13, it is set On the silver nanowire layer 12 , the metal layer 13 includes a metal sheet 131 and a metal wire 132 , and part of the metal layer 13 is in direct contact with the substrate 11 . In addition, in another embodiment of the stacked structure of the prior art shown in FIG. 3, the stacked structure 10 of the prior art includes: a substrate 11; a silver nanowire layer 12, which is arranged on the substrate and a metal layer 13, which is arranged on the nano silver wire layer 12, wherein the metal layer 13 includes a metal sheet 131 and a metal wire 132, and the metal layer 13 is connected with the base material 11 all include the silver nanowire layer 12 . The stacked structure of the prior art includes: a routing area TA, which includes the metal wire 132; a first An overlapping area 15, which includes an area relatively close to the metal wire 132 in the metal sheet 131; a second overlapping area 16, which includes an area relatively far away from the metal wire 132 in the metal sheet 131; The visible area VA includes an area adjacent to one side of the metal sheet 131 covered by the silver nanowire layer 12 and not covered by the metal sheet 131 .

In the stacked structure formed by the manufacturing method of the stacked structure in the prior art, the first overlapping region 15 and the second overlapping region 16 are made of solid copper on the entire surface, and the manufacturing process is relatively cumbersome and expensive. Therefore, it is necessary to provide a novel method for preparing a laminated structure, a laminated structure and a touch sensor.

In order to improve the cumbersome and expensive manufacturing process of the stacked structure of the prior art, the present invention provides a novel stacked structure manufacturing method, stacked structure and touch sensor.

In order to achieve the above and other purposes, the present invention provides a method for preparing a stacked structure, comprising: providing a substrate; applying flexographic printing technology to print a silver nanowire layer on the substrate; and Using flexographic printing technology, printing a metal layer on the substrate and the silver nanowire layer, wherein the metal layer includes: a metal grid at least partially covering the substrate and the silver nanowire layer layer; and metal wires connected to the metal grid.

In the above preparation method, the material of the metal layer can be selected from the group consisting of copper, copper-nickel alloy, copper-lead alloy, silver, silver-nickel alloy and silver-lead alloy.

The above-mentioned preparation method, wherein, the material of the substrate can be selected from polyethylene terephthalate (polyethylene terephthalate, PET), cyclic olefin copolymer (Cyclic olefin copolymer, COP), colorless polyimide (Colorless Polyimide) , CPI), polyethylene naphthalate (Polyethylene naphthalate, PEN), polycarbonate (Polycarbonate, PC) and polyethersulfone (Polyethersulfone, PES).

In the above preparation method, the thickness of the silver nano wire layer can be greater than 0.3 μm.

The above-mentioned preparation method, wherein, the penetration (T%) of the overlapping part of the silver nano wire layer and the metal grid is less than 90%.

To achieve the above purpose and other purposes, the present invention also provides a stacked structure, comprising: a base material; a silver nanowire layer disposed on the base material; and a metal layer disposed on the base material On the substrate and the silver nanowire layer, wherein the metal layer includes: a metal grid, which at least partially covers the substrate and the silver nanowire layer; and a metal wire, which is connected to the metal grid .

In the above stacked structure, wherein the material of the metal layer is selected from the group consisting of copper, copper-nickel alloy, copper-lead alloy, silver, silver-nickel alloy and silver-lead alloy.

In the above-mentioned laminated structure, wherein the material of the base material is selected from polyethylene terephthalate (polyethylene terephthalate, PET), cyclic olefin copolymer (Cyclic olefin copolymer, COP), colorless polyimide (Colorless Polyimide, CPI), polyethylene naphthalate (Polyethylene naphthalate, PEN), polycarbonate (Polycarbonate, PC) and polyethersulfone (Polyethersulfone, PES).

In the aforementioned stacked structure, the thickness of the silver nanowire layer is greater than 0.3 μm.

In the above stacked structure, the penetration (T%) of the overlapping portion of the silver nano wire layer and the metal grid is less than 90%.

The above-mentioned stacked structure, wherein, the stacked structure includes: a routing area, which includes the metal wire; a first overlapping area, which includes the metal grid that does not cover the nano silver wire layer area; a second overlapping area, which includes the opaque area covering the silver nanowire layer in the metal grid and the two opposite sides adjacent to the metal grid covered by the silver nanowire layer and not covered by the metal grid; a visible area, which includes an area adjacent to the side of the metal grid that is covered by the nano silver wire layer and not covered by the metal grid .

In the above-mentioned stacked structure, wherein, in the second overlapping area, the proportion of the light-transmitting area is smaller than that of the opaque area, and the proportion of the light-transmitting area in the second overlapping area The proportion is less than 50%.

The above-mentioned laminated structure, wherein the total width of the first overlapping region and the second overlapping region is less than 500 μm, and the ratio of the width of the first overlapping region to the second overlapping region is 0.1 between ~10.

The above-mentioned laminated structure, wherein, the total width of the first overlapping area and the second overlapping area is between 0.5 mm and 1.0 mm, and the width of the first overlapping area and the second overlapping area The width ratio is between 0.05 and 20.

The above-mentioned laminated structure, wherein, the total width of the first overlapping area and the second overlapping area is between 1.0 mm and 1.5 mm, and the width of the first overlapping area and the second overlapping area The width ratio is between 0.03 and 30.

The above-mentioned laminated structure, wherein, the total width of the first overlapping area and the second overlapping area is between 1.5 mm and 2.5 mm, and the width of the first overlapping area and the second overlapping area The width ratio is between 0.02 and 50.

In the aforementioned stacked structure, the pitch of the metal grid in the first overlapping region is 0.1-10 times the pitch of the metal wire.

The above stacked structure, wherein the pitch of the metal wires is 20 μm, the line width is 10 μm, and the line spacing is 10 μm, and the pitch of the metal grid in the first overlapping region is between 2 μm and 200 μm .

In the above stacked structure, wherein the line width of the metal grid in the first overlapping region is between about 2 μm˜50 μm, and the line spacing is between about 2 μm˜10 μm.

In the above stacked structure, the line width/space of the metal grid in the first overlapping region is 40 μm/10 μm, 30 μm/10 μm, 20 μm/10 μm or 10 μm/10 μm.

In the above stacked structure, the line width of the metal wire is between 3 μm and 30 μm and the line pitch is between 3 μm and 30 μm.

The above-mentioned stacked structure further includes: a bonding pad disposed on the base material, including: bonding metal mesh.

To achieve the above and other purposes, the present invention also provides a touch sensor, comprising: The above-mentioned stack structure; and a covering layer, which is disposed on the metal layer in the above-mentioned stack structure.

The above-mentioned touch sensor may further include: a second nano silver wire layer, which is arranged under the substrate in the above-mentioned stacked structure; a second metal layer, which is arranged on the Under the base material and the second nano silver wire layer, wherein the second metal layer comprises: a second metal grid at least partially covering the base material and the second nano silver wire layer; and a second metal wire, which is connected with the second metal grid; and a second covering layer, which is arranged under the second metal layer.

The preparation method of the stacked structure of the present invention can simplify the manufacturing process of the stacked structure, and reduce the manufacturing cost of the stacked structure and the touch sensor including the stacked structure.

The stacked structure and the touch sensor comprising the stacked structure of the present invention can reduce the consumption of metal raw materials, so as to reduce the manufacturing cost of the stacked structure and the touch sensor comprising the stacked structure.

2: ink supply

3: Anilox roller

4: scraper

5: plate cylinder

6: Flexo

7: Printed matter

10:Stack structure

11: Substrate

12: Nano silver wire layer

13: metal layer

131: metal sheet

132: metal wire

15: The first overlapping area

16:Second overlapping area

20: Stacked structure

21: Substrate

22: Nano silver wire layer

23: metal layer

231:Metal grid

232: metal wire

25: First lap area

26:Second overlapping area

27: Opaque area

28: Translucent area

30:Stack structure

31: Substrate

32: nano silver wire layer

33: metal layer

331:Metal grid

331': Bonded metal mesh

332: metal wire

35: The first overlapping area

36:Second overlapping area

37: Opaque area

38: Translucent area

39: Joint Pad

40:Stack structure

40': Touch sensor

41: Substrate

42: nano silver wire layer

43: metal layer

431: metal mesh

432: metal wire

45: First lap area

46:Second overlapping area

47: Overlay

50:Stack structure

50': Touch sensor

51: Substrate

52: nano silver wire layer

52': The second nano silver wire layer

53: metal layer

53': second metal layer

531:Metal grid

531': second metal grid

532: metal wire

532': second metal wire

55: First lap area

56:Second overlapping area

57: Overlay

57': Second overlay

S1: step

S2: step

S3: step

TA: Trace area

VA: visible area

A-A: cross section

B-B: section

C-C: section

D-D: section

[Fig. 1] is a schematic diagram of a stacked structure of the prior art.

[Fig. 2] is a schematic cross-sectional view of a stacked structure of the prior art.

[Fig. 3] is a schematic cross-sectional view of another embodiment of the stacked structure of the prior art.

[Fig. 4] is a flowchart of the preparation method of the stacked structure of the present invention.

[FIG. 5] is a schematic diagram of an exemplary flexographic printing technique.

[Fig. 6] is a schematic diagram of the stacked structure of Embodiment 2 of the present invention.

[FIG. 7] is a schematic cross-sectional view of the stacked structure of Embodiment 2 of the present invention.

[Fig. 8] is a schematic diagram of the stacked structure of Embodiment 3.

[Fig. 9] is a schematic cross-sectional view of the stacked structure of Embodiment 3 along the A-A section.

[Fig. 10] is a schematic cross-sectional view along the B-B section of the stacked structure of Embodiment 3.

[Fig. 11] is a schematic cross-sectional view along the C-C section of the stacked structure of Embodiment 3.

[FIG. 12] is a schematic cross-sectional view along the D-D section of the stacked structure of Embodiment 3.

[FIG. 13] is a schematic diagram of the touch sensor and its manufacturing process according to Embodiment 4 of the present invention.

[FIG. 14] is a schematic diagram of the touch sensor and its manufacturing process according to Embodiment 5 of the present invention.

The implementation of the present invention is described below through specific examples, and those skilled in the art can understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

As used in the specification and the appended claims, the singular forms "a" and "the" include plural references unless otherwise stated in the context.

Unless otherwise stated in the text, the term "or" used in the specification and the appended claims includes the meaning of "and/or".

The "width" of the first overlapping area and the second overlapping area mentioned herein refers to the width of the first overlapping area and the second overlapping area on the A-A section as shown in FIG. 8 .

The "pitch" mentioned in this article refers to the shortest distance between the central axis of a metal wire and the central axis of another adjacent metal wire, or the distance between the central axis of a metal line in a metal grid and the corresponding distance. The shortest distance between the central axes of another adjacent metal line.

The "line pitch" mentioned in this article refers to the shortest distance between the edge of a metal wire and the edge of another adjacent metal wire, or the edge of a metal line in a metal grid and another adjacent metal line The shortest distance between the edges.

Example 1

Fig. 4 is a flow chart of the preparation method of the stacked structure in Example 1 of the present invention. As shown in FIG. 4 , the method for preparing the laminated structure of Example 1 of the present invention includes: providing a substrate S1; applying flexographic printing technology to print a nano silver line layer on the substrate S2; And using flexographic printing technology, a metal layer is printed on the substrate and the nano silver wire layer, wherein the metal layer includes: a metal grid, which is at least partially covering the substrate and the nano silver wire layer a line layer; and a metal wire, which is connected to the metal grid S3.

The material of the substrate used in step S1 of the preparation method of this embodiment is not particularly limited. For example, suitable materials include but are not limited to polyethylene terephthalate (polyethylene terephthalate, PET), cycloolefin Copolymer (Cyclic olefin copolymer, COP), colorless polyimide (Colorless Polyimide, CPI), polyethylene naphthalate (Polyethylene naphthalate, PEN), polycarbonate (Polycarbonate, PC) and polyether ( Polyethersulfone, PES).

In step S2 of the preparation method of this embodiment, a known flexographic printing technique is used to print a silver nanowire layer on the substrate. The thickness of the silver nanowire layer is not particularly limited, as long as it can provide proper conductivity. For example, the thickness of the silver nanowire layer can be greater than 0.3 μm.

In the step S3 of the preparation method of this embodiment, a metal layer is printed on the substrate and the silver nano wire layer by using the known flexographic printing technology. The composition of the metal layer is not particularly limited, as long as it can provide proper conductivity. For example, the material of the metal layer can be copper, copper-nickel alloy, copper-lead alloy, silver, silver-nickel alloy and/or silver-lead alloy, but the invention is not limited thereto.

The metal layer printed in step S3 of the preparation method of this embodiment includes a metal grid, which at least partially covers the substrate and the silver nanowire layer; and metal wires, which are connected to the metal grid. With the above-mentioned technical means, the stacked structure produced by the preparation method of this embodiment can have the structure described in the following embodiment 2, so that it can be applied to touch sensors.

In a preferred embodiment, the penetration (T%) of the overlapped portion of the silver nanowire layer and the metal grid in the stacked structure prepared by the preparation method of this embodiment is less than 90%.

FIG. 5 exemplarily illustrates the flexographic printing technology used in step S2 and step S3 of the preparation method of this embodiment, but the present invention is not limited thereto. As shown in Figure 5, an exemplary flexographic printing technique uses an ink feeder 2 to drop ink onto an anilox roller 3, and then scrapes off the anilox roller 3 with a doctor blade 4 Excess ink. Next, the ink on the anilox roller 3 is transferred to a flexo plate 6 on a plate cylinder (Plate cylinder) 5 . Finally, the ink on the flexographic plate 6 is transferred to the printed matter 7 to print the desired pattern on the printed matter 7 .

Example 2

FIG. 6 and FIG. 7 are schematic diagrams of the stacked structure of Embodiment 2 of the present invention. As shown in Figures 6 and 7, the stacked structure 20 of this embodiment includes: a base material 21 (not shown in Figure 6); a nano silver wire layer 22, which is arranged on the base material 21 On; a metal layer 23, which is disposed on the substrate 21 and the silver nanowire layer 22, wherein the metal layer 23 includes: a metal grid 231, which at least partially covers the substrate 21 and the nanowire layer Silver wire layer 22 ; and metal wire 232 connected to the metal grid 231 .

The stacked structure 20 of the present embodiment includes: a routing area TA, which includes the metal wire 232; a first overlapping area 25, which includes the metal grid 231 that does not cover the nano silver wire layer 22; a second overlapping area 26, which includes the opaque region 27 covering the silver nanowire layer 22 in the metal grid 231 and the metal grid 231 adjacent to the opposite sides of the metal grid 231 by the nano The light-transmitting area 28 covered by the nano silver line layer 22 and not covered by the metal grid 231; a visible area VA, which includes a side adjacent to the metal grid 231 covered by the nano silver line layer 22 The area covered and not covered by the metal grid 231 .

The material of the substrate in the stacked structure of this embodiment is not particularly limited. For example, suitable materials include but are not limited to polyethylene terephthalate (polyethylene terephthalate, PET), cycloolefin copolymer (Cyclic Olefin copolymer, COP), colorless polyimide (Colorless Polyimide, CPI), polyethylene naphthalate (Polyethylene naphthalate, PEN), polycarbonate (Polycarbonate, PC) and polyethersulfone (Polyethersulfone, PES) .

The composition of the metal layer in the stacked structure of this embodiment is not particularly limited, as long as it can provide proper conductivity. For example, the material of the metal layer can be copper, copper-nickel alloy, copper-lead alloy, silver, silver-nickel alloy and/or silver-lead alloy, but the invention is not limited thereto.

The thickness of the silver nanowire layer in the stacked structure of this embodiment is not particularly limited, as long as it can provide proper conductivity. For example, the thickness of the silver nanowire layer can be greater than 0.3 μm.

In a preferred implementation, the penetration (T%) of the overlapping portion of the silver nanowire layer and the metal grid in the stacked structure of this embodiment is less than 90%.

In a preferred implementation manner, in the second overlapping region in the stacked structure of this embodiment, the proportion of the light-transmitting region is smaller than the proportion of the opaque region, and the light-transmitting region is within The proportion of the second overlapping area is less than 50%.

In a preferred embodiment, the total width of the first overlapping region and the second overlapping region in the stacked structure of this embodiment is less than 500 μm, and the first overlapping region and the second overlapping region The ratio of the width is between 0.1 and 10.

In a preferred embodiment, the total width of the first overlapping area and the second overlapping area in the stacked structure of this embodiment is between 0.5 mm and 1.0 mm, and the first overlapping area The ratio to the width of the second overlapping area is between 0.05-20.

In a preferred embodiment, the total width of the first overlapping area and the second overlapping area in the stacked structure of this embodiment is between 1.0 mm and 1.5 mm, and the first overlapping area The ratio to the width of the second overlapping area is between 0.03-30.

In a preferred embodiment, the total width of the first overlapping area and the second overlapping area in the stacked structure of this embodiment is between 1.5 mm and 2.5 mm, and the first overlapping area The ratio to the width of the second overlapping area is between 0.02-50.

In a preferred implementation manner, the pitch of the metal grids in the first overlapping region in the stacked structure of this embodiment is 0.1-10 times the pitch of the metal wires.

In a preferred implementation manner, the pitch of the metal wires in the stacked structure of this embodiment is 20 μm, the line width is 10 μm, and the line spacing is 10 μm, and the pitch of the metal grid in the first overlapping region Between 2μm~200μm

In a preferred embodiment, the line width of the metal grid in the first overlapping region is between about 2 μm˜50 μm, and the line pitch is between about 2 μm˜10 μm.

In a preferred embodiment, the line width/space of the metal grid in the first overlapping region is 40 μm/10 μm, 30 μm/10 μm, 20 μm/10 μm or 10 μm/10 μm.

In a preferred implementation, the line width of the metal wires in the stacked structure of this embodiment is between 3 μm and 30 μm, and the line spacing is between 3 μm and 30 μm.

For example, the stacked structure of this embodiment can be prepared by the preparation method described in Embodiment 1, but the present invention is not limited thereto.

Example 3

Fig. 8, Fig. 9, Fig. 10, Fig. 11 and Fig. 12 are schematic diagrams of the stacked structure of Embodiment 3 of the present invention. As shown in Fig. 8, Fig. 9, Fig. 10, Fig. 11 and Fig. 12, the laminated structure 30 of this embodiment includes: a base material 31 (not shown in Fig. 8); a nano silver wire layer 32, It is arranged on the substrate 31; a metal layer 33 is arranged on the substrate 31 and the silver nanowire layer 32, wherein the metal layer 33 includes: a metal grid 331, which is at least Partially covering the substrate 31 and the silver nanowire layer 32 ; and a metal wire 332 connected 331 to the metal grid.

The stacked structure 30 of the present embodiment includes: a routing area TA, which includes the metal wire 332; a first overlapping area 35, which includes the metal grid 331 that does not cover the nano silver wire layer 32; a second overlapping area 36, which includes the opaque region 37 covering the silver nano wire layer 32 in the metal grid 331 and the metal grid 331 adjacent to the opposite sides of the metal grid 331 by the nano The light-transmitting area 38 covered by the nano-silver wire layer 32 and not covered by the metal grid 331; a visible area VA, which includes a side adjacent to the metal grid 331 covered by the nano-silver wire layer 32 The area covered and not covered by the metal grid 331 .

Compared with Embodiment 2, the stacked structure 30 of this embodiment further includes: a bonding pad 39 disposed on the base material 31 , including: a bonding metal grid 331 ′.

The bonding pads in this embodiment can be used as contacts for connecting with external circuits.

For example, the stacked structure of this embodiment can be prepared by the preparation method described in Embodiment 1, but the present invention is not limited thereto. In this case, the metal layer and bonding pads in the stacked structure of this embodiment can be printed simultaneously in a single flexographic printing step.

Example 4

FIG. 13 is a schematic diagram of a touch sensor and its manufacturing process according to Embodiment 4 of the present invention. As shown in FIG. 13 , the touch sensor 40 ′ of this embodiment has the stacked structure 40 as described in the second embodiment.

The stacked structure 40 in the touch sensor 40' of this embodiment includes: a base material 41; a silver nanowire layer 42, which is arranged on the base material 41; a metal layer 43, which It is arranged on the substrate 41 and the silver nanowire layer 42, wherein the metal layer 43 includes: a metal grid 431, which at least partially covers the substrate 41 and the silver nanowire layer 42; and metal The wire 432 is connected with the metal grid 431 .

The stacked structure 40 in the touch sensor 40' of this embodiment includes: a wiring area TA, which includes the metal wire 432; a first overlapping area 45, which includes the metal grid 431 The region that does not cover the silver nanowire layer 42; a second overlapping region 46, which includes the opaque area covering the silver nanowire layer 42 in the metal grid 431 and adjacent to the metal grid 431 The light-transmitting area covered by the silver nano wire layer 42 and not covered by the metal grid 431 on the opposite two sides; a visible area VA, which includes the side adjacent to the metal grid 431 and covered by the metal grid 431 The area covered by the silver nanowire layer 42 and not covered by the metal grid 431 .

Compared with Embodiment 2, the touch sensor 40 ′ of this embodiment further includes a cover layer 47 disposed on the metal layer 43 .

As shown in FIG. 13 , an exemplary manufacturing process of the touch sensor 40' of this embodiment includes providing a substrate 41; applying flexographic printing technology to print a silver nanowire layer 42 on the substrate. Material 41 On; using flexographic printing technology, a metal layer 43 is printed on the substrate 41 and the silver nanowire layer 42, wherein the metal layer 43 includes: a metal grid 431, which is at least partially covering the substrate material 41 and the silver nanowire layer 42; and metal wires 432 connected to the metal grid 431; and a covering layer 47 is set on the metal layer 43.

Example 5

FIG. 14 is a schematic diagram of a touch sensor and its manufacturing process according to Embodiment 5 of the present invention. As shown in FIG. 14 , the touch sensor 50 ′ of this embodiment has the stacked structure 50 as described in the second embodiment.

The stacked structure 50 in the touch sensor 50' of this embodiment includes: a substrate 51; a silver nanowire layer 52 disposed on the substrate 51; a metal layer 53, which It is disposed on the substrate 51 and the silver nanowire layer 52, wherein the metal layer 53 includes: a metal grid 531, which at least partially covers the substrate 51 and the silver nanowire layer 52; and metal The wire 532 is connected with the metal grid 531 .

The stacked structure 50 in the touch sensor 50' of this embodiment includes: a trace area TA, which includes the metal wire 532; a first overlapping area 55, which includes the metal grid 531 The region that does not cover the silver nanowire layer 52; a second overlapping region 56, which includes the opaque region covering the silver nanowire layer 52 in the metal grid 531 and adjacent to the metal grid 531 The light-transmitting area covered by the silver nano wire layer 52 and not covered by the metal grid 531 on the opposite two sides; a visible area VA, which includes the side adjacent to the metal grid 531 and covered by the metal grid 531 The area covered by the silver nano wire layer 52 and not covered by the metal grid 531 .

Compared with Embodiment 2, the touch sensor 50 ′ of this embodiment further includes a cover layer 57 disposed on the metal layer 53 .

Compared with Embodiment 4, the touch sensor 50' of this embodiment further includes: a second nano silver wire layer 52', which is disposed on the substrate 51 in the above-mentioned stacked structure Below; a second metal layer 53', which is disposed under the substrate 51 and the second nano silver wire layer 52', wherein the second metal layer 53' includes: a second metal grid 531', It is at least partially covering the substrate 51 and the second nano silver wire layer 52'; and the second metal wire 532', which is connected to the second metal grid 531'; and a second covering layer 57' , which is disposed under the second metal layer 53'.

As shown in FIG. 14 , an exemplary manufacturing process of the touch sensor 50' of this embodiment includes providing a substrate 51; applying flexographic printing technology, and simultaneously applying a nano silver wire layer 52 and a second The silver nano wire layer 52' is printed on both sides of the base material 51; a metal layer 53 is printed on the base material 51 and the silver nano wire layer 52 at the same time using flexographic printing technology, and the A second metal layer 53' is printed under the substrate 51 and the second nano silver wire layer 52', wherein the metal layer 53 includes: a metal grid 531 at least partially covering the substrate 51 and The silver nanowire layer 52; and metal wires 532, which are connected to the metal grid 531, and the second metal layer 53' includes: a second metal grid 531', which at least partially covers the substrate 51 and the second nano silver wire layer 52'; and the second metal wire 532', which is connected to the second metal grid 531'; and a covering layer 57 is set on the metal layer 53, and on the A second covering layer 57' is disposed under the second metal layer 53'.

Based on the above, the preparation method of the laminated structure, the laminated structure and the touch sensor of the present invention have at least the following excellent technical effects:

1. The preparation method of the laminated structure of the present invention is to use flexographic printing technology to print the nano-silver wire layer, and then use flexographic printing technology to print the metal layer, which can completely avoid the traditional cumbersome and expensive yellow photoetching process . In this way, the preparation method of the stacked structure can simplify the manufacturing process of the stacked structure and reduce the Low fabrication cost of stacked structure. The preparation method of the stacked structure of the present invention can be applied in the manufacturing process of the touch sensor, thereby reducing the manufacturing cost of the touch sensor including the stacked structure.

2. The metal layer of the stacked structure of the present invention includes a metal grid, so that the stacked structure of the present invention and the touch sensor comprising the stacked structure have a unique stacking area in the first overlapping area and the second overlapping area. structural design. Compared with the traditional metal sheet, the metal grid can reduce the consumption of metal raw materials, so as to reduce the manufacturing cost of the stacked structure and the touch sensor including the stacked structure, so as to realize the ultra-narrow frame (square) touch sensor.

The above-mentioned embodiments are only illustrative of the present invention, not intended to limit the present invention. Anyone skilled in the art can make modifications and changes to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be set forth in the scope of patent application described later.

S1: step

S2: step

S3: step

Claims (13)

A method for preparing a laminated structure, comprising: providing a base material; applying a flexographic printing technique to print a nano silver wire layer on the base material; and applying a flexographic printing technique to print a metal layer On the base material and the silver nano wire layer, wherein the metal layer comprises: a metal grid, which at least partially covers the base material and the silver nano wire layer; and a metal wire, which is connected with the metal grid grid connection; wherein, the laminated structure includes: a routing area, which includes the metal wire; a first overlapping area, which includes the area of the metal grid that does not cover the nano silver wire layer; A second overlapping area, which includes the opaque area covering the silver nanowire layer in the metal grid and the two opposite sides adjacent to the metal grid that are covered by the silver nanowire layer and not covered by the silver nanowire layer A light-transmitting area covered by the metal grid; a visible area, which includes an area adjacent to one side of the metal grid that is covered by the nano-silver wire layer and not covered by the metal grid. The preparation method according to claim 1, wherein the material of the metal layer is selected from the group consisting of copper, copper-nickel alloy, copper-lead alloy, silver, silver-nickel alloy and silver-lead alloy. The preparation method as described in Claim 1, wherein the material of the substrate is selected from polyethylene terephthalate (PET), cycloolefin copolymer (Cyclic olefin copolymer, COP), colorless polyamide A group consisting of Colorless Polyimide (CPI), Polyethylene naphthalate (PEN), Polycarbonate (PC) and Polyethersulfone (PES). The preparation method according to claim 1, wherein the thickness of the silver nanowire layer is greater than 0.3 μm. A stacked structure, comprising: a substrate; a silver nanowire layer, which is arranged on the substrate; a metal layer, which is arranged on the substrate and the silver nanowire layer, wherein The metal layer includes: a metal grid, which at least partially covers the substrate and the silver nanowire layer; and a metal wire, which is connected to the metal grid, wherein the stacked structure includes: a wiring Area, which includes the metal wire; a first overlapping area, which includes the area of the metal grid that does not cover the silver nanowire layer; a second overlapping area, which includes the metal grid an opaque area covering the silver nanowire layer and a light-transmitting area covered by the silver nanowire layer and not covered by the metal grid adjacent to opposite sides of the metal grid; a visible area, It includes an area adjacent to one side of the metal grid that is covered by the nano-silver wire layer and not covered by the metal grid. The laminated structure according to claim 5, wherein, in the second overlapping region, the proportion of the transparent area is smaller than the proportion of the opaque area, and the transparent area is in the second overlapping area. The proportion of the overlapping area is less than 50%. The laminated structure according to claim 5, wherein the total width of the first overlapping region and the second overlapping region is less than 500 μm, and the width of the first overlapping region and the second overlapping region The ratio is between 0.1 and 10. The laminated structure according to claim 5, wherein, the total width of the first overlapping area and the second overlapping area is between 1.5 mm and 2.5 mm, and the first overlapping area and the second overlapping area The ratio of the widths of the two overlapping areas is between 0.02-50. The stacked structure according to claim 5, wherein the pitch of the metal grid in the first overlapping region is 0.1-10 times the pitch of the metal wire. The laminated structure as claimed in item 5, wherein the line width of the metal wire is between 3 μm and 30 μm and the line pitch is between 3 μm and 30 μm. The stacked structure according to claim 5, further comprising: a bonding pad disposed on the substrate, including: a bonding metal grid. A touch sensor, comprising: a stacked structure as described in any one of claims 5 to 11; and a covering layer, which is arranged on the over the metal layers in the stacked structure. The touch sensor as described in claim 12, further comprising: a second silver nanowire layer, which is disposed on the substrate in the stacked structure as described in any one of claims 5 to 11 Below; a second metal layer, which is disposed under the substrate and the second nano silver wire layer, wherein the second metal layer comprises: a second metal grid, which at least partially covers the substrate and the second silver nanowire layer; and a second metal wire connected to the second metal grid; and A second covering layer is disposed under the second metal layer.

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