TWI789175B - Maintenance method of plating equipment - Google Patents

Abstract

The present invention provides a technique capable of suppressing deformation of a film arranged inside a plating tank. The maintenance method of the plating device includes: after returning the anolyte in the anode chamber to the anolyte tank, circulating the anolyte between the anolyte tank and the anode chamber (step S10e); and returning the catholyte in the cathode chamber to the catholyte tank , after the anolyte starts to circulate between the anolyte tank and the anode compartment, the catholyte is circulated between the catholyte tank and the cathode compartment (step S10f).

Description

Maintenance method of plating equipment

The invention relates to a method for maintaining a coating device.

Conventionally, a so-called cup-type plating apparatus has been known as a plating apparatus for performing a plating process on a substrate (for example, refer to Patent Document 1 and Patent Document 2). Such a coating device has a coating tank. The inside of the coating tank is divided into an anode chamber below the membrane and a cathode chamber above the membrane by the membrane. An anode is arranged in the anode chamber, and a substrate serving as a cathode is arranged in the cathode chamber. In addition, during the plating process of forming a plated film on the substrate, the anolyte (plating solution) stored in the anolyte tank is circulated between the anolyte tank and the anode chamber, and the cathode stored in the catholyte tank is The liquid (plating solution) circulates between the catholyte tank and the cathode chamber. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-19496 [Patent Document 2] Specification of US Patent No. 6821407

(Problem to be solved by the invention)

In the above-mentioned cup-type plating device, for example, when the substrate has not been plated, the maintenance of the plating device will be performed. Specifically, in the maintenance of the plating device, for example, the anolyte remaining in the anode chamber of the coating tank is returned to the anolyte tank, and the anolyte is circulated between the anolyte tank and the anode chamber, or the The catholyte remaining in the cathode chamber of the coating tank is returned to the catholyte tank, and the catholyte is circulated between the catholyte tank and the cathode chamber. However, there is still room for improvement in the maintenance of such a coating apparatus from the viewpoint of suppressing deformation of the film disposed inside the coating tank.

One object of the present invention is to provide a technology capable of suppressing deformation of a film arranged inside a plating tank in view of the above circumstances. (a means of solving a problem) (pattern 1)

In order to achieve the above object, the maintenance method of a plating device of the present invention includes: returning the anolyte remaining in the anolyte compartment divided into the anode chamber below the membrane in the coating tank to the anolyte tank for storing the anolyte; The catholyte remaining in the catholyte that is divided into the catholyte above the membrane above the aforementioned coating tank is returned to the catholyte tank for storing the catholyte; Circulating between the aforementioned anolyte tank and the aforementioned anode compartment; and after returning the catholyte remaining in the aforementioned cathode compartment to the aforementioned catholyte tank, and after the anolyte starts to circulate between the aforementioned anolyte tank and the aforementioned anode compartment, make The catholyte circulates between the aforementioned catholyte tank and the aforementioned cathode chamber.

When this mode is adopted, since the circulation of the anolyte between the anolyte tank and the anode chamber starts before the circulation of the catholyte between the catholyte tank and the cathode chamber, the pressure of the anode chamber can be increased more than that of the cathode chamber. The pressure rise starts first. Thereby, for example, compared with the case where the circulation of the catholyte is performed earlier than the circulation of the anolyte, and the pressure rise of the cathode chamber starts earlier than the pressure rise of the anode chamber, it is possible to suppress the pressure of the membrane disposed inside the plating tank from passing through the cathode chamber. and deformed downward. (state 2)

The above state 1 may further include when the liquid level of the anolyte stored in the anolyte tank does not reach the preset specified level, the liquid level of the anolyte stored in the anolyte tank exceeds the specified level. In this way, the anolyte supplied from the anolyte supply device is replenished to the aforementioned anolyte tank. (state 3)

In the above-mentioned aspect 2, the anolyte is circulated between the anolyte tank and the anode chamber, and the anolyte stored in the anolyte tank after the anolyte remaining in the anode chamber is returned to the anolyte tank Executed when the liquid level exceeds the previously specified level. (state 4)

Any one of the above-mentioned conditions 1 to 3 may further include that when the liquid level of the catholyte stored in the catholyte tank does not reach the preset specified level, using the catholyte stored in the catholyte tank When the liquid level exceeds the predetermined level, the catholyte supplied from the catholyte supply device is replenished to the catholyte tank. (state 5)

The above aspect 4 may further include when the liquid level of the catholyte stored in the catholyte tank exceeds the aforementioned specified level, before the catholyte is circulated between the catholyte tank and the cathode chamber, making the catholyte stored in the aforementioned catholyte tank The catholyte in the catholyte tank returns to the catholyte tank after bypassing the cathode chamber.

In this aspect, the amount of air bubbles contained in the catholyte can be reduced by allowing the catholyte to bypass the cathode chamber and then return to the catholyte tank. Thereby, when the catholyte is circulated between the catholyte tank and the cathode chamber, the amount of air bubbles contained in the catholyte supplied to the cathode chamber can be reduced. (pattern 6)

In any one of the above-mentioned aspects 1 to 5, when the anolyte is circulated between the anolyte tank and the anode chamber, the anolyte tank is used to flow from the anolyte tank to the anode chamber by a thermostat. The temperature of the anolyte is adjusted to the specified temperature range.

In this aspect, the temperature of the anolyte flowing from the anolyte tank toward the anode chamber can be set within a predetermined temperature range at an early stage. (state 7)

In any one of the above-mentioned aspects 1 to 6, it may also include that when the catholyte is circulated between the aforementioned catholyte tank and the aforementioned cathode chamber, the thermoregulator will move from the aforementioned catholyte tank to the aforementioned cathode chamber. The temperature of the circulating catholyte is adjusted to the specified temperature range.

In this aspect, the temperature of the catholyte flowing from the catholyte tank toward the cathode chamber can be set within a predetermined temperature range at an early stage.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the drawings are schematically shown for easy understanding of features, and the dimensional ratios and the like of each component are not necessarily the same as the actual ones. In addition, the orthogonal coordinates of X-Y-Z are shown in some drawings for reference. In the orthogonal coordinates, the Z direction corresponds to the upper side, and the −Z direction corresponds to the lower side (the direction in which gravity acts).

FIG. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 according to this embodiment. FIG. 2 is a plan view showing the overall configuration of a plating apparatus 1000 according to this embodiment. As shown in Figures 1 and 2, the plating device 1000 is equipped with: a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dipping module 300, a plating module 400, a cleaning Module 500 , spin dryer 600 , conveying device 700 , and control module 800 .

The loading port 100 is a module for carrying substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 or carrying substrates out of the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring substrates, and is configured to receive and receive substrates between the loading port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 receive and receive substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrate can be performed through a temporary stand (not shown).

The aligner 120 is a module used to align the positions of the orientation planes or notches of the substrate in a predetermined direction. In this embodiment, two aligners 120 are arranged in a row in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wetting module 200 wets the plated surface of the substrate before the plating process with a treatment solution such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment solution. The pre-wetting module 200 is configured to perform pre-wetting treatment for easily supplying the plating solution to the inside of the pattern by replacing the treatment solution inside the pattern with the plating solution during plating. In this embodiment, two pre-humidity modules 200 are arranged vertically, but the number and arrangement of the pre-humidity modules 200 are arbitrary.

The prepreg module 300 is configured to perform, for example, an oxide film with high resistance formed on the surface of the seed layer of the plated surface of the substrate before the plating process, etch and remove it with a treatment solution such as sulfuric acid or hydrochloric acid, and then the plated The surface of the substrate is cleaned or activated with a pre-dip treatment. In this embodiment, two prepreg modules 300 are arranged vertically, but the number and arrangement of prepreg modules 300 are arbitrary. The plating module 400 performs plating treatment on the substrate. In this embodiment, there are 2 sets of 12 coating modules 400 arranged in an up-and-down direction and 4 units in a horizontal direction, and a total of 24 coating modules 400 are provided. The number and configuration of the modules 400 are arbitrary.

The cleaning module 500 is configured to perform cleaning treatment on the substrate so as to remove the plating solution and the like remaining on the substrate after the plating treatment. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of cleaning modules 500 are arbitrary. The spin dryer 600 is a module for drying the cleaned substrate by rotating it at high speed. In this embodiment, two spin dryers 600 are arranged vertically, but the number and arrangement of spin dryers 600 are arbitrary. The transfer device 700 is a device for transferring substrates between a plurality of modules in the coating device 1000 . The control module 800 is configured as a plurality of modules for controlling the plating apparatus 1000, and can be configured by a general computer or a dedicated computer having an input/output interface with an operator, for example.

An example of a series of plating processes performed by the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are loaded into the load port 100 . Next, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of the orientation flats and notches of the substrate in a predetermined direction. The transfer robot 110 receives and receives the substrate aligned by the aligner 120 to the transfer device 700 .

The transport device 700 transports the substrates received by the transport robot 110 to the pre-wetting module 200 . The pre-wet module 200 performs pre-wet treatment on the substrate. The transfer device 700 transfers the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg treatment on the substrate. The transport device 700 transports the prepreg-treated substrate to the coating module 400 . The plating module 400 performs plating treatment on the substrate.

The transfer device 700 transfers the plated substrate to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transfer device 700 transfers the cleaned substrate to the spin dryer 600 . The spin dryer 600 performs drying treatment on the substrate. The transfer device 700 receives and receives the dried substrate to and from the transfer robot 110 . The transfer robot 110 transfers the substrate received by the transfer device 700 to the cassette of the loading port 100 . Finally, the cassette containing the substrate is carried out from the loading port 100 .

In addition, the structure of the plating apparatus 1000 demonstrated in FIG. 1 and FIG. 2 is just an example, and the structure of the plating apparatus 1000 is not limited to the structure of FIG. 1 and FIG. 2.

Next, the plating module 400 will be described. In addition, since the several plating modules 400 which the plating apparatus 1000 of this embodiment has have the same structure, one plating module 400 is demonstrated.

FIG. 3 is a diagram schematically showing the surrounding configuration of one coating tank 10 of the coating module 400 in the coating device 1000 of the present embodiment. The coating device 1000 of this embodiment is a cup-type coating device. The plating module 400 of the plating apparatus 1000 of this embodiment includes: a plating tank 10 , a substrate holder 20 , a rotating mechanism 22 , and a lifting mechanism 24 .

In addition, in the present embodiment, one plating module 400 includes a plurality of plating tanks 10 . The number of the plurality of plating tanks 10 should be two or more, and the specific number is not particularly limited. An example of this embodiment is that one plating module 400 is provided with four plating tanks 10 (see FIG. 4 described later).

As shown in FIG. 3 , the plating tank 10 is constituted by a bottomed container having an opening above. Specifically, the plating tank 10 has: a bottom wall 10a; an outer peripheral wall 10b extending upward from the outer edge of the bottom wall 10a; and an upper opening of the outer peripheral wall 10b. In addition, the shape of the outer peripheral wall 10b of the coating tank 10 is not specifically limited, An example of the outer peripheral wall 10b of this embodiment has a cylindrical shape. The plating solution Ps is stored inside the plating tank 10 . An overflow tank 19 for storing the plating solution Ps overflowing from the upper end of the outer peripheral wall 10b is disposed outside the outer peripheral wall 10b of the coating tank 10 .

The plating liquid Ps should just contain the ion of the metal element which comprises a plating film easily, and the specific example is not specifically limited. In this embodiment, an example of the plating treatment is a copper plating treatment, and an example of the plating solution Ps is a copper sulfate solution.

In addition, in this embodiment, a predetermined plating additive is contained in the plating solution Ps. As a specific example of the specified plating additive, "non-ionic plating additive" is used in this embodiment. In addition, the term "nonionic plating additive" refers to an additive that does not exhibit ionic properties in the plating solution Ps.

An anode 13 is disposed inside the coating tank 10 . In addition, the anode 13 is arranged so as to extend in the horizontal direction. The specific type of the anode 13 is not particularly limited, and may be an insoluble anode or a soluble anode. An example of the anode 13 of this embodiment uses an insoluble anode. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, and the like can be used.

An ion resist 14 is arranged in the cathode chamber 12 described later inside the plating tank 10 . Specifically, the ion resister 14 is provided in the cathode chamber 12 above the film 40 described later and below the substrate Wf. The ion resister 14 can be a member that resists ion movement in the cathode chamber 12, and is provided for uniformizing the electric field formed between the anode 13 and the substrate Wf.

The ion resister 14 of the present embodiment is constituted by a plate member having a plurality of through holes 15 provided to penetrate the lower surface and the upper surface of the ion resister 14 . The plurality of through-holes 15 are provided in the hole formation region of the ion resister 14 (one example of this embodiment is a circular region in plan view). The specific material of the ion resister 14 is not particularly limited, but one example in this embodiment is to use a resin such as polyetheretherketone.

Since the plating module 400 has the ion resister 14, the film thickness of the plating film (plating layer) formed on the substrate Wf can be made uniform. However, the ion resister 14 is not an essential member in this embodiment, and the plating module 400 may be configured without the ion resister 14 .

A film 40 is arranged inside the plating tank 10 . The inside of the coating tank 10 is divided by the membrane 40 : the anode chamber 11 below the membrane 40 ; and the cathode chamber 12 above the membrane 40 . The aforementioned anode 13 is arranged in the anode chamber 11 , and the ion resister 14 is arranged in the cathode chamber 12 . In addition, when the plating process is performed on the substrate Wf, the substrate Wf is placed in the cathode chamber 12 .

In addition, in this embodiment, the plating solution Ps supplied to the anode chamber 11 is called "anolyte", and the plating solution Ps supplied to the cathode chamber 12 is called "cathode solution".

The film 40 is formed by allowing the ionic species (including metal ions) contained in the plating solution Ps to pass through the film 40 and inhibiting the non-ionic plating additives contained in the plating solution Ps from passing through the film 40. membrane. Specifically, the film 40 has a plurality of fine pores (micropores) (illustration of these fine pores is omitted). The average diameter of the plurality of pores is a nanometer size (that is, a size of not less than 1 nm and not more than 999 nm). Thereby, ionic species (which are nanometer-sized) including metal ions are allowed to pass through the plurality of micropores of the membrane 40, and in addition, non-ionic plating additives (which are larger than the nanometer size) are prevented from passing through the plurality of micropores of the membrane 40. hole. As such a membrane 40, for example, an ion exchange membrane can be used.

As in this embodiment, since the coating module 400 is provided with the film 40 , the non-ionic plating additive contained in the catholyte in the cathode chamber 12 can be suppressed from moving to the anode chamber 11 . Thereby, consumption of plating additives in the cathode chamber 12 can be reduced.

Moreover, as shown in FIG. 3 as an example, the film 40 may have the inclined part 41 inclined to the horizontal direction. Specifically, the inclined portion 41 of the film 40 shown in FIG. 3 is inclined to the horizontal direction, and is inclined so as to be located upward as it goes from the central side of the coating tank 10 toward the side of the outer peripheral wall 10b of the coating tank 10. . In addition, an example of the film 40 shown in FIG. 3 has a "V-shaped" appearance shape when viewed from the front.

However, the structure of the film 40 is not limited to the above-mentioned structure. For example, the film 40 may extend horizontally as a whole without the inclined portion 41 .

The substrate holder 20 holds the substrate Wf serving as the cathode so that the surface to be plated (lower surface) of the substrate Wf faces the anode 13 . The substrate holder 20 is connected to a rotation mechanism 22 . The rotation mechanism 22 is a mechanism for rotating the substrate holder 20 . The rotating mechanism 22 is connected to the lifting mechanism 24 . The elevating mechanism 24 is supported by a pillar 26 extending in the vertical direction. The elevating mechanism 24 is a mechanism for elevating the substrate holder 20 and the rotating mechanism 22 . The actions of the rotating mechanism 22 and the lifting mechanism 24 are controlled by the control module 800 . In addition, the substrate Wf and the anode 13 are electrically connected to a power supply device (not shown). The energizing device is a device for passing current between the substrate Wf and the anode 13 when the plating process is performed.

The coating tank 10 is provided with: an anode chamber supply port 16 a for supplying the anolyte to the anode chamber 11 ; and an anode chamber discharge port 16 b for discharging the anolyte from the anode chamber 11 . An example of the supply port 16a for an anode chamber of the present embodiment is arranged on the bottom wall 10a of the plating tank 10 . An example of the discharge port 16b for an anode chamber is arrange|positioned at the outer peripheral wall 10b of the coating tank 10. As shown in FIG. In addition, as an example of the discharge port 16b for an anode chamber, it is provided in two places of the coating tank 10. As shown in FIG.

In addition, a supply and discharge port 17 for the cathode chamber 12 is provided in the coating tank 10 . The supply and discharge port 17 is a combination of "supply port for catholyte" and "discharge port for catholyte".

That is, when the catholyte is supplied to the cathode chamber 12 , the supply and discharge port 17 functions as a "supply port for catholyte", and the catholyte is supplied to the cathode chamber 12 from the supply and discharge port 17 . In addition, the catholyte is discharged from the cathode chamber 12. For example, when the catholyte in the cathode chamber 12 is emptied, the supply and discharge port 17 functions as a "cathode liquid discharge port", and the catholyte is discharged from the supply and discharge port 17. .

In addition, the configuration of the supply/discharge port 17 is not limited to the configuration described above. When another example is given, the plating module 400 may be individually provided with a "supply port for catholyte" and a "discharge port for catholyte" instead of the supply/discharge port 17 .

An example of the supply and discharge port 17 of this embodiment is arranged on the outer peripheral wall 10b of the coating tank 10 such that the distance from the bottom (bottom surface) of the cathode chamber 12 to the supply and discharge port 17 is less than 20 mm, for example.

The overflow tank 19 is provided with an overflow tank discharge port 18 for discharging the plating solution Ps (catholyte) overflowing from the cathode chamber 12 and stored in the overflow tank 19 to the outside of the overflow tank 19 .

The coating tank 10 is provided with: a pressure gauge 80 a for detecting the pressure (Pa) of the anode chamber 11 ; and a pressure gauge 80 b for detecting the pressure (Pa) of the cathode chamber 12 . The detection results of the pressure gauge 80a and the pressure gauge 80b are sent to the control module 800 .

The control module 800 includes: a processor 801 and a permanent memory device 802 . Programs, data, and the like are stored in the memory device 802 . In the control module 800 , the processor 801 controls the action of the coating device 1000 according to the instructions of the program stored in the memory device 802 .

When performing the plating process on the substrate Wf, first, the rotating mechanism 22 rotates the substrate holder 20, and the elevating mechanism 24 moves the substrate holder 20 downward, so that the substrate Wf is immersed in the plating solution Ps ( catholyte in cathode chamber 12). Next, a current is passed between the anode 13 and the substrate Wf by means of an energization device. Thereby, a plating film is formed on the surface to be plated of the substrate Wf.

FIG. 4 is a schematic diagram showing a liquid circulation structure of a coating module 400 . As shown in Figure 4, the coating module 400 has: tanks 50, 51, pumps 52a, 52b, thermostats 53a, 53b, filter 54, anolyte supply device 57a, catholyte supply device 57b, additive supply device 57c, a metal ion supply device 57d, a plurality of flow paths (flow paths 70a to 70g4), a plurality of valves (valve 75a to 75o), and a plurality of flow path switching valves (flow path switching valves 77a to 77d, etc.).

In addition, as an example of this embodiment, four plating tanks 10 (plating tanks 10 of #1 to #4) are applied to one set of tanks 50 and 51 . That is, in the present embodiment, an example of the number of plating tanks 10 communicating with one set of tanks 50 and 51 via flow paths is four. However, the number of plating tanks 10 applicable to one set of tanks 50 and 51 should just be plural, and may be less than four or may be more than that.

A plurality of valves (valve 75a～75o) can be used to switch at least the valve closed state (valve opening is 0% state, and the flow of liquid through the valve is zero state); and the valve open state (valve opening is 0% state); % large state, and the flow rate of the liquid through the valve is greater than zero state) flow regulating valve.

In addition, these multiple valves can also be used to continuously or stepwise adjust the valve opening within the range of 0% and below 100% (that is, the flow through the valve is between zero and below the specified value). Flow adjustment valve.

In addition, the plurality of valves and the plurality of flow path switching valves may also be valves controlled by the control module 800, or may also be manual valves operated manually. In this embodiment, the plurality of valves and the plurality of flow switching valves are controlled by the control module 800 .

Tank 50 is a tank for storing anolyte. The tank 50 communicates with the anode chamber 11 . Tank 51 is a tank for storing catholyte. The tank 51 communicates with the cathode chamber 12 . In addition, the tank 50 is an example of the "anolyte tank", and the tank 51 is an example of the "catholyte tank".

The tank 50 is provided with a liquid level detector 81 a for detecting the liquid level of the anolyte stored in the tank 50 . In addition, a liquid level detector 81b for detecting the liquid level of the catholyte stored in the tank 51 is also disposed in the tank 51 . The detection results of the liquid level detectors 81 a and 81 b are sent to the control module 800 .

The pump 52 a is a pump for pressure-feeding the anolyte in the tank 50 toward the anode chamber 11 . The pump 52 b is a pump for pressure-feeding the catholyte in the tank 51 toward the cathode chamber 12 . The actions of the pumps 52a, 52b are controlled by the control module 800 . In addition, the pump 52a is an example of "anolyte pumping", and the pump 52b is an example of "catholyte pumping".

The thermostat 53a is a device for adjusting the temperature of the anolyte. The thermostat 53b is a device for adjusting the temperature of the catholyte. An example of the thermostat 53a of this embodiment is arranged on the downstream side of the flow path 70a from the pump 52a. An example of the thermostat 53b of this embodiment is arranged on the downstream side of the flow path 70c from the pump 52b. The actions of the thermostats 53a and 53b are controlled by the control module 800 .

As shown in FIG. 5 , the filter 54 is a device for filtering the catholyte flowing from the tank 51 toward the cathode chamber 12 . The filter 54 is arranged, for example, downstream of the thermostat 53b in the flow path 70c described later.

In addition, the number of filters included in the coating module 400 is not limited to one, but may be two or more. Alternatively, the coating module 400 may also be configured without a filter.

The anolyte supply device 57a is a device for supplying anolyte. The anolyte supplied by the anolyte supply device 57a may also be unused anolyte (that is, new anolyte), or anolyte used in plating treatment. The catholyte supply device 57b is a device for supplying catholyte. The catholyte supplied by the catholyte supply device 57b may also be unused catholyte (that is, new catholyte), or catholyte used in plating treatment.

The specific structure of the anolyte supply device 57a is not particularly limited. For example, the anolyte supply device 57a may also include: a tank for storing the anolyte for supply; The pumping of the anolyte. The specific structure of the catholyte supply device 57b is not particularly limited. For example, the catholyte supply device 57b may also be provided with: a tank for storing catholyte for supply; Pumping of catholyte. The operation of the anolyte supply device 57 a and the catholyte supply device 57 b in this embodiment is controlled by the control module 800 .

The additive supply device 57c is a device for supplying plating additives. In this embodiment, the additive supply device 57c is used when replenishing the plating additive to the plating solution Ps. Specifically, an example of the additive supply device 57 c of this embodiment is used when replenishing the plating additive in the catholyte in the tank 51 . The operation of the additive supply device 57c in this embodiment is controlled by the control module 800 .

The metal ion supply device 57d is a device for supplying metal ions. The metal ion supply device 57d of this embodiment is used when replenishing metal ions in the plating solution Ps. Specifically, an example of the metal ion supply device 57d of this embodiment is used when replenishing a solution containing metal ions (one example is copper ions) to the catholyte in the tank 51 . The operation of the metal ion supply device 57d in this embodiment is controlled by the control module 800 .

The flow path 70 a communicates with the tank 50 , the pump 52 a and the anode chamber 11 of each plating tank 10 . Moreover, the temperature regulator 53a is arrange|positioned in the flow path 70a of this embodiment. The flow path 70a of this embodiment is branched into a plurality of lines at the downstream side of the thermostat 53a, and becomes a flow path 70a1, a flow path 70a2, a flow path 70a3, and a flow path 70a4, and communicates with each of the coating tanks 10. Anode chamber 11.

The downstream end of the flow path 70a1 communicates with the supply port 16a for the anode chamber of the coating tank 10 of #1. The downstream end of the flow path 70a2 communicates with the supply port 16a for the anode chamber of the coating tank 10 of #2. The downstream end of the flow path 70a3 communicates with the supply port 16a for the anode chamber of the coating tank 10 of #3. The downstream end of the flow path 70a4 communicates with the supply port 16a for the anode chamber of the coating tank 10 of #4.

The flow paths 70b1 , 70b2 , 70b3 , and 70b4 are flow paths configured to return the anolyte in the anode chamber 11 of each plating tank 10 to the tank 50 .

Specifically, the flow path 70b1 of the present embodiment is branched into two at the upstream side of the designated position, and communicates with the two anode chamber discharge ports 16b of the #1 coating tank 10 . The downstream end of the flow path 70b1 communicates with the tank 50 . The part of the flow path 70b2 on the upstream side of the designated position is branched into two, and communicated with the two anode chamber discharge ports 16b of the coating tank 10 of #2. The downstream end of the flow path 70b2 communicates with the tank 50 .

The part of the flow path 70b3 on the upstream side of the designated part is branched into two, and communicates with the two anode chamber discharge ports 16b of the coating tank 10 of #3. The downstream end of the flow path 70b3 communicates with the tank 50 . The part of the flow path 70b4 on the upstream side of the designated part is branched into two, and communicates with the two anode chamber discharge ports 16b of the coating tank 10 of #4. The downstream end of the flow path 70b4 communicates with the tank 50 .

The flow path 70c communicates with the tank 51, the pump 52b, and the cathode chamber 12 of each plating tank 10. In addition, the temperature regulator 53b and the filter 54 are arrange|positioned in the flow path 70c of this embodiment. The flow path 70c of the present embodiment is branched into a plurality of flow paths 70c1, 70c2, 70c3, and 70c4 at the downstream side of the filter 54.

The downstream end of the flow path 70c1 is connected to the supply/discharge port 17 of the coating tank 10 of #1. The downstream end of the flow path 70c2 is connected to the supply/discharge port 17 of the coating tank 10 of #2. The downstream end of the flow path 70c3 is connected to the supply/discharge port 17 of the coating tank 10 of #3. The downstream end of the flow path 70c4 is connected to the supply/discharge port 17 of the coating tank 10 of #4.

The flow paths 70d1 , 70d2 , 70d3 , and 70d4 are flow paths configured to return the catholyte in the overflow tank 19 of each plating tank 10 to the tank 51 . Specifically, the upstream end of the flow path 70d1 communicates with the overflow tank discharge port 18 of the coating tank 10 of #1, and the downstream end communicates with the tank 51 . The upstream end of the flow path 70d2 is connected to the discharge port 18 for overflow tank of the coating tank 10 of #2, and the downstream end is connected to the tank 51 . The upstream end of the flow path 70d3 communicates with the discharge port 18 for an overflow tank of the coating tank 10 of #3, and the downstream end communicates with the tank 51 . The upstream end of the flow path 70d4 communicates with the discharge port 18 for an overflow tank of the coating tank 10 of #4, and the downstream end communicates with the tank 51 .

The flow paths 70e1 , 70e2 , 70e3 , and 70e4 are flow paths configured such that the catholyte bypasses the cathode chamber 12 and then returns to the tank 51 . Specifically, the upstream end of the flow path 70e1 communicates with the middle of the flow path 70c1 via the flow path switching valve 77a, and the downstream end communicates with the groove 51 . The upstream end of the flow path 70e2 communicates with the middle of the flow path 70c2 via the flow path switching valve 77b, and the downstream end communicates with the groove 51. The upstream end of the flow path 70e3 communicates with the middle of the flow path 70c3 via the flow path switching valve 77c, and the downstream end communicates with the tank 51 . The upstream end of the flow path 70e4 communicates with the middle of the flow path 70c4 via the flow path switching valve 77d, and the downstream end communicates with the groove 51.

The flow path 70g1 is a flow path configured so that the anolyte supplied from the anolyte supply device 57a flows into the tank 50 . Specifically, the upstream end of the flow path 70g1 communicates with the anolyte supply device 57 a , and the downstream end communicates with the tank 50 . The flow path 70g2 is a flow path configured such that the catholyte supplied from the catholyte supply device 57b flows into the tank 51 . Specifically, the upstream end of the flow path 70g2 communicates with the catholyte supply device 57b , and the downstream end communicates with the tank 51 .

The flow path 70g3 is a flow path configured such that the plating additive supplied from the additive supply device 57c flows into the tank 51 . The flow path 70g4 is a flow path configured such that a solution containing metal ions supplied from the metal ion supply device 57d flows into the tank 51 .

The flow path 70 f is a flow path (communication flow path) configured so as to communicate with the groove 50 and the groove 51 . Specifically, the flow path 70f of the present embodiment is designed to communicate with the middle part of the flow path 70a (the part upstream of the valve 75a described later) and the middle part of the flow path 70c (the part upstream of the valve 75j described later). constituted in a manner.

A valve 75k for opening and closing the flow path 70f is arranged in the flow path 70f. When the valve 75k is opened, the groove 50 and the groove 51 are communicated with each other via the flow path 70f. Also, when the valve 75k is in the closed state, the tank 50 and the tank 51 are in a non-communicative state.

When adopting this embodiment, when the anolyte and the catholyte are plating solutions with different components, by closing the valve 75k to close the flow path 70f, the anolyte in the tank 50 will not interfere with the cathode in the tank 51. liquid mix. In addition, for example, when the anolyte and the catholyte are plating solutions using the same composition, by opening the valve 75k to open the flow path 70f, the tank 50 and the tank 51 are communicated, and the tank 50 and the tank 51 can also be connected. 51 plays the function of a large plating solution tank.

The valve 75a is arranged on the upstream side of the pump 52a in the flow path 70a and downstream of the portion connected to the flow path 70f in the flow path 70a.

The valve 75b is arranged in the flow path 70a1. The valve 75c is arranged in the flow path 70a2. The valve 75d is arranged in the flow path 70a3. The valve 75e is arranged in the flow path 70a4.

The valve 75f is arranged in the flow path 70b1. The valve 75g is arranged in the flow path 70b2. The valve 75h is arranged in the flow path 70b3. The valve 75i is arranged in the flow path 70b4.

The valve 75j is arranged on the upstream side of the pump 52b in the flow path 70c and downstream of the portion connected to the flow path 70f in the flow path 70c. The valve 75l is arranged in the flow path 70g1. The valve 75m is arranged in the flow path 70g2. The valve 75n is arranged in the flow path 70g3. The valve 75o is arranged in the flow path 70g4.

The flow path switching valve 77a is arranged in the portion of the flow path 70c1 where the flow path 70e1 is connected. The flow path switching valve 77a switches the flow destination of the fluid in the flow path 70c1 between the flow path 70e1 and the anode chamber 11 of the #1 plating tank 10 . The flow path switching valve 77b is arranged in the portion of the flow path 70c2 where the flow path 70e2 is connected. The flow path switching valve 77b switches the flow destination of the fluid in the flow path 70c2 between the flow path 70e2 and the anode chamber 11 of the plating tank 10 of #2.

The channel switching valve 77c is disposed at a portion of the channel 70c3 where the channel 70e3 is connected. The flow path switching valve 77c switches the flow destination of the fluid in the flow path 70c3 between the flow path 70e3 and the anode chamber 11 of the #3 plating tank 10 . The channel switching valve 77d is disposed at a portion of the channel 70c4 where the channel 70e4 is connected. The flow path switching valve 77d switches the flow destination of the fluid in the flow path 70c4 between the flow path 70e4 and the anode chamber 11 of the #4 plating tank 10 .

In addition, so-called three-way valves can be used as the flow path switching valves 77a, 77b, 77c, and 77d.

FIG. 5 is a flowchart for explaining an example of a state of liquid circulation in the plating module 400 . Among the steps in FIG. 5 , the plating solution circulation step in step S20 is performed when the substrate Wf is plated. In addition, step S10 is performed during maintenance of the plating apparatus 1000 . That is, step S10 corresponds to the maintenance method of the plating apparatus 1000 . In addition, each step in FIG. 5 can also be automatically executed by the control module 800 according to the instruction of the program, for example. ＜＜Plating solution circulation steps＞＞

First, the plating solution circulation step of step S20 in FIG. 5 will be described. In the plating solution circulation step of step S20 , the anolyte is circulated between the tank 50 and the anode chamber 11 , and the catholyte is circulated between the tank 51 and the cathode chamber 12 . (anode cycle)

Specifically, when circulating the anolyte, the pump 52a is driven and the valves 75a, 75b, 75c, 75d, 75e, 75f, 75g, 75h, and 75i are opened. Thereby, the anolyte in the tank 50 flows in the flow channel 70a, continues to flow in the flow channels 70a1, 70a2, 70a3, and 70a4, and flows into the anode chambers 11 of the coating tanks 10 of #1 to #4. Then, the anolyte in the anode chambers 11 of the coating tanks 10 of #1 to #4 flows through the flow paths 70b1, 70b2, 70b3, and 70b4 and returns to the tank 50.

In addition, the flow paths 70 a , 70 a 1 , 70 a 2 , 70 a 3 , and 70 a 4 are examples of “anolyte supply flow paths” for supplying the anolyte in the tank 50 to the anode chamber 11 . In addition, the flow paths 70b1 , 70b2 , 70b3 , and 70b4 are examples of “anolyte return flow paths” for returning the anolyte in the anode chamber 11 to the tank 50 . In addition, the anolyte supply flow path and the anolyte return flow path are examples of the “anolyte circulation flow path” for circulating the anolyte between the tank 50 and the anode chamber 11 . (cathode cycle)

In addition, when circulating the catholyte, specifically, the pump 52b is driven and the valve 75j is opened. Further, the flow path switching valves 77a, 77b, 77c, and 77d are switched in such a way that the catholyte flows into the cathode chamber 12 that, after the catholyte in the tank 51 flows in the flow path 70c, it continues to flow through the flow paths 70c1, 70c2, 70c3, and 70c4. Flow in and flow into the cathode chamber 12 of the coating tank 10 of #1～#4. The catholyte overflowed from the cathode chamber 12 and flowed into the overflow tank 19 flows through the flow paths 70d1 , 70d2 , 70d3 , and 70d4 and returns to the tank 51 .

In addition, the flow paths 70 c , 70 c 1 , 70 c 2 , 70 c 3 , and 70 c 4 are examples of “catholyte supply flow paths” for supplying the catholyte in the tank 51 to the cathode chamber 12 . In addition, the flow paths 70d1, 70d2, 70d3, and 70d4 are examples of "catholyte return flow paths" for returning the catholyte in the cathode chamber 12 to the tank 51. In addition, the catholyte supply channel and the catholyte return channel are examples of the "catholyte circulation channel" that circulates the catholyte between the tank 51 and the cathode chamber 12 .

In addition, in step S20, the temperature of the anolyte can also be adjusted within a specified temperature range by the thermostat 53a. Similarly, the catholyte can also be adjusted within a specified temperature range by the thermostat 53b. Specific values of these temperature ranges are not particularly limited, but as an example, a range of 30°C to 70°C can be used, more specifically, a range of 40°C to 60°C can be used.

When adopting this embodiment, since each coating module 400 is equipped with a plurality of coating tanks 10, and in each coating module 400, anolyte is formed to circulate between the anode chamber 11 and the tank 50 of the plurality of coating tanks 10 , and the catholyte circulates between the cathode chamber 12 and the tank 51 of a plurality of plating tanks 10, so the circulation of the anolyte and catholyte in one plating module 400 is the same as that of other plating modules 400 The circulation of the anolyte and catholyte is carried out independently. Thereby, maintenance of a part of the plating module 400 can be performed independently from other plating modules 400 . Specifically, for example, maintenance of a part of the plating module 400 may be performed while the plating process on the substrate Wf is performed in another plating module 400 .

In addition, during the execution of step S20, the pressures of the anode chambers 11 of the coating tanks 10 of #1 to #4 can also be adjusted by adjusting the valves 75f, 75g, 75h, and 75i. When giving an example, for example, the pressures of the anode chambers 11 of the coating tanks 10 of #1 to #4 can be formed to be the same as the pressures of the cathode chambers 12 of the coating tanks 10 of #1 to #4, respectively, to adjust valves 75f, 75g, 75h, 75i.

Specifically, for example, by reducing the valve opening of the valve 75f, the flow rate of the anolyte passing through the valve 75f is reduced, and the pressure of the anode chamber 11 of the #1 coating tank 10 can be increased. In addition, by increasing the valve opening degree of the valve 75f, the flow rate of the anolyte passing through the valve 75f is increased, so that the pressure of the anode chamber 11 of the coating tank 10 of #1 can be reduced. Thus, by adjusting the valve opening of the valve 75f within the range of 0% to 100%, the pressure of the anode chamber 11 of the #1 coating tank 10 can be adjusted. Thereby, the pressure of the anode chamber 11 and the pressure of the cathode chamber 12 of the coating tank 10 of #1 can be set to the same value.

Similarly, by adjusting the valve opening of the valve 75g to adjust the pressure of the anode chamber 11 of the coating tank 10 of #2, the pressure of the anode chamber 11 can be formed to be the same as the pressure of the cathode chamber 12. In addition, by adjusting the valve opening of the valve 75h to adjust the pressure of the anode chamber 11 of the coating tank 10 of #3, the pressure of the anode chamber 11 can be made to be the same as the pressure of the cathode chamber 12. In addition, by adjusting the valve opening of the valve 75i to adjust the pressure of the anode chamber 11 of the #4 coating tank 10, the pressure of the anode chamber 11 can be made to be the same as the pressure of the cathode chamber 12.

In addition, the pressures of the anode chambers 11 of the coating tanks 10 of #1 to #4 can be obtained based on the detection results of the pressure gauge 80a, for example. In addition, the pressures of the cathode chambers 12 of the coating tanks 10 of #1 to #4 can be obtained, for example, according to the detection results of the pressure gauge 80b. ＜＜Preparation and treatment of liquid medicine＞＞

Next, the liquid medicine preparation process in step S10 in FIG. 5 will be described. Step S10 is performed before the plating process is performed on the substrate Wf. Specifically, step S10 of this embodiment is executed before step S20. Fig. 6 is a flow chart for explaining the liquid medicine preparation process in detail. (Anolyte and catholyte recovery step (step S10a))

In the chemical solution preparation process, first, the "anolyte recovery step" of returning the anolyte remaining in the anode chambers 11 of the plurality of plating tanks 10 to the tank 50 connected to the anode chambers 11 is performed. In addition, the "catholyte recovery step" of returning the catholyte remaining in the cathode chambers 12 of the plurality of coating tanks 10 to the tank 51 connected to the cathode chambers 12 is performed.

Specifically, in the anolyte recovery step, the valves 75f, 75g, 75h, and 75i are opened to allow the anolyte in each anode chamber 11 to flow through the flow paths 70b1 and 70b2 while the pump 52a is stopped. , 70b3, 70b4 circulate, and return to the tank 50 (recovery). In addition, at this time, the anolyte in the anode chamber 11 returns to the tank 50 by gravity.

In addition, in the catholyte recovery step, the flow path switching valves 77a, 77b, 77c, and 77d are switched so that the flow paths 70e1, 70e2, 70e3, and 70e4 communicate with the cathode chamber 12 while the pump 52b is stopped. , the catholyte in each of the cathode chambers 12 is returned to the tank 51 through the flow paths 70e1, 70e2, 70e3, and 70e4 (recovery). In addition, at this time, the catholyte in the cathode chamber 12 returns to the tank 51 by gravity.

In addition, in this embodiment, the anolyte recovery step can also be performed before the anolyte remaining in the anode chamber 11 is less than 10%, preferably less than 5%, more preferably less than 1% of the volume of the anode chamber 11 . Similarly, in this embodiment, the catholyte recovery step can also be performed before the catholyte remaining in the cathode chamber 12 is less than 10% of the volume of the cathode chamber 12, preferably less than 5%, more preferably less than 1%.

Specifically, in this embodiment, the anolyte recovery step can also be performed within a preset specified time. The designated time can be pre-tested, simulated, etc. to set the time when the anolyte remaining in the anode chamber 11 is less than 10% of the volume of the anode chamber 11, preferably less than 5%, more preferably less than 1%.

Similarly, in this embodiment, the catholyte recovery step can also be performed within a preset specified time. The specified time can be pre-tested, simulated, etc. to set the time when the catholyte remaining in the cathode chamber 12 is less than 10% of the volume of the cathode chamber 12, preferably less than 5%, more preferably less than 1%. (Anode and cathode liquid level determination step (step S10b))

Then, it is also possible to execute the "anolyte level determination step" of judging whether the liquid level of the anolyte stored in the tank 50 exceeds a preset designated level; Set the "cathode liquid level determination step" of the specified level. In addition, the liquid level of the anolyte in the tank 50 can be obtained according to the liquid level detector 81a, for example. The liquid level of the catholyte in the tank 51 can be obtained, for example, according to the detection result of the liquid level detector 81b.

The specific value of the "specified level" of the anolyte in the tank 50 is not particularly limited, but, for example, the minimum level at which the anolyte fills the anolyte chamber 11 and the anolyte can be circulated between the tank 50 and the anode chamber 11 can be used. Value above liquid level.

Similarly, the specific value of the "designated level" of the catholyte in the tank 51 is not particularly limited, but, for example, a catholyte can be used to fill the cathode chamber 12 with catholyte, and the catholyte can circulate between the tank 51 and the cathode chamber 12. Minimum value above liquid level. In addition, the "designated level" of the reference value of the liquid level of the anolyte in the determination tank 50 and the "designated level" of the reference value of the liquid level of the catholyte in the determination tank 51 may be the same value or different. value. (anolyte and catholyte replenishment step (step S10c))

When the liquid level of the anolyte stored in the tank 50 does not reach the specified level, it is preferable to execute the "anolyte solution" of replenishing the anolyte in the tank 50 in such a manner that the liquid level of the anolyte stored in the tank 50 exceeds the specified level. Supplementary steps". In addition, when the liquid level of the catholyte stored in the tank 51 does not reach the specified level, it is preferable to perform the "replenishment of the catholyte" in the tank 51 in such a manner that the liquid level of the catholyte stored in the tank 51 exceeds the specified level. Catholyte replenishment procedure".

Specifically, in the step of determining the level of the anolyte in the aforementioned step S10b, if it is not determined that the level of the anolyte stored in the tank 50 exceeds the specified level (when the level of the anolyte does not reach the specified level), the In the anolyte replenishment step of step S10c, the anolyte is supplied from the anolyte supply device 57a, and the valve 75l is opened. Thereby, the anolyte supplied from the anolyte supply device 57 a flows through the flow path 70 g 1 to replenish the tank 50 . This treatment is performed until the liquid level of the anolyte stored in the tank 50 exceeds a specified level.

Similarly, in the step of determining the catholyte level in the aforementioned step S10b, if it is not determined that the level of the catholyte stored in the tank 51 exceeds the specified level (when the level of the catholyte does not reach the specified level), in the step In the catholyte replenishment step of S10c, the catholyte is supplied from the catholyte supply device 57b, and the valve 75m is opened. Thereby, the catholyte supplied from the catholyte supply device 57 b flows through the flow path 70 g 2 to replenish the tank 51 . This process is performed until the liquid level of the catholyte stored in the tank 51 exceeds a specified level. (cathode bypass cycle step (step S10d))

As a result of the judgment of step S10b, when the liquid level of the catholyte stored in the tank 51 exceeds the specified level, it is advisable to execute the "cathode bypass cycle step" that makes the catholyte stored in the tank 51 bypass the cathode chamber 12 and then return to the tank 51. ". In addition, step S10d of this embodiment is performed at least before step S10f mentioned later (in FIG. 6, it is further executed before step S10e mentioned later).

Specifically, in step S10d, the pump 52b is operated, the valve 75j is opened, the other valves are closed, and the flow paths 70c1, 70c2, 70c3, 70c4 are connected to the flow paths 70e1, 70e2, 70e3, 70e4 are connected to each other to switch flow path switching valves 77a, 77b, 77c, 77d.

Thereby, the catholyte stored in the tank 51 flows through the flow path 70c, and continues to flow through the thermostat 53b and the filter 54. Then, after the catholyte circulating in the filter 54 circulates in the flow paths 70c1, 70c2, 70c3, 70c4, it continues to flow in the flow paths 70e1, 70e2, 70e3, 70e4 (that is, bypasses the cathode chamber 12 ) and return to slot 51. In addition, step S10d of this embodiment is executed at a preset designated time.

In addition, the flow paths 70c, 70c1, 70c2, 70c3, 70c4, 70e1, 70e2, 70e3, and 70e4 are used to make the catholyte stored in the tank 51 bypass flow through the cathode chamber 12 and then return to the tank 51. Road" example.

In addition, in step S10d, the thermostat 53b can also adjust the temperature of the catholyte circulating in the flow path within a specified temperature range. The specific value of the temperature range is not particularly limited, but as an example, a range of 30°C to 70°C can be used, more specifically, a range of 40°C to 60°C can be used.

When this embodiment is adopted, in the cathode bypass circulation step of step S10d, the amount of air bubbles contained in the catholyte can be reduced during the circulation of the catholyte. Thereby, when the catholyte in step S10f described later circulates between the tank 51 and the cathode chamber 12, the amount of air bubbles contained in the catholyte supplied to the cathode chamber 12 can be reduced. Thereby, for example, a large number of air bubbles can be suppressed from adhering to the ion resister 14 . (Anolyte circulation step (step S10e))

Next, in step S10e, an "anolyte circulation step" in which the anolyte is circulated between the tank 50 and the anode chamber 11 is performed. Thereby, the anode chamber 11 can be filled with anolyte.

Specifically, in step S10e, the pump 52a is operated, the valves 75a, 75b, 75c, 75d, 75e, 75f, 75g, 75h, and 75i are opened, and the other valves are closed. Thereby, the anolyte in the tank 50 flows through the flow path 70a, flows through the thermostat 53a, and then flows through the flow paths 70a1, 70a2, 70a3, and 70a4 to flow into each anode chamber 11. The anolyte flowing through the anode chamber 11 flows through the flow paths 70b1 , 70b2 , 70b3 , and 70b4 and returns to the tank 50 .

In addition, step S10e is performed at least after step S10a is completed. Specifically, step S10e of this embodiment is executed after step S10a ends, and when it is determined in step S10b that the liquid level of the anolyte stored in tank 50 exceeds a specified level, more specifically, further in step S10b Executed after S10d ends.

In step S10e, the temperature regulator 53a can also adjust the temperature of the anolyte flowing from the tank 50 toward the anode chamber 11 within a specified temperature range. The specific value of the temperature range is not particularly limited, but as an example, a range of 30°C to 70°C can be used, more specifically, a range of 40°C to 60°C can be used. With this configuration, the temperature of the anolyte flowing from the tank 50 toward the anode chamber 11 can be kept within a predetermined temperature range at an early stage. (Cathholyte circulation step (step S10f))

After step S10a ends (after the catholyte remaining in the cathode chamber 12 is returned to the tank 51), and after the anolyte circulation step of step S10e is started, the catholyte is carried out between the tank 51 and the cathode chamber 12 in step S10f The "catholyte circulation step" of the cycle. Thereby, the cathode chamber 12 can be filled with catholyte.

Specifically, in step S10f, the pump 52b is operated, and the control valve 75j is in the open state, and the other valves are in the closed state, and the catholyte flowing in the flow paths 70c1, 70c2, 70c3, and 70c4 flows into the cathode. The mode of the chamber 12 is switched by the flow path switching valves 77a, 77b, 77c, and 77d.

Thereby, the catholyte stored in the tank 51 flows through the flow path 70c, and continues to flow through the thermostat 53b and the filter 54. The catholyte flowing through the filter 54 continues to flow through the flow paths 70c1, 70c2, 70c3, 70c4, and then flows into each cathode chamber 12. The catholyte flowing through the cathode chamber 12 (specifically, the catholyte overflowing from the cathode chamber 12 and flowing into the overflow tank 19 ) circulates through the flow paths 70d1 , 70d2 , 70d3 , and 70d4 and returns to the tank 51 .

In step S10f, the thermostat 53b may also adjust the temperature of the catholyte flowing from the tank 51 toward the cathode chamber 12 to be within a specified temperature range. The specific value of the temperature range is not particularly limited, but as an example, a range of 30°C to 70°C can be used, more specifically, a range of 40°C to 60°C can be used. With this configuration, the temperature of the catholyte flowing from the tank 51 toward the cathode chamber 12 can be kept within a predetermined temperature range at an early stage.

In addition, step S10f may also be started after starting step S10e, for example, step S10e may also be continued during execution of step S10f. In other words, the anolyte circulation step of step S10e is started, and the catholyte circulation step of step S10f is started during the execution of the anolyte circulation step, and then the anolyte circulation step and the catholyte circulation step can also be performed together.

In addition, step S10f is preferably started after step S10e is started and after the anode chamber 11 is filled with anolyte. Specifically, at this time, for example, step S10f may be started after a preset specified time elapses after starting step S10e. The specified time is, for example, determined in advance for a sufficient time to fill the anode chamber 11 with the anolyte, and the time thus determined can be used.

In addition, for example, in step S10f, the plating additive may be replenished in the tank 51 (this is referred to as “additive replenishing step”). Specifically, in this additive replenishment step, the additive supply device 57c is started to supply the plating additive, and the control valve 75n is opened. Thereby, the plating additive supplied from the additive supply device 57c flows through the flow path 70g3 and replenishes the tank 51 .

In addition, for example, in performing step S10f, metal ions may be added to the tank 51 in addition to or instead of the additive replenishing step described above (this is referred to as “metal ion replenishing step”). Specifically, in this metal ion replenishment step, the metal ion supply device 57d is started to supply a solution containing metal ions, and the control valve 75o is opened. Thereby, the solution containing metal ions supplied from the metal ion supply device 57 d flows through the flow path 70 g 4 to replenish the tank 51 .

When adopting the present embodiment as described above, in the chemical solution preparation process of step S10, since the anolyte circulates between the tank 50 and the anode chamber 11 (the anolyte circulation step), compared with the catholyte in the tank 51 and the cathode chamber 12 The intermediate circulation (catholyte circulation step) starts first, so that the pressure rise of the anode chamber 11 can be started earlier than the pressure rise of the cathode chamber 12. Thereby, for example, compared with the case where the catholyte circulation step starts earlier than the anolyte circulation step, and the pressure rise of the cathode chamber 12 starts earlier than the pressure rise of the anode chamber 11, the film 40 disposed inside the coating tank 10 can be suppressed from passing through the cathode chamber 11. The pressure of the chamber 12 deforms downward.

The embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific embodiments, and various modifications and changes can be made within the scope of the present invention described in the claims.

10: Plating tank 10a: bottom wall 10b: peripheral wall 11: Anode chamber 12: Cathode chamber 13: anode 14: ion resister 15: Through hole 16a: Supply port for anode chamber 16b: Discharge port for anode chamber 17: Supply‧discharge port 18: Outlet for overflow tank 19: overflow tank 20: Substrate holder 22: Rotary mechanism 24: Lifting mechanism 26: Pillar 40: Membrane 41: Inclined part 50,51: slot 52a, 52b: pump 53a, 53b: thermostat 54: filter 57a: Anolyte supply device 57b: Catholyte supply device 57c: Additive supply device 57d: Metal ion supply device 70a~70g4: flow path 75a～75o: valve 77a, 77b, 77c, 77d: flow switching valve 70a1～70a4, 70b1～70b4, 70c1～70c4, 70d1～70d4, 70e1～70e4: flow path 80a, 80b: pressure gauge 801: Processor 802: memory device 81a, 81b: liquid level detector 400: Plating module 1000: Plating device Ps: Plating solution (anolyte, catholyte) Wf: Substrate

Fig. 1 is a perspective view showing the overall structure of a coating device in the embodiment of the present case. Fig. 2 is a plan view showing the overall structure of the coating device in the embodiment of the present case. Fig. 3 is a schematic diagram showing the surrounding composition of one plating tank of the plating module of the embodiment of the present case. Fig. 4 is a schematic diagram showing the liquid circulation structure of a coating module in the embodiment of the present case. Fig. 5 is a flow chart illustrating an example of the circulation state of the liquid in the coating module of the embodiment of the present invention. Fig. 6 is a flow chart for explaining the liquid medicine preparation process of the embodiment of the present invention in detail.

Claims (7)

A maintenance method for a plating device, comprising: Return the anolyte remaining in the anolyte chamber which is divided into the anode chamber below the membrane inside the plating tank to the anolyte tank for storing the anolyte; Let the catholyte remaining in the catholyte compartment divided into the above-mentioned film above the coating tank be returned to the catholyte tank for storing the catholyte; After the anolyte remaining in the anode chamber is returned to the anolyte tank, the anolyte is circulated between the anolyte tank and the anode chamber; and After the catholyte remaining in the cathode chamber is returned to the catholyte chamber, and after the anolyte begins to circulate between the anolyte chamber and the anode chamber, the catholyte is circulated between the catholyte chamber and the cathode chamber . The maintenance method of the plating device as claimed in claim 1, which further includes: when the liquid level of the anolyte stored in the anolyte tank does not reach the preset specified level, using the anolyte stored in the anolyte tank When the liquid level exceeds the specified level, the anolyte supplied from the anolyte supply device is replenished to the anolyte tank. The maintenance method of a plating device as claimed in claim 2, wherein the anolyte is circulated between the aforementioned anolyte tank and the aforementioned anode chamber, after the anolyte remaining in the aforementioned anolyte chamber returns to the aforementioned anolyte tank, and is stored in the aforementioned Executed when the liquid level of the anolyte in the anolyte tank exceeds the aforementioned specified level. The maintenance method of the coating device as claimed in item 1, which further includes: when the liquid level of the catholyte stored in the catholyte tank does not reach the preset specified level, using the catholyte stored in the catholyte tank When the liquid level exceeds the predetermined level, the catholyte supplied from the catholyte supply device is replenished to the catholyte tank. The maintenance method of the plating device as claimed in claim 4, which further includes: when the liquid level of the catholyte stored in the aforementioned catholyte tank exceeds the aforementioned specified level, making the catholyte between the aforementioned catholyte tank and the aforementioned cathode chamber Before inter-circulation, the catholyte stored in the catholyte tank bypasses the cathode chamber and then returns to the catholyte tank. The maintenance method of the plating device as claimed in claim 1, which includes: when the anolyte is circulated between the aforementioned anolyte tank and the aforementioned anode chamber, the anode that flows from the aforementioned anolyte tank toward the aforementioned anode chamber is transferred by a thermostat Adjust the temperature of the liquid to within the specified temperature range. The maintenance method of the coating device as claimed in claim 1, which includes: when the catholyte is circulated between the aforementioned catholyte tank and the aforementioned cathode chamber, the thermostat will flow from the aforementioned catholyte tank towards the aforementioned cathode chamber The temperature of the catholyte is adjusted to the specified temperature range.

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