TWI786824B - Semiconductor test module with temperature measurement component - Google Patents

Abstract

The present invention relates to a semiconductor test module with a temperature measurement component, which includes a chamber, a temperature measurement component, a test carrier and a probe component. The temperature measurement component is housed in the chamber and includes a hollow base, a plurality of hollow cylinders and a guide plate. Each hollow cylinder is equipped with a cylinder temperature sensing unit and is fixedly connected on the hollow base. At least one temperature sensing unit penetrates through the guide plate and is fixedly connected on the hollow base. The test carrier is carried on the chamber, and the probe assembly is located above the test carrier. The probe assembly includes a test base, a test carrier, a probe seat and probes. As such, in addition to improving the problem of the temperature sensor signal line breaking or abnormal sensing value due to long-term reciprocating pulling in the prior art, it can also reduce the generation of turbulence, maintain the temperature balance in the chamber, and measure the temperature change of the test carrier accurately.

Description

Semiconductor test module with temperature measurement components

The invention relates to a semiconductor test module with temperature measurement components, especially a semiconductor test module with temperature measurement components suitable for semiconductor element testing operations.

In the conventional technology, the test environment of the stress test process of semiconductor components can generally be adjusted and controlled for temperature and humidity. In the past, a temperature sensor was buried in the floating head of the needle test component, which can be used to sense the semiconductor. Temperature distribution of component holders.

However, the temperature sensor inside the floating head will also reciprocate up and down with the floating head, and the external temperature sensor signal line is easily pulled and displaced after long-term reciprocating action, which often causes problems such as abnormal temperature measurement and signal line breakage. In addition, the temperature and humidity of each test location in the floating design is not easy to be within the control range, and cannot be fully controlled. It is easy to cause slight errors in the test environment of each semiconductor component, and it is impossible to obtain accurate test information.

Because of this, the inventor, based on the spirit of active invention, wanted a semiconductor test module with temperature measurement components that can solve the above problems, and finally completed the present invention after several researches and experiments.

The main purpose of the present invention is to provide a semiconductor test module with a temperature measurement component. By installing a temperature measurement component in the cavity, it can not only improve the temperature sensor signal line in the prior art. In addition to the problem of abnormal sensing value, it can also reduce the generation of flocculation, maintain the temperature balance in the chamber, and accurately measure the temperature change of the test carrier plate.

To achieve the above object, the semiconductor test module with temperature measurement component of the present invention includes a cavity, a temperature measurement component, a test carrier plate and a pin test component. The temperature measurement component is accommodated in the cavity, including a hollow base, a plurality of hollow cylinders and a guide plate. Each hollow cylinder is respectively pierced with a cylinder temperature sensing unit and fixed on the hollow base. The board is pierced with at least one guide board temperature sensing unit and fixed on the hollow base. The test carrier is carried on the cavity for accommodating a plurality of semiconductor elements. The needle test component is located above the test carrier plate, and the needle test component includes a test base, a test carrier board, a test pin tester and a probe, and is used to obtain test information of a plurality of semiconductor components.

The above-mentioned column temperature sensing unit and at least one guide plate temperature sensing unit can be thermistors, which are a kind of sensor resistance, and the materials used are usually ceramics or polymers, and the resistance value changes with the change of temperature, so The measured temperature can be converted by measuring the resistance value.

A slot can be formed on the bottom surface of the above-mentioned hollow base, which is used to guide the air flow with specific temperature and humidity into the slot.

The above-mentioned hollow base includes an opening, and the opening communicates with the slot, and the opening is used to guide the airflow with specific temperature and humidity into the slot.

The above-mentioned hollow base can be provided with a plurality of screw holes communicating with slots, and each hollow cylinder and each cylinder temperature sensing unit are respectively corresponding to a plurality of semiconductor elements for measuring the temperature of the plurality of semiconductor elements.

The above-mentioned hollow base can be provided with a plurality of screw holes communicating with slots, and each hollow cylinder and each cylinder temperature sensing unit are respectively corresponding to the test carrier for measuring the temperature distribution of the test carrier.

The above-mentioned guide plate can be screwed on the hollow base; the hollow cylinder can have a bolt portion for locking on the hollow base. In this way, users can adjust the position or quantity of hollow cylinders, or replace guide plates of different specifications according to different test conditions, so as to meet the needs of customization.

There may be a distance between the above-mentioned guide plate and the test carrier plate, which is used to guide the specific temperature and humidity airflow to the plurality of semiconductor elements on the test carrier plate.

The two sides of the above-mentioned temperature measurement component can have a supporting part respectively, and an air-tight ring or an elastic layer is arranged between the supporting part and the cavity to ensure that the airflow cannot pass through the gap between the supporting part of the hollow base and the cavity. Flow through to guide airflow into and out of the slots in the hollow cylinder and hollow base.

In addition, another semiconductor test module with temperature measurement components of the present invention includes a cavity, a plurality of temperature measurement components, a test carrier plate and a pin test component. The cavity has at least one partition. A plurality of temperature measurement components are accommodated in the cavity, and each temperature measurement component is separated by a partition, including a hollow base, a plurality of hollow cylinders and a guide plate, and each hollow cylinder is respectively pierced with a column The body temperature sensing unit is fixed on the hollow base, and the guide plate is pierced with at least one guide plate temperature sensing unit and is fixed on the hollow base. The test carrier is carried on the cavity for accommodating a plurality of semiconductor elements. The needle testing component is located on the top of the test carrier, including the test base, the test carrier, the test pin tester and the probe, and is used to obtain the test information of a plurality of semiconductor components.

The cavity and the partition can form a port for guiding the air flow with specific temperature and humidity to enter and exit the plurality of temperature measuring components.

With the above two designs, the present invention can accurately measure the temperature change of the test carrier by maintaining the temperature balance in the cavity, and ensure that the relative humidity error in the cavity can be controlled within 1%, so that it can Allows micro-electromechanical system components (Micro Electro Mechanics System, MEMS) such as pressure gauges or hygrometers to be tested in a stable environment to improve the accuracy of the test.

The above summary and the following detailed description are exemplary in order to further illustrate the scope of the present invention. Other purposes and advantages of the present invention will be described in the subsequent description and illustrations.

1a-1g: Semiconductor test modules

2,2e: cavity

21: Partition

21A: port

211: air inlet

222: Exhaust port

3, 3d, 3e, 3e’, 3f, 3g: temperature measurement components

31,31': hollow base

310: opening

31A: airtight ring

31B: elastic layer

311: screw hole

312: guide port

32: hollow cylinder

320: Bolt Department

321: Column temperature sensing unit

33,33d: guide plate

331: guide plate temperature sensing unit

34: support part

35: slotting

4: Test carrier disk

40: Containment area

41: Semiconductor components

5: Needle test components

51: Test base

52: Test carrier board

53: needle measuring seat

54: Probe

D1, D2: Spacing

FIG. 1 is a cross-sectional view of a semiconductor test module with temperature measuring components according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the temperature measuring component of the first embodiment of the present invention.

Fig. 3 is a partially enlarged view of the temperature measuring component of the first embodiment of the present invention.

FIG. 4 is a schematic diagram of a three-dimensional air flow field of a semiconductor test module with a temperature measurement component according to the first embodiment of the present invention.

5A and 5B are schematic views of the cross-sectional air flow field of the semiconductor test module with temperature measurement components according to the first embodiment of the present invention.

6A and 6B are cross-sectional views of a semiconductor test module with temperature measurement components according to a second embodiment of the present invention.

FIG. 7 is a cross-sectional view of a semiconductor test module with temperature measurement components according to a third embodiment of the present invention.

FIG. 8 is a perspective view of a semiconductor test module with temperature measurement components according to a fourth embodiment of the present invention.

FIG. 9 is a cross-sectional view of a semiconductor test module with temperature measurement components according to a fourth embodiment of the present invention.

10 is a schematic diagram of a top view air flow field of a semiconductor test module with a temperature measurement component according to a fourth embodiment of the present invention.

11 is a schematic diagram of a cross-sectional air flow field of a semiconductor test module with a temperature measurement component according to a fourth embodiment of the present invention.

Fig. 12 is a perspective view of a temperature measuring component of a fifth embodiment of the present invention.

13A and 13B are cross-sectional views of a semiconductor test module with temperature measurement components according to a fifth embodiment of the present invention.

Please refer to FIG. 1 to FIG. 5B, which are respectively a cross-sectional view of a semiconductor test module with a temperature measurement component, a perspective view of a temperature measurement component, a partial enlarged view of a temperature measurement component, and a semiconductor test module according to a first embodiment of the present invention. The schematic diagram of the three-dimensional air flow field of the group and the schematic diagram of the cross-sectional air flow field of the semiconductor test module. The figure shows a semiconductor test module 1a with a temperature measurement component, including a cavity 2 , a temperature measurement component 3 , a test carrier 4 and a probe component 5 . The temperature measurement assembly 3 is accommodated in the accommodation space formed by the cavity 2, and includes a hollow base 31, a plurality of hollow cylinders 32 and a guide plate 33. In this embodiment, each hollow cylinder 32 has a The bolt part 320 is locked on the screw hole 311 of the hollow base 31, and is respectively pierced with a cylinder temperature sensing unit 321. The cylinder temperature sensing unit 321 is a thermistor, which is a sensor Resistors are usually made of ceramics or polymers, and the resistance value changes with temperature, so the measured temperature can be converted by measuring the resistance value. The guide plate 33 is screwed on the hollow base 31 and is pierced with a plurality of guide plate temperature sensing units 331. The guide plate temperature sensing units 331 are also thermistors, and the resistance value changes with the change of temperature. , so the measured temperature can be converted by measuring the resistance value.

In addition, the test carrier 4 is carried on the cavity 2, and a plurality of accommodating areas 40 are set up for accommodating a plurality of semiconductor elements 41, and the column temperature sensing unit 321 and the guide plate temperature sensing unit 331 are close to the test chamber. The test plate 4 is used to obtain the temperature change around the semiconductor element 41 . The needle test assembly 5 is located above the test carrier 4 and includes a test base 51 and a test carrier 52 disposed in the test base 51. The test carrier 52 is connected to the needle test base 53 and passes through the needle test base 53. The probe 54 pierced is used to obtain test information of a plurality of semiconductor devices 41 . Wherein, there is a distance D1 between the guide plate 33 and the test carrier 4 , which is used to guide a specific temperature and humidity airflow to the plurality of semiconductor devices 41 on the test carrier 4 . Furthermore, please refer to FIG. 4 , the two sides of the hollow base 31 in the temperature measurement assembly 3 have supporting parts 34 respectively, so that the air flow cannot flow through the supporting parts 34 of the hollow base 31 , and guide the air flow into the hollow base 31 One of the slots 35, so that the air flow can pass through the plurality of hollow cylinders 32 on the temperature measurement component 3 and the slots 35 under the hollow base 31 at the same time, so that the specific temperature and humidity air can be convected and conducted to the cylinder for temperature sensing The two ends of the unit 321 and the guide plate temperature sensing unit 331 reduce the transient temperature difference between the plurality of cylinder temperature sensing units 321 and the guide plate temperature sensing unit 331 to improve the accuracy of temperature measurement.

When the airflow of a specific temperature and humidity enters the cavity 2, since the airflow is input through the air inlet 221 and discharged from the exhaust port 222, the airflow will form a flow in one direction in the cavity 2. First, the airflow enters the air inlet 221 To the area between the guide plates 33, then the airflow begins to diffuse and flow, the guide plate 33 can be used to prevent most of the airflow from directly passing through the chamber 2, and the airflow is guided to the test carrier plate 4 and its plurality of semiconductor elements 41, thereby enabling the test The temperature and humidity of the airflow between the carrier plate 4 and the hollow base 31 are uniform and stable, and the test environment of the accelerated semiconductor element 41 is stable, so that the accuracy of the test result of the semiconductor element 41 is high.

In addition, please refer to FIG. 5A , the hollow base 31 includes an opening 310 , the opening 310 is disposed on one side of the hollow base 31 , and the opening 310 is adjacent to the cavity 2 , wherein the opening 310 is connected to the opening below the hollow base 31 The groove 35 communicates, and because there is a gap between the other side of the hollow base 31 and the cavity 2 , a guide port 312 is formed. Due to the large amount of air intake from the opening 310, the opening 310 can guide the air flow into the slot 35, so that the opening 310 forms an air intake end, and the air flow will flow from the opening 310 side of the hollow base 31 to the hollow base 31 and the cavity 2 Of The guide port 312 in between flows out, and the support portion 34 on both sides of the slot 35 is closely connected with the cavity 2, the air flow will not overflow from both ends of the support portion 34, so that the air flow enters the slot 35 with a fixed flow direction, And because the size of the guide port 312 between the hollow base 31 and the cavity 2 is smaller than the opening 310, and the air flow flows out from the opening 310 through the guide port 312 at one end of the slot 35, presenting a stable flow direction, reducing the flow of air in the cavity 2 In the case of irregular disturbances in the interior, maintain a good dynamic circulation of the airflow in the cavity 2, thereby reducing the measurement error caused by the temperature difference between the column temperature sensing unit 321 and the guide plate temperature sensing unit 331, and most of the airflow Provided to the plurality of semiconductor elements 41 on the test carrier 4, the temperature and humidity of the plurality of semiconductor elements 41 are maintained in a stable state.

Please also refer to FIG. 5B. In another preferred embodiment of the present invention, there is no opening on the hollow base 31'. When the air flow enters between the hollow base 31' and the test carrier 4, due to the The guide port 312 between the side and the cavity 2 has the same size, so the air flow through the guide port 312 on both sides has the same amount of air intake, and the guide port 312 on the two sides can guide the air flow into the slots 35 at both ends, so that the hollow base The transient temperature difference between the area of the slot 35 below the hollow base 31' and the area of the plurality of hollow cylinders 32 and the guide plate 33 above the hollow base 31' will not be too large, so as to avoid affecting the temperature sensing of the column temperature sensing unit 321 and the guide plate. The temperature measurement accuracy of the measurement unit 331 maintains the detection environment of the semiconductor element 41 in a stable state, thereby reducing the measurement error factors of the semiconductor element 41 .

Please refer to FIG. 6A and FIG. 6B , which are cross-sectional views of a semiconductor test module with a temperature measurement component according to a second embodiment of the present invention. As shown in Figure 6A, a semiconductor test module 1b is shown in the figure, and an airtight ring 31A can be added between the support part 34 of the temperature measurement component 3 and the cavity 2; as shown in Figure 6B, a semiconductor test module 1b is shown in the figure. In the test module 1c, an elastic layer 31B can be added between the support portion 34 of the temperature measurement component 3 and the cavity 2 to ensure the tight connection between the support portion 34 of the hollow base 31 and the cavity 2 so that the air flow cannot flow from The gap between the support portion 34 of the hollow base 31 and the cavity 2 flows through, so as to guide the airflow from the solid Go in and out of the slot 35 of the hollow cylinder 32 and the hollow base 31 in a fixed direction. In addition, when the probe assembly 5 presses the test carrier plate 4 for electrical testing, the airtight ring 31A or the elastic layer 31B between the temperature measurement component 3 and the cavity 2 under the test carrier plate 4 can provide a hollow column The column body temperature sensing unit 321 pierced by the body 32 and the guide plate temperature sensing unit 331 pierced in the guide plate 33 are adapted to float and touch the pressure test carrier plate 4 and the semiconductor element 41, wherein the test carrier plate 4 provides a pressure Contact with the column temperature sensing unit 321 and the guide plate temperature sensing unit 331 and stay for a predetermined time, so that the multiple column temperature sensing units 321 and the guide plate temperature sensing unit 331 can accurately measure the test carrier plate 4 and the receiving plate. The surface temperature of the semiconductor element 41 was measured.

Please refer to FIG. 7 , which is a cross-sectional view of a semiconductor test module with temperature measurement components according to a third embodiment of the present invention. The figure shows another semiconductor test module 1d with a temperature measurement component. Its basic structure is the same as that of the first embodiment, but the difference is that the temperature measurement component 3d of this embodiment can be selected according to the test requirements of the product. The height of the guide plate 33d, for example, when the thickness of different types of semiconductor elements 41 is large, a predetermined distance still needs to be reserved between the guide plate 33d and the test carrier plate 4 or the semiconductor element 41, so as to prevent the guide plate 33d from contacting the test carrier plate 4 or the semiconductor element 41. The semiconductor element 41 interferes, thereby blocking the movement of the airflow or making the passage of the airflow too small, which affects the temperature or humidity conditions of the test carrier 4 or the semiconductor element 41, so there is another gap between the guide plate 33d and the test carrier 4. The distance D2 is used to guide the specific temperature and humidity airflow to the plurality of semiconductor elements 41 on the test carrier plate 4. The length of the distance D2 can be designed to be greater than the distance D1, so that the flow rate of the airflow through the distance D2 can be increased, and further make the thicker semiconductor The element 41 has the effect of achieving rapid temperature rise or fall.

Please refer to FIG. 8 to FIG. 9 , which are respectively a perspective view and a cross-sectional view of a semiconductor test module with a temperature measurement component according to a fourth embodiment of the present invention. The figure shows yet another semiconductor test module 1e with temperature measuring components, its basic structure is the same as that of the first embodiment, the only difference is that the cavity 2e of this embodiment has a partition 21, and two sets of Temperature measurement components 3e, 3e', wherein the partition 21 is used to separate the two Sets of temperature measuring components 3e, 3e', but not limited to the above number, can also be two partitions 21 with three sets of temperature measuring components, etc., and so on.

Please refer to FIG. 10 and FIG. 11 , which are schematic diagrams of the top view air flow field and the cross-sectional air flow field of the semiconductor test module with temperature measurement components according to the fourth embodiment of the present invention. In this embodiment, the two temperature measuring components 3e, 3e' are separated by partitions 21 and accommodated in the cavity 2e. The cavity 2e includes an air inlet 221 and an exhaust port 222, wherein the air inlet The port 221 and the exhaust port 222 are arranged on opposite sides of the cavity 2e respectively, the air inlet 221 is used to provide the air flow of a specific temperature and humidity, and the exhaust port 222 has the ability to suck gas, and is used to turn the air inlet 221 The function of guiding and recovering the airflow is provided, so that the airflow generates a pressure difference in the cavity 2 e and forms a direction in which the airflow flows from the air inlet 221 to the air outlet 222 .

When the airflow enters through the air inlet 221 of the cavity 2e, it flows through the area of the temperature measurement component 3e. At this time, the support portion 34 of the hollow base 31 of the temperature measurement component 3e is closely connected with the cavity 2e or An airtight ring 31A or an elastic layer 31B is arranged between the support portion 34 and the cavity 2e, so the air flow can only pass through the area between the hollow base 31 and the test carrier 4 and the slot 35 of the hollow base 31 respectively, and the air flow After entering the cavity 2e, it first flows and diffuses between the air inlet 221 and the guide plate 33, and the air flow enters the slot 35 at the same time. The distance D1 between the test carrier plate 4 flows through, so that the airflow enters the area on the other side of the guide plate 33, and flows in the direction of the partition 21; The port 21A enters the area of the temperature measuring component 3e', where the port 21A is, for example, the gap formed between the partition 21 and the cavity 2e, or the opening on the partition 21 adjacent to the cavity 2e. At this time, the air flow According to the method of the aforementioned temperature measuring component 3e, it passes through the area of the temperature measuring component 3e', and is finally discharged from the exhaust port 222 of the cavity 2e, wherein the distance D1 between the opening 21A of the partition plate 21 and the guide plate 33 can be designed so that The airflow generates a specific flow path to reduce the occurrence of flocculation and stagnation of the airflow, and when the airflow passes through the opening 21A at different heights and the distance D1, the airflow passes through the narrow gap between the opening 21A and the distance D1 The gap will increase the flow rate of the airflow, and then the airflow can be quickly guided to the temperature measurement components 3e, 3e'. In this way, through the setting of the partition 21, the mutual influence of the transient temperature between different temperature measuring components 3e, 3e' can be effectively prevented, so as to provide an accurate testing temperature and humidity environment.

According to the spirit of the present invention, after the specific temperature and humidity airflow enters the cavity 2e, the humidity detector is used to detect the humidity value of the cavity 2e. The humidity value is, for example, in the range of 5%-95%. After checking the humidity value of each point, the error of the relative humidity value of each point in the chamber 2e after the detection is less than 1%. From this, it can be known that the structural design in the chamber 2e can ensure that the airflow is uniform in the chamber 2e The state can maintain the cavity 2e in a stable state with a specific temperature and humidity, thereby reducing the test error caused by the environmental state of the semiconductor element 41 and improving the accuracy of the test.

Please refer to FIG. 12 , FIG. 13A and FIG. 13B , which are respectively a perspective view of a temperature measurement component and a cross-sectional view of a semiconductor test module according to a fifth embodiment of the present invention. As shown in Figure 12, in this embodiment, the temperature measurement component 3f has a plurality of screw holes 311 penetrating through the slot 35 of the hollow base 31, and the positions of the plurality of screw holes 311 can correspond to those on the semiconductor test module 1f a plurality of semiconductor elements 41 placed in the test carrier 4; or, a plurality of screw holes 311 opening positions can correspond to the test carrier 4 on the semiconductor test module 1g, so that the cylinder temperature sensing in the hollow cylinder 32 The unit 321 can optionally measure the temperature of the test carrier 4 or the semiconductor device 41 . As shown in FIG. 13A , the column temperature sensing unit 321 of the temperature measurement component 3 f can be flexibly disposed on the semiconductor device 41 corresponding to the test carrier 4 to measure the temperature change of the semiconductor device 41 . Also as shown in FIG. 13B , the column temperature sensing units 321 of the temperature measurement component 3 g are inserted in an array in a specific area corresponding to the test carrier 4 to measure the temperature change of the test carrier 4 . In this way, the user can adjust the position or quantity of the hollow cylinder according to the different test conditions, or replace the guide plate with different specifications, so as to meet the needs of customized temperature measurement; or when the cylinder temperature sensing unit 321 or guide plate temperature sensing single When the element 331 needs to be repaired and replaced, the hollow cylinder 32 and the cylinder temperature sensing unit 321 or the guide plate 33 and the guide plate temperature sensing unit 331 can be replaced directly, which has the advantage of fast maintenance time.

With the above-mentioned embodiment, the present invention can not only improve the problem of the temperature sensor signal line breaking due to long-term reciprocating pull or abnormal sensing value in the conventional technology, but also reduce the generation of flocculation and maintain the temperature balance in the cavity , and can accurately measure the temperature change of the test plate, and ensure that the relative humidity error in the chamber can be controlled within 1%, so that MEMS components such as pressure gauges or hygrometers can be tested in a stable environment , to improve the accuracy of the test.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.

1a: Semiconductor test module

2: Cavity

3: Temperature measurement components

31: Hollow base

32: hollow cylinder

321: Column temperature sensing unit

33: guide plate

331: guide plate temperature sensing unit

4: Test carrier disk

40: Containment area

41: Semiconductor components

5: Needle test components

51: Test base

52: Test carrier board

53: needle measuring seat

54: Probe

D1: Spacing

Claims (12)

A semiconductor test module with a temperature measurement component, including: a cavity; a temperature measurement component, accommodated in the cavity, including a hollow base, a plurality of hollow cylinders and a guide plate, each of which The hollow cylinders are respectively pierced with a cylinder temperature sensing unit and fixed on the hollow base, and the guide plate is pierced with at least one guide plate temperature sensing unit and fixed on the hollow base; a test load A disc, carried on the cavity, for accommodating a plurality of semiconductor elements; and a pin testing component, located above the test carrier, including a test base, a test carrier connected to the test base, and a test carrier connected to the test base. A probe base of the test carrier board and a plurality of probes arranged on the probe base are used to obtain test information of the plurality of semiconductor components. The semiconductor test module with temperature measurement components as described in Claim 1, wherein the column temperature sensing unit and the at least one guide plate temperature sensing unit are thermistors. The semiconductor test module with a temperature measuring component as described in claim 1, wherein a slot is formed on the bottom surface of the hollow base, and is used to guide a specific temperature and humidity airflow to enter the slot. The semiconductor test module with a temperature measurement component as described in claim 3, wherein the hollow base includes an opening, and the opening communicates with the slot, and the opening is used to guide a specific temperature and humidity airflow into the opening groove. The semiconductor test module with temperature measurement components as described in claim 3, wherein the hollow base is provided with a plurality of screw holes communicating with the slot, and each hollow cylinder and each cylinder temperature sensor The units respectively correspond to the plurality of semiconductor elements and are used for measuring the temperature of the plurality of semiconductor elements. The semiconductor test module with temperature measurement components as described in claim 3, wherein the hollow base is provided with a plurality of screw holes communicating with the slot, and each hollow cylinder and each cylinder temperature sensor The units respectively correspond to the test carrier plates and are used for measuring the temperature distribution of the test carrier plates. The semiconductor test module with temperature measurement components as described in claim 1, wherein the guide plate is screwed to the hollow base. The semiconductor test module with temperature measurement components as described in claim 1, wherein the hollow cylinder has a bolt portion for locking on the hollow base. The semiconductor test module with temperature measurement components as described in claim 1, wherein there is a distance between the guide plate and the test carrier, to guide the airflow of specific temperature and humidity to the plurality of the test carrier semiconductor components. A semiconductor test module with a temperature measurement component as described in claim 1, wherein, the two sides of the temperature measurement component have a support part respectively, and an airtight ring or an airtight ring is arranged between the support part and the cavity Elastic layer. A semiconductor test module with temperature measurement components, including: a cavity with at least one partition; a plurality of temperature measurement components accommodated in the cavity, and each temperature measurement component is separated by the partition The spaced arrangement includes a hollow base, a plurality of hollow cylinders and a guide plate, each hollow cylinder is respectively pierced with a cylinder temperature sensing unit and fixed on the hollow base, the guide plate penetrates There is at least one guide plate temperature sensing unit fixed on the hollow base; a test carrier plate is carried on the cavity for accommodating a plurality of semiconductor elements; and A needle test component, located above the test carrier, the needle test component includes a test base, a test carrier connected to the test base, a needle test seat connected to the test carrier and arranged on the needle test The multiple probes of the socket are used to obtain the test information of the multiple semiconductor devices. The semiconductor test module with temperature measurement components as described in claim 11, wherein, the cavity and the partition form a port for guiding air flow with specific temperature and humidity to enter and exit the plurality of temperature measurement components.

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