TWI785746B - Thermal image auxiliary processing device and method thereof - Google Patents
Thermal image auxiliary processing device and method thereof Download PDFInfo
- Publication number
- TWI785746B TWI785746B TW110130622A TW110130622A TWI785746B TW I785746 B TWI785746 B TW I785746B TW 110130622 A TW110130622 A TW 110130622A TW 110130622 A TW110130622 A TW 110130622A TW I785746 B TWI785746 B TW I785746B
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal image
- temperature rise
- blank
- processing
- knife
- Prior art date
Links
Images
Abstract
Description
本發明是有關於一種加工方法,且特別是有關於一種熱影像輔助加工裝置及其方法。 The present invention relates to a processing method, and in particular to a thermal image auxiliary processing device and a method thereof.
一般而言,工具機進行加工時的刀具定位及磨耗檢測多採用人工手動與目測的方式進行,然而以此方式量測、設定刀具的進刀長度、工件尺寸及初次接觸胚料表面,會造成設備閒置的停機時間增加與目測誤差。此外,卸下刀具與工件在機台外量測,因鎖固誤差,安裝回去的刀具需重新校正長度與位置。此外,若使用光學影像辨識及量測,由於光學影像辨識容易受到光源、表面材質等環境因素影響,且需要高解析度的相機,因此在影像處理的設備上、成本上及技術上的要求相對較高。 Generally speaking, tool positioning and wear detection during machine tool processing are mostly carried out manually and visually. However, measuring and setting the cutting length of the tool, the size of the workpiece and the initial contact with the blank surface in this way will cause The downtime of equipment idling increases with visual error. In addition, the removed tool and workpiece are measured outside the machine. Due to the locking error, the length and position of the installed tool need to be re-calibrated. In addition, if optical image recognition and measurement are used, since optical image recognition is easily affected by environmental factors such as light sources and surface materials, and requires high-resolution cameras, the requirements for image processing equipment, cost, and technology are relatively high. higher.
本發明係有關於一種熱影像輔助加工方法,用以對刀具或磨具於加工前、後的輔助定位、磨耗檢測及待測物的尺寸、角度或平面度的量測。 The invention relates to a thermal image auxiliary processing method, which is used for auxiliary positioning, wear detection, and measurement of the size, angle or flatness of a tool or grinding tool before and after processing.
根據本發明的一方面,提出一種熱影像輔助加工方法,包括下列步驟。備妥一基準部件。以該基準部件建立一參考定位點或參考定位面。以該參考定位點或該參考定位面定位一待測刀具或磨具。根據一熱影像,求得一已測定位點或已測定位面。 According to one aspect of the present invention, a thermal image auxiliary processing method is proposed, which includes the following steps. Prepare a reference part. A reference positioning point or a reference positioning plane is established with the reference component. A tool or grinding tool to be tested is positioned by the reference positioning point or the reference positioning surface. According to a thermal image, a determined position or a determined plane is obtained.
根據本發明的一方面,提出一種熱影像輔助加工裝置,用以定位或量測一待測物。熱影像輔助加工裝置包括一熱影像感測模組以及一處理單元。熱影像感測模組同步監測待測物的熱溫升情形。處理單元包括一控制器,處理單元根據熱影像,監測到待測物的至少一溫升熱點時,藉由控制器進行機械座標換算以取得至少一位置座標資訊。 According to one aspect of the present invention, a thermal image auxiliary processing device is provided for positioning or measuring an object under test. The thermal image auxiliary processing device includes a thermal image sensing module and a processing unit. The thermal image sensing module synchronously monitors the thermal temperature rise of the object under test. The processing unit includes a controller. When the processing unit detects at least one hot spot of temperature rise of the object under test according to the thermal image, the controller performs mechanical coordinate conversion to obtain at least one position coordinate information.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given below, and the accompanying drawings are described in detail as follows:
100:工具機 100: machine tools
102:多軸伺服驅動馬達 102:Multi-axis servo drive motor
103:胚料(或待加工件) 103: Blank material (or workpiece to be processed)
104:刀具 104: Knife
105:修整器 105: Dresser
106:磨具 106: Abrasives
107:參考定位點(面) 107: Reference anchor point (surface)
108:預期加工位置 108: Expected processing position
108’:實際加工位置 108': actual processing position
109:基準刀的切削位置 109: Cutting position of reference knife
110:熱影像輔助加工裝置 110: Thermal image auxiliary processing device
111:砂輪 111: grinding wheel
112:處理單元 112: Processing unit
113:控制器 113: Controller
114:輸入單元 114: input unit
116:熱影像感測模組 116: Thermal image sensing module
117:精準磨削面(已測定位面) 117: Precise grinding surface (measured plane)
121:基準刀 121: Reference knife
122,123:加工刀 122,123: Processing knife
MG:熱影像 MG: thermal image
d:公差 d: Tolerance
H1,H2,H3:溫升熱點 H1, H2, H3: Hot spots of temperature rise
第1A圖繪示依照本發明一實施例的熱影像輔助加工裝置的示意圖;第1B及1C圖分別繪示依照本發明一實施例的熱影像輔助加工方法的流程圖;第2圖分別繪示依照本發明一實施例的用於刀具定位及磨耗檢測的熱影像輔助加工方法的流程圖;第3A及3B圖繪示第2圖中用於刀具(例如車刀)定位的熱影像輔助加工方法的一示例操作圖。 Figure 1A shows a schematic diagram of a thermal image auxiliary processing device according to an embodiment of the present invention; Figures 1B and 1C respectively illustrate a flow chart of a thermal image auxiliary processing method according to an embodiment of the present invention; Figure 2 shows respectively A flowchart of a thermal image-assisted processing method for tool positioning and wear detection according to an embodiment of the present invention; Figures 3A and 3B illustrate the thermal image-assisted processing method for tool (such as turning tool) positioning in Figure 2 An example operation diagram of .
第4A至4D圖分別繪示第2圖中用於刀具(例如車刀)磨耗檢測的熱影像輔助加工方法的二示例操作圖。 FIGS. 4A to 4D respectively illustrate two exemplary operation diagrams of the thermal image-aided processing method for wear detection of a tool (such as a turning tool) in FIG. 2 .
第5A及5B圖繪示第2圖中用於刀具(例如鑽頭或銑刀)定位的熱影像輔助加工方法的另一示例操作圖;第6A至6D圖分別繪示第2圖中用於刀具(例如銑刀)磨耗檢測的熱影像輔助加工方法的另二示例操作圖。 Figures 5A and 5B show another example operation diagram of the thermal image-assisted machining method used for tool (such as drill bit or milling cutter) positioning in Figure 2; Figures 6A to 6D illustrate the tool used in Figure 2 respectively Another example operation diagram of the thermal image-assisted processing method for wear detection (such as milling cutter).
第7A至7D圖分別繪示第2圖中用於刀具(例如鑽頭或銑刀)磨耗檢測的熱影像輔助加工方法的又二示例操作圖。 FIGS. 7A to 7D are respectively another two example operation diagrams of the thermal image-aided processing method for wear detection of a tool (such as a drill bit or a milling cutter) in FIG. 2 .
第8圖分別繪示依照本發明一實施例的用於磨具(例如砂輪)定位及磨耗量測的熱影像輔助加工方法的流程圖;第9A及9B圖繪示第8圖中用於磨具(例如砂輪)定位的熱影像輔助加工方法的一示例操作圖。 Figure 8 shows a flow chart of a thermal image-assisted processing method for abrasive tool (such as grinding wheel) positioning and wear measurement according to an embodiment of the present invention; An example operation diagram of a thermal image-assisted machining method for tool (eg, grinding wheel) positioning.
第10A及10B圖繪示第8圖中用於磨具(例如多邊形砂輪)定位的熱影像輔助加工方法的另一示例操作圖。 FIGS. 10A and 10B illustrate another exemplary operation of the thermal image-assisted processing method for positioning abrasive tools (eg, polygonal grinding wheels) in FIG. 8 .
第11A及11B圖繪示第8圖中用於磨具(例如砂輪)磨耗量測的熱影像輔助加工方法的一示例操作圖。 FIGS. 11A and 11B illustrate an example operation diagram of the thermal image-assisted processing method for wear measurement of abrasive tools (such as grinding wheels) in FIG. 8 .
第12A及12B圖分別繪示用於角度量測及平面度量測的熱影像輔助加工方法的二示例操作圖。 FIG. 12A and FIG. 12B show two example operation diagrams of the thermal image-assisted processing method for angle measurement and plane measurement, respectively.
現在將參考附圖更全面地描述示例實施方式。然而,示例實施方式能夠以多種形式實施,且不應被理解為限於在此闡述的範例;相反,提供這些實施方式使得本發明將更加全面和完整,並將示 例實施方式的構思全面地傳達給本領域的技術人員。所描述的特徵、結構或特性可以以任何合適的方式結合在一個或更多實施方式中。 Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will illustrate The concepts of the example embodiments are fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
此外,附圖僅為本發明的示意性圖解,並非一定是按比例繪製。圖中相同的附圖標記表示相同或類似的部分,因而將省略對它們的重複描述。附圖中所示的一些方框圖是功能實體,不一定必須與物理或邏輯上獨立的實體相對應。可以採用軟體形式來實現這些功能實體,或在一個或多個硬體模組或積體電路中實現這些功能實體,或在不同網路和/或處理器裝置和/或微控制器裝置中實現這些功能實體。 Furthermore, the drawings are merely schematic illustrations of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices these functional entities.
需要說明的是,在不衝突的情況下,本發明的實施例及不同實施例中的特徵可以相互組合。 It should be noted that, in the case of no conflict, the embodiments of the present invention and features in different embodiments can be combined with each other.
第1A圖繪示依照本發明一實施例的用於刀具104或磨具106定位及磨耗量測的熱影像輔助加工裝置110的示意圖,第1B及1C圖分別繪示依照本發明一實施例的熱影像輔助加工方法的流程圖。在本實施例中,熱影像輔助加工裝置110可用於一工具機100,工具機100包括車床、銑床、鑽床或磨床等電腦數值控制(CNC)工具機,用以對一胚料(或待加工件)103進行切削、銑削、鑽削或研磨等加工製程。使用者可經由控制器113將指令輸入至工具機100的多軸伺服驅動馬達102,以驅動刀具104或磨具106移動並對固定在機台上的胚料103進行加工,以完成一加工成品。當胚料103加工之前或加工之後,使用者還可經由控制器113輸入指令至工具機100的多軸伺服驅動馬達102,以驅動基準刀移動並對固定在機台上的胚料
103進行定位及公差量測,以確保加工後的成品公差在允許公差範圍內。或者,當磨具106研磨胚料103之前,使用者可以修整器105的尖端為參考定位點修整研磨表面,等到磨具106研磨胚料103一段時間之後,再經由修整器105對磨具106進行精準修整以及進行磨具106的磨耗檢測,以確保加工後的成品公差在允許公差範圍內。
Figure 1A shows a schematic diagram of a thermal imaging
請參照第1A圖,熱影像輔助加工裝置110用以對刀具104或磨具106於加工前、後的輔助定位及待測物(例如胚料103)的尺寸、角度或平面度的量測,熱影像輔助加工裝置110包括一熱影像感測模組116以及一處理單元112。處理單元112包括控制器113以及用以輸入指令的輸入單元114,例如是一部電腦。熱影像感測模組116以一熱影像(例如紅外線影像)同步監測胚料與刀具接觸時的熱溫升情形,而處理單元112可根據熱影像MG,判斷一溫升熱點H1最初產生時,以計算待測物的尺寸、角度、平面度,或決定刀具104與胚料103是否發生接觸。
Please refer to FIG. 1A, the thermal image
請參照第1B圖之定位量測流程,首先,在步驟S11中,備妥一基準部件,例如基準刀或修整器,在步驟S12中,以基準部件建立參考定位點(面),在步驟S13中,以參考定位點(面)定位待測的加工刀具(磨具),接著,在步驟S14中,根據熱影像中是否出現溫升熱點,以求得已測定位點(面)。如此,加工刀具(磨具)的定位量測完成,以利於後續進行量產加工。 Please refer to the positioning measurement process in Figure 1B. First, in step S11, prepare a reference component, such as a reference knife or trimmer. In step S12, establish a reference positioning point (surface) with the reference component. In step S13 , the processing tool (grinding tool) to be measured is positioned with the reference positioning point (surface), and then, in step S14, the measured position (surface) is obtained according to whether there is a temperature rise hot spot in the thermal image. In this way, the positioning measurement of the processing tool (grinding tool) is completed, so as to facilitate subsequent mass production processing.
請參照第1C圖之磨耗檢測流程,首先,在步驟S15中,以基準部件建立已測定位點(面),在步驟S16中,以已測定位點(面) 及依據指定加工指令進行循跡偏移切削,在步驟S17中,根據熱影像中是否出現溫升熱點,判斷待加工件尺寸是否符合公差標準,若不符合標準,進行步驟S18,調整磨耗值,並對待加工件進行重新加工或修正加工。若符合標準,繼續下一個量產加工。 Please refer to the wear detection process in Figure 1C. First, in step S15, the measured position (surface) is established with the reference component. In step S16, the measured position (surface) is established. And carry out tracking offset cutting according to the specified processing instructions. In step S17, according to whether there are temperature rise hot spots in the thermal image, it is judged whether the size of the workpiece to be processed meets the tolerance standard. If it does not meet the standard, proceed to step S18 to adjust the wear value. And the workpiece to be processed is reprocessed or corrected. If it meets the standard, continue to the next mass production process.
以下針對不同實施例的熱影像輔助加工方法詳細說明,其中第2圖分別繪示依照本發明一實施例之用於刀具104定位及磨耗檢測的熱影像輔助加工方法的流程圖;第3A及3B圖繪示第2圖中用於刀具104(例如車刀)定位的熱影像輔助加工方法的一示例操作圖;第4A及4D圖分別繪示第2圖中用於刀具104(例如車刀)磨耗檢測的熱影像輔助加工方法的二示例操作圖;第5A及5B圖繪示第2圖中用於刀具104(例如鑽頭或銑刀)定位的熱影像輔助加工方法的另一示例操作圖;第6A至6D圖分別繪示第2圖中用於刀具104(例如銑刀)磨耗檢測的熱影像輔助加工方法的另二示例操作圖;第7A至7D圖分別繪示第2圖中用於刀具104(例如鑽頭或銑刀)磨耗檢測的熱影像輔助加工方法的又二示例操作圖;第8圖分別繪示依照本發明一實施例的用於磨具106(例如砂輪)定位及磨耗檢測的熱影像輔助加工方法的流程圖;第9A及9B圖繪示第8圖中用於磨具106(例如砂輪)定位的熱影像輔助加工方法的一示例操作圖;第10A及10B圖繪示第8圖中用於磨具106(例如多邊形砂輪)定位的熱影像輔助加工方法的另一示例操作圖;第11A及11B圖繪示第8圖中用於磨具106(例如砂輪)磨耗檢測的熱影像輔助加工方法的一示例操作圖;第12A 及12B圖分別繪示用於角度量測及平面度量測的熱影像輔助加工方法的二示例操作圖。 The following is a detailed description of the thermal image-assisted processing method in different embodiments, wherein Figure 2 shows a flow chart of a thermal image-assisted processing method for tool 104 positioning and wear detection according to an embodiment of the present invention; Figures 3A and 3B The figure shows an example operation diagram of the thermal image-assisted processing method for positioning the tool 104 (such as a turning tool) in FIG. Two example operation diagrams of the thermal image-assisted processing method for wear detection; FIGS. 5A and 5B illustrate another exemplary operation diagram of the thermal image-assisted processing method for positioning the tool 104 (such as a drill bit or a milling cutter) in FIG. 2; Figures 6A to 6D show another example operation diagram of the thermal image-assisted processing method used in the wear detection of the tool 104 (such as a milling cutter) in Figure 2; Still another two example operation diagrams of the thermal image-assisted processing method for wear detection of a tool 104 (such as a drill bit or a milling cutter); FIG. 8 respectively depicts positioning and wear detection for a grinding tool 106 (such as a grinding wheel) according to an embodiment of the present invention A flow chart of the thermal image-assisted processing method; Figures 9A and 9B show an example operation diagram of the thermal image-assisted processing method for abrasive tool 106 (such as a grinding wheel) positioning in Figure 8; Figures 10A and 10B show Another example operation diagram of the thermal image-assisted processing method for positioning the abrasive tool 106 (such as a polygonal grinding wheel) in Fig. 8; Figs. 11A and 11B illustrate wear detection of the abrasive tool 106 (such as a grinding wheel) in Fig. 8 An example operation diagram of the thermal image-assisted processing method of ; No. 12A 12B and 12B respectively depict two example operation diagrams of the thermal image-assisted processing method for angle measurement and plane measurement.
請一併參照第2、3A及3B圖。首先,步驟S21,定位基準刀121。步驟S22,以基準刀121在一胚料103上切削,以建立一參考定位點(面)107,其中基準刀120尖端的座標為已知。步驟S23,以一加工刀122循環逼近胚料103,持續進行切削行程,但尚未接觸到胚料103。步驟S24,以熱影像感測模組106同步監測是否有熱溫升發生。若監測到溫升熱點H1,表示加工刀122剛接觸到胚料103,也即是到達了參考定位點(面)107,在步驟S25中,藉由控制器113進行機械座標換算以完成加工刀122定位(即求得已測定位點的座標)。若無監測到溫升熱點H1,回到步驟S23,持續逼近胚料103。所謂機械座標換算是指由控制器113計算加工刀122經多次循環進刀切削後所到達之位置或座標。
Please refer to Figures 2, 3A and 3B together. First, in step S21, the
請參照第3A圖,上述的基準刀121的刀尖座標位置為已知,且基準刀121完成定位之後,不參與後續的量產切削,僅做為定位用,可在幾乎無磨耗的情形下長期使用,不需每次都需經過基準刀121定位的流程。此外,基準刀121對胚料103切削時,第1圖的處理單元112可經由數值分析確定胚料103的位置及胚料103尺寸。
Please refer to Fig. 3A, the coordinate position of the tool tip of the above-mentioned
請參照第3B圖,上述的加工刀122的刀尖座標位置未知,因此先由基準刀121建立參考定位點(面)107的位置。接著,加工刀122循環逼近胚料103,直至剛接觸到胚料103產生切削(例如1μm切削厚度或更大,由進刀機構之精度而定)。此時,熱影像
MG中即時顯示加工刀122切削胚料103時所產生的溫升熱點H1,以供處理單元112之控制器113進行機械座標換算122的刀尖座標。例如,加工刀122的刀尖座標大致等於基準刀121建立的參考定位點(面)107減去同方向加工刀122逐次逼近至參考定位點(面)107的距離。最小逼近距離由工具機100的最小進給加工精度(可為1μm或更大)決定,但本發明不以此為限。
Please refer to FIG. 3B , the coordinate position of the tool nose of the above-mentioned
完成上述的加工刀122定位之後,可進一步進行加工刀122的磨耗檢測。請參照第2圖。首先,步驟S26,加工刀122開始進行量產切削,此時,加工刀122持續發生微量磨耗而減少長度,使加工刀122切削後具有一磨耗量(即加工刀122初始尺寸減去切削後的剩餘尺寸)。步驟S27,當量產切削完成後,改由基準刀121重複加工刀122的最後加工指令進行循跡偏移切削行程。例如,以基準刀121在胚料103上循跡移動並相對於胚料103的切削表面偏移一公差或一預定偏差值。步驟S28,從熱影像MG中同步監測此切削表面是否有溫升熱點H1發生。若監測到溫升熱點H1,在步驟S29中,判斷加工刀122的磨耗量大於公差(或預定偏差值),表示胚料103的尺寸公差大於偏差值,需調整磨耗值(如第1C圖的步驟S18所示),以對胚料103進行重新加工或修正加工(回到步驟S26)。若無監測到溫升熱點H1,判斷加工刀122的磨耗量小於公差(或預定偏差值),則回到步驟S26,持續進行下一輪量產切削。公差例如為加工人員對合格胚料103成品尺寸所容許的差值。
After the above-mentioned positioning of the
請一併參照第4A及4B圖,其繪示加工刀122的磨耗量小於公差d的一實施例。在本實施例中,加工刀122因多次循環加工後逐漸磨耗,使得加工刀122的實際切削量漸漸小於預期切削量,因此,有必要進行加工刀122的磨耗檢測,以確認加工刀122的磨耗量是否在允許公差範圍內(可為1μm或更大)。如第4A圖所示,當加工刀122的磨耗量尚小時,加工刀122在預期加工位置108上進行切削,接著,如第4B圖所示,基準刀121重複加工刀122的最後加工指令在胚料103上循跡移動並向外偏移一公差d,因此基準刀121的切削位置109偏離預期加工位置108,故不會接觸胚料103表面。此時並無熱溫升情形發生,故熱影像MG中無顯示切削的溫升熱點H1,表示加工刀122的磨耗量小於公差d。
Please refer to Figures 4A and 4B together, which illustrate an embodiment in which the wear amount of the
請一併參照第4C及4D圖,其繪示加工刀122的磨耗量大於公差d的一實施例。如第4C圖所示,當加工刀122的磨耗量過大時,加工刀122並非在預期加工位置108上進行切削,使得實際加工位置108’偏離預期加工位置108(大於等於公差d),接著,如第4D圖所示,基準刀121重複加工刀122的最後加工指令在胚料103上循跡移動並向外偏移一公差d,但由於加工刀122的切削量不足,故基準刀121仍會接觸胚料103表面,而在熱影像MG中顯示溫升熱點H1,表示加工刀122的磨耗量大於公差d。
Please refer to Figures 4C and 4D together, which illustrate an embodiment in which the wear amount of the
由上述的說明可知,當熱影像MG中顯示溫升熱點H1時,表示加工刀122的磨耗量超出允許公差範圍,此時,可對加工刀
122進行磨耗補正。磨耗補正可由上述第2圖中步驟S22至S25的定位量測來自動達成。
From the above description, it can be known that when the thermal image MG shows the hot spot H1 of temperature rise, it means that the wear amount of the
如第2圖所述,在步驟S29中,當尺寸公差大於偏差值時,參照步驟S22~S25,進行加工刀122的磨耗補正。類似的做法包括如下,在步驟S22,以基準刀121在胚料103上切削,以建立一新的參考定位點。在步驟S23,以加工刀122循環逼近胚料103直到切削到胚料103,在新的參考定位點上進行切削。在步驟S24,從熱影像MG中同步監測是否有溫升熱點H1。若監測到溫升熱點H1,在步驟S25中,藉由機械座標換算以進行加工刀122定位(即求得已測定位點),完成加工刀122的磨耗補正。
As described in FIG. 2 , in step S29 , when the dimensional tolerance is greater than the deviation value, refer to steps S22 to S25 to correct the wear of the
請參照第5A及5B圖,其與第3A及3B圖的熱影像輔助加工方法相似,均是用於刀具104的定位,相同或相對應的部分不再贅述,兩者差異在於:本實施例中定位的加工刀123為鑽頭或銑刀。鑽頭或銑刀可在XY平面、XZ平面或YZ平面上移動,直至接觸胚料103表面產生切削(例如1μm銑削厚度或更大)。此時,熱影像MG即時顯示加工刀123銑削胚料103時的溫升熱點H1,以供處理單元112經機械座標換算以完成加工刀123定位(即求得已測定位點)。
Please refer to Figures 5A and 5B, which are similar to the thermal image-assisted processing methods in Figures 3A and 3B, both of which are used for the positioning of the tool 104, and the same or corresponding parts will not be described again. The difference between the two lies in: this embodiment The
完成上述的加工刀123定位之後,當加工刀進行量產加工一段時間或次數後,可進一步進行加工刀123的磨耗檢測。請參照第6A至6D圖及第7A至7D圖,其與第4A至4D圖的熱影像輔助加工方法相似,均是用於加工刀123的磨耗檢測,相同或相對應的部分不再贅述,兩者差異在於:本實施例中進行磨耗檢測的加工刀123為
鑽頭或銑刀。鑽頭或銑刀因多次循環加工後逐漸磨耗(例如刀長或刀徑磨耗),使得實際切削量漸漸小於預期切削量,因此,有必要進行加工刀123的磨耗檢測,以確認加工刀123的磨耗量是否在允許公差範圍內(可為1μm或更大)。例如:如第6A及7A圖所示,當加工刀123的磨耗量尚小時,加工刀123在預期加工位置上進行銑削,接著,如第6B及7B圖所示,基準刀121重複加工刀123的最後加工指令在胚料103上循跡移動並向外偏移一公差,因此基準刀121不會接觸胚料103表面。此時,熱影像MG中無顯示切削的溫升熱點H1,表示加工刀123的磨耗量小於公差。此外,如第6C及7C圖所示,當加工刀123的磨耗量大時,加工刀123並非在預期加工位置上進行切削,使得實際加工位置108’偏離預期加工位置108,接著,如第6D及7D圖所示,基準刀121重複加工刀123的最後加工指令在胚料103上循跡移動並向外偏移一公差,但由於加工刀123的切削量不足,故基準刀121將會接觸胚料103表面,而在熱影像MG中顯示溫升熱點H1,表示加工刀123的磨耗量大於公差。
After the above-mentioned positioning of the
另外,類似於車刀的做法,後續的鑽頭或銑刀的尺寸補正可由上述第2圖中步驟S22至S25的定位量測來自動達成,在此不再贅述。 In addition, similar to the practice of the turning tool, the subsequent size correction of the drill bit or milling cutter can be automatically achieved by the positioning measurement of steps S22 to S25 in the second figure above, and will not be repeated here.
以下介紹用於磨具106(例如砂輪)定位及磨耗檢測的熱影像輔助加工方法。請參照第8圖,首先,步驟S81,定位一修整器105,修整器105的尖端的座標為已知,並以修整器105的尖端為一參考定位點。步驟S82,以砂輪111循環逼近修整器105直到接觸
修整器105。步驟S83,從一熱影像MG中同步監測是否有熱溫升發生。若監測到溫升熱點H1,表示砂輪111剛接觸到修整器105,接著,在步驟S84中,依照需求修整量進行精準修整,以建立一精準磨削面117(即已測定位面)。若無監測到溫升熱點H1,回到步驟S82,持續逼近修整器105。
The thermal image-assisted processing method for positioning and wear detection of the grinding tool 106 (such as a grinding wheel) is introduced below. Please refer to FIG. 8, firstly, step S81, positioning a
請一併參照第9A圖,上述的修整器105已定位,且修整器105的硬度及強度遠高於砂輪111,可在幾乎無磨耗的情形下長期使用,不需每次都需經過修整器105定位的流程。此外,修整器105對砂輪111修整時,處理單元112可經由控制器之數值分析確定砂輪111的精準磨削面117的位置。
Please also refer to Figure 9A, the above-mentioned
請一併參照第9B圖,以修整器105的尖端為基準,對砂輪111表面進行精準修整,以建立一精準磨削面117(即已測定位面),使砂輪111回復完整研磨力。此時,熱影像MG中即時顯示砂輪111修整的溫升熱點H1,以供處理單元112經機械座標換算以完成砂輪111定位(即求得已測定位點)。例如:砂輪111的定位由修整器刀尖座標加上控制器移動座標計算得知。
Please also refer to FIG. 9B, and use the tip of the
另外,請參照第10A及10B圖,若為多邊形砂輪的型式,同樣如上述步驟S82,以砂輪111循環逼近修整器105直到接觸修整器105,此時,接觸面為砂輪111的側表面與修整器105的側表面,接著,如上述步驟S84,砂輪表面依照需求修整量進行精準修整,以建立一精準磨削面117。
In addition, please refer to Fig. 10A and 10B, if it is the type of polygonal grinding wheel, similarly as above-mentioned step S82, approach the
完成上述的磨具106定位之後,可進一步進行磨具106的磨耗檢測。請參照第8圖。首先,步驟S85,砂輪111進行量產研磨切削,此時,砂輪111持續微量磨耗而減少砂輪111直徑,使砂輪111磨削後具有一磨耗量(即初始砂輪尺寸減去磨削後的剩餘尺寸)。步驟S86,砂輪111重複加工指令進行循跡偏移切削。例如,以砂輪111在胚料103上循跡移動並相對於胚料103的一磨削表面向外偏移一公差d或預定偏差值。步驟S87,從熱影像MG中同步監測此磨削表面是否有熱溫升發生。若監測到溫升熱點H1,在步驟S88中,判斷砂輪111的磨耗量大於公差d(或預定偏差值),表示胚料的尺寸公差大於偏差值,需調整磨耗值(如第1C圖的步驟S18),以對待加工件進行重新加工或修正加工(回到步驟S85)。若無監測到溫升熱點H1,判斷砂輪111的磨耗量小於公差d(或預定偏差值),則回到步驟S85,持續進行磨削。
After the above-mentioned positioning of the grinding tool 106 is completed, the wear detection of the grinding tool 106 can be further performed. Please refer to Figure 8. First, in step S85, the
請一併參照第11A及11B圖,其分別繪示砂輪111的磨耗量小於及大於等於公差的二實施例。在本實施例中,砂輪111因多次循環加工後逐漸磨耗,使得砂輪111的實際切削量漸漸小於預期切削量,因此,有必要進行砂輪111的磨耗檢測,以確認砂輪111的磨耗量是否在允許公差範圍內。先以修整器105對砂輪111進行精確修整,並利用控制器的移動座標取得,建立砂輪面上的參考定位面107,以參考定位面107對胚料103進行循跡偏移切削。如第11A圖所示,當砂輪111的磨耗量小時,砂輪111在胚料103上循跡移動並向外偏移一公差d,因此砂輪不會接觸胚料103表面。此時,熱影像MG無
顯示磨削的溫升熱點H1,表示砂輪111的磨耗量小於公差d。如第11B圖所示,當砂輪111的磨耗量過大時,即使砂輪111在胚料103上循跡移動並向外偏移一公差d,但由於砂輪111的研磨力不足,故砂輪111仍會接觸胚料103表面,而在熱影像MG中顯示溫升熱點H1,表示砂輪111的磨耗量大於公差。
Please also refer to Figures 11A and 11B, which respectively illustrate two embodiments in which the wear amount of the
由上述的說明可知,當熱影像MG中顯示溫升熱點H1時,表示砂輪111的磨耗量不在允許公差範圍,此時,可對砂輪111進行磨耗補正。尺寸補正可由上述第8圖中步驟S82至S84來自動達成。有關砂輪111的磨耗補正,大致上與第8圖所述類似,包括:以修整器105對砂輪表面進行修整,並以熱影像MG同步監測砂輪表面的熱溫升,接著,根據熱影像MG,在砂輪表面上建立一新的精準磨削面(即已測定位面),以進行砂輪111的磨耗補正。
From the above description, it can be known that when the thermal image MG shows the hot spot H1 of temperature rise, it means that the wear amount of the
請參照第12A及12B圖,除了上述各實施例的刀具104、磨具106的輔助定位及磨耗檢測,熱影像輔助加工方法亦可用於工件(例如胚料103)的角度量測及平面度量測上,請一併參照第1B圖所述的定位量測流程。在第12A圖中,以一個已定位的基準刀121或銑刀或磨具循環逼近胚料103表面,並以熱影像MG同步監測胚料103表面的熱溫升情形,以得到第一溫升熱點H1,藉由控制器機械座標換算以取得第一位置座標資訊(即第一定位點或第一定位面)。此外,以一個已定位的基準刀121或銑刀或磨具循環逼近胚料103表面,並以熱影像MG同步監測胚料103表面的熱溫升,以得到第二溫升熱點H2,藉由控制器機械座標換算以取得第二位置座標資訊(即第二定位
點或第二定位面)。第一定位點與第二定位點相隔一預定距離,根據第一定位點與第二定位點的距離及高度差,計算胚料103表面的斜率及傾斜角度,以完成角度量測。
Please refer to Figures 12A and 12B. In addition to the auxiliary positioning and wear detection of the cutting tool 104 and the grinding tool 106 in the above embodiments, the thermal imaging auxiliary processing method can also be used for angle measurement and plane measurement of the workpiece (such as the blank 103) For measurement, please also refer to the positioning measurement process described in Figure 1B. In Figure 12A, a positioned
在第12B圖中,類似上述的做法,以熱影像MG同步監測胚料103表面的熱溫升,以得到至少三個溫升熱點H1至H3(即至少三個定位點或定位面)。根據至少三個定位點所形成的平面及高度差,計算胚料103表面的平面度,以完成平面度量測。 In Fig. 12B, similar to the above method, the thermal image MG is used to simultaneously monitor the thermal temperature rise on the surface of the blank 103 to obtain at least three temperature rise hotspots H1 to H3 (ie at least three positioning points or positioning surfaces). According to the planes and height differences formed by at least three positioning points, the flatness of the surface of the blank 103 is calculated to complete the plane measurement.
根據本發明上述實施例的熱影像輔助加工裝置及其輔助加工方法,可用以對一刀具或一磨具的輔助定位及磨耗檢測以及用以對待測物的尺寸、角度或平面度進行量測。因此,本發明可避免手動與目測方式量測造成的設備停機時間增加、重新對刀的誤差等問題,同時,利用熱影像量測技術取代傳統的尺寸量測及一般光學影像辨識及監測,在操作上更為方便、成本低,不易受環境因素(包括光源、表面材質等)影響,且熱影像感測模組的安裝與量測容易、不需精確校正、且量測精度為機台最小有效移動距離(加工精度可為1μm或更大),因此能符合工具機的加工精度的要求。 The thermal image auxiliary processing device and its auxiliary processing method according to the above embodiments of the present invention can be used for auxiliary positioning and wear detection of a tool or a grinding tool, and for measuring the size, angle or flatness of the object to be measured. Therefore, the present invention can avoid problems such as increased downtime of equipment caused by manual and visual measurement, and errors in resetting the tool. The operation is more convenient, the cost is low, and it is not easily affected by environmental factors (including light source, surface material, etc.), and the installation and measurement of the thermal image sensing module are easy, no precise calibration is required, and the measurement accuracy is the smallest on the machine The effective moving distance (machining accuracy can be 1 μm or more), so it can meet the requirements of the machining accuracy of the machine tool.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.
S11~S14:步驟 S11~S14: Steps
Claims (13)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110130622A TWI785746B (en) | 2021-08-19 | 2021-08-19 | Thermal image auxiliary processing device and method thereof |
CN202210001421.0A CN115890491A (en) | 2021-08-19 | 2022-01-04 | Thermal image auxiliary processing device, positioning device and method thereof |
US17/695,334 US20230057196A1 (en) | 2021-08-19 | 2022-03-15 | Thermal image auxiliary processing device, positioning device and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110130622A TWI785746B (en) | 2021-08-19 | 2021-08-19 | Thermal image auxiliary processing device and method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI785746B true TWI785746B (en) | 2022-12-01 |
TW202308785A TW202308785A (en) | 2023-03-01 |
Family
ID=85767844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110130622A TWI785746B (en) | 2021-08-19 | 2021-08-19 | Thermal image auxiliary processing device and method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115890491A (en) |
TW (1) | TWI785746B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017177070A1 (en) * | 2016-04-06 | 2017-10-12 | Costa Larry J | Controlled camera off-axis alignment for the dynamic bore-surface-structure inspections via rotational/orbital/rotational orbiting angular off-axis controlled vision camera systems |
CN111002103A (en) * | 2019-12-16 | 2020-04-14 | 珠海格力智能装备有限公司 | Cutter temperature detection system and cutter temperature detection method |
TW202026580A (en) * | 2019-01-08 | 2020-07-16 | 國立高雄科技大學 | Active dissipating heat uniformly system |
CN111618662A (en) * | 2020-05-18 | 2020-09-04 | 湖北文理学院 | Method for testing thermal error characteristics of complete machine tool |
-
2021
- 2021-08-19 TW TW110130622A patent/TWI785746B/en active
-
2022
- 2022-01-04 CN CN202210001421.0A patent/CN115890491A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017177070A1 (en) * | 2016-04-06 | 2017-10-12 | Costa Larry J | Controlled camera off-axis alignment for the dynamic bore-surface-structure inspections via rotational/orbital/rotational orbiting angular off-axis controlled vision camera systems |
TW202026580A (en) * | 2019-01-08 | 2020-07-16 | 國立高雄科技大學 | Active dissipating heat uniformly system |
CN111002103A (en) * | 2019-12-16 | 2020-04-14 | 珠海格力智能装备有限公司 | Cutter temperature detection system and cutter temperature detection method |
CN111618662A (en) * | 2020-05-18 | 2020-09-04 | 湖北文理学院 | Method for testing thermal error characteristics of complete machine tool |
Also Published As
Publication number | Publication date |
---|---|
CN115890491A (en) | 2023-04-04 |
TW202308785A (en) | 2023-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1787176B2 (en) | Machine tool method | |
CN102854841B (en) | Shape and position error in-situ compensating and processing method for curved surface parts | |
CN100475394C (en) | Method and device for forming three-dimensional surface on workpiece | |
JP6862764B2 (en) | Grinding device and method of manufacturing rolling bearings using it | |
JP7287616B2 (en) | Vibration cutting device | |
JP6955296B2 (en) | Cutting equipment and contact position identification program | |
US20110295408A1 (en) | Process for positioning a workpiece | |
CN109968127B (en) | Grinding device | |
KR100976899B1 (en) | Machining error correction mathod adapted for numerically controlled machine tool and grinding machine using the same | |
KR101503616B1 (en) | Grinding machine and grinding method | |
JP2011206862A (en) | Method of positioning rotary tool in multishaft processing machine | |
CN111085902B (en) | Workpiece polishing system for visual online detection and correction | |
US9056385B2 (en) | Grinding machine and method with improved teaching operation | |
TWI785746B (en) | Thermal image auxiliary processing device and method thereof | |
JP6168396B2 (en) | Machine Tools | |
JP2008157646A (en) | Optical measurement apparatus and processing system | |
JP7074381B2 (en) | Cutting equipment | |
JP2005309673A (en) | Nc machine tool and compensation working method | |
US20230057196A1 (en) | Thermal image auxiliary processing device, positioning device and method thereof | |
CN211759888U (en) | Automatic processing one-time measurement backspacing system and machine tool | |
JP4545501B2 (en) | Tool centering method and tool measuring method | |
CN115365941B (en) | Automatic workpiece pose calibration method for optical polishing | |
JP7404591B2 (en) | Structure manufacturing method, structure manufacturing identifier, structure manufacturing system, and machining program | |
JP2007301695A (en) | Method and device for chamfering of spectacle lens | |
JP6883966B2 (en) | Method of estimating the diameter of the grindstone and the machine tool using it |