TWI785526B - Measurement system and method for vapor chamber - Google Patents

Abstract

A measurement system and method for vapor chamber is configured to measure a vapor chamber and includes a heat insulation layer, a cooler, a heater and a control device. The heat insulation layer is disposed on the upper center of the vapor chamber and covered a part area of the upper of the vapor chamber. The cooler is disposed on the upper center of the vapor chamber and covered an area of the upper of the vapor chamber other than the heat insulation layer. The heater is disposed below the bottom center of the vapor chamber. A temperature sensor is disposed on upper and bottom of the vapor chamber, and they disposed under the shadow area of the heat insulation layer. The control device is connected to the heater and the temperature sensor.

Description

Vapor chamber measurement system and method

A measurement system and method, in particular a measurement system and method for a temperature chamber.

Vapor Chamber (also known as heat conduction plate) is a device that can quickly transfer heat energy from a local heat source to a large-area flat panel. It is currently widely used in heat dissipation devices, especially electronic components such as servers, graphics cards, or LEDs. It can be matched with other equipment such as heat sink, fan or water jacket to produce a good heat dissipation effect.

However, the thermal conductivity of the vapor chamber needs to be judged and determined through measurement. Please refer to FIG. 1 . FIG. 1 shows a conventional chamber measurement system. In the known vapor chamber measurement system 10, a heater 12 is arranged under the vapor chamber 11, and a heat sink 13 and a fan 14 are arranged above the vapor chamber 11 (a water jacket is also used for heat dissipation in some conventional technologies) . The cooling and measurement methods of the vapor chamber are described below.

When the known vapor chamber measurement system is in operation, the heater 12 heats the vapor chamber 11, and the fan 14 operates to dissipate heat. At the same time, the temperature of the measurement points P1, P2, P3, P4 and P5 at different positions is measured. The measurement is further compared with the temperature change of a comparative material (such as copper block) to calculate the heat transfer efficiency.

However, in the measurement system 10 of FIG. 1 , a fan 14 is used to dissipate heat, and the speed of the fan 14 will greatly affect the measurement results, especially when the fan 14 rotates at a low speed, a better heat conduction efficiency will be measured, and vice versa. The same is true. For example, when the fan 14 is running at a high speed, the heat will be rapidly transferred upwards, resulting in a large temperature difference between the measurement point P2 and the measurement point P3, resulting in a biased heat transfer efficiency. Low. Conversely, when the fan 14 is running at a low speed, the heat conducts upwards slowly and conducts to the left and right, so that the temperature difference between the measurement point P2 and the measurement point P3 is small, and the measured heat transfer efficiency will be high. Therefore, such a measurement method cannot measure the heat conduction efficiency of the chamber 11 stably and accurately. In addition, as long as the fan speed is reduced, better heat conduction efficiency can be obtained, which is also suspected of cheating in the performance test of the chamber 11 .

Therefore, how to solve the above problems is worthy of consideration by those skilled in the art.

In view of this, the purpose of the present invention is to provide a chamber measurement system and method, which overcomes the defects of conventional chamber measurement methods and solves the technical problem that it is difficult to accurately calculate the chamber thermal conductivity. The technical means used are as follows: A chamber measuring system is suitable for measuring a chamber, and the chamber measuring system includes: a heat insulating layer, a radiator, a heater and a control device. The thermal insulation layer is arranged in the center above the uniform temperature plate, and covers a certain area on the upper side of the uniform temperature plate. The radiator is arranged above the temperature chamber and covers the area on the upper side of the temperature chamber other than the heat insulation layer. The heater is arranged in the center below the vapor chamber. The temperature sensors are respectively arranged above and below the temperature uniform plate, and are arranged below the projected area of the heat insulating layer. The control device is electrically connected to the heater and the temperature sensor.

In the vapor chamber measurement system above, the radiator is a water jacket or fan cooling device.

In the above vapor chamber measuring system, wherein the heat insulating layer is heat insulating foam.

The present invention also provides a method for measuring a vapor chamber, comprising: providing a vapor chamber; setting a thermal insulation layer at the center of the upper surface of the vapor chamber, and the area of the thermal insulation layer is smaller than the area of the vapor chamber surface; A radiator is arranged at the edge of the upper surface of the vapor chamber; Using a heater with an electric power to heat the vapor chamber from the central position of the lower surface of the vapor chamber; measuring the temperature everywhere on the vapor chamber includes: measuring the temperature at the central position of the lower surface of the vapor chamber, the uniform the temperature at the center of the upper surface of the chamber, the temperature at the lower surface of the chamber at the edge of the projected area of the insulation, and the temperature at the upper surface of the chamber at the edge of the projected area of the insulation; and according to the temperature of the chamber Measured Parameters Calculates a number of thermodynamic parameters.

In the above vapor chamber measurement method, wherein the radiator is a water jacket or a fan cooling device.

The above-mentioned temperature chamber measurement method, wherein the heat insulation layer is heat insulation foam.

In the above vapor chamber measurement method, wherein the thermodynamic parameters include the thermal conductivity in the horizontal direction and the thermal conductivity in the vertical direction.

In the above vapor chamber measurement method, the thermodynamic parameters further include thermal resistance in the horizontal direction and thermal resistance in the vertical direction.

In the above-mentioned temperature chamber measurement method, the thermodynamic parameters further include vertical thermal impedance, horizontal thermal impedance, and thermal impedance sum.

Compared with the conventional technology, the temperature difference comparison method is more used. In this case, Fourier's law is used to calculate the heat conduction coefficient, which is more able to calculate the heat conduction coefficient of the chamber corresponding to models with different heat source sizes, heat fluxes, chamber sizes, and heat dissipation methods, and can also calculate the chamber more accurately. The thermal conductivity coefficient.

10: Vapor plate measurement system

11: vapor chamber

12: heater

13: cooling plate

14: fan

100: Vapor plate measurement system

110: vapor chamber

120: heater

130: insulation layer

140: Radiator

150: multiple temperature sensors

160: Control device

Pu1, Pd1, Pu2, Pd2, Pu3, Pd3, Pu4, Pd4, Puc, Pdc: measuring points

Q: Electric power

Tu1, Td1, Tu2, Td2, Tu3, Td3, Tu4, Td4, Tuc, Tdc: temperature

Tua: average temperature around the upper surface

Tda: average temperature around the lower surface

t: thickness of vapor chamber

D1: heater characteristic diameter

D2: characteristic diameter of ambient temperature point

A1: heater area

A2: Virtual area of surrounding temperature points

K: Thermal conductivity coefficient

A: Conduction area

T:溫度差

T : temperature difference

X:位置差

X : Position difference

Kz: thermal conductivity in the vertical direction

Kxy: thermal conductivity in the horizontal direction

Rz: thermal resistance in the vertical direction

Rxy: thermal resistance in the horizontal direction

Iz: Thermal impedance in the vertical direction

Ixy: thermal impedance in the horizontal direction

Ixyz: thermal impedance and

Figure 1 shows a conventional chamber measurement system.

FIG. 2 is a structural diagram of the vapor chamber measurement system of the present invention.

3A to 3C are schematic diagrams of measurement positions.

Please refer to FIG. 2 . FIG. 2 is a structural diagram of the chamber measuring system of the present invention. The vapor chamber measurement system 100 of the present invention is suitable for measuring a vapor chamber 110, and the chamber temperature measurement system 100 includes a heat insulating layer 130, a radiator 140, a heater 120, a plurality of temperature sensors 150 and a control device 160 . The thermal insulation layer 130 is disposed at the center above the temperature chamber 110 and covers a certain area on the upper side of the temperature chamber 110 . In this embodiment, the heat insulating layer 130 is a kind of heat insulating foam.

The radiator 140 is disposed above the chamber 110 and covers an area on the upper side of the chamber 110 other than the heat insulating layer 130 . In this embodiment, the radiator 140 is a water jacket or a fan, wherein the water jacket is a kind of liquid pipeline, which allows the cooling liquid to flow in the water jacket to take away the heat energy on the vapor chamber 110 to achieve the purpose of heat dissipation. In addition, the radiator 140 is disposed on the edge of the temperature chamber 110 to dissipate heat from the edge of the temperature chamber 110 . The heater 150 is disposed at the center below the vapor chamber 110 and closely attached to the chamber 110 . The heater 150 can provide local heat energy to the vapor chamber 110 .

A plurality of temperature sensors 150 are respectively arranged above and below the temperature equalizing plate 110, and are arranged below the projected area of the heat insulating layer 130, that is, the temperature sensors 150 must be arranged within the coverage of the heat insulating layer 130 .

The control device 160 is electrically connected to the heater 120 and the temperature sensor 150 . In this embodiment, the control device 160 is an electronic device with a display screen and an operation interface, such as a personal computer. Therefore, the control device 160 is suitable for inputting a signal to control the heating power of the heater 120 . Moreover, the control device 160 can also receive a temperature sensing signal from the temperature sensor 150 and display it on the display screen.

Please refer to FIG. 3A to FIG. 3C . FIG. 3A to FIG. 3C are schematic diagrams of measurement positions. 3A is a schematic side sectional view of the temperature chamber 110 , FIG. 3B is a top view of the temperature chamber 110 , and FIG. 3C is a bottom view of the temperature chamber 110 . There are multiple measurement points Pu1, Pd1, Pu2, Pd2, Pu3, Pd3, Pu4, Pd4, Puc and Pdc on the temperature chamber 110, which are also the positions where the temperature sensor 150 is set. Therefore, in this embodiment, there are ten temperature sensors 150 in total. Those skilled in the art should know that to measure the average temperature For the purpose of controlling the temperature of each part of the plate, the number of measuring points and temperature sensors can be increased or decreased according to the size of the temperature chamber, and the number is not limited to 10.

Wherein, one temperature sensor 150 is arranged between the heater 120 and the temperature chamber 110 , that is, it is arranged at the measuring point Pdc. One temperature sensor 150 is set at the central position between the heat insulating layer 130 and the temperature chamber 110 , which is the measurement point Puc. The 4 edges set on the projected area of the heat insulation layer on the upper surface of the chamber 110 are the measurement points Pu1, Pu2, Pu3 and Pu4. The 4 edges set on the projected area of the heat insulation layer on the lower surface of the chamber 110 are the measurement points Pd1, Pd2, Pd3 and Pd4. Therefore, there are 10 measuring points in total, and 10 temperature sensors 150 are correspondingly provided.

Wherein, the measurement points Pu1, Pu2, Pu3 and Pu4 on the upper surface of the temperature chamber 110 are respectively set at the four corners of the projected area of the thermal insulation layer 130 (as shown in FIG. 3B ). The measurement points Pd1 , Pd2 , Pd3 and Pd4 on the lower surface of the temperature chamber 110 are also set at four corners of the projected area of the heat insulating layer 130 (as shown in FIG. 3C ).

Next, the thickness of the vapor chamber 110 is t, the input power to the heater 120 is Q, the characteristic diameter of the heater 120 is D1, the characteristic diameter of the surrounding temperature point is D2, the area of the heater 120 is A1, and the surrounding temperature point The virtual area is A2 (the area formed by the connecting lines of Pu1, Pu2, Pu3 and Pu4 or Pd1, Pd2, Pd3 and Pd4)

The temperature sensor 150 can obtain the temperature from each sensing point side, the temperature measured at the measuring point Pu1 is Tu1; the temperature measured at the measuring point Pu2 is Tu2; the temperature measured at the measuring point Pu3 is Tu3; The temperature measured by Pu4 is Tu4; the temperature measured by measuring point Pd1 is Td1; the temperature measured by measuring point Pd2 is Td2; the temperature measured by measuring point Pd3 is Td3; the temperature measured by measuring point Pd4 is Td4; the temperature measured at the measurement point Puc is Tuc, which is the central temperature of the upper surface of the chamber 110; the temperature measured at the measurement point Pdc is Tdc, which is the central temperature of the lower surface of the chamber 110. And the average temperature Tua around the upper surface and the average temperature Tda around the lower surface can be calculated in the following way:

T為溫度差、

X為位置差。如此一來，便可計算垂直方向Z與水平方向XY方向的熱傳導係數Kz、Kxy。 Then, the thermal conductivity K can be calculated using Fourier Law (Fourier Law, shown below). Among them, Q is the input power, A is the conduction area,

T is the temperature difference,

X is the position difference. In this way, the heat conduction coefficients Kz and Kxy in the vertical direction Z and the horizontal direction XY can be calculated.

The calculation method of Z in the vertical direction is as follows: First, the parameters of the above-mentioned embodiment are brought into Fourier's law, which is:

Further conversion is:

Wherein, Q is the input power of the control device 160 to the heater 120, A1 is the area of the heater 120, t is the thickness of the vapor chamber 110, the temperature Tdc of the center point of the lower surface of the vapor chamber 110 is the same as that of the upper surface of the vapor chamber 110 The central point temperature Tuc is measured by the temperature sensor 150, so the parameters are all known, and the thermal conductivity Kz in the vertical direction can be calculated.

Further, the vertical thermal resistance Rz (Thermal Resistance) and thermal impedance Iz (Thermal Impedance) can also be calculated in the following way:

The calculation method of the thermal conductivity Kxv in the horizontal direction is as follows:

Further conversion is:

Among them, Q is the input power of the control device 160 to the heater 120, A2 is the virtual area around the measurement point, t is the thickness of the chamber 110, and the temperature Tuc of the center point on the upper surface of the chamber 110 is determined by the temperature sensor 150, the average ambient temperature Tua on the upper surface of the temperature chamber 110 can be calculated by measuring the ambient temperatures Tu1, Tu2, Tu3 and Tu4 by the temperature sensor 150, so these parameters are known and can be calculated The thermal conductivity Kxy in the horizontal direction.

The horizontal thermal resistance Rxy and thermal impedance Ixy can be calculated by the following method:

Further add the thermal impedance Iz in the vertical direction and the thermal impedance Ixy in the horizontal direction to obtain the thermal impedance and Ixyz in the xyz direction, as follows:

In summary, the temperature chamber measurement method of the present invention includes the following steps. First, a temperature chamber 110 is provided. A heat insulating layer 130 is provided at the center of the upper surface of the temperature chamber 110 , and the area of the heat insulating layer 130 is smaller than the area of the upper surface of the temperature chamber 110 . A radiator 140 is provided at the edge of the upper surface of the chamber 110 .

Afterwards, the heater 120 is used to heat the vapor chamber 110 from the center of the lower surface of the chamber 110 with an electric power. Next, measure the temperature at the center of the lower surface of the chamber 110, the temperature at the center of the upper surface of the chamber 110, the temperature of the lower surface of the chamber 110 at the edge of the projected area of the heat insulating layer 130, and the temperature of the upper surface of the chamber 110 at the edge of the projected area. The temperature at the edge of the projected area of the thermal insulation layer 130. With the above measured parameters, multiple thermodynamic parameters can be calculated. Among them, the thermodynamic parameters include horizontal thermal conductivity, vertical thermal conductivity, horizontal thermal resistance, vertical thermal resistance, vertical thermal impedance, horizontal thermal impedance and thermal impedance sum. The specific calculation method of these thermodynamic parameters is as follows: Taking the electric power Q, the area A1 of the heater 120, the thickness t of the vapor chamber 110, and the temperature difference from the center of the lower surface of the vapor chamber 110 to the center of the upper surface of the vapor chamber 110 (Tdc minus Tuc) as parameters, the input Calculate the thermal conductivity in the vertical direction with the following formula.

Taking the electric power Q, the characteristic diameter D1 of the heater 120, the characteristic diameter D2 of the surrounding temperature point, the average temperature difference (Tuc minus Tua) from the upper center position of the temperature chamber 110 to the surrounding position, and the thickness t of the temperature chamber 110, into The following formula finds the thermal conductivity in the horizontal direction.

Calculate the thermal resistance Rz and thermal resistance Iz in the vertical direction by the following method:

Calculate the horizontal thermal resistance Rxy and thermal impedance Ixy by the following formula:

Calculate the thermal impedance and Ixyz by the following formula:

Compared with the conventional technology, the temperature difference comparison method is more used. In this case, Fourier's law is used to calculate the heat transfer coefficient, which is more able to calculate the heat conduction coefficient of the chamber corresponding to models with different heat source sizes, heat fluxes, chamber sizes, and heat dissipation methods, and can also be calculated more accurately. Thermal conductivity of the vapor chamber.

The description of the present invention is as above, but it is not intended to limit the scope of patent rights claimed by this creation. The scope of its patent protection shall depend on the scope of the appended patent application and its equivalent fields. Those who are generally known in the art Those who know, without departing from the spirit or scope of this patent, the changes or modifications made are all equivalent changes or designs completed under the spirit disclosed in this creation, and should be included in the scope of the following patent application.

100: Vapor plate measurement system

110: vapor chamber

120: heater

130: insulation layer

140: Radiator

150: multiple temperature sensors

160: Control device

Claims (10)

A chamber measuring system, suitable for measuring a chamber, comprising: a thermal insulation layer arranged in the center above the chamber and covering a certain area above the chamber; a radiator arranged on the chamber above the temperature chamber, and cover the area outside the thermal insulation layer on the upper side of the chamber; a heater is arranged in the center below the chamber; a plurality of temperature sensors are respectively arranged above and above the chamber the center of the bottom and the edge of the projected area of the heat insulation layer; and a control device electrically connected to the heater and the temperature sensor; wherein, all the temperature sensors are covered on the projection of the heat insulation layer area. The temperature chamber measurement system as described in claim 1, wherein the temperature sensor is respectively arranged between the heater and the temperature chamber, the central position between the heat insulation layer and the temperature chamber, and the temperature chamber. The edge of the projected area of the thermal insulation layer on the upper surface of the warm plate, and the edge of the projected area of the thermal insulation layer on the lower surface of the temperature chamber. The temperature chamber measurement system as described in Claim 1, wherein the radiator is a water jacket or a fan cooling device. The temperature chamber measuring system according to Claim 1, wherein the heat insulating layer is heat insulating foam. A method for measuring a vapor chamber, comprising: providing a vapor chamber; setting a thermal insulation layer at the center of the upper surface of the vapor chamber, the area of the thermal insulation layer being smaller than the area of the upper surface of the vapor chamber; A radiator is arranged at the edge of the upper surface of the chamber; a heater is used to heat the chamber from the center of the lower surface of the chamber with an electric power; the temperature of various places on the chamber is measured, including : The temperature at the center of the lower surface of the chamber, the temperature at the center of the upper surface of the chamber, the temperature at the edge of the projected area of the lower surface of the chamber at the edge of the heat insulation layer, and the temperature of the upper surface of the chamber at the edge of the insulation layer the temperature at the edge of the projected area; and calculating a plurality of thermodynamic parameters based on the measured parameters of the chamber. The temperature chamber measurement method as described in Claim 5, wherein the radiator is a water jacket or a fan cooling device. The temperature chamber measurement method as described in Claim 5, wherein the heat insulation layer is heat insulation foam. The temperature chamber measurement method as described in Claim 5, wherein the thermodynamic parameters include the thermal conductivity in the horizontal direction and the thermal conductivity in the vertical direction. The method for measuring a temperature chamber according to Claim 8, wherein the thermodynamic parameters further include thermal resistance in the horizontal direction and thermal resistance in the vertical direction. The method for measuring a temperature chamber according to Claim 9, wherein the thermodynamic parameters further include thermal impedance in the vertical direction, thermal impedance in the horizontal direction, and the sum of the thermal impedance.

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