TWI781646B - Solid-state drive having housing with engaging mechanism - Google Patents
Solid-state drive having housing with engaging mechanism Download PDFInfo
- Publication number
- TWI781646B TWI781646B TW110120394A TW110120394A TWI781646B TW I781646 B TWI781646 B TW I781646B TW 110120394 A TW110120394 A TW 110120394A TW 110120394 A TW110120394 A TW 110120394A TW I781646 B TWI781646 B TW I781646B
- Authority
- TW
- Taiwan
- Prior art keywords
- housing
- engaging portion
- interface
- casing
- solid
- Prior art date
Links
Images
Abstract
Description
本發明係有關於一種固態硬碟,尤其是一種其殼體是透過卡合機構而結合的固態硬碟。 The present invention relates to a solid-state hard disk, in particular to a solid-state hard disk whose housing is combined through a locking mechanism.
固態硬碟(solid-state drive,SSD)是一種以高密度集成電路(integrated circuit,IC)晶片作為儲存媒介的數位資料儲存裝置,如搭載非揮發性記憶體晶片如快閃記憶體時,則可作為永久性儲存裝置,如搭載揮發性記憶體晶片如隨機存取記憶體時,則可作為臨時性儲存裝置。 A solid-state drive (SSD) is a digital data storage device that uses a high-density integrated circuit (IC) chip as a storage medium. If it is equipped with a non-volatile memory chip such as a flash memory, then It can be used as a permanent storage device, and if it is equipped with a volatile memory chip such as a random access memory, it can be used as a temporary storage device.
按固態硬碟的發展現況,相關技術已趨於成熟,對比傳統的機械硬碟(HDD),固態硬碟具備許多機械硬碟無法達成之優點,包含讀寫速度快,無噪音,無可動部件損耗,耐震動,低耗電,低功耗,發熱量低,構造簡單,及壽命長等,因此雖然價格較高,但其應用已經逐漸普及。 According to the current development status of solid-state hard disks, related technologies have matured. Compared with traditional mechanical hard disks (HDDs), solid-state hard disks have many advantages that mechanical hard disks cannot achieve, including fast read and write speeds, no noise, and no moving parts. Loss, vibration resistance, low power consumption, low power consumption, low heat generation, simple structure, and long life, etc., so although the price is high, its application has gradually become popular.
大體而言,固態硬碟的構造十分簡單,拆開固態硬碟外殼後可發現,外殼內部只收納一片印刷電路板總成(PCBA),PCBA則由貼焊在PCB板上的控制晶片和多顆記憶體晶片構成,記憶體晶片負責存儲資料,控制晶片負責讀取、寫入資料和管理所有記憶體晶片與電路,固態硬碟等於是由加上的外殼PCBA構成。 Generally speaking, the structure of the solid-state hard drive is very simple. After disassembling the solid-state hard drive case, it can be found that there is only one printed circuit board assembly (PCBA) inside the case. The PCBA consists of a control chip and multiple The memory chip is responsible for storing data, and the control chip is responsible for reading, writing data and managing all memory chips and circuits. The solid-state hard drive is equivalent to an additional shell PCBA.
在習用技術中,固態硬碟的外殼通常包含上蓋及下蓋兩部 分,早期習慣透過螺絲鎖接上蓋與下蓋,但為了提升產品競爭力,成本有必要進一步降低,體積必須朝向小型化與薄型化設計,在空間有限的殼體內部,必須部署更多記憶晶片,重量也必須輕量化,要滿足這些條件,有必要捨棄螺絲鎖接,另外設計其他方式,來使上下蓋結合固定。 In conventional technology, the casing of a solid-state drive usually includes two parts: an upper cover and a lower cover. In the early days, the upper cover and the lower cover were used to be locked by screws. However, in order to improve product competitiveness, the cost must be further reduced, and the volume must be designed towards miniaturization and thinning. In the case with limited space, more memory chips must be deployed. , the weight must also be light. To meet these conditions, it is necessary to abandon the screw locking and design other methods to make the upper and lower covers combined and fixed.
職是之故,有鑑於習用技術中存在的缺點,發明人經過悉心嘗試與研究,並一本鍥而不捨之精神,終構思出本案「具有卡合式殼體的固態硬碟」,能夠克服上述缺點,以下為本發明之簡要說明。 Therefore, in view of the shortcomings in the conventional technology, the inventor has tried and researched carefully, and with the spirit of perseverance, finally conceived the case "solid state hard disk with a snap-on housing", which can overcome the above-mentioned shortcomings. The following is a brief description of the present invention.
有鑑於習用技術缺點,本發明提出使用卡合機構取代螺絲鎖接來結合固態硬碟的兩個外殼,並進一步消除卡合機構的幾樣缺點,包含卡合機構不耐反覆拆解,反覆拆卸易斷,也容易在拆卸中受損,以及由於固態硬碟體積較小,導致卡合機構體積偏小而拆卸不易等的缺點。 In view of the shortcomings of the conventional technology, the present invention proposes to use a snap-in mechanism instead of a screw lock to connect the two shells of the solid-state hard disk, and further eliminate several shortcomings of the snap-in mechanism, including the snap-in mechanism is not resistant to repeated disassembly, repeated disassembly It is easy to break, and it is also easy to be damaged during disassembly, and due to the small size of the solid state drive, the size of the locking mechanism is relatively small and it is not easy to disassemble.
本發明提出一種固態硬碟,其包含:第一殼體,其具有第一卡合部;第二殼體,其具有在位置上對應於該第一卡合部的第二卡合部,並與該第一殼體相互套合;以及儲存單元,其配置於該第一殼體與該第二殼體之間,其中該第一卡合部與該第二卡合部機構經結合後形成扣合結構,該第一殼體與該第二殼體透過該扣合結構彼此卡固連結。 The present invention proposes a solid state hard disk, which includes: a first housing with a first engaging portion; a second housing with a second engaging portion corresponding to the first engaging portion in position, and nested with the first housing; and a storage unit, which is disposed between the first housing and the second housing, wherein the first engaging portion and the second engaging portion are combined to form a mechanism The fastening structure, the first casing and the second casing are fixedly connected to each other through the fastening structure.
所描述之固態硬碟還包含:該第一殼體還具有第一面板以及垂直於該第一面板而設置的第一側壁,該第一側壁自該第一面板的邊緣朝該儲存單元的方向垂直設置,該第一卡合部設於該第一側壁;該第二殼體還具有第二面板以及垂直於該第二面板而設置的第二側壁,該第二側壁自該第二面板的邊緣朝該儲存單元的方向垂直設置,該第二卡合部設於該第 二側壁;該第一卡合部係由該第一側壁經加工而形成;或者該第二卡合部係由該第二側壁經加工而形成。 The described solid-state hard disk also includes: the first housing also has a first panel and a first side wall perpendicular to the first panel, the first side wall is from the edge of the first panel toward the direction of the storage unit set vertically, the first engaging portion is set on the first side wall; the second housing also has a second panel and a second side wall perpendicular to the second panel, the second side wall is formed from the second panel The edge is arranged vertically toward the direction of the storage unit, and the second locking part is arranged on the first Two side walls; the first engaging portion is formed by processing the first side wall; or the second engaging portion is formed by processing the second side wall.
所描述之固態硬碟還包含:該第一殼體在該第一面板接近於該扣合結構的位置上開設有第一通孔;或者該第二殼體在該第二面板接近於該扣合結構的位置上開設有第二通孔。 The described solid-state hard disk also includes: the first housing is provided with a first through hole at a position where the first panel is close to the buckle structure; or the second housing is opened at a position where the second panel is close to the buckle A second through hole is opened at the position of the combined structure.
該第一通孔提供第一工具從該第一通孔進入以釋放該扣合結構,該第二通孔提供第二工具從該第二通孔進入以釋放該扣合結構。 The first through hole allows a first tool to enter through the first through hole to release the fastening structure, and the second through hole allows a second tool to enter through the second through hole to release the fastening structure.
所描述之固態硬碟還包含:該第二殼體還具有附接孔,以供該第二殼體附接至主機裝置;或者該第二殼體還具有裝配定位孔,以供該儲存單元附接至該第二殼體。 The described solid-state hard disk also includes: the second casing also has an attachment hole for the second casing to be attached to the host device; or the second casing also has an assembly positioning hole for the storage unit attached to the second housing.
該第一卡合部係選自公扣件、卡扣件、卡合件、卡固件、卡榫件、卡勾件、卡接件、凸點、突起件、母扣件、卡溝、通孔、卡接孔、卡槽、凹槽、凹陷以及盲孔其中之一,該第二卡合部係選自公扣件、卡扣件、卡合件、卡固件、卡榫件、卡勾件、卡接件、凸點、突起件、母扣件、卡溝、通孔、卡接孔、卡槽、凹槽、凹陷以及盲孔其中之一。 The first engaging part is selected from a male fastener, a buckle, a fastener, a fastener, a tenon, a hook, a fastener, a bump, a protrusion, a female fastener, a groove, and a through hole. , snapping holes, slots, grooves, depressions, and blind holes, the second engaging portion is selected from male fasteners, snapping pieces, snapping pieces, fastening pieces, tenon pieces, hook pieces, One of clips, bumps, protrusions, female fasteners, clip grooves, through holes, clip holes, clip slots, grooves, depressions and blind holes.
該第一殼體與該第二殼體之材質係選自聚碳酸酯(PC)材料、丙烯腈-丁二烯-苯乙烯共聚物(ABS)材料、聚碳酸酯-丙烯腈-丁二烯-苯乙烯共聚物混合物(PC/ABS)複合材料、基於丙烯腈-丁二烯-苯乙烯共聚物之複合材料、合金材料及其組合其中之一。 The material of the first shell and the second shell is selected from polycarbonate (PC) material, acrylonitrile-butadiene-styrene copolymer (ABS) material, polycarbonate-acrylonitrile-butadiene - one of styrene copolymer mixture (PC/ABS) composite material, composite material based on acrylonitrile-butadiene-styrene copolymer, alloy material and combination thereof.
該儲存單元包含電路基板以及設置於該電路基板上包含複數非揮發性記憶體的非揮發性記憶體陣列以及連接器。 The storage unit includes a circuit substrate, a non-volatile memory array including a plurality of non-volatile memories arranged on the circuit substrate, and a connector.
該等非揮發性記憶體係選自3D NAND快閃記憶體,、 V-NAND快閃記憶體、QLC NAND快閃記憶體、TLC NAND快閃記憶體、MLC NAND快閃記憶體及SLC NAND快閃記憶體其中之一,該連接器使用之傳輸介面規格係選自PCIe介面、NVMe介面、M.2介面、U.2介面、mSATA介面、SATA介面、SATA Express介面、AHCI介面、UATA介面、ZIF介面、IDE介面、CF介面及CFast介面其中之一。 These non-volatile memory systems are selected from 3D NAND flash memory, One of V-NAND flash memory, QLC NAND flash memory, TLC NAND flash memory, MLC NAND flash memory and SLC NAND flash memory, the transmission interface specification used by the connector is selected from One of PCIe interface, NVMe interface, M.2 interface, U.2 interface, mSATA interface, SATA interface, SATA Express interface, AHCI interface, UATA interface, ZIF interface, IDE interface, CF interface and CFast interface.
本發明進一步提出一種固態硬碟,其包含:至少一卡合機構,其包含在位置上相互對應的第一卡合部與第二卡合部;第一殼體,其具有該第一卡合部;第二殼體,其具有該第二卡合部,並與該第一殼體相互套合;以及固態儲存單元,其配置於該第一殼體與該第二殼體之間,其中該第一殼體與該第二殼體透過該至少一卡合機構彼此扣合連結。 The present invention further proposes a solid-state hard disk, which includes: at least one engaging mechanism, which includes a first engaging portion and a second engaging portion corresponding to each other in position; a first housing, which has the first engaging part; a second shell, which has the second engaging portion, and fits with the first shell; and a solid state storage unit, which is arranged between the first shell and the second shell, wherein The first casing and the second casing are buckled and connected to each other through the at least one engaging mechanism.
上述發明內容旨在提供本揭示內容的簡化摘要,以使讀者對本揭示內容具備基本的理解,此發明內容並非揭露本發明的完整描述,且用意並非在指出本發明實施例的重要/關鍵元件或界定本發明的範圍。 The above summary of the invention is intended to provide a simplified summary of the disclosure to enable readers to have a basic understanding of the disclosure. This summary of the invention is not intended to disclose a complete description of the invention, and is not intended to point out important/key elements or components of the embodiments of the invention. define the scope of the invention.
10:固態硬碟 10: SSD
100:第一殼體 100: first case
110:第一面板 110: first panel
121、123:第一側壁 121, 123: the first side wall
122、124:第一側壁 122, 124: the first side wall
130:第一連接器開口 130: first connector opening
180:加強筋 180: Rib
200:第二殼體 200: second shell
210:第二面板 210: second panel
223:第二側壁 223: second side wall
222、224:第二側壁 222, 224: the second side wall
230:第二連接器開口 230: second connector opening
240:連接器開口 240: Connector opening
250:第二通孔 250: Second through hole
260:附接孔 260: Attachment hole
270:裝配定位孔 270: Assembly positioning hole
300:卡合機構 300: snap mechanism
310:第一卡合部 310: the first engaging part
312:矩形卡扣 312: Rectangular buckle
314:拉伸三角形卡扣 314: Stretch triangle buckle
320:第二卡合部 320: the second engaging part
322:矩形卡溝 322: Rectangular slot
324:內凹三角形盲孔 324: Concave triangular blind hole
330:扣合結構 330: buckle structure
400:儲存單元 400: storage unit
401:電路基板 401: circuit substrate
403:連接器 403: connector
405:主控晶片 405: Main control chip
407:隨機存取記憶體晶片 407: Random Access Memory Chip
409:非揮發性記憶體晶片 409: Non-volatile memory chips
411:非揮發性記憶體陣列 411: Non-volatile memory array
413:電容器 413: Capacitor
415:排插結構 415: socket structure
417:安裝定位孔 417: Installation positioning hole
第1圖與第2圖係揭示本發明固態硬碟第一實施例之示意圖; Figure 1 and Figure 2 are schematic diagrams showing the first embodiment of the solid state disk of the present invention;
第3圖係揭示本發明固態硬碟第二實施例之示意圖; Figure 3 is a schematic diagram showing the second embodiment of the solid state disk of the present invention;
第4圖與第5圖係揭示本發明固態硬碟第三實施例之示意圖;以及 Figure 4 and Figure 5 are schematic diagrams showing the third embodiment of the solid state disk of the present invention; and
第6圖係揭示本發明固態硬碟包含之儲存單元之功能方塊示意圖。 Fig. 6 is a schematic diagram showing the functional block of the storage unit included in the solid state disk of the present invention.
本發明將可由以下的實施例說明而得到充分瞭解,使得熟習本技藝之人士可以據以完成之,然本發明之實施並非可由下列實施案例而 被限制其實施型態;本發明之圖式並不包含對大小、尺寸與比例尺的限定,本發明實際實施時其大小、尺寸與比例尺並非可經由本發明之圖式而被限制。 The present invention will be fully understood by the following examples, so that those skilled in the art can complete it, but the implementation of the present invention cannot be determined by the following examples Its implementation is limited; the drawings of the present invention do not contain limitations on the size, size and scale, and the size, size and scale of the present invention cannot be limited by the drawings of the present invention during actual implementation.
本文中用語“較佳”是非排他性的,應理解成“較佳為但不限於”,任何說明書或請求項中所描述或者記載的任何步驟可按任何順序執行,而不限於請求項中所述的順序,本發明的範圍應僅由所附請求項及其均等方案確定,不應由實施方式示例的實施例確定;本文中用語“包含”及其變化出現在說明書和請求項中時,是一個開放式的用語,不具有限制性含義,並不排除其他特徵或步驟。 The word "preferred" in this article is non-exclusive and should be understood as "preferably but not limited to". order, the scope of the present invention should be determined only by the appended claims and their equivalents, not by the examples illustrated in the implementation; when the term "comprising" and its variations appear in the specification and claims, it is An open-ended term without a restrictive meaning that does not exclude other features or steps.
第1圖與第2圖係揭示本發明固態硬碟第一實施例之示意圖;本發明固態硬碟10包含第一殼體100、第二殼體200、卡合機構(engaging mechanism)300、以及儲存單元400,在本實施例,第一殼體100較佳是作為上部蓋體,第二殼體200較佳是作為下部蓋體,至少一卡合機構300包含可互相結合與分離的第一卡合部310與第二卡合部320。
FIG. 1 and FIG. 2 are schematic diagrams showing the first embodiment of the solid state hard disk of the present invention; the solid state
可供製作第一殼體100與第二殼體200之材質涵蓋例如但不限於聚碳酸酯(PC)材料、丙烯腈-丁二烯-苯乙烯共聚物(ABS)材料、聚碳酸酯-丙烯腈-丁二烯-苯乙烯共聚物混合物(PC/ABS)之合金樹脂材料、基於ABS之複合材料或者合金材料等,其中基於ABS之複合材料例如PA/ABS複合材料、PBT/ABS複合材料或者ABS/PVC複合材料。
The materials available for making the first housing 100 and the
第一殼體100具有作為上蓋板的第一面板110以及與第一面板110垂直配置的多個第一側壁121、122、123與124,配合固態硬碟的現況規格,第一殼體100的形狀以矩形為佳,因此第一面板110大致呈矩形平板
狀,多個第一側壁121、122、123與124以環繞第一面板110邊緣的方式,配置在第一面板110的邊緣處,並朝向儲存單元400的方向垂直設置,多個第一側壁121、122、123與124彼此間可以是不連續配置,或者如本實施例所採的連續配置。
The first housing 100 has a first panel 110 as an upper cover and a plurality of
較佳地在例如第一側壁122與124上,皆設置有數量不限但至少一個的第一卡合部310,而且第一卡合部310的形態為例如但不限於:公扣件、卡扣件、卡合件、卡固件、卡榫件、卡勾件、卡接件、凸點或突起件等。第一卡合部310較佳是經由實施彎折、反折、拉伸或成型(forming)等衝壓工序,以加工第一側壁122與124的本體材料,直接以第一側壁122與124的本體來製作。
Preferably, for example, on the
舉例來說,如第1圖所示,經由衝壓加工而擠壓第一側壁122與124本體,直接在第一側壁122與124上形成一個突起的矩形卡扣312,或者,如第2圖所示,經由衝壓加工而擠壓第一側壁122與124本體,直接在第一側壁122與124上形成一個突起的拉伸三角形卡扣314,或者,經由衝壓第一側壁122與124本體,直接在第一側壁122與124上形成一個突出的圓形凸點,而以第一側壁122與124的本體材料來製作第一卡合部310。
For example, as shown in FIG. 1, the bodies of the
第二殼體200具有作為下蓋板的第二面板210以及與第二面板210垂直配置的多個第二側壁222、223與224,對應第一殼體100的形狀,第二殼體200的形狀亦以矩形為佳,因此第二面板210大致呈矩形平板狀,多個第二側壁222、223與224以環繞第二面板210邊緣的方式,配置在第二面板210的邊緣處,並朝向儲存單元400的方向垂直設置,多個第二側壁222、223與224彼此間可以是連續配置,或者如本實施例所採的不連續配置。
The
較佳地在例如第二側壁222與224上,皆設置有數量不限但至少一個的第二卡合部320,而且第二卡合部320的形態為例如但不限於:母扣件、通孔、卡溝、卡接孔、卡槽、凹槽、凹陷或盲孔等,在本實施例,如第1圖與第2圖所揭示,第二卡合部320是採用矩形卡溝322的形態來實施。
Preferably, for example, on the
第二卡合部320較佳是經由實施衝壓工序,以加工第二側壁222與224的本體材料,而直接以第二側壁222與224的本體來製作。舉例來說,經由衝壓成型而擠壓第二側壁222與224本體,直接在第二側壁222與224上形成一個凹陷的矩形卡溝,或者,經由衝切加工而貫穿第二側壁222與224,而在第二側壁222與224上形成一個卡溝,而以第二側壁222與224的本體材料來製作第二卡合部320。
The second
第一殼體100的第一側壁121上還具有一個第一連接器開口130的缺口,第二殼體200的第二面板210上還具有一個第二連接器開口230的缺口,當第一殼體100與第二殼體200套合後,第一連接器開口130與第二連接器開口230將共同組成連接器開口240,以提供儲存單元400上連接器403露出並構成排插結構,用於插接到主機裝置之固態硬碟插槽。
The
較佳的,第一殼體100的大小經設計稍大於第二殼體200,第二殼體200可套入第一殼體100,當第一殼體100與第二殼體200相互套合後,多個第一側壁121、122、123與124將包圍多個第二側壁222、223與224,而且多個第一卡合部310與多個第二卡合部320在位置與形狀上將相互對應,經由施力擠壓第一殼體100與第二殼體200產生套合,並使多個第一卡合部310與多個第二卡合部320卡合構成多個扣合結構330,第一殼體100與第二殼體200將透過扣合結構330卡固連結。
Preferably, the size of the first shell 100 is designed to be slightly larger than the
第3圖係揭示本發明固態硬碟第二實施例之示意圖;在本實施例,第一卡合部310係為拉伸三角形卡扣314,第二卡合部320係內凹三角形盲孔324,第一卡合部310經由衝切與衝壓加工而拉伸第一側壁122與124本體,直接在第一側壁122與124上形成拉伸三角形卡扣314,而第二卡合部320經由衝切與衝壓成型而拉伸第二側壁222與224本體,直接在第二側壁222與224上形成一個內凹三角形盲孔324。
Figure 3 is a schematic diagram showing the second embodiment of the solid state hard drive of the present invention; in this embodiment, the first
多個第一卡合部310與多個第二卡合部320較佳可另描述為一組具有在位置上係應互相對應,並在結構、形狀與形式上呈互補關係的立體結構,以在兩卡合部的結合面上產生高低差,造成扣閉效果,經受力結合後構成一個緊密結合但可拆的扣合結構330,使第一殼體100與第二殼體200間透過扣合結構330卡固連結,構成密合蓋上的狀態。至少一卡合機構300係包含一個第一卡合部310與一個第二卡合部320。
The plurality of first
第4圖與第5圖係揭示本發明固態硬碟第三實施例之示意圖;在本實施例,第二殼體200在第二面板210上接近於第一殼體100第一側壁122第一卡合部310、第二殼體200第二側壁222第二卡合部320或者扣合結構330的位置處,選擇性地開設有數量不限但至少一個的第二通孔250,當要分開扣合中的第一殼體100與第二殼體200時,可以從第二通孔250插入輔助工具例如起子,並使用輔助工具將第一卡合部310推出第二卡合部320,以釋放扣合結構330,而完成第一殼體100與第二殼體200的拆解與分離。
Figure 4 and Figure 5 are schematic diagrams showing the third embodiment of the solid state hard disk of the present invention; in this embodiment, the
第二通孔250較佳的亦可稱為維修孔,便於固態硬碟的多次維修拆裝或重複拆解,可供多次維修與重工而不損傷扣合結構,或者第二通孔250也可視為是一種快拆設計,使得固態硬碟可以被快速拆卸。選擇性
地,也可選擇在第一殼體100在第一面板110上接近於第一卡合部310、第二卡合部320或者扣合結構330的位置處,開設數量不限但至少一個的第一通孔作為維修孔。
The second through
第二殼體200在第二面板210或第二側壁222與224上,還開設有數量不限的附接孔260,以便提供將第二殼體200及整組固態硬碟10,透過例如但不限於螺絲,而附接至並鎖固在主機裝置上。第一殼體100的內側較佳選擇性的形成有多條加強筋180,以增強第一殼體100與第二殼體200的整體結構強度。
The
第6圖係揭示本發明固態硬碟包含之儲存單元之功能方塊示意圖;舉例來說,儲存單元400之基本結構包含電路基板(PCB)401、連接器403、主控晶片405、隨機存取記憶體晶片407、由多顆非揮發性記憶體晶片409組成的非揮發性記憶體陣列411及多顆電容器413,各元件是使用例如但不限於表面貼焊方法(SMT)安裝在電路基板401其中一面或者兩面上,這些非揮發性記憶體顆粒較佳係為例如但不限於快閃記憶體(flash memory),快閃記憶體涵蓋例如但不限於3D NAND快閃記憶體、V-NAND快閃記憶體、QLC NAND快閃記憶體、TLC NAND快閃記憶體、MLC NAND快閃記憶體、SLC NAND快閃記憶體。
Figure 6 is a schematic diagram showing the functional block of the storage unit included in the solid state hard drive of the present invention; for example, the basic structure of the
連接器403具有由多個接腳(pins)構成的排插結構415,可供插接並電連接到主機裝置之固態硬碟插槽,連接器403的傳輸介面規格涵蓋例如但不限於PCIe、NVMe、M.2、U.2、mSATA、SATA、SATA Express、AHCI、UATA、ZIF、IDE、CF、CFast等,儲存單元400透過連接器403從主機裝置接收電力供應,並透過連接器403從主機裝置接收指令與訊號,主控
晶片405係控制、管理、調度非揮發性記憶體陣列411中數億個記憶胞元,按照指令進行資料的讀寫作動,主控晶片405較佳為例如系統單晶片(SoC)。
The
隨機存取記憶體晶片407為選擇性元件,在某些實施例中儲存單元400未搭載隨機存取記憶體晶片407,可降低製造成本,但搭載隨機存取記憶體晶片407可提高非揮發性記憶體陣列411讀寫速度,也可發揮資料緩衝器功效,非揮發性記憶體陣列411是以單面配置的方式,或者雙面配置的方式,安裝在電路基板401的單一面或者兩面上,雙面配置的方式將有效增加固態硬碟的記憶容量,多顆電容器413係安裝在電路基板401其中一面或者兩面上,以對主控晶片405、隨機存取記憶體晶片407、及非揮發性記憶體陣列411等元件,在讀寫期間提供斷電保護。
The random
電路基板401上開設有例如數量不限的安裝定位孔417,可提供例如螺絲或螺柱通過,而將電路基板401與儲存單元400固定並定位到第二殼體200上,相應地,第二殼體200在第二面板210上開設有數量與安裝定位孔417對應的裝配定位孔270,以便將儲存單元400固定並定位在第二殼體200上,從而將儲存單元400配置在由第一殼體100與第二殼體200構成的容置空間當中。
The
本發明提出使用在固態硬碟外殼中,以卡合機構取代螺絲鎖接來結合第一殼體與第二殼體,並進一步克服了存在於卡合機構中的幾個缺點,包含卡合機構不耐反覆拆解,反覆拆卸易斷,也容易在拆卸中受損,以及由於固態硬碟體積較小,導致卡合機構體積偏小而拆卸不易等的缺點。 The present invention proposes to be used in solid-state hard disk shells, to combine the first shell and the second shell with a snap-in mechanism instead of screw locking, and further overcome several shortcomings in the snap-in mechanism, including the snap-in mechanism It is not resistant to repeated disassembly, it is easy to break after repeated disassembly, and it is also easy to be damaged during disassembly. Due to the small size of the solid state drive, the size of the locking mechanism is too small and it is not easy to disassemble.
本發明以上各實施例彼此之間可以任意組合或者替換,從而衍生更多之實施態樣,但皆不脫本發明所欲保護之範圍,茲進一步提供更 多本發明實施例如次: The above embodiments of the present invention can be arbitrarily combined or replaced with each other, thereby deriving more implementation forms, but none of them depart from the scope of protection intended by the present invention. Hereby further provide Many embodiments of the present invention are as follows:
實施例1:一種固態硬碟,其包含:第一殼體,其具有第一卡合部;第二殼體,其具有在位置上對應於該第一卡合部的第二卡合部,並與該第一殼體相互套合;以及儲存單元,其配置於該第一殼體與該第二殼體之間,其中該第一卡合部與該第二卡合部機構經結合後形成扣合結構,該第一殼體與該第二殼體透過該扣合結構彼此卡固連結。 Embodiment 1: A solid state hard disk, which includes: a first housing with a first engaging portion; a second housing with a second engaging portion corresponding in position to the first engaging portion, and fit with the first housing; and a storage unit, which is arranged between the first housing and the second housing, wherein the first engaging part and the second engaging part are combined A fastening structure is formed, and the first casing and the second casing are fixedly connected to each other through the fastening structure.
實施例2:如實施例1描述之固態硬碟還包含:該第一殼體還具有第一面板以及垂直於該第一面板而設置的第一側壁,該第一側壁自該第一面板的邊緣朝該儲存單元的方向垂直設置,該第一卡合部設於該第一側壁;該第二殼體還具有第二面板以及垂直於該第二面板而設置的第二側壁,該第二側壁自該第二面板的邊緣朝該儲存單元的方向垂直設置,該第二卡合部設於該第二側壁;該第一卡合部係由該第一側壁經加工而形成;或者該第二卡合部係由該第二側壁經加工而形成。 Embodiment 2: The solid-state hard disk as described in Embodiment 1 also includes: the first casing also has a first panel and a first side wall arranged perpendicular to the first panel, and the first side wall extends from the first panel The edge is vertically arranged toward the direction of the storage unit, and the first engaging portion is arranged on the first side wall; the second casing also has a second panel and a second sidewall arranged perpendicular to the second panel, the second The side wall is vertically arranged from the edge of the second panel toward the direction of the storage unit, and the second locking part is arranged on the second side wall; the first locking part is formed by processing the first side wall; or the second locking part is formed by processing the first side wall; The two locking parts are formed by processing the second side wall.
實施例3:如實施例2描述之固態硬碟還包含:該第一殼體在該第一面板接近於該扣合結構的位置上開設有第一通孔;或者該第二殼體在該第二面板接近於該扣合結構的位置上開設有第二通孔。 Embodiment 3: The solid-state hard disk as described in Embodiment 2 further includes: the first housing is provided with a first through hole at a position close to the fastening structure on the first panel; or the second housing is provided at the position A second through hole is opened on the second panel at a position close to the fastening structure.
實施例4:如實施例3描述之固態硬碟,該第一通孔提供第一工具從該第一通孔進入以釋放該扣合結構,該第二通孔提供第二工具從該第二通孔進入以釋放該扣合結構。 Embodiment 4: As described in Embodiment 3, the solid state hard disk, the first through hole provides a first tool to enter through the first through hole to release the fastening structure, and the second through hole provides a second tool to enter through the second through hole. The through hole enters to release the snap-fit structure.
實施例5:如實施例1描述之固態硬碟還包含:該第二殼體還具有附接孔,以供該第二殼體附接至主機裝置;或者該第二殼體還具有裝配定位孔,以供該儲存單元附接至該第二殼體。 Embodiment 5: The solid-state hard disk as described in Embodiment 1 also includes: the second casing also has an attachment hole for the second casing to be attached to the host device; or the second casing also has an assembly location A hole is provided for the storage unit to be attached to the second housing.
實施例6:如實施例1描述之固態硬碟,該第一卡合部係選自公扣件、卡扣件、卡合件、卡固件、卡榫件、卡勾件、卡接件、凸點、突起件、母扣件、卡溝、通孔、卡接孔、卡槽、凹槽、凹陷以及盲孔其中之一,該第二卡合部係選自公扣件、卡扣件、卡合件、卡固件、卡榫件、卡勾件、卡接件、凸點、突起件、母扣件、卡溝、通孔、卡接孔、卡槽、凹槽、凹陷以及盲孔其中之一。 Embodiment 6: The solid state hard disk as described in Embodiment 1, the first engaging part is selected from male fasteners, buckle parts, snap parts, clip parts, tenon parts, hook parts, clip parts, protrusions One of points, protrusions, female fasteners, card grooves, through holes, card connection holes, card slots, grooves, depressions and blind holes, the second engaging part is selected from male fasteners, card fasteners, card Fittings, clips, tenons, hooks, clips, bumps, protrusions, female fasteners, grooves, through holes, holes, slots, grooves, depressions, and blind holes one.
實施例7:如實施例1描述之固態硬碟,該第一殼體與該第二殼體之材質係選自聚碳酸酯(PC)材料、丙烯腈-丁二烯-苯乙烯共聚物(ABS)材料、聚碳酸酯-丙烯腈-丁二烯-苯乙烯共聚物混合物(PC/ABS)複合材料、基於丙烯腈-丁二烯-苯乙烯共聚物之複合材料、合金材料及其組合其中之一。 Embodiment 7: As described in Embodiment 1, the solid state hard disk, the material of the first casing and the second casing is selected from polycarbonate (PC) material, acrylonitrile-butadiene-styrene copolymer ( ABS) materials, polycarbonate-acrylonitrile-butadiene-styrene copolymer mixture (PC/ABS) composite materials, composite materials based on acrylonitrile-butadiene-styrene copolymers, alloy materials and combinations thereof one.
實施例8:如實施例1描述之固態硬碟,該儲存單元包含電路基板以及設置於該電路基板上包含複數非揮發性記憶體的非揮發性記憶體陣列以及連接器。 Embodiment 8: The solid-state hard disk as described in Embodiment 1, the storage unit includes a circuit substrate, a non-volatile memory array including a plurality of non-volatile memories disposed on the circuit substrate, and a connector.
實施例9:如實施例8描述之固態硬碟,該等非揮發性記憶體係選自3D NAND快閃記憶體、V-NAND快閃記憶體、QLC NAND快閃記憶體、TLC NAND快閃記憶體、MLC NAND快閃記憶體及SLC NAND快閃記憶體其中之一,該連接器使用之傳輸介面規格係選自PCIe介面、NVMe介面、M.2介面、U.2介面、mSATA介面、SATA介面、SATA Express介面、AHCI介面、UATA介面、ZIF介面、IDE介面、CF介面及CFast介面其中之一。 Embodiment 9: The solid-state hard disk as described in embodiment 8, these non-volatile memory systems are selected from 3D NAND flash memory, V-NAND flash memory, QLC NAND flash memory, TLC NAND flash memory one of MLC NAND flash memory and SLC NAND flash memory, the transmission interface specification used by the connector is selected from PCIe interface, NVMe interface, M.2 interface, U.2 interface, mSATA interface, SATA One of interface, SATA Express interface, AHCI interface, UATA interface, ZIF interface, IDE interface, CF interface and CFast interface.
實施例10:一種固態硬碟,其包含:至少一卡合機構,其包含在位置上相互對應的第一卡合部與第二卡合部;第一殼體,其具有該第 一卡合部;第二殼體,其具有該第二卡合部,並與該第一殼體相互套合;以及固態儲存單元,其配置於該第一殼體與該第二殼體之間,其中該第一殼體與該第二殼體透過該至少一卡合機構彼此扣合連結。 Embodiment 10: A solid state hard disk, which includes: at least one engaging mechanism, which includes a first engaging portion and a second engaging portion corresponding to each other in position; a first housing, which has the first engaging portion a locking part; a second housing, which has the second locking part, and fits with the first housing; and a solid state storage unit, which is arranged between the first housing and the second housing Between, wherein the first casing and the second casing are buckled and connected to each other through the at least one engaging mechanism.
本發明各實施例彼此之間可以任意組合或者替換,從而衍生更多之實施態樣,但皆不脫本發明所欲保護之範圍,本發明保護範圍之界定,悉以本發明申請專利範圍所記載者為準。 The various embodiments of the present invention can be combined or replaced arbitrarily with each other, thereby deriving more implementation forms, but none of them depart from the intended protection scope of the present invention, and the definition of the protection scope of the present invention is fully defined by the patent scope of the present invention application The recorder shall prevail.
200:第二殼體 200: second shell
210:第二面板 210: second panel
223、224:第二側壁 223, 224: the second side wall
230:第二連接器開口 230: second connector opening
240:連接器開口 240: Connector opening
250:第二通孔 250: Second through hole
260:附接孔 260: Attachment hole
270:裝配定位孔 270: Assembly positioning hole
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110120394A TWI781646B (en) | 2021-06-04 | 2021-06-04 | Solid-state drive having housing with engaging mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110120394A TWI781646B (en) | 2021-06-04 | 2021-06-04 | Solid-state drive having housing with engaging mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI781646B true TWI781646B (en) | 2022-10-21 |
TW202249003A TW202249003A (en) | 2022-12-16 |
Family
ID=85462533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110120394A TWI781646B (en) | 2021-06-04 | 2021-06-04 | Solid-state drive having housing with engaging mechanism |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI781646B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205752855U (en) * | 2015-12-11 | 2016-11-30 | 东莞市米南实业有限公司 | A kind of SSD shell exempts from rivet fixed structure with adapter |
CN108430759A (en) * | 2015-11-23 | 2018-08-21 | 利奇得公司 | The rack-mounted storage assembly of grid type framework |
US20200117241A1 (en) * | 2015-11-18 | 2020-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
CN210956147U (en) * | 2019-09-30 | 2020-07-07 | 深圳市华广塑胶制品有限公司 | Solid state hard drives shell |
TWM605760U (en) * | 2020-09-07 | 2020-12-21 | 德邁科技有限公司 | Quick-release structure for computer components |
-
2021
- 2021-06-04 TW TW110120394A patent/TWI781646B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200117241A1 (en) * | 2015-11-18 | 2020-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
CN108430759A (en) * | 2015-11-23 | 2018-08-21 | 利奇得公司 | The rack-mounted storage assembly of grid type framework |
CN205752855U (en) * | 2015-12-11 | 2016-11-30 | 东莞市米南实业有限公司 | A kind of SSD shell exempts from rivet fixed structure with adapter |
CN210956147U (en) * | 2019-09-30 | 2020-07-07 | 深圳市华广塑胶制品有限公司 | Solid state hard drives shell |
TWM605760U (en) * | 2020-09-07 | 2020-12-21 | 德邁科技有限公司 | Quick-release structure for computer components |
Also Published As
Publication number | Publication date |
---|---|
TW202249003A (en) | 2022-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7269003B1 (en) | External box for hard disk drives | |
TWI487469B (en) | Combined rack for hard disk module | |
US7869218B2 (en) | Light-weight solid state drive with rivet sets | |
US7701725B2 (en) | Computer system with riser card | |
US9367084B2 (en) | Electronic device | |
TWM529759U (en) | Fan module | |
TW201506948A (en) | Expansion apparatus for solid state drive | |
CN205721582U (en) | A kind of novel hard disk backboard structure and comprise its server | |
TWI781646B (en) | Solid-state drive having housing with engaging mechanism | |
TW201703609A (en) | Server case | |
US8848357B2 (en) | Electronic device with connector | |
CN216871582U (en) | Solid state disk | |
US20130322006A1 (en) | Computer enclosure and mounting assembly for data storage device of the same | |
CN103729022A (en) | Portable electronic device | |
TWM548413U (en) | Server equipment with foolproof structure | |
JP3125255U (en) | Computer power supply mounting structure | |
TW201348929A (en) | Electronic device and memories thereof | |
JP2006331632A (en) | Cartridge carrier | |
TWM554693U (en) | Quick release set of computer storage device | |
US20100087094A1 (en) | Connector And Circuit Board For Multiple Transmission Interfaces | |
TWM502935U (en) | Modular housing and solid state disk | |
TWM562547U (en) | Case structure | |
US20050289572A1 (en) | External optical storage device having a dustproof cover | |
TW201536150A (en) | Mounting apparatus of data storage device | |
JP3770267B2 (en) | Memory card and electronic system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |