TWI781446B - Object Thickness Measurement Device - Google Patents

Object Thickness Measurement Device Download PDF

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Publication number
TWI781446B
TWI781446B TW109132793A TW109132793A TWI781446B TW I781446 B TWI781446 B TW I781446B TW 109132793 A TW109132793 A TW 109132793A TW 109132793 A TW109132793 A TW 109132793A TW I781446 B TWI781446 B TW I781446B
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Taiwan
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measuring device
conveying
frame
seat
thickness
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TW109132793A
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Chinese (zh)
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TW202212771A (en
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周勳乾
謝振盛
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萬潤科技股份有限公司
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Abstract

本發明係一種物件厚度量測裝置,包括:一座架;一輸送機構,設於該機台台面上,該輸送機構設有一軌座,該軌座上設有一輸送流道供搬送一物件;一第一量測器,設於該座架上對該輸送流道所搬送的該物件進行檢測;一移動機構,供該座架或輸送機構其中之一置設,並可驅動該座架或輸送機構相對該機台台面平移;藉此,以適用對可供輸送之物件進行厚度量測。The invention relates to a device for measuring the thickness of an object, comprising: a frame; a conveying mechanism arranged on the table top of the machine, the conveying mechanism is provided with a rail seat, and the rail seat is provided with a conveying channel for conveying an object; The first measuring device is set on the frame to detect the object conveyed by the conveying channel; a moving mechanism is set on one of the frame or the conveying mechanism, and can drive the frame or convey The mechanism moves in translation relative to the machine table; thereby, it is suitable for thickness measurement of objects that can be conveyed.

Description

物件厚度量測裝置Object Thickness Measuring Device

本發明係有關於一種厚度量測裝置,尤指一種用以對可供輸送之物件進行厚度量測之物件厚度量測裝置。 The present invention relates to a thickness measuring device, in particular to an object thickness measuring device for measuring the thickness of objects that can be transported.

按,隨著科技產業的迅速發展,對於高科技半導體晶片的搬送更為自動化,在製程精度的要求也更高,尤其電子元件間的貼合、堆疊或組合技術也更廣泛運用;而貼合、堆疊或組合都需考慮貼合或組合後的厚度,傳統的單一元件或貼合、堆疊、組合後的組件厚度檢測常將該元件或組件直接置於量測器下方載台進行量測,但在自動生產中,元件或組件常被快速搬送,例如由一供料裝置搬送至一加工主機,加工主機完成製程後再搬送出至一收料裝置,而供料裝置與加工主機之間,或加工主機與收料裝置之間,元件或組件等之待被檢測的物件常被複數個以矩陣方式置於一載盤,並使該載盤被一軌道中的輸送皮帶所搬送。 According to, with the rapid development of the technology industry, the transfer of high-tech semiconductor chips is more automated, and the requirements for process accuracy are also higher, especially the bonding, stacking or combination technologies between electronic components are also widely used; and bonding , stacking or combination all need to consider the thickness after bonding or combination. The traditional single component or component thickness detection after bonding, stacking and combination usually places the component or component directly on the stage under the measuring device for measurement. However, in automatic production, components or components are often transported quickly, for example, from a feeding device to a processing host, and the processing host completes the process and then transported to a receiving device, and between the feeding device and the processing host, Or between the processing mainframe and the receiving device, components or components to be inspected are often placed on a tray in a matrix, and the tray is conveyed by a conveyor belt in a track.

該先前技術欲進行厚度量測時,常需將該載盤自該軌道中檢出在外另作檢測,若要對輸送皮帶所搬送的該載盤之物件進行量測,則由於物件本身在製造過程中可能存在表面各部位厚度不一的情況,且輸送皮帶高速的運輸速度的慣性作用下,運輸中的物件難以在極短時間內完全停止在精確的量測位置上,尤其複數個物件以矩陣方式置於該載盤,在逐一檢測時需驅動輸送皮帶以轉換被 檢測物件至檢測定位,頻繁的快速移動輸送皮帶所造成的位移錯動更易造成每一物件量測位置的定位偏移不一,因此在進行該物件的厚度量測時所檢測出的數值易具有不確定性。 When the prior art intends to measure the thickness, it is often necessary to detect the carrier plate from the track for additional detection. During the process, there may be situations where the thickness of each part of the surface is different, and under the inertia of the high-speed conveying speed of the conveyor belt, it is difficult for the objects in transportation to completely stop at the precise measurement position in a very short time, especially when multiple objects are The matrix is placed on the tray, and the conveyor belt needs to be driven to convert the From the detection of the object to the detection position, the displacement caused by the frequent and rapid movement of the conveyor belt is more likely to cause the positioning deviation of the measurement position of each object to be different, so the value detected when measuring the thickness of the object is easy to have Uncertainty.

爰是,本發明之目的,在於提供一種可適用對可供輸送之物件進行厚度量測之物件厚度量測裝置。 Therefore, the object of the present invention is to provide an object thickness measuring device that can be used to measure the thickness of the objects that can be transported.

本發明目的之物件厚度量測裝置,包括:一座架;一輸送機構,設於該機台台面上,該輸送機構設有一軌座,該軌座上設有一輸送流道供搬送一物件;一第一量測器,設於該座架上對該輸送流道所搬送的該物件進行檢測;一移動機構,供該座架或輸送機構其中之一置設,並可驅動該座架或輸送機構相對該機台台面平移。 The device for measuring the object thickness of the object of the present invention includes: a frame; a conveying mechanism, which is arranged on the table top of the machine, and the conveying mechanism is provided with a rail seat, and the rail seat is provided with a conveying channel for conveying an object; The first measuring device is set on the frame to detect the object conveyed by the conveying channel; a moving mechanism is set on one of the frame or the conveying mechanism, and can drive the frame or convey The mechanism translates relative to the table top of the machine.

本發明實施例之物件厚度量測裝置,由於在載盤停止於輸送流道時,藉由可X軸向或Y軸向移動的該移動機構,將整個座架或輸送機構位移,使以連同該載盤及其上的物件或整個第一量測器精準地移動到該量測區間內進行該物件的厚度量測,而非透過該輸送皮帶輸送該載盤連同該物件移動到該量測區間內,使得該物件可以不受該輸送皮帶完全停止前的晃動影響其精密定位。 In the object thickness measuring device of the embodiment of the present invention, when the carrier plate stops in the conveying flow channel, the entire seat frame or the conveying mechanism is displaced by the moving mechanism that can move in the X-axis or Y-axis, so that together with The carrier plate and the object on it or the entire first measuring device are accurately moved to the measurement area to measure the thickness of the object, instead of transporting the carrier plate and the object through the conveyor belt to move to the measurement In the interval, the precise positioning of the object will not be affected by the shaking before the conveyor belt stops completely.

A:座架 A: Mount

A1:支柱 A1: Pillar

A2:第一橫樑 A2: First beam

A21:第一檢視區間 A21: The first viewing interval

A22:第一載架 A22: The first carrier

A221:固定部 A221: Fixed part

A3:量測區間 A3: Measurement interval

A4:第二橫樑 A4: Second beam

A41:第二載架 A41: Second carrier

A42:第二檢視區間 A42: The second viewing interval

A5:量測區間 A5: Measurement interval

B:輸送機構 B: Conveying mechanism

B1:軌座 B1: rail seat

B11:第一側架 B11: First side frame

B111:第一上框邊 B111: First upper frame edge

B112:第一下框邊 B112: First lower frame edge

B113:第一前框邊 B113: First front frame edge

B114:第一後框邊 B114: First rear frame edge

B115:第一壓抵件 B115: The first pressing part

B116:滑座 B116: sliding seat

B12:第二側架 B12: Second side frame

B121:第二上框邊 B121: Second upper frame edge

B122:第二下框邊 B122: Second lower frame edge

B123:第二前框邊 B123: Second front frame edge

B124:第二後框邊 B124: Second rear frame edge

B125:第二壓抵件 B125: Second pressing piece

B13:輸送皮帶 B13: Conveyor belt

B14:基準單元 B14: Reference unit

B141:基準件 B141: Reference parts

B15:驅動件 B15: Driver

B151:螺桿 B151: screw

B152:樞桿 B152: Pivot

B16:連動件 B16: Linkage

B161:齒輪 B161: gear

B17:升降平台 B17: Lifting platform

B171:升降連動件 B171: Lifting linkage

B1711:滾輪 B1711:Roller

B172:吸嘴 B172: Nozzle

B173:通孔 B173: Through hole

B174:固定件 B174:Fixer

B1741:滑軌 B1741: slide rail

B1742:滑座 B1742: sliding seat

B1743:驅動件 B1743: Driver

B1744:驅動桿 B1744: Drive Rod

B1745:滑軌 B1745: slide rail

B175:作用件 B175: Action parts

B1751:導槽 B1751: Guide groove

B1752:被驅動件 B1752: driven part

B1753:滑座 B1753: sliding seat

B18:擋止機構 B18: Stop Mechanism

B181:擋止驅動件 B181: stop drive

B182:連動桿 B182: linkage rod

B183:樞接部 B183: Pivot joint

B184:擺動桿 B184: Oscillating rod

B185:擋止件 B185: Stopper

B186:樞轉部 B186: Pivot

B187:扣拉部 B187: Buckle and pull

B188:滑槽 B188: Chutes

B189:擋抵面 B189: Resisting surface

B2:置座 B2: seat

B21:底座 B21: base

B22:滑軌 B22: slide rail

B23:齒條座 B23: Rack seat

B3:輸送流道 B3: Delivery channel

C:移動機構 C: mobile mechanism

C1:第一軸向位移機構 C1: The first axial displacement mechanism

C11:第一底座 C11: First base

C12:線性馬達 C12: Linear motor

C121:主滑座 C121: Main slider

C13:滑軌 C13: slide rail

C14:第一承載座 C14: The first bearing seat

C2:第二軸向位移機構 C2: The second axial displacement mechanism

C21:第二底座 C21:Second base

C22:線性馬達 C22: Linear Motor

C221:主滑座 C221: Main slider

C23:滑軌 C23: slide rail

C231:副滑座 C231: Auxiliary slider

C24:第二承載座 C24: Second bearing seat

D:第一量測器 D: the first measuring device

E:第二量測器 E: Second measuring device

F:分光鏡 F: beam splitter

F1:第一側面 F1: first side

F2:第二側面 F2: second side

G:取像器 G: viewfinder

H:分光鏡 H: beam splitter

H1:鏤孔 H1: Perforated

J:座架 J: mount

J1:第一橫樑 J1: first beam

J2:第二橫樑 J2: Second beam

K:機台台面 K: Machine table

L1:第一中心軸線 L1: the first central axis

L2:第二中心軸線 L2: second central axis

M:輸送機構 M: conveying mechanism

M1:支座 M1: support

M2:軌座 M2: rail seat

M3:輸送流道 M3: Delivery channel

N1:第一取像器 N1: the first image picker

N2:第二取像器 N2: Second image picker

S:第二標準高度 S: second standard height

S1:第二量測距離值 S1: The second measurement distance value

S2:第三量測距離值 S2: The third measurement distance value

S3:第四量測距離值 S3: The fourth measurement distance value

S4:第五量測距離值 S4: The fifth measured distance value

T:載盤 T: tray

T1:鏤空區間 T1: hollow interval

T2:限位銷 T2: limit pin

W:物件 W: object

d:第一標準高度 d: first standard height

d1:第一基準距離值 d1: the first reference distance value

d2:第一量測距離值 d2: the first measured distance value

圖1係本發明實施例中待測之晶片物件放置於載盤之示意圖。 FIG. 1 is a schematic diagram of placing wafer objects to be tested on a carrier in an embodiment of the present invention.

圖2係本發明實施例中待測之基板(Substrate)物件示意圖。 FIG. 2 is a schematic diagram of a substrate object to be tested in an embodiment of the present invention.

圖3係本發明第一實施例示意圖。 Fig. 3 is a schematic diagram of the first embodiment of the present invention.

圖4係本發明第一實施例中該輸送機構之示意圖。 Fig. 4 is a schematic diagram of the conveying mechanism in the first embodiment of the present invention.

圖5係本發明第一實施例中該升降平台及相關機構一側之立體示意圖(一)。 Fig. 5 is a perspective view (1) of one side of the lifting platform and related mechanisms in the first embodiment of the present invention.

圖6係本發明第一實施例中該升降平台及相關機構另一側之立體示意圖(二)。 Fig. 6 is a perspective view (2) of the other side of the lifting platform and related mechanisms in the first embodiment of the present invention.

圖7係本發明第一實施例中該擋止機構中該擋止件之擋止示意圖。 Fig. 7 is a schematic view of the stop member in the stop mechanism in the first embodiment of the present invention.

圖8係本發明第一實施例中該擋止機構中該擋止件之脫離擋止之示意圖。 Fig. 8 is a schematic diagram of the disengagement of the stop member in the stop mechanism in the first embodiment of the present invention.

圖9係本發明第一實施例中該移動機構立體分解示意圖。 Fig. 9 is a three-dimensional exploded schematic diagram of the moving mechanism in the first embodiment of the present invention.

圖10係本發明第一實施例中進行厚度量測之計算方式示意圖。 FIG. 10 is a schematic diagram of a calculation method for thickness measurement in the first embodiment of the present invention.

圖11係本發明第二實施例示意圖。 Fig. 11 is a schematic diagram of the second embodiment of the present invention.

圖12係本發明第二實施例中一第一量測器與一第二量測器的對應關係示意圖。 FIG. 12 is a schematic diagram of the corresponding relationship between a first measuring device and a second measuring device in the second embodiment of the present invention.

圖13係本發明第二實施例中進行厚度量測之計算方式示意圖。 FIG. 13 is a schematic diagram of a calculation method for thickness measurement in the second embodiment of the present invention.

圖14本發明第三實施例中一第一量測器、一第二量測器、一取像器與一分光鏡的對應關係示意圖。 FIG. 14 is a schematic diagram of the corresponding relationship between a first measuring device, a second measuring device, an image pickup device and a beam splitter in the third embodiment of the present invention.

圖15本發明第四實施例示意圖。 Fig. 15 is a schematic diagram of the fourth embodiment of the present invention.

圖16本發明第五實施例示意圖。 Fig. 16 is a schematic diagram of the fifth embodiment of the present invention.

本發明實施例可對如圖1、2所示之物件W進行厚度量測,其中,圖1為例如球格陣列基板置入晶粒封裝後的晶片,圖2為薄片狀基板(Substrate),當該物件W為圖1之小體積晶片時,可以矩陣排列方式置於一載盤T之複數個矩陣排列的鏤空區間T1上進行操作,每一該鏤空區間T1內徑具有至少部份小於該物件W外徑的寬 度,使該物件W受該鏤空區間T1周緣外側支撐而可被保持於該載盤T上,並受該鏤空區間T1外近周緣之複數個限位銷T2限制水平位移。 The embodiment of the present invention can measure the thickness of the object W as shown in Figures 1 and 2, wherein Figure 1 shows, for example, a chip with a ball grid array substrate embedded in a die package, and Figure 2 shows a thin substrate (Substrate), When the object W is a small-volume wafer as shown in FIG. 1, it can be placed in a matrix arrangement on a plurality of matrix-arranged hollowed-out intervals T1 of a carrier T1 for operation, and the inner diameter of each hollowed-out interval T1 has at least a portion smaller than the The width of the outer diameter of the object W degree, so that the object W can be held on the carrier T by being supported by the outer periphery of the hollowed-out section T1, and the horizontal displacement is limited by a plurality of limit pins T2 near the outer periphery of the hollowed-out section T1.

請參閱圖3,本發明第一實施例可以如圖所示之裝置進行如圖1所示小體積晶片為例進行說明,該裝置設有:一座架A,以龍門型式架設於一機台台面K上,該座架A以兩支柱A1支撐位於上方之一第一橫樑A2,該第一橫樑A2下方形成供該物件W在其間進行厚度量測之一量測區間A3,該第一橫樑A2上側設有鏤空並垂直貫通至下側該量測區間A3的一第一檢視區間A21;一輸送機構B,設於該機台台面K上,該輸送機構B設有一軌座B1及供該軌座B1設置其上的一置座B2,該軌座B1上設有一輸送流道B3供搬送該物件W;一移動機構C,供該輸送機構B置設並可驅動該輸送機構B相對該座架A及該機台台面K進行X軸向或Y軸向之平移;一第一量測器D,設於該座架A之該第一橫樑A2上,其例如共軛交雷射測距器、LED----等可發射諸如雷射光束、LED光束之可見光束的非接觸式光學測距器,並設於固設於該第一橫樑A2的一第一載架A22上,及自該第一橫樑A2上方伸入的該第一檢視區間A21向下對該量測區間A3中該輸送流道B3所搬送的該物件W進行檢測。 Please refer to Fig. 3, the first embodiment of the present invention can be described by taking the device as shown in the figure to carry out the small-volume wafer as shown in Fig. 1 as an example. On K, the stand A uses two pillars A1 to support a first beam A2 located above, and a measurement section A3 is formed below the first beam A2 for the thickness measurement of the object W therebetween. The first beam A2 The upper side is provided with a first inspection section A21 which is hollowed out and vertically penetrates to the measurement section A3 on the lower side; a conveying mechanism B is arranged on the table top K of the machine, and the conveying mechanism B is provided with a rail seat B1 and for the rail The seat B1 is provided with a seat B2 on it, and the rail seat B1 is provided with a conveying channel B3 for conveying the object W; a moving mechanism C is provided for the conveying mechanism B and can drive the conveying mechanism B relative to the seat The frame A and the table top K of the machine are translated in the X-axis or the Y-axis; a first measuring device D is set on the first beam A2 of the frame A, such as a conjugate cross-laser ranging Devices, LEDs, etc. can emit non-contact optical range finders such as laser beams, LED beams of visible beams, and are arranged on a first carrier A22 fixed on the first beam A2, and The first inspecting section A21 protruding from above the first crossbeam A2 detects the object W transported by the conveying channel B3 in the measuring section A3 downward.

請參閱圖3、4,該輸送機構B的該軌座B1呈矩形框體狀,並設有矩形框體狀且相隔一間距並相互平行設置之一第一側架B11及一第二側架B12;其中,該第一側架B11框體狀上側的第一上框邊B111與該第二側架B12框體狀上側的第二上框邊B121相向的內側對應分別各設有一輸送皮帶B13,且以一驅動件B131驅動該輸 送皮帶B13運轉以形成位於該第一橫樑A2下方一輸送流道B3,該輸送流道B3的輸送方向在X、Y座標面上與該第一橫樑A2呈垂直交錯並可輸送該載盤T至該量測區間A3;該第一側架B11框體狀下側的第一下框邊B112與該第二側架B12框體狀下側的第二下框邊B122則設於該置座B2上;以該載盤T搬送流向所朝的前方為前端側,則該第一側架B11、第二側架B12框體狀前側立設的第一前框邊B113與第二前框邊B123設於該輸送流道B3的前端下方,而相對為後側立設的第一後框邊B114與第二後框邊B124則設於該輸送流道B3的後端下方;該第一側架B11、第二側架B12相向朝內的一側,各與每一該輸送皮帶B13對應的上方分別各設有第一壓抵件B115、第二壓抵件B125,該載盤T在該輸送皮帶B13及該第一壓抵件B115、第二壓抵件B125之間被該輸送皮帶B13輸送,其中,在量測呈薄片狀且面積較大之如圖2所示的基板時,該基板P可不需置放於該載盤T而直接承放於該輸送皮帶B13上被輸送;該輸送流道B3外的該第二側架B12之一側設有一基準單元B14,該基準單元B14中在與該載盤T上表面或該物件下底面同高的部位處設有例如塊規之一基準件B141供該第一量測器D進行基準距離量測,在該移動機構C驅動下,該基準件B141與該輸送機構B的該軌座B1、輸送流道B3及該載盤T和其上的該物件W同步位移;該基準單元B14的該基準件B141亦可為經檢測過的該物件W,例如置於該載盤T上的晶片、或經檢測過的如圖2所示的薄片狀基板。 Please refer to Figures 3 and 4, the rail seat B1 of the conveying mechanism B is in the shape of a rectangular frame, and is provided with a first side frame B11 and a second side frame in the shape of a rectangular frame separated by a distance and parallel to each other. B12; where the first upper frame edge B111 on the frame-shaped upper side of the first side frame B11 is opposite to the second upper frame edge B121 on the frame-shaped upper side of the second side frame B12. A conveyor belt B13 is respectively provided , and drive the output with a driver B131 The conveying belt B13 runs to form a conveying channel B3 located below the first beam A2. The conveying direction of the conveying channel B3 is perpendicular to the first beam A2 on the X and Y coordinate planes and can transport the tray T to the measurement interval A3; the first lower frame edge B112 of the frame-shaped lower side of the first side frame B11 and the second lower frame edge B122 of the frame-shaped lower side of the second side frame B12 are set on the seat On B2: with the forward side towards which the tray T is conveyed and flowed as the front end side, the first front frame side B113 and the second front frame side of the first side frame B11 and the second side frame B12 are erected on the frame-like front side B123 is arranged under the front end of the conveying channel B3, and the first rear frame side B114 and the second rear frame side B124 which are vertically arranged on the rear side are arranged under the rear end of the conveying channel B3; the first side On the side facing inwardly of the frame B11 and the second side frame B12, a first pressing member B115 and a second pressing member B125 are respectively provided on the top corresponding to each of the conveyor belts B13, and the carrier T is placed on the top of the conveyor belt B13. The conveyor belt B13, the first pressing member B115, and the second pressing member B125 are conveyed by the conveying belt B13, wherein, when measuring a sheet-shaped substrate with a large area as shown in FIG. 2 , the The substrate P can be directly placed on the conveying belt B13 without being placed on the tray T to be conveyed; one side of the second side frame B12 outside the conveying channel B3 is provided with a reference unit B14, and the reference unit B14 A reference part B141 such as a block gauge is provided at the same height as the upper surface of the carrier T or the lower bottom surface of the object for the first measuring device D to measure the reference distance. Driven by the moving mechanism C, The reference part B141 is displaced synchronously with the rail seat B1, the delivery channel B3, the carrier T and the object W on the conveying mechanism B; the reference part B141 of the reference unit B14 can also be a detected The object W is, for example, a wafer placed on the tray T, or a inspected thin substrate as shown in FIG. 2 .

請參閱圖4、5,該輸送機構B的該置座B2設有位於一底座B21上相互平行呈Y軸向的二滑軌B22及二齒條座B23;該軌座B1的該第一下框邊B112與該第二下框邊B122間的該第一下框邊 B112上相間隔設有二滑座B116,該二滑座B116固設於該第一側架B11的該第一下框邊B112且位於該二滑軌B22上並可在其上作滑動位移;該第一側架B11、第二側架B12的該第一下框邊B112與該第二下框邊B122間於前端近角落處穿設有受一驅動件B15驅動的螺桿B151,並於後端近角落處設有未被驅動的一樞桿B152,該二滑座B116間則設有兩端各設有齒輪B161的連動件B16;藉由在該第二側架B12固定於該底座B21不動下,該驅動件B15驅動該螺桿B151使該第一側架B11在該樞桿B152支撐下位移,而連動該二滑座B116在該二滑軌B21上滑動位移,及藉該連動件B16兩端的各該齒輪B161在該二齒條座B23囓動,使該第一側架B11前、後端側的位移同步;藉由上述調整使該輸送流道B3寬度改變,以適應不同規格的物件W或載盤T的搬送。 Please refer to Figures 4 and 5, the seat B2 of the conveying mechanism B is provided with two slide rails B22 and two rack seats B23 parallel to each other in the Y-axis on a base B21; the first bottom of the rail seat B1 The first lower frame edge between the frame edge B112 and the second lower frame edge B122 Two sliding seats B116 are arranged at intervals on the B112, and the two sliding seats B116 are fixed on the first lower frame edge B112 of the first side frame B11 and are located on the two sliding rails B22 and can be slidably displaced thereon; Between the first lower frame side B112 and the second lower frame side B122 of the first side frame B11 and the second side frame B12, a screw rod B151 driven by a driving member B15 is pierced at the front end near the corner, and the rear A pivot bar B152 that is not driven is provided near the corner of the end, and a link B16 with a gear B161 at both ends is provided between the two sliding seats B116; by fixing the second side frame B12 to the base B21 When not moving, the driver B15 drives the screw B151 so that the first side frame B11 is displaced under the support of the pivot bar B152, and the two sliding seats B116 are linked to slide on the two slide rails B21, and the linkage B16 Each of the gears B161 at both ends meshes in the two rack seats B23 to synchronize the displacement of the front and rear ends of the first side frame B11; the width of the conveying channel B3 is changed by the above adjustment to adapt to different specifications. Transport of objects W or trays T.

該輸送機構B的該軌座B1形成該輸送機構B的該第一上框邊B111與第二上框邊B121相向內側的二輸送皮帶B13間,設有一升降平台B17,該升降平台B17前後兩端分別各受該第一前框邊B113與該第二前框邊B123間及該第一後框邊B114與該第二後框邊B124間的各一升降連動件B171同步連動可作上下位移以升降該載盤T;該升降平台B17上設有可吸附該載盤T底面的複數個吸嘴B172及對應該載盤T之複數鏤空區間T1的複數個通孔B173,對於使用在可無需藉載盤承載而直接在該輸送皮帶B13被搬送的如圖2基板進行量測時,該升降平台B17可以在升降過程中,藉由該載盤T上方兩側的該第一壓抵件B115、第二壓抵件B125壓平該基板以使其平整。 The rail seat B1 of the conveying mechanism B forms a lift platform B17 between the first upper frame edge B111 and the second upper frame edge B121 of the conveyer mechanism B and the two conveyor belts B13 on the inner side. Each end is respectively controlled by a lifting link B171 between the first front frame side B113 and the second front frame side B123 and between the first rear frame side B114 and the second rear frame side B124. To lift the tray T; the lifting platform B17 is provided with a plurality of suction nozzles B172 that can absorb the bottom surface of the tray T and a plurality of through holes B173 corresponding to the plurality of hollow intervals T1 of the tray T, which can be used without When measuring the substrate as shown in Figure 2 directly carried by the carrier plate and directly carried by the conveyor belt B13, the lifting platform B17 can use the first pressing member B115 on both sides above the carrier plate T during the lifting process. , The second pressing member B125 flattens the substrate to make it flat.

請參閱圖5、6,每一該升降連動件B171上端與該升降平台B1連動,下端則設在固定於該二滑座B116上呈X軸向的一固定件B174兩端分別所設之Z軸向滑軌B1741的滑座B1742上,每一該升降連動件B171下端分別各向相對該固定件B174的另一側凸設有一滾輪B1711,該滾輪B1711分別各樞設於與固定件B174保持間距相對並平行設置的一作用件B175於近兩端所開設的Y軸向鏤空的導槽B1751中,該導槽B1751呈長橢狀傾斜設置,其內徑的長度大於該滾輪B1711的直徑,該作用件B175上二該導槽B1751呈相同傾斜角度,在圖6中所顯示者為右上左下;在該固定件B174與該作用件B175相向內側的區間B176中,設有固定於該固定件B174的一電動缸所構成的驅動件B1743,及設有固定於該作用件B175的一被驅動件B1752,該驅動件B1743以一驅動桿B1744的一端與該被驅動件B1752連動;在該固定件B174與該作用件B175相向內側的區間B176中,該驅動件B1743兩端外側的該固定件B174上分別各設有X軸向的一滑軌B1745,而對應各該滑軌B1745的該作用件B175上則分別各設有一滑座B1753,該滑座B1753在該滑軌B1745上可作X軸向位移,並在該固定件B174不動下,連動該作用件B175相對該固定件B174作X軸向位移;故當該驅動件B1743以該驅動桿B1744驅動使該被驅動件B1752連動時,該作用件B175藉該滑座B1753在該滑軌B1745上的X軸向位移,將以該作用件B175近兩端的各該導槽B1751導引各該滾輪B1711斜向上昇或下降,並據以連動各該升降連動件B171藉該滑座B1742在該Z軸向滑軌B1741作上、下位移,以昇降該升降平台B1。 Please refer to Figures 5 and 6, the upper end of each lifting linkage B171 is linked with the lifting platform B1, and the lower end is fixed on the two ends of a fixed piece B174 fixed on the two sliding seats B116 in the X-axis. On the sliding seat B1742 of the axial slide rail B1741, a roller B1711 protrudes from the lower end of each lifting linkage B171 to the other side opposite to the fixing piece B174, and each of the rollers B1711 is pivotally mounted on and held by the fixing piece B174. An action piece B175 arranged oppositely and parallel to each other is set in a Y-axis hollow guide groove B1751 near both ends. The guide groove B1751 is obliquely arranged in an oblong shape, and its inner diameter is longer than the diameter of the roller B1711. The two guide grooves B1751 on the active part B175 have the same inclination angle, which is upper right and lower left as shown in Fig. 6; The driving part B1743 formed by an electric cylinder of B174 is provided with a driven part B1752 fixed on the active part B175, and the driving part B1743 is linked with the driven part B1752 by one end of a driving rod B1744; In the inner section B176 of the part B174 and the active part B175, the fixing part B174 outside the two ends of the driving part B1743 is respectively provided with a slide rail B1745 in the X-axis direction, corresponding to the function of each slide rail B1745 A sliding seat B1753 is respectively provided on the parts B175, and the sliding seat B1753 can make an X-axis displacement on the slide rail B1745, and when the fixing part B174 does not move, the active part B175 moves X relative to the fixing part B174. Axial displacement; therefore, when the driving part B1743 is driven by the driving rod B1744 to make the driven part B1752 move in unison, the X-axis displacement of the active part B175 on the slide rail B1745 by the slide seat B1753 will use the action The guide grooves B1751 near both ends of the component B175 guide the rollers B1711 to rise or fall obliquely, and accordingly the lifting linkages B171 are moved up and down on the Z-axis slide rail B1741 through the sliding seat B1742 , to lift the lifting platform B1.

請參閱圖5,該輸送機構B於該軌座B1設有一擋止機構B18,該擋止機構B18於該第一前框邊B113與該第二前框邊B123間設有一擋止驅動件B181,該擋止驅動件B181驅動一連動桿B182作上、下位移,以連動以一樞接部B183樞設於該軌座B1之一擺動桿B184的一端,該擺動桿B184的另一端接設一擋止件B185,請同時配合參閱圖7,該擋止件B185設有一樞轉部B186及一扣拉部B187,該扣拉部B187受該擺動桿B184一端長橢狀的一滑槽B188所扣拉並可於該滑槽B188中滑移,該扣拉部B187與該樞轉部B186保持一間距,使該扣拉部B187因該擺動桿B184的擺動位移而可在該滑槽B188中滑移,並以該擋止件B185的一擋抵面B189對該輸送流道B3中被搬送的該載盤T或物件W如圖7所示執行擋抵定位,或如圖8所示使該擋抵面B189擺移於該輸送流道B3下方供該載盤T或物件W通過。 Please refer to Fig. 5, the conveying mechanism B is provided with a stop mechanism B18 on the rail base B1, and the stop mechanism B18 is provided with a stop drive member B181 between the first front frame side B113 and the second front frame side B123 , the stop driving member B181 drives a linkage rod B182 to move up and down, and is pivotally arranged on one end of a swing rod B184 of the rail seat B1 with a pivot joint B183 in conjunction with the other end of the swing rod B184. A stopper B185, please refer to Fig. 7 at the same time, the stopper B185 is provided with a pivoting part B186 and a buckle part B187, the buckle part B187 is received by an oblong chute B188 at one end of the swing bar B184 The buckle is pulled and can slide in the chute B188, the buckle part B187 keeps a distance from the pivot part B186, so that the buckle part B187 can slide in the chute B188 due to the swing displacement of the swing lever B184 slide in the center, and perform abutment positioning on the tray T or object W conveyed in the conveying channel B3 with a abutting surface B189 of the stopper B185 as shown in FIG. 7 , or as shown in FIG. 8 The abutting surface B189 is swung below the conveying channel B3 for the tray T or the object W to pass through.

請參閱圖3、9,該移動機構C設有一第一軸向位移機構C1與一第二軸向位移機構C2;其中,該第一軸向位移機構C1設於該輸送機構B與該第二軸向位移機構C2之間,其在一第一底座C11上設有一鐵心式線性馬達C12並在該鐵心式線性馬達C12上一主滑座C121作X軸向位移路徑的兩側分別相隔間距平行各設有一滑軌C13,每一滑軌C13上分別各設有二副滑座C131,所述該主滑座C121、副滑座C131上共同載設一第一承載座C14,該第一承載座C14供該輸送機構B下方的該置座B2置設並連動;該第二軸向位移機構C2設於該第一軸向位移機構C1下方,其在一第二底座C21上設有一鐵心式線性馬達C22,並在該鐵心式線性馬達C22上一主滑座C221作Y軸向位移路徑的兩側分別相隔間距平行各設有一滑軌 C23,每一滑軌C23上分別各設有一副滑座C231,所述該主滑座C221、副滑座C231上共同載設一第二承載座C24,該第二承載座C24供第一軸向位移機構C1及其上的該輸送機構B置設並連動;該第二軸向位移機構C2之鐵心式線性馬達C22Y軸向的位移動路的第一中心軸線L1與該座架A之該第一橫樑A2Y軸向的第二中心軸線L2間相隔一間距,使該位移中心軸線L1朝該輸送流道B3後端偏位,該偏位使當該載盤W在該輸送流道B3近中央位置被定位時,該第一量測器D下方可以恰對應該載盤W的前端,俾可便於起始量測的進行。 Please refer to Figures 3 and 9, the moving mechanism C is provided with a first axial displacement mechanism C1 and a second axial displacement mechanism C2; wherein, the first axial displacement mechanism C1 is located between the conveying mechanism B and the second Between the axial displacement mechanism C2, it is provided with an iron-core linear motor C12 on a first base C11, and on the iron-core linear motor C12, a main slide seat C121 is used as the two sides of the X-axis displacement path, respectively spaced apart and parallel Each is provided with a slide rail C13, and each slide rail C13 is respectively provided with two auxiliary sliding seats C131, and the main sliding seat C121 and the auxiliary sliding seat C131 are jointly equipped with a first bearing seat C14, and the first bearing The seat C14 is provided for the seat B2 below the conveying mechanism B to be set and linked; the second axial displacement mechanism C2 is arranged below the first axial displacement mechanism C1, and it is provided with an iron core type on a second base C21. Linear motor C22, and on the core type linear motor C22, a main slide seat C221 is used as the Y-axis displacement path on both sides of the Y-axis displacement path. C23, each slide rail C23 is respectively provided with a secondary slide seat C231, the main slide seat C221 and the secondary slide seat C231 are jointly equipped with a second bearing seat C24, the second bearing seat C24 is used for the first shaft The first central axis L1 of the axial displacement path of the iron-core linear motor C22Y of the second axial displacement mechanism C2 and the first central axis L1 of the seat A There is a distance between the second center axis L2 of the first crossbeam A2Y in the axial direction, so that the displacement center axis L1 is biased toward the rear end of the delivery channel B3, and the offset makes the carrier W near the delivery channel B3. When the central position is positioned, the bottom of the first measuring device D can be aligned with the front end of the carrier W, so as to facilitate the initial measurement.

本發明第一實施例中,當承載複數個物件W的該載盤T由前一供料裝置供料或一製程的機台加工後被搬送欲進入該輸送機構B的該輸送流道B3時,該移動機構C的該第一軸向位移機構C1與該第二軸向位移機構C2分別以X軸向或Y軸向移動以連動該輸送機構B,令該輸送機構B的該輸送流道B3的後端位於該供料裝置或前一製程的機台的出口端,該驅動件B131驅動該輸送皮帶B13運轉而帶動該載盤T作直線位移輸送,藉以導引該載盤T進入該輸送流道B3中,同時該擋止驅動件B181驅動該擋止件B185擋止於該輸送流道B3內,藉使該載盤T停止前進在一搬送定位處;該載盤T定位後,該驅動件B1743驅動使該作用件B175與該藉該滑座B1753在該滑軌B1745上的X軸向位移,將以該作用件B175近兩端的各該導槽B1751導引各該滾輪B1711斜向上昇或下降,並據以連動各該升降連動件B171藉該滑座B1742在該Z軸向滑軌B1741作上、下位移,以昇降該升降平台B17,直到接觸該載盤T 下方並以該升降平台B17的吸嘴B172吸附該載盤T,此時該載盤T完全停止於該輸送流道B3上一預設高度處;該載盤T停止於該輸送流道B3時,透過該移動機構C的該第一軸向位移機構C1與該第二軸向位移機構C2分別以X軸向或Y軸向移動,將該輸送流道B3上的該載盤T位移至該第一量測器D下方所對應的該量測區間A3內一量測定位處,以進行該載盤T上該物件W的厚度量測,而非透過該輸送皮帶B13輸送該載盤T連同該物件W移動到該量測區間A3內,使得該物件W可以不受該輸送皮帶B13完全停止前的晃動影響其精密定位。 In the first embodiment of the present invention, when the tray T carrying a plurality of objects W is fed by a previous feeding device or processed by a machine of a process, it is transported to enter the conveying channel B3 of the conveying mechanism B , the first axial displacement mechanism C1 and the second axial displacement mechanism C2 of the moving mechanism C respectively move in the X-axis or the Y-axis to link the conveying mechanism B, so that the conveying channel of the conveying mechanism B The rear end of B3 is located at the outlet end of the feeding device or the machine of the previous process. The driving member B131 drives the conveyor belt B13 to run and drives the carrier T for linear displacement transportation, so as to guide the carrier T into the In the conveying channel B3, at the same time, the stop drive member B181 drives the stopper B185 to stop in the conveying channel B3, so that the tray T stops advancing at a transport positioning position; after the tray T is positioned, The driving part B1743 drives the X-axis displacement of the active part B175 and the sliding seat B1753 on the slide rail B1745, and guides the rollers B1711 obliquely with the guide grooves B1751 near both ends of the active part B175. Up or down, and according to this, each lifting linkage B171 is moved up and down on the Z-axis slide rail B1741 by the sliding seat B1742, so as to lift the lifting platform B17 until it touches the carrier T The carrier T is sucked by the suction nozzle B172 of the lift platform B17, and the carrier T is completely stopped at a preset height on the delivery channel B3; when the carrier T is stopped at the delivery channel B3 , through the first axial displacement mechanism C1 and the second axial displacement mechanism C2 of the moving mechanism C to move in the X-axis or Y-axis respectively, the carrier T on the delivery channel B3 is displaced to the A measurement position in the measurement section A3 corresponding to the lower part of the first measuring device D is used to measure the thickness of the object W on the carrier T, instead of conveying the carrier T together with the conveying belt B13 The object W moves into the measurement interval A3, so that the precise positioning of the object W will not be affected by the shaking before the conveyor belt B13 stops completely.

在進行厚度量測時,請同時參閱圖10,該第一量測器D先對該基準單元B14中該基準件B141上表面以可見光束測距,以取得用來比較的一第一基準距離值d1,再以該第一量測器D對該載盤T上該物件W的上表面進行測距,以取得一第一量測距離值d2,由於該基準件的第一標準高度d為已知,且該基準件B141與該物件W置於相同高度的部位,則由第一基準距離值d1與第一量測距離值d2的差異即可推得該物件W的厚度為:(d1+d)-d2。 When measuring the thickness, please also refer to FIG. 10 , the first measuring device D first measures the distance of the upper surface of the reference part B141 in the reference unit B14 with a visible beam to obtain a first reference distance for comparison value d1, and then use the first measuring device D to measure the distance of the upper surface of the object W on the tray T to obtain a first measured distance value d2, because the first standard height d of the reference part is Known, and the reference part B141 and the object W are placed at the same height, then the thickness of the object W can be deduced from the difference between the first reference distance d1 and the first measured distance d2: (d1 +d)-d2.

當量測完畢後,該擋止驅動件B181帶動該擋止件B185旋擺至低於該載盤T的位置以供該載盤T通過,該移動機構C的該第一軸向位移機構C1與該第二軸向位移機構C2分別以X軸向或Y軸向移動該輸送機構B,令該輸送機構B的該輸送流道B3的前端位於一收料裝置或一下一製程的機台入口端,使該驅動件B131驅動該輸送皮帶B13運轉而帶動該載盤T作直線位移輸送該載盤T至該收料裝置或該下一製程的機台。 After the measurement is completed, the stop driving part B181 drives the stop part B185 to swing to a position lower than the carrier T for the carrier T to pass through, and the first axial displacement mechanism C1 of the moving mechanism C Move the conveying mechanism B in the X-axis or Y-axis with the second axial displacement mechanism C2, so that the front end of the conveying channel B3 of the conveying mechanism B is located at the entrance of a receiving device or a machine for the next process end, so that the driving member B131 drives the conveyor belt B13 to run and drives the tray T to make a linear displacement to transport the tray T to the material receiving device or the machine of the next process.

當使用的載盤T不同規格時,可透過該驅動件B15驅動該螺桿B151旋轉,以使該第一側架B11在該樞桿B152支撐下位移,使該輸送流道B3寬度改變,以適應不同規格的物件W或載盤T的搬送。 When the tray T used is of different specifications, the screw B151 can be driven to rotate through the drive member B15, so that the first side frame B11 can be displaced under the support of the pivot B152, so that the width of the conveying channel B3 can be changed to suit Transport of objects W or trays T of different specifications.

本發明第一實施例藉由該輸送流道B3搬送該物件W,及設有具一第一標準高度的基準件B141之該基準單元B14,配合可發射可見光束進行距離量測的第一量測器D,使該第一量測器D對該基準件B141上表面以可見光束測距,以取得一第一基準距離值d1;及以該第一量測器D對該物件W的上表面進行測距,以取得一第一量測距離值d2;並藉比較計算該第一標準高度d、第一基準距離值d1、第一量測距離值d2以取得該物件W厚度,使被搬送的該物件W可獲得精確的厚度量測。 In the first embodiment of the present invention, the object W is transported through the conveying channel B3, and the reference unit B14 is provided with a reference part B141 having a first standard height, and cooperates with a first quantity capable of emitting visible light beams for distance measurement. Measuring device D, so that the first measuring device D measures the distance of the upper surface of the reference part B141 with a visible beam to obtain a first reference distance value d1; and using the first measuring device D to measure the upper surface of the object W Surface distance measurement to obtain a first measured distance value d2; and by comparing and calculating the first standard height d, the first reference distance value d1, and the first measured distance value d2 to obtain the thickness of the object W, so that the The conveyed object W can obtain accurate thickness measurement.

本發明第二實施例可以如圖11、12所示,相較第一實施例更在與該第一橫樑A2相隔間距及平行下於該第一橫樑A2下方設一第二橫樑A4,使量測區間A5形成於該第一橫樑A2下方及該第二橫樑A4上方之間,並使該輸送機構B的該軌座B1之該第一上框邊B111與第二上框邊B121及其間的該輸送流道B3通過該量測區間A5,並將例如共軛交雷射測距器、LED----等可發射諸如雷射光束、LED光束之可見光束的非接觸式光學測距器的一第二量測器E設於該第二橫樑A4之一第二載架A41上,該第二量測器E自該第二橫樑A4所鏤空設置的一第二檢視區間A42由下往上朝向該第一橫樑A2下方及該第二橫樑A4上方之間的該量測區間A5,並位於該輸送流道B3及該物件W下方,其以投射可見光束對該物件W下方表面進行檢測;該第一量測器D與該第二量測器E可見光束所投射的光路係同軸 配置而方向相反;其中,該第二量測器E可見光束所投射的光路係穿經該升降平台B17的該通孔B173及該鏤空區間T1至該物件W之下表面;當物件W係放置於該輸送皮帶B13上時,該第二量測器E的光路係穿經二該輸送皮帶B13之間至該物件W之該下表面。 The second embodiment of the present invention can be shown in Figures 11 and 12. Compared with the first embodiment, a second beam A4 is arranged below the first beam A2 at a distance from and parallel to the first beam A2, so that The measuring section A5 is formed between the lower part of the first crossbeam A2 and the upper part of the second crossbeam A4, and makes the first upper frame side B111 and the second upper frame side B121 of the rail seat B1 of the conveying mechanism B and the distance between them The conveying flow channel B3 passes through the measurement interval A5, and the non-contact optical rangefinder that can emit visible beams such as laser beams and LED beams, such as conjugated cross-laser rangefinders, LEDs, etc. A second measuring device E is set on a second carrier A41 of the second beam A4, and the second measuring device E is from the bottom to the second viewing area A42 hollowed out by the second beam A4. It faces the measurement section A5 between the bottom of the first beam A2 and the top of the second beam A4, and is located below the conveying channel B3 and the object W, and detects the lower surface of the object W by projecting a visible light beam ; The first measuring device D is coaxial with the optical path system projected by the visible light beam of the second measuring device E The arrangement is opposite in direction; wherein, the optical path projected by the visible light beam of the second measuring device E passes through the through hole B173 of the lifting platform B17 and the hollowed-out area T1 to the lower surface of the object W; when the object W is placed When on the conveyor belt B13, the optical path of the second measuring device E passes between the two conveyor belts B13 to the lower surface of the object W.

請參閱圖13,本發明第二實施例在進行厚度量測時,該第一量測器D對該基準單元B14中該基準件B141上表面以可見光束測距,取得用來比較的一第二基準距離值S1,同時該第二量測器E對該基準件B141下表面以可見光束測距,取得用來比較的一第三基準距離值S2;再以該第一量測器D對該載盤T上該物件W的上表面進行測距,取得一第四量測距離值S3,同時該第二量測器E對該物件W的下表面進行測距,取得一第五量測距離值S4;由於該基準件的第二標準高度S為已知,則由第二基準距離值S1、第三基準距離值S2與第四量測距離值S3、第五量測距離值S4的差異即可推得該物件W的厚度為:(S1+S2+S)-(S3+S4)。 Please refer to FIG. 13 , in the second embodiment of the present invention, when measuring the thickness, the first measuring device D measures the distance of the upper surface of the reference part B141 in the reference unit B14 with a visible light beam, and obtains a first value for comparison. Two reference distance values S1, at the same time the second measuring device E measures the distance of the lower surface of the reference part B141 with a visible light beam to obtain a third reference distance value S2 for comparison; then use the first measuring device D to The upper surface of the object W on the tray T is measured to obtain a fourth measured distance value S3, and at the same time, the second measuring device E is used to measure the distance of the lower surface of the object W to obtain a fifth measured distance Distance value S4; Since the second standard height S of the reference part is known, then by the second reference distance value S1, the third reference distance value S2 and the fourth measurement distance value S3, the fifth measurement distance value S4 The difference can be used to deduce the thickness of the object W as: (S1+S2+S)-(S3+S4).

請參閱圖11、14,本發明第三實施例相較第二實施例更設呈四十五度傾斜之一分光鏡F於該輸送流道B3之上方,並對應位於該第一橫樑A2的該第一檢視區間A21正下方的該量測區間A5中;另設例如互補式金氧半導體(CMOS)或電荷耦合器件(CCD)之一取像器G於該輸送流道B3之上方,並位於該第一橫樑A2下方,該分光鏡F及該取像器G共同設於該第一載架A22一側向下延伸的一固定部A221;該取像器G呈水平設置並對應該分光鏡F位於旁側之一第一側面F1及該量測區間A5,其取像路徑以水平方向經該分光鏡F轉折後垂直至該物件W上表面;同時該第一量測器D呈垂直設置並對應該分光鏡F之一第二側面F2,該第一量測器D的可見光束向 下恰穿透該分光鏡F而抵至該物件W上表面,而使該第一量測器D在該分光鏡F至該物件W上表面間的光路,與該取像器G在該分光鏡F至該物件W上表面間的該取像路徑同軸,意即該光路在該取像器G自該分光鏡F的取像範圍內。 Please refer to Figures 11 and 14. Compared with the second embodiment, the third embodiment of the present invention has a beam splitter F inclined at forty-five degrees above the conveying flow channel B3 and correspondingly located on the first beam A2. In the measurement interval A5 directly below the first inspection interval A21; an image pickup G such as a complementary metal oxide semiconductor (CMOS) or a charge-coupled device (CCD) is additionally set above the delivery channel B3, and Located below the first beam A2, the beam splitter F and the image finder G are jointly arranged on a fixed portion A221 extending downward on one side of the first carriage A22; the image finder G is horizontally arranged and corresponds to the beam splitter The mirror F is located on one of the first side surfaces F1 and the measurement interval A5 on the side, and its imaging path is turned in the horizontal direction by the beam splitter F and then vertical to the upper surface of the object W; at the same time, the first measuring device D is vertical Set and correspond to one of the second side F2 of the beam splitter F, the visible light beam of the first measuring device D is directed to The bottom just penetrates the beam splitter F and reaches the upper surface of the object W, so that the optical path of the first measuring device D between the beam splitter F and the upper surface of the object W, and the image pickup G in the beam splitter The image capturing path between the mirror F and the upper surface of the object W is coaxial, which means that the optical path is within the image capturing range of the image finder G from the beam splitter F.

本發明第三實施例可以該取像器G先對該物件W上表面一個預設部位進行取像定位,再依該取像器G取得的定位由該第一量測器D及該第二量測器E進行對該物件W的該預設部位進行厚度量測;而在裝置如第一實施例僅設有該第一量測器D而無該第二量測器E的情況下,該取像器G同樣可以同理適用於該第一實施例中輔助先取得對預設部位的取像定位,再由該第一量測器D進行厚度量測;另外,該第一量測器D與該取像器G的位置係可以互換,在該第一量測器D在該分光鏡F至該物件W上表面間的光路,與該取像器G在該分光鏡F至該物件W上表面間的該取像路徑同軸的情況下,同理進行上述取像定位及厚度量測的實施。 In the third embodiment of the present invention, the image picker G can first take an image of a preset position on the upper surface of the object W, and then use the first measuring device D and the second measuring device D according to the position obtained by the image picker G. The measuring device E measures the thickness of the predetermined part of the object W; and in the case of the device such as the first embodiment, only the first measuring device D is provided without the second measuring device E, The image picker G can also be used in the first embodiment in the same way to assist in first obtaining the image capture position of the preset position, and then the thickness measurement is performed by the first measuring device D; in addition, the first measurement The positions of the image pickup device D and the image pickup device G can be interchanged, the optical path between the first measuring device D from the beam splitter F to the upper surface of the object W, and the image pickup device G from the beam splitter F to the In the case that the imaging paths between the upper surfaces of the object W are coaxial, the implementation of the above-mentioned imaging positioning and thickness measurement is similarly performed.

本發明第四實施例如圖15所示,可以使該分光鏡H形成一鏤孔H1,讓該第一量測器D的光路直接穿經該鏤孔H1至該物件W,則可以避免可見光束受到分光鏡H中漫射現象的干擾,增加可見光束測距的精準度。 The fourth embodiment of the present invention is shown in FIG. 15. A hollow hole H1 can be formed on the beam splitter H, and the optical path of the first measuring device D can directly pass through the hollow hole H1 to the object W, so that visible light beams can be avoided. Interferenced by the diffusion phenomenon in the beam splitter H, the accuracy of the distance measurement of the visible light beam is increased.

本發明第五實施例如圖16所示,可在一機台台面上將移動機構C設於座架J下方,使第一軸向位移機構C1呈Y軸向,第二軸向位移機構C2呈X軸向,該第一軸向位移機構C1設於該座架J與該第二軸向位移機構C2之間,以驅動該座架J被連動作X、Y軸向位移,並連動該座架J上的該第一量測器D、第二量測器E位移,及使輸送機構M以二支座M1分別跨於該座架J兩側並固定地設於該機台 台面K上,使該輸送機構M上的軌座M2上伸經該座架J一第一橫樑J1、一第二橫樑J2相隔間距所形成的量測區間J3中,而使該軌座M2上的輸送流道M3僅在定位提供輸送流路,並使載盤M4及設於該軌座M2一側的該基準單元B14的該基準件B141僅在定位提供量測,同時在該第一量測器D、第二量測器E一側相隔間距平行對應地於該輸送流道M3上方設有例如CCD鏡頭的由上往下檢視的第一取像器N1,及於該輸送流道M3下方設有例如CCD鏡頭的由下往上檢視的第二取像器N2;在量測時,由該移動機構C驅動該座架J相對該輸送機構C平移,同時連動該第一取像器N1、第二取像器N2取得該物件W預設量測點之定位後,再由該移動機構C驅動該座架J連動該第一量測器D、第二量測器E取得該物件W預設量測點之厚度資訊。 The fifth embodiment of the present invention is shown in Fig. 16. The moving mechanism C can be installed under the seat J on the table top of the machine, so that the first axial displacement mechanism C1 is in the Y direction, and the second axial displacement mechanism C2 is in the Y direction. In the X-axis direction, the first axial displacement mechanism C1 is arranged between the seat frame J and the second axial displacement mechanism C2 to drive the seat frame J to be displaced in the X and Y axial directions in conjunction with the seat The first measuring device D and the second measuring device E on the frame J are displaced, and the conveying mechanism M is fixedly set on the machine platform by straddling the two sides of the frame J with two supports M1 On the platform K, the rail seat M2 on the conveying mechanism M is extended through the measurement interval J3 formed by the seat frame J, the first crossbeam J1, and the second crossbeam J2, and the rail seat M2 is placed on the The conveying channel M3 of the conveying channel M3 provides a conveying flow path only at the positioning, and the carrier plate M4 and the reference member B141 of the reference unit B14 arranged on one side of the rail seat M2 only provide the measurement at the positioning, and at the same time, the first quantity One side of the measuring device D and the second measuring device E are spaced apart from each other and correspondingly above the conveying channel M3, a first image picker N1 such as a CCD lens for viewing from top to bottom is provided, and on the conveying channel M3 The bottom is provided with a second image pickup N2 such as a CCD lens that can be viewed from bottom to top; during measurement, the moving mechanism C drives the mount J to translate relative to the conveying mechanism C, and at the same time drives the first image pickup After N1 and the second image picker N2 obtain the position of the preset measurement point of the object W, the moving mechanism C drives the mount J to link the first measuring device D and the second measuring device E to obtain the object W presets the thickness information of the measuring point.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 But what is described above is only an embodiment of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.

A:座架 A: Mount

A1:支柱 A1: Pillar

A2:第一橫樑 A2: First beam

A21:第一檢視區間 A21: The first viewing interval

A22:第一載架 A22: The first carrier

A3:量測區間 A3: Measurement interval

B:輸送機構 B: Conveying mechanism

B1:軌座 B1: rail seat

B2:置座 B2: seat

B3:輸送流道 B3: Delivery channel

C:移動機構 C: mobile mechanism

D:第一量測器 D: the first measuring device

K:機台台面 K: Machine table

L1:第一中心軸線 L1: the first central axis

L2:第二中心軸線 L2: second central axis

T:載盤 T: tray

Claims (12)

一種物件厚度量測裝置,包括: 一座架; 一輸送機構,設於該機台台面上,該輸送機構設有一軌座,該軌座上設有一輸送流道供搬送一物件; 一第一量測器,設於該座架上對該輸送流道所搬送的該物件進行檢測; 一移動機構,供該座架或輸送機構其中之一置設,並可驅動該座架或輸送機構相對該機台台面平移。 A device for measuring the thickness of an object, comprising: a frame; A conveying mechanism is arranged on the table top of the machine, and the conveying mechanism is provided with a rail seat, and a conveying flow channel is provided on the rail seat for conveying an object; a first measuring device, installed on the frame to detect the object conveyed by the conveying channel; A moving mechanism is provided for one of the seat frame or the conveying mechanism, and can drive the seat frame or the conveying mechanism to translate relative to the table top of the machine. 如請求項1所述物件厚度量測裝置,其中,該座架以以兩支柱支撐位於上方之一第一橫樑,該第一橫樑下方形成供該物件在其間進行厚度量測之一量測區間。The device for measuring the thickness of an object according to claim 1, wherein the seat frame is supported by two pillars on a first crossbeam located above, and a measurement section is formed below the first crossbeam for the thickness measurement of the object therebetween . 如請求項1所述物件厚度量測裝置,其中,該輸送機構的該軌座呈矩形框體狀,並設有矩形框體狀且相隔一間距並相互平行設置之一第一側架及一第二側架;其中,該第一側架框體狀上側的第一上框邊與該第二側架框體狀上側的第二上框邊相向的內側對應分別各設有一輸送皮帶,且以一驅動件驅動該輸送皮帶運轉以形成該輸送流道。The object thickness measuring device as described in Claim 1, wherein, the rail seat of the conveying mechanism is in the shape of a rectangular frame, and is provided with a first side frame and a rectangular frame-shaped spaced apart and parallel to each other. The second side frame; wherein, the inner sides of the first upper frame edge on the frame-shaped upper side of the first side frame and the second upper frame edge on the second side frame-shaped upper side of the second side frame are respectively provided with a conveyor belt, and The conveying belt is driven to run by a driving member to form the conveying channel. 如請求項3所述物件厚度量測裝置,其中,該輸送機構設有供該軌座設置其上的一置座,該移動機構供該置座置設;該置座設有滑軌;該第二側架固定不動下,該第一側架可位移使該輸送流道寬度改變。The object thickness measuring device as described in claim 3, wherein, the conveying mechanism is provided with a seat on which the rail seat is set, and the moving mechanism is used for setting the seat; the seat is provided with a slide rail; When the second side frame is fixed, the first side frame can be displaced to change the width of the conveying channel. 如請求項1所述物件厚度量測裝置,其中,該輸送機構的該軌座設有一升降平台,該升降平台可作上下位移並設有吸嘴。The object thickness measuring device as described in Claim 1, wherein, the rail base of the conveying mechanism is provided with a lifting platform, and the lifting platform can be moved up and down and is provided with a suction nozzle. 如請求項5所述物件厚度量測裝置,其中,該升降平台前後兩端分別各受一升降連動件同步連動,每一該升降連動件設有一滾輪,該滾輪分別各樞設於與一固定件保持間距相對並平行設置的一作用件所開設的導槽中,一驅動件連動該作用件相對該固定件位移,以連動各該升降連動件作上、下位移,以昇降該升降平台。The object thickness measuring device as described in claim item 5, wherein, the front and rear ends of the lifting platform are respectively synchronously linked by a lifting linkage, each of the lifting linkages is provided with a roller, and the rollers are respectively pivoted on a fixed In the guide groove provided by an active part that is arranged in parallel and opposite to each other, a driving part is linked to the displacement of the active part relative to the fixed part, so as to move the lifting linkage parts up and down to lift the lifting platform. 如請求項1所述物件厚度量測裝置,其中,該輸送機構於該軌座設有一擋止機構,該擋止機構設有一擋止驅動件,該擋止驅動件驅動一連動桿作上、下位移,以連動以一樞接部樞設於該軌座之一擺動桿的一端,該擺動桿的另一端接設一擋止件。The object thickness measuring device as described in Claim 1, wherein, the conveying mechanism is provided with a stop mechanism on the rail seat, and the stop mechanism is provided with a stop driving part, and the stop driving part drives a linkage rod to move up and down. The downward displacement is connected with one end of a swing bar of the rail seat with a pivot joint, and a stopper is connected with the other end of the swing bar. 如請求項1所述物件厚度量測裝置,其中,該第一橫樑下方設一第二橫樑, 該量測區間形成於該第一橫樑下方及該第二橫樑上方之間,並使該輸送機構的該軌座之該輸送流道通過該量測區間;一第二量測器由下往上朝向該量測區間,並位於該輸送流道及該物件下方,其以投射可見光束對該物件下方表面進行檢測。The object thickness measuring device as described in Claim 1, wherein a second beam is arranged below the first beam, the measurement section is formed between the bottom of the first beam and the top of the second beam, and the conveying mechanism The conveying channel of the rail base passes through the measuring section; a second measuring device faces the measuring section from bottom to top, and is located under the conveying channel and the object, and projects a visible light beam on the object Check the surface below. 如請求項1所述物件厚度量測裝置,其中,該輸送流道上方設有一取像器,該取像器先對該物件上表面一個預設部位進行取像定位,再依該取像器取得的定位由該第一量測器進行對該物件的該預設部位進行厚度量測。The object thickness measuring device as described in claim 1, wherein an image picker is arranged above the conveying channel, and the image picker first takes an image of a preset position on the upper surface of the object, and then according to the image picker The obtained position is used by the first measuring device to measure the thickness of the preset part of the object. 如請求項9所述物件厚度量測裝置,其中,該取像器在該第一量測器一側相隔間距平行對應地於該輸送流道上方,設有由上往下檢視的第一取像器,及於該輸送流道下方設有由下往上檢視的第二取像器。The device for measuring the thickness of an object according to claim 9, wherein the image picker is arranged on the side of the first measuring device in parallel with a space above the conveying flow channel, and a first pick-up for viewing from top to bottom is provided. An imager, and a second imager for viewing from bottom to top is arranged below the conveying channel. 如請求項9所述物件厚度量測裝置,其中,該輸送流道上方設有一分光鏡;該取像器其取像路徑以水平方向經該分光鏡轉折後垂直至該物件上表面;該第一量測器以一雷射光束穿透該分光鏡而抵至該物件上表面,而使該第一量測器在該分光鏡至該物件上表面間的光路,與該取像器在該分光鏡至該物件上表面間的取像路徑同軸。The device for measuring the thickness of an object as described in Claim 9, wherein a beam splitter is arranged above the conveying channel; the imaging path of the image picker is turned horizontally by the beam splitter and then vertically to the upper surface of the object; A measuring device uses a laser beam to penetrate the beam splitter and reach the upper surface of the object, so that the optical path of the first measuring device between the beam splitter and the upper surface of the object, and the image picker at the The imaging path between the beam splitter and the upper surface of the object is coaxial. 如請求項11所述物件厚度量測裝置,其中,該分光鏡形成一鏤孔,讓該第一量測器的光路直接穿經該鏤孔至該物件。The object thickness measuring device as claimed in claim 11, wherein the beam splitter forms a hole, so that the optical path of the first measuring device directly passes through the hole to the object.
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JPH0387605A (en) * 1989-08-31 1991-04-12 Toshiba Corp Method and device for measuring film thickness
TWI282405B (en) * 2004-12-23 2007-06-11 Corning Inc Overlapping common-path interferometers for two-sided measurement
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TWI486550B (en) * 2014-01-20 2015-06-01 Nat Univ Tsing Hua An Optical Interferometry Based On-Line Real-Time Thickness Measurement Apparatus and Method Thereof

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JPH0387605A (en) * 1989-08-31 1991-04-12 Toshiba Corp Method and device for measuring film thickness
TWI282405B (en) * 2004-12-23 2007-06-11 Corning Inc Overlapping common-path interferometers for two-sided measurement
US20100195092A1 (en) * 2007-10-16 2010-08-05 Aisin Seiki Kabushiki Kaisha Noncontact film thickness measurement method and device
TWI486550B (en) * 2014-01-20 2015-06-01 Nat Univ Tsing Hua An Optical Interferometry Based On-Line Real-Time Thickness Measurement Apparatus and Method Thereof

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