TWI780810B - Non-volatile memory apparatus and a method for determining a read verification voltage - Google Patents
Non-volatile memory apparatus and a method for determining a read verification voltage Download PDFInfo
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本發明是有關於一種記憶體裝置及其操作電壓的決定方法,且特別是有關於一種非揮發性記憶體裝置及其讀取驗證電壓的決定方法。 The present invention relates to a memory device and its operating voltage determination method, and in particular to a non-volatile memory device and its read verification voltage determination method.
隨著電子科技的演進,電子裝置成為人們生活中必要的工具。例如快閃記憶體等的非揮發性記憶體裝置可提供長效且大量的資料儲存功能,已成為重要的資料儲存媒介。在非揮發性記憶體經過寫入操作之後,其臨界電壓分布曲線的最小值通常會大於寫入驗證電壓。然而,在非揮發性記憶體經烘烤(baking)後,其一部分的記憶體晶胞的臨界電壓可能會低於讀取驗證電壓,此部分的記憶體晶胞稱為保持失效位元(retention failure bit)。若臨界電壓低於讀取驗證電壓的記憶體晶胞過多可能會使得非揮發性記憶體裝置無法通過讀取驗證,表示其資料保持性能(retention performance)不佳,可靠度不足。 With the evolution of electronic technology, electronic devices have become a necessary tool in people's lives. Non-volatile memory devices such as flash memory can provide long-term and large-scale data storage functions, and have become important data storage media. After the write operation of the non-volatile memory, the minimum value of its threshold voltage distribution curve is usually greater than the write verification voltage. However, after the non-volatile memory is baked, the threshold voltage of a part of the memory unit cells may be lower than the read verification voltage, and this part of the memory unit cells is called a retention failure bit (retention). failure bit). If there are too many memory cells whose threshold voltage is lower than the read verification voltage, the non-volatile memory device may fail to pass the read verification, indicating that its data retention performance (retention performance) is poor and the reliability is insufficient.
除此之外,記憶體晶胞的臨界電壓分布曲線會受到溫度的影響而改變其峰值的位置。相較於室溫時的臨界電壓分布曲線,不同溫度的臨界電壓分布曲線的峰值會改變。此時,若讀取驗證電壓不隨之調整,可能會造成記憶體晶胞被判定為失效位元的數量會增加,造成驗證結果不一致。 In addition, the critical voltage distribution curve of the memory unit cell will change its peak position due to the influence of temperature. Compared with the critical voltage distribution curve at room temperature, the peak value of the critical voltage distribution curve at different temperatures will change. At this time, if the read verification voltage is not adjusted accordingly, the number of memory cells determined to be invalid may increase, resulting in inconsistent verification results.
本發明提供一種非揮發性記憶體裝置及其讀取驗證電壓的決定方法,可使不同溫度時的讀取驗證結果具有一致性。 The invention provides a non-volatile memory device and a method for determining the read verification voltage, which can make the read verification results consistent at different temperatures.
本發明的非揮發性記憶體裝置包括非揮發性記憶體以及記憶體控制器。非揮發性記憶體包括多個記憶體晶胞。記憶體控制器耦接至非揮發性記憶體。在第一溫度時,記憶體控制器利用第一參考驗證電壓對非揮發性記憶體進行讀取操作,以取得記憶體晶胞的失效位元數。在不同於第一溫度的第二溫度時,記憶體控制器對非揮發性記憶體進行多次讀取操作,並且逐次調整第一參考驗證電壓,以取得相同的失效位元數。在取得相同的失效位元數的該次讀取操作時所使用的參考驗證電壓為第二參考驗證電壓。記憶體控制器比較第一參考驗證電壓及第二參考驗證電壓以取得兩者的差值。 The non-volatile memory device of the present invention includes a non-volatile memory and a memory controller. Non-volatile memory includes multiple memory cells. The memory controller is coupled to the non-volatile memory. At the first temperature, the memory controller uses the first reference verification voltage to perform a read operation on the non-volatile memory to obtain the number of failed bits of the memory unit cell. When the second temperature is different from the first temperature, the memory controller performs multiple read operations on the non-volatile memory, and adjusts the first reference verification voltage successively to obtain the same number of failed bits. The reference verification voltage used when obtaining the same number of failed bits in the read operation is the second reference verification voltage. The memory controller compares the first reference verification voltage and the second reference verification voltage to obtain a difference between them.
在本發明的一實施例中,上述的第二溫度高於第一溫度。在第二溫度時,記憶體控制器逐次減少第一參考驗證電壓,以對非揮發性記憶體進行多次讀取操作。 In an embodiment of the present invention, the above-mentioned second temperature is higher than the first temperature. At the second temperature, the memory controller gradually reduces the first reference verification voltage to perform multiple read operations on the non-volatile memory.
在本發明的一實施例中,在第一溫度時,在記憶體控制器對非揮發性記憶體進行讀取操作之前,記憶體控制器先對非揮發性記憶體進行抹除操作,再對非揮發性記憶體進行寫入操作。 In an embodiment of the present invention, at the first temperature, before the memory controller performs a read operation on the non-volatile memory, the memory controller first performs an erase operation on the non-volatile memory, and then Write operation to non-volatile memory.
在本發明的一實施例中,上述的記憶體控制器根據寫入驗證電壓來決定第一參考驗證電壓。 In an embodiment of the present invention, the above memory controller determines the first reference verification voltage according to the write verification voltage.
在本發明的一實施例中,上述的記憶體控制器將寫入驗證電壓加上參考電壓差值,以決定第一參考驗證電壓。 In an embodiment of the present invention, the above-mentioned memory controller adds the writing verification voltage to the reference voltage difference to determine the first reference verification voltage.
在本發明的一實施例中,上述的第一參考驗證電壓是在第一溫度時記憶體晶胞的臨界電壓分布曲線的中央臨界電壓。 In an embodiment of the present invention, the above-mentioned first reference verification voltage is the central threshold voltage of the threshold voltage distribution curve of the memory cell at the first temperature.
在本發明的一實施例中,上述的記憶體晶胞當中臨界電壓小於及等於第一參考驗證電壓的數量為記憶體晶胞的失效位元數。 In an embodiment of the present invention, the number of memory cells whose threshold voltage is less than or equal to the first reference verification voltage is the number of failed bits of the memory cell.
在本發明的一實施例中,記憶體控制器在第一溫度時利用第一讀取驗證電壓對非揮發性記憶體進行讀取操作。記憶體控制器在第二溫度時利用第二讀取驗證電壓對非揮發性記憶體進行讀取操作。第二讀取驗證電壓是第一讀取驗證電壓加上差值。 In an embodiment of the present invention, the memory controller uses a first read verification voltage to perform a read operation on the non-volatile memory at a first temperature. The memory controller uses the second read verification voltage to perform a read operation on the non-volatile memory at the second temperature. The second read verify voltage is the first read verify voltage plus a difference.
本發明的非揮發性記憶體裝置的讀取驗證電壓的決定方法包括:在第一溫度時,利用第一參考驗證電壓對非揮發性記憶體進行讀取操作,以取得記憶體晶胞的失效位元數;在不同於第 一溫度的第二溫度時,對非揮發性記憶體進行多次讀取操作,並且逐次調整第一參考驗證電壓,以取得相同的失效位元數。在取得相同的失效位元數的該次讀取操作時所使用的參考驗證電壓為第二參考驗證電壓;比較第一參考驗證電壓及第二參考驗證電壓以取得兩者的差值;以及根據第一參考驗證電壓及第二參考驗證電壓的差值以及第一溫度的讀取驗證電壓來決定第二溫度的讀取驗證電壓。 The method for determining the read verification voltage of the non-volatile memory device of the present invention includes: at the first temperature, using the first reference verification voltage to perform a read operation on the non-volatile memory to obtain failure of the memory unit cell number of bits; When the first temperature is the second temperature, multiple read operations are performed on the non-volatile memory, and the first reference verification voltage is adjusted successively to obtain the same number of failed bits. The reference verification voltage used when obtaining the read operation with the same number of failed bits is the second reference verification voltage; comparing the first reference verification voltage and the second reference verification voltage to obtain a difference between the two; and according to The difference between the first reference verification voltage and the second reference verification voltage and the read verification voltage at the first temperature determine the read verification voltage at the second temperature.
在本發明的一實施例中,上述的第二溫度高於第一溫度。在第二溫度時,逐次減少第一參考驗證電壓,以對非揮發性記憶體進行多次讀取操作。 In an embodiment of the present invention, the above-mentioned second temperature is higher than the first temperature. At the second temperature, the first reference verification voltage is gradually reduced to perform multiple read operations on the non-volatile memory.
在本發明的一實施例中,上述的非揮發性記憶體裝置的讀取驗證電壓的決定方法更包括:在第一溫度時,在對非揮發性記憶體進行讀取操作之前,先對非揮發性記憶體進行抹除操作,再對非揮發性記憶體進行寫入操作。 In an embodiment of the present invention, the method for determining the read verification voltage of the non-volatile memory device further includes: at the first temperature, before performing the read operation on the non-volatile memory, The volatile memory is erased, and then the non-volatile memory is written.
在本發明的一實施例中,上述的非揮發性記憶體裝置的讀取驗證電壓的決定方法更包括:根據寫入驗證電壓來決定第一參考驗證電壓。 In an embodiment of the present invention, the method for determining the read verification voltage of the non-volatile memory device further includes: determining a first reference verification voltage according to the write verification voltage.
在本發明的一實施例中,在根據寫入驗證電壓來決定第一參考驗證電壓的步驟中,是將寫入驗證電壓加上參考電壓差值,以決定第一參考驗證電壓。 In an embodiment of the present invention, in the step of determining the first reference verification voltage according to the writing verification voltage, the writing verification voltage is added to the reference voltage difference to determine the first reference verification voltage.
在本發明的一實施例中,上述的第一參考驗證電壓是在第一溫度時記憶體晶胞的臨界電壓分布曲線的中央臨界電壓。 In an embodiment of the present invention, the above-mentioned first reference verification voltage is the central threshold voltage of the threshold voltage distribution curve of the memory cell at the first temperature.
在本發明的一實施例中,上述記憶體晶胞當中臨界電壓小於或等於第一參考驗證電壓的數量為記憶體晶胞的失效位元數。 In an embodiment of the present invention, the number of memory cells whose critical voltage is less than or equal to the first reference verification voltage is the number of failed bits of the memory cell.
在本發明的一實施例中,在根據第一參考驗證電壓及第二參考驗證電壓的差值以及第一溫度的讀取驗證電壓來決定第二溫度的讀取驗證電壓的步驟中,是將第一溫度的讀取驗證電壓加上差值以決定第二溫度的讀取驗證電壓。 In an embodiment of the present invention, in the step of determining the read verification voltage at the second temperature according to the difference between the first reference verification voltage and the second reference verification voltage and the read verification voltage at the first temperature, the The difference is added to the read verification voltage at the first temperature to determine the read verification voltage at the second temperature.
基於上述,在本發明的實施例中,非揮發性記憶體裝置及其讀取驗證電壓的決定方法,對第二溫度的讀取驗證電壓進行補償,可使不同溫度時的讀取驗證結果具有一致性。 Based on the above, in the embodiment of the present invention, the non-volatile memory device and the method for determining the read verification voltage compensate the read verification voltage at the second temperature, so that the read verification results at different temperatures have the same consistency.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.
100:非揮發性記憶體裝置 100: Non-volatile memory device
110:非揮發性記憶體 110: Non-volatile memory
112:記憶體晶胞 112: Memory cell
120:記憶體控制器 120: memory controller
200、300、400、500:臨界電壓分布曲線 200, 300, 400, 500: critical voltage distribution curve
210、310:區域 210, 310: area
600:讀取電壓 600: read voltage
BL:位元線 BL: bit line
DV:差值 DV: Difference
DV_ref:參考電壓差值 DV_ref: Reference voltage difference
PV、PV1、PV2、PV3、PV4:寫入驗證電壓 PV, PV1, PV2, PV3, PV4: write verification voltage
RV1、RV2:讀取驗證電壓 RV1, RV2: read verification voltage
S100、S110、S120、S130、S140、S200、S210、S220、S230: 方法步驟 S100, S110, S120, S130, S140, S200, S210, S220, S230: Method steps
SL:源極線 SL: source line
T1、T2:溫度 T1, T2: temperature
Vt、Vt1、Vt2:臨界電壓 Vt, Vt1, Vt2: critical voltage
Vt_c:中央臨界電壓 Vt_c: central critical voltage
WL:字元線 WL: character line
“00”:資料 "00": information
圖1繪示本發明一實施例之非揮發性記憶體裝置的概要示意圖。 FIG. 1 shows a schematic diagram of a non-volatile memory device according to an embodiment of the present invention.
圖2及圖3分別繪示圖1實施例之記憶體晶胞在不同溫度的臨界電壓分布圖。 FIG. 2 and FIG. 3 respectively show the threshold voltage distribution diagrams of the memory unit cell in the embodiment of FIG. 1 at different temperatures.
圖4繪示本發明一實施例之記憶體晶胞在室溫時的臨界電壓分布圖。 FIG. 4 is a graph showing the threshold voltage distribution of a memory unit cell at room temperature according to an embodiment of the present invention.
圖5繪示本發明一實施例之記憶體晶胞在高溫時的臨界電壓 分布圖。 Figure 5 shows the threshold voltage of the memory unit cell at high temperature according to an embodiment of the present invention Distribution.
圖6繪示本發明一實施例之非揮發性記憶體裝置的補償差值的決定方法的步驟流程圖。 FIG. 6 is a flow chart showing the steps of the method for determining the compensation difference of the non-volatile memory device according to an embodiment of the present invention.
圖7繪示本發明一實施例之非揮發性記憶體裝置的讀取驗證電壓的決定方法的步驟流程圖。 FIG. 7 is a flow chart showing the steps of a method for determining a read verification voltage of a non-volatile memory device according to an embodiment of the present invention.
圖1繪示本發明一實施例之非揮發性記憶體裝置的概要示意圖。圖2及圖3分別繪示圖1實施例之記憶體晶胞在不同溫度的臨界電壓分布圖,其橫軸為記憶體晶胞的臨界電壓Vt,縱軸為位元數量(bit count),即記憶體晶胞的數量。請參考圖1至圖3,本實施例之非揮發性記憶體裝置100包括非揮發性記憶體110及記憶體控制器120。記憶體控制器120耦接至非揮發性記憶體110。記憶體控制器120用以對非揮發性記憶體110進行寫入操作及讀取操作。
FIG. 1 shows a schematic diagram of a non-volatile memory device according to an embodiment of the present invention. Fig. 2 and Fig. 3 respectively depict the critical voltage distribution diagram of the memory unit cell of the embodiment of Fig. 1 at different temperatures, the horizontal axis is the critical voltage Vt of the memory unit cell, and the vertical axis is the number of bits (bit count), That is, the number of memory cells. Please refer to FIG. 1 to FIG. 3 , the
非揮發性記憶體110包括多個記憶體晶胞112。圖1僅繪出一個記憶體晶胞112例示說明,其數量不用以限定本發明。記憶體晶胞112包括第一端、第二端及控制端。第一端耦接至位元線BL,第二端耦接至源極線SL,控制端耦接至字元線WL。在進行讀取操作期間,記憶體控制器120對記憶體晶胞112施加讀取電壓600,並且驗證其臨界電壓是否大於讀取驗證電壓RV1或RV2,如圖2及圖3所示。
The
具體而言,圖2繪示的是記憶體晶胞在室溫T1(第一溫度)時的臨界電壓分布圖。在此例中,記憶體控制器120在室溫T1時利用讀取驗證電壓RV1(第一讀取驗證電壓)對非揮發性記憶體110進行讀取操作。也就是說,記憶體控制器120在室溫T1對記憶體晶胞112進行讀取操作,並且驗證其臨界電壓是否大於讀取驗證電壓RV1。在室溫讀取時,在臨界電壓小於或等於讀取驗證電壓RV1的區域210,記憶體晶胞112會被判定為失效位元(failure bit),其數量稱為失效位元數(failure bit count,FBC)。在本實施例中,室溫T1例如是攝氏溫度25℃,惟本發明不加以限制。
Specifically, FIG. 2 shows the threshold voltage distribution diagram of the memory unit cell at room temperature T1 (the first temperature). In this example, the
類似地,圖3繪示的是記憶體晶胞在高溫T2(第二溫度)時的臨界電壓分布圖。在此例中,記憶體控制器120在溫度高於室溫T1的高溫T2時利用讀取驗證電壓RV2(第二讀取驗證電壓)對非揮發性記憶體110進行讀取操作。也就是說,記憶體控制器120在高溫T2時對記憶體晶胞112進行讀取操作,並且其讀取驗證電壓被調整至讀取驗證電壓RV2,以確保在高溫讀取時,記憶體晶胞112的失效位元數(區域310)會與在室溫讀取時大致相同。因此,在高溫讀取時,在臨界電壓小於或等於讀取驗證電壓RV2的區域310,記憶體晶胞112會被判定為失效位元。在本實施例中,高溫T2例如是攝氏溫度90℃,惟本發明不加以限制。也就是說,第二溫度T2高於第一溫度T1。
Similarly, FIG. 3 shows the distribution diagram of the threshold voltage of the memory cell at the high temperature T2 (the second temperature). In this example, the
一般而言,記憶體晶胞的臨界電壓分布曲線會受到溫度
的影響而改變其峰值的位置。相較於室溫時的臨界電壓分布曲線200,高溫時的臨界電壓分布曲線300的峰值會向左移動,如圖3所示。若讀取驗證電壓不隨之調整,則可能造成記憶體晶胞被判定為失效位元的數量會增加,造成驗證結果不一致。因此,為了使在不同溫度時的讀取驗證結果具有一致性,記憶體控制器120在高溫讀取時會對讀取驗證電壓進行補償,將驗證基準從讀取驗證電壓RV1調整至讀取驗證電壓RV2。舉例而言,在本實施例中,在高溫時,記憶體控制器120將讀取驗證電壓RV1加上一個差值DV而得到讀取驗證電壓RV2,其中差值DV為負值。也就是說,記憶體控制器120在高溫時會減少讀取驗證電壓的值。
Generally speaking, the critical voltage distribution curve of the memory cell will be affected by the temperature
The influence changes the position of its peak value. Compared with the threshold
在一實施例中,若第二溫度T2低於第一溫度T1,則記憶體控制器120調整讀取驗證電壓的方式例如是將讀取驗證電壓RV1加上一個差值DV而得到讀取驗證電壓RV2,其中差值DV為正值。也就是說,記憶體控制器120在低溫時會增加讀取驗證電壓的值。此外,在圖1至圖3的實施例中,雖然是以第二溫度T2高於第一溫度T1來例示說明本發明之概念,但是第二溫度T2低於第一溫度T1的實施方式當可以此類推。
In one embodiment, if the second temperature T2 is lower than the first temperature T1, the
底下說明如何取得補償讀取驗證電壓的差值DV。 The following describes how to obtain the difference DV that compensates the read verification voltage.
圖4繪示本發明一實施例之記憶體晶胞在室溫時的臨界電壓分布圖。請參考圖4,在記憶體控制器120對非揮發性記憶體110進行讀取操作之前,記憶體控制器120先對非揮發性記憶體進行抹除操作,接著再對非揮發性記憶體110進行寫入操作,以將
資料”00”寫入非揮發性記憶體110中。資料”00”僅用以例示說明,本發明不加以限制。接著,在室溫T1(第一溫度)時,記憶體控制器120利用第一參考驗證電壓PV1對非揮發性記憶體110進行讀取操作,以取得記憶體晶胞112的失效位元數。
FIG. 4 is a graph showing the threshold voltage distribution of a memory unit cell at room temperature according to an embodiment of the present invention. Please refer to FIG. 4, before the
在本實施例中,記憶體控制器120根據寫入驗證電壓PV來決定第一參考驗證電壓PV1。舉例而言,記憶體控制器120將寫入驗證電壓PV加上參考電壓差值DV_ref,以決定第一參考驗證電壓PV1。在此例中,第一參考驗證電壓PV1是在室溫T1時記憶體晶胞112的臨界電壓分布曲線400的中央臨界電壓Vt_c。因此,在室溫T1時,記憶體晶胞112當中臨界電壓小於或等於第一參考驗證電壓PV1的數量(即記憶體晶胞的失效位元數)約占記憶體晶胞112整體數量的50%。記憶體控制器120可將此失效位元數儲存在非揮發性記憶體裝置100中的熔絲區塊(fuse block)中。
In this embodiment, the
在本實施例中,將第一參考驗證電壓PV1設定為臨界電壓分布曲線400的中央臨界電壓Vt_c僅用以例示說明,不用以限定本發明。第一參考驗證電壓PV1可設定為在臨界電壓Vt1至Vt2之間的任意值。第一參考驗證電壓PV1的設定可依據不同的記憶體晶片而做不同的設定,本發明不加以限制。
In this embodiment, setting the first reference verification voltage PV1 as the central threshold voltage Vt_c of the threshold
圖5繪示本發明一實施例之記憶體晶胞在高溫時的臨界電壓分布圖。請參考圖5,在高溫T2(第二溫度)時,記憶體控制器120對非揮發性記憶體110進行多次讀取操作,並且逐次調
整參考驗證電壓,以取得與室溫時相同的失效位元數。舉例而言,在圖5中,記憶體控制器120逐次減少參考驗證電壓,以對該非揮發性記憶體進行多次讀取操作。因此,記憶體控制器120逐次將參考驗證電壓由PV1減少至PV4。記憶體控制器120將在取得相同的失效位元數的該次讀取操作時所使用的參考驗證電壓PV3設定為第二參考驗證電壓。
FIG. 5 is a graph showing the threshold voltage distribution of a memory unit cell at high temperature according to an embodiment of the present invention. Please refer to FIG. 5, when the high temperature T2 (second temperature), the
也就是說,在高溫T2時,記憶體控制器120依序利用參考驗證電壓PV1、PV2、PV3及PV4對非揮發性記憶體110進行讀取操作,以取得記憶體晶胞112的失效位元數,其中在第三次讀取操作時,可取得與室溫時相同的失效位元數。因此,記憶體控制器120將此參考驗證電壓PV3設定為第二參考驗證電壓。因此,在高溫T2時,記憶體晶胞112當中臨界電壓小於或等於第二參考驗證電壓PV3的數量也約占記憶體晶胞112整體數量的50%。
That is to say, at the high temperature T2, the
接著,記憶體控制器120比較第一參考驗證電壓PV1及第二參考驗證電壓PV3以計算並取得兩者的差值DV。例如,記憶體控制器120將第二參考驗證電壓PV3減去第一參考驗證電壓PV1以取得兩者的差值DV,其中差值DV為負值。在另一實施例中,也可將第一參考驗證電壓PV1減去第二參考驗證電壓PV3以取得兩者的差值,其中此差值為正值。
Next, the
因此,參照上述圖4及圖5實施例的揭示內容,可取得補償讀取驗證電壓的差值DV。 Therefore, referring to the disclosed content of the embodiments of FIG. 4 and FIG. 5 , the difference DV of the compensating read verification voltage can be obtained.
圖6繪示本發明一實施例之非揮發性記憶體裝置的補償
差值的決定方法的步驟流程圖。請參考圖1及圖6,本實施例之補償差值的決定方法至少適用於圖1的非揮發性記憶體裝置100,惟本發明並不加以限制。以圖1的非揮發性記憶體裝置100為例,在步驟S100中,記憶體控制器120在第一溫度T1時對非揮發性記憶體110進行抹除操作。在步驟S110中,記憶體控制器120在第一溫度T1時對非揮發性記憶體110進行寫入操作。
FIG. 6 illustrates compensation of a non-volatile memory device according to an embodiment of the present invention
Flowchart of the steps for determining the difference. Please refer to FIG. 1 and FIG. 6 , the method for determining the compensation difference in this embodiment is at least applicable to the
在步驟S120中,記憶體控制器120在第一溫度T1時,利用第一參考驗證電壓PV1對非揮發性記憶體110進行讀取操作,以取得記憶體晶胞112的失效位元數。在步驟S130中,記憶體控制器120在第二溫度T2時,對非揮發性記憶體110進行多次讀取操作,並且逐次調整第一參考驗證電壓PV1,以取得相同的失效位元數。在此步驟中,在取得相同的失效位元數的該次讀取操作時所使用的參考驗證電壓為第二參考驗證電壓PV3。在步驟S140中,記憶體控制器120比較第一參考驗證電壓PV1及第二參考驗證電壓PV3以取得兩者的差值DV。此差值DV可在第二溫度T2時對讀取驗證電壓進行補償。另外,本實施例之補償差值的決定方法可以由圖1至圖5實施例之敘述中獲致足夠的教示、建議與實施說明。
In step S120 , the
圖7繪示本發明一實施例之非揮發性記憶體裝置的讀取驗證電壓的決定方法的步驟流程圖。請參考圖1及圖7,本實施例之讀取驗證電壓的決定方法至少適用於圖1的非揮發性記憶體裝置100,惟本發明並不加以限制。以圖1的非揮發性記憶體裝置
100為例,在步驟S200中,記憶體控制器120在第一溫度T1時,利用第一參考驗證電壓PV1對非揮發性記憶體110進行讀取操作,以取得記憶體晶胞112的失效位元數。在步驟S210中,記憶體控制器120在不同於第一溫度T1的第二溫度T2時,對非揮發性記憶體110進行多次讀取操作,並且逐次調整第一參考驗證電壓PV1,以取得相同的失效位元數。在此步驟中,在取得相同的失效位元數的該次讀取操作時所使用的參考驗證電壓為第二參考驗證電壓PV3。
FIG. 7 is a flow chart showing the steps of a method for determining a read verification voltage of a non-volatile memory device according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 7 , the method for determining the read verification voltage in this embodiment is at least applicable to the
在步驟S220中,記憶體控制器120比較第一參考驗證電壓PV1及第二參考驗證電壓PV3以取得兩者的差值DV。接著,在步驟S230中,記憶體控制器120根據第一參考驗證電壓PV1及第二參考驗證電壓的差值PV3以及第一溫度T1的讀取驗證電壓RV1來決定第二溫度T2的讀取驗證電壓RV2。舉例而言,記憶體控制器120在第二溫度T2時會對讀取驗證電壓進行補償,將驗證基準從讀取驗證電壓RV1減少至讀取驗證電壓RV2,減少幅度為差值DV的絕對值。另外,本實施例之讀取驗證電壓的決定方法可以由圖1至圖6實施例之敘述中獲致足夠的教示、建議與實施說明。
In step S220 , the
綜上所述,在本發明的實施例中,記憶體控制器在室溫以外的溫度對非揮發性記憶體進行讀取操作時會對讀取驗證電壓進行補償,以將調整讀取驗證電壓,可使不同溫度時的讀取驗證結果具有一致性。此外,本發明的實施例的讀取驗證電壓的決定 方法可在個別的記憶體晶片上執行以為個別的記憶體晶片決定出各自的讀取驗證電壓。 To sum up, in the embodiment of the present invention, when the memory controller performs a read operation on the non-volatile memory at a temperature other than room temperature, it will compensate the read verification voltage, so as to adjust the read verification voltage , allowing consistent read verification results across temperatures. In addition, the read verify voltage of the embodiment of the present invention determines the The method can be executed on individual memory chips to determine respective read verify voltages for the individual memory chips.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.
S200、S210、S220、S230:方法步驟 S200, S210, S220, S230: method steps
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US20130163342A1 (en) * | 2011-12-22 | 2013-06-27 | Deepanshu Dutta | Program temperature dependent read |
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