TWI779376B - Light-emitting device and manufacturing method therefor - Google Patents

Abstract

A light emitting device comprises a substrate, a light-emitting module, a switch module, and a circuit board. The light-emitting module comprises a plurality of light-emitting diodes, and is disposed on the substrate. The switch module is disposed on the substrate, and configured to control brightness or color of the light-emitting module. The circuit board is disposed on the switch module. The switch module is electrically connected to the substrate and the circuit board, respectively.

Description

Light emitting device and manufacturing method thereof

The present invention relates to a light-emitting device, especially a light-emitting device with a novel bonding structure between a substrate and a circuit board, and a manufacturing method thereof, especially a manufacturing method that uses a novel bonding step to achieve the above-mentioned bonding structure.

The light-emitting device composed of light-emitting diode units (LED) has many advantages such as high luminous efficiency, long service life, small size, environmental protection and mercury-free, and can be used for low-voltage drive. In addition, LED can be driven in a simple way and can be packaged In various forms, it has been widely used in various fields. In the light-emitting device, the light-emitting diode unit is bonded to the circuit board, and the circuit board provides signals for control.

FIG. 1 shows a conventional bonding of a circuit board 3 to a substrate 2 with LEDs. As shown in FIG. 1 , the connection between the substrate 2 and the circuit board 3 is through the connection of flexible wires. The limitation of this bonding method is that it is necessary to manually connect the flexible wires to the soldering points of the substrate 2 and the circuit board 3 , and the bonding of the substrate and the circuit board cannot be completed simultaneously by automation. In addition, flexible wires cannot support the circuit board.

FIG. 2 shows another conventional bonding of a circuit board 3 to a substrate 2 with LEDs. As shown in FIG. 2 , the connection between the substrate 2 and the circuit board 3 is by setting the connector on the substrate 2 (connector), and the circuit board 3 is provided with a male connector of the connector, as the interface between the substrate 2 and the circuit board 3. However, after the male and female connectors of the connectors are respectively provided and then connected, not only the manufacturing process of the two-stage assembly is cumbersome but also requires additional manufacturing costs.

It can be seen that the bonding structures and methods of the substrate and the circuit board in the above two conventional light-emitting devices have their own shortcomings. Therefore, there is an urgent need to propose an improved or brand-new light-emitting device and its manufacturing method to eliminate or alleviate the above-mentioned problems.

In view of this, the present invention aims to provide a light-emitting device and a manufacturing method thereof, which can overcome the problems in the prior art that the substrate and the circuit board cannot be connected in an automated manner or require cumbersome and expensive connectors for bonding steps, and can Achieve automated rapid production. In addition, a switch module is provided. On the one hand, it is quickly bonded to the substrate and the circuit board respectively through solder. On the other hand, it is a multi-stage switch module, which can further control the light-emitting module by hand. shades or hues.

According to a viewpoint of the present invention, a light-emitting device is proposed, including: a substrate; a light-emitting module, which includes a plurality of light-emitting diode units, disposed on the substrate; a switch module, disposed on the substrate, and It is configured to control the brightness or color tone of the light-emitting module; and a circuit board is arranged on the switch module; wherein the switch module is electrically connected with the substrate and the circuit board respectively.

Optionally, or preferably, in the light-emitting device of the present invention, the substrate is a metal substrate, and the circuit board is a perforable substrate.

Optionally, or preferably, in the lighting device of the present invention, the switch module is provided with a first connection module, which includes a plurality of positioning feet.

Optionally, or preferably, in the light-emitting device of the present invention, a plurality of through holes are formed on the circuit board, the positioning pins pass through the through holes respectively, and the positioning pins and the positioning pins are fixed by solder. perforation.

Optionally, or preferably, the light emitting device of the present invention may further include a second connection module disposed around the switch module, the second connection module includes a plurality of pins, and the circuit A plurality of additional through holes are formed on the board, the pins pass through the extra through holes, and the pins and the extra through holes are fixed by solder.

Optionally, or preferably, in the light-emitting device of the present invention, the substrate is coated with a plurality of discrete welding points for connecting the switch module, and these welding points contain solder.

Optionally, or preferably, in the lighting device of the present invention, the switch module is a multi-stage switch module or a manual switch.

Optionally, or preferably, in the light-emitting device of the present invention, the solder is solder paste or a tin-containing material.

In addition, according to another aspect of the present invention, a method for manufacturing a light-emitting device is proposed, including: step S1: providing a substrate; step S2: applying solder (such as solder paste) on the substrate; step S3: applying a light-emitting module and a second connection module is arranged on the substrate; step S4: provide a circuit board; step S5: electrically connect the circuit board with the switch module; and step S6: set the switch module (welding and fixing ) on the substrate.

Optionally, or preferably, in the manufacturing method of the light-emitting device of the present invention, the substrate is a metal substrate, and the circuit board is a perforable substrate.

Optionally, or preferably, in the manufacturing method of the light emitting device of the present invention, the switch module is provided with a first connection module, which includes a plurality of positioning feet.

Optionally, or preferably, in the manufacturing method of the light-emitting device of the present invention, step S4 further includes step S41: forming a plurality of through holes and/or a plurality of additional through holes on the circuit board through a punching machine.

Optionally, or preferably, in the manufacturing method of the light-emitting device of the present invention, step S5 further includes step S51: passing the positioning pins through the through holes respectively; and step S52: fixing the positioning pins by solder The feet are pierced with these.

Optionally, or preferably, in the manufacturing method of the light-emitting device of the present invention, in step S52, a solder furnace is provided, and the switch module is held by a mechanical arm, a pallet, or a tool, so that the switch The pins of the module are scratched across a surface of the solder oven to pick up solder.

Optionally, or preferably, in the manufacturing method of the light-emitting device of the present invention, step S6 further includes: step S61: disposing the switch module on the substrate, and disposing the second connection module on the Around the substrate, the second connection module also includes a plurality of pins; step S62 : passing the pins through the additional through holes; and step S63 , fixing the pins and the extra through holes with solder.

The other objects, advantages, and novel features of the present invention will be more clearly described below in conjunction with drawings and detailed descriptions.

[Prior Art]

2: Substrate

3: circuit board

[this invention]

1: Lighting device

10: Substrate

12: Lighting module

14: Switch module

16: Circuit board

18: The first connection module

19: Second connection module

20: Welding point

22: Solder furnace

24: Mechanical arm, pallet, or tool

120: light emitting diode unit

161: perforation

162: Extra perforation

181: positioning foot

191: Pin

288: extra pin

FIG. 1 shows a schematic diagram of a conventional circuit board bonding to a substrate with light emitting diodes.

FIG. 2 is a schematic diagram showing another conventional bonding of a circuit board to a substrate with LEDs.

FIG. 3 shows a perspective view of a light emitting device according to an embodiment of the present invention.

FIG. 4 shows a bottom view of a light emitting device according to an embodiment of the present invention.

FIG. 5 shows a side view of a light emitting device according to an embodiment of the present invention.

6A to 6F show the analysis diagrams of the light-emitting device according to an embodiment of the present invention at different manufacturing stages.

Various embodiments of the invention are provided below. These examples are used to illustrate the technical content of the present invention, but not to limit the scope of rights of the present invention. A feature of one embodiment can be applied to other embodiments through appropriate modification, substitution, combination, and isolation.

It should be noted that, unless otherwise specified herein, having “a” element is not limited to having a single element, but may have one or more elements.

In addition, in this article, unless otherwise specified, ordinal numbers such as "first" and "second" are only used to distinguish multiple components with the same name, and do not indicate that there is a hierarchy, level, or execution order between them. , or process sequence. A "first" element and a "second" element may appear together in the same component, or may appear separately in different components. The presence of an element with a higher ordinal number does not necessarily indicate the presence of another element with a lower ordinal number.

In this paper, unless otherwise specified, the so-called feature A "or" (or) or "and/or" (and/or) feature B means that nail exists alone, B exists alone, or A and B exist simultaneously ; The so-called feature A "and" (and) or "and" (and) or "and" (and) feature B is the nail Exist with B at the same time; the so-called "include", "include", "have", and "contain" mean including but not limited to.

In addition, in this article, terms such as "upper", "lower", "left", "right", "front", "rear", or "between" are only used to describe the distance between multiple elements. relative position, and can be generalized in interpretation to include cases of translation, rotation, or mirroring.

In addition, unless otherwise specified herein, "an element is on another element" or similar expressions do not necessarily mean that the element contacts the other element.

In addition, in this article, "preferably" or "better" is used to describe optional or additional elements or features, that is, these elements or features are not essential and may be omitted.

In addition, in this article, unless otherwise specified, the so-called "suitable" or "suitable for" another element means that the other element does not belong to a part of the subject matter of the application, but is an example or a reference It is helpful to conceive the nature or application of the element; similarly, in this text, unless otherwise specified, the so-called element is "adapted" or "adapted" to a configuration or an action, and the described is a feature of the component, but does not mean that the configuration has been set or that the action has been performed.

In addition, each element can be implemented as a single circuit or an integrated circuit in an appropriate manner, and can include one or more active elements, such as transistors or logic gates, or one or more passive elements, such as resistors, capacitors , or inductance, but not limited thereto. The components can be connected to each other in a suitable manner, for example, using one or more lines to form a series connection or a parallel connection according to the input signal and the output signal respectively. In addition, each element can allow input signals and output signals to enter and exit sequentially or in parallel. The above configurations are determined according to the actual application.

In addition, in this article, terms such as "system", "equipment", "device", "module", or "unit" refer to an electronic component or a digital circuit composed of multiple electronic components, A class of analog circuits, or other broader circuits, and unless otherwise specified, they do not necessarily have a hierarchical or hierarchical relationship.

In addition, herein, unless otherwise specified, the electrical connection of two elements may include direct connection or indirect connection. In an indirect connection, there may be one or more other elements, such as resistors, capacitors, or inductors, between the two elements. An electrical connection is used to transmit one or more signals, such as DC or AC current or voltage, depending on the application.

(light emitting device)

First, please refer to FIG. 3 , FIG. 4 and FIG. 5 together. FIG. 3 shows a perspective view of a light emitting device 1 according to an embodiment of the present invention, FIG. 4 shows a bottom view of a light emitting device 1 according to an embodiment of the present invention, and FIG. 5 shows a side view of a light emitting device 1 according to an embodiment of the present invention.

As shown in FIG. 3 , FIG. 4 and FIG. 5 , a light emitting device 1 according to an embodiment of the present invention includes a substrate 10 , a light emitting module 12 , a switch module 14 and a circuit board 16 . The light-emitting module 12 is arranged on the substrate 10, in one embodiment, it is arranged at the center of the substrate 10, and includes a plurality of light-emitting diode units 120, and these light-emitting diode units 120 are configured to have different brightness, Dark yellow light and white light are important elements for providing light sources in the light emitting device 1 . The light emitting diode unit 120 can also have other colors. The switch module 14 is disposed on the substrate 10 and configured to control the brightness or color tone of the light emitting module 12 , and the color tone is adjusted by the brightness ratio of the yellow light and the white light. Wherein, the switch module 14 can be a one-hand toggle switch with a pull rod, and in order to facilitate people's hands to toggle (adjust) the switch, the substrate 10 at the pull rod of the switch module 14 adopts a hollow design, especially as shown in Figure 4 Show. A circuit board 16 is arranged above the switch module 14, wherein the switch module 14 is electrically connected to the substrate 10 and the circuit board 16 respectively, so as to realize the control of the switch element 14 on the circuit board 16 and the circuit board 16 can therefore provide driving signals to the Lighting module 12. Further, the circuit board 16 can be a printed circuit board (PCB) or otherwise soft enough to be punched by a punch. After the light-emitting device 1 is added with a light-transmitting protective cover (not shown), it can be embedded in ceilings or walls as lighting lamps.

In the above embodiment, the switch module 14 may be a multi-stage switch module, for example, it may be a 5-stage switch module, that is, the brightness/hue of the light emitting module 12 is divided into 5 levels (level), through the 5-stage switch module, the required brightness/hue level can be selected respectively. When the light-emitting module 12 needs to have different brightness/color configurations in rooms with different lighting conditions or different decoration methods, or when it needs to have the same brightness/color color as other adjacent lighting lamps, the multi-stage switch module The brightness/hue of the lighting module 12 can be selected using. In addition, for example, in order to respond to the application methods in Europe and the United States, once the user selects the brightness/color tone of the light emitting module 12 through the switch module 14, since the light emitting device 1 is embedded in the ceiling or wall, etc., it cannot be changed arbitrarily. For adjustment, the brightness/tone of the light emitting module 12 can be selected through the switch module 14 after the light emitting device 1 is removed from the ceiling or wall, but it is not limited to this application.

It should be noted that the light emitting device 1 according to one embodiment of the present invention has multiple novel joint structures. The multiple novel joint structures of the present invention will be described below, and please refer to FIG. 6A to FIG. 6D together. Meanwhile, in order to satisfy multiple novel structures of the present invention, the above-mentioned substrate 10 can be a metal substrate (which cannot be punched by a puncher), and the circuit board 16 can be a perforable substrate.

One of the configurations in the above-mentioned multiple novel bonding structures is that the switch module 14 is coated with a plurality of discrete (discrete) welding points 20 around the place where it is installed on the substrate 10, and the welding points 20 contain solder, so they are suitable for connecting The connection between the switch module 14 and the substrate 10 .

Another configuration of the above-mentioned multiple novel joint structures is that a first connection module 18 is disposed above the switch module 14 and includes a plurality of positioning feet 181 , and a plurality of through holes 161 are formed on the circuit board 16 . The positioning feet 181 pass through the through holes 161 respectively, and the positioning feet 181 and the through holes 161 are fixed by solder. (because Here, the first connection module 18 and its positioning feet 181 are mainly used to fix the switch module 14 to the circuit board 16 , and do not need to provide the function of electrical connection. )

Another configuration among the above multiple novel joint structures is that the light emitting device 1 can further include a second connection module 19, which can be arranged around the switch module 14. In the specific embodiment of FIG. 3, it is arranged On the left and right sides of the switch module 14. The second connection module 19 includes a plurality of pins 191, and a plurality of extra through holes 162 are formed on the circuit board 16, the pins 191 pass through the extra through holes 162 respectively, and the pins 191 and the extra through holes 162 are fixed by solder, It serves as a support for the circuit board 16 to provide additional support for the circuit board 16 where the first connection module 18 is not provided. If there is a signal to be transmitted between the substrate 10 and the circuit board 16 , it can also be achieved by the reconfigured second connection module 19 . (Therefore, in addition to further fixing the circuit board 16 and the switch module 14 fixed on the circuit board 16 to the substrate 10, the second connection module 19 and its pins 191 also provide the function of electrical connection.)

Another configuration among the above-mentioned multiple novel joint structures is that a plurality of extra pins 288 are arranged on the top of the switch module 14, and these extra pins 288 can be used to form an electrical connection between the switch module 14 and the circuit board 16 .

It is worth mentioning that the solder used in the above embodiments can be solder paste or tin-containing material, but the present invention is not limited thereto.

(Manufacturing method of light-emitting device)

Yet another embodiment of the present invention provides a method for manufacturing a light emitting device 1 . Please refer to FIG. 6A to FIG. 6F together, which show the analysis diagrams of the light emitting device 1 in different manufacturing stages according to an embodiment of the present invention. The manufacturing method of the light-emitting device 1 includes the following steps: Step S1: providing a substrate 10, corresponding to that shown in FIG. 6A; Step S2: apply solder (such as solder paste) on the substrate 10, as shown in FIG. 19 includes a plurality of pins 191, as shown in Figure 6C; step S4: provide a circuit board 16; step S5: electrically connect the circuit board 16 to the switch module 14, as shown in the upper part of Figure 6D ; and step S6: setting (welding and fixing) the switch module 14 on the substrate 10, corresponding to the connection line shown by the dotted line in FIG. 6D, and the completed diagram is shown in FIG. 6F.

In order to realize multiple novel structures of the light emitting device 1 of the present invention, further, the substrate 10 of the above embodiment can be a metal substrate, and the circuit board 16 can be a perforable substrate.

Still further, the switch module 14 may be provided with a first connection module 18 including a plurality of positioning feet 181 .

In an embodiment of the present invention, step S4 may further include the following steps to perform subsequent steps of disposing the circuit board 16 on the switch module 14: Step S41 : Form a plurality of through holes 161 and/or a plurality of additional through holes 162 on the circuit board 16 through a punching machine.

Cooperating with the above-mentioned embodiment, step S5 may further include the following steps. The following steps may refer to FIG. 6D correspondingly, including: step S51, respectively passing the positioning feet 181 through the through holes 161; and step S52: fixing the positioning feet 181 and the through holes with solder 161. (the first connection module 18 and its positioning feet 181 are mainly used to fix the switch module 14 on the circuit board 16, and do not need to provide the function of electrical connection can. The electrical connection between the switch module 14 and the circuit board 16 can be achieved by using extra pins 288 on the contact surface of the two and through solder, but is not limited thereto. )

It is worth mentioning that, in the analysis diagram of the process stage shown in FIG. 6E, in the above-mentioned step S52, a solder furnace 22 is provided, and a robot arm 24, a pallet (not shown in the figure), or a tool (fig. (not shown) to hold the switch module 14, so that the positioning feet 181 of the switch module 14 pass across the surface of the solder furnace 22 to be stained with solder. In this way, the positioning feet 181 and the through holes 161 can be quickly and comprehensively fixed.

Finally, as shown in FIG. 6D, in the process stage shown in FIG. 6D, the following steps may be further included in step S6: Step S61: setting the switch module 14 on the substrate 10, and the second connection module 19 is located around the switch module 14, wherein the first The two connection modules 19 are arranged on the left and right sides of the switch module 14 in one embodiment; step S62: pass the pins 191 through the additional through holes 162; and step S63, fix the pins 191 and the extra holes by solder 162 perforations. (The second connection module 19 and its pins 191 are not only used to further fix the circuit board 16 and the switch module 14 fixed on the circuit board 16 to the substrate 10, but also provide the function of electrical connection.)

It should be noted that the above steps can be performed sequentially or simultaneously, or can also be performed in an interchanged order, and even additional steps can be inserted between different steps. In particular, the through hole 161 and the additional through hole 162 can be formed in the same step. The positioning pin 181 and the connecting pin 191 can also be fixed in the same step.

To sum up, according to multiple embodiments of the present invention, a light emitting device and a manufacturing method thereof are provided, mainly through punching a circuit board and directly passing the pins or positioning pins of the switch module through the punched holes. Fixed, and achieve automatic rapid production, overcome the shortcomings of the previous technology. In addition, the light-emitting device of the present invention further provides a switch module, which can be quickly connected to The substrate and the circuit board are bonded together. On the other hand, it is a multi-stage switch module, which can further control the brightness or color tone of the light-emitting module by manual dialing.

Although the present invention has been described through several embodiments, it should be understood that many other possible modifications and changes can be made without departing from the spirit of the present invention and the claimed scope of the patent application.

1: Lighting device

10: Substrate

12: Lighting module

14: Switch module

16: Circuit board

18: The first connection module

19: Second connection module

120: light emitting diode unit

181: positioning foot

191: pin

Claims (11)

A light-emitting device (1), comprising: a substrate (10); a light-emitting module (12), which includes a plurality of light-emitting diode units (120), arranged on the substrate (10); a switch module ( 14), a first connection module (18) is provided, which includes a plurality of positioning feet (181), arranged on the substrate (10), and configured to control the brightness or color tone of the light emitting module (12); A circuit board (16), is formed with a plurality of perforations (161) on it, and these positioning pins (181) pass through these perforation holes (161) respectively, and these positioning pins (181) and these positioning pins (181) and these positioning pins (181) are fixed by solder Perforation (161) is arranged on the switch module (14); and a second connection module (19) is arranged around the switch module (14), and the second connection module (19) includes multiple pins (191), and a plurality of extra through holes (162) are formed on the circuit board (16), these pins (191) pass through these extra through holes (162), and these pins (191) are fixed by solder Pins (191) and the extra holes (162). Wherein the switch module (14) is electrically connected with the substrate (10) and the circuit board (16) respectively. The light emitting device (1) as claimed in claim 1, wherein the substrate (10) is a metal substrate, and the circuit board (16) is a perforable substrate. The light-emitting device (1) according to claim 1, wherein the substrate (10) is coated with a plurality of discrete welding points (20) for connecting the pins (191) to connect the switch module ( 14), the welding points (20) contain solder. The lighting device (1) according to claim 1, wherein the switch module (14) is a multi-stage switch module or a manual switch. The light-emitting device (1) according to claim 1, wherein the solder is solder paste or a tin-containing material. A method for manufacturing a light-emitting device, comprising: step S1: providing a substrate (10); step S2: dripping solder on the substrate (10); step S3: connecting a light-emitting module (12) and a second connecting mold The group (19) is arranged on the substrate (10); step S4: providing a circuit board (16), formed with a plurality of through holes (161) and/or a plurality of additional through holes (162); step S5: the circuit board (16) set on a switch module (14), and electrically connected with the switch module (14); step S6: set the switch module (14) on the substrate (10); step S61: The switch module (14) is arranged on the substrate (10), and the second connection module (19) is located around the switch module (14), and the second connection module (19) includes a plurality of pins (191); step S62: passing the pins (191) through the extra through holes (162); and step S63, fixing the pins (191) and the extra through holes (162) by solder . The manufacturing method of a light-emitting device according to claim 6, wherein the substrate (10) is a metal substrate, and the circuit board (16) is a perforable substrate. The manufacturing method of a light emitting device according to claim 6, wherein the switch module (14) is provided with a first connection module (18), which includes a plurality of positioning feet (181). The method for manufacturing a light-emitting device according to claim 8, wherein step S4 further includes step S41: forming the through holes (161) and/or the additional through holes ( 162). The method for manufacturing a light-emitting device according to claim 9, wherein step S5 further includes step S51: passing the positioning pins (181) through the through holes (161); and step S52: fixing the positioning pins (181) by solder Locate the feet (181) and the perforations (161). The method for manufacturing a light-emitting device according to claim 10, wherein, in step S52, a solder furnace (22) is provided, and the switch module (14) is held by a mechanical arm (24), a pallet, or a tool , make the positioning pins (181) of the switch module (14) slide across a surface of the solder furnace (22) to be stained with solder.

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