TWI777182B - Silver powder and method for producing same - Google Patents

Silver powder and method for producing same Download PDF

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TWI777182B
TWI777182B TW109121129A TW109121129A TWI777182B TW I777182 B TWI777182 B TW I777182B TW 109121129 A TW109121129 A TW 109121129A TW 109121129 A TW109121129 A TW 109121129A TW I777182 B TWI777182 B TW I777182B
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particle size
silver powder
size distribution
volume
laser diffraction
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TW202107494A (en
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藤井政德
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日商同和電子科技有限公司
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

There are provided a silver powder, which is able to form an electrically conductive film having a lower resistance value than that of conventional electrically conductive films when the silver powder is used as the material of an electrically conductive paste which is fired to form the electrically conductive film, and a method for producing the same. A first silver powder, wherein the number of peak(s) having the maximum frequency in a volume-based particle size distribution obtained by measuring the first silver powder in a dry process by means of a laser diffraction particle size analyzer is one or more, is mixed with a second silver powder, wherein the number of peaks having the maximum frequency in a volume-based particle size distribution obtained by measuring the second silver powder in a dry process by means of a laser diffraction particle size analyzer is two or more, to produce a silver powder wherein the number of peaks having the maximum frequency in a volume-based particle size distribution obtained by measuring the silver powder in a dry process by means of a laser diffraction particle size analyzer is three or more and wherein the number of peak(s) having the maximum frequency in a volume-based particle size distribution obtained by measuring the silver powder in a wet process by means of a laser diffraction particle size analyzer is one or more.

Description

銀粉及其製造方法Silver powder and method for producing the same

本發明涉及銀粉及其製造方法,尤其涉及適於導電性糊之材料的銀粉及其製造方法。The present invention relates to silver powder and a manufacturing method thereof, in particular to silver powder suitable for a material of conductive paste and a manufacturing method thereof.

以往,作為形成太陽能電池之電極、使用低溫燒成陶瓷(LTCC)之電子零件或積層陶瓷電感(MLCI)等積層陶瓷電子零件之內部電極、積層陶瓷電容器或積層陶瓷電感等之外部電極等的導電性糊之材料,係使用銀粉等金屬粉末。Conventionally, it has been used as an electrode for forming a solar cell, an electronic component using a low temperature firing ceramic (LTCC), an internal electrode for a multilayer ceramic electronic component such as a multilayer ceramic inductor (MLCI), and an external electrode for a multilayer ceramic capacitor or a multilayer ceramic inductor. The material of the paste is metal powder such as silver powder.

作為這種導電性糊之材料,已有文獻提出一種混合導電粉,其包含概略單分散化粒徑且大致球狀的銀、鈀或該等合金中之2種組合而成的粒子,且相對充填密度為68~80%,並且2種之銀、鈀或該等合金之其中一者的平均粒徑為另一者之平均粒徑的5~25倍(例如參照專利文獻1)。As a material for this conductive paste, a mixed conductive powder has been proposed in the literature, which contains particles composed of silver, palladium, or a combination of two of these alloys with a generally monodispersed particle size and a generally spherical shape, and relatively The packing density is 68 to 80%, and the average particle size of one of the two types of silver, palladium, or these alloys is 5 to 25 times the average particle size of the other (for example, refer to Patent Document 1).

又,關於混合2種金屬粒子而成之混合金屬粒子的用途,已有文獻提出一種分散有混合金屬粒子之導電性塗料,該混合金屬粒子係平均粒徑為2~20µm之大徑金屬粒子與平均粒徑為0.1~1µm之小徑金屬粒子混合而成(粒度分布具有2個以上波峰)者(例如參照專利文獻2)。 先前技術文獻 專利文獻In addition, regarding the use of mixed metal particles obtained by mixing two kinds of metal particles, a conductive paint in which mixed metal particles are dispersed has been proposed. A mixture of small-diameter metal particles having an average particle diameter of 0.1 to 1 µm (the particle size distribution has two or more peaks) (for example, refer to Patent Document 2). prior art literature Patent Literature

專利文獻1:日本特開2011-204688號公報(段落編號0012) 專利文獻2:日本特開平1-295170號公報(第2頁)Patent Document 1: Japanese Patent Laid-Open No. 2011-204688 (paragraph number 0012) Patent Document 2: Japanese Patent Application Laid-Open No. 1-295170 (page 2)

發明欲解決之課題The problem to be solved by the invention

然而,當將專利文獻1之混合導電粉或專利文獻2之混合金屬粒子作為導電性糊之材料使用,並燒成該導電性糊來形成太陽能電池的電極時,會有電極的電阻值變得較高的情況,而為了使太陽能電池的轉換效率提升,便期望減低電極的電阻值。However, when the mixed conductive powder of Patent Document 1 or the mixed metal particles of Patent Document 2 are used as a material for a conductive paste, and the conductive paste is fired to form an electrode of a solar cell, the resistance value of the electrode may change. In the higher case, in order to improve the conversion efficiency of the solar cell, it is desirable to reduce the resistance value of the electrode.

因此,鑑於上述以往之問題點,本發明之目的即在於提供一種銀粉及其製造方法,在使用該銀粉作為導電性糊之材料並燒成該導電性糊而形成導電膜時,可形成電阻值較以往更低之導電膜。 用以解決課題之手段Therefore, in view of the above-mentioned conventional problems, an object of the present invention is to provide a silver powder and a method for producing the same, which can form a resistance value when a conductive film is formed using the silver powder as a material of a conductive paste and firing the conductive paste. A lower conductive film than before. means of solving problems

本發明人等為解決上述課題而潛心研究後,結果發現若藉由混合下述第1銀粉與下述第2銀粉來製造銀粉,可製造在作為導電性糊之材料使用並燒成該導電性糊而形成導電膜時可形成電阻值較以往更低之導電膜的銀粉,遂而完成本發明;該第1銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個以上者;該第2銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為2個以上者;混合第1銀粉與第2銀粉所製造之銀粉,係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個者。The inventors of the present invention have made intensive studies in order to solve the above-mentioned problems, and as a result, they have found that if silver powder is produced by mixing the following first silver powder and the following second silver powder, it can be produced and used as a material for a conductive paste, and the conductive paste can be fired. When the conductive film is formed by paste, a silver powder with a lower resistance value than the conventional conductive film can be formed, and the present invention is completed; the first silver powder is based on the volume obtained by dry measurement using a laser diffraction particle size distribution measuring device. In the particle size distribution, there is one or more peaks with a maximum frequency; the second silver powder is a particle size distribution based on a volume obtained by dry measurement using a laser diffraction particle size distribution measuring device, and the peak frequency becomes a maximum of 2 The silver powder produced by mixing the first silver powder and the second silver powder has three or more peaks whose frequency becomes the maximum in the volume-based particle size distribution obtained by dry measurement with a laser diffraction particle size distribution analyzer. , and in the particle size distribution on a volume basis obtained by wet measurement with a laser diffraction scattering particle size distribution analyzer, there is one peak whose frequency becomes the maximum.

即,本發明之銀粉之製造方法之特徵在於:藉由混合第1銀粉與第2銀粉來製造銀粉,該第1銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個以上者;該第2銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為2個以上者;混合第1銀粉與第2銀粉所製造之銀粉,係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個者。That is, the method for producing silver powder according to the present invention is characterized in that the silver powder is produced by mixing a first silver powder and a second silver powder, the first silver powder being on a volume basis obtained by dry measurement using a laser diffraction particle size distribution analyzer. In the particle size distribution of , the frequency of which becomes the maximum peak is one or more; the second silver powder is in the volume-based particle size distribution obtained by dry measurement using a laser diffraction particle size distribution measuring device, and the frequency becomes the maximum peak of Two or more; the silver powder produced by mixing the first silver powder and the second silver powder has three peaks whose frequency becomes the maximum in the volume-based particle size distribution obtained by dry measurement with a laser diffraction particle size distribution measuring device As mentioned above, in the particle size distribution on a volume basis obtained by wet measurement with a laser diffraction scattering particle size distribution measuring apparatus, one peak whose frequency becomes the maximum is one.

該銀粉之製造方法中,第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜大於第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )。且,第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為0.3~1µm。並且,宜為第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )為1~4μm,且為第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )的4倍以下。並且,利用雷射繞射散射式粒度分布測定裝置進行之濕式測定宜使銀粉分散於異丙醇中來進行。In the manufacturing method of the silver powder, the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is preferably larger than the volume-based particle size distribution of the second silver powder by wet measurement. Cumulative 50% particle size (D 50 ). In addition, the cumulative 50% particle size (D 50 ) of the second silver powder in the volume-based particle size distribution obtained by wet measurement is preferably 0.3 to 1 µm. In addition, it is preferable that the cumulative 50% particle size (D 50 ) of the first silver powder in the particle size distribution based on the volume obtained by the wet measurement is 1 to 4 μm, and the second silver powder is preferably the volume standard obtained by the wet measurement. 4 times or less of the cumulative 50% particle diameter (D 50 ) in the particle size distribution. In addition, the wet measurement by a laser diffraction scattering particle size distribution analyzer is preferably performed by dispersing silver powder in isopropyl alcohol.

又,本發明之銀粉之特徵在於:其在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個。In addition, the silver powder of the present invention is characterized in that in the particle size distribution on a volume basis obtained by dry measurement using a laser diffraction particle size distribution measuring device, there are three or more peaks whose frequency becomes the maximum, and in the particle size distribution using the laser diffraction particle size distribution In the volume-based particle size distribution obtained by the wet measurement of the radiation scattering particle size distribution analyzer, there is one peak whose frequency becomes the maximum.

就該銀粉而言,銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為1.2~3.0μm。且,銀粉之累積90%粒徑(D90 )相對於累積10%粒徑(D10 )之比宜為2.0~8.0。並且,利用雷射繞射散射式粒度分布測定裝置進行之濕式測定宜使銀粉分散於異丙醇中來進行。For the silver powder, the cumulative 50% particle size (D 50 ) of the silver powder in the volume-based particle size distribution obtained by wet measurement is preferably 1.2 to 3.0 μm. In addition, the ratio of the cumulative 90% particle size (D 90 ) to the cumulative 10% particle size (D 10 ) of the silver powder is preferably 2.0 to 8.0. In addition, the wet measurement by a laser diffraction scattering particle size distribution analyzer is preferably performed by dispersing silver powder in isopropyl alcohol.

又,本發明之導電性糊之特徵在於:其係於有機成分中分散有上述銀粉者。Furthermore, the conductive paste of the present invention is characterized in that the above-mentioned silver powder is dispersed in an organic component.

本說明書中,「在體積基準之粒度分布中頻率成為極大之波峰」,係指將以粒度(µm)為橫軸且以頻率(%)為縱軸之體積基準的粒度分布以頻率分布來表示時,在顯示粒度分布之相鄰測定點的粒徑之比以乾式測定為1.2(以濕式測定為1.09)所得之頻率分布的直方圖中顯示極大值之測定點。此外,若該波峰有複數個,當以頻率最大之波峰為主波峰、其之外的波峰為次波峰時,「在體積基準之粒度分布中頻率成為極大之波峰」不包含:頻率非常小到無法與背景區別之次波峰(在主波峰之頻率的15%以下之頻率的次波峰)、或主波峰之粒徑與次波峰之粒徑的差非常小之次波峰(主波峰之粒徑與次波峰之粒徑的差小於主波峰之粒徑的30%之次波峰)。又,在次波峰彼此之關係中,同樣是頻率非常小之次波峰、或與其他次波峰之粒徑的差非常小之次波峰亦不包含於「在體積基準之粒度分布中頻率成為極大之波峰」。 發明效果In this specification, "the peak whose frequency becomes the maximum in the particle size distribution based on volume" means that the particle size distribution based on volume with the particle size (µm) as the horizontal axis and the frequency (%) as the vertical axis is represented as a frequency distribution When the ratio of the particle diameters of the adjacent measurement points showing the particle size distribution is 1.2 in the dry measurement (1.09 in the wet measurement), the measurement point of the maximum value is shown in the histogram of the frequency distribution. In addition, if there are multiple peaks, when the peak with the highest frequency is the main peak and the other peaks are the secondary peaks, "the peak whose frequency becomes the maximum in the particle size distribution based on the volume" does not include: the frequency is very small to A secondary peak that cannot be distinguished from the background (a secondary peak with a frequency below 15% of the frequency of the primary peak), or a secondary peak with a very small difference between the particle size of the primary peak and the secondary peak (the particle size of the primary peak is The difference in particle size of the secondary peak is less than 30% of the particle size of the main peak (secondary peak). Also, in the relationship between the sub-peaks, the sub-peaks whose frequency is very small, or the sub-peaks whose particle diameters differ from other sub-peaks are very small are also not included in "the frequency becomes the largest in the particle size distribution based on volume". crest". Invention effect

根據本發明,可製造在作為導電性糊之材料使用並燒成該導電性糊而形成導電膜時可形成電阻值較以往更低之導電膜的銀粉。According to the present invention, when used as a material of a conductive paste, and when the conductive paste is fired to form a conductive film, a silver powder that can form a conductive film with a lower resistance value than conventional ones can be produced.

本發明之銀粉之實施形態之製造方法,係藉由混合第1銀粉與第2銀粉來製造銀粉,該第1銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個以上者;該第2銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為2個以上者;混合第1銀粉與第2銀粉所製造之銀粉,係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個者。The manufacturing method of the embodiment of the silver powder of the present invention is to manufacture the silver powder by mixing the first silver powder and the second silver powder, and the first silver powder is on the volume basis obtained by dry measurement using a laser diffraction particle size distribution measuring device. In the particle size distribution, there is one or more peaks with a maximum frequency; the second silver powder is a particle size distribution based on a volume obtained by dry measurement using a laser diffraction particle size distribution measuring device, and the peak frequency becomes a maximum of 2 The silver powder produced by mixing the first silver powder and the second silver powder has three or more peaks whose frequency becomes the maximum in the volume-based particle size distribution obtained by dry measurement with a laser diffraction particle size distribution analyzer. , and in the particle size distribution on a volume basis obtained by wet measurement with a laser diffraction scattering particle size distribution analyzer, there is one peak whose frequency becomes the maximum.

在該銀粉之製造方法之實施形態中使用之第1銀粉與第2銀粉係凝集性不同之銀粉,藉由製成這種凝集性不同之銀粉混合存在而成之銀粉,在(如溶解於溶劑中之狀態)分散力可發揮之條件下,凝集會被消除,在體積基準的粒度分布中頻率成為極大之波峰變成1個,而在(如乾燥狀態)分散力無法發揮之條件下,因凝集力而在體積基準的粒度分布中頻率成為極大的波峰會變成3個以上,而充填性會變高。只要使用這種銀粉作為導電性糊之材料,藉由塗佈導電性糊並使其乾燥,可形成缺陷或擦痕少之均勻的高充填膜。只要燒成這種高充填膜,便可形成電阻值低的導電膜。若觀察以上述方式形成之導電膜的截面,相較於將以往之銀粉作為導電性糊的材料使用而形成之導電膜的截面,(藉由燒成而銀粒子彼此凝集時所形成之)空隙所佔面積之比率或空隙的大小會減少,吾等認為因這種空隙所佔面積之比率或空隙的大小之減少,從而導電膜的電阻值會變低。The first silver powder and the second silver powder used in the embodiment of the method for producing silver powder are silver powders with different agglutination properties, and the silver powder with the different agglomeration properties is prepared by mixing the silver powders with different agglomeration properties. Under the condition that the dispersing force can be exerted, the agglomeration will be eliminated, and the peak frequency becomes one in the particle size distribution based on the volume, and under the condition that the dispersing force cannot be exerted (such as the dry state), the agglomeration will be caused. In the particle size distribution based on volume, there are three or more wave peaks where the frequency becomes the maximum, and the filling property becomes high. As long as this silver powder is used as the material of the conductive paste, by coating the conductive paste and drying it, a uniform highly filled film with few defects or scratches can be formed. By firing such a high-filling film, a conductive film with a low resistance value can be formed. When the cross-section of the conductive film formed as described above is observed, compared with the cross-section of the conductive film formed using conventional silver powder as a material for the conductive paste, voids (formed when silver particles are agglomerated by firing) The ratio of the area occupied or the size of the voids decreases, and we think that the resistance value of the conductive film becomes lower due to the reduction in the ratio of the area occupied by the voids or the size of the voids.

該銀粉之製造方法中,第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜大於第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )。且,第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為0.3~1µm,較宜為0.5~0.9μm。且,第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為1~4μm,較宜為1.5~3.3μm。並且,第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )的5倍以下,較宜為4倍以下。此外,銀粉(混合銀粉)中,第1銀粉與第2銀粉之質量比宜為為95:5~50:50,較宜為90:10~65:35。且,利用雷射繞射散射式粒度分布測定裝置進行之濕式測定宜使銀粉分散於異丙醇等溶劑中來進行。In the manufacturing method of the silver powder, the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is preferably larger than the volume-based particle size distribution of the second silver powder by wet measurement. Cumulative 50% particle size (D 50 ). In addition, the cumulative 50% particle size (D 50 ) of the second silver powder in the volume-based particle size distribution obtained by wet measurement is preferably 0.3 to 1 µm, more preferably 0.5 to 0.9 µm. Furthermore, the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is preferably 1 to 4 μm, more preferably 1.5 to 3.3 μm. In addition, the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is preferably the cumulative 50% of the second silver powder in the volume-based particle size distribution obtained by wet measurement. The particle size (D 50 ) is 5 times or less, preferably 4 times or less. In addition, in the silver powder (mixed silver powder), the mass ratio of the first silver powder to the second silver powder is preferably 95:5~50:50, more preferably 90:10~65:35. In addition, the wet measurement by a laser diffraction scattering particle size distribution measuring apparatus is preferably performed by dispersing silver powder in a solvent such as isopropyl alcohol.

又,本發明之銀粉之實施形態中,在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個以上。In addition, in the embodiment of the silver powder of the present invention, in the particle size distribution on a volume basis obtained by dry measurement with a laser diffraction particle size distribution measuring device, there are three or more peaks with a maximum frequency, and in the particle size distribution using a laser diffraction particle size distribution In the volume-based particle size distribution obtained by the wet measurement of the radiation-scattering particle size distribution analyzer, there is one or more peaks at which the frequency becomes the maximum.

該銀粉中,銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )宜為1.2~3.0μm,較宜為1.5~2.8μm。且,銀粉之累積90%粒徑(D90 )相對於累積10%粒徑(D10 )之比宜為2.0~8.0,較宜為2.5~7.0。並且,利用雷射繞射散射式粒度分布測定裝置進行之濕式測定宜使銀粉分散於異丙醇等溶劑中來進行。In the silver powder, the cumulative 50% particle size (D 50 ) of the silver powder in the volume-based particle size distribution obtained by wet measurement is preferably 1.2-3.0 μm, more preferably 1.5-2.8 μm. In addition, the ratio of the cumulative 90% particle size (D 90 ) to the cumulative 10% particle size (D 10 ) of the silver powder is preferably 2.0 to 8.0, more preferably 2.5 to 7.0. In addition, the wet measurement by a laser diffraction scattering particle size distribution analyzer is preferably performed by dispersing silver powder in a solvent such as isopropyl alcohol.

此外,上述第1銀粉與第2銀粉之形狀可為球狀或小片狀等各種粒狀形狀中之任一形狀,亦可為形狀不一致之不定形。In addition, the shape of the said 1st silver powder and the 2nd silver powder may be any shape among various granular shapes, such as spherical shape and a small flake shape, and may be an indefinite shape in which the shape does not match.

將本發明之銀粉之實施形態用作為(燒成型導電性糊等之)導電性糊之材料時,導電性糊之構成要素包含:銀粉與(飽和脂肪族烴類、不飽和脂肪族烴類、酮類、芳香族烴類、二醇醚類、酯類、醇類等之)有機溶劑。且,亦可因應需要包含已將(乙基纖維素或丙烯酸樹脂等之)黏結劑樹脂溶解於有機溶劑中之媒液、玻璃料、無機氧化物、分散劑等。When the embodiment of the silver powder of the present invention is used as a material of a conductive paste (such as a fired conductive paste), the components of the conductive paste include: silver powder and (saturated aliphatic hydrocarbons, unsaturated aliphatic hydrocarbons) , ketones, aromatic hydrocarbons, glycol ethers, esters, alcohols, etc.) organic solvents. In addition, if necessary, a vehicle, glass frit, inorganic oxide, dispersant, etc., in which a binder resin (such as an ethyl cellulose or an acrylic resin) has been dissolved in an organic solvent may also be included.

導電性糊中之銀粉的含量由導電性糊之導電性及製造成本的觀點來看,宜為5~98質量%,較宜為70~95質量%。且,導電性糊中之黏結劑樹脂的含量由導電性糊中之銀粉的分散性及導電性糊之導電性的觀點來看,宜為0.1~10質量%,較宜為0.1~6質量%。已將該黏結劑樹脂溶解於有機溶劑中之媒液亦可混合2種以上來使用。又,導電性糊中之玻璃料的含量由在將導電性糊塗佈於基板來形成電極時,確保燒結導電性糊後藉由燒穿進行之電極與基板間之導通及電極之導電性的觀點來看,宜為0.1~20質量%,較宜為0.1~10質量%。該玻璃料亦可混合2種以上來使用。又,考量導電性糊中之銀粉的分散性及導電性糊之適當的黏度,導電性糊中之有機溶劑的含量(導電性糊中包含媒液時,為包含媒液之有機溶劑的合計之有機溶劑的含量)宜為0.8~20質量%,較宜為0.8~15質量%。該有機溶劑亦可將2種以上混合來使用。The content of the silver powder in the conductive paste is preferably 5 to 98% by mass, and more preferably 70 to 95% by mass, from the viewpoints of the conductivity of the conductive paste and the production cost. In addition, the content of the binder resin in the conductive paste is preferably 0.1 to 10 mass %, more preferably 0.1 to 6 mass %, from the viewpoints of the dispersibility of the silver powder in the conductive paste and the electrical conductivity of the conductive paste. . It is also possible to mix and use two or more types of the vehicle in which the binder resin has been dissolved in an organic solvent. In addition, the content of the glass frit in the conductive paste is from the viewpoint of securing the conduction between the electrode and the substrate and the conductivity of the electrode by firing through the conductive paste when the conductive paste is applied to the substrate to form the electrode. In view of this, it is preferably 0.1 to 20 mass %, more preferably 0.1 to 10 mass %. The glass frit may be used by mixing two or more types. In addition, considering the dispersibility of the silver powder in the conductive paste and the appropriate viscosity of the conductive paste, the content of the organic solvent in the conductive paste (when the conductive paste contains a vehicle, it is the total of the organic solvents including the vehicle). The content of the organic solvent) is preferably 0.8 to 20% by mass, more preferably 0.8 to 15% by mass. This organic solvent can also be used in mixture of 2 or more types.

這種導電性糊例如可藉由計量各構成要素後放入預定之容器中,使用擂潰機、萬能攪拌機、捏合機等進行預捏合後,以3支輥進行正式捏合來製作。又,亦可視需求於其後添加有機溶劑來調整黏度。又,亦可僅將玻璃料或無機氧化物與媒液進行正式捏合使粒度降低後,最後再追加銀粉進行正式捏合。 實施例Such a conductive paste can be produced by, for example, measuring each component, placing it in a predetermined container, pre-kneading using a beater, an all-purpose mixer, a kneader, etc., and then performing full-scale kneading with three rolls. In addition, an organic solvent may be added thereafter to adjust the viscosity as required. In addition, after only main-kneading the glass frit or inorganic oxide and the vehicle liquid to reduce the particle size, silver powder may be added to perform main-kneading at the end. Example

以下,詳細說明本發明之銀粉及其製造方法之實施例。Hereinafter, embodiments of the silver powder of the present invention and its manufacturing method will be described in detail.

[實施例1] 準備市售之銀粉(DOWA HIGHTECH CO.,LTD.製之AG-5-54F)作為銀粉1,使用乾式雷射繞射式粒度分布測定裝置(股份公司日本雷射製之Sympatec粒度分布測定裝置(HELOS&RODOS)),在測定透鏡R1、焦點距離20mm、分散壓2.0bar、抽吸壓100mbar下測定該銀粉之體積基準的粒度分布,求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉1之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為1.4μm,累積50%粒徑(D50 徑)為2.8μm,體積基準之累積90%粒徑(D90 徑)為4.2μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率19.6%下峰值粒徑A為3.6µm。將該測定結果顯示於圖1A。[Example 1] A commercially available silver powder (AG-5-54F manufactured by DOWA HIGHTECH CO., LTD.) was prepared as silver powder 1, and a dry laser diffraction particle size distribution analyzer (Sympatec manufactured by Nippon Laser Co., Ltd.) was used. Particle size distribution measuring device (HELOS & RODOS)), measure the particle size distribution on the volume basis of the silver powder under the measuring lens R1, the focal distance 20mm, the dispersion pressure 2.0bar, and the suction pressure 100mbar, and obtain (using a dry laser diffraction particle size distribution) The volume-based particle size distribution of the obtained silver powder 1 was measured, and the cumulative 10% particle size (D 10 diameter) was 1.4 μm, the cumulative 50% particle size (D 50 diameter) was 2.8 μm, and the volume-based cumulative 90% particle size (D 90 diameter) was 4.2 μm. In addition, in this particle size distribution, there is one peak where the frequency becomes the maximum, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 3.6 µm at a frequency of 19.6%. The measurement results are shown in Fig. 1A.

又,將上述銀粉(銀粉1)0.1g加入異丙醇(IPA)40mL中,藉由晶片前端直徑18mm之超音波均質機(股份公司日本精機製作所製之US-150T,19.5kHz)使其分散2分鐘而得試料,針對所得試料利用雷射繞射散射式粒度分布測定裝置(MicrotracBEL股份公司製之MICROTRAC MT3300EXII),在全反射模式下求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉1之體積基準的粒度分布,結果累積10%粒徑(D10 )為1.7μm,累積50%粒徑(D50 )為2.5μm,累積90%粒徑(D90 )為3.9μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率11.2%下峰值粒徑A為2.8µm。將該測定結果顯示於圖1B。並將上述銀粉(銀粉1)之1萬倍的掃描電子顯微鏡照片(SEM影像)顯示於圖1C。使用該SEM影像測定任意100個以上粒子之(圓等效)直徑,算出其平均值(SEM粒徑)為1.32µm。In addition, 0.1 g of the above-mentioned silver powder (silver powder 1) was added to 40 mL of isopropyl alcohol (IPA), and dispersed by an ultrasonic homogenizer (US-150T, 19.5 kHz, manufactured by Nippon Seiki Co., Ltd., Japan Seiki Co., Ltd.) with a diameter of 18 mm at the front end of the wafer. A sample was obtained for 2 minutes, and the obtained sample was determined in the total reflection mode using a laser diffraction scattering particle size distribution analyzer (MICROTRAC MT3300EXII manufactured by MicrotracBEL Co., Ltd.) (particle size distribution measurement by wet laser diffraction scattering). The obtained) volume-based particle size distribution of the silver powder 1 shows that the cumulative 10% particle size (D 10 ) is 1.7 μm, the cumulative 50% particle size (D 50 ) is 2.5 μm, and the cumulative 90% particle size (D 90 ) is 3.9 μm. In addition, in this particle size distribution, there is one peak with a maximum frequency, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 2.8 µm at a frequency of 11.2%. The measurement results are shown in FIG. 1B . A scanning electron microscope photograph (SEM image) of 10,000 times the above-mentioned silver powder (silver powder 1) is shown in FIG. 1C . Using this SEM image, the (circle-equivalent) diameter of any 100 or more particles was measured, and the average value (SEM particle diameter) was calculated to be 1.32 µm.

又,準備另一市售之銀粉(DOWA HIGHTECH CO.,LTD.製之AG-2-1C)作為銀粉2,藉由與上述相同方法求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉1之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為0.5μm,累積50%粒徑(D50 徑)為0.9μm,累積90%粒徑(D90 徑)為1.9μm。又,該粒度分布中,頻率成為極大的波峰有2個,當令該等2個波峰中頻率最高之粒徑為峰值粒徑A,並令較其更低之頻率的粒徑為峰值粒徑B時,頻率13.1%之峰值粒徑A為1.5µm,頻率11.4%之峰值粒徑B為0.7µm。將該測定結果顯示於圖2A。Further, another commercially available silver powder (AG-2-1C manufactured by DOWA HIGHTECH CO., LTD.) was prepared as silver powder 2, and was obtained by the same method as above (by dry laser diffraction particle size distribution measurement). ) Volume-based particle size distribution of silver powder 1, the cumulative 10% particle diameter (D 10 diameter) is 0.5 μm, the cumulative 50% particle diameter (D 50 diameter) is 0.9 μm, and the cumulative 90% particle diameter (D 90 diameter) is 0.9 μm 1.9 μm. In addition, in this particle size distribution, there are two peaks whose frequency becomes the maximum, when let the particle size with the highest frequency among these two peaks be the peak particle size A, and let the particle size with a lower frequency be the peak particle size B. , the peak particle size A of frequency 13.1% is 1.5µm, and the peak particle size B of frequency 11.4% is 0.7µm. The measurement results are shown in Fig. 2A.

又,針對上述銀粉(銀粉2),藉由與上述相同方法求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉2之體積基準的粒度分布,結果累積10%粒徑(D10 )為0.4μm,累積50%粒徑(D50 )為0.9μm,累積90%粒徑(D90 )為1.7μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率6.6%下峰值粒徑A為1.1µm。將該測定結果顯示於圖2B。並將上述銀粉(銀粉2)之1萬倍的SEM影像顯示於圖2C。使用該SEM影像測定任意100個以上粒子之(圓等效)直徑,算出其平均值(SEM粒徑)為0.46µm。In addition, with respect to the above-mentioned silver powder (silver powder 2), the volume-based particle size distribution of the silver powder 2 (obtained by wet laser diffraction scattering particle size distribution measurement) was obtained by the same method as described above, and the cumulative 10% particle size ( D 10 ) was 0.4 μm, the cumulative 50% particle diameter (D 50 ) was 0.9 μm, and the cumulative 90% particle diameter (D 90 ) was 1.7 μm. In addition, in this particle size distribution, there is one peak where the frequency becomes the maximum, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 1.1 µm at a frequency of 6.6%. The measurement results are shown in Fig. 2B. A 10,000-fold SEM image of the above-mentioned silver powder (silver powder 2) is shown in FIG. 2C . Using this SEM image, the (circle-equivalent) diameter of 100 or more arbitrary particles was measured, and the average value (SEM particle diameter) was calculated to be 0.46 µm.

接著,將42.5g(85質量%)之銀粉1與7.5g(15質量%)之銀粉2放入電動咖啡碾(Melitta Ltd.製之ECG-62)中,混合4分鐘。Next, 42.5 g (85 mass %) of silver powder 1 and 7.5 g (15 mass %) of silver powder 2 were placed in an electric coffee mill (ECG-62 manufactured by Melitta Ltd.), and mixed for 4 minutes.

針對依上述方式獲得之銀粉(混合銀粉),藉由與上述相同方法求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為0.7μm,體積基準的累積50%粒徑(D50 徑)為2.3μm,體積基準的累積90%粒徑(D90 徑)為4.5μm。又,該粒度分布中,頻率成為極大的波峰有3個,當令該等3個波峰中頻率最高之粒徑為峰值粒徑A,令較其更低之頻率的粒徑為峰值粒徑B,並令再較其更低之頻率的粒徑為峰值粒徑C時,頻率11.6%之峰值粒徑A為3.6µm,頻率7.1%之峰值粒徑B為1.8µm,頻率3.9%之峰值粒徑C為0.7µm。將該測定結果顯示於圖3A。For the silver powder (mixed silver powder) obtained as described above, the volume-based particle size distribution of the silver powder (obtained by the dry laser diffraction particle size distribution measurement) was obtained by the same method as above, and the cumulative 10% particle size (D 10 diameter) was 0.7 μm, the volume-based cumulative 50% particle diameter (D 50 diameter) was 2.3 μm, and the volume-based cumulative 90% particle diameter (D 90 diameter) was 4.5 μm. Also, in this particle size distribution, there are 3 peaks whose frequency becomes the maximum, when let the particle diameter with the highest frequency among these 3 peaks be the peak particle diameter A, and let the particle diameter with a lower frequency be the peak particle diameter B, And let the particle size of the lower frequency be the peak particle size C, the peak particle size A of the frequency 11.6% is 3.6µm, the peak particle size B of the frequency 7.1% is 1.8µm, and the peak particle size of the frequency 3.9% is 1.8µm. C is 0.7µm. The measurement results are shown in Fig. 3A.

又,針對上述銀粉(混合銀粉),藉由與上述相同方法求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 )為0.8μm,累積50%粒徑(D50 )為2.1μm,累積90%粒徑(D90 )為4.1μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率6.5%下峰值粒徑A為2.5µm。將該測定結果顯示於圖3B。並將上述銀粉(混合銀粉)之1萬倍的SEM影像顯示於圖3C。In addition, for the above-mentioned silver powder (mixed silver powder), the volume-based particle size distribution of the silver powder (obtained by wet laser diffraction scattering particle size distribution measurement) was obtained by the same method as above, and the cumulative 10% particle size (D 10 ) was 0.8 μm, the cumulative 50% particle diameter (D 50 ) was 2.1 μm, and the cumulative 90% particle diameter (D 90 ) was 4.1 μm. In addition, in this particle size distribution, there is one peak where the frequency becomes the maximum, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 2.5 µm at a frequency of 6.5%. The measurement results are shown in Fig. 3B. 10,000 times the SEM image of the above-mentioned silver powder (mixed silver powder) is shown in FIG. 3C .

又,將所得銀粉(混合銀粉)89.8質量%、玻璃料(岡本玻璃股份公司製之FSGCO2)2.0質量%、作為分散劑之油酸0.4質量%、作為樹脂之乙基纖維素與羥丙基纖維素的混合物0.2質量%、作為溶劑之萜品醇與Texanol(2,2,4-三甲基-1,3-戊二醇單異丁酸酯)與丁卡必醇乙酸酯的混合物6.2質量%、作為觸變劑之氫化篦麻油1.1質量%及作為線狀維持劑之二甲基聚矽氧烷0.4質量%,用無螺槳自轉公轉式攪拌脫泡裝置(股份公司THINKY製之AR250)捏合並用3支輥(EXAKT公司製之80S)捏合後,使其通過500μm的網目,藉此獲得導電性糊。Further, 89.8% by mass of the obtained silver powder (mixed silver powder), 2.0% by mass of glass frit (FSGCO2 manufactured by Okamoto Glass Co., Ltd.), 0.4% by mass of oleic acid as a dispersant, ethyl cellulose and hydroxypropyl fiber as resins 0.2 mass % of a mixture of vegans, a mixture of terpineol and Texanol (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate) and tetracarbitol acetate as a solvent 6.2 % by mass, 1.1% by mass of hydrogenated sesame oil as a thixotropic agent, and 0.4% by mass of dimethylpolysiloxane as a linear maintenance agent, using a propellerless rotating revolution type stirring and defoaming device (AR250 manufactured by Thinky Co., Ltd. ) was kneaded and kneaded with three rolls (80S manufactured by EXAKT Corporation), and passed through a mesh of 500 μm to obtain a conductive paste.

接著,準備太陽能電池用矽基板(100Ω/□),於該矽基板背面藉由網版印刷機(Micro-tec股份公司製之MT-320T)將鋁糊(東洋鋁股份公司製之ALSOLAR 14-7021)印刷成154mm見方之矩形的圖案,並藉由熱風式乾燥機在200℃下乾燥10分鐘,同時於該矽基板表面藉由網版印刷機(Micro-tec股份公司製之MT-320T)將上述導電性糊印刷成110支寬度27µm之指狀電極形狀與4支寬度1.1mm之匯流排電極形狀,並藉由熱風式乾燥機在200℃下乾燥10分鐘後,利用高速燒成IR爐(日本碍子股份公司製之高速燒成試驗4室爐)在大氣中設為in-out 21秒鐘在770℃下燒成而形成導電膜,藉此製作出太陽能電池。Next, a silicon substrate (100Ω/□) for solar cells was prepared, and aluminum paste (ALSOLAR 14- manufactured by Toyo Aluminium Co., Ltd.) was applied to the back surface of the silicon substrate by a screen printing machine (MT-320T manufactured by Micro-tec Co., Ltd.). 7021) was printed into a 154mm square rectangular pattern, and dried at 200 ° C for 10 minutes by a hot air dryer, and at the same time on the surface of the silicon substrate by a screen printing machine (MT-320T manufactured by Micro-tec Co., Ltd.) The above conductive paste was printed into 110 finger electrodes with a width of 27µm and 4 busbar electrodes with a width of 1.1mm, dried at 200°C for 10 minutes by a hot air dryer, and then fired in a high-speed IR furnace. (High-speed firing test 4-chamber furnace manufactured by NGK Co., Ltd.) The solar cell was produced by firing at 770° C. with in-out for 21 seconds in the atmosphere to form a conductive film.

利用太陽光模擬器(WACOM ELECTRIC CO.,LTD.製)之氙燈對上述太陽能電池照射光照射能100mW/cm2 的模擬太陽光。結果,使太陽能電池的輸出端子短路時兩端子間流動之電流(短路電流)Isc為8.78A,開放太陽能電池之輸出端子時兩端子間之電壓(開路電壓)Voc為0.63V,電流密度Jsc(每1cm2 之短路電流Isc)為3.7×10-2 A/cm2 ,最大功率Pmax(=Imax・Vmax)除以開路電壓Voc與電流密度Jsc之積所得之值(填充因數)FF(=Pmax/Voc・Isc)為79.66,轉換效率(發電效率)Eff(將最大功率Pmax除以(每1cm2 之)照射光量(W)所得之值乘以100後之值)為18.27%,為良好,串聯電阻Rs為6.4×10-3 Ω/□。The solar cell was irradiated with simulated sunlight having a light irradiation energy of 100 mW/cm 2 using a xenon lamp of a solar simulator (manufactured by WACOM ELECTRIC CO., LTD.). As a result, when the output terminal of the solar cell was short-circuited, the current (short-circuit current) Isc flowing between the two terminals was 8.78 A, the voltage (open-circuit voltage) Voc between the two terminals when the output terminal of the solar cell was opened was 0.63 V, and the current density Jsc ( The short-circuit current Isc) per 1 cm 2 is 3.7×10 -2 A/cm 2 , the value obtained by dividing the maximum power Pmax (=Imax·Vmax) by the product of the open circuit voltage Voc and the current density Jsc (fill factor) FF (=Pmax /Voc・Isc) was 79.66, and the conversion efficiency (power generation efficiency) Eff (the value obtained by dividing the maximum power Pmax by the amount of irradiated light (W) per 1 cm 2 and multiplying it by 100) was 18.27%, which was considered good. The series resistance Rs was 6.4×10 -3 Ω/□.

[實施例2] 將5525g(85質量%)之銀粉1與975g(15質量%)之銀粉2放入V型混合器(DULTON COMPANY LIMITED製之DV-1-10)中,以60rpm混合360分鐘,除此之外藉由與實施例1相同方法針對所得銀粉(混合銀粉),求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為0.6μm,累積50%粒徑(D50 徑)為2.1μm,累積90%粒徑(D90 徑)為4.2μm。又,該粒度分布中,頻率成為極大的波峰有3個,當令該等3個波峰中頻率最高之粒徑為峰值粒徑A,令較其更低之頻率的粒徑為峰值粒徑B,並令再較其更低之頻率的粒徑為峰值粒徑C時,頻率11.1%之峰值粒徑A為3.0µm,頻率8.4%之峰值粒徑B為1.8µm,頻率3.8%之峰值粒徑C為0.7µm。將該測定結果顯示於圖4A。[Example 2] 5525 g (85 mass %) of silver powder 1 and 975 g (15 mass %) of silver powder 2 were put into a V-type mixer (DV-1-10 manufactured by DULTON COMPANY LIMITED), and mixed at 60 rpm for 360 minutes , except that by the same method as in Example 1 for the obtained silver powder (mixed silver powder), the particle size distribution on the volume basis of the silver powder (obtained by dry laser diffraction particle size distribution measurement) was obtained, and the result accumulated 10% particles The diameter (D 10 diameter) was 0.6 μm, the cumulative 50% particle diameter (D 50 diameter) was 2.1 μm, and the cumulative 90% particle diameter (D 90 diameter) was 4.2 μm. Also, in this particle size distribution, there are 3 peaks whose frequency becomes the maximum, when let the particle diameter with the highest frequency among these 3 peaks be the peak particle diameter A, and let the particle diameter with a lower frequency be the peak particle diameter B, And let the particle size of the lower frequency be the peak particle size C, the peak particle size A of the frequency 11.1% is 3.0µm, the peak particle size B of the frequency 8.4% is 1.8µm, and the peak particle size of the frequency 3.8% is 1.8µm. C is 0.7µm. The measurement results are shown in Fig. 4A.

又,針對上述銀粉(混合銀粉),藉由與實施例1相同方法求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 )為0.9μm,累積50%粒徑(D50 )為2.2μm,累積90%粒徑(D90 )為4.0μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率7.1%下峰值粒徑A為2.5µm。將該測定結果顯示於圖4B。並將上述銀粉(混合銀粉)之1萬倍的SEM影像顯示於圖4C。In addition, with respect to the above-mentioned silver powder (mixed silver powder), the volume-based particle size distribution of the silver powder (obtained by wet laser diffraction scattering particle size distribution measurement) was obtained by the same method as in Example 1, and the result was a cumulative 10% particle size. (D 10 ) was 0.9 μm, the cumulative 50% particle diameter (D 50 ) was 2.2 μm, and the cumulative 90% particle diameter (D 90 ) was 4.0 μm. In addition, in this particle size distribution, there is one peak with a maximum frequency, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 2.5 µm at a frequency of 7.1%. The measurement results are shown in Fig. 4B. The SEM image of 10,000 times the above-mentioned silver powder (mixed silver powder) is shown in FIG. 4C .

又,使用所得銀粉(混合銀粉),藉由與實施例1相同方法獲得導電性糊後,製作太陽能電池並求出串聯電阻,得6.4×10-3 Ω/□。Moreover, after obtaining a conductive paste by the same method as Example 1 using the obtained silver powder (mixed silver powder), the solar cell was produced, and the series resistance was calculated|required, and 6.4×10 -3 Ω/□ was obtained.

[比較例1] 將銀濃度1.4質量%之硝酸銀水溶液3670.1g放入玻璃製燒杯中,於該硝酸銀水溶液中加入濃度28質量%之氨水161.8g(相對於銀1莫耳為2.67莫耳當量之氨),並在加入該氨水起30秒後加入濃度20質量%之氫氧化鈉水溶液7.5g,而獲得銀氨錯合物水溶液。將該銀氨錯合物水溶液攪拌3分鐘後,於該經攪拌之銀氨錯合物水溶液中混合(已將福馬林以純水稀釋過之)21.0質量%之甲醛水溶液357.6g(相對於銀1莫耳為為12.4莫耳當量),於該混合開始起15秒後加入(作為還原劑)濃度1.55質量%之硬脂酸之乙醇溶液6.01g後使還原反應結束,而獲得含銀粒子之漿料。過濾該漿料並水洗至濾液之導電率成為0.2mS後,利用真空乾燥機在73℃下乾燥10小時後,將所得乾燥粉投入碎解機(協立理工股份公司製之SK-M10型)中,反覆進行2次30秒鐘之碎解而獲得銀粉。[Comparative Example 1] Put 3670.1 g of an aqueous silver nitrate solution with a silver concentration of 1.4 mass % into a glass beaker, add 161.8 g of ammonia water with a concentration of 28 mass % to the silver nitrate aqueous solution (2.67 molar equivalent of ammonia with respect to 1 molar of silver), and put it in a glass beaker. 30 seconds after the addition of the ammonia water, 7.5 g of an aqueous sodium hydroxide solution having a concentration of 20 mass % was added to obtain a silver ammonia complex aqueous solution. After the silver-ammine complex aqueous solution was stirred for 3 minutes, 357.6 g (relative to silver) of 21.0 mass % formaldehyde aqueous solution (formalin was diluted with pure water) was mixed with the stirred silver-ammine complex aqueous solution. 1 mol is 12.4 mol equivalent), 15 seconds after the start of the mixing, 6.01 g of an ethanol solution of stearic acid with a concentration of 1.55 mass % (as a reducing agent) was added to complete the reduction reaction, and a silver-containing particle was obtained. slurry. The slurry was filtered and washed with water until the conductivity of the filtrate became 0.2 mS. After drying at 73° C. for 10 hours with a vacuum dryer, the resulting dried powder was put into a disintegrator (SK-M10, manufactured by Kyoritsu Kogyo Co., Ltd.) In the process, the disintegration for 30 seconds was repeated twice to obtain silver powder.

將依上述方式獲得之銀粉作為銀粉1,藉由與實施例1相同方法求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為1.0μm,累積50%粒徑(D50 徑)為2.1μm,體積基準的累積90%粒徑(D90 徑)為3.4μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率17.4%下峰值粒徑A為2.3µm。將該測定結果顯示於圖5A。The silver powder obtained in the above manner was used as silver powder 1, and the particle size distribution on the volume basis of the silver powder (obtained by dry laser diffraction particle size distribution measurement) was obtained by the same method as in Example 1, and the result was a cumulative 10% particle size ( D 10 diameter) was 1.0 μm, cumulative 50% particle diameter (D 50 diameter) was 2.1 μm, and volume-based cumulative 90% particle diameter (D 90 diameter) was 3.4 μm. In addition, in this particle size distribution, there is one peak with a maximum frequency, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 2.3 µm at a frequency of 17.4%. The measurement results are shown in Fig. 5A.

又,針對所得銀粉(銀粉1),藉由與實施例1相同方法求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 )為1.1μm,累積50%粒徑(D50 )為1.8μm,累積90%粒徑(D90 )為2.8μm。又,該粒度分布中,頻率成為極大的波峰為1個,當令頻率最高之粒徑為峰值粒徑A時,在頻率10.2%下峰值粒徑A為2.1µm。將該測定結果顯示於圖5B。並將上述銀粉之1萬倍的SEM影像顯示於圖5C。使用該SEM影像測定任意100個以上粒子之(圓等效)直徑,算出其平均值(SEM粒徑)為1.29µm。Moreover, with respect to the obtained silver powder (silver powder 1), the volume-based particle size distribution of the silver powder (obtained by wet laser diffraction scattering particle size distribution measurement) was obtained by the same method as in Example 1, and the result was a cumulative 10% particle size. (D 10 ) was 1.1 μm, the cumulative 50% particle diameter (D 50 ) was 1.8 μm, and the cumulative 90% particle diameter (D 90 ) was 2.8 μm. In addition, in this particle size distribution, there is one peak with a maximum frequency, and when the particle size with the highest frequency is the peak particle size A, the peak particle size A is 2.1 µm at a frequency of 10.2%. The measurement results are shown in Fig. 5B. The 10,000-fold SEM image of the above-mentioned silver powder is shown in FIG. 5C . Using this SEM image, the (circle equivalent) diameter of 100 or more arbitrary particles was measured, and the average value (SEM particle diameter) was calculated to be 1.29 µm.

又,直接使用所得銀粉(銀粉1)(不製成混合銀粉),藉由與實施例1相同方法獲得導電性糊後,製作太陽能電池並求出串聯電阻,得6.8×10-3 Ω/□。In addition, the obtained silver powder (silver powder 1) was used as it was (not mixed silver powder), and a conductive paste was obtained in the same manner as in Example 1, and then a solar cell was fabricated and the series resistance was determined to obtain 6.8×10 -3 Ω/□ .

[比較例2] 又,直接使用實施例1之銀粉1(DOWA HIGHTECH CO.,LTD.製之AG-5-54F)(不製成混合銀粉),藉由與實施例1相同方法獲得導電性糊後,製作太陽能電池並求出串聯電阻,得6.8×10-3 Ω/□。[Comparative Example 2] In addition, the silver powder 1 of Example 1 (AG-5-54F manufactured by DOWA HIGHTECH CO., LTD.) was used as it was (without mixed silver powder), and conductivity was obtained by the same method as in Example 1. After pasting, a solar cell was fabricated and the series resistance was determined to be 6.8×10 -3 Ω/□.

[比較例3] 準備市售之銀粉(DOWA HIGHTECH CO.,LTD.製之FA-S-16)作為銀粉1,藉由與實施例1相同方法求出(利用乾式雷射繞射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 徑)為0.5μm,累積50%粒徑(D50 徑)為1.5μm,累積90%粒徑(D90 徑)為9.5μm。又,該粒度分布中,頻率成為極大的波峰有3個,當令該等3個波峰中頻率最高之粒徑為峰值粒徑A,令較其更高之頻率的粒徑為峰值粒徑B,並令再較其更高之頻率的粒徑為峰值粒徑C時,頻率8.0%之峰值粒徑A為1.5µm,頻率6.3%之峰值粒徑B為0.7µm,頻率5.3%之峰值粒徑C為8.6µm。將該測定結果顯示於圖6A。[Comparative Example 3] A commercially available silver powder (FA-S-16 manufactured by DOWA HIGHTECH CO., LTD.) was prepared as silver powder 1, and was obtained by the same method as in Example 1 (using a dry laser diffraction particle size distribution The particle size distribution on the volume basis of the obtained silver powder was measured, and the cumulative 10% particle diameter (D 10 diameter) was 0.5 μm, the cumulative 50% particle diameter (D 50 diameter) was 1.5 μm, and the cumulative 90% particle diameter (D 90 diameter) was 1.5 μm. ) is 9.5 μm. Also, in this particle size distribution, there are 3 peaks whose frequency becomes the maximum, when let the particle diameter with the highest frequency among these 3 peaks be the peak particle diameter A, and let the particle diameter with a higher frequency be the peak particle diameter B, And let the particle size of the higher frequency be the peak particle size C, the peak particle size A of the frequency 8.0% is 1.5µm, the peak particle size B of the frequency 6.3% is 0.7µm, and the peak particle size of the frequency 5.3% is 0.7µm. C is 8.6 µm. The measurement results are shown in Fig. 6A.

又,針對上述銀粉(銀粉1),藉由與實施例1相同方法求出(利用濕式雷射繞射散射式粒度分布測定所得之)銀粉之體積基準的粒度分布,結果累積10%粒徑(D10 )為0.5μm,累積50%粒徑(D50 )為1.9μm,累積90%粒徑(D90 )為9.8μm。又,該粒度分布中,頻率成為極大的波峰有2個,當令該等2個波峰中頻率最高之粒徑為峰值粒徑A,令較其更高之頻率的粒徑為峰值粒徑B時,在頻率3.2%下峰值粒徑A為1.4µm,在頻率2.6%下峰值粒徑B為7.1µm。將該測定結果顯示於圖6B。並將上述銀粉之1萬倍的SEM影像顯示於圖6C。In addition, with respect to the above-mentioned silver powder (silver powder 1), the volume-based particle size distribution of the silver powder (obtained by wet laser diffraction scattering particle size distribution measurement) was obtained by the same method as in Example 1, and the result was a cumulative 10% particle size. (D 10 ) was 0.5 μm, the cumulative 50% particle diameter (D 50 ) was 1.9 μm, and the cumulative 90% particle diameter (D 90 ) was 9.8 μm. In addition, in this particle size distribution, there are two peaks whose frequency becomes the maximum, when the particle size with the highest frequency among these two peaks is the peak particle size A, and the particle size with a higher frequency is the peak particle size B. , the peak particle size A is 1.4 µm at a frequency of 3.2%, and the peak particle size B is 7.1 µm at a frequency of 2.6%. The measurement results are shown in Fig. 6B. The 10,000-fold SEM image of the above-mentioned silver powder is shown in FIG. 6C .

又,直接使用上述銀粉(銀粉1)(不製成混合銀粉),藉由與實施例1相同方法獲得導電性糊後,形成導電膜並嘗試製作太陽能電池,但導電膜斷線而無法測定串聯電阻。如該比較例可知,當將使用有以下銀粉之導電性糊印刷於基板時,缺陷及擦痕會變多,而難以形成均勻的高充填膜,該銀粉在(利用乾式雷射繞射式粒度分布測定所得之)體積基準的粒度分布中頻率成為極大之波峰有3個,且在(利用濕式雷射繞射散射式粒度分布測定所得之)體積基準的粒度分布中頻率成為極大之波峰有2個。In addition, the above-mentioned silver powder (silver powder 1) was used as it was (not mixed silver powder), and a conductive paste was obtained by the same method as in Example 1, and then a conductive film was formed to try to produce a solar cell, but the conductive film was disconnected and the series connection could not be measured. resistance. As can be seen from this comparative example, when the conductive paste using the following silver powder is printed on the substrate, defects and scratches will increase, and it is difficult to form a uniform high-fill film. There are 3 peaks with a maximum frequency in the volume-based particle size distribution obtained by the distribution measurement, and there are 3 peaks with a maximum frequency in the volume-based particle size distribution (obtained by the wet laser diffraction scattering particle size distribution measurement). 2.

將該等實施例及比較例之銀粉的特性列於表1~表2。The properties of the silver powders of these examples and comparative examples are listed in Tables 1 to 2.

[表1]

Figure 02_image001
[Table 1]
Figure 02_image001

[表2]

Figure 02_image003
[Table 2]
Figure 02_image003

又,將實施例1~2及比較例1~2中所得各太陽能電池沿相對於其表面呈垂直之方向切割,並將該截面用離子研磨裝置(股份公司日立High-Technologies製之ArBlade500),在射束電流180µA下間歇性反覆ON-OFF(20秒ON與10秒OFF),進行3小時研磨。將依上述方式研磨後之太陽能電池的導電膜之截面的掃描電子顯微鏡照片(SEM影像)顯示於圖7~圖10。In addition, each solar cell obtained in Examples 1 to 2 and Comparative Examples 1 to 2 was cut in a direction perpendicular to the surface thereof, and the cross section was subjected to an ion milling apparatus (ArBlade 500 manufactured by Hitachi High-Technologies Co., Ltd.), At a beam current of 180 µA, ON-OFF (20 seconds ON and 10 seconds OFF) was intermittently repeated, and polishing was performed for 3 hours. Scanning electron microscope photographs (SEM images) of the cross-sections of the conductive films of the solar cells polished as described above are shown in FIGS. 7 to 10 .

針對圖7~圖10所示SEM影像,利用影像解析軟體(股份公司Mountech製之Mac-View)進行解析,求出空隙面積相對於導電膜面積的比率。此外,所使用之影像解析軟體只要以觸控筆摹繪出SEM影像中導電膜與空隙之輪廓,便可算出導電膜面積與空隙面積。結果,空隙面積相對於導電膜面積的比率在實施例1中為14.4%,在實施例2中為13.8%,在比較例1中為18.7%,在比較例2中為22.8%。由該等結果來看,相較於比較例1~2,實施例1~2之空隙面積相對於導電膜面積的比率少,故吾等認為導電膜的電阻值較低。 產業上之可利用性The SEM images shown in FIGS. 7 to 10 were analyzed using image analysis software (Mac-View manufactured by Mounttech Co., Ltd.), and the ratio of the void area to the conductive film area was obtained. In addition, the image analysis software used can calculate the area of the conductive film and the void area by tracing the outline of the conductive film and the void in the SEM image with a stylus. As a result, the ratio of the void area to the conductive film area was 14.4% in Example 1, 13.8% in Example 2, 18.7% in Comparative Example 1, and 22.8% in Comparative Example 2. From these results, compared with Comparative Examples 1 and 2, the ratio of the void area to the conductive film area of Examples 1 to 2 is small, so we think that the resistance value of the conductive film is low. industrial availability

為了形成太陽能電池之電極、使用低溫燒成陶瓷(LTCC)之電子零件或積層陶瓷電感等積層陶瓷電子零件之內部電極、積層陶瓷電容器或積層陶瓷電感等之外部電極等,可利用本發明之銀粉作為燒成型導電性糊之材料來獲得高導電性之導電膜。The silver powder of the present invention can be used to form electrodes for solar cells, electronic components using low temperature firing ceramics (LTCC), internal electrodes for multilayer ceramic electronic components such as multilayer ceramic inductors, and external electrodes for multilayer ceramic capacitors or multilayer ceramic inductors. It is used as a material for sintered conductive paste to obtain a conductive film with high conductivity.

圖1A係顯示實施例中使用之銀粉1利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖1B係顯示實施例中使用之銀粉1利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖1C為實施例中使用之銀粉1之1萬倍的掃描電子顯微鏡照片(SEM影像)。 圖2A係顯示實施例中使用之銀粉2利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖2B係顯示實施例中使用之銀粉2利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖2C為實施例中使用之銀粉2之1萬倍的SEM影像。 圖3A係顯示實施例1中所得銀粉利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖3B係顯示實施例1中所得銀粉利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖3C為實施例1中所得銀粉之1萬倍的SEM影像。 圖4A係顯示實施例2中所得銀粉利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖4B係顯示實施例2中所得銀粉利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖4C為實施例2中所得銀粉之1萬倍的SEM影像。 圖5A係顯示比較例1中所得銀粉利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖5B係顯示比較例1中所得銀粉利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖5C為比較例1中所得銀粉之1萬倍的SEM影像。 圖6A係顯示比較例3中所得銀粉利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布之圖。 圖6B係顯示比較例3中所得銀粉利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布之圖。 圖6C為比較例3中所得銀粉之1萬倍的SEM影像。 圖7係燒成實施例1中所得導電性糊後之導電膜之截面的掃描電子顯微鏡照片(SEM影像)。 圖8係燒成實施例2中所得導電性糊後之導電膜之截面的SEM影像。 圖9係燒成比較例1中所得導電性糊後之導電膜之截面的SEM影像。 圖10係燒成比較例2中所得導電性糊後之導電膜之截面的SEM影像。1A is a graph showing the particle size distribution on a volume basis obtained by dry measurement of the silver powder 1 used in the examples using a laser diffraction particle size distribution analyzer. 1B is a graph showing the particle size distribution on a volume basis obtained by wet measurement of the silver powder 1 used in the examples using a laser diffraction scattering particle size distribution analyzer. FIG. 1C is a scanning electron microscope photograph (SEM image) of 10,000 times the silver powder used in the example. FIG. 2A is a graph showing the particle size distribution on a volume basis obtained by dry measurement of the silver powder 2 used in the examples using a laser diffraction particle size distribution analyzer. 2B is a graph showing the particle size distribution on a volume basis obtained by wet measurement of the silver powder 2 used in the examples using a laser diffraction scattering particle size distribution measuring apparatus. FIG. 2C is an SEM image of 10,000 times the silver powder 2 used in the example. 3A is a graph showing the volume-based particle size distribution of the silver powder obtained in Example 1 by dry measurement using a laser diffraction particle size distribution analyzer. 3B is a graph showing the particle size distribution on a volume basis of the silver powder obtained in Example 1 by wet measurement with a laser diffraction scattering particle size distribution analyzer. FIG. 3C is an SEM image of 10,000 times the silver powder obtained in Example 1. FIG. 4A is a graph showing the particle size distribution on a volume basis of the silver powder obtained in Example 2 by dry measurement using a laser diffraction particle size distribution measuring device. 4B is a graph showing the volume-based particle size distribution of the silver powder obtained in Example 2 by wet measurement with a laser diffraction scattering particle size distribution analyzer. 4C is an SEM image of 10,000 times the silver powder obtained in Example 2. 5A is a graph showing the particle size distribution on a volume basis of the silver powder obtained in Comparative Example 1 by dry measurement with a laser diffraction particle size distribution analyzer. 5B is a graph showing the volume-based particle size distribution of the silver powder obtained in Comparative Example 1 by wet measurement with a laser diffraction scattering particle size distribution analyzer. FIG. 5C is an SEM image of the silver powder obtained in Comparative Example 1 at a magnification of 10,000 times. 6A is a graph showing the particle size distribution on a volume basis of the silver powder obtained in Comparative Example 3 by dry measurement using a laser diffraction particle size distribution analyzer. 6B is a graph showing the particle size distribution on a volume basis of the silver powder obtained in Comparative Example 3 by wet measurement with a laser diffraction scattering particle size distribution analyzer. FIG. 6C is an SEM image of 10,000 times the silver powder obtained in Comparative Example 3. FIG. 7 is a scanning electron microscope photograph (SEM image) of a cross-section of the conductive film after firing the conductive paste obtained in Example 1. FIG. FIG. 8 is an SEM image of a cross-section of the conductive film after firing the conductive paste obtained in Example 2. FIG. 9 is an SEM image of a cross-section of the conductive film after firing the conductive paste obtained in Comparative Example 1. FIG. 10 is an SEM image of a cross-section of the conductive film after firing the conductive paste obtained in Comparative Example 2. FIG.

Claims (10)

一種銀粉之製造方法,特徵在於:藉由混合第1銀粉與第2銀粉來製造銀粉,該第1銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個以上者;該第2銀粉係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為2個以上者;混合第1銀粉與第2銀粉所製造之銀粉,係在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個者。A method for producing silver powder, characterized in that: producing silver powder by mixing a first silver powder and a second silver powder, the first silver powder being in the volume-based particle size distribution obtained by dry measurement using a laser diffraction particle size distribution measuring device , the frequency becomes the maximum peak is 1 or more; the second silver powder is the particle size distribution based on the volume obtained by dry measurement using a laser diffraction particle size distribution measuring device, and the frequency becomes the maximum peak is 2 or more. ; The silver powder produced by mixing the first silver powder and the second silver powder is in the particle size distribution on the volume basis obtained by dry measurement using a laser diffraction particle size distribution measuring device, and there are three or more peaks whose frequency becomes the maximum, and in In the particle size distribution on a volume basis obtained by wet measurement with a laser diffraction scattering particle size distribution analyzer, one peak whose frequency becomes the maximum is one. 如請求項1之銀粉之製造方法,其中前述第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )大於前述第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )。The method for producing silver powder according to claim 1, wherein the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is larger than that of the second silver powder obtained by wet measurement. Cumulative 50% particle size (D 50 ) in the particle size distribution on a volume basis. 如請求項1之銀粉之製造方法,其中前述第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )為0.3~1µm。The method for producing silver powder according to claim 1, wherein the cumulative 50% particle size (D 50 ) of the second silver powder in the volume-based particle size distribution obtained by wet measurement is 0.3 to 1 µm. 如請求項1之銀粉之製造方法,其中前述第1銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )為1~4μm,且為前述第2銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50 )的4倍以下。The method for producing silver powder according to claim 1, wherein the cumulative 50% particle size (D 50 ) of the first silver powder in the volume-based particle size distribution obtained by wet measurement is 1 to 4 μm, and the second silver powder is in the range of 1 to 4 μm. Four times or less of the cumulative 50% particle diameter (D 50 ) in the volume-based particle size distribution obtained by wet measurement. 如請求項1之銀粉之製造方法,其中前述利用雷射繞射散射式粒度分布測定裝置進行之濕式測定係使前述銀粉分散於異丙醇中來進行。The method for producing silver powder according to claim 1, wherein the wet measurement using a laser diffraction scattering particle size distribution measuring device is performed by dispersing the silver powder in isopropyl alcohol. 一種銀粉,特徵在於:其在利用雷射繞射式粒度分布測定裝置以乾式測定所得之體積基準的粒度分布中,頻率成為極大之波峰有3個以上,且在利用雷射繞射散射式粒度分布測定裝置以濕式測定所得之體積基準的粒度分布中,頻率成為極大之波峰為1個。A silver powder, characterized in that: in the particle size distribution on the volume basis obtained by dry measurement by using a laser diffraction particle size distribution measuring device, there are more than 3 peaks whose frequency becomes the maximum, and when using a laser diffraction scattering particle size distribution In the volume-based particle size distribution obtained by the wet measurement of the distribution measuring apparatus, there is one peak whose frequency becomes the maximum. 如請求項6之銀粉,其中前述銀粉在以濕式測定所得之體積基準的粒度分布中之累積50%粒徑(D50)為1.2~3.0μm。The silver powder of claim 6, wherein the cumulative 50% particle size (D50) of the aforementioned silver powder in the volume-based particle size distribution obtained by wet measurement is 1.2-3.0 μm. 如請求項6之銀粉,其中前述銀粉之累積90%粒徑(D90 )相對於累積10%粒徑(D10 )之比為2.0~8.0。The silver powder of claim 6, wherein the ratio of the cumulative 90% particle size (D 90 ) to the cumulative 10% particle size (D 10 ) of the aforementioned silver powder is 2.0 to 8.0. 如請求項6之銀粉,其中前述利用雷射繞射散射式粒度分布測定裝置進行之濕式測定係使前述銀粉分散於異丙醇中來進行。The silver powder according to claim 6, wherein the wet measurement using a laser diffraction scattering particle size distribution analyzer is performed by dispersing the silver powder in isopropyl alcohol. 一種導電性糊,特徵在於:其係於有機成分中分散有如請求項6之銀粉者。A conductive paste characterized in that the silver powder according to claim 6 is dispersed in an organic component.
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