TWI775257B - Circuit board dividing and cutting method and equipment - Google Patents
Circuit board dividing and cutting method and equipment Download PDFInfo
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- TWI775257B TWI775257B TW109146508A TW109146508A TWI775257B TW I775257 B TWI775257 B TW I775257B TW 109146508 A TW109146508 A TW 109146508A TW 109146508 A TW109146508 A TW 109146508A TW I775257 B TWI775257 B TW I775257B
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Abstract
本發明「電路板分割裁切方法與設備」,其針對電路板製程中,就單組銅箔中多片基板進行分割裁切時所提出之改善方案。特別是在裁切時至少令電路板一端進行拉緊攤平之動作,藉此,能使該基板間原本呈皺摺狀的銅箔完全平整,確保裁切正確且裁切線平整,避免以往裁切失誤或裁切線彎曲凌亂拉扯等現像。 The present invention, "the method and equipment for dividing and cutting circuit boards", is aimed at the improvement scheme proposed when dividing and cutting multiple substrates in a single group of copper foils in the circuit board manufacturing process. In particular, at least one end of the circuit board is stretched and flattened during cutting, so that the original wrinkled copper foil between the substrates can be completely flattened, ensuring correct cutting and smooth cutting lines, avoiding previous cutting Miscuts or the cutting line is bent and pulled in a mess.
Description
本發明「電路板分割裁切方法與設備」,涉及一種電路板分割裁切技術,尤指一種能避免於裁切時銅箔皺摺之技術領域。 The invention "a method and apparatus for dividing and cutting a circuit board" relates to a technology for dividing and cutting a circuit board, especially to a technical field that can avoid the copper foil wrinkling during cutting.
電路板製程中,於多片基板壓合後,普遍會在上下對應的兩片銅箔間,相鄰適當間隔配置至少兩塊基板,形成該電路板半成品的前半段與後半段間僅靠銅箔連接;而後續製程需就該兩塊基板間所連接的銅箔處進行分割裁切。習知技術於該分割裁切時往往會有銅箔發生重疊或皺摺現像,導致分割裁切時銅箔容易產生拉扯或切面歪斜、扭曲等不平整或失誤狀況,相當困擾,也容易提高不良率。 In the circuit board manufacturing process, after a plurality of substrates are pressed together, at least two substrates are generally arranged between the two corresponding upper and lower copper foils, adjacent to an appropriate interval, forming the first half and the second half of the semi-finished circuit board only rely on copper foil. Foil connection; and the subsequent process needs to divide and cut the copper foil connected between the two substrates. In the conventional technology, the copper foil is often overlapped or wrinkled during the splitting and cutting, which causes the copper foil to be easily pulled or the cut surface is skewed, twisted and other unevenness or errors during the splitting and cutting. Rate.
發明人有鑑於此,特以研創成本案,期能藉本案之提出,俾改進現有電路板分割裁切之缺點,期使電路板分割裁切之效果得以更臻完善且理想,符合實際需求。 In view of this, the inventor has developed this case, hoping to improve the shortcomings of the existing circuit board cutting and cutting, and hope that the effect of circuit board cutting and cutting can be more perfect and ideal, and meet the actual needs.
為改善前述習知電路板於進行分割裁切時銅箔因不平整衍生的各項缺失,本發明其主要目的在於:於裁切時令電路板一端進行拉移之動作;藉此,能使該基板間原本呈皺摺或波浪狀的銅箔處完全平整,確保分割裁切正確且裁切線平整,避免以往裁切失誤或裁切線彎曲、凌亂、拉扯等現像,進而提升分割品質,降低不良率。 In order to improve the defects of the copper foil caused by unevenness of the copper foil when the circuit board is divided and cut, the main purpose of the present invention is to make one end of the circuit board pull and move during cutting; The original wrinkled or wavy copper foil between the substrates is completely flat, ensuring correct cutting and cutting lines, avoiding previous cutting mistakes or cutting lines bending, messy, pulling and other phenomena, thereby improving the quality of cutting and reducing defects Rate.
為達成上述目的,本案具體之手段為:該電路板分割裁切方法,主要是依序進行下述步驟:電路板入料、進行靶位偵測、調整電路板位置、拉移電路板一端、壓制後段電路板、進行分割裁切、電路板依序出料。 In order to achieve the above purpose, the specific means in this case are as follows: the method of dividing and cutting the circuit board mainly includes the following steps in sequence: feeding the circuit board, detecting the target position, adjusting the position of the circuit board, pulling and moving one end of the circuit board, The back-end circuit boards are pressed, segmented and cut, and the circuit boards are discharged in sequence.
較佳的,前述該進行靶位偵測步驟,係就電路板中已預設的靶位記號,以X光設備進行位置讀取;此為習知技術。 Preferably, the aforesaid step of performing target position detection is to read the position of the target position preset on the circuit board with X-ray equipment; this is a conventional technique.
較佳的,前述該調整電路板位置步驟,係利用一移載單元吸附於電路板之前段,就電路板進行位置校準。 Preferably, in the aforementioned step of adjusting the position of the circuit board, a transfer unit is used to adsorb the front section of the circuit board to perform position calibration on the circuit board.
較佳的,前述該拉移電路板一端步驟,係利用吸附於電路板前段之移載單元,將該電路板的前段向外拉移適當距離。 Preferably, in the aforementioned step of pulling and moving one end of the circuit board, a transfer unit that is adsorbed on the front section of the circuit board is used to pull the front section of the circuit board outward by an appropriate distance.
較佳的,前述該壓制後段電路板步驟,係利用一升降式壓制元件,以令電路板之後段被固定位置。 Preferably, in the aforementioned step of pressing the back-end circuit board, a lift-type pressing element is used to fix the position of the back-end circuit board.
較佳的,前述該進行分割裁切步驟,係利用一位於預設裁切線處之裁切單元進行裁切。 Preferably, in the aforementioned step of dividing and cutting, a cutting unit located at a preset cutting line is used for cutting.
較佳的,前述該拉移電路板一端與進行分割裁切兩步驟間,更可依需要增設有:降低後段電路板位置之流程。 Preferably, between the aforementioned two steps of pulling one end of the circuit board and dividing and cutting, a process of lowering the position of the rear circuit board can be added as required.
較佳的,前述該降低後段電路板位置之步驟,係就後段電路板位置適當降低,藉以繃緊位於切割線處之銅箔。 Preferably, the aforementioned step of lowering the position of the rear circuit board is to appropriately lower the position of the rear circuit board, so as to tighten the copper foil at the cutting line.
至於本案電路板分割裁切設備,包括:一入料單元、一裁切單元、一偵測單元、一移載單元與一出料單元。 As for the circuit board dividing and cutting equipment in this case, it includes: a feeding unit, a cutting unit, a detecting unit, a transferring unit and a discharging unit.
較佳的其中一種實施例,該入料單元,為一輸送用平台,包括有一個或一個以上的前輸送帶,該前輸送帶靠近末端處上方,懸設有一橫桿,該橫桿處設置有一個或一個以上的壓制元件,該壓制元件得為具伸縮功能之氣壓缸或油壓缸或等效構件;該前輸送帶底部,固設有一板體,該板體上配置有一個或一個以上的動力缸,該動力缸具伸縮作用,該動力缸末端連結到該前輸送帶後端底部,致使該動力缸內縮時該前輸送帶後端能降低高度;反之,該動力缸外伸時該前輸送帶後端能上升回復到原本高度。 In one of the preferred embodiments, the feeding unit is a platform for conveying, including one or more front conveyor belts, the front conveyor belt is close to the top of the end, and a horizontal bar is suspended, and the horizontal bar is set. There are one or more pressing elements, which may be pneumatic cylinders or hydraulic cylinders with telescopic function or equivalent components; a plate body is fixed on the bottom of the front conveyor belt, and one or one plate is arranged on the plate body. In the above power cylinder, the power cylinder has a telescopic function, and the end of the power cylinder is connected to the bottom of the rear end of the front conveyor belt, so that the rear end of the front conveyor belt can be lowered in height when the power cylinder is retracted; At the same time, the rear end of the front conveyor belt can rise back to its original height.
較佳的其中一種實施例,該裁切單元,續接於該入料單元後端;該裁切單元底部包括有一平台,該平台 頂部懸設有一裁刀,該裁刀底部呈傾斜狀;又該裁刀一旁緣排列設置有複數個壓合元件,該些壓合元件略具彈性,且其底面以超越該裁刀底面為佳;該裁切單元頂部設置有一傳動元件組,該傳動元件組作動時能連動該裁刀上下移動。 In a preferred embodiment, the cutting unit is connected to the rear end of the feeding unit; the bottom of the cutting unit includes a platform, the platform A cutting knife is suspended from the top, and the bottom of the cutting knife is inclined; and a plurality of pressing elements are arranged on a side of the cutting knife. ; A transmission element group is arranged on the top of the cutting unit, and the transmission element group can move the cutting knife up and down in conjunction with it when it is actuated.
較佳的其中一種實施例,該偵測單元,續接於該裁切單元後端;該偵測單元包括有兩光學式偵照元件,具體為X光偵照元件;該X光偵照元件能用以偵照電路板中原先預設之靶位,以便得知電路板之位置,俾利後續進行位置調整。 In a preferred embodiment, the detection unit is connected to the rear end of the cutting unit; the detection unit includes two optical detection elements, specifically X-ray detection elements; the X-ray detection elements It can be used to detect the original preset target position in the circuit board, so as to know the position of the circuit board, so as to facilitate the subsequent position adjustment.
較佳的其中一種實施例,該移載單元,設於該偵測單元後端;該移載單元包括有一動力元件,該動力元件能用以連動一螺桿,該螺桿兩旁對應設置有滑軌;該螺桿一端連設有一平台組,該平台組上設置有複數吸盤,且該平台組下方設置有調整機構。 In one of the preferred embodiments, the transfer unit is located at the rear end of the detection unit; the transfer unit includes a power element, and the power element can be used to link a screw, and slide rails are correspondingly provided on both sides of the screw; One end of the screw rod is connected with a platform group, a plurality of suction cups are arranged on the platform group, and an adjustment mechanism is arranged below the platform group.
較佳的其中一種實施例,該出料單元,包括有兩後輸送帶,該兩後輸送帶分別設置於該移載單元兩旁。 In a preferred embodiment, the discharging unit includes two rear conveyor belts, and the two rear conveyor belts are respectively arranged on both sides of the transfer unit.
1:入料單元 1: Feeding unit
10:前輸送帶 10: Front conveyor belt
11:橫桿 11: Crossbar
12:壓制元件 12: Press components
13:板體 13: Board body
14:動力缸 14: Power cylinder
2:裁切單元 2: cutting unit
21:平台 21: Platform
22:裁刀 22: Cutter
23:壓合元件 23: Press-fit components
24:傳動元件組 24: Transmission element group
3:偵測單元 3: Detection unit
31:X光偵照元件 31: X-ray detection element
4:移載單元 4: Transfer unit
41:動力元件 41: Power components
42:螺桿 42: Screw
43:滑軌 43: Slide rail
44:平台組 44: Platform Group
441:吸盤 441: Sucker
45:調整機構 45: Adjustment mechanism
5:出料單元 5: discharge unit
51:後輸送帶 51: Rear conveyor belt
9:電路板 9: circuit board
90:靶位 90: Target
91:銅箔 91: copper foil
92:板片 92: Plate
第一圖:係為本發明之立體外觀圖; Figure 1: It is a three-dimensional appearance view of the present invention;
第二圖:係為本發明入料單元之立體外觀圖; The second figure: is the three-dimensional appearance view of the feeding unit of the present invention;
第三圖:係為本發明裁切單元之立體外觀圖; Figure 3: It is a three-dimensional appearance view of the cutting unit of the present invention;
第四圖:係為本發明偵測單元立體外觀圖; Figure 4: It is a three-dimensional appearance view of the detection unit of the present invention;
第五圖:係為本發明移載單元與出料單元之立體外觀圖; Figure 5: It is a three-dimensional appearance view of the transfer unit and the discharge unit of the present invention;
第六圖:係為本發明入料時之示意圖; The sixth figure: is the schematic diagram of the present invention when feeding;
第七圖:係為本發明進行電路板靶位偵測之示意圖; Figure 7: It is a schematic diagram of the present invention for detecting the target position of the circuit board;
第八圖:係為本發明移載單元吸取電路板之示意圖; Figure 8: It is a schematic diagram of the transfer unit of the present invention sucking the circuit board;
第九圖:係為本發明進行電路板位置調整之示意圖; Figure 9: It is a schematic diagram of the present invention for adjusting the position of the circuit board;
第十圖:係為本發明進行拉移電路板之示意圖; Figure 10: It is a schematic diagram of the present invention for pulling and moving the circuit board;
第十一圖:係為本發明入料單元夾壓電路板並降低高度之示意圖; Figure 11: It is a schematic diagram of the feeding unit of the present invention clamping the circuit board and reducing the height;
第十二圖:係為本發明裁切單元就電路板進行裁切之示意圖; The twelfth figure: it is a schematic diagram of the cutting unit of the present invention cutting the circuit board;
第十三圖:係為本發明入料單元上升復位且向外輸送前端電路板之示意圖。 Figure 13: It is a schematic diagram of the feeding unit ascending and resetting and conveying the front-end circuit board outwards according to the present invention.
茲謹就本發明電路板分割裁切方法與設備其結構組成,及所能產生的功效,配合圖式,舉一本案之較佳實施例詳細說明如下。 Hereby, with regard to the structure and composition of the circuit board dividing and cutting method and equipment of the present invention, as well as the effects that can be produced, a preferred embodiment of the case is described in detail as follows.
本案電路板分割裁切方法,主要是依序進行下述步驟:電路板入料、進行靶位偵測、調整電路板位置、拉移電路板一端、壓制後段電路板、進行分割裁切、電路板依序出料。 The circuit board segmentation and cutting method in this case mainly involves the following steps in sequence: circuit board feeding, target position detection, circuit board position adjustment, pulling and moving one end of the circuit board, pressing the back-end circuit board, dividing and cutting, circuit The plates are discharged in sequence.
前述該進行靶位偵測步驟,係就電路板中已預 設的靶位記號,以X光設備進行位置讀取;此為習知技術。前述該調整電路板位置步驟,係利用一移載單元吸附於電路板之前段,就電路板進行位置校準。前述該拉移電路板一端步驟,係利用吸附於電路板前段之移載單元,將該電路板的前段向外拉移適當距離。前述該壓制後段電路板步驟,係利用一升降式壓制元件,以令電路板之後段被固定位置。前述該進行分割裁切步驟,係利用一位於預設裁切線處之裁切單元進行裁切。前述該拉移電路板一端與進行分割裁切兩步驟間,更可依需要增設有:降低後段電路板位置之流程。前述該降低後段電路板位置之步驟,係就後段電路板位置適當降低,藉以繃緊位於切割線處之銅箔。 The aforementioned step of performing target detection is based on the fact that the circuit board has been pre- The set target mark is read by X-ray equipment; this is a conventional technology. In the aforementioned step of adjusting the position of the circuit board, a transfer unit is used to adsorb on the front section of the circuit board, and the position of the circuit board is calibrated. In the aforementioned step of pulling and moving one end of the circuit board, a transfer unit that is adsorbed on the front section of the circuit board is used to pull the front section of the circuit board outward by an appropriate distance. In the aforementioned step of pressing the back-end circuit board, a lift-type pressing element is used to fix the position of the back-end circuit board. In the aforementioned step of dividing and cutting, a cutting unit located at a preset cutting line is used for cutting. Between the aforementioned two steps of pulling one end of the circuit board and dividing and cutting, a process of lowering the position of the rear circuit board can be added as required. The aforementioned step of lowering the position of the back-end circuit board is to appropriately lower the position of the back-end circuit board, so as to tighten the copper foil at the cutting line.
請參閱第一圖所示,本案電路板分割裁切設備,包括:一入料單元1、一裁切單元2、一偵測單元3、一移載單元4與一出料單元5。
Please refer to the first figure, the circuit board dividing and cutting equipment in this case includes: a feeding
其中該入料單元1(請配合第二圖),為一輸送用平台,包括有一個或一個以上的前輸送帶10,該前輸送帶10靠近末端處上方,懸設有一橫桿11,該橫桿11處設置有一個或一個以上的壓制元件12,該壓制元件12得為具伸縮功能之氣壓缸或油壓缸或等效構件;該前輸送帶10底部,固設有一板體13,該板體13上配置有一個或一個以上的動力缸14,該動力缸14具伸縮作用,該動力缸14末端連結到該前輸送帶10末端底部,致使該動力缸14內縮時該前輸送
帶10後端能降低高度;反之,該動力缸14外伸時該前輸送帶10後端能上升回復到原本高度。
The feeding unit 1 (please refer to the second picture) is a conveying platform, including one or more
該裁切單元2(請配合第三圖),續接於該入料單元1後端;該裁切單元2底部包括有一平台21,該平台21頂部懸設有一裁刀22,該裁刀22底部呈傾斜狀;又該裁刀22一旁緣排列設置有複數個壓合元件23,該些壓合元件23略具彈性,且其底面以向下超越該裁刀22底面為佳;該裁切單元2頂部設置有一傳動元件組24,該傳動元件組24作動時能連動該裁刀22上下移動。
The cutting unit 2 (please refer to the third picture) is connected to the rear end of the
該偵測單元3(請配合第四圖),續接於該裁切單元2後端;該偵測單元3包括有兩光學式偵照元件,具體為X光偵照元件31;該X光偵照元件31能用以偵照電路板中原先預設之靶位,以便得知電路板之位置,俾利後續進行位置調整。
The detection unit 3 (please refer to the fourth figure) is connected to the rear end of the
該移載單元4(請配合第五圖),設於該偵測單元3後端;該移載單元4包括有一動力元件41,該動力元件41能用以連動一螺桿42,該螺桿42兩旁對應設置有滑軌43;該螺桿42一端連設有一平台組44,該平台組44上設置有複數吸盤441,且該平台組44下方設置有調整機構45。該動力元件41作動能用以藉該螺桿42連動該平台組44位移,而該調整機構45能用以調變該平台組44進行多軸位置調整。
The transfer unit 4 (please refer to the fifth figure) is located at the rear end of the
該出料單元5(請配合第五圖),包括有兩後輸送
帶51,該兩後輸送帶51分別設置於該移載單元4兩旁。
The discharge unit 5 (please match the fifth picture), including two rear conveying
本案實施時,請參閱第六圖。將一電路板9經入料單元1送入,經前輸送帶10向後移送,令該偵測單元3進行靶位90讀取以得知偏移位置(如第七圖,其中該電路板9結構包括有銅箔91夾合內部之板片92);經得知該電路板9位置後,繼續移送該電路板9向後到該移載單元4處,如第八圖,令該移載單元4上升,各吸盤441吸取該電路板9下方,接著藉調整機構45令平台組44調整電路板9位置至正確(第九圖),跟著令移載單元4些微拉移電路板9(第十圖),同時間入料單元1之壓制元件12降低高度以便下壓電路板9之後半段,跟著動力缸14內縮以便令前輸送帶10後端降低高度,藉以繃緊電路板9兩塊板片92間的銅箔91(第十一圖),使銅箔91在其中一端被往前拉、另一端被下移的情況下能完全攤平;而後令傳動元件組24作動進而使裁刀22下移,藉以對電路板9中央之銅箔91處進行裁切(第十二圖),並分離成兩塊面積相對較小的電路板,最後令入料單元1上升復位,向外依序輸送分割後的電路板9即可(第十三圖)。
When this case is implemented, please refer to Figure 6. A
綜上所述,本案「電路板分割裁切方法與設備」,其於電路板分割裁切前,能確實將之攤平拉伸,避免習知裁切處銅箔彎曲皺折現像,有效改善裁切效果與平整度,也能摒除不良問題;本案技術內容完全符合發明專利之取得要件。本案在產業上確實得以利用,於申請前未曾見 於刊物或公開使用,且非為公眾所知悉之技術。再者,本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求,得佐證本新型並非能輕易完成。本案富具專利法規定之「產業利用性」、「新穎性」與「進步性」等要件,爰依法提請專利,懇請 鈞局詳查,並儘早為准予專利之審定,以保護申請人之智慧財產權,俾勵創新。 To sum up, the "circuit board cutting method and equipment" in this case can be flattened and stretched before the circuit board is cut and cut, so as to avoid the bending and wrinkling of the copper foil in the conventional cutting place, and effectively improve the The cutting effect and flatness can also eliminate bad problems; the technical content of this case fully complies with the requirements for obtaining an invention patent. This case is indeed used in the industry, and it has not been seen before the application Technology used in publications or publicly and not known to the public. Furthermore, this case effectively solves the long-standing problems in the prior art and meets the long-term needs of the relevant users and consumers, which proves that the present invention cannot be easily accomplished. This case is full of the requirements of "industrial utilization", "novelty" and "progress" stipulated by the Patent Law. It is required to apply for a patent in accordance with the law. I urge the Bureau to conduct a detailed investigation and approve the patent as soon as possible to protect the wisdom of the applicant. Property rights to encourage innovation.
本發明已藉由上述之實施例及變化例來詳加描述。然而,熟習該項技術者當了解的是,本發明之所有的實施例在此僅為例示性而非為限制性,亦即,在不脫離本發明實質精神及範圍之內,基於上述所述及之其他變化例及修正例均為本發明所涵蓋,本發明係由後附之申請專利範圍所加以界定。 The present invention has been described in detail by the above-mentioned embodiments and modifications. However, it should be understood by those skilled in the art that all embodiments of the present invention herein are merely illustrative and not restrictive, that is, without departing from the spirit and scope of the present invention, based on the above-mentioned And other variations and amendments are covered by the present invention, and the present invention is defined by the appended claims.
1:入料單元 1: Feeding unit
2:裁切單元 2: cutting unit
3:偵測單元 3: Detection unit
4:移載單元 4: Transfer unit
5:出料單元 5: discharge unit
Claims (2)
Priority Applications (1)
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TW109146508A TWI775257B (en) | 2020-12-28 | 2020-12-28 | Circuit board dividing and cutting method and equipment |
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TW109146508A TWI775257B (en) | 2020-12-28 | 2020-12-28 | Circuit board dividing and cutting method and equipment |
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TW202226913A TW202226913A (en) | 2022-07-01 |
TWI775257B true TWI775257B (en) | 2022-08-21 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005153063A (en) * | 2003-11-25 | 2005-06-16 | Toyota Motor Corp | Method and device for cutting sheet material |
TWM534340U (en) * | 2016-05-26 | 2016-12-21 | mao-xiang Wu | Substrate inspection apparatus |
CN107511520A (en) * | 2017-08-25 | 2017-12-26 | 湖州德耀金属制品有限公司 | A kind of metal plate positioning-cutting device |
TWM589952U (en) * | 2019-10-02 | 2020-01-21 | 捷惠自動機械有限公司 | Circuit board mark making equipment |
TW202044942A (en) * | 2019-05-22 | 2020-12-01 | 捷惠自動機械有限公司 | Board splitting method and apparatus for circuit boards in which a multi-circuitry circuit board is subject to cutting and splitting multiple times to obtain individual single-circuitry circuit boards |
-
2020
- 2020-12-28 TW TW109146508A patent/TWI775257B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005153063A (en) * | 2003-11-25 | 2005-06-16 | Toyota Motor Corp | Method and device for cutting sheet material |
TWM534340U (en) * | 2016-05-26 | 2016-12-21 | mao-xiang Wu | Substrate inspection apparatus |
CN107511520A (en) * | 2017-08-25 | 2017-12-26 | 湖州德耀金属制品有限公司 | A kind of metal plate positioning-cutting device |
TW202044942A (en) * | 2019-05-22 | 2020-12-01 | 捷惠自動機械有限公司 | Board splitting method and apparatus for circuit boards in which a multi-circuitry circuit board is subject to cutting and splitting multiple times to obtain individual single-circuitry circuit boards |
TWM589952U (en) * | 2019-10-02 | 2020-01-21 | 捷惠自動機械有限公司 | Circuit board mark making equipment |
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