TWI775070B - Modular plug and cable harness - Google Patents

Abstract

The present invention suppresses crosstalk in modular plugs. The modular plug 2 includes: a plurality of plug contacts 20 respectively capable of contacting a plurality of counterpart contacts of the modular socket; a contact holding part 21 for holding the plurality of plug contacts 20 ; and a relay substrate 5 . The relay substrate 5 has an upper surface 40 and a lower surface 41 opposite to the upper surface 40 . The plurality of header contacts 20 include upper contacts 30 and lower contacts 31 . The upper contact member 30 has an upper connecting portion 35 which is opposite to the upper surface 40 and is used for being electrically connected to the contact electrode pads 42 formed on the upper surface 40 . The lower contact member 31 has a lower connecting portion 38 which is opposite to the lower surface 41 and is used for electrical connection to the contact electrode pads 42 formed on the lower surface 41 .

Description

Modular plugs and cable harnesses

The present invention relates to modular plugs and cable harnesses.

As shown in FIG. 18 of this application, Patent Document 1 (US Patent Application Publication No. 2018/0254586 ) discloses an RJ45 plug assembly 100 . The RJ45 plug assembly 100 includes: a front housing 101 , a front comb 102 , a conductive shell 103 , a PCB assembly 104 , a rear conductive shell 105 , and a bending radius control shield 106 . The PCB assembly 104 includes a PCB 110 , a plurality of header contacts 111 press-fitted and held by the PCB 110 , a front load bar 112 and a rear load bar 113 .

With the increase in communication speed in recent years, the standards required for crosstalk in modular plugs have become stricter.

An object of the present invention is to provide a technology for suppressing crosstalk in a modular plug.

According to the aspect of the present invention, a modular plug is provided, the modular plug is provided with: a plurality of contacts, respectively, which can be in contact with a plurality of object contacts of the modular socket; and a contact holding portion for maintaining the contacts and a substrate; the substrate has: a first contact connection surface; and a second contact connection surface opposite to the first contact connection surface; the contacts include: a first contact with a first connection portion , which is opposite to the connecting surface of the first contact piece, and is used to electrically connect to the first electrode pad formed on the connecting surface of the first contact piece; and the second contact piece has a second connecting portion, which is connected to the second contact piece The connecting surfaces of the contact pieces are opposite to each other, and are used for being electrically connected to the second electrode pads formed on the connecting surfaces of the second contact pieces.

Preferably, the substrate is disposed between the first connection portion and the second connection portion in the thickness direction of the substrate.

Preferably, the first connecting portion is welded to the first electrode pad, the second connecting portion is welded to the second electrode pad, and the contact holding portion does not cover the first connecting portion in the thickness direction of the substrate and the second connection portion.

Preferably, it further includes: a first cover part covering the first connection part in the thickness direction of the substrate; and a second cover part covering the second connection part in the thickness direction of the substrate.

Preferably, an insertion guide is formed on the contact holding portion for guiding the substrate when the substrate is inserted between the first connecting portion of the first contact and the second connecting portion of the second contact. substrate.

Preferably, the insertion guide has: two first opposing portions facing the substrate in the thickness direction of the substrate; and two second opposing portions facing the substrate in the thickness direction of the substrate and the substrate The insertion direction is orthogonal to the substrate.

Preferably, the insertion guide has an opening for inserting the substrate.

A cable harness is provided, the cable harness is provided with the above-mentioned modular plug and a cable on which the modular plug is installed.

According to the present invention, the second connection portion of the second contact is disposed on the opposite side of the first connection portion of the first contact via the substrate, so that the first contact can be prevented from coming into contact with the second contact crosstalk between pieces.

The above-mentioned contents and other objects, features and advantages of the present invention will be understood from the following detailed description and the contents disclosed in the drawings. The drawings are merely illustrative of the embodiments of the present invention and are not intended to limit the contents of the present invention.

Hereinafter, the embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the illustration of the solder itself is omitted for convenience of explanation.

Figure 1 shows a LAN cable 1 (cable harness) with a plug. The LAN cable 1 with a plug of the present embodiment is a type corresponding to PoE, which has power supply performance specified by IEEE802.3bt (type 4), and is more suitable for high-speed communication, and its communication speed is 10 [Gbps].

The LAN cable 1 with plug is composed of a modular plug 2 and a cable 3 . Modular plug 2 conforms to RJ45. As shown in FIG. 2 , the cable 3 is configured by covering four pairs of twisted wires p with a shield 3A and a sheath 3B.

However, the power supply performance and communication speed of the LAN cable 1 with the plug, the connector shape of the modular plug, the number of pairs of twisted pairs p of the cable 3, and the presence or absence of shielding are not limited to the above.

As shown in FIG. 2 , the modular plug 2 includes a plug body 4 , a relay board 5 (substrate), a positioner 6 , an upper cover 7 (first cover), a lower cover 8 (second cover), and a shield 9 and cover 10.

(definition of direction) Here, the "insertion direction", the "up-down direction", and the "width direction" are defined with reference to FIGS. 1 and 2 .

The insertion and extraction direction is defined as the direction in which the modular plug 2 is inserted into and extracted from the modular socket (not shown). The insertion/removal direction includes a fitting direction and a removal direction opposite to the fitting direction. The fitting direction is the direction in which the modular plug 2 is moved toward the modular socket so that the modular plug 2 is fitted into the modular socket.

The up-down direction is a direction orthogonal to the insertion/extraction direction, and is defined as the thickness direction of the relay substrate 5 in FIG. 2 . The up-down direction includes an up direction and a down direction. The upward direction is the direction in which the upper cover 7 is viewed from the relay substrate 5 .

The width direction is a direction orthogonal to the insertion and extraction direction and the vertical direction.

(plug body 4) Hereinafter, the plug body 4 will be described with reference to FIGS. 3 to 8 .

As shown in FIG. 3 , the plug body 4 includes a plurality of plug contacts 20 (contacts) and a contact holding portion 21 that holds the plurality of plug contacts 20 .

As shown in FIGS. 4 and 5 , the contact holding portion 21 is constituted by a holding portion main body 22 , an insertion guide 23 , and two connecting portions 24 .

The holding part main body 22 holds parts of the plurality of plug contacts 20 by press-fitting, and is formed in a substantially rectangular parallelepiped shape, and is formed with a plurality of contact slits 25 for press-fitting the plurality of plug contacts 20 respectively. The plurality of contact slits 25 are formed at predetermined intervals in the width direction, and open in the vertical direction.

The insertion guide 23 is arranged to be separated from the holder main body 22 in the extraction direction when the interposer 5 is inserted into the contact holder 21 and mounted, to guide the inserted portion of the substrate 5 . The insertion guide 23 has a rectangular cylindrical shape opened in the insertion and extraction direction, and is composed of a top plate 23A and a bottom plate 23B facing each other in the vertical direction, and side plates 23C facing each other in the width direction. The top plate 23A is arranged above the bottom plate 23B. Both side plates 23C are connected to the top plate 23A and the bottom plate 23B at positions separated in the width direction. Therefore, the insertion guide 23 has an insertion opening 23D opened in the insertion and extraction direction.

Both of the two connecting portions 24 are portions connecting the holding portion main body 22 and the insertion guide 23 at positions separated in the width direction, and extend from the holding portion main body 22 to the insertion guide 23 in a beam shape along the insertion and extraction direction. The two connection parts 24 are arranged so as to be separated from each other in the width direction, and face each other in the width direction. The two connecting portions 24 respectively connect the two side plates 23C of the insertion guide 23 to the ends of the holder body 22 in the width direction. Therefore, as shown in FIG. 5, the contact holding|maintenance part 21 has the confirmation window 26 opened in an up-down direction.

The plurality of plug contacts 20 shown in FIG. 3 includes upper contacts 30 (first contacts) shown in FIG. 6 and lower contacts 31 (second contacts) shown in FIG. 7 . In this embodiment, the plurality of header contacts 20 includes eight header contacts 20 . The eight header contacts 20 include six upper contacts 30 and two lower contacts 31 . However, the number of the plug contacts 20, or the upper contacts 30 and the lower contacts 31 is not limited to this. The plurality of plug contacts 20 are manufactured by nickel-plating and gold-plating after stamping a metal plate of copper or copper alloy, for example.

As shown in FIG. 6 , each upper contact 30 includes a press-fit portion 32 , an upper protruding portion 33 , and a connecting arm portion 34 .

The press-fitting portion 32 is press-fitted into each contact slit 25 of the holding portion main body 22 of the contact holding portion 21 shown in FIG. 4 .

The upper protruding portion 33 is a portion protruding upward from the press-fit portion 32 .

The connecting arm portion 34 is a cantilever beam extending in the plucking direction from the upper end portion 33A of the upper protruding portion 33 . The connecting arm portion 34 has an upper connecting portion 35 (first connecting portion) as a free end portion on the side in the extraction direction. The upper connection portion 35 is formed so as to bulge slightly downward.

As shown in FIG. 7 , each lower contact piece 31 includes a press-fit portion 36 and a connecting arm portion 37 .

The press-fitting portion 36 is press-fitted into each contact slit 25 of the holding portion main body 22 of the contact holding portion 21 in FIG. 4 .

The connecting arm portion 37 is a cantilever beam extending in the extraction direction from the upper end portion 36A of the press-fit portion 36 . The connecting arm portion 37 has a lower connecting portion 38 (second connecting portion) as a free end portion on the side in the extraction direction.

FIG. 8 shows a state in which the plurality of plug contacts 20 are respectively pressed into the plurality of contact slits 25 of the holder body 22 of the contact holder 21 . A part of the contact holding portion 21 is cut out for convenience of explanation.

Hereinafter, in FIG. 8 , the plurality of header contacts 20 are referred to as header contacts 201 , header contacts 202 , header contacts 203 , header contacts 204 , header contacts 205 , and header contacts in this order in the width direction. 206, header contacts 207, and header contacts 208 for ease of illustration. As is well known, the plug contacts 201 and the plug contacts 202 form a pair and transmit differential signals. Also, the plug contacts 203 and the plug contacts 206 form a pair and transmit differential signals. Also, the plug contacts 204 and the plug contacts 205 form a pair and transmit differential signals. Also, the plug contacts 207 and the plug contacts 208 form a pair and transmit differential signals. Furthermore, although the plug contacts 203 and the plug contacts 206 form a pair for transmitting differential signals, they are not adjacent to each other, and are arranged with the plug contacts 204 and 205 therebetween. Therefore, the plug contacts 203 and the plug contacts 206 are prone to crosstalk with the adjacent differential signal pairs. In detail, the plug contacts 203 are prone to crosstalk with the adjacent plug contacts 201, a pair of the plug contacts 202, and a pair of the plug contacts 204 and 205, respectively, and the plug contacts 206 are prone to follow Crosstalk occurs between the adjacent plug contacts 204 , a pair of plug contacts 205 , and a pair of plug contacts 207 , 208 , respectively. Therefore, it is particularly difficult for the plug contacts 203 and the plug contacts 206 to exert Near End Crosstalk (NEXT) performance. Therefore, in this embodiment, the plug contacts 201, 202, 204, 205, 207 and 208 adopt the upper contacts 30, and the remaining plug contacts The lower contact 31 is used for the plug 203 and the header contact 206 . In other words, the plug contact piece 203 and the plug contact piece 206 use the lower contact piece 31. Although the plug contact piece 203 and the plug contact piece 206 form a pair for transmitting differential signals, they are not adjacent to each other, and the plug contact piece 201, The header contact 202, the header contact 204, the header contact 205, the header contact 207 and the header contact 208 use the upper contact 30, the header contact 201, the header contact 202, the header contact 204, the header The contact piece 205, the header contact piece 207, and the header contact piece 208 form a pair that transmits the remaining differential signals, and are adjacent to each other. Thereby, the upper connecting parts 35 of the plug contacts 201 , the plug contacts 202 , the plug contacts 204 , the plug contacts 205 , the plug contacts 207 , and the plug contacts 208 are connected to the lower parts of the plug contacts 203 and 206 . The parts 38 are arranged apart from each other in the up-down direction. Therefore, compared to the upper connecting portion 35 of the header contact 201 , the header contact 202 , the header contact 204 , the header contact 205 , the header contact 207 , and the header contact 208 , the upper connection portion 35 of the header contact 203 and the header contact 206 When the lower connection parts 38 are adjacent to each other in the width direction, crosstalk between the plug contacts 203 and the plug contacts 206 can be suppressed, and the required NEXT performance can be easily achieved. In addition, contrary to the present embodiment, the following situation may be adopted: the plug contact piece 203 and the plug contact piece 206 adopt the upper contact piece 30, although the plug contact piece 203 and the plug contact piece 206 form a pair for transmitting differential signals, But they are not adjacent to each other, and the plug contact 201, the plug contact 202, the plug contact 204, the plug contact 205, the plug contact 207 and the plug contact 208 use the lower contact 31, the plug contact 201, the plug contact The contact piece 202, the header contact piece 204, the header contact piece 205, the header contact piece 207, and the header contact piece 208 form a pair that transmits the remaining differential signals and abut each other.

In addition, due to the lower connection of the upper connecting portion 35 of the header contact 201 , the header contact 202 , the header contact 204 , the header contact 205 , the header contact 207 and the header contact 208 to the lower connection of the header contact 203 and the header contact 206 The portion 38 is soldered to the relay board 5 and thus protrudes into the confirmation window 26 shown in FIG. 5 in plan view.

(Relay board 5) Next, the relay substrate 5 will be described in detail with reference to FIGS. 9 to 12 .

The relay substrate 5 is disposed between the cable 3 and the plug body 4 and is used for relaying communication and power supply. In this embodiment, in order to improve the NEXT performance and realize the above-mentioned high-speed communication, the relay substrate 5 is a so-called four-layer substrate in which four-layer wiring patterns are formed on both sides and inside of the relay substrate 5 . However, the relay substrate 5 may also be a two-layer substrate with two layers of wiring patterns formed on both sides of the relay substrate 5, or a substrate having four or more layers such as six layers. The relay substrate 5 is usually a glass epoxy substrate.

As shown in FIGS. 9 and 10 , the relay substrate 5 has an upper surface 40 (first contact connection surface) and a lower surface 41 (second contact connection surface).

As shown in FIG. 9 , a plurality of contact electrode pads 42 (first electrode pads) are formed on the upper surface 40 for soldering with the plurality of plug contacts 20 . Specifically, six contact electrode pads 42 are formed as follows: The contact electrode pads 421 soldered to the plug contacts 201, The contact electrode pads 422 soldered to the plug contacts 202, The contact electrode pads 424 soldered to the plug contacts 204, The contact electrode pads 425 soldered to the plug contacts 205, Contact electrode pads 427 soldered to header contacts 207, and Contact electrode pads 428 soldered to header contacts 208 .

As shown in FIG. 10 , a plurality of contact electrode pads 42 are formed on the lower surface 41 for soldering with the plurality of plug contacts 20 . Specifically, two contact electrode pads 42 (second electrode pads) are formed as follows: the contact electrode pads 423 soldered to the header contacts 203, and Contact electrode pads 426 soldered to the header contacts 206 .

Referring to FIG. 9 again, a plurality of cable electrode pads 43 are formed on the upper surface 40 for welding with a plurality of wires of the cable 3 . Specifically, four cable electrode pads 43 as shown below are formed: The cable electrode pads 431 that are in conduction with the contact electrode pads 421, The cable electrode pads 432 that are in conduction with the contact electrode pads 422, the cable electrode pad 434 in conduction with the contact electrode pad 424, and The cable electrode pad 435 in conduction with the contact electrode pad 425.

Referring to FIG. 10 again, a plurality of cable electrode pads 43 are formed on the lower surface 41 for welding with a plurality of wires of the cable 3 . Specifically, four cable electrode pads 43 as shown below are formed: The cable electrode pads 433 that are in conduction with the contact electrode pads 423, The cable electrode pads 436, which are in conduction with the contact electrode pads 426, the cable electrode pad 437 in conduction with the contact electrode pad 427, and Cable electrode pad 438 in conduction with contact electrode pad 428.

As shown in FIG. 11 and FIG. 12 , a compensation capacitor 44 is formed between the contact electrode pad 422 and the contact electrode pad 425 to improve the NEXT performance. Likewise, a compensation capacitor 45 is formed between the contact electrode pad 426 and the contact electrode pad 428 to improve NEXT performance.

(The connection between the plug body 4 and the relay board 5) 13 and 14 show a state in which the relay substrate 5 is mounted on the plug body 4 .

As shown in FIG. 13 , when the relay substrate 5 is mounted on the plug body 4 , the relay substrate 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug body 4 in the fitting direction. Thereby, as shown in FIGS. 13 and 14 , the relay substrate 5 is guided between the plurality of upper connection portions 35 and the plurality of lower connection portions 38 . As a result, the upper connection portion 35 of the header contact 201 is opposed to the contact electrode pad 421 in the up-down direction. In this state, the upper connecting portion 35 of the plug contact 201 is electrically connected to the contact electrode pad 421 by, for example, soldering. The same is true for the other plug contacts 20 .

As shown in FIGS. 13 and 14 , the contact holding portion 21 is configured so as not to cover the upper connection portion 35 and the lower connection portion 38 of each header contact 20 in the up-down direction. That is, in a state where each header contact 20 is mounted on the contact holding portion 21 , the upper connection portion 35 and the lower connection portion 38 of each header contact 20 are exposed in the up-down direction. Therefore, when the upper connection portion 35 and the lower connection portion 38 of each plug contact 20 are soldered to each contact electrode pad 42, it can be confirmed whether the soldering is successful.

(Locator 6) Next, the positioner 6 will be described with reference to FIG. 15 . The positioner 6 is made of polyamide, for example.

As shown in FIGS. 15 and 16 , the retainer 6 has a substantially rectangular parallelepiped shape, and a plurality of through holes 50 are formed to open in the insertion and extraction directions. The plurality of through holes 50 include the following: The through-hole 501 through which the electric wire q connected to the cable electrode pad 431 passes, The through-hole 502 through which the electric wire q connected to the cable electrode pad 432 passes, The through-hole 503 through which the electric wire q connected to the cable electrode pad 433 passes, The through-hole 504 through which the electric wire q connected to the cable electrode pad 434 passes, The through-hole 505 through which the electric wire q connected to the cable electrode pad 435 passes, The through holes 506 through which the wires q connected to the cable electrode pads 436 pass, the through hole 507 through which the wire q connected to the cable electrode pad 437 passes, and The through-hole 508 through which the electric wire q connected to the cable electrode pad 438 passes.

The retainer 6 has a front end surface 51 in the fitting direction and a rear end surface 52 in the extraction direction. A board fitting groove 53 for fitting the relay board 5 is formed on the front end surface 51 . The substrate fitting groove 53 extends in the width direction. The through-hole 501 , the through-hole 502 , the through-hole 504 , and the through-hole 505 are formed above the substrate fitting groove 53 . The through hole 503 , the through hole 506 , the through hole 507 , and the through hole 508 are formed below the substrate fitting groove 53 .

FIG. 16 shows a state in which each wire q of the cable 3 is inserted into each through hole 50 corresponding to the positioner 6 . As shown in FIG. 16 , if each wire q of the cable 3 is inserted into each through hole 50 corresponding to the positioner 6 , preferably, between the positioner 6 and the sheath 3B, a resin R such as polyethylene resin is used. Encapsulates multiple wires q. As a result, the relative positions of the wires q with respect to the insertion/extraction direction of the positioner 6 are fixed, and as shown in FIG. 16 and FIG.

(top cover 7) 2 again, the upper cover 7 is used to cover the plug body 4, the relay substrate 5 and the positioner 6 which are combined with each other from above, and a lance 60 is formed to lock the modular plug 2 and the modular socket. 's chimera. The upper cover 7 is made of polycarbonate, for example.

(lower cover 8) The lower cover 8 is used to cover the plug body 4 , the relay substrate 5 and the positioner 6 which are combined with each other from below. The lower cover 8 is made of polycarbonate, for example.

(shield 9) The shield 9 is used to block the spatial conduction of noise. The shield 9 is made of, for example, a copper alloy.

(hood 10) The cover 10 is used to improve the bending resistance of the cable 3 . The cover 10 is made of, for example, a polyvinyl chloride-based elastomer.

(Manufacturing method of modular plug 2) Next, the manufacturing method of the modular plug 2 is demonstrated.

First, as shown in FIGS. 3 , 4 and 8 , the plurality of plug contacts 20 are respectively press-fitted into the plurality of contact slits 25 of the contact holding portion 21 .

Next, solder paste is supplied to the plurality of contact electrode pads 42 of the relay substrate 5 shown in FIG. 9 . At this stage, the solder paste can be cured by heating and cooling it once.

Next, as shown in FIGS. 13 and 14 , in the fitting direction, the interposer board 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug body 4 . At this time, the internal dimensions of the insertion opening 23D in at least one or both of the vertical direction and the width direction may be designed so that the relay substrate 5 is pressed into the insertion opening 23D. As shown in FIGS. 13 and 14 , the relay substrate 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug body 4 , and the relay substrate 5 is arranged on the upper connecting portions of the plurality of plug contacts 20 . 35 and the lower connecting portions 38 of the plurality of plug contacts 20 . In this state, the plug body 4 and the relay substrate 5 are placed in the reflow oven, and the upper connecting parts 35 and the lower connecting parts 38 of the plurality of plug contacts 20 are soldered to the plurality of contact electrode pads 42 . At this time, as described above, the contact holding portion 21 does not cover the upper connecting portions 35 and the lower connecting portions 38 of the plurality of header contacts 20 and the plurality of contact electrode pads 42 in the vertical direction, so that it can be easily confirmed whether the above-mentioned soldering is successful or not. .

Next, as shown in FIGS. 15 and 16 , each wire q of the plurality of twisted pairs p of the cable 3 is inserted into each through hole 50 of the positioner 6 , and between the positioner 6 and the sheath 3B of the cable 3 , The plurality of twisted pairs p are encapsulated with resin R. Thereby, each electric wire q is fixed in the insertion and extraction direction.

Next, preliminary soldering is performed on each of the cable electrode pads 43 of the relay substrate 5 and each of the wires q of the cable 3 . After that, as shown in FIG. 17 , the relay substrate 5 is fitted into the substrate fitting groove 53 of the positioner 6 . In this state, the respective wires q of the cable 3 are welded to the respective cable electrode pads 43 of the relay substrate 5 by pulse heating or high-frequency welding.

In this way, since the wires q of the cable 3 are welded to the relay substrate 5 and the plug contacts 20 are welded to the relay substrate 5, the wires q are connected to the plug contacts 20 by pressure welding compared to the conventional method. In this case, stable electrical connection can be achieved, and large power can be supplied stably.

Next, referring to FIG. 2 again, the upper cover 7 and the lower cover 8 are fitted to each other in such a way that the plug body 4 , the relay board 5 and the positioner 6 which are combined with each other are sandwiched in the up-down direction.

Next, the outer sides of the upper cover 7 and the lower cover 8 are covered with the shield 9 . Finally, the cover 10 is formed by mold forming. In addition, the following simple holding structure may be adopted. Instead of forming the cover 10 by mold molding, the cover 10 is prefabricated as a separate component, the shield 9 and the cable 3 are riveted to fix the modular plug 2 to the cable 3, and the cover 10 is fixed. For example, it is locked to a protrusion or the like provided on the upper cover 7 .

The preferred embodiments of the present invention have been described above, and the above-mentioned embodiments have the following features.

As shown in FIGS. 1 to 4 , the modular plug 2 includes a plurality of plug contacts 20 (contacts), a contact holding portion 21 and a relay substrate 5 (substrate), and the plurality of plug contacts 20 can be respectively The contact holding portion 21 is used for holding the plurality of plug contacts 20 in contact with a plurality of object contacts of the modular socket (not shown). As shown in FIGS. 9 and 10 , the relay substrate 5 has an upper surface 40 (first contact connection surface) and a lower surface 41 (second contact connection surface) facing the upper surface 40 . As shown in FIG. 8 , the plurality of header contacts 20 include upper contacts 30 (first contacts) and lower contacts 31 (second contacts). As shown in FIG. 8 and FIG. 13 , the upper contact member 30 has an upper connection portion 35 (first connection portion), which is opposite to the upper surface 40 and is used for electrical connection to the contact electrode pads 42 (the first connection portion) formed on the upper surface 40 . 1 electrode pad). As shown in FIGS. 8 and 14 , the lower contact member 31 has a lower connection portion 38 (second connection portion), which is opposite to the lower surface 41 and is used for electrical connection to the contact electrode pads 42 (second connection portion) formed on the lower surface 41 . electrode pads). According to the above structure, as shown in FIGS. 13 and 14 , the lower connection portion 38 of the lower contact 31 is disposed on the opposite side of the upper connection portion 35 of the upper contact 30 with the relay substrate 5 interposed therebetween, so that the upper contact 30 can be suppressed. Crosstalk with the lower contact piece 31 can further suppress the crosstalk in the modular plug 2 .

Further, as shown in FIGS. 13 and 14 , the relay substrate 5 is disposed between the upper connection portion 35 and the lower connection portion 38 in the up-down direction (the plate thickness direction of the relay substrate 5 ).

Further, as shown in FIGS. 13 and 14 , the upper connection portion 35 is soldered to the contact electrode pad 421 (first electrode pad) as the contact electrode pad 42 , and the lower connection portion 38 is soldered to the contact electrode pad 423 as the contact electrode pad 42 . (2nd electrode pad). The contact holding portion 21 is formed so as not to cover the upper connection portion 35 and the lower connection portion 38 in the thickness direction of the relay substrate 5 . According to the above structure, it can be confirmed whether the welding of the contact electrode pads 42 of the upper connection portion 35 and the lower connection portion 38 is successful.

In addition, as shown in FIG. 2 , the modular plug 2 further includes an upper cover 7 (first cover) covering the upper connecting portion 35 in the thickness direction of the relay substrate 5 , and an upper cover 7 (first cover portion) in the thickness direction of the relay substrate 5 . The lower cover 8 (second cover portion) of the lower connecting portion 38 is covered up. According to the above structure, the upper connecting portion 35 and the lower connecting portion 38 can be effectively protected.

The upper cover 7 and the lower cover 8 close the confirmation window 26 shown in FIG. 5 in the up-down direction.

In addition, as shown in FIGS. 13 and 14 , an insertion guide 23 is formed on the contact holding portion 21 for insertion between the upper connecting portion 35 of the upper contact 30 and the lower connecting portion 38 of the lower contact 31 When relaying the substrate 5, the relay substrate 5 is guided. According to the above structure, the workability of inserting the relay substrate 5 between the upper connection portion 35 of the upper contact 30 and the lower connection portion 38 of the lower contact 31 is good.

Further, as shown in FIG. 4 , the insertion guide 23 has a top plate 23A and a bottom plate 23B (two first opposing portions) opposed to the relay substrate 5 in the up-down direction, and two opposed to the relay substrate 5 in the width direction. 23C of side plates (2nd opposing part). According to the above structure, the insertion of the interposer board 5 can be guided in the vertical direction and the width direction.

Furthermore, as shown in FIG. 4 , the insertion guide 23 has an insertion opening 23D for inserting the relay substrate 5 . According to the above structure, the insertion of the interposer board 5 can be guided in the vertical direction and the width direction.

In addition, as shown in FIG. 4 , the insertion guide 23 is formed in a continuous square cylinder shape, but a discontinuous shape may be used instead: a slit extending in the insertion and extraction direction is provided in the side peripheral surface of the insertion guide 23 either party.

Further, as shown in FIG. 1 , a LAN cable 1 (cable harness) with a plug includes a modular plug 2 and a cable 3 to which the modular plug 2 is attached.

The present disclosure has been disclosed above, and it will be appreciated that the embodiments of the present disclosure can be varied in various ways. Such modifications do not depart from the spirit and scope of the invention, and all such modifications obvious to those skilled in the art are intended to be included within the scope of the appended claims.

1: LAN cable with plug 2: Modular plug 3: Cable 3A: Shield 3B: Sheath 4: Plug body 5: Relay board (substrate) 6: Locator 7: Upper cover (1st cover part) 8: Lower cover (2nd cover part) 9: Shield 10: Cover 20, 201, 202, 203, 204, 205, 206, 207, 208: plug contacts (contacts) 21: Contact holding part 22: Holder body 23: Insert guide 23A: Top Plate (1st Opposite) 23B: Bottom plate (1st opposite part) 23C: Side plate (2nd opposite part) 23D: Insertion opening 24: Links 25: Contact slit 26: Confirmation window 30: Upper contact (1st contact) 31: Lower contact (second contact) 32: Press-in part 33: The upper protrusion 33A, 36A: upper end 34: Connect the wrist 35: Upper connecting part (1st connecting part) 36: Press-in part 37: Connect the wrist 38: Lower connection part (2nd connection part) 40: Upper surface (connecting surface of the first contact piece) 41: Lower surface (connecting surface of the second contact piece) 42, 421, 422, 423, 424, 425, 426, 427, 428: Contact electrode pads 43, 431, 432, 433, 434, 435, 436, 437, 438: Cable electrode pads 44, 45: Compensation capacitor 50, 501, 502, 503, 504, 505, 506, 507, 508: through holes 51: Front face 52: rear face 53: Substrate fitting groove 60: Spear 100: Plug Assembly 101: Shell 102: Front Comb 103: Conductive shell 104: PCB Assembly 105: Rear conductive shell 106: Bend Radius Control Shield 110:PCB 111: plug contacts 112: Front Load Bar 113: Rear Load Bar p: twisted pair q: wire R: resin

Figure 1 shows a perspective view of a LAN cable with a plug. Figure 2 shows an exploded perspective view of a LAN cable with a plug. FIG. 3 is a perspective view of the plug body. FIG. 4 is a perspective view of the contact holding portion. FIG. 5 is a perspective view of the contact holding portion viewed from another angle. Figure 6 shows a perspective view of the upper contact. Figure 7 shows a perspective view of the lower contact. FIG. 8 is a perspective view of a partial cutout of the plug body. FIG. 9 is a perspective view of the relay substrate. FIG. 10 is a perspective view of the relay substrate viewed from another angle. FIG. 11 is a perspective view showing a wiring pattern. FIG. 12 is a plan view showing the wiring pattern of each layer. The perspective view shown in FIG. 13 is the state where the relay board is attached to the plug body. The perspective view shown in FIG. 14 is the state in which the relay board is mounted on the plug body when viewed from another angle. Figure 15 shows a perspective view of the positioner. The perspective view shown in FIG. 16 is the state which encapsulated a part of the cable attached to the positioner with resin. The perspective view shown in FIG. 17 is the state in which the cable is soldered to the relay substrate. As shown in FIG. 18, FIG. 12 of Patent Document 1 is simplified.

4: Plug body

20, 201, 202, 203, 204, 205, 206, 207, 208: plug contacts (contacts)

21: Contact holding part

30: Upper contact (1st contact)

31: Lower contact (second contact)

35: Upper connecting part (1st connecting part)

38: Lower connection part (2nd connection part)

Claims (8)

A modular plug is characterized in that it comprises: a plurality of contact pieces, respectively capable of contacting with a plurality of object contacts of a modular socket; a contact holding part for holding the contact pieces; and a base plate; the base plate, It has: a first contact connection surface; and a second contact connection surface, which is opposite to the first contact connection surface; the contacts are arranged at predetermined intervals in the width direction; the contacts are provided with: a first a contact piece, having a first connection part, which is opposite to the connection surface of the first contact piece, and is used for being electrically connected to a first electrode pad formed on the connection surface of the first contact piece; and a second contact piece, having a second contact piece The connecting part is opposite to the connecting surface of the second contact piece and is used to electrically connect to the second electrode pad formed on the connecting surface of the second contact piece; the first contact piece forms a pair for transmitting differential signals, and adjacent to each other; the second contact pieces form a pair for transmitting differential signals, and are not adjacent to each other. The modular plug according to claim 1, wherein the substrate is disposed between the first connection portion and the second connection portion in a thickness direction of the substrate. The modular plug as claimed in claim 1, wherein the first connecting portion is welded to the first electrode pad, and the second connecting portion is welded to the second electrode pad, The contact holding portion is formed so as not to cover the first connection portion and the second connection portion in the thickness direction of the substrate. The modular plug according to claim 3, further comprising: a first cover part covering the first connection part in the board thickness direction of the substrate; and a second cover part covering the board thickness direction of the board cover the second connection part. The modular plug according to claim 1, wherein an insertion guide is formed in the contact holding portion for connecting the first connection portion of the first contact with the second connection of the second contact When the substrate is inserted between the parts, the substrate is guided. The modular plug according to claim 5, wherein the insertion guide has: two first opposing parts facing the board in the thickness direction of the board; and two second opposing parts The substrate faces the substrate in a direction orthogonal to the thickness direction of the substrate and the insertion direction of the substrate. The modular plug of claim 5, wherein the insertion guide has an opening for inserting the substrate. A cable harness comprising: the modular plug as described in any one of claims 1 to 7; and a cable on which the modular plug is mounted.

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