CN112242637A

CN112242637A - Modular plug and cable harness

Info

Publication number: CN112242637A
Application number: CN202010425986.2A
Authority: CN
Inventors: 田中理司
Original assignee: Japan Aviation Electronics Industry Ltd
Current assignee: Japan Aviation Electronics Industry Ltd
Priority date: 2019-07-17
Filing date: 2020-05-19
Publication date: 2021-01-19
Anticipated expiration: 2040-05-19
Also published as: JP2021018842A; CN112242637B; JP7265438B2; TWI775070B; TW202105854A

Abstract

The invention provides a modular plug (2) which can suppress crosstalk in the modular plug. The modular plug (2) comprises: a plurality of plug contacts (20) which can be brought into contact with a plurality of mating contacts of the modular jack, a contact holding portion (21) for holding the plurality of plug contacts (20), and a relay board (5). The relay substrate (5) has an upper surface (40) and a lower surface (41) opposite to the upper surface (40). The plurality of plug contacts (20) includes an upper contact (30) and a lower contact (31). The upper contact (30) has an upper connection portion (35), and the upper connection portion (35) is opposed to the upper surface (40) and is electrically connected to a contact electrode pad (42) formed on the upper surface (40). The lower contact (31) has a lower connection portion (38), and the lower connection portion (38) is opposite to the lower surface (41) and is electrically connected to a contact electrode pad (42) formed on the lower surface (41).

Description

Modular plug and cable harness

Cross Reference to Related Applications

The priority and interest of the japanese patent application No. 2019-131840, filed on 17.7.2019, the entire contents of which are incorporated by reference in the present application.

Technical Field

The invention relates to a modular plug and a cable harness.

Background

Patent document 1 (U.S. patent application publication No. 2018/0254586 specification), as shown in fig. 18 of the present application, discloses an RJ45 plug assembly 100. RJ45 plug assembly 100 includes front housing 101, front comb 102, conductive shell 103, PCB assembly 104, rear conductive shell 105, and flex diameter inhibitor cap 106. The PCB assembly 104 includes a PCB110, a plurality of plug contacts 111 pressed into and held on the PCB110, a front load bar 112, and a rear load bar 113.

Disclosure of Invention

However, with the recent increase in communication speed, the level of requirements for crosstalk in modular plugs has become more stringent.

An object of the present invention is to provide a technique for suppressing crosstalk in a modular plug.

According to an aspect of the present invention, there is provided a modular plug including a plurality of contacts contactable with a plurality of counterpart contacts of a modular jack, respectively, a contact holding portion for holding the plurality of contacts, and a substrate; the substrate has a first contact connection face and a second contact connection face opposite the first contact connection face; the plurality of contacts includes: a first contact that is opposed to the first contact connection face and has a first connection portion electrically connected to a first electrode pad formed on the first contact connection face; and a second contact that is opposed to the second contact connection surface and has a second connection portion electrically connected to a second electrode pad formed on the second contact connection surface.

Preferably, the substrate is disposed between the first connection portion and the second connection portion in a plate thickness direction of the substrate.

Preferably, the first connection portion is solder-connected to the first electrode pad, the second connection portion is solder-connected to the second electrode pad, and the contact holding portion is formed so as not to cover the first connection portion and the second connection portion in a plate thickness direction of the substrate.

Preferably, the method further comprises the following steps: a first cover portion that covers the first connection portion in a plate thickness direction of the substrate; and a second cover portion that covers the second connection portion in a plate thickness direction of the substrate.

Preferably, an insertion guide for guiding the substrate when the substrate is inserted between the first connection portion of the first contact and the second connection portion of the second contact is formed in the contact holding portion.

Preferably, the insertion guide has two first facing portions facing the substrate in a plate thickness direction of the substrate, and two second facing portions facing the substrate in a direction orthogonal to the plate thickness direction of the substrate and an insertion direction of the substrate.

Preferably, the insertion guide has an opening into which the substrate is inserted.

In addition, a cable harness is provided, which comprises the modular plug and a cable connected with the modular plug.

According to the present invention, since the second connection portion of the second contact is disposed on the opposite side of the first connection portion of the first contact with the substrate interposed therebetween, crosstalk between the first contact and the second contact can be suppressed.

The above and other objects, features and advantages of the present disclosure will be more fully understood from the detailed description given below and the accompanying drawings; the drawings are given by way of illustration only and therefore should not be construed to limit the disclosure.

Drawings

Fig. 1 is a perspective view of a Local Area Network (LAN) cable with a plug.

Fig. 2 is an exploded perspective view of a LAN cable with a plug.

Fig. 3 is a perspective view of the plug main body.

Fig. 4 is a perspective view of the contact holding portion.

Fig. 5 is a perspective view of the contact holding portion when viewed from another angle.

Fig. 6 is a perspective view of the upper contact.

Fig. 7 is a perspective view of the lower contact.

Fig. 8 is a partially cut-away perspective view of the plug main body.

Fig. 9 is a perspective view of the relay substrate.

Fig. 10 is a perspective view of the relay substrate when viewed from another angle.

Fig. 11 is a perspective view of the wiring pattern.

Fig. 12 is a plan view of the wiring pattern of each layer.

Fig. 13 is a perspective view showing a state in which the relay substrate is attached to the plug main body.

Fig. 14 is a perspective view showing a state in which the relay substrate is attached to the plug main body when viewed from another angle.

Fig. 15 is a perspective view of the positioner.

Fig. 16 is a perspective view showing a state in which a part of the cable mounted to the positioner is encapsulated with resin.

Fig. 17 is a perspective view showing a state where a cable is solder-connected to the relay substrate.

Fig. 18 is a simplified diagram of fig. 12 of patent document 1.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In each of the drawings, the solder itself is not depicted for convenience of explanation.

A plugged LAN cable 1 (cable harness) is shown in fig. 1. The LAN cable with plug 1 of the present embodiment is of the active ethernet (PoE) application type, has power supply performance specified by ieee802.3bt (type 4), and is suitable for high-speed communication at a communication speed of 10 Gbps.

The LAN cable with plug 1 is constituted by a modular plug 2 and a cable 3. The modular plug 2 is a plug conforming to the RJ45 standard. As shown in fig. 2, the cable 3 is formed by coating 4 twisted pairs p with a shield layer 3A and an outer coating layer 3B.

However, the power feeding performance and communication speed of the LAN cable with plug 1, the connector shape of the modular plug, the number of pairs p of the cable 3, and the presence or absence of the shield layer are not limited to the above.

As shown in fig. 2, the modular plug 2 includes a plug main body 4, a relay substrate 5 (substrate), a retainer 6, an upper cover 7 (first cover), a lower cover 8 (second cover), a shield 9, and a cover (hood) 10.

(definition of orientation)

Here, referring to fig. 1 and 2, the "inserting and extracting direction", "up and down direction", and "width direction" are defined.

The insertion and extraction direction is defined as a direction in which the modular plug 2 is inserted into and extracted from a modular jack, not shown. The insertion and extraction direction includes a fitting direction and an extraction direction opposite thereto. The fitting direction is a direction in which the module plug 2 is moved toward the module jack in order to fit the module plug 2 into the module jack.

The vertical direction is a direction orthogonal to the insertion and extraction direction, and is defined as a plate thickness direction of the relay substrate 5 in fig. 2. The up-down direction includes an upper direction and a lower direction. The upper side is a direction in which the upper cover 7 is viewed from the relay substrate 5.

The width direction is a direction orthogonal to the inserting/extracting direction and the vertical direction.

(plug main body 4)

The plug main body 4 will be described below with reference to fig. 3 to 8.

As shown in fig. 3, the plug main body 4 includes a plurality of plug contacts 20 (contacts) and a contact holding portion 21 for holding the plurality of plug contacts 20.

As shown in fig. 4 and 5, the contact holding portion 21 is composed of a holding portion body 22, an insertion guide 23, and two coupling portions 24.

The holding portion main body 22 is a portion that holds the plurality of plug contacts 20 by press-fitting, and is formed in a substantially rectangular parallelepiped shape, and is formed with a plurality of contact slits 25 into which the plurality of plug contacts 20 are respectively press-fitted. The plurality of contact slits 25 are formed at a predetermined pitch in the width direction and are opened in the up-down direction.

The insertion guide 23 is a portion that guides insertion of the relay board 5 when the relay board 5 is inserted and mounted in the contact holding portion 21, and is disposed away from the holding portion main body 22 in the extraction direction. The insertion guide 23 is a square tube shape that is open in the insertion and extraction direction, and is composed of a top plate 23A and a bottom plate 23B that are opposed to each other in the up-down direction, and two side plates 23C that are opposed to each other in the width direction. The top plate 23A is disposed above the bottom plate 23B. Both side plates 23C join the top plate 23A and the bottom plate 23B at positions separated in the width direction. Therefore, the insertion guide 23 has an insertion opening 23D that opens in the insertion and extraction direction.

Both the connecting portions 24 are portions that connect the holder main body 22 and the insertion guide 23 at positions separated in the width direction, and extend from the holder main body 22 toward the insertion guide 23 in a beam shape in the insertion and extraction direction. The two coupling portions 24 are arranged apart from each other in the width direction and face each other in the width direction. The two connecting portions 24 connect the two side plates 23C of the insertion guide 23 to the widthwise ends of the holder main body 22, respectively. Therefore, as shown in fig. 5, the contactor holding portion 21 has an inspection window 26 that opens in the vertical direction.

The plurality of header contacts 20 shown in fig. 3 includes an upper contact 30 (first contact) shown in fig. 6, and a lower contact 31 (second contact) shown in fig. 7. In the present embodiment, the plurality of header contacts 20 includes eight header contacts 20. Eight plug contacts 20, including six upper contacts 30 and two lower contacts 31. However, the number of the header contacts 20, the upper contacts 30, and the lower contacts 31 is not limited thereto. The plurality of plug contacts 20 are formed, for example, by blanking a metal plate of copper or a copper alloy and then plating it with nickel and gold.

As shown in fig. 6, each upper contact 30 includes: a press-fitting portion 32, an upper protruding portion 33, and a connecting arm portion 34.

The press-fitting portion 32 is a portion to be press-fitted into each contact portion slit 25 of the holding portion main body 22 of the contact holding portion 21 of fig. 4.

The upper protruding portion 33 protrudes upward from the press-fitting portion 32.

The connecting arm portion 34 is a cantilever beam extending in the pull-out direction from the upper end portion 33A of the upper protruding portion 33. The connecting arm portion 34 has an upper connecting portion 35 (first connecting portion) as a free end portion on the extraction direction side. The upper connecting portion 35 is formed in a slightly downwardly bulging shape.

As shown in fig. 7, each lower contact 31 includes a press-fitting portion 36 and a connecting arm portion 37.

The press-fitting portion 36 is a portion to be press-fitted into each contact portion slit 25 of the holding portion main body 22 of the contact holding portion 21 of fig. 4.

The connecting arm portion 37 is a cantilever beam extending in the pull-out direction from the upper end portion 36A of the press-fitting portion 36. The connecting arm portion 37 has a lower connecting portion 38 (second connecting portion) as a free end portion on the pull-out direction side.

Fig. 8 shows a state in which the plurality of plug contacts 20 are respectively pressed into the plurality of contact slits 25 of the holder main body 22 of the contact holder 21. For convenience of description, a part of the contact holding portion 21 is cut away.

Hereinafter, for convenience of description, in fig. 8, the plurality of header contacts 20 are referred to as a header contact 201, a header contact 202, a header contact 203, a header contact 204, a header contact 205, a header contact 206, a header contact 207, and a header contact 208 in this order in the width direction. As is well known, the

plug contacts

201 and 202 transmit differential signals in pairs. Also, the

plug contacts

203 and 206 transmit differential signals in pairs. Further, the

plug contacts

204 and 205 transmit differential signals in pairs. Also, the

plug contacts

207 and 208 transmit differential signals in pairs. Moreover, the header contact 203 and the header contact 206, although forming a pair for transmitting a differential signal, are not adjacent to each other, and are disposed with the

header contacts

204 and 205 interposed therebetween. Therefore, crosstalk is likely to occur between the

plug contacts

203 and 206 and the adjacent differential signal pairs. Specifically, the header contact 203 is susceptible to crosstalk with the pair of

adjacent header contacts

201, 202 and 204, 205, respectively, and the header contact 206 is susceptible to crosstalk with the pair of

adjacent header contacts

204, 205 and 207, 208, respectively. Thus, the

plug contacts

203 and 206 are particularly difficult to perform with Near End Crosstalk (NEXT). Therefore, in the present embodiment, the upper contacts 30 are used as the

header contacts

201, 202, 204, 205, 207, 208, and the lower contacts 31 are used as the remaining

header contacts

203 and 206. In other words, the

plug contacts

203 and 206 forming pairs that transmit differential signals that are not adjacent to each other use the lower contact 31, while the remaining

plug contacts

201, 202, 204, 205, 207, 208 forming pairs that transmit differential signals that are adjacent to each other use the upper contact 30. Thus, the upper connection portions 35 of the

plug contacts

201, 202, 204, 205, 207, and 208 and the lower connection portions 38 of the

plug contacts

203 and 206 are arranged so as to be separated from each other in the vertical direction. Therefore, as compared with the case where the upper connection portions 35 of the

plug contacts

201, 202, 204, 205, 207, and 208 and the lower connection portions 38 of the

plug contacts

203 and 206 are adjacent in the width direction, crosstalk of the

plug contacts

203 and 206 is suppressed, and desired NEXT performance is easily obtained. In contrast to the present embodiment, the upper contacts 30 may be used for the

plug contacts

203 and 206 that form pairs for transmitting differential signals but are not adjacent to each other, and the lower contacts 31 may be used for the remaining

plug contacts

201, 202, 204, 205, 207, and 208 that form pairs for transmitting differential signals and are adjacent to each other.

In addition, the upper connection portions 35 of the

header contacts

201, 202, 204, 205, 207, 208 and the lower connection portions 38 of the

header contacts

203, 206 protrude into the inspection window 26 shown in fig. 5 in plan view so as to be solder-connected to the relay substrate 5.

(Relay board 5)

Next, the relay substrate 5 will be described in detail with reference to fig. 9 to 12.

The relay board 5 is disposed between the cable 3 and the plug main body 4, and is a board for relaying communication or power supply. In the present embodiment, the relay board 5 is a so-called four-layer board in which four wiring patterns are formed on both surfaces and inside of the relay board 5, so as to improve NEXT performance and realize the high-speed communication. However, the relay substrate 5 may be a two-layer substrate in which two wiring patterns are formed on both surfaces of the relay substrate 5, or may be a substrate having four or more layers, for example, six layers. The relay substrate 5 is typically a glass epoxy substrate.

As shown in fig. 9 and 10, the relay substrate 5 has an upper surface 40 (first contact connection surface) and a lower surface 41 (second contact connection surface).

As shown in fig. 9, a plurality of contact electrode pads 42 (first electrode pads) for solder connection with the plurality of header contacts 20 are formed on the upper surface 40. Specifically, six contact electrode pads 42 shown below are formed.

Contact electrode pad 421 to be soldered to plug contact 201

Contact electrode pad 422 for solder connection with plug contact 202

Contact electrode pad 424 for solder connection with header contact 204

Contact electrode pad 425 to be soldered to plug contact 205

Contact electrode pads 427 to be solder-connected to the header contacts 207

Contact electrode pad 428 that is solder-connected to plug contact 208

As shown in fig. 10, a plurality of contact electrode pads 42 for solder connection with the plurality of header contacts 20 are formed on the lower surface 41. Specifically, two contact electrode pads 42 (second electrode pads) shown below are formed.

Contact electrode pad 423 solder-connected to plug contact 203

Contact electrode pad 426 for solder connection with plug contact 206

Returning to fig. 9, a plurality of cable electrode pads 43 for solder connection with a plurality of wires of the cable 3 are formed on the upper surface 40. Specifically, four cable electrode pads 43 shown below are formed.

Cable electrode pad 431 in conduction with contact electrode pad 421

Cable electrode pad 432 in conduction with contact electrode pad 422

Cable electrode pad 434 in conductive communication with contact electrode pad 424

Cable electrode pad 435 in electrical communication with contact electrode pad 425

As shown in fig. 10, a plurality of cable electrode pads 43 for solder connection with a plurality of wires of the cable 3 are formed on the lower surface 41. Specifically, four cable electrode pads 43 shown below are formed.

Cable electrode pad 433 in conduction with contact electrode pad 423

Cable electrode pad 436 in conductive communication with contact electrode pad 426

Cable electrode pad 437 in electrical communication with contact electrode pad 427

Cable electrode pad 438 in electrical communication with contact electrode pad 428

As shown in fig. 11 and 12, a compensation capacitor 44 for improving NEXT performance is formed between the contact electrode pad 422 and the contact electrode pad 425. Likewise, between the contact electrode pad 426 and the contact electrode pad 428, a compensation capacitor 45 for improving NEXT performance is formed.

(connection between plug main body 4 and relay board 5)

Fig. 13 and 14 show a state in which the relay substrate 5 is mounted on the plug main body 4.

To mount the relay substrate 5 on the plug main body 4, as shown in fig. 13, the relay substrate 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug main body 4 in the fitting direction. Then, as shown in fig. 13 and 14, the relay board 5 is guided between the plurality of upper connection portions 35 and the plurality of lower connection portions 38. As a result, the upper connection portion 35 of the plug contact 201 faces the contact electrode pad 421 in the vertical direction. In this state, the upper connection portion 35 of the plug contact 201 is electrically connected to the contact electrode pad 421 by, for example, soldering connection. The same is true for the other plug contacts 20.

As shown in fig. 13 and 14, the contact holding portion 21 is configured not to cover the upper connection portion 35 and the lower connection portion 38 of each plug contact 20 in the vertical direction. That is, the upper connection portion 35 and the lower connection portion 38 of each plug contact 20 are exposed in the vertical direction in a state where each plug contact 20 is mounted on the contact holding portion 21. Therefore, when the upper connection portion 35 and the lower connection portion 38 of each header contact 20 are solder-connected to each contact electrode pad 42, it is possible to check whether the solder connection is successful.

(retainer 6)

Next, the positioner 6 will be described with reference to fig. 15. The retainer 6 is made of polyamide, for example.

As shown in fig. 15 and 16, the retainer 6 has a substantially rectangular parallelepiped shape, and is formed with a plurality of through holes 50 that open in the insertion and extraction direction. The plurality of through holes 50 include the following.

Through-hole 501 for passing electric wire q connected to cable electrode pad 431

Through-hole 502 through which electric wire q connected to cable electrode pad 432 passes

A through hole 503 through which the electric wire q connected to the cable electrode pad 433 passes

Through-hole 504 through which electric wire q connected to cable electrode pad 434 passes

Through-hole 505 through which electric wire q connected to cable electrode pad 435 passes

Through hole 506 through which electric wire q connected to cable electrode pad 436 passes

Through-hole 507 through which electric wire q connected to cable electrode pad 437 passes

Through-hole 508 for passing through electric wire q connected to cable electrode pad 438

The retainer 6 has a front end surface 51 facing the fitting direction and a rear end surface 52 facing the removal direction. The front end surface 51 is formed with a board fitting groove 53 into which the relay board 5 is fitted. The board fitting groove 53 extends in the width direction. The through hole 501, the through hole 502, the through hole 504, and the through hole 505 are formed above the board fitting groove 53. The through hole 503, the through hole 506, the through hole 507, and the through hole 508 are formed below the board fitting groove 53.

Fig. 16 shows a state in which each electric wire q of the cable 3 is inserted into the corresponding each through hole 50 of the positioner 6. As shown in fig. 16, it is preferable that after each electric wire q of the cable 3 is inserted into the corresponding through hole 50 of the retainer 6, the plurality of electric wires q are sealed with a resin R such as a polyethylene resin between the retainer 6 and the outer covering layer 3B. As a result, since the relative position of each wire q with respect to the positioner 6 in the insertion/extraction direction is fixed, as shown in fig. 16 and 17, the workability of connecting each wire q of the cable 3 to the relay substrate 5 is good.

(Upper cover 7)

Returning to fig. 2, the upper cover 7 covers the plug main body 4, the relay board 5, and the retainer 6, which are coupled to each other, from above, and is formed with a lock lever (place) 60 for locking the module socket of the module plug 2. The upper cover 7 is made of polycarbonate, for example.

(lower cover 8)

The lower cover 8 covers the plug main body 4, the relay board 5, and the retainer 6, which are coupled to each other, from below. The lower cover 8 is made of polycarbonate, for example.

(Shield 9)

The shield 9 serves to block spatial conduction of noise. The shield 9 is formed of, for example, a copper alloy.

(cover 10)

The cover 10 is a member for improving the bending resistance of the cable 3. The cover 10 is made of, for example, a polyvinyl chloride-based elastomer.

(method of manufacturing Modular plug 2)

Next, a method for manufacturing the modular plug 2 will be described.

First, as shown in fig. 3, 4, and 8, the plurality of header contacts 20 are respectively press-fitted into the plurality of contact slits 25 of the contact holding portion 21.

Next, solder paste is supplied to the plurality of contact electrode pads 42 of the relay substrate 5 shown in fig. 9. At this stage, the solder paste may also be solidified by heating and cooling the solder paste at once.

Next, as shown in fig. 13 and 14, the relay substrate 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug main body 4 in the fitting direction. At this time, the inner dimension of the insertion opening 23D in at least either one or both of the vertical direction and the width direction may be designed so that the relay substrate 5 is press-fitted into the insertion opening 23D. When the relay substrate 5 is inserted into the insertion opening 23D of the insertion guide 23 of the contact holding portion 21 of the plug main body 4, as shown in fig. 13 and 14, the relay substrate 5 is arranged between the upper connection portions 35 of the plurality of plug contacts 20 and the lower connection portions 38 of the plurality of plug contacts 20. By placing the header body 4 and the relay substrate 5 in a reflow furnace in this state, the upper connection portions 35 and the lower connection portions 38 of the plurality of header contacts 20 are solder-connected to the plurality of contact electrode pads 42. At this time, as described above, since the contact holding portion 21 does not cover the upper connection portions 35 and the lower connection portions 38 of the plurality of header contacts 20 and the plurality of contact electrode pads 42 in the up-down direction, it is possible to easily check whether the above-described solder connection is successful.

Next, as shown in fig. 15 and 16, the wires q of the twisted pairs p of the cable 3 are inserted into the through holes 50 of the positioner 6, and the twisted pairs p are resin-sealed with a resin R between the positioner 6 and the outer coating layer 3B of the cable 3. Thereby, the wires q are fixed in the inserting and extracting direction.

Next, the cable electrode pads 43 of the relay board 5 and the wires q of the cable 3 are pre-soldered. Thereafter, as shown in fig. 17, the relay substrate 5 is fitted into the substrate fitting groove 53 of the positioner 6. In this state, the wires q of the cable 3 are soldered to the cable electrode pads 43 of the relay substrate 5 by pulse heating or high-frequency soldering, respectively.

In this way, each electric wire q of the cable 3 is solder-connected to the relay substrate 5, and each plug contact 20 is solder-connected to the relay substrate 5, so that stable electrical connection is achieved and larger electric power can be stably supplied, compared to the related art in which each electric wire q is connected to each plug contact 20 by crimping.

Next, returning to fig. 2, the upper cover 7 and the lower cover 8 are fitted to each other so that the plug main body 4, the relay board 5, and the retainer 6, which are coupled to each other, are sandwiched between the upper cover 7 and the lower cover 8 in the vertical direction.

Then, the outer sides of the upper cover 7 and the lower cover 8 are covered with the shield 9. Finally, the cover 10 is formed by molding. The cover 10 may be formed not by molding but in advance as a separate member, and the modular plug 2 may be fixed to the cable 3 by caulking the shield 9 to the cable 3, for example, the cover 10 may be engaged with a projection or the like provided on the upper cover 7, thereby forming a simple holding structure.

The preferred embodiments of the present invention have been described above, and the above embodiments have the following features.

As shown in fig. 1 to 4, the modular plug 2 includes: a plurality of plug contacts 20 (contacts) which can be brought into contact with a plurality of mating contacts of a modular jack (not shown), a contact holding portion 21 for holding the plurality of plug contacts 20, and a relay board 5 (board). As shown in fig. 9 and 10, the relay substrate 5 has an upper surface 40 (first contact connection surface) and a lower surface 41 (second contact connection surface) opposite to the upper surface 40. As shown in fig. 8, the plurality of header contacts 20 includes an upper contact 30 (first contact), and a lower contact 31 (second contact). As shown in fig. 8 and 13, the upper contact 30 has an upper connection portion 35 (first connection portion), and the upper connection portion 35 is opposed to the upper surface 40 and electrically connected to a contact electrode pad 42 (first electrode pad) formed on the upper surface 40. As shown in fig. 8 and 14, the lower contact 31 has a lower connection portion 38 (second connection portion), and the lower connection portion 38 is opposed to the lower surface 41 and is electrically connected to a contact electrode pad 42 (second electrode pad) formed on the lower surface 41. According to the above configuration, as shown in fig. 13 and 14, since the lower connection portion 38 of the lower contact 31 is disposed on the opposite side of the upper connection portion 35 of the upper contact 30 via the relay board 5, crosstalk between the upper contact 30 and the lower contact 31 can be suppressed, and crosstalk in the modular plug 2 can be suppressed.

As shown in fig. 13 and 14, the relay substrate 5 is disposed between the upper connection portion 35 and the lower connection portion 38 in the vertical direction (the thickness direction of the relay substrate 5).

Further, as shown in fig. 13 and 14, the upper connection portion 35 is solder-connected to the contact electrode pad 42, i.e., the contact electrode pad 421 (first electrode pad), and the lower connection portion 38 is solder-connected to the contact electrode pad 42, i.e., the contact electrode pad 423 (second electrode pad). The contact holding portion 21 is formed so as not to cover the upper connection portion 35 and the lower connection portion 38 in the plate thickness direction of the relay substrate 5. According to the above structure, it can be checked whether the upper connection portion 35 and the lower connection portion 38 are successfully solder-connected to the contact electrode pad 42.

As shown in fig. 2, the modular plug 2 further includes: an upper cover 7 (first cover part) that covers the upper connection part 35 in the plate thickness direction of the relay substrate 5; and a lower cover 8 (second cover portion) that covers the lower connection portion 38 in the plate thickness direction of the relay substrate 5. According to the above structure, the upper connection part 35 and the lower connection part 38 can be effectively protected.

The upper cover 7 and the lower cover 8 close the inspection window 26 shown in fig. 5 in the up-down direction.

Further, as shown in fig. 13 and 14, an insertion guide 23 is formed in the contact holding portion 21, and the insertion guide 23 guides the relay substrate 5 when the relay substrate 5 is inserted between the upper connection portion 35 of the upper contact 30 and the lower connection portion 38 of the lower contact 31. According to the above configuration, workability of inserting the relay board 5 between the upper connection portion 35 of the upper contact 30 and the lower connection portion 38 of the lower contact 31 is good.

Further, as shown in fig. 4, the insertion guide 23 has a top plate 23A and a bottom plate 23B (two first facing portions) which face the relay substrate 5 in the up-down direction, and two side plates 23C (second facing portions) which face the relay substrate 5 in the width direction. According to the above configuration, the insertion of the relay board 5 can be guided in the vertical direction and the width direction.

As shown in fig. 4, the insertion guide 23 has an insertion opening 23D into which the relay substrate 5 is inserted. According to the above configuration, the insertion of the relay board 5 can be guided in the vertical direction and the width direction.

As shown in fig. 4, the insertion guide 23 is formed in a square tube shape without a notch, but instead, it may be formed in a shape having a notch that is a slit provided on any one of the side peripheral surfaces of the insertion guide 23 and extending in the insertion and extraction direction.

Further, as shown in fig. 1, the plug-equipped LAN cable 1 (cable harness) includes a modular plug 2, and a cable 3 connected to the modular plug 2.

Thus, it will be apparent from the described disclosure that embodiments of the disclosure may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the disclosure, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Claims

1. A modular plug, comprising:

a plurality of contacts that are respectively contactable with a plurality of counterpart contacts of the modular jack;

a contact holding portion for holding the plurality of contacts; and

a substrate;

the substrate has a first contact connection face and a second contact connection face opposite the first contact connection face;

the plurality of contacts includes:

a first contact that is opposed to the first contact connection face and has a first connection portion electrically connected to a first electrode pad formed on the first contact connection face; and

and a second contact which is opposed to the second contact connection surface and has a second connection portion electrically connected to a second electrode pad formed on the second contact connection surface.

2. A modular plug according to claim 1, wherein the substrate is provided between the first connecting portion and the second connecting portion in a plate thickness direction of the substrate.

3. A modular plug according to claim 1 or 2, wherein the first connection portion is soldered to the first electrode pad,

the second connection part is solder-connected to the second electrode pad,

the contact holding portion is formed so as not to cover the first connection portion and the second connection portion in a plate thickness direction of the substrate.

4. A modular plug in accordance with claim 3, further comprising:

a first cover portion that covers the first connection portion in a plate thickness direction of the substrate; and

and a second cover portion that covers the second connection portion in a plate thickness direction of the substrate.

5. A modular plug according to any of claims 1 to 4, wherein an insertion guide is formed in the contact retaining portion, the insertion guide guiding the substrate when inserted between the first connection portion of the first contact and the second connection portion of the second contact.

6. A modular plug according to claim 5, wherein the insertion guide has two first opposing portions opposing the substrate in a plate thickness direction of the substrate, and two second opposing portions opposing the substrate in a direction orthogonal to the plate thickness direction of the substrate and an insertion direction of the substrate.

7. A modular plug in accordance with claim 5 wherein the insertion guide has an opening into which the substrate is inserted.

8. A cable harness, comprising:

a modular plug according to any one of claims 1 to 7; and

a cable connected to the modular plug.