TWI773402B - Improving pin test coverage rate system for boundary scan test and method thereof - Google Patents

Abstract

An improving pin test coverage rate system for boundary scan test and a method thereof are provided. First test pin board and second test pin board are electrical connection with boundary scan interconnect workstation respectively. Detection signal of tested point is obtained by boundary scan interconnect workstation from first test pin board to decided tested point is conduction or not. Boundary scan interconnect test result of boundary scan component in tested circuit board is obtained by boundary scan interconnect workstation from second test pin board. Test result is integrated and generated according to conduction determination result of detection signal and boundary scan interconnect test result by boundary scan interconnect workstation. Therefore, the improving efficiency of pin test coverage rate for boundary scan test may be achieved.

Description

System and method for improving the coverage rate of pin position test for boundary scan test

A test system and method thereof, in particular to an improved boundary for testing the pins that can perform boundary scan testing and have power supply and the pins that cannot perform boundary scan testing and do not have power supply through different test pin boards. Foot test coverage system and method for scan test.

The existing boundary scan interconnection test workstation is to test the boundary scan components on the circuit board to be tested, and the boundary scan chain established by the boundary scan detection program is used to realize the data analysis and processing in the boundary scan detection program, and finally form the pin Failure criteria for bit interconnect status.

The existing boundary scan interconnection testing workstation can test the interconnection between each connector on the circuit board to be tested and the boundary scan wafer, and can detect structural faults, such as: fault, short circuit, open circuit, etc.

The core technology of the existing boundary scan interconnect test station is to use the boundary scan test technology. However, the boundary scan test technology requires boundary scan wafers at both ends of the line to be tested and the boundary scan wafers have a controllable shift temporary storage. cell, but for the line under test A boundary scan wafer at one end or a boundary scan wafer without a controllable shift register cannot be tested according to the existing boundary scan test technology.

In addition, when testing the circuit board to be tested at the boundary scan interconnection test station, the circuit board to be tested needs to be tested when there is a power supply. Issues with provisioning tests.

To sum up, it can be seen that there has been a problem in the prior art that the boundary scan test of the existing circuit board under test can only measure the detection of each pin of a boundary scan chip with a power supply and a controllable shift register. It is necessary to propose improved technical means to solve this problem.

In view of the problem in the prior art that the boundary scan test of the existing circuit board under test can only measure the detection of each pin of a boundary scan chip with a power supply and a controllable shift register, the present invention discloses a method to improve the boundary scan test. Foot test coverage system and method thereof, wherein: The system for improving the footprint test coverage of the boundary scan test disclosed in the present invention is suitable for the detection of the boundary scan interconnection test station, and includes: a circuit board to be tested, a first test pin board and a second test pin board.

The circuit board to be tested is set with a plurality of test points to be tested by the boundary scan interconnection test station, and the test points to be tested cannot be tested by the boundary scan interconnection test; the first test pin board has a plurality of first test pins, the first test point is The pins are respectively corresponding to the positions of the test points to be detected, and the first test pins are respectively electrically connected with the corresponding test points to be detected by pressing the clamps of the boundary scan interconnection test workstation; and the second test pin board provides the boundary scan interconnection The test station performs boundary scan interconnection tests on the boundary scan components of the circuit board to be tested.

The boundary scan interconnection test station is electrically connected with the first test needle board and the second test needle board respectively, and the boundary scan interconnection test station obtains the detection signal corresponding to the test point to be detected from the first test needle board, and according to The detection signal determines whether it is connected, and the boundary scan interconnection test station obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test pin board. Scan interconnect test results are consolidated and inspection results are generated.

The method disclosed by the present invention for improving the coverage ratio of a boundary scan test pin position comprises the following steps: First, the boundary scan interconnect test station sets a plurality of test points to be tested on the circuit board to be tested, and the test points to be tested cannot be tested through the boundary scan interconnect test; then, a first test with a plurality of first test pins is provided Needle board, the first test needle board has a plurality of first test pins, the first test pins are respectively corresponding to the positions of the test points to be detected; then, the test pin board is connected by the boundary scan to the clamp of the test station and presses together to make the first test pins respectively form an electrical connection with the corresponding test points to be detected; then, the second test pin board provides a boundary scan interconnection test station to perform boundary scan interconnection tests on the boundary scan elements of the circuit board to be detected; then, the boundary scan interconnection test station respectively form an electrical connection with the first test needle board and the second test needle board; then, the boundary scan interconnection test station obtains the detection signal corresponding to the test point to be detected from the first test needle board, and determines whether it is connected according to the detection signal; Next, the boundary scan interconnection test station obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test needle board; finally, the boundary scan interconnection test station compares the conduction determination result of the detection signal with the boundary scan interconnection test result. Integrate test results and generate test results.

The system and method disclosed in the present invention are as described above. The difference between the system and the method disclosed in the present invention is that the boundary scan interconnection test station is electrically connected to the first test pin board and the second test pin board, respectively. Then, the boundary scan interconnection test station obtains the detection signal corresponding to the test point to be detected from the first test needle board, and determines whether it is connected according to the detection signal, and the boundary scan interconnection test station obtains the test signal of the circuit board to be detected through the second test needle board. The boundary scan interconnection test result of the boundary scan element, the boundary scan interconnection test station integrates the conduction determination result of the detection signal and the boundary scan interconnection test result and generates the detection result.

Through the above-mentioned technical means, the present invention can achieve the technical effect of improving the coverage rate of the pin position test of the boundary scan test.

100: Boundary Scan Interconnect Test Station

10: PCB to be tested

11: Measuring point to be detected

12: Boundary Scan Components

13: Boundary scan pin

20: The first test pin board

21: First test pin

30: Second test pin board

31: Second test pin

Step 101: The boundary scan interconnection test workstation sets a plurality of test points to be tested on the circuit board to be tested, and the test points to be tested cannot be detected through the boundary scan interconnection test

Step 102: Provide a first test pin board with a plurality of first test pins, the first test pin board has a plurality of first test pins, and the first test pins correspond to the positions of the test points to be detected respectively

Step 103: The test pin board is pressed together by the clamps of the boundary scan interconnection test workstation so that the first test pins are respectively electrically connected with the corresponding test points to be tested

Step 104: The second test needle board provides a boundary scan interconnection test station to perform boundary scan interconnection test on the boundary scan elements of the circuit board to be tested

Step 105: The boundary scan interconnection test station forms electrical connections with the first test pin board and the second test pin board respectively

Step 106: The boundary scan interconnection test station obtains the detection signal corresponding to the test point to be detected from the first test needle board, and determines whether it is connected according to the detection signal

Step 107: The boundary scan interconnection test workstation obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test needle board

Step 108: The boundary scan interconnection test workstation integrates the conduction determination result of the detection signal with the boundary scan interconnection test result and generates the detection result

FIG. 1 is a system block diagram of the system for improving the coverage of the pin test for boundary scan test according to the present invention.

FIG. 2 is a schematic diagram of the connection structure of the present invention to improve the coverage of the pin test of the boundary scan test.

FIG. 3A and FIG. 3B are method flowcharts of the method for improving the coverage of the pin test of the boundary scan test according to the present invention.

The embodiments of the present invention will be described in detail below with the drawings and examples, so as to fully understand and implement the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects.

In the following, firstly, the system for improving the coverage rate of the boundary scan test disclosed by the present invention will be explained, and please refer to the "Figure 1". System block diagram of the coverage system.

The system for improving the footprint test coverage of the boundary scan test disclosed in the present invention includes: suitable for the detection of the boundary scan interconnect test station 100 , and includes: a circuit board to be tested 10 , a first test pin board 20 and a second test pin board 20 Test pin board 30.

Please refer to "FIG. 2". "FIG. 2" is a schematic diagram of the connection structure of the present invention to improve the coverage of the pin test of the boundary scan test.

The circuit board 10 to be tested is set with a plurality of test points 11 to be tested by the boundary scan interconnection test station 100 , and the boundary scan interconnection test station 100 performs the to-be-tested in the electronic circuits that cannot be tested by the boundary scan interconnection test. The setting of the measuring point 11, the set measuring point 11 to be detected is provided for the purpose of detecting the conduction of the electronic circuit.

The first test pin board 20 has a plurality of first test pins 21 , and the first test pins 21 correspond to the positions of the test points 11 to be tested respectively. The setting positions of the first test pins 21 may be different, may be partially the same and partially different, or may be completely the same.

After the boundary scan interconnection test workstation 100 selects the corresponding first test pin board 20 according to the circuit board 10 to be tested, the boundary scan interconnection test workstation 100 presses the fixture to make the first test pins of the first test pin board 20 21 respectively form electrical connections with the corresponding test points 11 to be tested in the circuit board 10 to be tested.

Since the positions of the boundary scan wafers, connectors, etc. are different for different types of circuit boards 10 to be tested, the boundary scan interconnection test workstation 100 also needs to select the circuit board to be tested. The second test pin board 30 corresponding to the circuit board 10, so that the second test pin board 30 provides the boundary scan interconnection test station 100 to perform the boundary scan interconnection test of the boundary scan elements of the circuit board 10 to be tested, and the boundary scan interconnection test For the test process of the boundary scan interconnection test performed by the workstation 100 through the second test needle board 30 on the boundary scan components of the circuit board 10 to be tested, please refer to the description of the prior art, which will not be repeated in the present invention.

The boundary scan interconnection test station 100 is electrically connected to the first test pin board 20 and the second test pin board 30 respectively. The extended wire forms an electrical connection, or the first test pin 21 of the first test pin board 20 is connected to the connector through the circuit design of the first test pin board 20, and then the boundary scan is performed through the connection between the connecting line and the connector. The interconnection test station 100 is electrically connected to the first test pin board 20 , and the second test needle board 30 is connected to each other through connectors and connecting lines, so that the boundary scan interconnection test station 100 and the second test needle board 30 are electrically connected connect.

When the boundary scan interconnection test workstation 100 forms electrical connections between the first test pins 21 of the first test pin board 20 and the corresponding test points 11 in the circuit board 10 to be tested by pressing the clamps, the boundary scan The interconnected test station 100 can receive the electronic signal of the test point 11 to be tested from the first test pin board 20, and convert the received electronic signal of the test point 11 to be tested into the test signal corresponding to the test point 11 to be tested, so that the boundary The scanning interconnection test station 100 can determine whether the connection is made according to the detection signal corresponding to the test point 11 to be tested obtained from the first test needle board 20 .

It is worth noting that the first test pins 21 of the first test pin board 20 are electrically connected to the corresponding test points 11 in the circuit board 10 to be tested by pressing the clamps in the boundary scan interconnect test station 100 . When connected, the circuit board 10 to be tested does not receive power supply at this time.

Next, the boundary scan interconnect test workstation 100 replaces the first test pin board 20 with the second test pin board 30 , and the second test pins 31 of the second test pin board 30 and the boundary scan pins 13 of the boundary scan element 12 form an electrical circuit. The boundary scan interconnection test station 100 obtains the boundary scan interconnection test result of the boundary scan element 12 of the circuit board 10 to be tested through the second test pin board 30. It is worth noting that the boundary scan interconnection test station 100 passes through When the second test needle board 30 obtains the boundary scan interconnection test result of the boundary scan elements of the circuit board 10 to be tested, the circuit board 10 to be tested is now supplied with power.

Then, the boundary scan interconnection test workstation 100 can integrate the conduction determination result of the detection signal and the boundary scan interconnection test result to generate a detection result.

Next, the operation system and method of the first embodiment of the present invention will be described below with the first embodiment, and please refer to the "1st Figure" and the "2nd Figure" at the same time, and the "2nd Figure" shows It is a method flow chart of the method for improving the coverage rate of the pin position test of the boundary scan test according to the present invention.

First, the boundary scan interconnect test station sets a plurality of test points to be tested on the circuit board to be tested, and the test points to be tested cannot be tested by the boundary scan interconnect test (step 101 ); then, a plurality of first test pins are provided. The first test pin board, the first test pin board has a plurality of first test pins, the first test pins are respectively corresponding to the positions of the test points to be detected (step 102); The clamps are pressed together so that the first test pins are respectively electrically connected with the corresponding test points to be tested (step 103 ); then, the second test pin board provides a boundary scan interconnection test station to perform boundary scan on the boundary scan elements of the circuit board to be tested Interconnection test (step 104); then, the boundary scan interconnection test station forms electrical connections with the first test pin board and the second test pin board respectively (step 105); then, the boundary scan interconnection test station from the first test The needle board obtains the test signal corresponding to the test point to be tested, and determines whether it is connected according to the test signal (step 106); then, the boundary scan interconnection test station obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test needle board (step 107); finally, the boundary scan interconnection test station will detect the signal The turn-on determination results are integrated with the boundary scan interconnect test results to generate a test result (step 108).

From the above, it can be seen that the difference between the present invention and the prior art is that the boundary scan interconnection test station forms electrical connections with the first test pin board and the second test needle board respectively, and the boundary scan interconnection test station is tested from the first test pin board. The needle board obtains the test signal corresponding to the test point to be tested, and determines whether it is connected according to the test signal. The boundary scan interconnection test station obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test needle board. The scan interconnection test station integrates the conduction determination result of the test signal with the boundary scan interconnection test result and generates the test result.

This technical means can solve the problem existing in the prior art that the boundary scan test of the existing circuit board to be tested can only measure the detection of each pin of a boundary scan chip with a power supply and a controllable shift register, thereby achieving Technical efficacy to improve pin test coverage for boundary scan testing.

Although the embodiments disclosed in the present invention are as above, the above-mentioned contents are not used to directly limit the scope of the patent protection of the present invention. Anyone with ordinary knowledge in the technical field to which the present invention pertains can make some changes in the form and details of the implementation without departing from the spirit and scope of the present invention. The scope of patent protection of the present invention shall still be defined by the scope of the appended patent application.

100: Boundary Scan Interconnect Test Station

10: PCB to be tested

20: The first test pin board

30: Second test pin board

Claims (10)

A pin test coverage system for improving boundary scan test, suitable for the detection of a boundary scan interconnection test station, comprising: a circuit board to be tested, the circuit board to be tested is set with a plurality of test points to be tested by the boundary scan interconnection test station, and the test points to be tested cannot be detected by the boundary scan interconnection test; A first test pin board, the first test pin board has a plurality of first test pins, the first test pins are respectively corresponding to the positions of the test points to be detected, and the fixtures of the test workstation are interconnected through the boundary scan Pressing makes the first test pins respectively form electrical connections with the corresponding test points to be tested; and a second test needle board, the second test needle board provides the boundary scan interconnection test workstation to perform boundary scan interconnection tests on the boundary scan elements of the circuit board to be tested; Wherein, the boundary scan interconnection test station is electrically connected with the first test needle board and the second test needle board respectively, and the boundary scan interconnection test station obtains the data obtained from the first test needle board. A test signal corresponding to the test point to be tested, and according to the test signal to determine whether it is turned on, the boundary scan interconnection test station obtains the boundary of the boundary scan element of the circuit board to be tested through the second test pin board Scanning the interconnection test result, the boundary scan interconnection test station integrates the conduction determination result of the detection signal and the boundary scan interconnection test result to generate a detection result. The system for improving the footprint test coverage of boundary scan testing according to claim 1, wherein the boundary scan interconnection test workstation obtains the detection signal corresponding to the to-be-detected measurement point from the first test pin board, And according to the detection signal, it is determined whether the connection is turned on because the boundary scan interconnection test station receives the electronic signal of the test point to be tested from the first test needle board, and the received electronic signal of the test point to be tested is received. It is converted into the detection signal corresponding to the measurement point to be detected. The system for improving the footprint test coverage of boundary scan test according to claim 1, wherein the boundary scan interconnection test station selects the corresponding first test pin board according to the circuit board to be tested to make the boundary scan The clamps of the scanning interconnection test station are pressed together so that the first test pins are respectively electrically connected with the corresponding test points to be tested. The system for improving the footprint test coverage of boundary scan testing according to claim 1, wherein the boundary scan interconnection test workstation obtains the detection signal corresponding to the to-be-detected measurement point from the first test pin board, And according to the detection signal, it is determined whether the circuit board is turned on, and the circuit board to be detected does not obtain power supply. The system for improving the footprint test coverage of boundary scan testing according to claim 1, wherein the boundary scan interconnection test station obtains the boundary scan of the boundary scan elements of the circuit board to be tested through the second test pin board As a result of the interconnection test, the circuit board to be tested obtains power supply. A method for improving the coverage ratio of a boundary scan test for a pin position, which is suitable for the detection of a boundary scan interconnection test station, comprising the following steps: The boundary scan interconnection test workstation sets a plurality of to-be-detected test points on a circuit board to be tested, and the to-be-detected test points cannot be detected by the boundary scan interconnection test; providing a first test pin board with a plurality of first test pins, the first test pin board has a plurality of first test pins, and the first test pins respectively correspond to the positions of the test points to be detected; The test pin board is press-fitted through the clamp of the boundary scan interconnection test station, so that the first test pins are respectively electrically connected with the corresponding test points to be tested; A second test needle board provides the boundary scan interconnection test station to perform boundary scan interconnection test on the boundary scan elements of the circuit board to be tested; The boundary scan interconnection test station is electrically connected to the first test pin board and the second test pin board respectively; The boundary scan interconnection test station obtains a detection signal corresponding to the to-be-detected test point from the first test needle board, and determines whether the connection is turned on according to the detection signal; The boundary scan interconnection test workstation obtains the boundary scan interconnection test result of the boundary scan element of the circuit board to be tested through the second test pin board; and The boundary scan interconnection test station integrates the conduction determination result of the detection signal and the boundary scan interconnection test result to generate a detection result. The method for improving the footprint test coverage of boundary scan testing according to claim 6, wherein the boundary scan interconnection test station obtains a detection signal corresponding to the to-be-detected test point from the first test pin board, and In the step of judging whether the connection is turned on according to the detection signal, the boundary scan interconnection test station receives the electronic signal of the test point to be tested from the first test needle board, and the received electronic signal of the test point to be tested is The signal is converted into the detection signal corresponding to the detection point to be detected. The method for improving the test coverage rate of a boundary scan test according to claim 6, wherein the test pin board is pressed together by a jig of the boundary scan interconnection test station so that the first test pins are respectively connected with the corresponding corresponding pins. The step of forming the electrical connection between the test points to be tested is that the boundary scan interconnection test station selects the corresponding first test pin board according to the circuit board to be tested, so that the clamp of the boundary scan interconnection test station is pressed. The first test pins are combined to form electrical connections with the corresponding test points to be detected, respectively. The method for improving the footprint test coverage of boundary scan testing according to claim 6, wherein the boundary scan interconnection test station obtains a detection signal corresponding to the to-be-detected test point from the first test pin board, and In the step of determining whether the circuit board is turned on according to the detection signal, the circuit board to be detected does not receive power supply. The method for improving the footprint test coverage of the boundary scan test according to claim 6, wherein the boundary scan interconnection test station obtains the boundary scan of the boundary scan elements of the circuit board to be tested through the second test pin board In the step of interconnecting the test results, the circuit board to be tested obtains power supply.

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