以下，對本發明之實施形態，參照圖式詳細地進行說明。另，於各圖中對相同或相當部分標註相同符號，且省略重複之說明。
如圖1所示般，半導體裝置1具備具有彼此對向之第1表面2a及第2表面2b之半導體基板2。半導體裝置1係例如矽光電二極體等之光裝置。於半導體裝置1中，例如於包含n型之矽之半導體基板2內之第1表面2a側之特定區域，設置有選擇性擴散有p型之雜質之p型區域2c。於半導體基板2之第1表面2a，例如包含鋁之第1配線3係介隔氧化膜4而設置。於氧化膜4中與第1配線3之焊墊部3a對應之部分，形成有開口4a。於氧化膜4中與p型區域2c之端部對應之部分，形成有開口4b。第1配線3係經由開口4b而電性連接於p型區域2c。另，亦可取代氧化膜4，而設置SiN等、包含其他之絕緣材料之絕緣膜。
於半導體基板2之第1表面2a，配置有包含玻璃等之光透過型材料之光透過基板5。半導體基板2與光透過基板5係藉由包含光學接著劑之接著層6光學性且物理性連接。於半導體裝置1中，經由光透過基板5及接著層6而於p型區域2c入射光。另，半導體基板2之厚度較光透過基板5之厚度小(薄)。作為一例，半導體基板2之厚度係數十μm左右，光透過基板5之厚度係數百μm左右。
於半導體基板2，形成自第1表面2a到達至第2表面2b之貫通孔7。貫通孔7之第1開口7a係位於半導體基板2之第1表面2a，貫通孔7之第2開口7b係位於半導體基板2之第2表面2b。第1開口7a與氧化膜4之開口4a連續，且係由第1配線3之焊墊部3a覆蓋。貫通孔7之內表面7c係自第1表面2a朝第2表面2b擴大之錐狀之面。例如，貫通孔7係形成為自第1表面2a朝第2表面2b擴大之四角形錐台狀。另，於自與貫通線7之中心線CL平行之方向觀察之情形時，貫通孔7之第1開口7a之緣與氧化膜4之開口4a之緣不必一致，例如氧化膜4之開口4a之緣亦可相對於貫通孔7之第1開口7a之緣而位於內側。
貫通孔7之縱橫比係0.2～10。所謂縱橫比，係以貫通孔7之深度(第1開口7a與第2開口7b之距離)除以第2開口7b之寬度(於第2開口7b為矩形之情形時為第2開口7b之對邊間之距離，於第2開口7b為圓形之情形時為第2開口7b之直徑)之值。作為一例，係貫通孔7之深度為30 μm，且第2開口7b之寬度為130 μm。該情形時，縱橫比成為0.23。
於貫通孔7之內表面7c及半導體基板2之第2表面2b，設置有樹脂絕緣層10。樹脂絕緣層10係經由貫通孔7之第2開口7b而連續。樹脂絕緣層10係於貫通孔7之內側，經由氧化膜4之開口4a而到達至第1配線3之焊墊部3a，且於半導體基板2之第1表面2a側具有開口10a。
於樹脂絕緣層10之表面10b(與貫通孔7之內表面7c及半導體基板2之第2表面2b相反之側之表面)，設置有例如包含鋁之第2配線8。第2配線8係於樹脂絕緣層10之開口10a中電性連接於第1配線3之焊墊部3a。進而，於樹脂絕緣層10之表面10b(與半導體基板2之第2表面2b相反之側之表面)，設置有例如包含鋁之第3配線22。第3配線22係於形成於樹脂絕緣層10之開口10c中電性連接於半導體基板2之第2表面2b。
第2配線8及第3配線22係由樹脂保護層21覆蓋。於樹脂保護層21中與貫通孔7對應之部分，形成有具有平滑之內表面之較淺之凹部21a。於樹脂保護層21中與第2配線8之焊墊部8a對應之部分，形成有使焊墊部8a露出之開口21b。於樹脂保護層21中與第3配線22之焊墊部22a對應之部分，形成有使焊墊部22a露出之開口21c。於樹脂保護層21之開口21b，配置有凸塊電極即取出電極9。取出電極9係電性連接於第2配線8之焊墊部8a。於樹脂保護層21之開口21c，配置有凸塊電極即取出電極23。取出電極23係電性連接於第3配線22之焊墊部22a。半導體裝置1係經由取出電極9及取出電極23而安裝於電路基板，且取出電極9及取出電極23係分別作為陽極電極及陰極電極而發揮功能。另，亦可代替樹脂保護層21，設置包含其他之絕緣材料之保護層(例如，氧化膜、氮化膜等)。又，樹脂保護層21之厚度可為與樹脂絕緣層10之厚度相同程度，或，亦可設為較樹脂絕緣層10之厚度小。尤其，若樹脂保護層21之厚度為與樹脂絕緣層10之厚度相同程度，則可降低作用於第2配線8及第3配線22之應力。
對上述之樹脂絕緣層10，一邊參照圖2，一邊更詳細地進行說明。另，於圖2中，省略光透過基板5、接著層6及樹脂保護層21。
如圖2所示般，樹脂絕緣層10之表面10b包含：第1區域11，其於貫通孔7之內側到達至第1開口7a；第2區域12，其於貫通孔7之內側到達至第2開口7b；及第3區域13，其於貫通孔7之外側與半導體基板2之第2表面2b對向。
第1區域11係自半導體基板2之第1表面2a向第2表面2b擴大之錐狀之區域。第1區域11具有平均傾斜角度α。所謂第1區域11之平均傾斜角度α，係對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與第1區域11之交線相對於第1表面2a所成之角度之平均值。於該交線為直線之情形時，該直線與第1表面2a所成之角度成為第1區域11之平均傾斜角度α。於該交線為曲線之情形時，該曲線之接線與第1表面2a所成角度之平均值，成為第1區域11之平均傾斜角度α。第1區域11之平均傾斜角度α係大於0°且小於90°。
第2區域12係自半導體基板2之第1表面2a向第2表面2b擴大之錐狀之區域。第2區域12具有平均傾斜角度β。所謂第2區域12之平均傾斜角度β，係對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與第2區域12之交線相對於第1表面2a所成之角度之平均值。於該交線為直線之情形時，該直線與第1表面2a所成之角度成為第2區域12之平均傾斜角度β。於該交線為曲線之情形時，該曲線之接線與第1表面2a所成角度之平均值，成為第2區域12之平均傾斜角度β。第2區域12之平均傾斜角度β係大於0°且小於90°。
第2區域12之平均傾斜角度β小於第1區域11之平均傾斜角度α。即，第2區域12係具有較第1區域11平緩之傾斜之區域。又，第2區域12之平均傾斜角度β小於貫通孔7之內表面7c之平均傾斜角度γ。即，第2區域12係具有較貫通孔7之內表面7c平緩之傾斜之區域。於本實施形態中，第1區域11之平均傾斜角度α較第2區域12之平均傾斜角度β更接近貫通孔7之內表面7c之平均傾斜角度γ。此處，第1區域11之平均傾斜角度α＞貫通孔7之內表面7c之平均傾斜角度γ＞第2區域12之平均傾斜角度β。所謂貫通孔7之內表面7c之平均傾斜角度γ，係對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與內表面7c之交線相對於第1表面2a所成之角度之平均值。於該交線為直線之情形時，該直線與第1表面2a所成之角度成為貫通孔7之內表面7c之平均傾斜角度γ。於該交線為曲線之情形時，該曲線之接線與第1表面2a所成角度之平均值成為貫通孔7之內表面7c之平均傾斜角度γ。
樹脂絕緣層10之表面10b進而包含：第4區域14，其於與貫通孔7之內表面7c相反之側具有凸之最大曲率；及第5區域15，其沿著貫通孔7之第2開口7b之緣。所謂於與貫通孔之內表面7c相反之側凸之最大曲率，係於對包含貫通線7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，於該平面與表面10b之交線中之朝與貫通孔7之內表面7c相反之側凸狀地彎曲之部分之曲率之最大值。另，第1區域11係於設置於貫通孔7之內表面7c之樹脂絕緣層10之表面10b中之較第4區域14更接近貫通孔7之第1開口7a側(與貫通孔7之中心線CL平行之方向之第1開口7a側)之區域。第2區域12係設置於貫通孔7之內表面7c之樹脂絕緣層10之表面10b中之較第4區域14更接近貫通孔7之第2開口7b側(與貫通孔7之中心線CL平行之方向之第2開口7b側)之區域(即，第4區域14與第5區域15之間之區域)。
第4區域14係以與第1區域11與第2區域12連續地連接之方式彎曲。即，第4區域14係帶有圓角之曲面，且將第1區域11與第2區域12平滑地連接。此處，若假定第4區域14不存在，且使第1區域11朝半導體基板2之第2表面2b側延伸，使第2區域12朝半導體基板2之第1表面2a側延伸，則藉由第1區域11與第2區域12形成交線(角、彎曲部位)。第4區域14係相當於將該交線(角、彎曲部位)進行R倒角時形成之曲面。第4區域14係於對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與表面10b之交線中之於與第1區域11對應之部分及與第2區域12對應之部分之間、朝與貫通孔7之內表面7c相反之側凸狀地彎曲之部分。
第5區域15係以將第2區域12與第3區域13連續地連接之方式彎曲。即，第5區域15係帶有圓角之曲面，且將第2區域12與第3區域13平滑地連接。此處，若假定第5區域15不存在，且使第2區域12朝半導體基板2之第2表面2b側延伸，使第3區域13朝貫通孔7之中心線CL延伸，則藉由第2區域12與第3區域13形成交線(角、彎曲部位等)。第5區域15相當於將該交線(角、彎曲部位等)進行R倒角時形成之曲面。第5區域15係於對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與表面10b之交線中之與第2區域12對應之部分及與第3區域13對應之部分之間，朝與貫通孔7之第2開口7b之緣相反之側凸狀地彎曲之部分。
於本實施形態中，第1區域11、第4區域14及第5區域15係朝與貫通孔7之內表面7c相反之側凸狀地彎曲之曲面。第2區域12係於貫通孔7之內表面7c側凸狀地彎曲之曲面(即，若自與貫通孔7之內表面7c相反之側觀察，則凹狀地彎曲之曲面)。第3區域13係與半導體基板2之第2表面2b大致平行之平面。如上述般，第4區域14係以將第1區域11與第2區域12連續地連接之方式彎曲，且第5區域15係以將第2區域12與第3區域13連續地連接之方式彎曲，故樹脂絕緣層10之表面10b成為連續之面(不存在面與面之交線(角、彎曲部位等)等不連續部位，各區域11、12、13、14、15為平滑地連接之面)。
設置於貫通孔7之內表面7c之樹脂絕緣層10之平均厚度大於設置於半導體基板2之第2表面2b之樹脂絕緣層10之平均厚度。設置於貫通孔7之內表面7c之樹脂絕緣層10之平均厚度，係於與內表面7c垂直之方向之樹脂絕緣層10之厚度之平均值。所謂設置於半導體基板2之第2表面2b之樹脂絕緣層10之平均厚度，係於與第2表面2b垂直之方向之樹脂絕緣層10之厚度之平均值。
於半導體基板2之與第1表面2a及第2表面2b平行之方向上，樹脂絕緣層10中之與第1區域11對應之部分之平均厚度較樹脂絕緣層10中之與第2區域12對應之部分之平均厚度大。於半導體基板2之與第1表面2a及第2表面2b平行之方向上，所謂與樹脂絕緣層10中之與第1區域11對應之部分之平均厚度，係於該方向之第1區域11與貫通孔7之內表面7c之距離之平均值。於半導體基板2之與第1表面2a及第2表面2b平行之方向上，所謂樹脂絕緣層10中之與第2區域12對應之部分之平均厚度，係該方向之第2區域12與貫通孔7之內表面7c之距離之平均值。
於樹脂絕緣層10中，第1區域11係設置於貫通孔7之內表面7c之樹脂絕緣層10中之自半導體基板2之第1表面2a具有高度H之部分之表面。高度H係半導體基板2之厚度(即，第1表面2a與第2表面2b之距離)與設置於半導體基板2之第2表面2b之樹脂絕緣層10之平均厚度之和D之1/2以下。
於樹脂絕緣層10中，將通過樹脂絕緣層10之開口10a之緣及貫通孔7之第2開口7b之緣之面S設為邊界面，若著眼於相對於面S而貫通孔7之內表面7c側之部分P1、及相對於面S而與貫通孔7之內表面7c相反之側之部分P2，則部分P1之體積大於部分P2之體積。又，於樹脂絕緣層10中，若對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域，則三角形T1之面積較三角形T2之面積大。三角形T1係於包含貫通孔7之中心線CL之平面中(即，於圖2之剖面中)，將貫通孔7之第1開口7a之緣、貫通孔7之第2開口7b之緣、及樹脂絕緣層10之開口10a之緣設為頂點之三角形。三角形T2係於包含貫通孔7之中心線CL之平面中(即，圖2之剖面中)，將樹脂絕緣層10之開口10a之緣、貫通孔7之第2開口7b之緣、及第4區域14之頂部設為頂點之三角形。
樹脂絕緣層10具有第1彎曲部101、第2彎曲部102、及第3彎曲部103。第1彎曲部101係於第1開口部7a與第2開口部7b之間覆蓋貫通孔7之內表面7c。第2彎曲部102覆蓋貫通孔7之第2開口7b之緣(即，半導體基板2之第2表面2b與貫通孔之內表面7c之交線)。第2彎曲部102係以跨及半導體基板2之第2表面2b與貫通孔之內表面7c之方式形成。於本實施形態中，無論第2開口7b之緣之形狀為矩形或為圓形，第2開口7b之緣均不會成為倒角後之狀態，而成為角(邊緣)。第2彎曲部102將該角覆蓋。第3彎曲部103係於第1彎曲部101與第2彎曲部102之間覆蓋貫通孔7之內表面7c。第1彎曲部101與第3彎曲部103彼此分離，且第2彎曲部102與第3彎曲部103彼此分離。第1彎曲部101之樹脂絕緣層10之表面10b(於本實施形態中，相當於第4區域14)係朝與貫通孔7之內表面7c相反之側凸狀地彎曲。第2彎曲部102之樹脂絕緣層10之表面10b(於本實施形態與第5區域15相當)朝與貫通孔7之內表面7c相反之側凸狀地彎曲。第3彎曲部103之樹脂絕緣層10之表面10b(於本實施形態中，相當於第2區域12)朝貫通孔7之內表面7c側凸狀地彎曲(即，若自與貫通孔7之內表面7c相反之側觀察，則凹狀地彎曲)。第1彎曲部101之樹脂絕緣層10之表面10b之曲率、與第2彎曲部102之樹脂絕緣層10之表面10b之曲率彼此不同。
所謂向與貫通孔7之內表面7c相反之側凸狀之彎曲，係指於對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與表面10b之交線朝與貫通孔7之內表面7c相反之側凸狀地彎曲。所謂向貫通孔7之內表面7c側凸狀之彎曲，係指於對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域之情形時，該平面與表面10b之交線朝貫通孔7之內表面7c側凸狀地彎曲。
如圖3所示般，自與貫通孔7之中心線CL平行之方向觀察之情形時，第2配線8之外緣係位於貫通孔7之第2開口7b之外側。即，第2配線8之外緣係位於與樹脂絕緣層10之表面10b中之與半導體基板2之第2表面2b相反之側之表面。另，於圖3中，樹脂絕緣層10係以虛線顯示，第2配線8係以二點鏈線顯示。
於貫通孔7形成為自第1表面2a朝第2表面2b擴大之四角錐台狀之情形時，於第2彎曲部102之樹脂絕緣層10之表面10b(於本實施形態中，相當於第5區域15)中，於與貫通孔7之中心線CL平行之方向觀察之情形時，較之自貫通孔7之第2開口7b之各邊至該表面10b之距離，自貫通孔7之第2開口7b之各角至該表面10b之距離較大。藉此，於貫通孔7之第2開口7b之各角中，第2彎曲部102成為更平緩之曲面，故可確實地抑制貫通孔7之第2開口7b之緣露出，且可進一步確實地抑制第2配線8與半導體基板2之間之電流之洩漏產生。
又，於第1彎曲部101之樹脂絕緣層10之表面10b(於本實施形態中，相當於第4區域14)中，於自與貫通孔7之中心線CL平行之方向觀察之情形時，較之自貫通孔7之第1開口7a之各邊至該表面10b之距離，自貫通孔7之第1開口7a之各角至該表面10b之距離較大。進而，於自與貫通孔7之中心線CL平行之方向觀察之情形時，第2彎曲部102之樹脂絕緣層10之表面10b(於本實施形態中，相當於第5區域15)、與第2彎曲部102之樹脂絕緣層10之表面10b(於本實施形態中，相當於第5區域15)之距離係較之於貫通孔7之第1開口7a之各邊之該距離，於貫通孔7之第1開口7a之各角之該距離較大。藉此，雖然四角錐台狀之貫通孔7之角部(谷部)係絕緣膜進一步容易變薄之部分，但可於該角部(谷部)中充分地確保樹脂絕緣層10之厚度。
如以上說明般，於半導體裝置1中，樹脂絕緣層10具有覆蓋貫通孔7之第2開口7b之緣之第2彎曲部102，且第2彎曲部102之表面10b朝與貫通孔7之內表面7c相反之側凸狀地彎曲。藉此，設置於貫通孔7之內表面7c之樹脂絕緣層10之表面10b與設置於半導體基板2之第2表面2b之樹脂絕緣層10之表面10b係平滑地連接。因此，無論於製造時或製造後，均可防止於貫通孔7之第2開口7b部分之第2配線8之斷線。又，樹脂絕緣層10於第1開口7a與第2開口7b之間具有覆蓋貫通孔7之內表面7c之第1彎曲部101，第1彎曲部101之表面10b朝與貫通孔7之內表面7c相反之側凸狀地彎曲。藉此，即使於例如將貫通孔7小徑化之情形時，亦可充分確保半導體基板2之第1表面2a側之樹脂絕緣層10之開口10a之寬度。因此，無論於製造時或製造後，均可防止於樹脂絕緣層10之開口10a部分之第1配線3與第2配線8之斷線。因此，根據半導體裝置1，可將半導體基板2之經由貫通孔7之電性連接確實化。
於半導體裝置1中，樹脂絕緣層10於第1彎曲部101與第2彎曲部102之間進而具有覆蓋貫通孔7之內表面7c之第3彎曲部103，第3彎曲部103之表面10b朝貫通孔7之內表面7c側凸狀地彎曲。藉此，例如，即使自貫通孔7之第2開口7b側向第1開口7a側作用一些外力，第3彎曲部103亦可作為緩衝區域發揮功能。因此，可降低產生於第1配線3與第2配線8之連接部分之應力，可進一步確實地防止第1配線3與第2配線8之斷線。
於半導體裝置1中，設置於貫通孔7之內表面7c之樹脂絕緣層10之平均厚度較設置於第2表面2b之樹脂絕緣層10之平均厚度大。藉此，即使於例如將半導體基板2薄型化之情形時，設置於貫通孔7之內表面7c之樹脂絕緣層10亦可作為增強層發揮功能，故可充分地確保貫通孔7周邊部分之強度。又，可將第1區域11之平均傾斜角度及第2區域12之平均傾斜角度設為期望之角度，可獲得表面10b成為連續之面(不存在面與面之交線(角、彎曲部位等)等不連續部位，各區域11、12、13、14、15為平滑地連接之面)之樹脂絕緣層10。於例如樹脂絕緣層10係沿著貫通孔7之內表面7c以均勻之厚度形成之情形時，不可能獲得表面10b成為連續之面之樹脂絕緣層10。
於半導體裝置1中，貫通孔7之內表面7c係自第1表面2a朝第2表面2b擴大之錐狀之面。於該情形時，亦可將半導體基板2之經由貫通孔7之電性連接確實化。
於半導體裝置1中，樹脂絕緣層10之表面10b中之到達至貫通孔7之第1開口7a之第1區域11、及到達至貫通孔7之第2開口7b之第2區域12，係自半導體基板2之第1表面2a朝第2表面2b擴大之錐狀之區域。然後，第2區域12之平均傾斜角度較貫通孔7之內表面7c之平均傾斜角度小。藉此，樹脂絕緣層10之表面10b中之與半導體基板2之第2表面2b對向之第3區域13與到達至貫通孔7之第2開口7b之第2區域12所成之角度，較半導體基板2之第2表面2b與貫通孔7之內表面7c所成之角度大(即、平緩)。因此，無論於製造時或製造後，均防止於貫通孔7之第2開口7b部分之第2配線8之斷線。又，與例如樹脂絕緣層10係沿著貫通孔7之內表面7c以均勻之厚度形成之情形相比，第2區域12之傾斜成為平緩，故可容易且確實地形成第2配線8。進而，由於可不依存於貫通孔7之內表面7c之形狀而形成第2配線8，故於例如於貫通孔7之內表面7c殘留有尖銳之部分之情形時，亦可防止起因於此種部分之第2配線8之斷線。又，第2區域12之平均傾斜角度成為較第1區域11之平均傾斜角度小。換言之，到達至貫通孔7之第1開口7a之第1區域11之平均傾斜角度大於第2區域12之平均傾斜角度。藉此，於例如將貫通孔7小徑化之情形時，亦可充分地確保半導體基板2之第1表面2a側之樹脂絕緣層10之開口10a之寬度。因此，無論於製造時或製造後，均可防止於樹脂絕緣層10之開口10a部分之第1配線3與第2配線8之斷線。進而，於樹脂絕緣層10之表面10b中，第4區域14係以將第1區域11與第2區域12連續地連接之方式彎曲，第5區域15係以將第2區域12與第3區域13連續地連接之方式彎曲。因此，無論於製造時或製造後，均防止於樹脂絕緣層10之表面10b之整個區域之第2配線8之斷線。尤其於製造後，可於樹脂絕緣層10之表面10b之整個區域緩和應力集中，故對於第2配線8之斷線之防止較有效。藉由以上，根據半導體裝置1，可將半導體基板2之經由貫通孔7之電性連接確實化。
於半導體裝置1中，樹脂絕緣層10之表面10b成為連續之面(不存在面與面之交線(角、彎曲部位等)等不連續部位，各區域11、12、13、14、15為平滑地連接之面)。藉此，可緩和應力集中而防止第2配線8之斷線。
於半導體裝置1中，第1區域11之平均傾斜角度較第2區域12之平均傾斜角度更接近貫通孔7之內表面7c之平均傾斜角度。藉此，可獲得為了使第1配線3之焊墊部3a露出而具有充足之寬度之開口10a，其結果，無論於製造時或製造後，均可確實地防止於樹脂絕緣層10之開口10a部分之第1配線3與第2配線8之斷線。
於半導體裝置1中，成為第1區域11之平均傾斜角度α＞貫通孔7之內表面7c之平均傾斜角度γ＞第2區域12之平均傾斜角度β。藉此，可防止第2配線8之斷線，且可獲得為了使第1配線3之焊墊部3a露出而具有充足之寬度之開口10a。
於半導體裝置1中，於與半導體基板2之第1表面2a及第表面2b平行之方向上，樹脂絕緣層10中之與第1區域11對應之部分之平均厚度較樹脂絕緣層10中之與第2區域12對應之部分之平均厚度大。藉此，可獲得具有難以產生第2配線8之斷線且難以產生第1配線3與第2配線8之斷線之形狀之樹脂絕緣層10。
於半導體裝置1中，即使例如於貫通孔7之第2開口7b之緣殘存有突懸等，該突懸等亦被樹脂絕緣層10覆蓋，且於凸狀地彎曲之曲面即第5區域15設置有第2配線8。藉此，可確實地防止於貫通孔7之第2開口7b部分之第2配線8之斷線。
於半導體裝置1中，設置於貫通孔7之內表面7c之樹脂絕緣層10中之具有設置於半導體基板2之厚度與第2表面2b之樹脂絕緣層10之平均厚度之和D之1/2以下之高度H之部分之表面成為第1區域11。藉此，於樹脂絕緣層10之表面10b中，可將第1區域11與第2區域12平緩地連接，而確實地防止於第1區域11與第2區域12之邊界之第2配線8之斷線。
於半導體裝置1之樹脂絕緣層10中，將通過樹脂絕緣層10之開口10a之緣及貫通孔7之第2開口7b之緣之面S設為邊界面，若著眼於相對於面S而貫通孔7之內表面7c側之部分P1、及相對於面S而與貫通孔7之內表面7c相反之側之部分P2，則部分P1之體積大於部分P2之體積。又，若對包含貫通孔7之中心線CL之平面，著眼於中心線CL之一側之區域，則三角形T1之面積大於三角形T2之面積。藉由該等，於樹脂絕緣層10之表面10b中，亦可將第1區域11與第2區域12平緩地連接，可確實地防止於第1區域11與第2區域12之邊界之第2配線8之斷線。
於半導體裝置1中，設置於貫通孔7之內表面7c之樹脂絕緣層10之表面10b中之於與貫通孔7之內表面7c相反之側具有凸之最大曲率之較第4區域14更接近第1開口7a側之區域成為第1區域11，較第4區域14更接近第2開口7b側之區域成為第2區域12。此種樹脂絕緣層10之形狀於將半導體基板2之經由貫通孔7之電性連接確實化方面尤其有效。
接著，對上述之半導體裝置1之製造方法，一般參照圖4～圖9，一邊進行說明。首先，如圖4之(a)所示般，於半導體基板2形成p型區域2c，且於半導體基板2之第1表面2a，設置氧化膜4及第1配線3(第1步驟)。接著，如圖4之(b)所示般，於半導體基板2之第1表面2a經由接著層6而安裝光透過基板(支持基板)5(第2步驟)。
接著，如圖5之(a)所示般，藉由研磨安裝有光透過基板5之半導體基板2之第2表面2b(即、藉由去除半導體基板2之第2表面2b側之部分)，可以半導體基板2之厚度小於光透過基板5之厚度之方式將半導體基板2薄型化(第3步驟)。如此，藉由將半導體基板2薄型化，可於其後之步驟中容易地形成貫通孔7。又，即使於完成之半導體裝置1中亦可謀求應答速度之提高。接著，如圖5之(b)所示般，藉由各向異性之濕式蝕刻而於半導體基板2形成貫通孔7，且進而，如圖6之(a)所示般，於氧化膜4中去除與第1配線3之焊墊部3a對應之部分，於氧化膜4形成開口4a。藉此，於貫通孔7之第1開口7a使第1配線3之焊墊部3a露出(第4步驟)。另，於自與貫通孔7之中心線CL平行之方向觀察之情形時，不必以使貫通孔7之第1開口7a之緣與氧化膜4之開口4a之緣一致之方式於氧化膜4形成開口4a，亦可以例如氧化膜4之開口4a之緣相對於貫通孔7之第1開口7a之緣而位於內側之位置之方式於氧化膜4形成開口4a。
接著，準備具有10 cp以上黏度之正型之第1樹脂材料，使用該第1樹脂材料而實施浸漬塗佈法(將對象物浸漬於樹脂塗料，將對象物自樹脂塗料吸起，藉此於對象物形成樹脂層之方法)，藉此如圖6之(b)所示般，於貫通孔7之內表面7c及半導體基板2之第2表面2b設置樹脂絕緣層10(第5步驟)。藉此，於樹脂絕緣層10，形成具有追隨於第2區域12、第3區域13及第5區域15之內表面之凹部17。又，於與光透過基板5之半導體基板2相反之側之表面亦附著有第1樹脂材料，且形成有樹脂層100。另，作為第1樹脂材料，可使用例如酚醛樹脂、聚醯亞胺樹脂、及環氧樹脂等。
接著，如圖7之(a)所示般，使用遮罩(省略圖示)，於樹脂絕緣層10中僅於與接觸孔16對應之部分及與開口10c對應之部分照射光，且僅將其等之部分進行曝光。進而，於樹脂層100(參照圖6之(b))亦照射光，且亦將樹脂層100進行曝光。然後，於樹脂絕緣層10中將與接觸孔16對應之部分及與開口10c對應之部分、以及樹脂層100進行顯影，藉此於樹脂絕緣層10形成接觸孔16及開口10c，且去除樹脂層100(即、附著於光透過基板5之與半導體基板2相反之側之表面之第1樹脂材料)。藉此，於樹脂絕緣層10之開口10a使第1配線3之焊墊部3a露出，且於樹脂絕緣層10之開口10c使半導體基板2之第2表面2b之一部分露出(第6步驟)。另，於形成接觸孔16時，亦可併用灰化處理等。
於曝光之時，於遮罩(省略圖示)之光透過部與樹脂絕緣層10中與接觸孔16對應之部分之間，藉由形成於樹脂絕緣層10之凹部17而形成間隙。藉此，光繞射而照射於樹脂絕緣層10。因此，於顯影之時，形成具有追隨於自半導體基板2之第1表面2a向第2表面2b擴大之錐狀之第1區域11、及第2區域12之內表面之接觸孔16。
接著，如圖7之(b)所示般，例如使用鋁而實施濺鍍法，藉此於樹脂絕緣層10之表面10b設置第2配線8及第3配線22，於樹脂絕緣層10之開口10a中將第1配線3與第2配線8電性連接，且於樹脂絕緣層10之開口10c中將第3配線22與半導體基板2之第2表面2b電性連接(第7步驟)。此時，接觸孔16具有追隨於自半導體基板2之第1表面2a向第2表面2b擴大之錐狀之第1區域11之內表面，故於該內表面亦確實地形成金屬膜，進而，於樹脂絕緣層10之開口10a中將第1配線3與第2配線8確實地連接。
接著，準備具有10 cp以上之黏度之正型之第2樹脂材料，藉由使用該第2樹脂材料而實施浸漬塗佈法，如圖8之(a)所示般，以覆蓋第2配線8及第3配線22之方式，於樹脂絕緣層10之表面10b設置樹脂保護層21(第8步驟)。藉此，於樹脂保護層21形成凹部21a。又，於光透過基板5之與半導體基板2相反之側之表面亦附著第2樹脂材料，形成樹脂層210。另，作為第2樹脂材料，可使用例如酚醛樹脂、聚醯亞胺樹脂、及環氧樹脂等。
接著，如圖8之(b)所示般，使用遮罩(省略圖示)，而於樹脂保護層21中僅於與第2配線8之焊墊部8a對應之部分及與第3配線22之焊墊部22a對應之部分照射光，且僅將其等之部分曝光。進而，於樹脂層210(參照圖8之(a))亦照射光，將樹脂層210進行曝光。然後，於樹脂保護層21中與第2配線8之焊墊部8a對應之部分及與第3配線22之焊墊部22a對應之部分、以及樹脂層210進行顯影，藉此於樹脂保護層21形成開口21b及開口21c，且去除樹脂層210(即，附著於光透過基板5之與半導體基板2相反之側之表面之第2樹脂材料)。藉此，於樹脂保護層21之開口21b使第2配線8之焊墊部8a露出，且於樹脂保護層21之開口21c使第3配線22之焊墊部22a露出(第9步驟)。最後，於未由樹脂保護層21覆蓋之第2配線8之焊墊部8a配置取出電極9，且於未由樹脂保護層21覆蓋之第3配線22之焊墊部22a配置取出電極23，獲得上述之半導體裝置1。
對實施上述之浸漬塗佈法之步驟，進一步詳細地進行說明。於本實施形態中，用以形成樹脂絕緣層10之第1樹脂材料、與用以形成樹脂保護層21之第1樹脂材料係相同。因此，用以形成樹脂絕緣層10之浸漬塗佈法、及用以形成樹脂保護層21之浸漬塗佈法均如下述般實施。另，上述之半導體裝置1之製造方法之各步驟係以晶圓級實施，最後，將包含複數個半導體裝置1之晶圓進行切割而獲得各個半導體裝置1。
如圖9所示般，於存積於容器C之樹脂材料F，浸漬含有相當於複數個半導體裝置1之部分之晶圓W。於樹脂材料F浸漬晶圓W時，維持使存積於容器C之樹脂材料F之液面FL與半導體基板2之第1表面2a交叉之狀態(於本實施形態中為正交之狀態、即半導體基板2之第1表面2a為與垂直方向平行之狀態)。
接著，自存積於容器C之樹脂材料F，將包含相當於複數個半導體裝置1之部分之晶圓W上拉。於將樹脂材料F自晶圓W上拉時，維持使存積於容器C之樹脂材料F之液面FL與半導體基板2之第1表面2a交叉之狀態(於本實施形態中，為正交之狀態，即半導體基板2之第1表面2a為與垂直方向平行之狀態)。
其後，進行塗佈於晶圓W之樹脂材料F之預烘乾。較佳為於該預烘乾時，將晶圓W之朝向維持為與進行相對於樹脂材料F之半導體基板2之浸漬及上拉時相同之朝向。其理由係如下述。即，其原因為於預烘乾之時，若與進行相對於樹脂材料F之半導體基板2之浸漬及上拉時於不同之朝向使晶圓之朝向變化，則樹脂材料F之附著狀態變化，有於每個貫通孔7中樹脂絕緣層10及樹脂保護層21之形成狀態偏差之虞。
另，將樹脂絕緣層10及樹脂保護層21之各者圖案化之步驟之詳細之一例係如下述。即，藉由浸漬塗佈法塗佈樹脂材料，進行上述之樹脂材料之預烘乾、進行上述之樹脂材料之曝光、進行樹脂材料之烘乾、進行上述之樹脂材料之顯影、進行樹脂材料之烘乾。另，亦可不進行於上述之樹脂材料之曝光後且樹脂材料之顯影前之樹脂材料之烘乾。
以上，如說明般，於半導體裝置1之製造方法中，於將半導體基板2薄型化之步驟以後之各步驟，可以於半導體基板2安裝有光透過基板5之狀態實施。藉此，可防止於貫通孔7之周邊部分產生損傷。又，藉由浸漬塗佈法之實施，形成樹脂絕緣層10。藉此，可確實地形成可確保電性絕緣之具有充足之厚度之樹脂絕緣層10。因此，根據半導體裝置1之製造方法，可一邊將半導體基板2薄型化，一邊防止於貫通孔7之周邊部分產生損傷，且可確保於貫通孔7內之配線與半導體基板2之間之電性絕緣。
於半導體裝置1之製造方法中，於用以形成樹脂絕緣層10之浸漬塗佈法、及用以形成樹脂保護層21之浸漬塗佈法之各者中，如下述般，實施相對於樹脂材料F之浸漬及上拉。即，以使存積之樹脂材料F之液面FL與半導體基板2之第1表面2a交叉之方式，於存積之樹脂材料F，浸漬安裝有光透過基板5之半導體基板2，且以使存積之樹脂材料F之液面FL與半導體基板2之第1表面2a交叉之方式，自存積之樹脂材料F將安裝有光透過基板5之半導體基板2上拉。藉此，與以例如存積之樹脂材料F之液面FL與半導體基板2之第1表面2a平行之狀態，實施相對於樹脂材料F之浸漬及上拉之情形相比，可降低於貫通孔7之周邊部分產生之應力。又，例如，與以存積之樹脂材料F之液面FL與半導體基板2之第1表面2a平行之狀態，實施相對於樹脂材料F之浸漬及上拉之情形相比，可抑制於形成於貫通孔7之內表面7c之樹脂絕緣層10殘存氣泡。
於半導體裝置1之製造方法中，於用以形成樹脂絕緣層10之浸漬塗佈法、及用以形成樹脂保護層21之浸漬塗佈法之各者中，使用具有10 cp以上之黏度之相同之樹脂材料。藉由使用具有10 cp以上之黏度之樹脂材料，可確實地形成可確保電性絕緣之具有充足之厚度之樹脂絕緣層10，且可確實地形成可保護第2配線8及第3配線22之具有充足之厚度之樹脂保護層21。又，藉由使用相同之樹脂材料，即使起因於溫度變化而樹脂絕緣層10及樹脂保護層21變形，由於其等之變形之程度成為同等，故亦可防止起因於其等變形之程度大為不同而於第2配線8及第3配線222產生損傷。
另，於浸漬塗佈法，一般而言，使用黏性較低之樹脂材料(例如使用於斥水被覆之樹脂材料等，例如具有1 cp以下之黏度之樹脂材料)。然而，即使使用此種樹脂材料而實施浸漬塗佈法，樹脂絕緣層10亦沿著貫通孔7之內表面7c以大致均勻之厚度形成。因此，於上述半導體裝置1之製造方法中，藉由使用具有10 cp以上之黏度之樹脂材料而實施浸漬塗佈法，可容易且確實地獲得具有上述之形狀之樹脂絕緣層10。
於半導體裝置1之製造方法中，於在樹脂絕緣層10形成接觸孔16及開口10c時，去除樹脂層100(即，附著於光透過基板5之與半導體基板2相反之側之表面之第1樹脂材料)。又，於在樹脂保護層21形成開口21b及開口21c時，去除樹脂層210(即，附著於光透過基板5之與半導體基板2相反之側之表面之第2樹脂材料)。藉此，即使將光透過基板5作為支持基板使用，亦可自支持基板去除樹脂層100及樹脂層210，故可使支持基板作為光透過基板5而有效地發揮功能。
另，較佳為不集中去除樹脂層100及樹脂層210，而於各者之顯影時去除樹脂層100及樹脂層210之各者。於顯影後進而進行樹脂材料之烘乾，於該烘乾後無法將樹脂材料去除完，故例如使樹脂層100保持殘存之狀態，於最後之步驟即使欲與樹脂層210一起將樹脂層100去除，亦無法將樹脂層100去除完。因此，於各者之顯影時將樹脂層100及樹脂層210之各者去除。將樹脂層100及樹脂層210確實地去除係於將支持基板作為光透過基板5利用之情形時當為有效。又，於不將支持基板作為光透過基板5利用之情形(最終除去之情形)時，若不將樹脂層100及樹脂層210確實地去除，則於晶圓製程中於固定面存在凹凸，處理亦成為不穩定，且，成為相對於半導體基板2而作用應力。因此，確實地去除樹脂層100及樹脂層210，係對於不將支持基板作為光透過基板5利用之情形(最終除去之情形)亦有效。
於半導體裝置1之製造方法中，藉由實施浸漬塗佈法，以覆蓋第2配線8及第3配線22之方式，於樹脂絕緣層10之表面10b形成樹脂保護層21。藉此，於樹脂保護層21中與貫通孔7對應之部分，形成具有平滑之內表面之較淺之凹部21a。因此，於經由取出電極9及取出電極23而將半導體裝置1安裝於電路基板，且於半導體裝置1與電路基板之間填充底層填料樹脂之情形時，底層填料樹脂容易流入至凹部21a之內側，且難以於凹部21a之內側殘存氣泡等。
於上述半導體裝置1之製造方法中，使用正型之樹脂材料，於貫通孔7之內表面7c及半導體基板2之第2表面2b設置樹脂絕緣層10。然後，於樹脂絕緣層10中將與接觸孔16對應之部分曝光及顯影，藉此於樹脂絕緣層10形成接觸孔16。藉此，可容易且確實地獲得具有上述之形狀之樹脂絕緣層10。另，於曝光及顯影之時，藉由形成於樹脂絕緣層10之凹部17，於樹脂絕緣層10中與接觸孔16對應之部分之厚度變薄(即，由於與接觸孔16對應之部分為樹脂絕緣層10中之具有半導體基板2之厚度與設置於第2表面2b之樹脂絕緣層10之平均厚度之和D之1/2以下之高度H之部分)，故可容易且確實地獲得具有期望之形狀之接觸孔16。
以上，對本發明之一實施形態進行說明，但本發明並非限定於上述實施形態者。例如，於上述實施形態中，貫通孔7之第1開口7a係由第1配線3之焊墊部3a覆蓋，但只要第1配線3之一部分位於第1開口7a上即可，第1配線3亦可覆蓋第1開口7a之整個區域。
又，於上述實施形態中，第1區域11之平均傾斜角度較第2區域12之平均傾斜角度更接近貫通孔7之內表面7c之平均傾斜角度，但亦可為第2區域12之平均傾斜角度較第1區域11之平均傾斜角度更接近貫通孔7之內表面7c之平均傾斜角度。
又，於上述實施形態中，作為支持基板而使用光透過基板5，但於半導體裝置1不具備光透過基板5之情形時，亦可將其他之基板作為支持基板而使用。於將其他之基板作為支持基板使用之情形時，亦可於在半導體裝置1之製造步驟中設置取出電極9及取出電極23後，自半導體基板2去除支持基板。又，於將其他之基板作為支持基板使用之情形時，藉由實施浸漬塗佈法可去除附著於支持基板之樹脂層100及樹脂層210，且亦可使其殘存。進而，於將其他之基板作為支持基板使用之情形時，作為接著層6不必使用光學接著劑。
又，於上述實施形態中，於自與貫通孔7之中心線CL平行之方向觀察之情形時，第2配線8之焊墊部8a及取出電極9位於貫通孔7之第2開口7b之外側附近，但第2配線8之焊墊部8a及取出電極9亦可以自貫通孔7之第2開口7b充分地分離之狀態，位於樹脂絕緣層10之表面10b中之與半導體基板2之第2表面2b相反之側之表面。但，於自與貫通孔7之中心線CL平行之方向觀察之情形時，即使第2電極8之焊墊部8a及取出電極9位於貫通孔7之第2開口7b之外側附近，亦如圖10所示般，於取出電極9因熱等膨脹時產生之應力朝各箭頭A1、A2、A3之方向分散。此係由於設置有取出電極9之樹脂保護層21之開口21b之側壁(內表面)彎曲所致。又，由於設置於貫通孔7之內表面7c之樹脂絕緣層10之表面10b與設置於半導體基板2之第2表面2b之樹脂絕緣層10之表面10b平滑地連接所致。進而，作用於箭頭A3方向之應力沿著第2配線8朝箭頭A4之方向作用。因此，即使第2配線8之焊墊部8a及取出電極9位於貫通孔7之第2開口7b之外側附近，亦防止於貫通孔7之第2開口7b部分附近第2配線8斷線。假如僅對箭頭A3之方向作用應力，則樹脂保護層21之開口21b被推開，有第2配線8斷線之虞。
又，如圖11所示般，取出電極9亦可以自半導體基板2之第2表面2b突出之方式，配置於貫通孔7之內側。於將取出電極9配置於貫通孔7之內側之情形時，貫通孔7之內表面7c為自第1表面2a朝第2表面2b擴大之錐狀之面，故熔融之焊錫等之金屬材料(用以形成取出電極9之材料)容易流入至貫通孔7之內側，且於貫通孔7之內側難以殘存氣泡等。又，即使例如自貫通孔7之第2開口7b側向第1開口7a側對取出電極9作用一些外力，樹脂絕緣層10(尤其為上述之第3彎曲部103)亦作為緩衝區域而發揮功能。因此，可降低於取出電極9產生之應力，且可確實地維持第1配線3、第2配線8及取出電極9之彼此間之電性連接。另，於將取出電極9配置於貫通孔7之內側之情形時，不必將第2配線8引出至貫通孔7之第2開口7b之外側，故於自與貫通孔7之中心線CL平行之方向觀察之情形時，第2配線8之外緣亦可位於貫通孔7之第2開口7b之內側。即，第2配線8之外緣亦可位於樹脂絕緣層10之表面10b中之與貫通孔7之內表面7c相反之側之表面。
又，如圖12及圖13所示般，於自與貫通孔7之中心線CL平行之方向觀察之情形時，第2配線8之外緣係除了於焊墊部8a延伸之部分以外，亦可位於貫通孔7之第2開口7b之內側。即，第2配線8之外緣係除了於焊墊部8a延伸之部分以外，亦可位於樹脂絕緣層10之表面10b中之與貫通孔7之內表面7c相反之側之表面。於該情形時，第2配線8中之僅延伸於焊墊部8a之部分橫切貫通孔7之第2開口7b，故於貫通孔7之第2開口7b部分中，可進一步確實地抑制於第2配線8與半導體基板2之間之電流之洩漏產生。尤其，於貫通孔7之第2開口7b之形狀為矩形之情形時，第2配線8中之於焊墊部8a延伸之部分係以橫切除了矩形之角部以外之邊之部分之方式構成，藉此於貫通孔7之第2開口7b部分中，可進一步確實地抑制於第2配線8與半導體基板2之間之電流之洩漏產生。另，於圖13中，樹脂絕緣層10係以虛線顯示，第2配線8係以二點鏈線顯示。
又，如圖14所示般，貫通孔7之內表面7c(於貫通孔7之內表面7c為圓柱面等之曲面之情形時，為該曲面之切平面)亦可為與第1表面2a及第2表面2b正交之面。於該情形時，亦可將半導體基板2之經由貫通孔7之電性連接確實化。此處，貫通孔7之縱橫比為0.2～10。作為一例，貫通孔7之深度為40 μm，第2開口7b之寬度為30 μm。於該情形時，縱橫比成為1.3。另，具有圓柱狀、四角柱狀等之形狀之貫通孔7係例如藉由乾式蝕刻形成。
關於圖14所示之貫通孔7，第2區域12之平均傾斜角度β亦小於第1區域11之平均傾斜角度α，且小於貫通孔7之內表面7c之平均傾斜角度γ(於該情形時為90°)。即，第2區域12係較第1區域11具有更平緩之傾斜，且較貫通孔7之內表面7c具有更平緩之傾斜之區域。又，第1區域11之平均傾斜角度α較第2區域12之平均傾斜角度β更接近貫通孔7之內表面7c之平均傾斜角度γ。此處，成為貫通孔7之內表面7c之平均傾斜角度γ＞第1區域11之平均傾斜角度α＞第2區域12之平均傾斜角度β。藉此，可防止第2配線8之斷線，且可獲得為了使第1配線3之焊墊部3a露出而具有充足之寬度之開口10a。又，樹脂絕緣層10之表面10b成為連續之面(不存在面與面之交線(角、彎曲部位等)等不連續部位，各區域11、12、13、14、15為平滑地連接之面)。又，於樹脂絕緣層10中，將通過樹脂絕緣層10之開口10a之緣及貫通孔7之第2開口7b之緣之面S設為邊界面，若著眼於相對於面S而貫通孔7之內表面7c側之部分P1、及相對於面S而與貫通孔7之內表面7c相反之側之部分P2，則部分P1之體積大於部分P2之體積。又，於樹脂絕緣層10中，對包含貫通孔7之中心線CL之平面，若著眼於中心線CL之一側之區域，則三角形T1之面積大於三角形T2之面積。又，於半導體基板2之與第1表面2a及第2表面2b平行之方向上，樹脂絕緣層10中之與第1區域11對應之部分之平均厚度較樹脂絕緣層10中之與第2區域12對應之部分之平均厚度大。
又，第1區域11亦可為設置於貫通孔7之內表面7c之樹脂絕緣層10中之具有半導體基板2之厚度與設置於半導體基板2之第2表面2b的樹脂絕緣層10之平均厚度之和D之2/3以下之高度H之部分之表面10b(參照圖14)。於該情形時，於樹脂絕緣層10之表面10b中，將第1區域11與第2區域12平緩地連接，而可確實地防止於第1區域11與第2區域12之邊界之第2配線8之斷線。另，於曝光及顯影之時，藉由形成於樹脂絕緣層10之凹部17，於樹脂絕緣層10中與接觸孔16對應之部分之厚度變薄(即，與接觸孔16對應之部分為樹脂絕緣層10中之具有半導體基板2之厚度與設置於第2表面2b之樹脂絕緣層10之平均厚度之和D之2/3以下之高度H之部分)，故可容易且確實地獲得具有期望之形狀之接觸孔16。
又，於上述半導體裝置1之製造方法中，使用正型之樹脂材料，於貫通孔7之內表面7c及半導體基板2之第2表面2b設置樹脂絕緣層10，且將於樹脂絕緣層10中與接觸孔16對應之部分及與開口10c對應之部分曝光及顯影，藉此於樹脂絕緣層10形成接觸孔16及開口10c，但本發明並非限定於此。例如，亦可使用負型之樹脂材料，而於貫通孔7之內表面7c及半導體基板2之第2表面2b設置樹脂絕緣層10。於該情形時，亦可將於樹脂絕緣層10中與接觸孔16對應之部分及與開口10c對應之部分以外之部分進行曝光，且將於樹脂絕緣層10中與接觸孔16對應之部分及與開口10c對應之部分進行顯影，藉此於樹脂絕緣層10形成接觸孔16及開口10c。起因於光之衰減、光之繞射等，雖僅藉由顯影，可形成自半導體基板2之第2表面2b向第1表面2a擴大之錐狀之接觸孔16，但藉由進而實施熱處理等，可獲得自半導體基板2之第1表面2a向第2表面2b擴大之錐狀之接觸孔16。
又，於上述實施形態中，於例如包含n型之矽之半導體基板2內之第1表面2a側之特定區域，設置有選擇性擴散有p型之雜質之p型區域2c，但各導電型亦可為相反。該情形時，取出電極9及取出電極23分別作為陰極電極及陽極電極發揮功能。進而，並非限定於在第1導電型(p型及n型之一者)之半導體基板2內形成第2導電型(p型及n型之另一者)之區域者，亦可為於第1導電型(p型及n型之一者)之半導體基板2上形成第2導電型(p型及n型之另一者)之半導體層者，且亦可為於基板上形成第1導電型(p型及n型之一者)之半導體層，且於該第1導電型之半導體層上形成第2導電層(p型及n型之另一者)之半導體層者。即，只要為於半導體基板2之第1導電型區域形成第2導電型之區域者即可，又，於上述實施形態中，半導體裝置1為例如矽光電二極體等之光裝置，但半導體裝置1亦可為其他之光裝置，且亦可為電子裝置等。
又，於上述半導體裝置1之製造方法中，藉由實施浸漬塗佈法，設置樹脂絕緣層10及樹脂保護層21，但本發明並非限定於此。例如，亦可實施使用樹脂片之層壓法、使用樹脂塗料之旋轉塗佈法等其他之方法，藉此設置樹脂絕緣層10及/或樹脂保護層21。
[產業上之可利用性]
根據本發明，可提供一種可一邊將半導體基板薄型化，一邊防止於貫通孔之周邊部分產生損傷，且可確保貫通孔內之配線與半導體基板之間之電性絕緣之半導體裝置之製造方法。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code|symbol is attached|subjected to the same or a corresponding part, and the repeated description is abbreviate|omitted. As shown in FIG. 1 , the semiconductor device 1 includes a semiconductor substrate 2 having a first surface 2a and a second surface 2b facing each other. The semiconductor device 1 is an optical device such as a silicon photodiode. In the semiconductor device 1, for example, in a specific region on the first surface 2a side in the semiconductor substrate 2 including n-type silicon, a p-type region 2c to which p-type impurities are selectively diffused is provided. On the first surface 2 a of the semiconductor substrate 2 , the first wiring 3 including, for example, aluminum is provided through the oxide film 4 . An opening 4a is formed in a portion of the oxide film 4 corresponding to the pad portion 3a of the first wiring 3 . An opening 4b is formed in a portion of the oxide film 4 corresponding to the end of the p-type region 2c. The first wiring 3 is electrically connected to the p-type region 2c through the opening 4b. In addition, instead of the oxide film 4, an insulating film made of SiN or other insulating materials may be provided. On the first surface 2a of the semiconductor substrate 2, a light-transmitting substrate 5 including a light-transmitting material such as glass is disposed. The semiconductor substrate 2 and the light-transmitting substrate 5 are optically and physically connected by an adhesive layer 6 containing an optical adhesive. In the semiconductor device 1 , light is incident on the p-type region 2 c through the light-transmitting substrate 5 and the bonding layer 6 . In addition, the thickness of the semiconductor substrate 2 is smaller (thinner) than the thickness of the light transmitting substrate 5 . As an example, the thickness coefficient of the semiconductor substrate 2 is about ten μm, and the thickness coefficient of the light-transmitting substrate 5 is about one hundred μm. In the semiconductor substrate 2, through-holes 7 extending from the first surface 2a to the second surface 2b are formed. The first opening 7 a of the through hole 7 is located on the first surface 2 a of the semiconductor substrate 2 , and the second opening 7 b of the through hole 7 is located on the second surface 2 b of the semiconductor substrate 2 . The first opening 7 a is continuous with the opening 4 a of the oxide film 4 , and is covered by the pad portion 3 a of the first wiring 3 . The inner surface 7c of the through hole 7 is a tapered surface that expands from the first surface 2a toward the second surface 2b. For example, the through hole 7 is formed in a quadrangular frustum shape that expands from the first surface 2a toward the second surface 2b. In addition, when viewed from a direction parallel to the center line CL of the through-line 7, the edge of the first opening 7a of the through-hole 7 and the edge of the opening 4a of the oxide film 4 do not necessarily coincide. For example, the edge of the opening 4a of the oxide film 4 The edge may be located inside with respect to the edge of the first opening 7 a of the through hole 7 . The aspect ratio of the through hole 7 is 0.2-10. The aspect ratio is calculated by dividing the depth of the through hole 7 (the distance between the first opening 7a and the second opening 7b) by the width of the second opening 7b (when the second opening 7b is rectangular, it is the pair of the second opening 7b). The distance between the sides is the value of the diameter of the second opening 7b when the second opening 7b is circular. As an example, the depth of the through hole 7 is 30 μm, and the width of the second opening 7b is 130 μm. In this case, the aspect ratio is 0.23. A resin insulating layer 10 is provided on the inner surface 7c of the through hole 7 and the second surface 2b of the semiconductor substrate 2 . The resin insulating layer 10 is continuous through the second opening 7 b of the through hole 7 . The resin insulating layer 10 reaches the pad portion 3a of the first wiring 3 through the opening 4a of the oxide film 4 inside the through hole 7 , and has an opening 10a on the first surface 2a side of the semiconductor substrate 2 . On the surface 10b of the resin insulating layer 10 (surface opposite to the inner surface 7c of the through hole 7 and the second surface 2b of the semiconductor substrate 2), the second wiring 8 made of, for example, aluminum is provided. The second wiring 8 is electrically connected to the pad portion 3 a of the first wiring 3 in the opening 10 a of the resin insulating layer 10 . Furthermore, on the surface 10b of the resin insulating layer 10 (surface on the opposite side to the second surface 2b of the semiconductor substrate 2), a third wiring 22 made of, for example, aluminum is provided. The third wiring 22 is electrically connected to the second surface 2b of the semiconductor substrate 2 in the opening 10c formed in the resin insulating layer 10 . The second wiring 8 and the third wiring 22 are covered with a resin protective layer 21 . A shallow concave portion 21a having a smooth inner surface is formed in a portion of the resin protective layer 21 corresponding to the through hole 7 . In a portion of the resin protective layer 21 corresponding to the pad portion 8a of the second wiring 8, an opening 21b for exposing the pad portion 8a is formed. In a portion of the resin protective layer 21 corresponding to the pad portion 22a of the third wiring 22, an opening 21c for exposing the pad portion 22a is formed. In the opening 21 b of the resin protective layer 21 , a bump electrode, that is, an extraction electrode 9 is disposed. The extraction electrode 9 is electrically connected to the pad portion 8 a of the second wiring 8 . In the opening 21 c of the resin protective layer 21 , a bump electrode, that is, an extraction electrode 23 is disposed. The extraction electrode 23 is electrically connected to the pad portion 22 a of the third wiring 22 . The semiconductor device 1 is mounted on a circuit board via the extraction electrode 9 and the extraction electrode 23, and the extraction electrode 9 and the extraction electrode 23 function as an anode electrode and a cathode electrode, respectively. In addition, instead of the resin protective layer 21, a protective layer containing other insulating materials (eg, an oxide film, a nitride film, etc.) may be provided. In addition, the thickness of the resin protective layer 21 may be the same as the thickness of the resin insulating layer 10 , or may be smaller than the thickness of the resin insulating layer 10 . In particular, when the thickness of the resin protective layer 21 is approximately the same as the thickness of the resin insulating layer 10, the stress acting on the second wiring 8 and the third wiring 22 can be reduced. The above-mentioned resin insulating layer 10 will be described in more detail with reference to FIG. 2 . In addition, in FIG. 2, the light transmission board|substrate 5, the adhesive layer 6, and the resin protective layer 21 are abbreviate|omitted. As shown in FIG. 2 , the surface 10 b of the resin insulating layer 10 includes: a first region 11 , which reaches the first opening 7 a inside the through hole 7 ; and a second region 12 , which reaches the first opening 7 a inside the through hole 7 . 2 openings 7 b ; and a third region 13 , which faces the second surface 2 b of the semiconductor substrate 2 on the outside of the through hole 7 . The first region 11 is a tapered region that expands from the first surface 2a of the semiconductor substrate 2 to the second surface 2b. The first region 11 has an average inclination angle α. The average inclination angle α of the first region 11 refers to the plane including the center line CL of the through hole 7, when focusing on the region on one side of the center line CL, the intersection of the plane and the first region 11 is relative to the plane. The average value of the angle formed by the first surface 2a. When the intersection line is a straight line, the angle formed by the straight line and the first surface 2 a becomes the average inclination angle α of the first region 11 . When the intersection line is a curved line, the average value of the angle formed by the line of the curved line and the first surface 2 a becomes the average inclination angle α of the first region 11 . The average inclination angle α of the first region 11 is larger than 0° and smaller than 90°. The second region 12 is a tapered region that expands from the first surface 2a of the semiconductor substrate 2 to the second surface 2b. The second region 12 has an average inclination angle β. The average inclination angle β of the second region 12 is the plane including the center line CL of the through hole 7, when focusing on the region on one side of the center line CL, the intersection of the plane and the second region 12 is relative to the plane. The average value of the angle formed by the first surface 2a. When the intersection line is a straight line, the angle formed by the straight line and the first surface 2 a becomes the average inclination angle β of the second region 12 . When the intersection line is a curved line, the average value of the angle formed between the line of the curved line and the first surface 2 a becomes the average inclination angle β of the second region 12 . The average inclination angle β of the second region 12 is larger than 0° and smaller than 90°. The average inclination angle β of the second region 12 is smaller than the average inclination angle α of the first region 11 . That is, the second region 12 is a region having a gentler inclination than the first region 11 . In addition, the average inclination angle β of the second region 12 is smaller than the average inclination angle γ of the inner surface 7 c of the through hole 7 . That is, the second region 12 is a region having a gentler inclination than the inner surface 7c of the through hole 7 . In this embodiment, the average inclination angle α of the first region 11 is closer to the average inclination angle γ of the inner surface 7 c of the through hole 7 than the average inclination angle β of the second region 12 . Here, the average inclination angle α of the first region 11 > the average inclination angle γ of the inner surface 7 c of the through hole 7 > the average inclination angle β of the second region 12 . The so-called average inclination angle γ of the inner surface 7c of the through hole 7 is the intersection of the plane and the inner surface 7c when looking at the area on one side of the center line CL with respect to the plane including the center line CL of the through hole 7 The average value of the angle formed with respect to the 1st surface 2a. When the intersection line is a straight line, the angle formed by the straight line and the first surface 2a becomes the average inclination angle γ of the inner surface 7c of the through hole 7 . When the intersecting line is a curved line, the average value of the angle formed between the line of the curved line and the first surface 2 a becomes the average inclination angle γ of the inner surface 7 c of the through hole 7 . The surface 10b of the resin insulating layer 10 further includes: a fourth region 14 having a convex maximum curvature on the side opposite to the inner surface 7c of the through hole 7 ; and a fifth region 15 along the second opening of the through hole 7 The edge of 7b. The so-called maximum curvature of the lateral convexity opposite to the inner surface 7c of the through hole refers to the case where the plane including the center line CL of the through line 7 is focused on the region on one side of the center line CL, and the plane and the surface The maximum value of the curvature of the portion that is convexly curved toward the side opposite to the inner surface 7c of the through hole 7 among the intersection lines of 10b. In addition, the first region 11 is closer to the first opening 7a side of the through hole 7 (and the center of the through hole 7) than the fourth region 14 in the surface 10b of the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 The area on the side of the first opening 7a) in the direction parallel to the line CL. The second region 12 is provided on the surface 10b of the resin insulating layer 10 on the inner surface 7c of the through hole 7 and is closer to the second opening 7b of the through hole 7 than the fourth region 14 (parallel to the center line CL of the through hole 7 ) The region (ie, the region between the fourth region 14 and the fifth region 15) in the direction of the second opening 7b side). The fourth region 14 is curved so as to be continuously connected with the first region 11 and the second region 12 . That is, the fourth region 14 is a curved surface with rounded corners, and connects the first region 11 and the second region 12 smoothly. Here, assuming that the fourth region 14 does not exist, and the first region 11 is extended toward the second surface 2b side of the semiconductor substrate 2, and the second region 12 is extended toward the first surface 2a side of the semiconductor substrate 2, the The first region 11 and the second region 12 form an intersection (corner, bent portion). The fourth region 14 corresponds to a curved surface formed when the intersection line (corner, curved portion) is R-chamfered. The fourth area 14 is a plane including the center line CL of the through hole 7, when looking at the area on one side of the center line CL, the intersection of the plane and the surface 10b corresponds to the first area 11. Between the part and the part corresponding to the second region 12 , the part that is convexly curved toward the side opposite to the inner surface 7 c of the through hole 7 . The fifth region 15 is curved so as to continuously connect the second region 12 and the third region 13 . That is, the fifth region 15 is a curved surface with rounded corners, and connects the second region 12 and the third region 13 smoothly. Here, assuming that the fifth region 15 does not exist, and the second region 12 is extended toward the second surface 2b side of the semiconductor substrate 2, and the third region 13 is extended toward the center line CL of the through hole 7, the second The area 12 and the third area 13 form an intersection (corner, curved portion, etc.). The fifth region 15 corresponds to a curved surface formed when the intersection line (corner, curved portion, etc.) is R-chamfered. The fifth area 15 is a portion corresponding to the second area 12 in the intersection of the plane and the surface 10b when looking at the area on one side of the center line CL with respect to the plane including the center line CL of the through hole 7 Between the portion corresponding to the third region 13, the portion that is convexly curved toward the side opposite to the edge of the second opening 7b of the through-hole 7. In this embodiment, the 1st area|region 11, the 4th area|region 14, and the 5th area|region 15 are the curved surfaces curved convexly toward the side opposite to the inner surface 7c of the through-hole 7. The second region 12 is a convexly curved surface on the inner surface 7c side of the through hole 7 (ie, a concavely curved surface when viewed from the side opposite to the inner surface 7c of the through hole 7). The third region 13 is a plane substantially parallel to the second surface 2 b of the semiconductor substrate 2 . As described above, the fourth region 14 is bent so as to continuously connect the first region 11 and the second region 12 , and the fifth region 15 is bent so as to continuously connect the second region 12 and the third region 13 Therefore, the surface 10b of the resin insulating layer 10 becomes a continuous surface (there is no discontinuous part such as a surface-to-surface intersection (corner, curved part, etc.), and the regions 11, 12, 13, 14, and 15 are smoothly connected. noodle). The average thickness of the resin insulating layer 10 provided on the inner surface 7 c of the through hole 7 is greater than the average thickness of the resin insulating layer 10 provided on the second surface 2 b of the semiconductor substrate 2 . The average thickness of the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 is the average value of the thickness of the resin insulating layer 10 in the direction perpendicular to the inner surface 7c. The average thickness of the resin insulating layer 10 provided on the second surface 2b of the semiconductor substrate 2 is the average thickness of the resin insulating layer 10 in the direction perpendicular to the second surface 2b. In the direction parallel to the first surface 2a and the second surface 2b of the semiconductor substrate 2, the average thickness of the portion of the resin insulating layer 10 corresponding to the first region 11 is larger than that of the resin insulating layer 10 corresponding to the second region 12 The average thickness of the part is large. In the direction parallel to the first surface 2a and the second surface 2b of the semiconductor substrate 2, the average thickness of the part corresponding to the first region 11 in the resin insulating layer 10 is the first region 11 and the first region 11 in the direction. The average value of the distances between the inner surfaces 7c of the through holes 7. In the direction parallel to the first surface 2a and the second surface 2b of the semiconductor substrate 2, the average thickness of the part corresponding to the second region 12 in the resin insulating layer 10 is the second region 12 and the through hole in the direction. 7 is the average of the distances from the inner surface 7c. In the resin insulating layer 10 , the first region 11 is provided on the surface of the portion having the height H from the first surface 2 a of the semiconductor substrate 2 in the resin insulating layer 10 of the inner surface 7 c of the through hole 7 . The height H is equal to or less than 1/2 of the sum D of the thickness of the semiconductor substrate 2 (that is, the distance between the first surface 2a and the second surface 2b ) and the average thickness of the resin insulating layer 10 provided on the second surface 2b of the semiconductor substrate 2 . In the resin insulating layer 10, the surface S passing through the edge of the opening 10a of the resin insulating layer 10 and the edge of the second opening 7b of the through hole 7 is set as the boundary surface. The volume of the part P1 on the side of the surface 7c and the part P2 on the side opposite to the inner surface 7c of the through hole 7 with respect to the surface S is larger than that of the part P2. Furthermore, in the resin insulating layer 10 , the area of the triangle T1 is larger than the area of the triangle T2 when the area on one side of the center line CL is focused on the plane including the center line CL of the through hole 7 . The triangle T1 is in the plane including the center line CL of the through hole 7 (ie, in the cross section of FIG. 2 ), and the edge of the first opening 7 a of the through hole 7 , the edge of the second opening 7 b of the through hole 7 , and The edge of the opening 10a of the resin insulating layer 10 is set as the triangle of the vertex. The triangle T2 is in the plane including the center line CL of the through hole 7 (that is, in the cross section of FIG. 2 ), and the edge of the opening 10a of the resin insulating layer 10 , the edge of the second opening 7b of the through hole 7 , and the fourth The top of the area 14 is set as the vertex of the triangle. The resin insulating layer 10 has a first curved portion 101 , a second curved portion 102 , and a third curved portion 103 . The first curved portion 101 covers the inner surface 7c of the through hole 7 between the first opening portion 7a and the second opening portion 7b. The second curved portion 102 covers the edge of the second opening 7b of the through hole 7 (ie, the intersection of the second surface 2b of the semiconductor substrate 2 and the inner surface 7c of the through hole). The second curved portion 102 is formed so as to straddle the second surface 2b of the semiconductor substrate 2 and the inner surface 7c of the through hole. In this embodiment, regardless of whether the shape of the edge of the second opening 7b is a rectangle or a circle, the edge of the second opening 7b does not become a chamfered state, but becomes a corner (edge). The second curved portion 102 covers this corner. The third curved portion 103 covers the inner surface 7c of the through hole 7 between the first curved portion 101 and the second curved portion 102 . The first curved portion 101 and the third curved portion 103 are separated from each other, and the second curved portion 102 and the third curved portion 103 are separated from each other. The surface 10b of the resin insulating layer 10 of the first curved portion 101 (corresponding to the fourth region 14 in this embodiment) is convexly curved toward the side opposite to the inner surface 7c of the through hole 7 . The surface 10b of the resin insulating layer 10 of the second curved portion 102 (corresponding to the fifth region 15 in this embodiment) is convexly curved toward the side opposite to the inner surface 7c of the through hole 7 . The surface 10b of the resin insulating layer 10 of the third curved portion 103 (corresponding to the second region 12 in this embodiment) is convexly curved toward the inner surface 7c of the through hole 7 (that is, if When viewed from the opposite side of the inner surface 7c, it is concavely curved). The curvature of the surface 10b of the resin insulating layer 10 of the first curved portion 101 and the curvature of the surface 10b of the resin insulating layer 10 of the second curved portion 102 are different from each other. The convex curvature to the side opposite to the inner surface 7c of the through hole 7 refers to the case where the plane including the center line CL of the through hole 7 is focused on a region on one side of the center line CL, and the plane is the same as the center line CL. The intersection line of the surfaces 10b is convexly curved toward the side opposite to the inner surface 7c of the through hole 7 . The convex curvature toward the inner surface 7c of the through hole 7 refers to the difference between the plane and the surface 10b when looking at the area on one side of the center line CL with respect to the plane including the center line CL of the through hole 7. The intersection line is convexly curved toward the inner surface 7 c side of the through hole 7 . As shown in FIG. 3 , when viewed from a direction parallel to the center line CL of the through hole 7 , the outer edge of the second wiring 8 is positioned outside the second opening 7 b of the through hole 7 . That is, the outer edge of the second wiring 8 is the surface on the opposite side to the second surface 2b of the semiconductor substrate 2 among the surfaces 10b of the resin insulating layer 10 . In addition, in FIG. 3, the resin insulating layer 10 is shown by a dotted line, and the 2nd wiring 8 is shown by the two-dot chain line. When the through hole 7 is formed in the shape of a quadrangular pyramid that expands from the first surface 2a toward the second surface 2b, the surface 10b of the resin insulating layer 10 in the second curved portion 102 (in this embodiment, corresponds to the first surface 10b) 5 area 15), when viewed in a direction parallel to the center line CL of the through hole 7, compared with the distance from each side of the second opening 7b of the through hole 7 to the surface 10b, the distance from the second opening 7b of the through hole 7 to the surface 10b 2. The distance from each corner of the opening 7b to the surface 10b is relatively large. As a result, the second curved portion 102 has a more gentle curved surface at each corner of the second opening 7b of the through hole 7, so that the edge of the second opening 7b of the through hole 7 can be reliably suppressed from being exposed, and more reliable The occurrence of current leakage between the second wiring 8 and the semiconductor substrate 2 is suppressed. Further, in the surface 10b of the resin insulating layer 10 of the first bent portion 101 (corresponding to the fourth region 14 in this embodiment), when viewed from a direction parallel to the center line CL of the through hole 7, The distance from each corner of the first opening 7a of the through hole 7 to the surface 10b is larger than the distance from each side of the first opening 7a of the through hole 7 to the surface 10b. Furthermore, when viewed from a direction parallel to the center line CL of the through-hole 7, the surface 10b (corresponding to the fifth region 15 in this embodiment) of the resin insulating layer 10 of the second curved portion 102 and the 2. The distance between the surface 10b of the resin insulating layer 10 of the bent portion 102 (corresponding to the fifth region 15 in this embodiment) is compared with the distance between the sides of the first opening 7a of the through-hole 7. The distance at each corner of the first opening 7a of 7 is larger. Thereby, although the corners (valleys) of the quadrangular pyramid-shaped through-holes 7 are the portions where the insulating film is further thinned, the thickness of the resin insulating layer 10 can be sufficiently secured in the corners (valleys). As described above, in the semiconductor device 1 , the resin insulating layer 10 has the second curved portion 102 covering the edge of the second opening 7 b of the through hole 7 , and the surface 10 b of the second curved portion 102 faces into the through hole 7 The opposite side of the surface 7c is convexly curved. Thereby, the surface 10b of the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 and the surface 10b of the resin insulating layer 10 provided on the second surface 2b of the semiconductor substrate 2 are smoothly connected. Therefore, the disconnection of the second wiring 8 in the portion of the second opening 7b of the through-hole 7 can be prevented at the time of manufacture or after manufacture. Furthermore, the resin insulating layer 10 has a first curved portion 101 covering the inner surface 7c of the through hole 7 between the first opening 7a and the second opening 7b, and the surface 10b of the first curved portion 101 faces the inner surface of the through hole 7 The opposite side of 7c is convexly curved. Thereby, even when the diameter of the through hole 7 is reduced, for example, the width of the opening 10a of the resin insulating layer 10 on the first surface 2a side of the semiconductor substrate 2 can be sufficiently ensured. Therefore, the disconnection of the first wiring 3 and the second wiring 8 in the portion of the opening 10a of the resin insulating layer 10 can be prevented at the time of manufacture or after manufacture. Therefore, according to the semiconductor device 1, the electrical connection of the semiconductor substrate 2 via the through-hole 7 can be secured. In the semiconductor device 1, the resin insulating layer 10 further has a third curved portion 103 covering the inner surface 7c of the through hole 7 between the first curved portion 101 and the second curved portion 102, and the surface 10b of the third curved portion 103 faces The inner surface 7c side of the through hole 7 is convexly curved. Thereby, for example, even if some external force acts from the second opening 7b side of the through hole 7 to the first opening 7a side, the third curved portion 103 can function as a buffer region. Therefore, the stress generated at the connecting portion of the first wiring 3 and the second wiring 8 can be reduced, and the disconnection of the first wiring 3 and the second wiring 8 can be prevented more reliably. In the semiconductor device 1, the average thickness of the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 is larger than the average thickness of the resin insulating layer 10 provided on the second surface 2b. Thereby, even when the semiconductor substrate 2 is thinned, for example, the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 can function as a reinforcing layer, so that the strength of the peripheral portion of the through hole 7 can be sufficiently ensured . In addition, the average inclination angle of the first region 11 and the average inclination angle of the second region 12 can be set to desired angles, and the surface 10b can be obtained as a continuous surface (there is no surface-to-surface intersection (angle, curved portion, etc.) ) and other discontinuous parts, the regions 11, 12, 13, 14, 15 are the surfaces that are smoothly connected) of the resin insulating layer 10. In the case where, for example, the resin insulating layer 10 is formed with a uniform thickness along the inner surface 7c of the through hole 7, it is impossible to obtain the resin insulating layer 10 in which the surface 10b becomes a continuous surface. In the semiconductor device 1, the inner surface 7c of the through hole 7 is a tapered surface that expands from the first surface 2a toward the second surface 2b. In this case, the electrical connection of the semiconductor substrate 2 via the through hole 7 can also be confirmed. In the semiconductor device 1, the first region 11 reaching the first opening 7a of the through hole 7 and the second region 12 reaching the second opening 7b of the through hole 7 in the surface 10b of the resin insulating layer 10 are formed from A tapered region in which the first surface 2a of the semiconductor substrate 2 expands toward the second surface 2b. Then, the average inclination angle of the second region 12 is smaller than the average inclination angle of the inner surface 7 c of the through hole 7 . Therefore, the angle formed by the third region 13 facing the second surface 2b of the semiconductor substrate 2 and the second region 12 reaching the second opening 7b of the through hole 7 in the surface 10b of the resin insulating layer 10 is relatively The angle formed between the second surface 2b of the semiconductor substrate 2 and the inner surface 7c of the through hole 7 is large (ie, gentle). Therefore, the disconnection of the second wiring 8 in the portion of the second opening 7b of the through-hole 7 is prevented at the time of manufacture or after manufacture. Moreover, compared with the case where the resin insulating layer 10 is formed with a uniform thickness along the inner surface 7c of the through hole 7, the inclination of the second region 12 is gentler, so that the second wiring 8 can be easily and surely formed. Furthermore, since the second wiring 8 can be formed independently of the shape of the inner surface 7c of the through-hole 7, for example, when a sharp portion remains on the inner surface 7c of the through-hole 7, it can also be prevented from being caused by such a portion. The disconnection of the second wiring 8. In addition, the average inclination angle of the second region 12 is smaller than the average inclination angle of the first region 11 . In other words, the average inclination angle of the first region 11 reaching the first opening 7 a of the through hole 7 is larger than the average inclination angle of the second region 12 . Thereby, when the diameter of the through hole 7 is reduced, for example, the width of the opening 10a of the resin insulating layer 10 on the side of the first surface 2a of the semiconductor substrate 2 can be sufficiently ensured. Therefore, the disconnection of the first wiring 3 and the second wiring 8 in the portion of the opening 10a of the resin insulating layer 10 can be prevented at the time of manufacture or after manufacture. Furthermore, on the surface 10b of the resin insulating layer 10, the fourth region 14 is bent so as to continuously connect the first region 11 and the second region 12, and the fifth region 15 is formed to connect the second region 12 and the third region 13 Bends in a way that is continuously connected. Therefore, the disconnection of the 2nd wiring 8 in the whole area|region of the surface 10b of the resin insulating layer 10 is prevented at the time of manufacture or after manufacture. Especially after manufacture, since the stress concentration can be relieved in the whole area of the surface 10b of the resin insulating layer 10, it is effective for preventing the disconnection of the 2nd wiring 8. As shown in FIG. As described above, according to the semiconductor device 1, the electrical connection of the semiconductor substrate 2 through the through hole 7 can be secured. In the semiconductor device 1, the surface 10b of the resin insulating layer 10 is a continuous surface (there are no discontinuous parts such as surface-to-surface intersections (corners, curved parts, etc.), and the regions 11, 12, 13, 14, and 15 are smoothly connected faces). Thereby, the stress concentration can be alleviated, and disconnection of the second wiring 8 can be prevented. In the semiconductor device 1 , the average inclination angle of the first region 11 is closer to the average inclination angle of the inner surface 7 c of the through hole 7 than the average inclination angle of the second region 12 . As a result, the opening 10a having a sufficient width for exposing the pad portion 3a of the first wiring 3 can be obtained. As a result, the opening 10a of the resin insulating layer 10 can be reliably prevented both during and after manufacture. Part of the first wiring 3 and the second wiring 8 are disconnected. In the semiconductor device 1 , the average inclination angle α of the first region 11 > the average inclination angle γ of the inner surface 7 c of the through hole 7 > the average inclination angle β of the second region 12 . Thereby, the disconnection of the 2nd wiring 8 can be prevented, and the opening 10a which has a sufficient width for exposing the pad part 3a of the 1st wiring 3 can be obtained. In the semiconductor device 1, in the direction parallel to the first surface 2a and the first surface 2b of the semiconductor substrate 2, the average thickness of the portion of the resin insulating layer 10 corresponding to the first region 11 is larger than that of the resin insulating layer 10 and The portion corresponding to the second region 12 has a large average thickness. Thereby, the resin insulating layer 10 which has a shape which is hard to generate|occur|produce the disconnection of the 2nd wiring 8 and the disconnection of the 1st wiring 3 and the 2nd wiring 8 can be obtained. In the semiconductor device 1, for example, even if an overhang or the like remains on the edge of the second opening 7b of the through hole 7, the overhang or the like is covered by the resin insulating layer 10, and the fifth region 15, which is a convexly curved curved surface, remains. The second wiring 8 is provided. Thereby, the disconnection of the 2nd wiring 8 in the 2nd opening 7b part of the through-hole 7 can be prevented reliably. In the semiconductor device 1, the resin insulating layer 10 provided on the inner surface 7c of the through-hole 7 has 1/2 of the sum D of the thickness of the resin insulating layer 10 provided on the semiconductor substrate 2 and the average thickness of the resin insulating layer 10 on the second surface 2b. The surface of the part of the following height H becomes the 1st area|region 11. As a result, the first region 11 and the second region 12 can be smoothly connected on the surface 10b of the resin insulating layer 10, and the second wiring 8 at the boundary between the first region 11 and the second region 12 can be reliably prevented from disconnected. In the resin insulating layer 10 of the semiconductor device 1, the surface S passing through the edge of the opening 10a of the resin insulating layer 10 and the edge of the second opening 7b of the through hole 7 is set as the boundary surface. The volume of the part P1 on the inner surface 7c side of the hole 7 and the part P2 on the side opposite to the inner surface 7c of the through hole 7 with respect to the surface S is larger than that of the part P2. Moreover, if the plane including the center line CL of the through hole 7 is focused on the area on one side of the center line CL, the area of the triangle T1 is larger than the area of the triangle T2. By doing so, in the surface 10b of the resin insulating layer 10, the first region 11 and the second region 12 can be smoothly connected, and the second region at the boundary between the first region 11 and the second region 12 can be reliably prevented. Disconnection of wiring 8. In the semiconductor device 1 , the surface 10 b of the resin insulating layer 10 provided on the inner surface 7 c of the through hole 7 has a convex maximum curvature on the opposite side to the inner surface 7 c of the through hole 7 and is closer than the fourth region 14 The region on the side of the first opening 7 a becomes the first region 11 , and the region closer to the second opening 7 b than the fourth region 14 becomes the second region 12 . Such a shape of the resin insulating layer 10 is particularly effective in securing the electrical connection of the semiconductor substrate 2 via the through holes 7 . Next, a method of manufacturing the above-mentioned semiconductor device 1 will be described with reference to FIGS. 4 to 9 in general. First, as shown in FIG. 4( a ), the p-type region 2 c is formed on the semiconductor substrate 2 , and the oxide film 4 and the first wiring 3 are provided on the first surface 2 a of the semiconductor substrate 2 (first step). Next, as shown in FIG. 4( b ), a light-transmitting substrate (supporting substrate) 5 is mounted on the first surface 2 a of the semiconductor substrate 2 via the adhesive layer 6 (second step). Next, as shown in FIG. 5( a ), by polishing the second surface 2 b of the semiconductor substrate 2 on which the light-transmitting substrate 5 is mounted (that is, by removing the portion on the side of the second surface 2 b of the semiconductor substrate 2 ), The semiconductor substrate 2 can be thinned so that the thickness of the semiconductor substrate 2 is smaller than the thickness of the light-transmitting substrate 5 (third step). In this way, by reducing the thickness of the semiconductor substrate 2, the through-hole 7 can be easily formed in the subsequent steps. In addition, even in the completed semiconductor device 1, the response speed can be improved. Next, as shown in FIG. 5( b ), through-holes 7 are formed in the semiconductor substrate 2 by anisotropic wet etching, and further, as shown in FIG. 6( a ), in the oxide film 4 A portion corresponding to the pad portion 3 a of the first wiring 3 is removed, and an opening 4 a is formed in the oxide film 4 . Thereby, the pad part 3a of the 1st wiring 3 is exposed to the 1st opening 7a of the through-hole 7 (4th step). In addition, when viewed from a direction parallel to the center line CL of the through hole 7, it is not necessary to form the oxide film 4 so that the edge of the first opening 7a of the through hole 7 is aligned with the edge of the opening 4a of the oxide film 4 The opening 4a may be formed in the oxide film 4 such that the edge of the opening 4a of the oxide film 4 is located inward with respect to the edge of the first opening 7a of the through hole 7, for example. Next, a positive-type first resin material having a viscosity of 10 cp or more is prepared, and a dip coating method is performed using the first resin material (the object is immersed in the resin paint, the object is sucked up from the resin paint, and thereby A method of forming a resin layer for an object), as shown in FIG. 6( b ), a resin insulating layer 10 is provided on the inner surface 7c of the through hole 7 and the second surface 2b of the semiconductor substrate 2 (5th step). Thereby, in the resin insulating layer 10, the recessed part 17 which follows the inner surface of the 2nd area|region 12, the 3rd area|region 13, and the 5th area|region 15 is formed. Moreover, the 1st resin material is also adhered to the surface on the opposite side to the semiconductor substrate 2 of the light-transmitting substrate 5, and the resin layer 100 is formed. Moreover, as a 1st resin material, a phenol resin, a polyimide resin, an epoxy resin, etc. can be used, for example. Next, as shown in FIG. 7( a ), using a mask (not shown), the resin insulating layer 10 is irradiated with light only on the portion corresponding to the contact hole 16 and the portion corresponding to the opening 10 c , and only The other parts are exposed. Furthermore, light is also irradiated to the resin layer 100 (refer FIG.6(b)), and the resin layer 100 is also exposed. Then, the portion corresponding to the contact hole 16 and the portion corresponding to the opening 10c, and the resin layer 100 are developed in the resin insulating layer 10, thereby forming the contact hole 16 and the opening 10c in the resin insulating layer 10, and removing the resin layer 100 (ie, the first resin material attached to the surface of the light-transmitting substrate 5 on the opposite side to the semiconductor substrate 2). Thereby, the pad portion 3a of the first wiring 3 is exposed in the opening 10a of the resin insulating layer 10, and a part of the second surface 2b of the semiconductor substrate 2 is exposed in the opening 10c of the resin insulating layer 10 (6th step). In addition, when forming the contact hole 16, an ashing process etc. may be used together. During exposure, a gap is formed by the recess 17 formed in the resin insulating layer 10 between the light transmitting portion of the mask (not shown) and the portion of the resin insulating layer 10 corresponding to the contact hole 16 . Thereby, the light is diffracted and irradiated to the resin insulating layer 10 . Therefore, at the time of development, contact holes 16 having the first region 11 and the inner surface of the second region 12 are formed following the tapered shape extending from the first surface 2a to the second surface 2b of the semiconductor substrate 2 . Next, as shown in FIG. 7( b ), sputtering is performed using, for example, aluminum, whereby the second wiring 8 and the third wiring 22 are provided on the surface 10 b of the resin insulating layer 10 , and the openings in the resin insulating layer 10 are formed. In 10a, the first wiring 3 and the second wiring 8 are electrically connected, and the third wiring 22 and the second surface 2b of the semiconductor substrate 2 are electrically connected in the opening 10c of the resin insulating layer 10 (7th step). At this time, since the contact hole 16 has the inner surface of the first region 11 following the tapered shape expanding from the first surface 2a to the second surface 2b of the semiconductor substrate 2, the metal film is also reliably formed on the inner surface, and further, The first wiring 3 and the second wiring 8 are securely connected in the opening 10 a of the resin insulating layer 10 . Next, a positive-type second resin material having a viscosity of 10 cp or more is prepared, and by using the second resin material, a dip coating method is performed, as shown in FIG. 8( a ), to cover the second wiring 8 In the form of the third wiring 22, the resin protective layer 21 is provided on the surface 10b of the resin insulating layer 10 (the eighth step). Thereby, the concave portion 21 a is formed in the resin protective layer 21 . In addition, the second resin material is also attached to the surface of the light-transmitting substrate 5 on the side opposite to the semiconductor substrate 2 to form the resin layer 210 . Moreover, as a 2nd resin material, a phenol resin, a polyimide resin, an epoxy resin, etc. can be used, for example. Next, as shown in FIG. 8( b ), a mask (not shown) is used to cover only the portion corresponding to the pad portion 8 a of the second wiring 8 and the third wiring 22 in the resin protective layer 21 . The portion corresponding to the pad portion 22a is irradiated with light, and only the portion thereof is exposed. Furthermore, light is also irradiated to the resin layer 210 (refer FIG. 8 (a)), and the resin layer 210 is exposed. Then, in the resin protective layer 21 , the portion corresponding to the pad portion 8 a of the second wiring 8 , the portion corresponding to the pad portion 22 a of the third wiring 22 , and the resin layer 210 are developed, whereby the resin protective layer 21 is developed. The openings 21b and 21c are formed, and the resin layer 210 (ie, the second resin material attached to the surface of the light-transmitting substrate 5 opposite to the semiconductor substrate 2) is removed. Thereby, the pad portion 8a of the second wiring 8 is exposed in the opening 21b of the resin protective layer 21, and the pad portion 22a of the third wiring 22 is exposed in the opening 21c of the resin protective layer 21 (9th step). Finally, the extraction electrode 9 is arranged on the pad portion 8a of the second wiring 8 which is not covered by the resin protective layer 21, and the extraction electrode 23 is arranged on the pad portion 22a of the third wiring 22 which is not covered by the resin protection layer 21. The above-mentioned semiconductor device 1. The procedure for implementing the above-mentioned dip coating method will be described in further detail. In the present embodiment, the first resin material for forming the resin insulating layer 10 is the same as the first resin material for forming the resin protective layer 21 . Therefore, the dip coating method for forming the resin insulating layer 10 and the dip coating method for forming the resin protective layer 21 are implemented as follows. In addition, each step of the above-mentioned manufacturing method of the semiconductor device 1 is performed at the wafer level, and finally, the wafer including the plurality of semiconductor devices 1 is diced to obtain each semiconductor device 1 . As shown in FIG. 9 , the resin material F stored in the container C is impregnated with a wafer W containing a portion corresponding to a plurality of semiconductor devices 1 . When the resin material F is impregnating the wafer W, a state in which the liquid level FL of the resin material F stored in the container C intersects with the first surface 2a of the semiconductor substrate 2 is maintained (in the present embodiment, the state is perpendicular to that The first surface 2a of the semiconductor substrate 2 is in a state parallel to the vertical direction). Next, the wafer W including the portion corresponding to the plurality of semiconductor devices 1 is pulled up from the resin material F stored in the container C. When the resin material F is pulled up from the wafer W, the state where the liquid level FL of the resin material F stored in the container C intersects the first surface 2a of the semiconductor substrate 2 is maintained (in this embodiment, it is perpendicular to state, that is, the state where the first surface 2a of the semiconductor substrate 2 is parallel to the vertical direction). After that, pre-baking of the resin material F coated on the wafer W is performed. It is preferable to maintain the orientation of the wafer W in the same orientation as the orientation of the semiconductor substrate 2 with respect to the resin material F during the dipping and pull-up during the pre-baking. The reason for this is as follows. That is, the reason for this is that during pre-baking, if the orientation of the wafer is changed in a different orientation than that during the dipping and pulling of the semiconductor substrate 2 with respect to the resin material F, the adhesion state of the resin material F changes. There is a possibility that the formation state of the resin insulating layer 10 and the resin protective layer 21 may vary in each through hole 7 . In addition, a detailed example of the steps of patterning each of the resin insulating layer 10 and the resin protective layer 21 is as follows. That is, the resin material is coated by the dip coating method, the above-mentioned pre-baking of the resin material is performed, the above-mentioned exposure of the resin material is performed, the drying of the resin material is performed, the above-mentioned development of the resin material is performed, and the resin material is subjected to drying. In addition, the drying of the resin material after the above-mentioned exposure of the resin material and before the development of the resin material may not be performed. As described above, in the manufacturing method of the semiconductor device 1 , the steps after the step of reducing the thickness of the semiconductor substrate 2 can be implemented in a state where the light-transmitting substrate 5 is mounted on the semiconductor substrate 2 . Thereby, damage to the peripheral portion of the through hole 7 can be prevented. Moreover, the resin insulating layer 10 is formed by implementing the dip coating method. Thereby, the resin insulating layer 10 having a sufficient thickness to ensure electrical insulation can be reliably formed. Therefore, according to the manufacturing method of the semiconductor device 1, the semiconductor substrate 2 can be reduced in thickness while preventing damage to the peripheral portion of the through hole 7, and the electrical properties between the wiring in the through hole 7 and the semiconductor substrate 2 can be ensured insulation. In the manufacturing method of the semiconductor device 1 , in each of the dip coating method for forming the resin insulating layer 10 and the dip coating method for forming the resin protective layer 21 , the method for forming the resin material is carried out as follows. F dip and pull up. That is, the semiconductor substrate 2 of the light-transmitting substrate 5 is dipped into the stored resin material F so that the liquid level FL of the stored resin material F intersects the first surface 2a of the semiconductor substrate 2, and The semiconductor substrate 2 on which the light-transmitting substrate 5 is mounted is pulled up from the accumulated resin material F so that the liquid level FL of the stored resin material F intersects the first surface 2 a of the semiconductor substrate 2 . Thereby, compared with the case where the liquid level FL of the stored resin material F is parallel to the first surface 2a of the semiconductor substrate 2, for example, the dipping and pull-up with respect to the resin material F can be reduced compared to the case where the penetration hole is reduced. The stress generated in the peripheral part of 7. Furthermore, for example, compared with the case where the dipping and pull-up with respect to the resin material F are performed in a state where the liquid level FL of the accumulated resin material F is parallel to the first surface 2a of the semiconductor substrate 2, it is possible to suppress the formation of the Air bubbles remain in the resin insulating layer 10 on the inner surface 7 c of the through hole 7 . In the manufacturing method of the semiconductor device 1, in each of the dip coating method for forming the resin insulating layer 10 and the dip coating method for forming the resin protective layer 21, the same one having a viscosity of 10 cp or more is used. resin material. By using a resin material having a viscosity of 10 cp or more, a resin insulating layer 10 having a sufficient thickness to ensure electrical insulation can be reliably formed, and a layer that can protect the second wiring 8 and the third wiring 22 can be reliably formed. Resin protective layer 21 with sufficient thickness. In addition, by using the same resin material, even if the resin insulating layer 10 and the resin protective layer 21 are deformed due to temperature changes, since the degree of deformation of the same becomes the same, it is possible to prevent the degree of deformation caused by the same from becoming too large. Differently, damage occurs in the second wiring 8 and the third wiring 222 . In addition, in the dip coating method, generally speaking, a resin material with low viscosity (such as a resin material used for water-repellent coating, etc., such as a resin material with a viscosity of 1 cp or less) is used. However, even if the dip coating method is performed using such a resin material, the resin insulating layer 10 is formed with a substantially uniform thickness along the inner surface 7 c of the through hole 7 . Therefore, in the above-mentioned manufacturing method of the semiconductor device 1, the resin insulating layer 10 having the above-mentioned shape can be easily and reliably obtained by performing the dip coating method using a resin material having a viscosity of 10 cp or more. In the manufacturing method of the semiconductor device 1, when the contact hole 16 and the opening 10c are formed in the resin insulating layer 10, the resin layer 100 (that is, the first surface attached to the surface of the light-transmitting substrate 5 opposite to the semiconductor substrate 2) is removed. Resin material). When the openings 21b and 21c are formed in the resin protective layer 21, the resin layer 210 (ie, the second resin material adhering to the surface of the light-transmitting substrate 5 opposite to the semiconductor substrate 2) is removed. Thereby, even if the light-transmitting substrate 5 is used as the support substrate, the resin layer 100 and the resin layer 210 can be removed from the support substrate, so that the support substrate can function effectively as the light-transmitting substrate 5 . In addition, it is preferable not to remove the resin layer 100 and the resin layer 210 collectively, but to remove each of the resin layer 100 and the resin layer 210 during development of each. After the development, the resin material is dried, and the resin material cannot be completely removed after the drying. Therefore, for example, the resin layer 100 is kept in a residual state, and the resin layer 100 is to be removed together with the resin layer 210 in the final step. , the resin layer 100 cannot be completely removed. Therefore, each of the resin layer 100 and the resin layer 210 is removed during the development of each. The reliable removal of the resin layer 100 and the resin layer 210 is effective when the support substrate is used as the light-transmitting substrate 5 . In addition, in the case where the support substrate is not used as the light-transmitting substrate 5 (the case where it is finally removed), if the resin layer 100 and the resin layer 210 are not reliably removed, there will be unevenness on the fixed surface during the wafer process, and the processing It also becomes unstable, and stress acts on the semiconductor substrate 2 . Therefore, the reliable removal of the resin layer 100 and the resin layer 210 is effective even in the case where the support substrate is not used as the light-transmitting substrate 5 (the case of final removal). In the manufacturing method of the semiconductor device 1, the resin protective layer 21 is formed on the surface 10b of the resin insulating layer 10 so that the 2nd wiring 8 and the 3rd wiring 22 may be covered by the dip coating method. Thereby, a shallow recess 21a having a smooth inner surface is formed in a portion of the resin protective layer 21 corresponding to the through hole 7 . Therefore, when the semiconductor device 1 is mounted on the circuit board via the extraction electrode 9 and the extraction electrode 23, and the underfill resin is filled between the semiconductor device 1 and the circuit board, the underfill resin tends to flow into the inside of the recess 21a, In addition, it is difficult for air bubbles and the like to remain inside the concave portion 21a. In the above-described manufacturing method of the semiconductor device 1 , a positive resin material is used, and the resin insulating layer 10 is provided on the inner surface 7 c of the through hole 7 and the second surface 2 b of the semiconductor substrate 2 . Then, the portions corresponding to the contact holes 16 in the resin insulating layer 10 are exposed to light and developed, thereby forming the contact holes 16 in the resin insulating layer 10 . Thereby, the resin insulating layer 10 having the above-mentioned shape can be obtained easily and reliably. In addition, at the time of exposure and development, the concave portion 17 formed in the resin insulating layer 10 reduces the thickness of the portion corresponding to the contact hole 16 in the resin insulating layer 10 (that is, since the portion corresponding to the contact hole 16 is The resin insulating layer 10 has a height H that is less than 1/2 of the sum D of the thickness of the semiconductor substrate 2 and the average thickness of the resin insulating layer 10 provided on the second surface 2b), so it is possible to easily and reliably obtain Contact holes 16 of desired shape. One embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the first opening 7a of the through hole 7 is covered by the pad portion 3a of the first wiring 3, but as long as a part of the first wiring 3 is located on the first opening 7a, the first wiring 3 The entire area of the first opening 7a may also be covered. Moreover, in the above-mentioned embodiment, the average inclination angle of the first region 11 is closer to the average inclination angle of the inner surface 7c of the through hole 7 than the average inclination angle of the second region 12, but it may be the average inclination angle of the second region 12 The angle is closer to the average inclination angle of the inner surface 7 c of the through hole 7 than the average inclination angle of the first region 11 . Further, in the above-described embodiment, the light-transmitting substrate 5 is used as the support substrate, but when the semiconductor device 1 does not include the light-transmitting substrate 5, other substrates may be used as the support substrate. When another substrate is used as the support substrate, the support substrate may be removed from the semiconductor substrate 2 after the extraction electrode 9 and the extraction electrode 23 are provided in the manufacturing step of the semiconductor device 1 . In addition, when another substrate is used as a support substrate, the resin layer 100 and the resin layer 210 adhering to the support substrate can be removed by performing the dip coating method, and can also be left. Furthermore, when another substrate is used as a support substrate, it is not necessary to use an optical adhesive as the adhesive layer 6 . Furthermore, in the above-described embodiment, when viewed from a direction parallel to the center line CL of the through hole 7, the pad portion 8a of the second wiring 8 and the extraction electrode 9 are located outside the second opening 7b of the through hole 7 Although the pad portion 8a of the second wiring 8 and the extraction electrode 9 can be sufficiently separated from the second opening 7b of the through hole 7, they are located between the surface 10b of the resin insulating layer 10 and the second portion of the semiconductor substrate 2. The surface on the opposite side of the surface 2b. However, when viewed from a direction parallel to the center line CL of the through hole 7, even if the pad portion 8a of the second electrode 8 and the extraction electrode 9 are located in the vicinity of the outer side of the second opening 7b of the through hole 7, as shown in FIG. As indicated by 10, the stress generated when the extraction electrode 9 expands due to heat or the like is dispersed in the directions of the arrows A1, A2, and A3. This is due to the bending of the side wall (inner surface) of the opening 21b of the resin protective layer 21 in which the extraction electrode 9 is provided. In addition, the surface 10b of the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 and the surface 10b of the resin insulating layer 10 provided on the second surface 2b of the semiconductor substrate 2 are smoothly connected. Furthermore, the stress acting in the direction of arrow A3 acts in the direction of arrow A4 along the second wiring 8 . Therefore, even if the pad portion 8a of the second wiring 8 and the extraction electrode 9 are located near the outer side of the second opening 7b of the through hole 7, the second wiring 8 is prevented from being disconnected near the second opening 7b of the through hole 7. If the stress acts only in the direction of the arrow A3, the opening 21b of the resin protective layer 21 will be pushed open, and there is a possibility that the second wiring 8 will be disconnected. Furthermore, as shown in FIG. 11 , the extraction electrode 9 may be disposed inside the through hole 7 so as to protrude from the second surface 2 b of the semiconductor substrate 2 . When the extraction electrode 9 is disposed inside the through hole 7, the inner surface 7c of the through hole 7 is a tapered surface that expands from the first surface 2a to the second surface 2b, so the molten metal material such as solder ( The material for forming the extraction electrode 9 ) easily flows into the inside of the through hole 7 , and it is difficult for air bubbles and the like to remain inside the through hole 7 . In addition, even if some external force acts on the extraction electrode 9 from the second opening 7b side of the through hole 7 to the first opening 7a side, for example, the resin insulating layer 10 (especially the third curved portion 103 described above) functions as a buffer region . Therefore, the stress generated in the extraction electrode 9 can be reduced, and the electrical connection between the first wiring 3, the second wiring 8, and the extraction electrode 9 can be reliably maintained. In addition, when the extraction electrode 9 is arranged inside the through hole 7, it is not necessary to lead the second wiring 8 to the outside of the second opening 7b of the through hole 7. When viewed from the direction, the outer edge of the second wiring 8 may be located inside the second opening 7 b of the through hole 7 . That is, the outer edge of the second wiring 8 may be located on the surface on the opposite side to the inner surface 7c of the through hole 7 in the surface 10b of the resin insulating layer 10 . Furthermore, as shown in FIGS. 12 and 13 , when viewed from a direction parallel to the center line CL of the through hole 7 , the outer edge of the second wiring 8 is not limited to the portion extending from the pad portion 8 a . It can be located inside the second opening 7b of the through hole 7 . That is, the outer edge of the second wiring 8 may be located on the surface opposite to the inner surface 7c of the through hole 7 in the surface 10b of the resin insulating layer 10 in addition to the portion extending from the pad portion 8a. In this case, the portion of the second wiring 8 extending only from the pad portion 8a crosses the second opening 7b of the through hole 7, so that the portion of the second opening 7b of the through hole 7 can be further reliably suppressed from being damaged. Leakage of current occurs between the second wiring 8 and the semiconductor substrate 2 . In particular, when the shape of the second opening 7b of the through-hole 7 is a rectangle, the portion of the second wiring 8 extending from the pad portion 8a is constituted by transversely cutting out the portion of the side other than the corner portion of the rectangle. Therefore, in the portion of the second opening 7 b of the through hole 7 , the leakage of the current between the second wiring 8 and the semiconductor substrate 2 can be suppressed more reliably. In addition, in FIG. 13, the resin insulating layer 10 is shown by a dotted line, and the 2nd wiring 8 is shown by the two-dot chain line. Moreover, as shown in FIG. 14, the inner surface 7c of the through hole 7 (in the case where the inner surface 7c of the through hole 7 is a curved surface such as a cylindrical surface, the tangent plane of the curved surface) may be the same as the first surface 2a. and the surface orthogonal to the second surface 2b. In this case, the electrical connection of the semiconductor substrate 2 via the through hole 7 can also be confirmed. Here, the aspect ratio of the through hole 7 is 0.2-10. As an example, the depth of the through hole 7 is 40 μm, and the width of the second opening 7b is 30 μm. In this case, the aspect ratio becomes 1.3. In addition, the through-hole 7 which has a shape of a columnar shape, a square column shape, etc. is formed by dry etching, for example. Regarding the through hole 7 shown in FIG. 14 , the average inclination angle β of the second region 12 is also smaller than the average inclination angle α of the first region 11 and smaller than the average inclination angle γ of the inner surface 7c of the through hole 7 (in this case 90°). That is, the second region 12 has a gentler inclination than the first region 11 , and has a gentler inclination than the inner surface 7 c of the through hole 7 . In addition, the average inclination angle α of the first region 11 is closer to the average inclination angle γ of the inner surface 7 c of the through hole 7 than the average inclination angle β of the second region 12 . Here, the average inclination angle γ of the inner surface 7 c of the through hole 7 > the average inclination angle α of the first region 11 > the average inclination angle β of the second region 12 . Thereby, the disconnection of the 2nd wiring 8 can be prevented, and the opening 10a which has a sufficient width for exposing the pad part 3a of the 1st wiring 3 can be obtained. In addition, the surface 10b of the resin insulating layer 10 is a continuous surface (there are no discontinuous parts such as surface-to-surface intersections (corners, curved parts, etc.), and the regions 11, 12, 13, 14, and 15 are smoothly connected. noodle). Furthermore, in the resin insulating layer 10, the surface S passing through the edge of the opening 10a of the resin insulating layer 10 and the edge of the second opening 7b of the through hole 7 is set as the boundary surface. The volume of the part P1 on the side of the inner surface 7c and the part P2 on the side opposite to the inner surface 7c of the through hole 7 with respect to the surface S is larger than that of the part P2. Furthermore, in the resin insulating layer 10, with respect to the plane including the center line CL of the through hole 7, if the area on one side of the center line CL is considered, the area of the triangle T1 is larger than the area of the triangle T2. In addition, in the direction parallel to the first surface 2a and the second surface 2b of the semiconductor substrate 2, the average thickness of the portion of the resin insulating layer 10 corresponding to the first region 11 is larger than that of the resin insulating layer 10 and the second region. The average thickness of the portion corresponding to 12 is large. In addition, the first region 11 may have the thickness of the semiconductor substrate 2 in the resin insulating layer 10 provided on the inner surface 7c of the through hole 7 and the average thickness of the resin insulating layer 10 provided on the second surface 2b of the semiconductor substrate 2 The surface 10b of the part of the height H which is less than 2/3 of the sum D (refer to FIG. 14). In this case, in the surface 10b of the resin insulating layer 10, the first region 11 and the second region 12 are gently connected, and the second wiring at the boundary between the first region 11 and the second region 12 can be reliably prevented. 8 of the disconnection. In addition, during exposure and development, the concave portion 17 formed in the resin insulating layer 10 reduces the thickness of the portion corresponding to the contact hole 16 in the resin insulating layer 10 (that is, the portion corresponding to the contact hole 16 is made of resin). In the insulating layer 10, a portion having a height H that is less than 2/3 of the sum D of the thickness of the semiconductor substrate 2 and the average thickness of the resin insulating layer 10 provided on the second surface 2b) can be easily and reliably obtained with the desired The shape of the contact hole 16. Furthermore, in the above-mentioned manufacturing method of the semiconductor device 1, a positive type resin material is used, the resin insulating layer 10 is provided on the inner surface 7c of the through hole 7 and the second surface 2b of the semiconductor substrate 2, and the resin insulating layer 10 is placed in the resin insulating layer 10. The portion corresponding to the contact hole 16 and the portion corresponding to the opening 10c are exposed and developed to form the contact hole 16 and the opening 10c in the resin insulating layer 10, but the present invention is not limited thereto. For example, a negative resin material may be used, and the resin insulating layer 10 may be provided on the inner surface 7c of the through hole 7 and the second surface 2b of the semiconductor substrate 2 . In this case, the portion of the resin insulating layer 10 corresponding to the contact hole 16 and the portion other than the portion corresponding to the opening 10 c may also be exposed, and the portion of the resin insulating layer 10 corresponding to the contact hole 16 and The portion corresponding to the opening 10 c is developed, thereby forming the contact hole 16 and the opening 10 c in the resin insulating layer 10 . Due to attenuation of light, diffraction of light, etc., the contact hole 16 in the shape of a taper that expands from the second surface 2b to the first surface 2a of the semiconductor substrate 2 can be formed only by developing, but by further performing heat treatment, etc. , a taper-shaped contact hole 16 extending from the first surface 2a of the semiconductor substrate 2 to the second surface 2b can be obtained. In the above-described embodiment, for example, in a specific region on the first surface 2a side in the semiconductor substrate 2 including n-type silicon, a p-type region 2c to which p-type impurities are selectively diffused is provided, but each conductivity type The opposite is also possible. In this case, the extraction electrode 9 and the extraction electrode 23 function as a cathode electrode and an anode electrode, respectively. Furthermore, it is not limited to forming the region of the second conductivity type (the other of the p-type and the n-type) in the semiconductor substrate 2 of the first conductivity type (one of the p-type and the n-type). A semiconductor layer of a conductivity type (one of p-type and n-type) is formed on a semiconductor substrate 2, and a semiconductor layer of the second conductivity type (the other of p-type and n-type) is formed on the substrate, and the first conductivity type can also be formed on the substrate. type (one of p-type and n-type) semiconductor layer, and a semiconductor layer of the second conductive layer (the other of p-type and n-type) is formed on the first-conductivity-type semiconductor layer. That is, it is only necessary to form a region of the second conductivity type in the region of the first conductivity type of the semiconductor substrate 2. In the above-mentioned embodiment, the semiconductor device 1 is an optical device such as a silicon photodiode, but the semiconductor device 1 is an optical device such as a silicon photodiode. The device 1 can also be other optical devices, and can also be electronic devices or the like. Moreover, in the manufacturing method of the semiconductor device 1 described above, the resin insulating layer 10 and the resin protective layer 21 are provided by implementing the dip coating method, but the present invention is not limited to this. For example, the resin insulating layer 10 and/or the resin protective layer 21 may be provided by other methods such as a lamination method using a resin sheet, a spin coating method using a resin coating, and the like. [Industrial Applicability] According to the present invention, it is possible to provide a semiconductor substrate capable of reducing the thickness of the semiconductor substrate, preventing damage to the peripheral portion of the through hole, and ensuring electrical properties between the wiring in the through hole and the semiconductor substrate. A method of manufacturing an insulated semiconductor device.
