TWI770773B - Method of manufacturing overmolding material to prevent overflow loss during high frequency or ultra-high frequency signal transmission - Google Patents

Abstract

This invention is related to a method of manufacturing overmolding material to prevent overflow loss during high frequency or ultra-high frequency signal transmission, which uses the sheet structure of high insulating ceramic material and polymer to form a low dielectric constant dielectric layer with no voids and no microporosity. Accordingly, the dielectric functional layer is used to cover the plug-in and socket of various cables or connectors to prevent overflow losses in the transmission of high-frequency signals, and to increase the practical efficiency in the overall implementation and use.

Description

Manufacturing method of plastic-coated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission

The present invention relates to a manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission, in particular to a method for coating various wire or connector plug-ins and sockets with a dielectric functional layer, so that the In the process of high-frequency signal transmission, the overflow loss of high-frequency or ultra-high-frequency electrical signal transmission can be prevented, and the utility function can be improved in its overall implementation and use.

Press, with the vigorous development of high technology, the volume of electronic passive components tends to be miniaturized, and the density per unit area is getting higher and higher, and its efficiency is continuously enhanced. The demand for product quality is increasing almost year by year.

For common electronic passive components, it is an electronic component that does not generate electricity, but consumes, stores and/or releases electricity, such as capacitors, resistors, inductors, etc. In most circuits, the Passive-like components are connected with active components to complete the operation of the overall circuit; among them, wires, connectors, etc. are generally used to connect various passive components and active components. Plastic wrap.

However, although the above-mentioned plastic materials can be widely used in the coating of various wires, connectors, etc. to achieve the expected effect of insulation, it is also found in the actual implementation process that due to the advent of the 5G high-frequency communication era, high-frequency signal During the transmission process, the general plastic material will produce a great overflow loss for high-frequency signal transmission, so that there is still room for improvement in the overall structural design.

The reason is, in view of this, the inventor, adhering to the rich experience in design, development and actual production in the related industry for many years, researches and improves the existing defects, and provides a plastic-coated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission. method, in order to achieve the purpose of better practical value.

The main purpose of the present invention is to provide a method for manufacturing a plastic-covered material to prevent overflow loss during transmission of high-frequency or ultra-high-frequency signals, which mainly uses a dielectric functional layer to cover various types of wires or plug-ins and sockets of connectors, In the process of high-frequency signal transmission, the overflow loss of ultra-high-frequency electrical signal transmission can be prevented, and the utility function can be improved in its overall implementation and use.

The main purpose and effect of the present invention to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission in the manufacturing method of the plastic-coated material are achieved by the following specific technical means:

Its main system includes the following steps:

A. Sheet-like structure: a sheet-like structure using high-insulation ceramic materials, the sheet-like structure is micron-scale and nano-scale, and the sheet-like structure has a sheet diameter of 0.5μm~10μm, so that the layer of the sheet-like structure is The number is 1 to 10 layers, so that the thickness of each layer of the sheet structure is 1 nm to 3 nm;

B. Compounding: compound the sheet structure with high molecular polymer;

C. Dielectric functional layer: A dielectric functional layer with no voids, no micropores and low dielectric constant is formed by manufacturing.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step A, the sheet-like structure of the high-insulation ceramic material is cubic or pseudocubic Any kind of crystal.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step A, the sheet diameter of the sheet-like structure is 5 μm.

The present invention is a preferred embodiment of the method for preventing overflow loss during high frequency or ultra-high frequency signal transmission.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high frequency signal transmission. Or evenly compounded with high molecular polymers.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step B, the sheet-like structure is compounded with a high molecular polymer, and a mixer is used to compound to form a slurry Either in the form of material, granulation or plastic granules.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission. The sheet-like structure of the highly insulating ceramic material accounts for at least 50% of all solids content.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission. The sheet-like structure of the highly insulating ceramic material accounts for 98% of all solids content.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high frequency or ultra-high frequency signal transmission, wherein, in step B, the slurry method is to disperse ceramic materials with a particle size of at most 60 nm with non-polar dispersion. The agent is mixed, and then ball-milled and dispersed, and the ball-mill dispersion time is at least 8 hours.

The present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step B, the ball-milling dispersion time is 10 hours.

A preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission. Mix with a non-polar dispersant, and then perform ball milling for at least 3 hours.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step B, the ceramic material has a diameter of 960nm-1100nm.

The present invention is a preferred embodiment of the method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step B, the ball-milling dispersion time is 4 hours.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing the encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step C, it is manufactured by any one of coating, blow molding, die casting, and injection molding. method to fabricate the dielectric functional layer.

A preferred embodiment of the present invention is a preferred embodiment of the method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission, wherein, in step C, the dielectric functional layer is in a plastic shape.

The preferred embodiment of the present invention is a preferred embodiment of the method for preventing overflow loss during high frequency or ultra high frequency signal transmission. The viscosity of the slurry is to form a film, and the thickness of the formed film after curing is at least 6 μm, and the initial temperature of the film during the curing process is 100°C~200°C, and the temperature is maintained for at least 1 minute.

The present invention is a preferred embodiment of the method for preventing overflow loss during high frequency or ultra-high frequency signal transmission, wherein in step C, the initial temperature of the film in the curing process is 150°C.

In order to make the technical content used in the present invention, the purpose of the invention and the effect achieved by the present invention more completely and clearly disclosed, it is explained in detail below, and please refer to the disclosed drawings and drawing numbers together:

First, please refer to the schematic diagram of the manufacturing process of the present invention in Figure 1. The present invention mainly includes the following steps:

A. Flake structure: the use of cubic or pseudo-cubic high-insulation ceramic material sheet structure, the sheet structure is micro-scale and nano-scale, and the sheet diameter of the sheet structure is 0.5μm ~ 10μm, The optimum sheet diameter is 5 μm, the number of layers of the sheet structure is 1 to 10 layers, the optimum number of layers is 1 to 3 layers, and the thickness of each layer of the sheet structure is 1 nm to 3 nm. The optimal thickness of each layer is 1.5nm~2nm;

B. Compounding: The sheet-like structure is compounded in-situ with a non-polar polymer or evenly compounded with a polymer, and then compounded by a mixer to form slurry or granulation or plastic granules. The sheet-like structure of the highly insulating ceramic material contained in the slurry or granulated or plastic granules accounts for at least 50% of all solids, and preferably 98%. The slurry system will have a particle size of at most 60nm. The ceramic material is mixed with a non-polar dispersant, and then ball-milled for dispersion. The ball-milling dispersion time is at least 8 hours, and 10 hours is the best. In addition, the slurry type can also use non-polar ceramic materials with a micron size of 110nm~1500nm. The polar dispersant is mixed, and the optimal sheet diameter is 960nm~1100nm, and then ball-milling is carried out for dispersion. The ball-milling dispersion time is at least 3 hours, and 4 hours is the best;

C. Dielectric functional layer: Then through coating or blow molding or die casting or injection molding, it forms a dielectric functional layer with no voids, no micropores and a low dielectric constant. The layer can be in the shape of a plastic body, and at the same time, the dielectric functional layer can be used in addition to the ratio of various materials according to the required functions, and can also use solvent to adjust the viscosity of the slurry according to the practical needs of coating and application, so as to form a thin film The thickness of the formed film after curing is at least 6 μm, and the initial temperature of the film during the curing process is 100°C to 200°C, the optimum temperature is 150°C, and the temperature is maintained for at least 1 minute.

In this way, please refer to the second schematic diagram of the side sectional structure of the present invention in use state, and the dielectric functional layer (1) can be applied to Type C 3.0, Type C 3.5, Type C C 4.5, etc., the coating of the wire (2), or the overmolding applied to the plug-in and socket of the connector [such as: RJ45], and the film-like dielectric function layer (1) is used in the wire (2) The contact surface has a higher duty cycle than the average insulating filler to prevent overflow loss of ultra-high frequency electrical signal transmission.

From the above, it can be seen from the description of the use and implementation of the present invention that, compared with the prior art, the present invention mainly uses a dielectric functional layer to coat the plug-ins and sockets of various wires or connectors, so that the In the process of high-frequency signal transmission, the overflow loss of ultra-high-frequency electrical signal transmission can be prevented, and the utility function can be enhanced in its overall implementation and use.

However, the foregoing embodiments or drawings do not limit the product structure or usage of the present invention, and any appropriate changes or modifications made by those with ordinary knowledge in the technical field should be regarded as not departing from the scope of the present invention.

To sum up, the embodiment of the present invention can indeed achieve the expected use effect, and the specific structure disclosed is not only not seen in similar products, but also not disclosed before the application, which fully complies with the provisions of the patent law In accordance with the requirements, I would like to file an application for an invention patent in accordance with the law, and I sincerely request that it be reviewed and granted the patent.

1: Dielectric functional layer

2: Wire

Figure 1: Schematic diagram of the manufacturing process of the present invention

The second figure: the use state of the present invention shows the side view cross-sectional structure schematic diagram

Claims (18)

A manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission, which mainly includes the following steps: A. Sheet-like structure: a sheet-like structure using high-insulation ceramic materials, the sheet-like structure is micron-scale and nano-scale, and the sheet-like structure has a sheet diameter of 0.5μm~10μm, so that the layer of the sheet-like structure is The number is 1 to 10 layers, so that the thickness of each layer of the sheet structure is 1 nm to 3 nm; B. Compounding: compound the sheet structure with high molecular polymer; C. Dielectric functional layer: A dielectric functional layer with no voids, no micropores and low dielectric constant is formed by manufacturing. The method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as claimed in claim 1, wherein, in step A, the sheet-like structure of the high-insulation ceramic material is cubic or pseudocubic either. The method for manufacturing a plastic-encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission according to claim 1, wherein, in the step A, the sheet diameter of the sheet-like structure is 5 μm. According to the method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 1, wherein, in step A, the number of layers of the sheet-like structure is 1 to 3 layers. The method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission according to claim 1, wherein, in step A, the thickness of each layer of the sheet-like structure is 1.5 nm to 2 nm. The method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 1, wherein, in step B, the sheet-like structure is in-situ compounded with a non-polar polymer or It is evenly compounded with high molecular polymer. The manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 1, wherein, in step B, the sheet-like structure is compounded with a high molecular polymer, and a mixer is used to compound to form a slurry Form or granulation or plastic granules. The manufacturing method for preventing overflow loss during high frequency or ultra-high frequency signal transmission according to claim 7, wherein, in step B, the compounded slurry or granulation or plastic granules contained in The sheet-like structure of the highly insulating ceramic material accounts for at least 50% of all solids content. The method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 8, wherein, in step B, the compounded slurry or granulation or plastic granules contained in The sheet-like structure of the highly insulating ceramic material accounts for 98% of all solids. The manufacturing method for preventing overflow loss during high frequency or ultra-high frequency signal transmission as described in claim 7, wherein, in step B, the slurry type uses a non-polar dispersant for ceramic materials with a particle size of at most 60 nm. Mix, and then carry out ball-milling dispersion, and the ball-milling dispersion time is at least 8 hours. The manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 10, wherein, in step B, the ball-milling dispersion time is 10 hours. The manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 7, wherein, in step B, the slurry-type ceramic material with a diameter of 110nm-1500nm in the micron order is made of non-ferrous material. The polar dispersants are mixed, and then ball-milled and dispersed for at least 3 hours. The method for manufacturing a plastic-encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission according to claim 12, wherein, in step B, the ceramic material has a sheet diameter of 960 nm to 1100 nm. The method for manufacturing a plastic-encapsulated material to prevent overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 12, wherein, in step B, the ball-milling dispersion time is 4 hours. The method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission according to claim 1, wherein in step C, any one of coating, blow molding, die casting, and injection molding is used for manufacturing The dielectric functional layer is fabricated. The method for manufacturing an encapsulated material for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission according to claim 1, wherein, in step C, the dielectric functional layer is in a plastic shape. The manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 1, wherein, in step C, the dielectric functional layer is adjusted with a solvent according to the practical needs of coating and application. The viscosity of the slurry is to form a film. The thickness of the formed film after curing is at least 6 μm, and the initial temperature of the film during the curing process is between 100°C and 200°C, and the temperature is maintained for at least 1 minute. The manufacturing method for preventing overflow loss during high-frequency or ultra-high-frequency signal transmission as described in claim 17, wherein, in step C, the initial temperature of the film in the curing process is 150°C.

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