TWI770385B - Cu核球、焊接頭、焊膏及泡沫焊料 - Google Patents

Cu核球、焊接頭、焊膏及泡沫焊料 Download PDF

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Publication number
TWI770385B
TWI770385B TW108117471A TW108117471A TWI770385B TW I770385 B TWI770385 B TW I770385B TW 108117471 A TW108117471 A TW 108117471A TW 108117471 A TW108117471 A TW 108117471A TW I770385 B TWI770385 B TW I770385B
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Taiwan
Prior art keywords
balls
solder
ball
less
mass ppm
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TW108117471A
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English (en)
Chinese (zh)
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TW202006146A (zh
Inventor
川浩由
近藤茂喜
須藤皓紀
𡈽屋政人
八嶋崇志
六本木貴弘
相馬大輔
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日商千住金屬工業股份有限公司
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  • Powder Metallurgy (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW108117471A 2018-06-12 2019-05-21 Cu核球、焊接頭、焊膏及泡沫焊料 TWI770385B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018111879A JP6572998B1 (ja) 2018-06-12 2018-06-12 Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ
JP2018-111879 2018-06-12

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TW202006146A TW202006146A (zh) 2020-02-01
TWI770385B true TWI770385B (zh) 2022-07-11

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TW108117471A TWI770385B (zh) 2018-06-12 2019-05-21 Cu核球、焊接頭、焊膏及泡沫焊料

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JP (1) JP6572998B1 (ja)
TW (1) TWI770385B (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201315821A (zh) * 2011-12-21 2013-04-16 Tanaka Electronics Ind 包鈀（Ｐｄ）銅球銲接合線
TW201504459A (zh) * 2013-06-19 2015-02-01 Senju Metal Industry Co Ｃｕ核球
TW201630682A (zh) * 2014-11-05 2016-09-01 Senju Metal Industry Co 焊接材料、焊膏、泡沫焊料、焊料接頭及焊接材料的管理方法
TW201716592A (zh) * 2015-11-02 2017-05-16 Tanaka Electronics Ind 球焊用貴金屬被覆銅線

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201315821A (zh) * 2011-12-21 2013-04-16 Tanaka Electronics Ind 包鈀（Ｐｄ）銅球銲接合線
TW201504459A (zh) * 2013-06-19 2015-02-01 Senju Metal Industry Co Ｃｕ核球
TW201630682A (zh) * 2014-11-05 2016-09-01 Senju Metal Industry Co 焊接材料、焊膏、泡沫焊料、焊料接頭及焊接材料的管理方法
TW201716592A (zh) * 2015-11-02 2017-05-16 Tanaka Electronics Ind 球焊用貴金屬被覆銅線

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Publication number Publication date
JP2019214762A (ja) 2019-12-19
TW202006146A (zh) 2020-02-01
JP6572998B1 (ja) 2019-09-11

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