TWI769463B - Dehumidification system and method for reducing space humidity - Google Patents
Dehumidification system and method for reducing space humidity Download PDFInfo
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本發明是有關於除濕系統及降低空間濕度的方法,且更具體言之,是有關於使用經乾燥調節濕度之空氣的除濕系統及降低空間濕度的方法。The present invention relates to a dehumidification system and a method of reducing the humidity of a space, and more particularly, to a dehumidification system and a method of reducing the humidity of a space using air dried to adjust the humidity.
在自動化生產環境中,普遍有建置可供存放電子產品的乾燥室,以獲得受控制的溫度與濕度,進而避免電子產品受潮而發生不必要的功能異常。In an automated production environment, a drying room for storing electronic products is generally built to obtain controlled temperature and humidity, so as to avoid unnecessary malfunction of electronic products due to moisture.
現行業界大多以低溫冰水機、化學除濕輪或特規除濕輪等方式來達到小坪數乾燥室的溫濕度控制。其中最常使用方式為化學除濕輪,其係利用除濕輪的吸濕特性,將空氣中的水分吸附在轉輪上,以獲得環境所需的乾燥空氣。然而,不論是使用除濕輪,還是使用冰水機,都存在造價成本高、佔地面積大、建置時間長及運轉維護成本高等諸多缺點。In the current industry, most of the low-temperature ice water machines, chemical dehumidification wheels or special dehumidification wheels are used to achieve the temperature and humidity control of small-scale drying rooms. The most commonly used method is the chemical dehumidification wheel, which uses the moisture absorption characteristics of the dehumidification wheel to absorb the moisture in the air on the runner to obtain the dry air required by the environment. However, whether it is using a dehumidifier wheel or an ice water machine, there are many disadvantages such as high cost, large floor space, long construction time, and high operation and maintenance costs.
在一實施例中,一種除濕系統包括至少一風扇過濾單元及經乾燥調節濕度之空氣。所述風扇過濾單元包括一風扇及一過濾件。所述過濾件對應所述風扇。所述經乾燥調節濕度之空氣吹向所述風扇過濾單元之所述風扇,再進入較所述風扇過濾單元為大之一容置空間中。In one embodiment, a dehumidification system includes at least one fan filter unit and air dried to adjust humidity. The fan filter unit includes a fan and a filter element. The filter element corresponds to the fan. The air whose humidity has been dried and adjusted is blown toward the fan of the fan filter unit, and then enters into an accommodating space larger than the fan filter unit.
在一實施例中,一種降低空間濕度的方法包括:提供一容置空間;從所述容置空間之外部導入經乾燥調節濕度之空氣至所述容置空間內;及通過至少一風扇過濾單元將所述經乾燥調節濕度之空氣分散於所述容置空間中,以降低所述容置空間的濕度。In one embodiment, a method for reducing space humidity includes: providing an accommodating space; introducing dried and humidity-adjusted air into the accommodating space from outside the accommodating space; and passing at least one fan filter unit The dried and humidity-regulated air is dispersed in the accommodating space to reduce the humidity of the accommodating space.
貫穿圖式及實施方式使用共同參考編號以指示相同或相似組件。自結合附圖的以下詳細描述將更容易理解本發明之實施例。Common reference numbers are used throughout the drawings and the embodiments to refer to the same or similar components. Embodiments of the present invention will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.
以下揭示內容提供用於實施所提供主題之不同特徵的許多不同實施例或實例。在下文描述組件及配置之特定實例以闡明本發明之特定態樣。當然,此等組件、值、操作、材料及配置僅為實例且不意欲為限制性的。舉例而言,在本文中所提供之描述中,第一特徵在第二特徵上方或上的形成可包括第一特徵以及第二特徵直接接觸地形成或安置的實施例,且亦可包括額外特徵可在第一特徵與第二特徵之間形成或安置使得第一特徵與第二特徵可不直接接觸的實施例。另外,本發明可在本文中所提供之各種實例中重複參考數字及/或字母。此重複係出於簡化及清楚之目的,且本身並不指示所論述各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to illustrate particular aspects of the invention. Of course, these components, values, operations, materials and configurations are examples only and are not intended to be limiting. For example, in the description provided herein, the formation of a first feature over or over a second feature may include embodiments in which the first feature and the second feature are formed or disposed in direct contact, and may also include additional features Embodiments may be formed or positioned between the first and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples provided herein. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.
圖1顯示本發明之除濕系統1的系統架構圖。圖2顯示本發明之主導管、次導管及風扇過濾單元之配置示意圖。配合參閱圖1及圖2,本發明之除濕系統1包括一容置空間90、一迴風牆60、至少一風扇過濾單元10、經乾燥調節濕度之空氣20、至少一導管30、至少一消音器40、一氣體流量控制閥50、至少一溫度感測器65、至少一濕度感測器66、一吸附式乾燥機71、一減壓閥72及至少一乾燥冷卻器(dry cooler)80。FIG. 1 shows a system architecture diagram of a
所述容置空間90界定一存放區域91及一頂部區域92,所述存放區域91與所述頂部區域92以一隔板93分隔。在一實施例中,所述容置空間90係可為乾燥室、無塵室或模具室。所述存放區域91可用以存放對濕度敏感的物件(例如:電子產品或模具)。所述頂部區域92係位於所述存放區域91上方,用以提供處理空氣或分配空氣之空間。The
所述迴風牆60包圍所述存放區域91與所述頂部區域92。所述迴風牆60具有一內部迴風空間62及複數個迴風孔63。所述內部迴風空間62通過該等迴風孔63連通所述存放區域91與所述頂部區域92。在一實施例中,該等迴風孔63可包括複數個第一迴風孔631及複數個第二迴風孔632。所述內部迴風空間62係可通過該等第一迴風孔631連通所述存放區域91,以及通過該等第二迴風孔632連通所述頂部區域92。The
所述至少一風扇過濾單元10設置於所述隔板93上,且所述至少一風扇過濾單元10連通所述存放區域91與所述頂部區域92。在一實施例中,所述容置空間90較所述風扇過濾單元10為大。所述存放區域91較所述風扇過濾單元10為大,且所述頂部區域92較所述風扇過濾單元10為大。The at least one
在一實施例中,所述至少一風扇過濾單元10包括一風扇11及一過濾件12。所述風扇11具有一進氣側112及一出氣側114。所述出氣側114相對於所述進氣側112。所述過濾件12對應所述風扇11。在一實施例中,所述過濾件12係可設置於所述風扇11之所述出氣側114。在一實施例中,所述至少一風扇過濾單元10係位於所述隔板93上,且所述過濾件12係面向所述存放區域91。In one embodiment, the at least one
所述經乾燥調節濕度之空氣20係從所述容置空間90之外部導入至所述容置空間90(例如:所述頂部區域92)內,並吹向所述風扇過濾單元10之所述風扇11的中央位置,再進入較所述風扇過濾單元10為大之所述容置空間90(例如:所述存放區域91)中,以降低所述容置空間90(例如:所述存放區域91)的濕度。在一實施例中,所述經乾燥調節濕度之空氣20係吹向所述風扇11之所述進氣側112,並通過所述風扇11之所述出氣側114及所述過濾件12進入所述容置空間90之所述存放區域91中。The dried
在一實施例中,所述至少一風扇過濾單元10係可包括複數個風扇過濾單元10。該等風扇過濾單元10呈間隔設置,且所述經乾燥調節濕度之空氣20係可吹向各所述風扇過濾單元10之各所述風扇11之所述進氣側112,並通過各所述風扇11之所述出氣側114及各所述過濾件12分散進入所述容置空間90之所述存放區域91中。此外,由於所述迴風牆60之所述內部迴風空間62通過該等第一迴風孔631連通所述存放區域91以及通過該等第二迴風孔632連通所述頂部區域92,因此,所述經乾燥調節濕度之空氣20可循環流動於所述頂部區域92、所述存放區域91及所述迴風牆60之所述內部迴風空間62。In one embodiment, the at least one
在一實施例中,所述經乾燥調節濕度之空氣20係可來源於製程氣體20',且所述製程氣體20'係可儲存於一儲氣裝置25內。此外,為有效降低所述容置空間90之濕度,所述經乾燥調節濕度之空氣20係可為經乾燥調節濕度之壓縮空氣,且所述經乾燥調節濕度之空氣20的露點係為-5.26℃至0.37℃。In one embodiment, the dried and humidity-adjusted
所述至少一導管30用以將所述經乾燥調節濕度之空氣20從所述容置空間90之外部導入至所述容置空間90(例如:所述頂部區域92)內,即所述經乾燥調節濕度之空氣20係於所述導管30內流動。在一實施例中,所述至少一導管30係可包括一主導管31及複數個次導管32。The at least one
所述主導管31從所述容置空間90之外部導入所述經乾燥調節濕度之空氣20,因此,如圖1所示,所述主導管31之一部份是設置於所述容置空間90之外部,而其另一部分是設置於所述容置空間90之所述頂部區域92內。The
再參閱圖1及圖2,該等次導管32呈間隔設置,且該等次導管32連通所述主導管31,以分散所述經乾燥調節濕度之空氣20。在一實施例中,各所述次導管32係分別對應各所述風扇過濾單元10之各所述風扇11的中央位置。Referring to FIG. 1 and FIG. 2 again, the
所述消音器40對應所述風扇11之所述進氣側112,且所述經乾燥調節濕度之空氣20係通過所述消音器40,以減小所述經乾燥調節濕度之空氣20產生之噪音。The
在一實施例中,如圖1所示,所述除濕系統1係可包括複數個消音器40,各所述消音器40係分別設置於各所述次導管32的出口處,以減小所述經乾燥調節濕度之空氣20從各所述次導管32吹出時之噪音。In one embodiment, as shown in FIG. 1 , the
所述氣體流量控制閥50設置於所述導管30上,用以調整所述經乾燥調節濕度之空氣20的流量。在一實施例中,所述氣體流量控制閥50係可設置於所述主導管31上,且所述氣體流量控制閥50係可為比例式電動閥。The gas
所述溫度感測器65及所述濕度感測器66設置於所述迴風牆60之所述內部迴風空間62中,用以感測所述經乾燥調節濕度之空氣20的溫度及濕度變化。在一實施例中,所述氣體流量控制閥50係可依據所述濕度感測器66所測得之濕度,即時調整所述經乾燥調節濕度之空氣20的流量。The
所述吸附式乾燥機71連接所述儲氣裝置25之出口,所述經乾燥調節濕度之空氣20可通過所述吸附式乾燥機71,以吸附所述經乾燥調節濕度之空氣20中的多餘水分。The
所述減壓閥72設置於所述氣體流量控制閥50與所述吸附式乾燥機71之間,所述經乾燥調節濕度之空氣20可通過所述減壓閥72,以減低所述經乾燥調節濕度之空氣20的氣壓。這是由於所述經乾燥調節濕度之空氣20可能為高壓之壓縮空氣,因此,減低所述經乾燥調節濕度之空氣20的氣壓,可減小所述經乾燥調節濕度之空氣20產生之噪音及避免所述經乾燥調節濕度之空氣20衝擊損壞所述存放區域91內的物件。The
所述至少一乾燥冷卻器80設置於所述容置空間90內,用以控制所述容置空間90的溫度。在一實施例中,所述至少一乾燥冷卻器80係可設置於所述容置空間90之所述頂部區域92內,且所述至少一乾燥冷卻器80的內部可流通冷水及熱水,以控制所述容置空間90的溫度。此外,所述至少一乾燥冷卻器80係可根據所述溫度感測器65所測得之溫度,即時調整其內部之冷水量及熱水量。在一實施例中,所述至少一乾燥冷卻器80係可將所述容置空間90的溫度控制在21℃至27℃之間。The at least one drying cooler 80 is disposed in the
如圖1所示,從所述容置空間90之外部導入至所述容置空間90內之所述經乾燥調節濕度之空氣20,經所述風扇過濾單元10分散於所述容置空間90後,可大幅降低所述容置空間90的濕度至30%以下。此外,本發明之除濕系統1相較於習知之除濕輪或冰水機等除濕方式,具有造價成本低、佔地面積小、建置時間短及運轉維護成本低等優勢,可用以取代習知之除濕系統。As shown in FIG. 1 , the
圖3至圖8顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。3-8 illustrate one or more stages of some embodiments of the method of reducing space humidity of the present invention.
參閱圖3,本發明之降低空間濕度的方法的步驟(a)是提供一容置空間90。在該步驟(a)中,所述容置空間90界定一存放區域91及一頂部區域92,所述存放區域91與所述頂部區域92以一隔板93分隔。在一實施例中,所述容置空間90係可為乾燥室、無塵室或模具室。所述存放區域91可用以存放對濕度敏感的物件(例如:電子產品或模具)。Referring to FIG. 3 , step (a) of the method for reducing space humidity of the present invention is to provide an
此外,如圖3所示,所述容置空間90係可與一迴風牆60、至少一風扇過濾單元10、製程氣體20'、至少一導管30、至少一消音器40、一氣體流量控制閥50、至少一溫度感測器65、至少一濕度感測器66、一吸附式乾燥機71、一減壓閥72及至少一乾燥冷卻器80構成一除濕系統1'。圖3之除濕系統1'係相同於圖1之除濕系統1。In addition, as shown in FIG. 3 , the
參閱圖4至圖7,本發明之降低空間濕度的方法的步驟(b)是從所述容置空間90之外部導入所述經乾燥調節濕度之空氣20至所述容置空間90內。如圖4所示,所述經乾燥調節濕度之空氣20係可來源於製程氣體20',且所述經乾燥調節濕度之空氣20係可為經乾燥調節濕度之壓縮空氣。Referring to FIG. 4 to FIG. 7 , step (b) of the method for reducing room humidity of the present invention is to introduce the dried
在該步驟(b)中,所述經乾燥調節濕度之空氣20係設置於所述至少一導管30內,且所述經乾燥調節濕度之空氣20係通過所述吸附式乾燥機71,以吸附所述經乾燥調節濕度之空氣20中的水分,並將所述經乾燥調節濕度之空氣20的露點調整為-5.26℃至0.37℃。In this step (b), the
在一實施例中,所述至少一導管30係可包括一主導管31及複數個次導管32。所述主導管31可將所述經乾燥調節濕度之空氣20從所述容置空間90之外部導入所述容置空間90之所述頂部區域92內,因此,如圖4所示,所述主導管31之一部份是設置於所述容置空間90之外部,而其另一部分是設置於所述容置空間90之所述頂部區域92內。該等次導管32呈間隔設置,且該等次導管32連通所述主導管31,用以分散所述經乾燥調節濕度之空氣20。在一實施例中,各所述次導管32係分別對應各所述風扇過濾單元10之各所述風扇11的中央位置。In one embodiment, the at least one
如圖5所示,所述經乾燥調節濕度之空氣20在通過所述吸附式乾燥機71之後,可接續通過所述減壓閥72,以減低所述經乾燥調節濕度之空氣20的氣壓。這是由於所述經乾燥調節濕度之空氣20可能為高壓之壓縮空氣,而減低所述經乾燥調節濕度之空氣20的氣壓,可減小所述經乾燥調節濕度之空氣20產生之噪音。在一實施例中,所述經乾燥調節濕度之空氣20的氣壓係可減低至小於或等於2 Kg/cm2
。As shown in FIG. 5 , after passing through the
如圖6所示,所述經乾燥調節濕度之空氣20在通過所述減壓閥72之後,可接續通過所述氣體流量控制閥50,以調整所述經乾燥調節濕度之空氣20的流量。在一實施例中,所述氣體流量控制閥50係可為比例式電動閥,且所述氣體流量控制閥50係可依據所述濕度感測器66所測得之濕度,即時調整所述經乾燥調節濕度之空氣20的流量。As shown in FIG. 6 , after passing through the
如圖7所示,所述經乾燥調節濕度之空氣20在通過所述氣體流量控制閥50之後,依序進入所述次導管32、通過所述消音器40進行消音處理及吹向所述風扇過濾單元10。在一實施例中,所述消音器40係設置於所述次導管32的出口處,以減小所述經乾燥調節濕度之空氣20從所述次導管32吹出時之噪音。As shown in FIG. 7 , after passing through the gas
參閱圖8,本發明之降低空間濕度的方法的步驟(c)是通過所述至少一風扇過濾單元10將所述經乾燥調節濕度之空氣20分散於所述容置空間90中,以降低所述容置空間90的濕度。在該步驟(c)中,所述至少一風扇過濾單元10係將所述經乾燥調節濕度之空氣20從所述頂部區域92吹向所述存放區域91。Referring to FIG. 8 , step (c) of the method for reducing space humidity of the present invention is to disperse the dried and humidity-adjusted
在一實施例中,所述至少一風扇過濾單元10可包括一風扇11及一過濾件12。所風扇11可將所述經乾燥調節濕度之空氣20吹向所述存放區域91。所述過濾件12對應所述風扇11,且所述經乾燥調節濕度之空氣20可通過所述過濾件12進入所述存放區域91。在一實施例中,所述過濾件12係可設置於所述風扇11之所述出氣側114。In one embodiment, the at least one
再參閱圖1,進入所述存放區域91之所述經乾燥調節濕度之空氣20可進一步通過所述迴風牆60之該等第一迴風孔631進入所述內部迴風空間62,並通過該等第二迴風孔632進入所述頂部區域92。也就是說,所述經乾燥調節濕度之空氣20可循環流動於所述頂部區域92、所述存放區域91及所述迴風牆60之所述內部迴風空間62。Referring again to FIG. 1 , the dried
此外,由於所述濕度感測器66是設置於所述迴風牆60之所述內部迴風空間62中,因此,可即時取得所述容置空間90的濕度變化,且所述濕度感測器66所測得之濕度可即時反饋給所述氣體流量控制閥50,以使所述氣體流量控制閥50可根據所述容置空間90的濕度調整所述經乾燥調節濕度之空氣20的流量,進而降低所述容置空間90的濕度至30%以下。另外,設置於所述迴風牆60之所述內部迴風空間62中之所述溫度感測器65,亦可即時取得所述容置空間90的溫度變化,且所述溫度感測器65所測得之溫度可即時反饋給所述至少一乾燥冷卻器80,以使所述至少一乾燥冷卻器80可根據所述容置空間90的溫度調整其內部之冷水量及熱水量,進而將所述容置空間90的溫度控制在所需之溫度區間(例如:21℃至27℃之間)。In addition, since the
上述實施例僅為說明本發明之原理及其功效,並非限制本發明,因此習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。The above-mentioned embodiments are only to illustrate the principles and effects of the present invention, but not to limit the present invention. Therefore, those skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit of the present invention. The scope of the rights of the present invention should be listed in the scope of the patent application described later.
1:除濕系統 1':除濕系統 10:風扇過濾單元 11:風扇 12:過濾件 20:經乾燥調節濕度之空氣 20':製程氣體 25:儲氣裝置 30:導管 31:主導管 32:次導管 40:消音器 50:氣體流量控制閥 60:迴風牆 62:內部迴風空間 63:迴風孔 65:溫度感測器 66:濕度感測器 71:吸附式乾燥機 72:減壓閥 80:乾燥冷卻器 90:容置空間 91:存放區域 92:頂部區域 93:隔板 112:進氣側 114:出氣側 631:第一迴風孔 632:第二迴風孔1: Dehumidification system 1': Dehumidification system 10: Fan filter unit 11: Fan 12: Filters 20: Dry air to adjust humidity 20': Process gas 25: Gas storage device 30: Catheter 31: Main tube 32: Secondary catheter 40: muffler 50: Gas flow control valve 60: Air return wall 62: Internal return air space 63: return air hole 65: temperature sensor 66: Humidity sensor 71: Adsorption dryer 72: Pressure reducing valve 80: Dry cooler 90: accommodating space 91: Storage area 92: Top area 93: Separator 112: Intake side 114: Outlet side 631: First return air hole 632: Second return air hole
當結合附圖閱讀時,自以下詳細描述易於理解本發明之一些實施例的態樣。應注意,各種結構可能未按比例繪製,且各種結構之尺寸可出於論述清晰起見任意增大或減小。Aspects of some embodiments of the invention will be readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion.
圖1顯示本發明之除濕系統的系統架構圖。FIG. 1 shows a system architecture diagram of the dehumidification system of the present invention.
圖2顯示本發明之主導管、次導管及風扇過濾單元之配置示意圖。FIG. 2 shows a schematic diagram of the configuration of the main duct, the secondary duct and the fan filter unit of the present invention.
圖3顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 3 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
圖4顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 4 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
圖5顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 5 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
圖6顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 6 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
圖7顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 7 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
圖8顯示本發明之降低空間濕度的方法的一些實施例的一或多個階段。Figure 8 shows one or more stages of some embodiments of the method of reducing space humidity of the present invention.
1:除濕系統1: Dehumidification system
10:風扇過濾單元10: Fan filter unit
11:風扇11: Fan
12:過濾件12: Filters
20:經乾燥調節濕度之空氣20: Dry air to adjust humidity
20':製程氣體20': Process gas
25:儲氣裝置25: Gas storage device
30:導管30: Catheter
31:主導管31: Main pipe
32:次導管32: Secondary catheter
40:消音器40: muffler
50:氣體流量控制閥50: Gas flow control valve
60:迴風牆60: Air return wall
62:內部迴風空間62: Internal return air space
63:迴風孔63: return air hole
65:溫度感測器65: temperature sensor
66:濕度感測器66: Humidity sensor
71:吸附式乾燥機71: Adsorption dryer
72:減壓閥72: Pressure reducing valve
80:乾燥冷卻器80: Dry cooler
90:容置空間90: accommodating space
91:存放區域91: Storage area
92:頂部區域92: Top area
93:隔板93: Separator
112:進氣側112: Intake side
114:出氣側114: Outlet side
631:第一迴風孔631: First return air hole
632:第二迴風孔632: Second return air hole
Claims (28)
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TW109119093A TWI769463B (en) | 2020-06-05 | 2020-06-05 | Dehumidification system and method for reducing space humidity |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001044089A (en) * | 1999-07-28 | 2001-02-16 | Takasago Thermal Eng Co Ltd | Clean room system |
KR20060075692A (en) * | 2004-12-29 | 2006-07-04 | 삼성전자주식회사 | Fan unit |
CN204254779U (en) * | 2012-05-15 | 2015-04-08 | 大同工程株式会社 | Toilet's dehumidification air-conditioner |
TW201916427A (en) * | 2017-09-14 | 2019-04-16 | 日商西部技研股份有限公司 | Dry Room For Gas Substitution |
CN110043969A (en) * | 2019-05-13 | 2019-07-23 | 西安航天神舟建筑设计院有限公司 | A kind of air handling system |
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2020
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001044089A (en) * | 1999-07-28 | 2001-02-16 | Takasago Thermal Eng Co Ltd | Clean room system |
KR20060075692A (en) * | 2004-12-29 | 2006-07-04 | 삼성전자주식회사 | Fan unit |
CN204254779U (en) * | 2012-05-15 | 2015-04-08 | 大同工程株式会社 | Toilet's dehumidification air-conditioner |
TW201916427A (en) * | 2017-09-14 | 2019-04-16 | 日商西部技研股份有限公司 | Dry Room For Gas Substitution |
CN110043969A (en) * | 2019-05-13 | 2019-07-23 | 西安航天神舟建筑设计院有限公司 | A kind of air handling system |
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