TWI768749B - Coating apparatus and method for removing air bubbles in coating apparatus - Google Patents

Abstract

[Problem] The present invention provides a technique capable of suppressing deterioration of the plating quality of a substrate due to air bubbles remaining on the surface to be plated of the substrate. [Solution] The plating apparatus 1000 of the present invention includes: a plating tank 10 storing a plating solution and arranging an anode 11 inside; an anode 11 disposed above the anode, and a substrate serving as a cathode that holds the substrate to be plated on the surface A substrate holder 30 facing downward and having a ring 31 protruding beyond the outer periphery of the plated surface of the substrate; a rotation mechanism 40 for rotating the substrate holder; and a lifting mechanism 50 for raising and lowering the substrate holder; At least one protrusion 35 protruding toward the downward side is arranged on a part of the lower surface.

Description

Coating apparatus and bubble removing method of coating apparatus

The present invention relates to a coating device and a bubble removing method of the coating device.

Conventionally, as a plating apparatus for performing a plating process on a substrate, a so-called cup type plating apparatus has been known (for example, refer to Patent Document 1). Such a plating apparatus includes: a plating tank for storing a plating solution and arranging an anode inside; a substrate holder that is arranged above the anode and holds a substrate serving as a cathode so that the plating surface of the substrate faces downward; the substrate holder A rotating mechanism for rotation; and a lifting mechanism for raising and lowering the substrate holder. In addition, the substrate holder of this coating apparatus has a ring which protrudes further below than the outer periphery of the coated surface of the substrate. [Prior Art Literature] [Patent Documents]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-19496

[Problems to be Solved by Invention]

In the cup-type plating apparatus as described above, air bubbles are generated in the plating solution of the plating tank for some reasons. At this time, the air bubbles may remain on the plated surface of the substrate. In particular, when the above-mentioned ring is provided in the substrate holder, it is difficult for the bubbles of the plating solution to pass over the ring, and the possibility of the bubbles remaining on the plated surface of the substrate increases. In this way, when air bubbles remain on the plated surface of the substrate, the plating quality of the substrate may be degraded by the retained air bubbles.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a technique capable of suppressing deterioration of the plating quality of the substrate due to air bubbles remaining on the plating surface of the substrate. [Means of Solving Problems]

(pattern 1) In order to achieve the above object, a plating apparatus according to an aspect of the present invention includes: a plating tank that stores a plating solution and has an anode disposed inside; and a substrate holder that is disposed above the anode and holds a The substrate of the cathode has the plated surface of the substrate facing downward, and has a ring that protrudes below the outer periphery of the plated surface of the substrate; a rotation mechanism, which rotates the substrate holder; and a lift mechanism, which The substrate holder is moved up and down, and at least one protrusion protruding downward is arranged on a part of the lower surface of the ring.

In this state, the substrate holder is rotated in a state where the plated surface of the substrate is immersed in the plating solution, and the plating solution can be pushed out by the protrusions in the direction of rotation of the substrate holder. Strong plating liquid flow (liquid flow) from the center side of the plated surface of the substrate toward the outer peripheral side. By the strong liquid flow, the air bubbles present on the plated surface of the substrate can pass over the ring and be discharged to the outside of the ring. That is, air bubbles existing on the plated surface of the substrate can be removed from the plated surface. Thereby, it can suppress that the plating quality of a board|substrate is deteriorated by the air bubbles which remain|survived on the surface to be plated of the board|substrate.

(pattern 2) In the above-mentioned aspect 1, the protrusion may be constituted by a plate member having an axis extending from the inner peripheral side toward the outer peripheral side under the ring.

(pattern 3) In the above-mentioned aspect 2, the angle formed by the axis of the protrusion and the tangent of the inner peripheral surface of the ring may be formed, and in the rotation direction of the substrate holder when the substrate holder rotates in one direction, from the axis When the angle measured from the side facing the tangent line is 0° or more and less than 20°, the rotation mechanism rotates the substrate holder at 100 rpm or more, and when the angle is 20° or more and less than 60°, the above When the rotation mechanism rotates the substrate holder at 40 rpm or more and the angle is 60° or more and 120° or less, the rotation mechanism rotates the substrate holder at 25 rpm or more, and the angle is greater than 120° and 160° or less When the rotation mechanism rotates the substrate holder at 25 rpm or more, and the angle is larger than 160° and 180° or less, the rotation mechanism rotates the substrate holder at 100 rpm or more.

(pattern 4) In the above-mentioned aspect 3, the aforementioned angle may be 60° or more and 160° or less.

(pattern 5) In the said aspect 4, the said rotation mechanism may rotate the said board|substrate holder at 30 rpm or more.

(pattern 6) In any one of the above-mentioned aspects 1 to 5, the number of the protrusions may be plural. In this aspect, compared with the case where the number of protrusions is one, the air bubbles existing on the plated surface of the substrate can be effectively removed.

(pattern 7) In the above-mentioned aspect 3, the number of the protrusions is plural, and the plurality of the protrusions include: a first protrusion that faces from the side of the axis in the rotation direction of the substrate holder when the substrate holder is rotated forwardly The angle measured on the side of the tangent line is 60° or more and 160° or less; and the second protrusion is from the side of the axis toward the above in the rotation direction of the substrate holder when the substrate holder is reversed. The angle measured on the side of the tangent is 60° or more and 160° or less; the rotation mechanism can also be configured to rotate the substrate holder forward when performing the plating process of the plating process on the plated surface of the substrate. and reversal are performed at least once respectively.

In this state, during the plating process, when the substrate holder rotates (forward rotation and reverse rotation), any one of the first protrusion and the second protrusion will have a "distance between the axis of the protrusion and the inner peripheral surface of the ring". The angle formed by the tangent, and the angle measured from the side of the axis toward the side of the tangent in the rotation direction of the substrate holder" shall be 60° or more and 160° or less.

(pattern 8) Any one of the above-mentioned aspects 1 to 7 may further include: at least one supply port provided on the outer peripheral wall of the plating tank for supplying the plating solution in the plating tank; and at least one supply port A discharge port is provided on the outer peripheral wall of the coating tank and faces the supply port, sucks the plating solution in the coating tank, and discharges it from the coating tank; the supply port and the discharge port are configured as follows A shear flow of the plating solution along the plating surface is formed under the plating surface of the substrate in the plating tank so that the discharge port sucks the plating solution supplied from the supply port.

In this aspect, when the plated surface of the substrate is immersed in the plating solution, the bubbles generated in the center of the plated surface of the substrate can be easily moved toward the outer peripheral surface of the plated surface by the shear flow. Thereby, the bubble which moved to this outer peripheral side can be discharged|emitted to the outer side of a ring efficiently by a protrusion.

(pattern 9) Any one of the above-mentioned aspects 1 to 7 may further include a flow mechanism for flowing the plating solution in the plating tank before the plated surface of the substrate is immersed in the plating solution, so that the The liquid surface of the plating solution in the center of the coating tank is raised upward, and the elevating mechanism lowers the substrate holder in a state where the liquid surface of the plating solution in the center of the plating tank is raised upward. The center of the said surface to be plated of the said substrate contacts the plating solution earlier than the outer periphery of the said surface to be plated.

In this state, when the surface to be plated of the substrate is in contact with the plating solution, the center of the surface to be plated is brought into contact with the liquid first, and the air bubbles present in the center of the surface to be plated escape to the outer peripheral side of the surface to be plated, and at the same time The surface to be plated can be immersed in the plating solution. As a result, the air bubbles moved to the outer peripheral side can be efficiently discharged to the outside of the ring by the protrusion.

(pattern 10) In any one of the above-mentioned aspects 1 to 7, the plating apparatus may be configured such that the surface to be plated of the substrate is brought into contact with a liquid in a state inclined to the horizontal liquid surface of the plating solution in the plating tank. .

In this state, when the plated surface of the substrate is in contact with the plating solution, the air bubbles present on the plated surface can be moved obliquely upward along the plated surface by buoyancy, and the plated surface can be immersed in the plating solution at the same time. . Thereby, the air bubbles can be efficiently moved to the outer peripheral side of the surface to be plated. As a result, the air bubbles moved to the outer peripheral side can be efficiently discharged to the outside of the ring by the protrusion.

(pattern 11) Any one of the above-mentioned aspects 1 to 7 may further include a paddle, which is arranged above the anode in the coating tank and below the substrate, and moves back and forth in the horizontal direction. way to stir the plating solution in the aforementioned plating tank.

In this aspect, by stirring the plating solution with the paddle, the air bubbles present on the plated surface of the substrate can be efficiently moved to the outer peripheral side of the plated surface. Thereby, the air bubbles moved to the outer peripheral side can be efficiently discharged to the outside of the ring by the protrusion.

(pattern 12) In order to achieve the above object, a method for removing bubbles of a plating apparatus according to an aspect of the present invention includes: a plating tank that stores a plating solution and has an anode disposed inside; and a substrate holder that is Arranged above the anode, holding the substrate as a cathode with the plated surface of the substrate facing downward, and having a ring that protrudes below the outer periphery of the plated surface of the substrate; a part below the ring At least one protrusion protruding downward is arranged, and the bubble removing method includes rotating the substrate holder in a state in which the plated surface of the substrate is immersed in a plating solution.

In this aspect, deterioration of the plating quality of the substrate due to air bubbles remaining on the plating surface of the substrate can be suppressed.

(implementation form) Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following embodiment and the modification of the embodiment mentioned later, the same code|symbol is attached|subjected to the same or corresponding structure, and description is abbreviate|omitted suitably. In addition, the drawings are schematic diagrams for easy understanding of the features of the constituent elements, and are not limited to the fact that the dimensional ratios and the like of the constituent elements are the same as the actual ones. In addition, in some drawings, XY-Z rectangular coordinates are shown for reference. In this rectangular coordinate, the Z direction corresponds to the upper direction, and the −Z direction corresponds to the downward direction (the direction of the action of gravity).

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. As shown in FIGS. 1 and 2 , the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , The spin-rinsing dryer 600 , the conveying device 700 , and the control module 800 .

The loading port 100 is used for loading substrates stored in cassettes such as FOUPs (not shown) in the plating apparatus 1000 , or modules for unloading the substrates from the plating apparatus 1000 to the cassettes. In this embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrates can be performed via a temporary stage (not shown).

The aligner 120 is a module for aligning the positions of the orientation plane grooves and the like of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 replaces the air inside the pattern formed on the substrate surface with the processing liquid so that the plated surface of the substrate before the plating treatment is wetted with the processing liquid such as pure water or degassed water. The pre-wetting module 200 is configured to carry out the pre-wetting treatment, and at the time of plating, the plating solution can be easily supplied to the inside of the pattern by replacing the treatment solution inside the pattern with the plating solution. In this embodiment, two pre-wet modules 200 are arranged in parallel in the up-down direction, but the number and arrangement of the pre-wet modules 200 are not limited.

For example, the prepreg module 300 is configured to perform a prepreg treatment, which is etched with a treatment solution such as sulfuric acid or hydrochloric acid to remove a large-resistance oxide film formed on the surface of the seed layer of the plated surface of the substrate before the plating treatment. , to clean or activate the surface of the plated substrate. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs plating processing on the substrate. In this embodiment, there are two sets of plating modules 400 in which three are arranged in parallel in the vertical direction and 12 out of four are arranged in parallel in the horizontal direction, and a total of 24 plating modules 400 are provided, but the plating modules 400 The quantity and configuration are not limited.

The cleaning module 500 is configured to perform a cleaning process on a substrate, and to remove the plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-rinsing dryer 600 is a module for rotating and drying the substrate after the cleaning process at a high speed. In this embodiment, two spin-rinsing-dryers are arranged in parallel in the up-down direction, but the number and arrangement of the spin-rinsing-dryers are not limited. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the coating apparatus 1000, and may be configured by, for example, a general computer or a dedicated computer, and has an input/output interface between the control module and the operator.

An example of a series of plating processes in the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are carried into the loading port 100 . Continuing, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the position of the orientation plane or groove of the substrate in a specified direction. The transfer robot 110 delivers the substrate in the alignment direction of the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wetting module 200 . The pre-wetting module 200 performs pre-wetting treatment on the substrate. The transfer device 700 transfers the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg processing on the substrate. The transfer device 700 transfers the prepreg-processed substrate to the plating module 400 . The plating module 400 performs plating processing on the substrate.

The transfer device 700 transfers the substrate after the plating process to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600 . The spin rinse dryer 600 performs drying processing on the substrate. The transfer device 700 delivers the substrate after the drying process to the transfer robot 110 . The transfer robot 110 transfers the substrates received from the transfer device 700 to the cassettes of the loading port 100 . Finally, the cassette in which the substrates are accommodated is carried out from the load port 100 .

In addition, the structure of the coating apparatus 1000 demonstrated to FIG. 1 and FIG. 2 is only an example, and the structure of the coating apparatus 1000 is not limited to the structure of FIG. 1 and FIG. 2. FIG.

Continuing, the plating module 400 will be described. In addition, since a plurality of plating modules 400 included in the plating apparatus 1000 of the present embodiment have the same configuration, one plating module 400 will be described.

FIG. 3 is a schematic diagram showing the structure of the coating module 400 in the coating apparatus 1000 of the present embodiment. The plating apparatus 1000 of the present embodiment is a cup-type plating apparatus. The plating module 400 of the plating apparatus 1000 of the present embodiment includes a plating tank 10 , an overflow tank 20 , a substrate holder 30 , a rotation mechanism 40 , a tilt mechanism 45 , and a lift mechanism 50 . In addition, in FIG. 3, the cross section of some members (the plating tank 10, the overflow tank 20, the board|substrate holder 30, etc.) is shown schematically.

The plating tank 10 of the present embodiment is constituted by a bottomed container having an upper opening. Specifically, the plating tank 10 has: a bottom wall 10a; an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a; and an upper portion of the outer peripheral wall 10b is opened. In addition, the shape of the outer peripheral wall 10b of the coating tank 10 is not particularly limited, and an example of the outer peripheral wall 10b of the present embodiment has a cylindrical shape. The plating solution Ps is stored inside the plating tank 10 .

The plating solution Ps should just be a solution containing ions of metal elements constituting the plating film, and specific examples thereof are not particularly limited. In the present embodiment, an example of the plating treatment is the use of copper plating treatment, and an example of the plating solution Ps is the use of a copper sulfate solution. In addition, in the present embodiment, a predetermined additive is contained in the plating solution Ps. However, it is not limited to this structure, and the structure which does not contain an additive may be sufficient as the plating solution Ps.

The plating tank 10 is provided with a plating liquid supply port (not shown) for supplying the plating liquid Ps to the plating tank 10 . The plating liquid supply port of this embodiment is arrange|positioned at the bottom wall 10a of the plating tank 10, and supplies the plating liquid Ps toward the upper direction. In addition, "F1" shown in FIG. 3 shows an example of the flow direction of the plating liquid Ps supplied from the plating liquid supply port.

An anode 11 is arranged inside the coating tank 10 . Specifically, an example of the anode 11 of the present embodiment is arranged on the bottom wall 10 a of the coating tank 10 . The specific type of the anode 11 is not particularly limited, and it may be a non-dissolving anode or a dissolving anode. In the present embodiment, a non-dissolving anode is used as an example of the anode 11 . The specific type of the non-dissolving anode is not particularly limited, and platinum, iridium oxide, etc. can be used. In addition, the substrate Wf and the anode 11 are electrically connected to an energizing device (not shown). This energizing device is a device for energizing between the substrate Wf and the anode 11 when the plating process is performed.

Inside the plating tank 10 , a resistor 12 is arranged above the anode 11 . Specifically, the resistor body 12 is constituted by a porous plate member having a plurality of holes (pores). The resistor 12 is a member provided in order to uniformize the electric field formed between the anode 11 and the substrate Wf. Therefore, by arranging the resistor body 12 in the plating tank 10, the film thickness of the plating film (plating layer) formed on the substrate Wf can be easily made uniform. In addition, the resistor body 12 is not an essential member in this embodiment, and the plating apparatus 1000 may be configured without the resistor body 12 .

The overflow tank 20 is disposed outside the coating tank 10 and is constituted by a bottomed container. The overflow tank 20 is provided for temporarily storing the plating solution Ps exceeding the upper end of the outer peripheral wall 10b of the coating tank 10 (that is, the plating solution Ps overflowing from the plating tank 10). The plating solution Ps temporarily stored in the overflow tank 20 is discharged from a discharge port (not shown) for the overflow tank 20 and then temporarily stored in a storage tank (not shown) for the overflow tank 20 . The plating liquid Ps stored in the storage tank is then pressure-fed by a pump (not shown), and is circulated again to the plating tank 10 from the plating liquid supply port.

The substrate holder 30 is arranged above the anode 11 (in this embodiment, above the resistor 12 ). The substrate holder 30 holds the substrate Wf serving as the cathode with the plated surface Wfa of the substrate Wf facing downward.

Referring to FIG. 3 , particularly an enlarged view of part A1, the substrate holder 30 of the present embodiment has a ring 31 (an annular member) that protrudes downward from the outer peripheral edge of the plated surface Wfa of the substrate Wf (the ring 31 See Figure 5 below for the bottom view). In addition, “h1” shown in the enlarged view of the part A1 of FIG. 3 represents the height (protrusion height) of the ring 31 . In addition, in this embodiment, although the lower surface 31a of the ring 31 is substantially a plane (a plane extending in a horizontal direction), it is not limited to this structure. For example, the lower surface 31a of the ring 31 may be inclined to the horizontal direction.

The material of the substrate holder 30 (including the ring 31 ) is not particularly limited, but polyvinyl chloride (PVC) is used as an example of the present embodiment. In addition, a sealing member (not shown) for preventing the plating solution Ps from entering the gap between the substrate holder 30 and the substrate Wf may be disposed between the substrate holder 30 and the substrate Wf. That is, at this time, the substrate holder 30 holds the substrate Wf via the sealing member. As the material of the sealing member, fluororubber (FKM) or the like can be used.

The substrate holder 30 is connected to the rotation mechanism 40 . The rotation mechanism 40 is a mechanism for rotating the substrate holder 30 . Specifically, the rotation mechanism 40 of the present embodiment is configured to rotate the substrate holder 30 in the forward rotation direction ( R1 ). In addition, in the present embodiment, among the rotation directions of the substrate holder 30 , an example of the forward rotation direction ( R1 ) is the clockwise direction when the substrate holder 30 is viewed in plan (or plan view) from above. The specific type of the rotating mechanism 40 is not particularly limited, and for example, a conventional rotating motor can be used.

The tilt mechanism 45 is a mechanism for tilting the substrate holder 30 with respect to the horizontal plane. Specifically, the tilt mechanism 45 of the present embodiment tilts the substrate holder 30 so as to tilt the rotation mechanism 40 . As such a tilt mechanism 45, a known tilt mechanism such as a piston cylinder can be used, for example. The elevating mechanism 50 is supported by a support shaft 51 extending in the up-down direction. The elevating mechanism 50 is a mechanism for elevating the substrate holder 30 , the rotating mechanism 40 , and the tilting mechanism 45 in the vertical direction. As the elevating mechanism 50, a known elevating mechanism such as a linear actuator can be used.

The action of the coating module 400 is controlled by the control module 800 . The control module 800 includes a microcomputer including a CPU (Central Processing Unit) serving as a processor, a memory device serving as a non-transitory memory medium, and the like. The control module 800 is used as the operation of the CPU of the processor according to the instructions of the program stored in the memory device to control the controlled parts (such as the rotating mechanism 40, the tilting mechanism 45, the lifting mechanism 50, etc.) of the coating module 400. action.

FIG. 4 is a schematic cross-sectional view showing a state in which the substrate Wf is immersed in the plating solution Ps. During the plating process "during the plating process" performed on the plated surface Wfa of the substrate Wf, the rotation mechanism 40 rotates the substrate holder 30, the elevating mechanism 50 moves the substrate holder 30 downward, and the substrate Wf is immersed in the in the plating solution Ps of the plating tank 10 . In addition, the substrate holder 30 may be rotated before the plating surface Wfa of the substrate Wf is brought into contact with the plating solution Ps, or may be rotated after being brought into contact with the plating solution Ps. Next, electricity is supplied between the anode 11 and the substrate Wf by the electricity supply means. Thereby, a plated film is formed on the plated surface Wfa of the substrate Wf. In addition, during the plating process, the tilt mechanism 45 can also tilt the substrate holder 30 as required.

Furthermore, in the cup-type plating apparatus 1000 of the present embodiment, bubbles (Bu: this symbol is shown in FIG. 5 described later) are generated in the plating solution Ps of the plating tank 10 for some reason. Specifically, when a non-dissolving anode is used as the anode 11 as in the present embodiment, oxygen (O ₂ ) is generated in the plating solution Ps according to the following reaction formula when the plating process is performed (at the time of energization). At this time, the generated oxygen becomes bubbles.

2H ₂ O→O ₂ +4H ⁺ +4e ^-

In addition, if a dissolved anode is used as the anode 11, although the above-mentioned reaction formula does not occur, for example, when the plating solution Ps is first introduced into the plating tank 10, air flows into the plating tank together with the plating solution Ps. 10 Danger. Therefore, even when a dissolved anode is used as the anode 11 , there is a possibility that bubbles are generated in the plating solution Ps of the plating tank 10 .

As described above, when air bubbles are generated in the plating solution Ps of the plating tank 10 , if the air bubbles remain on the plated surface Wfa of the substrate Wf, the retained air bubbles may block the electric field. In this case, there is a possibility that the plating quality of the substrate Wf may be deteriorated. Therefore, the present embodiment employs the technique described below in order to deal with this problem.

FIG. 5 is a schematic bottom view showing a state in which the substrate holder 30 is recognized from below. Referring to FIG. 5 , and the aforementioned FIG. 3 , particularly the enlarged view of the part A1, at least one protrusion 35 protruding downward is disposed on a part of the lower surface 31 a of the ring 31 of the present embodiment. The number of protrusions 35 may be one or a plurality of protrusions, but in one example, the number of protrusions 35 in this embodiment is one.

The protrusions 35 are configured so that the protrusions 35 rotate the plating liquid Ps in the substrate holder 30 when the substrate holder 30 is rotated by the rotation mechanism 40 in a state where the plating surface Wfa of the substrate Wf is immersed in the plating liquid Ps. direction roll out.

Specifically, as shown in FIG. 5 , the projection 35 of the present embodiment is constituted by a plate member having an axis AL1 extending from the inner peripheral side toward the outer peripheral side of the lower surface 31a of the ring 31 . With this configuration, the projections 35 can effectively push out the plating solution Ps in the rotational direction of the substrate holder 30 .

In addition, the specific shape of the protrusion 35 is not specifically limited, An example of the protrusion 35 of this embodiment has the shape of a rectangle whose longitudinal direction is the direction of the axis AL1 in a bottom view.

According to the present embodiment as described above, in a state where the plating surface Wfa of the substrate Wf is immersed in the plating liquid Ps, the substrate holder 30 is rotated so that the plating liquid Ps can be transferred to the substrate holder via the protrusions 35 30 is pushed out in the rotational direction, whereby the flow (liquid flow) of the strong plating solution Ps can be generated from the center side toward the outer peripheral side of the plating surface Wfa of the substrate Wf. By this strong liquid flow, the air bubbles (Bu) existing on the plated surface Wfa of the substrate Wf can pass over the ring 31 and be discharged to the outside of the ring 31 (in addition, "F2" in FIG. 5 shows an example of the bubble flow direction. Wire). That is, the air bubbles existing in the plated surface Wfa of the substrate Wf can be removed from the plated surface Wfa. Thereby, deterioration of the plating quality of the substrate Wf due to the air bubbles remaining on the plating surface Wfa of the substrate Wf can be suppressed.

(Example) In the above-mentioned coating apparatus 1000, it was experimentally confirmed that when "the rotation speed of the substrate holder 30" and "the angle θ formed by the axis AL1 of the protrusion 35 and the tangent TL of the inner peripheral surface 31b of the ring 31" were changed, the The degree to which the plated surface Wfa of Wf removes air bubbles. In addition, the “angle θ” formed by the axis AL1 and the tangent line TL is, specifically, “when the substrate holder 30 rotates in one direction (forward rotation in the present embodiment) from the direction of rotation of the substrate holder 30 . The angle θ measured when the side of the axis AL1 faces the side of the tangent line TL. The experimental results are described below.

The coating apparatus 1000 used in the experiment is the coating apparatus 1000 illustrated in FIGS. 3 to 5 . Specifically, the height (h1) of the ring 31 is 2.5 mm, the height (h2) of the protrusion 35 is 5 mm, and the ring The distance (d) in the horizontal direction between the inner peripheral surface 31b of the 31 and the protrusion 35 is 0.5 mm. The substrate Wf held by the substrate holder 30 is immersed in the plating solution Ps of the plating tank 10, and 0.1 ml of air bubbles are retained on the plated surface Wfa of the substrate Wf, and then the substrate holder is rotated by the rotation mechanism 40. 30 Rotate in the forward rotation direction at the rotational speed (revolutions per minute: rpm) described in Table 1. The degree of removal of air bubbles from the plated surface Wfa of the substrate Wf at this time was visually measured.

The measurement results are shown in Table 1. In addition, the rotation speed of the substrate holder 30 shown in Table 1 is in a range from a low speed (10 rpm) to a high speed (100 rpm), but this is the range of the rotation speed assuming that the plating apparatus 1000 is in normal use. In addition, when the rotational speed of the substrate holder 30 was greater than 100 rpm, the same results as when the rotational speed was 100 rpm were obtained. Therefore, the indication of the measurement results when the rotational speed is greater than 100 rpm is omitted.

〔Table 1〕 Angle (θ) 0°≦θ＜20° 20°≦θ＜60° 60°≦θ＜120° 120°＜θ≦160° 160°＜θ≦180° Rotation speed (rpm) 10 D D D D D 20 D D D D D 25 D D C C D 30 D D B A D 40 D B B A D 50 D B B A D 60 D B B A D 70 D B A A D 100 C B A A C

In Table 1, the degree of removal of air bubbles from the plated surface Wfa of the substrate Wf increased in the order of D, C, B, and A. In other words, the time required to remove air bubbles from the plated surface Wfa of the substrate Wf is shortened in the order of D, C, B, and A. In addition, "A" refers to the degree of removal of air bubbles, which means that air bubbles existing inside the inner peripheral surface 31b of the ring 31 can be reliably discharged to the outside of the ring 31 when the air bubbles reach the position of the protrusions 35 . "B" means that it takes longer than "A" to discharge the air bubbles existing inside the ring 31 to the outside of the ring 31, "C" means that it takes this time than "B", and "D" means that it takes this time than "C".

As can be seen from Table 1, even when the angle θ is in the range of 0° or more and 180° or less, within the range of the rotation speed of the substrate holder 30 (from low within the range of high speed), at least a "D" rating or higher will be obtained. That is, it is understood that the protrusions 35 are provided on the lower surface 31a of the ring 31 of the substrate holder 30 so that the substrate holder 30 can be rotated to remove air bubbles existing on the plated surface Wfa of the substrate Wf from the plated surface Wfa.

However, compared with the evaluation of "D", the evaluation of "C" or higher is preferable because the bubble removal effect is high. The combination of "angle θ and rotational speed" that obtained the evaluation of "C" or higher is as follows.

That is, when the angle θ is 0° or more and less than 20°, when the substrate holder 30 is rotated at 100 rpm or more, an evaluation of "C" or more can be obtained. Similarly, when the angle θ is 20° or more and less than 60°, the substrate holder 30 is preferably rotated at 40 rpm or more, and when the angle θ is 60° or more and 120° or less, the substrate holder 30 is preferably rotated at 25 rpm or more. When the angle θ is greater than 120° and less than 160°, the substrate holder 30 is preferably rotated at 25 rpm or more, and when the angle θ is greater than 160° and 180° or less, the substrate holder 30 is rotated at 100 rpm or more. should.

In addition, it is understood from Table 1 that when the angle θ is in the range of 60° or more and 160° or less, compared with the case where the angle θ is less than 60° and when the angle θ is greater than 160°, the substrate holder 30 obtained the evaluation of “C” or higher. Rotation speed range expanded. That is, when the angle θ is in the range of 60° or more and 160° or less, compared with the case where the angle θ is smaller than 60° and when the angle θ is larger than 160°, a high rotational speed can be obtained over a wide range of the rotation speed of the substrate holder 30 . Bubble removal effect.

In addition, it is understood from Table 1 that when the angle θ is in the range of 60° or more and 160° or less, and the angle θ is larger than 120° and 160° or less, compared with the case where the angle θ is 60° or more and 120° or less, " The rotation speed range of the substrate holder 30 evaluated by A" was expanded. That is, when the angle θ is larger than 120° and 160° or less, the highest bubble removal effect can be obtained over a wide range of the rotational speed of the substrate holder 30 .

In addition, the angle θ of the protrusions 35 in FIG. 5 is in the range of 60° or more and 160° or less, specifically, in the range greater than 120° and 160° or less.

In addition, it is understood from Table 1 that when the angle θ is in the range of 60° or more and 160° or less, when the rotation speed of the substrate holder 30 is 30 rpm or more, the bubble removal effect is higher than when the angle θ is less than 30 rpm. That is, when the angle θ is in the range of 60° or more and 160° or less, the rotation speed of the substrate holder 30 is preferably 30 rpm or more.

In addition, the bubble removal method of the plating apparatus of this embodiment is implemented by the above-mentioned plating apparatus 1000. Therefore, in order to omit the repeated description, the detailed description of this bubble removal method is abbreviate|omitted.

(Variation 1 of the embodiment) In the above-mentioned embodiment, the protrusion 35 has a rectangular shape when viewed from the bottom, but the shape of the protrusion 35 is not limited to this. 6(A) is a schematic bottom view of a portion (A2 portion) in the vicinity of the projection 35A of the substrate holder 30A of the plating apparatus 1000A of the modification 1 of the embodiment. The protrusion 35A of the present modification has a triangular shape when viewed from the bottom. Specifically, the protrusion 35A of this modification has an apex in the direction of the axis AL1 and the inner circumference of the ring 31 , and has a triangular shape whose width increases from the apex toward the outer circumference of the ring 31 . In this modified example, the same functions and effects as those of the foregoing embodiment can also be achieved.

(Variation 2 of the embodiment) 6(B) is a schematic bottom view of a portion (A2 portion) near the projection 35B of the substrate holder 30B of the plating apparatus 1000B according to Modification 2 of the embodiment. The protrusion 35B of this modification has the shape of a rhombus (or a parallelogram) when viewed from the bottom. Specifically, the protrusion 35B of the present modification has a shape of a rhombus (or a parallelogram) whose length in the direction of the axis AL1 is longer than that in the direction perpendicular to the axis AL1. In this modified example, the same functions and effects as those of the foregoing embodiment can also be achieved.

6(A) and FIG. 6(B) are merely examples of other shapes of the protrusions 35, and the other shapes of the protrusions 35 are not limited to these.

(Variation 3 of the embodiment) FIG. 7 is a schematic bottom view of a substrate holder 30C of a coating apparatus 1000C according to Modification 3 of the embodiment. In addition, FIG. 7 schematically shows the same parts as those in the aforementioned FIG. 5 . The substrate holder 30C of the present modification is different from the aforementioned substrate holder 30 of FIG. 5 in that it has a plurality of protrusions 35 .

Specifically, the plurality of protrusions 35 in this modification are arranged at equal intervals on the lower surface 31 a of the ring 31 . More specifically, the plurality of protrusions 35 are arranged at intervals of 45° in the circumferential direction of the lower surface 31 a of the ring 31 . In addition, in this modification, the angle θ of each protrusion 35 is in the range of 60° or more and 160° or less, specifically, larger than 120° and 160° or less, as in the case of FIG. 5 .

In addition, the number of the plurality of protrusions 35 is not limited to the above-mentioned four, and may be less than four or more. In addition, the shape of each protrusion 35 is not limited to the rectangular shape illustrated in FIG. 7 , and may be a shape other than a rectangular shape (for example, the shapes illustrated in Variation 1 and Variation 2).

According to this modification, since the number of the protrusions 35 is plural, the alignment frequency between the bubbles existing on the plated surface Wfa of the substrate Wf and the position of the protrusion 35 can be increased compared to when the number of the protrusions 35 is one. . Thereby, the air bubbles existing in the surface to be plated Wfa can be efficiently discharged to the outside of the ring 31 and removed efficiently.

(Variation 4 of the embodiment) FIG. 8 is a schematic bottom view of the substrate holder 30D of the coating apparatus 1000D according to Modification 4 of the embodiment. The substrate holder 30D of this modification is different from the substrate holder 30 of FIG. 5 in that it has the first protrusion 36 and the second protrusion 37 as a plurality of protrusions.

The first protrusion 36 has the same structure as the protrusion 35 of FIG. 5 described above. That is, the first protrusion 36 is formed so that the angle formed by the axis AL1 and the tangent TL is formed from the side of the axis AL1 toward the tangent TL in the rotation direction of the substrate holder 30D when the substrate holder 30D is rotated forward. The angle θ" at the time of side measurement is 60° or more and 160° or less of the protrusion. Specifically, the "angle θ" of the first protrusions 36 of the present modification is larger than 120° and is in the range of 160° or less.

In addition, the second protrusion 37 is formed so that the angle formed by the axis line AL1 and the tangent line TL is formed from the side of the axis line AL1 toward the side of the tangent line TL in the rotation direction of the substrate holder 30D when the substrate holder 30D is reversed. The angle θ2" at the time of measurement is a protrusion of 60° or more and 160° or less. Specifically, the "angle θ2" of the second protrusion 37 of the present modification is larger than 120° and is in the range of 160° or less.

The rotation mechanism 40 of the present modification performs the forward rotation ( R1 ) and the reverse rotation (− R1 ) of the substrate holder 30D at least once each at the time of the plating process. Specifically, during the plating process, the rotating mechanism 40 can also make the substrate holder 30D rotate forwardly and then reversely within a specified time, or can also make the substrate holder 30D rotate forwardly after a specified time The forward rotation and reverse rotation (or reverse rotation and forward rotation) of the substrate holder 30D can be repeated several times.

In the plating process with this modification, when the substrate holder 30D rotates (forward rotation and reverse rotation), any one of the first protrusion 36 and the second protrusion 37 "is the angle formed by the axis AL1 and the tangent TL, and The angle "when measured from the side of the axis AL1 toward the side of the tangent line TL" in the rotation direction of the substrate holder 30D is 60° or more and 160° or less. Specifically, during the plating process, when the substrate holder 30D is rotated forward, the "angle θ" of the first protrusion 36 is 60° or more and 160° or less, and when the substrate holder 30D is reversed, the first projection 36 is The "angle θ2" of the two protrusions 37 is 60° or more and 160° or less. Therefore, when the angle of the protrusions disposed on the ring 31 when the substrate holder 30D is rotated during the plating process is not 60° or more and 160° or less (that is, the angle of the protrusions is less than 60° or greater than 160°) ), a high bubble removal effect can be obtained in a wide range of the rotation speed of the substrate holder 30 .

(Variation 5 of the embodiment) FIG. 9 is a schematic cross-sectional view of the surrounding structure of a coating tank 10 of a coating apparatus 1000E according to Modification 5 of the embodiment. FIG. 10 is a diagram schematically showing a cross section taken along the line B1-B1 in FIG. 9 . The coating apparatus 1000E of the present modification is different from the coating apparatus 1000 ( FIG. 3 ) of the aforementioned embodiment in that it further includes at least one supply port 60 and at least one discharge port 61 . Specifically, the coating apparatus 1000E of the present modification includes a plurality of supply ports 60 and discharge ports 61 , respectively.

The supply port 60 is provided in the outer peripheral wall 10 b of the coating tank 10 , and is configured to supply the plating solution Ps to the coating tank 10 . The discharge port 61 is provided in the outer peripheral wall 10b of the coating tank 10 so as to face the supply port 60 . Moreover, the discharge port 61 is comprised so that the plating solution Ps of the coating tank 10 may be sucked in and discharged from the coating tank 10 . The supply port 60 and the discharge port 61 suck the plating solution Ps supplied from the supply port 60 through the discharge port 61 to form a plating along the plating surface Wfa under the plating surface Wfa of the substrate Wf in the plating tank 10 Shear flow of liquid Ps (F3).

Specifically, as shown in FIG. 9 , the supply port 60 and the discharge port 61 of the present modification are arranged at a position higher than the resistor body 12 inside the plating tank 10 . As shown in FIG. 10, the supply port 60 of this modification is arrange|positioned over the whole circumference of one side with respect to the axis line AL2 (line which shows the center axis) of the outer peripheral wall 10b of the coating tank 10. Moreover, the discharge port 61 is arrange|positioned over the whole periphery of the other side with respect to the axis line AL2 of the outer peripheral wall 10b of the coating tank 10. In other words, the supply port 60 is arranged over the half circumference of the outer peripheral wall 10b, and the discharge port 61 is arranged over the other half of the outer peripheral wall 10b.

In addition, in this modification, the partition wall 62a is provided between the adjacent supply ports 60, and the partition wall 62b is provided between the adjacent discharge ports 61. Moreover, the upstream part of the some supply port 60 merges, and this merged part is called the merge port 63a. In addition, the part on the downstream side of the some discharge port 61 merges, and this merged part is called a merge port 63b. However, the configuration of the supply port 60 and the discharge port 61 is not limited to this. For example, the upstream side of the plurality of supply ports 60 may be configured to be non-merged, and the downstream side of the plurality of discharge ports 61 may be configured to be non-merged.

In addition, the number of the supply port 60 and the discharge port 61 should just be able to form a shear flow (F3), and is not limited to plural. For example, the coating apparatus 1000E may be configured to include only one supply port 60 and one discharge port 61, respectively. In this case, in FIG. 10 , for example, it is only necessary to have a configuration in which the partition wall 62 a and the partition wall 62 b are not provided. That is, at this time, in FIG. 10 , the adjacent supply ports 60 are connected to form one large supply port so that there is no partition wall 62a. Similarly, the adjacent discharge ports 61 are connected to form one large discharge port so that there is no partition wall 62b.

In addition, the timing for starting supply of the plating solution Ps from the supply port 60 and the timing for starting suction of the plating solution Ps from the discharge port 61 may be started at least at the time when the plating process is started, and the specific timing is not particularly limited. Qualifier. For example, the supply and suction of the plating solution Ps may be started before the substrate Wf comes into contact with the plating solution Ps, or the supply and suction of the plating solution may be started after the substrate Wf is immersed in the plating solution Ps and before the start of the plating process. Liquid Ps.

According to this modification, when the plating surface Wfa of the substrate Wf is immersed in the plating solution Ps, the air bubbles generated in the center of the plating surface Wfa of the substrate Wf can be easily directed toward the center of the plating surface Wfa by the shear flow (F3). The peripheral side moves. Thereby, the air bubbles moved to the outer peripheral side can be efficiently discharged to the outside of the ring 31 by the protrusion 35 .

In addition, the present modification may further include any one of the features of the modification 1 to 4 described above.

(Variation 6 of the embodiment) FIG. 11 is a schematic diagram of a plating apparatus 1000F for explaining a modification example 6 of the embodiment. The plating apparatus 1000F of the present modification is further provided with a flow mechanism 70 which is configured to flow the plating solution Ps in the plating tank 10 to allow the plating solution Ps to flow before the plating surface Wfa of the substrate Wf is immersed in the plating solution Ps. The liquid surface of the plating solution Ps in the center of the coating tank 10 is raised upward. The other structures are the same as those of the coating apparatus 1000 of the aforementioned embodiment.

Specifically, the flow mechanism 70 of the present modification is arranged in the center of the bottom wall 10a of the coating tank 10, and is constituted by a discharge port that discharges the coating solution Ps upward. The liquid surface of the plating liquid Ps in the center of the coating tank 10 can be easily raised upward so that the plating liquid Ps is discharged upward from the discharge port.

The elevating mechanism 50 of the present modification lowers the substrate holder 30 in a state where the liquid surface of the plating solution Ps in the center of the plating tank 10 is raised upward. Thereby, the center of the plated surface Wfa of the substrate Wf can be brought into contact with the plating solution Ps earlier than the outer periphery of the plated surface Wfa.

In addition, in this modification, the substrate holder 30 may start to rotate before the plating surface Wfa of the substrate Wf contacts the plating solution Ps, or may rotate after the plating surface Wfa contacts the plating solution Ps.

In this modified example, the resistor 12 is arranged in the plating tank 10 , but the resistor 12 may not be arranged in the plating tank 10 as in the above-mentioned embodiment. In addition, when the resistor body 12 is not arranged in the plating tank 10, the liquid surface of the plating solution Ps in the center of the plating tank 10 can be easily raised upward compared with the case where the resistor 12 is arranged.

According to this modification, when the plating surface Wfa of the substrate Wf contacts the plating solution Ps, the center of the plating surface Wfa can be brought into contact with the liquid earlier, so that the air bubbles existing in the center of the plating surface Wfa escape to the plating surface Wfa. On the outer peripheral side, the surface to be plated Wfa can be immersed in the plating solution Ps. As a result, the air bubbles moved to the outer peripheral side can be effectively discharged to the outside of the ring 31 by the protrusions 35 .

In addition, the present modification may further include any one of the features of the modification 1 to 4 described above.

(Variation 7 of the embodiment) FIG. 12 is a schematic diagram for explaining a plating apparatus 1000G of Modification 7 of the embodiment. The plating apparatus 1000G of the present modification is configured so that the plating surface Wfa of the substrate Wf is in contact with the liquid in a state inclined with respect to the horizontal liquid surface of the plating liquid Ps of the plating tank 10 . Device 1000 is different.

Specifically, the coating apparatus 1000G of the present modification implements the above-described configuration by the tilt mechanism 45 . More specifically, the tilt mechanism 45 of the coating apparatus 1000G tilts the substrate holder 30 with respect to the horizontal plane in a state where the plated surface Wfa of the substrate Wf is positioned above the liquid level of the plating solution Ps. Next, in such a state that the substrate holder 30 is inclined, the elevating mechanism 50 lowers the substrate holder 30 to immerse the plated surface Wfa of the substrate Wf in the plating solution Ps.

In addition, in the present modification, the substrate holder 30 may start to rotate before the plating surface Wfa of the substrate Wf contacts the plating solution Ps, or may rotate after it contacts the plating solution Ps.

According to this modification, when the plating surface Wfa of the substrate Wf contacts the plating solution Ps, the air bubbles present on the plating surface Wfa can be moved obliquely upward along the plating surface Wfa by buoyancy, and the plating surface Wfa can be immersed in the plating solution Ps. Thereby, the air bubbles can be efficiently moved to the outer peripheral side of the surface to be plated Wfa. As a result, the air bubbles moved to the outer peripheral side can be efficiently discharged to the outside of the ring 31 by the protrusions 35 .

In addition, the present modification may further include any one of the features of the modification 1 to 4 described above.

(Variation 8 of the embodiment) FIG. 13 is a schematic diagram of a plating apparatus 1000H for explaining a modification example 8 of the embodiment. The plating apparatus 1000H of the present modification is configured so that the plating surface Wfa of the substrate Wf is inclined with respect to the horizontal liquid surface of the plating solution Ps of the plating tank 10 by installing the plating apparatus 1000H in a state inclined with respect to the horizontal plane in advance. in contact with liquids. That is, at least the substrate holder 30 and the coating tank 10 of the coating apparatus 1000H of the present modification are provided in a state inclined with respect to the horizontal plane in advance. This modification is different from the coating apparatus 1000G of the modification 7 described above. In addition, in this modification, the plating apparatus 1000H may include the tilt mechanism 45 .

Even this modification can still achieve the same function and effect as the coating apparatus 1000G of the aforementioned modification 7.

In addition, the present modification may further include any one of the features of the modification 1 to 4 described above.

(Variation 9 of the embodiment) FIG. 14 is a schematic diagram for explaining a plating apparatus 1000I of Modification 9 of the embodiment. The coating apparatus 1000I of the present modification is different from the coating apparatus 1000 of the aforementioned embodiment in that the paddle 80 is further provided.

The paddle 80 is arranged above the anode 11 and below the substrate Wf. Specifically, in the plating tank 10 of this modification, the resistor 12 is arranged above the anode 11 , and therefore, the paddle 80 is arranged above the resistor 12 and below the substrate Wf. The paddle 80 reciprocates in the horizontal direction so as to be driven by a paddle driving device (not shown). Thereby, the plating solution Ps in the plating tank 10 is stirred. In addition, "mv" in the illustration is a symbol showing an example of the moving direction of the blade 80 .

FIG. 15 is a schematic top view showing a situation in which the blade 80 is recognized from above. The paddle 80 of the present modification is provided with: a plurality of stirring members 81 extending in a direction perpendicular to the reciprocating movement direction of the paddle 80; a connecting member 82a connecting one end of the plurality of stirring members 81 in the extending direction of the plurality of stirring members 81; And the connection member 82b which connects the edge part of the other side in the extending direction of the several stirring member 81. When the paddle 80 moves back and forth, the stirring member 81 of the paddle 80 stirs the plating solution Ps.

In addition, the start timing of the reciprocating movement of the paddle 80 may be started at least during the plating process, and the specific timing is not particularly limited. For example, the paddle 80 may start to move back and forth before the substrate Wf contacts the plating solution Ps. Alternatively, the paddle 80 may start to move back and forth after the substrate Wf contacts the plating solution Ps and before starting the plating process (before starting the energization of the substrate Wf).

According to this modification, by stirring the plating solution Ps with the paddle 80, the air bubbles present on the plating surface Wfa of the substrate Wf can be efficiently moved to the outer peripheral side of the plating surface Wfa. As a result, the air bubbles moved to the outer peripheral side can be effectively discharged to the outside of the ring 31 by the protrusions 35 .

In addition, the present modification may further include any one of the features of the modification 1 to 4 described above.

The embodiments and modifications of the present invention have been described above in detail, however, the present invention is not limited to the specific embodiments and modifications, and various modifications and changes can be further implemented within the scope of the gist of the present invention described in the scope of the claims. .

10: Plating tank 10a: Bottom wall 10b: Peripheral wall 11: Anode 12: Resistor body 20: Overflow tank 30, 30A~D: Substrate holder 31: Ring 31a: Below 31b: inner peripheral surface 35, 35A, 35B: Protrusions 36: The first protrusion 37: Second protrusion 40: Rotary Mechanism 45: Tilt Mechanism 50: Lifting mechanism 51: Pivot 60: Supply port 61: discharge port 62a, 62b: Dividing walls 63a, 63b: Confluence 70: Mobile Institutions 80: Paddle 400: Plating module 800: Control Module 1000, 1000A~I: Coating device

AL1,AL2: axis

TL: Tangent

Bu: bubble

Wf: substrate

F3: Shear Flow

Wfa: plated surface

Ps: plating solution

θ, θ2: angle

FIG. 1 is a perspective view showing the overall configuration of a coating apparatus according to an embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus according to the embodiment. FIG. 3 is a schematic diagram showing the structure of the coating module in the coating apparatus of the embodiment. FIG. 4 is a schematic cross-sectional view showing a state in which the substrate of the embodiment is immersed in a plating solution. 5 is a schematic bottom view of the substrate holder of the embodiment. FIG. 6(A) is a schematic bottom view of a portion near the protrusion of the substrate holder of the plating apparatus according to Modification 1 of the embodiment. FIG. 6(B) is a schematic bottom view of the portion near the protrusion of the substrate holder of the plating apparatus according to Modification 2 of the embodiment. Fig. 7 is a schematic bottom view of a substrate holder of a plating apparatus according to Modification 3 of the embodiment. FIG. 8 is a schematic bottom view of a substrate holder of a plating apparatus according to Modification 4 of the embodiment. FIG. 9 is a schematic cross-sectional view of the surrounding structure of a coating tank of a coating apparatus according to Modification 5 of the embodiment. FIG. 10 is a schematic diagram of a cross section taken along the line B1-B1 in FIG. 9 . FIG. 11 is a schematic diagram of a plating apparatus for explaining a modification example 6 of the embodiment. FIG. 12 is a schematic diagram of a plating apparatus for explaining a modification example 7 of the embodiment. FIG. 13 is a schematic diagram of a plating apparatus for explaining a modification example 8 of the embodiment. FIG. 14 is a schematic diagram of a plating apparatus for explaining a modification example 9 of the embodiment. Fig. 15 is a schematic plan view of a blade of Modification 9 of the embodiment.

10: Plating tank

10a: Bottom wall

10b: Peripheral wall

11: Anode

12: Resistor body

20: Overflow tank

30: Substrate holder

31: Ring

31a: Below

31b: inner peripheral surface

35: Protrusions

40: Rotary Mechanism

45: Tilt Mechanism

50: Lifting mechanism

51: Pivot

400: Plating module

1000: Coating device

Wf: substrate

Wfa: plated surface

Claims (11)

A plating apparatus is provided with: a plating tank that stores a plating solution, and an anode is arranged inside; The plated surface faces downward, and has a ring that protrudes below the outer periphery of the plated surface of the substrate; a rotation mechanism, which rotates the substrate holder; and a lifting mechanism, which makes the substrate holder move up and down; At least one protrusion protruding downward is arranged on a part of the lower surface of the ring, and the protrusion is formed of a plate member having an axis extending from the inner peripheral side to the outer peripheral side of the lower surface of the ring. The coating apparatus according to claim 1, wherein the axis of the protrusions forms an angle with a tangent to the inner peripheral surface of the ring, and in the rotation direction of the substrate holder when the substrate holder rotates in one direction, from the When the angle measured from the side of the axis toward the tangent line is 0° or more and less than 20°, the rotation mechanism rotates the substrate holder at 100 rpm or more, and when the angle is 20° or more and less than 60°, When the rotation mechanism rotates the substrate holder at 40 rpm or more and the angle is 60° or more and 120° or less, the rotation mechanism rotates the substrate holder at 25 rpm or more, and the angle is greater than 120° and is 160° In the following case, the rotation mechanism rotates the substrate holder at 25 rpm or more, and when the angle is larger than 160° and is 180° or less, the rotation mechanism rotates the substrate holder at an angle of 25 rpm or more. Rotate above 100rpm. The coating apparatus of claim 2, wherein the angle is greater than or equal to 60° and less than or equal to 160°. The coating apparatus of claim 3, wherein the rotating mechanism rotates the substrate holder at 30 rpm or more. The coating apparatus of claim 1, wherein the number of the protrusions is plural. The coating apparatus of claim 2, wherein the number of the protrusions is plural, and the plurality of the protrusions include: a first protrusion, which is connected to the substrate holder in the rotation direction of the substrate holder from the The angle measured from the side of the axis toward the side of the tangent line is 60° or more and 160° or less; and a second protrusion, which extends from the axis in the direction of rotation of the substrate holder when the substrate holder is reversed. The angle when measured from the side facing the tangent line is 60° or more and 160° or less; the rotation mechanism is configured to hold the substrate when the plating process is performed on the plated surface of the substrate. The forward rotation and reverse rotation are performed at least once respectively. The coating apparatus according to claim 1, further comprising: at least one supply port, which is provided on the outer peripheral wall of the coating tank, and supplies the plating solution in the coating tank; and at least one discharge port, which is It is provided on the outer peripheral wall of the coating tank to face the supply port, sucks the plating solution in the coating tank, and discharges it from the coating tank; the supply port and the discharge port are configured to be sucked through the discharge port With the plating solution supplied from the supply port, a shear flow of the plating solution along the plating surface is formed under the plating surface of the substrate in the plating tank. The coating apparatus according to claim 1, further comprising a flow mechanism, which is based on the aforementioned Before the plated surface of the plate is immersed in the plating solution, the plating solution in the plating tank is made to flow, so that the liquid surface of the plating solution in the center of the plating tank is raised upward, and the lifting mechanism is located in the center of the plating tank. In a state where the liquid surface of the plating solution is raised upward, the substrate holder is lowered so that the center of the plated surface of the substrate contacts the plating solution earlier than the outer periphery of the plated surface. The plating apparatus according to claim 1, wherein the plating apparatus is configured to contact the liquid in a state where the horizontal liquid level of the plating liquid of the plating liquid of the substrate to be plated faces the plating tank in a tilted state. The coating apparatus according to claim 1, further comprising a paddle which is arranged above the anode in the coating tank and below the substrate, and stirs the above-mentioned reciprocating movement in the horizontal direction. The plating solution of the plating tank. A method for removing air bubbles in a plating apparatus, the plating apparatus comprising: a plating tank that stores a plating solution and has an anode disposed therein; and a substrate holder that is disposed above the anode and holds a The substrate of the cathode has the plated surface of the substrate facing downward, and has a ring that protrudes further downward than the outer periphery of the plated surface of the substrate; a portion of the lower surface of the ring is provided with at least one ring that protrudes downward. Each projection is formed by a plate member having an axis extending from an inner peripheral side toward an outer peripheral side of the lower surface of the ring, and the bubble removing method includes immersing the plated surface of the substrate in a plating solution Rotate the aforementioned substrate holder in the state of .

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