TWI761447B - Electromagnetic wave shielding film, shielding printed wiring board and electronic equipment - Google Patents
Electromagnetic wave shielding film, shielding printed wiring board and electronic equipment Download PDFInfo
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- TWI761447B TWI761447B TW107104531A TW107104531A TWI761447B TW I761447 B TWI761447 B TW I761447B TW 107104531 A TW107104531 A TW 107104531A TW 107104531 A TW107104531 A TW 107104531A TW I761447 B TWI761447 B TW I761447B
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- electromagnetic wave
- wave shielding
- shielding film
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- printed wiring
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
本發明目的在於提供一種電磁波屏蔽膜，其在製造屏蔽印刷配線板時，屏蔽層與導電性接著劑層之層間密著不易受到破壞，且耐彎折性夠高。本發明之電磁波屏蔽膜係由導電性接著劑層、積層於前述導電性接著劑層上之屏蔽層及積層於前述屏蔽層上之絶緣層所構成者，其特徵在於：前述屏蔽層形成有多數開口部；該電磁波屏蔽膜於下述層間剝離評價中不發生膨脹，且於JIS P8115：2001所規定之MIT耐折疲勞試驗中，在彎折次數600次下不發生斷線。層間剝離評價：以熱壓將電磁波屏蔽膜貼附於印刷配線板上，將所得屏蔽印刷配線板加熱至265℃後冷卻至室溫，進行該加熱與冷卻合計5次後，以目測觀察前述電磁波屏蔽膜是否發生膨脹。The object of the present invention is to provide an electromagnetic wave shielding film which, when manufacturing a shielded printed wiring board, the interlayer adhesion between the shielding layer and the conductive adhesive layer is not easily damaged, and the bending resistance is sufficiently high. The electromagnetic wave shielding film of the present invention is composed of a conductive adhesive layer, a shielding layer laminated on the conductive adhesive layer, and an insulating layer laminated on the shielding layer, and is characterized in that the shielding layer is formed with a plurality of layers. Opening: The electromagnetic wave shielding film did not swell in the following evaluation of interlayer peeling, and did not break in the MIT bending fatigue test specified in JIS P8115:2001 after 600 times of bending. Evaluation of interlayer peeling: The electromagnetic wave shielding film was attached to a printed wiring board by hot pressing, the obtained shielding printed wiring board was heated to 265° C. and then cooled to room temperature. After heating and cooling were performed five times in total, the electromagnetic waves were visually observed. Whether the shielding film expands.
Description
本發明有關一種電磁波屏蔽膜、屏蔽印刷配線板及電子機器。The invention relates to an electromagnetic wave shielding film, a shielding printed wiring board and an electronic machine.
背景技術 迄今以來一直都在採行對諸如撓性印刷配線板(FPC)等印刷配線板貼附電磁波屏蔽膜以屏蔽來自外部之電磁波。Background Art Attaching an electromagnetic wave shielding film to a printed wiring board such as a flexible printed wiring board (FPC) has hitherto been adopted to shield electromagnetic waves from the outside.
電磁波屏蔽膜通常具有依序積層導電性接著劑層、由金屬薄膜等構成之屏蔽層及絶緣層之結構。將此種電磁波屏蔽膜在疊合至印刷配線板之狀態下進行熱壓，藉此，電磁波屏蔽膜透過接著劑層接著至印刷配線板而製出屏蔽印刷配線板。於該接著後，利用迴焊在印刷配線板上安裝零件。此外，印刷配線板呈現基底膜上之印刷圖案受絕緣膜被覆之結構。The electromagnetic wave shielding film generally has a structure in which a conductive adhesive layer, a shielding layer composed of a metal thin film or the like, and an insulating layer are laminated in this order. Such an electromagnetic wave shielding film is hot-pressed in a state of being laminated on a printed wiring board, whereby the electromagnetic wave shielding film is bonded to the printed wiring board through the adhesive layer, and a shielded printed wiring board is produced. After this connection, components are mounted on the printed wiring board by reflow. In addition, the printed wiring board has a structure in which the printed pattern on the base film is covered by the insulating film.
製造屏蔽印刷配線板時，若以熱壓及迴焊來加熱屏蔽印刷配線板，將會有氣體自電磁波屏蔽膜之導電性接著劑層及印刷配線板之絶緣膜等產生。此外，印刷配線板之基底膜係以聚醯亞胺等高吸濕性樹脂形成時，有時會因加熱而自基底膜產生水蒸氣。由於產生自導電性接著劑層、絕緣膜或基底膜之此等揮發成分無法通過屏蔽層，將會蓄積在屏蔽層與導電性接著劑層之間。因此，若在迴焊步驟進行急遽加熱，會有屏蔽層與導電性接著劑層之層間密著因蓄積在屏蔽層與導電性接著劑層間之揮發成分而受到破壞，致使屏蔽特性降低的情況。When manufacturing a shielded printed wiring board, if the shielded printed wiring board is heated by hot pressing and reflow, gas will be generated from the conductive adhesive layer of the electromagnetic wave shielding film and the insulating film of the printed wiring board. In addition, when the base film of the printed wiring board is formed of a highly hygroscopic resin such as polyimide, water vapor may be generated from the base film by heating. Since these volatile components generated from the conductive adhesive layer, insulating film or base film cannot pass through the shielding layer, they will accumulate between the shielding layer and the conductive adhesive layer. Therefore, if rapid heating is performed in the reflow step, the interlayer adhesion between the shielding layer and the conductive adhesive layer may be destroyed by the volatile components accumulated between the shielding layer and the conductive adhesive layer, resulting in a decrease in shielding properties.
為了解決此種問題，專利文獻1記載了一種在屏蔽層(金屬薄膜)設置多數開口部而使透氣性提升的電磁波屏蔽膜。 若在屏蔽層設置多數開口部，即使產生揮發成分，揮發成分仍可透過開口部而通過屏蔽層。因此，可防止揮發成分蓄積於屏蔽層與導電性接著劑層之間，進而可防止層間密著受到破壞所致之屏蔽特性降低。 先行技術文献 專利文獻In order to solve such a problem, Patent Document 1 describes an electromagnetic wave shielding film in which a large number of openings are provided in a shielding layer (metal thin film) to improve air permeability. If a plurality of openings are provided in the shielding layer, even if volatile components are generated, the volatile components can pass through the openings and pass through the shielding layer. Therefore, the accumulation of volatile components between the shielding layer and the conductive adhesive layer can be prevented, and the shielding properties can be prevented from being deteriorated due to the destruction of the interlayer adhesion. Prior art documents Patent documents
[專利文獻1]國際公開2014/192494號[Patent Document 1] International Publication No. 2014/192494
發明概要 發明欲解決之課題 然而，專利文獻1所載電磁波屏蔽膜因屏蔽層形成有開口部，屏蔽層之強度較弱。 因此，若將專利文獻1之電磁波屏蔽膜使用於撓性印刷配線板，將產生下述問題。 亦即，撓性印刷配線板在使用時將會被反覆彎折。用於此種撓性印刷配線板之電磁波屏蔽膜及構成該電磁波屏蔽膜之屏蔽層也會隨之反覆彎折。 如上所述，專利文獻1所載電磁波屏蔽膜因屏蔽層之強度較弱，而有一旦反覆彎折屏蔽層容易受到破壞之問題。SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, in the electromagnetic wave shielding film disclosed in Patent Document 1, since the shielding layer has openings formed, the strength of the shielding layer is weak. Therefore, when the electromagnetic wave shielding film of patent document 1 is used for a flexible printed wiring board, the following problems arise. That is, the flexible printed wiring board is repeatedly bent during use. The electromagnetic wave shielding film used for such a flexible printed wiring board and the shielding layer constituting the electromagnetic wave shielding film are also repeatedly bent. As described above, the electromagnetic wave shielding film disclosed in Patent Document 1 has a problem that the shielding layer is easily damaged when the shielding layer is repeatedly bent because the strength of the shielding layer is weak.
本發明係鑑於上述問題而為者，本發明之目的即在於提供一種在製造屏蔽印刷配線板時屏蔽層與導電性接著劑層之層間密著不易受到破壞且耐彎折性夠高的電磁波屏蔽膜。 用以解決課題之手段The present invention is made in view of the above-mentioned problems, and an object of the present invention is to provide an electromagnetic wave shield that is not easily damaged and has high bending resistance when the interlayer adhesion between the shielding layer and the conductive adhesive layer is not easily damaged when manufacturing a shielded printed wiring board. membrane. means of solving problems
亦即，本發明之電磁波屏蔽膜係由導電性接著劑層、積層於前述導電性接著劑層上之屏蔽層及積層於前述屏蔽層上之絶緣層所構成者，其特徵在於：前述屏蔽層形成有多數開口部；該電磁波屏蔽膜於下述層間剝離評價中不發生膨脹，且於JIS P8115：2001所規定之MIT耐折疲勞試驗中，在彎折次數600次下不發生斷線。 層間剝離評價：以熱壓將電磁波屏蔽膜貼附於印刷配線板上，將所得屏蔽印刷配線板加熱至265℃後冷卻至室溫，進行該加熱與冷卻合計5次後，以目測觀察前述電磁波屏蔽膜是否發生膨脹。That is, the electromagnetic wave shielding film of the present invention is composed of a conductive adhesive layer, a shielding layer laminated on the conductive adhesive layer, and an insulating layer laminated on the shielding layer, and is characterized in that the shielding layer is A large number of openings were formed; the electromagnetic wave shielding film did not swell in the following interlayer peeling evaluation, and in the MIT bending fatigue test specified in JIS P8115:2001, no wire breakage occurred at 600 times of bending. Evaluation of interlayer peeling: The electromagnetic wave shielding film was attached to a printed wiring board by hot pressing, the obtained shielding printed wiring board was heated to 265° C. and then cooled to room temperature. After heating and cooling were performed five times in total, the electromagnetic waves were visually observed. Whether the shielding film expands.
本發明之電磁波屏蔽膜係於屏蔽層形成有多數開口部。 因此，使用本發明之電磁波屏蔽膜製造屏蔽印刷配線板時，即使熱壓步驟及迴焊步驟等中，屏蔽層與導電性接著劑層之間產生揮發成分，揮發成分仍可通過屏蔽層之開口部。 因此，屏蔽層與導電性接著劑層之間變得不易蓄積揮發成分。結果，可防止層間密著受到破壞。 因此，於後述之層間剝離評價中不會發生膨脹，且後述以KEC法測得之200MHz下電磁波屏蔽特性提高。In the electromagnetic wave shielding film of the present invention, a plurality of openings are formed in the shielding layer. Therefore, when using the electromagnetic wave shielding film of the present invention to manufacture a shielded printed wiring board, even if volatile components are generated between the shielding layer and the conductive adhesive layer in the hot pressing step and the reflow step, the volatile components can still pass through the opening of the shielding layer. department. Therefore, it becomes difficult to accumulate volatile components between the shield layer and the conductive adhesive layer. As a result, the interlayer adhesion can be prevented from being damaged. Therefore, expansion does not occur in the evaluation of interlayer peeling described later, and the electromagnetic wave shielding properties at 200 MHz measured by the KEC method described later are improved.
本發明之電磁波屏蔽膜於層間剝離評價中不會發生膨脹。亦即，屏蔽層與導電性接著劑層間之層間密著不易受到破壞。The electromagnetic wave shielding film of the present invention does not swell in the evaluation of interlayer peeling. That is, the interlayer adhesion between the shield layer and the conductive adhesive layer is less likely to be damaged.
另，層間剝離評價意指下述評價。 以熱壓將電磁波屏蔽膜貼附於印刷配線板上，將所得屏蔽印刷配線板加熱至265℃後冷卻至室溫，進行該加熱與冷卻合計5次後，以目測觀察前述電磁波屏蔽膜是否發生膨脹。In addition, the interlayer peeling evaluation means the following evaluation. The electromagnetic wave shielding film was attached to the printed wiring board by hot pressing, and the obtained shielding printed wiring board was heated to 265° C. and then cooled to room temperature. After this heating and cooling were performed five times in total, it was visually observed whether or not the electromagnetic wave shielding film occurred. swell.
本發明之電磁波屏蔽膜於JIS P8115：2001規定之MIT耐折疲勞試驗中，在彎折次數600次下不發生斷線。 本發明之電磁波屏蔽膜具有如此高之耐彎折性時，即使將本發明之電磁波屏蔽膜用於撓性印刷配線板等，仍不易發生斷線。The electromagnetic wave shielding film of the present invention did not break in the MIT bending fatigue test specified in JIS P8115:2001 when the number of bendings was 600 times. When the electromagnetic wave shielding film of the present invention has such high bending resistance, even if the electromagnetic wave shielding film of the present invention is used for a flexible printed wiring board or the like, wire breakage is unlikely to occur.
本發明之電磁波屏蔽膜以KEC法測得之200MHz下之電磁波屏蔽特性宜為85dB以上。此種電磁波屏蔽膜具有夠高之屏蔽特性。The electromagnetic wave shielding properties of the electromagnetic wave shielding film of the present invention at 200 MHz measured by the KEC method are preferably above 85 dB. This electromagnetic wave shielding film has sufficiently high shielding properties.
另，「KEC法」意指下述方法。 圖1為示意圖，其示意性地顯示KEC法所用系統之結構。In addition, "KEC method" means the following method. FIG. 1 is a schematic diagram schematically showing the structure of a system used in the KEC method.
KEC法所用系統係以電磁波屏蔽效果測定裝置80、析譜儀91、進行10dB衰減之衰減器92、進行3dB衰減之衰減器93與前置放大器94來構成。The system used in the KEC method is composed of an electromagnetic wave shielding
如圖1所示，電磁波屏蔽效果測定裝置80中，2個測定夾具83呈對向設置。並且以電磁波屏蔽膜(圖1中以元件符號110表示)被挾持在該測定夾具83之間的方式來設置。測定夾具83已計入TEM室(Transverse Electro Magnetic Cell)之尺寸份量，呈現出在與其傳送軸方向垂直之面內分割成左右對稱之構造。但，為了防止因電磁波屏蔽膜110插入而形成短路，平板狀之中心導體84係與各測定夾具83之間隔著空隙配置。As shown in FIG. 1 , in the electromagnetic wave shielding
KEC法係先將輸出自析譜儀91之信號經由衰減器92輸入至送信側之測定夾具83。接著，以受信側之測定夾具83接收後，將經由衰減器93而來之信號以前置放大器94增幅，之後以析譜儀91測定信號位準。另，析譜儀91係以未將電磁波屏蔽膜110設置在電磁波屏蔽效果測定裝置80之狀態為基準，輸出已將電磁波屏蔽膜110設置在電磁波屏蔽效果測定裝置80時之衰減量。In the KEC method, the signal output from the
本發明之電磁波屏蔽膜之使用此種裝置測得之200MHz下之電磁波屏蔽特性為85dB以上。The electromagnetic wave shielding properties of the electromagnetic wave shielding film of the present invention measured at 200 MHz using this device are above 85 dB.
本發明之電磁波屏蔽膜中，上述開口部之開口面積與開口節距宜滿足下述式(1)及式(2)之關係。 y≧0.02x＋3・・・(1) y≦0.135x・・・・(2) (式(1)及式(2)中，y表示開口面積(μm2 )之平方根，x表示開口節距(μm))。 開口部之開口面積與開口節距滿足上述式(1)及式(2)之關係時，層間剝離評價及JIS P8115：2001所規定之MIT耐折疲勞試驗評價良好。In the electromagnetic wave shielding film of the present invention, it is preferable that the opening area and the opening pitch of the openings satisfy the relationship of the following formulas (1) and (2). y≧0.02x＋3・・・(1) y≦0.135x・・・・(2) (In equations (1) and (2), y represents the square root of the opening area (μm 2 ), and x represents the opening pitch ( μm)). When the opening area and the opening pitch of the openings satisfy the relationship between the above-mentioned equations (1) and (2), the evaluation of interlayer peeling and the evaluation of the MIT folding fatigue test specified in JIS P8115:2001 are favorable.
本發明之電磁波屏蔽膜中，上述開口部之開口面積為70~71000μm2 ，且上述開口部之開口率為0.05~3.6%。 若形成於屏蔽層之開口部的開口面積及開口率在此範圍內，則耐彎折性充分且可防止揮發成分蓄積於屏蔽層與導電性接著劑層之間。 若開口部之開口面積小於70μm2 ，則開口部過窄，揮發成分變得難以通過屏蔽層。結果，揮發成分變得容易蓄積於屏蔽層與導電性接著劑層之間。因此，使用該電磁波屏蔽膜製造屏蔽印刷配線板時，屏蔽層與導電性接著劑層之層間密著變得容易受到破壞。結果，屏蔽特性降低。 若開口部之開口面積大於71000μm2 ，則開口部過廣，屏蔽層變得脆弱而使得耐彎折性降低。 若開口部之開口率小於0.05%，則開口部之比率過低，揮發成分變得難以通過屏蔽層。結果，揮發成分變得容易蓄積在屏蔽層與導電性接著劑層之間。 若開口部之開口率大於3.6%，則開口部之比率過高，屏蔽層變得脆弱而使耐彎折性降低。 另，本說明書中，「開口率」意指：相對於屏蔽層主面全體面積之多數開口部總開口面積。In the electromagnetic wave shielding film of this invention, the opening area of the said opening part is 70-71000 micrometers< 2 >, and the aperture ratio of the said opening part is 0.05-3.6%. When the opening area and the aperture ratio of the openings formed in the shielding layer are within these ranges, the bending resistance is sufficient and the accumulation of volatile components between the shielding layer and the conductive adhesive layer can be prevented. When the opening area of the opening is less than 70 μm 2 , the opening is too narrow, and it becomes difficult for the volatile components to pass through the shielding layer. As a result, the volatile components tend to accumulate between the shield layer and the conductive adhesive layer. Therefore, when a shielded printed wiring board is produced using this electromagnetic wave shielding film, the interlayer adhesion between the shielding layer and the conductive adhesive layer is easily broken. As a result, the shielding characteristic is lowered. When the opening area of the opening is larger than 71000 μm 2 , the opening is too wide, the shielding layer becomes weak, and the bending resistance decreases. If the aperture ratio of the openings is less than 0.05%, the ratio of the openings is too low, and it becomes difficult for the volatile components to pass through the shielding layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer. If the aperture ratio of the openings exceeds 3.6%, the ratio of the openings is too high, the shielding layer becomes weak, and the bending resistance decreases. In addition, in this specification, the "aperture ratio" means the total opening area of a plurality of openings with respect to the whole area of the main surface of the shielding layer.
本發明之電磁波屏蔽膜中，上述開口部之開口節距宜為10~10000μm。 若開口部之開口節距小於10μm，屏蔽層整體之開口部比率增加。結果，屏蔽層變得脆弱，耐彎折性降低。 若開口部之開口節距大於10000μm，屏蔽層整體之開口部比率減少。結果，揮發成分變得難以通過屏蔽層，揮發成分變得容易蓄積在屏蔽層與導電性接著劑層之間。 另，本說明書中，「開口部之開口節距」係指最相互鄰近之開口部彼此之重心間之距離。In the electromagnetic wave shielding film of the present invention, the opening pitch of the openings is preferably 10 to 10000 μm. If the opening pitch of the openings is less than 10 μm, the opening ratio of the entire shielding layer increases. As a result, the shielding layer becomes weak and the bending resistance decreases. If the opening pitch of the openings is larger than 10000 μm, the opening ratio of the entire shielding layer decreases. As a result, it becomes difficult for the volatile component to pass through the shielding layer, and the volatile component becomes easy to accumulate between the shielding layer and the conductive adhesive layer. In addition, in this specification, "the opening pitch of an opening part" means the distance between the center of gravity of the opening parts most adjacent to each other.
本發明之電磁波屏蔽膜中，上述屏蔽層之厚度宜為0.5μm以上。 若屏蔽層之厚度小於0.5μm，因屏蔽層過薄，屏蔽特性將降低。In the electromagnetic wave shielding film of the present invention, the thickness of the shielding layer is preferably 0.5 μm or more. If the thickness of the shielding layer is less than 0.5μm, the shielding properties will be reduced because the shielding layer is too thin.
本發明之電磁波屏蔽膜中，上述屏蔽層宜包含銅層。 從導電性及經濟性之觀點來看，對於屏蔽層而言，銅為理想之材料。In the electromagnetic wave shielding film of the present invention, the shielding layer preferably includes a copper layer. Copper is the ideal material for the shielding layer from the viewpoint of conductivity and economy.
本發明之電磁波屏蔽膜中，上述屏蔽層宜進一步包含銀層，上述銀層宜配置於上述絕緣層側，上述銅層宜配置於上述導電性接著劑層側。 此種結構之電磁波屏蔽膜可藉由在絕緣層上以形成開口部之方式塗佈銀膏製成銀層並對銀層鍍銅來輕易製作。In the electromagnetic wave shielding film of the present invention, the shielding layer preferably further includes a silver layer, the silver layer is preferably arranged on the side of the insulating layer, and the copper layer is preferably arranged on the side of the conductive adhesive layer. The electromagnetic wave shielding film of this structure can be easily produced by coating silver paste on the insulating layer to form an opening to form a silver layer, and then plating the silver layer with copper.
本發明之電磁波屏蔽膜宜供撓性印刷配線板之用。 本發明之電磁波屏蔽膜係如上述，製造屏蔽印刷配線板時，揮發成分不易蓄積在屏蔽層與導電性接著劑層之間。此外，本發明之電磁波屏蔽膜具有充分之耐彎折性。因此，本發明之電磁波屏蔽膜即使用於撓性印刷配線板而被反覆彎折仍不易破損。 因此，本發明之電磁波屏蔽膜可適於用作撓性印刷配線板用之電磁波屏蔽膜。The electromagnetic wave shielding film of the present invention is suitable for use in flexible printed wiring boards. In the electromagnetic wave shielding film of the present invention, as described above, when manufacturing a shielded printed wiring board, volatile components are less likely to accumulate between the shielding layer and the conductive adhesive layer. In addition, the electromagnetic wave shielding film of the present invention has sufficient bending resistance. Therefore, even if the electromagnetic wave shielding film of the present invention is used for a flexible printed wiring board and is repeatedly bent, it is not easily damaged. Therefore, the electromagnetic wave shielding film of the present invention can be suitably used as an electromagnetic wave shielding film for a flexible printed wiring board.
本發明之屏蔽印刷配線板具有：基底構件，其形成有印刷電路；印刷配線板，其具有以包覆上述印刷電路之方式設於上述基底構件上之絕緣膜；及，電磁波屏蔽膜，其設於上述印刷配線板上；該屏蔽印刷配線板之特徵在於：上述電磁波屏蔽膜為上述本發明之電磁波屏蔽膜。The shielding printed wiring board of the present invention includes: a base member on which a printed circuit is formed; a printed wiring board having an insulating film provided on the base member so as to cover the printed circuit; and an electromagnetic wave shielding film provided with On the above-mentioned printed wiring board, the shielding printed wiring board is characterized in that: the above-mentioned electromagnetic wave shielding film is the above-mentioned electromagnetic wave shielding film of the present invention.
此外，本發明之屏蔽印刷配線板中，上述印刷配線板宜為撓性印刷配線板。In addition, in the shielded printed wiring board of the present invention, the printed wiring board is preferably a flexible printed wiring board.
本發明之屏蔽印刷配線板具有具充分耐彎折性之本發明電磁波屏蔽膜。因此，本發明之屏蔽印刷配線板也具有充分之耐彎折性。The shielding printed wiring board of the present invention has the electromagnetic wave shielding film of the present invention having sufficient bending resistance. Therefore, the shielded printed wiring board of the present invention also has sufficient bending resistance.
本發明之電子機器特徵在於：組裝有上述本發明之屏蔽印刷配線板，且該屏蔽印刷配線板係於彎折狀態下組裝。The electronic apparatus of the present invention is characterized in that the shielded printed wiring board of the present invention is assembled, and the shielded printed wiring board is assembled in a bent state.
如上所述，本發明之屏蔽印刷配線板具有充分之耐彎折性。因此，即使在彎折狀態下組裝於電子機器也不易破損。因此，本發明之電子機器可窄化用以配置屏蔽印刷配線板之空間。 爰此，本發明之電子機器可製成薄型。 發明效果As described above, the shielded printed wiring board of the present invention has sufficient bending resistance. Therefore, even if it is assembled to an electronic device in a folded state, it is not easily damaged. Therefore, the electronic apparatus of the present invention can narrow the space for disposing the shielded printed wiring board. Therefore, the electronic device of the present invention can be made thin. Invention effect
本發明之電磁波屏蔽膜係於屏蔽層形成有多數開口部，且於層間剝離評價中不發生膨脹，於JIS P8115：2001規定之MIT耐折疲勞試驗中，在彎折次數600次下不發生斷線。 因此，使用本發明之電磁波屏蔽膜製造屏蔽印刷配線板時，即使在熱壓步驟及迴焊步驟等中屏蔽層與導電性接著劑層之間產生揮發成份，揮發成分仍可通過屏蔽層之開口部。因此，揮發成分不易蓄積於屏蔽層與導電性接著劑層之間。結果，可防止層間密著受到破壞。 此外，本發明之電磁波屏蔽膜具有高耐彎折性。The electromagnetic wave shielding film of the present invention has a large number of openings formed in the shielding layer, does not expand in the evaluation of interlayer peeling, and does not break in the MIT bending fatigue test specified in JIS P8115:2001 when the number of bending times is 600 times. Wire. Therefore, when using the electromagnetic wave shielding film of the present invention to manufacture a shielded printed wiring board, even if volatile components are generated between the shielding layer and the conductive adhesive layer in the hot pressing step and the reflow step, the volatile components can still pass through the opening of the shielding layer. department. Therefore, volatile components are less likely to accumulate between the shield layer and the conductive adhesive layer. As a result, the interlayer adhesion can be prevented from being damaged. In addition, the electromagnetic wave shielding film of the present invention has high bending resistance.
用以實施發明之形態 以下，就本發明之電磁波屏蔽膜予以具體說明。然而，本發明並不限定於以下實施形態，可在不變更本發明要旨之範圍內作適度變更應用。Modes for Carrying Out the Invention Hereinafter, the electromagnetic wave shielding film of the present invention will be specifically described. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied within the scope of not changing the gist of the present invention.
圖2為截面圖，其示意性地顯示本發明之電磁波屏蔽膜之一例。 如圖2所示，電磁波屏蔽膜10係由導電性接著劑層20、積層於導電性接著劑層20上之屏蔽層30及積層於屏蔽層30上之絕緣層40所構成。 此外，屏蔽層30形成有多數開口部50。FIG. 2 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention. As shown in FIG. 2 , the electromagnetic
(導電性接著劑層) 於電磁波屏蔽膜10中，導電性接著劑層20僅需具有導電性且可用作接著劑來發揮機能，無論由何種材料構成皆可。 舉例來說，導電性接著劑層20可由導電性粒子及接著性樹脂組成物構成。(Conductive Adhesive Layer) In the electromagnetic
導電性粒子並未特別受限，可為金屬微粒子、奈米碳管、碳纖維及金屬纖維等。The conductive particles are not particularly limited, and may be metal microparticles, carbon nanotubes, carbon fibers, metal fibers, and the like.
導電性粒子為金屬微粒子時，金屬微粒子並未特別受限，可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施予鍍銀而成之覆銀銅粉以及將高分子微粒子或玻璃珠等以金屬被覆而成之微粒子等。 從經濟性之觀點來看，其等之中以可廉價取得之銅粉或覆銀銅粉為宜。When the conductive particles are metal particles, the metal particles are not particularly limited, and can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by applying silver plating to copper powder, and polymer powder. Microparticles, glass beads, etc., which are coated with metal, and the like. From the viewpoint of economy, among them, copper powder or silver-clad copper powder which can be obtained at low cost is preferable.
導電性粒子之平均粒徑未特別受限，但宜為0.5~15.0μm。若導電性粒子之平均粒徑在0.5μm以上，導電性接著劑層之導電性良好。若導電性粒子之平均粒徑在15.0μm以下，則可薄化導電性接著劑層。The average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 to 15.0 μm. When the average particle diameter of the electroconductive particles is 0.5 μm or more, the electroconductivity of the electroconductive adhesive layer is favorable. When the average particle diameter of the conductive particles is 15.0 μm or less, the conductive adhesive layer can be thinned.
導電性粒子之形狀並未特別受限，可適當選自球狀、扁平狀、鱗片狀、樹枝狀、棒狀及纖維狀等。The shape of the electroconductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, dendritic, rod-like, fibrous, and the like.
接著性樹脂組成物之材料並未特別受限，可使用苯乙烯系樹脂組成物、乙酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物及丙烯酸系樹脂組成物等熱可塑性樹脂組成物，或者酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物及醇酸系樹脂組成物等熱硬化性樹脂組成物等。 接著性樹脂組成物之材料可為其等中之單一種類，也可為2種以上之組合。The material of the adhesive resin composition is not particularly limited, and styrene-based resin compositions, vinyl acetate-based resin compositions, polyester-based resin compositions, polyethylene-based resin compositions, and polypropylene-based resin compositions can be used , Imide resin composition, amide resin composition and acrylic resin composition and other thermoplastic resin compositions, or phenolic resin composition, epoxy resin composition, urethane resin composition , Thermosetting resin compositions such as melamine-based resin compositions and alkyd-based resin compositions. The material of the adhesive resin composition may be a single type, or a combination of two or more types.
導電性接著劑層20可視需要而含有硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充劑、阻燃劑及黏度調節劑等。The conductive
導電性接著劑層20中導電性粒子之摻合量並未特別受限，宜為15~80質量%，更宜為15~60質量%。 若為上述範圍，導電性接著劑層對印刷配線板之接著性將提升。The blending amount of the conductive particles in the conductive
導電性接著劑層20之厚度並未特別受限，可視需要來適當設定，但宜為0.5~20.0μm。 若導電性接著劑層之厚度小於0.5μm，將變得不易獲得良好之導電性。若導電性接著劑層之厚度大於20.0μm，則電磁波屏蔽膜之整體厚度變厚而難以處置。The thickness of the conductive
又，導電性接著劑層20宜具各向異性導電性。 若導電性接著劑層20具各向異性導電性，則相較於其具各向同性導電性時，印刷配線板以信號電路傳送之高頻信號的傳送特性將更提升。In addition, the conductive
(絶緣層) 於電磁波屏蔽膜10中，絕緣層40僅需具有充分之絕緣性且可保護導電性接著劑層20及屏蔽層30即可，並未特別受限，舉例來說，宜由熱可塑性樹脂組成物、熱硬化性樹脂組成物及活性能量線硬化性組成物等構成。 上述熱可塑性樹脂組成物並未特別受限，但可舉如苯乙烯系樹脂組成物、乙酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物及丙烯酸系樹脂組成物等。(Insulating Layer) In the electromagnetic
上述熱硬化性樹脂組成物並未特別受限，但可舉如酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物及醇酸系樹脂組成物等。The above-mentioned thermosetting resin composition is not particularly limited, but examples include phenol-based resin compositions, epoxy-based resin compositions, urethane-based resin compositions, melamine-based resin compositions, and alkyd-based resin compositions things etc.
上述活性能量線硬化性組成物並未特別受限，但可舉例如分子中具至少2個(甲基)丙烯醯氧基之聚合性化合物等。The said active energy ray curable composition is not specifically limited, For example, the polymerizable compound etc. which have at least 2 (meth)acryloyloxy groups in a molecule|numerator are mentioned.
絕緣層40可由單一種類材料構成，亦可由2種以上材料構成。The insulating
絕緣層40可視需要而含有硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充劑、阻燃劑、黏度調節劑及抗黏劑等。The insulating
絕緣層40之厚度並未特別受限，可視需要予以適當設定，但宜為1~15μm，更宜為3~10μm。 若絕緣層40之厚度小於1μm，將因過薄而變得無法充分保護導電性接著劑層20及屏蔽層30。 若絕緣層40之厚度大於15μm，則因過厚而使電磁波屏蔽膜10變得不易彎折，此外絕緣層40本身變得容易破損。因此而變得不易適用於有耐彎折性需求之構件。The thickness of the insulating
(屏蔽層) 在說明本發明之電磁波屏蔽膜的屏蔽層之前，先就使用未在屏蔽層形成開口部之電磁波屏蔽膜來製造屏蔽印刷配線板的情況，利用圖式予以說明。 圖3(a)及(b)為示意圖，其示意性地顯示：使用未於屏蔽層形成開口部之電磁波屏蔽膜來製造屏蔽印刷配線板的情況。(Shielding Layer) Before describing the shielding layer of the electromagnetic wave shielding film of the present invention, a case where a shielding printed wiring board is manufactured using the electromagnetic wave shielding film without forming an opening in the shielding layer will be described with reference to the drawings. FIGS. 3( a ) and ( b ) are schematic views schematically showing a case where a shielded printed wiring board is produced using an electromagnetic wave shielding film in which an opening is not formed in a shielding layer.
如圖3(a)所示，製造屏蔽印刷配線板時，配置了電磁波屏蔽膜510之屏蔽印刷配線板會利用熱壓或迴焊來加熱。 因該加熱，會自電磁波屏蔽膜510之導電性接著劑層520、印刷配線板之絕緣膜及基底膜等產生揮發成分560。As shown in FIG. 3( a ), when manufacturing a shielded printed wiring board, the shielded printed wiring board provided with the electromagnetic
一旦於此種狀態下進行急遽加熱，如圖3(b)所示，因蓄積於屏蔽層530與導電性接著劑層520之間的揮發成分560，屏蔽層530與導電性接著劑層520之層間密著有時會受到破壞。Once rapidly heated in this state, as shown in FIG. 3( b ), due to the
然而，圖2所示之電磁波屏蔽膜10係於屏蔽層30形成有多數開口部50。 因此，使用電磁波屏蔽膜10製造屏蔽印刷配線板時，即使屏蔽層30與導電性接著劑層20之間因加熱而產生揮發成分，揮發成分仍可通過屏蔽層30之開口部50。 因此，揮發成分變得不易蓄積在屏蔽層30與導電性接著劑層20之間。結果，可防止層間密著受到破壞。However, the electromagnetic
因此，電磁波屏蔽膜10可在上述層間剝離評價中不發生膨脹。所以，可使其藉由上述KEC法所測得之200MHz下之電磁波屏蔽特性在85dB以上。Therefore, the electromagnetic
電磁波屏蔽膜10中，開口部50之開口面積宜為70~71000μm2
，且開口部50之開口率宜為0.05~3.6%。 開口部50之開口面積宜為70~32000μm2
，且較宜為70~10000μm2
，更宜為80~8000μm2
。 此外，開口部50之開口率宜為0.1~3.6%。 若形成於屏蔽層30之開口部50之開口面積及開口率在此範圍內，則耐彎折性充分且可防止揮發成分蓄積在屏蔽層30與導電性接著劑層20之間。 此外，層間剝離評價及以KEC法測得之電磁波屏蔽膜在200MHz下之電磁波屏蔽特性良好。In the electromagnetic
若屏蔽層開口部之開口面積小於70μm2 ，開口部過窄，揮發成分變得難以通過屏蔽層。結果，揮發成分變得容易蓄積在屏蔽層與導電性接著劑層之間。 若屏蔽層開口部之開口面積大於71000μm2 ，則開口部過廣，屏蔽層變得脆弱而使耐彎折性降低。If the opening area of the opening of the shielding layer is less than 70 μm 2 , the opening is too narrow, and it becomes difficult for volatile components to pass through the shielding layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer. If the opening area of the opening of the shielding layer is larger than 71000 μm 2 , the opening will be too wide, the shielding layer will become weak, and the bending resistance will decrease.
若屏蔽層開口部之開口率小於0.05%，開口部之比率過低，揮發成分變得難以通過屏蔽層。結果，揮發成分變得容易蓄積於屏蔽層與導電性接著劑層之間。 若屏蔽層開口部之開口率大於3.6%，開口部之比率過大，屏蔽層變得脆弱而使耐彎折性降低。If the aperture ratio of the openings of the shielding layer is less than 0.05%, the ratio of the openings is too low, and it becomes difficult for the volatile components to pass through the shielding layer. As a result, the volatile components tend to accumulate between the shield layer and the conductive adhesive layer. If the aperture ratio of the opening portion of the shielding layer is greater than 3.6%, the ratio of the opening portion is too large, and the shielding layer becomes weak and the bending resistance decreases.
電磁波屏蔽膜10中，開口部50之形狀未特別受限，可為圓形、橢圓形、軌道形、三角形、四邊形、五邊形、六邊形、八邊形及星形等。 從開口部50之形成容易度來看，該等之中以圓形為宜。 此外，多數開口部50之形狀可為單一種類，亦可組合多數種類。In the electromagnetic
電磁波屏蔽膜10中，開口部50之開口節距宜為10~10000μm，且較宜為25~2000μm，更宜為250~2000μm。 若開口部之開口節距小於10μm，屏蔽層全體之開口部比率增加。結果，屏蔽層變得脆弱而使耐彎折性降低。 若開口部之開口節距大於10000μm，屏蔽層全體之開口部比率降低。結果，揮發成分變得難以通過屏蔽層，揮發成分變得容易蓄積在屏蔽層與導電性接著劑層之間。結果，屏蔽層與導電性接著劑層之層間密著變得容易受到破壞，屏蔽特性亦容易降低。In the electromagnetic
電磁波屏蔽膜10中，開口部50之開口面積與開口節距宜滿足下述式(1)及式(2)之關係。 y≧0.02x＋3・・・(1) y≦0.135x・・・・(2) (式(1)及式(2)中，y表示開口面積(μm2
)之平方根，x表示開口節距(μm))。In the electromagnetic
電磁波屏蔽膜10中，開口部之開口面積與開口節距滿足上述式(1)及式(2)時，層間剝離評價及於JIS P8115：2001所規定之MIT耐折疲勞試驗中之評價良好。In the electromagnetic
電磁波屏蔽膜10中，開口部50之配列圖案並未特別受限，舉例來說可為下示配列圖案。In the electromagnetic
圖4(a)~(c)為俯視圖，其示意性地顯示：構成本發明電磁波屏蔽膜之屏蔽層中之開口部配列圖案之一例。FIGS. 4( a ) to ( c ) are plan views schematically showing an example of an arrangement pattern of openings in the shielding layer constituting the electromagnetic wave shielding film of the present invention.
如圖4(a)所示，開口部50之配列圖案可為如下所述之配列圖案：在將正三角形縱橫連續排列而成之平面中，各開口部50之中心位在正三角形之頂點上。As shown in FIG. 4( a ), the arrangement pattern of the
此外，如圖4(b)所示，開口部50之配列圖案亦可為如下所述之配列圖案：在將正方形縱橫連續排列而成之平面中，開口部50之中心位在正方形之頂點上。In addition, as shown in FIG. 4( b ), the arrangement pattern of the
此外，如圖4(c)所示，開口部50之配列圖案也可為如下所述之配列圖案：在將正六邊形縱橫連續排列而成之平面中，開口部50之中心位在正六邊形之頂點上。In addition, as shown in FIG. 4( c ), the arrangement pattern of the
電磁波屏蔽膜10中，屏蔽層30之厚度宜為0.5μm以上，更宜為1.0μm以上。此外，屏蔽層30之厚度宜為10μm以下。 若屏蔽層之厚度小於0.5μm，因屏蔽層過薄，屏蔽特性降低。In the electromagnetic
此外，若屏蔽層30之厚度為1.0μm以上，則在傳送頻率為0.01~10GHz之高頻信號的信號傳達系統中，傳送特性變得良好。 另，屏蔽層未形成開口部時，若屏蔽層增厚，製造屏蔽印刷配線板時，屏蔽層與導電性接著劑層間之層間密著易生破壞。尤其，若屏蔽層30之厚度大於1.0μm，層間密著之破壞將顯著發生。然而，在電磁波屏蔽膜10中，因屏蔽層30形成有開口部50，可防止屏蔽層30與導電性接著劑層20間之層間密著受到破壞。In addition, when the thickness of the
本發明之電磁波屏蔽膜宜用於傳送頻率為0.01~10GHz之信號的信號傳達系統。The electromagnetic wave shielding film of the present invention is suitable for a signal transmission system that transmits signals with a frequency of 0.01 to 10 GHz.
本發明之電磁波屏蔽膜中，只要屏蔽層具有電磁波屏蔽性，無論由何種材料構成皆可，例如，也可由金屬層構成。In the electromagnetic wave shielding film of the present invention, as long as the shielding layer has electromagnetic wave shielding properties, any material may be used, and for example, a metal layer may be used.
屏蔽層可包含由金、銀、銅、鋁、鎳、錫、鈀、鉻、鈦、鋅等材料構成之層，且宜包含銅層。 從導電性及經濟性之觀點來看，對於屏蔽層而言銅為理想之材料。The shielding layer may include a layer composed of materials such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, etc., and preferably includes a copper layer. Copper is an ideal material for shielding layers from the viewpoint of conductivity and economy.
另，上述屏蔽層亦可包含由上述金屬合金構成之層。Moreover, the said shield layer may contain the layer which consists of the said metal alloy.
此外，屏蔽層可積層有多數金屬層而成。 屏蔽層尤宜包含銅層及銀層。In addition, the shielding layer may be formed by laminating a plurality of metal layers. In particular, the shielding layer preferably includes a copper layer and a silver layer.
茲使用圖式，就屏蔽層包含銅層及銀層之情況予以說明。 圖5為截面圖，其示意性地顯示屏蔽層由銅層及銀層構成之本發明電磁波屏蔽膜之一例。The diagrams are used to illustrate the case where the shielding layer includes a copper layer and a silver layer. 5 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention in which the shielding layer is composed of a copper layer and a silver layer.
圖5所示的電磁波屏蔽膜110係由導電性接著劑層120、積層於導電性接著劑層120上之屏蔽層130及積層於屏蔽層130上之絕緣層140所構成。 此外，屏蔽層130係由銅層132及銀層131構成，銀層131配置於絕緣層140側，銅層132則配置於導電性接著劑層120側。The electromagnetic
此種結構之電磁波屏蔽膜110可藉由在絕緣層140上以形成開口部150之方式塗佈銀膏製成銀層，再於銀層上鍍銅而輕易製出。The electromagnetic
(其他結構) 本發明之電磁波屏蔽膜可在絕緣層與屏蔽層之間形成有錨定塗層。 錨定塗層之材料可舉如胺甲酸乙酯樹脂、丙烯酸樹脂、以胺甲酸乙酯樹脂為殼且以丙烯酸樹脂為核之核殼型複合樹脂、環氧樹脂、醯亞胺樹脂、醯胺樹脂、三聚氰胺樹脂、酚樹脂、脲甲醛樹脂、使酚等封端劑與聚異氰酸酯反應而得之封端異氰酸酯、聚乙烯醇及聚乙烯吡咯啶酮等。(Other Structures) The electromagnetic wave shielding film of the present invention may have an anchor coating layer formed between the insulating layer and the shielding layer. The materials of the anchor coating include urethane resin, acrylic resin, core-shell composite resin with urethane resin as shell and acrylic resin as core, epoxy resin, imide resin, amide Resins, melamine resins, phenol resins, urea formaldehyde resins, blocked isocyanates obtained by reacting blocking agents such as phenol with polyisocyanates, polyvinyl alcohol and polyvinylpyrrolidone, etc.
此外，本發明之電磁波屏蔽膜可於絕緣層側備有支持體膜，也可於導電性接著劑層側具有剝離性膜。若電磁波屏蔽膜具有支持體膜及剝離性膜，則在輸送本發明之電磁波屏蔽膜及使用本發明之電磁波屏蔽膜來製造屏蔽印刷配線板等時的作業過程中，本發明之電磁波屏蔽膜將變得容易處置。 又，於屏蔽印刷配線板等上配置本發明之電磁波屏蔽膜時，此等支持體膜及剝離性膜將會被剝除。Moreover, the electromagnetic wave shielding film of this invention may have a support film on the insulating layer side, and may have a peelable film on the conductive adhesive layer side. If the electromagnetic wave shielding film has a support film and a peelable film, the electromagnetic wave shielding film of the present invention will be removed during the operation of transporting the electromagnetic wave shielding film of the present invention and manufacturing a shielded printed wiring board using the electromagnetic wave shielding film of the present invention. become easier to handle. Moreover, when the electromagnetic wave shielding film of this invention is arrange|positioned on a shielding printed wiring board etc., these support body films and peelable films are peeled off.
只要是在阻斷電磁波之目的下，本發明之電磁波屏蔽膜可用在任何用途上。 本發明之電磁波屏蔽膜尤宜用於印刷配線板，特別是撓性印刷配線板。 本發明之電磁波屏蔽膜係如上述，於製造屏蔽印刷配線板時，揮發成分不易蓄積在屏蔽層與導電性接著劑層之間。又，本發明之電磁波屏蔽膜具有充分之耐彎折性。因此，本發明之電磁波屏蔽膜即便用於撓性印刷配線板而被反覆彎折，仍不易破損。 因此，本發明之電磁波屏蔽膜可適於用作撓性印刷配線板用之電磁波屏蔽膜。The electromagnetic wave shielding film of the present invention can be used in any application as long as the purpose is to block electromagnetic waves. The electromagnetic wave shielding film of the present invention is particularly suitable for printed wiring boards, especially flexible printed wiring boards. In the electromagnetic wave shielding film of the present invention, as described above, when manufacturing a shielded printed wiring board, volatile components are less likely to accumulate between the shielding layer and the conductive adhesive layer. Moreover, the electromagnetic wave shielding film of this invention has sufficient bending resistance. Therefore, even if the electromagnetic wave shielding film of the present invention is used for a flexible printed wiring board and is repeatedly bent, it is not easily damaged. Therefore, the electromagnetic wave shielding film of the present invention can be suitably used as an electromagnetic wave shielding film for a flexible printed wiring board.
如前述，具有本發明之電磁波屏蔽膜的屏蔽印刷配線板即為本發明之屏蔽印刷配線板。 亦即，本發明之屏蔽印刷配線板具有：基底構件，其形成有印刷電路；印刷配線板，其具有以包覆上述印刷電路之方式設於上述基底構件上之絕緣膜；及，電磁波屏蔽膜，其設於上述印刷配線板上；並且，該屏蔽印刷配線板之特徵在於：上述電磁波屏蔽膜為上述本發明之電磁波屏蔽膜。 此外，上述印刷配線板宜為撓性印刷配線板。 本發明之屏蔽印刷配線板具有具充分耐彎折性之本發明電磁波屏蔽膜。因此，本發明之屏蔽印刷配線板也具有充分之耐彎折性。As described above, the shielded printed wiring board having the electromagnetic wave shielding film of the present invention is the shielded printed wiring board of the present invention. That is, the shielding printed wiring board of the present invention has: a base member on which a printed circuit is formed; a printed wiring board having an insulating film provided on the base member so as to cover the printed circuit; and an electromagnetic wave shielding film , which is provided on the above-mentioned printed wiring board; and, the shielding printed wiring board is characterized in that: the above-mentioned electromagnetic wave shielding film is the above-mentioned electromagnetic wave shielding film of the present invention. In addition, it is preferable that the above-mentioned printed wiring board is a flexible printed wiring board. The shielding printed wiring board of the present invention has the electromagnetic wave shielding film of the present invention having sufficient bending resistance. Therefore, the shielded printed wiring board of the present invention also has sufficient bending resistance.
本發明之屏蔽印刷配線板係組裝於電子機器中作使用。 尤其是將上述本發明之屏蔽印刷配線板以彎折狀態組裝的電子機器，即是本發明之電子機器。 如上所述，本發明之屏蔽印刷配線板具充分之耐彎折性。因此，即使於彎折狀態下組裝於電子機器也不易破損。因此，本發明之電子機器可窄化用以配置屏蔽印刷配線板之空間。 因此，本發明之電子機器可製成薄型。The shielded printed wiring board of the present invention is assembled in electronic equipment for use. In particular, an electronic device in which the above-mentioned shielded printed wiring board of the present invention is assembled in a bent state is an electronic device of the present invention. As described above, the shielded printed wiring board of the present invention has sufficient bending resistance. Therefore, even if it is assembled to an electronic device in a folded state, it is not easily damaged. Therefore, the electronic apparatus of the present invention can narrow the space for disposing the shielded printed wiring board. Therefore, the electronic apparatus of the present invention can be made thin.
(電磁波屏蔽膜之製造方法) 其次，就本發明之電磁波屏蔽膜之製造方法予以說明。另，本發明之電磁波屏蔽膜不限於以下述方法製得者。(Manufacturing method of electromagnetic wave shielding film) Next, the manufacturing method of the electromagnetic wave shielding film of this invention is demonstrated. In addition, the electromagnetic wave shielding film of this invention is not limited to the thing produced by the following method.
首先，說明電磁波屏蔽膜10之製造方法之一例，該電磁波屏蔽膜10為本發明電磁波屏蔽膜之一例。 製造電磁波屏蔽膜10之方法包含(1)屏蔽層形成步驟、(2)絕緣層形成步驟及(3)導電性接著劑層形成步驟。First, an example of the manufacturing method of the electromagnetic
使用圖式將此等步驟詳述如下。 圖6(a)~(c)為步驟圖，其示意性地依序顯示本發明之電磁波屏蔽膜之製造方法之一例。These steps are detailed below using diagrams. FIGS. 6( a ) to ( c ) are step diagrams schematically showing an example of the manufacturing method of the electromagnetic wave shielding film of the present invention in sequence.
(1)屏蔽層形成步驟 首先，如圖6(a)所示，準備具電磁波屏蔽性之片材35，並於片材35上形成開口部50來製作屏蔽層30。(1) Shield layer forming step First, as shown in FIG.
此時，宜以開口部50之開口面積與開口節距滿足下述式(1)及式(2)之關係的方式來形成開口部。 y≧0.02x＋3・・・(1) y≦0.135x・・・・(2) (式(1)及式(2)中，y表示開口面積(μm2
)之平方根，x表示開口節距(μm))。In this case, the openings are preferably formed so that the opening area and the opening pitch of the
開口部50可藉衝孔及照射雷射等來形成。 此外，片材35由銅等可蝕刻材料構成時，也可在片材35表面上配置會形成開口部50之圖案的光阻，並以蝕刻來形成開口部50。 又，亦可於片材35表面印刷導電性膏或用作鍍敷催化劑來發揮機能之膏。於該印刷中，也能以預定圖案進行印刷，藉此形成開口部50。 印刷上述用作鍍敷催化劑來發揮機能之膏時，宜在印刷膏並形成開口部50後，以無電式鍍敷法或電鍍法來形成金屬膜並藉此形成屏蔽層。 上述用作鍍敷催化劑發揮機能之膏可使用含有由鎳、銅、鉻、鋅、金、銀、鋁、錫、鈷、鈀、鉛、鉑、鎘及銠等構成之金屬的流體。The
(2)絶緣層形成步驟 接著，如圖6(b)所示，於屏蔽層30之一側面上塗佈絕緣層用樹脂組成物45，使其硬化而形成絕緣層40。 塗佈絕緣層用樹脂組成物之方法可舉如習用公知之塗佈方法，例如凹版塗佈式、吻合塗佈(kiss coating)式、模塗式、唇塗式、缺角輪塗佈(comma coating)式、刮塗(blade coating)式、輥塗式、刮刀塗佈(knife coating)式、噴塗式、棒塗式、旋塗式及浸漬塗佈式等。 使絕緣層用樹脂組成物硬化之方法可因應絕緣層用樹脂組成物之種類，採用習用公知之各種方法。(2) Insulating layer forming step Next, as shown in FIG. 6( b ), the insulating
(3)導電性接著劑層形成步驟 接著，如圖6(c)所示，在屏蔽層30之形成有絕緣層40之面的相反面上塗佈導電性接著劑層用組成物25，形成導電性接著劑層20。 塗佈導電性接著劑層用組成物25之方法可舉如習用公知之塗佈方法，例如凹版塗佈式、吻合塗佈式、模塗式、唇塗式、缺角輪塗佈式、刮塗式、輥塗式、刮刀塗佈式、噴塗式、棒塗式、旋塗式及浸漬塗佈式等。(3) Conductive Adhesive Layer Forming Step Next, as shown in FIG. 6( c ), the conductive
經以上步驟，即可製造屬本發明電磁波屏蔽膜之一例的電磁波屏蔽膜10。Through the above steps, the electromagnetic
接著，說明製造屏蔽層係由銅層及銀層構成之電磁波屏蔽膜110之方法的一例，該電磁波屏蔽膜110為本發明電磁波屏蔽膜之一例。 製造電磁波屏蔽膜110之方法包含(1)絕緣層準備步驟、(2)銀膏印刷步驟、(3)鍍銅步驟及(4)導電性接著劑層形成步驟。Next, an example of a method of manufacturing the electromagnetic
使用圖7~圖12，就該等步驟詳述如下。These steps are described in detail below using FIGS. 7 to 12 .
(1)絶緣層準備步驟 圖7為步驟圖，其示意性地顯示本發明電磁波屏蔽膜之製造方法中之絕緣層準備步驟之一例。 首先，如圖7所示，準備絕緣層140。 絕緣層140可利用習知方法來準備。(1) Insulating layer preparation step Fig. 7 is a step diagram schematically showing an example of an insulating layer preparation step in the method of manufacturing the electromagnetic wave shielding film of the present invention. First, as shown in FIG. 7 , the insulating
(2)含有金屬作為鍍敷催化劑之流體的印刷步驟(銀膏印刷步驟) 接著，於絕緣層之一側主面上印刷銀膏作為鍍敷催化劑。此時，以銀膏上會形成開口部的方式來進行。 印刷銀膏之方法可舉如：利用凹版印刷等凹版印刷及柔版印刷等凸版印刷之方法、利用網版印刷之方法、利用平板印刷(將經凹版或凸版、網版等形成圖案之物轉印來進行)之方法、利用無須印版之噴墨印刷之方法等。 以下，說明利用凹版印刷來印刷銀膏之方法。(2) Printing Step of Fluid Containing Metal as Plating Catalyst (Silver Paste Printing Step) Next, silver paste was printed as a plating catalyst on one side main surface of the insulating layer. At this time, it is performed so that an opening part may be formed in the silver paste. Examples of methods for printing silver paste include: methods of gravure printing such as gravure printing and letterpress printing such as flexo printing, methods of using screen printing, and lithographic printing (transferring objects that have been patterned by gravure, letterpress, screen, etc.). The method of printing), the method of using inkjet printing without a printing plate, etc. Hereinafter, a method of printing the silver paste by gravure printing will be described.
圖8~圖10為步驟圖，其示意性地顯示本發明電磁波屏蔽膜之製造方法中之銀膏印刷步驟之一例。 首先，如圖8所示，準備表面形成有多數柱狀突起部72之滾筒狀印版滾筒70。另，未形成突起部72之印版滾筒表面為突起部非形成區域71。8 to 10 are step diagrams, which schematically show an example of the silver paste printing step in the manufacturing method of the electromagnetic wave shielding film of the present invention. First, as shown in FIG. 8, a cylinder-shaped
接著，如圖9所示，使銀膏133覆上突起部非形成區域71。此時，以突起部72之上表面73上不塗佈銀膏133的方式來進行。Next, as shown in FIG. 9 , the
接著，如圖10所示，使絕緣層140通過壓印滾筒75與已覆上銀膏133之印版滾筒70之間，藉此在絕緣層140之一側主面上印刷銀膏133。 於該印刷中，絕緣層140中突起部72所接觸之部分不會印刷到銀膏133而可製成開口部150。 印刷於絕緣層140之銀膏133將會成為銀層131。Next, as shown in FIG. 10 , the insulating
銀膏133只要含有銀粒子即可，也可含有其他分散劑、增稠劑、調平劑及消泡劑等各種添加劑。 銀粒子之形狀並未特別受限，可使用球狀、薄片狀、樹枝狀、針狀及纖維狀等任意形狀之材料。 上述銀粒子為粒子狀物時，宜為奈米尺寸之物。具體來說，以平均粒徑在1~100nm範圍內之銀粒子為宜，更宜為1~50nm範圍內之銀粒子。 另，於本說明書中，「平均粒徑」意指：以分散用溶劑稀釋銀粒子，藉動態光散射法測得之體積平均值。 該測定可使用MicrotracBEL Corp.製「Nanotrac UPA-150」。The
此外，藉印刷銀膏所形成之銀層厚度宜為5~200nm。In addition, the thickness of the silver layer formed by printing the silver paste is preferably 5-200 nm.
(3)鍍銅步驟 圖11(a)及(b)為步驟圖，其示意性地顯示本發明電磁波屏蔽膜之製造方法中之鍍銅步驟之一例。 接著，如圖11(a)及(b)所示，在銀層131上鍍銅，藉此在銀層131上形成銅層132。 鍍銅方法並未特別受限，可利用習知之無電式鍍敷及電鍍。(3) Copper Plating Step Figures 11(a) and (b) are step diagrams schematically showing an example of the copper plating step in the method of manufacturing the electromagnetic wave shielding film of the present invention. Next, as shown in FIGS. 11( a ) and ( b ),
以無電式鍍敷鍍銅時，鍍液宜使用含有硫酸銅、還原劑及水性介質、有機溶劑等溶劑之物。 以電鍍法鍍銅時，鍍液宜使用含有硫酸銅、硫酸及水性介質之物，且宜透過控制鍍敷處理時間、電流密度及鍍敷用添加劑之使用量等來進行調整以形成所欲之銅厚度。When copper plating is performed by electroless plating, the plating solution preferably contains copper sulfate, a reducing agent, an aqueous medium, an organic solvent, and other solvents. When copper is plated by electroplating, the plating solution should be made of copper sulfate, sulfuric acid and aqueous medium, and should be adjusted by controlling the plating treatment time, current density and the amount of plating additives used to form the desired material. Copper thickness.
鍍敷之銅厚度宜為0.1~10μm。The thickness of the plated copper is preferably 0.1 to 10 μm.
經上述步驟，可形成由銀層131及銅層132構成之屏蔽層130。Through the above steps, the
(4)導電性接著劑層形成步驟 圖12(a)及(b)為步驟圖，其示意性地顯示本發明電磁波屏蔽膜之製造方法中之導電性接著劑層形成步驟之一例。另，圖12(a)及(b)係將圖11(b)上下逆轉來圖示其後續之步驟。 接著，如圖12(a)及(b)所示，於銅層132上塗佈導電性接著劑層用組成物125而形成導電性接著劑層120。 塗佈導電性接著劑層用組成物125之方法可舉如習用公知之塗佈方法，例如凹版塗佈式、吻合塗佈式、模塗式、唇塗式、缺角輪塗佈式、刮塗式、輥塗式、刮刀塗佈式、噴塗式、棒塗式、旋塗式及浸漬塗佈式等。(4) Conductive Adhesive Layer Forming Steps Figures 12(a) and (b) are step diagrams schematically showing an example of the conductive adhesive layer forming steps in the method for producing the electromagnetic wave shielding film of the present invention. In addition, Fig. 12(a) and (b) reverse Fig. 11(b) up and down to illustrate the subsequent steps. Next, as shown in FIGS. 12( a ) and ( b ), the conductive
經上述步驟即可製造電磁波屏蔽膜110，該電磁波屏蔽膜110為本發明電磁波屏蔽膜之一例。 實施例After the above steps, the electromagnetic
以下述方法製出屏蔽層之開口部面積(開口部面積之平方根)為79μm2 (8.89μm)、1963μm2 (44.30μm)、4418μm2 (66.47μm)、7854μm2 (88.62μm)、12272μm2 (110.78μm)、17671μm2 (132.93μm)、31416μm2 (177.25μm)、49087μm2 (221.56μm)或70686μm2 (265.87μm)且開口節距為10μm、50μm、100μm、200μm、500μm、750μm、1000μm、1500μm、2000μm、3000μm、4000μm、5000μm、7500μm或10000μm之合計126種電磁波屏蔽膜。 另，屏蔽層之開口部形狀為圓形。The opening area (square root of the opening area) of the shielding layer produced by the following method is 79 μm 2 (8.89 μm), 1963 μm 2 (44.30 μm), 4418 μm 2 (66.47 μm), 7854 μm 2 ( 88.62 μm), 12272 μm 2 ( 110.78μm), 17671μm 2 (132.93μm), 31416μm 2 (177.25μm), 49087μm 2 (221.56μm) or 70686μm 2 (265.87μm) with opening pitches of 10μm, 50μm, 100μm, 200μm, 500μm, 750μm A total of 126 electromagnetic wave shielding films of 1500 μm, 2000 μm, 3000 μm, 4000 μm, 5000 μm, 7500 μm or 10000 μm. In addition, the shape of the opening of the shielding layer is circular.
(調製例1：銀膏之調製例) 於乙醇35質量份與離子交換水65質量份之混合溶劑中，使用聚乙烯亞胺化合物作為分散劑，使平均粒徑30nm之銀粒子分散，藉此製得銀濃度為15質量%之銀膏。(Preparation Example 1: Preparation Example of Silver Paste) In a mixed solvent of 35 parts by mass of ethanol and 65 parts by mass of ion-exchanged water, using a polyethyleneimine compound as a dispersant, silver particles having an average particle diameter of 30 nm were dispersed to thereby disperse silver particles having an average particle diameter of 30 nm. A silver paste having a silver concentration of 15% by mass was obtained.
(電磁波屏蔽膜之製造) (1)絶緣層準備步驟 準備厚度為5μm之由環氧樹脂構成之絕緣層。(Manufacture of electromagnetic wave shielding film) (1) Step of preparing insulating layer An insulating layer made of epoxy resin having a thickness of 5 µm was prepared.
(2)銀膏印刷步驟 接著，以圖8~圖10所示方法，使用滾筒狀之印版滾筒，於絕緣層之一側主面上，以會形成多數開口部的方式，印刷銀膏而形成銀層。 開口部之開口面積與開口節距之組合係如上述。(2) Silver paste printing step Next, in the method shown in FIGS. 8 to 10 , using a roller-shaped printing plate cylinder, on one main surface of the insulating layer, the silver paste is printed in such a manner that many openings are formed. A silver layer is formed. The combination of the opening area of the opening portion and the opening pitch is as described above.
另，令銀層厚度為50nm。 銀膏使用調製例1所得銀膏。 此外，開口部之形狀為圓形，且令開口部之配列圖案為下述配列圖案：於將正三角形縱橫連續排列而成之平面中，各開口部之中心位在正三角形之頂點上。In addition, let the thickness of the silver layer be 50 nm. The silver paste obtained in Preparation Example 1 was used. In addition, the shape of the openings is circular, and the arrangement pattern of the openings is an arrangement pattern in which the center of each opening is located on the apex of the equilateral triangle in a plane formed by continuously arranging equilateral triangles vertically and horizontally.
(3)鍍銅步驟 接著，於55℃下將印刷銀膏後之絕緣層浸漬於無電式銅鍍液(奥野製藥股份有限公司製「ARG Copper」、pH12.5)中20分鐘，而在銀層上形成無電解銅鍍膜(厚0.5μm)。 接著，將上述所得無電解銅鍍膜表面設置為陰極，將含磷銅設置為陽極，使用含硫酸銅之電鍍液並以電流密度2.5A/dm2 進行30分鐘電鍍，而在銀層上積層合計厚度為1μm之銅鍍層。電鍍液使用硫酸銅70g/公升、硫酸200g/公升、氯離子50mg/公升、Top Lucina SF(奥野製藥工業股份有限公司製，光澤劑)5g/公升之溶液。(3) Copper plating step Next, the insulating layer after printing the silver paste was immersed in an electroless copper plating solution (“ARG Copper” manufactured by Okuno Pharmaceutical Co., Ltd., pH 12.5) at 55° C. for 20 minutes, and the silver An electroless copper plating film (thickness 0.5 μm) was formed on the layer. Next, the surface of the electroless copper plated film obtained above was set as a cathode, and phosphorous-containing copper was set as an anode, and electroplating was performed for 30 minutes using a copper sulfate-containing electroplating solution at a current density of 2.5 A/dm 2 , and the silver layer was laminated with a total of Copper plating with a thickness of 1 μm. As the plating solution, a solution of 70 g/liter of copper sulfate, 200 g/liter of sulfuric acid, 50 mg/liter of chloride ion, and 5 g/liter of Top Lucina SF (manufactured by Okuno Pharmaceutical Co., Ltd., gloss agent) was used.
(4)導電性接著劑層形成步驟 於銅層上塗佈在含磷環氧樹脂中添加了20質量%被覆Ag之Cu粉末的導電性接著劑層，使其厚度為15μm，製出電磁波屏蔽膜。 另，塗佈方法使用唇塗式。(4) Step of forming conductive adhesive layer On the copper layer, a conductive adhesive layer containing 20% by mass of Cu powder coated with Ag in phosphorus-containing epoxy resin was applied to a thickness of 15 μm to prepare an electromagnetic wave shield. membrane. In addition, as the coating method, a lip coating type was used.
(層間剝離評價) 以下述方法進行電磁波屏蔽膜之層間剝離評價。 首先，利用熱壓，將各電磁波屏蔽膜貼附在印刷配線板上。 接著，將該屏蔽印刷配線板放置於23℃、63%RH之無塵室中7天後，暴露於迴流時之溫度條件下30秒並評價層間剝離之有無。另，就迴流時之溫度條件而言，係預設無鉛焊接，設定最高265℃之溫度剖線。此外，層間剝離之有無係使屏蔽印刷配線板通過5次大氣迴流，然後以目測觀察有無膨脹。 茲將結果示於圖13。 圖13為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根且橫軸為開口節距，顯示電磁波屏蔽膜之層間剝離評價。 於圖13中，符號「○」表示於層間剝離評價中不發生膨脹之電磁波屏蔽膜。 於圖13中，符號「×」表示於層間剝離評價中發生膨脹之電磁波屏蔽膜。 如圖13所示，令開口面積之平方根為y且開口節距為x時，若y與x之關係滿足下述式(1)，則電磁波屏蔽膜之層間剝離評價良好。 y≧0.02x＋3・・・(1)(Evaluation of interlayer peeling) The evaluation of interlayer peeling between the electromagnetic wave shielding films was performed by the following method. First, each electromagnetic wave shielding film is attached to a printed wiring board by hot pressing. Next, the shielded printed wiring board was placed in a clean room at 23° C. and 63% RH for 7 days, and then exposed to the temperature conditions during reflow for 30 seconds to evaluate the presence or absence of interlayer peeling. In addition, in terms of temperature conditions during reflow, lead-free soldering is preset, and the maximum temperature profile is set to 265°C. In addition, the presence or absence of interlayer peeling was performed by reflowing the shielded printed wiring board through the atmosphere five times, and then visually observed for the presence or absence of swelling. The results are shown in Figure 13. FIG. 13 is a scatter diagram of the electromagnetic wave shielding films, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the evaluation of interlayer peeling of the electromagnetic wave shielding films. In FIG. 13 , the symbol “◯” represents the electromagnetic wave shielding film that did not swell in the evaluation of interlayer peeling. In FIG. 13 , the symbol “×” represents the electromagnetic wave shielding film that swelled in the evaluation of interlayer peeling. As shown in FIG. 13 , when the square root of the opening area is y and the opening pitch is x, and the relationship between y and x satisfies the following formula (1), the evaluation of interlayer peeling between electromagnetic wave shielding films is good. y≧0.02x＋3・・・(1)
(耐彎折性之評價) 以下述方法評價各電磁波屏蔽膜。 以熱壓將各電磁波屏蔽膜貼附在50μm厚之聚醯亞胺膜兩面，裁切成長×寬＝130mm×15mm大小來製成試驗片，再使用MIT耐折疲勞試驗機(安田精機製作所股份有限公司製，No.307 MIT形耐折度試驗機)，按JIS P8115：2001規定之方法測定各試驗片之耐彎折性。 試驗條件如下。 彎折夾鉗前端R：0.38mm 彎折角度：±135° 彎折速度：175cpm 負載：500gf 檢測方法：以內建通電裝置感測屏蔽膜之斷線(Evaluation of bending resistance) Each electromagnetic wave shielding film was evaluated by the following method. Each electromagnetic wave shielding film was attached to both sides of a 50 μm thick polyimide film by hot pressing, and the length × width = 130 mm × 15 mm was cut to make a test piece, and then the MIT folding fatigue tester (Ysuda Seiki Manufacturing Co., Ltd. was used) was used. Co., Ltd., No. 307 MIT type flexural endurance tester), the flexural resistance of each test piece was measured according to the method specified in JIS P8115:2001. The test conditions are as follows. Front R of the bending clamp: 0.38mm Bending angle: ±135° Bending speed: 175cpm Load: 500gf Detection method: Built-in power-on device to sense the disconnection of the shielding film
茲將結果示於圖14。 圖14為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根且横軸為開口節距，顯示電磁波屏蔽膜之耐彎折性評價。 於圖14中，符號「○」表示：於耐彎折性評價中，在彎折次數600次下不發生斷線的電磁波屏蔽膜。 於圖14中，符號「×」表示：於耐彎折性評價中，在彎折次數小於600次下即發生斷線的電磁波屏蔽膜。 如圖14所示，令開口面積之平方根為y且開口節距為x時，若y與x之關係滿足下述式(2)，則電磁波屏蔽膜之耐彎折性良好。 y≦0.135x・・・(2)The results are shown in Figure 14. 14 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the evaluation of the bending resistance of the electromagnetic wave shielding film. In FIG. 14 , the symbol “◯” represents the electromagnetic wave shielding film which did not break when the number of times of bending was 600 times in the evaluation of bending resistance. In FIG. 14 , the symbol “×” represents an electromagnetic wave shielding film that breaks when the number of times of bending is less than 600 times in the evaluation of bending resistance. As shown in FIG. 14 , when the square root of the opening area is y and the opening pitch is x, and the relationship between y and x satisfies the following formula (2), the electromagnetic wave shielding film has good bending resistance. y≦0.135x・・・(2)
(層間剝離評價與耐彎折性評價之綜合評價) 圖15為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根且横軸為開口節距，顯示電磁波屏蔽膜之層間剝離評價與耐彎折性評價之綜合評價。 於圖15中，符號「○」表示：於層間剝離評價中不發生膨脹且於耐彎折性評價中在彎折次數600次下不發生斷線的電磁波屏蔽膜。 於圖15中，符號「×」表示：於層間剝離評價中發生膨脹及/或於耐彎折性評價中在彎折次數小於600次下即發生斷線的電磁波屏蔽膜。(Comprehensive evaluation of evaluation of interlayer peeling and evaluation of bending resistance) FIG. 15 is a scatter diagram of electromagnetic wave shielding films, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the difference between the evaluation of interlayer peeling of electromagnetic wave shielding films and the Comprehensive evaluation of bending resistance evaluation. In FIG. 15 , the symbol “◯” represents an electromagnetic wave shielding film that did not swell in the evaluation of interlayer peeling and did not break when the number of bendings was 600 times in the evaluation of bending resistance. In FIG. 15 , the symbol “x” represents an electromagnetic wave shielding film that swells in the evaluation of interlayer peeling and/or breaks when the number of bending times is less than 600 in the evaluation of bending resistance.
於圖15中，符號「○」所示電磁波屏蔽膜為本發明實施例之電磁波屏蔽膜，符號「×」所示電磁波屏蔽膜為本發明比較例之電磁波屏蔽膜。 如圖15所示，若令開口面積之平方根為y且開口節距為x，y與x之關係滿足下述式(1)及式(2)關係之電磁波屏蔽膜為本發明實施例之電磁波屏蔽膜。 y≧0.02x＋3・・・(1) y≦0.38x・・・・・(2)In FIG. 15, the electromagnetic wave shielding film indicated by the symbol "○" is the electromagnetic wave shielding film of the embodiment of the present invention, and the electromagnetic wave shielding film indicated by the symbol "x" is the electromagnetic wave shielding film of the comparative example of the present invention. As shown in FIG. 15 , if the square root of the opening area is y and the opening pitch is x, the electromagnetic wave shielding film whose relationship between y and x satisfies the following equations (1) and (2) is the electromagnetic wave shielding film of the embodiment of the present invention shielding film. y≧0.02x＋3・・・(1) y≦0.38x・・・・・(2)
(利用KEC法之電磁波屏蔽特性評價) 針對各電磁波屏蔽膜之電磁波屏蔽特性，使用一般社團法人KEC關西電子工業振興中心開發之電磁波屏蔽效果測定裝置，在溫度25℃、相對溼度30~50%之條件下，將各電磁波屏蔽膜裁切為邊長15cm之正方形，進行200MHz下之電磁波屏蔽特性測定並予以評價。 茲將結果示於圖16。 圖16為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根且横軸為開口節距，顯示電磁波屏蔽膜之電磁波屏蔽特性之評價。 於圖16中，符號「○」表示：以KEC法測得之200MHz下之電磁波屏蔽特性為85dB以上的電磁波屏蔽膜。 於圖16中，符號「×」表示：以KEC法測得之200MHz下之電磁波屏蔽特性小於85dB的電磁波屏蔽膜。 如圖16所示，令開口面積之平方根為y且開口節距為x時，若y與x之關係滿足下述式(3)，則電磁波屏蔽膜之利用KEC法之電磁波屏蔽特性評價良好。 y≦0.38x・・・(3)(Evaluation of electromagnetic wave shielding properties by KEC method) For the electromagnetic wave shielding properties of each electromagnetic wave shielding film, an electromagnetic wave shielding effect measuring device developed by KEC Kansai Electronics Industry Promotion Center was used. Under the conditions, each electromagnetic wave shielding film was cut out into a square with a side length of 15 cm, and the electromagnetic wave shielding characteristics at 200 MHz were measured and evaluated. The results are shown in Figure 16. 16 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the evaluation of the electromagnetic wave shielding properties of the electromagnetic wave shielding film. In FIG. 16, the symbol "○" represents an electromagnetic wave shielding film whose electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method is 85 dB or more. In Fig. 16, the symbol "x" represents an electromagnetic wave shielding film having an electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method of less than 85 dB. As shown in FIG. 16 , when the square root of the opening area is y and the opening pitch is x, if the relationship between y and x satisfies the following formula (3), the electromagnetic wave shielding film has a good evaluation of the electromagnetic wave shielding properties by the KEC method. y≦0.38x・・・(3)
(層間剝離評價、耐彎折性評價及利用KEC法之電磁波屏蔽特性評價之綜合評價) 圖17為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根且横軸為開口節距，顯示電磁波屏蔽膜之層間剝離評價、耐彎折性評價及電磁波屏蔽特性評價之綜合評價。 於圖17中，符號「○」表示：於層間剝離評價中不發生膨脹、以KEC法測得之200MHz下之電磁波屏蔽特性為85dB以上且於耐彎折性評價中在彎折次數600次下不發生斷線的電磁波屏蔽膜。 於圖17中，符號「×」表示：於層間剝離評價中發生膨脹及/或於耐彎折性評價中在彎折次數小於600次下即發生斷線的電磁波屏蔽膜。 如圖17所示，於耐彎折性評價中在彎折次數600次下不發生斷線的電磁波屏蔽膜亦為以KEC法測得之200MHz下之電磁波屏蔽特性為85dB以上的電磁波屏蔽膜。(Comprehensive evaluation of evaluation of interlayer peeling, evaluation of bending resistance, and evaluation of electromagnetic wave shielding properties by KEC method) Fig. 17 is a scatter diagram of an electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, Displays the comprehensive evaluation of the evaluation of interlayer peeling, the evaluation of bending resistance, and the evaluation of electromagnetic wave shielding properties between electromagnetic wave shielding films. In Fig. 17, the symbol "○" indicates that no swelling occurred in the evaluation of interlayer peeling, the electromagnetic wave shielding property at 200 MHz measured by the KEC method was 85 dB or more, and the number of bending times in the evaluation of bending resistance was 600 times. Electromagnetic wave shielding film that does not cause wire breakage. In FIG. 17 , the symbol “×” represents an electromagnetic wave shielding film that swells in the evaluation of interlayer peeling and/or breaks when the number of bending times is less than 600 in the evaluation of bending resistance. As shown in FIG. 17 , the electromagnetic wave shielding film which did not break when the bending frequency was 600 times in the bending resistance evaluation was also an electromagnetic wave shielding film whose electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method was 85 dB or more.
10、110‧‧‧電磁波屏蔽膜20、120‧‧‧導電性接著劑層25、125‧‧‧導電性接著劑層用組成物30、130‧‧‧屏蔽層40、140‧‧‧絶緣層45‧‧‧絶緣層用樹脂組成物50、150‧‧‧開口部70‧‧‧印版滾筒71‧‧‧突起部非形成區域72‧‧‧突起部73‧‧‧突起部之上表面75‧‧‧壓印滾筒80‧‧‧電磁波屏蔽效果測定裝置83‧‧‧測定夾具84‧‧‧中心導體91‧‧‧析譜儀92、93‧‧‧衰減器94‧‧‧前置放大器131‧‧‧銀層132‧‧‧銅層133‧‧‧銀膏10. 110‧‧‧Electromagnetic
圖1為示意圖，其示意性地顯示KEC法中使用之系統結構。 圖2為截面圖，其示意性地顯示本發明之電磁波屏蔽膜之一例。 圖3(a)及(b)為示意圖，其示意性地顯示使用屏蔽層未形成開口部之電磁波屏蔽膜來製造屏蔽印刷配線板的情況。 圖4(a)~(c)為俯視圖，其示意性地顯示構成本發明電磁波屏蔽膜之屏蔽層中之開口部配列圖案之一例。 圖5為截面圖，其示意性地顯示屏蔽層係由銅層及銀層構成之本發明電磁波屏蔽膜之一例。 圖6(a)~(c)為步驟圖，其示意性地依序顯示本發明之電磁波屏蔽膜之製造方法之一例。 圖7為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之絕緣層準備步驟之一例。 圖8為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之銀膏印刷步驟之一例。 圖9為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之銀膏印刷步驟之一例。 圖10為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之銀膏印刷步驟之一例。 圖11(a)及(b)為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之鍍銅步驟之一例。 圖12(a)及(b)為步驟圖，其示意性地顯示本發明之電磁波屏蔽膜之製造方法中之導電性接著劑層形成步驟之一例。 圖13為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根、横軸為開口節距，顯示電磁波屏蔽膜之層間剝離評價。 圖14為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根、横軸為開口節距，顯示電磁波屏蔽膜之耐彎折性評價。 圖15為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根、横軸為開口節距，顯示電磁波屏蔽膜之電磁波屏蔽特性評價與耐彎折性評價之綜合評價。 圖16為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根、横軸為開口節距，顯示電磁波屏蔽膜之電磁波屏蔽特性評價。 圖17為電磁波屏蔽膜之散佈圖，其令縱軸為開口面積之平方根、横軸為開口節距，顯示電磁波屏蔽膜之層間剝離評價、耐彎折性評價及電磁波屏蔽特性評價之綜合評價。FIG. 1 is a schematic diagram schematically showing the structure of a system used in the KEC method. FIG. 2 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention. FIGS. 3( a ) and ( b ) are schematic views schematically showing a case where a shielded printed wiring board is manufactured using an electromagnetic wave shielding film in which an opening is not formed in the shielding layer. FIGS. 4( a ) to ( c ) are plan views schematically showing an example of an arrangement pattern of openings in the shielding layer constituting the electromagnetic wave shielding film of the present invention. 5 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention in which the shielding layer is composed of a copper layer and a silver layer. FIGS. 6( a ) to ( c ) are step diagrams schematically showing an example of the manufacturing method of the electromagnetic wave shielding film of the present invention in sequence. 7 is a step diagram schematically showing an example of an insulating layer preparation step in the method of manufacturing the electromagnetic wave shielding film of the present invention. FIG. 8 is a step diagram schematically showing an example of a silver paste printing step in the manufacturing method of the electromagnetic wave shielding film of the present invention. FIG. 9 is a step diagram schematically showing an example of a silver paste printing step in the manufacturing method of the electromagnetic wave shielding film of the present invention. FIG. 10 is a step diagram schematically showing an example of a silver paste printing step in the manufacturing method of the electromagnetic wave shielding film of the present invention. FIGS. 11( a ) and ( b ) are step diagrams schematically showing an example of the copper plating step in the method for producing the electromagnetic wave shielding film of the present invention. FIGS. 12( a ) and ( b ) are step diagrams schematically showing an example of the steps of forming the conductive adhesive layer in the method for producing the electromagnetic wave shielding film of the present invention. 13 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, and shows the evaluation of interlayer peeling of the electromagnetic wave shielding films. 14 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, and shows the evaluation of the bending resistance of the electromagnetic wave shielding film. 15 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the comprehensive evaluation of the electromagnetic wave shielding property evaluation and the bending resistance evaluation of the electromagnetic wave shielding film. 16 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, and shows the electromagnetic wave shielding characteristic evaluation of the electromagnetic wave shielding film. 17 is a scatter diagram of the electromagnetic wave shielding film, in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, showing the comprehensive evaluation of the evaluation of interlayer peeling, the evaluation of bending resistance, and the evaluation of electromagnetic wave shielding properties of the electromagnetic wave shielding film.
10‧‧‧電磁波屏蔽膜 10‧‧‧Electromagnetic wave shielding film
20‧‧‧導電性接著劑層 20‧‧‧Conductive adhesive layer
30‧‧‧屏蔽層 30‧‧‧Shielding
40‧‧‧絕緣層 40‧‧‧Insulating layer
50‧‧‧開口部 50‧‧‧Opening
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017021651 | 2017-02-08 | ||
| JP2017-021651 | 2017-02-08 |
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| TW107104531A TWI761447B (en) | 2017-02-08 | 2018-02-08 | Electromagnetic wave shielding film, shielding printed wiring board and electronic equipment |
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| JP (1) | JP6404535B1 (en) |
| KR (1) | KR102245681B1 (en) |
| CN (1) | CN110235538B (en) |
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| JP7363103B2 (en) * | 2019-05-30 | 2023-10-18 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic shielding sheets and printed wiring boards |
| JP6645610B1 (en) * | 2019-08-01 | 2020-02-14 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
| JP6860111B1 (en) * | 2019-10-23 | 2021-04-14 | 東洋インキＳｃホールディングス株式会社 | Manufacturing method of electromagnetic wave shield film |
| CN114007401A (en) * | 2020-07-28 | 2022-02-01 | 臻鼎科技股份有限公司 | Method for manufacturing electromagnetic shielding film |
| CN112428699B (en) * | 2020-11-11 | 2022-04-15 | 大连理工大学 | Integrated printing device of flexible microwave shield and circuit design method of microwave shield |
| KR102496420B1 (en) | 2020-12-31 | 2023-02-06 | 동의대학교 산학협력단 | Wallpaper and floor panel with excellent radon blocking effect |
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| JP2000196285A (en) * | 1998-12-25 | 2000-07-14 | Sumitomo Rubber Ind Ltd | Translucent electromagnetic wave shielding member and manufacture thereof |
| JP2004273577A (en) * | 2003-03-06 | 2004-09-30 | Sumitomo Electric Printed Circuit Inc | Shield film and its manufacturing method |
| JP2010189688A (en) * | 2009-02-17 | 2010-09-02 | Fujifilm Corp | Method of producing microstructure and microstructure |
| TW201325425A (en) * | 2011-12-08 | 2013-06-16 | Ind Tech Res Inst | Electromagnetic wave shielding composited films and flexible printed circuit boards with the composite film |
| US20140141232A1 (en) * | 2012-11-21 | 2014-05-22 | Industrial Technology Research Institute | Electromagnetic wave shielding structure and method for fabricating the same |
| US20160120077A1 (en) * | 2013-05-29 | 2016-04-28 | Tatsuta Electric Wire & Cable Co., Ltd. | Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4647924B2 (en) * | 2004-03-23 | 2011-03-09 | タツタ電線株式会社 | Shield film for printed wiring board and method for producing the same |
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2018
- 2018-02-07 WO PCT/JP2018/004113 patent/WO2018147302A1/en active Application Filing
- 2018-02-07 KR KR1020197015507A patent/KR102245681B1/en active IP Right Grant
- 2018-02-07 JP JP2018535441A patent/JP6404535B1/en active Active
- 2018-02-07 CN CN201880009011.2A patent/CN110235538B/en active Active
- 2018-02-08 TW TW107104531A patent/TWI761447B/en active
Patent Citations (6)
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| JP2000196285A (en) * | 1998-12-25 | 2000-07-14 | Sumitomo Rubber Ind Ltd | Translucent electromagnetic wave shielding member and manufacture thereof |
| JP2004273577A (en) * | 2003-03-06 | 2004-09-30 | Sumitomo Electric Printed Circuit Inc | Shield film and its manufacturing method |
| JP2010189688A (en) * | 2009-02-17 | 2010-09-02 | Fujifilm Corp | Method of producing microstructure and microstructure |
| TW201325425A (en) * | 2011-12-08 | 2013-06-16 | Ind Tech Res Inst | Electromagnetic wave shielding composited films and flexible printed circuit boards with the composite film |
| US20140141232A1 (en) * | 2012-11-21 | 2014-05-22 | Industrial Technology Research Institute | Electromagnetic wave shielding structure and method for fabricating the same |
| US20160120077A1 (en) * | 2013-05-29 | 2016-04-28 | Tatsuta Electric Wire & Cable Co., Ltd. | Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil |
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| Publication number | Publication date |
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| WO2018147302A1 (en) | 2018-08-16 |
| CN110235538B (en) | 2020-12-22 |
| CN110235538A (en) | 2019-09-13 |
| JP6404535B1 (en) | 2018-10-10 |
| TW201841565A (en) | 2018-11-16 |
| KR102245681B1 (en) | 2021-04-27 |
| KR20190116973A (en) | 2019-10-15 |
| JPWO2018147302A1 (en) | 2019-02-14 |
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