TWI760248B - Transient thermal diffusivity measurement method of heat dissipation module - Google Patents
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Abstract
一種散熱模組之暫態熱擴散性能量測方法,主要是於一散熱模組的表面選擇二量測點,並且使該二量測點位於熱中心點的同一側但不同距離,之後再分別量測該二量測點的溫度,並代入下列式(1),其中該式(1)係為對能量方程式求解析解; A method for measuring the transient thermal diffusivity of a heat dissipation module is mainly to select two measurement points on the surface of a heat dissipation module, and make the two measurement points located on the same side of a thermal center point but at different distances, and then separately Measure the temperature of the two measuring points, and substitute the following formula (1), wherein the formula (1) is an analytical solution to the energy equation;
在上述之代入式(1)運算之後,可得下列式(2)及式(3)來求得M; After substituting the above equation (1), the following equations (2) and (3) can be obtained to obtain M;
最後,將M與第一量測點的距離X1以及在暫態之某一時刻之溫度T1代入式(1),即可求得的熱擴散係數α的值,該熱擴散係數α的值即用來代表該散熱模組之暫態熱擴散性能。 Finally, the distance X1 between M and the first measurement point and the temperature T1 at a certain moment in the transient state are substituted into the formula (1), and the value of the thermal diffusivity α can be obtained. The value of the thermal diffusivity α is Used to represent the transient thermal diffusion performance of the cooling module.
Description
本發明係與熱擴散性能的量測技術有關,特別是指一種散熱模組之暫態熱擴散性能量測方法。 The present invention is related to the measurement technology of thermal diffusivity, in particular to a method for measuring the transient thermal diffusivity of a heat dissipation module.
散熱模組是目前廣泛使用於電腦或發熱晶片模組(例如LED燈板)的裝置。目前已知的散熱模組,大多是以一金屬底板(鋁或銅)上方設置或一體成形複數散熱鰭片,並以該金屬底板貼置於一熱源,藉此對該熱源提供將熱能向側方傳導並向上傳導藉由該複數散熱鰭片進行散熱的效果。 The heat dissipation module is a device widely used in computers or heat-generating chip modules (such as LED light panels). Most of the known heat dissipation modules currently have a plurality of heat dissipation fins disposed on or integrally formed on a metal base plate (aluminum or copper), and the metal base plate is attached to a heat source, thereby providing heat energy to the heat source to the side. Square conduction and upward conduction through the plurality of heat dissipation fins to dissipate heat.
前述以金屬底板做為散熱模組來與熱源貼接的技術,在熱源的熱能不高時其金屬熱傳導的效果還可算得上堪用,但在現在電腦CPU(中央處理單元)或LED燈板愈來愈進步,而單位時間內所產生的熱能也愈來愈高的情況下,前述以金屬底板做為散熱模組的技術其藉由金屬熱傳導的速度顯已不敷使用。因此,有人提出使用均溫導熱板(蒸汽腔室,Vapor Chamber)設置於該金屬底板下方而貼接於熱源,而成為一種含有均溫導熱板的散熱模組,藉由該均溫導熱板的快速均溫的特性,達到將熱能快速分散至該均溫導熱板各個位置的效果,因此獲得了更好的散熱效果。 The aforementioned technology of using the metal base plate as a heat dissipation module to attach to the heat source, the effect of metal heat conduction can be considered acceptable when the heat energy of the heat source is not high, but in the current computer CPU (Central Processing Unit) or LED light board Under the situation that the heat energy generated per unit time is getting higher and higher, the above-mentioned technology of using the metal base plate as the heat dissipation module is obviously not enough to use the speed of metal heat conduction. Therefore, some people propose to use a vapor chamber (vapor chamber) to be placed under the metal bottom plate and attached to the heat source, so as to become a heat dissipation module including a vapor chamber. The characteristic of rapid temperature uniformity achieves the effect of quickly dispersing heat energy to various positions of the uniform temperature and heat conduction plate, thus obtaining a better heat dissipation effect.
然而,目前的技術雖已發展至使用均溫導熱板與散熱模組組合來增強散熱效果,然而,對於散熱模組的熱擴散性能,僅有概念上的快與慢或 好與差的區別而已,並沒有一個具體且有數據根據的量測技術,僅能依靠儀器長時間的量測以獲得觀察到的結果。 However, although the current technology has been developed to use a combination of a thermally conductive plate and a heat dissipation module to enhance the heat dissipation effect, however, for the heat dissipation performance of the heat dissipation module, there are only conceptual fast and slow or The difference between good and bad is just that, there is no specific and data-based measurement technology, and the observed results can only be obtained by measuring instruments for a long time.
本發明之主要目的即在於提出一種散熱模組之暫態熱擴散性能量測方法,其係為一種具體且有數據根據的量測技術。 The main purpose of the present invention is to provide a transient thermal diffusivity energy measurement method of a heat dissipation module, which is a specific and data-based measurement technology.
本發明之再一目的即在於提出一種散熱模組之暫態熱擴散性能量測方法,其可提供使用者具體的量測結果,供使用者判斷被量測的散熱模組之散熱效果的好壞。 Another object of the present invention is to provide a method for measuring the transient thermal diffusivity of a heat dissipation module, which can provide a user with specific measurement results, so that the user can judge whether the heat dissipation effect of the measured heat dissipation module is good. Bad.
為了達成上述目的,本發明提出一種散熱模組之暫態熱擴散性能量測方法,包含有下列步驟A)至步驟D):A)決定一第一量測點及一第二量測點:將該散熱模組用來與一熱源貼接的表面定義為一導熱面,該導熱面貼接該熱源的區域的中心點定義為一熱中心點,並且於該導熱面上以該熱中心點為中心定義一矩形,該矩形之長寬均不超出該導熱面之邊緣;於該導熱面上的該矩形一邊的外側與該導熱面邊緣之間,任意選擇一第一量測點以及一第二量測點,該第一量測點與該矩形之該邊或該邊之虛擬延長線的直線距離係大於該第二量測點與該矩形之該邊或該邊之虛擬延長線的直線距離;B)量測溫度:將該散熱模組貼置於該熱源,並在該熱源穩定發熱的狀態下,分別量測該第一量測點以及該第二量測點的溫度隨時間的變化,且該散熱模組的散熱狀態不再有所改變即進入穩態;C)代入計算式:將該第一量測點與該第二量測點的溫度及距離代入下列式(1)及計算:以該第一量測點的距離X1之穩態溫度T1及第二量測 點的距離X2之穩態溫度T2而言,代入下列式(1),其中該式(1)係為對能量方程式求解析解; In order to achieve the above object, the present invention provides a method for measuring the transient thermal diffusivity of a heat dissipation module, comprising the following steps A) to D): A) determining a first measurement point and a second measurement point: The surface used for the heat dissipation module to be attached to a heat source is defined as a heat conduction surface, the center point of the area where the heat conduction surface is attached to the heat source is defined as a heat center point, and the heat center point is defined as the heat center point on the heat conduction surface. A rectangle is defined as the center, and the length and width of the rectangle do not exceed the edge of the heat-conducting surface; a first measurement point and a first measuring point are arbitrarily selected between the outer side of the rectangle on the heat-conducting surface and the edge of the heat-conducting surface. Two measurement points, the straight line distance between the first measurement point and the side of the rectangle or the virtual extension of the side is greater than the straight line between the second measurement point and the side of the rectangle or the virtual extension of the side distance; B) measuring temperature: the heat dissipation module is attached to the heat source, and when the heat source is stably generating heat, the temperature of the first measurement point and the temperature of the second measurement point are respectively measured over time. change, and the heat dissipation state of the heat dissipation module no longer changes, that is, it enters a steady state; C) Substitute into the calculation formula: Substitute the temperature and distance of the first measurement point and the second measurement point into the following formula (1) And calculation: using the steady-state temperature T1 of the distance X1 of the first measurement point and the second measurement For the steady-state temperature T2 of the distance X2 from the point, substitute the following formula (1), where the formula (1) is an analytical solution to the energy equation;
其中,,,,dX=X1-X2, ,;其中,M為熱傳導與熱對流強度比,h為對流熱傳係數,K為熱傳導係數,D為特徵直徑,T為溫度,t為時間,X為位置,L為特徵長度,λ為特徵值,dx為第一量測點與第二量測點之間的距離,X1為該第一量測點與該矩形之該邊或該邊之虛擬延長線的直線距離;在上述之代入式(1)運算之後,可得下列式(2)及式(3); in, , , , dX = X 1 - X 2, , ; where M is the ratio of heat conduction to heat convection intensity, h is the convective heat transfer coefficient, K is the heat transfer coefficient, D is the characteristic diameter, T is the temperature, t is the time, X is the position, L is the characteristic length, and λ is the characteristic value , dx is the distance between the first measurement point and the second measurement point, X1 is the straight-line distance between the first measurement point and the side of the rectangle or the virtual extension line of the side; in the above substitution formula ( 1) After the operation, the following formulas (2) and (3) can be obtained;
由上述之式(2)及式(3)可求得M;D)結果:將步驟C)中求得之M與該第一量測點的距離X1於暫態之某一時刻t1之溫度T1代入式(1),即可求得的熱擴散係數α的值,該熱擴散係數α的值即用來代表該散熱模組之暫態熱擴散性能。 M can be obtained from the above formulas (2) and (3); D) Result: the temperature of the distance X1 between the M obtained in step C) and the first measurement point at a certain moment t1 in the transient state Substitute T1 into Equation (1) to obtain the value of the thermal diffusivity α, which is used to represent the transient thermal diffusivity of the heat dissipation module.
藉此,本發明為一個具體且有數據根據的量測技術而可供業界使用,進而,本發明可提供使用者具體的量測結果,供使用者判斷被量測的散熱模組之散熱效果的好壞。 Therefore, the present invention is a specific and data-based measurement technology that can be used by the industry, and further, the present invention can provide the user with specific measurement results for the user to judge the heat dissipation effect of the measured heat dissipation module good or bad.
11:散熱模組 11: Cooling module
12:金屬底板 12: Metal bottom plate
14:散熱鰭片 14: cooling fins
15:均溫導熱板 15: Temperature and heat conduction plate
151:導熱面 151: Thermal surface
152:矩形 152: Rectangle
16:風扇 16: Fan
O:熱中心點 O: hot center point
O1:第一量測點 O1: The first measurement point
O2:第二量測點 O2: The second measuring point
X1:直線距離 X1: straight line distance
X2:直線距離 X2: Straight line distance
圖1係本發明一較佳實施例之流程圖。 FIG. 1 is a flow chart of a preferred embodiment of the present invention.
圖2係本發明一較佳實施例之散熱模組之組合示意圖。 FIG. 2 is a schematic diagram of a combination of a heat dissipation module according to a preferred embodiment of the present invention.
圖3係本發明一較佳實施例之散熱模組底面示意圖。 3 is a schematic diagram of the bottom surface of a heat dissipation module according to a preferred embodiment of the present invention.
圖4係本發明一較佳實施例之另一散熱模組之組合示意圖。 FIG. 4 is a schematic diagram of the assembly of another heat dissipation module according to a preferred embodiment of the present invention.
圖5係本發明一較佳實施例之另一散熱模組底面示意圖。 FIG. 5 is a schematic bottom view of another heat dissipation module according to a preferred embodiment of the present invention.
為了詳細說明本發明之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中: In order to illustrate the technical features of the present invention in detail, the following preferred embodiments are given and described in conjunction with the drawings as follows, wherein:
如圖1至圖3所示,本發明一較佳實施例所提出之一種散熱模組之暫態熱擴散性能量測方法,主要是以下列步驟來進行量測: As shown in FIG. 1 to FIG. 3 , a method for measuring the transient thermal diffusivity of a heat dissipation module according to a preferred embodiment of the present invention is mainly performed by the following steps:
A)決定一第一量測點及一第二量測點:將一散熱模組11用來與一熱源(圖中未示)(例如電腦的中央處理單元CPU或LED晶片電路板)貼接的表面定義為一導熱面151,於本實施例中,該散熱模組11係具有一金屬底板12以及由該金屬底板12向上延伸的複數散熱鰭片14,以及具有一均溫導熱板15以其頂面貼設於該金屬底板12之底面,該均溫導熱板15之底面即做為該導熱面151,該散熱模組11還具有一風扇16設於該複數散熱鰭片14上;該導熱面151貼接該熱源的區域的中心點定義為一熱中心點O,並且於該導熱面151上以該熱中心點O為中心定義一矩形152,該矩形152之長寬均不超出該導熱面151之邊緣;於該導熱面151上的該矩形152一邊的外側與該導熱面151邊緣之間,選擇一第一量測點O1以及一第二量測點O2,該第一量測點O1與該矩形152之該邊的直線距離X1係大於該
第二量測點O2與該矩形152之該邊的直線距離X2。此外,於本實施例中,該第二量測點O2係位於該第一量測點O1與該矩形152之該邊的垂直連線上,亦即,該第二量測點O2與該第一量測點O1是沿著其與該矩形152之該邊的垂直線而呈現線性關係。另外,於本實施例中,是以該矩形152的大小與該熱源的大小一致為例說明,不過,該矩形152的大小也可以在長度及寬度上小於該熱源的長度及寬度,或大於該熱源的長度及寬度,在該矩形152極小的狀況下,其各邊即視為與該熱中心點O重疊。
A) Determine a first measurement point and a second measurement point: use a
B)量測溫度:將該散熱模組11貼置於該熱源,並在該熱源穩定發熱的狀態下,分別量測該第一量測點O1以及該第二量測點O2的溫度隨時間的變化,且該散熱模組11的散熱狀態不再有所改變即進入穩態。
B) Measure temperature: place the
C)代入計算式:將該第一量測點O1與該第二量測點O2的溫度及距離代入下列式(1)計算: C) Substitute into calculation formula: Substitute the temperature and distance of the first measurement point O1 and the second measurement point O2 into the following formula (1) to calculate:
以該第一量測點O1的距離X1之穩態溫度T1及第二量測點O2的距離X2之穩態溫度T2而言,代入下列式(1),其中該式(1)係為對能量方程式求解析解; Taking the steady-state temperature T1 of the distance X1 of the first measurement point O1 and the steady-state temperature T2 of the distance X2 of the second measurement point O2, substitute the following formula (1), wherein the formula (1) is for Analytical solution of the energy equation;
其中,,,,dX=X1-X2, ,。 in, , , , dX = X 1 - X 2, , .
其中,M為熱傳導與熱對流強度比,h為對流熱傳係數,K為熱傳導係數,D為特徵直徑,T為溫度,t為時間,X為位置,L為特徵長度,λ為特徵
值,dx為第一量測點O1與第二量測點O2之間的距離,X1為該第一量測點O1與該矩形152之該邊的直線距離,X2為該第一量測點O2與該矩形152之該邊的直線距離。
Among them, M is the ratio of heat conduction to heat convection intensity, h is the convective heat transfer coefficient, K is the heat conduction coefficient, D is the characteristic diameter, T is the temperature, t is the time, X is the position, L is the characteristic length, and λ is the characteristic
value, dx is the distance between the first measurement point O1 and the second measurement point O2, X1 is the straight-line distance between the first measurement point O1 and the side of the
在上述之代入式(1)運算之後,可得下列式(2)及式(3): After the above-mentioned substitution equation (1) operation, the following equations (2) and (3) can be obtained:
由上述之式(2)及式(3)可求得M。 M can be obtained from the above equations (2) and (3).
D)結果:將步驟C)中求得之M與該第一量測點O1的距離X1於暫態之某一時刻t1之溫度T1代入式(1),即可求得的熱擴散係數α的值,該熱擴散係數α的值即用來代表該散熱模組11之暫態熱擴散性能。
D) Result: Substitute the temperature T1 of the distance X1 between the M obtained in step C) and the first measurement point O1 at a certain moment t1 of the transient state into the formula (1), and the thermal diffusivity α can be obtained. The value of the thermal diffusivity α is used to represent the transient thermal diffusivity of the
以上說明了本發明的量測方法的各個步驟,接下來以實際數據進行說明。 The steps of the measurement method of the present invention have been described above, and the actual data will be used to describe the following.
在該第一量測點O1與該矩形152之該邊的直線距離X1=0.16m(公尺)以及該第二量測點O2與該矩形152之該邊的直線距離X2=0.07m的條件下,在某一時刻(即穩態)時,該第一量測點O1的溫度t1=攝氏67.5℃,該第二量測點O2的溫度t2=攝氏71.5℃。依上述之公式代入後,即求得熱擴散係數α=1.187cm2/s。藉此,即可藉由該熱擴散係數α的數值大小來判斷該散熱模組11的散熱效果。
Under the condition that the linear distance between the first measurement point O1 and the side of the
前述的散熱模組11,是以具有均溫導熱板15的散熱模組為例說明,然而,若是不含均溫導熱板15的散熱模組,亦即單純為具有一金屬底板12以及複數散熱鰭片14者,如圖4所示,亦可以對其底面使用本發明之方法來量測出該散熱模組11的熱擴散係數α之數值。
The above-mentioned
上述的說明中,是以該第二量測點O2係位於該第一量測點O1與該矩形152之該邊的垂直連線上的關係來說明的,然而,如圖5所示,事實上該第二量測點O2也可以不位於該第一量測點O1與該矩形152之該邊的垂直連線上,而呈現非線性關係。這是由於本案的技術主要是以該第一量測點O1及該第二量測點O2各自與該矩形152之該邊的直線距離來進行計算,因此即使是非線性關係,也可以進行運算。例如,如圖5所示,該第一量測點O1所處的位置超出該矩形152的該邊的範圍,則垂直連線即無法交接於該邊,此時則可以將該邊延長而得到一虛擬延伸線,供該第一量測點O1及該第二量測點O2與該虛擬延伸線之間得以構成垂直連線。
In the above description, the relationship between the second measurement point O2 and the vertical connection line between the first measurement point O1 and the side of the
本案的技術重點在於該第一量測點O1及該第二量測點O2都位於該矩形152一邊的外側,也就是同一邊的外側,因此是屬於一維的熱擴散量測技術。本發明之技術並不包含該第一量測點O1位於該矩形152一邊的外側,而該第二量測點O2位於另一個邊的外側這樣的狀況。
The technical focus of this case is that the first measurement point O1 and the second measurement point O2 are both located outside of one side of the
綜上可知,本發明乃是一種具體且有數據根據的量測技術,其可以提供使用者具體的量測結果,即熱擴散係數α,供使用者判斷被量測的散熱模組11之散熱效果的好壞。
To sum up, the present invention is a specific and data-based measurement technology, which can provide the user with a specific measurement result, that is, the thermal diffusivity α, for the user to judge the heat dissipation of the
11:散熱模組 11: Cooling module
15:均溫導熱板 15: Temperature and heat conduction plate
151:導熱面 151: Thermal surface
152:矩形 152: Rectangle
O:熱中心點 O: hot center point
O1:第一量測點 O1: The first measurement point
O2:第二量測點 O2: The second measuring point
X1:直線距離 X1: straight line distance
X2:直線距離 X2: Straight line distance
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TW201638706A (en) * | 2015-04-24 | 2016-11-01 | 長聖儀器股份有限公司 | Cooling device |
TWI716240B (en) * | 2019-12-27 | 2021-01-11 | 長聖儀器股份有限公司 | Thermal diffusivity performance measuring system and method |
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TW201638706A (en) * | 2015-04-24 | 2016-11-01 | 長聖儀器股份有限公司 | Cooling device |
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