TWI758911B - Electronic product touch sensing display module - Google Patents

Abstract

A touch sensing display module is provided, including: a display unit and a film sensing structure. The display unit has a front surface, a rear surface opposite to the front surface, and a side connecting the front surface and the rear surface. The film sensing structure is attached to the display unit, and includes a main body and a bending portion connected to the main body, wherein the bending portion includes a slot. The bending portion extends from the front surface of the display unit to the rear surface through the side, and covers a portion of the side and the rear surface, and a portion of the display unit is exposed by the slot.

Description

Electronic products and touch-sensitive display modules

The present disclosure relates to electronic products and touch-sensing display modules, and more particularly, to a touch-sensing display module including a thin-film sensing structure with a bent portion and a slot.

With the development of science and technology, people's pursuit of high-efficiency and high-standard visual enjoyment of electronic products is getting higher and higher, so as to enrich and better product experience. For example, products such as smart phones, laptop computers, and tablet computers that are operated by touch screens have appeared today, which enriches people's experience in using electronic products. In the face of people's desire to pursue products that are more powerful, thinner, and more efficient, the volume of the product itself is also approaching miniaturization and multi-functionality, such as narrow bezel, full-screen design, or curved screen design. In view of this, how to provide a device structure that is intuitive to use, miniaturized, or efficiently utilizes space so that the volume of the device can be reduced is an important issue.

An embodiment of the present disclosure provides a touch sensing display module including a display unit and a thin film sensing structure. The display unit has a front surface, a back surface opposite to the front surface, and a side edge connecting the front surface and the back surface. The thin film sensing structure is attached to the display unit, and includes a body and a bending part connected to the body, wherein the bending part includes a slot. The bent portion extends from the front surface of the display unit through the side to the back surface, covers part of the side edge and the back surface, and is grooved to reveal part of the display unit.

In one embodiment, the aforementioned slot exposes part of the back surface and the side of the display unit.

In one embodiment, the body is adjacent to the front surface, and the bent portion is adjacent to the side edge and the rear surface.

In one embodiment, the aforementioned touch-sensing display module further includes a substrate, the thin-film sensing structure and the display unit are disposed on the substrate, and the thin-film sensing structure is located between the substrate and the display unit.

In one embodiment, the front surface of the aforementioned display unit faces the substrate.

In one embodiment, the bending portion is formed at least at one end of the thin-film sensing structure.

In one embodiment, the aforementioned thin film sensing structure has an L-shaped structure.

In one embodiment, the aforementioned bending portions are formed at opposite ends of the thin-film sensing structure, and the thin-film sensing structure has a C-shaped structure.

In one embodiment, the aforementioned slot is a through slot penetrating through the thin film sensing structure.

In one embodiment, the aforementioned touch-sensitive display module further includes a first optical adhesive disposed between the thin-film sensing structure and the display unit, and the display unit is attached to the thin-film sensing structure by the first optical adhesive.

In one embodiment, the aforementioned touch-sensitive display module further includes a second optical adhesive disposed between the substrate and the thin-film sensing structure, and the thin-film sensing structure is attached to the substrate by the second optical adhesive.

Another embodiment of the present disclosure provides an electronic product, including: the aforementioned touch-sensitive display module and a functional element. The functional element is adjacent to the touch-sensitive display module. Wherein, the arrangement position of the slot of the bending portion is set corresponding to the position of the functional element.

In one embodiment, the aforementioned touch-sensing display module further includes a shielding layer disposed on a surface of the substrate to define a peripheral area of the touch-sensing display module.

In one embodiment, an optical hole corresponding to the functional element is configured on the substrate through a shielding layer or a hole.

100: Touch sensing display module

110: Substrate

110A: External surface

110B: Shaded area

110H: Optical hole

120: Thin Film Sensing Structure

121: Ontology

122: Bending part

130: Display unit

130A: Front surface

130B: Back surface

130C: Side

131: Backlight components

132: liquid crystal layer

133: Polarizing member

134: Display unit frame

A-A', B-B': line segment

MS: Functional Elements

OP: Slotted

OA1: First Optical Adhesive

OA2: Second Optical Adhesive

PF: release mold

X100: Electronics

FIG. 1 is a schematic diagram of a touch-sensing display module according to an embodiment of the present disclosure, wherein the thin-film sensing structure of the touch-sensing display module is in an unbent state.

Fig. 2A is a schematic diagram showing a state in which the thin film sensing structure of the touch sensing display module in Fig. 1 has been bent.

Fig. 2B is a schematic cross-sectional view along the line A-A' in Fig. 2A.

Fig. 2C is a schematic cross-sectional view along the line B-B' in Fig. 2A.

FIGS. 3A to 3E are schematic diagrams illustrating a manufacturing process of a touch-sensitive display module according to an embodiment of the present disclosure.

Other areas of applicability to the devices of the present disclosure will be apparent from the detailed description provided below. It must be understood that the following detailed description and specific embodiments, while presenting exemplary embodiments of the carrier assembly, are for descriptive purposes only and are not intended to limit the scope of the present disclosure.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formalized manner. construed in this manner, unless specifically defined herein.

FIGS. 1 and 2A are schematic diagrams of the touch-sensing display module 100 according to an embodiment of the present disclosure, wherein FIG. 1 shows a state where a thin-film sensing structure 120 of the touch-sensing display module 100 has not been bent, and the first FIG. 2A shows a state in which the thin film sensing structure 120 has been bent. The touch sensing display module 100 can be applied to an electronic product, such as a mobile phone, a notebook computer or a tablet computer, and provides touch sensing function and display function. The user can touch the touch-sensitive display module 100 to achieve the function of inputting commands or operations, and watch the image screen output by the electronic product. in some touches In the process of controlling the sensing display module, by bending the local thin film sensing structure 120, the frame can be narrowed and the frameless design can be achieved, so that the display surface of the electronic product can be more beautiful and the display area can be increased. The detailed structure of the touch-sensitive display module 100 will be described below first, and the manufacturing process of the touch-sensitive display module 100 in some embodiments will be described in detail later.

The touch sensing display module 100 includes a substrate 110 , a thin film sensing structure 120 and a display unit 130 , the thin film sensing structure 120 and the display unit 130 are located on the substrate 110 (Z-axis direction), and the thin film sensing structure 120 is located on the substrate 110 and the display unit 130 between units 130. Referring to FIGS. 2A-2C together, the substrate 110 can be a cover glass, which is located at the outermost layer of the touch-sensing display module 100 and can protect the thin-film sensing structure 120 and the display unit 130 covered by the cover glass. In some embodiments, the outer surface 110A of the substrate 110 may be a surface that the user touches and operates. On the contrary, the thin film sensing structure 120 and the display unit 130 are disposed on the inner side of the substrate 110 . In addition, in some embodiments, the thin film sensing structure 120 is a part of the electronic product X100 ( FIGS. 2B-2C ), and the electronic product X100 further includes a functional element MS, wherein the functional element MS is disposed adjacent to the touch sensing display module 100 , and can be arranged on the inner side of the substrate 110, the functional element MS is such as an optical component, for example, the optical component can be, for example, a camera lens unit, an optical sensing element, an optical receiving element, etc., and other functional elements MS can also be, for example, It is a structural component such as an antenna, a fixing member, a protruding device, etc., which is not limited by this embodiment.

In addition, a shielding layer 110B may be disposed on the inner surface of the substrate 110 to define a peripheral area for shielding the periphery of the touch-sensing display module 100 Functional components MS of circuits and electronic products, etc. If the functional element MS is exemplified by an optical component, in order to allow the optical component to operate normally, the substrate 110 may be provided with an optical hole 110H corresponding to the optical component through the space or opening of the shielding layer 110B to provide an optical channel, The shielding layer 110B is prevented from shielding the optical components. In some embodiments, in the Y-axis direction, the optical hole 110H is usually located near the upper edge of the touch-sensitive display module 100 .

The display unit 130 can be used to display images for the user to watch, and the thin film sensing structure 120 can enable the touch sensing display module 100 to have a touch sensing function, and the user can touch the substrate 110 (for example, with a hand or a stylus) The outer surface 110A of the touch sensor is realized.

The aforementioned display unit 130 is used for displaying images, which can be a liquid crystal display (LCD), a light emitting diode (LED) display, or other types of suitable displays. The aforementioned light-emitting diodes may include organic light-emitting diodes (OLEDs), sub-millimeter light-emitting diodes (mini LEDs), micro light-emitting diodes (micro LEDs) or quantum dot light-emitting diodes (quantum dots). dot LED, QDLED), etc. This embodiment is described by, for example, a liquid crystal display. The display unit 130 has a backlight member 131 , a liquid crystal layer 132 , a polarizing member 133 and a display unit frame 134 , wherein the backlight member 131 , the liquid crystal layer 132 and the polarizing member 133 are provided within the outer frame 134 of the display unit. In other embodiments, the display unit 130 may include an alignment layer, an overcoat layer, a diffusion layer or a brightness enhancement film, so as to make the light output of the display unit 130 uniform or brightened.

Regarding the thin film sensing structure 120, please continue to refer to FIGS. 2A-2C, it has a main body 121 and a bending part 122, the bending part 122 is connected to at least one side of the main body 121, and in the Z-axis direction, the display unit 130 is a It is sandwiched between the main body 121 and the bending portion 122 . In detail, the display unit 130 has a front surface 130A, a back surface 130B opposite to the front surface 130A, and a side 130C connecting the front surface 130A and the back surface 130B. The body 121 of the thin film sensing structure 120 is adjacent to the front surface 130A, and the thin film sensing The bent portion 122 of the structure 120 is adjacent to the side edge 130C and the rear surface 130B. The bent portion 122 extends from the front surface 130A through the side edge 130C to the rear surface 130B, and partially covers the side edge 130C and the rear surface 130B of the display unit 130 . In some embodiments, the thin film sensing structure 120 includes a transparent sensing electrode layer (not shown) and peripheral leads (not shown) electrically connected to the transparent sensing electrode layer, wherein the transparent sensing electrode layer is correspondingly disposed on the The area of the body 121 and the peripheral lead are correspondingly disposed in the area of the bent portion 122 .

It should be noted that the bent portion 122 of the thin film sensing structure 120 is provided with an opening OP. In this embodiment, the opening OP is a through groove that penetrates the thin film sensing structure 120 and exposes part of the display unit 130 . Specifically, the position of the slot OP on the bent portion 122 is designed to correspond to the position of the functional element MS of the electronic product. In this way, by arranging the slot OP on the bent portion 122, the thin film sensing structure can be avoided. 120 When the bending portion 122 is bent, a mechanism interference occurs between the functional element MS of the electronic product and the bending portion 122 , which can be more flexible in terms of mechanism layout or subsequent production and assembly processes. In addition, since the peripheral leads of the thin film sensing structure 120 are disposed on the bent portion 122, after the bent portion 122 is bent to form a bending angle of less than 180° (eg, 90°) with the body 121 , so that the peripheral leads can be at least relatively On the side 130C of the unit 130 , the setting area of the shielding layer 110B of the substrate 110 can be relatively reduced, which is beneficial to the narrowing of the border of the display surface of electronic products or the design of the full screen without borders.

It is added that the thin film sensing structure 120 may include, for example, at least one substrate (not shown) and at least one transparent sensing electrode layer (not shown) disposed on the substrate. In one embodiment, the stacked structure may be, for example, a transparent sensing electrode layer disposed on at least one surface of a substrate. In some embodiments, the stacked structure may be, for example, two transparent sensing electrode layers are respectively disposed on opposite side surfaces of a substrate. In some embodiments, the stacked structure can be, for example, two transparent sensing electrode layers are respectively disposed on the surfaces of different sheets of substrates, and then an adhesive layer (not shown) is used to bond the two sheets to form a transparent sensing electrode layer. The substrate of the sensing electrode layer. Certainly, the specific stack structure design scheme of the thin film sensing structure 120 of the present disclosure is not limited to the above-mentioned structure.

FIGS. 3A to 3E are flowcharts showing the manufacturing process of the touch-sensitive display module according to an embodiment of the present disclosure. It should be noted that this embodiment is used to describe the manufacturing method of the touch-sensitive display module, and other functional elements of electronic products are omitted. In fact, reference can be made to the touch-sensitive display shown in Figures 2B and 2C. The adjacency relationship between the module 100 and the functional element MS. First, as shown in FIG. 3A, a film sensing structure 120 is disposed on a release mold PF, wherein the release mold PF can be a release film, for example, as a temporary carrier substrate, and the film sensing structure 120 is placed on the film sensing structure. A first optical adhesive OA1 is configured on the 120 . In some embodiments, if the thin film sensing structure 120 itself already includes a substrate with sufficient support in the process, the release mold PF may not be needed, and the In the process, the thin film sensing structure 120 is directly provided, and the first optical adhesive OA1 is disposed on the thin film sensing structure 120 .

Next, as shown in FIG. 3B , a display unit 130 is disposed on the thin film sensing structure 120 through the first optical adhesive OA1 . A bending process is performed. As shown in FIG. 3C, the film sensing structure 120 and the first optical adhesive OA1 are bent by the release mold PF, wherein, in this embodiment, the film sensing structure with the first optical adhesive OA1 is provided. The structure 120 is exemplified by the fact that the opposite ends of the structure 120 are bent, that is, the opposite ends of the thin film sensing structure 120 have bending portions 122. In other words, the two bending portions 122 in this embodiment are connected to the body. Opposite sides of 121. During the bending process, the bending portion 122 of the thin film sensing structure 120 extends from the front surface 130A of the display unit 130 through the side edge 130C to the back surface 130B, and covers part of the side edge 130C and the back surface 130B after being bent. Viewed from the direction, the bent portion 122 presents an L-shaped or C-shaped structure. In addition, the bent portion 122 of the thin film sensing structure 120 can be attached to the side edge 130C and the back surface 130B of the display unit 130 through the first optical adhesive OA1.

Continuing to refer to FIG. 3D, the release mold PF is released from the bent thin film sensing structure 120 (at least partially covering the display unit 130), and the thin film sensing structure 120 is placed on a substrate 110, wherein the thin film sensing structure 120 is connected and disposed on the substrate 110 by a second optical adhesive OA2. In this way, the bent thin film sensing structure 120 is disposed on the substrate 110 , as shown in FIG. 3E . In this embodiment, since opposite ends of the thin film sensing structure 120 are bent, the thin film sensing structure 120 is perpendicular to the arrangement direction of the substrate 110 , the thin film sensing structure 120 , and the display unit 130 , that is, in the x-axis direction. Renders a C-shaped structure. In other embodiments, the thin film sensing structure 120 has At least one end has a bent portion 122 , that is, the bent portion 122 is connected to one side of the main body 121 , as shown in FIG. 2C , so that the thin film sensing structure 120 presents an L-shaped structure.

It is worth noting that the bent portion 122 of the thin film sensing structure 120 has a slot OP, that is, there is no longer the thickness of the thin film sensing structure 120 at the slot OP, so that the functional element of the electronic product corresponding to the slot OP is no longer there. The MS can avoid bending interference and assembly interference with the thin-film sensing structure 120 . In other words, since the bending portion 122 is formed with the slot OP, the thin-film sensing structure 120 , the substrate 110 , and the functional element MS of the electronic product can be more easily accessible. In addition, since there is no longer the thickness of the thin film sensing structure 120 at the slot OP, the distance between other functional elements MS and the thin film sensing structure 120 can be greatly reduced, that is, no special space is required to avoid the gap between the two. Interference occurs to effectively solve the problem of interference between components. In addition, the bending portion 122 extends from the front surface 130A to the rear surface 130B of the display unit 130 and covers the side edge 130C of the display unit 130 , which can facilitate the adhesion between the thin film sensing structure 120 and the display unit 130 combined to improve the reliability of the device.

To sum up, an embodiment of the present disclosure provides a touch sensing display module including a display unit and a thin film sensing structure. The display unit has a front surface, a back surface opposite to the front surface, and a side edge connecting the front surface and the back surface. The thin film sensing structure is attached to the display unit, and includes a body and a bending part connected to the body, wherein the bending part includes a slot. The bent portion extends from the front surface of the display unit through the side to the back surface, covers part of the side edge and the back surface, and is grooved to reveal part of the display unit.

An embodiment of the present disclosure provides an electronic product including the aforementioned touch-sensitive display module and a functional element. The functional element is adjacent to the touch-sensitive display module. Wherein, the arrangement position of the slot of the bending portion is set corresponding to the position of the functional element.

The embodiment of the present disclosure has at least one of the following advantages or effects. By forming a slot in the bent portion of the thin film sensing structure, the gap in the bent portion of the thin film sensing structure can correspond to other functional elements of electronic products, which can avoid or The interference between the thin-film sensing structure and other functional elements is greatly reduced. Furthermore, since the peripheral leads of the thin-film sensing structure are arranged on the bent portion, the peripheral leads can be at least relatively located on the side of the display unit due to the bent portion being bent. In this way, the setting area of the shielding layer of the substrate can be relatively reduced, which is helpful for the design of narrow or no frame of the display surface of the electronic product. In addition, the bending portion is bent toward the back of the display unit to cover the side and back of the display unit, so as to facilitate the adhesion of the film sensing structure and the display unit, and improve the quality of the module.

The ordinal numbers, such as "first", "second", etc., in this specification and the scope of the patent application have no sequential relationship with each other, and are only used to indicate and distinguish two different elements with the same name.

The above embodiments are described in sufficient detail to enable those skilled in the art to implement the apparatus disclosed in the present disclosure by the above description, and it must be understood that, without departing from the spirit and scope of the present disclosure, when Slight changes and modifications may be made, so the scope of protection of this disclosure should be determined by the scope of the appended patent application.

100: Touch sensing display module

110: Substrate

110H: Optical hole

120: Thin Film Sensing Structure

122: Bending part

130: Display unit

OP: Slotted

Claims (14)

A touch sensing display module, comprising: a display unit having a front surface, a back surface opposite to the front surface, and a side connecting the front surface and the back surface; and a thin film sensing structure, and the The display unit is attached, and includes a body and a bending part connected to the body, wherein the bending part includes a slot; wherein, the bending part extends from the front surface of the display unit to the side through the side The back surface covers part of the side edge and the back surface, and the slot exposes part of the display unit. The touch-sensitive display module of claim 1, wherein the slot exposes part of the back surface and the side of the display unit. The touch-sensitive display module of claim 1, wherein the main body is adjacent to the front surface, and the bent portion is adjacent to the side edge and the rear surface. The touch sensing display module of claim 1 further comprises a substrate, the thin film sensing structure and the display unit are disposed on the substrate, and the thin film sensing structure is located between the substrate and the display unit. The touch-sensitive display module of claim 4, wherein the front surface of the display unit faces the substrate. The touch sensing display module of claim 1, wherein the bending portion is formed at least at one end of the thin film sensing structure. The touch sensing display module of claim 6, wherein the thin film sensing structure presents an L-shaped structure. The touch sensing display module of claim 1, wherein the bent portions are formed at opposite ends of the thin film sensing structure, and the thin film sensing structure presents a C-shaped structure. The touch sensing display module of claim 1, wherein the slot is a through slot penetrating the thin film sensing structure. The touch sensing display module of claim 1, further comprising a first optical adhesive disposed between the film sensing structure and the display unit, and the display unit is attached to the film sensing structure by the first optical adhesive . The touch-sensitive display module of claim 4 further comprises a second optical adhesive disposed between the substrate and the thin film sensing structure, and the thin film sensing structure is attached to the substrate by the second optical adhesive. An electronic product, comprising: the touch-sensitive display module according to any one of claims 4, 5, and 11; and a functional element disposed adjacent to the touch-sensitive display module; wherein the bending portion The configuration position of the slot is set corresponding to the position of the functional element. The electronic product of claim 12, wherein the touch-sensitive display module further comprises a shielding layer disposed on a surface of the substrate to define a peripheral area of the touch-sensitive display module. The electronic product of claim 13, wherein the substrate is dislocated or opened through the shielding layer to configure an optical hole corresponding to the functional element.

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