TWI758221B - Disc leveling device and method for leveling disc - Google Patents
Disc leveling device and method for leveling disc Download PDFInfo
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Abstract
Description
本發明是有關於一種碟片整平技術,且特別是有關於一種兼具加熱與淬火整平功能之碟片整平技術及碟片整平方法。The present invention relates to a disc leveling technology, and more particularly, to a disc leveling technology and a disc leveling method with both heating and quenching leveling functions.
碟片的應用範圍廣,例如可作為剎車碟盤。碟片的強度與平整度均與碟片的品質有關,當碟片因加工因素而造成其強度或平整度不佳時,則會導致碟片的安裝性不佳,進而增加其成本、維修成本、製程難度或與其他零件的配合性。Discs have a wide range of applications, for example as brake discs. The strength and flatness of the disc are related to the quality of the disc. When the disc is not strong or flat due to processing factors, it will lead to poor installation of the disc, thereby increasing its cost and maintenance cost. , process difficulty or compatibility with other parts.
因此,本發明之實施例之一目的是在於提供一種碟片整平裝置及碟片整平方法,其可同時進行碟片加熱及碟片模內淬火整平的工序,以達到兼顧碟片品質與製程效率之目的。Therefore, an object of an embodiment of the present invention is to provide a disc leveling device and a disc leveling method, which can perform the processes of disc heating and disc in-mold quenching and leveling at the same time, so as to achieve both disc quality and process efficiency.
根據本發明之實施例之上述目的,提出一種碟片整平裝置。碟片整平裝置適用以對一碟片進行壓合整平。碟片整平裝置包含第一模具、第二模具、致動器以及加熱器。第一模具具有複數個第一流道,其中第一流道配置以連接第一冷卻源。第二模具配置以與第一模具對應貼合,其中第二模具具有通孔及複數個第二流道,其中通孔貫穿第二模具,且第二流道不與通孔連通,其中第二流道配置以連接第二冷卻源。致動器設置在第一模具與第二模具下方,其中致動器連接碟片定位件,其中碟片定位件位於第二模具之通孔中,致動器配置以在第一模具與第二模具之分離狀態下,驅動碟片定位件升降。加熱器設置在第一模具與第二模具之一側,加熱器配置以在分離狀態下,移動至第一模具與第二模具之間對碟片進行加熱步驟。According to the above objective of the embodiments of the present invention, a disc leveling device is provided. The disc leveling device is suitable for pressing and leveling a disc. The disc leveling device includes a first mold, a second mold, an actuator, and a heater. The first mold has a plurality of first runners, wherein the first runners are configured to connect to the first cooling source. The second mold is configured to correspond to the first mold, wherein the second mold has through holes and a plurality of second flow channels, wherein the through holes pass through the second mold, and the second flow channels are not communicated with the through holes, wherein the second The runner is configured to connect to the second cooling source. The actuator is arranged under the first mold and the second mold, wherein the actuator is connected to the disc positioning member, wherein the disc positioning member is located in the through hole of the second mold, and the actuator is configured to be between the first mold and the second mold. When the mold is separated, drive the disc positioning member to lift. The heater is provided on one side of the first mold and the second mold, and the heater is configured to move between the first mold and the second mold to perform the heating step of the disc in a separated state.
依據本發明之一實施例,上述之碟片定位件為穿設在通孔之軸桿,且軸桿的頂部具有凸出結構,凸出結構配置以供碟片套設定位。According to an embodiment of the present invention, the above-mentioned disc positioning member is a shaft passing through the through hole, and the top of the shaft has a protruding structure, and the protruding structure is configured for setting the position of the disc sleeve.
依據本發明之一實施例,上述之第一流道包含複數個第一循環管、第一入水管以及第一出水管。第一循環管沿著一方向排列設置。第一入水管平行於上述之方向設置,且連通每一個第一循環管之一端。第一出水管平行於上述之方向設置,且連通每一個第一循環管之另一端。According to an embodiment of the present invention, the above-mentioned first flow channel includes a plurality of first circulation pipes, a first water inlet pipe and a first water outlet pipe. The first circulation pipes are arranged along one direction. The first water inlet pipes are arranged parallel to the above-mentioned directions and communicate with one end of each of the first circulation pipes. The first water outlet pipes are arranged parallel to the above-mentioned directions, and communicate with the other end of each of the first circulation pipes.
依據本發明之一實施例,上述之第二流道包含複數個第二循環管、第二入水管、第二出水管以及複數個導流管。第二循環管沿著一方向排列設置。第二入水管平行於上述之方向設置,且連通每一個第二循環管之一端。第二出水管平行於上述之方向設置,且連通每一個第二循環管之另一端。導流管環繞通孔設置,且每一個導流管之一端連接第二入水管,另一端連接第二出水管。According to an embodiment of the present invention, the above-mentioned second flow channel includes a plurality of second circulation pipes, a second water inlet pipe, a second water outlet pipe, and a plurality of guide pipes. The second circulation pipes are arranged along one direction. The second water inlet pipes are arranged parallel to the above-mentioned direction, and communicate with one end of each of the second circulation pipes. The second water outlet pipes are arranged parallel to the above-mentioned directions, and communicate with the other end of each of the second circulation pipes. The guide pipes are arranged around the through holes, and one end of each guide pipe is connected to the second water inlet pipe, and the other end is connected to the second water outlet pipe.
依據本發明之一實施例,上述之加熱器為感應加熱器,且加熱器連接壓缸,壓缸配置以驅動加熱器移動至第一模具與第二模具之間。According to an embodiment of the present invention, the above-mentioned heater is an induction heater, and the heater is connected to a pressure cylinder, and the pressure cylinder is configured to drive the heater to move between the first mold and the second mold.
依據本發明之一實施例,上述之感應加熱器包含半圓環加熱殼體,半圓環加熱殼體具有加熱空間,加熱空間配置以容納碟片之一部分。致動器更配置以驅動碟片在加熱空間旋轉。According to an embodiment of the present invention, the above-mentioned induction heater includes a semi-circular heating casing, the semi-circular heating casing has a heating space, and the heating space is configured to accommodate a portion of the disc. The actuator is further configured to drive the disc to rotate in the heated space.
根據本發明之實施例之上述目的,提出一種碟片整平方法。碟片整平方法包含以下步驟。首先,提供上述之碟片整平裝置。在分離狀態下,安裝碟片在碟片定位件上。利用加熱器對碟片進行加熱步驟。利用致動器將碟片移動至第二模具上。利用第一模具與第二模具對碟片進行壓合整平步驟。利用第一冷卻源與第二冷卻源分別提供第一冷卻流體及第二冷卻流體至第一流道與第二流道中,以對碟片進行淬火處理。According to the above objective of the embodiments of the present invention, a disc leveling method is provided. The disc leveling method consists of the following steps. First, the above-mentioned disc leveling device is provided. In the separated state, the disc is installed on the disc positioning member. The heating step is performed on the disc using a heater. An actuator is used to move the disc onto the second mold. The disc is pressed and leveled by using the first mold and the second mold. The first cooling fluid and the second cooling fluid are respectively supplied to the first flow channel and the second flow channel by the first cooling source and the second cooling source, so as to quench the disc.
依據本發明之一實施例,上述之加熱器為感應加熱器,且包含半圓環加熱殼體,半圓環加熱殼體具有加熱空間,加熱空間配置以容納碟片之一部分,其中進行加熱步驟包含利用致動器驅動碟片在加熱空間旋轉。According to an embodiment of the present invention, the above-mentioned heater is an induction heater, and includes a semi-circular heating casing, the semi-circular heating casing has a heating space, and the heating space is configured to accommodate a portion of the disc, wherein the heating step is performed. Including the use of an actuator to drive the disc to rotate in the heated space.
依據本發明之一實施例,上述之利用加熱器對碟片進行加熱步驟之前,包含利用壓缸驅動加熱器移動至第一模具與第二模具之間。According to an embodiment of the present invention, before the step of using the heater to heat the disc, the step of using a pressure cylinder to drive the heater to move between the first mold and the second mold is included.
依據本發明之一實施例,上述之碟片定位件為穿設在通孔之軸桿,且軸桿的頂部具有凸出結構,其中安裝碟片在碟片定位件上包含將碟片套設在凸出結構上。According to an embodiment of the present invention, the above-mentioned disc positioning member is a shaft passing through the through hole, and the top of the shaft has a protruding structure, wherein installing the disc on the disc positioning member includes placing the disc on the disc positioning member. on the protruding structure.
由上述可知,本發明之碟片整平裝置主要可同時提供碟片加熱與碟片整平的功能,將碟片加熱至沃斯田鐵化之後,再利用模具壓合的方式來進行碟片模內淬火整平之工序,達到提升碟片品質性能之目的。另一方面,模具本身的冷卻流道設計搭配冷卻源控制冷卻流體的流速與流量,可以因應不同的熱處理條件需求來調整,使得碟片在淬火時能夠控制碟片的鋼材組織及所需硬度,故能達到提升品質、加速產能、簡化製程與品質監控等多重目的。As can be seen from the above, the disc leveling device of the present invention can mainly provide the functions of disc heating and disc leveling at the same time. The process of in-mold quenching and leveling can achieve the purpose of improving the quality and performance of the disc. On the other hand, the cooling channel design of the mold itself is matched with the cooling source to control the flow rate and flow of the cooling fluid, which can be adjusted according to different heat treatment conditions, so that the disc can control the steel structure and required hardness of the disc during quenching. Therefore, it can achieve multiple purposes such as improving quality, accelerating production capacity, simplifying manufacturing process and quality control.
請同時參照圖1及圖2,其中圖1係繪示依照本發明之一實施方式之一種碟片整平裝置之裝置示意圖,圖2係繪示依照本發明之一實施方式之一種碟片整平裝置之制動器驅動碟片定位件下降之示意圖。本實施方式之碟片整平裝置100適用以對一碟片W1進行淬火壓合整平。如圖1及圖2所示,碟片整平裝置100主要包含第一模具110、第二模具120、致動器130以及加熱器140。其中第一模具110與第二模具120可受到一驅動裝置(例如壓缸)驅動而相對移動並互相貼合,藉以承載並夾合碟片W1,以對碟片W1進行壓合動作。其中,第一模具110具有複數個第一流道111,第二模具120具有複數個第二流道122。第一流道111與第二流道122主要是用來供冷卻流體流過,以使第一模具110及第二模具120在壓合碟片W1時,能夠同時對碟片W1進行冷卻淬火的動作。致動器130設置在第一模具110與第二模具120下方,用以驅動碟片W1升降與旋轉。加熱器140可受到一壓缸(圖未示)驅動而移動至碟片W1旁以加熱碟片W1,待碟片W1加熱至預設溫度時,再退回至初始位置,以利第一模具110與第二模具120進行併合。Please refer to FIG. 1 and FIG. 2 at the same time, wherein FIG. 1 shows a schematic diagram of a disc leveling device according to an embodiment of the present invention, and FIG. 2 shows a disc leveling device according to an embodiment of the present invention. Schematic diagram of the brake of the flat device driving the disc positioning member down. The
具體而言,如圖1及圖2所示,第一模具110具有複數個第一流道111,其中第一流道111配置以連接第一冷卻源(例如冷卻流體供應器)。第二模具120配置以與第一模具110對應貼合。第二模具120具有通孔121及複數個第二流道122,其中通孔121是從第二模具120的頂面貫穿至第二模具120的底面,且第二流道122不與通孔121連通。其中第二流道122配置以連接第二冷卻源(例如冷卻流體供應器)。致動器130設置在第一模具110與第二模具120下方,其中致動器130連接碟片定位件131,且碟片定位件131位於第二模具120之通孔121中,致動器130配置以在第一模具110與第二模具120之分離狀態(未併合狀態)下,驅動碟片定位件131升降與旋轉。在一實施例中 ,如圖2所示,碟片定位件131為穿設在第二模具120之通孔121的軸桿,且軸桿的頂部具有凸出結構131a,凸出結構131a配置以供碟片W1套設定位。也就是說,碟片定位件131頂部之凸出結構131a的設計,是可供碟片W1的內環緣套設在凸出結構131a,達到限位碟片W1之目的。藉此,透過致動器130可驅動碟片定位件131帶動碟片W1升降與旋轉。Specifically, as shown in FIGS. 1 and 2 , the
請繼續參照圖1及圖2,加熱器140設置在第一模具110與第二模具120之一側。加熱器140配置以在第一模具110與第二模具120之分離狀態下,移動至第一模具110與第二模具120之間,以對碟片W1進行加熱步驟。在一實施例中,加熱器140可連接一壓缸(圖未示),例如氣壓缸或油壓缸。壓缸配置以驅動加熱器140移動至第一模具110與第二模具120之間。如圖1所示,在一實施例中,加熱器140為感應加熱器,其包含半圓環加熱殼體141,半圓環加熱殼體141具有加熱空間141a,加熱空間141a配置以容納碟片W1之一部分。具體而言,半圓環加熱殼體141的尺寸係與碟片W1尺寸對應,且半圓環加熱殼體141可包覆碟片W1的一部分,故當致動器130驅動碟片W1旋轉時,可讓碟片W1的每一部分都能經過半圓環加熱殼體141的加熱空間141a而被均勻加熱。具體而言,在第一模具110與第二模具120之分離狀態下,且加熱器140尚未移動至第一模具110與第二模具之間時,致動器130可先驅動碟片定位件131伸出至第二模具120上方以供碟片W1安裝於其上,在碟片W1定位至碟片定位件131上之後,再控制壓缸驅動加熱器140移動至第一模具110與第二模具之間,並使半圓環加熱殼體141包覆碟片W1的部分開始進行加熱動作,而當致動器130驅動碟片定位件131旋轉時,碟片W1的整體則可均勻地被加熱。在碟片W1加熱至900℃以上沃斯田鐵化後,壓缸可控制加熱器140退回至第一模具110與第二模具旁,以利致動器130驅動碟片W1下降,使得第一模具110與第二模具120可進一步對加熱後的碟片W1進行壓合整平動作。Please continue to refer to FIG. 1 and FIG. 2 , the
在第一模具110與第二模具120對加熱後的碟片W1進行壓合整平動作的同時,冷卻流體可分別在第一模具110的第一流道111與第二模具120的第二流道122內循環,以使第一模具110與第二模具120同時對碟片W1進行淬火步驟。在一實施例中,第一模具110的第一流道111與第二模具120的第二流道122為各自獨立的冷卻循環流道。另請一併參照圖3,圖3係繪示依照本發明之一實施方式之一種第一模具之剖面示意圖。如圖3所示,第一流道111包含複數個第一循環管111a、第一入水管111b以及第一出水管111c。在一實施例中,第一循環管111a、第一入水管111b以及第一出水管111c設置在第一模具110的內部。其中,第一循環管111a沿著方向D1排列設置,第一入水管111b與第一出水管111c平行於方向D1設置,且第一入水管111b連通每一個第一循環管111a之一端。第一出水管111c連通每一個第一循環管111a之另一端。藉此,冷卻流體可從第一入水管111b進入第一模具110的內部,流經每一個第一循環管111a後,再從第一出水管111c流出,達到冷卻循環的目的。在第一模具110的流道設計上,可在第一模具110的其中一側面設置貫穿第一模具110內部之數個橫向流道(也就是第一循環管111a)至另一側面,並設置兩個縱向流道(也就是第一入水管111b與第一出水管111c)連通橫向流道後,再利用盲栓封閉第一循環管111a之位於第一模具110之側面上的開孔,使得第一循環管111a、第一入水管111b以及第一出水管111c共同形成循環管道。While the
另請參照圖4及圖5,圖4係繪示依照本發明之一實施方式之一種第二模具之裝置示意圖, 圖5係繪示依照本發明之一實施方式之一種第一模具與第二模具之結構示意圖。如圖4所示,第二流道122包含複數個第二循環管122a、第二入水管122b、第二出水管122c以及複數個導流管122d。第二循環管122a沿著方向D2排列設置。第二入水管122b與第二出水管122c平行於方向D2設置,且第二入水管122b連通每一個第二循環管122a之一端,第二出水管122c連通每一個第二循環管122a之另一端。導流管122d環繞通孔121設置,且每一個導流管122d連通部分之第二循環管122a。在一例子中,導流管122d之一端連通至第二入水管122b,另一端連通至第二出水管122c。Please also refer to FIGS. 4 and 5 , FIG. 4 is a schematic diagram illustrating a device of a second mold according to an embodiment of the present invention, and FIG. 5 is a first mold and a second mold according to an embodiment of the present invention. Schematic diagram of the structure of the mold. As shown in FIG. 4 , the
請同時參照圖4至圖7,其中圖6係繪示沿著圖5之A-A剖線剖切之剖面示意圖,圖7係繪示沿著圖5之B-B剖線剖切之剖面示意圖。如圖4所示,導流管122d主要可由類V型流道與數個直立流道組成。類V型流道與第二循環管122a、第二入水管122b、第二出水管122c設置在不同水平面,直立流道連通部分之第二循環管122a與類V型流道。藉此,第二冷卻源所提供的冷卻流體可從第二入水管122b進入第二模具120中,流經第二循環管122a與導流管122d後,而從第二出水管122c流出。Please refer to FIGS. 4 to 7 at the same time, wherein FIG. 6 is a schematic cross-sectional view taken along the line A-A of FIG. 5 , and FIG. 7 is a cross-sectional view taken along the line B-B of FIG. 5 . As shown in FIG. 4 , the
在第二模具120的流道設計上,可在第二模具120的其中一側面設置貫穿模具本體之數個橫向流道(也就是第二循環管122a)至另一側面,並設置兩個縱向流道(也就是第二入水管122b與第二出水管122c)連通橫向流道後,然後再利用盲栓封閉第二循環管122之位於第二模具120之側面上的開孔,使得第二循環管122a、第二入水管122b與第二出水管122c共同形成循環管道。另一方面,如圖6所示,靠近第二模具120之通孔121相對二側的第二循環管122a是從第二模具120的側面穿入第二模具120中,而未連通至通孔121。又如圖4及圖7所示,導流管122d的類V型流道是從第二模具120的另外二側面斜向穿入第二模具120中所形成,且其開口同樣可用盲栓封閉。如圖4及圖5所示,導流管122d的直立流道則是從第二模具120的底部穿入第二模具120中而連通至靠近第二模具120之通孔121相對二側的第二循環管122a及類V型流道,且其開口係由盲栓封閉。藉由此設計,第二循環管122a、第二入水管122b、導流管122d及第二出水管122c可共同形成循環管道。具體而言,其中一部分的冷卻流體是直接從第二入水管122b流入第二循環管122a中,而從第二出水管122c流出;而另一部分的冷卻流體,如圖4所示,是從第二入水管122b流入與導流管122d連通之第二循環管122a中,而從導流管122d的直立流道往上流動進入類V型流道後,再進入靠近第二出水管122c之直立流道,而向下流動至靠近第二出水管122c之第二循環管122a,再由第二出水管122c流出。藉此,透過將第一模具110的第一流道111與第二模具120的第二流道122的流道設計與配置方式,並分別控制第一冷卻源與第二冷卻源提供冷卻流體之流速與流量的方式,可以確保碟片W能夠均勻冷卻,提升模內淬火之成效。In terms of the flow channel design of the
另請同時參照圖1及圖8,其中圖8係繪示依照本發明之一實施方式之一種碟片整平方法之流程示意圖。本發明另提供一種碟片整平方法200,此方法包含以下步驟。首先,進行步驟210,提供如圖1所示之碟片整平裝置100。接著,進行步驟220,安裝碟片W1在碟片定位件131的凸出結構131a上。然後,進行步驟230,利用壓缸驅動加熱器140移動至第一模具110與第二模具120之間,以對碟片W1進行加熱步驟。在加熱步驟中,可透過致動器130驅動碟片定位件131旋轉,使得碟片W1的每一部分都可旋轉經過半圓環加熱殼體141的加熱空間141a,而可均勻地被加熱。在步驟230後,接著進行步驟240,利用壓缸驅動加熱器140復歸至其初始位置,且致動器130可同時控制碟片定位件131復歸,以將碟片W1移動至第二模具120上。然後,進行步驟250,利用第一模具110與第二模具120對碟片W1進行壓合整平步驟。在步驟250中,可同時進行步驟260,分別提供第一冷卻流體及第二冷卻流體至第一模具110的第一流道111與第二模具120之第二流道122中,以對碟片W1進行淬火處理。Please also refer to FIG. 1 and FIG. 8 at the same time, wherein FIG. 8 is a schematic flowchart illustrating a method for leveling a disc according to an embodiment of the present invention. The present invention further provides a
由上述本發明實施方式可知,本發明之碟片整平裝置主要可同時提供碟片加熱與碟片整平的功能,將碟片加熱至沃斯田鐵化之後,再利用模具壓合的方式來進行碟片模內淬火整平之工序,達到提升碟片品質性能之目的。另一方面,模具本身的冷卻流道設計搭配冷卻源控制冷卻流體的流速與流量,可以因應不同的熱處理條件需求來調整,使得碟片在淬火時能夠控制碟片的鋼材組織及所需硬度,故能達到提升品質、加速產能、簡化製程與品質監控等多重目的。It can be seen from the above embodiments of the present invention that the disc leveling device of the present invention can mainly provide the functions of disc heating and disc leveling at the same time. To carry out the process of quenching and leveling in the disc mold to achieve the purpose of improving the quality and performance of the disc. On the other hand, the cooling channel design of the mold itself is matched with the cooling source to control the flow rate and flow of the cooling fluid, which can be adjusted according to different heat treatment conditions, so that the disc can control the steel structure and required hardness of the disc during quenching. Therefore, it can achieve multiple purposes such as improving quality, accelerating production capacity, simplifying manufacturing process and quality control.
雖然本發明之實施例已以實施例揭露如上,然其並非用以限定本發明之實施例,任何所屬技術領域中具有通常知識者,在不脫離本發明之實施例的精神和範圍內,當可作些許的更動與潤飾,故本發明之實施例的保護範圍當視後附的申請專利範圍所界定者為準。Although the embodiments of the present invention have been disclosed above with examples, they are not intended to limit the embodiments of the present invention. Anyone with ordinary knowledge in the technical field, without departing from the spirit and scope of the embodiments of the present invention, should Slight changes and modifications can be made, so the protection scope of the embodiments of the present invention should be determined by the scope of the appended patent application.
100:碟片整平裝置
110:第一模具
111:第一流道
111a:第一循環管
111b:第一入水管
111c:第一出水管
120:第二模具
121:通孔
122:第二流道
122a:第二循環管
122b:第二入水管
122c:第二出水管
122d:導流管
130:致動器
131:碟片定位件
131a:凸出結構
140:加熱器
141:半圓環加熱殼體
141a:加熱空間
200:碟片整平方法
210:步驟
220:步驟
230:步驟
240:步驟
250:步驟
260:步驟
D1:方向
D2:方向
W1:碟片100: Disc leveling device
110: The first mold
111:
為了更完整了解實施例及其優點,現參照結合所附圖式所做之下列描述,其中: 圖1係繪示依照本發明之一實施方式之一種碟片整平裝置之裝置示意圖; 圖2係繪示依照本發明之一實施方式之一種碟片整平裝置之制動器驅動碟片定位件下降之示意圖; 圖3係繪示依照本發明之一實施方式之一種第一模具之剖面示意圖; 圖4係繪示依照本發明之一實施方式之一種第二模具之裝置示意圖; 圖5係繪示依照本發明之一實施方式之一種第一模具與第二模具之結構示意圖; 圖6係繪示沿著圖5之A-A剖線剖切之剖面示意圖; 圖7係繪示沿著圖5之B-B剖線剖切之剖面示意圖;以及 圖8係繪示依照本發明之一實施方式之一種碟片整平方法之流程示意圖。 For a more complete understanding of embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, wherein: FIG. 1 is a schematic diagram of a disc leveling device according to an embodiment of the present invention; FIG. 2 is a schematic diagram illustrating the descending of the brake-driven disc positioning member of a disc leveling device according to an embodiment of the present invention; 3 is a schematic cross-sectional view of a first mold according to an embodiment of the present invention; 4 is a schematic diagram illustrating a device of a second mold according to an embodiment of the present invention; FIG. 5 is a schematic structural diagram of a first mold and a second mold according to an embodiment of the present invention; 6 is a schematic cross-sectional view taken along the line A-A of FIG. 5; FIG. 7 is a schematic cross-sectional view taken along the line B-B of FIG. 5; and FIG. 8 is a schematic flowchart illustrating a method for leveling a disc according to an embodiment of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without
100:碟片整平裝置 100: Disc leveling device
110:第一模具 110: The first mold
111:第一流道 111: First runner
111a:第一循環管 111a: first circulation pipe
111b:第一入水管 111b: The first water inlet pipe
111c:第一出水管 111c: The first outlet pipe
120:第二模具 120: Second mold
121:通孔 121: Through hole
122:第二流道 122: Second runner
130:致動器 130: Actuator
131:碟片定位件 131: Disc positioning piece
131a:凸出結構 131a: Protruding structure
140:加熱器 140: Heater
141:半圓環加熱殼體 141: Half ring heating shell
141a:加熱空間 141a: Heating space
W1:碟片 W1: Disc
Claims (10)
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TW110129674A TWI758221B (en) | 2021-08-11 | 2021-08-11 | Disc leveling device and method for leveling disc |
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TW110129674A TWI758221B (en) | 2021-08-11 | 2021-08-11 | Disc leveling device and method for leveling disc |
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TW202307222A TW202307222A (en) | 2023-02-16 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014123229A1 (en) * | 2013-02-08 | 2014-08-14 | 新日鐵住金ステンレス株式会社 | Stainless steel brake disc and method for manufacturing same |
CN107900612A (en) * | 2017-11-02 | 2018-04-13 | 江苏巨能机械有限公司 | The processing technology of large-scale two phase stainless steel rotary drum disk |
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Patent Citations (3)
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WO2014123229A1 (en) * | 2013-02-08 | 2014-08-14 | 新日鐵住金ステンレス株式会社 | Stainless steel brake disc and method for manufacturing same |
US20150101898A1 (en) * | 2013-02-08 | 2015-04-16 | Nippon Steel & Sumikin Stainless Steel Corporation | Stainless steel brake disc and method for production thereof |
CN107900612A (en) * | 2017-11-02 | 2018-04-13 | 江苏巨能机械有限公司 | The processing technology of large-scale two phase stainless steel rotary drum disk |
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