TWI758220B - Automatic replenishment control method of trace electroplating additives - Google Patents

Abstract

The invention discloses an automatic replenishment control method of trace electroplating additives, which includes: S1: in the initial state, the first conduction valve and the second conduction valve are both closed; S2: when the electroplating control equipment starts the electroplating work, the electroplating control equipment sends The signal is sent to the controller. After receiving the signal, the controller controls the propulsion mechanism to push the rear end of the syringe forward. At this time, the first conduction valve is turned on and the second conduction valve is closed; the electroplating additive in the syringe can enter through the first pipeline In the electroplating tank, add liquid to the electroplating tank; S3: When the liquid is added, the controller controls the advancing mechanism to drive the rear end of the syringe to move backward. At this time, a negative pressure is formed in the syringe, so that the first conduction valve is closed, and the second The pilot valve is turned on; the syringe can suck new electroplating additives from the replenishing tank through the second pipeline to replenish the syringe; S4: repeat steps S2-S3, and proceed in a loop. The invention can improve the accuracy of adding electroplating additives.

Description

Automatic replenishment control method of trace electroplating additives

The invention relates to the technical field of semiconductor production, in particular to an automatic replenishment control method of trace electroplating additives.

Carrier Tape refers to a tape-like product used in the field of electronic packaging. It has a specific thickness and is equidistantly distributed along its length with holes for holding electronic components and for indexing positioning. positioning hole.

The full name of COF (chip on film) is chip on film. The display driver chip is directly mounted on the flexible circuit board without any packaging to achieve the purpose of reducing the volume and being able to bend freely. COF flexible packaging carrier tape is a flexible circuit board that connects semiconductor display chips and terminal products, and is a key material in COF packaging; COF packaging display driver chips are currently mainly used in TVs, computers, mobile phones and other products. Display screen applications are LCD / One of the key core chips of OLED display.

In the manufacturing process of COF, the required circuit copper layer needs to be plated on the surface of the substrate. During electroplating, a small amount of electroplating additives need to be added to the electroplating solution. The electroplating additives added each time are generally between 0.01ml-0.1ml. In the prior art, the method of manual addition is mostly adopted, but the error generated by the method of manual addition is relatively large, which will affect the effect of subsequent electroplating, resulting in differences between products.

The technical problem to be solved by the present invention is: in order to solve the technical problem that the addition of electroplating additives cannot be accurately controlled in the prior art, the present invention provides an automatic replenishment control method of trace electroplating additives, which accurately controls the amount of electroplating additives added by the injection mechanism through a controller, It can avoid human errors, improve work efficiency, and improve the accuracy of adding electroplating additives. In addition, a set of injection mechanisms can be used to control the amount of liquid addition and liquid replenishment at the same time, and the liquid addition and liquid replenishment can be automatically looped.

The technical solution adopted by the present invention to solve the technical problem is as follows: an automatic replenishment control method of trace electroplating additives, which adopts an automatic replenishment device for trace electroplating solution, and the device includes an electroplating tank for carrying the electroplating solution, and the electroplating tank is connected with the electroplating control method. Equipment connection; liquid replenishment tank for carrying electroplating additives; injection mechanism, the electroplating tank is communicated with the front end of the injection mechanism through the first pipeline, and the liquid replenishment tank is connected with the front end of the injection mechanism through the second pipeline The injection mechanism includes a syringe and a Y-shaped tube, the first end of the Y-shaped tube is communicated with the front end of the syringe, and the second end of the Y-shaped tube is communicated with the first pipeline, so The third end of the Y-shaped pipe is communicated with the second pipeline, the first pipeline is provided with a first conducting valve, and the second pipeline is provided with a second conducting valve; a propulsion mechanism, the propulsion mechanism The back end of the injection mechanism can be pushed to reciprocate. When the push mechanism pushes the back end of the injection mechanism to move forward, the injection mechanism can add liquid to the electroplating tank. When the push mechanism drives the back end of the injection mechanism to move backward, The injection mechanism can stop adding liquid to the electroplating tank, and at the same time make the liquid replenishment tank add liquid to the injection mechanism; the controller, the electroplating control device and the propulsion mechanism are all signal-connected to the controller.

The automatic replenishment control method of trace electroplating additives has the following steps: S1: In the initial state, the syringe, the Y-tube, the first conduction valve, the first pipeline, the second conduction valve and the second pipeline are all filled with electroplating additives, and the first conduction valve and the second conduction valve are both closed ; S2: When the electroplating control device starts electroplating work, the electroplating control device sends a signal to the controller, and the controller controls the propulsion mechanism to push the rear end of the syringe to move forward after receiving the signal. At this time, since the pressure at the rear end of the first conduction valve is greater than The pressure at the front end of the first conduction valve makes the first conduction valve conduct. Since the pressure at the rear end of the second conduction valve is greater than the pressure at the front end of the second conduction valve, the second conduction valve is closed; the electroplating additives in the syringe can pass through the first pipeline. Enter the electroplating tank and add liquid to the electroplating tank; S3: When the liquid addition is completed, the controller controls the propulsion mechanism to drive the rear end of the syringe to move backward. At this time, a negative pressure is formed in the syringe, so that the pressure at the rear end of the first conduction valve is lower than the pressure at the front end of the first conduction valve. The conducting valve is closed, so that the pressure at the rear end of the second conducting valve is less than the pressure at the front end of the second conducting valve, and the second conducting valve is conducting; the syringe can absorb new electroplating additives from the replenishment tank through the second pipeline to replenish the syringe; S4: Steps S2-S3 are repeated, and the loop is performed.

The automatic replenishment control method of trace electroplating additives of the present invention controls the forward movement of the propulsion mechanism through the controller, thereby driving the rear end of the injection mechanism to move forward, and the injection mechanism can add liquid into the electroplating tank; when the liquid addition is completed, the propulsion mechanism The rear end of the injection mechanism automatically moves backwards, so that the rear end of the injection mechanism also moves backwards. The injection mechanism can absorb new electroplating additives from the liquid replenishment tank, realize automatic liquid addition and automatic liquid replenishment, and can accurately control the injection mechanism. The amount of electroplating solution added, Avoid mistakes in operation and improve the precision of product electroplating. The first conduction valve can control the conduction or closing of the first pipeline, and the second conduction valve can control the conduction or closing of the second pipeline. When the syringe adds electroplating additives to the electroplating tank, the first conduction valve is turned on, and the second conduction valve is turned on. The valve is closed. When the syringe absorbs new electroplating additives from the replenishment tank, the first conduction valve is closed and the second conduction valve is opened, so that the addition and replenishment will not interfere with each other, which further improves the accuracy of adding electroplating additives. .

Further, the method also includes: setting the need to add a total of Xml of electroplating additives to the electroplating tank, adding Yml in every t minutes, the number of additions is n=X/Y, and the controller controls the injector to add to the electroplating tank first. Add Yml of electroplating additives, and then the controller controls the syringe to absorb Yml of electroplating additives from the refill tank, and loops for n times of adding and refilling operations until Xml of electroplating additives are added to the electroplating tank.

Further, the liquid addition speed that the controller sets the syringe to be V1 and the liquid infusion speed to the syringe is V2, and the speed V1 is greater than the speed V2, and the time occupied by the liquid addition operation in t minutes is t/4, and the liquid infusion rate is t/4. The time occupied by the operation is t/6. For example, if 1.1ml of electroplating additive needs to be added per minute, set the liquid addition rate V1 to 2.75ml/min and the liquid replenishment rate V2 to 1.83ml/min.

Further, the first conduction valve includes a first housing, and the first housing is provided with a first filter screen, a first spring and a first gasket, and the first filter screen is close to the front end of the first housing , the first gasket is close to the rear end of the first shell, the first filter is fixedly connected to the inner wall of the first shell, and one end of the first spring is fixedly connected to the first filter , the other end of the first spring is fixedly connected to the first gasket, the rear end of the first casing is provided with a first through hole, and the first through hole is connected to the Y through the first pipeline. The second end of the molding tube is connected, the front end of the first shell is provided with a second through hole, the second through hole is communicated with the electroplating tank through the first pipeline, and the first spring is in the first The filter screen and the first gasket are in a compressed state, so that the first gasket abuts on the first through hole, and the first through hole is sealed at this time; the second conduction valve includes a second housing, the A second filter screen, a second spring and a second gasket are arranged in the second shell, the second gasket is close to the front end of the second shell, and the second filter screen is close to the rear end of the second shell , the second filter is fixedly connected to the inner wall of the second housing, one end of the second spring is fixedly connected to the second filter, and the other end of the second spring is connected to the second gasket Fixed connection, the rear end of the second shell is provided with a third through hole, the third through hole communicates with the third end of the Y-shaped pipe through the second pipeline, and the front end of the second shell A fourth through hole is opened, the fourth through hole is communicated with the liquid replenishing tank through the second pipeline, and the second spring is in a compressed state between the second filter screen and the second gasket, so that the first through hole is in a compressed state. The two gaskets abut on the fourth through hole, and the fourth through hole is sealed at this time.

When the rear end of the syringe moves forward, the pressure at the rear end of the first conducting valve is greater than the pressure at the front end of the first conducting valve, so that the first gasket is separated from the first through hole, the first conducting valve is turned on, and at the same time, the second conducting valve is turned on. The pressure at the rear end of the conduction valve is also greater than the pressure at the front end of the second conduction valve, so that the second gasket and the fourth through hole are more closely fitted, and the second conduction valve is closed. The pipeline passes smoothly into the electroplating tank; when the rear end of the syringe moves backward, a negative pressure is formed in the syringe, so that the pressure at the rear end of the first conduction valve is lower than the pressure at the front end of the first conduction valve, so that the first gasket and the first The through hole is tightly fitted, the first conduction valve is closed, and at the same time, the pressure at the rear end of the second conduction valve is also smaller than the pressure at the front end of the second conduction valve, so that the second gasket is separated from the fourth through hole, and the second conduction valve is turned on. At the same time, the electroplating additives in the liquid replenishment tank can smoothly pass through the second pipeline and enter the syringe.

Further, the syringe includes a syringe, a plunger rod and a plunger, the plunger is fixedly connected with the front end of the plunger rod, and the plunger is installed in the syringe so that the inside of the syringe A rodless cavity and a rod cavity are formed, the part of the plunger rod is located in the rod cavity, the rear end of the plunger rod is located outside the barrel, and the front end of the rodless cavity is connected to the Y The first end of the mold tube is connected, and the rodless cavity is used for containing the electroplating additive. When the plunger rod moves forward, the pressure in the rodless cavity increases, so that the first conduction valve is turned on and the second conduction valve is closed to realize the liquid adding operation; when the plunger rod moves backward, a negative pressure is formed in the rodless cavity. pressure, so that the first conduction valve is closed, and the second conduction valve is turned on to realize the liquid replenishment operation.

Further, the propulsion mechanism includes a propulsion plate and a lead screw stepping motor, the propulsion plate is connected with the lead screw of the lead screw stepping motor, and the lead screw stepping motor is signally connected with the controller, so The upper end surface of the push plate is provided with a clamping groove, and the rear part of the plunger rod is installed on the clamping groove. The lead screw stepping motor can do linear reciprocating motion. When the controller sends a signal to the lead screw stepping motor, the lead screw stepping motor can drive the propulsion plate to do linear reciprocating motion, and the propulsion plate then drives the plunger rod to do linear reciprocating motion. , to achieve liquid addition and rehydration operations.

Further, it also includes a fixing mechanism, the fixing mechanism is located below the syringe, the fixing mechanism includes a first fixing seat, a second fixing seat and a third fixing seat, the first fixing seat and the second fixing seat The fixing base is detachably connected, the second fixing base is detachably connected to the third fixing base, and the middle part of the needle cylinder is erected on the first fixing base, the second fixing base or the third fixing base. The quick-release fixing mechanism can be applied to syringes of different sizes, so that the syringes of different sizes and the propelling plate can always be kept in the same level position to ensure the accuracy of the addition of electroplating additives.

Further, in order to facilitate installation and disassembly, the first fixing seat is provided with a first accommodating groove, the bottom of the first accommodating groove is provided with a first installation hole, and the bottom surface of the first fixing seat is provided with a first installation column ; a second accommodating slot is arranged on the second fixing seat, a second mounting hole is arranged at the bottom of the second accommodating slot, and a second mounting post is arranged on the bottom surface of the second fixing seat; the third fixing seat is There is a third accommodating groove, the bottom of the third accommodating groove is provided with a third mounting hole, and the bottom surface of the third fixing base is provided with a third mounting post; when the first fixing base is connected with the second fixing base When the first mounting post is located in the second mounting hole, and the first fixing seat is located in the second accommodating groove; when the second fixing seat is connected with the third fixing seat, The second mounting post is located in the third mounting hole, and the second fixing seat is located in the third accommodating groove.

Further, in order to install the first fixing seat, the second fixing seat and the third fixing seat more firmly, the width of the first fixing seat is W1, the length of the first fixing seat is H1, and the first fixing seat is H1. The width of the second fixing seat is W2, the length of the second fixing seat is H2, the width of the second accommodating groove is d2, the length of the second accommodating groove is L2, and the width of the third accommodating groove is d3, the length of the second accommodating groove is L3, the width W1 matches the width d2, the length H1 matches the length L3, and the width W2 matches the width d3, so The length H2 matches the length L3.

The beneficial effect of the present invention is that, in the automatic replenishment control method of trace electroplating additives of the present invention, the controller controls the forward movement of the propulsion mechanism, thereby driving the rear end of the injection mechanism to move forward, and the injection mechanism can add the electroplating additives into the electroplating tank; When the addition is completed, the rear end of the propulsion mechanism automatically moves backward, so that the rear end of the injection mechanism also moves backward, and the injection mechanism can absorb new electroplating additives from the liquid replenishment tank, realize automatic liquid addition and automatic liquid replenishment, and can accurately control the injection The amount of electroplating additives added by the mechanism can avoid mistakes in operation and improve the accuracy of product electroplating. It can also control the amount of liquid addition and liquid replenishment at the same time through a set of injection mechanisms, and can make liquid addition and liquid replenishment can be automatically looped. The first conduction valve can control the conduction or closing of the first pipeline, and the second conduction valve can control the conduction or closing of the second pipeline. When the syringe adds electroplating additives to the electroplating tank, the first conduction valve is turned on, and the second conduction valve is turned on. The valve is closed. When the syringe absorbs new electroplating additives from the replenishment tank, the first conduction valve is closed and the second conduction valve is opened, so that the addition and replenishment will not interfere with each other, which further improves the accuracy of adding electroplating additives. . The quick-release fixing mechanism can be applied to syringes of different diameters, and realize the injection of adding different amounts of electroplating additives. The invention has simple structure, convenient operation and can be used in a circle.

The present invention will now be described in further detail with reference to the drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientation or positional relationship indicated by "radial direction", "circumferential direction", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device or element. It must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, features delimited with "first", "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

In this embodiment, the direction in which the electroplating solution enters the electroplating tank is taken as the front. As shown in FIG. 1 to FIG. 11 , an automatic replenishment control method of trace electroplating additives includes: electroplating tank 11 for carrying electroplating solution, the electroplating tank 11 is connected to the electroplating control equipment; liquid replenishing tank 12 for carrying electroplating additives; injection; Mechanism 5, the electroplating tank 11 is communicated with the front end of the injection mechanism 5 through the first pipeline, the liquid replenishment tank 12 is communicated with the front end of the injection mechanism 5 through the second pipeline, and the injection mechanism 5 includes a syringe 51 and a Y-shaped tube 52, Y The first end 521 of the Y-shaped tube 52 is communicated with the front end of the syringe 51, the second end 522 of the Y-shaped tube 52 is communicated with the first pipeline, the third end 523 of the Y-shaped tube 52 is communicated with the second pipeline, and the first tube There is a first conducting valve 53 on the road, and a second conducting valve 54 on the second pipeline; the propulsion mechanism 3, the propulsion mechanism 3 can push the rear end of the injection mechanism 5 to reciprocate, when the propulsion mechanism 3 pushes the rear end of the injection mechanism 5 When moving forward, the injection mechanism 5 can add liquid to the electroplating tank 11, and when the propulsion mechanism 3 drives the rear end of the injection mechanism 5 to move backward, the injection mechanism 5 can stop adding liquid to the electroplating tank 11, and at the same time make the liquid replenishment. The tank 12 feeds the injection mechanism 5 ; the controller 2 , the electroplating control equipment and the propulsion mechanism 3 are all signally connected to the controller 2 .

The automatic replenishment control method of trace electroplating additives has the following steps: S1: In the initial state, the syringe 51, the Y-shaped tube 52, the first conduction valve 53, the first pipeline, the second conduction valve 54 and the second pipeline are all filled with electroplating additives, and the first conduction valve 53 and the second conduction The valves 54 are all closed. S2: When the electroplating control device starts the electroplating work, the electroplating control device sends a signal to the controller 2, and the controller 2 controls the propulsion mechanism 3 to push the rear end of the syringe 51 to move forward after receiving the signal. At this time, due to the first conduction valve The pressure at the rear end of 53 is greater than the pressure at the front end of the first conduction valve 53, so that the first conduction valve 53 is turned on. Since the pressure at the rear end of the second conduction valve 54 is greater than the pressure at the front end of the second conduction valve 54, the second conduction valve 54 is closed; the syringe The electroplating additives in 51 can enter the electroplating tank 11 through the first pipeline, and add liquid to the electroplating tank 11 . S3: When the liquid addition is completed, the controller 2 controls the propulsion mechanism 3 to drive the rear end of the syringe 51 to move backward. At this time, a negative pressure is formed in the syringe 51, so that the pressure at the rear end of the first conducting valve 53 is smaller than that of the first conducting valve 53 The pressure at the front end, the first conduction valve 53 is closed, so that the pressure at the rear end of the second conduction valve 54 is less than the pressure at the front end of the second conduction valve 54, and the second conduction valve 54 is turned on; the syringe 51 can pass through the second pipeline. A new electroplating additive is drawn from the inside, and the syringe 51 is replenished with liquid; at this time, the inside of the syringe 51 is filled with the electroplating additive again. S4: Steps S2-S3 are repeated, and the loop is performed.

In this embodiment, it is set that a total of Xml of electroplating additives needs to be added to the electroplating tank 11, Yml is added every t minutes, and the number of additions is n=X/Y. The controller 2 controls the injector 51 to add Yml to the electroplating tank 11 first. Then the controller 2 controls the injector 51 to carry out the replenishment operation of absorbing Yml of the electroplating additive from the replenishment tank 12, and loops n times of liquid addition and replenishment operation, until a total of Xml electroplating additives are added to the electroplating tank 11. . The controller 2 sets the liquid addition speed of the syringe 51 as V1 and the liquid replenishment speed to the syringe 51 as V2, the speed V1 is greater than the speed V2, and the time occupied by the liquid addition operation in t minutes is t/4, and the liquid replenishment operation occupies t/4. The time is t/6. For example, if 1.1ml of electroplating additive needs to be added per minute, the liquid addition speed V1 can be set to 2.75ml/min, and the liquid replenishment speed V2 can be set to 1.83ml/min, but it is not limited to this, and the settings can be changed according to actual needs.

The first conduction valve 53 includes a first housing 531, and the first housing 531 is provided with a first filter 532, a first spring 533 and a first gasket 534. The first filter 532 is close to the front end of the first housing 531, and the first The gasket 534 is close to the rear end of the first housing 531, the first filter 532 is fixedly connected to the inner wall of the first housing 531, one end of the first spring 533 is fixedly connected to the first filter 532, and the other end of the first spring 533 is connected to the inner wall of the first housing 531. The first gasket 534 is fixedly connected, the rear end of the first shell 531 is provided with a first through hole 535, the first through hole 535 communicates with the second end 522 of the Y-shaped pipe 52 through a first pipeline, and the front end of the first shell 531 A second through hole 536 is opened, the second through hole 536 communicates with the electroplating tank 11 through the first pipeline, and the first spring 533 is in a compressed state between the first filter screen 532 and the first gasket 534, so that the first gasket The sheet 534 abuts on the first through hole 535, and the first through hole 535 is sealed at this time. The second conduction valve 54 includes a second housing 541 . The second housing 541 is provided with a second filter screen 542 , a second spring 543 and a second gasket 544 . The second gasket 544 is close to the front end of the second housing 541 , and the second The filter screen 542 is close to the rear end of the second shell 541, the second filter screen 542 is fixedly connected with the inner wall of the second shell 541, one end of the second spring 543 is fixedly connected with the second filter screen 542, and the other end of the second spring 543 is connected with The second gasket 544 is fixedly connected, the rear end of the second housing 541 is provided with a third through hole 545, and the third through hole 545 communicates with the third end 523 of the Y-shaped pipe 52 through the second pipeline. The front end is provided with a fourth through hole 546, the fourth through hole 546 communicates with the fluid replenishing tank 12 through the second pipeline, and the second spring 543 is in a compressed state between the second filter screen 542 and the second gasket 544, so that the second The gasket 544 abuts on the fourth through hole 546, and the fourth through hole 546 is sealed at this time. In this embodiment, the first filter screen 532 can filter impurities in the electroplating additive, so as to prevent the electrolyte solution entering the electroplating tank 11 from containing impurities. Because the electroplating additive is an acid or/and alkaline chemical substance, the first spring 533 is selected from a spring that can resist acid, and the first gasket 534 is selected from an acid-resistant gasket, so that the first spring 533 and the first gasket can be extended. life of sheet 534. The second filter screen 542 can filter the impurities in the electroplating additives to prevent the electrolyte solution entering the syringe 51 from containing impurities. Because the electroplating additive is an acid or/and alkaline chemical substance, the second spring 543 is selected from an acid-resistant spring, and the second gasket 544 is selected from an acid-resistant gasket, which can extend the length of the second spring 543 and the second gasket. life of sheet 544.

The syringe 51 includes a syringe 511, a plunger rod 512 and a plunger 515, the plunger 515 is fixedly connected to the front end of the plunger rod 512, and the plunger 515 is installed in the syringe 511, so that the inside of the syringe 511 forms a rodless cavity 513 and There is a rod cavity 514, the part of the plunger rod 512 is located in the rod cavity 514, the rear end of the plunger rod 512 is located outside the barrel 511, and the front end of the rodless cavity 513 is connected with the first end 521 of the Y-shaped tube 52, without Rod cavity 513 is used to contain plating additives.

The propulsion mechanism 3 includes a propulsion plate 31 and a lead screw stepping motor 32, the propulsion plate 31 is connected with the lead screw of the lead screw stepping motor 32, the lead screw stepping motor 33 is signally connected with the controller 2, and the upper end surface of the propulsion plate 31 is set. There is a card slot 331 on which the rear of the plunger rod 512 is mounted.

This embodiment further includes a fixing mechanism 4, which is located below the syringe 51, and the fixing mechanism 4 includes a first fixing seat 41, a second fixing seat 42 and a third fixing seat 43, the first fixing seat 41 and the second fixing seat 42 is detachably connected, the second fixing base 42 is detachably connected to the third fixing base 43 , and the middle of the needle cylinder 511 is erected on the first fixing base 41 , the second fixing base 42 or the third fixing base 43 . In this embodiment, the first fixing seat 41 , the second fixing seat 42 and the third fixing seat 43 can all be used to install the syringe 51 , and the dimensions of the first fixing seat 41 , the second fixing seat 42 and the third fixing seat 43 Differently, the size of the first fixing seat 41 is smaller than that of the second fixing seat 42 , and the size of the second fixing seat 42 is smaller than the size of the third fixing seat 43 , which are respectively suitable for syringes of different capacities. For example, the first fixing seat 41 can be installed with a syringe with a capacity of 1 ml, the second fixing seat 42 can be installed with a syringe with a capacity of 5 ml, and the third fixing seat 43 can be installed with a syringe with a capacity of 10 ml. In addition, the number of fixing seats is not limited to three, and this embodiment is only an example, and the number of fixing seats can be increased or decreased according to actual needs.

The first fixing seat 41 is provided with a first accommodating groove 411 , the bottom of the first accommodating groove 411 is provided with a first mounting hole 412 , the bottom surface of the first fixing seat 41 is provided with a first mounting post 413 ; the second fixing seat 42 is provided with a first mounting hole 412 . The second accommodating groove 421 is provided with a second mounting hole 422 at the bottom of the second accommodating groove 421 , and the second mounting post 423 is provided on the bottom surface of the second fixing base 42 ; the third fixing base 43 is provided with a third accommodating groove 431 . A third mounting hole 432 is provided at the bottom of the accommodating slot 431, and a third mounting post 433 is provided on the bottom surface of the third fixing base 43; hole 422, and the first fixing seat 41 is located in the second accommodating groove 421; when the second fixing seat 42 is connected with the third fixing seat 43, the second mounting post 423 is located in the third mounting hole 432, and the second fixing The seat 41 is located in the third accommodating groove 431 . That is to say, the first fixed seat 41 , the second fixed seat 42 and the third fixed seat 43 can be stacked and placed. Since the height of the second push plate 33 is fixed, when the syringe 51 is changed from a large capacity to a small one When the volume is increased, the diameter of the syringe 51 is also reduced. At this time, if the small-volume syringe is still placed on the third fixing seat 41, the tail of the syringe will be higher than the head of the syringe, and the injection volume will be different. Accurate, affecting the electroplating effect. Therefore, when the capacity of the syringe 51 needs to be replaced, the fixing bases need to be stacked together or separated, so that the tail and the head of the syringe 51 are always kept at the same level, so as to ensure the precision of electrolyte injection. In this way, in the same system, different amounts of electroplating additives can be injected at the same time, with better adaptability and cost savings.

The width of the first fixing seat 41 is W1, the length of the first fixing seat 41 is H1, the width of the second fixing seat 42 is W2, the length of the second fixing seat 42 is H2, the width of the second receiving groove 421 is d2, The length of the second accommodating groove 421 is L2, the width of the third accommodating groove 431 is d3, the length of the second accommodating groove 421 is L3, the width W1 matches the width d2, the length H1 matches the length L3, and the width W2 matches the width d3 matches, and length H2 matches length L3.

Taking the above ideal embodiments according to the present invention as inspiration, and through the above description, relevant personnel can make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

11: Electroplating tank 12: Rehydration tank 2: Controller 3: Promoting Mechanisms 4: Fixed mechanism 5: Injection mechanism 31: Propulsion Board 32: Screw stepper motor 311: Card slot 41: The first fixed seat 42: Second fixed seat 43: The third fixed seat 411: The first accommodating slot 412: The first mounting hole 413: First mounting post 421: The second holding slot 422: Second mounting hole 423: Second mounting post 431: The third holding slot 432: The third mounting hole 433: Third mounting post 51: Syringe 52: Y-tube 53: The first conduction valve 54: The second conducting valve 511: Syringe 512: Plunger rod 513: Rodless cavity 514: with rod cavity 515: Plunger 521: First End 522: second end 523: Third End 531: First Shell 532: The first filter 533: First Spring 534: First gasket 535: first through hole 536: second through hole 541: Second shell 542: Second filter 543: Second Spring 544: Second gasket 545: third through hole 546: Fourth through hole

Fig. 1 is a flow chart of the automatic replenishment control method of trace electroplating additives of the present invention.

FIG. 2 is a schematic structural diagram of the automatic replenishing device for the micro-plating solution of the present invention.

Figure 3 is an enlarged view of the injection mechanism of the present invention.

FIG. 4 is a schematic diagram of the first conduction valve of the present invention when it is turned on.

FIG. 5 is a schematic diagram of the second conduction valve of the present invention when it is turned on.

FIG. 6 is a schematic view of the structure of the propelling plate of the present invention.

FIG. 7 is a schematic structural diagram of the fixing mechanism of the present invention.

Fig. 8 is a plan view of the fixing mechanism of the present invention.

FIG. 9 is a schematic structural diagram of a third fixing seat of the present invention.

FIG. 10 is a schematic structural diagram of the second fixing seat of the present invention.

FIG. 11 is a schematic structural diagram of the first fixing seat of the present invention.

Claims (9)

An automatic replenishment control method for trace electroplating additives, wherein an automatic replenishment device for trace electroplating additives is adopted, and the device includes: an electroplating tank (11) for carrying the electroplating solution, the electroplating tank (11) is connected with the electroplating control equipment; a liquid replenishing tank (12) for carrying electroplating additives; An injection mechanism (5), the electroplating tank (11) is communicated with the front end of the injection mechanism (5) through a first pipeline, and the liquid replenishing tank (12) is connected with the front end of the injection mechanism (5) through a second pipeline The injection mechanism (5) includes a syringe (51) and a Y-shaped tube (52). A first end (521) of the Y-shaped tube (52) is communicated with the front end of the syringe (51). The A second end (522) of the Y-shaped pipe (52) is communicated with the first pipeline, and a third end (523) of the Y-shaped pipe (52) is communicated with the second pipeline. A first conducting valve (53) is provided, and a second conducting valve (54) is provided on the second pipeline; A propulsion mechanism (3), which can push the rear end of the injection mechanism (5) to reciprocate, when the propulsion mechanism (3) pushes the rear end of the injection mechanism (5) to move forward, the The injection mechanism (5) can add liquid to the electroplating tank (11), and when the propulsion mechanism (3) drives the rear end of the injection mechanism (5) to move backwards, the injection mechanism (5) can stop feeding the electroplating liquid is added in the tank (11), and at the same time, the liquid replenishing tank (12) is made to add liquid to the injection mechanism (5); a controller (2), both the electroplating control device and the propulsion mechanism (3) are electrically connected to the controller (2); The automatic replenishment control method of trace electroplating additives has the following steps: S1: In the initial state, the syringe (51), the Y-shaped tube (52), the first conducting valve (53), the first pipeline, the second conducting valve (54) and the inside of the second pipeline Both are filled with electroplating additives, and the first conducting valve (53) and the second conducting valve (54) are both closed; S2: When the electroplating control device starts electroplating work, the electroplating control device sends a signal to the controller (2). After receiving the signal, the controller (2) controls the propulsion mechanism (3) to push the rear end of the syringe (51) to the Forward movement, at this time, since the pressure at the rear end of the first conducting valve (53) is greater than the pressure at the front end of the first conducting valve (53), the first conducting valve (53) is turned on, because the second conducting valve (54) ) The pressure at the rear end is greater than the pressure at the front end of the second conducting valve (54), so that the second conducting valve (54) is closed; the electroplating additive in the syringe (51) can enter the electroplating tank (11) through the first pipeline inside, adding liquid to the electroplating tank (11); S3: When the liquid addition is completed, the controller (2) controls the propulsion mechanism (3) to drive the rear end of the syringe (51) to move backward. At this time, a negative pressure is formed in the syringe (51), so that the first The pressure at the rear end of the conducting valve (53) is lower than the pressure at the front end of the first conducting valve (53), and the first conducting valve (53) is closed, so that the pressure at the rear end of the second conducting valve (54) is smaller than the pressure at the front end of the second conducting valve (54) The pressure at the front end of the valve (54), the second conducting valve (54) is turned on; the syringe (51) can absorb new electroplating additives from the liquid replenishment tank (12) through the second pipeline, and give the syringe (51) rehydration; S4: Steps S2-S3 are repeated, and the loop is performed. The automatic replenishment control method for trace electroplating additives according to claim 1, wherein the method further comprises: setting a total of Xml of electroplating additives to be added to the electroplating tank (11), adding Yml every t minutes, and adding the number of times n =X/Y, the controller (2) controls the injector (51) to add Yml of electroplating additives into the electroplating tank (11) first, and then the controller (2) controls the injector (51) The replenishment operation of sucking Yml of electroplating additives is performed from the replenishment tank (12), and the liquid addition and replenishment operations are repeated n times until a total of Xml of electroplating additives are added to the electroplating tank (11). The automatic replenishment control method for trace electroplating additives according to claim 2, wherein the controller (2) sets the injection rate of the syringe (51) as V1 and the injection rate of the syringe (51) as V2, and the rate V1 greater than the speed V2, and the time occupied by the liquid addition operation in t minutes is t/4, and the time occupied by the liquid replenishment operation is t/6. The automatic replenishment control method for trace electroplating additives according to claim 1, wherein the first conduction valve (53) comprises a first casing (531), and a first filter screen (532) is arranged in the first casing (531). ), a first spring (533) and a first gasket (534), the first filter screen (532) is close to the front end of the first shell (531), the first gasket (534) is close to the first the rear end of the casing (531), the first filter screen (532) is fixedly connected to the inner wall of the first casing (531), and one end of the first spring (533) is fixedly connected to the first filter screen (532), The other end of the first spring (533) is fixedly connected to the first washer (534), and the rear end of the first housing (531) defines a first through hole (535) through which the first through hole (535) passes The first pipeline communicates with the second end (522) of the Y-shaped pipe (52). The front end of the first housing (531) defines a second through hole (536). The second through hole (536) ) is communicated with the electroplating tank (11) through the first pipeline, and the first spring (533) is in a compressed state between the first filter screen (532) and the first gasket (534), so that the first spring (533) is in a compressed state. A gasket (534) abuts on the first through hole (535), and the first through hole (535) is sealed at this time; the second conduction valve (54) includes a second housing (541), the first through hole (535) is sealed. A second filter screen (542), a second spring (543) and a second gasket (544) are arranged in the two outer casings (541), and the second gasket (544) is close to the second outer casing (541). Front end, the second filter screen (542) is close to the rear end of the second shell (541), the second filter screen (542) is fixedly connected with the inner wall of the second shell (541), the second spring (543) One end of the spring (543) is fixedly connected to the second filter screen (542), the other end of the second spring (543) is fixedly connected to the second gasket (544), and a third A through hole (545), the third through hole (545) is communicated with a third end (523) of the Y-shaped pipe (52) through the second pipeline, and the front end of the second housing (541) is provided with a first Four through holes (546), the fourth through holes (546) communicate with the fluid replenishing tank (12) through the second pipeline; the second spring (543) is connected between the second filter screen (542) and the second pad The sheets (544) are in a compressed state, so that the second gasket (544) abuts on the fourth through hole (546), which is now sealed. The automatic replenishment control method for trace electroplating additives according to claim 1, wherein the syringe (51) comprises a syringe (511), a plunger rod (512) and a plunger (515), the plunger (515) ) is fixedly connected with the front end of the plunger rod (512), the plunger (515) is installed in the barrel (511), so that a rodless cavity (513) and a rod with a rod are formed inside the barrel (511). A cavity (514), part of the plunger rod (512) is located in the rod cavity (514), the rear end of the plunger rod (512) is located outside the barrel (511), the rodless cavity (513) Its front end is connected with a first end (521) of the Y-shaped tube (52), and the rodless cavity (513) is used for accommodating electroplating additives. The automatic replenishment control method for trace electroplating additives according to claim 5, wherein the advancing mechanism (3) comprises a advancing plate (31) and a lead rod stepping motor (32), the advancing plate (31) is compatible with the The lead screw of the lead screw stepping motor (32) is connected with the lead screw stepping motor (33) in signal connection with the controller (2). The rear of the plunger rod (512) is mounted on the slot (311). The automatic replenishment control method for trace electroplating additives according to claim 5, further comprising a fixing mechanism (4), the fixing mechanism (4) being located below the syringe (51), the fixing mechanism (4) comprising a first A fixing seat (41), a second fixing seat (42) and a third fixing seat (43), the first fixing seat (41) and the second fixing seat (42) are detachably connected, the second fixing seat (42) The seat (42) is detachably connected to the third fixing seat (43), and the middle part of the needle cylinder (511) is erected on the first fixing seat (41), the second fixing seat (42) or the third fixing seat (43) on. The automatic replenishment control method for trace electroplating additives according to claim 7, wherein a first accommodating groove (411) is provided on the first fixing seat (41), and a first mounting groove (411) is provided at the bottom of the first accommodating groove (411). A hole (412), the bottom surface of the first fixing seat (41) is provided with a first mounting post (413); the second fixing seat (42) is provided with a second accommodating groove (421), the second accommodating groove (421) ) is provided with a second mounting hole (422) at the bottom, and a second mounting post (423) is provided on the bottom of the second fixing seat (42); A third mounting hole (432) is provided at the bottom of the third accommodating groove (431), and a third mounting post (433) is provided on the bottom of the third fixing seat (43); When the two fixing bases (42) are connected, the first mounting post (413) is located in the second mounting hole (422), and the first fixing base (41) is located in the second accommodating groove (421); When the second fixing seat (42) is connected with the third fixing seat (43), the second mounting post (423) is located in the third mounting hole (432), and the second fixing seat (41) is located in the third mounting hole (432) three accommodating grooves (431). The automatic replenishment control method for trace electroplating additives according to claim 8, wherein the width of the first fixing seat (41) is W1, the length of the first fixing seat (41) is H1, and the second fixing seat (42) ) width is W2, the length of the second fixing seat (42) is H2, the width of the second accommodating groove (421) is d2, the length of the second accommodating groove (421) is L2, the third accommodating groove The width of (431) is d3, the length of the second accommodating groove (421) is L3, the width W1 matches the width d2, the length H1 matches the length L3, and the width W2 matches the width d3 matches, the length H2 matches the length L3.

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