TWI756049B - Magnetic device - Google Patents
Magnetic device Download PDFInfo
- Publication number
- TWI756049B TWI756049B TW110104848A TW110104848A TWI756049B TW I756049 B TWI756049 B TW I756049B TW 110104848 A TW110104848 A TW 110104848A TW 110104848 A TW110104848 A TW 110104848A TW I756049 B TWI756049 B TW I756049B
- Authority
- TW
- Taiwan
- Prior art keywords
- magnetic
- magnetic core
- conductive element
- protruding portion
- core
- Prior art date
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
本發明係有關於一種磁性裝置。更具體地來說,本發明有關於一種具有導磁元件的磁性裝置。 The present invention relates to a magnetic device. More specifically, the present invention relates to a magnetic device having a magnetically permeable element.
許多電子設備中皆具有包含線圈和磁性元件的零件,例如電感器或電壓器等。為了避免線圈和磁性元件之間產生短路,且為了符合安全規範,線圈和磁性裝置之間通常會以氣隙間隔。然而,此種結構會使得損耗提高,進而使得零件的使用效率變差。因此,如何解決前述問題始成一重要之課題。 Many electronic devices have components that include coils and magnetic components, such as inductors or voltages. To avoid short circuits between the coils and the magnetics, and to comply with safety regulations, the coils and the magnetics are usually separated by an air gap. However, such a structure will increase the loss, thereby making the use efficiency of the parts worse. Therefore, how to solve the aforementioned problems has become an important issue.
本發明提供一種磁性裝置,包括一上磁芯、一下磁芯、一線圈、以及一導磁元件,其中導磁元件設置於上磁芯和下磁芯之間。再者,導磁元件更包覆前述線圈,且與上磁芯和下磁芯接觸。 The invention provides a magnetic device, comprising an upper magnetic core, a lower magnetic core, a coil, and a magnetic conductive element, wherein the magnetic conductive element is arranged between the upper magnetic core and the lower magnetic core. Furthermore, the magnetic conductive element further covers the coil and is in contact with the upper magnetic core and the lower magnetic core.
本發明一些實施例中,前述導磁元件的初始磁導率大於空氣的初始磁導率。上磁芯的初始磁導率大於導磁元件的初始磁導率。下磁芯的初始磁導率大於導磁元件的初始磁導率。 In some embodiments of the present invention, the initial magnetic permeability of the aforementioned magnetically permeable element is greater than the initial magnetic permeability of air. The initial magnetic permeability of the upper magnetic core is greater than the initial magnetic permeability of the magnetically permeable element. The initial permeability of the lower magnetic core is greater than that of the magnetically permeable element.
本發明一些實施例中,前述導磁元件係以黏膠和高導磁率的粉末混合形成。 In some embodiments of the present invention, the aforementioned magnetic conductive element is formed by mixing adhesive and powder with high magnetic permeability.
本發明一些實施例中,前述上磁芯與下磁芯連接,以於上磁芯和下磁芯之間形成一容置空間,且導磁元件設置於容置空間中。容置空間形成於兩個側柱之間,且每個側柱的輪廓的至少部分大致相同於導磁元件的輪廓的至少部分。於一些實施例中,導磁元件填滿容置空間。 In some embodiments of the present invention, the aforementioned upper magnetic core and the lower magnetic core are connected to form an accommodating space between the upper magnetic core and the lower magnetic core, and the magnetic conductive element is disposed in the accommodating space. The accommodating space is formed between the two side pillars, and at least part of the outline of each side pillar is substantially the same as at least part of the outline of the magnetic conductive element. In some embodiments, the magnetic conductive element fills the accommodating space.
本發明一些實施例中,前述上磁芯具有一第一凸出部,下磁芯具有一第二凸出部,第一凸出部對齊第二凸出部,且導磁元件圍繞第一凸出部和第二凸出部。導磁元件的部分位於線圈和第一凸出部之間。 In some embodiments of the present invention, the upper magnetic core has a first protruding portion, the lower magnetic core has a second protruding portion, the first protruding portion is aligned with the second protruding portion, and the magnetic conductive element surrounds the first protruding portion Outlet and second protrusion. A portion of the magnetically conductive element is located between the coil and the first protrusion.
本發明一些實施例中,前述線圈具有一環狀結構,環狀結構圍繞一中空部,且導磁元件填滿中空部。 In some embodiments of the present invention, the aforementioned coil has an annular structure, the annular structure surrounds a hollow portion, and the magnetic conductive element fills the hollow portion.
本發明一些實施例中,前述下磁芯包括複數個引腳。 In some embodiments of the present invention, the aforementioned lower magnetic core includes a plurality of pins.
100:上磁芯 100: Upper magnetic core
110:頂板 110: Top plate
111:第一表面 111: First surface
120:側柱 120: jamb
121:內凹曲面 121: Concave surface
130:第一凸出部 130: The first protrusion
200:下磁芯 200: Lower core
210:底板 210: Bottom plate
211:第二表面 211: Second Surface
220:側柱 220: jamb
221:內凹曲面 221: Concave Surface
230:第二凸出部 230: Second protrusion
300:線圈 300: Coil
310:中空部 310: hollow part
400:導磁元件 400: Magnetically conductive element
M1:磁性裝置 M1: Magnetic device
M2:磁性裝置 M2: Magnetic device
M3:磁性裝置 M3: Magnetic device
R:容置空間 R: accommodation space
W:繞線架 W: reel
W1:引腳 W1: pin
W2:引腳 W2: pin
根據以下的詳細說明並配合所附圖式可以更加理解本發明實施例。應注意的是,根據本產業的標準慣例,圖式中的各種部件並未必按照比例繪製。事實上,可能任意的放大或縮小各種部件的尺寸,以做清楚的說明。 The embodiments of the present invention can be better understood according to the following detailed description and the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components in the drawings are not necessarily drawn to scale. In fact, the dimensions of various components may be arbitrarily enlarged or reduced for clarity of illustration.
第1圖係表示本發明一實施例之磁性裝置的示意圖。 FIG. 1 is a schematic diagram showing a magnetic device according to an embodiment of the present invention.
第2圖係表示本發明一實施例之磁性裝置的爆炸圖。 Fig. 2 is an exploded view showing a magnetic device according to an embodiment of the present invention.
第3圖係表示第1圖中沿A-A方向的剖視圖。 Fig. 3 is a cross-sectional view taken along the direction A-A in Fig. 1 .
第4圖係表示第1圖中沿B-B方向的剖視圖。 FIG. 4 is a cross-sectional view taken along the direction B-B in FIG. 1 .
第5圖係表示本發明另一實施例之磁性裝置的示意圖。 FIG. 5 is a schematic diagram showing a magnetic device according to another embodiment of the present invention.
第6圖係表示本發明另一實施例之磁性裝置的爆炸圖。 Fig. 6 is an exploded view showing a magnetic device according to another embodiment of the present invention.
第7圖係表示第5圖中沿C-C方向的剖視圖。 FIG. 7 is a cross-sectional view taken along the C-C direction in FIG. 5 .
第8圖係表示本發明又一實施例之磁性裝置的示意圖。 FIG. 8 is a schematic diagram showing a magnetic device according to another embodiment of the present invention.
以下說明本發明之磁性裝置。然而,可輕易了解本發明提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。 The magnetic device of the present invention will be described below. It can be readily appreciated, however, that the present invention provides many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of particular ways to use the invention, and are not intended to limit the scope of the invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本發明的背景或上下文一致的意 思,而不應該以一理想化或過度正式的方式解讀,除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of the present invention. should not be read in an idealized or overly formal manner unless specifically defined herein.
本說明書以下的揭露內容是敘述各個構件及其排列方式的特定範例,以求簡化發明的說明。當然,這些特定的範例並非用以限定本發明。例如,若是本說明書以下的揭露內容敘述了將一第一特徵形成於一第二特徵之上或上方,即表示其包含了所形成的上述第一特徵與上述第二特徵是直接接觸的實施例,亦包含了尚可將附加的特徵形成於上述第一特徵與上述第二特徵之間,而使上述第一特徵與上述第二特徵可能未直接接觸的實施例。再者,為了方便描述圖式中一特徵與另一特徵的關係,可使用空間相關用語,例如「下面」、「下方」、「之下」、「上方」、「之上」、以及類似的用語等。除了圖式所繪示的方位之外,空間相關用語涵蓋裝置在使用或操作中的不同方位。所述裝置也可被另外定位(旋轉90度或在其他方位上),且同樣可對應地解讀於此所使用的空間相關描述。 The following disclosure of this specification is to describe specific examples of various components and their arrangement in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the present invention. For example, if the following disclosure of this specification describes that a first feature is formed on or over a second feature, it means that it includes an embodiment in which the first feature and the second feature are formed in direct contact with each other. , and also includes embodiments in which additional features may be formed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, for convenience in describing the relationship of one feature to another feature in the drawings, spatially relative terms such as "below", "below", "below", "above", "above", and the like may be used. terms, etc. In addition to the orientation depicted in the drawings, spatially relative terms encompass different orientations of the device in use or operation. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptions used herein interpreted accordingly.
首先請參閱第1圖和第2圖,本發明一實施例之磁性裝置M1主要包括一上磁芯100、一下磁芯200、一線圈300、以及一導磁元件400。上磁芯100和下磁芯200可彼此組合並在兩者之間形成一容置空間R,且前述線圈300和導磁元件400可容置於此容置空間R中。於本實施例中,磁性裝置M1可為一電感器,用以降低突波(ripple)、去除雜訊、降低電磁干擾(Electromagnetic Interference,EMI)、及/或轉換功率。磁性裝置M1可應用於許多
不同的電子設備中,例如電源供應器、主機板、數據機等,但並不限定於此。
Please refer to FIG. 1 and FIG. 2 first. The magnetic device M1 according to an embodiment of the present invention mainly includes an upper
上磁芯100具有E字形結構。詳細而言,上磁芯100可具有一頂板110、兩個側柱120(第一側柱)、以及一第一凸出部130。兩個側柱120連接頂板110,且分別位於頂板110之一第一表面111的兩端。第一凸出部130則設置於頂板110的中央,且相離於前述側柱120。於本實施例中,第一凸出部130具有一圓柱體結構,且當上磁芯100和下磁芯200相互結合時,兩個側柱120和第一凸出部130皆是朝向下磁芯200延伸。
The upper
下磁芯200同樣具有E字形結構。詳細而言,下磁芯200可具有一底板210、兩個側柱220(第二側柱)、以及一第二凸出部230。兩個側柱220連接底板210,且分別位於底板210之一第二表面211的兩端。第二凸出部230則設置於底板210的中央,且分離於前述側柱220。於本實施例中,第二凸出部230具有一圓柱體結構,且當上磁芯100和下磁芯200相互結合時,兩個側柱220和第二凸出部230皆是朝向上磁芯100延伸,且容置空間R是形成於該些側柱120、220之間。
The lower
於本實施例中,第一凸出部130的剖面形狀和尺寸大致相同於和第二凸出部230的剖面形狀和尺寸,且當上磁芯100和下磁芯200相互結合時,第一凸出部130會對齊且接觸第二凸出部230,從而可形成位於容置空間R中的柱體。
In this embodiment, the cross-sectional shape and size of the first protruding
需特別說明的是,前述上磁芯100和下磁芯200是以高初始磁導率(μi)的材料構成,例如可為初始磁導率介於8000~10000的材料。舉例而言,上磁芯100和下磁芯200可包括鐵、錳、鋅、非晶態金屬、其組合、或其合金等,但並不限定於此。於本實施例中,上磁芯100的頂板110、側柱120和第一凸出部130是以一體成型的方式形成,且下磁芯200的底板210、側柱220和第二凸出部230亦是以一體成型的方式形成。
It should be noted that the above-mentioned upper
第3圖係表示前述磁性裝置M1沿A-A方向的剖視圖,且第4圖係表示前述磁性裝置M1沿B-B方向的剖視圖。如第1圖至第4圖所示,當磁性裝置M1組裝完成時,線圈300和導磁元件400會容置於容置空間R中,且圍繞由第一凸出部130和第二凸出部230形成的柱體。線圈300可被導磁元件400所包覆,且導磁元件400可與上磁芯100和下磁芯200接觸。
FIG. 3 is a cross-sectional view of the magnetic device M1 taken along the A-A direction, and FIG. 4 is a cross-sectional view of the magnetic device M1 taken along the B-B direction. As shown in FIG. 1 to FIG. 4 , when the magnetic device M1 is assembled, the
導磁元件400可包括高磁導率的粉末與黏膠。使用者可將高磁導率的粉末與黏膠混合之後,以射出成型方式包覆整個線圈300,再升溫(例如升至130℃至150℃)烘烤使粉末和黏膠的混合物固化,從而可形成包覆線圈300的導磁元件400。通過前述方式所形成的導磁元件400的初始磁導率將可大於空氣的初始磁導率(空氣的初始磁導率大約為1),例如可介於2000~3000。
The magnetic
於本實施例中,當包覆線圈300的導磁元件400設置於容置空間R時,導磁元件400會設置於上磁芯100的兩個側柱120之間。每個側柱120面朝導磁元件400的表面上可形成一內凹曲
面121,且所述內凹曲面121的輪廓可對應於導磁元件400的輪廓。因此,當導磁元件400設置於容置空間R時,其將可接觸側柱120的內凹曲面121,並被內凹曲面121所定位。
In this embodiment, when the magnetic
同樣的,當包覆線圈300的導磁元件400設置於容置空間R時,導磁元件400會設置於下磁芯200的兩個側柱220之間。每個側柱220面朝導磁元件400的表面上可形成一內凹曲面221,且所述內凹曲面221的輪廓可對應於導磁元件400的輪廓。因此,當導磁元件400設置於容置空間R時,其將可接觸側柱220的內凹曲面221,並被內凹曲面221所定位。
Similarly, when the magnetic
此外,上磁芯100和下磁芯200相互結合時,頂板110和底板210之間的距離大致相同於導磁元件400的厚度,因此當導磁元件400設置於容置空間R時,導磁元件400也將同時接觸上磁芯100的頂板110和下磁芯200的底板210。
In addition, when the upper
再者,線圈300具有一環狀結構,故環狀結構將圍繞一中空部310,前述第一凸出部130和第二凸出部230可穿過此中空部310。由於導磁元件400是完整包覆線圈300,因此部分的導磁元件400會位於線圈300和第一凸出部130/第二凸出部230之間,且可接觸第一凸出部130和第二凸出部230。
Furthermore, the
通過前述結構,可減少線圈300和上磁芯100、以及線圈300和下磁芯200之間的氣隙,進而提高感值,且可減少電路上的突波(ripple)。
Through the foregoing structure, the air gaps between the
於一些實施例中,導磁元件400可填滿容置空間R,以增加導磁元件400和上磁芯100、下磁芯200的接觸面積,從而提高電感值並增強定位效果。
In some embodiments, the magnetic
請參閱第5圖至第7圖,於本發明另一實施例中,磁性裝置M2主要包括一上磁芯100、一下磁芯200、一線圈300、以及一導磁元件400。磁性裝置M2的結構和配置大致與磁性裝置M1相同,故相同的部分將不再贅述。
Please refer to FIGS. 5 to 7 , in another embodiment of the present invention, the magnetic device M2 mainly includes an upper
與磁性裝置M1不同的是,磁性裝置M2的上磁芯100和下磁芯200各自具有C字型結構,因此磁性裝置M2將不會包含位於容置空間R中的第一凸出部130和第二凸出部230。線圈300具有環狀結構以及被環狀結構圍繞的中空部310,導磁元件400將會填滿前述中空部310。
Different from the magnetic device M1, the upper
請參閱第8圖,於本發明另一實施例中,磁性裝置M3主要包括一上磁芯100、一下磁芯200、一線圈300、以及一導磁元件400。磁性裝置M3的結構和配置大致與磁性裝置M1相同,故相同的部分將不再贅述。於本實施例中,磁性裝置M3可為一變壓器,當電流流入磁性裝置M3後,磁性裝置M3可藉由電磁感應輸出不同電壓的電流。
Referring to FIG. 8 , in another embodiment of the present invention, the magnetic device M3 mainly includes an upper
與磁性裝置M1不同的是,磁性裝置M3更包括一繞線架W,上磁芯100和下磁芯200的第一凸出部130和第二凸出部230係穿設於繞線架W中央之貫穿孔中,且導磁元件400係環設於繞線架W之繞線部之外環面,繞線架W上分別設有一或多個引腳W1、
W2,導磁元件400內的線圈300之端部可穿過導磁元件400並纏繞於這些引腳W1、W2上。
Different from the magnetic device M1, the magnetic device M3 further includes a bobbin W, and the first protruding
綜上所述,本發明提供一種磁性裝置,包括一上磁芯、一下磁芯、一線圈、以及一導磁元件,其中導磁元件設置於上磁芯和下磁芯之間。再者,導磁元件更包覆前述線圈,且與上磁芯和下磁芯接觸。藉由磁性裝置的前述結構,可有效地提升磁性裝置的感值,並降低電路上的突波。再者,由於不需額外設置定位元件來定位線圈,可減少製程的複雜度,且可使磁性裝置的整體體積縮小,有利於磁性裝置的小型化。 In summary, the present invention provides a magnetic device comprising an upper magnetic core, a lower magnetic core, a coil, and a magnetic conductive element, wherein the magnetic conductive element is disposed between the upper magnetic core and the lower magnetic core. Furthermore, the magnetic conductive element further covers the coil and is in contact with the upper magnetic core and the lower magnetic core. With the aforementioned structure of the magnetic device, the inductance value of the magnetic device can be effectively increased, and the surge on the circuit can be reduced. Furthermore, since there is no need for additional positioning elements to position the coil, the complexity of the manufacturing process can be reduced, and the overall volume of the magnetic device can be reduced, which is beneficial to the miniaturization of the magnetic device.
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and any person with ordinary knowledge in the technical field can learn from the present disclosure. It is understood that processes, machines, manufactures, compositions of matter, devices, methods and steps developed in the present or in the future can be used in accordance with the present invention as long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claimed scope constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claimed scope and the embodiments.
雖然本發明以前述數個較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在 不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外,每個申請專利範圍建構成一獨立的實施例,且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。 Although the present invention is disclosed in the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains, Minor changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application. Furthermore, each claimable scope constitutes a separate embodiment, and various claims and combinations of embodiments are intended to be within the scope of the present disclosure.
100:上磁芯 100: Upper magnetic core
110:頂板 110: Top plate
111:第一表面 111: First surface
120:側柱 120: jamb
130:第一凸出部 130: The first protrusion
200:下磁芯 200: Lower core
210:底板 210: Bottom plate
211:第二表面 211: Second Surface
220:側柱 220: jamb
230:第二凸出部 230: Second protrusion
300:線圈 300: Coil
400:導磁元件 400: Magnetically conductive element
M1:磁性裝置 M1: Magnetic device
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110104848A TWI756049B (en) | 2021-02-09 | 2021-02-09 | Magnetic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110104848A TWI756049B (en) | 2021-02-09 | 2021-02-09 | Magnetic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI756049B true TWI756049B (en) | 2022-02-21 |
TW202232524A TW202232524A (en) | 2022-08-16 |
Family
ID=81329274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110104848A TWI756049B (en) | 2021-02-09 | 2021-02-09 | Magnetic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI756049B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200910392A (en) * | 2007-08-27 | 2009-03-01 | zheng-xiong Li | Inductor structure applied in wideband range |
TW201707019A (en) * | 2015-08-05 | 2017-02-16 | 佳邦科技股份有限公司 | Customized SMD power inductor and method of manufacturing the same |
TWM552661U (en) * | 2017-05-15 | 2017-12-01 | Yujing Technology Co Ltd | Resonant transformer with leakage inductance adjustment |
-
2021
- 2021-02-09 TW TW110104848A patent/TWI756049B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200910392A (en) * | 2007-08-27 | 2009-03-01 | zheng-xiong Li | Inductor structure applied in wideband range |
TW201707019A (en) * | 2015-08-05 | 2017-02-16 | 佳邦科技股份有限公司 | Customized SMD power inductor and method of manufacturing the same |
TWM552661U (en) * | 2017-05-15 | 2017-12-01 | Yujing Technology Co Ltd | Resonant transformer with leakage inductance adjustment |
Also Published As
Publication number | Publication date |
---|---|
TW202232524A (en) | 2022-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI581277B (en) | Surface mount inductor and method for making surface mount inductor | |
CN1627457B (en) | Magnetic component and its making method | |
US6392525B1 (en) | Magnetic element and method of manufacturing the same | |
US9082541B2 (en) | Coil electrical component and method of manufacturing the same | |
JP4446487B2 (en) | Inductor and method of manufacturing inductor | |
JP2007150307A (en) | Inductor and method of manufacturing the same | |
JP5402850B2 (en) | Reactor | |
TW201113913A (en) | Transformer structure | |
US20080129438A1 (en) | Noise filter and manufacturing method thereof | |
JP2018133500A (en) | Reactor and manufacturing method thereof | |
TW201301315A (en) | Magnetic element | |
KR101111189B1 (en) | Terminal stand for inductor and inductor apparatus using the same | |
TWI756049B (en) | Magnetic device | |
JP5082293B2 (en) | Inductance component and manufacturing method thereof | |
JP2006332245A (en) | Coil component | |
TWI622067B (en) | Coil component | |
JP2007165623A (en) | Choke coil | |
TWI575542B (en) | Detachable transformer | |
US20220254558A1 (en) | Magnetic device | |
KR20160134633A (en) | Wire wound inductor and manufacturing method thereof | |
TWI756108B (en) | Transformer | |
KR101093112B1 (en) | The inductor which has the separation type magnetic circuit of multiple | |
TWM649847U (en) | Magnetic core structure and magnetic component | |
TW201814740A (en) | Coil device | |
TWM556915U (en) | Inductor component |