TWI752470B - Inductance method and its structure - Google Patents

Abstract

The invention relates to an inductor manufacturing method and its structure. The manufacturing process steps of the inductor of a precision circuit at least include: taking a core, coating epoxy resin, hardening treatment, irradiating a specific route by laser, electroless copper plating to form a conductive circuit, Get the finished product. Inductor structures using this method include wire wound inductors and stacked inductors, which have the advantages of small size, high inductance, and good quality factor Q value, which can meet the needs of miniaturization of components for miniaturized electronic products.

Description

Inductance method and its structure

The present invention relates to a manufacturing method and structure of an inductor, and relates to a manufacturing process of an electronic component, in particular to the manufacturing field of a miniaturized inductor.

All electronic products are composed of numerous electronic components, one of which is a common inductive component, whose basic function is to allow direct current to pass through and block alternating current; more specifically, it can isolate and filter alternating current signals, and can even be combined with capacitors and resistor to form a resonant circuit.

As electronic products are increasingly designed to be light, thin, and short, electronic components must be miniaturized to meet the demand, and their performance must also be improved. However, the traditional inductor is limited by the existing structural design factors, and it is difficult and limited to reduce the size. In view of this, the inventor has developed this case, and hopes to use the proposal of this case to improve the existing inductor structure and cannot be further reduced. It is expected that the advantages of small size derived from this new inductor structure can meet the needs of product miniaturization.

In order to improve the shortcomings of the conventional inductor structure that is too large, which is not conducive to application in miniaturized electronic products, the main purpose of the present invention is to provide an innovative inductor manufacturing method and structure, which utilizes a new process and a new structure. The volume of the finished inductor can be made smaller than that of the prior art; thereby, the inductor can be used in miniaturized electronic products to meet the miniaturization requirements.

Another main purpose of the present invention is to provide an innovative manufacturing method and structure of an inductor. The new manufacturing process of the inductor can not only make the inductor product smaller in size than the prior art, but also maintain high inductance and ideal Q value, in order to achieve the purpose of ensuring the normal operation of electronic products and improving performance.

In order to achieve the above purpose, one of the preferred manufacturing methods of the inductor includes the following steps: taking a core, coating epoxy resin, curing, irradiating a specific route with laser, electroless copper plating to form a conductive circuit, and obtaining a finished product.

In order to achieve the above purpose, another preferred manufacturing method of the inductor includes the following steps: taking a plurality of sheet-like cores provided with perforations, coating epoxy resin, hardening treatment, irradiating a specific route with laser, and electroless copper plating to form a conductive circuit , Laminate and connect the cores, pour conductive glue into each perforation, and obtain the finished product.

In a preferred embodiment, the core is made of ceramic material.

In a preferred embodiment, the core is made of ferrite material.

In a preferred embodiment, the epoxy resin is a liquid resin containing a laser-sensitive substance.

In a preferred embodiment, the hardening treatment is performed by heating and baking.

In a preferred embodiment, the heating and baking of the hardening treatment is preferably performed at a temperature of 50-200° C. and a time of about 10-60 minutes.

11: Take a core

12: Coating epoxy resin

13: Hardening

14: Laser irradiation specific route

15: Electroless copper plating to form conductive lines

16: Get the finished product

21: Core

22: epoxy resin

23: Laser irradiation area

24: Copper Substance

31: Take a plurality of sheet cores provided with perforations

32: Coating epoxy resin

33: Hardening

34: Laser irradiation specific route

35: Electroless copper plating to form conductive lines

36: Laminate the cores

37: Pour conductive glue into each perforation

38: Get the finished product

41: sheet core

411: First Piercing

412: Second Perforation

413: Third Piercing

414: Fourth Piercing

415: Laser irradiation area

42: epoxy resin

43: Copper Substance

44: Conductive glue

Figure 1: It is a flow chart of the first implementation process of the present invention;

The second figure: is a schematic structural diagram of the first implementation process of the present invention;

Figure 3: It is another structural schematic diagram of the first implementation process of the present invention;

Figure 4: It is a flow chart of the second implementation process of the present invention;

Figure 5: It is a schematic structural diagram of the second implementation process of the present invention;

Figure 6: is another structural schematic diagram of the second implementation process of the present invention;

Figure 7: is another structural schematic diagram of the second implementation process of the present invention;

Figure 8: It is another structural schematic diagram of the second implementation process of the present invention.

Hereby, the process and structure of the inductor manufacturing method and its structure of the present invention are described in detail as follows with reference to the preferred embodiments of the present case.

Please refer to the first figure. In the first embodiment, the inductance manufacturing method of the present application includes the following steps: taking a core 11, coating epoxy resin 12, hardening treatment 13, irradiating a specific route 14 by laser, chemically The conductive lines 15 are formed by copper plating, and the finished product 16 is obtained.

Please cooperate with the first and second drawings. After the core body 21 is subjected to the aforementioned steps of coating epoxy resin 12 and hardening treatment 13, an epoxy resin 22 is formed on the outer layer of the core body 21; After irradiating the specific route 14, a laser irradiated area 23 (please refer to the third figure) is generated. After the electroless copper plating is performed to form the conductive circuit 15, a spiral shape can be formed on each outer ring surface of the core 21. The copper material 24 of the copper material 24 is equivalent to that of the traditional winding, so as to provide the function of the inductance.

In the second embodiment of this case: please refer to the fourth figure, the The inductance manufacturing method includes performing the following steps: taking a plurality of sheet-like cores 31 provided with perforations, coating epoxy resin 32, hardening 33, irradiating a specific route 34 by laser, electroless copper plating to form a conductive circuit 35, and stacking the cores Connecting 36 , pouring conductive glue 37 into each through hole, and obtaining a finished product 38 .

Please refer to Figure 4 and Figure 5. After the combination of the plurality of sheet-like cores 41 in a stacked connection relationship, the topmost and bottommost sheet-like cores 41 are respectively provided with a first through hole 411 and a fourth through hole. 414, the second through holes 412 and the third through holes 413 are respectively pierced through each of the sheet cores 41, and the second through holes 412 and the third through holes 413 are preferably located on the same side edge; The through holes 412 can be connected with the first through holes 411 or the third through holes 413 of the upper layer of sheet core 41 , and each third through hole 413 can be connected with the second through holes 412 or the fourth through holes of the next layer of sheet core 41 . 414 docking; after performing the procedures of coating epoxy resin 32 and hardening treatment 33, and then cooperating with the sixth figure, laser irradiation is performed on each sheet-like core 41 on a specific route 34, so that each sheet-like core 41 is formed on the Laser irradiation area 415, each laser irradiation area 415 is in the shape of ㄇ; then electroless copper plating is performed to form conductive lines 35, so that copper substances 43 are generated on each sheet-like core 41, and then the cores are laminated and connected 36 (the seventh figure), and pour the conductive glue 44 (the eighth figure) into each through hole, and finally the finished product 38 can be obtained. Due to the aforementioned laser irradiation regions 415, if the sheet-like core 41 is provided with the second through holes 412 and the third through holes 413, the copper substance 43 produced can connect the second through holes 412 and the third through holes 413; In this way, after the conductive glue 44 is poured into each through hole, the first through hole 411 and the fourth through hole 414 can form an electrical communication relationship with the conductive glue 44 through the copper substance 43 therebetween, and the copper substances 43 at the staggered positions are laminated. After the sheet-like core 41 is connected in series between layers, the whole circuit is in the form of a spiral coil, so that the inductance can function.

The aforementioned cores 21 and sheet-like cores 41 are formed by pressing either of ceramic materials or ferrite materials; the epoxy resins 22 and 42 are liquid resins containing laser-sensitive substances; the The hardening treatments 13 and 24 are performed by heating and baking.

The advantage of using the inductor produced by the process of the second embodiment is that the wire made by laser direct forming (LDS) can be used to replace the wire, so that the wire diameter can be reduced, the number of turns of the spiral wire can be increased, and the wires will not be the same as each other. Conventional windings are short-circuited due to accidental insulation defects, or can be reduced in size under the same number of winding coils, while the thickness of the transverse axis can be adjusted by chemical plating time to adjust the value of the current that can be passed, and to balance the capacitance between the wires . Therefore, under the condition of the same inductor size, this case can greatly increase the number of windings and improve the performance; or under the condition of the same number of coils, this case can be smaller than the prior art; the advantages and progress of this case are obvious.

Furthermore, for the multilayer inductor fabricated by the process of the second embodiment, since the coil circuit is formed of chemical copper instead of the traditional conductive paste such as printed conductive silver paste, it has higher conductivity and a nearly straight line. quality, which helps to reduce stray currents, and capacitors improve the quality of inductance.

To sum up, according to the current patent law, there is no such thing as the "inductor manufacturing method and its structure" of the present invention. This case has indeed been used in the industry, has not been seen in publications or publicly used before the application, and is not a technology known to the public. Furthermore, this case effectively solves the long-standing problems in the prior art and meets the long-term needs of relevant users and consumers, which proves that the present invention cannot be easily accomplished. This case fully complies with the requirements of "industrial utilization", "novelty" and "progressiveness" stipulated in the Patent Law. It is required to apply for a patent in accordance with the law. I urge the Bureau to conduct a detailed investigation and approve the patent as soon as possible, so as to protect the wisdom of the applicant. Property rights to encourage innovation.

Although the present invention is described by the foregoing embodiments, its form and details can still be changed without departing from the spirit of the present invention, and can be understood by those skilled in the art. The above-mentioned preferred embodiment of this case is only one of the ways that can be implemented by the principle of this case, but it is not limited by this, and should be defined in accordance with the scope of the appended patent application.

11: Take a core

12: Coating epoxy resin

13: Hardening

14: Laser irradiation specific route

15: Electroless copper plating to form conductive lines

16: Get the finished product

Claims (2)

An inductance manufacturing method, comprising the following steps: taking a core, coating epoxy resin, hardening treatment, irradiating a specific route with laser, electroless copper plating to form a conductive circuit, and obtaining a finished product; wherein the core system is made of a ceramic material or a ferrite material Any one of them is pressed; the epoxy resin is a liquid resin containing laser-sensitive substances; the hardening treatment is carried out by heating and baking; minute. An inductor structure is provided with a hardened epoxy resin outside a core body, and copper is plated on the epoxy resin after a specific route is irradiated by a laser, so as to be provided with a copper substance; wherein the core system is made of ceramic material or iron Any one of the oxygen materials is pressed; the epoxy resin is a liquid resin containing a laser-sensitive substance.

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