TWI752100B - 用於訓練檢查相關演算法之系統、非暫時性電腦可讀媒體及電腦實施方法 - Google Patents

用於訓練檢查相關演算法之系統、非暫時性電腦可讀媒體及電腦實施方法 Download PDF

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TWI752100B
TWI752100B TW106135435A TW106135435A TWI752100B TW I752100 B TWI752100 B TW I752100B TW 106135435 A TW106135435 A TW 106135435A TW 106135435 A TW106135435 A TW 106135435A TW I752100 B TWI752100 B TW I752100B
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inspection
defects
algorithm
version
defect
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TW106135435A
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TW201825883A (zh
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馬丁 普莉霍爾
爾方 索湯莫罕瑪迪
沙瑞維南 普瑞瑪西文
賽朗 拉布
安基特 簡恩
莎拉斯 雪基札爾
普拉山堤 俄帕魯里
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美商克萊譚克公司
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Priority claimed from US15/782,820 external-priority patent/US10267748B2/en
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Publication of TW201825883A publication Critical patent/TW201825883A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Signal Processing (AREA)
  • Computational Linguistics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Complex Calculations (AREA)
TW106135435A 2016-10-17 2017-10-17 用於訓練檢查相關演算法之系統、非暫時性電腦可讀媒體及電腦實施方法 TWI752100B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
IN201641035490 2016-10-17
IN201641035490 2016-10-17
US201762477248P 2017-03-27 2017-03-27
US62/477,248 2017-03-27
US15/782,820 2017-10-12
US15/782,820 US10267748B2 (en) 2016-10-17 2017-10-12 Optimizing training sets used for setting up inspection-related algorithms

Publications (2)

Publication Number Publication Date
TW201825883A TW201825883A (zh) 2018-07-16
TWI752100B true TWI752100B (zh) 2022-01-11

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TW106135435A TWI752100B (zh) 2016-10-17 2017-10-17 用於訓練檢查相關演算法之系統、非暫時性電腦可讀媒體及電腦實施方法

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JP (1) JP6833027B2 (ja)
KR (1) KR102293789B1 (ja)
CN (1) CN109844919B (ja)
IL (1) IL265744B (ja)
SG (1) SG11201902745RA (ja)
TW (1) TWI752100B (ja)

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US10677586B2 (en) * 2018-07-27 2020-06-09 Kla-Tencor Corporation Phase revealing optical and X-ray semiconductor metrology
US11468553B2 (en) * 2018-11-02 2022-10-11 Kla Corporation System and method for determining type and size of defects on blank reticles
US20220130027A1 (en) * 2019-02-15 2022-04-28 Hitachi High-Tech Corporation Structure Estimation System and Structure Estimation Program
TWI694250B (zh) * 2019-03-20 2020-05-21 英業達股份有限公司 表面缺陷偵測系統及其方法
US11360030B2 (en) * 2020-02-04 2022-06-14 Applied Materials Isreal Ltd Selecting a coreset of potential defects for estimating expected defects of interest
WO2021250884A1 (ja) * 2020-06-12 2021-12-16 株式会社日立ハイテク 欠陥検査のための方法、システム、及びコンピューター可読媒体
KR102203222B1 (ko) * 2020-10-08 2021-01-14 (주)이랑텍 Ai 학습 기반 rf 필터 자동 튜닝 시스템 및 방법
CN116344378B (zh) * 2023-03-31 2024-01-23 江苏神州新能源电力有限公司 一种光伏板生产用智能检测系统及其检测方法
CN116666248B (zh) * 2023-07-26 2023-11-17 北京象帝先计算技术有限公司 测试结果异常确定方法、装置、电子设备及可读存储介质

Citations (4)

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JP2008082821A (ja) * 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置
JP2013224943A (ja) * 2012-04-19 2013-10-31 Applied Materials Israel Ltd 自動及び手動欠陥分類の統合
US20150262038A1 (en) * 2014-03-17 2015-09-17 Kla-Tencor Corporation Creating Defect Classifiers and Nuisance Filters
TW201624580A (zh) * 2014-10-23 2016-07-01 應用材料以色列公司 疊代式缺陷濾除製程

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US7061601B2 (en) * 1999-07-02 2006-06-13 Kla-Tencor Technologies Corporation System and method for double sided optical inspection of thin film disks or wafers
US8948494B2 (en) * 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
TWI525317B (zh) 2013-10-08 2016-03-11 國立清華大學 整合影像分析與資料挖礦之自動光學檢測缺陷影像分類方法
US9518932B2 (en) * 2013-11-06 2016-12-13 Kla-Tencor Corp. Metrology optimized inspection
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
CN106409711B (zh) * 2016-09-12 2019-03-12 佛山市南海区广工大数控装备协同创新研究院 一种太阳能硅晶片缺陷检测系统及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082821A (ja) * 2006-09-27 2008-04-10 Hitachi High-Technologies Corp 欠陥分類方法及びその装置並びに欠陥検査装置
JP2013224943A (ja) * 2012-04-19 2013-10-31 Applied Materials Israel Ltd 自動及び手動欠陥分類の統合
US20150262038A1 (en) * 2014-03-17 2015-09-17 Kla-Tencor Corporation Creating Defect Classifiers and Nuisance Filters
TW201624580A (zh) * 2014-10-23 2016-07-01 應用材料以色列公司 疊代式缺陷濾除製程

Also Published As

Publication number Publication date
IL265744B (en) 2021-06-30
TW201825883A (zh) 2018-07-16
KR102293789B1 (ko) 2021-08-24
JP2020500422A (ja) 2020-01-09
SG11201902745RA (en) 2019-05-30
JP6833027B2 (ja) 2021-02-24
IL265744A (en) 2019-06-30
CN109844919B (zh) 2020-12-11
CN109844919A (zh) 2019-06-04
KR20190057402A (ko) 2019-05-28

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