TWI747738B - Electronic display assembly - Google Patents

Abstract

An electronic display assembly is provided. The electronic display assembly comprises a backlight module, a transparent plate, a liquid crystal panel, an internal heat exchange path and an external heat dissipation path with ambient air flowing through. The liquid crystal panel is disposed between the transparent plate and the backlight module. The internal heat exchange path comprises a first pathway, a second pathway and a third pathway. The first pathway is arranged between the transparent plate and the liquid crystal panel. The second pathway is arranged between the liquid crystal panel and backlight module. The third pathway is located directly behind the backlight module. The external heat dissipation path carries heat conducted from air flowing through the third pathway.

Description

Electronic display components

The present invention relates to an electronic display assembly. More specifically, the present invention relates to an electronic display assembly with high heat dissipation efficiency.

As display devices are widely used in different environments, how to ensure the reliability and stability of the display device under harsh conditions has become an important issue. For example, if the display device is placed outdoors, the sunlight may cause the temperature of the display device to rise rapidly. The heat accumulated in the internal space of the display device will affect the normal functions of the electronic components. For example, due to the increase in temperature in the internal space of the display device, the electronic components may have a shortened service life or even malfunction. In addition, for optical components (for example, liquid crystal layers or optical films), if the temperature inside the display device is too high, problems such as liquefaction or yellowing of liquid crystals may occur.

In view of the above situation, it is necessary to provide an electronic device with high heat dissipation efficiency, so as to ensure the normal operation of the display device and make the display device have a longer service life.

In one aspect according to some embodiments, an electronic display assembly is provided. The electronic display assembly includes a backlight module, a transparent plate, a liquid crystal panel, an internal heat exchange path and an external heat dissipation path through which ambient air flows. The liquid crystal panel is arranged between the transparent plate and the backlight module. The internal heat exchange path includes a first path, a second path, and a third path. The first passage is arranged between the transparent plate and the liquid crystal panel. The second channel is configured between the liquid crystal panel and the backlight module. The third channel is directly behind the backlight module. The external heat dissipation path carries heat conducted by the air flowing through the third path.

In a preferred embodiment, the third passage and the external heat dissipation path together form a heat exchanger with at least two passages.

In a preferred embodiment, the direction of the air flow of the internal air flowing through the third passage is substantially parallel to the direction of the air flow of the ambient air flowing through the external heat dissipation path.

In a preferred embodiment, the optical film is disposed between the liquid crystal panel and the backlight module, and the second passage is disposed between the liquid crystal panel and the optical film.

In a preferred embodiment, the optical film is disposed between the liquid crystal panel and the backlight module, and the second passage is disposed between the optical film and the backlight module.

In a preferred embodiment, the optical film is disposed between the liquid crystal panel and the backlight module. The internal heat exchange path further includes a fourth path, and the second path is disposed between the liquid crystal panel and the optical film, and the fourth path is disposed between the optical film and the backlight module.

Other aspects and embodiments of the present invention are also considered. The foregoing summary of the invention and the following embodiments are not meant to limit the present invention to any specific embodiment, but only to describe some embodiments of the present invention.

The invention provides an electronic display assembly. In the various embodiments of the electronic display assembly described herein, the high-temperature air flow in the housing is brought to the inside of the heat exchanger. Ambient air in the external environment flows through the outside of the heat exchanger. Due to the heat exchange between the inside and the outside, the heat generated by the backlight module or the heat accumulated in the internal space of the electronic display assembly under sunlight exposure is transferred to the outside through the heat exchanger, thereby reducing the temperature of the electronic display assembly. The design of multiple pathways within the electronic display assembly allows heat to escape faster. In addition, the non-connection design between the inside and the outside of the heat exchanger is beneficial to prevent moisture and dust existing in the external environment from entering the housing, so the electronic display assembly is suitable for outdoor use.

FIG. 1 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention. As shown in FIG. 1, the electronic display assembly 1 includes a transparent plate 102, a liquid crystal panel 104, a backlight module 20, a housing 30, an airflow generator 42 and a heat exchanger 50. The transparent plate 102 is disposed in the display opening of the front part 30 s1 of the housing 30. The liquid crystal panel 104 is disposed between the transparent plate 102 and the backlight module 20. The backlight module 20 is disposed between the display unit 10 and the heat exchanger 50. The backlight module 20 may include an optical film 202 and a circuit board with one or more light sources 204 thereon. The light source 204 may be a plurality of LEDs, for example, to provide backlighting for the liquid crystal panel 104. The optical film 202 may be, for example, a light diffuser, a light reflector, a brightness enhancement film, or a combination of two or more of them.

The electronic display assembly 1 includes an internal heat exchange path Pin and an external heat dissipation path Pex. The ambient air flow AF flows through the external heat dissipation path Pex. In this embodiment, the internal heat exchange path Pin includes a path P1, a path P2, and a path P4. The passage P1 is arranged between the transparent plate 102 and the liquid crystal panel 104. The passage P2 is arranged between the liquid crystal panel 104 and the backlight module 20. That is, the internal air flow can pass through the front side and the back side of the liquid crystal panel 104 via the passages P1 and P2, respectively. The path P4 is directly arranged behind the backlight module 20. Specifically, the passage P4 is configured to be adjacently attached to the surface away from the light source 204. The passages P1, P2, and P4 are fluidly connected to the accommodating space S in the housing 30. That is, the flow of internal air can pass through the passages P1, P2, and P4 of the accommodating space S and the internal heat exchange path Pin.

The electronic display assembly 1 includes a wind flow generator 42. The air flow generator 42 is, for example, a fan, which is disposed in the containing space S of the housing 30 and is configured to generate an internal air flow flowing through the passages P1, P2, P4 and the containing space S to form an internal circulating air flow. It should be noted that the number of wind flow generators 42 is not limited to the embodiment of the present invention.

The electronic display assembly 1 further includes another wind flow generator 44. The wind flow generator 44 is, for example, a fan, which is used to generate an air flow through the external heat dissipation path Pex to bring the heat conducted by the heat exchanger 50 to the environment.

The heat exchanger 50 is provided in the installation opening of the rear part 30 s2 of the housing 30. The passage P4, the external heat dissipation path Pex, and the heat conducting portion 502 together form the heat exchanger 50. The heat conducting portion 502 is, for example, a metal plate made of aluminum. It should be noted that any air flow in the passage P4 is independent of the ambient air flow AF in the external heat dissipation path Pex.

The inside of the heat exchanger 50 is provided in the accommodating space S. The inner surface of the heat exchanger 50 is attached to the back side of the backlight module 20 so that the backlight module 20 and the heat exchanger 50 are in thermal contact. The passage P4 of the heat exchanger 50 is connected to the accommodation space S so that the air flow generated by the wind flow generator 42 in the housing 30 can pass through the passage P4 of the heat exchanger 50. The outside of the heat exchanger 50 protrudes from the mounting opening to the outside of the rear part 30s2 of the housing 30, and the external heat dissipation path Pex is fluidly connected with the external environment. In this embodiment, since the casing 30 isolates the passage P4 from the external environment and is set to be non-connected between the path P4 and the external heat dissipation path Pex, the ambient air flow AF cannot flow into the passage P4, and therefore the airflow in the casing 30 The air flow cannot flow out to the external heat dissipation path Pex.

The heat exchanger 50 according to the present embodiment is beneficial to dissipate the heat accumulated in the electronic display assembly 1, thereby reducing the temperature in the electronic display assembly 1. The heat accumulated in the electronic display assembly 1 mainly comes from two methods: one method is heat generated under sunlight exposure, and the other method is generated by the light source 204 of the backlight module 20 and/or other electronic components in the electronic display assembly 1. The heat. As shown in FIG. 1, the wind flow generator 42 generates a flow of air flowing through the passage P4. In addition, the air flows through the accommodating space S in the housing 30 and flows through the passages P1 and P2. It can be clearly seen from FIG. 1 that the air flow generated by the air flow generator 42 forms an internal circulating air flow. In detail, the heat generated by sunlight irradiating the transparent plate 102 and the liquid crystal panel 104 can be transferred to the air in the passages P1 and P2. During the heat exchange or the force of the wind flow generator 42, the high-temperature air flow HF moves from the passages P1 and P2 of the heat exchanger 50 to the passage P4 through the accommodation space S due to the characteristic of heat transfer from a high temperature to a low temperature, thereby Realize internal circulation air flow. Due to the connection between the passages P1 and P2 along the front side of the liquid crystal panel 104 and the passage P4 of the heat exchanger 50 along the back side of the liquid crystal panel 104, the high-temperature air flow HF caused by sunlight flows in the passages P1 and P2 and the heat The exchanger 50 flows between the passages P4.

The ambient air flow AF (for example, cold air) flows in the external heat dissipation path Pex of the heat exchanger 50. The high-temperature air flow HF in the passage P4 increases the internal temperature of the heat exchanger 50, and the ambient air flow AF in the external heat dissipation path Pex reduces the temperature outside the heat exchanger 50. Therefore, due to the thermal contact between the inside and the outside of the heat exchanger 50 via the heat conducting part 502, the heat generated by the sunlight and/or the backlight module 20 of the electronic display assembly 1 is transferred to the external environment through the heat exchanger 50, thereby reducing The temperature of the electronic display assembly 1 is shown.

It should be noted that the heat generated by sunlight irradiating the transparent plate 102 and the liquid crystal panel 104 or the heat generated by the light source 204 of the backlight module 20 or the heat generated by other electronic components is accumulated in the electronic display assembly 1. The heat exchanger 50 is mainly configured to dissipate heat accumulated in one or more components of the electronic display assembly 1. In this embodiment, the heat exchanger 50 equipped with the wind flow generator 42 is used for the heat dissipation of the transparent plate 102, the liquid crystal panel 104 and the backlight module 20, so as to reduce the overall temperature of the electronic display assembly 1. It should be noted that because there are two air passages on the front and back sides of the liquid crystal panel 104, the heat accumulated on the transparent plate 102 and the liquid crystal panel 104 by sunlight can be quickly guided to the inside of the heat exchanger 50. Due to the thermal contact between the inside and the outside of the heat exchanger 50 via the heat conducting part 502, the overall temperature of the electronic display assembly 1 can be reduced.

Figure 2 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention. As shown in FIG. 2, the electronic display assembly 2 includes a transparent plate 102, a liquid crystal panel 104, an optical film 106, a backlight module 20 ′, a housing 30, a wind flow generator 42 and a heat exchanger 50. The transparent plate 102 is disposed in the display opening of the front part 30 s1 of the housing 30. The liquid crystal panel 104 is disposed between the transparent plate 102 and the optical film 106. The backlight module 20 ′ is disposed between the optical film 106 and the heat exchanger 50. The backlight module 20' may include a printed circuit board (PCB) having one or more light sources 204 thereon. The light source 204 is disposed on the front side of the backlight module 20' (that is, facing the liquid crystal panel 104).

The electronic display assembly 2 includes an internal heat exchange path Pin and an external heat dissipation path Pex. The ambient air flow AF flows through the external heat dissipation path Pex. In this embodiment, the internal heat exchange path Pin includes a path P1, a path P3, and a path P4. The passage P1 is arranged between the transparent plate 102 and the liquid crystal panel 104. The passage P3 is disposed between the optical film 106 and the backlight module 20'. The path P4 is directly arranged behind the backlight module 20'. Specifically, the passage P4 is attached to the back side of the backlight module 20'. The passages P1, P3, and P4 are fluidly connected to the accommodating space S in the housing 30. That is, the internal air flow can pass through the passages P1, P3, and P4 of the accommodation space S and the internal heat exchange path Pin.

The electronic display assembly 2 further includes a wind flow generator 42. The air flow generator 42 is, for example, a fan, which is disposed in the containing space S of the housing 30 and is configured to generate an internal air flow flowing through the passages P1, P3, P4 and the containing space S to form an internal circulating air flow. It should be noted that the number of wind flow generators 42 is not limited to the embodiment of the present invention.

The electronic display assembly 2 further includes another wind flow generator 44. The wind flow generator 44 is, for example, a fan, which is used to generate an air flow through the external heat dissipation path Pex to bring the heat conducted by the heat exchanger 50 to the environment.

The heat exchanger 50 is provided in the installation opening of the rear part 30 s2 of the housing 30. The passage P4, the external heat dissipation path Pex, and the heat conducting portion 502 together form the heat exchanger 50. The heat conducting portion 502 is, for example, a metal plate made of aluminum. It should be noted that any air flow in the passage P4 is independent of the ambient air flow AF in the external heat dissipation path Pex.

The inside of the heat exchanger 50 is provided in the accommodating space S. The inside surface of the heat exchanger 50 is attached to the back side of the backlight module 20 ′ so that the backlight module 20 ′ is in thermal contact with the heat exchanger 50. The passage P4 of the heat exchanger 50 is connected to the accommodation space S so that the air flow generated by the wind flow generator 42 in the housing 30 can pass through the passage P4 of the heat exchanger 50. The outside of the heat exchanger 50 protrudes from the mounting opening to the outside of the rear part 30s2 of the housing 30, and the external heat dissipation path Pex is fluidly connected with the external environment. In this embodiment, since the casing 30 isolates the passage P4 from the external environment and is set to be non-connected between the path P4 and the external heat dissipation path Pex, the ambient air flow AF cannot flow into the passage P4, and therefore the airflow in the casing 30 The air flow cannot flow out to the external heat dissipation path Pex.

The heat exchanger 50 according to the present embodiment is beneficial to dissipate the heat accumulated in the electronic display assembly 2 so as to reduce the temperature in the electronic display assembly 2. The heat accumulated in the electronic display assembly 2 mainly comes from two ways: one way is heat generated under sunlight exposure, and the other way is by the light source 204 of the backlight module 20' and/or other electronic components in the electronic display assembly 2. The heat generated. As shown in FIG. 2, the wind flow generator 42 generates a flow of air flowing through the passage P4. In addition, the air flows through the accommodating space S in the housing 30 and flows through the passages P1 and P3. It can be clearly seen from FIG. 2 that the air flow generated by the air flow generator 42 forms an internal circulating air flow. In detail, the heat generated by sunlight irradiating the transparent plate 102 can be transferred to the air in the passage P1. In addition, the heat generated by the light source 204 and/or other electronic components of the backlight module 20' can be transferred to the passages P3 and P4. Due to the connection between the passage P4 of the heat exchanger 50, the passage P1 along the front side of the liquid crystal panel 104, and the passage P3 along the front side of the backlight module 20', the high-temperature air flow HF is between the passages P1, P3, and P4 flow.

The ambient air flow AF (for example, cold air) flows in the external heat dissipation path Pex of the heat exchanger 50. The high-temperature air flow HF in the passage P4 increases the internal temperature of the heat exchanger 50, and the ambient air flow AF in the external heat dissipation path Pex reduces the temperature outside the heat exchanger 50. Therefore, due to the thermal contact between the inside and the outside of the heat exchanger 50 via the heat conducting portion 502, the heat accumulated in the electronic display assembly 2 is transferred to the external environment through the heat exchanger 50, thereby reducing the temperature of the electronic display assembly 2.

It should be noted that, compared to the electronic display assembly 2 shown in FIG. 2, the heat generated by sunlight on the transparent plate 102 and the liquid crystal panel 104 of the electronic display assembly 1 shown in FIG. 1 can be dissipated more quickly , Because there are two air passages on the front and back sides of the liquid crystal panel 104. On the other hand, compared to the electronic display assembly 1 shown in FIG. 1, the heat generated by the light source 204 of the backlight module 20' of the electronic display assembly 2 shown in FIG. The light source 204 of the module 20' has two air passages on the front side and the back side.

Fig. 3 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention. As shown in FIG. 3, the electronic display assembly 3 includes a transparent plate 302, a liquid crystal panel 304, an optical film 306, a backlight module 308, a housing 30, an air flow generator 42 and a heat exchanger 50.

The transparent plate 302 is disposed in the display opening of the front part 30 s1 of the housing 30. The liquid crystal panel 304 is disposed between the transparent plate 302 and the optical film 306. The optical film 306 may be, for example, a light diffuser, a light reflector, or a brightness enhancement film, or a combination of two or more thereof, and is not limited thereto. The optical film 306 is disposed between the liquid crystal panel 304 and the backlight module 308. The backlight module 308 may include a printed circuit board (PCB) having one or more light sources 310 thereon. The light source 310 may be a plurality of LEDs, for example, to provide backlighting for the liquid crystal panel 304.

The electronic display assembly 3 includes an internal heat exchange path Pin and an external heat dissipation path Pex. The ambient air flow AF flows through the external heat dissipation path Pex. In this embodiment, the internal heat exchange path Pin includes a path P1, a path P2, a path P3, and a path P4. The passage P1 is arranged between the transparent plate 302 and the liquid crystal panel 304. The passage P2 is arranged between the liquid crystal panel 304 and the optical film 306. The passage P3 is disposed between the optical film 306 and the backlight module 308. The path P4 is directly arranged behind the backlight module 308. The passages P1, P2, P3, and P4 are fluidly connected to the accommodating space S in the housing 30. That is, the internal air flow (for example, the high-temperature air flow HF) can pass through the passages P1, P2, P3, and P4 of the accommodating space S and the internal heat exchange path Pin.

The air flow generator 42 is, for example, a fan, which is arranged in the containing space S of the housing 30 and is configured to generate an internal air flow flowing through the passages P1, P2, P3, and P4 and the containing space S to form an internal circulating air flow .

The electronic display assembly 3 further includes another wind flow generator 44. The wind flow generator 44 is, for example, a fan, which is used to generate an air flow through the external heat dissipation path Pex to bring the heat conducted by the heat exchanger 50 to the environment.

The heat exchanger 50 is provided in the installation opening of the rear part 30 s2 of the housing 30. The passage P4, the external heat dissipation path Pex, and the heat conducting portion 502 together form the heat exchanger 50.

The inside of the heat exchanger 50 is provided in the accommodating space S. The inner surface of the heat exchanger 50 is attached to the back side of the backlight module 308 so that the backlight module 308 is in thermal contact with the heat exchanger 50. The passage P4 of the heat exchanger 50 is connected to the accommodation space S so that the air flow generated by the wind flow generator 42 in the housing 30 can pass through the passage P4 of the heat exchanger 50. The outside of the heat exchanger 50 protrudes from the mounting opening to the outside of the rear part 30s2 of the housing 30, and the external heat dissipation path Pex is fluidly connected with the external environment. In this embodiment, since the casing 30 isolates the passage P4 from the external environment and is not connected between the passage P4 and the external heat dissipation path Pex, the ambient air flow AF cannot flow into the passage P4, and the air in the casing 30 Air cannot flow out to the external heat dissipation path Pex.

The heat exchanger 50 according to the present embodiment is beneficial to dissipate the heat accumulated in the electronic display assembly 3, thereby reducing the temperature in the electronic display assembly 3. The heat accumulated in the electronic display assembly 3 mainly comes from sunlight exposure or electronic components in the electronic display assembly 3, such as the light source 310 of the backlight module 308. As shown in FIG. 3, the wind flow generator 42 generates a flow of air flowing through the passage P4. In addition, the air flows through the accommodating space S in the housing 30 and flows through the passages P1, P2, and P3. It can be clearly seen from FIG. 3 that the air flow generated by the air flow generator 42 forms an internal circulating air flow. In detail, the heat generated by sunlight irradiating the transparent plate 302, the liquid crystal panel 304, and/or the optical film 306 can be transferred to the passages P1 and P2. In addition, the heat generated by the backlight module 308 or other electronic components can be transferred to the channels P3 and P4.

The ambient air flow AF (for example, cold air) flows into the external heat dissipation path Pex of the heat exchanger 50. The high-temperature air flow HF in the passage P4 increases the internal temperature of the heat exchanger 50, and the ambient air flow AF in the external heat dissipation path Pex reduces the temperature outside the heat exchanger 50. Therefore, due to the thermal contact between the inside and the outside of the heat exchanger 50 via the heat conducting portion 502, the heat accumulated in the housing 30 of the electronic display assembly 3 is transferred to the external environment through the heat exchanger 50, thereby reducing the electronic display assembly. 3 of the temperature.

It should be noted that, compared to the electronic display assembly 1 shown in FIG. 1 and the electronic display assembly 2 shown in FIG. 2, the heat accumulated in the electronic display assembly 3 can be dissipated more quickly because of the There are two air passages (ie, P1 and P2) on the front and back sides, and two air passages (ie, P3 and P4) on the front and back sides of the backlight module 308.

It should be noted that the gap of each passage P1, P2, P3, and P4 in the embodiment of the present invention can be appropriately adjusted based on actual needs, so that the internal circulating air flow can flow through the passages P1, P2, P3, and P4.

Various embodiments of the heat exchanger 50 are shown in the following paragraphs.

Figure 4A is a schematic diagram of a heat exchanger according to some embodiments of the present invention. 4A, the heat exchanger 50A can be attached to the backlight module (for example, the backlight module 20, 20' or 308) of the electronic display assembly (for example, the electronic display assembly 1, 2 or 3) to improve heat dissipation. .

The heat exchanger 50A includes an inner part L (for example, the left half of the broken line as shown in FIG. 4A) and an outer part R (for example, the right half of the broken line as shown in FIG. 4A). The inner side surface 50s1 of the inner portion L of the heat exchanger 50A is configured to be attached to the back side of the backlight module (ie, a surface away from the light-emitting surface), and the inner portion L has a heat dissipation channel CH1. The heat dissipation channel CH1 is connected with the accommodating space S of the electronic display assembly. In other words, the high-temperature air flow HF generated by the electronic display assembly can pass through the accommodating space S and the heat dissipation channel CH1. In addition, a plurality of heat sink fins (not shown in the figure) may be provided in the heat dissipation channel CH1.

The outer part R of the heat exchanger 50A is in thermal contact with the inner part L of the heat exchanger 50A. In this embodiment, the outer part R also has a heat dissipation channel CH2. The direction of the air flow of the internal air flowing through the heat dissipation channel CH1 and the direction of the air flow AF of the ambient air flowing through the heat dissipation channel CH2 are substantially parallel. The heat dissipation channel CH1 and the heat dissipation channel CH2 are not in fluid communication. Specifically, the high-temperature air flow HF passing through the heat dissipation channel CH1 does not flow into the heat dissipation channel CH2, and the ambient air flow AF passing through the heat dissipation channel CH2 does not flow into the heat dissipation channel CH1. The heat exchanger 50A is made of, for example, a thermally conductive material (for example, a metal material). Therefore, if the temperature in the heat dissipation channel CH1 is higher than the temperature in the heat dissipation channel CH2, the heat will be transferred from the heat dissipation channel CH1 to the heat dissipation channel CH2 through the metal plate between the heat dissipation channel CH1 and the heat dissipation channel.

Referring to FIGS. 1-3 and 4A, the heat exchanger 50A is disposed in the installation opening of the rear part 30s2 of the housing 30. Specifically, the inner portion L of the heat exchanger 50A (for example, the left half of the broken line as shown in FIG. 4A) is disposed in the containing space S in the housing 30 of the electronic display assembly 1, 2 or 3. The outer part R of the heat exchanger 50A (for example, the right half part of the dashed line as shown in FIG. 4A) protrudes from the installation opening to the outside of the rear part 30s2 of the housing 30. In this embodiment, the heat exchanger 50A is an integrated single piece. Therefore, it is advantageous for the simple manufacture of the heat exchanger 50A to reduce the cost and ensure proper thermal contact between the inner portion L and the outer portion R. It should be noted that the integrated heat exchanger 50A is not limited to the embodiment shown in the present invention. FIG. 4B is a schematic diagram of the separation components of the heat exchanger 50B according to some embodiments of the present invention. 4B, the inner part L and the outer part R are separate components, which can be assembled together to form a heat exchanger. Any suitable joining technique with a thermally conductive material can be used to attach the inner part L and the outer part R to each other.

Figure 5 is a schematic diagram of a heat exchanger according to some embodiments of the present invention. 5, the heat exchanger 50C can be attached to the backlight module (for example, the backlight module 20, 20' or 308) of the electronic display assembly (for example, the electronic display assembly 1, 2 or 3) to improve heat dissipation. . The heat exchanger 50C includes an inner part L (for example, the left half of the broken line as shown in FIG. 5) and an outer part R (for example, the right half of the broken line as shown in FIG. 5).

The heat exchanger 50C of FIG. 5 is similar to the heat exchanger 50A of FIG. 4A, and the difference between them lies in the number of heat dissipation channels. Specifically, the internal portion L of the heat exchanger 50C has a plurality of heat dissipation channels. In this embodiment, the inner portion L of the heat exchanger 50C has five heat dissipation channels. Similarly, the outer portion R of the heat exchanger 50C also has a plurality of heat dissipation channels. In this embodiment, the outer portion R of the heat exchanger 50C also has five heat dissipation channels. The direction of the air flow of the internal air flowing through the heat dissipation channel of the inner portion L is substantially parallel to the direction of the air flow AF of the ambient air flowing through the heat dissipation channel of the outside R. It should be noted that if the total heat dissipation area of the inner walls of the multiple heat dissipation channels of the inner part L and the outer part R of the heat exchanger 50C is greater than the total heat dissipation area of the inner walls of the heat dissipation channels CH1 and CH2 of the heat exchanger 50A, then The heat exchanger 50C shown in FIG. 5 has a better heat dissipation effect than the heat exchanger 50A shown in FIG. 4A.

It should be noted that the number of heat dissipation channels of the outer part R and the inner part L can be determined based on actual requirements, and is not limited to the present invention. In addition, the number of heat dissipation channels of the outer part R and the number of heat dissipation channels of the inner part L may be the same or different.

Furthermore, in some embodiments of the present invention, the cross-sectional area of each heat dissipation channel of the inner portion L and the cross-sectional area of each heat dissipation channel of the outer portion R are rectangular. It should be noted that the shape of the cross-sectional area of each heat dissipation channel can be, for example, a square, a rectangle, a circle, or an ellipse, and is not limited to the present invention.

Figure 6 is a schematic diagram of a heat exchanger according to some embodiments of the present invention. 6, the heat exchanger 50D can be attached to the backlight module (for example, the backlight module 20, 20' or 308) of the electronic display assembly (for example, the electronic display assembly 1, 2 or 3) to improve heat dissipation. . The heat exchanger 50D includes an inner part L (for example, the left half of the broken line as shown in FIG. 6) and an outer part R (for example, the right half of the broken line as shown in FIG. 6).

The heat exchanger 50D of FIG. 6 is similar to the heat exchanger 50A of FIG. Specifically, the direction of the air flow of the internal air flowing through the heat dissipation channel CH1 of the inner portion L is substantially perpendicular to the direction of the air flow AF of the ambient air flowing through the heat dissipation channel CH2' of the outside through R.

Fig. 7 is a schematic diagram of a heat exchanger according to some embodiments of the present invention. 7, the heat exchanger 50E can be attached to the backlight module (for example, the backlight module 20, 20' or 308) of the electronic display assembly (for example, the electronic display assembly 1, 2 or 3) to improve heat dissipation. . The heat exchanger 50E includes an inner part L (for example, the left half of the broken line as shown in FIG. 7) and an outer part R (for example, the right half of the broken line as shown in FIG. 7).

The heat exchanger 50E of FIG. 7 is similar to the heat exchanger 50D of FIG. 6, and the difference between them lies in the number of heat dissipation channels. Specifically, the internal portion L of the heat exchanger 50E has a plurality of heat dissipation channels. In this embodiment, the inner part L of the heat exchanger 50E has five heat dissipation channels CH11, CH12, CH13, CH14, and CH15. Similarly, the outer portion R of the heat exchanger 50E also has a plurality of heat dissipation channels. In this embodiment, the outer part R of the heat exchanger 50E also has five heat dissipation channels CH21, CH22, CH23, CH24, and CH25. The direction of the plurality of internal air flows AF flowing through the heat dissipation channel of the inner part L is substantially perpendicular to the direction of the plurality of ambient air flows AF flowing through the outer heat dissipation channel R. It should be noted that if the total heat dissipation area of the inner walls of the multiple heat dissipation channels of the inner part L and the outer part R of the heat exchanger 50E is greater than the total heat dissipation area of the inner walls of the heat dissipation channels CH1 and CH2' of the heat exchanger 50D, Then the heat exchanger 50E shown in FIG. 7 has a better heat dissipation effect than the heat exchanger 50D shown in FIG. 6.

It should be noted that the heat dissipation efficiency varies depending on the orientation of the heat dissipation channel. Please refer to Figure 7, the ambient air at the entrance of channels CH21, CH22, CH23, CH24, and CH25 is cooler than the ambient air at the exit of channels CH21, CH22, CH23, CH24, and CH25. Therefore, the heat carried by the air in the channel CH15 is dissipated faster than the heat carried by the air in the channel CH11. This is because the temperature difference between the air in the channel CH15 and the entrance of the channels CH21, CH22, CH23, CH24, and CH25 is much higher than the temperature difference between the air in the channel CH11 and the exit of the channels CH21, CH22, CH23, CH24, and CH25. Based on the above, the heat exchanger 50C may have better heat dissipation performance than the heat exchanger 50E; and the heat exchanger 50A may have better heat dissipation performance than the heat exchanger 50D.

FIG. 8 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention. The electronic display assembly 8 of FIG. 8 is similar to the electronic display assembly 1 of FIG. 1; therefore, only the differences are described below.

The electronic display assembly 8 includes a cover 60. The external heat dissipation path Pex is inside the cover 60. The wind flow generator 42 is provided in the housing 30. The wind flow generator 44 is provided outside the housing 30 and inside the cover 60, and the wind flow generator 44 corresponds to the external heat dissipation path Pex of the heat exchanger. The air flow generator 42 is configured to bring the high temperature air flow HF in the housing 30 into the passage P4. The air flow generator 44 is configured to bring the ambient air flow AF into the external heat dissipation path Pex.

Since the air flow generator 44 forces the air to move to generate the ambient air flow AF, it is beneficial to improve the heat exchange efficiency between the passage P4 and the external heat dissipation path Pex. In addition, since the cover 60 covers the external heat dissipation path Pex protruding from the housing 30, it is beneficial to the aesthetics of the electronic display assembly 8.

Unless the context clearly dictates otherwise, as used herein, the singular terms "a/an" and "the" may include plural referents. For example, unless the context clearly dictates otherwise, a reference to an electronic device may include multiple electronic devices.

As used herein, the term "connect/connected/connection" refers to operational coupling or linking. The connected components may be directly or indirectly coupled to each other, for example, via another component set.

In addition, sometimes amounts, ratios, and other numerical values are presented in a range format in this article. It should be understood that this type of range format is used for convenience and brevity, and should be flexibly understood to include not only the values expressly designated as range limits, but also all individual values or sub-ranges covered within that range, as Clearly specify that each value and sub-range are general.

Although the present invention has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations are not restrictive. Those familiar with the art should understand that various changes can be made and equivalents can be substituted without departing from the true spirit and scope of the present invention as defined by the scope of the appended patent application. The description does not have to be drawn to scale. Due to manufacturing procedures and tolerances, there may be a difference between the artistic reproduction in the present invention and the actual device. There may be other embodiments of the invention that are not specifically described. The description and drawings should be regarded as illustrative rather than restrictive. Modifications can be made to adapt specific situations, materials, material compositions, methods, or manufacturing processes to the goals, spirit, and scope of the present invention. All such modifications are intended to be within the scope of the patent application attached herewith. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalents without departing from the teachings of the present invention method. Therefore, unless otherwise specifically indicated herein, the order and grouping of operations is not a limitation of the present invention.

1: Electronic display components 2: Electronic display components 8: Electronic display components 20: Backlight module 20': Backlight module 30: shell 30s1: front 30s2: rear 42: Wind current generator 44: Wind flow generator 50: heat exchanger 50A: Heat exchanger 50B: Heat exchanger 50C: Heat exchanger 50D: Heat exchanger 50E: Heat exchanger 502: heat conduction part 50s1: inside surface 60: Hood 102: transparent board 104: LCD panel 106: Optical film 202: Optical Film 204: light source 302: Transparent board 304: LCD panel 306: Optical Film 308: Backlight module 310: light source AF: Ambient air flow CH1, CH2, CH2': heat dissipation channel CH11, CH12, CH13, CH14, CH15: heat dissipation channel CH21, CH22, CH23, CH24, CH25: heat dissipation channel HF: high temperature air flow L: Internal part P1: access P2: access P3: access P4: Access Pin: internal heat exchange path Pex: external heat dissipation path R: external part S: accommodation space

In order to better understand the essence and objectives of some embodiments of the present invention, the following embodiments combined with the drawings should be referred to. In the drawings, unless otherwise specified, the same or functionally same elements are given the same reference signs.

FIG. 1 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention.

Figure 2 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention.

Fig. 3 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention.

Figure 4A is a schematic diagram of a heat exchanger according to some embodiments of the present invention.

Fig. 4B is a schematic diagram of a separation assembly of a heat exchanger according to some embodiments of the present invention.

Figure 5 is a schematic diagram of a heat exchanger according to some embodiments of the present invention.

Figure 6 is a schematic diagram of a heat exchanger according to some embodiments of the present invention.

Fig. 7 is a schematic diagram of a heat exchanger according to some embodiments of the present invention.

FIG. 8 is a cross-sectional view of an electronic display assembly according to some embodiments of the present invention.

1: Electronic display assembly 20: Backlight module 30: Housing 30s1: Front 30s2: Rear 42: Wind flow generator 44: Wind flow generator 50: Heat exchanger 502: Heat conduction part 102: Transparent plate 104: Liquid crystal panel 202: Optical film 204: light source AF: ambient air flow HF: high temperature air flow P1: passage P2: passage P3 _: passage P4: passage Pex _: external heat dissipation path S: accommodation space

Claims (11)

An electronic display assembly, which includes: A backlight module; A transparent board; A liquid crystal panel arranged behind the transparent plate; An optical film arranged between the liquid crystal panel and the backlight module; An internal heat exchange path, which includes: A first passage, which is arranged between the transparent plate and the liquid crystal panel; A second passage, which is arranged between the liquid crystal panel and the optical film; A third passage, which is arranged between the optical film and the backlight module; A fourth channel, which is directly behind the backlight module, Wherein, the directions of the air flow inside one of the first passage, the second passage, and the third passage are all the same and parallel to each other; and An external heat dissipation path through which an ambient air flow flows, wherein the external heat dissipation path carries heat conducted by the air flowing through the fourth path. Such as the electronic display assembly of claim 1, wherein the fourth passage and the external heat dissipation path together form a heat exchanger with at least two passages. Such as the electronic display assembly of claim 2, wherein the switch further includes a plurality of external heat dissipation paths and a plurality of fourth paths. For the electronic display assembly of claim 2, wherein the direction of the air flow of the internal air flowing through the fourth passage is substantially perpendicular to the direction of the air flow of the ambient air flowing through the external heat dissipation path. The electronic display assembly of claim 1, wherein the direction of the internal air flow through the fourth passage is substantially parallel to the direction of the ambient air flow through the external heat dissipation path. For example, the electronic display assembly of claim 1, which further includes a housing, wherein the external heat dissipation path is outside the housing. For example, the electronic display assembly of claim 6, which further includes a cover, wherein the external heat dissipation path is inside the cover. Such as the electronic display assembly of claim 7, wherein the cover has an opening, so that the ambient air flow can pass through the external heat dissipation path through the opening. Such as the electronic display assembly of claim 1, which further includes an air flow generator configured to generate the internal air flow through the fourth passage. Such as the electronic display assembly of claim 9, wherein the wind flow generator is arranged around the fourth passage. The electronic display assembly of claim 1, wherein the direction of the flow of the internal air flowing through the first passage, the second passage, and the third passage is opposite to the direction of the flow of the internal air flowing through the fourth passage.

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