TWI747699B - Method for preparing laser-induced graphene - Google Patents

Method for preparing laser-induced graphene Download PDF

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TWI747699B
TWI747699B TW110100327A TW110100327A TWI747699B TW I747699 B TWI747699 B TW I747699B TW 110100327 A TW110100327 A TW 110100327A TW 110100327 A TW110100327 A TW 110100327A TW I747699 B TWI747699 B TW I747699B
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light source
laser light
graphene
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TW202227360A (en
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曾釋鋒
蔡語珊
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國立臺北科技大學
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Abstract

A method for preparing laser-induced graphene, comprising providing a substrate; and adjusting a laser light source and a far-infrared auxiliary light source to irradiate the substrate, and further forming a laser light-induced graphene on a surface of the substrate. By combining the technical features of the method with the far-infrared auxiliary light source, the present invention can effectively improve the defect and the electrical properties of the laser-induced graphene.

Description

製備雷射光誘發石墨烯的方法Method for preparing graphene induced by laser light

本發明係關於一種石墨烯的製備方法,尤其係一種以雷射光誘發石墨烯生成的製備方法。The present invention relates to a preparation method of graphene, in particular to a preparation method of graphene induced by laser light.

近年來,石墨烯(Graphene)奈米材料由於其獨特的物理及化學性質(例如:高表面積、高導電性、良好的機械強度等),以及其在生物、材料、能源和通訊等領域的應用潛能,而受到全世界的廣泛關注。以往來說,石墨烯常見的製備方法包括物理式機械剝離法、化學氣相沉積法等方式,通常會涉及高溫處理或者多步驟的化學合成,工藝較為繁雜且難以圖案化。In recent years, Graphene nanomaterials are due to their unique physical and chemical properties (such as high surface area, high conductivity, good mechanical strength, etc.), and their applications in the fields of biology, materials, energy, and communications. Potential, and received widespread attention from all over the world. In the past, common preparation methods for graphene include physical mechanical peeling, chemical vapor deposition, etc., which usually involve high-temperature processing or multi-step chemical synthesis, and the process is complicated and difficult to pattern.

直到2014年,雷射光誘發石墨烯(laser-induced graphene, LIG)以及相關的製法被提出,大大地改變了石墨烯製備工藝的生態。雷射誘發石墨烯係一種在普通大氣環境中,透過雷射光在碳基材上直接寫入的材料;該技術不但能將3D石墨烯的製備與圖案化結合,更是不需要傳統的濕化學步驟;顯著地降低了加工成本。其後,雷射光誘發石墨烯引發了廣泛的研究興趣;除了機制本身的探討之外,其在能源、傳感以及環境等領域的應用性也相當值得期待。Until 2014, laser-induced graphene (LIG) and related preparation methods were proposed, which greatly changed the ecology of the graphene preparation process. Laser-induced graphene is a material that is directly written on a carbon substrate through laser light in an ordinary atmospheric environment; this technology can not only combine the preparation of 3D graphene with patterning, but also does not require traditional wet chemistry Steps; significantly reduce processing costs. Since then, laser light-induced graphene has aroused extensive research interest; in addition to the discussion of the mechanism itself, its application in the fields of energy, sensing, and environment is also quite worth looking forward to.

然而,透過雷射光直寫而製成的雷射光誘發石墨烯,經拉曼光譜儀(Raman spectroscopy)測定後,時常發現具有較多缺損的情形。針對雷射光誘發石墨烯的缺損情形,本發明所屬領域的研究學者亦提出不同的解決方法,例如:調整碳基材或雷射光源的選擇、雷射光通過次數等。據此可以理解,如何調整雷射光誘發石墨烯製程,進而改善其缺損狀況係一本發明所屬領域中亟需被解決的一個問題。However, the laser light-induced graphene made by direct writing with laser light is often found to have many defects after being measured by Raman spectroscopy. Regarding the defect of graphene induced by laser light, researchers in the field of the present invention have also proposed different solutions, such as adjusting the choice of carbon substrate or laser light source, and the number of passes of the laser light. Based on this, it can be understood that how to adjust the laser light-induced graphene process to improve the defect status is a problem that needs to be solved urgently in the field of the present invention.

發明內容旨在提供本發明的簡化摘要,以令閱讀者對本發明具備基本的理解。此發明內容並非本發明的完整概述,且其用意並非指出本發明實施例的重要或關鍵元件或界定本發明的範圍。The summary of the invention aims to provide a simplified summary of the invention so that readers have a basic understanding of the invention. This summary is not a complete overview of the invention, and its intention is not to point out important or key elements of the embodiments of the invention or to define the scope of the invention.

有鑑於先前技術所提及的內容,本發明之主要目的即係提供一種製備雷射光誘發石墨烯的方法;其方法除了包括用於直寫的雷射光源以外,更包括遠紅外線輔助光源共同使用,進而製備出缺損情況較低而電性較佳之雷射光誘發石墨烯。In view of the content mentioned in the prior art, the main purpose of the present invention is to provide a method for preparing laser-induced graphene; the method includes not only the laser light source for direct writing, but also the common use of far-infrared auxiliary light sources. , And then prepare laser-induced graphene with lower defects and better electrical properties.

具體而言,本發明提供一種製備雷射光誘發石墨烯的方法,其包括下列步驟。首先,提供一基材;接著,調整一雷射光源以及一遠紅外線輔助光源照射該基材,進而於該基材之一表面上形成一雷射光誘發石墨烯。 根據本發明的一些實施方式,該基材包括一聚合物;且進一步而言,該聚合物係一聚醯亞胺(PI, Polyimide) 或一聚醚酰亞胺(PEI, Polyetherimide)。 Specifically, the present invention provides a method for preparing laser light-induced graphene, which includes the following steps. First, a substrate is provided; then, a laser light source and a far-infrared auxiliary light source are adjusted to irradiate the substrate, and then a laser light-induced graphene is formed on a surface of the substrate. According to some embodiments of the present invention, the substrate includes a polymer; and further, the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide).

根據本發明的一些實施方式,該基材的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。According to some embodiments of the present invention, the form of the substrate is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof.

根據本發明的一些實施方式,該雷射光源為CO 2雷射光源、UV雷射光源、可見光雷射光源或光纖雷射光源。 According to some embodiments of the present invention, the laser light source is a CO 2 laser light source, a UV laser light source, a visible light laser light source, or a fiber laser light source.

根據本發明的一些實施方式,調整該雷射光源包括調節該雷射光源之一個或多個參數;且進一步而言,該雷射光源之一個或多個參數係雷射光波長、雷射光功率、雷射光能量密度、該雷射光源與該基材之距離、雷射光頻率、雷射掃描速率、雷射掃描路徑、雷射掃描路徑間距或其任意組合。According to some embodiments of the present invention, adjusting the laser light source includes adjusting one or more parameters of the laser light source; and further, the one or more parameters of the laser light source are laser light wavelength, laser light power, The energy density of the laser light, the distance between the laser light source and the substrate, the frequency of the laser light, the laser scanning rate, the laser scanning path, the distance between the laser scanning paths, or any combination thereof.

根據本發明的一些實施方式,調整該遠紅外線輔助光源包括調節該遠紅外線輔助光源之一個或多個參數;且進一步而言,該遠紅外線輔助光源之一個或多個參數係遠紅外線輔助光源功率、該遠紅外線輔助光源與該基材之距離或其任意組合。According to some embodiments of the present invention, adjusting the far-infrared auxiliary light source includes adjusting one or more parameters of the far-infrared auxiliary light source; and further, the one or more parameters of the far-infrared auxiliary light source are far-infrared auxiliary light source power , The distance between the far-infrared auxiliary light source and the substrate or any combination thereof.

根據本發明的一些實施方式,該雷射光誘發石墨烯係單層石墨烯、多層石墨烯、多孔石墨烯、未官能化石墨烯、官能化石墨烯或其任意組合。According to some embodiments of the present invention, the laser light-induced graphene is a single-layer graphene, a multi-layer graphene, a porous graphene, an unfunctionalized graphene, a functionalized graphene, or any combination thereof.

為了使本發明的敘述更加詳盡與完備,下文針對了本發明的實施態樣與具體實施例提出了說明性的描述,但這並非實施或運用本發明具體實施例的唯一形式。在本說明書及後附之申請專利範圍中,除非上下文另外載明,否則「一」及「該」亦可解釋為複數。此外,在本說明書及後附之申請專利範圍中,除非另外載明,否則「設置於某物之上」可視為直接或間接以貼附或其他形式與某物之表面接觸,該表面之界定應視說明書內容之前後/段落語意以及本說明所屬領域之通常知識予以判斷。In order to make the description of the present invention more detailed and complete, the following provides an illustrative description for the implementation aspects and specific embodiments of the present invention, but this is not the only way to implement or use the specific embodiments of the present invention. In the scope of this specification and the appended patent application, unless the context clarifies otherwise, "a" and "the" can also be interpreted as plurals. In addition, in the scope of this specification and the appended patent application, unless otherwise stated, "installed on something" can be regarded as directly or indirectly in contact with the surface of something by attaching or other forms. The definition of the surface It should be judged based on the semantics of the preceding and following/paragraphs of the description and the general knowledge of the field to which this description belongs.

雖然用於界定本發明的數值範圍與參數皆是約略的數值,此處已盡可能精確地呈現具體實施例中的相關數值。然而,任何數值本質上不可避免地含有因個別測試方法所致的標準偏差。在此處,「約」通常係指實際數值在一特定數值或一範圍的正負10%、5%、1%或0.5%之內。或者是,「約」一詞代表實際數值落在平均值的可接受標準誤差之內,是本發明所屬領域中具有通常知識者的考量而定。因此,除非另有相反的說明,本說明書與附隨申請專利範圍所揭示的數值參數皆為約略的數值,且可視需求而更動。至少應將這些數值參數理解為所指出的有效位數與套用一般進位法所得到的數值。Although the numerical ranges and parameters used to define the present invention are approximate numerical values, the relevant numerical values in the specific embodiments have been presented here as accurately as possible. However, any value inherently inevitably contains standard deviations due to individual test methods. Here, "about" usually means that the actual value is within plus or minus 10%, 5%, 1%, or 0.5% of a specific value or a range. Or, the word "about" means that the actual value falls within the acceptable standard error of the average value, which is determined by those with ordinary knowledge in the field of the present invention. Therefore, unless otherwise stated to the contrary, the numerical parameters disclosed in this specification and the accompanying patent scope are approximate values and can be changed according to requirements. At least these numerical parameters should be understood as the indicated effective number of digits and the value obtained by applying the general carry method.

定義definition

雷射光誘發石墨烯(laser-induced graphene, LIG),係意謂在一大氣常壓且常溫的環境之下,以一雷射光直寫(direct writing)於一碳基材上所製成的石墨烯。Laser-induced graphene (LIG) refers to graphite made by direct writing of a laser light on a carbon substrate under a normal atmospheric pressure and normal temperature environment. Ene.

拉曼光譜(Raman spectra)係意謂一種振動光譜,原理係利用固定波長的雷射光源激發待測樣品,當激發光與樣品分子作用時,如果光子與分子碰撞後光子與分子碰撞後發生了能量交換,則光子將一部分能量傳遞給了樣品分子或從樣品分子獲得一部分能量,從而改變了光的頻率;該變化即為拉曼位移(Raman shift)。拉曼位移的多寡不會因為雷射波長而改變,因此可以用來了解分子鍵結與結構,還可以進一步了解分子所處環境,例如:樣品中的雜質會因為應力(Stress)與張力(Strain)使得鍵結發生變化並反應在拉曼位移;化合物的不同狀態的形變,例如:加熱或是外力所引起的熔化與結晶,亦會有所影響。Raman spectra means a kind of vibrational spectroscopy. The principle is to use a laser light source with a fixed wavelength to excite the sample to be tested. When the excitation light interacts with the sample molecule, if the photon collides with the molecule, the collision occurs after the photon collides with the molecule. Energy exchange, the photon transfers part of the energy to the sample molecule or obtains a part of the energy from the sample molecule, thereby changing the frequency of the light; this change is the Raman shift. The amount of Raman shift does not change due to the wavelength of the laser, so it can be used to understand the molecular bonding and structure, and it can also further understand the environment of the molecule. For example, the impurities in the sample can be caused by stress and strain. ) Causes the bond to change and react in the Raman shift; the deformation of the compound in different states, such as melting and crystallization caused by heating or external force, will also have an impact.

實施方法Method of implementation

為解決在先前技術的基礎上所發現的問題,本發明提出一種製備雷射光誘發石墨烯的方法。第1圖係依據本發明之實施例所繪示的方法流程圖;如第1圖所示,該製備雷射光誘發石墨烯的方法包含步驟S1-S2。首先,步驟S1係提供一基材;接續,步驟S2係調整一雷射光源以及一遠紅外線輔助光源照射該基材,進一步於該基材之一表面上形成一雷射光誘發石墨烯。藉由該方法中搭配照射遠紅外線輔助光源的技術特徵,本發明得以有效地改善雷射光誘發石墨烯的缺損情形以及電性。In order to solve the problems found on the basis of the prior art, the present invention proposes a method for preparing laser light-induced graphene. Fig. 1 is a flowchart of a method according to an embodiment of the present invention; as shown in Fig. 1, the method for preparing laser-induced graphene includes steps S1-S2. First, step S1 is to provide a substrate; next, step S2 is to adjust a laser light source and a far-infrared auxiliary light source to irradiate the substrate, and further form a laser light-induced graphene on a surface of the substrate. By combining the technical features of the method with the far-infrared auxiliary light source, the present invention can effectively improve the defect and electrical properties of the graphene induced by laser light.

具體而言,在步驟S2當中,調整該雷射光源係包括調節該雷射光源之一個或多個參數;更進一步來說,該一個或多個參數係雷射光波長、雷射光功率、雷射光能量密度、該雷射光源與該基材之距離、雷射光頻率、雷射掃描速率、雷射掃描路徑、雷射掃描路徑間距或者其任意組合。Specifically, in step S2, adjusting the laser light source includes adjusting one or more parameters of the laser light source; furthermore, the one or more parameters are laser light wavelength, laser light power, laser light The energy density, the distance between the laser light source and the substrate, the frequency of the laser light, the laser scanning rate, the laser scanning path, the distance between the laser scanning paths, or any combination thereof.

另一方面,在步驟S2當中,調整該遠紅外線輔助光源包括調節該遠紅外線輔助光源之一個或多個參數;更進一步來說,該遠紅外線輔助光源之一個或多個參數係遠紅外線輔助光源功率、該遠紅外線輔助光源與該基材之距離或其任意組合。On the other hand, in step S2, adjusting the far-infrared auxiliary light source includes adjusting one or more parameters of the far-infrared auxiliary light source; further speaking, one or more parameters of the far-infrared auxiliary light source are far-infrared auxiliary light sources Power, the distance between the far-infrared auxiliary light source and the substrate, or any combination thereof.

又,在步驟S2當中,該雷射光誘發石墨烯係單層石墨烯、多層石墨烯、多孔石墨烯、未官能化石墨烯、官能化石墨烯或其任意組合。In addition, in step S2, the laser light induced graphene-based single-layer graphene, multi-layer graphene, porous graphene, unfunctionalized graphene, functionalized graphene, or any combination thereof.

第2A圖係依據本發明之實施例所繪示的雷射直寫系統示意圖,而第2B及2C圖係依據第2A圖所繪示的光斑示意圖。請共同參閱第1-2C圖,一雷射光源100以一遠心透鏡102朝向一平檯110設置,該平檯110面向該遠心透鏡102之一面上置有一基材120,而該基材120與該遠心透鏡102之間為一距離Z1。同時,一遠紅外線輔助光源130朝向該基材120設置,用以照射該基材120。FIG. 2A is a schematic diagram of a laser direct writing system according to an embodiment of the present invention, and FIGS. 2B and 2C are schematic diagrams of a light spot according to FIG. 2A. Please refer to Figs. 1-2C together. A laser light source 100 is arranged with a telecentric lens 102 facing a platform 110. A substrate 120 is placed on a surface of the platform 110 facing the telecentric lens 102, and the substrate 120 and the There is a distance Z1 between the telecentric lenses 102. At the same time, a far-infrared auxiliary light source 130 is arranged toward the substrate 120 to illuminate the substrate 120.

具體而言,該雷射光源100用以發射一雷射光線,該雷射光線穿過該遠心透鏡102後照射於該基材120的表面上,進而形成複數光斑122。然而該雷射光線基本上係聚焦於一焦平面112上,且該焦平面112距離該遠心透鏡102為一距離Z2。據此可以理解,若該距離Z2等於該距離Z1時,該雷射光線將在該基材120的表面上刻劃出如第2B圖所示的光斑態樣;而若該距離Z1的長度小於該距離Z2,換言之即為上離焦狀態時,該雷射光線則將在該基材120的表面刻劃出如第2C圖所示的光斑態樣。另一方面,該平檯110可實質地沿X及Y軸移動,因此相應地可以定義一雷射掃描速率;藉此,該複數光斑122不但可進一步依據該雷射掃描速率形成特定的雷射掃描路徑態樣,該複數光斑122個別圓心之間亦可界定一雷射掃描路徑間距124。 細部而言,該基材120的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。又,該基材120包括一聚合物;且較佳地,該聚合物係一聚醯亞胺(PI, Polyimide)或一聚醚酰亞胺(PEI, Polyetherimide)。另外,該雷射光源100為CO 2雷射光源、UV雷射光源、可見光雷射光源或是光纖雷射光源;較佳地,該雷射光源100係一 UV雷射光源,又更佳地,其係一UV奈秒脈衝雷射。 Specifically, the laser light source 100 is used to emit a laser light, which passes through the telecentric lens 102 and irradiates the surface of the substrate 120 to form a plurality of light spots 122. However, the laser light is basically focused on a focal plane 112, and the focal plane 112 is a distance Z2 from the telecentric lens 102. Based on this, it can be understood that if the distance Z2 is equal to the distance Z1, the laser light will mark the surface of the substrate 120 as shown in Figure 2B; and if the length of the distance Z1 is less than When the distance Z2, in other words, is in the up-defocus state, the laser light will mark the surface of the substrate 120 with a spot pattern as shown in FIG. 2C. On the other hand, the platform 110 can substantially move along the X and Y axes, so a laser scanning rate can be defined accordingly; thereby, the complex number of spots 122 can not only further form a specific laser based on the laser scanning rate In the scanning path aspect, a laser scanning path distance 124 can also be defined between the individual circle centers of the plurality of light spots 122. In detail, the form of the substrate 120 is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof. In addition, the substrate 120 includes a polymer; and preferably, the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide). In addition, the laser light source 100 is a CO 2 laser light source, a UV laser light source, a visible light laser light source, or a fiber laser light source; preferably, the laser light source 100 is a UV laser light source, and more preferably , Which is a UV nanosecond pulse laser.

以下所描述的內容,主要係關於第一到第四實施例中製備的雷射光誘發石墨烯之測定結果。需要特別說明的是,本發明所屬技藝領域中具有通常知識者應當可以理解,以拉曼光譜儀對石墨烯進行測定而產生的拉曼頻譜圖中,需要特別注意G、D以及2D峰。其中,G峰一般呈現於拉曼位移大約為1580公分 -1的位置;其代表的係石墨烯當中sp 2鍵結的振動模式,觀察者可藉其了解樣品sp 2鍵結完整度,進而推知樣品的結晶特性;位於大約1270-1450公分 -1位置的D峰則係表達樣品缺陷、非晶質碳或是石墨邊緣的特性;而2D峰的產生則與石墨的層數有密切相關性。 The content described below is mainly related to the measurement results of the laser light-induced graphene prepared in the first to fourth embodiments. It should be particularly noted that those with ordinary knowledge in the technical field of the present invention should understand that in the Raman spectrogram generated by measuring graphene with a Raman spectrometer, special attention should be paid to the G, D, and 2D peaks. Among them, the G peak generally appears at the position where the Raman shift is about 1580 cm-1 ; it represents the vibration mode of the sp 2 bonding in graphene, and the observer can use it to understand the integrity of the sp 2 bonding of the sample, and then infer The crystalline characteristics of the sample; the D peak located at about 1270 to 1450 cm-1 expresses the characteristics of sample defects, amorphous carbon or graphite edges; and the generation of 2D peaks is closely related to the number of graphite layers.

基於上述內容,在本實施例中若欲判讀石墨烯樣品的材料特性,可分別參酌D峰強度/G峰強度(以下稱為I D/I G)的值以及2D峰強度/G峰強度(以下稱為I 2D/I G)的值。I 2D/I G值越高即代表石墨烯樣品的缺陷程度亦越高。I 2D/I G值則用以判別石墨烯樣品層數。當其值介於1.5-2之間時,表示樣品為單層石墨烯;而當其值小於1時,即表示樣品為多層石墨烯。 Based on the foregoing, in the present embodiment, the material properties of graphene Ruoyu interpretation of samples, respectively, taking into account any peak intensity D / G peak intensity (hereinafter, referred to as I D / I G) of the peak intensity value and the 2D / G peak intensity ( Hereinafter, it is referred to as the value of I 2D /I G ). The higher the I 2D / IG value, the higher the defect degree of the graphene sample. The I 2D /I G value is used to determine the number of graphene sample layers. When its value is between 1.5-2, it means that the sample is single-layer graphene; when its value is less than 1, it means that the sample is multi-layer graphene.

第一實施例The first embodiment

該雷射光源100為CO 2雷射光源、UV雷射光源、可見光雷射光源或是光纖雷射光源;依據第一實施例而言,該雷射光源100係一UV奈秒脈衝雷射,且該雷射光源100之功率經調整為3W。據此,該距離Z1可調整為15000-20000μm之間並成上離焦狀態(以UV雷射之焦距而言,該距離Z2係介於20000-30000μm之間);且依據第一實施例而言,該距離Z1為17000μm。除此之外,該雷射光源之頻率為100kHZ;該雷射掃描路徑間距124為0.05mm;而該雷射掃描速率可調整為50-150mm/s之間,依據第一實施例而言,該雷射掃描速率為100mm/s。 The laser light source 100 is a CO 2 laser light source, a UV laser light source, a visible light laser light source or a fiber laser light source; according to the first embodiment, the laser light source 100 is a UV nanosecond pulse laser, And the power of the laser light source 100 is adjusted to 3W. Accordingly, the distance Z1 can be adjusted to be between 15000-20000μm and be in a defocused state (in terms of the focal length of the UV laser, the distance Z2 is between 20000-30000μm); and according to the first embodiment In other words, the distance Z1 is 17000 μm. In addition, the frequency of the laser light source is 100kHZ; the distance between the laser scanning paths 124 is 0.05mm; and the laser scanning rate can be adjusted between 50-150mm/s. According to the first embodiment, The laser scanning rate is 100mm/s.

另一方面,該基材120的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。又,該基材120包括一聚合物,且該聚合物係一聚醯亞胺(PI, Polyimide)或一聚醚酰亞胺(PEI, Polyetherimide);依據第一實施例而言,該聚合物係一聚醯亞胺(PI, Polyimide)。On the other hand, the form of the substrate 120 is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof. In addition, the substrate 120 includes a polymer, and the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide); according to the first embodiment, the polymer It is a polyimide (PI, Polyimide).

接著分別針對採用以及未採用該遠紅外線輔助光源130而製成的雷射光誘發石墨烯,進行拉曼光譜分析(採用以及未採用的結果分別如第3A圖以及第3B圖所示)以及電性分析。其中,該遠紅外線輔助光源130之功率係介於200-400W之間;依據第一實施例而言,其係300W。如第3A及3B圖所示,未採用該遠紅外線輔助光源130之I D/I G值為1.185,I 2D/I G值為0.737;採用該遠紅外線輔助光源130之I D/I G值為1.005,I 2D/I G值為0.789。據此可以理解,在採用該遠紅外線輔助光源130之情形下,石墨烯缺損程度明顯下降;而兩種情形下所產生的皆為多層石墨烯。此外,以電性結果而言,在未採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為17Ω,而在採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為16Ω,呈現出較佳的電性。 Then, Raman spectroscopy is performed on the laser light-induced graphene made with and without the far-infrared auxiliary light source 130 (the results of using and not using the far-infrared auxiliary light source 130 are shown in Figure 3A and Figure 3B, respectively) and electrical properties analyze. Wherein, the power of the far-infrared auxiliary light source 130 is between 200-400W; according to the first embodiment, it is 300W. As shown in section 3A and FIG. 3B, the far-infrared is not used auxiliary light source 130 of the I D / I G is 1.185, I 2D / I G is 0.737; using the far infrared auxiliary light source 130. I D / I G value of 1.005, I 2D / I G value of 0.789. Based on this, it can be understood that when the far-infrared auxiliary light source 130 is used, the degree of graphene defect is significantly reduced; and in both cases, multilayer graphene is produced. In addition, in terms of electrical results, when the far-infrared auxiliary light source 130 is not used, the resistance value of graphene is 17Ω, and when the far-infrared auxiliary light source 130 is used, the resistance value of graphene is 16Ω , Showing better electrical properties.

第二實施例Second embodiment

該雷射光源100為CO 2雷射光源、UV雷射光源、可見光雷射光源或是光纖雷射光源;依據第二實施例而言,該雷射光源100係一UV奈秒脈衝雷射,且該雷射光源100之功率經調整為3W。據此,該距離Z1可調整為15000-20000μm之間並成上離焦狀態(以UV雷射之焦距而言,該距離Z2係介於20000-30000μm之間);且依據第二實施例而言,該距離Z1為17000μm。除此之外,該雷射光源之頻率為100kHZ;該雷射掃描路徑間距124為0.05mm;而該雷射掃描速率可調整為50-150mm/s之間,依據第二實施例而言,該雷射掃描速率為125mm/s。 另一方面,該基材120的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。又,該基材120包括一聚合物,且該聚合物係一聚醯亞胺(PI, Polyimide)或一聚醚酰亞胺(PEI, Polyetherimide);依據第二實施例而言,該聚合物係一聚醯亞胺(PI, Polyimide)。 The laser light source 100 is a CO 2 laser light source, a UV laser light source, a visible light laser light source or a fiber laser light source; according to the second embodiment, the laser light source 100 is a UV nanosecond pulse laser, And the power of the laser light source 100 is adjusted to 3W. Accordingly, the distance Z1 can be adjusted to be between 15000-20000μm and be in a defocused state (in terms of the focal length of the UV laser, the distance Z2 is between 20000-30000μm); and according to the second embodiment In other words, the distance Z1 is 17000 μm. In addition, the frequency of the laser light source is 100kHZ; the distance between the laser scanning paths 124 is 0.05mm; and the laser scanning rate can be adjusted between 50-150mm/s. According to the second embodiment, The laser scanning rate is 125mm/s. On the other hand, the form of the substrate 120 is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof. In addition, the substrate 120 includes a polymer, and the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide); according to the second embodiment, the polymer It is a polyimide (PI, Polyimide).

接著分別針對採用以及未採用該遠紅外線輔助光源130而製成的雷射光誘發石墨烯,進行拉曼光譜分析(採用以及未採用的結果分別如第4A圖以及第4B圖所示)以及電性分析。其中,該遠紅外線輔助光源130之功率係介於200-400W之間;依據第二實施例而言,其係300W。如第4A及4B圖所示,未採用該遠紅外線輔助光源130之I D/I G值為1.125,I 2D/I G值為0.747;採用該遠紅外線輔助光源130之I D/I G值為1.063,I 2D/I G值為0.738。據此可以理解,在採用該遠紅外線輔助光源130之情形下,石墨烯缺損程度明顯下降;而兩種情形下所產生的皆為多層石墨烯。此外,以電性結果而言,在未採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為22Ω,而在採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為19Ω,呈現出較佳的電性。 Then, Raman spectroscopy analysis was performed on the laser light-induced graphene made with and without the far-infrared auxiliary light source 130 (the results of using and not using the far-infrared auxiliary light source 130 are shown in Figure 4A and Figure 4B, respectively) and electrical properties analyze. Wherein, the power of the far-infrared auxiliary light source 130 is between 200-400W; according to the second embodiment, it is 300W. As shown in FIG. 4A and FIG. 4B are not on the far-infrared auxiliary light source 130. I D / I G is 1.125, I 2D / I G is 0.747; using the far infrared auxiliary light source 130. I D / I G value of 1.063, I 2D / I G value of 0.738. Based on this, it can be understood that when the far-infrared auxiliary light source 130 is used, the degree of graphene defect is significantly reduced; and in both cases, multilayer graphene is produced. In addition, in terms of electrical results, when the far-infrared auxiliary light source 130 is not used, the resistance value of graphene is 22Ω, and when the far-infrared auxiliary light source 130 is used, the resistance value of graphene is 19Ω , Showing better electrical properties.

第三實施例The third embodiment

該雷射光源100為CO 2雷射光源、UV雷射光源、可見光雷射光源或是光纖雷射光源;依據第三實施例而言,該雷射光源100係一UV奈秒脈衝雷射,且該雷射光源100之功率經調整為4W。據此,該距離Z1可調整為15000-20000μm之間並成上離焦狀態(以UV雷射之焦距而言,該距離Z2係介於20000-30000μm之間);且依據第三實施例而言,該距離Z1為17000μm。除此之外,該雷射光源之頻率為100kHZ;該雷射掃描路徑間距124為0.05mm;而該雷射掃描速率可調整為50-150mm/s之間,依據第三實施例而言,該雷射掃描速率為50mm/s。 另一方面,該基材120的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。又,該基材120包括一聚合物,且該聚合物係一聚醯亞胺(PI, Polyimide)或一聚醚酰亞胺(PEI, Polyetherimide);依據第三實施例而言,該聚合物係一聚醯亞胺(PI, Polyimide)。 The laser light source 100 is a CO 2 laser light source, a UV laser light source, a visible light laser light source or a fiber laser light source; according to the third embodiment, the laser light source 100 is a UV nanosecond pulse laser, And the power of the laser light source 100 is adjusted to 4W. Accordingly, the distance Z1 can be adjusted to be between 15000-20000μm and be in a defocused state (in terms of the focal length of the UV laser, the distance Z2 is between 20000-30000μm); and according to the third embodiment In other words, the distance Z1 is 17000 μm. In addition, the frequency of the laser light source is 100kHZ; the distance between the laser scanning paths 124 is 0.05mm; and the laser scanning rate can be adjusted between 50-150mm/s. According to the third embodiment, The laser scanning rate is 50mm/s. On the other hand, the form of the substrate 120 is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof. In addition, the substrate 120 includes a polymer, and the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide); according to the third embodiment, the polymer It is a polyimide (PI, Polyimide).

接著分別針對採用以及未採用該遠紅外線輔助光源130而製成的雷射光誘發石墨烯,進行拉曼光譜分析(採用以及未採用的結果分別如第5A圖以及第5B圖所示)以及電性分析。其中,該遠紅外線輔助光源130之功率係介於200-400W之間;依據第三實施例而言,其係300W。如第5A及5B圖所示,未採用該遠紅外線輔助光源130之I D/I G值為0.778,I 2D/I G值為0.690;採用該遠紅外線輔助光源130之I D/I G值為0.687,I 2D/I G值為0.832。據此可以理解,在採用該遠紅外線輔助光源130之情形下,石墨烯缺損程度明顯下降;而兩種情形下所產生的皆為多層石墨烯。此外,以電性結果而言,在未採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為12Ω,而在採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為10Ω,呈現出較佳的電性。 Then, Raman spectroscopy is performed on the laser light-induced graphene made with and without the far-infrared auxiliary light source 130 (the results of using and not using the far-infrared auxiliary light source 130 are shown in Figure 5A and Figure 5B, respectively) and electrical properties analyze. Wherein, the power of the far-infrared auxiliary light source 130 is between 200-400W; according to the third embodiment, it is 300W. 5A and 5B as in the first shown in FIG not using the far-infrared auxiliary light source 130. I D / I G is 0.778, I 2D / I G is 0.690; using the far infrared auxiliary light source 130. I D / I G value of 0.687, I 2D / I G value of 0.832. Based on this, it can be understood that when the far-infrared auxiliary light source 130 is used, the degree of graphene defect is significantly reduced; and in both cases, multilayer graphene is produced. In addition, in terms of electrical results, when the far-infrared auxiliary light source 130 is not used, the resistance value of graphene is 12Ω, and when the far-infrared auxiliary light source 130 is used, the resistance value of graphene is 10Ω , Showing better electrical properties.

第四實施例Fourth embodiment

該雷射光源100為CO 2雷射光源、UV雷射光源、可見光雷射光源或是光纖雷射光源;依據第四實施例而言,該雷射光源100係一UV奈秒脈衝雷射,且該雷射光源100之功率經調整為5W。據此,該距離Z1可調整為15000-20000μm之間並成上離焦狀態(以UV雷射之焦距而言,該距離Z2係介於20000-30000μm之間);且依據第四實施例而言,該距離Z1為17000μm。除此之外,該雷射光源之頻率為100kHZ;該雷射掃描路徑距離124為0.05mm;而該雷射掃描速率可調整為50-150mm/s之間,依據第四實施例而言,該雷射掃描速率為50mm/s。 The laser light source 100 is a CO 2 laser light source, a UV laser light source, a visible light laser light source or a fiber laser light source; according to the fourth embodiment, the laser light source 100 is a UV nanosecond pulse laser, And the power of the laser light source 100 is adjusted to 5W. Accordingly, the distance Z1 can be adjusted to be between 15000-20000μm and be in a defocused state (in terms of the focal length of the UV laser, the distance Z2 is between 20000-30000μm); and according to the fourth embodiment In other words, the distance Z1 is 17000 μm. In addition, the frequency of the laser light source is 100kHZ; the laser scanning path distance 124 is 0.05mm; and the laser scanning rate can be adjusted between 50-150mm/s. According to the fourth embodiment, The laser scanning rate is 50mm/s.

另一方面,該基材120的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合。又,該基材120包括一聚合物,且該聚合物係一聚醯亞胺(PI, Polyimide)或一聚醚酰亞胺(PEI, Polyetherimide);依據第一實施例而言,該聚合物係一聚醯亞胺(PI, Polyimide)。On the other hand, the form of the substrate 120 is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof. In addition, the substrate 120 includes a polymer, and the polymer is a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide); according to the first embodiment, the polymer It is a polyimide (PI, Polyimide).

接著分別針對採用以及未採用該遠紅外線輔助光源130而製成的雷射光誘發石墨烯,進行拉曼光譜分析(採用以及未採用的結果分別如第6A圖以及第6B圖所示)以及電性分析。其中,該遠紅外線輔助光源130之功率係介於200-400W之間;依據第四實施例而言,其係300W。如第6A及6B圖所示,未採用該遠紅外線輔助光源130之I D/I G值為0.729,I 2D/I G值為0.801;採用該遠紅外線輔助光源130之I D/I G值為0.587,I 2D/I G值為0.803。據此可以理解,在採用該遠紅外線輔助光源130之情形下,石墨烯缺損程度明顯下降;而兩種情形下所產生的皆為多層石墨烯。此外,以電性結果而言,在未採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為34Ω,而在採用該遠紅外線輔助光源130之情形下,石墨烯的電阻值為12Ω,呈現出較佳的電性。 Then, Raman spectroscopy is performed on the laser light-induced graphene made with and without the far-infrared auxiliary light source 130 (the results of using and not using the far-infrared auxiliary light source 130 are shown in Figure 6A and Figure 6B respectively) and electrical properties analyze. Wherein, the power of the far-infrared auxiliary light source 130 is between 200-400W; according to the fourth embodiment, it is 300W. As shown in FIG. 6B and 6A of not using the far-infrared auxiliary light source 130. I D / I G is 0.729, I 2D / I G is 0.801; using the far infrared auxiliary light source 130. I D / I G value It is 0.587, and the I 2D /I G value is 0.803. Based on this, it can be understood that when the far-infrared auxiliary light source 130 is used, the degree of graphene defect is significantly reduced; and in both cases, multilayer graphene is produced. In addition, in terms of electrical results, when the far-infrared auxiliary light source 130 is not used, the resistance value of graphene is 34Ω, and when the far-infrared auxiliary light source 130 is used, the resistance value of graphene is 12Ω , Showing better electrical properties.

綜上所述,藉由本發明所界定的實施方式與具體且不同的實施例可以理解,透過本發明所提供之製備雷射光誘發石墨烯的方法,可以獲得具備缺損程度較低且電性較佳的雷射光誘發石墨烯。In summary, it can be understood from the embodiments defined by the present invention and specific and different examples that through the method for preparing laser-induced graphene provided by the present invention, it is possible to obtain lower defects and better electrical properties. The laser light induces graphene.

雖然本發明已以實施例揭露如上,然而其並非用以限定本發明。任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可進行些許更動已及潤飾。故,本發明的保護範圍當視後附之專利申請範圍所界定者為依據。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on what is defined by the attached patent application scope.

S1-S2:步驟 100:雷射光源 102:遠心透鏡 110:平檯 112:焦平面 120:基材 122:光斑 124:雷射掃描路徑間距 130:遠紅外線輔助光源 S1-S2: steps 100: Laser light source 102: Telecentric lens 110: platform 112: focal plane 120: Substrate 122: light spot 124: Laser scanning path spacing 130: far-infrared auxiliary light source

為讓本發明的上述與其他目的、特徵、優點與實施例能更淺顯易懂,所附圖式之說明如下: 第1圖係依據本發明實施例所繪示的方法流程圖; 第2A圖係依據本發明實施例所繪示的雷射直寫系統示意圖; 第2B及2C圖係依據第2A圖所繪示的光斑示意圖; 第3A-6B圖係本發明實施例的石墨烯拉曼頻譜圖。 In order to make the above and other objects, features, advantages and embodiments of the present invention easier to understand, the description of the accompanying drawings is as follows: Figure 1 is a flowchart of a method according to an embodiment of the present invention; Figure 2A is a schematic diagram of a laser direct writing system according to an embodiment of the present invention; Figures 2B and 2C are based on the schematic diagram of the light spot drawn in Figure 2A; Figures 3A-6B are graphene Raman spectrograms of an embodiment of the present invention.

根據慣常的作業方式,圖中各種特徵與元件並未依實際比例繪製,其繪製方式是為了以最佳的方式呈現與本發明相關的具體特徵與元件。此外,在不同圖式間,以相同或相似的元件符號指稱相似的元件及部件。According to the usual operation method, the various features and elements in the figure are not drawn according to the actual scale, and the drawing method is to present the specific features and elements related to the present invention in the best way. In addition, in different drawings, the same or similar element symbols are used to refer to similar elements and components.

S1~S2:步驟 S1~S2: steps

Claims (4)

一種製備雷射光誘發石墨烯的方法,其包括下列步驟:提供一基材,其中該基材包括一聚醯亞胺(PI,Polyimide)或一聚醚酰亞胺(PEI,Polyetherimide),且該基材的形式係電子電路基板、柔性基板、剛性基板、薄膜、團狀、粉末或其任意組合;以及調整一雷射光源以及一遠紅外線輔助光源照射該基材,進而於該基材之一表面上形成一雷射光誘發石墨烯,其中該遠紅外線輔助光源之功率係介於200-400W之間;其中該雷射光源係一UV奈秒脈衝雷射,功率介於3-5W之間,頻率為100kHZ,掃描速率介於50-150mm/s之間。 A method for preparing laser light-induced graphene includes the following steps: providing a substrate, wherein the substrate includes a polyimide (PI, Polyimide) or a polyetherimide (PEI, Polyetherimide), and the The form of the substrate is an electronic circuit substrate, a flexible substrate, a rigid substrate, a film, a mass, a powder, or any combination thereof; and a laser light source and a far-infrared auxiliary light source are adjusted to irradiate the substrate, and then on one of the substrates A laser light-induced graphene is formed on the surface, where the power of the far-infrared auxiliary light source is between 200-400W; where the laser light source is a UV nanosecond pulse laser with power between 3-5W, The frequency is 100kHZ, and the scan rate is between 50-150mm/s. 如請求項1所述之方法,更包括調整該雷射光源之雷射光波長、該雷射光源之雷射光能量密度、該雷射光源與該基材之距離、該雷射光源之雷射掃描路徑、或該雷射光源之雷射掃描路徑間距。 The method according to claim 1, further comprising adjusting the laser light wavelength of the laser light source, the laser light energy density of the laser light source, the distance between the laser light source and the substrate, and the laser scanning of the laser light source The path, or the distance between the laser scanning path of the laser light source. 如請求項1所述之方法,更包括調整該遠紅外線輔助光源與該基材之距離。 The method according to claim 1, further comprising adjusting the distance between the far-infrared auxiliary light source and the substrate. 如請求項1所述之方法,其中該雷射光誘發石墨烯係單層石墨烯、多層石墨烯、多孔石墨烯、未官能化石墨烯、官能化石墨烯或其任意組合。 The method according to claim 1, wherein the laser light-induced graphene is a single-layer graphene, a multilayer graphene, a porous graphene, an unfunctionalized graphene, a functionalized graphene, or any combination thereof.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106232520A (en) * 2014-02-17 2016-12-14 威廉马歇莱思大学 The grapheme material of induced with laser and they purposes in an electronic
TW201833232A (en) * 2016-12-08 2018-09-16 德商漢高股份有限及兩合公司 A composition suitable for application with laser induced forward transfer (lift)
CN110759338A (en) * 2019-12-04 2020-02-07 广东工业大学 Method for preparing large-size graphene based on laser fixed-point processing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106232520A (en) * 2014-02-17 2016-12-14 威廉马歇莱思大学 The grapheme material of induced with laser and they purposes in an electronic
TW201833232A (en) * 2016-12-08 2018-09-16 德商漢高股份有限及兩合公司 A composition suitable for application with laser induced forward transfer (lift)
CN110759338A (en) * 2019-12-04 2020-02-07 广东工业大学 Method for preparing large-size graphene based on laser fixed-point processing

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