TWI746979B - Workbench and back alignment device - Google Patents
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
本發明屬於積體電路製造技術領域,例如揭示一種工作台及背面對準裝置。本發明揭示的工作台包含水平基座、氣足、吸盤及第一導氣組件;水平基座上開設有貫穿水平基座上表面的透光孔;氣足設置在水平基座上,且能相對水平基座在水平面上移動,氣足上間隔開設有多個第一通光孔,當氣足在水平基座上移動時,多個第一通光孔中的一個與透光孔導通;吸盤設置在氣足上方,能相對氣足進行三個自由度上的轉動並沿垂直方向平移,吸盤對應於第一通光孔的位置開設有第二通光孔;第一導氣組件,吸盤上表面設置有用於吸附基底的第一吸附氣道,第一導氣組件的第一端與氣足連通,第一導氣組件的第二端與第一吸附氣道連通。 The invention belongs to the technical field of integrated circuit manufacturing, and for example discloses a workbench and a back alignment device. The workbench disclosed in the present invention includes a horizontal base, an air foot, a suction cup, and a first air guide component; the horizontal base is provided with a light-transmitting hole that penetrates the upper surface of the horizontal base; the air foot is set on the horizontal base and can Relative to the horizontal base moving on a horizontal surface, a plurality of first light through holes are spaced apart on the air foot, and when the air foot moves on the horizontal base, one of the plurality of first light through holes communicates with the light through hole; The suction cup is arranged above the air foot and can rotate in three degrees of freedom relative to the air foot and translates along the vertical direction. The suction cup is provided with a second light through hole at a position corresponding to the first light through hole; the first air guide component, the suction cup The upper surface is provided with a first adsorption air passage for adsorbing the substrate, the first end of the first air guide component is connected with the air foot, and the second end of the first air guide component is connected with the first adsorption air passage.
Description
本發明關於積體電路製造領域,例如關於一種工作台及背面對準裝置。 The present invention relates to the field of integrated circuit manufacturing, for example, to a workbench and a back-side alignment device.
隨著電子產品的不斷發展,電子產品內積體電路所包含的矽片數量在不斷增加,且電子產品小型化、智慧化的發展需求,對半導體封裝器件的智慧化及小型化提出更高的要求。多矽片封裝係一個將兩種或更多平面器件堆疊並連接起來的矽片級封裝方法,從而使有限的空間內能設置更多的半導體器件。 With the continuous development of electronic products, the number of silicon chips contained in the integrated circuits of electronic products is increasing, and the development of miniaturization and intelligence of electronic products requires higher intelligence and miniaturization of semiconductor packaging devices. Require. Multi-chip packaging is a silicon-chip-level packaging method in which two or more planar devices are stacked and connected, so that more semiconductor devices can be placed in a limited space.
矽穿孔封裝工藝(Through Silicon Via,TSV)係多矽片封裝中的一種,其在半導體矽片的正面到背面形成微型通孔,以電氣方式將上下矽片連接,實現矽片間的連接封裝。因採用垂直互聯的方式,縮短矽片之間互聯引線的長度,引線長度短、引線密封高、封裝體積小及矽片間訊號傳遞快。 Through Silicon Via (TSV) is a type of multi-silicon package, which forms micro-vias from the front to the back of the semiconductor wafer to electrically connect the upper and lower silicon wafers to realize the connection and packaging between the silicon wafers. . Due to the vertical interconnection method, the length of the interconnection leads between the silicon wafers is shortened, the lead length is short, the lead sealing is high, the package volume is small, and the signal transmission between the silicon wafers is fast.
矽穿孔封裝工藝方式要求能在矽片背面進行曝光,因此要求半導體光刻設備具有背面對準裝置以滿足矽片背面曝光的工藝需求。該背面對準裝置以矽片前表面(或稱為矽片正面)已有的圖形為矽片背面後面對準標記,從而確定矽片背面曝光圖形與矽片前表面已有圖形之間的位置誤差。背面對準裝置的測量精度將直接決定矽片前後表面光刻圖形之間的套刻誤差。 The through-silicon via packaging process requires exposure on the backside of the silicon wafer, and therefore requires the semiconductor lithography equipment to have a backside alignment device to meet the process requirements for the backside exposure of the silicon wafer. The back side alignment device uses the existing pattern on the front surface of the silicon wafer (or called the front surface of the silicon wafer) as the back side alignment mark of the silicon wafer to determine the gap between the exposed pattern on the back side of the silicon wafer and the existing pattern on the front surface of the silicon wafer. Position error. The measurement accuracy of the back-side alignment device will directly determine the over-engraving error between the lithographic patterns on the front and rear surfaces of the silicon wafer.
相關技術中一個背面對準標記對應一套背面對準標記照明裝置,導致背面對準標記照明裝置裝配複雜且成本高;因背面對準標記照明裝置位於矽片承片台下方,因此矽片承片台結構設計複雜、加工成本高;同時因該裝置中要求背面對準標記位置必須位於背面對準標記照明裝置的照明視場內,因此導致工藝適應性差。 In the related art, a back-side alignment mark corresponds to a set of back-side alignment mark lighting devices, which leads to complicated assembly and high cost of the back-side alignment mark lighting devices; The structure design of the film stage is complicated and the processing cost is high; at the same time, the device requires that the back side alignment mark position must be in the illumination field of view of the back side alignment mark illuminating device, which results in poor process adaptability.
又,在相關技術中矽片背面標記照明裝置亦可以安裝於矽片承片台內,因此工作台結構設計及裝配比較複雜,且加工成本高,且受到矽片全場對準精度及矽片承片台空間尺寸的制約,必須在矽片背面標記照明裝置指定位置處製作相應的矽片背面對準標記,因此增加工藝流程及複雜度,導致工藝適應性差。 Moreover, in the related technology, the silicon wafer backside marking lighting device can also be installed in the silicon wafer carrier. Therefore, the workbench structure design and assembly are more complicated, and the processing cost is high. Due to the limitation of the space size of the wafer table, the corresponding silicon wafer backside alignment mark must be made at the designated position of the silicon wafer backside marking lighting device, which increases the process flow and complexity, resulting in poor process adaptability.
以下係對本文詳細描述的主題的概述。本概述並非是為了限制申請專利範圍的保護範圍。 The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the patent application.
本發明提供一種工作台,以減少背面對準裝置用工作台的結構複雜度,降低工作台的加工成本,且提高工作台的工藝適應性。 The invention provides a workbench to reduce the structural complexity of the workbench for the back alignment device, reduce the processing cost of the workbench, and improve the process adaptability of the workbench.
本發明提供一種背面對準裝置,減少背面對準裝置的結構複雜度,降低背面對準裝置的加工成本,提高背面對準裝置的使用靈活性及工藝適應性。 The invention provides a back aligning device, which reduces the structural complexity of the back aligning device, reduces the processing cost of the back aligning device, and improves the use flexibility and process adaptability of the back aligning device.
本發明採用下述技術手段: The present invention adopts the following technical means:
一種工作台,包含:水平基座,其上開設有貫穿前述水平基座上表面的透 光孔,前述透光孔內設置有第一透光片;氣足,設置在前述水平基座上,且能相對前述水平基座在水平面上移動,前述氣足上間隔開設有多個第一通光孔,當前述氣足在前述水平基座上移動時,多個前述第一通光孔中的一個與前述透光孔導通;吸盤,設置在前述氣足上方,前述吸盤能相對前述氣足進行三個自由度上的轉動並能相對前述氣足沿垂直方向平移,前述吸盤對應於前述第一通光孔的位置開設有第二通光孔,前述第一通光孔與前述第二通光孔連通,前述第二通光孔內設置有第二透光片;第一導氣組件,前述吸盤上表面設置有用於吸附基底的第一吸附氣道,前述第一導氣組件的第一端與前述氣足內部連通,前述第一導氣組件的第二端與前述第一吸附氣道連通。 A workbench, comprising: a horizontal base, on which a transparent penetrating through the upper surface of the horizontal base is opened A light hole, a first light-transmitting sheet is arranged in the light-transmitting hole; an air foot is arranged on the horizontal base and can move on a horizontal surface relative to the horizontal base, and a plurality of first light-transmitting sheets are spaced apart on the air foot The light-passing hole, when the air foot moves on the horizontal base, one of the plurality of first light-passing holes communicates with the light-transmitting hole; The foot can rotate in three degrees of freedom and can translate in the vertical direction relative to the air foot. The suction cup is provided with a second light-passing hole at a position corresponding to the first light-passing hole. The light-passing hole is connected, and the second light-transmitting sheet is arranged in the second light-passing hole; the first air guide assembly, the upper surface of the suction cup is provided with a first suction air passage for adsorbing the substrate, and the first air guide of the first air guide assembly The end is in communication with the inside of the air foot, and the second end of the first air guide assembly is in communication with the first adsorption air passage.
在一實施型態中,前述工作台進一步包含調節裝置,前述調節裝置包含:水平調節組件,與前述氣足連接,設置為帶動前述氣足進行水平方向移動;垂向調節組件,垂向調節組件的第一端與前述氣足連接,垂向調節組件的第二端與前述吸盤連接,設置為帶動前述吸盤相對水平方向呈非零夾角及豎直方向平移;旋轉調節組件,與前述吸盤連接,設置為帶動前述吸盤相對前述氣足繞豎直方向轉動。 In one embodiment, the aforementioned workbench further includes an adjustment device, the aforementioned adjustment device includes: a horizontal adjustment component connected to the aforementioned air foot and configured to drive the aforementioned air foot to move in a horizontal direction; a vertical adjustment component, a vertical adjustment component The first end of the vertical adjustment component is connected to the aforementioned air foot, and the second end of the vertical adjustment component is connected to the aforementioned suction cup, and is configured to drive the aforementioned suction cup to have a non-zero included angle with respect to the horizontal direction and to translate in a vertical direction; the rotation adjustment component is connected to the aforementioned suction cup, It is arranged to drive the suction cup to rotate in a vertical direction relative to the air foot.
在一實施型態中,前述工作台進一步包含:吸盤座,吸盤座的上端與前述吸盤連接,吸盤座的下端與前述氣足連接,前述垂向調節組件及前述旋轉調節組件均藉由前述吸盤座與前述吸盤連接,前述吸盤座對應於前述第一通光孔的位置開設有第三通光孔,前述第三通光孔分別與前述第一通光孔及前述第二通光孔連通;前述吸盤座的上表面及前述吸盤的下表面中的至少一個開設有第二吸附氣道,前述第一導氣組件與前述第二吸附氣道連通。 In one embodiment, the workbench further includes: a suction cup seat, the upper end of the suction cup seat is connected to the suction cup, the lower end of the suction cup seat is connected to the air foot, the vertical adjustment component and the rotation adjustment component are all through the suction cup The seat is connected with the aforementioned suction cup, and the aforementioned suction cup seat is provided with a third light-passing hole at a position corresponding to the aforementioned first light-passing hole, and the aforementioned third light-passing hole is respectively communicated with the aforementioned first light-passing hole and the aforementioned second light-passing hole; At least one of the upper surface of the suction cup seat and the lower surface of the suction cup is provided with a second adsorption air passage, and the first air guide component is in communication with the second adsorption air passage.
在一實施型態中,前述工作台進一步包含:上平板,前述上平 板的下端與前述氣足連接,前述上平板的上端與前述吸盤座連接,前述垂向調節組件的第一端連接前述氣足,前述垂向調節組件的第二端連接前述上平板,前述吸盤座與前述吸盤能相對前述上平板繞豎直方向轉動,前述垂向調節組件(8)藉由前述上平板(3)及前述吸盤座(4)與前述吸盤(5)連接。 In one embodiment, the aforementioned workbench further includes: an upper plate, the aforementioned upper plate The lower end of the plate is connected to the aforementioned air foot, the upper end of the aforementioned upper plate is connected to the aforementioned suction cup seat, the first end of the aforementioned vertical adjustment assembly is connected to the aforementioned air foot, the second end of the aforementioned vertical adjustment assembly is connected to the aforementioned upper plate, and the aforementioned suction cup The seat and the suction cup can rotate in a vertical direction relative to the upper plate, and the vertical adjustment component (8) is connected with the suction cup (5) through the upper plate (3) and the suction cup seat (4).
在一實施型態中,前述吸盤座及前述吸盤均為圓盤狀結構,前述旋轉調節組件帶動前述吸盤座繞前述吸盤座的中心軸轉動。 In one embodiment, the suction cup holder and the suction cup are both disc-shaped structures, and the rotation adjustment component drives the suction cup holder to rotate around the central axis of the suction cup holder.
在一實施型態中,前述旋轉調節組件包含:弧形電機,前述弧形電機的定子與前述上平板固定,前述弧形電機的轉子與前述吸盤座的外壁固定連接,且前述轉子遠離前述定子的一側與前述吸盤座外壁貼合。 In one embodiment, the rotation adjustment assembly includes an arc-shaped motor, the stator of the arc-shaped motor is fixed to the upper plate, the rotor of the arc-shaped motor is fixedly connected to the outer wall of the suction cup base, and the rotor is far away from the stator. One side is attached to the outer wall of the aforementioned suction cup seat.
在一實施型態中,前述旋轉調節組件進一步包含:弧形導向塊,固定在前述上平板上,多個弧形導向塊沿前述吸盤座的周向間隔設置,且前述弧形導向塊的弧形面與前述吸盤座的外壁配合。 In one embodiment, the rotation adjustment assembly further includes: an arc-shaped guide block fixed on the upper plate, a plurality of arc-shaped guide blocks are arranged at intervals along the circumferential direction of the suction cup seat, and the arc of the arc-shaped guide block The shaped surface is matched with the outer wall of the aforementioned suction cup seat.
在一實施型態中,前述旋轉調節組件進一步包含:第二導氣組件,前述上平板的上表面及前述吸盤座的下表面中的至少一個設置有充氣氣道,前述第二導氣組件的第一端與前述氣足的內部連通,前述第二導氣組件的第二端與前述充氣氣道連通。 In one embodiment, the rotation adjustment assembly further includes: a second air guide assembly, at least one of the upper surface of the upper plate and the lower surface of the suction cup seat is provided with an inflatable air passage, and the first air guide assembly of the second air guide assembly One end is communicated with the inside of the aforementioned air foot, and the second end of the aforementioned second air guide assembly is communicated with the aforementioned inflation air passage.
在一實施型態中,前述弧形導向塊為弧形氣浮,前述弧形氣浮與前述第二導氣組件連通。 In one embodiment, the arc-shaped guide block is an arc-shaped air float, and the arc-shaped air float is in communication with the second air guide assembly.
在一實施型態中,前述上平板的上表面及前述吸盤座的下表面中的至少一個開設有第三吸附氣道,前述第三吸附氣道與前述第二導氣組件連通。 In one embodiment, at least one of the upper surface of the upper plate and the lower surface of the suction cup seat is provided with a third adsorption air passage, and the third adsorption air passage is in communication with the second air guide assembly.
在一實施型態中,前述上平板的上表面凸設有氣浮面,多個氣 浮面沿一圓周間隔設置;前述上平板的上表面開設有真空腔,多個真空腔繞前述圓周間隔設置,前述真空腔的上端面與前述氣浮面平齊;前述上平板的下表面開設有第一環形氣道及第二環形氣道,前述第一環形氣道分別連通前述第二導氣組件及前述氣浮面,前述第二環形氣道分別連通前述第二導氣組件及前述真空腔;前述上平板的下表面對應於前述第一環形氣道及第二環形氣道的位置連接有第一密封板。 In one embodiment, the upper surface of the upper plate is convexly provided with an air floating surface, and a plurality of air The floating surfaces are arranged at intervals along a circumference; the upper surface of the upper plate is provided with vacuum chambers, a plurality of vacuum chambers are arranged at intervals around the circumference, the upper end surface of the vacuum chamber is flush with the air floating surface; the lower surface of the upper plate is provided with a first An annular air passage and a second annular air passage, the first annular air passage is respectively connected to the second air guiding component and the air floating surface, and the second annular air passage is connected to the second air guiding component and the vacuum chamber respectively; the upper plate A first sealing plate is connected to the position of the lower surface corresponding to the first annular air passage and the second annular air passage.
在一實施型態中,前述第一吸附氣道包含沿前述吸盤徑向間隔設置的第一氣道、第二氣道及第三氣道,前述第一氣道、前述第二氣道及前述第三氣道分別與六寸、八寸及十二寸的基底相適應。 In one embodiment, the first adsorption air passage includes a first air passage, a second air passage, and a third air passage spaced apart along the radial direction of the suction cup. The first air passage, the second air passage, and the third air passage are respectively and 6 It is suitable for the base of inch, eight inch and twelve inch.
在一實施型態中,前述第一導氣組件包含:第一分流塊,第一分流塊的第一端與前述氣足連接;第一導氣管,第一導氣管的第一端與前述第一分流塊的第二端連接;第二分流塊,與前述第一導氣管連通,前述第二分流塊具有四個出氣口,四個前述出氣口分別與前述第一氣道、前述第二氣道、前述第三氣道及前述第二吸附氣道連通。 In one embodiment, the first air guide assembly includes: a first shunt block, the first end of the first shunt block is connected to the aforementioned air foot; a first air guide tube, the first end of the first air guide tube is connected to the first end The second end of a splitter block is connected; the second splitter block communicates with the first air duct, the second splitter block has four air outlets, and the four air outlets are respectively connected to the first airway, the second airway, The aforementioned third air passage and the aforementioned second adsorption air passage are connected.
在一實施型態中,前述垂向調節組件包含:轉接板,其下表面與前述上平板的上表面抵接;直線電機,前述直線電機的固定部與前述氣足連接,前述直線電機的輸出軸與前述轉接板連接;彈性元件,套設在前述固定部外部,且彈性元件的第一端與前述氣足連接,彈性元件的第二端與前述上平板的下表面連接。 In one embodiment, the vertical adjustment component includes: an adapter plate, the lower surface of which is in contact with the upper surface of the upper plate; a linear motor, the fixed part of the linear motor is connected to the air foot, and the linear motor The output shaft is connected with the aforementioned adapter plate; the elastic element is sleeved outside the aforementioned fixing part, and the first end of the elastic element is connected with the aforementioned air foot, and the second end of the elastic element is connected with the lower surface of the aforementioned upper plate.
在一實施型態中,前述垂向調節組件進一步包含:底座,底座的下端與前述氣足連接,底座的上端與前述直線電機的下端連接;調節座,螺紋套設在前述底座上,前述調節座的上端面開設有凹槽,前述彈性元件的下端 卡設在前述凹槽內。 In one embodiment, the aforementioned vertical adjustment assembly further includes: a base, the lower end of the base is connected with the aforementioned air foot, the upper end of the base is connected with the lower end of the aforementioned linear motor; an adjustment seat, threaded on the aforementioned base, the aforementioned adjustment The upper end surface of the seat is provided with a groove, and the lower end of the aforementioned elastic element It is clamped in the aforementioned groove.
在一實施型態中,前述垂向調節組件沿前述上平板的周緣設置有四組,四組前述垂向調節組件呈矩形分佈。 In one embodiment, the vertical adjustment components are arranged in four groups along the periphery of the upper plate, and the four vertical adjustment components are distributed in a rectangular shape.
在一實施型態中,前述工作台進一步包含支撐組件,前述支撐組件包含:支撐座,設置在前述矩形的中心,前述支撐座下端與前述氣足固定連接;彈性片,前述彈性片上表面的外側與前述上平板固定連接,前述彈性片下表面的內側與前述支撐座上端固定連接。 In one embodiment, the workbench further includes a support component, the support component includes: a support seat, arranged at the center of the rectangle, the lower end of the support seat is fixedly connected with the air foot; an elastic sheet, the outer side of the upper surface of the elastic sheet It is fixedly connected with the aforementioned upper plate, and the inner side of the lower surface of the aforementioned elastic sheet is fixedly connected with the upper end of the aforementioned supporting seat.
一種背面對準裝置,包含上述的工作台。 A back alignment device includes the above-mentioned workbench.
在閱讀並理解圖式及詳細描述後,可以明白其他態樣。 After reading and understanding the schema and detailed description, other aspects can be understood.
本發明提供的背面對準裝置,藉由採用上述的工作台,可用一套照明裝置捕獲所有背面對準標記,簡化背面對準裝置的整體結構,提高背面對準裝置的裝配複雜度,降低背面對準裝置的成本,提高背面對準裝置的工藝適應性。 The back alignment device provided by the present invention, by using the above-mentioned workbench, can capture all the back alignment marks with a set of lighting devices, simplify the overall structure of the back alignment device, improve the assembly complexity of the back alignment device, and reduce the back The cost of the alignment device improves the process adaptability of the back-side alignment device.
1:水平基座 1: Horizontal base
2:氣足 2: air foot
3:上平板 3: upper plate
4:吸盤座 4: Suction cup holder
5:吸盤 5: Suction cup
6:第一導氣組件 6: The first air guide component
7:水平調節組件 7: Level adjustment components
8:垂向調節組件 8: Vertical adjustment components
9:旋轉調節組件 9: Rotation adjustment component
10:支撐組件 10: Support components
11:透光孔 11: light hole
12:第一透光片 12: The first light-transmitting film
20:基底 20: Base
21:本體部 21: Body part
22:氣浮部 22: Floatation part
30:照明裝置 30: Lighting device
31:第四通光孔 31: The fourth light hole
32:第一環形氣道 32: The first circular airway
33:第二環形氣道 33: Second circular airway
34:第一連通氣道 34: The first connecting airway
35:第二連通氣道 35: Second connecting airway
36:第三連通氣道 36: Third connecting airway
37:第四連通氣道 37: Fourth connecting airway
38:氣浮面 38: Floating surface
39:真空腔 39: vacuum chamber
41:第三通光孔 41: The third light hole
42:第二吸附氣道 42: The second adsorption airway
43:轉接塊 43: transfer block
44:第一導流管 44: The first draft tube
45:第二導流管 45: second draft tube
46:第一垂直氣道 46: First vertical airway
47:第二垂直氣道 47: second vertical airway
48:第三垂直氣道 48: Third vertical airway
51:第二通光孔 51: The second light hole
52:第二透光片 52: The second light-transmitting film
53:第一氣道 53: First Airway
54:第二氣道 54: Second Airway
55:第三氣道 55: Third Airway
61:第一導氣管 61: First airway
62:第二分流塊 62: second shunt block
71:第一滑軌 71: The first slide
72:第二滑軌 72: second slide
73:第一滑塊 73: The first slider
74:第二滑塊 74: second slider
75:支撐塊 75: support block
76:連接軌 76: connecting rail
77:第一區域 77: The first area
78:第二區域 78: second area
81:直線電機 81: Linear Motor
82:彈性元件 82: Elastic element
83:轉接板 83: adapter board
84:底座 84: base
85:調節座 85: Adjusting seat
86:固定座 86: fixed seat
91:弧形電機 91: Arc motor
92:弧形導向塊 92: Arc guide block
93:第二導氣組件 93: The second air guide assembly
101:支撐座 101: Support seat
102:彈性片 102: elastic sheet
103:下環片 103: Lower ring piece
104:下夾板 104: Lower splint
201:背面對準標記 201: Alignment mark on the back
211:第一通光孔 211: The first light hole
212:定位槽 212: positioning slot
221:氣浮孔 221: Floating Hole
421:第三環形氣道 421: Third Annular Airway
422:轉接氣道 422: transfer airway
423:第四環形氣道 423: Fourth Annular Airway
911:定子 911: Stator
912:轉子 912: Rotor
931:第三分流塊 931: third shunt block
932:第二導氣管 932: second airway
933:第四分流塊 933: the fourth shunt block
9111:定殼體 9111: fixed shell
9112:線圈 9112: Coil
9121:動殼體 9121: Moving shell
9122:磁鐵 9122: Magnet
【圖1】係本發明提供的工作台的結構示意圖。 [Figure 1] is a schematic diagram of the structure of the workbench provided by the present invention.
【圖2】係本發明提供的工作台的結構透視圖。 [Figure 2] is a perspective view of the structure of the workbench provided by the present invention.
【圖3】係本發明提供的水平基座、水平調節組件及氣足的結構透視圖。 [Figure 3] is a perspective view of the horizontal base, level adjustment components and air feet provided by the present invention.
【圖4】係本發明提供的氣足的仰視圖。 [Figure 4] is a bottom view of the air foot provided by the present invention.
【圖5】係一實施型態的氣足及水平調節組件的俯視簡圖。 [Figure 5] is a schematic top view of an implementation type of air foot and level adjustment components.
【圖6】係另一實施型態的氣足及水平調節組件的俯視簡圖。 [Figure 6] is a schematic top view of another embodiment of the air foot and level adjustment assembly.
【圖7】係本發明提供的工作台的部分結構示意圖。 [Figure 7] is a schematic diagram of part of the structure of the workbench provided by the present invention.
【圖8】係本發明提供的氣足、上平板及垂向調節組件的結構示意圖。 [Figure 8] is a schematic diagram of the structure of the air foot, the upper plate and the vertical adjustment assembly provided by the present invention.
【圖9】係本發明提供的垂向調節組件的剖視圖。 [Figure 9] is a cross-sectional view of the vertical adjustment assembly provided by the present invention.
【圖10】係本發明提供的支撐組件的結構示意圖。 [Figure 10] is a schematic diagram of the structure of the support assembly provided by the present invention.
【圖11】係本發明提供的吸盤座及旋轉調節組件的結構示意圖。 [Figure 11] is a schematic diagram of the structure of the suction cup seat and the rotation adjustment assembly provided by the present invention.
【圖12】係圖11中I處的局部放大圖。 [Fig. 12] is a partial enlarged view of I in Fig. 11.
【圖13】係本發明提供的上平板的仰視圖。 [Figure 13] is a bottom view of the upper plate provided by the present invention.
【圖14】係本發明提供的上平板的俯視圖。 [Figure 14] is a top view of the upper plate provided by the present invention.
【圖15】係本發明提供的吸盤座及第一導氣組件的結構示意圖。 [Figure 15] is a schematic view of the structure of the suction cup seat and the first air guide assembly provided by the present invention.
【圖16】係本發明提供的吸盤的結構示意圖。 [Figure 16] is a schematic diagram of the structure of the suction cup provided by the present invention.
【圖17】係圖16中吸盤的內部氣道分佈圖。 [Figure 17] is the internal airway distribution diagram of the suction cup in Figure 16.
下面結合圖式及實施例對本發明作進一步的詳細說明。可以理解的是,此處所描述的具體實施例僅僅用於解釋本發明,而非對本發明的限定。又還必須說明的是,為了便於描述,圖式中僅示出與本發明相關的部分而非全部結構。 The present invention will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. It should also be noted that, for ease of description, only a part of the structure related to the present invention, but not all of the structure, is shown in the drawings.
圖1為本實施例提供的工作台的結構示意圖,圖2為本實施例提供的工作台的結構透視圖,其中,以垂直方向為Z向,水平方向為X向及Y向,且X、Y及Z滿足右手坐標系法則。如圖1及圖2所示,本實施例提供一種用於背面對準裝置的工作台,主要包含水平基座1、氣足2、吸盤5及第一導氣組件6。水平基座1用於為整個工作台提供結構支撐,水平基座1上開設有貫穿水平基座1上下表面的透光孔11,透光孔11內設置有第一透光片12;
氣足2設置在水平基座1上,且能相對水平基座1進行X及Y向的水平移動,氣足2上間隔開設有多個第一通光孔211,當氣足2在水平基座1上進行水平方向的移動時,多個第一通光孔211中的一個與透光孔11導通;吸盤5設置在氣足2上方,且能相對氣足2轉動以及沿Z向的平移運動,吸盤5上對應第一通光孔211的位置開設有第二通光孔51,且第一通光孔211及第二通光孔51導通,第二通光孔51內亦設置有第二透光片52;吸盤5上表面開設有用於吸附基底20的第一吸附氣道,第一導氣組件6的第一端與氣足2內部連通,第一導氣組件6的第二端與第一吸附氣道連通。
Figure 1 is a schematic diagram of the structure of the workbench provided by this embodiment, and Figure 2 is a perspective view of the structure of the workbench provided by this embodiment, wherein the vertical direction is the Z direction, the horizontal direction is the X and Y directions, and X, Y and Z satisfy the law of the right-handed coordinate system. As shown in FIG. 1 and FIG. 2, this embodiment provides a workbench for a back alignment device, which mainly includes a
本發明提供的工作台,藉由採用水平基座、氣足及吸盤,且氣足能相對水平基座水平方向移動,吸盤能相對氣足進行三個自由度的轉動及豎直方向的平移,可以實現整個工作台在六個自由度上的調節;藉由在水平基座1上設置透光孔11,在水平基座1上方設置可水平移動的氣足2,以及在氣足2及吸盤5上分別對應設置多個第一通光孔211及第二通光孔51,藉由氣足2相對水平基座1的水平移動,從而使多個第一通光孔211及對應的第二通光孔51在氣足2移動過程中分別導通透光孔11,繼而使位於透光孔11下方的照明裝置30發出的紅外光線能穿過透光孔11及與之連通的第一通光孔211及第二通光孔51,照射在位於吸盤5上方的基底20的背面對準標記201上。為實現基底20的背面對準,基底20上通常設置多個背面對準標記201,上述工作台的該種設置,可藉由移動背面對準標記201的方式,將背面對準標記201位於照明裝置30的視場內,能夠用一套照明裝置30捕獲所有背面對準標記201,簡化工作台的結構、降低工作台對照明裝置30的設計要求及工作台的裝配複雜度,同時降低開發成本,提高背面對準裝置對基底20背面對準標記201的
工藝適應性。
The workbench provided by the present invention adopts a horizontal base, an air foot and a suction cup, and the air foot can move horizontally relative to the horizontal base, and the suction cup can rotate three degrees of freedom relative to the air foot and translate in the vertical direction. The entire workbench can be adjusted in six degrees of freedom; by setting a light-transmitting
在本實施例中,基底20可以為矽片,亦可以為玻璃基底等用於光刻的其他基底材料。
In this embodiment, the
氣足2設置為實現相對水平基座1的水平範圍的移動,進行背面對準標記201相對照明裝置30的對準;為實現氣足2在水平基座1上的水平移動,本實施例提供的工作台亦包含水平調節組件7。
The
圖3為本實施例提供的水平基座1、水平調節組件7及氣足2的結構透視圖。如圖3所示,本實施例提供的水平調節組件7包含沿Y向設置的第一滑軌71及沿X向設置的第二滑軌72。兩根第一滑軌71平行間隔設置,且分別位於氣足2的相對兩端,兩根第一滑軌71之間連接有兩根連接軌76,兩根連接軌76分別位於第一滑軌71的兩端;兩根第二滑軌72平行間隔設置,且分別位於對應連接軌76的外側。在本實施例中,兩根連接軌76平行設置且與第二滑軌72平行。氣足2與第一滑軌71正對的兩側分別連接有第一滑塊73,第一滑塊73可沿第一滑軌71的長度方向滑動,使得氣足2相對水平基座1在Y向的平移運動;連接軌76上連接有第二滑塊74,第二滑塊74沿第二滑軌72的長度方向移動,使得氣足2相對水平基座1在X方向的平移運動。
FIG. 3 is a perspective view of the structure of the
在本實施例中,第一滑塊73為Z型滑塊,Z型滑塊的上端與第一滑軌71的上表面滑動連接,Z型滑塊的下端與氣足2固定連接;且在氣足2的同一側,間隔設置有兩個第一滑塊73,在其他實施例中,第一滑塊73的結構形式及數量均可以根據需要設置為其他形式,本實施例不對第一滑軌71的結構及數量進行限制,同樣,圖3中滑軌及滑塊的結構均為例示性結構,本實
施例亦不對第一滑軌71、第二滑軌72及第二滑塊74的具體形式做出具體限制,只要能實現滑塊及滑軌的相對滑動的結構均可以。
In this embodiment, the first sliding
在本實施例中,第一滑軌71的兩端均設置有支撐塊75,一方面支撐塊75設置為提升第一滑軌71的下表面距離水平基座1的高度,使氣足2部分伸入第一滑軌71下側,減小工作台整體結構的體積;另一方面,支撐塊75的設置可以減小第一滑軌71與水平基座1的接觸面積,降低氣足2沿X向滑動的阻力。在本實施例中,支撐塊75為氣浮支撐塊,藉由向支撐塊75內充入正壓氣體,並在支撐塊75的下表面與水平基座1間形成氣膜,使支撐塊75及支撐塊75支承的結構浮在水平基座1上,實現氣足2在X向的無摩擦平移,提高工作台的調節精度,有利於背面對準裝置的高精度運行。
In this embodiment, both ends of the
在本實施例中,採用第一滑軌71及第二滑軌72進行氣足2的Y向運動及X向運動調節,在其他實施例中,亦可以採用其他結構形式的水平調節組件7,只要能實現氣足2相對水平基座1的X向及Y向運動的結構均可。
In this embodiment, the
圖4為本實施例提供的氣足2的仰視圖,如圖4所示,氣足2包含本體部21及設置在本體部21兩側的氣浮部22,氣浮部22上垂直開設有貫穿氣浮部22下表面的氣浮孔221,藉由向氣浮部22輸入正壓氣體,使氣足2具有一定的支撐強度;且正壓氣體藉由氣浮孔221作用於氣足2下表面與水平基座1上表面之間,使氣足2下表面及水平基座1上表面間形成氣膜,使氣足2浮在水平基座1上。藉由氣足2的設計,實現氣足2在水平基座1上的無摩擦運動,提高氣足2在水平基座1上的運行精度,保證背面對準裝置的精密測量的實現。本體部21設置為支撐設置在氣足2上的其他結構,多個第一通
光孔211開設在本體部21上,並貫穿本體部21的上下表面。
Fig. 4 is a bottom view of the
在本實施例中,每個氣浮部22上均設置有兩個氣浮孔221,且兩個氣浮孔221分別設置在氣浮部22的兩端,在其他實施例中,可以在每個氣浮部22上設置一個、三個或多個氣浮孔221,本實施例不對氣浮孔221的位置、數量進行具體限制。在本實施例中,氣足2為矩形結構,有利於控制氣足2在X向及在Y向的位移量以及水平調節組件7的設計。在其他實施例中,氣足2亦可以為具有其他外形的結構。
In this embodiment, each
圖5為一實施例的氣足2及水平調節組件7的俯視簡圖,圖6係另一實施例的氣足2及水平調節組件7的俯視簡圖,如圖5及圖6所示,根據氣浮部22相對第一滑軌71的位置關係,氣浮部22在氣足2相對水平基座1移動的過程中具有兩種相異的移動區域。圖5中,氣浮部22位於氣足2平行第一滑軌71的兩側,每個氣浮部22在對應的第一區域77內移動;圖6中,氣浮部22位於氣足2平行第二滑軌72的兩側,每個氣浮部22在對應的第二區域78內移動。圖5及圖6中,實線矩形孔代表在氣足2上開設的第一通光孔211,多個第一通光孔211繞氣足2的中心間隔設置,實線圓形孔代表在水平基座1上開設的透光孔11。在氣足2運動過程中,必須使第一通光孔211對準透光孔11,以使各個第一通光孔211對應的背面對準標記201均能被照明裝置30的視場搜索到,在氣足2運動過程中,透光孔11的位置不能與氣浮部22的運動區域相干涉,且各個第一通光孔211均能被透光孔11對準,即氣足2需要足夠的面積以避免氣浮部22與透光孔11的干涉,且需要足夠的運動範圍使每個第一通光孔211均能與透光孔11連通;氣足2的大小及水平調節組件7的尺寸直接關係水平基座1及整個工作台的尺寸,為滿足工作台小型化的要
求,需要氣足2的面積足夠小。
FIG. 5 is a schematic top view of the
在本實施例中,透光孔11開設在以矩形移動區域的中心為圓心,以50mm為半徑的圓形範圍內。藉由將透光孔11設置在範圍內,可以在滿足透光孔11對第一通光孔211進行搜索的同時,又能減小氣足2的活動範圍,減小工作台的體積。
In this embodiment, the light-transmitting
在本實施例中,因氣足2在第一滑軌71上運動,且第一滑軌71帶動氣足2在第二滑軌72上相對滑動,因此,本實施例中,可以將氣浮部22設置在氣足2平行第一滑軌71的兩側,此時,藉由將氣浮部22伸入第一滑軌71與水平基座1之間,可以在保證氣足2運動區域的同時,減小整個水平調節組件7的尺寸,從而減小水平基座1及工作台的整體尺寸。
In this embodiment, because the
在本實施例的圖3-6中,第一通光孔211及與對應的第二通光孔51為矩形,在其他實施例中,第一通光孔211及對應的第二通光孔51可以為其他形式,如圓形孔等,本實施例不對透光孔及通光孔的具體外形進行限制。在本實施例中,第一通光孔211的個數為三個,在其他實施例中,第一通光孔211的數量可根據具體需要進行具體設置。
In FIGS. 3-6 of this embodiment, the first light-passing
圖7為本實施例提供的工作台的部分結構示意圖,如圖7所示,吸盤5設置在氣足2的上方,用於吸附基底20,吸盤5能相對氣足2進行Z向平移及各向旋轉的微調,提高工作台對背面對準標記201相對照明裝置30對準的精度及背面對準裝置的測量精度。在一實施例中,為實現吸盤5的運動,本實施例提供的工作台亦包含垂向調節組件8及旋轉調節組件9,其中垂向調節組件8設置為帶動吸盤5相對氣足2的繞X軸及Y軸轉動,旋轉調節組件9設置為帶動吸盤5繞Z軸轉動。
Figure 7 is a partial structural diagram of the workbench provided by this embodiment. As shown in Figure 7, the
為簡化吸盤5的結構、方便各結構的佈局以及工作台的組裝裝配,本實施例提供的工作台亦包含上平板3及吸盤座4。上平板3設置在氣足2與吸盤5之間,垂向調節組件8的第一端與氣足2連接,垂向調節組件8的第二端與上平板3連接,實現上平板3相對氣足2的豎直方向平移;吸盤座4設置在上平板3與吸盤5之間,旋轉調節組件9與吸盤座4連接,帶動吸盤座4相對上平板3轉動,實現吸盤5繞Z軸轉動的微調。吸盤座4及上平板3上分別對應於第一通光孔211開設有第三通光孔41及第四通光孔31,第一通光孔211、第二通光孔51、第三通光孔41及第四通光孔31依次導通。藉由設置上平板3及吸盤座4,旋轉調節組件9及垂向調節組件8不直接與吸盤5相連,降低吸盤5設計的複雜度,有利於使吸盤5的設計更適用於待連接的基底20;且方便各零件的維修及更換,且有利於工作台的組裝及拆卸,且在減小結構尺寸的同時,使各調節組件之間的佈置空間更大,不會出現各調節零件干涉的情況,且有利於各自由度的解耦調節。
In order to simplify the structure of the
圖8為本實施例提供的氣足2、上平板3及垂向調節組件8的結構示意圖,如圖8所示,在本實施例中,上平板3為矩形結構,垂向調節組件8在上平板3的四角分別設置有一組。垂向調節組件8設置在上平板3與氣足2之間,設置為對上平板3與氣足2間的豎直方向的距離進行微調。同時,藉由在上平板3四角分別設置垂向調節組件8,藉由調節每組垂向調節組件8的調節高度,使上平板3在Rx及Ry自由度上進行微調,該種設置方式,可以簡化整體結構的複雜度,降低設計成本。在其他實施例中,亦可設置其他的調節裝置來實現托盤在Rx及Ry自由度上的調節,因相關技術中實現繞X向及繞Y向調節的裝置較多,本實施例不再對其他實現Rx及Ry向調節的方式進
行贅述。
Fig. 8 is a schematic structural diagram of the
圖9係本實施例提供的垂向調節組件8的剖視圖,如圖8及圖9所示,垂向調節組件8包含直線電機81、轉接板83及彈性元件82。直線電機81垂直設置在氣足2上,其固定部與氣足2固定連接,上平板3對應於輸出軸的位置開設有穿接孔,輸出軸上端穿過穿接孔與位於上平板3上方的轉接板83連接固定連接。轉接板83下端面的內側與輸出軸固定連接,外側與上平板3的上表面固定連接。彈性元件82套設在直線電機81外部,且彈性元件82的第一端與氣足2連接,彈性元件82的第二端與上平板3抵接。藉由設置直線電機81、轉接板83以及彈性元件82,可以藉由直線電機81輸出軸的直線運動,帶動上平板3在的垂直運動,調節上平板3與氣足2之間的垂直距離;藉由設置彈性元件82,抵消上平板3之上的結構的部分重力,實現豎直方向重力補償;藉由設置轉接板83,可以方便直線電機81與上平台的連接及拆卸,有利於直線電機81的維修及更換。
9 is a cross-sectional view of the
為方便垂向調節組件8的安裝、拆卸及調節,垂向調節組件8亦包含調節座85、底座84及固定座86。固定座86下端與氣足2固定連接,底座84下端與固定座86上端連接,底座84上端與直線電機81連接。調節座85套設在底座84外壁上,且與底座84外壁螺紋連接,底座84上端面開設有環形凹槽,彈性元件82的下端卡設在環形凹槽內,藉由螺紋旋擰,調節調節座85相對氣足2的豎直方向的位置,即可調節彈性元件82的壓縮或伸長量,改變彈性元件82對上平板3的作用力,更佳地發揮重力補償的作用。
In order to facilitate the installation, disassembly and adjustment of the
在本實施例中,底座84下端開設有螺紋孔,固定座86上端與螺紋孔螺紋連接,例如可藉由細牙螺紋連接,便於直線電機81的安裝及垂向
調節組件8的安裝、拆卸及維護。在其他實施例中,底座84及固定座86亦可以採用其他的可拆卸連接方式。在本實施例中,直線電機81為音圈電機,體積小、調節靈敏度高、調節精度高。在本實施例中,彈性元件82為彈簧,在其他實施例中,彈性元件82亦可以為其他能夠套設在電機外部,且能發生彈性變形的元件。
In this embodiment, the bottom end of the
在本實施例中,轉接板83沿在其周緣上間隔凸設有多個連接凸台,相鄰兩個連接凸台之間採用圓弧過渡連接,且可以採用內凹圓弧過渡連接。藉由設置連接凸台,有利於轉接板83的連接安裝定位,且該種轉接板83的結構,有利於減小轉接板83的重量及體積。在本實施例中,每個轉接板83上均勻間隔設置有三個連接凸台,在其他實施例中,亦可設置兩個、四個或多個連接凸台。在本實施例中,採用連接凸台加圓弧過渡連接的轉接板83結構,在其他實施例中,可以採用其他形式的轉接板83結構,如圓形等,本實施例不對轉接板83的具體結構進行限制。
In this embodiment, the
在本實施例中,為使直線電機81中的線纜順利引出,上平板3上開設有用於避讓線纜的避讓槽。
In this embodiment, in order to smoothly lead out the cables in the
在本實施例中,藉由採用多組上述的垂向調節組件8,可以對上平板3及氣足2之間的豎直方向的距離進行微調及上平板3在Rx及Ry自由度上進行微調,且能抵消位於垂向調節組件8上方的結構的部分重力,實現豎直方向的重力補償;本實施例提供的垂向調節組件8安裝及維護方便,體積較小,適用於在垂直空間狹小的位置進行垂向調節組件8的佈置、維護及拆卸,有利於減小工作台的整體結構尺寸,降低工作台的豎直方向的尺寸,使工作台運動更加平穩,有利於工作台的高速及高精度運行。
In this embodiment, by using multiple sets of the above-mentioned
圖10為本實施例提供的支撐組件10的結構示意圖,如圖10所示,本實施例提供的工作台亦包含支撐組件10,支撐組件10包含支撐座101及彈性片102,其中,支撐座101的下端與氣足2固定連接,氣足2上設置有用於支撐座101連接定位的定位槽212;彈性片102為輪輻狀結構,支撐座101的上端與彈性片102的內圈固定連接。彈性片102的外圈與上平板3的下表面固定連接。當多組垂向調節組件8的調節高度相異時,垂向調節組件8對應的各個彈性片102外側的部分的變形相異,而彈性片102內圈因支撐座101的限制基本不發生變形,從而可藉由彈性片102外圈的變形實現Z向平移、繞x向轉動並繞Y向轉動的解耦運動。
FIG. 10 is a schematic structural diagram of a
在本實施例中,彈性片102與支撐座101的藉由上環片及下環片103固定,彈性片102的內圈設置在上環片及下環片103之間,並被上環片及下環片103夾緊,上環片及下環片103藉由螺紋等連接方式與支撐座101連接。彈性片102與上平板3藉由相對設置的上夾板及下夾板104實現,彈性片102設置在上夾板及下夾板104之間,並被上夾板及下夾板104夾緊固定,上夾板及下夾板104藉由螺紋等連接方式與上平板3連接,上夾板與下夾板104均沿彈性片102的周向均勻間隔設置,且上夾板與下夾板104有三組。在其他實施例中,彈性片102與支撐座101及上平板3之間的連接亦可以為其他的可拆卸連接形式。
In this embodiment, the
在本實施例中,彈性片102對應於第四通光孔31的位置開設有第五通光孔,第五通光孔的面積大於第四通光孔31,且第五通光孔的內徑等於支撐座101的外徑,可以提高彈性片102對應的各垂向調節組件8的位置處的變形靈敏度。每組上夾板及下夾板104均設置在第五通光孔的外側邊緣,有利
於上夾板及下夾板104的安裝。且在本實施例中,上夾板及下夾板104均為弧形結構,其內徑等於第五通光孔的外徑。彈性片102在第五通光孔的兩側開設有防撕裂槽,設置為防止彈性片102受力撕裂,多個第五通光孔的防撕裂槽沿支撐座101的周向呈放射狀設置。
In this embodiment, the
在本實施例中,支撐座101為圓筒形結構,且包含三個沿周向均勻間隔設置的支腳,每個支腳的側壁均開設有貫穿支腳側壁的槽。該種支撐座101的結構,在保證支撐穩定性的同時,亦能減輕支撐座101的整體重量。在本實施例中,彈性片102為簧片,在其他實施例中,彈性片102亦可以為其他能夠產生彈性變形的薄片狀結構。
In this embodiment, the
圖11為本實施例提供的吸盤座4及旋轉調節組件9的結構示意圖,圖12為圖11中I處的局部放大圖,如圖11及圖12所示,本實施例提供的吸盤座4為圓盤形結構,本實施例提供的旋轉調節組件9包含弧形電機91、弧形導向塊92及第二導氣組件93。弧形電機91包含定子911及能相對定子911轉動的轉子912,其中,定子911與上平板3固定連接,定子911呈弧形結構,包含弧形的定殼體9111及線圈9112,其中線圈9112設置在定殼體9111的容置槽中,並位於定殼體9111及轉子912之間。轉子912包含弧形的動殼體9121及磁鐵9122,動殼體9121一側與吸盤座4固定連接,其朝向吸盤座4的一側與吸盤座4外壁緊密貼合,多個磁鐵9122間隔設置在動殼體9121遠離吸盤座4的一側,且相鄰兩個磁鐵9122間的磁性相反。磁鐵9122與線圈9112相對設置,當弧形電機91通電後,藉由線圈9112及磁鐵9122間產生的磁力作用帶動動殼體9121相對定殼體9111轉動,從而實現吸盤座4相對上平板3繞Z向的轉動。
11 is a schematic diagram of the structure of the
為對吸盤座4的繞Z向轉動提供導向,上平板3上設置有多個弧形導向塊92,弧形導向塊92朝向吸盤座4的一側為弧形面,且弧形面的直徑與吸盤座4的外徑配合,多個弧形導向塊92沿吸盤座4的周向均勻間隔設置。為減小吸盤座4繞Z向轉動的摩擦,提高Z向轉動調節的精度,旋轉調節組件9亦包含第二導氣組件93,且弧形導向塊92為氣浮導向塊,藉由設置第二導氣組件93,使吸盤座4浮在上平板3上,同時採用氣浮導向塊對吸盤座4的轉動進行導向,實現吸盤座4在繞Z向轉動時的無摩擦運動。在本實施例中,三個弧形導向塊92沿吸盤座4的側壁均勻間隔設置,在其他實施例中,弧形導向塊92的個數亦可為兩個、四個或多個。
In order to provide guidance for the rotation of the
在一實施例中,上平板3的上表面及吸盤座4的下表面中的至少一個設置有充氣氣道,第二導向組件的第一端與氣足2內部連通,第二導向組件的第二端與充氣氣道連通,將氣足2中的正壓空氣充入充氣氣道中,使上平板3與吸盤座4之間形成氣膜,且吸盤座4浮在上平板3上。上平板3的上表面及吸盤座4的下表面中的至少一個開設有第三吸附氣道,用於上平板3與吸盤座4的真空吸附。
In one embodiment, at least one of the upper surface of the
在本實施例中,在上平板3的上表面開設有充氣氣道及第三吸附氣道。第二導氣組件93包含第三分流塊931、第二導氣管932以及第四分流塊933。第三分流塊931的兩端分別連通氣足2內部及第二導氣管932的第一端,第四分流塊933連接第二導氣管932的第二端。第三分流塊931具有三個分流出口,第四分流塊933分別具有三個分流入口及三個分流出口,第二導氣管932具有三個分氣管,每個分氣管連通分別連通一個第三分流塊931的分流出口及第四分流塊933的分流入口,第四分流塊933的三個分流出口分別連通
至充氣氣道、第三吸附氣道以及弧形導向塊92。
In this embodiment, an inflation air passage and a third adsorption air passage are opened on the upper surface of the
在本實施例中,第二導氣管932包含三根波紋管,三根波紋管分別連通第三分流塊931的三個分流出口及第四分流塊933的三個分流入口。在其他實施例中,第二導氣管932可以為螺旋軟管,螺旋軟管內包含三根軟管,三根軟管分別連通第三分流塊931的三個分流出口及第四分流塊933的三個分流入口。採用波紋管或螺旋軟管,可以使波紋管或螺旋軟管在隨工作台微動時,不產生應力,即不會影響工作台的運動性能。
In this embodiment, the
在本實施例中,藉由設置三根分流管及三個分流出口,可以第四分流塊933的每個分流出口依次連通充氣氣道、第三吸附氣道以及弧形導向塊92,能根據實際需要對每個氣道進行開啟或關閉以及對進入氣道的流量進行調節,使整個氣路系統調節性能更強,更適用於實際運用。在其他實施例中,亦可根據實際需要選擇分流管及分流口的個數,如用於使吸盤座4浮在上平板3上的充氣氣道及用於使上平板3吸附吸盤座4的第三吸附氣道不會同時使用,因此,充氣氣道及第三吸附氣道可以共用一個氣道,當向該共用氣道充入正壓空氣使吸盤座4浮在上平板3上時,該共用氣道充當充氣氣道,當向該共用氣道抽真空使上平板3吸附吸盤座4時,該共用氣道充當第三吸附氣道。
In this embodiment, by arranging three shunt pipes and three shunt outlets, each shunt outlet of the
在一實施例中,圖13為本實施例提供的上平板3的仰視圖,圖14為本實施例提供的上平板3的俯視圖,結合圖13及圖14所示,上平板3的上表面凸設有多個氣浮面38,多個氣浮面38沿與吸盤座4同軸的圓周均勻間隔設置。上平板3的下表面開設有第一環形氣道32,上平板3內部水平開設有連通第三分流塊931的一個分流出口及第一環形氣道32的第一連通氣道34,上平板3內部垂直開設有連通氣浮面38及第一環形氣道32的第二連通氣道
35,充氣氣道包含依次連通的第一連通氣道34、第一環形氣道32及第二連通氣道35。其中,第一連通氣道34可以設置多個,第二連通氣道35至少每個氣浮面38對應設置一個。在本實施例中,氣浮面38的個數為三個,每個氣浮面38對應設置一個第二連通氣道35,在其他實施例中,第一連通氣道34、氣浮面38及第二連通氣道35的個數可以根據實際需要具體設置。
In one embodiment, FIG. 13 is a bottom view of the
上平板3的上表面開設有多個真空腔39,真空腔39的上端面與氣浮面38平齊,多個真空腔39沿與吸盤座4同軸的圓周間隔設置。上平板3的下表面開設有第二環形氣道33,上平板3內部水平開設有連通第三分流塊931的另一分流口及第二環形氣道33的第三連通氣道36,上平板3內部垂直開設有連通真空腔39及第二環形氣道33的第四連通氣道37,第三吸附氣道包含依次連通的第三連通氣道36、第二環形氣道33及第四連通氣道37。在本實施例中,氣浮面38所在的圓周與真空腔39所在的圓周相同,每個氣浮面38沿圓周周向的兩側分別設置有一個真空腔39。在其他實施例中,真空腔39的個數及位置關係可以根據實際需要具體設置。
The upper surface of the
在本實施例中,因藉由上平板3底部的環形氣道將正壓氣體或真空通入上平板3上表面,該種設置方式可以使氣路的佈置更為簡單方便,佔用空間更小,不會對設置在上平板3上方的吸盤座4的佈置造成干涉,有利於簡化工作台整體結構及方便工作台的安裝。為防止真空氣體或正壓氣體從上平板3的底部流出上平板3外部,上平板3底部設置有環形的第一密封板,設置為密封第一環形氣道32及第二環形氣道33。
In this embodiment, because the positive pressure gas or vacuum is introduced into the upper surface of the
吸盤座4設置在上平板3與吸盤5之間,吸盤座4的上端面用於吸附吸盤5。在吸盤座4的上表面及吸盤5的下表面中的至少一個開設有第
二吸附氣道42,用於將吸盤5真空吸附至吸盤座4上。在本實施例中,吸盤座4的上表面開設有第二吸附氣道42。吸盤5設置在吸盤座4上表面,吸盤5上表面開設有用於吸附基底20的第一吸附氣道。在本實施例中,第一吸附氣道藉由吸盤座4連通第一導氣組件6,吸盤座4上對應於第一吸附氣道設置有轉接氣路。
The
在本實施例中,第一吸附氣道包含第一氣道53、第二氣道54及第三氣道55,分別與六寸、八寸及十二寸的基底20相適應。因此,轉接氣路對應設置有連通第一氣道53的第一轉接氣路、連通第二氣道54的第二轉接氣路及連接第三氣道55的第三轉接氣路。
In this embodiment, the first adsorption air passage includes a
在一實施例中,圖15為本實施例提供的吸盤座4及第一導氣組件6的結構示意圖,如圖15所示,第一導氣組件6包含第一分流塊、第一導氣管61及第二分流塊62。第一分流塊兩端分別連接氣足2內部及第一導氣管61,第二分流塊62分別連通第一導氣管61及吸盤座4。第一分流塊有四個分流出口、第二分流塊62具有四個分流入口,第一導氣管61具有四個分流管,分別對應連接第一分流塊的四個分流出口及第二分流塊62的四個分流入口。第二分流塊62具有四個分流出口,分別連通第二吸附氣道42、第一轉接氣路、第二轉接氣路及第三轉接氣路。
In one embodiment, FIG. 15 is a schematic diagram of the structure of the
在本實施例中,第一導氣管61包含四根波紋管,四根波紋管分別連通第一分流塊的四個分流出口及第二分流塊62的四個分流入口。在其他實施例中,第一導氣管61可以為螺旋軟管,螺旋軟管內包含四根軟管,四根軟管分別連通第一分流塊的四個分流出口及第二分流塊62的四個分流入口。採用波紋管或螺旋軟管,可以使波紋管或螺旋軟管在隨工作台微動時,不產生
應力,即不會影響工作台的運動性能。
In this embodiment, the
在本實施例中,藉由設置四根分流管及四個分流出口,可以第二分流塊62的每個分流出口依次連通第二吸附氣道42、第一轉接氣路、第二轉接氣路及第三轉接氣路,能根據實際需要對每個氣道進行開啟或關閉以及對進入氣道的流量進行調節,使整個氣路系統調節性能更強,更適用於實際運用。在其他實施例中,亦可根據實際需要選擇分流管及分流口的個數。
In this embodiment, by arranging four shunt pipes and four shunt outlets, each shunt outlet of the
如圖15所示,吸盤座4上端面開設有環形凹槽,環形凹槽內均勻間隔設置有多個轉接塊43,轉接塊43的內側與環形凹槽的內槽壁抵接,轉接塊43的外側與環形凹槽的外槽壁抵接,且轉接塊43的上端面與吸盤座4的上表面平齊。吸盤座4上表面於環形凹槽的內側開設有第三環形氣道421,吸盤座4上表面於環形凹槽的外側開設有第四環形氣道423,轉接塊43的上表面開設有連通第三環形氣道421及第四環形氣道423的轉接氣道422。第二吸附氣道42包含依次連通的第三環形氣道421、轉接氣道422及第四環形氣道423,第二環形氣道33連通於第二分流塊62的第一分流口。
As shown in Figure 15, the upper end surface of the
第一轉接氣路包含在轉接塊43及吸盤座4內部水平開設的第一水平氣道、在吸盤座4下表面開設的環形過氣凹槽以及在垂直貫穿吸盤座4及轉接塊43的第一垂直氣道46,其中,每個轉接塊43及對應的吸盤座4處均開設有第一垂直氣道46,第一水平氣道的兩端分別連通第二分流塊62的第二分流口及環形過氣凹槽,第一垂直氣道46分別連通環形過氣凹槽及第一氣道53。吸盤座4下表面設置有第二密封板,設置為底部密封環形過氣凹槽。
The first adapter air path includes a first horizontal air channel horizontally opened inside the
第二轉接氣路包含在轉接塊43及吸盤座4內部水平開設的第二水平氣道、設置在環形凹槽內部的第一導流管44以及在轉接塊43內部垂直開
設的第二垂直氣道47。其中,第二水平氣道連通第二分流塊62的第三分流口;第一導流管44為類環形,且依次水平貫穿各個轉接塊43,第一導流管44分別連通第二垂直氣道47及第二水平氣道,第二垂直氣道47連通第二氣道54。第三轉接氣路的設置與第二轉接氣路類似,包含在轉接塊43及吸盤座4內部水平開設的第三水平氣道、設置在環形凹槽內部的第二導流管45以及在轉接塊43內部垂直開設的第三垂直氣道48,其中,第三水平氣道連通第二分流塊62的第四分流口,第三垂直氣道48連通第三氣道55,第二導流管45設置在第一分流管的外側。在本實施例中,第一垂直氣道46位於第一圓周上、第二垂直氣道47位於第二圓周上,第三垂直氣道48位於第三圓周上,第一圓周、第二圓周及第三圓周同軸設置且從內到外依次設置,分別適應於六寸、八寸及十二寸基底20的尺寸。
The second adapter air path includes a second horizontal air channel horizontally opened inside the
在本實施例中,藉由設置帶有環形凹槽的吸盤座4,在吸盤座4的底部設置環形過氣凹槽,可以避免在環形凹槽內設置過多的導流管,有利於減小環形凹槽的體積,且避免在直徑較小的第一圓周處設置導流管所導致的內部空間不足或對第三通光孔41造成遮蔽等情況。藉由在環形凹槽內部設置第一導流管44、第二導流管45及轉接塊43以及環形過氣凹槽的設置,可以將第二分流塊62的氣流均勻導向至第一圓周、第二圓周及第三圓周的周向各處,有利於對基底20的均勻吸附。
In this embodiment, by arranging the
圖16為本實施例提供的吸盤5的結構示意圖,圖17為圖16中吸盤5的氣道分佈示意圖,如圖16及圖17所示,在本實施例中,吸盤5為圓盤形,第一氣道53包含在吸盤5內部徑向設置的第一道、沿吸盤5的豎直方向設置的第二道及第三道,其中,第二道上端連通第一道,第二道下端貫穿吸
盤5下表面且連通第四連通氣道37,第三道下端連通第一道,第三道上端貫穿吸盤5上表面,且第三道沿第一道的長度方向間隔設置有多個,且第三道設置在吸盤5中心與第二道之間,用於實現對基底20徑向的均勻吸附。第二氣道54與第三氣道55的設置與第一氣道53類似,第二氣道54包含徑向設置的第四道及垂直設置的第五道及第六道,其中,第五道上端連通第四道,第五道下端連通第六連通氣道,第六道下端連通第四道,第六道上端貫穿吸盤5上表面;第三氣道55包含徑向設置的第七道及沿豎直方向設置的第八道及第九道,其中,第八道上端連通第七道,第八道下端連通第八連通氣道,第九道下端連通第七道,第九道上端貫穿吸盤5上表面。在本實施例中,第三道設置在第二道的內側,其沿第一道的長度方向間隔設置有多個,第六道設置在第二道與第五道之間,且沿第四道的長度方向間隔設置有多個,第九道設置在第五道外側,且沿第七道長度方向間隔設置有多個,且第一道、第四道及第七道均沿吸盤5的周向間隔設置有多個。
16 is a schematic diagram of the structure of the
本實施例中,第一氣道53、第二氣道54及第三氣道55的設置方式,適用於六寸、八寸及十二寸基底20的吸附,當基底20為六寸基底20時,採用第一氣道53對基底20進行吸附;當基底20為八寸基底20時,採用第一氣道53及第二氣道54同時對基底20進行吸附;當基底20為十二寸基底20時,採用第一氣道53、第二氣道54及第三氣道55同時對基底20進行吸附,在節省資源的同時,能夠適用於各個相異尺寸基底20的吸附。且能在基底20的周向及徑向上實現均勻的吸附。
In this embodiment, the arrangement of the
本實施例亦提供一種包含上述工作台的背面對準裝置。 This embodiment also provides a back alignment device including the above-mentioned workbench.
本發明提供的背面對準裝置,藉由採用上述的工作台,可用一 套照明裝置捕獲所有背面對準標記,簡化背面對準裝置的整體結構,提高背面對準裝置的裝配複雜度,降低背面對準裝置的成本,提高背面對準裝置的工藝適應性。 The back alignment device provided by the present invention, by using the above-mentioned workbench, can be used with a A set of lighting devices captures all back alignment marks, simplifies the overall structure of the back alignment device, improves the assembly complexity of the back alignment device, reduces the cost of the back alignment device, and improves the process adaptability of the back alignment device.
本發明主張於2018年05月18日提交中國專利局,申請號為201810481198.8之中國專利申請的優先權,該發明的全部內容藉由引用結合在本發明中。 The present invention claims the priority of the Chinese patent application filed with the Chinese Patent Office on May 18, 2018, the application number is 201810481198.8, and the entire content of the invention is incorporated into the present invention by reference.
1‧‧‧水平基座 1‧‧‧Horizontal base
2‧‧‧氣足 2‧‧‧Enough
3‧‧‧上平板 3‧‧‧Upper plate
4‧‧‧吸盤座 4‧‧‧Suction cup holder
5‧‧‧吸盤 5‧‧‧Sucker
7‧‧‧水平調節組件 7‧‧‧Horizontal adjustment components
8‧‧‧垂向調節組件 8‧‧‧Vertical adjustment assembly
9‧‧‧旋轉調節組件 9‧‧‧Rotation adjustment assembly
52‧‧‧第二透光片 52‧‧‧Second light-transmitting film
Claims (16)
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CN111390845B (en) * | 2019-11-26 | 2023-05-05 | 浙江杭机股份有限公司 | Static pressure rotary worktable |
JP2023009504A (en) * | 2021-07-07 | 2023-01-20 | 株式会社Screenホールディングス | Wafer alignment device, wafer processing device, wafer alignment method and wafer processing method |
CN114193408B (en) * | 2021-12-28 | 2022-12-09 | 江苏伟博机械制造有限公司 | Damping pressing equipment for plate processing |
CN114536951B (en) * | 2022-02-21 | 2023-05-02 | Tcl王牌电器(惠州)有限公司 | Printing auxiliary device and printing system |
CN114678320A (en) * | 2022-03-18 | 2022-06-28 | 深圳市鹰眼在线电子科技有限公司 | Mini LED mounting head vacuum distribution device |
CN114683223B (en) * | 2022-03-29 | 2023-01-06 | 苏州矽行半导体技术有限公司 | Wafer carrying platform |
CN115435015B (en) * | 2022-09-21 | 2023-10-24 | 江苏京创先进电子科技有限公司 | Air-floatation rotary table and working method thereof |
CN115547916B (en) * | 2022-12-01 | 2023-03-14 | 上海隐冠半导体技术有限公司 | Rotating table and moving device |
CN116387234B (en) * | 2023-04-11 | 2023-12-19 | 北京瑞邦精控科技有限公司 | Wafer bearing device |
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- 2018-05-18 CN CN201810481198.8A patent/CN110504203A/en active Pending
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- 2019-05-13 WO PCT/CN2019/086604 patent/WO2019218961A1/en active Application Filing
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CN101241314A (en) * | 2008-03-11 | 2008-08-13 | 上海微电子装备有限公司 | 6 freedom degree precision positioning station capable of compensating Z-direction position |
CN102540781A (en) * | 2010-12-28 | 2012-07-04 | 上海微电子装备有限公司 | Backside alignment device and method |
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CN110504203A (en) | 2019-11-26 |
KR20210010582A (en) | 2021-01-27 |
TW202004953A (en) | 2020-01-16 |
KR102427693B1 (en) | 2022-08-01 |
WO2019218961A1 (en) | 2019-11-21 |
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