TWI745645B - Single-sided and double-sided sidewall inspection system and paired mirror assembly device - Google Patents

Single-sided and double-sided sidewall inspection system and paired mirror assembly device Download PDF

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TWI745645B
TWI745645B TW107146567A TW107146567A TWI745645B TW I745645 B TWI745645 B TW I745645B TW 107146567 A TW107146567 A TW 107146567A TW 107146567 A TW107146567 A TW 107146567A TW I745645 B TWI745645 B TW I745645B
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image
image capturing
side wall
mirror
hole
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TW202024602A (en
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張勛豪
黃冠勳
鄒嘉駿
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由田新技股份有限公司
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Priority to CN201911229714.9A priority patent/CN111351797A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515Objects of complex shape, e.g. examined with use of a surface follower device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

The invention provides a single-sided and double-sided sidewall inspection system, comprising an object platform, an image capturing device, and one or plurality of reflecting mirror. The image capturing device is disposed on one side of the object to capture an image of the object. The reflecting mirror is disposed between the image capturing device and the object platform, whereby the reflecting mirror reflects the inner side wall of the hole from the object, to obtain the defect through the reflecting mirror from the image capturing device.

Description

單側及雙側式檢測系統及成對反射鏡組裝置Single-sided and double-sided detection system and paired mirror group device

本發明係有關於一種光學檢測系統,尤指一種用以檢測待測物孔洞側壁的光學檢測系統。The present invention relates to an optical detection system, in particular to an optical detection system for detecting the side wall of a hole of an object to be tested.

自動光學檢查(Automated Optical Inspection, AOI),係運用機器視覺做為檢測標準技術,透過機器視覺取代傳統人眼辨識以達到高精密度及高效率的檢測。作為改良傳統上以人力使用光學儀器進行檢測的缺點,應用層面包括從高科技產業之研發、製造品管、國防、民生、醫療、環保、電力等領域。Automated Optical Inspection (AOI) uses machine vision as the inspection standard technology to replace traditional human eye recognition through machine vision to achieve high-precision and high-efficiency inspections. As an improvement on the shortcomings of the traditional use of optical instruments for inspection by humans, the application level includes areas such as research and development, manufacturing quality control, national defense, people's livelihood, medical care, environmental protection, and electricity in high-tech industries.

在光學檢測領域中,複雜表面的檢測相對平滑表面較為困難,一般可視性的複雜表面取決於攝影機的景深範圍,若是攝影機的景深足夠一般都可以克服。相對而言,針對平面不可視的缺陷,則是難以由傳統的光學方式(例如平面拍攝)進行檢測,以致於在進行這類的檢測時非常的耗時耗功,難以達到相應的效率。In the field of optical inspection, it is more difficult to detect complex surfaces than smooth surfaces. Generally, the visibility of complex surfaces depends on the depth of field of the camera. If the depth of field of the camera is sufficient, it can generally be overcome. Relatively speaking, it is difficult to detect defects with invisible planes by traditional optical methods (such as plane shooting), so that such inspections are very time-consuming and labor-intensive, and it is difficult to achieve corresponding efficiency.

本發明的目的,在於提供一種單側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、以及一影像擷取裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像,其中該影像擷取裝置與該孔洞側壁之間具有一取像傾角,以擷取該孔洞側壁的影像。The object of the present invention is to provide a single-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and an image capturing device. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is an image capturing angle between the image capturing device and the side wall of the hole to capture the side wall of the hole image.

本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一第一影像擷取裝置、以及一第二影像擷取裝置。該待測物載台用以承載該待測物。該第一影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像,其中該第一影像擷取裝置與該孔洞側壁之間具有一第一取像傾角,以擷取該孔洞側壁的第一側影像。該第二影像擷取裝置設置於該待測物載台一側,用以擷取該待測物影像,其中該第二影像擷取裝置與該孔洞側壁之間具有一第二取像傾角,使該影像擷取裝置擷取該孔洞側壁的一第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and a first image capturing device , And a second image capturing device. The test object carrier is used to carry the test object. The first image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is a first image capturing inclination between the first image capturing device and the side wall of the hole to Capture the first side image of the side wall of the hole. The second image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is a second image capturing inclination between the second image capturing device and the side wall of the hole, The image capturing device captures a second side image of the side wall of the hole.

本發明的另一目的,在於提供一種單側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一影像擷取裝置、以及一反射鏡裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該反射鏡裝置設置於該影像擷取裝置及該待測物載台之間,該反射鏡裝置與該孔洞側壁之間具有一取像傾角,使該影像擷取裝置透過該反射鏡裝置擷取該孔洞側壁的影像。Another object of the present invention is to provide a single-sided detection system for detecting at least one side wall of a hole on an object to be tested, the single-sided detection system including a platform for the object to be tested, an image capturing device, and A mirror device. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. The reflecting mirror device is arranged between the image capturing device and the object-to-be-tested stage, and there is an image capturing angle between the reflecting mirror device and the side wall of the hole, so that the image capturing device can capture through the reflecting mirror device The image of the side wall of the hole.

本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一第一影像擷取裝置與一第二影像擷取裝置、一第一反射鏡裝置、以及一第二反射鏡裝置。該待測物載台用以承載該待測物。該第一影像擷取裝置與該第二影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該第一反射鏡裝置設置於該第一影像擷取裝置及該待測物載台之間,其中該第一反射鏡裝置與該孔洞側壁之間具有一第一取像傾角,使該第一影像擷取裝置透過該第一反射鏡裝置擷取該孔洞側壁的第一側影像。該第二反射鏡裝置設置於該第二影像擷取裝置及該待測物載台之間,該第二反射鏡與該孔洞側壁之間具有一第二取像傾角,使該第二影像擷取裝置透過該第二反射鏡裝置擷取該孔洞側壁的第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and a first image capturing device And a second image capturing device, a first mirror device, and a second mirror device. The test object carrier is used to carry the test object. The first image capturing device and the second image capturing device are arranged on one side of the test object carrier to capture images of the test object. The first mirror device is disposed between the first image capturing device and the object-to-be-tested stage, wherein there is a first image acquisition inclination between the first mirror device and the side wall of the hole, so that the first The image capturing device captures the first side image of the side wall of the hole through the first mirror device. The second mirror device is disposed between the second image capturing device and the object-to-be-tested stage, and there is a second image capturing angle between the second mirror and the side wall of the hole, so that the second image is captured The capturing device captures the second side image of the side wall of the hole through the second mirror device.

本發明的另一目的,在於提供一種成對反射鏡組裝置,包括一第一反射鏡、以及一第二反射鏡。該第一反射鏡設置於該影像擷取裝置及該待測物載台之間,該第一反射鏡與該待測物的孔洞側壁之間具有一第一取像傾角。該第二反射鏡設置於該影像擷取裝置及該待測物載台之間並設置於該第一反射鏡的對向側,該第二反射鏡與該待測物的孔洞側壁之間具有一第二取像傾角。Another object of the present invention is to provide a paired mirror assembly device, including a first mirror and a second mirror. The first reflecting mirror is arranged between the image capturing device and the object under test platform, and there is a first image acquisition inclination between the first reflecting mirror and the side wall of the hole of the object under test. The second reflecting mirror is arranged between the image capturing device and the object-to-be-measured stage and arranged on the opposite side of the first reflecting mirror. There is a gap between the second reflecting mirror and the side wall of the hole A second acquisition inclination angle.

本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括一待測物載台、一影像擷取裝置、一如上所述的成對反射鏡組裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該影像擷取裝置透過該反射鏡擷取該孔洞側壁的第一側影像以及第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes a platform for the object to be tested, an image capture device, and a The paired mirror group device as described above. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. The image capturing device captures the first side image and the second side image of the side wall of the hole through the reflecting mirror.

本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括一待測物載台、一影像擷取裝置、複數個如上所述的成對反射鏡組裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。複數個如上所述的成對反射鏡組裝置,分別對應該待測物的孔洞側壁設置,該影像擷取裝置透過該反射鏡擷取該孔洞側壁的第一側影像以及第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes a platform for the object to be tested, an image capturing device, and A pair of mirror group devices as described above. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. A plurality of the above-mentioned paired mirror group devices are respectively arranged corresponding to the side wall of the hole of the object to be measured, and the image capturing device captures the first side image and the second side image of the side wall of the hole through the mirror.

本發明可以有效的提升光學檢測系統檢測盲孔、穿孔或是其他複雜表面的瑕疵的效率,相較於習知技術可以大幅地降低檢測所需的時間成本。The invention can effectively improve the efficiency of the optical detection system to detect blind holes, perforations or other complex surface defects, and can greatly reduce the time cost required for detection compared with the conventional technology.

再者,本發明機構設置簡單,相較於習知技術可以降低檢測的複雜度,同時降低設備的維修成本。Furthermore, the mechanism of the present invention is simple to set up, and compared with the conventional technology, the complexity of detection can be reduced, and the maintenance cost of the equipment can be reduced at the same time.

有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必照實際比例繪製,該等圖式及其比例並非用以限制本發明之範圍,在此先行敘明。The detailed description and technical content of the present invention will now be described in conjunction with the drawings as follows. Furthermore, for the convenience of description, the figures in the present invention are not necessarily drawn according to actual proportions. These figures and their proportions are not intended to limit the scope of the present invention, and are described here first.

於本發明中並未於圖式中明確揭示有控制器,惟,可理解本發明係應用於光學檢測設備,必然包括有用於執行影像處理用的影像處理器;為協調各部裝置的運作,其必然包括中央控制器(例如PLC)調整各部裝置的參數,以確保裝置的運作順暢並消弭誤差;裝置可個別包括獨立的控制器及對應的韌體,以切換各裝置的工作模式、或是由感測器反饋對應的參數等,在此必須先予以敘明。In the present invention, the controller is not explicitly disclosed in the drawings. However, it can be understood that the present invention is applied to optical inspection equipment and must include an image processor for performing image processing; in order to coordinate the operation of various devices, It must include a central controller (such as PLC) to adjust the parameters of each device to ensure the smooth operation of the device and eliminate errors; the device can individually include an independent controller and corresponding firmware to switch the working mode of each device, or by The parameters corresponding to the sensor feedback must be described here first.

該等控制器例如可以為中央處理器(Central Processing Unit;CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor;DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits;ASIC)、可程式化邏輯裝置(Programmable Logic Device;PLD)或其他類似裝置或這些裝置的組合。The controllers can be, for example, a central processing unit (Central Processing Unit; CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessors), digital signal processors (Digital Signal Processors; DSPs), Programmable controller, Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD) or other similar devices or a combination of these devices.

本發明光學檢測系統主要是用於對複雜表面的待測物進行光學檢測,該等複雜表面包括凹凸表面、金柱、盲孔、穿孔等,用以特別針對平面拍攝時待測物表面不容易顯示的側壁進行檢測。本發明用於盲孔、穿孔的檢測上特別具有功效,可以經由一次性拍攝即完成複數個盲孔、穿孔內部孔壁的檢測。The optical detection system of the present invention is mainly used for optical detection of objects to be tested on complex surfaces, such complex surfaces including concave and convex surfaces, gold pillars, blind holes, perforations, etc., which are particularly difficult for the surface of the object to be tested when shooting in a plane. The sidewalls shown are inspected. The present invention is particularly effective for detecting blind holes and perforations, and can complete the detection of multiple blind holes and the inner wall of the perforation through one-time shooting.

以下係針對本發明複數個不同實施例分別進行說明,請先一併參閱「圖1」,係本發明第一實施例的外觀示意圖。The following is a description of a plurality of different embodiments of the present invention. Please refer to "FIG. 1" first, which is a schematic diagram of the appearance of the first embodiment of the present invention.

本實施例係提供一種單側式待測物側壁檢測系統100,包括一待測物載台10A、一影像擷取裝置20A、一反射鏡裝置30A、以及一第一移載裝置40A。This embodiment provides a single-sided object-to-be-tested sidewall inspection system 100, which includes an object-to-be-tested stage 10A, an image capture device 20A, a mirror device 30A, and a first transfer device 40A.

待測物載台10A係用以承載該待測物AN。於其中一較佳實施例中,該待測物載台10A係可以為用以擺設待測物AN的平台,透過治具固定待測物AN位置。於用以檢測穿孔的實施例中,該待測物載台10A係可以做為一第二光源,用以對待測物AN提供背光源,該第二光源設置於該孔洞側壁H下方,以提供該孔洞側壁H照明光源,以對該穿孔內側提供均光照明。於較佳實施例中,該第二光源包括一面光源,其中該面光源的面積與該待測物AN成正比,於本發明中對於該待測物載台10A的實施例不予以限制。The test object carrier 10A is used to carry the test object AN. In one of the preferred embodiments, the test object carrier 10A can be a platform for placing the test object AN, and the position of the test object AN is fixed by a jig. In the embodiment for detecting the perforation, the test object carrier 10A can be used as a second light source to provide a backlight source for the test object AN, and the second light source is arranged under the side wall H of the hole to provide The side wall H of the hole illuminates the light source to provide uniform illumination to the inner side of the hole. In a preferred embodiment, the second light source includes a surface light source, wherein the area of the surface light source is proportional to the test object AN, and the embodiment of the test object stage 10A is not limited in the present invention.

影像擷取裝置20A設置於該待測物載台10A一側,用以擷取待測物影像。該影像擷取裝置20A係透過感光元件及對應的鏡頭拍攝待測物AN的影像,並將所獲取的影像傳送至後端的影像處理裝置IP進行影像分析,以確認待測物AN的瑕疵狀態並完成檢測。於本實施例中,為了進行高精度的檢測,該影像擷取裝置20A包括一成像單元21A、一設置於該成像單元21A上的物鏡22A、以及一結合於該物鏡22A的第一光源。其中該成像單元21A係包括複數個感光元件。該物鏡22A內側對應於其光路設置有複數個光學元件(例如透鏡、鏡片)。該影像擷取裝置包括但不限於線掃描攝影機或面掃描攝影機。於一較佳實施例中,該影像擷取裝置係可以為線掃描攝影機,有利於增加檢測的效率。所述的第一光源設置於該孔洞側壁H上方,以提供該孔洞側壁H照明光源。於較佳實施例中,該第一光源的類型包括同軸光源23A、側向光源70A或環形光源。The image capturing device 20A is arranged on the side of the test object stage 10A to capture the image of the test object. The image capturing device 20A captures the image of the test object AN through the photosensitive element and the corresponding lens, and sends the acquired image to the back-end image processing device IP for image analysis to confirm the defect status of the test object AN and Complete the test. In this embodiment, in order to perform high-precision detection, the image capturing device 20A includes an imaging unit 21A, an objective lens 22A disposed on the imaging unit 21A, and a first light source combined with the objective lens 22A. The imaging unit 21A includes a plurality of photosensitive elements. The inner side of the objective lens 22A is provided with a plurality of optical elements (for example, lenses, mirrors) corresponding to the optical path thereof. The image capturing device includes, but is not limited to, a line scan camera or an area scan camera. In a preferred embodiment, the image capturing device can be a line scan camera, which is beneficial to increase the detection efficiency. The first light source is arranged above the side wall H of the hole to provide an illuminating light source for the side wall H of the hole. In a preferred embodiment, the type of the first light source includes a coaxial light source 23A, a side light source 70A, or a ring light source.

反射鏡裝置30A設置於該影像擷取裝置20A及該待測物載台10A之間。該反射鏡裝置30A於一較佳實施例中,係可以為金屬鍍膜反射鏡、矽光反射鏡、介電質光反射鏡等,於本發明中不予以限制。該反射鏡裝置30A與該待測物AN目標側壁之間具有一取像傾角A,以令該孔洞側壁H落在該反射鏡裝置30A相對該影像擷取裝置20A的取像範圍內。其中該反射鏡裝置30A具有一調整機構,藉以調整該反射鏡裝置30A的該取像傾角A的範圍。於較佳實施例中,該反射鏡裝置30A包括一平面鏡或一菱鏡,藉以由該影像擷取裝置20A透過該反射鏡裝置30A擷取該孔洞側壁H的影像。The mirror device 30A is disposed between the image capturing device 20A and the object stage 10A. In a preferred embodiment, the reflector device 30A can be a metal-coated reflector, a silicon light reflector, a dielectric light reflector, etc., which is not limited in the present invention. There is an imaging inclination A between the mirror device 30A and the target side wall of the object AN to be measured, so that the hole side wall H falls within the imaging range of the mirror device 30A relative to the image capturing device 20A. The reflector device 30A has an adjustment mechanism to adjust the range of the imaging inclination angle A of the reflector device 30A. In a preferred embodiment, the mirror device 30A includes a flat mirror or a diamond mirror, so that the image capturing device 20A captures the image of the side wall H of the hole through the mirror device 30A.

該影像擷取裝置20A及該反射鏡裝置30A設置於第一移載裝置40A上反射鏡(該反射鏡裝置30A亦可以結合於該物鏡22A上,並配合該物鏡22A從動),並將該影像擷取裝置20A及該反射鏡裝置30A,由該待測物載台10A的第一側位置移動至第二側位置,獲取該待測物AN整面所有該目標側壁的影像。於另一較佳實施例中,該待測物載台10A亦可以設置於一第二移載裝置上,用以移載該待測物載台10A相對該影像擷取裝置20A移動,該第二移載裝置係可以為可動式載台(或XYZ載台、XYθ載台等),可移載或移動待測物AN至適當的取像位置。The image capturing device 20A and the mirror device 30A are disposed on the mirror on the first transfer device 40A (the mirror device 30A can also be combined with the objective lens 22A and cooperate with the objective lens 22A to follow), and the The image capturing device 20A and the mirror device 30A are moved from the first side position of the test object stage 10A to the second side position to obtain images of all the target side walls of the entire surface of the test object AN. In another preferred embodiment, the object-under-test stage 10A can also be arranged on a second transfer device for moving the object-under-test stage 10A relative to the image capturing device 20A. The second transfer device can be a movable stage (or XYZ stage, XYθ stage, etc.), which can transfer or move the test object AN to an appropriate image capturing position.

請一併參閱「圖2」及「圖3」,係本發明第一實施例的光學路徑示意圖、以及成像示意圖。Please refer to "FIG. 2" and "FIG. 3" together, which are the schematic diagrams of the optical path and the imaging diagram of the first embodiment of the present invention.

如「圖2」,於進行檢測時,第一移載裝置40A係將該影像擷取裝置20A及該反射鏡裝置30A,由該待測物載台10A的第一側位置L1移動至第二側位置L2(如箭頭A1),完成該待測物AN於一整條路徑上盲孔及穿孔的檢測。為了將該待測物載台10A上待測物AN的目標影像反射至該影像擷取裝置20A,以拍攝待測物AN的孔洞側壁H,在該影像擷取裝置20A與待測物AN平面為90度設置的情況下,所述的取像傾角A至少必須要低於45度角。於較佳實施例中,為了減少取像距離,該取像傾角A係介於10度至20度之間,可以得到較佳的成像品質。所取得的影像如「圖3」所示,於進行單向的移動時,該待測物AN孔洞側壁H的第一側影像W1如斜線位置,係可以被影像擷取裝置20A拍攝並取得。相對該目標側壁W1的另一側孔洞側壁H的第二側影像(圖未示)則可以由鏡向的方式取得(例如整個影像擷取裝置及反射鏡裝置水平旋轉180度、反射鏡裝置180度鏡向旋轉、或是直接設置輔助影像擷取裝置及輔助反射鏡如後面第二實施例所示)。As shown in "FIG. 2", during inspection, the first transfer device 40A moves the image capturing device 20A and the mirror device 30A from the first side position L1 of the test object stage 10A to the second The side position L2 (such as the arrow A1) completes the detection of blind holes and perforations on the entire path of the test object AN. In order to reflect the target image of the test object AN on the test object stage 10A to the image capturing device 20A to photograph the side wall H of the hole of the test object AN, in the image capturing device 20A and the test object AN plane When it is set to 90 degrees, the inclination angle A of the image acquisition must be at least lower than 45 degrees. In a preferred embodiment, in order to reduce the imaging distance, the imaging inclination A is between 10 degrees and 20 degrees, so that better imaging quality can be obtained. The obtained image is shown in "FIG. 3". When moving in one direction, the first side image W1 of the side wall H of the hole of the test object AN is like a diagonal position, which can be captured and obtained by the image capturing device 20A. The second side image (not shown) of the hole side wall H on the other side of the target side wall W1 can be obtained by mirroring (for example, the entire image capturing device and the mirror device are rotated 180 degrees horizontally, the mirror device 180 The degree mirror rotates, or the auxiliary image capturing device and the auxiliary mirror are directly set (as shown in the second embodiment below).

有關於檢測時該影像擷取裝置20A的移動路徑,請一併參閱「圖4」及「圖5」,係本發明第一實施例的工作示意圖(一)及工作示意圖(二)。For the moving path of the image capturing device 20A during detection, please refer to "FIG. 4" and "FIG. 5" together, which are the working schematic diagram (1) and working schematic diagram (2) of the first embodiment of the present invention.

如「圖4」,於本實施例中,第一移載裝置40A係可以帶動該影像擷取裝置20A以S路徑方式移動,藉此取得待測物AN上複數排孔洞側壁H的影像。有關於S路徑轉折的次數取決於待測物AN的面積大小、或是該影像擷取裝置20A的取像範圍,於本發明中不予以限制。As shown in "FIG. 4", in this embodiment, the first transfer device 40A can drive the image capturing device 20A to move in an S path, thereby obtaining images of the side walls H of the plurality of rows of holes on the test object AN. The number of turns of the S path depends on the area of the object AN or the imaging range of the image capturing device 20A, which is not limited in the present invention.

於拍攝完該目標側壁的影像後,如「圖5」,到達路徑末端時,該影像擷取裝置20A及該反射鏡裝置30A係可以水平旋轉180度後,在延S路徑原路復歸至起始位置,完成孔洞側壁H第二側影像的檢測。藉此孔洞側壁H兩側的影像都可以被有效的取得。After shooting the image of the target side wall, as shown in "Figure 5", when reaching the end of the path, the image capturing device 20A and the mirror device 30A can be rotated 180 degrees horizontally, and then return to the original path along the S path. From the starting position, the detection of the second side image of the side wall H of the hole is completed. In this way, the images on both sides of the side wall H of the hole can be effectively obtained.

於另一較佳實施例中,該第一移載裝置40A係可以省略,而直接由該待測物載台10A(XY載台)相對該影像擷取裝置20A移動,以獲取所有側壁影像,此部分非屬本發明所欲限制的範圍。In another preferred embodiment, the first transfer device 40A can be omitted, and the test object stage 10A (XY stage) is directly moved relative to the image capturing device 20A to obtain all sidewall images. This part is not within the scope of the present invention.

關於光源配置的部分,請一併參閱「圖6」及「圖7」,係本發明第一實施例用於盲孔檢測及用於穿孔檢測的光學配置方式。Regarding the configuration of the light source, please refer to "FIG. 6" and "FIG. 7" together, which is the optical configuration method for blind hole detection and perforation detection according to the first embodiment of the present invention.

本發明用於盲孔檢測的實施例,請參閱圖6,盲孔檢測主要是透過同軸光源23A對待測物AN的孔洞側壁H進行補光,透過相對高指向性的同軸光照亮該孔洞側壁H,以凸顯該孔洞側壁H上的瑕疵。除了用同軸光進行補光外,亦可以透過一側或兩側的側向光源70A對待測物AN進行補光,該側向光源70A係可以為平行光源或是漫射光源,於較佳實施例中則是可以在多種光源中進行切換,以便後端影像處理設備對不同種類的瑕疵進行分類。For an embodiment of the present invention for blind hole detection, please refer to FIG. 6. Blind hole detection mainly uses coaxial light source 23A to fill light on the side wall H of the hole of the object AN to be measured, and illuminate the side wall of the hole with relatively high directivity coaxial light H, to highlight the flaws on the side wall H of the hole. In addition to supplementing light with coaxial light, the side light source 70A on one or both sides can also be used to supplement light to the object under test. In the example, it is possible to switch among multiple light sources so that the back-end image processing equipment can classify different types of defects.

本發明用於穿孔檢測的實施例,請參閱圖7,穿孔檢測主要是透過設置於待測物載台10A上的背光源80A進行補光。該背光源80A較佳係為漫射光源,透過均光板提供一致性的補光。為了進一步加強穿孔內壁的影像,於檢測穿孔的光學配置仍可以提供側向光源進一步補光。For an embodiment of the present invention used for perforation detection, please refer to FIG. The backlight source 80A is preferably a diffuse light source, which provides consistent fill light through a light homogenizing plate. In order to further enhance the image of the inner wall of the perforation, the optical configuration for detecting the perforation can still provide a side light source to further supplement the light.

於另一較佳實施例,請一併參閱「圖8」,係本發明第二實施例的外觀示意圖。以下針對本發明的第二實施例進行說明,由於本實施例與第一實施例的差異性僅在於本發明影像擷取裝置及反射鏡裝置的數量,相同部分即不再予以贅述。For another preferred embodiment, please also refer to "FIG. 8", which is a schematic diagram of the appearance of the second embodiment of the present invention. The second embodiment of the present invention will be described below. Since the difference between this embodiment and the first embodiment is only in the number of image capture devices and mirror devices of the present invention, the same parts will not be repeated.

本實施例除了原先包括的待測物載台10A、影像擷取裝置20A(第一影像擷取裝置)、反射鏡裝置30A(第一反射鏡裝置)、以及第一移載裝置40A之外,更進一步包括一第二影像擷取裝置50A、以及一第二反射鏡裝置60A。該第二影像擷取裝置50A設置於該待測物載台10A一側,用以拍攝待測物AN孔洞側壁H的影像。該第二反射鏡裝置60A設置於該第二影像擷取裝置50A及該待測物載台10A之間。In addition to the object stage 10A, the image capture device 20A (first image capture device), the mirror device 30A (first mirror device), and the first transfer device 40A originally included in this embodiment, It further includes a second image capturing device 50A and a second mirror device 60A. The second image capturing device 50A is arranged on the side of the test object carrier 10A, and is used to capture an image of the side wall H of the hole AN of the test object. The second mirror device 60A is disposed between the second image capturing device 50A and the object stage 10A to be tested.

請一併參閱「圖9」,係本發明第二實施例中第二影像擷取裝置50A的成像示意圖。由於該第二反射鏡裝置60A與該待測物AN相對該孔洞側壁H具有第二取像傾角B,該第二影像擷取裝置50A經由該第二反射鏡裝置60A拍攝該孔洞側壁H時將獲得該孔洞側壁H的第二側影像W2,藉以拍攝並獲得該孔洞側壁H的所有區域。Please also refer to "FIG. 9", which is a schematic diagram of imaging of the second image capturing device 50A in the second embodiment of the present invention. Since the second mirror device 60A and the test object AN have a second image capturing angle B with respect to the side wall H of the hole, the second image capturing device 50A will photograph the side wall H of the hole through the second mirror device 60A. The second side image W2 of the side wall H of the hole is obtained, so that all areas of the side wall H of the hole are photographed and obtained.

於較佳實施例中,該第二影像擷取裝置50A及該第二反射鏡裝置60A係相對該第一影像擷取裝置20A、第一反射鏡裝置30A以鏡向方式設置,並共同設置於該第一移載裝置40A上,藉由此方式該第一移載裝置40A移動時可同時透過第一影像擷取裝置20A及第一反射鏡裝置30A的組合取得目標側壁(第一方向)的影像、第二影像擷取裝置50A及第二反射鏡裝置60A的組合取得另一目標側壁(第二方向)的影像,藉此於一次路徑方向上完成兩側目標側壁的檢測。In a preferred embodiment, the second image capturing device 50A and the second mirror device 60A are arranged in a mirror direction with respect to the first image capturing device 20A and the first mirror device 30A, and are arranged together in On the first transfer device 40A, in this way, when the first transfer device 40A moves, the target sidewall (first direction) can be obtained through the combination of the first image capturing device 20A and the first mirror device 30A at the same time. The combination of the image, the second image capturing device 50A, and the second mirror device 60A obtains the image of the other target side wall (the second direction), thereby completing the detection of the target side walls on both sides in the primary path direction.

以下係針對本發明的第三實施例進行說明,請一併參閱「圖10」,係本發明第三實施例的外觀示意圖。以下有關於相同專業名詞的定義不再予以贅述,僅針對結構上與第一實施例及第二實施例的主要差異性部分進行說明。The following is a description of the third embodiment of the present invention. Please also refer to "FIG. 10", which is a schematic diagram of the appearance of the third embodiment of the present invention. The following definitions of the same technical terms will not be repeated, and only the main differences between the first embodiment and the second embodiment in terms of structure will be described.

本實施例係提供一種雙側式待測物側壁檢測系統200,包括一待測物載台10B、一影像擷取裝置20B、一成對反射鏡組裝置30B、以及一線性滑軌載台40B。於較佳實施例中,所述的待測物載台10B、一影像擷取裝置20B、以及一成對反射鏡組裝置30B係可以共構為一體。所述的影像擷取裝置20B設置於該待測物載台10B一側,用以拍攝待測物影像。所述的成對反射鏡組裝置30B設置於該影像擷取裝置20B及該待測物載台10B之間,包括一第一反射鏡31B以及一設置於該第一反射鏡31B對向側的第二反射鏡32B。該第一反射鏡31B與該待測物AN的孔洞側壁H之間具有一第一取像傾角C,該第二反射鏡32B與該待測物AN的孔洞側壁H之間具有一第二取像傾角D,以令該孔洞側壁H的第一側影像與該孔洞側壁H的第二側影像分別落在該第一反射鏡31B及該第二反射鏡32B相對該影像擷取裝置20B的取像範圍內。其中該第一反射鏡31B具有一第一調整機構,藉以調整該第一反射鏡31B的該第一取像傾角的範圍,該第二反射鏡32B具有一第二調整機構,藉以調整該第二反射鏡32B的該第二取像傾角的範圍。This embodiment provides a double-sided object-to-be-tested sidewall inspection system 200, which includes an object-to-be-tested stage 10B, an image capturing device 20B, a paired mirror assembly device 30B, and a linear slide rail stage 40B . In a preferred embodiment, the object stage 10B, an image capturing device 20B, and a pair of mirror assembly devices 30B can be co-constituted as a whole. The image capturing device 20B is arranged on the side of the test object stage 10B, and is used to capture an image of the test object. The paired mirror assembly device 30B is disposed between the image capturing device 20B and the object stage 10B, and includes a first mirror 31B and a mirror set on the opposite side of the first mirror 31B The second mirror 32B. There is a first imaging inclination angle C between the first reflector 31B and the hole side wall H of the test object AN, and a second picking angle C is provided between the second reflector 32B and the hole side wall H of the test object AN. The image inclination angle D is such that the first side image of the hole side wall H and the second side image of the hole side wall H respectively fall on the first mirror 31B and the second mirror 32B relative to the image capturing device 20B. Like the range. The first mirror 31B has a first adjustment mechanism to adjust the range of the first imaging inclination angle of the first mirror 31B, and the second mirror 32B has a second adjustment mechanism to adjust the second The range of the second imaging inclination angle of the mirror 32B.

為了將該待測物載台10B上待測物AN的孔洞側壁H影像反射至該影像擷取裝置20B,以進行檢測,在該影像擷取裝置20B與待測物AN平面為90度設置的情況下,包含但不限於第一取像傾角C至少必須要低於45度角(0度至45度),於鏡向設置的實施例中,包含但不限於第二取像傾角D則至少必須要高於45度角(-45度至0度)。於較佳實施例中,為了減少取像距離,該第一取像傾角C係介於10度至20度之間、該第二取像傾角D係介於-10度至-20度之間,可以得到較佳的成像品質。In order to reflect the image of the side wall H of the hole of the test object AN on the test object carrier 10B to the image capture device 20B for detection, the plane of the image capture device 20B and the test object AN is set at 90 degrees In the case, including but not limited to, the first imaging inclination angle C must be at least less than 45 degrees (0° to 45 degrees). In the mirror setting embodiment, including but not limited to the second imaging inclination angle D, it must be at least Must be higher than 45 degrees (-45 degrees to 0 degrees). In a preferred embodiment, in order to reduce the imaging distance, the first imaging inclination angle C is between 10 degrees and 20 degrees, and the second imaging inclination angle D is between -10 degrees and -20 degrees. , You can get better imaging quality.

須注意的是,於線掃描攝影機的實施例中,為了同時取得第一反射鏡31B以及第二反射鏡32B的影像,該線掃描攝影機的掃描方向係正交於該第一反射鏡31B以及該第二反射鏡32B,以同時獲取孔洞側壁H的第一側影像及第二側影像。It should be noted that in the embodiment of the line scan camera, in order to obtain the images of the first mirror 31B and the second mirror 32B at the same time, the scanning direction of the line scan camera is orthogonal to the first mirror 31B and the The second reflecting mirror 32B simultaneously obtains the first side image and the second side image of the side wall H of the hole.

請一併參閱「圖11」及「圖12」,係本發明第三實施例的光學路徑示意圖、以及成像示意圖。如「圖11」,以線掃描攝影機為實施例進行檢測時,所述的線性滑軌載台40B係將該影像擷取裝置20B相對該成對反射鏡組裝置30B由該待測物載台10B的第一側位置L3移動至第二側位置L4(如箭頭A2),以沿路徑掃過複數個孔洞側壁H,完成該待測物AN於一整條路徑上孔洞側壁H的檢測。如「圖12」,對向兩側(第一反射鏡31B、第二反射鏡32B)的影像同時由該影像擷取裝置20B所拍攝取得,因此於一次行程中,影像擷取裝置20B即可完成孔洞側壁H的第一側影像P1及第二側影像P2的檢測。Please refer to "FIG. 11" and "FIG. 12" together, which are the schematic diagrams of the optical path and the imaging diagram of the third embodiment of the present invention. As shown in "FIG. 11", when a line scan camera is used as an embodiment for detection, the linear slide rail stage 40B is configured to move the image capturing device 20B relative to the paired mirror assembly device 30B from the object stage to be tested. The first side position L3 of 10B is moved to the second side position L4 (such as arrow A2) to scan the plurality of hole sidewalls H along the path to complete the detection of the hole sidewall H on the entire path of the test object AN. As shown in "Figure 12", the images on the opposite sides (the first mirror 31B and the second mirror 32B) are captured by the image capturing device 20B at the same time, so in one trip, the image capturing device 20B is sufficient The detection of the first side image P1 and the second side image P2 of the side wall H of the hole is completed.

以下係針對本發明的第四實施例進行說明,請一併參閱「圖13」,係本發明第四實施例的外觀示意圖。The following is a description of the fourth embodiment of the present invention. Please also refer to "FIG. 13", which is a schematic diagram of the appearance of the fourth embodiment of the present invention.

以下針對本發明的第四實施例進行說明,由於本實施例與第三實施例的差異性僅在於成對反射鏡組裝置的設置數量,相同部分即不再予以贅述。The following describes the fourth embodiment of the present invention. Since the difference between this embodiment and the third embodiment is only the number of paired mirror assembly devices, the same parts will not be repeated.

本實施例係包括複數個成對反射鏡組裝置30B用以分別對準至待測物AN上的複數個區域的盲孔及穿孔進行檢測。於本實施例中,影像擷取裝置20B係配合設置於一線性滑軌載台40B上,以經由該線性滑軌載台40B移動至複數個區域上以分別拍攝盲孔及穿孔的第一目標側壁及第二目標側壁。由於多個成對反射鏡組裝置30B所組成的成對反射鏡列Ⅰ,設置於待測物AN上側,可一次擷取多個孔洞的第一目標側壁影像及第二目標側壁影像。This embodiment includes a plurality of paired mirror assembly devices 30B for respectively aligning to the blind holes and perforations of the plurality of areas on the test object AN for detection. In this embodiment, the image capturing device 20B is cooperatingly arranged on a linear slide rail carrier 40B, so as to move to a plurality of areas via the linear slide rail carrier 40B to respectively photograph the blind holes and perforated first targets The side wall and the second target side wall. Since the paired mirror row I composed of a plurality of paired mirror group devices 30B is arranged on the upper side of the test object AN, the first target sidewall image and the second target sidewall image of a plurality of holes can be captured at one time.

有關於檢測時該影像擷取裝置20B的移動路徑,請一併參閱「圖14」,係本發明第四實施例的工作示意圖。For the moving path of the image capturing device 20B during detection, please also refer to "FIG. 14", which is a working schematic diagram of the fourth embodiment of the present invention.

如「圖14」,於本實施例中,由於多個成對反射鏡組裝置30B以排列設置於待測物AN的盲孔或穿孔周側,線性滑軌載台40B係可以直接將影像擷取裝置20B沿一直線路徑方式移動,分別拍攝對應位置上的盲孔及穿孔。於拍攝完該盲孔及穿孔的影像到達路徑末端時,即完成一次檢測。藉由本實施例的方式,可以大幅地縮減檢測所需的時間,有效提升檢測的效率。As shown in "FIG. 14", in this embodiment, since a plurality of pairs of mirror assembly devices 30B are arranged on the side of the blind hole or perforation of the test object AN, the linear slide rail carrier 40B can directly capture the image The fetching device 20B moves along a linear path, and respectively photographs the blind holes and perforations at the corresponding positions. When the image of the blind hole and perforation reaches the end of the path after shooting, an inspection is completed. With the method of this embodiment, the time required for detection can be greatly reduced, and the efficiency of detection can be effectively improved.

請一併參閱「圖15」,係本發明第五實施例的工作示意圖於另一較佳實施態樣中,成對反射鏡組亦可以直接以直條的菱鏡取代,由於本實施例與第四實施例的差異性僅在於反射鏡種類,相同部分即不再予以贅述。Please also refer to "Figure 15", which is a schematic diagram of the operation of the fifth embodiment of the present invention. The difference of the fourth embodiment lies only in the types of mirrors, and the same parts will not be repeated.

本實施例係包括複數個並排設置的菱鏡M用以分別對準至待測物AN上的複數個區域的盲孔及穿孔進行檢測,如「圖15」,該菱鏡M係呈倒三角形,於該菱鏡M的二側斜面上係設置有一層反射膜。於本實施例中,影像擷取裝置20B係配合設置於一線性滑軌載台40B上,以經由該線性滑軌載台40B移動至複數個區域上以分別拍攝盲孔及穿孔的第一目標側壁及第二目標側壁。由於多個菱鏡M設置於待測物AN上側,可一次擷取多個孔洞的第一目標側壁影像及第二目標側壁影像。有關於檢測時該影像擷取裝置20B的移動路徑請一併參閱「圖14」。This embodiment includes a plurality of diamond mirrors M arranged side by side to respectively align to the blind holes and perforations of the plurality of areas on the test object AN for detection. As shown in "Figure 15", the diamond mirror M is in the shape of an inverted triangle. , A reflective film is provided on the two slopes of the diamond mirror M. In this embodiment, the image capturing device 20B is cooperatingly arranged on a linear slide rail carrier 40B, so as to move to a plurality of areas via the linear slide rail carrier 40B to respectively photograph the blind holes and perforated first targets The side wall and the second target side wall. Since the multiple diamond mirrors M are arranged on the upper side of the test object AN, the first target sidewall image and the second target sidewall image of multiple holes can be captured at one time. Please also refer to "FIG. 14" for the moving path of the image capturing device 20B during detection.

如「圖14」,於本實施例中,由於多個菱鏡M以並排方式設置於待測物AN的盲孔或穿孔周側,線性滑軌載台40B係可以直接將影像擷取裝置20B沿一直線路徑方式移動,分別拍攝對應位置上的盲孔及穿孔。於拍攝完該盲孔及穿孔的影像到達路徑末端時,即完成一次檢測。藉由本實施例的方式,可以大幅地縮減檢測所需的時間,有效提升檢測的效率。As shown in "FIG. 14", in this embodiment, since a plurality of diamond mirrors M are arranged side by side on the blind hole or perforation side of the test object AN, the linear slide rail carrier 40B can directly connect the image capturing device 20B Move along a straight path to shoot blind holes and perforations at corresponding positions. When the image of the blind hole and perforation reaches the end of the path after shooting, an inspection is completed. With the method of this embodiment, the time required for detection can be greatly reduced, and the efficiency of detection can be effectively improved.

請一併參閱「圖16」,係本發明第六實施例的外觀示意圖。Please also refer to "FIG. 16", which is a schematic diagram of the appearance of the sixth embodiment of the present invention.

於本實施例中揭示一種單側式檢測系統300,用於檢測待測物AN上的至少一個孔洞側壁H。該單側式檢測系統300包括一待測物載台10C、以及一影像擷取裝置20C。In this embodiment, a single-sided detection system 300 is disclosed for detecting at least one side wall H of the hole on the test object AN. The single-sided inspection system 300 includes a test object stage 10C and an image capturing device 20C.

所述的待測物載台10C用以承載該待測物AN,於其中一較佳實施例中,該待測物載台10C係可以為用以擺設待測物AN的平台,透過治具固定待測物AN位置。於另一較佳實施例中,該待測物載台10C係可以為可動式載台(或XYZ載台、XYθ載台等),可移載或移動待測物AN至適當的取像位置。於用以檢測穿孔的實施例中,在該待測物載台10C下方,係設置有一面光源,用以對待測物AN提供背光源,其中該面光源的面積與該待測物AN成正比以對該穿孔內側提供均光照明,於本發明中對於該待測物載台10C的實施例不予以限制。The test object carrier 10C is used to carry the test object AN. In one of the preferred embodiments, the test object carrier 10C can be a platform for placing the test object AN through a fixture Fix the AN position of the test object. In another preferred embodiment, the test object stage 10C may be a movable stage (or XYZ stage, XYθ stage, etc.), which can transfer or move the test object AN to an appropriate image capturing position . In the embodiment for detecting perforations, under the test object stage 10C, a surface light source is provided to provide a backlight source for the test object AN, wherein the area of the surface light source is proportional to the test object AN In order to provide uniform illumination on the inner side of the perforation, the embodiment of the test object carrier 10C is not limited in the present invention.

該影像擷取裝置20C設置於該待測物載台10C一側,用以擷取待測物AN影像,該影像擷取裝置20C係透過感光元件及對應的鏡頭拍攝待測物AN的影像,並將所獲取的影像傳送至後端的影像處理裝置24C進行影像分析,以確認待測物AN的瑕疵狀態並完成檢測。於本實施例中,為了進行高精度的檢測,該影像擷取裝置20C包括一成像單元21C、一設置於該成像單元21C上的物鏡22C、以及一結合於該物鏡22C的第一光源23C。其中該成像單元21C係包括複數個感光元件。該物鏡22C內側對應於其光路設置有複數個光學元件(例如透鏡、鏡片)。該影像擷取裝置20C包括但不限於,可為線掃描攝影機或面掃描攝影機。於一較佳實施例中,該影像擷取裝置20C係可以為線掃描攝影機,有利於增加檢測的效率。The image capturing device 20C is arranged on the side of the test object stage 10C to capture the image of the test object AN. The image capturing device 20C captures the image of the test object AN through the photosensitive element and the corresponding lens. The obtained image is sent to the back-end image processing device 24C for image analysis to confirm the defect state of the test object AN and complete the inspection. In this embodiment, in order to perform high-precision detection, the image capturing device 20C includes an imaging unit 21C, an objective lens 22C disposed on the imaging unit 21C, and a first light source 23C combined with the objective lens 22C. The imaging unit 21C includes a plurality of photosensitive elements. The inner side of the objective lens 22C is provided with a plurality of optical elements (for example, lenses, mirrors) corresponding to its optical path. The image capturing device 20C includes, but is not limited to, a line scan camera or an area scan camera. In a preferred embodiment, the image capturing device 20C can be a line scan camera, which is beneficial to increase the detection efficiency.

為了拍攝該孔洞側壁H的影像,該影像擷取裝置20C與該孔洞側壁H之間具有一取像傾角E,使該影像擷取裝置20C擷取該孔洞側壁H的影像。該取像傾角E於較佳實施例中,係可以為15度至75度之間。In order to capture the image of the side wall H of the hole, there is an inclination angle E between the image capturing device 20C and the side wall H of the hole, so that the image capturing device 20C captures the image of the side wall H of the hole. In a preferred embodiment, the image acquisition inclination angle E may be between 15 degrees and 75 degrees.

於一較佳實施例中,為了取得該孔洞側壁H內的影像,該影像擷取裝置20C可以配合線性軌道、環形軌道、多軸機臂、或其他類此的裝置設置。於線性軌道的實施例中,可以透過該線性軌道移動該影像擷取裝置20C分別拍攝孔洞側壁H的第一側影像後,再由另一側方向復歸時旋轉180度,拍攝孔洞側壁H的第二側影像,以完成孔洞側壁H的檢測;於環形軌道的實施例中,該影像擷取裝置20A係可以該孔洞側壁H的中心為軸心,於平面上旋轉180度以獲取該孔洞側壁H的所有影像;該等實施例非屬本發明所欲限制的範圍。In a preferred embodiment, in order to obtain the image in the side wall H of the hole, the image capturing device 20C can be configured with a linear track, a circular track, a multi-axis arm, or other similar devices. In the embodiment of the linear track, the image capturing device 20C can be moved through the linear track to capture the first side image of the side wall H of the hole, and then rotate 180 degrees when returning from the other side to capture the first side image of the side wall H of the hole. Two-sided images to complete the detection of the side wall H of the hole; in the embodiment of the circular track, the image capturing device 20A can be rotated 180 degrees on the plane with the center of the side wall H of the hole as the axis to obtain the side wall H of the hole All images of; these embodiments are not within the scope of the present invention.

於一可行的較佳實施例中,該單側式檢測系統300可進一步包括一反射鏡裝置設置於該影像擷取裝置20C及該待測物載台10C之間,該影像擷取裝置20C具有一調整機構,藉以調整該反射鏡裝置的該取像傾角E的範圍。In a feasible preferred embodiment, the single-sided inspection system 300 may further include a mirror device disposed between the image capturing device 20C and the object stage 10C, the image capturing device 20C having An adjustment mechanism is used to adjust the range of the imaging inclination E of the mirror device.

請一併參閱「圖17」,係本發明第七實施例的外觀示意圖。Please also refer to "FIG. 17", which is a schematic diagram of the appearance of the seventh embodiment of the present invention.

以下針對本發明的第六實施例進行說明,由於本實施例與第一實施例的差異性僅在於本發明影像擷取裝置的數量,相同部分即不再予以贅述。The sixth embodiment of the present invention will be described below. Since the difference between this embodiment and the first embodiment lies in the number of image capturing devices of the present invention, the same parts will not be repeated.

於本實施例中,係更進一步設置一第二影像擷取裝置50C,該第二影像擷取裝置50C係設置於該第一影像擷取裝置20C相對於孔洞側壁H的另一側,因此可以同時拍攝到待測物AN孔洞側壁H的第一側影像及第二側影像。於本實施例中,該第一影像擷取裝置20C與該孔洞側壁H之間具有一第一取像傾角E,該第二影像擷取裝置50C與該孔洞側壁H之間具有一第二取像傾角F,使該第一影像擷取裝置20C及該第二影像擷取裝置50C分別擷取該孔洞側壁H的第一側影像以及第二側影像。In this embodiment, a second image capturing device 50C is further provided. The second image capturing device 50C is disposed on the other side of the first image capturing device 20C relative to the side wall H of the hole, so that At the same time, the first side image and the second side image of the side wall H of the hole of the test object AN are captured. In this embodiment, there is a first image capturing angle E between the first image capturing device 20C and the side wall H of the hole, and a second capturing angle E is provided between the second image capturing device 50C and the side wall H of the hole. The image inclination angle F enables the first image capturing device 20C and the second image capturing device 50C to capture the first side image and the second side image of the side wall H of the hole, respectively.

為了拍攝該孔洞側壁H的影像,該第一影像擷取裝置20C與該孔洞側壁H之間具有一取像傾角E,使該影像擷取裝置20C擷取該孔洞側壁H的影像。該取像傾角E於較佳實施例中,係可以為15度至45度之間,該取像傾角E於較佳實施例中,係可以為-15度至-45度之間。In order to capture the image of the side wall H of the hole, there is an inclination E between the first image capturing device 20C and the side wall H of the hole, so that the image capturing device 20C captures the image of the side wall H of the hole. In a preferred embodiment, the imaging inclination angle E may be between 15 degrees and 45 degrees, and in a preferred embodiment, the imaging inclination angle E may be between -15 degrees and -45 degrees.

綜上所述,本發明可以有效的提升光學檢測系統檢測盲孔、穿孔或是其他複雜表面的瑕疵的效率,相較於習知技術可以大幅地降低檢測所需的時間成本。此外,本發明機構設置簡單,相較於習知技術可以降低檢測的複雜度,同時降低設備的維修成本。In summary, the present invention can effectively improve the efficiency of the optical inspection system to detect blind holes, perforations or other complex surface defects, and can greatly reduce the time and cost required for inspection compared with the prior art. In addition, the mechanism of the present invention is simple to set up, and compared with the conventional technology, the complexity of detection can be reduced, and the maintenance cost of the equipment can be reduced at the same time.

以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, everything made in accordance with the scope of the patent application of the present invention is equal Changes and modifications should still fall within the scope of the patent of the present invention.

100:單側式檢測系統 10A:待測物載台 20A:影像擷取裝置 21A:成像單元 22A:物鏡 23A:同軸光源 30A:反射鏡裝置 40A:第一移載裝置 50A:第二影像擷取裝置 60A:第二反射鏡裝置 70A:側向光源 A:取像傾角 B:第二取像傾角 W1:第一側影像 W2:第二側影像 200:雙側式檢測系統 10B:待測物載台 20B:影像擷取裝置 30B:成對反射鏡組裝置 31B:第一反射鏡 32B:第二反射鏡 40B:線性滑軌載台 C:第一取像傾角 D:第二取像傾角 P1:第一目標側壁 P2:第二目標側壁 H:孔洞側壁 L1:第一側位置 L2:第二側位置 A1:箭頭 L3:第一側位置 L4:第二側位置 A2:箭頭 300:單側式檢測系統 10C:待測物載台 20C:影像擷取裝置 40C:線性滑軌載台 50C:第二影像擷取裝置 A3:箭頭 E:第一取像傾角 F:第二取像傾角 Ⅰ:成對反射鏡列 IP:影像處理裝置 100: Single-sided detection system 10A: Object stage to be tested 20A: Image capture device 21A: imaging unit 22A: Objective lens 23A: Coaxial light source 30A: Mirror device 40A: The first transfer device 50A: Second image capture device 60A: Second mirror device 70A: Side light A: Acquisition inclination B: The second acquisition inclination W1: The first side image W2: second side image 200: Double-sided detection system 10B: Object stage to be tested 20B: Image capture device 30B: Paired mirror group device 31B: The first mirror 32B: second mirror 40B: Linear slide rail carrier C: The first acquisition inclination D: The second acquisition inclination P1: first target side wall P2: Second target side wall H: Sidewall of the hole L1: first side position L2: second side position A1: Arrow L3: First side position L4: second side position A2: Arrow 300: Single-sided detection system 10C: Object stage to be tested 20C: Image capture device 40C: Linear slide rail carrier 50C: Second image capture device A3: Arrow E: The first acquisition inclination F: second acquisition inclination Ⅰ: Pair of mirrors IP: image processing device

圖1,本發明第一實施例的外觀示意圖。Fig. 1 is a schematic diagram of the appearance of the first embodiment of the present invention.

圖2,本發明第一實施例的光學路徑示意圖。Fig. 2 is a schematic diagram of the optical path of the first embodiment of the present invention.

圖3,本發明第一實施例的成像示意圖。Fig. 3 is a schematic diagram of imaging of the first embodiment of the present invention.

圖4,本發明第一實施例的工作示意圖(一)。Fig. 4 is a working schematic diagram (1) of the first embodiment of the present invention.

圖5,本發明第一實施例的工作示意圖(二)。Fig. 5 is a working schematic diagram (2) of the first embodiment of the present invention.

圖6,本發明第一實施例用於盲孔檢測的光學配置方式。Fig. 6 shows the optical configuration for blind hole detection according to the first embodiment of the present invention.

圖7,本發明第一實施例用於穿孔檢測的光學配置方式。Fig. 7 shows the optical configuration for perforation detection in the first embodiment of the present invention.

圖8,本發明第二實施例的外觀示意圖。Fig. 8 is a schematic diagram of the appearance of the second embodiment of the present invention.

圖9,本發明第二實施例中第二影像擷取裝置的成像示意圖。FIG. 9 is a schematic diagram of imaging of the second image capturing device in the second embodiment of the present invention.

圖10,本發明第二實施例的外觀示意圖。Fig. 10 is a schematic diagram of the appearance of the second embodiment of the present invention.

圖11,本發明第三實施例的外觀示意圖。Fig. 11 is a schematic diagram of the appearance of the third embodiment of the present invention.

圖12,本發明第三實施例的工作示意圖。Fig. 12 is a schematic diagram of the operation of the third embodiment of the present invention.

圖13,本發明第三實施例的成像示意圖。Fig. 13 is a schematic diagram of imaging of the third embodiment of the present invention.

圖14,本發明第四實施例的外觀示意圖。Fig. 14 is a schematic diagram of the appearance of the fourth embodiment of the present invention.

圖15,本發明第四實施例的工作示意圖。Fig. 15 is a schematic diagram of the operation of the fourth embodiment of the present invention.

圖16,本發明第五實施例的外觀示意圖。Fig. 16 is a schematic diagram of the appearance of the fifth embodiment of the present invention.

圖17,本發明第六實施例的工作示意圖。Fig. 17 is a schematic diagram of the operation of the sixth embodiment of the present invention.

100:單側式檢測系統 100: Single-sided detection system

10A:待測物載台 10A: Object stage to be tested

20A:影像擷取裝置 20A: Image capture device

21A:成像單元 21A: imaging unit

22A:物鏡 22A: Objective lens

23A:同軸光源 23A: Coaxial light source

30A:反射鏡裝置 30A: Mirror device

40A:第一移載裝置 40A: The first transfer device

A:取像傾角 A: Acquisition inclination

IP:影像處理裝置 IP: image processing device

AN:待測物 AN: DUT

H:孔洞側壁 H: Sidewall of the hole

Claims (32)

一種單側式檢測系統,用於檢測待測物上的複數個孔洞側壁,該單側式檢測系統包括:一待測物載台,用以承載該待測物;一影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;以及一第一移載裝置,用以於XY平面上水平移載該影像擷取裝置,該XY平面正交於該些孔洞側壁的壁面;其中該影像擷取裝置與每一該些孔洞側壁之間具有一取像傾角,以擷取該些孔洞側壁的影像。 A single-sided detection system is used to detect a plurality of side walls of holes on an object to be tested. The single-sided detection system includes: an object-to-be-tested platform for carrying the object to be tested; an image capture device provided with On the side of the test object stage, it is used to capture the image of the test object; and a first transfer device is used to horizontally transfer the image capture device on the XY plane, the XY plane being orthogonal to the The wall surface of the side wall of the hole; wherein there is an inclination angle between the image capturing device and the side wall of each of the holes to capture the image of the side wall of the holes. 如申請專利範圍第1項所述的單側式檢測系統,其中該取像傾角的範圍以垂直面為基準起算介於15度至75度之間。 The single-sided detection system described in item 1 of the scope of patent application, wherein the range of the inclination angle of the image acquisition is between 15 degrees and 75 degrees based on the vertical plane. 一種雙側式檢測系統,用於檢測待測物上的複數個孔洞側壁,該單側式檢測系統包括:一待測物載台,用以承載該待測物;一第一影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;一第二影像擷取裝置,設置於該待測物載台一側,用以擷取該待測物影像;以及一第一移載裝置,用以於XY平面上水平移載該第一影像擷取裝置及該第二影像擷取裝置,該XY平面正交於該些孔洞側壁的壁面; 其中該第一影像擷取裝置與每一該些孔洞側壁之間具有一第一取像傾角,以擷取該些孔洞側壁的第一側影像,以及該第二影像擷取裝置與每一該些孔洞側壁之間具有一第二取像傾角,以擷取該些孔洞側壁的一第二側影像。 A double-sided detection system for detecting a plurality of sidewalls of holes on an object to be tested. The single-sided detection system includes: a platform for the object to be tested for carrying the object to be tested; and a first image capturing device , Arranged on the side of the test object carrier to capture the image of the test object; a second image capturing device is arranged on the side of the test object carrier to capture the image of the test object; And a first transfer device for horizontally transferring the first image capturing device and the second image capturing device on an XY plane, the XY plane being orthogonal to the walls of the side walls of the holes; There is a first image capturing angle between the first image capturing device and the sidewalls of each of the holes to capture first side images of the sidewalls of the holes, and the second image capturing device and each of the holes There is a second image capturing angle between the side walls of the holes to capture a second side image of the side walls of the holes. 如申請專利範圍第3項所述的單側式檢測系統,其中該取像傾角的範圍以垂直面為基準起算介於15度至75度之間。 For the single-sided detection system described in item 3 of the scope of patent application, the range of the inclination angle of the image acquisition is between 15 degrees and 75 degrees based on the vertical plane. 一種單側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括:一待測物載台,用以承載該待測物;一影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;一反射鏡裝置,設置於該影像擷取裝置及該待測物載台之間;以及一第一移載裝置,用以於XY平面上水平移載該影像擷取裝置及該反射鏡裝置;其中該反射鏡裝置與該孔洞側壁之間具有一取像傾角,使該影像擷取裝置透過該反射鏡裝置擷取該孔洞側壁的影像。 A single-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes: an object to be tested carrier for carrying the object to be tested; an image capturing device provided with On the side of the object to be tested for capturing an image of the object to be tested; a mirror device arranged between the image capturing device and the object to be tested; and a first transfer device for The image capturing device and the mirror device are moved horizontally on the XY plane; wherein there is an image inclination angle between the mirror device and the side wall of the hole, so that the image capturing device captures the image through the mirror device Image of the side wall of the hole. 如申請專利範圍第5項所述的單側式檢測系統,其中該影像擷取裝置包括線掃描攝影機或面掃描攝影機。 According to the one-sided inspection system described in the fifth item of the scope of patent application, the image capturing device includes a line scan camera or an area scan camera. 如申請專利範圍第5項所述的單側式檢測系統,其中更包括一第二移載裝置,用以移載該待測物載台。 The single-sided detection system described in item 5 of the scope of patent application further includes a second transfer device for transferring the object under test. 如申請專利範圍第5項所述的單側式檢測系統,其中該待測物包括銅箔基板、印刷電路板(Printed Circuit Board,PCB)、軟式印刷電路板(Flexible Printed Circuit)、或沖壓板件。 The single-sided inspection system as described in item 5 of the scope of patent application, wherein the object to be tested includes a copper foil substrate, a printed circuit board (PCB), a flexible printed circuit board (Flexible Printed Circuit), or a stamping board Pieces. 如申請專利範圍第5項所述的單側式檢測系統,其中該孔洞側壁包括穿孔側壁或盲孔側壁。 According to the single-sided detection system described in item 5 of the scope of patent application, the side wall of the hole includes a perforated side wall or a blind hole side wall. 如申請專利範圍第5項所述的單側式檢測系統,其中更包括一第一光源,設置於該孔洞側壁上方,以提供該孔洞側壁照明光源。 The single-sided detection system described in item 5 of the scope of patent application further includes a first light source disposed above the side wall of the hole to provide an illumination light source for the side wall of the hole. 如申請專利範圍第10項所述的單側式檢測系統,其中該第一光源的類型包括同軸光源、側向光源或環形光源。 According to the single-sided detection system described in item 10 of the scope of patent application, the type of the first light source includes a coaxial light source, a side light source or a ring light source. 如申請專利範圍第5項所述的單側式檢測系統,其中更包括一第二光源,設置於該孔洞側壁下方,以提供該孔洞側壁照明光源。 The single-sided detection system described in item 5 of the scope of patent application further includes a second light source disposed under the side wall of the hole to provide an illumination light source for the side wall of the hole. 如申請專利範圍第12項所述的單側式檢測系統,其中該第二光源包括一面光源,其中該面光源的面積與該待測物成正比。 The single-sided detection system described in item 12 of the scope of patent application, wherein the second light source includes a surface light source, and the area of the surface light source is proportional to the object to be measured. 如申請專利範圍第5項所述的單側式檢測系統,其中該反射鏡裝置具有一調整機構,藉以調整該反射鏡裝置的該取像傾角的範圍。 According to the one-sided detection system described in item 5 of the scope of patent application, the reflector device has an adjustment mechanism to adjust the range of the inclination angle of the image pickup of the reflector device. 如申請專利範圍第5項所述的單側式檢測系統,其中該取像傾角的範圍以垂直面為基準起算介於10度至20度之間。 For the single-sided detection system described in item 5 of the scope of patent application, the range of the inclination angle of the image acquisition is between 10 degrees and 20 degrees based on the vertical plane. 如申請專利範圍第5項所述的單側式檢測系統,其中該反射鏡裝置包括一平面鏡或一菱鏡,藉以由該影像擷取裝置透過該反射鏡裝置擷取該孔洞側壁的影像。 According to the one-sided detection system described in item 5 of the scope of patent application, the mirror device includes a flat mirror or a diamond mirror, whereby the image capturing device captures the image of the side wall of the hole through the mirror device. 一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括:一待測物載台,用以承載該待測物;一第一影像擷取裝置與一第二影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;一第一反射鏡裝置,設置於該第一影像擷取裝置及該待測物載台之間,其中該第一反射鏡裝置與該孔洞側壁之間具有一第一取像傾角;一第二反射鏡裝置,設置於該第二影像擷取裝置及該待測物載台之間,該第二反射鏡與該孔洞側壁之間具有一第二取像傾角;以及一第一移載裝置,用以於XY平面上水平移載該第一影像擷取裝置、第二影像擷取裝置、該第一反射鏡裝置及該第二反射鏡裝置;其中該第一影像擷取裝置透過該第一反射鏡裝置擷取該孔洞側壁的第一側影像,以及該第二影像擷取裝置透過該第二反射鏡裝置擷取該孔洞側壁的第二側影像。 A double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes: an object to be tested carrier for carrying the object to be tested; and a first image capturing device And a second image capturing device arranged on the side of the test object carrier to capture the image of the test object; and a first mirror device arranged on the first image capturing device and the test object Between the stages, wherein there is a first image capturing inclination between the first mirror device and the side wall of the hole; a second mirror device is arranged between the second image capturing device and the object stage to be tested Between the second mirror and the side wall of the hole, there is a second image capturing angle; and a first transfer device for horizontally transferring and transferring the first image capturing device and the second image capturing device on the XY plane. Capture device, the first mirror device and the second mirror device; wherein the first image capture device captures the first side image of the side wall of the hole through the first mirror device, and the second image capture The device captures the second side image of the side wall of the hole through the second mirror device. 一種成對反射鏡組裝置,包括:一第一反射鏡,設置於該影像擷取裝置及該待測物載台之間,該第一反射鏡與該待測物的孔洞側壁之間具有一第一取像傾角;以及 一第二反射鏡,設置於該影像擷取裝置及該待測物載台之間並設置於該第一反射鏡的對向側,該第二反射鏡與該待測物的孔洞側壁之間具有一第二取像傾角。 A paired reflecting mirror group device includes: a first reflecting mirror arranged between the image capturing device and the object to be measured, and a hole side wall of the object to be measured is provided between the first reflecting mirror and the object to be measured. The first acquisition inclination angle; and A second reflecting mirror is arranged between the image capturing device and the object-to-be-measured stage and arranged on the opposite side of the first reflecting mirror, between the second reflecting mirror and the side wall of the hole of the object-to-be-measured It has a second inclination angle. 一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括:一待測物載台,用以承載該待測物;一影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;一如申請專利範圍第18項所述的成對反射鏡組裝置;以及一第一移載裝置,用以於XY平面上水平移載該影像擷取裝置及該成對反射鏡組裝置;其中該影像擷取裝置透過該第一反射鏡擷取該孔洞側壁的第一側影像,以及該影像擷取裝置透過該第二反射鏡擷取該孔洞側壁的第二側影像。 A double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes: a platform for the object to be tested for carrying the object to be tested; an image capturing device provided with On the side of the test object stage, it is used to capture the image of the test object; the paired mirror group device as described in the 18th patent application; and a first transfer device for the XY plane The image capturing device and the paired mirror assembly device are moved horizontally; wherein the image capturing device captures the first side image of the side wall of the hole through the first mirror, and the image capturing device transmits the first side image of the hole The second mirror captures the second side image of the side wall of the hole. 如申請專利範圍第19項所述的雙側式檢測系統,其中,該影像擷取裝置包括線掃描攝影機或面掃描攝影機。 For the double-sided detection system described in item 19 of the scope of patent application, the image capturing device includes a line scan camera or an area scan camera. 如申請專利範圍第19項所述的雙側式檢測系統,其中更包括一第一移載裝置,用以移載該影像擷取裝置及該反射鏡裝置。 The double-sided detection system described in item 19 of the scope of patent application further includes a first transfer device for transferring the image capturing device and the mirror device. 如申請專利範圍第19項所述的雙側式檢測系統,其中更包括一第二移載裝置,用以移載該待測物載台。 As described in item 19 of the scope of patent application, the double-sided detection system further includes a second transfer device for transferring the object under test. 如申請專利範圍第19項所述的雙側式檢測系統,其中該待測物包括銅箔基板、印刷電路板(Printed Circuit Board,PCB)、軟式印刷電路板(Flexible Printed Circuit)、或沖壓板件。 The double-sided inspection system described in item 19 of the scope of patent application, wherein the object to be tested includes a copper foil substrate, a printed circuit board (PCB), a flexible printed circuit board (Flexible Printed Circuit), or a stamping board Pieces. 如申請專利範圍第19項所述的雙側式檢測系統,其中該孔洞側壁包括穿孔側壁或盲孔側壁。 The double-sided detection system described in item 19 of the scope of patent application, wherein the side wall of the hole includes a side wall of a perforated hole or a side wall of a blind hole. 如申請專利範圍第19項所述的雙側式檢測系統,其中更包括一第一光源,設置於該孔洞側壁上方,以提供該孔洞側壁照明光源。 The double-sided detection system described in item 19 of the scope of patent application further includes a first light source disposed above the side wall of the hole to provide an illumination light source for the side wall of the hole. 如申請專利範圍第25項所述的雙側式檢測系統,其中該第一光源的類型包括同軸光源、側向光源或環形光源。 According to the double-sided detection system described in item 25 of the scope of patent application, the type of the first light source includes a coaxial light source, a side light source or a ring light source. 如申請專利範圍第19項所述的雙側式檢測系統,其中更包括一第二光源,設置於該孔洞側壁下方,以提供該孔洞側壁照明光源。 As described in item 19 of the scope of patent application, the double-sided detection system further includes a second light source disposed under the side wall of the hole to provide an illumination light source for the side wall of the hole. 如申請專利範圍第27項所述的雙側式檢測系統,其中該第二光源包括一面光源,其中該面光源的面積與該待測物成正比。 According to the double-sided detection system described in item 27 of the scope of patent application, the second light source includes a surface light source, and the area of the surface light source is proportional to the object to be measured. 如申請專利範圍第19項所述的雙側式檢測系統,其中該第一反射鏡具有一第一調整機構,藉以調整該第一反射鏡裝置的該第一取像傾角的範圍;其中該第二反射鏡具有一第二調整機構,藉以調整該第二反射鏡的該第二取像傾角的範圍。 The double-sided detection system described in item 19 of the scope of patent application, wherein the first reflector has a first adjustment mechanism, so as to adjust the range of the first imaging inclination angle of the first reflector device; wherein the first reflector device The two reflecting mirrors have a second adjusting mechanism, so as to adjust the range of the second image capturing inclination angle of the second reflecting mirror. 如申請專利範圍第19項所述的雙側式檢測系統,其中該第一取像傾角的範圍以垂直面為基準起算介於10度至20度之間;其中該第一取像傾角的範圍以垂直面為基準起算介於-10度至-20度之間。 The double-sided detection system described in item 19 of the scope of patent application, wherein the range of the first image acquisition inclination angle is between 10 degrees and 20 degrees based on the vertical plane; wherein the range of the first image acquisition inclination angle It is between -10 degrees and -20 degrees based on the vertical plane. 如申請專利範圍第19項所述的雙側式檢測系統,其中該第一反射鏡包括一平面鏡或一菱鏡,藉以由該影像擷取裝置透過該第一反射鏡擷取該孔洞側壁的第一側影像;該第二反射鏡包括一平面鏡或一菱鏡,藉以由該影像擷取裝置透過該第二反射鏡擷取該孔洞側壁的第二側影像。 For the double-sided detection system described in item 19 of the scope of patent application, wherein the first mirror includes a flat mirror or a diamond mirror, whereby the image capturing device captures the first mirror of the side wall of the hole through the first mirror. One side image; the second mirror includes a flat mirror or a diamond mirror, whereby the image capturing device captures the second side image of the side wall of the hole through the second mirror. 一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括:一待測物載台,用以承載該待測物;一影像擷取裝置,設置於該待測物載台一側,用以擷取待測物影像;複數個如申請專利範圍第18項所述的成對反射鏡組裝置,分別對應該待測物的孔洞側壁設置;以及一第一移載裝置,用以於XY平面上水平移載該影像擷取裝置及該成對反射鏡組裝置;其中該影像擷取裝置透過該第一反射鏡擷取該孔洞側壁的第一側影像,以及該影像擷取裝置透過該第二反射鏡擷取該孔洞側壁的第二側影像。 A double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes: a platform for the object to be tested for carrying the object to be tested; an image capturing device provided with On the side of the test object stage, it is used to capture the image of the test object; a plurality of paired mirror group devices as described in item 18 of the scope of patent application are respectively arranged corresponding to the side wall of the hole of the test object; and A first transfer device for horizontally transferring the image capturing device and the paired mirror assembly device on the XY plane; wherein the image capturing device captures the first side wall of the hole through the first mirror A side image, and the image capturing device captures a second side image of the side wall of the hole through the second reflector.
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