TWI744958B - Probe with improved grasping structure - Google Patents
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Abstract
本發明公開一種具有改進的抓取結構的探針。所公開的探針包括:針 主體,位於一側,且包括多個孔;第一延伸部,從所述針主體的外側向上側方向延伸形成;第二延伸部,從所述第一延伸部的另一側端向另一側方向以比所述針主體更長的長度延伸形成並隔開;以及尖端部,從所述第二延伸部的外側上端向上側方向,與所述第二延伸部形成為一體,其中,其末端尖銳地突出形成,在所述第二延伸部具有多個彈性提供孔,其與所述第二延伸部的外周表面平行,並且具有彼此不同的形狀,以使所述尖端部的針頭部分具有可流動的彈性力。 The invention discloses a probe with an improved grasping structure. The disclosed probe includes: needle The main body is located on one side and includes a plurality of holes; a first extension is formed from the outer side of the needle main body to extend upward; a second extension is formed from the other side end of the first extension to the other The lateral direction is formed and separated by a longer length than the needle body; and the tip portion, which is formed integrally with the second extension portion from the outer upper end of the second extension portion to the upper direction, is formed integrally with the second extension portion. The tip is sharply formed, and the second extension portion has a plurality of elasticity providing holes, which are parallel to the outer peripheral surface of the second extension portion and have different shapes from each other, so that the needle portion of the tip portion has Flowable elasticity.
Description
本發明涉及一種具有改進的抓取結構的探針。 The invention relates to a probe with an improved grasping structure.
更具體地,涉及一種具有改進的抓取結構,以能夠量產並保持精度的探針。 More specifically, it relates to a probe with an improved gripping structure to enable mass production and maintain accuracy.
在檢測包括半導體在內的各種被檢測體的電氣特性的電氣特性檢測(EDS:Electrical Die Sorting)中,探針卡是將讀取檢測信號的產生及其結果的檢測器(tester)與被檢測體連接的接口部分。 In the electrical characteristics test (EDS: Electrical Die Sorting) that detects the electrical characteristics of various test objects including semiconductors, the probe card is a tester that reads the generation and result of the test signal and the tester. The interface part of the body connection.
探針卡的探針與諸如半導體的被檢測體的焊盤(例如,外部信號連接端子)直接接觸,以傳遞由檢測器發送的信號並接收相應的信號。隨著半導體的集成狀態的增加,檢測對象的焊盤的數量增加,並且焊盤的間隙也形成得非常緊密,因此探針也可以形成得非常細且緊密。迄今為止開發的探針有,由鎢或錸鎢絲材料製成的針型(Needle Type),由鎳或鈹等材料製成的刀片型(Blade Type),在聚醯亞胺薄膜(Polymide Film)上放置銅板或其他導電體並進行蝕刻加工而製成的薄膜型(Film Type),利用半導體工藝技術在薄膜型中注入導電性介質的混合型(Hybrid Type),將利用彈簧張力的彈簧針(Pogo Pin)為材料製成的彈針型(Pogo Type),利用半導體MEMS工藝技術的MEMS型等。 The probes of the probe card are in direct contact with the pads (for example, external signal connection terminals) of the test object, such as a semiconductor, to transmit the signal sent by the detector and receive the corresponding signal. As the integration state of semiconductors increases, the number of pads to be inspected increases, and the gaps between the pads are also formed very tightly, so the probes can also be formed very thin and tightly. The probes developed so far include the needle type (Needle Type) made of tungsten or rhenium-tungsten wire materials, the blade type (Blade Type) made of nickel or beryllium and other materials. ) Is placed on a copper plate or other conductors and etched to make the film type (Film Type), using semiconductor process technology to inject a conductive medium into the hybrid type (Hybrid Type), will use the spring tension of the pogo pin (Pogo Pin) is a pogo type made of material, a MEMS type using semiconductor MEMS process technology, etc.
對於普通的探針來說,由於連接尖端和基座的彈性部分由一個結 構來構成,因此存在如下問題,即,當檢測體與尖端接觸時不能均勻地產生彈性力,由此測試體被尖端損壞。 For ordinary probes, since the elastic part connecting the tip and the base consists of a knot Therefore, there is a problem that when the test body is in contact with the tip, elastic force cannot be uniformly generated, and the test body is damaged by the tip.
現有的探針的長度可以根據晶片的芯片的Y尺寸來設計。然而,隨著近來技術的發展以及半導體的集成化,晶片的芯片的Y尺寸從6mm縮短到5mm,並且在縮短到3.5mm以下的技術節點上需要作出應對。 The length of the existing probe can be designed according to the Y size of the chip of the wafer. However, with the recent development of technology and the integration of semiconductors, the Y size of the chip of the wafer has been reduced from 6mm to 5mm, and it is necessary to cope with the reduction of technology nodes below 3.5mm.
然而,為了應對3.5mm以下的晶片的芯片的Y尺寸,探針的長度被限制為1.5mm以下,並且考慮到這種限制,將夾具的長度縮短到200μm才能夠進行應對,但是將其長度縮短時,夾具會變得很小,因此會縮短耐用性。 However, in order to cope with the Y size of the chip of a wafer of 3.5mm or less, the length of the probe is limited to 1.5mm or less, and in consideration of this restriction, the length of the jig can be reduced to 200μm, but the length is shortened At this time, the jig will become very small, so the durability will be shortened.
由於目前作為夾具能夠把持探針的最佳長度,其長度需要300μm以上,因此在將夾具部的長度保持在300μm以上的同時,還能夠將探針的長度限制為1.5mm以下。 Since the current optimal length of the probe as a clamp can be held, the length needs to be 300 μm or more. Therefore, while keeping the length of the clamp part at 300 μm or more, the length of the probe can be limited to 1.5 mm or less.
本發明是用於解決如上所述的現有技術中存在的技術問題的發明,本發明的目的在於提供一種探針,其形成為探針的第一至第二延伸部位於探針的抓取部與探針的針主體之間,並且將抓取部設置在鍵合基座的上部,以便在將探針安裝到基板上的過程中防止探針的位置散亂。 The present invention is an invention for solving the technical problems existing in the prior art as described above. The object of the present invention is to provide a probe formed such that the first to second extensions of the probe are located at the gripping portion of the probe Between the probe body and the needle body of the probe, and the grasping part is arranged on the upper part of the bonding base, so as to prevent the position of the probe from being scattered during the process of installing the probe on the substrate.
並且,本發明的另一目的在於提供一種改進的探針,其形成為在3.5mm以下的晶片的芯片的Y尺寸下也能夠抓取探針,以能夠實現量產、鍵合並保持精度。 In addition, another object of the present invention is to provide an improved probe, which is formed to be able to grasp the probe even under the Y size of a chip of a wafer of 3.5 mm or less, so as to achieve mass production and maintain precision in bonding.
為了實現如上所述的目的,本發明的一特徵的探針包括:針主體,位於一側,且包括多個孔;第一延伸部,從所述針主體的外側向上側方向延伸形成;第二延伸部,從所述第一延伸部的另一側端向另一側方向以比所述針主體更長的長度延伸形成並隔開;以及尖端部,從所述第二延伸部的外側上端向上側方向,與所述第二延伸部形成為一體,其中,所述尖端部的末端尖銳地突出形成,在所述第二延伸部具有多個彈性提供孔,其與所述第二延伸部的外周表面平行,並且具有彼此不同的形狀,以使所述尖端部的針頭部分具有可流動的彈性力。 In order to achieve the above-mentioned object, a characteristic probe of the present invention includes: a needle body located on one side and including a plurality of holes; a first extension part extending from the outer side of the needle body to the upper side; Two extension parts extending from the other side end of the first extension part to the other side by a length longer than the needle body and spaced apart; and a tip part, from the outside of the second extension part The upper end is formed integrally with the second extension part in the upward direction, wherein the tip end of the tip part is formed to protrude sharply, and the second extension part has a plurality of elasticity providing holes, which are connected to the second extension part. The outer peripheral surfaces of the tip portion are parallel and have different shapes from each other, so that the needle portion of the tip portion has a flowable elastic force.
所述第一彈性提供孔具有又長又細的形狀,所述第二彈性提供孔具有比所述第一彈性提供孔更厚的形狀,且形成在所述第一彈性提供孔的上部,可以被形成在所述第一延伸部的前面的突出部分開。 The first elasticity providing hole has a long and thin shape, and the second elasticity providing hole has a thicker shape than the first elasticity providing hole, and is formed on the upper portion of the first elasticity providing hole. The protruding part formed in the front of the first extension part is opened.
還可以包括抓取部,其形成在所述第一延伸部的上部,以能夠被夾具抓取。 It may further include a grabbing part formed on the upper part of the first extension part so as to be able to be grabbed by the clamp.
所述抓取部形成在所述第一延伸部的上部,以能夠在進行鍵合的針主體的內側實施所述夾具的抓取,所述第二延伸部可以形成在所述抓取部的下部。 The grabbing portion is formed on the upper part of the first extension portion to enable the gripping of the clamp to be performed inside the needle body to be bonded, and the second extension portion may be formed on the upper portion of the grabbing portion. Lower part.
所述針主體可以向所述第二延伸部側突出以保持剛性。 The needle main body may protrude toward the second extension portion side to maintain rigidity.
通過上述的技術方案,本發明的一實施例的具有改進的抓取結構的探針具有如下效果。 Through the above technical solution, the probe with an improved grasping structure according to an embodiment of the present invention has the following effects.
第二延伸部相比於抓取部形成在下側位置,第二延伸部中形成在彈性提供孔的下側的第二延伸部的一側端部形成為與針主體的上部連接,從而 能夠保持比現有的探針更高的剛性。 The second extension portion is formed at a lower position than the grasping portion, and one end of the second extension portion formed on the lower side of the elasticity providing hole in the second extension portion is formed to be connected to the upper portion of the needle body, thereby It can maintain higher rigidity than existing probes.
並且,通過形成在第一延伸部的上部的抓取部,在進行鍵合的針主體的內側實施夾具的抓取,因此可以防止鍵合時以針主體為中心,尖端部被向上抬起的現象,從而能夠實現鍵合並保持精度。 In addition, the gripping part formed on the upper part of the first extension part enables the gripping of the jig to be carried out inside the needle body to be bonded. Therefore, it is possible to prevent the tip part from being lifted up when the needle body is the center of the needle body during bonding. Phenomenon, which can achieve key combination to maintain accuracy.
參照相同或相似的附圖標記表示相同的組件的附圖並通過下面的說明,可以清楚地理解本發明的另外的優點。 The additional advantages of the present invention can be clearly understood by referring to the drawings in which the same or similar reference numerals denote the same components and through the following description.
20:基板 20: substrate
21:電極 21: Electrode
300:探針 300: Probe
310:針主體 310: Needle body
312:孔 312: hole
314:下端 314: Bottom
330:第一延伸部 330: first extension
332:突出部 332: protruding part
340:第二延伸部 340: second extension
342:第一彈性提供孔 342: First elasticity providing hole
344:第二彈性提供孔 344: second elasticity providing hole
350:尖端部 350: Tip
352:針頭 352: Needle
354:對準部 354: Alignment Department
360:抓取部 360: grasping department
400:夾具 400: Fixture
L:激光 L: Laser
圖1是示出本發明的一實施例的具有改進的抓取結構的探針的示意圖。 FIG. 1 is a schematic diagram showing a probe with an improved grasping structure according to an embodiment of the present invention.
圖2a至圖2c是示出圖1所示的探針的焊接過程的操作順序圖。 2a to 2c are operation sequence diagrams showing the welding process of the probe shown in FIG. 1.
以下,參照附圖對本發明的實施例的結構及作用進行詳細的說明。以下的說明是可以請求保護的本發明的若干方面(aspects)之一,下面的說明可以構成本發明的詳細的記述的一部分。 Hereinafter, the structure and function of the embodiment of the present invention will be described in detail with reference to the drawings. The following description is one of several aspects of the present invention that can be claimed, and the following description may constitute a part of the detailed description of the present invention.
但是,為了清楚地說明本發明,可以省略對公知的結構或功能的具體的說明。 However, in order to clearly describe the present invention, detailed descriptions of well-known structures or functions may be omitted.
本發明可以進行各種變更且可以包括各種實施例,將特定的實施例在附圖中示出並在詳細的說明中進行描述。然而,這並不只在本發明限於特定的實施方式,應被理解為包括本發明的思想及技術範圍所包括的所有的變更、等同物和替代物。 The present invention can be modified in various ways and can include various embodiments. Specific embodiments are shown in the drawings and described in the detailed description. However, this is not only limited to the specific embodiments of the present invention, but should be understood to include all changes, equivalents, and alternatives included in the idea and technical scope of the present invention.
雖然包括序數(如第一、第二等)的術語可以用於描述各種組件, 但是這些組件不應受這些術語限制。這些術語僅用於將一個組件與另一個組件區分開。 Although terms including ordinal numbers (such as first, second, etc.) can be used to describe various components, But these components should not be limited by these terms. These terms are only used to distinguish one component from another.
本發明中所使用的術語僅用於描述特定的實施例,而並不只在限定本發明。除非上下文中明確另有所指,否則單數表達方式可以包括複數表達方式。 The terms used in the present invention are only used to describe specific embodiments, but not only to limit the present invention. Unless the context clearly indicates otherwise, the singular expression may include the plural expression.
以下,參照附圖對本發明的一實施例進行詳細的說明。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
圖1示出本發明的一實施例的具有改進的抓取結構的探針,圖2a至圖2c示出圖1的探針的焊接過程。 Fig. 1 shows a probe with an improved grasping structure according to an embodiment of the present invention, and Figs. 2a to 2c show the welding process of the probe of Fig. 1.
參照圖1,本發明的一優選實施例的探針300包括:針主體310,位於一側,且包括多個孔312;第一延伸部330,從所述針主體310的外側向上側方向延伸形成;第二延伸部340,從所述第一延伸部330的另一側端向另一側方向以比所述針主體310更長的長度延伸形成並隔開;以及尖端部350,從所述第二延伸部340的外側上端向上側方向,與所述第二延伸部340形成為一體,其中,所述尖端部350的末端尖銳地突出形成。
1, the
針主體310包括多個孔312,從而當各個探針300彼此直接接合到主板(未示出)時,由於接合劑經過各個孔312而位於針主體310的兩側,因此能夠提高接合性。
The
並且,針主體310的下端,即接合到主板的所述下端314可以形成為鋸齒形狀,從而當各個探針300彼此直接接合到主板時,由於鋸齒形狀相較於線形,其接合面積增大,因此能夠提高接合性。
In addition, the lower end of the
所述尖端部350可以包括:針頭(needle)352,成錐形地形成以便尖銳地形成,從而在檢測所述面板的時與所述面板的導線接觸;以及對準(align)部354,與針頭352相隔開並延伸形成。其中,所述針頭352比對準部354從第二延伸部340突出得更多。並且,所述對準部354用於判斷所述面板的各個
導線與各個針頭352接觸時是否對準。
The
所述第二延伸部340包括在中央部分形成為棒狀的多個彈性提供孔342、344。附圖中示出為兩個的彈性提供孔342、344形成為,具有沿第二延伸部340的長度方向拉長和延伸的形狀,並且與第二延伸部340的外周表面平行,並且可以具有一個以上,也可以具有其他形狀。
The
第一彈性提供孔342具有又長又細的形狀,但第二彈性提供孔344具有比第一彈性提供孔342更厚的形狀,且形成在第一彈性提供孔342的上部,第二彈性提供孔344可被形成在第一延伸部330的前面的突出部332分開而提供各種彈性。根據一實施例,雖然沒有具體示出,但是突出部332可以形成為,通過被分離為若干個的多個突出部或各種形狀提供各種彈性。不僅如此,為了解決由於施加電流而產生的熱量,可以設置能夠增加針的表面積的結構(如突出部),以促進散熱。
The first
如上所述,本發明實施例的探針300包括具有上述結構的彈性提供孔342、344,針頭352部分在上下方包括彈性提供孔342、344,從而針頭352部分具有可上下流動的彈性力。
As described above, the
另外,第二延伸部340相比於後述的抓取部360可以形成在下側位置,並且在第二延伸部340中形成在彈性提供孔342、344的下側的第二延伸部340的一側端部可以被形成為與針主體310的上端連接。由此,能夠保持比現有的探針更高的剛性。
In addition, the
並且,本發明實施例的探針300還可以包括形成在第一延伸部330的上部的抓取部360,以能夠被夾具400抓取。
In addition, the
抓取部360可以形成在不偏離第一延伸部330的一側末端(圖1中的右側末端)的內側區域中。
The
優選地,形成為第一延伸部330的一側末端與針主體310的一側末
端一致,並且優選為第一延伸部330的一側末端與抓取部360的一側末端一致。
Preferably, it is formed such that one end of the
另外,抓取部360的長度方向的寬度可以形成為不大於夾具400的長度方向的寬度。優選地,可以形成為抓取部360的長度方向寬度與夾具400的長度方向的寬度相同。
In addition, the width of the
如上所述,針主體310的一側末端、第一延伸部330的一側末端以及抓取部360的一側末端形成為一致,並且抓取部360的長度方向寬度與夾具400的長度方向寬度形成為相同,當夾具400把持抓取部360並與基板20接觸以進行鍵合時,從夾具400傳遞的載荷的方向一致為豎直方向。由此,防止在鍵合過程中針主體310的另一側末端部分(圖1中針主體310的左側末端)被抬起,最終能夠防止尖端部350被抬起。
As described above, one end of the
另一方面,針主體310形成為,比第一延伸部330和抓取部360更向尖端部350的方向突出,從而能夠進一步防止在鍵合過程中針主體310的另一側末端部分被抬起。
On the other hand, the
以如上所述的方式構成的本發明的探針300可通過鍵合裝置的操作來鍵合。以下對利用鍵合裝置的操作的鍵合方法進行說明。
The
首先,在將多個探針300安裝於盒子(cassette)的狀態下,沿規定的方向移動盒子,以使所述探針靠近夾具400,然後在通過視覺系統(未示出)映射探針300的位置而掌握正確的位置之後,夾具400把持抓取部360並依次移送。
First, in a state where a plurality of
為了將所移送的探針300結合到基板20上以實現電連接,而需要焊接過程,焊接可能需要必要的諸如鉛之類的物質。其中,對於鉛,夾具400把持探針300的抓取部360之後,將針主體310浸入鉛槽中以將鉛塗在針主體310的表面上,然後如圖2a至2c所示,將所述探針移送至基板20,也可以利用預先在針主體310上鍍覆鉛的探針300,然後如圖2a至2c所示,使夾具400將所述探針移送
至基板20。
In order to bond the transferred
在這種狀態下,利用視覺系統在X方向、Y方向以及Z方向上,或進行旋轉來對準平台(未示出),從而確認本發明實施例的探針300的針主體310和基板20的電極21的位置並進行對準,然後用激光L照射探針300的針主體310的下部或基板20,以將針主體310的下部焊接到基板20的電極21。當然,通過監控裝置(未示出)對上述的焊接過程進行監控。
In this state, use the vision system to align the platform (not shown) in the X, Y, and Z directions, or rotate, to confirm the
根據如上所述的本發明探針300,第二延伸部340相比於抓取部360形成在下側位置,並且第二延伸部340中形成在彈性提供孔342、344的下側的第二延伸部340的一側端部形成為與針主體310的上部連接,由此能夠保持比現有的探針更高的剛性。
According to the
並且,通過形成在第一延伸部330的上部的抓取部360,在進行鍵合的針主體310的內側實施夾具400的抓取,因此可以防止鍵合時以針主體310為中心,尖端部350被向上抬起的現象,從而能夠實現鍵合並保持精度。
In addition, the gripping
由於在不脫離本發明的範圍的情況下,可以通過本說明書中記述並例示的構成和方法實現各種變形例,因此包括在上述的詳細的說明中或者在附圖中所示出的所有內容是均是示例性的,並不只在限定本發明。因此,本發明的範圍不限於上述示例性實施例,而應僅根據申請專利範圍及其等同物來限定。 Without departing from the scope of the present invention, various modifications can be realized by the configurations and methods described and exemplified in this specification. Therefore, all the contents included in the above detailed description or shown in the drawings are All are exemplary, and not only to limit the present invention. Therefore, the scope of the present invention is not limited to the above-mentioned exemplary embodiments, but should be limited only according to the scope of patent applications and their equivalents.
20:基板 20: substrate
300:探針 300: Probe
310:針主體 310: Needle body
312:孔 312: hole
314:下端 314: Bottom
330:第一延伸部 330: first extension
332:突出部 332: protruding part
340:第二延伸部 340: second extension
342:第一彈性提供孔 342: First elasticity providing hole
344:第二彈性提供孔 344: second elasticity providing hole
350:尖端部 350: Tip
352:針頭 352: Needle
354:對準部 354: Alignment Department
360:抓取部 360: grasping department
400:夾具 400: Fixture
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI792995B (en) * | 2022-04-29 | 2023-02-11 | 中華精測科技股份有限公司 | Cantilever probe card device and focusing probe thereof |
Citations (3)
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KR20100055911A (en) * | 2008-11-18 | 2010-05-27 | 주식회사 코디에스 | Probe and menufacturing method of the same |
TW201024741A (en) * | 2008-12-29 | 2010-07-01 | Japan Electronic Materials | Probe, probe card with probe mounted thereon, method for mounting probe on probe card and method for removing probe mounted on probe card |
TW201415035A (en) * | 2012-08-10 | 2014-04-16 | Nihon Micronics Kk | Contact probe and probe card |
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KR20100055911A (en) * | 2008-11-18 | 2010-05-27 | 주식회사 코디에스 | Probe and menufacturing method of the same |
TW201024741A (en) * | 2008-12-29 | 2010-07-01 | Japan Electronic Materials | Probe, probe card with probe mounted thereon, method for mounting probe on probe card and method for removing probe mounted on probe card |
TW201415035A (en) * | 2012-08-10 | 2014-04-16 | Nihon Micronics Kk | Contact probe and probe card |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI792995B (en) * | 2022-04-29 | 2023-02-11 | 中華精測科技股份有限公司 | Cantilever probe card device and focusing probe thereof |
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