TWI737595B - Semiconductor wafer carrier assembly, door assembly, substrate container in combination with getter modules, and method of reducing concentration of contaminants within a front opening container - Google Patents

Abstract

A semiconductor wafer carrier assembly includes a carrier, the carrier defining a wafer storage area adapted to support one or more semiconductor wafers. The carrier has a door for access to the wafer storage area, the door defining an interior. The assembly also includes a getter module, the getter module including a housing, getter material disposed within the housing, the getter material adapted to decrease concentration of contaminants within the wafer storage area of the carrier, and at least one connection feature adapted to readily removably secure the getter module to the interior of the door.

Description

Among semiconductor wafer carrier assembly, door assembly, substrate container and getter module Combining and reducing the concentration of pollutants in the front opening container 【Priority Statement】

This application claims the priority of U.S. Provisional Application No. 62/131,478 filed on March 11, 2015.

The present invention relates to a semiconductor wafer carrier assembly, a door assembly for a substrate container, a combination of a substrate container and a plurality of getter modules, and a method for reducing the concentration of pollutants in the microenvironment of a front-opening container.

Substrates (such as wafers and reticles) used in semiconductor processing are extremely vulnerable to contaminants (including moisture, volatile organic components (VOC) and particles). The presence of moisture can, for example, lead to the growth of haze on the mask and wafer. One way to control contaminants containing water is to continuously or periodically flush the space in the container in which the substrate is stored or fixed. During the transportation, it has been considered that the use of purge is not practical, and devices such as getters have been used in the container to keep the moisture and volatile organic components at acceptable levels during the transportation. The desiccant and getter in the substrate container are usually needed in the washing container The previous removal or detachment is because the fluid used can cause damage to the desiccant or getter.

Sealed containers called front opening unified pod (FOUP), front opening shipping boxes (FOSB), or standard mechanical interface (SMIF) boxes are used as wafer containers Or mask box. These containers provide a micro-environment to isolate and control the volume of the wafers and substrates used in the manufacture of integrated circuits. These containers are available from Entegris, Inc., the owner of this application.

Due to the adverse effects of moisture, volatile organic components, and particles on semiconductor production, it is desirable to improve the control of these pollutants.

A semiconductor wafer carrier assembly includes a carrier that defines a wafer storage area suitable for supporting one or more semiconductor wafers. The carrier has a front-opening door. The front-opening door includes a door housing and a latch mechanism. The latch mechanism is operatively coupled to the door housing to close the door securely. The door is openable. For accessing the wafer storage area, the door defines an inner side facing the wafer storage area. The assembly also includes a getter module. The getter module includes: a rigid polymer housing with an access opening; a getter material disposed in the getter module housing, the getter module The gas material is suitable for reducing the concentration of contaminants in the wafer storage area of the carrier through the access opening; and at least one rigid polymer connection feature as part of the getter module housing or from the The getter module housing is extended, and the connection feature is suitable for easily and removably fixing the getter module to the inner side of the door.

According to one embodiment, the getter material is in the form of a single getter pack, which is disposed between a base and a single cover. According to other embodiments, the getter material is in the form of a plurality of getter packs supported on a base frame, wherein A cover is arranged above each getter package. For easy removal and replacement, both a single getter type module or assembly and a multi-getter type module or assembly are opposed to each other in the container or attachment point in the door of the container Ground and removably attached to the door of the vehicle.

The embodiments of the present invention can be used to accommodate different wafer sizes (such as 150 mm silicon wafers, 200 mm silicon wafers, 300 mm silicon wafers, and 450 mm silicon wafers. Here are just a few examples) Use various transporters or other vehicles or containers together. From reading the present invention, other aspects of the present invention will be obvious to those of ordinary knowledge, and the content of the present invention should not be regarded as restrictive.

10: Semiconductor wafer carrier assembly/assembly/carrier assembly

15: Vehicle/Container

20: Semiconductor wafer/wafer

25: Stack

30: Wafer storage area

35: door

37: inner wall

40: inside

42: Surface facing inward

43: Outer Wall

45: outside

46: outer surface

50: Door shell

52: Latch mechanism

55: Tab

60: Porosity

65: Groove

100: Getter module / module / first getter module / single getter module / getter assembly / attached module / passive getter module

100’: The second getter module

105: shell

110: Pedestal

112: Groove

115: cap

120: getter material/single getter package

125: seal/joint surface

130: filter/slide-in or snap-in filter

135: filter cover

140: Pore/Central Pore

145: Circumferentially set pores/pores

150: Pore

155: Pore

160, 162: connection features

165: protrusion

170: Central fin/fin/first module

172: The second module

174: The third module

175: end fin/fin

176: Fourth Module

180: Biased substantial V-shaped member/member/biased member

182: Legs

184: Legs

185: internal panel or surface

186: External panel or surface

190: Receptacle

192: Groove

194: Sidewall

196: Stop component

198: Flange

200: Wafer holder/structure/holder

205: Wafer Platform

210: Snap-in connector

300: Getter Module/Module/Multi-Getter Module/Getter Assembly/Passive Getter Module

305: Shell

310: Pedestal

312, 314: Groove/End Groove

313: Groove/Middle Groove

315, 317, 319: cover

320, 322, 324: getter material

325, 327, 329: seal/joint surface

330: filter

335: filter cover

340: Pore

360, 362: connection features

375: Pore

410, 415, 420, 425: steps

Figure 1 is a front perspective view of a substrate container with a door according to an embodiment of the present invention.

Figure 2 is an exploded view of a getter module according to an embodiment of the invention.

Fig. 3 is a front perspective view of the getter module shown in Fig. 2 according to an embodiment of the present invention.

Fig. 4 is a rear perspective view of the getter module shown in Fig. 2 according to an embodiment of the present invention.

Figure 5 is a perspective view of a container door having a plurality of getter modules shown in Figure 2 according to an embodiment of the present invention, wherein one getter module is fixed to the door, and one getter module The group is in a position before installation or a position after removal with respect to the door.

Fig. 6 is a close-up perspective view of the getter module shown in Fig. 2 installed in the door shown in Fig. 5 according to an embodiment of the present invention.

Figure 7 is an exploded view of a getter module according to another embodiment of the present invention.

Fig. 8 is a perspective view of the getter module shown in Fig. 7 according to an embodiment of the present invention.

Fig. 9 shows the getter module shown in Fig. 8 and the third The perspective view of the door shown in Figure 5 of the getter module shown in the figure.

Fig. 10 is a close-up perspective view of the getter module shown in Fig. 8 installed in the door shown in Fig. 5 according to an embodiment of the present invention.

Figure 11 is a flowchart showing a method according to an embodiment of the present invention.

The uncontrolled concentration of moisture, oxygen, airborne molecular contaminant (AMC), volatile organic compound (VOC), or other foreign substances in the microenvironment of the wafer container can cause the circuit Defects and lower yield. Use getters to control and reduce these concentrations. However, in some wafer carriers (such as 450 mm or larger wafer carriers), there may not be enough space behind the carrier to place a getter, and there may not be enough space in the carrier for a getter. The 26th or other additional wafer slot to accommodate the disc equipped with a getter. Certain embodiments of the present invention solve these problems by providing insertable and replaceable getters in the door of a carrier by using attachment points that can also be used to attach accessories such as wafer pads or holders. problem.

More specifically, a getter assembly or module includes a housing or a closed body, and the housing or the closed body is provided with a getter and installed on an inner surface of a microenvironment door. The getter assembly is used to remove various chemicals or otherwise reduce the concentration of pollutants or other foreign objects in the carrier. One or more getter assemblies can be attached to multiple positions of the door. In one configuration, a frame is attached to multiple locations on the door and supports multiple getters. Fasteners, press fits, snap fits, and friction fits are examples of methods used to attach the frame or getter assembly to other locations in the door or carrier. The getter assembly can be a consumable or single-use commodity type; the getter assembly can also be reused or refilled between multiple uses of a specific microenvironment container.

The embodiments of the present invention can provide the following advantages: such as improving wafer yield and sustaining Protect the microenvironment for a long time from moisture, oxygen, acid, alkali, and other pollutants. In some cases, installing a getter module in a container door will eliminate or reduce the need for additional holes in the container to the external environment. A number of different getter modules can be configured and arranged to remove various chemicals as needed, and can be accessed by manipulating the door instead of manipulating the entire carrier assembly or invading the carrier closer to the wafer manipulation volume in other ways Replace the getter module inside.

Turning to the drawings, FIG. 1 illustrates a semiconductor wafer carrier assembly 10 according to an embodiment of the present invention. The assembly 10 includes a carrier 15 suitable for supporting one or more semiconductor wafers 20 in the wafer storage area 30 or other substrates in the stack 25. The carrier 15 has a door 35 for sealingly closing the carrier 15 and for opening the carrier 15 to allow access to the wafer storage area 30. Referring also to Figure 5, the door 35 has an inner wall 37 and an outer wall 43. The inner wall 37 has an inner side 40 and is located in an inwardly facing surface 42 that faces the wafer storage area 30. The outer wall 43 has an outer side 45 and An outer surface 46 faces away from the wafer storage area 30. The door 35 includes a door housing 50 of a latch mechanism 52, and the latch mechanism 52 includes a tab 55 extending from the aperture 60 to a corresponding groove 65 in the carrier 15 to lock the door 35 securely.

In the illustrated embodiment, the carrier assembly 10 is referred to as a front-opening unified standard box (FOUP) and a front-opening wafer container. Other types of carrier assemblies according to embodiments of the present invention include a front opening transport box (FOSB), a standard mechanical interface box (SMIF pod), a horizontal wafer transporter, a single wafer transporter, a universal wafer transporter, or Any other type of carrier used for semiconductor disks or wafers, for substrates, or for other items. Examples of these vehicles are described in U.S. Patent Nos. 4,815,912, 4,995,430, 5,788,082, 6,010,008, and 6,354,601. The above-mentioned U.S. patents are owned by the owner of this application and are incorporated by reference in their entirety. Included in this article for all purposes.

Figures 2 to 4 illustrate a getter module 100 which is also referred to as a getter assembly. The getter module 100 includes a housing 105 having a base 110 and a cover 115. The getter material 120 is disposed in the housing 105, and specifically, is supported on the base 110 in the groove 112 of the base 110. seal up The cover 115 is disposed above the base 110 and the getter material 120. According to one embodiment, the cover 115 is sealed or otherwise substantially permanently connected to the base 110 by means of adhesive, ultrasonic welding or other welding or other methods along the sealing member or joint surface 125, in which air is inhaled The agent module 100 can be completely disposed of after use. As another option, the cover 115 is removably attached to the base 110 by, for example, a snap-fit connection, so that the getter material 120 or other components in the housing 105 can be replaced or re-used between multiple uses. add.

One or more optional filters 130 are disposed between the cover 115 and the getter material 120, and are positioned and supported by one or more optional corresponding filter covers 135. According to an embodiment of the present invention, the filter cover 135 is permanently (for example, by ultrasonic welding) or removably fixed to the cover 115, for example, the filter 130 is fixed relative to the cover 115 and the getter material 120 Hold it in an appropriate place. The filter cover 135 can also be in the form of a holder for accommodating a slide-in or snap-in filter 130. The filter 130 provides protection from the inside out and protection from the outside in. It is used to filter out particulate matter and substantially reduce the pollution of the getter material 120 by external particles, and it is also used to keep any particles Inside the shell 105 to prevent corresponding pollution to the microenvironment in the carrier 15.

The getter module 100 also defines one or more apertures 140 through the cover 115. The apertures 140 are used to chemically expose the getter material 120 to the inside of the carrier 15 and the wafer storage area 30, or otherwise The method promotes or allows the interaction between the getter material 120 and the environment outside the getter module 100. In the illustrated embodiment, the pore 140 is a central pore surrounded by six circumferentially arranged pores 145, but by reading this disclosure, other numbers and configurations of the pores 140 and 145 are for the ordinary knowledgeable person. Will be obvious. The central pore 140 and the circumferentially arranged pores 145 correspond to and are substantially aligned with the corresponding pores 150 and 155 in each filter cover 135.

According to an example, the getter material 120 is optionally in the form of a getter package, that is, it is pressed or otherwise formed as an integral removable unit. )part. By reading this disclosure, other forms of getter packs will be obvious to those of ordinary knowledge. The getter material 120 is suitable for reducing the concentration of pollutants in the carrier 15 (specifically, in the wafer storage area 30). In one embodiment, the getter material 120 removes gases, water, airborne molecular contaminants (AMC), volatile organic compounds (VOC), or other substances that may have an adverse effect on the items or processing in the carrier assembly 10 Unwanted pollutants or substances. Airborne molecular pollutants that can be controlled according to the present invention include acids and bases (for example, NH ₃ and SO ₄ ), biotoxins, compressible pollutants or corrosive pollutants, volatile organic compounds, dopants, and Other types of these pollutants or substances.

Different types of getter packages or getter materials 120 can be selected to remove or reduce the concentration of specific types of pollutants or substances, as may be required in specific applications. A user of the carrier assembly 10 can select and select different getter materials 120 or getter modules according to the type of pollutants to be controlled and/or according to the specific items or treatments present in the carrier assembly 10 100.

Examples of getter materials suitable for use in accordance with the embodiments of the present invention include getter materials used in CLARILITE wafers available from Intel Corporation. The getter materials fit in a front-opening unified standard box and a front-opening transport box. In the wafer slot to absorb contaminants and water. CLARILITE is a registered trademark of Intel Corporation. Examples of suitable getter materials are also disclosed in the jointly granted U.S. Patent No. 8,776,841, U.S. Patent No. 8,783,463, and Patent Cooperation Treaty Application No. PCT/US2014/054399 filed on September 5, 2014. The above-mentioned patents are incorporated herein by reference in their entirety for all purposes.

The getter material according to the embodiment of the present invention can be granular desiccant, rigid plate, absorbent disc, molecular sieve, and/or polymer matrix (polymer matrix) that holds the desiccant or molecular sieve material (only a few are listed here) Instance) of the form. The getter material may also include a polymer base, a channeling agent, and/or a desiccant as needed. In some embodiments, the polymer is a thermoplastic polymer. Thermoplastic polymers include: acrylic acid, such as poly(methyl methacrylate) (poly(methyl methacrylate); PMMA); poly(methyl methacrylate); Such as nylon; polybenzimidazole (PBI); polyethylene, including ultra-high molecular weight polyethylene (UHMWPE), high-density polyethylene (HDPE), and low density Polyethylene; polypropylene (PP); polystyrene; polyvinyl chloride (PVC); and polytetrafluoroethylene (PTFE). The channeling agent is a compound that is insoluble in the polymer but is used to form a channel through the polymer that can communicate with the desiccant. Examples of such channeling agents include, but are not limited to, ethylene-vinyl alcohol (EVOH) and polyvinyl alcohol (PVOH). Examples of desiccants include: anhydrous salts, which form water-containing crystals; reactive compounds, which chemically react with water to form new compounds; and physical absorbers, which have a plurality of microtubes and therefore rely on capillary action to absorb from the environment Moisture. Examples of such absorbents include molecular sieves, silica gels, clays, and starches. In an embodiment, activated carbon may be an absorbent material, especially for volatile organic compounds. The embodiments of the present invention can substantially reduce the amount of oxygen, moisture, moisture, volatile organic compounds, and other pollutants in the associated transporter or other container.

The getter module 100 includes one or more connection features 160, 162 suitable for easily and removably fixing the getter module 100 to the inner side 40 of the door 35. The connection feature 160 includes a protrusion 165 that extends substantially parallel to the plane of the base 110 and substantially perpendicular to the connection feature 162. The central fin 170 and the end fin 175 connect the protrusion 165 to one of the remaining parts of the base 110 and provide enhanced rigidity and structural strength of the protrusion 165 relative to the base 110. The fins 170 and 175 also provide proper alignment of the connection feature 160 and the module 100 with respect to the door 35. The connecting feature 162 shown in Figure 4 is a substantially V-shaped member 180 with one of the two legs 182, 184 offset. The leg 184 is bent relative to the leg 182 to bias the getter module 100 to the position on the inner side 40 of the door 35. The member 180 therefore acts as a spring or biasing member and is used to help snap-fit the getter module 100 into a spot in the door 35. The protrusion 165 is disposed on one of the getter module 100 opposite to the member 180 Side, and extend in a direction substantially perpendicular to the member 180.

5 to 6 show the connection of the getter module 100 to the inner side 40 of the door 35. The door 35 includes an inner panel or surface 185 and an outer panel or surface 186, and an inner volume of the door 35 is defined between the inner panel or surface 185 and the outer panel or surface 186. The door 35 includes a plurality of receptacles 190 or attachment points for the module 100. Each container 190 includes a groove 192 that extends into the volume 189 and has a sufficient size and depth to at least partially accommodate the getter module 100. The side wall 194 is disposed on one side of the groove 192. A stopper member 196 in the form of two laterally extending stoppers is disposed adjacent to or close to the side wall 194. The side wall 194 and the stop member 196 are used for accommodating and holding the biased member 180. The leg 184 of the member 180 contacts the side wall 194, and an upper end of the leg 184 abuts or almost abuts a lower side of the stop member 196.

On the opposite side of the getter module 100, the flange 198 on the inner side 40 of the door 35 defines a recess under the flange 198 for receiving the protrusion 165 of the connection feature 160. In order to insert or attach the getter module 100 to the door 35, the protrusion 165 is first placed in the recess under the flange 198. Then the module 100 is further rotated or pressed into the groove 192 so that the biased member 180 contacts the side wall 194. The biasing member 180 pushes the getter module 100 to the right as viewed in Figure 6 to lock or snap-fit the protrusion 165 into the recess under the flange 198 and toward the flange 198 pushes the fins 170, 175 or pushes the fins 170, 175 to align with the flange 198. The stop member 196 substantially prevents the member 180 from sliding upward along the side wall 194 and out of position. The getter module 100 is therefore at least partially disposed in the recess 192 and extends to the inner volume of the door 35 between the inner panel or surface 185 and the outer panel or surface 186. According to an alternative embodiment, the getter module 100 is fully extended in the groove 192 such that a top surface of the getter module 100 and the inner panel 185 of the door 35 are substantially flush or substantially coplanar. For removal, according to one embodiment, the module 100 is pushed to the left as viewed in Figure 6, the protrusion 165 is removed from the recess under the flange 198, and then from the groove 192 and The door 35 completely removes the module 100.

In FIG. 5, a first getter module 100 has been attached to the inner side 40 of the door 35. According to an embodiment of the present invention, the getter material 120 in the attached module 100 is a type of getter selected by a user to remove one or more specific types of contaminants from the carrier 15气材料。 Gas materials. A second getter module 100' is about to be inserted into the inner side 40 of the door 35 as shown in the figure. According to one embodiment, the getter material in the second getter module 100' is used to remove from the carrier 15 one or more different types of pollution that are different from those controlled by the attached module 100 One type of getter material. Alternatively, the getter material may be the same as the getter material 120 of the attached getter module 100. By selecting and selecting different getter modules for the required receptacle 190 in the door 15, a user can select specific items to be placed in the carrier 15, the processing to be performed, or in other ways The distribution, quantity, and arrangement of the getter in the carrier 15 are customized in accordance with the types and concentrations of pollutants that may be present in the carrier 15 and may need to be removed.

FIG. 5 also illustrates a wafer holder 200 for guiding or supporting the wafer held in the carrier 15. According to one embodiment, the holder 200 includes a plurality of stacked wafer platforms 205 to help guide or support the stacked wafers 20 in the carrier 15. The structure 200 includes a snap-on connector 210 to be connected to the receptacle on the inner side 40 of the door 35, and is similar in shape, size, and/or function to the receptacle 190 for accommodating the getter module 100 The container. Therefore, according to an example, if the holder 200 needs to be replaced with a larger holder to accommodate a larger wafer 20, the larger holder can be equipped with the getter module 100 for accommodating The connection structure in the receptacle 190 is equipped with a connector suitable for fitting in the receptacle 190 in the same way. Therefore, each container 190 is suitable for accommodating an accessory (such as the holder 200 or other guiding or supporting structure for the wafer 20), and each container 190 is also suitable for accommodating a getter module The connection features 160 and/or 162 of 100 are used to easily and removably fix the getter module 100 to the inner side 40 of the door 35. According to the embodiment of the present invention, each container 190 has a variety of uses no matter where it is located on the door 35 or other positions in the carrier 15.

The getter module 100 is a single getter-type module, and the single getter-type module contains a method for removing or otherwise reducing a type of pollutant or a group of pollutants in the carrier 15 One single getter package 120 in concentration. The embodiment of the present invention also envisages a multi-getter type module for accommodating a plurality of getter packs for disposing of multiple types of pollutants or higher concentrations of pollutants in the carrier 15, which will now be referred to Figures 7 to 8 illustrate this in detail.

Figures 7 to 8 illustrate a getter module 300 which is also referred to as a getter assembly. The getter module 300 includes a housing 305 having a base 310 in the form of a base frame and a plurality of covers 315, 317, and 319. The getter materials 320, 322, and 324 are disposed in the housing 305, and specifically, are supported on the base 310 in the grooves 312, 313, and 314 of the base 310. The getter materials 320, 322, and 324 are in the form of a plurality of getter packs, which are respectively similar to the getter packs described with reference to FIGS. 2 to 4.

The covers 315, 317, and 319 are disposed above the base 310 and are respectively disposed above the grooves 312, 313, 314 and the corresponding getter materials 320, 322, and 324 of the base 310. According to one embodiment, the cover 315, 317, 319 is sealed or otherwise connected to the base 310 along the sealing member or bonding surface 325, 327, 329 by adhesive, ultrasonic welding or other welding, or other methods, The getter module 300 can be completely disposed of after use. As another option, the covers 315, 317, 319 are removably attached to the base 310 by a snap-fit connection, so that the getter materials 320, 322, 324 or other components in the housing 305 are more than It can be replaced or refilled between uses. One or more optional filters 330 are disposed between the covers 315, 317, 319 and the corresponding getter materials 320, 322, 324 to be positioned and supported by the one or more corresponding filter covers 335 as needed. According to an embodiment of the present invention, the filter cover 335 is permanently or removably fixed to the cover 315, for example, to hold the filter 330 in place relative to the cover 315 and the getter material 320, 322, 324 . The getter module 300 also defines one or more apertures 340 through the cover 315, 317, 319. The apertures 340 are used to chemically expose the getter material to the inside of the carrier 15 and the wafer storage area 30. Or with it Other methods promote or allow the interaction between the getter material and the environment outside the getter module 300. The other aspects of the one or more pores 340 and the corresponding pores in the filter cover 335 are the same as those described with respect to the pores 140, 145, 150, and 155 in FIGS. 2 to 4, and I will not repeat them here. In addition, unless otherwise specified, all other details related to the getter module 300 (for example, inserting it into and removing from the internal volume of groove 192 and door 35) The details are the same as those described for the getter module 100.

Although the illustrated embodiment of the module 300 includes three getter packs and three caps, an alternative embodiment of the module 300 includes two getter packs and two caps, four getter packs and Four covers, or any other required number.

The getter module 300 includes one or more connection features 360, 362 suitable for easily and removably fixing the getter module 300 to the inner side 40 of the door 35. The connection features 360 and 362 are the same as the connection features 160 and 162 described with reference to FIGS. 2 to 4 in terms of structure and operation as required, and will not be repeated here. Each receptacle 190 of the door 35 is suitable for easily and removably accommodating a single getter type module 100 as described above, and a plurality of receptacles 190 are suitable for easily and removably receiving The connection features 360 are arranged to fix the multi-getter module 300 to the door 35.

Apertures 375 are provided adjacent to or on opposite sides of the grooves 312, 313, 314 in the base frame or the base 310. The middle groove 313 includes two such holes 375, one is located on either longitudinal side of the two longitudinal sides of the middle groove 313, and the end grooves 312, 314 include one such hole 375 on its inner end. The aperture 375 contains, for example, a tool for assisting in inserting the base 310 into the door 35 or removing the base 310 from the door 35.

9 to 10 show the connection of the getter module 300 with respect to the inner side 40 of the door 35. As previously described with reference to FIGS. 5 to 6 in this article, the door 35 includes a plurality of containers 190 or attachment points for the module 100. These receptacles 190 (including the groove 192, the side wall 194, the stop member 196, and other features) are used to accommodate the connection features 160 of the single getter module 100, 162 accommodates the connection features 360, 362 of the multi-getter module 300 in the same manner. Figure 9 shows both a multi-getter module 300 and a single getter module 100 attached to the inner side 40 of the door 35, which can be selected by a user. The modules include a first module 170, a second module 172, a third module 174, and a fourth module 176.

As should be understood, the single getter module 100 and/or the multiple getter module 300 can be attached to the inner side 40 of the door 35 in any desired manner and combination, so as to lower the interior of the carrier 15 in a customized manner. Concentration of pollutants. Each multi-getter module 300 includes a getter package required for a specific application, such as two or three different getter packages, two getter packages of the same type, and a different type of getter package. Kits, or any other desired combination of getter kits. The multi-getter module 300 can be used on the same door together with the single getter module 100 as needed. The getter modules 100 and 300 can be customized or purchased for specific applications, or kits with different types of getter modules 100 and/or 300 can also be provided and used.

Figure 11 shows the method steps according to an embodiment of the invention. A method for reducing the concentration of gas, moisture, and/or other airborne molecular contaminants in a container microenvironment includes: at 410, attaching one or more getter modules 100 or 300 to the container 15 Door 35. Each getter module is suitable for removing a different type of pollutant from the container microenvironment as needed, and/or one getter module is suitable for removing a variety of different pollutants as needed. The method additionally includes: at 415, closing the door 35 of the container 15 to expose the getter module to the container microenvironment. At 420, the door 35 is finally opened, and at 425, one or more of the getter modules are replaced.

The embodiments of the present invention are particularly useful in non-purging, passive environments. According to these embodiments, the getter modules 100, 300 do not include a connection to the purge port or other purge components and are therefore outside of a purge flow. However, the containers used with these passive getter modules 100, 300 may themselves include a microenvironment in which purge gas and systems are used to actively reduce the concentration of pollutants. In other embodiments, the purge gas or other gas can be directly passed through the planned route. The modules 100 and 300 are passed through, so that these modules are directly in the purge flow.

It should be noted that the embodiments of the present invention are not limited to use with semiconductor materials, wafers or other substrates or carriers. The embodiments of the present invention can be used to protect any items that should be transported in a clean, non-polluting or otherwise protected state, and these embodiments can also be applied to various industries and other environments in addition to the semiconductor industry. The term substrate used herein includes wafers processed into integrated circuits, solar panels, flat panels, or other semiconductor devices; substrates also include photomasks used in lithography and memory disks (such as hard drives) Disk in the middle; and any other items that you want to protect. The embodiments of the present invention can be applied to various industries and various pollution-sensitive items, not only to the semiconductor industry and semiconductor wafers. For example, the embodiments of the present invention are also applied to life sciences and biological/pharmaceutical industries. In addition, unless otherwise indicated, the terms container, carrier, transporter, cassette, transport/storage bin, etc. can also be used interchangeably in this text. In addition, the terms getter module and getter assembly are used interchangeably herein. Various modifications and changes of the illustrated and described embodiments that are within the scope of this application will be obvious to those familiar with the art. Changes in form and content can be made without departing from the spirit and scope of the present invention.

35: door

37: inner wall

40: inside

42: Surface

100: Getter module/module/first getter module/single getter module/getter assembly/attached module

100’: The second getter module

185: internal panel or surface

186: External panel or surface

190: Receptacle

192: Groove

194: Sidewall

200: Wafer holder/structure/holder

205: Wafer Platform

210: Snap-in connector

Claims (27)

A semiconductor wafer carrier assembly, comprising: a carrier defining a wafer storage area suitable for supporting one or more semiconductor wafers, the carrier having a front opening door, the The front-opening door includes a door housing and a latch mechanism that is operatively coupled to the door housing to close the front-opening door, and the front-opening door is openable for access to the wafer A storage area, the front opening door defines an inner side facing the wafer storage area; and a getter module, the getter module includes: a getter module housing with an access opening, The getter module housing includes a base and at least one cover fixed to the base; a getter material is arranged in the getter module housing between the cover and the base, The getter material is suitable for reducing the concentration of contaminants in the wafer storage area of the carrier through the access opening, wherein the getter material is in the form of a plurality of getter packs, the At least one cover includes a plurality of covers, the covers respectively corresponding to a corresponding getter pack, and the base defines a base frame, the base frame is used for the base frame and the corresponding seals The getter packs are supported between the covers; and at least one rigid polymer connection feature as a part of the getter module housing or extending from the getter module housing, the rigid polymer connection feature It is suitable for easily and removably fixing the getter module to the inner side of the door. The carrier assembly according to claim 1, wherein the getter module further includes a filter disposed between the cover and the getter material. The carrier assembly according to claim 1, wherein the getter packs are directly supported on the base frame superior. The vehicle assembly according to claim 1, wherein the inner side of the door defines a plurality of receptacles; and wherein the at least one rigid polymer connection feature defines a plurality of connection features so that the base frame can be easily and easily The receptacles fixed to the door removably. The carrier assembly according to claim 4, wherein each accommodator on the inner side of the door is also suitable for accommodating at least one connection feature of a second getter module, the second getter module The set has a single base, a single cover, and a single getter package arranged between the single base and the single cover. The carrier assembly according to claim 1, wherein the getter module is conformed to a groove in the door. The carrier assembly according to claim 1, wherein the inner side of the door defines a container, and the container is suitable for receiving one of a plurality of wafers in the wafer storage area to guide or support the wafer Structure; the container is also suitable for accommodating the at least one rigid polymer connection feature of the getter module, so that the getter module can be easily and removably fixed to the inner side of the door. The carrier assembly of claim 1, wherein the at least one rigid polymer connection feature includes a snap-fitting member for snap-fitting the getter module to the door. The carrier assembly according to claim 8, wherein the at least one rigid polymer connection feature further comprises a protrusion, and the protrusion is disposed on a side of the getter module opposite to the snap-fitting member, To fit in one of the openings in the inner side of the door. The vehicle assembly according to claim 1, wherein the at least one rigid polymer connection feature comprises a substantially V-shaped member that is biased, and the substantially V-shaped member is biased to be pressed against a container of the door置器. The carrier assembly according to claim 10, wherein the at least one rigid polymer connection feature further includes a protrusion extending in a direction substantially perpendicular to the substantially V-shaped member. A door assembly for a substrate container, comprising: a door for closing the substrate container, a first getter module, the first getter module defining a single getter, the single getter The agent includes a first getter material for removing contaminants from the substrate container; a second getter module, the second getter module defines a second getter, the second getter The agent includes a second getter material that is different from the first getter material for removing contaminants from the substrate container, wherein the door defines a plurality of attachment points, and the attachment points are respectively suitable for attaching the first suction material. An aerosol module and the second getter module, wherein the first getter module and the second getter module are attached to the door at a selected attachment point among the attachment points. The door assembly according to claim 12, wherein the first getter module is suitable for removing one type of pollutants from the container; and wherein the second getter module is suitable for removing from the container different from The one type of pollutant is at least one other type of pollutant. The door assembly according to claim 12, wherein each of the first getter module and the second getter module includes a biased member so that the corresponding getter module The group snaps to engage the door at any one of the attachment points. The door assembly according to claim 12, wherein the attachment points have the same shape. The door assembly according to claim 12, further comprising a third getter module, the third getter module having a third one which is different from the first getter material and the second getter material Getter material. The door assembly described in claim 12 is combined with a container. A combination of a substrate container, a first getter module and a second getter module, each of the first getter module and the second getter module includes: a suction The aerosol pack is supported by a base, the getter pack contains a getter formula; a cover is arranged above the base and the getter pack; and at least one filter is operatively connected to Between the getter package and the cover; wherein the getter module is easily and removably fixed to the substrate container inside one of the substrate containers; wherein the cover defines at least one channel, the At least one channel is suitable for chemically encapsulating the getter and exposing the inside of the substrate container; and each of the first getter module and the second getter module includes at least one connection feature, the At least one connection feature is suitable for fixing the first getter module or the second getter module to a door of the substrate container, respectively. The combination of the substrate container and the first getter module and the second getter module according to claim 18, wherein the getter formula of the first getter package is different from that of the second getter The getter formula of the aerosol package. The combination of the substrate container and the first getter module and the second getter module according to claim 18, wherein each of the first getter module and the second getter module includes At least one connection feature, the at least one connection feature being suitable for fixing the first getter module or the second getter module to an inner side of the door at any one of a plurality of attachment points, respectively. The combination of the substrate container and the first getter module and the second getter module according to claim 20, wherein the at least one connection feature defines a snap fit, a press fit, and a friction fit one of them. The combination of the substrate container according to claim 18, the first getter module and the second getter module is combined with one or more substrates placed in the substrate container. A door assembly for an article container. The door assembly includes: a door bottom frame with an inwardly facing surface, a groove for accommodating a wafer gasket, and a groove attached to the groove at the groove The wafer liner of the door is recessed in a receptacle in the surface of a door assembly, the surface of the door assembly is configured to face the articles in the article container, and the receptacle is suitable for accommodating a suction An agent module, the getter module includes a connection feature having a biasing member, the connection feature includes two legs engaged with the receptacle to fix the getter module to the door chassis And the getter module is accommodated by the container, and the getter module is suitable for reducing pollution in the container of the article. The door assembly according to claim 23, wherein the getter module is at least partially disposed in a groove of the container. The door assembly according to claim 23, wherein the surface of the door assembly has an inner door wall and the door assembly further includes an outer door wall, and the inner door wall and the outer door wall are defined between the door assembly An internal volume, wherein the getter module extends over the inner door wall and enters the internal volume of the door assembly. The door assembly according to claim 23, wherein the getter module is a passive getter module, and the passive getter module does not include a connection with a purge flow. The door assembly described in claim 23 is combined with an article container, and the article container is selectively opened and closed by the door assembly.

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