TWI730776B - Electronic device - Google Patents
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- TWI730776B TWI730776B TW109116830A TW109116830A TWI730776B TW I730776 B TWI730776 B TW I730776B TW 109116830 A TW109116830 A TW 109116830A TW 109116830 A TW109116830 A TW 109116830A TW I730776 B TWI730776 B TW I730776B
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種包含散熱組件的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device including a heat dissipation component.
隨著筆記型電腦的效能不斷增進,其內部元件運作時產生大量的熱,故其散熱能力需相應地提升。藉由增加散熱組件的體積可有效提升其散熱能力,然在筆記型電腦輕薄的設計趨勢之下,其機體內部的配置空間有限而難以增加散熱組件的體積。因此,如何在不增加筆記型電腦的體積的前提下有效提升其散熱能力,是筆記型電腦之散熱設計的重要議題。As the performance of the notebook computer continues to increase, its internal components generate a lot of heat when operating, so its heat dissipation capability needs to be improved accordingly. Increasing the volume of the heat dissipation component can effectively improve its heat dissipation capacity. However, under the trend of thin and light design of the notebook computer, the configuration space inside the body is limited and it is difficult to increase the volume of the heat dissipation component. Therefore, how to effectively improve the heat dissipation capacity of the notebook computer without increasing the size of the notebook computer is an important issue in the heat dissipation design of the notebook computer.
本發明提供一種電子裝置,可節省其內部配置空間並提升散熱能力。The present invention provides an electronic device, which can save the internal configuration space and improve the heat dissipation capacity.
本發明的電子裝置包括一第一機體、一第二機體、一樞軸組件、一連動結構及一散熱組件。第一機體及第二機體藉由樞軸組件而相互樞接。連動結構配置於第一機體內且連接於樞軸組件。散熱組件配置於第一機體內且連接於連動結構。隨著第二機體從第一機體展開,樞軸組件藉由連動結構帶動散熱組件部分地突伸至第一機體外。The electronic device of the present invention includes a first body, a second body, a pivot assembly, a linkage structure, and a heat dissipation assembly. The first body and the second body are pivotally connected to each other by the pivot assembly. The linkage structure is arranged in the first body and connected to the pivot assembly. The heat dissipation component is arranged in the first body and connected to the linkage structure. As the second body is unfolded from the first body, the pivot assembly drives the heat dissipation component to partially protrude outside the first body through the linkage structure.
在本發明的一實施例中,上述的第一機體具有相對的一前端及一後端,第二機體藉由樞軸組件而樞接於後端,第一機體在後端具有一開槽,散熱組件適於透過開槽而部分地突伸至第一機體外。In an embodiment of the present invention, the above-mentioned first body has a front end and a rear end opposite to each other, the second body is pivotally connected to the rear end by a pivot assembly, and the first body has a slot at the rear end. The heat dissipation component is adapted to partially protrude to the outside of the first body through the slot.
在本發明的一實施例中,上述的樞軸組件具有一第一齒輪,連動結構具有一第二齒輪,散熱組件具有一齒條,第二齒輪嚙合於第一齒輪且嚙合於齒條。In an embodiment of the present invention, the above-mentioned pivot assembly has a first gear, the linkage structure has a second gear, the heat dissipation assembly has a rack, and the second gear meshes with the first gear and meshes with the rack.
在本發明的一實施例中,包括一彈性件,其中彈性件連接於散熱組件與第一機體之間,散熱組件適於藉由彈性件的彈性力而維持為部分地突伸至第一機體外的狀態。In an embodiment of the present invention, an elastic element is included, wherein the elastic element is connected between the heat dissipation element and the first body, and the heat dissipation element is adapted to be maintained to partially protrude to the first body by the elastic force of the elastic element Outside the state.
在本發明的一實施例中,上述的樞軸組件具有一齒輪,連動結構包括一第一桿件及一第二桿件,第一桿件具有一齒條,齒條嚙合於齒輪,第二桿件可動地連接於第一桿件與散熱組件之間。In an embodiment of the present invention, the above-mentioned pivot assembly has a gear, and the linkage structure includes a first rod and a second rod. The first rod has a rack, and the rack is meshed with the gear. The rod is movably connected between the first rod and the heat dissipation component.
在本發明的一實施例中,上述的第二桿件具有一第一連接端、一第二連接端及一樞接部,樞接部位於第一連接端與第二連接端之間且樞接於第一機體,第一連接端及第二連接端分別可轉動地滑設於第一桿件及散熱組件。In an embodiment of the present invention, the above-mentioned second rod has a first connecting end, a second connecting end, and a pivoting portion. The pivoting portion is located between the first connecting end and the second connecting end and is pivoted. Connected to the first body, the first connecting end and the second connecting end are respectively rotatably slidably disposed on the first rod and the heat dissipation component.
在本發明的一實施例中,上述的第一連接端及第一桿件的其中之一具有一滑槽,第一連接端及第一桿件的其中之另一具有一凸柱,凸柱可轉動地滑設於滑槽。In an embodiment of the present invention, one of the above-mentioned first connecting end and the first rod has a sliding groove, and the other of the first connecting end and the first rod has a protruding post, and the protruding post The chute is rotatably slidably arranged.
在本發明的一實施例中,上述的第二連接端及散熱組件的其中之一具有一滑槽,第二連接端及散熱組件的其中之另一具有一凸柱,凸柱可轉動地滑設於滑槽。In an embodiment of the present invention, one of the above-mentioned second connecting end and the heat dissipation element has a sliding groove, and the other of the second connection end and the heat dissipation element has a protruding post, and the protruding post is rotatably slidable Located in the chute.
在本發明的一實施例中,上述的散熱組件包括一移動件及一散熱鰭片組,移動件滑設於第一機體內,散熱鰭片組配置於移動件內且適於隨著移動件往第一機體外移動。In an embodiment of the present invention, the above-mentioned heat dissipation assembly includes a moving part and a heat dissipation fin group, the moving part is slidably arranged in the first body, and the heat dissipation fin group is arranged in the moving part and is suitable for following the moving part. Move to the body of the first machine.
在本發明的一實施例中,上述的散熱鰭片組包括至少一彈性散熱體,至少一彈性散熱體連接於第一機體與移動件之間。In an embodiment of the present invention, the aforementioned heat dissipation fin set includes at least one elastic heat dissipation body, and the at least one elastic heat dissipation body is connected between the first body and the moving part.
在本發明的一實施例中,當移動件往第一機體外移動時,移動件拉伸至少一彈性散熱體。In an embodiment of the present invention, when the moving part moves outside the first body, the moving part stretches at least one elastic heat sink.
基於上述,本發明將散熱組件配置為可隨著電子裝置之第二機體的展開而部分地突伸至電子裝置之第一機體外。藉此,當電子裝置為展開狀態時,散熱組件因部分地突伸至第一機體外而可增加其散熱效率,故不需以增加散熱組件的體積之方式來提升其散熱能力。從而,可在兼顧散熱設計的同時節省電子裝置的內部配置空間。Based on the above, the present invention configures the heat dissipating component to partially protrude into the first body of the electronic device as the second body of the electronic device is unfolded. Thereby, when the electronic device is in the unfolded state, the heat dissipation element can increase its heat dissipation efficiency because it partially protrudes outside the first body. Therefore, it is not necessary to increase the heat dissipation capacity of the heat dissipation element by increasing the volume of the heat dissipation element. Therefore, the internal configuration space of the electronic device can be saved while taking into account the heat dissipation design.
圖1是本發明一實施例的電子裝置的立體圖。圖2繪示圖1的電子裝置展開。請參考圖1及圖2,本實施例的電子裝置100例如是筆記型電腦且包括一第一機體110、一第二機體120及一樞軸組件130。第一機體110及第二機體120例如分別是筆記型電腦的主機及螢幕且藉由樞軸組件130而相互樞接。藉由樞軸組件130的樞轉,第二機體120可從圖1所示的閉合狀態相對於第一機體110轉動至圖2所示的展開狀態。FIG. 1 is a perspective view of an electronic device according to an embodiment of the invention. Fig. 2 shows the electronic device of Fig. 1 unfolded. Please refer to FIGS. 1 and 2, the
圖3是圖1的電子裝置的部分構件放大圖,其對應於圖1的區域A。請參考圖3,樞軸組件130包括分別連接第一機體110(繪示於圖1及圖2)及第二機體120且可相對樞轉的轉軸132、134。在第二機體120從第一機體110展開的過程中,第二機體120及轉軸134會相對於第一機體110及轉軸132樞轉。本實施例的電子裝置100如圖3所示更包括至少一連動結構140及至少一散熱組件150(圖1及圖2繪示為兩個)。連動結構140配置於第一機體110內且連接於樞軸組件130的轉軸134,散熱組件150配置於第一機體110內且連接於連動結構140。FIG. 3 is an enlarged view of part of the components of the electronic device in FIG. 1, which corresponds to area A in FIG. 1. Please refer to FIG. 3, the
圖4是圖1的電子裝置的側視圖。圖5是圖2的電子裝置的側視圖。隨著第二機體120從圖1及圖4所示狀態相對於第一機體110展開至圖2及圖5所示狀態,樞軸組件150的轉軸134相對於第一機體110轉動並藉由連動結構140帶動散熱組件150如圖2及圖5所示部分地突伸至第一機體110外。Fig. 4 is a side view of the electronic device of Fig. 1. Fig. 5 is a side view of the electronic device of Fig. 2. As the
如上所述,本實施例將散熱組件150配置為可隨著電子裝置100之第二機體120的展開而部分地突伸至電子裝置100之第一機體110外。藉此,當電子裝置100為展開狀態時,散熱組件150因部分地突伸至第一機體110外而可增加其散熱效率,故不需以在電子裝置100內部增加散熱組件150的體積之方式來提升其散熱能力。從而,可在兼顧散熱設計的同時節省電子裝置100的內部配置空間。As described above, in this embodiment, the
請參考圖3,本實施例的散熱組件150包括一移動件152及一散熱鰭片組154,移動件152滑設於第一機體110內,散熱鰭片組154配置於移動件152內且適於隨著移動件152往第一機體110外移動。移至第一機體110外的散熱鰭片組154可更有效率地與外界的空氣進行熱交換,據以提升散熱效果。3, the
在本實施例中,第一機體110具有相對的一前端110a及一後端110b,第二機體120藉由樞軸組件130而樞接於第一機體110的後端110b。第一機體110在其後端110b具有一開槽110c(標示於圖1及圖2),散熱組件150適於透過開槽110c而部分地突伸至第一機體110外。在其他實施例中,散熱組件150可從第一機體110的其他位置突伸出,本發明不對此加以限制。In this embodiment, the
請參考圖3,在本實施例中,樞軸組件130具有一齒輪134a,齒輪134a例如藉由樞軸蓋134b而與轉軸134相互固定。亦即,轉軸134、齒輪134a及樞軸蓋134b相互固定而適於同步地轉動。圖6繪示圖1的電子裝置於另一視角的局部結構。圖7繪示圖2的電子裝置於另一視角的局部結構。請參考圖3、圖6及圖7,連動結構140包括一第一桿件142及一第二桿件144,第一桿件142具有一齒條142a,齒條142a嚙合於齒輪134a,第二桿件144可動地連接於第一桿件142與散熱組件150之間。在第二機體120相對於第一機體110展開的過程中,隨著轉軸134的轉動,齒輪134a藉由齒條142a帶動第一桿件142、第二桿件144及散熱組件150從圖6所示狀態作動至圖7所示狀態,使散熱組件150從第一機體110突伸出。Please refer to FIG. 3, in this embodiment, the
詳細而言,本實施例的第二桿件144具有一第一連接端144a、一第二連接端144b及一樞接部144c。樞接部144c位於第一連接端144a與第二連接端144b之間且樞接於第一機體110,第一連接端144a可轉動地滑設於第一桿件142,第二連接端144b可轉動地滑設於散熱組件150的一延伸板150a。散熱組件150例如是藉由延伸板150a而滑設於第一機體110。圖8是圖6的第二桿件及延伸板於另一視角的立體圖。更具體而言,本實施例的第二桿件144的第一連接端144a如圖3及圖8所示具有一滑槽144a1,第一桿件142如圖3所示具有一凸柱142b,凸柱142b可轉動地滑設於滑槽144a1。類似地,本實施例的第二桿件144的第二連接端144b如圖8所示具有一凸柱144b1,散熱組件150的延伸板150a如圖8所示具有一滑槽150a1,凸柱144b1可轉動地滑設於滑槽150a1。在其他實施例中,連動結構140可為其他適當形式,本發明不對此加以限制。以下藉由圖式對此舉例說明。In detail, the
圖9A至圖9C繪示本發明另一實施例的電子裝置的作動流程。圖9A至圖9C所示實施例與前述實施例的不同處在於,在本實施例的電子裝置100A中,樞軸組件130’具有一第一齒輪G1,連動結構140’具有一第二齒輪G2,散熱組件150’具有一齒條G3,第二齒輪G2嚙合於第一齒輪G1且嚙合於齒條G3。在第二機體120相對第一機體110展開的過程中,第一齒輪G1隨著樞軸組件130’轉動而藉由第二齒輪G2及齒條G3帶動散熱組件150’從圖9A所示位置移至圖9B所示位置,使散熱組件150’部分地突伸至第一機體110外。此外,藉由對齒條G3的長度及其與第二齒輪G2的相對位置進行適當地設置,可使第二齒輪G2於第二機體120展開至圖9B所示狀態後不再繼續帶動齒條G3,從而在第二機體120從圖9B所示狀態繼續展開至圖9C所示狀態的過程中,散熱組件150’的位置不變。9A to 9C illustrate the operation flow of the electronic device according to another embodiment of the present invention. The embodiment shown in FIGS. 9A to 9C is different from the previous embodiment in that, in the
進一步而言,本實施例的電子裝置100A更包括一彈性件160,彈性件160連接於散熱組件150’與第一機體110之間,散熱組件150’適於藉由彈性件160的彈性力而維持為圖9B所示的部分地突伸至第一機體110外的狀態。藉此,可避免散熱組件150’因受到撞擊或推擠而非預期地移至第一機體110內,用以保持散熱組件150’持續展開,維持較佳的散熱效果。Furthermore, the
本發明不限制散熱鰭片組的形式,以下藉由圖式對此舉例說明。圖10A及圖10B繪示本發明另一實施例的電子裝置的作動流程。圖10A及圖10B所示實施例與前述實施例的不同處在於,在本實施例的電子裝置100B中,散熱鰭片組154’包括至少一彈性散熱體S(繪示為多個)。移動件152’滑設於第一機體110內,彈性散熱體S連接於第一機體110與移動件152’之間。當移動件152’如圖10A至圖10B所示往第一機體110外移動時,移動件152’如圖10B所示拉伸彈性散熱體S,使彈性散熱體S的延伸長度增加而至少部分地移至第一機體110外以提升散熱效率。在本實施例中,彈性散熱體S例如是形成為蜿蜒狀而可彈性拉伸的金屬材,然本發明不以此為限。本實施例的移動件152’的驅動方式可相同或相似於前述任一實施例。此外,散熱鰭片組154’可鄰近第一機體110內的散熱風扇F及熱管P。The present invention does not limit the form of the heat-dissipating fin group, which is illustrated by the following figures. 10A and 10B show the operation flow of the electronic device according to another embodiment of the present invention. The embodiment shown in FIGS. 10A and 10B is different from the previous embodiment in that, in the
綜上所述,本發明將散熱組件配置為可隨著電子裝置之第二機體的展開而部分地突伸至電子裝置之第一機體外。藉此,當電子裝置為展開狀態時,散熱組件因部分地突伸至第一機體外而可增加其散熱效率,故不需以增加散熱組件的體積之方式來提升其散熱能力。從而,可在兼顧散熱設計的同時節省電子裝置的內部配置空間。In summary, in the present invention, the heat dissipation component is configured to partially protrude into the first body of the electronic device as the second body of the electronic device is unfolded. Thereby, when the electronic device is in the unfolded state, the heat dissipation element can increase its heat dissipation efficiency because it partially protrudes outside the first body. Therefore, it is not necessary to increase the heat dissipation capacity of the heat dissipation element by increasing the volume of the heat dissipation element. Therefore, the internal configuration space of the electronic device can be saved while taking into account the heat dissipation design.
100、100A、100B:電子裝置
110:第一機體
110a:前端
110b:後端
110c:開槽
120:第二機體
130、130’:樞軸組件
132、134:轉軸
134a:齒輪
134b:樞軸蓋
140:連動結構
142:第一桿件
142a、G3:齒條
142b、144b1:凸柱
144:第二桿件
144a:第一連接端
144a1、150a1:滑槽
144b:第二連接端
144c:樞接部
150、150’:散熱組件
150a:延伸板
152、152’:移動件
154、154’:散熱鰭片組
160:彈性件
A:區域
F:散熱風扇
G1:第一齒輪
G2:第二齒輪
P:熱管
S:彈性散熱體100, 100A, 100B: electronic device
110:
圖1是本發明一實施例的電子裝置的立體圖。 圖2繪示圖1的電子裝置展開。 圖3是圖1的電子裝置的部分構件放大圖。 圖4是圖1的電子裝置的側視圖。 圖5是圖2的電子裝置的側視圖。 圖6繪示圖1的電子裝置於另一視角的局部結構。 圖7繪示圖2的電子裝置於另一視角的局部結構。 圖8是圖6的第二桿件及延伸板於另一視角的立體圖。 圖9A至圖9C繪示本發明另一實施例的電子裝置的作動流程。 圖10A及圖10B繪示本發明另一實施例的電子裝置的作動流程。FIG. 1 is a perspective view of an electronic device according to an embodiment of the invention. Fig. 2 shows the electronic device of Fig. 1 unfolded. FIG. 3 is an enlarged view of part of the components of the electronic device in FIG. 1. Fig. 4 is a side view of the electronic device of Fig. 1. Fig. 5 is a side view of the electronic device of Fig. 2. FIG. 6 shows a partial structure of the electronic device of FIG. 1 from another viewing angle. FIG. 7 shows a partial structure of the electronic device of FIG. 2 in another viewing angle. FIG. 8 is a perspective view of the second rod and extension plate of FIG. 6 from another perspective. 9A to 9C illustrate the operation flow of the electronic device according to another embodiment of the present invention. 10A and 10B show the operation flow of the electronic device according to another embodiment of the present invention.
100:電子裝置 100: electronic device
110:第一機體 110: First Body
110a:前端 110a: front end
110b:後端 110b: backend
110c:開槽 110c: Slotted
120:第二機體 120: Second Body
130:樞軸組件 130: pivot assembly
150:散熱組件 150: cooling components
Claims (10)
Applications Claiming Priority (2)
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US201962851078P | 2019-05-21 | 2019-05-21 | |
US62/851,078 | 2019-05-21 |
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TW202044976A TW202044976A (en) | 2020-12-01 |
TWI730776B true TWI730776B (en) | 2021-06-11 |
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TW109116830A TWI730776B (en) | 2019-05-21 | 2020-05-21 | Electronic device |
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CN115370656B (en) * | 2022-09-27 | 2024-02-20 | 高创(苏州)电子有限公司 | Open lifting motion structure and electronic equipment |
Citations (2)
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CN205193676U (en) * | 2015-11-24 | 2016-04-27 | 联想(北京)有限公司 | Electronic equipment |
TWM575549U (en) * | 2018-06-15 | 2019-03-11 | 宏碁股份有限公司 | Electronic device |
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CN205193676U (en) * | 2015-11-24 | 2016-04-27 | 联想(北京)有限公司 | Electronic equipment |
TWM575549U (en) * | 2018-06-15 | 2019-03-11 | 宏碁股份有限公司 | Electronic device |
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