TWI730776B - Electronic device - Google Patents

Abstract

An electronic device including a first body, a second body, a hinge assembly, a linking structure and a heat dissipation assembly is provided. The first body and the second body are pivoted to each other by the hinge assembly. The linking structure is disposed in the first body and connected to the hinge assembly. The heat dissipation assembly is disposed in the first body and connected to the linking structure. With the second body being expended from the first body, the hinge assembly drives the heat dissipation assembly to partially protrude out of the first body by the linking structure.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device including a heat dissipation component.

As the performance of the notebook computer continues to increase, its internal components generate a lot of heat when operating, so its heat dissipation capability needs to be improved accordingly. Increasing the volume of the heat dissipation component can effectively improve its heat dissipation capacity. However, under the trend of thin and light design of the notebook computer, the configuration space inside the body is limited and it is difficult to increase the volume of the heat dissipation component. Therefore, how to effectively improve the heat dissipation capacity of the notebook computer without increasing the size of the notebook computer is an important issue in the heat dissipation design of the notebook computer.

The present invention provides an electronic device, which can save the internal configuration space and improve the heat dissipation capacity.

The electronic device of the present invention includes a first body, a second body, a pivot assembly, a linkage structure, and a heat dissipation assembly. The first body and the second body are pivotally connected to each other by the pivot assembly. The linkage structure is arranged in the first body and connected to the pivot assembly. The heat dissipation component is arranged in the first body and connected to the linkage structure. As the second body is unfolded from the first body, the pivot assembly drives the heat dissipation component to partially protrude outside the first body through the linkage structure.

In an embodiment of the present invention, the above-mentioned first body has a front end and a rear end opposite to each other, the second body is pivotally connected to the rear end by a pivot assembly, and the first body has a slot at the rear end. The heat dissipation component is adapted to partially protrude to the outside of the first body through the slot.

In an embodiment of the present invention, the above-mentioned pivot assembly has a first gear, the linkage structure has a second gear, the heat dissipation assembly has a rack, and the second gear meshes with the first gear and meshes with the rack.

In an embodiment of the present invention, an elastic element is included, wherein the elastic element is connected between the heat dissipation element and the first body, and the heat dissipation element is adapted to be maintained to partially protrude to the first body by the elastic force of the elastic element Outside the state.

In an embodiment of the present invention, the above-mentioned pivot assembly has a gear, and the linkage structure includes a first rod and a second rod. The first rod has a rack, and the rack is meshed with the gear. The rod is movably connected between the first rod and the heat dissipation component.

In an embodiment of the present invention, the above-mentioned second rod has a first connecting end, a second connecting end, and a pivoting portion. The pivoting portion is located between the first connecting end and the second connecting end and is pivoted. Connected to the first body, the first connecting end and the second connecting end are respectively rotatably slidably disposed on the first rod and the heat dissipation component.

In an embodiment of the present invention, one of the above-mentioned first connecting end and the first rod has a sliding groove, and the other of the first connecting end and the first rod has a protruding post, and the protruding post The chute is rotatably slidably arranged.

In an embodiment of the present invention, one of the above-mentioned second connecting end and the heat dissipation element has a sliding groove, and the other of the second connection end and the heat dissipation element has a protruding post, and the protruding post is rotatably slidable Located in the chute.

In an embodiment of the present invention, the above-mentioned heat dissipation assembly includes a moving part and a heat dissipation fin group, the moving part is slidably arranged in the first body, and the heat dissipation fin group is arranged in the moving part and is suitable for following the moving part. Move to the body of the first machine.

In an embodiment of the present invention, the aforementioned heat dissipation fin set includes at least one elastic heat dissipation body, and the at least one elastic heat dissipation body is connected between the first body and the moving part.

In an embodiment of the present invention, when the moving part moves outside the first body, the moving part stretches at least one elastic heat sink.

Based on the above, the present invention configures the heat dissipating component to partially protrude into the first body of the electronic device as the second body of the electronic device is unfolded. Thereby, when the electronic device is in the unfolded state, the heat dissipation element can increase its heat dissipation efficiency because it partially protrudes outside the first body. Therefore, it is not necessary to increase the heat dissipation capacity of the heat dissipation element by increasing the volume of the heat dissipation element. Therefore, the internal configuration space of the electronic device can be saved while taking into account the heat dissipation design.

FIG. 1 is a perspective view of an electronic device according to an embodiment of the invention. Fig. 2 shows the electronic device of Fig. 1 unfolded. Please refer to FIGS. 1 and 2, the electronic device 100 of this embodiment is, for example, a notebook computer and includes a first body 110, a second body 120 and a pivot assembly 130. The first body 110 and the second body 120 are, for example, a host and a screen of a notebook computer, respectively, and are pivotally connected to each other by a pivot assembly 130. By the pivoting of the pivot assembly 130, the second body 120 can rotate relative to the first body 110 from the closed state shown in FIG. 1 to the unfolded state shown in FIG. 2.

FIG. 3 is an enlarged view of part of the components of the electronic device in FIG. 1, which corresponds to area A in FIG. 1. Please refer to FIG. 3, the pivot assembly 130 includes rotating shafts 132 and 134 which are respectively connected to the first body 110 (shown in FIGS. 1 and 2) and the second body 120 and are relatively pivotable. When the second body 120 is unfolded from the first body 110, the second body 120 and the rotating shaft 134 will pivot relative to the first body 110 and the rotating shaft 132. As shown in FIG. 3, the electronic device 100 of this embodiment further includes at least one linkage structure 140 and at least one heat dissipation component 150 (two are shown in FIG. 1 and FIG. 2 ). The linkage structure 140 is disposed in the first body 110 and connected to the rotating shaft 134 of the pivot assembly 130, and the heat dissipation assembly 150 is disposed in the first body 110 and connected to the linkage structure 140.

Fig. 4 is a side view of the electronic device of Fig. 1. Fig. 5 is a side view of the electronic device of Fig. 2. As the second body 120 expands from the state shown in FIGS. 1 and 4 relative to the first body 110 to the state shown in FIGS. 2 and 5, the rotating shaft 134 of the pivot assembly 150 rotates relative to the first body 110 and moves by linkage The structure 140 drives the heat dissipation component 150 to partially protrude out of the first body 110 as shown in FIGS. 2 and 5.

As described above, in this embodiment, the heat dissipation component 150 is configured to partially protrude out of the first body 110 of the electronic device 100 as the second body 120 of the electronic device 100 is unfolded. Thereby, when the electronic device 100 is in the unfolded state, the heat dissipation element 150 partially protrudes out of the first body 110 to increase its heat dissipation efficiency, so there is no need to increase the volume of the heat dissipation element 150 inside the electronic device 100 To improve its heat dissipation capacity. Therefore, the internal configuration space of the electronic device 100 can be saved while taking into account the heat dissipation design.

3, the heat dissipation assembly 150 of this embodiment includes a moving part 152 and a heat dissipation fin group 154. The moving part 152 is slidably disposed in the first body 110, and the heat dissipation fin group 154 is disposed in the moving part 152 and is suitable for Then, the moving part 152 moves out of the first body 110. The heat dissipation fin group 154 moved outside the first body 110 can more efficiently exchange heat with the outside air, thereby enhancing the heat dissipation effect.

In this embodiment, the first body 110 has a front end 110 a and a rear end 110 b opposite to each other, and the second body 120 is pivotally connected to the rear end 110 b of the first body 110 by the pivot assembly 130. The first body 110 has a slot 110c (marked in FIGS. 1 and 2) at its rear end 110b, and the heat dissipation component 150 is adapted to partially protrude out of the first body 110 through the slot 110c. In other embodiments, the heat dissipation component 150 may protrude from other positions of the first body 110, which is not limited in the present invention.

Please refer to FIG. 3, in this embodiment, the pivot assembly 130 has a gear 134a, and the gear 134a is fixed to the rotating shaft 134 by, for example, a pivot cover 134b. That is, the rotating shaft 134, the gear 134a, and the pivot cover 134b are fixed to each other so as to be suitable for synchronous rotation. FIG. 6 shows a partial structure of the electronic device of FIG. 1 from another viewing angle. FIG. 7 shows a partial structure of the electronic device of FIG. 2 in another viewing angle. 3, 6 and 7, the linkage structure 140 includes a first rod 142 and a second rod 144, the first rod 142 has a rack 142a, the rack 142a is engaged with the gear 134a, the second The rod 144 is movably connected between the first rod 142 and the heat dissipation assembly 150. When the second body 120 is deployed relative to the first body 110, with the rotation of the shaft 134, the gear 134a drives the first rod 142, the second rod 144, and the heat dissipation assembly 150 through the rack 142a as shown in FIG. The shown state is moved to the state shown in FIG. 7, so that the heat dissipation assembly 150 protrudes from the first body 110.

In detail, the second rod 144 of this embodiment has a first connecting end 144a, a second connecting end 144b, and a pivoting portion 144c. The pivot portion 144c is located between the first connection end 144a and the second connection end 144b and is pivotally connected to the first body 110. The first connection end 144a is rotatably slidably disposed on the first rod 142, and the second connection end 144b can An extension plate 150a of the heat dissipation assembly 150 is rotatably slidably disposed. The heat dissipation element 150 is slidably disposed on the first body 110 by the extension plate 150a, for example. FIG. 8 is a perspective view of the second rod and extension plate of FIG. 6 from another perspective. More specifically, the first connecting end 144a of the second rod 144 of this embodiment has a sliding groove 144a1 as shown in FIG. 3 and FIG. 8, and the first rod 142 has a protrusion 142b as shown in FIG. The protrusion 142b is rotatably slidably disposed in the sliding groove 144a1. Similarly, the second connecting end 144b of the second rod 144 of the present embodiment has a protruding post 144b1 as shown in FIG. 8, and the extension plate 150a of the heat dissipation assembly 150 has a sliding groove 150a1 and a protruding post 144b1 as shown in FIG. The sliding groove 150a1 is rotatably slidable. In other embodiments, the linkage structure 140 may be in other suitable forms, and the present invention does not limit this. The following illustrates this with a diagram.

9A to 9C illustrate the operation flow of the electronic device according to another embodiment of the present invention. The embodiment shown in FIGS. 9A to 9C is different from the previous embodiment in that, in the electronic device 100A of this embodiment, the pivot assembly 130' has a first gear G1, and the linkage structure 140' has a second gear G2 The heat dissipation assembly 150' has a rack G3, and the second gear G2 meshes with the first gear G1 and meshes with the rack G3. When the second body 120 is deployed relative to the first body 110, the first gear G1 rotates with the pivot assembly 130' and drives the heat dissipation assembly 150' to move from the position shown in FIG. 9A by the second gear G2 and the rack G3. To the position shown in FIG. 9B, the heat dissipation component 150 ′ partially protrudes out of the first body 110. In addition, by appropriately setting the length of the rack G3 and its relative position with the second gear G2, the second gear G2 can no longer drive the rack after the second body 120 is expanded to the state shown in FIG. 9B G3, so that when the second body 120 continues to expand from the state shown in FIG. 9B to the state shown in FIG. 9C, the position of the heat dissipation assembly 150' does not change.

Furthermore, the electronic device 100A of this embodiment further includes an elastic member 160, which is connected between the heat dissipating member 150' and the first body 110, and the heat dissipating member 150' is adapted to be formed by the elastic force of the elastic member 160. It maintains the state shown in FIG. 9B partially protruding to the outside of the first body 110. In this way, it is possible to prevent the heat dissipating component 150' from being moved into the first body 110 unexpectedly due to impact or pushing, so as to keep the heat dissipating component 150' continuously expanded and maintain a better heat dissipation effect.

The present invention does not limit the form of the heat-dissipating fin group, which is illustrated by the following figures. 10A and 10B show the operation flow of the electronic device according to another embodiment of the present invention. The embodiment shown in FIGS. 10A and 10B is different from the previous embodiment in that, in the electronic device 100B of this embodiment, the heat dissipation fin set 154' includes at least one elastic heat dissipation body S (multiple are shown). The moving part 152' is slidably disposed in the first body 110, and the elastic heat sink S is connected between the first body 110 and the moving part 152'. When the moving part 152' moves out of the first body 110 as shown in FIG. 10A to FIG. 10B, the moving part 152' stretches the elastic heat sink S as shown in FIG. 10B, so that the extension length of the elastic heat sink S is increased and at least partially The ground is moved outside the first body 110 to improve heat dissipation efficiency. In this embodiment, the elastic heat sink S is, for example, a metal material that is formed in a serpentine shape and can be elastically stretched, but the present invention is not limited thereto. The driving mode of the moving element 152' in this embodiment may be the same or similar to any of the foregoing embodiments. In addition, the heat dissipation fin group 154' may be adjacent to the heat dissipation fan F and the heat pipe P in the first body 110.

In summary, in the present invention, the heat dissipation component is configured to partially protrude into the first body of the electronic device as the second body of the electronic device is unfolded. Thereby, when the electronic device is in the unfolded state, the heat dissipation element can increase its heat dissipation efficiency because it partially protrudes outside the first body. Therefore, it is not necessary to increase the heat dissipation capacity of the heat dissipation element by increasing the volume of the heat dissipation element. Therefore, the internal configuration space of the electronic device can be saved while taking into account the heat dissipation design.

100, 100A, 100B: electronic device 110: First Body 110a: front end 110b: backend 110c: Slotted 120: Second Body 130, 130’: pivot assembly 132, 134: shaft 134a: Gear 134b: pivot cover 140: Linkage structure 142: The first member 142a, G3: rack 142b, 144b1: convex post 144: second member 144a: the first connection end 144a1, 150a1: Chute 144b: second connection end 144c: pivot 150, 150’: Cooling components 150a: Extension board 152, 152’: Moving parts 154, 154’: cooling fin set 160: Elastic A: area F: cooling fan G1: The first gear G2: second gear P: Heat pipe S: Elastic heat sink

FIG. 1 is a perspective view of an electronic device according to an embodiment of the invention. Fig. 2 shows the electronic device of Fig. 1 unfolded. FIG. 3 is an enlarged view of part of the components of the electronic device in FIG. 1. Fig. 4 is a side view of the electronic device of Fig. 1. Fig. 5 is a side view of the electronic device of Fig. 2. FIG. 6 shows a partial structure of the electronic device of FIG. 1 from another viewing angle. FIG. 7 shows a partial structure of the electronic device of FIG. 2 in another viewing angle. FIG. 8 is a perspective view of the second rod and extension plate of FIG. 6 from another perspective. 9A to 9C illustrate the operation flow of the electronic device according to another embodiment of the present invention. 10A and 10B show the operation flow of the electronic device according to another embodiment of the present invention.

100: electronic device

110: First Body

110a: front end

110b: backend

110c: Slotted

120: Second Body

130: pivot assembly

150: cooling components

Claims (10)

An electronic device, comprising: a first body; a second body; a pivot assembly, the first body and the second body are pivotally connected to each other by the pivot assembly; a linkage structure is arranged on the first body Inside the body and connected to the pivot component; and a heat dissipation component disposed in the first body and connected to the linkage structure, wherein as the second body is unfolded from the first body, the pivot component passes through the The linkage structure drives the heat dissipating assembly to partially protrude outside the first body, wherein the heat dissipating assembly includes a moving part and a heat dissipating fin group, the moving part is slidably disposed in the first body, and the heat dissipating fin group is configured It is in the moving part and is suitable for moving outside the first machine body along with the moving part. The electronic device according to claim 1, wherein the first body has a front end and a rear end opposite to each other, the second body is pivotally connected to the rear end by the pivot assembly, and the first body is at the rear The end is provided with a slot, and the heat dissipation component is adapted to partially protrude to the body of the first body through the slot. The electronic device according to claim 1, wherein the pivot assembly has a first gear, the linkage structure has a second gear, the heat dissipation assembly has a rack, and the second gear meshes with the first gear and meshes with In the rack. The electronic device according to claim 1, comprising an elastic element, wherein the elastic element is connected between the heat dissipation element and the first body, and the heat dissipation element is adapted to be partially maintained by the elastic force of the elastic element The state protruding to the outside of the first body. The electronic device according to claim 1, wherein the pivot assembly has a gear, the linkage structure includes a first rod and a second rod, the first rod has a rack, and the rack is engaged with The gear and the second rod are movably connected between the first rod and the heat dissipation assembly. The electronic device according to claim 5, wherein the second rod has a first connection end, a second connection end, and a pivot part, and the pivot part is located at the first connection end and the second connection end Between and pivotally connected to the first body, the first connecting end and the second connecting end are respectively rotatably slidably disposed on the first rod and the heat dissipation assembly. The electronic device according to claim 6, wherein one of the first connecting end and the first rod has a sliding groove, and the other of the first connecting end and the first rod has a convex The protruding column is rotatably slidably arranged in the sliding groove. The electronic device according to claim 6, wherein one of the second connection end and the heat dissipation component has a sliding groove, and the other of the second connection end and the heat dissipation component has a protrusion, and the protrusion The chute is rotatably slidably arranged. The electronic device according to claim 1, wherein the heat dissipation fin set includes at least one elastic heat dissipation body, and the at least one elastic heat dissipation body is connected between the first body and the moving part. The electronic device according to claim 9, wherein when the moving part moves outside the first body, the moving part stretches the at least one elastic heat sink.

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