TWI724721B - Electronic component testing device and probe - Google Patents

Abstract

The invention discloses an electronic component testing device and a probe. The electronic component testing device comprises a carrier substrate and a probe. The carrier substrate carries an electronic component. The probe comprises a contact portion and a normally closed switch. The contact portion, electrically connected with a measurement circuit, is configured to contact the electronic component. The normally closed switch, electrically connected with the measurement circuit, is controlled by a control signal. The normally closed switch provides a bypass current path to conduct the measurement circuit and a bypass end while not receiving the control signal. The normally closed switch does not provide the bypass current path while receiving the control signal.

Description

Electronic component testing device and probe

The present invention relates to a testing device and probe, in particular to a testing device and probe with electrostatic discharge protection function.

Generally speaking, because the product has a relatively complete protection mechanism for electrostatic discharge, the electronic components in the product are less susceptible to damage by electrostatic discharge. However, electronic components are often unable to withstand the attack of electrostatic discharge before they are installed in the product. For example, electronic components undergo a series of tests before they leave the factory to ensure the quality of the electronic components. However, electrostatic discharge encountered during the test, such as when installing electronic components or contacting electronic components with probes, is likely to cause damage to the electronic components due to the lack of protection mechanisms at this time.

In addition, since the attack position of electrostatic discharge is difficult to predict, if the attack position of electrostatic discharge is very close to the electronic component, even if the machine for testing the electronic component has the function of electrostatic discharge protection, it may not be able to reliably protect the electronic component. Accordingly, the industry needs a new electrostatic discharge protection countermeasure to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.

The present invention provides an electronic component testing device. When a probe in the electronic component testing device contacts an electronic component, the probe first provides a bypass current path with lower impedance to reduce the damage of the electronic component by electrostatic discharge during testing. The possibility.

The present invention provides an electronic component testing device. The electronic component testing device includes a carrier board and a probe. The carrier board is used to carry electronic components. The probe includes a contact portion and a normally closed switch. The contact part is electrically connected to the measurement module and used for contacting electronic components. The normally closed switch is electrically connected to the measurement module and controlled by a control signal. When the normally closed switch does not receive the control signal, the normally closed switch provides a bypass current path, and the bypass current path is used to conduct the measurement module to the bypass terminal. When the normally closed switch receives the control signal, the normally closed switch does not provide the bypass current path.

In some embodiments, after the bypass terminal is electrically connected to the ground terminal, the contact portion can contact the electronic component, and the carrier board can also be electrically connected to the ground terminal. Here, the normally closed switch can be a depleted field effect transistor or a normally closed relay. In addition, the electronic component testing device may further include a box body and a detector. The carrier board is detachably arranged in the box body. The detector is used to detect the use state of the box body and generate a box state signal accordingly. In addition, the electronic component testing device may also include a processing unit. The processing unit determines whether the box state signal is normal. When the box state signal is normal, the processing unit provides a control signal. The box body can be made of metal to provide the function of electrostatic shielding or magnetic field shielding.

The present invention provides a probe. When the probe contacts an electronic component, the probe first provides a bypass current path with lower impedance to reduce the possibility of the electronic component being damaged by electrostatic discharge during testing.

The present invention provides a probe including a first current path, a second current path, and a normally closed switch. The first current path is electrically connected between the signal terminal and the contact part, and the contact part is used to electrically connect the electronic element. The second current path is electrically connected between the signal terminal and the bypass terminal, and the impedance in the second current path is smaller than the impedance in the first current path. The normally closed switch is arranged in the second current path and controlled by the control signal. When the normally closed switch does not receive the control signal, the first current path and the second current path are simultaneously conducted. When the normally closed switch receives the control signal, only the first current path is turned on.

In some embodiments, the normally closed switch may be a depleted field effect transistor or a normally closed relay. In addition, the bypass end can be adjacent to the contact portion, and the bypass end can be used to electrically connect to the ground end.

In summary, the electronic component testing device and probe provided by the present invention can prevent electrostatic current from being generated at the moment when the probe contacts the electronic component. In addition, since the probe is preset to provide a bypass current path with a lower impedance, even if electrostatic current is generated, it can be guided away via the bypass current path, so as to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.

The features, objectives and functions of the present invention will be further disclosed below. However, the following are only examples of the present invention, and should not be used to limit the scope of the present invention, that is, all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention will still be the essence of the present invention. Without departing from the spirit and scope of the present invention, it should be regarded as a further implementation aspect of the present invention.

Please refer to FIGS. 1 and 2 together. FIG. 1 is a schematic structural diagram of an electronic component testing device according to an embodiment of the present invention, and FIG. 2 is a schematic circuit diagram of an electronic component testing device according to an embodiment of the present invention. As shown in the figure, the electronic component testing device 1 includes a carrier board 10, a probe 12, a measurement module 14 and a processing unit 16. The carrier board 10 can be used to carry electronic components DUT, and the probe 12 can be used to contact electronic components. The DUT transmits the signal of the electronic component DUT to the measurement module 14 so that the measurement module 14 can measure various electrical parameters such as voltage, current, or impedance inside the electronic component DUT. In an example, the electronic component DUT may be a laser diode, of course, this embodiment is not limited, the electronic component DUT may also be a chip with other functions or an optoelectronic component. The components of the electronic component testing device 1 will be described below.

The carrier board 10 may have slots corresponding to the electronic component DUT for accommodating one or more electronic component DUTs. Here, FIG. 1 takes the carrier board 10 provided with an electronic component DUT as an example. In addition, the carrier board 10 may have a ground terminal 100, and the ground terminal 100 may be electrically connected to a piece of metal plate body. Those with ordinary knowledge in the relevant technical field should understand that the metal plate body can be regarded as a ground potential. In other words, when the carrier board 10 is provided with the electronic component DUT, there may be no potential difference between the carrier board 10 and the electronic component DUT, and the carrier board 10 and the electronic component DUT may both have a ground potential. In addition, the electronic component testing device 1 may also have a box body (not shown), and the carrier board 10 is detachably arranged in the box body. The box body may be made of metal to shield static electricity or magnetic field. The metal plate body to which the aforementioned ground terminal 100 is electrically connected may be a part of the box body or electrically connected to the box body, which is not limited in this embodiment.

In an example, the electronic component testing device 1 may also include a plurality of boxes, and each box may be like a drawer, and can be plugged into the electronic component testing device 1. Here, in addition to the carrier board 10 of the electronic component testing device 1 can be set in the box, the probe 12 can also be set in the box, or a part of the probe 12 extends into the box, which is not limited in this embodiment. Since the box body can block external interference as much as possible, the probe 12 can have a higher accuracy when measuring the electrical parameters of the electronic component DUT in the box body. In addition, FIG. 1 also shows the measurement module 14. The measurement module 14 can be installed in the box or outside the box, and this embodiment is not limited. In practice, the measurement module 14 is used to receive and read the results measured by the probe 12. This embodiment does not limit the type of the measurement module 14. For example, the measurement module 14 may be composed of some The signal processing circuit is combined.

Taking the example of FIG. 1 as an example, the probe 12 may have a contact portion 120, a signal terminal 122 and a bypass terminal 124 in structure. The contact portion 120 is used to contact the electronic component DUT and read out signals from the pads on the electronic component DUT. In addition, the signal terminal 122 is used to electrically connect to the measurement module 14, and the bypass terminal 124 is used to electrically connect to the ground terminal 100. The signal terminal 122 and the contact portion 120 may be electrically connected together, and the signal terminal 122 and the bypass terminal 124 may be electrically connected together, and the electronic component testing device 1 may define a first current path C1 and Bypass the current path (second current path C2). The first current path C1 may be a current path from the measurement module 14, the signal terminal 122 of the probe 12, the contact portion 120 of the probe 12, and the electronic component DUT to the ground potential. In addition, the second current path C2 may be a current path from the measurement module 14, the signal terminal 122 of the probe 12, and the bypass terminal 124 of the probe 12 to the ground potential. Although FIG. 1 illustrates that the bypass terminal 124 of the probe 12 is electrically connected to the ground potential through the ground terminal 100, the probe 12 may also be electrically connected to the ground potential through other methods, which is not limited in this embodiment. In practice, the second current path C2 also includes a normally closed switch 126. The normally closed switch 126 can be controlled by a control signal generated by the processing unit 16 to determine whether the second current path C2 is turned on.

In one example, the normally closed switch 126 is different from the general switch in that the normally closed switch 126 is only stable in the closed state but not in the open state. For example, the normally closed switch 126 may be a depletion type (depletion type). ) Field effect transistor or a normally closed relay. In other words, when the normally closed switch 126 is not triggered by the control signal, the normally closed switch 126 will remain in the closed state and keep the second current path C2 conducting. When the normally closed switch 126 is triggered by the control signal, the normally closed switch 126 will switch to the open state and cut off the second current path C2. When the control signal ends, the normally closed switch 126 will switch back to the closed state and conduct the second current path C2. It is worth mentioning that, because the normally closed switch 126 is selected in this embodiment, it is not necessary to energize the normally closed switch 126 and also keep the second current path C2 conducting. Therefore, the electronic component testing device 1 of this embodiment does not matter whether there is The electronic component DUT can be protected even when the power is turned on.

Since the impedance of the normally closed switch 126 is extremely small, when the normally closed switch 126 is in the closed state and the second current path C2 is turned on, it can be seen that the probe 12 is short-circuited to the ground via the second current path C2. In addition, since the first current path C1 passes through the electronic component DUT with a relatively large impedance, the impedance in the second current path C2 is much smaller than the impedance in the first current path C1. Those with ordinary knowledge in the technical field should understand that as long as the second current path C2 is conductive, no matter whether the first current path C1 is conductive or not, all currents or signals will go through the second current path C2 instead of the electronic component DUT. Where is the first current path C1. In other words, when the normally closed switch 126 is in the closed state and the second current path C2 is turned on, all currents (including electrostatic currents) or signals will bypass the electronic component DUT. When the normally closed switch 126 is in the open state and cuts off the second current path C2, since only the first current path C1 is left, all currents or signals will pass through the electronic component DUT at this time.

Taking a practical example, when the box body has not been placed in the appropriate position in the electronic component testing device 1, it is possible that static current may be generated during handling or contact between equipment, or the moment the probe 12 just touches the electronic component DUT , There may also be electrostatic currents. It can be seen from FIG. 2 that in this embodiment, in the preset state, both the first current path C1 and the second current path C2 are conductive. In practice, before the probe 12 contacts the electronic component DUT, the bypass terminal 124 in the second current path C2 is electrically connected to the ground terminal 100 first, and is electrically connected to the ground potential through the ground terminal 100. In other words, if an electrostatic current is generated when the probe 12 is in contact with the electronic component DUT, because the second current path C2 is short-circuited to the ground potential, the electrostatic current will be guided to the ground by the second current path C2, and the electrostatic current can be avoided Flow through the electronic component DUT. However, since it is difficult to determine when or where the electrostatic current is generated, the electronic component testing device 1 can do some inspections and judgments, for example, it will cut off only when the box is actually installed and the electronic component DUT is judged to be ready for measurement. The second current path C2. That is, before the processing unit 16 generates the control signal, all currents or signals will bypass the electronic component DUT by the second current path C2. In practice, the electronic component testing device 1 can use one or more detectors (not shown) to detect the use state of the box, so that the processing unit 16 can determine whether to generate the control signal based on the use state of the box. .

In one example, the box body may have a slide rail, and the electronic component testing device 1 may be provided with a detector to detect whether the box body has been pushed into the correct position by the slide rail. For example, when the box body is assembled on the slide rail and pushed into the electronic component testing device 1, the detector can generate a corresponding box body state signal and indicate that the box body has been pushed to the bottom. Alternatively, the electronic component testing device 1 may be provided with a door stop of the box body. After the box body has been pushed into the correct position by the sliding rail, the door stop can fix the box body. Of course, the door stop has a corresponding detector, which can generate a corresponding box state signal and indicate that the box has been pushed to the bottom. Here, the present embodiment does not limit the number of the above-mentioned two types of detectors, nor does it limit whether to provide two types of detectors or choose one of them. It can be designed freely in the technical field. In addition, when the box body is placed in the correct position, the electronic component testing device 1 can lock the position of the box body so that the box body cannot be drawn out before the measurement is completed. In one example, the instruction of the electronic component testing device 1 to lock the position of the box body, the electronic component testing device 1 waiting for a preset period of time, or the electronic component testing device 1 reaching the preset temperature, etc., may also be regarded as a box state. The signal is not limited in this embodiment.

Continuing the above, the processing unit 16 can receive the box state signal generated by the detector, and determine whether one or more of the above-mentioned box state signals are normal. When the processing unit 16 determines that the one or more box state signals are normal, it can be inferred that the box is indeed installed and the system is in a relatively stable state. Because the box itself has the function of shielding static electricity or magnetic fields, after the electronic component DUT is in the box and the box is installed, it means that the probability of the electronic component DUT suddenly being attacked by electrostatic current is very low. At this time, the processing unit 16 can then set the normally closed switch 126 to the open state, and then start the measurement of the electronic component DUT. In this way, the electronic component testing device 1 can provide a complete protection against electrostatic discharge or surge in the electronic component DUT.

In summary, the electronic component testing device and probe provided by the present invention can provide a bypass current path with a lower impedance in advance when measuring electronic components, so that the electrostatic current can be guided away through the bypass current path instead of Electrostatic current can attack electronic components. Moreover, the electronic component testing device provided by the present invention can check whether the system is in a stable state, and the bypass current path is cut only when the system is stable, so as to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.

1: Electronic component testing device 10: Carrier board 100: Ground terminal 12: Probe 120: contact part 122: signal end 124: Bypass end 126: Normally closed switch 14: Measurement module 16: processing unit C1, C2: current path DUT: electronic components

FIG. 1 is a schematic diagram showing the structure of an electronic component testing device according to an embodiment of the present invention.

FIG. 2 is a schematic circuit diagram of an electronic component testing device according to an embodiment of the present invention.

no

1: Electronic component testing device

10: Carrier board

100: Ground terminal

12: Probe

120: contact part

122: signal end

124: Bypass end

14: Measurement module

16: processing unit

DUT: electronic components

Claims (8)

An electronic component testing device, comprising: a box body; a detector for detecting the use state of the box body to generate a box body state signal accordingly; a carrier board detachably arranged in the box body , Used to carry an electronic component; a probe, including: a contact part, electrically connected to a measurement module, and used to contact the electronic component; and a normally closed switch, electrically connected to the measurement module, And controlled by a control signal; and a processing unit, which determines whether the box state signal is normal, and when the box state signal is normal, the processing unit provides the control signal; wherein when the normally closed switch does not receive the When the control signal, the normally closed switch provides a bypass current path, the bypass current path is used to conduct the measurement module to a bypass terminal; wherein when the normally closed switch receives the control signal, the normally closed switch Closed switches do not provide this bypass current path. The electronic component testing device according to claim 1, wherein after the bypass terminal is electrically connected to a ground terminal, the contact portion contacts the electronic component. The electronic component testing device according to claim 2, wherein the carrier board is electrically connected to the ground terminal. The electronic component testing device according to claim 1, wherein the normally closed switch is a depleted field effect transistor or a normally closed relay. The electronic component testing device according to claim 1, wherein the box system is made of metal to shield static electricity or magnetic fields. A probe for measuring an electronic component, the electronic component is carried on a carrier board, the carrier board is detachably arranged in a box body, a detector detects the use state of the box body, and generates A box state signal. A processing unit determines whether the box state signal is normal. When the box state signal is normal, the processing unit provides a control signal. The probe includes: a first current path, which is electrically connected Between a signal terminal and a contact part, the contact part is used to electrically connect an electronic component; a second current path is electrically connected between the signal terminal and a bypass terminal, and the second current path is The impedance is smaller than the impedance in the first current path; and a normally closed switch is arranged in the second current path and controlled by the control signal; wherein when the normally closed switch does not receive the control signal, The first current path and the second current path are conducted simultaneously; wherein when the normally closed switch receives the control signal, only the first current path is conducted. The probe according to claim 6, wherein the normally closed switch is a depleted field effect transistor or a normally closed relay. The probe according to claim 6, wherein the bypass end is adjacent to the contact portion, and the bypass end is used to electrically connect to a ground end.

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