TWI724721B - Electronic component testing device and probe - Google Patents
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本發明係關於一種測試裝置與探針,特別是關於一種具靜電放電保護功能的測試裝置與探針。The present invention relates to a testing device and probe, in particular to a testing device and probe with electrostatic discharge protection function.
一般來說,由於產品對於靜電放電的保護機制較為完善,使得電子元件在產品之中較不容易受到靜電放電的破壞。然而,電子元件在安裝到產品之前,往往無法抵抗靜電放電的攻擊。舉例來說,電子元件出廠前會進行一連串的測試,以確保電子元件的品質。但是,測試的過程中遇到靜電放電,例如在安裝電子元件或用探針接觸電子元件時,則很有可能因為此時缺少保護機制而導致電子元件的損壞。Generally speaking, because the product has a relatively complete protection mechanism for electrostatic discharge, the electronic components in the product are less susceptible to damage by electrostatic discharge. However, electronic components are often unable to withstand the attack of electrostatic discharge before they are installed in the product. For example, electronic components undergo a series of tests before they leave the factory to ensure the quality of the electronic components. However, electrostatic discharge encountered during the test, such as when installing electronic components or contacting electronic components with probes, is likely to cause damage to the electronic components due to the lack of protection mechanisms at this time.
此外,由於靜電放電的攻擊位置難以預測,如果靜電放電的攻擊位置很靠近電子元件,縱使測試電子元件的機台本身具有靜電放電防護的功能,很可能也無法確實保護到電子元件。據此,業界需要一種新的靜電放電保護的對策,以減少電子元件於測試時被靜電放電破壞的可能性。In addition, since the attack position of electrostatic discharge is difficult to predict, if the attack position of electrostatic discharge is very close to the electronic component, even if the machine for testing the electronic component has the function of electrostatic discharge protection, it may not be able to reliably protect the electronic component. Accordingly, the industry needs a new electrostatic discharge protection countermeasure to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.
本發明提供一種電子元件測試裝置,所述電子元件測試裝置中的探針接觸到電子元件時,探針會先提供阻抗較低的旁路電流路徑,以減少電子元件於測試時被靜電放電破壞的可能性。The present invention provides an electronic component testing device. When a probe in the electronic component testing device contacts an electronic component, the probe first provides a bypass current path with lower impedance to reduce the damage of the electronic component by electrostatic discharge during testing. The possibility.
本發明提出一種電子元件測試裝置,所述電子元件測試裝置包含載板以及探針。所述載板用以承載電子元件。所述探針包含接觸部以及常閉型開關。接觸部電性連接量測模組,並用以接觸電子元件。常閉型開關電性連接量測模組,並受控於控制信號。當常閉型開關未收到控制信號時,常閉型開關提供旁路電流路徑,旁路電流路徑用以將量測模組導通至旁路端。當常閉型開關收到控制信號時,常閉型開關不提供該旁路電流路徑。The present invention provides an electronic component testing device. The electronic component testing device includes a carrier board and a probe. The carrier board is used to carry electronic components. The probe includes a contact portion and a normally closed switch. The contact part is electrically connected to the measurement module and used for contacting electronic components. The normally closed switch is electrically connected to the measurement module and controlled by a control signal. When the normally closed switch does not receive the control signal, the normally closed switch provides a bypass current path, and the bypass current path is used to conduct the measurement module to the bypass terminal. When the normally closed switch receives the control signal, the normally closed switch does not provide the bypass current path.
於一些實施例中,於旁路端電性連接接地端後,接觸部可以接觸電子元件,且載板也可以電性連接接地端。在此,常閉型開關可以為空乏型場效電晶體或常閉型繼電器。此外,電子元件測試裝置可以更包含盒體與偵測器,載板可拆卸地設置於盒體中,偵測器用以偵測盒體的使用狀態,據以產生盒體狀態信號。另外,電子元件測試裝置也可以包含處理單元,處理單元判斷盒體狀態信號是否正常,當盒體狀態信號正常,則處理單元提供控制信號。所述盒體可以由金屬製成,用以提供靜電屏蔽或磁場屏蔽的功能。In some embodiments, after the bypass terminal is electrically connected to the ground terminal, the contact portion can contact the electronic component, and the carrier board can also be electrically connected to the ground terminal. Here, the normally closed switch can be a depleted field effect transistor or a normally closed relay. In addition, the electronic component testing device may further include a box body and a detector. The carrier board is detachably arranged in the box body. The detector is used to detect the use state of the box body and generate a box state signal accordingly. In addition, the electronic component testing device may also include a processing unit. The processing unit determines whether the box state signal is normal. When the box state signal is normal, the processing unit provides a control signal. The box body can be made of metal to provide the function of electrostatic shielding or magnetic field shielding.
本發明提供一種探針,在接觸到電子元件時,探針會先提供阻抗較低的旁路電流路徑,以減少電子元件於測試時被靜電放電破壞的可能性。The present invention provides a probe. When the probe contacts an electronic component, the probe first provides a bypass current path with lower impedance to reduce the possibility of the electronic component being damaged by electrostatic discharge during testing.
本發明提出一種探針,包含第一電流路徑、第二電流路徑以及常閉型開關。第一電流路徑電性連接於信號端和接觸部之間,接觸部用以電性連接電子元件。第二電流路徑電性連接於信號端和旁路端之間,第二電流路徑中的阻抗小於第一電流路徑中的阻抗。常閉型開關設置於第二電流路徑中,並受控於控制信號。當常閉型開關未收到控制信號時,第一電流路徑與第二電流路徑同時導通。當常閉型開關收到控制信號時,僅第一電流路徑導通。The present invention provides a probe including a first current path, a second current path, and a normally closed switch. The first current path is electrically connected between the signal terminal and the contact part, and the contact part is used to electrically connect the electronic element. The second current path is electrically connected between the signal terminal and the bypass terminal, and the impedance in the second current path is smaller than the impedance in the first current path. The normally closed switch is arranged in the second current path and controlled by the control signal. When the normally closed switch does not receive the control signal, the first current path and the second current path are simultaneously conducted. When the normally closed switch receives the control signal, only the first current path is turned on.
於一些實施例中,常閉型開關可以為空乏型場效電晶體或常閉型繼電器。此外,旁路端可以相鄰接觸部,且旁路端可以用來電性連接接地端。In some embodiments, the normally closed switch may be a depleted field effect transistor or a normally closed relay. In addition, the bypass end can be adjacent to the contact portion, and the bypass end can be used to electrically connect to the ground end.
綜上所述,本發明提供的電子元件測試裝置以及探針,可以避免探針接觸到電子元件的瞬間產生靜電電流。此外,由於探針被預設提供阻抗較低的旁路電流路徑,縱使產生靜電電流也可以經由旁路電流路徑導引掉,以減少電子元件於測試時被靜電放電破壞的可能性。In summary, the electronic component testing device and probe provided by the present invention can prevent electrostatic current from being generated at the moment when the probe contacts the electronic component. In addition, since the probe is preset to provide a bypass current path with a lower impedance, even if electrostatic current is generated, it can be guided away via the bypass current path, so as to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.
下文將進一步揭露本發明之特徵、目的及功能。然而,以下所述者,僅為本發明之實施例,當不能以之限制本發明之範圍,即但凡依本發明申請專利範圍所作之均等變化及修飾,仍將不失為本發明之要意所在,亦不脫離本發明之精神和範圍,故應將視為本發明的進一步實施態樣。The features, objectives and functions of the present invention will be further disclosed below. However, the following are only examples of the present invention, and should not be used to limit the scope of the present invention, that is, all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention will still be the essence of the present invention. Without departing from the spirit and scope of the present invention, it should be regarded as a further implementation aspect of the present invention.
請一併參閱圖1與圖2,圖1係繪示依據本發明一實施例之電子元件測試裝置的結構示意圖,圖2係繪示依據本發明一實施例之電子元件測試裝置的電路示意圖。如圖所示,電子元件測試裝置1包含了載板10、探針12、量測模組14以及處理單元16,載板10可以用來承載電子元件DUT,探針12可以用來接觸電子元件DUT並將電子元件DUT的信號傳輸給量測模組14,使得量測模組14可以量測電子元件DUT內部的電壓、電流或者阻抗等各種電性參數。於一個例子中,電子元件DUT可以是一種雷射二極體,當然本實施例不加以限制,電子元件DUT也有可能是具其他功能的晶片或者是光電元件。以下分別說明電子元件測試裝置1的各部元件。Please refer to FIGS. 1 and 2 together. FIG. 1 is a schematic structural diagram of an electronic component testing device according to an embodiment of the present invention, and FIG. 2 is a schematic circuit diagram of an electronic component testing device according to an embodiment of the present invention. As shown in the figure, the electronic
載板10上可以有對應電子元件DUT的槽位,用以容置一個或多個電子元件DUT,在此圖1係以載板10設置一個電子元件DUT為例子。此外,載板10可以有接地端100,所述接地端100可以電性連接到一片金屬板體。於所屬技術領域具有通常知識者應可以明白,金屬板體可以被視為接地電位。也就是說,載板10設置有電子元件DUT時,載板10和電子元件DUT之間可以是沒有電位差的,且載板10和電子元件DUT可以都是接地電位。另外,電子元件測試裝置1還可以有一個盒體(圖未示),而載板10可拆卸地設置於所述盒體中,所述盒體可以係由金屬製成,用以屏蔽靜電或磁場。前述接地端100電性連接到的金屬板體可以是所述盒體的一部份或電性連接到盒體,本實施例不加以限制。The
於一個例子中,電子元件測試裝置1也可以包含多個盒體,而每個盒體可以像抽屜一般,可插拔地組合於電子元件測試裝置1中。在此,除了電子元件測試裝置1的載板10可以設置在盒體中,探針12也可以設置於盒體中,或者一部分的探針12延伸進盒體中,本實施例不加以限制。由於盒體能夠儘可能地阻斷外界的干擾,探針12在盒體內量測電子元件DUT的電性參數時,能夠有較高的準確度。此外,圖1還繪示了量測模組14,量測模組14可以設置於盒體中或者盒體外,本實施例不加以限制。實務上,量測模組14是用來接收並讀出探針12量測到的結果,本實施例也不限制量測模組14的種類,例如量測模組14可以是由一些用於信號處理的電路組合而成。In an example, the electronic
以圖1的例子來說,探針12在結構上可以有接觸部120、信號端122和旁路端124。接觸部120用來接觸電子元件DUT,並從電子元件DUT上的接墊(pad)讀出信號。此外,信號端122用來電性連接量測模組14,而旁路端124用來電性連接接地端100。信號端122和接觸部120之間可以電性連接在一起,且信號端122和旁路端124之間可以電性連接在一起,而電子元件測試裝置1中可以定義有第一電流路徑C1和旁路電流路徑(第二電流路徑C2)。第一電流路徑C1可以是從量測模組14、探針12的信號端122、探針12的接觸部120、電子元件DUT到接地電位的電流路徑。此外,第二電流路徑C2可以是從量測模組14、探針12的信號端122、探針12的旁路端124到接地電位的電流路徑。雖然圖1繪示了探針12的旁路端124會經過接地端100電性連接到接地電位,但探針12也有可能透過其他方式電性連接到接地電位,本實施例不加以限制。實務上,第二電流路徑C2中還包含了常閉型開關126,常閉型開關126可以受控於處理單元16產生的控制信號,用來決定第二電流路徑C2是否導通。Taking the example of FIG. 1 as an example, the
於一個例子中,常閉型開關126與一般的開關不同的是,常閉型開關126僅穩定於閉合狀態而不會穩定於開路狀態,例如常閉型開關126可以是一種空乏型(depletion type)的場效電晶體或一種常閉型繼電器。也就是說,常閉型開關126在沒有受到控制信號的觸發時,常閉型開關126會保持在閉合狀態並保持第二電流路徑C2導通。當常閉型開關126受到控制信號的觸發時,常閉型開關126才會切換到開路狀態並截止第二電流路徑C2。當控制信號結束,常閉型開關126又會切換回閉合狀態並導通第二電流路徑C2。值得一提的是,因為本實施例選用了常閉型開關126,不需要給常閉型開關126通電也讓第二電流路徑C2保持導通,因此本實施例的電子元件測試裝置1不論是否有上電都能夠保護電子元件DUT。In one example, the normally closed
由於常閉型開關126的阻抗極小,當常閉型開關126在閉合狀態而第二電流路徑C2導通時,可以看成探針12會經由第二電流路徑C2短路到接地。此外,因第一電流路徑C1中會經過阻抗較大的電子元件DUT,使得第二電流路徑C2中的阻抗會遠小於第一電流路徑C1中的阻抗。於所屬技術領域具有通常知識者應可以明白,只要第二電流路徑C2是導通的,不論第一電流路徑C1是否導通,所有的電流或信號都會走第二電流路徑C2,而不走電子元件DUT所在的第一電流路徑C1。換句話說,當常閉型開關126在閉合狀態而第二電流路徑C2導通時,所有的電流(含靜電電流)或信號會旁路(bypass)電子元件DUT。當常閉型開關126在開路狀態而截止第二電流路徑C2時,由於僅剩下第一電流路徑C1,此時所有的電流或信號才會經過電子元件DUT。Since the impedance of the normally closed
以實際的例子來說,在盒體尚未安置於電子元件測試裝置1內的適當位置時,有可能在搬運或者器械間的接觸時產生靜電電流,或者探針12剛剛接觸到電子元件DUT的瞬間,也有可能產生靜電電流。由圖2可知,本實施例在預設狀態下,第一電流路徑C1和第二電流路徑C2都是導通的。實務上,在探針12與電子元件DUT接觸之前,於第二電流路徑C2中的旁路端124會先電性連接到接地端100,並經過接地端100電性連接到接地電位。也就是說,如果探針12與電子元件DUT接觸時產生了靜電電流,因為第二電流路徑C2是短路到接地電位,所以靜電電流會由第二電流路徑C2導引接地,而可以避免靜電電流流經電子元件DUT。然而,由於很難確定靜電電流於何時或何處產生,因此電子元件測試裝置1可以做一些檢查與判斷,例如在盒體已經確實裝好且判斷電子元件DUT可以準備量測時,才會截止第二電流路徑C2。也就是說,在處理單元16產生所述控制信號之前,所有的電流或信號會由第二電流路徑C2旁路電子元件DUT。實務上,電子元件測試裝置1可以利用一個或多個偵測器(圖未示)來偵測盒體的使用狀態,使得處理單元16能夠基於盒體的使用狀態來判斷是否產生所述控制信號。Taking a practical example, when the box body has not been placed in the appropriate position in the electronic
於一個例子中,盒體可以具有滑軌,且電子元件測試裝置1可以設置有偵測器,來偵測盒體是否已經由滑軌推入到正確位置。例如,當盒體組裝於滑軌並推入電子元件測試裝置1後,偵測器可以產生對應的盒體狀態信號並指示盒體已經推到底。或者,電子元件測試裝置1可以設置有盒體的門檔,當盒體已經由滑軌推入到正確位置後,門檔可以固定盒體。當然,門檔有對應的偵測器,偵測器可以產生對應的盒體狀態信號並指示盒體已經推到底。在此,本實施例不限制上述兩種偵測器的數量,也不限制是否設置兩種偵測器或是擇一設置,於所屬技術領域可以自由設計。此外,當盒體被放置到正確位置後,電子元件測試裝置1可以鎖定盒體的位置,使盒體在完成量測之前不能再被抽出。於一個例子中,電子元件測試裝置1鎖定盒體位置的指令、電子元件測試裝置1等待一段預設時間或者電子元件測試裝置1達到預設溫度等,也都有可能被視為一種盒體狀態信號,本實施例不加以限制。In one example, the box body may have a slide rail, and the electronic
承接上述,處理單元16可以接收偵測器產生的盒體狀態信號,並判斷上述一個或多個的盒體狀態信號是否正常。當處理單元16判斷所述一個或多個的盒體狀態信號是正常的,則可以推論盒體已經確實裝好並且系統處於相對穩定的狀態。因為盒體本身具有屏蔽靜電或磁場的功能,電子元件DUT在盒體中且盒體裝設好之後,意味著電子元件DUT突然被靜電電流攻擊的機率很低。此時,處理單元16可以接著把常閉型開關126設定為開路狀態,再開始進行電子元件DUT的量測。如此一來,電子元件測試裝置1便可以提供電子元件DUT完整的防護靜電放電或突波的機制。Continuing the above, the
綜上所述,本發明提供的電子元件測試裝置以及探針於量測電子元件時,可以預設提供阻抗較低的旁路電流路徑,讓靜電電流經由旁路電流路徑導引掉,而不會讓靜電電流攻擊電子元件。並且,本發明提供的電子元件測試裝置可以檢查系統是否在一個穩定的狀態,只有在系統穩定時才會切開旁路電流路徑,以減少電子元件於測試時被靜電放電破壞的可能性。In summary, the electronic component testing device and probe provided by the present invention can provide a bypass current path with a lower impedance in advance when measuring electronic components, so that the electrostatic current can be guided away through the bypass current path instead of Electrostatic current can attack electronic components. Moreover, the electronic component testing device provided by the present invention can check whether the system is in a stable state, and the bypass current path is cut only when the system is stable, so as to reduce the possibility of electronic components being damaged by electrostatic discharge during testing.
1:電子元件測試裝置 10:載板 100:接地端 12:探針 120:接觸部 122:信號端 124:旁路端 126:常閉型開關 14:量測模組 16:處理單元 C1、C2:電流路徑 DUT:電子元件 1: Electronic component testing device 10: Carrier board 100: Ground terminal 12: Probe 120: contact part 122: signal end 124: Bypass end 126: Normally closed switch 14: Measurement module 16: processing unit C1, C2: current path DUT: electronic components
圖1係繪示依據本發明一實施例之電子元件測試裝置的結構示意圖。FIG. 1 is a schematic diagram showing the structure of an electronic component testing device according to an embodiment of the present invention.
圖2係繪示依據本發明一實施例之電子元件測試裝置的電路示意圖。FIG. 2 is a schematic circuit diagram of an electronic component testing device according to an embodiment of the present invention.
無no
1:電子元件測試裝置 1: Electronic component testing device
10:載板 10: Carrier board
100:接地端 100: Ground terminal
12:探針 12: Probe
120:接觸部 120: contact part
122:信號端 122: signal end
124:旁路端 124: Bypass end
14:量測模組 14: Measurement module
16:處理單元 16: processing unit
DUT:電子元件 DUT: electronic components
Claims (8)
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TW108148478A TWI724721B (en) | 2019-12-31 | 2019-12-31 | Electronic component testing device and probe |
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TW108148478A TWI724721B (en) | 2019-12-31 | 2019-12-31 | Electronic component testing device and probe |
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TWI724721B true TWI724721B (en) | 2021-04-11 |
TW202127049A TW202127049A (en) | 2021-07-16 |
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TW108148478A TWI724721B (en) | 2019-12-31 | 2019-12-31 | Electronic component testing device and probe |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5523699A (en) * | 1992-06-03 | 1996-06-04 | Seiko Epson Corporation | Method and apparatus for testing semiconductor device |
US20060114010A1 (en) * | 2001-06-25 | 2006-06-01 | Byrd Phillip E | Method to prevent damage to probe card |
TWI398655B (en) * | 2009-03-17 | 2013-06-11 | Chroma Ate Inc | A probe detection machine with an electrostatic discharge device |
TWI553315B (en) * | 2015-11-27 | 2016-10-11 | 致茂電子股份有限公司 | Detection assembly for electro static discharge test |
WO2016180771A1 (en) * | 2015-05-11 | 2016-11-17 | Robert Bosch Gmbh | Device and method for detecting a number of electrostatic discharges |
-
2019
- 2019-12-31 TW TW108148478A patent/TWI724721B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5523699A (en) * | 1992-06-03 | 1996-06-04 | Seiko Epson Corporation | Method and apparatus for testing semiconductor device |
US20060114010A1 (en) * | 2001-06-25 | 2006-06-01 | Byrd Phillip E | Method to prevent damage to probe card |
TWI398655B (en) * | 2009-03-17 | 2013-06-11 | Chroma Ate Inc | A probe detection machine with an electrostatic discharge device |
WO2016180771A1 (en) * | 2015-05-11 | 2016-11-17 | Robert Bosch Gmbh | Device and method for detecting a number of electrostatic discharges |
TWI553315B (en) * | 2015-11-27 | 2016-10-11 | 致茂電子股份有限公司 | Detection assembly for electro static discharge test |
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