TWI722952B

TWI722952B - Inductor device

Info

Publication number: TWI722952B
Application number: TW109126927A
Authority: TW
Inventors: 顏孝璁; 陳建祐; 陳家源
Original assignee: 瑞昱半導體股份有限公司
Priority date: 2019-09-11
Filing date: 2020-08-07
Publication date: 2021-03-21
Also published as: CN112489921A; TW202111741A; CN112489921B

Abstract

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces. Terminals of one ends of the at least two sub-traces are coupled to each other at a first node. The second trace includes at least two sub-traces. Terminals of one ends of the at least two sub-traces are coupled to each other at a second node. The capacitor is coupled to the firs node and the second node.

Description

Inductance device

本案係有關於一種電子裝置，且特別是有關於一種電感裝置。This case is related to an electronic device, and in particular to an inductive device.

射頻(Radio frequency, RF)裝置於運作時會產生兩倍頻諧波(harmonic)、三倍頻諧波…等等，上述諧波會對其餘電路產生不良影響。例如2.4GHz電路的兩倍頻諧波會產生5GHz訊號進而於集成電路(SOC)產生不良影響。Radio frequency (RF) devices will produce double-frequency harmonics (harmonic), triple-frequency harmonics... etc., and the above-mentioned harmonics will have an adverse effect on the rest of the circuit. For example, the double-frequency harmonics of the 2.4GHz circuit will generate a 5GHz signal and then have an adverse effect on the integrated circuit (SOC).

一般解決上述諧波對電路產生影響的方式，是在電路外部設置濾波器以濾除上述諧波。然而，設置於電路外部的濾波器會影響到電路本身的性能和額外的費用。The general way to solve the influence of the above harmonics on the circuit is to set a filter outside the circuit to filter out the above harmonics. However, the filter installed outside the circuit will affect the performance of the circuit itself and additional costs.

本案內容之一技術態樣係關於一種電感裝置，其包括第一走線、第二走線及電容。第一走線包括至少兩個子走線，且至少兩個子走線的一端耦接於第一節點。第二走線包括至少兩個子走線，且至少兩個子走線的一端耦接於第二節點。電容耦接於第一節點及第二節點之間。One of the technical aspects of this case relates to an inductive device, which includes a first wiring, a second wiring and a capacitor. The first wire includes at least two sub wires, and one end of the at least two sub wires is coupled to the first node. The second wire includes at least two sub wires, and one end of the at least two sub wires is coupled to the second node. The capacitor is coupled between the first node and the second node.

因此，根據本案之技術內容，本案實施例所示之電感裝置中的電容可形成一個低頻濾除的功能，以使於電感裝置感應的低頻訊號無法通過而高頻訊號能直接通過。低頻訊號舉例而言，如2.4GHz主要操作頻率，藉由電感裝置之曲折的電感架構(folded inductor)對主要操作頻率的感應訊號進行相消，所以曲折的電感架構並不會影響電感操作頻率的特性，而若中央電感架構有高頻訊號，例如2倍諧波5GHz，則因高頻訊號電容為導通之故，使得高頻訊號由曲折的電感架構通過電容而形成一個繞圍一圈的感應電感，進而在本案主張之電感架構感應出相對應2.4GHz十倍以上的5GHz諧波訊號。使用者再把此5GHz訊號於電路中應用，例如放大訊號之後再把操作頻率的5GHz諧波進行相消，另其應用放大電路可為熟知電路設計者最佳化調整而定。如此，即可降低對5GHz之電路所產生的不良影響。再者，由於本案將濾波器設置於電感裝置內，因此，不需於電感裝置外部設置濾波器，從而避免外部濾波器影響到電路本身的性能或是增加額外的費用。Therefore, according to the technical content of the present case, the capacitor in the inductive device shown in the embodiment of the present case can form a low-frequency filtering function, so that the low-frequency signal induced by the inductive device cannot pass but the high-frequency signal can pass directly. For example, for low-frequency signals, such as the main operating frequency of 2.4GHz, the folded inductor of the inductive device cancels the induced signal at the main operating frequency, so the tortuous inductor structure does not affect the operating frequency of the inductor. If the central inductance structure has a high frequency signal, such as 2 times harmonic 5GHz, the high frequency signal capacitor is turned on, so that the high frequency signal is formed by the tortuous inductance structure through the capacitor to form a circle of induction The inductor, and the inductor structure proposed in this case induces a 5GHz harmonic signal corresponding to more than ten times the 2.4GHz. The user then applies the 5GHz signal in the circuit, for example, after amplifying the signal, cancels the 5GHz harmonics of the operating frequency. In addition, the application of the amplifier circuit can be optimized and adjusted by the well-known circuit designer. In this way, the adverse effects on the 5GHz circuit can be reduced. Furthermore, since the filter is arranged in the inductance device in this case, it is not necessary to install the filter outside the inductance device, so as to prevent the external filter from affecting the performance of the circuit itself or adding extra cost.

第1圖係依照本揭露一實施例繪示一種電感裝置1000的示意圖。為使第1圖之電感裝置1000易於理解，將第1圖之電感裝置1000的結構設計圖簡化為第2A圖之電感裝置1000的示意圖。FIG. 1 is a schematic diagram of an inductance device 1000 according to an embodiment of the disclosure. In order to make the inductance device 1000 in FIG. 1 easier to understand, the structural design diagram of the inductance device 1000 in FIG. 1 is simplified to a schematic diagram of the inductance device 1000 in FIG. 2A.

請同時參閱第1圖及第2A圖，電感裝置1000包括第一走線1100、第二走線1200及電容C。再者，第一走線1100包括至少兩個子走線1110、1120。第二走線1200包括至少兩個子走線1210、1220。Please refer to FIG. 1 and FIG. 2A at the same time. The inductive device 1000 includes a first wiring 1100, a second wiring 1200, and a capacitor C. Furthermore, the first wiring 1100 includes at least two sub-wiring 1110 and 1120. The second trace 1200 includes at least two sub traces 1210 and 1220.

於一實施例中，至少兩個子走線1110、1120的一端(如上端)耦接於第一節點N1。至少兩個子走線1210、1220的一端(如上端)耦接於第二節點N2。電容C耦接於第一節點N1及第二節點N2之間。In one embodiment, one end (such as the upper end) of the at least two sub-wirings 1110 and 1120 is coupled to the first node N1. One end (such as the upper end) of at least two sub-wires 1210 and 1220 is coupled to the second node N2. The capacitor C is coupled between the first node N1 and the second node N2.

於另一實施例中，第一走線1100之至少兩個子走線1110、1120其中之一的另一端(如下端)耦接於第二走線1200之至少兩個子走線1210、1220其中之一的另一端(如下端)。舉例而言，電感裝置1000更包括連接件1300，第一走線1100之子走線1110的下端可透過連接件1300耦接於第二走線1200之子走線1210的下端。In another embodiment, the other end (the lower end) of one of the at least two sub-wires 1110, 1120 of the first wiring 1100 is coupled to the at least two sub-wires 1210, 1220 of the second wiring 1200 The other end of one of them (the lower end). For example, the inductive device 1000 further includes a connecting member 1300, and the lower end of the sub-wiring 1110 of the first wiring 1100 can be coupled to the lower end of the sub-wiring 1210 of the second wiring 1200 through the connecting member 1300.

於一實施例中，第一走線1100之至少兩個子走線1110、1120的每一者包含U型子走線。舉例而言，子走線1110、1120皆為U型之子走線。此外，第二走線1200的至少兩個子走線1210、1220的每一者亦包含U型子走線。舉例而言，子走線1210、1220皆為U型之子走線。然本案不以第2A圖之實施例為限，在其餘實施例中，子走線亦可為其它適當之形狀，端視實際需求而定。In one embodiment, each of the at least two sub-wiring 1110, 1120 of the first wiring 1100 includes a U-shaped sub-wiring. For example, the sub-wires 1110 and 1120 are all U-shaped sub-wires. In addition, each of the at least two sub-wiring 1210, 1220 of the second wiring 1200 also includes a U-shaped sub-wiring. For example, the sub-wires 1210 and 1220 are all U-shaped sub-wires. However, this case is not limited to the embodiment shown in FIG. 2A. In other embodiments, the sub-wiring can also have other appropriate shapes, depending on actual requirements.

請同時參閱第1圖及第2A圖，第一走線1100包括第一子走線1110及第二子走線1120。再者，第一子走線1110及第二子走線1120皆包括第一端及第二端。如圖所示，第一子走線1110的第一端(如上端)耦接於第二子走線1120的第一端(如上端)。Please refer to FIG. 1 and FIG. 2A at the same time. The first trace 1100 includes a first sub trace 1110 and a second sub trace 1120. Furthermore, the first sub-line 1110 and the second sub-line 1120 both include a first end and a second end. As shown in the figure, the first end (such as the upper end) of the first sub-wire 1110 is coupled to the first end (such as the upper end) of the second sub-wire 1120.

此外，第二走線1200包括第三子走線1210及第四子走線1220。再者，第三子走線1210及第四子走線1220皆包括第一端及第二端。如圖所示，第三子走線1210的第一端(如上端)耦接於第四子走線1220的第一端(如上端)。In addition, the second wiring 1200 includes a third sub-wiring 1210 and a fourth sub-wiring 1220. Furthermore, the third sub-line 1210 and the fourth sub-line 1220 both include a first end and a second end. As shown in the figure, the first end (such as the upper end) of the third sub-wire 1210 is coupled to the first end (such as the upper end) of the fourth sub-wire 1220.

於一實施例中，電感裝置1000之連接件1300耦接於第一子走線1110之第二端(如下端)與第三子走線1210之第二端(如下端)。In one embodiment, the connector 1300 of the inductance device 1000 is coupled to the second end (the lower end) of the first sub-wire 1110 and the second end (the lower end) of the third sub-wire 1210.

於另一實施例中，電容C與連接件1300分別位於電感裝置1000之兩側。舉例而言，電容C位於電感裝置1000之上側，而連接件1300則位於電感裝置1000之下側。需說明的是，本案不以第1圖及第2A圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。In another embodiment, the capacitor C and the connecting member 1300 are located on both sides of the inductance device 1000, respectively. For example, the capacitor C is located on the upper side of the inductive device 1000, and the connecting member 1300 is located on the lower side of the inductive device 1000. It should be noted that this case is not limited to the structure shown in Figure 1 and Figure 2A, and it is only used to illustrate one of the implementation methods of this case.

第2B圖係依照本揭露一實施例繪示一種電感裝置1000A的示意圖。相較於第2A圖所示之電感裝置1000，第2B圖之電感裝置1000A的連接件1300A耦接於第二子走線1120A之第二端(如下端)與第四子走線1220A之第二端(如下端)。需說明的是，於第2B圖之實施例中，元件標號類似於第2A圖中的元件標號者，具備類似的結構特徵，為使說明書簡潔，於此不作贅述。此外，本案不以第2B圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。FIG. 2B is a schematic diagram of an inductor device 1000A according to an embodiment of the disclosure. Compared with the inductor device 1000 shown in FIG. 2A, the connector 1300A of the inductor device 1000A in FIG. 2B is coupled to the second end (the lower end) of the second sub-line 1120A and the fourth sub-line 1220A. Two ends (lower end). It should be noted that, in the embodiment shown in FIG. 2B, the component numbers are similar to those in FIG. 2A, and have similar structural features. In order to keep the description concise, it will not be repeated here. In addition, this case is not limited to the structure shown in Figure 2B, and it is only used to illustrate one of the implementation methods of this case.

第3圖係依照本揭露一實施例繪示一種電感裝置1000B的示意圖。相較於第1圖所示之電感裝置1000，第3圖之電感裝置1000B的內部可配置一個電感5000。需說明的是，於第3圖之實施例中，元件標號類似於第1圖中的元件標號者，具備類似的結構特徵，為使說明書簡潔，於此不作贅述。再者，本案不以第3圖之實施例為限，在其餘實施例中，電感裝置1000B的內部可配置其餘型態、種類之電感，端視實際需求而定。此外，本案不以第3圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。FIG. 3 is a schematic diagram of an inductance device 1000B according to an embodiment of the disclosure. Compared with the inductance device 1000 shown in Fig. 1, an inductance 5000 can be configured inside the inductance device 1000B in Fig. 3. It should be noted that, in the embodiment in FIG. 3, the component numbers are similar to those in FIG. 1 and have similar structural features. In order to keep the description concise, it will not be repeated here. Furthermore, this case is not limited to the embodiment shown in FIG. 3, in other embodiments, other types and types of inductors can be configured inside the inductance device 1000B, depending on actual requirements. In addition, this case is not limited to the structure shown in Figure 3, and it is only used to illustrate one of the implementation methods of this case.

第4圖係依照本揭露一實施例繪示一種電感裝置的部分結構示意圖。第4圖之電感裝置的部分結構示意圖係對第3圖之電感裝置1000B的左上角結構進行配置。請參閱第4圖，第一子走線1110包括複數個第一線圈1111、1113，第二子走線1120包括複數個第二線圈1121、1123。舉例而言，第一子走線1110可繞設為多個第一線圈1111、1113，第二子走線1120亦可繞設為多個第二線圈1121、1123。FIG. 4 is a schematic diagram showing a partial structure of an inductance device according to an embodiment of the disclosure. The partial schematic diagram of the structure of the inductance device in FIG. 4 is to arrange the structure of the upper left corner of the inductance device 1000B in FIG. 3. Referring to FIG. 4, the first sub-wiring 1110 includes a plurality of first coils 1111, 1113, and the second sub-wiring 1120 includes a plurality of second coils 1121, 1123. For example, the first sub-wire 1110 can be wound as a plurality of first coils 1111 and 1113, and the second sub-wire 1120 can also be wound as a plurality of second coils 1121 and 1123.

如第4圖所示，第一線圈1111、1113與第二線圈1121、1123間隔排列。舉例而言，線圈的排列方式可為第一線圈1111、第二線圈1121、第一線圈1113、第二線圈1123。在一實施例中，多個第一線圈1111、1113與多個第二線圈1121、1123配置於鄰近第一子走線1110的第一端(如上端)。然本案不以第4圖之實施例為限，在其餘實施例中，電感裝置的子走線可以其餘適當之方式配置，端視實際需求而定。此外，本案不以第4圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。As shown in Fig. 4, the first coils 1111, 1113 and the second coils 1121, 1123 are arranged at intervals. For example, the arrangement of the coils may be the first coil 1111, the second coil 1121, the first coil 1113, and the second coil 1123. In an embodiment, the plurality of first coils 1111, 1113 and the plurality of second coils 1121, 1123 are disposed adjacent to the first end (such as the upper end) of the first sub-wiring 1110. However, this case is not limited to the embodiment in FIG. 4, in other embodiments, the sub-wiring of the inductance device can be configured in other appropriate ways, depending on actual requirements. In addition, this case is not limited to the structure shown in Figure 4, and it is only used to illustrate one of the implementation methods of this case.

於一實施例中，除對第3圖之電感裝置1000B的左上角結構進行配置，亦可對電感裝置1000B的左下角結構進行配置，因此，第一子走線1110更包括複數個第三線圈(圖中未示)，第二子走線1120更包括複數個第四線圈(圖中未示)，且第三線圈與第四線圈間隔排列。於另一實施例中，多個第三線圈與多個第四線圈配置於鄰近第一子走線1110的第二端(如下端)。In one embodiment, in addition to arranging the upper left corner structure of the inductance device 1000B in FIG. 3, the lower left corner structure of the inductance device 1000B can also be arranged. Therefore, the first sub-wiring 1110 further includes a plurality of third coils. (Not shown in the figure), the second sub-wiring 1120 further includes a plurality of fourth coils (not shown in the figure), and the third coil and the fourth coil are arranged at intervals. In another embodiment, the plurality of third coils and the plurality of fourth coils are disposed adjacent to the second end (the lower end) of the first sub-wiring 1110.

於一實施例中，除對第3圖之電感裝置1000B的左側結構進行配置，亦可對電感裝置1000B的右上角結構進行配置，因此，第三子走線1210包括複數個第五線圈(圖中未示)，第四子走線1220包括複數個第六線圈(圖中未示)。於另一實施例中，第三子走線1210可繞設為多個第五線圈，第四子走線1220亦可繞設為多個第六線圈，且第五線圈與第六線圈間隔排列。於一實施例中，多個第五線圈與多個第六線圈配置於鄰近第三子走線1210的第一端(如上端)。In one embodiment, in addition to arranging the left side structure of the inductance device 1000B in FIG. 3, the upper right corner structure of the inductance device 1000B can also be arranged. Therefore, the third sub-wiring 1210 includes a plurality of fifth coils (Fig. Not shown in the figure), the fourth sub-wiring 1220 includes a plurality of sixth coils (not shown in the figure). In another embodiment, the third sub-wiring 1210 can be wound as multiple fifth coils, and the fourth sub-wiring 1220 can also be wound as multiple sixth coils, and the fifth coil and the sixth coil are arranged at intervals . In one embodiment, the plurality of fifth coils and the plurality of sixth coils are disposed adjacent to the first end (such as the upper end) of the third sub-wiring 1210.

於另一實施例中，除對第3圖之電感裝置1000B的右上角結構進行配置，亦可對電感裝置1000B的右下角結構進行配置，因此，第三子走線1210更包括複數個第七線圈，第四子走線1220更包括複數個第八線圈，且第七線圈與第八線圈間隔排列。於一實施例中，多個第七線圈與多個第八線圈配置於鄰近第三子走線1210的第二端(如下端)。In another embodiment, in addition to arranging the upper right corner structure of the inductance device 1000B in FIG. 3, the lower right corner structure of the inductance device 1000B can also be arranged. Therefore, the third sub-wiring 1210 further includes a plurality of sevenths. For the coil, the fourth sub-wiring 1220 further includes a plurality of eighth coils, and the seventh coil and the eighth coil are arranged at intervals. In one embodiment, the plurality of seventh coils and the plurality of eighth coils are disposed adjacent to the second end (the lower end) of the third sub-wiring 1210.

第5圖係依照本揭露一實施例繪示一種電感裝置的示意圖。相較於第2A圖所示之電感裝置1000，第5圖之電感裝置1000C更包括第三走線1400C、第四走線1500C、第五走線1600C及第六走線1700C。如第5圖所示，第三走線1400C與第一走線1100C配置於電感裝置1000C之第一側(如左側)，且第三走線1400C配置於電感裝置1000C之內側。在一實施例中，第三走線1400C耦接於第二走線1200C之至少兩個子走線1210C、1220C其中一者。舉例而言，第三走線1400C耦接於第二走線1200C之第四子走線1220C。FIG. 5 is a schematic diagram of an inductance device according to an embodiment of the disclosure. Compared with the inductive device 1000 shown in FIG. 2A, the inductive device 1000C in FIG. 5 further includes a third trace 1400C, a fourth trace 1500C, a fifth trace 1600C, and a sixth trace 1700C. As shown in FIG. 5, the third wiring 1400C and the first wiring 1100C are arranged on the first side (such as the left side) of the inductive device 1000C, and the third wiring 1400C is arranged on the inner side of the inductive device 1000C. In one embodiment, the third trace 1400C is coupled to one of the at least two sub traces 1210C and 1220C of the second trace 1200C. For example, the third trace 1400C is coupled to the fourth sub trace 1220C of the second trace 1200C.

於一實施例中，第四走線1500C與第二走線1200C配置於電感裝置1000C之第二側(如右側)，且第四走線1500C配置於電感裝置1000C之內側。於另一實施例中，第四走線1500C耦接於第一走線1100C之至少兩個子走線1110C、1120C其中一者。舉例而言，第四走線1500C耦接於第一走線1100C之第二子走線1120C。In one embodiment, the fourth wire 1500C and the second wire 1200C are arranged on the second side (such as the right side) of the inductive device 1000C, and the fourth wire 1500C is arranged on the inner side of the inductive device 1000C. In another embodiment, the fourth trace 1500C is coupled to one of the at least two sub traces 1110C and 1120C of the first trace 1100C. For example, the fourth line 1500C is coupled to the second sub-line 1120C of the first line 1100C.

於另一實施例中，第五走線1600C與第一走線1100C配置於電感裝置1000C之第一側(如左側)，且第五走線1600C配置於電感裝置1000C之外側。於一實施例中，第五走線1600C耦接於第二走線1200C之至少兩個子走線1210C、1220C其中一者。舉例而言，第五走線1600C耦接於第二走線1200C之第三子走線1210C。In another embodiment, the fifth wire 1600C and the first wire 1100C are arranged on the first side (such as the left side) of the inductive device 1000C, and the fifth wire 1600C is arranged on the outer side of the inductive device 1000C. In one embodiment, the fifth trace 1600C is coupled to one of the at least two sub traces 1210C and 1220C of the second trace 1200C. For example, the fifth line 1600C is coupled to the third sub-line 1210C of the second line 1200C.

於一實施例中，第六走線1700C與第二走線1200C配置於電感裝置1000C之第二側(如右側)，且第六走線1700C配置於電感裝置1000C之外側。於另一實施例中，第六走線1700C耦接於第一走線1100C之至少兩個子走線1110C、1120C其中一者。舉例而言，第六走線1700C耦接於第一走線1100C之第一子走線1110C。In one embodiment, the sixth wiring 1700C and the second wiring 1200C are arranged on the second side (such as the right side) of the inductive device 1000C, and the sixth wiring 1700C is arranged on the outer side of the inductive device 1000C. In another embodiment, the sixth trace 1700C is coupled to one of the at least two sub traces 1110C and 1120C of the first trace 1100C. For example, the sixth trace 1700C is coupled to the first sub trace 1110C of the first trace 1100C.

請參閱第5圖，電感裝置1000C更包括輸入輸出端1800C。輸入輸出端1800C配置於第三走線1400C與第四走線1500C之間。需說明的是，於第5圖之實施例中，元件標號類似於第2A圖中的元件標號者，具備類似的結構特徵，為使說明書簡潔，於此不作贅述。再者本案不以第5圖之實施例為限，在其餘實施例中，電感裝置的走線可以其餘適當之方式配置，端視實際需求而定。此外，本案不以第5圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。Please refer to Fig. 5, the inductance device 1000C further includes an input and output terminal 1800C. The input and output terminal 1800C is disposed between the third wire 1400C and the fourth wire 1500C. It should be noted that, in the embodiment in FIG. 5, the component numbers are similar to those in Figure 2A, and have similar structural features. In order to keep the description concise, it will not be repeated here. Furthermore, this case is not limited to the embodiment shown in FIG. 5. In the other embodiments, the wiring of the inductance device can be configured in other appropriate ways, depending on actual requirements. In addition, this case is not limited to the structure shown in Fig. 5, which is only used to illustrate one of the implementation methods of this case.

第6圖係依照本揭露一實施例繪示一種電感裝置1000D的示意圖。相較於第5圖所示之電感裝置1000C，第6圖之電感裝置1000D之輸入輸出端1800D配置的方式不同，於第6圖之電感裝置1000D中，輸入輸出端1800D是配置於第五走線1600D與第六走線1700D之間。需說明的是，於第6圖之實施例中，元件標號類似於第5圖中的元件標號者，具備類似的結構特徵，為使說明書簡潔，於此不作贅述。再者本案不以第6圖之實施例為限，在其餘實施例中，電感裝置的走線可以其餘適當之方式配置，端視實際需求而定。此外，本案不以第6圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。FIG. 6 is a schematic diagram of an inductance device 1000D according to an embodiment of the disclosure. Compared with the inductance device 1000C shown in Fig. 5, the input and output terminals 1800D of the inductance device 1000D in Fig. 6 are arranged differently. In the inductance device 1000D in Fig. 6, the input and output terminals 1800D are arranged in the fifth path. Between the line 1600D and the sixth line 1700D. It should be noted that, in the embodiment in FIG. 6, the component numbers are similar to those in FIG. 5, and have similar structural features. In order to keep the description concise, it will not be repeated here. Furthermore, this case is not limited to the embodiment shown in FIG. 6, in other embodiments, the wiring of the inductance device can be configured in other appropriate ways, depending on actual requirements. In addition, this case is not limited to the structure shown in Figure 6, and it is only used to illustrate one of the implementation methods of this case.

第7圖係依照本揭露一實施例繪示一種電感裝置1000E的示意圖。第7圖之電感裝置1000E係為第5圖之電感裝置1000D的實作應用圖。於第7圖之電感裝置1000E中，電感裝置1000E外圍之結構(包含走線1100E、1200E、1400E、1500E、1600E、1700E及電容C)與第5圖之電感裝置1000D相似，此外，第7圖之電感裝置1000E內部更配置電感5000E。需說明的是，於第7圖之實施例中，元件標號類似於第5圖中的元件標號者，具備類似的結構特徵，為使說明書簡潔，於此不作贅述。再者，本案不以第7圖之實施例為限，在其餘實施例中，電感裝置1000E的內部可配置其餘型態、種類之電感，端視實際需求而定。此外，本案不以第7圖所示之結構為限，其僅用以例示性地繪示本案的實現方式之一。FIG. 7 is a schematic diagram of an inductance device 1000E according to an embodiment of the disclosure. The inductance device 1000E in Fig. 7 is an implementation and application diagram of the inductance device 1000D in Fig. 5. In the inductive device 1000E in Figure 7, the peripheral structure of the inductive device 1000E (including traces 1100E, 1200E, 1400E, 1500E, 1600E, 1700E and capacitor C) is similar to the inductive device 1000D in Figure 5. In addition, Figure 7 The inductance device 1000E is equipped with an inductance 5000E inside. It should be noted that, in the embodiment in FIG. 7, the component numbers are similar to those in FIG. 5, and have similar structural features. In order to keep the description concise, it will not be repeated here. Furthermore, this case is not limited to the embodiment shown in FIG. 7. In other embodiments, other types and types of inductors can be configured inside the inductance device 1000E, depending on actual requirements. In addition, this case is not limited to the structure shown in FIG. 7, which is only used to illustrate one of the implementation methods of this case.

由上述本案實施方式可知，應用本案具有下列優點。本案實施例所示之電感裝置可感應中央電感(如電感5000B、5000E)的高頻訊號，例如二階諧波，於額外的電路放大後，以相消原先電路二階諧波的不良影響。舉例而言，藉由電感裝置之電容主要使用於讓高頻通過和阻擋低頻的功效，如此，即可讓同一個電感裝置相對於高低頻有二種不同的訊號感應方式。再者，由於本案將濾波器設置於積體電路(integrated circuit,IC)內，因此，不需於電感裝置外部設置濾波器，從而避免外部濾波器影響到電路本身的性能以及其額外的費用。It can be seen from the above implementation of this case that the application of this case has the following advantages. The inductance device shown in the embodiment of this case can induce high-frequency signals of central inductors (such as inductors 5000B and 5000E), such as second-order harmonics, and amplified by additional circuits to cancel the adverse effects of the original circuit second-order harmonics. For example, the capacitance of an inductive device is mainly used to pass high frequencies and block low frequencies. In this way, the same inductive device can have two different signal sensing methods relative to high and low frequencies. Furthermore, since the filter is arranged in an integrated circuit (IC) in this case, it is not necessary to install a filter outside the inductance device, thereby preventing the external filter from affecting the performance of the circuit itself and its extra cost.

1000、1000A~1000E: 電感裝置 1100、1100A~1100E: 第一走線 1110、1110A~1110E: 第一子走線 1120、1120A~1120E: 第二子走線 1200、1200A~1200E: 第二走線 1210、1210A~1210E: 第三子走線 1220、1220A~1220E: 第四子走線 1300、1300A、1300B: 連接件 1400C、1400D、1400E: 第三走線 1500C、1500D、1500E: 第四走線 1600C、1600D、1600E: 第五走線 1700C、1700D、1700E: 第六走線 1800C、1800D: 輸入輸出端 5000B、5000E: 電感 C: 電容 N1: 第一節點 N2: 第二節點 1000, 1000A~1000E: Inductance device 1100, 1100A~1100E: first trace 1110, 1110A~1110E: the first sub-line 1120, 1120A~1120E: second sub-line 1200, 1200A~1200E: second trace 1210, 1210A~1210E: third sub-line 1220, 1220A~1220E: the fourth sub-line 1300, 1300A, 1300B: connectors 1400C, 1400D, 1400E: third trace 1500C, 1500D, 1500E: fourth trace 1600C, 1600D, 1600E: fifth trace 1700C, 1700D, 1700E: sixth trace 1800C, 1800D: input and output 5000B, 5000E: Inductance C: Capacitance N1: the first node N2: second node

為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：第1圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第2A圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第2B圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第3圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第4圖係依照本揭露一實施例繪示一種電感裝置的部分結構示意圖。第5圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第6圖係依照本揭露一實施例繪示一種電感裝置的示意圖。第7圖係依照本揭露一實施例繪示一種電感裝置的示意圖。根據慣常的作業方式，圖中各種特徵與元件並未依比例繪製，其繪製方式是為了以最佳的方式呈現與本揭露相關的具體特徵與元件。此外，在不同圖式間，以相同或相似的元件符號來指稱相似的元件/部件。 In order to make the above and other objectives, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows: FIG. 1 is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 2A is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 2B is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 3 is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 4 is a schematic diagram showing a partial structure of an inductance device according to an embodiment of the disclosure. FIG. 5 is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 6 is a schematic diagram of an inductance device according to an embodiment of the disclosure. FIG. 7 is a schematic diagram of an inductance device according to an embodiment of the disclosure. According to the usual operation method, the various features and components in the figure are not drawn to scale, and the drawing method is to best present the specific features and components related to the present disclosure. In addition, between different drawings, the same or similar element symbols are used to refer to similar elements/components.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

1000: 電感裝置 1100: 第一走線 1110、1120: 子走線 1200: 第二走線 1210、1220: 子走線 1300: 連接件 C: 電容 N1: 第一節點 N2: 第二節點 1000: Inductive device 1100: First trace 1110, 1120: sub-line 1200: second trace 1210, 1220: sub-line 1300: Connector C: Capacitance N1: the first node N2: second node

Claims

An inductance device, including: A first route, including: At least two sub-wires, wherein one end of the at least two sub-wires is coupled to a first node; A second route, including: At least two sub-wires, wherein one end of the at least two sub-wires is coupled to a second node; and A capacitor is coupled between the first node and the second node.

The inductive device according to claim 1, wherein the at least two traces of the first trace include: A first sub-line, including: A first end; and A second end; and A second sub-line, including: A first end, coupled to the first end of the first sub-wiring; and A second end.

The inductive device according to claim 2, wherein the at least two traces of the second trace include: A third sub-line, including: A first end; and A second end; and A fourth sub-line, including: A first end, coupled to the first end of the third sub-wiring; and A second end.

The inductive device described in claim 3 further includes: A connector coupled to the second end of the first sub-line and the second end of the third sub-line, or coupled to the second end and the fourth end of the second sub-line The second end of the sub-wire, wherein the capacitor and the connecting member are respectively located on both sides of the inductance device.

The inductive device according to claim 4, wherein the first sub-line includes a plurality of first coils, and the second sub-line includes a plurality of second coils, wherein the first coils and the second coils are spaced apart The arrangement, wherein the first sub-wire further includes a plurality of third coils, the second sub-wire further includes a plurality of fourth coils, and the third coils and the fourth coils are arranged at intervals.

The inductance device according to claim 5, wherein the first coils and the second coils are disposed adjacent to the first end of the first sub-wire, and the third coils and the fourth coils are disposed At the second end adjacent to the first sub-wiring.

The inductance device according to claim 6, wherein the third sub-line includes a plurality of fifth coils, and the fourth sub-line includes a plurality of sixth coils, wherein the fifth coils are separated from the sixth coils The arrangement, wherein the third sub-line further includes a plurality of seventh coils, the fourth sub-line further includes a plurality of eighth coils, and the seventh coils and the eighth coils are arranged at intervals.

The inductance device according to claim 7, wherein the fifth coils and the sixth coils are disposed adjacent to the first end of the third sub-wire, and the seventh coils and the eighth coils are disposed At the second end adjacent to the third sub-wiring.

The inductive device as described in claim 8, further including: A third wire and the first wire are arranged on a first side of the inductive device and arranged on the inner side of the inductive device, wherein the third wire is coupled to the at least two of the second wires One of the individual traces; and A fourth wire and the second wire are arranged on a second side of the inductive device and arranged on the inner side of the inductive device, wherein the fourth wire is coupled to the at least two of the first wires One of them.

The inductive device described in claim 9 further includes: A fifth wire and the first wire are arranged on the first side of the inductive device and arranged on the outer side of the inductive device, wherein the fifth wire is coupled to the at least two of the second wires One of the individual traces; and A sixth trace and the second trace are arranged on the second side of the inductive device and on the outer side of the inductive device, wherein the sixth trace is coupled to the at least two of the first trace One of them.