CN112489921B - Inductance device - Google Patents
Inductance device Download PDFInfo
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- CN112489921B CN112489921B CN202010825074.4A CN202010825074A CN112489921B CN 112489921 B CN112489921 B CN 112489921B CN 202010825074 A CN202010825074 A CN 202010825074A CN 112489921 B CN112489921 B CN 112489921B
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- 239000003990 capacitor Substances 0.000 claims abstract description 17
- 230000001939 inductive effect Effects 0.000 claims description 72
- 238000010586 diagram Methods 0.000 description 17
- 230000002411 adverse Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/005—Wound, ring or feed-through type inductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
An inductance device includes a first trace, a second trace and a capacitor. The first wire includes at least two sub-wires, and one end of the at least two sub-wires is coupled to the first node. The second trace comprises at least two sub-traces, and one end of each of the at least two sub-traces is coupled to the second node. The capacitor is coupled between the first node and the second node.
Description
Technical Field
The present disclosure relates to electronic devices, and more particularly, to an inductive device.
Background
Radio Frequency (RF) devices generate harmonic doublets (harmonic), harmonic triplets …, etc. when operating, which may adversely affect other circuits. For example, the harmonic of twice the frequency of a 2.4GHz circuit can produce a 5GHz signal that can adversely affect an integrated circuit (SOC).
Generally, a filter is disposed outside the circuit to filter out the harmonic. However, the filter disposed outside the circuit may affect the performance of the circuit itself and additional cost.
Disclosure of Invention
One technical implementation of the present disclosure relates to an inductance device including a first trace, a second trace, and a capacitor. The first wire includes at least two sub-wires, and one end of the at least two sub-wires is coupled to the first node. The second trace comprises at least two sub-traces, and one end of each of the at least two sub-traces is coupled to the second node. The capacitor is coupled between the first node and the second node.
Therefore, according to the technical content of the present disclosure, the capacitor in the inductance device shown in the embodiment of the present disclosure may form a low frequency filtering function, so that the low frequency signal induced by the inductance device cannot pass through and the high frequency signal can pass through directly. For example, a low frequency signal, such as 2.4GHz main operating frequency, cancels an induction signal of the main operating frequency through a meandering inductor structure (folded inductor) of the inductor device, so the meandering inductor structure does not affect the characteristics of the inductor operating frequency, and if the central inductor structure has a high frequency signal, such as 2 times harmonic 5GHz, since the high frequency signal capacitor is turned on, the high frequency signal forms an induction inductor which surrounds a circle through the capacitor by the meandering inductor structure, and then a 5GHz harmonic signal more than ten times corresponding to 2.4GHz is induced in the inductor structure of the present disclosure. The user then applies the 5GHz signal to the circuit, for example, amplifies the signal and then cancels the 5GHz harmonic of the operating frequency, and the application of the amplifying circuit can be optimized by the well-known circuit designer. Thus, the adverse effect on the 5GHz circuit can be reduced. Furthermore, since the filter is disposed in the inductive device, the filter does not need to be disposed outside the inductive device, thereby preventing the external filter from affecting the performance of the circuit itself or increasing extra cost.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the disclosure more comprehensible, the following description is given:
fig. 1 is a schematic diagram illustrating an inductive device according to an embodiment of the disclosure.
Fig. 2A is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
Fig. 2B is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
Fig. 3 is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
Fig. 4 is a schematic diagram illustrating a partial structure of an inductive device according to an embodiment of the present disclosure.
Fig. 5 is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
Fig. 6 is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
Fig. 7 is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure.
In accordance with conventional practice, the various features and elements of the drawings are not drawn to scale in order to best illustrate the specific features and elements associated with the present disclosure. Moreover, the same or similar reference numbers are used throughout the different drawings to reference like elements/components.
Description of the symbols
1000. 1000A to 1000E: inductance device
1100. 1100A to 1100E: first wire
1110. 1110A to 1110E: first sub-routing
1120. 1120A to 1120E: second sub-routing
1200. 1200A to 1200E: second routing
1210. 1210A to 1210E: third sub-routing
1220. 1220A to 1220E: fourth sub-routing
1300. 1300A, 1300B: connecting piece
1400C, 1400D, 1400E: third routing
1500C, 1500D, 1500E: fourth routing
1600C, 1600D, 1600E: fifth wire
1700C, 1700D, 1700E: sixth wire
1800C, 1800D: input/output terminal
5000B, 5000E: inductance
C: capacitor with a capacitor element
N1: first node
N2: second node
Detailed Description
Fig. 1 is a schematic diagram illustrating an inductive device 1000 according to an embodiment of the disclosure. To facilitate understanding of the inductive device 1000 in fig. 1, the structural design of the inductive device 1000 in fig. 1 is simplified to be a schematic diagram of the inductive device 1000 in fig. 2A.
Referring to fig. 1 and fig. 2A, the inductive device 1000 includes a first trace 1100, a second trace 1200 and a capacitor C. Furthermore, the first trace 1100 includes at least two sub-traces 1110 and 1120. The second trace 1200 includes at least two sub-traces 1210, 1220.
In one embodiment, one end (e.g., the upper end) of at least two sub-traces 1110 and 1120 is coupled to the first node N1. One end (e.g., the upper end) of at least two sub-traces 1210, 1220 is coupled to the second node N2. The capacitor C is coupled between the first node N1 and the second node N2.
In another embodiment, the other end (e.g., lower end) of one of the at least two sub-traces 1110 and 1120 of the first trace 1100 is coupled to the other end (e.g., lower end) of one of the at least two sub-traces 1210 and 1220 of the second trace 1200. For example, the inductive device 1000 further includes a connecting member 1300, and a lower end of the sub-trace 1110 of the first trace 1100 can be coupled to a lower end of the sub-trace 1210 of the second trace 1200 through the connecting member 1300.
In an embodiment, each of the at least two sub-traces 1110, 1120 of the first trace 1100 includes a U-shaped sub-trace. For example, the sub-traces 1110 and 1120 are both U-shaped sub-traces. In addition, each of the at least two sub-traces 1210, 1220 of the second trace 1200 also includes a U-shaped sub-trace. For example, the sub-traces 1210 and 1220 are U-shaped sub-traces. However, the disclosure is not limited to the embodiment of fig. 2A, and in other embodiments, the sub-traces may also have other suitable shapes, depending on the actual requirements.
Referring to fig. 1 and fig. 2A, the first trace 1100 includes a first sub-trace 1110 and a second sub-trace 1120. Furthermore, the first sub-trace 1110 and the second sub-trace 1120 both include a first end and a second end. As shown, a first end (e.g., upper end) of the first sub-trace 1110 is coupled to a first end (e.g., upper end) of the second sub-trace 1120.
In addition, the second trace 1200 includes a third sub-trace 1210 and a fourth sub-trace 1220. Furthermore, the third sub-trace 1210 and the fourth sub-trace 1220 each include a first end and a second end. As shown, a first end (e.g., upper end) of the third sub-trace 1210 is coupled to a first end (e.g., upper end) of the fourth sub-trace 1220.
In an embodiment, the connecting element 1300 of the inductive device 1000 is coupled to the second end (e.g., the lower end) of the first sub-trace 1110 and the second end (e.g., the lower end) of the third sub-trace 1210.
In another embodiment, the capacitor C and the connecting element 1300 are respectively located at two sides of the inductive device 1000. For example, the capacitor C is located on the upper side of the inductor 1000, and the connection component 1300 is located on the lower side of the inductor 1000. It should be noted that the present disclosure is not limited to the structures shown in fig. 1 and fig. 2A, and is only used to illustrate one implementation manner of the present disclosure.
Fig. 2B is a schematic diagram illustrating an inductive device 1000A according to an embodiment of the disclosure. Compared to the inductive device 1000 shown in fig. 2A, the connection element 1300A of the inductive device 1000A shown in fig. 2B is coupled to the second end (e.g., the lower end) of the second sub-trace 1120A and the second end (e.g., the lower end) of the fourth sub-trace 1220A. It should be noted that, in the embodiment of fig. 2B, the element numbers are similar to those in fig. 2A, and have similar structural features, and are not described herein again for brevity of the description. Furthermore, the present disclosure is not limited to the structure shown in fig. 2B, which is merely used to exemplarily show one of the implementations of the present disclosure.
Fig. 3 is a schematic diagram illustrating an inductive device 1000B according to an embodiment of the disclosure. Compared to the inductive device 1000 shown in fig. 1, an inductor 5000 may be disposed inside the inductive device 1000B shown in fig. 3. It should be noted that, in the embodiment of fig. 3, the element numbers are similar to those in fig. 1, and have similar structural features, and are not described herein again for brevity of the description. Furthermore, the present disclosure is not limited to the embodiment of fig. 3, and in other embodiments, other types and kinds of inductors may be configured inside the inductor device 1000B, depending on the actual requirement. Furthermore, the present disclosure is not limited to the structure shown in fig. 3, which is merely used to exemplarily show one of the implementations of the present disclosure.
Fig. 4 is a schematic diagram illustrating a partial structure of an inductive device according to an embodiment of the present disclosure. The partial structure diagram of the inductive device of fig. 4 is a configuration of the upper left corner structure of the inductive device 1000B of fig. 3. Referring to fig. 4, the first sub-trace 1110 includes a plurality of first coils 1111 and 1113, and the second sub-trace 1120 includes a plurality of second coils 1121 and 1123. For example, the first sub-trace 1110 may be formed as a plurality of first coils 1111 and 1113, and the second sub-trace 1120 may also be formed as a plurality of second coils 1121 and 1123.
As shown in fig. 4, the first coils 1111 and 1113 and the second coils 1121 and 1123 are spaced apart from each other. For example, the coils may be arranged in a first coil 1111, a second coil 1121, a first coil 1113, and a second coil 1123. In one embodiment, the first coils 1111 and 1113 and the second coils 1121 and 1123 are disposed adjacent to a first end (e.g., upper end) of the first sub-trace 1110. However, the present disclosure is not limited to the embodiment of fig. 4, and in other embodiments, the sub-traces of the inductance device may be configured in other suitable manners, depending on the actual requirements. Furthermore, the present disclosure is not limited to the structure shown in fig. 4, which is merely used to exemplarily show one of the implementations of the present disclosure.
In an embodiment, in addition to configuring the upper left corner structure of the inductive device 1000B in fig. 3, the lower left corner structure of the inductive device 1000B may also be configured, so that the first sub-trace 1110 further includes a plurality of third coils (not shown), the second sub-trace 1120 further includes a plurality of fourth coils (not shown), and the third coils and the fourth coils are arranged at intervals. In another embodiment, the third and fourth coils are disposed adjacent to the second end (e.g., the lower end) of the first sub-trace 1110.
In an embodiment, in addition to configuring the left structure of the inductive device 1000B in fig. 3, the upper right corner structure of the inductive device 1000B may also be configured, so that the third sub-trace 1210 includes a plurality of fifth coils (not shown), and the fourth sub-trace 1220 includes a plurality of sixth coils (not shown). In another embodiment, the third sub-trace 1210 can be wound to form a plurality of fifth loops, the fourth sub-trace 1220 can also be wound to form a plurality of sixth loops, and the fifth loops and the sixth loops are arranged at intervals. In one embodiment, the fifth and sixth coils are disposed adjacent to a first end (e.g., the upper end) of the third sub-trace 1210.
In another embodiment, in addition to configuring the upper right corner structure of the inductive device 1000B in fig. 3, the lower right corner structure of the inductive device 1000B can also be configured, so that the third sub-trace 1210 further includes a plurality of seventh coils, the fourth sub-trace 1220 further includes a plurality of eighth coils, and the seventh coils and the eighth coils are arranged at intervals. In one embodiment, the seventh coils and the eighth coils are disposed adjacent to the second end (e.g., the lower end) of the third sub-trace 1210.
Fig. 5 is a schematic diagram illustrating an inductive device, according to an embodiment of the present disclosure. Compared to the inductive device 1000 shown in fig. 2A, the inductive device 1000C of fig. 5 further includes a third trace 1400C, a fourth trace 1500C, a fifth trace 1600C and a sixth trace 1700C. As shown in fig. 5, the third trace 1400C and the first trace 1100C are disposed on a first side (e.g., left side) of the inductive device 1000C, and the third trace 1400C is disposed on the inner side of the inductive device 1000C. In an embodiment, the third trace 1400C is coupled to one of the at least two sub-traces 1210C, 1220C of the second trace 1200C. For example, the third trace 1400C is coupled to the fourth sub-trace 1220C of the second trace 1200C.
In an embodiment, the fourth trace 1500C and the second trace 1200C are disposed on a second side (e.g., right side) of the inductive device 1000C, and the fourth trace 1500C is disposed on the inner side of the inductive device 1000C. In another embodiment, the fourth trace 1500C is coupled to one of the at least two sub-traces 1110C and 1120C of the first trace 1100C. For example, the fourth trace 1500C is coupled to the second sub-trace 1120C of the first trace 1100C.
In another embodiment, the fifth trace 1600C and the first trace 1100C are disposed on a first side (e.g., left side) of the inductive device 1000C, and the fifth trace 1600C is disposed on an outer side of the inductive device 1000C. In an embodiment, the fifth trace 1600C is coupled to at least one of the two sub-traces 1210C and 1220C of the second trace 1200C. For example, the fifth trace 1600C is coupled to the third sub-trace 1210C of the second trace 1200C.
In an embodiment, the sixth trace 1700C and the second trace 1200C are disposed on a second side (e.g., right side) of the inductive device 1000C, and the sixth trace 1700C is disposed on an outer side of the inductive device 1000C. In another embodiment, the sixth trace 1700C is coupled to one of the at least two sub-traces 1110C and 1120C of the first trace 1100C. For example, the sixth trace 1700C is coupled to the first sub-trace 1110C of the first trace 1100C.
Referring to fig. 5, the inductive device 1000C further includes an input/output terminal 1800C. The input/output terminal 1800C is disposed between the third trace 1400C and the fourth trace 1500C. It should be noted that, in the embodiment of fig. 5, the element numbers are similar to those in fig. 2A, and have similar structural features, and are not described herein again for brevity of the description. Furthermore, the present disclosure is not limited to the embodiment of fig. 5, and in other embodiments, the routing of the inductance device may be configured in other suitable manners, depending on the actual requirement. Furthermore, the present disclosure is not limited to the structure shown in fig. 5, which is merely used to exemplarily show one of the implementations of the present disclosure.
Fig. 6 is a schematic diagram illustrating an inductive device 1000D according to an embodiment of the disclosure. Compared to the inductive device 1000C shown in fig. 5, the input/output ends 1800D of the inductive device 1000D in fig. 6 are configured differently, in the inductive device 1000D in fig. 6, the input/output ends 1800D are configured between the fifth trace 1600D and the sixth trace 1700D. It should be noted that, in the embodiment of fig. 6, the element numbers are similar to those in fig. 5, and have similar structural features, and are not repeated herein for brevity of the description. Furthermore, the present disclosure is not limited to the embodiment of fig. 6, and in other embodiments, the routing of the inductance device may be configured in other suitable manners, depending on the actual requirement. In addition, the present disclosure is not limited to the structure shown in fig. 6, which is only used to exemplarily show one of the implementations of the present disclosure.
Fig. 7 is a schematic diagram illustrating an inductive device 1000E, according to an embodiment of the disclosure. Inductive device 1000E of fig. 7 is an implementation of inductive device 1000D of fig. 5. In the inductive device 1000E of fig. 7, the structure of the periphery of the inductive device 1000E (including the traces 1100E, 1200E, 1400E, 1500E, 1600E, 1700E and the capacitor C) is similar to the inductive device 1000D of fig. 5, and in addition, an inductor 5000E is also disposed inside the inductive device 1000E of fig. 7. It should be noted that, in the embodiment of fig. 7, the element numbers are similar to those in fig. 5, and have similar structural features, and are not repeated herein for brevity of the description. Furthermore, the present disclosure is not limited to the embodiment of fig. 7, and in other embodiments, other types and kinds of inductors may be configured inside the inductor device 1000E, depending on the actual requirement. In addition, the present disclosure is not limited to the structure shown in fig. 7, which is only used to exemplarily show one of the implementations of the present disclosure.
As can be seen from the above-described embodiments of the present disclosure, the following advantages can be obtained by applying the present disclosure. The inductor device shown in the embodiments of the present disclosure can induce high frequency signals, such as second order harmonics, of the central inductor (e.g., inductors 5000B and 5000E), and cancel the adverse effect of the second order harmonics of the original circuit after the additional circuit amplification. For example, the capacitor of the inductor device is mainly used for the technical effects of passing high frequency and blocking low frequency, so that the same inductor device has two different signal induction modes relative to high frequency and low frequency. Furthermore, since the filter is disposed in an Integrated Circuit (IC), the filter does not need to be disposed outside the inductive device, thereby preventing the external filter from affecting the performance of the circuit itself and the extra cost thereof.
Claims (6)
1. An inductive device, comprising:
a first trace, comprising:
at least two sub-traces, wherein one end of each of the at least two sub-traces is coupled to a first node;
a second trace, comprising:
at least two sub-traces, wherein one end of each of the at least two sub-traces is coupled to a second node; and
a capacitor coupled between the first node and the second node, wherein the at least two sub-traces of the first trace comprise:
a first sub-trace, comprising:
a first end; and
a second end; and
a second sub-trace, comprising:
a first end coupled to the first end of the first sub-trace; and
a second end, wherein the at least two sub-traces of the second trace comprise:
a third sub-trace, comprising:
a first end; and
a second end; and
a fourth sub-trace, comprising:
a first end coupled to the first end of the third sub-trace; and
a second terminal, wherein the inductor apparatus further comprises:
a connecting element coupled to the second end of the first sub-trace and the second end of the third sub-trace, or coupled to the second end of the second sub-trace and the second end of the fourth sub-trace, wherein the capacitor and the connecting element are respectively located at two sides of the inductor, wherein the first sub-trace includes a plurality of first coils, the second sub-trace includes a plurality of second coils, wherein the plurality of first coils and the plurality of second coils are arranged at intervals, wherein the first sub-trace further includes a plurality of third coils, the second sub-trace further includes a plurality of fourth coils, and wherein the plurality of third coils and the plurality of fourth coils are arranged at intervals.
2. The inductive device of claim 1, wherein the first and second coils are disposed adjacent to the first end of the first sub-trace, and wherein the third and fourth coils are disposed adjacent to the second end of the first sub-trace.
3. The inductive device of claim 2, wherein the third sub-trace includes a plurality of fifth loops, the fourth sub-trace includes a plurality of sixth loops, wherein the plurality of fifth loops are spaced apart from the plurality of sixth loops, wherein the third sub-trace further includes a plurality of seventh loops, and the fourth sub-trace further includes a plurality of eighth loops, wherein the plurality of seventh loops are spaced apart from the plurality of eighth loops.
4. The inductive device of claim 3, wherein the fifth coils and the sixth coils are disposed adjacent to the first end of the third sub-trace, wherein the seventh coils and the eighth coils are disposed adjacent to the second end of the third sub-trace.
5. The inductive device of claim 4, further comprising:
a third trace, disposed on a first side of the inductive device and disposed on an inner side of the inductive device together with the first trace, wherein the third trace is coupled to one of the at least two sub-traces of the second trace; and
a fourth trace disposed on a second side of the inductive device and disposed on an inner side of the inductive device, wherein the fourth trace is coupled to one of the at least two sub-traces of the first trace.
6. The inductive device of claim 5, further comprising:
a fifth trace disposed on the first side of the inductive device and outside the inductive device together with the first trace, wherein the fifth trace is coupled to one of the at least two sub-traces of the second trace; and
a sixth trace, disposed on the second side of the inductive device and outside the inductive device together with the second trace, wherein the sixth trace is coupled to one of the at least two sub-traces of the first trace.
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CN106571216A (en) * | 2015-10-06 | 2017-04-19 | 乾坤科技股份有限公司 | Apparatus of coupled inductors |
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DE102007027612B4 (en) * | 2007-06-12 | 2009-04-02 | Atmel Duisburg Gmbh | Monolithic integrated inductance |
CN101685704B (en) * | 2008-09-26 | 2011-12-07 | 财团法人工业技术研究院 | Transformer and structure thereof as well as power amplifier |
US8842410B2 (en) * | 2009-08-31 | 2014-09-23 | Qualcomm Incorporated | Switchable inductor network |
CN108028248B (en) * | 2015-07-17 | 2020-12-25 | 无锡中感微电子股份有限公司 | Integrated circuit with low common mode coupling effect |
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TWI722952B (en) | 2021-03-21 |
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