TWI720661B - Testing device for packaged integrated circuit and automation testing equipment - Google Patents

Abstract

The present disclosure provides a test device for a packaged integrated circuit and an automation testing equipment. The test device includes a chamber, a socket, and an arm. The chamber includes a first portion and a second portion. The socket is disposed at the first portion of the chamber for carrying a packaged integrated circuit. The packaged integrated circuit is configured to emit a wireless signal. The arm is coupled to the second portion of the chamber for picking, placing, and transferring the packaged integrated circuit. The second portion of the chamber is moved relative to the first portion by a movement of the arm such that an interior of the chamber is in a sealed state or an open state.

Description

Test equipment and automated test equipment for packaging integrated circuits

The present disclosure relates to an integrated circuit with antenna in package (AiP IC) test device, and more particularly to a test device and automated test equipment that can measure the wireless signal emitted by the AiP IC.

Please refer to FIG. 1, which shows a schematic cross-sectional view of a testing device 10 of a conventional packaged integrated circuit 1. The test device 10 includes a carrier board 11 and a test base 12. The test base 12 is disposed on the carrier board 11 and includes an insulating base 121 and a plurality of pogo pins 122, wherein the plurality of pogo pins 122 are disposed between the carrier board 11 and the insulating base 121. The testing device 10 is suitable for measuring the packaged integrated circuit 1 packaged in a traditional way, and it does not have the function of transmitting wireless signals. The traditional measurement method of the packaged integrated circuit 1 is to place a single packaged integrated circuit 1 on the insulating base 121, and realize the signal transmission between the carrier board 11 and the packaged integrated circuit 1 through the spring pins 122 , To measure the electrical characteristics of the package integrated circuit 1, and then obtain the pin signal of the package integrated circuit 1.

However, as electronic products develop toward precision and multi-function, the structure of integrated circuits used in electronic products also tends to be complicated. In particular, integrated circuits have become increasingly complex after using antenna in package (AiP) technology. However, the conventional testing device 10 of the packaged integrated circuit 1 lacks the necessary structure for measuring wireless signals, so the conventional electrical contact measurement method is no longer adequate. In addition, the traditional measurement method of the packaged integrated circuit 1 relies on manual methods to pick and place the packaged integrated circuit 1 to be tested, which results in low production efficiency and is not conducive to mass production.

In view of this, it is necessary to provide a test device for a packaged integrated circuit capable of transmitting wireless signals and an automated test equipment with the test device to solve the problems in the prior art.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a testing device and automated testing equipment that can test the wireless signal emitted by an integrated circuit (IC).

In order to achieve the above object, the present disclosure provides a test device for packaged integrated circuit, which includes: a cavity including a first part and a second part; a test seat arranged on the first part of the cavity, and Carrying a packaged integrated circuit, where the packaged integrated circuit is used to transmit a wireless signal; and an arm, connected to the second part of the cavity, for picking up and transferring the packaged integrated circuit, wherein The movement of the arm drives the second part of the cavity to move relative to the first part, so that the inside of the cavity is in a closed state or an open state.

In a preferred embodiment, the test device further includes: a receiving element disposed opposite to the test base for receiving the wireless signal transmitted by the package integrated circuit and generating an intermediate signal according to the wireless signal; and a The analysis instrument is arranged outside the cavity and is electrically connected to the test base and the receiving element for receiving the intermediate signal and generating a test result according to the intermediate signal.

In a preferred embodiment, the receiving element includes a standard integrated circuit, and the standard integrated circuit and the package integrated circuit are produced by the same manufacturing process.

In a preferred embodiment, the arm includes a hollow shell, and the thickness of the shell wall of the hollow shell is less than 1 cm.

In a preferred embodiment, the arm penetrates through the second part from one side of the second part of the cavity and extends to the other side of the second part.

The present disclosure also provides an automated test equipment for packaged integrated circuits, including: a feeding device for providing a plurality of packaged integrated circuits; and a testing device, adjacent to the feeding device, including: a cavity, It includes a first part and a second part; a test socket, arranged on the first part of the cavity, for carrying one of the plurality of packaged integrated circuits, wherein the packaged integrated circuit is used for emitting a A wireless signal; and an arm connected to the second part of the cavity for moving between the feeding device and the test base to pick up and transfer one of the plurality of packaged integrated circuits, and The movement of the arm drives the second part of the cavity to move relative to the first part of the cavity, so that the inside of the cavity is in a closed state or an open state.

In a preferred embodiment, the arm includes a hollow shell, and the thickness of the shell wall of the hollow shell is less than 1 cm.

In a preferred embodiment, the arm penetrates through the second part from one side of the second part of the cavity and extends to the other side of the second part.

In a preferred embodiment, the test device further includes: a receiving element disposed opposite to the test base for receiving the wireless signal transmitted by the package integrated circuit and generating an intermediate signal according to the wireless signal; and a The analysis instrument is arranged outside the cavity and is electrically connected to the test base and the receiving element for receiving the intermediate signal and generating a test result according to the intermediate signal.

In a preferred embodiment, the receiving element includes a standard integrated circuit, and the standard integrated circuit and the package integrated circuit are produced by the same manufacturing process.

Compared with the prior art, the embodiment of the present disclosure uses the design of a detachable cavity and a movable arm to create an environment that can be used to test the wireless signal emitted by a packaged integrated circuit and realize the effect of automated testing. In addition, with the IC-to-IC transceiver design, the structure and manufacturing cost of the test device can be simplified.

In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

Please refer to Figures 2 and 3. Figure 2 shows a schematic cross-sectional view of the cavity 210 of the testing device 20 of the preferred embodiment of the present disclosure in an open state, and Figure 3 shows the testing of the preferred embodiment of the present disclosure A schematic cross-sectional view of the cavity 210 of the device 20 in a closed state. The test device 20 is suitable for measuring the wireless signals emitted by the packaged integrated circuit 3 that comply with any wireless standard or protocol, including but not limited to WiFi (IEEE802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long-term evolution technology (long term evolution, LTE), EV-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and are specified as 3G, 4G, 5G, and any other wireless Signal of agreement. The packaged integrated circuit 3 is, for example, an integrated circuit with antenna in package (AiP IC).

As shown in FIGS. 2 and 3, the test device 20 includes a cavity 210, a base 220, a carrier 230, a test base 240, a receiving element 250, an arm 260, and an analysis instrument 270. The cavity 210 includes a first part 211 and a second part 212, and the first part 211 and the second part 212 can move relative to each other, so that the inside of the cavity 210 is open (as shown in Figure 2) or airtight Status (as shown in Figure 3).

As shown in Figures 2 and 3, the base 220, the carrier board 230, the test socket 240, and the receiving element 250 are all arranged in the first part 211 of the cavity 210, and the arm 260 is connected to the second part 212 of the cavity 210 . In addition, the analysis instrument 270 is installed on the outside of the cavity 210. Specifically, the first portion 211 of the cavity 210 includes a first inner surface and a second inner surface opposite to each other. The base 220 is fixed on the first inner surface of the first part 211, and the base 220 is electrically connected to the analysis instrument 270 through the first wire 281. For example, the first wire 281 may penetrate through the cavity 210 from the inside of the cavity 210 and extend to the outside of the cavity 210. Optionally, the first wire 281 may have a multi-segment structure, and the wall surface of the cavity 210 is provided with a corresponding plug interface, so that the segments of the first wire 281 are connected by the plug interface, thereby realizing the first wire 281 is electrically connected to the analysis instrument 270. The carrier board 230 is disposed on the base 220 and is electrically connected to the base 220. Preferably, the carrier board 230 includes a circuit board and an interposer formed on the circuit board. In addition, both the carrier board 230 and the base 220 are designed with corresponding signal traces. The test seat 240 includes an insulating base 241 and a plurality of pogo pins 242, wherein the insulating base 241 is fixed on the carrier board 230, and the pogo pins 242 are aligned with corresponding elements (such as contact pads) of the carrier board 230. The receiving element 250 is disposed on the second inner surface of the first part 211 of the cavity 210. The receiving element 250 is electrically connected to the analysis instrument 270 through a second wire 282, wherein the second wire 282 can adopt the same or similar wiring design as the first wire 281.

As shown in Figures 2 and 3, the arm 260 is used to pick, place, and transfer the packaged integrated circuit 3 to place the packaged integrated circuit 3 on the test base 240, or to remove the packaged product on the test base 240. Body circuit 3. Specifically, the arm 260 connected to the second part 212 of the cavity 210 can move relative to the first part 211 of the cavity 210, so that the movement of the arm 260 drives the second part 212 of the cavity 210 relative to the first part 211. 211 moves. It should be understood that the arm 260 includes various elements such as a base, a rotating arm, a hook, a sensor, a controller, and a driver to realize various movements of the arm 260 (for example, rotation, lateral movement, lifting, etc.). In addition, a fixing element is provided at one end of the arm 260 to hold the package integrated circuit 3 thereon. For example, the fixing element can be a clamping jaw, a vacuum chuck, or the like.

As shown in FIG. 2, when the arm 260 is transferring the packaged integrated circuit 3, the cavity 210 is in an open state. And, as shown in FIG. 3, after the arm 260 obtains a packaged integrated circuit 3 to be tested, the arm 260 moves toward the first part 211 of the cavity 210 to place the packaged integrated circuit 3 on the test base 240 . The packaged integrated circuit 3 is in contact with one end of each spring pin 122 of the test socket 240. When the arm 260 moves to a fixed point, the first part 211 and the second part 212 of the cavity 210 are closely attached to each other, so that the inside of the cavity 210 is in a sealed state. It should be noted that when the cavity 210 is in a closed state, the cavity 210 can be used as a dark room (chamber) of an over-the-air (OTA) system. For example, the cavity 210 is provided with a wave absorbing material, and when the cavity 210 is in a sealed state, a complete and non-reflective measurement space is formed inside the cavity 210. Optionally, the joint of the first part 211 and the second part 212 of the cavity 210 is provided with an appropriate airtight element, such as a gasket, an airtight ring, and the like. Or, the joint of the first part 211 and the second part 212 is made of soft material, but it is not limited to this.

As shown in Figure 3, when the arm 260 moves to a fixed point, the arm 260 will exert downward pressure on the package integrated circuit 3, so that the pogo pin 242 of the test seat 240 will be transformed from the initial state to the compressed state, thereby making each spring One end of the pin 242 is in electrical contact with a corresponding element (such as a contact pad) on the carrier board 230. Therefore, both ends of the pogo pin 242 are electrically connected to the package integrated circuit 3 and the carrier board 230, respectively. During the test, the analysis instrument 270 sends out a test signal 31. The test signal 31 is transmitted to the base 220 along the first wire 281. Then, the base 220 transmits the test signal 31 to the package integrated circuit 3 via the carrier 230 and the test socket 240 in sequence. The packaged integrated circuit 3 emits a wireless signal 32 according to the test signal 31, such as a millimeter wave (mmWAVE) radio frequency signal. The receiving component 250 receives the wireless signal 32 and generates an intermediate signal 33 according to the wireless signal 32. Then, the intermediate signal 33 is transmitted to the analysis instrument 270 via the second wire 282. Finally, the analysis instrument 270 receives the intermediate signal 33 and generates a test result according to the intermediate signal 33.

It should be noted that in this embodiment, the receiving element 250 includes a standard integrated circuit (golden IC), and the standard integrated circuit and the package integrated circuit 3 to be tested are produced by the same manufacturing process. The standard integrated circuit is selected from the integrated circuit whose electrical characteristics all meet the specifications. The present disclosure can simplify the structure and manufacturing cost of the test device 20 through the IC-to-IC transceiver design. In detail, theoretically, the standard integrated circuit and the packaged integrated circuit 3 have the same signal transmitting and receiving capabilities, so the configuration of IC to IC is equivalent to that the packaged integrated circuit 3 is sending and receiving signals spontaneously. In other words, the theoretical value of the wireless signal 32 that should be emitted by the package integrated circuit 3 can be calculated in advance by the value of the test signal 31 emitted by the analysis instrument 270. It should be understood that there is a certain path loss during signal transmission, so the theoretical energy value can be subtracted from the path loss to obtain a predetermined energy value, which is equivalent to the value that a standard integrated circuit should receive. Therefore, the standard integrated circuit can generate a comparison result (ie, the intermediate signal 33) by comparing the predetermined energy value with the actual energy value of the received wireless signal 32 by its internal processor. The intermediate signal 33 carries information on whether the predetermined energy value is the same as the actual energy value of the wireless signal 32 (for example, represented by 0 or 1). Thereby, the analysis instrument 270 can generate a test result of whether the packaged integrated circuit 3 meets the specification according to the intermediate signal 33. In contrast, traditional OTA systems use antennas and reflectors as receiving elements, which require complex calculations and expensive arithmetic instruments, thereby increasing production costs. Furthermore, the design of the receiving element of the conventional technology is complicated, for example, it must meet the requirements of the far and near fields when the antenna sends signals, and realize the conversion between spherical waves and plane waves. In addition, the signal received by the antenna needs to be transmitted to the measuring instrument for a series of complex analysis and calculations, and finally the test result can be obtained. Therefore, the traditional testing device has disadvantages such as difficulty in structure setting, complicated calculation, and high manufacturing cost.

As shown in FIG. 3, since the wireless signal 32 passes through the arm 260 to reach the receiving element 250 on the other side, the arm 260 preferably adopts a low-loss structure and material. In this embodiment, the arm 260 includes a hollow shell 261, and the thickness of the shell wall of the hollow shell 261 is less than 1 cm. Moreover, the material of the hollow shell 261 is preferably Teflon. With this design, the path loss caused by the arm 260 to the wireless signal can be greatly reduced.

Please refer to FIG. 4, which shows a schematic cross-sectional view of the automated test equipment 40 of the preferred embodiment of the present disclosure. The automated test equipment 40 includes a test device 20 and a feeding device 41. The structure of the testing device 20 is as described above, and will not be repeated here. The feeding device 41 is adjacent to the testing device 20. The feeding device 41 is used to provide a plurality of packaged integrated circuits 3 to be tested. Optionally, the feeding device 41 is a container, a conveyor belt, etc., which can store a plurality of packaged integrated circuits 3, and is not limited thereto. The arm 260 of the testing device 20 moves between the feeding device 41 and the testing base 240 to pick up and transfer one of the plurality of packaged integrated circuits 3. With this design, during mass production, manual replacement of the packaged integrated circuit 3 is not required, and automated measurement can be realized by the action of the arm, thereby improving production efficiency.

In summary, the test device of the embodiment of the present disclosure uses the design of a detachable cavity and a movable arm to create an environment that can be used to test the wireless signals emitted by the packaged integrated circuit and realize the effect of automatic testing. In addition, with the IC-to-IC transceiver design, the structure and manufacturing cost of the test device can be simplified.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

10, 20: test device 210: Cavity 211: Part One 212: The second part 220: Pedestal 11, 230: carrier board 12.240: Test seat 121, 241: insulating base 122, 242: pogo pin 250: receiving component 260: arm 261: Hollow shell 270: Analytical Instruments 281: first wire 282: second wire 3: Package integrated circuit 31: Test signal 32: wireless signal 33: Intermediate signal 40: automated test equipment 41: Feeding device

Figure 1 shows a schematic cross-sectional view of a conventional packaged integrated circuit testing device; Figure 2 shows a schematic cross-sectional view of the cavity of the testing device of the preferred embodiment of the present disclosure in an open state; Figure 3 shows a schematic cross-sectional view of the cavity of the testing device of the preferred embodiment of the present disclosure in a sealed state; and Figure 4 shows a schematic cross-sectional view of the automated test equipment of the preferred embodiment of the present disclosure.

20: Test device

210: Cavity

211: Part One

212: The second part

220: Pedestal

230: carrier board

240: test seat

250: receiving component

260: arm

261: Hollow shell

270: Analytical Instruments

281: first wire

282: second wire

3: Package integrated circuit

31: Test signal

32: wireless signal

33: Intermediate signal

Claims (10)

A testing device for a packaged integrated circuit, comprising: a cavity, including a first part and a second part; a test seat, arranged on the first part of the cavity, for carrying a packaged integrated circuit, The packaged integrated circuit is used to transmit a wireless signal; and an arm is connected to the second part of the cavity for picking, placing and transferring the packaged integrated circuit, wherein one end of the arm is provided with a fixing element to The package integrated circuit is held on it, and the second part of the cavity is moved relative to the first part by the movement of the arm, so that the inside of the cavity is in a closed state or an open state . For example, the test device of the packaged integrated circuit of claim 1, wherein the test device further comprises: a receiving element, which is arranged opposite to the test base, for receiving the wireless signal transmitted by the packaged integrated circuit and generating it according to the wireless signal An intermediate signal; and an analysis instrument, arranged outside the cavity and electrically connected to the test base and the receiving element, for receiving the intermediate signal and generating a test result according to the intermediate signal. For example, the test device for a packaged integrated circuit of claim 2, wherein the receiving element includes a standard integrated circuit, and the standard integrated circuit and the packaged integrated circuit are produced by the same manufacturing process. For example, the test device for packaged integrated circuit of claim 1, wherein the arm includes a hollow shell, and the thickness of the shell wall of the hollow shell is less than 1 cm. The test device for a packaged integrated circuit according to claim 1, wherein the arm penetrates through the second part from one side of the second part of the cavity and extends to the other side of the second part. An automated test equipment for packaged integrated circuits, comprising: a feeding device for providing a plurality of packaged integrated circuits; and A test device, adjacent to the feeding device, includes: a cavity including a first part and a second part; a test seat, which is arranged on the first part of the cavity, and is used to carry one of them The plurality of packaged integrated circuits, wherein the packaged integrated circuit is used for transmitting a wireless signal; and an arm connected to the second part of the cavity for moving between the feeding device and the test base To pick, place and transfer one of the plurality of packaged integrated circuits, and drive the second part of the cavity to move relative to the first part of the cavity by the movement of the arm, so that the cavity The inside is a closed state or an open state. For example, the automated test equipment for packaged integrated circuit of claim 6, wherein the arm includes a hollow shell, and the thickness of the shell wall of the hollow shell is less than 1 cm. According to claim 6, the automated test equipment for packaged integrated circuits, wherein the arm penetrates through the second part from one side of the second part of the cavity and extends to the other side of the second part. For example, the automated test equipment of the packaged integrated circuit of claim 6, wherein the test device further includes: a receiving element, which is arranged opposite to the test base, for receiving the wireless signal transmitted by the packaged integrated circuit and based on the wireless signal An intermediate signal is generated; and an analysis instrument is arranged outside the cavity and is electrically connected to the test base and the receiving element for receiving the intermediate signal and generating a test result according to the intermediate signal. For example, the automated test equipment for packaged integrated circuit of claim 9, wherein the receiving element includes a standard integrated circuit, and the standard integrated circuit and the packaged integrated circuit are produced by the same manufacturing process.

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