TWM595886U - Testing device for packaged integrated circuit and automation testing equipment - Google Patents

Abstract

The present disclosure provides a test device and automated test equipment for packaging integrated circuits. The test device includes a circuit board, a plurality of receiving elements, and a reflective sheet. The circuit board includes a placement area, wherein the placement area is configured to place a packaged integrated circuit. A plurality of receiving elements are provided on the circuit board. The reflective sheet is opposed to the circuit board and arranged at a distance from each other. The present disclosure simplifies the structure of the test device, realizes automatic measurement, and can replace the traditional high price by integrating the placement area for placing the packaged integrated circuit and the plurality of receiving elements on the circuit board And complex measuring instruments.

Description

Test device and automatic test equipment for packaging integrated circuits

The present disclosure relates to a testing device for packaging integrated circuits, and in particular to a testing device and automated testing equipment capable of measuring wireless signals emitted by packaging integrated circuits.

Nowadays, the testing of packaged integrated circuits (ICs) uses SMA high-frequency cable connectors (SMA connectors) and coaxial cables (coaxial cables) to connect the load board and automatic test equipment (automatic) in the circuit board. test equipment, ATE) connection. Moreover, the packaged IC is electrically connected to the load board via a test socket (socket) to test and analyze the performance of the packaged IC with automatic test equipment. In addition, a test device for a circuit board with a test circuit is currently developed by connecting a packaged IC to the circuit board and then controlling the packaged IC to send a strong signal. The strong signal is sent back to the packaged IC through the test circuit of the circuit board. Since the strong signal will be lost after passing through the test loop, the signal returned to the packaged IC is a weak signal. With this design, the signal receiving sensitivity of the packaged IC can be directly tested. The above-mentioned traditional testing methods all use wired methods to transmit signals. Specifically, the signal transmission path is sent from the packaged IC and then transmitted to the load board through the test socket. However, when the traditional test device transmits high-frequency signals, the wired signal transmission method will cause high-frequency signals to be severely attenuated at locations where impedance control is not easy (such as the through holes of the circuit board or the pins of the test base), which in turn causes The high frequency signal is distorted and cannot be measured.

On the other hand, with the development of electronic products towards precision and multi-functionalization, the IC structure used in electronic products also tends to be complicated. For example, an IC using antenna in package (AiP) technology has the ability to send and receive wireless signals. Therefore, the existing wired measurement method is insufficient. In addition, the traditional packaging IC measurement method relies on manual picking and placing of the packaged IC to be tested, which results in low production efficiency and is not conducive to mass production.

In view of this, it is necessary to propose a test device that can measure the wireless signal emitted by the packaged IC and an automated test device with the test device to solve the problems in the conventional technology.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a test device and an automated test device that can test the wireless signal emitted by the packaged integrated circuit.

To achieve the above objective, the present disclosure provides a test device for packaging integrated circuits, including: a circuit board, a plurality of receiving elements, and a reflective sheet. The circuit board includes a placement area, wherein the placement area is configured to place a packaged integrated circuit. A plurality of receiving elements are provided on the circuit board. The reflection sheet is opposed to the circuit board and is spaced apart from each other, wherein in response to the packaged integrated circuit being electrically connected to the circuit board, the packaged integrated circuit emits a wireless signal toward the direction of the reflection sheet, and the reflection sheet reflects The wireless signal is directed to the receiving elements.

In a preferred embodiment, the plurality of receiving elements are arranged on the circuit board at equal intervals.

In a preferred embodiment, the plurality of receiving elements are arranged around the placement area of the circuit board.

In a preferred embodiment, the distance between each receiving element and the packaged integrated circuit is equal.

In a preferred embodiment, the plurality of receiving elements are arranged at equal angular intervals from each other in a radial direction penetrating the vertical line of the circuit board.

In a preferred embodiment, the test device includes three of the receiving elements.

The present disclosure also provides an automated testing device for packaging integrated circuits, including: a feeding device, a testing device, and an arm. The feeding device is configured to provide a plurality of packaged integrated circuits. The testing device, which is arranged downstream of the feeding device, includes: a circuit board, a plurality of receiving elements, and a reflective sheet. The circuit board includes a placement area, wherein the placement area is configured to place one of the packaged integrated circuits. A plurality of receiving elements are provided on the circuit board. The reflective sheet is opposed to the circuit board and arranged at a distance from each other. The arm is configured to be movable between the feeding device and the circuit board of the test device to pick and place and transfer one of the plurality of packaged integrated circuits, wherein the packaged integrated circuit and the The circuit board is electrically connected, the packaged integrated circuit emits a wireless signal toward the direction of the reflective sheet, and the reflective sheet reflects the wireless signal to guide it to the plurality of receiving elements.

In a preferred embodiment, the plurality of receiving elements are arranged on the circuit board at equal intervals.

In a preferred embodiment, the plurality of receiving elements are arranged around the placement area of the circuit board.

In a preferred embodiment, the distance between each receiving element and the packaged integrated circuit is equal.

In a preferred embodiment, the plurality of receiving elements are arranged at equal angular intervals from each other in a radial direction penetrating the vertical line of the circuit board.

In a preferred embodiment, the test device includes three of the receiving elements.

Compared with the prior art, the present disclosure simplifies the structure of the test device, realizes automatic measurement, and can replace the traditional by integrating the placement area for placing the packaged integrated circuit and placing a plurality of receiving elements on the circuit board High-cost and complex measuring instruments to reduce the cost of measurement.

In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more obvious and understandable, the preferred embodiments of the present disclosure will be specifically described below, and in conjunction with the accompanying drawings, detailed descriptions are as follows.

Please refer to FIG. 1 and FIG. 2, FIG. 1 shows a schematic diagram of the test device 10 of the packaged integrated circuit 9 according to the preferred embodiment of the present disclosure. The packaged integrated circuit 9 is, for example, an integrated circuit with antenna in package (AiP IC). The test device 10 is suitable for measuring wireless signals sent by the package integrated circuit 9 that conform to any wireless standard or protocol, including but not limited to WiFi (IEEE802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long-term evolution technology (long term evolution, LTE), EV-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and 3G, 4G, 5G, and any other wireless The signal of the agreement.

As shown in FIG. 1, the test device 10 includes a circuit board 110, a reflective sheet 120, and a plurality of receiving elements 130. The circuit board 110 includes a placement area 111 configured to place the packaged integrated circuit 9. The reflective sheet 120 is opposed to the circuit board 110 and is spaced apart from each other. A plurality of receiving elements 130 are disposed on the circuit board 130 and adjacent to the placement area 111. It should be noted that the distance between the reflective sheet 120 and the circuit board 110 is determined according to the environmental signal reflection capability and the signal transmission and reception paths. It should be understood that the reflective sheet 120 and the circuit board 110 can be fixed in specific positions by suitable bases and fixing members, but not limited thereto.

As shown in FIG. 1, during the test, the packaged integrated circuit 9 is first placed in the placement area 111 of the circuit board 110 and electrically connected to the circuit board 110. Next, the test device 10 receives the test signal sent by the external instrument and transmits it to the circuit board 110. The circuit board 110 transmits the test signal to the packaged integrated circuit 9. The signal transmitting unit 91 encapsulating the integrated circuit 9 emits a wireless signal 32 according to the test signal, such as a millimeter wave (mmWAVE) radio frequency signal. It should be noted that, in the present disclosure, since the circuit board 110 and the reflective sheet 120 are oppositely arranged, the wireless signal will be transmitted toward the reflective sheet 120 to reach the reflective sheet 120. After that, the reflective sheet 120 reflects the wireless signal to guide it to the positions of the plurality of receiving elements 130. The receiving element 130 receives the reflected wireless signal, and feeds back the received result to an external device. Finally, the external device generates a test result according to the signal fed back by the receiving element 130.

It should be noted that in the present disclosure, by using a plurality of receiving elements 130, the wireless signal emitted by the package integrated circuit 9 can be easily tested to reflect the strongest position at different phase angle signals after reflection. That is to say, after the wireless signal transmitted by the package integrated circuit 9 is reflected by the reflection sheet 120 and received by the plurality of receiving elements 130, the reception signal from the plurality of receiving elements 130 can know the transmitting capability of the package integrated circuit 9. Therefore, the present disclosure can replace the traditional high-cost and complicated automatic test equipment (ATE) measuring instruments by the design of the plurality of receiving elements 130 to reduce the measurement cost.

Please refer to FIG. 2, which shows a top view of the circuit board 110 and the plurality of receiving elements 130 of the test device 10 of FIG. 1. In this embodiment, the number of receiving elements 130 is three, that is, the first receiving element 131, the second receiving element 132, and the third receiving element 133. In addition, three receiving elements 130 are arranged around the placement area 111 of the circuit board 110. In the present disclosure, by designing the three receiving elements 130 and the placement area 111 for placing the packaged integrated circuit 9 on the same circuit board 110, the manufacturing difficulty and manufacturing cost can be reduced.

Preferably, as shown in FIG. 2, the three receiving elements 130 are arranged on the circuit board 110 at equal intervals. Specifically, the three receiving elements 130 are arranged at equal angular intervals from each other in a radial direction penetrating the vertical line of the circuit board 110. That is, the angle between the first receiving element 132 and second receiving element 131 Θ1 is 120 degrees, the angle between the receiving member 133 of the second 132 and the third receiving element Θ2 is 120 degrees, and a first receiving element 131 and the The angle Θ3 between the three receiving elements 133 is 120 degrees. Moreover, preferably, the distance between each receiving element 130 and the package integrated circuit 9 is equal. The symmetrical or equidistant arrangement design of the three receiving elements 130 can greatly improve the testing performance of the testing device 10.

Please refer to FIG. 3, which shows a schematic cross-sectional view of an automated testing device 1 according to a preferred embodiment of the present disclosure. The automated testing apparatus 1 includes a testing device 10, a feeding device 20, and an arm 30. The structure of the test device 10 is as described above and will not be repeated here. The feeding device 20 is adjacent to the testing device 10, and the testing device 10 is provided downstream of the feeding device 20. The feeding device 20 is used to provide a plurality of packaged integrated circuits 9 to be tested. Optionally, the feeding device 20 is a container box, a conveyor belt, etc. that can store a plurality of packaged integrated circuits 9, and is not limited thereto. The arm 30 can move between the feeding device 20 and the circuit board 110 of the testing device 10 to pick and place and transfer one of the plurality of packaged integrated circuits 9. It should be understood that the arm 30 includes various elements such as a base, a rotating arm, a hook, a sensor, a controller, a driver, etc. to realize various movements of the arm 30 (for example, rotation, lateral movement, lifting, etc.). Also, one end of the arm 30 is provided with a fixing element to hold the packaged integrated circuit 9 thereon. For example, the fixing element may be a clamping jaw, a vacuum suction cup, or the like. With this design, since the present disclosure integrates the placement area 111 for placing the packaged integrated circuit 9 and the plurality of receiving elements 130 on the circuit board 110, the space above the packaged integrated circuit 9 can be released, which is conducive to mass production The automatic operation of the arm 30 replaces the manual replacement of the packaged integrated circuit 9 to realize automatic measurement, thereby reducing test time and improving production efficiency.

In summary, in this disclosure, the placement area for placing the packaged integrated circuit and the plurality of receiving elements are integrated on the circuit board, which can simplify the structure of the test device, realize automated measurement, and can replace the traditional High-cost and complex measuring instruments to reduce the cost of measurement.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, a number of improvements and retouchings can be made, and these improvements and retouchings should also be regarded as the present disclosure. protected range.

1: automated test equipment 10: test device 110: circuit board 111: placement area 120: reflective sheet 130: receiving element 131: first receiving element 132: second receiving element 133: third receiving element 20: feeding device 30: arm 9: packaging an integrated circuit 91: signal transmitting unit Θ1, Θ2, Θ3: angle

FIG. 1 shows a schematic diagram of a test device for packaging integrated circuits according to a preferred embodiment of the present disclosure; Figure 2 shows a top view of the circuit board and a plurality of receiving elements of the test device of Figure 1; and FIG. 3 shows a schematic diagram of the automated testing equipment of the preferred embodiment of the present disclosure.

10: Test device

110: circuit board

111: Placement area

120: reflector

130: receiving element

131: The first receiving element

132: Second receiving element

9: Package integrated circuit

91: Signal transmission unit

Claims (12)

A test device for packaging integrated circuits, including: A circuit board including a placement area, wherein the placement area is configured to place a packaged integrated circuit; A plurality of receiving elements are provided on the circuit board; and A reflection sheet, which is opposite to the circuit board and arranged at a distance from each other, wherein in response to the packaged integrated circuit being electrically connected to the circuit board, the packaged integrated circuit emits a wireless signal toward the direction of the reflection sheet, and the reflection The sheet reflects the wireless signal to direct it to the plurality of receiving elements. A test device for packaging integrated circuits as claimed in claim 1, wherein the plurality of receiving elements are arranged on the circuit board at equal intervals. A test device for packaging an integrated circuit according to claim 1, wherein the plurality of receiving elements are circumferentially arranged around the placement area of the circuit board. As in the test device for the packaged integrated circuit of claim 1, the distance between each of the receiving elements and the packaged integrated circuit is equal. The test device for a packaged integrated circuit according to claim 1, wherein the plurality of receiving elements are arranged at equal angular intervals from each other in a radial direction penetrating the vertical line of the circuit board. The test device for packaging an integrated circuit according to claim 1, wherein the test device includes three of the receiving elements. An automatic test equipment for packaging integrated circuits, including: A feeding device, configured to provide a plurality of packaged integrated circuits; A testing device, which is arranged downstream of the feeding device and includes: A circuit board including a placement area, wherein the placement area is configured to place one of the packaged integrated circuits; A plurality of receiving elements are provided on the circuit board; and A reflective sheet that is opposite to the circuit board and spaced apart from each other; and An arm configured to be movable between the feeding device and the circuit board of the test device to pick and place and transfer one of the plurality of packaged integrated circuits, wherein the packaged integrated circuit is responsive to one of them Electrically connected to the circuit board, the packaged integrated circuit emits a wireless signal toward the reflective sheet, and the reflective sheet reflects the wireless signal to direct it to the plurality of receiving elements. The automatic test equipment for packaging an integrated circuit according to claim 7, wherein the plurality of receiving elements are arranged on the circuit board at equal intervals. The automatic test equipment for packaging an integrated circuit according to claim 7, wherein the plurality of receiving elements are circumferentially arranged around the placement area of the circuit board. For example, in the automated test equipment for packaged integrated circuits of claim 7, the distance between each of the receiving elements and the packaged integrated circuits is equal. An automatic test equipment for packaging integrated circuits as claimed in claim 7, wherein the plurality of receiving elements are arranged at equal angular intervals from each other in a radial direction penetrating a vertical line of the circuit board. The automatic test equipment for packaging integrated circuits according to claim 7, wherein the test device includes three of the receiving elements.

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