TWI718599B - Communication device - Google Patents

Communication device Download PDF

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TWI718599B
TWI718599B TW108126078A TW108126078A TWI718599B TW I718599 B TWI718599 B TW I718599B TW 108126078 A TW108126078 A TW 108126078A TW 108126078 A TW108126078 A TW 108126078A TW I718599 B TWI718599 B TW I718599B
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Taiwan
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communication device
device described
band gap
item
scope
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TW108126078A
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Chinese (zh)
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TW202105832A (en
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黃傑超
陳彥廷
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台達電子工業股份有限公司
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Priority to CN202010086565.1A priority patent/CN112310617B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems

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  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

A communication device includes a ground plane, an antenna array, and an EBG (Electromagnetic Band Gap) structure. The antenna array includes a plurality of antenna elements. The EBG structure includes a plurality of EBG units. The EBG units are coupled to the ground plane. The antenna array is surrounded by the EBG structure. The EBG structure is configured to suppress the front-to-back ratio of the radiation efficiency of the antenna array.

Description

通訊裝置Communication device

本發明係關於一種通訊裝置,特別係關於一種可降低天線陣列(Antenna Array)之輻射場型(Radiation Pattern)之前後比(Front-to-Back Ratio)之通訊裝置。The present invention relates to a communication device, and more particularly to a communication device that can reduce the front-to-back ratio of the radiation pattern of the antenna array.

隨著行動通訊技術的發達,行動裝置在近年日益普遍,常見的例如:手提式電腦、行動電話、多媒體播放器以及其他混合功能的攜帶型電子裝置。為了滿足人們的需求,行動裝置通常具有無線通訊的功能。有些涵蓋長距離的無線通訊範圍,例如:行動電話使用2G、3G、LTE(Long Term Evolution)系統及其所使用700MHz、850 MHz、900MHz、1800MHz、1900MHz、2100MHz、2300MHz以及2500MHz的頻帶進行通訊,而有些則涵蓋短距離的無線通訊範圍,例如:Wi-Fi、Bluetooth系統使用2.4GHz、5.2GHz和5.8GHz的頻帶進行通訊。With the development of mobile communication technology, mobile devices have become more and more common in recent years, such as portable computers, mobile phones, multimedia players and other portable electronic devices with mixed functions. In order to meet people's needs, mobile devices usually have wireless communication functions. Some cover long-distance wireless communication ranges. For example, mobile phones use 2G, 3G, LTE (Long Term Evolution) systems and their use of 700MHz, 850 MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz, and 2500MHz frequency bands for communication. Some cover short-distance wireless communication ranges, for example: Wi-Fi, Bluetooth systems use 2.4GHz, 5.2GHz and 5.8GHz frequency bands for communication.

天線(Antenna)是使行動裝置能高速上網之必要元件。在進入下一通訊世代後,支援5G之天線陣列(Antenna Array)常面臨二大困境,一是較短之通訊距離(Communication Distance),二是較差之空間效率(Spatial Efficiency),其皆導因於天線元件之間之隔離度(Isolation)太低且天線陣列之輻射場型之前後比太高。有鑑於此,勢必要提出一種全新之解決方案,以克服先前技術所面臨之問題。Antenna is a necessary element for mobile devices to surf the Internet at a high speed. After entering the next generation of communications, 5G-supporting antenna arrays often face two major dilemmas, one is the short communication distance (Communication Distance), and the other is the poor spatial efficiency (Spatial Efficiency), both of which are caused by The isolation between the antenna elements is too low and the front-to-back ratio of the radiation pattern of the antenna array is too high. In view of this, it is necessary to propose a new solution to overcome the problems faced by the prior art.

在較佳實施例中,本發明提供一種通訊裝置,包括:一接地面;一天線陣列,包括複數個天線元件;以及一電磁帶隙結構,包括複數個電磁帶隙單元,其中該等電磁帶隙單元皆耦接至該接地面;其中該天線陣列係由該電磁帶隙結構所包圍。In a preferred embodiment, the present invention provides a communication device including: a ground plane; an antenna array including a plurality of antenna elements; and an electromagnetic band gap structure including a plurality of electromagnetic band gap units, wherein the electromagnetic bands The gap units are all coupled to the ground plane; wherein the antenna array is surrounded by the electromagnetic band gap structure.

在一些實施例中,該電磁帶隙結構係用於抑制該天線陣列之輻射場型之前後比。In some embodiments, the electromagnetic band gap structure is used to suppress the front-to-back ratio of the radiation pattern of the antenna array.

在一些實施例中,該天線陣列涵蓋介於27GHz至29GHz之間之一操作頻帶。In some embodiments, the antenna array covers an operating frequency band between 27 GHz and 29 GHz.

在一些實施例中,該等天線元件係排列成為一第一對稱圖案。In some embodiments, the antenna elements are arranged in a first symmetrical pattern.

在一些實施例中,該第一對稱圖案係呈現一正方形。In some embodiments, the first symmetrical pattern exhibits a square shape.

在一些實施例中,該等天線元件之每一者各自為一補釘天線。In some embodiments, each of the antenna elements is a patch antenna.

在一些實施例中,該等天線元件之每一者之長度皆大致等於該操作頻帶之0.25倍波長。In some embodiments, the length of each of the antenna elements is approximately equal to 0.25 wavelength of the operating frequency band.

在一些實施例中,該等天線元件之任相鄰二者之間距皆大致等於該操作頻帶之0.5倍波長。In some embodiments, the distance between any adjacent two of the antenna elements is approximately equal to 0.5 times the wavelength of the operating frequency band.

在一些實施例中,該等天線元件之總數量為16。In some embodiments, the total number of the antenna elements is 16.

在一些實施例中,該等電磁帶隙單元係排列成為一第二對稱圖案。In some embodiments, the electromagnetic bandgap units are arranged in a second symmetrical pattern.

在一些實施例中,該第二對稱圖案係呈現一空心正方形。In some embodiments, the second symmetrical pattern presents a hollow square.

在一些實施例中,該第二對稱圖案包括一第一環形和一第二環形,該第二環形係位於該第一環形之內部,而該等天線元件皆位於該第二環形之內部。In some embodiments, the second symmetrical pattern includes a first ring and a second ring, the second ring is located inside the first ring, and the antenna elements are all located inside the second ring .

在一些實施例中,該等電磁帶隙單元之每一者各自呈現一蘑菇形。In some embodiments, each of the electromagnetic bandgap units exhibits a mushroom shape.

在一些實施例中,該等電磁帶隙單元之每一者各自包括一頂面金屬片和一連接金屬柱,而該頂面金屬片係經由該連接金屬柱耦接至該接地面。In some embodiments, each of the electromagnetic bandgap units includes a top metal sheet and a connecting metal pillar, and the top metal sheet is coupled to the ground plane via the connecting metal pillar.

在一些實施例中,該等電磁帶隙單元之每一者之長度皆小於該操作頻帶之0.1倍波長。In some embodiments, the length of each of the electromagnetic bandgap units is less than 0.1 times the wavelength of the operating frequency band.

在一些實施例中,該等電磁帶隙單元之每一者之高度皆小於該操作頻帶之0.1倍波長。In some embodiments, the height of each of the electromagnetic bandgap units is less than 0.1 times the wavelength of the operating frequency band.

在一些實施例中,該等電磁帶隙單元之任相鄰二者之間距皆小於該操作頻帶之0.02倍波長。In some embodiments, the distance between any adjacent two of the electromagnetic band gap units is less than 0.02 wavelength of the operating frequency band.

在一些實施例中,該等天線元件之任一者至該電磁帶隙結構之最短距離皆大於該操作頻帶之0.25倍波長。In some embodiments, the shortest distance from any one of the antenna elements to the electromagnetic band gap structure is greater than 0.25 times the wavelength of the operating frequency band.

在一些實施例中,該等電磁帶隙單元之總數量為184。In some embodiments, the total number of the electromagnetic band gap units is 184.

在一些實施例中,該通訊裝置更包括:一介質基板,設置於該接地面上,其中該等電磁帶隙單元皆穿透過該介質基板。In some embodiments, the communication device further includes: a dielectric substrate disposed on the ground surface, wherein the electromagnetic band gap units all penetrate the dielectric substrate.

為讓本發明之目的、特徵和優點能更明顯易懂,下文特舉出本發明之具體實施例,並配合所附圖式,作詳細說明如下。In order to make the purpose, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are listed below, with the accompanying drawings, and detailed descriptions are as follows.

在說明書及申請專利範圍當中使用了某些詞彙來指稱特定的元件。本領域技術人員應可理解,硬體製造商可能會用不同的名詞來稱呼同一個元件。本說明書及申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及申請專利範圍當中所提及的「包含」及「包括」一詞為開放式的用語,故應解釋成「包含但不僅限定於」。「大致」一詞則是指在可接受的誤差範圍內,本領域技術人員能夠在一定誤差範圍內解決所述技術問題,達到所述基本之技術效果。此外,「耦接」一詞在本說明書中包含任何直接及間接的電性連接手段。因此,若文中描述一第一裝置耦接至一第二裝置,則代表該第一裝置可直接電性連接至該第二裝置,或經由其它裝置或連接手段而間接地電性連接至該第二裝置。In the specification and the scope of patent application, certain words are used to refer to specific elements. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This specification and the scope of patent application do not use differences in names as a way to distinguish elements, but use differences in functions of elements as a criterion for distinguishing. The terms "include" and "include" mentioned in the entire specification and the scope of the patent application are open-ended terms and should be interpreted as "including but not limited to". The term "approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and achieve the basic technical effect. In addition, the term "coupling" includes any direct and indirect electrical connection means in this specification. Therefore, if it is described in the text that a first device is coupled to a second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means. Two devices.

第1圖係顯示根據本發明一實施例所述之通訊裝置100之示意圖。如第1圖所示,通訊裝置100包括一接地面(Ground Plane)110、一天線陣列(Antenna Array)120,以及一電磁帶隙(Electromagnetic Band Gap,EBG)結構130,其皆可用金屬材質製成。天線陣列120包括複數個天線元件(Antenna Element)(未顯示)。該等天線元件之形狀和種類於本發明中並不特別限制。例如,每一天線元件可各自為一補釘天線(Patch Antenna)、一單極天線(Monopole Antenna)、一偶極天線(Dipole Antenna)、一領結天線(Bowtie Antenna)、一迴圈天線(Loop Antenna)、一螺旋天線(Helical Antenna),或是一晶片天線(Chip Antenna),但亦不僅限於此。電磁帶隙結構130包括複數個電磁帶隙單元(未顯示),其中該等電磁帶隙單元皆耦接至接地面110。該等電磁帶隙單元之形狀和種類於本發明中亦不特別限制。必須注意的是,天線陣列120係由電磁帶隙結構130所完全包圍。在此設計下,電磁帶隙結構130可用於抑制天線陣列120之輻射場型(Radiation Pattern)之前後比(Front-to-Back Ratio),從而可有效提升通訊裝置100之通訊距離(Communication Distance)和空間效率(Spatial Efficiency)。另外,雖然未顯示於第1圖中,但通訊裝置100更可包括其他元件,例如:一處理器(Processor)、一供電模組(Power Supply Module),或(且)一外殼(Housing)。FIG. 1 is a schematic diagram of a communication device 100 according to an embodiment of the invention. As shown in Figure 1, the communication device 100 includes a ground plane (Ground Plane) 110, an antenna array (Antenna Array) 120, and an electromagnetic band gap (Electromagnetic Band Gap, EBG) structure 130, all of which can be made of metal materials to make. The antenna array 120 includes a plurality of antenna elements (not shown). The shapes and types of the antenna elements are not particularly limited in the present invention. For example, each antenna element can be a patch antenna, a monopole antenna, a dipole antenna, a bowtie antenna, and a loop antenna. Antenna), a helical antenna (Helical Antenna), or a chip antenna (Chip Antenna), but it is not limited to this. The electromagnetic band gap structure 130 includes a plurality of electromagnetic band gap units (not shown), and the electromagnetic band gap units are all coupled to the ground plane 110. The shapes and types of the electromagnetic bandgap units are not particularly limited in the present invention. It must be noted that the antenna array 120 is completely surrounded by the electromagnetic band gap structure 130. Under this design, the electromagnetic band gap structure 130 can be used to suppress the front-to-back ratio of the radiation pattern of the antenna array 120, thereby effectively increasing the communication distance of the communication device 100. And Spatial Efficiency. In addition, although not shown in Figure 1, the communication device 100 may further include other components, such as a processor, a power supply module, or (and) a housing.

以下實施例將介紹通訊裝置100之細部結構和具體實施方式。必須理解的是,這些圖式和敘述僅為舉例,而非用於限制本發明之範圍。The following embodiments will introduce the detailed structure and specific implementation of the communication device 100. It must be understood that these drawings and descriptions are only examples and are not used to limit the scope of the present invention.

第2圖係顯示根據本發明一實施例所述之通訊裝置200之俯視圖。在第2圖之實施例中,通訊裝置200包括一接地面210、一天線陣列220,以及一電磁帶隙結構230,其皆可用金屬材質製成。天線陣列220包括複數個天線元件240。例如,該等天線元件240之每一者可各自為一補釘天線。該等天線元件240可排列成為一第一對稱圖案(Symmetrical Pattern)250。例如,第一對稱圖案250可大致呈現一正方形。在一些實施例中,該等天線元件240之總數量為16,它們可以形成4x4之正方形矩陣(Matrix)。在另一些實施例中,該等天線元件240之總數量亦可根據不同需求進行調整。FIG. 2 is a top view of the communication device 200 according to an embodiment of the invention. In the embodiment of FIG. 2, the communication device 200 includes a ground plane 210, an antenna array 220, and an electromagnetic band gap structure 230, all of which can be made of metal materials. The antenna array 220 includes a plurality of antenna elements 240. For example, each of the antenna elements 240 can each be a patch antenna. The antenna elements 240 can be arranged into a first symmetrical pattern (Symmetrical Pattern) 250. For example, the first symmetrical pattern 250 may be approximately a square. In some embodiments, the total number of the antenna elements 240 is 16, and they can form a 4×4 square matrix. In other embodiments, the total number of the antenna elements 240 can also be adjusted according to different requirements.

電磁帶隙結構230包括複數個電磁帶隙單元260,其中該等電磁帶隙單元260皆耦接至接地面210。例如,該等電磁帶隙單元260之每一者可各自呈現一蘑菇形(Mushroom-Shape)。該等電磁帶隙單元260可排列成為一第二對稱圖案270。例如,第二對稱圖案270可呈現一空心正方形。詳細而言,第二對稱圖案270可包括一第一環形271和一第二環形272,其中第二環形272可位於第一環形271之內部,而天線陣列220之該等天線元件240皆可位於第二環形272之內部。根據實際量測結果,此種雙環形之電磁帶隙單元260之排列方式可作為一帶拒濾波器(Band Rejection Filter),其可有效阻擋一目標頻帶(Target Band)內之表面波(Surface Wave)。在一些實施例中,該等電磁帶隙單元260之總數量為184。在另一些實施例中,該等電磁帶隙單元260之總數量亦可根據不同需求進行調整。The electromagnetic band gap structure 230 includes a plurality of electromagnetic band gap units 260, and the electromagnetic band gap units 260 are all coupled to the ground plane 210. For example, each of the electromagnetic band gap units 260 may each exhibit a mushroom-shape (Mushroom-Shape). The electromagnetic band gap units 260 can be arranged in a second symmetrical pattern 270. For example, the second symmetrical pattern 270 may present a hollow square. In detail, the second symmetrical pattern 270 may include a first loop 271 and a second loop 272, wherein the second loop 272 may be located inside the first loop 271, and the antenna elements 240 of the antenna array 220 are all It can be located inside the second ring 272. According to the actual measurement results, the arrangement of the double-ring electromagnetic bandgap unit 260 can be used as a Band Rejection Filter, which can effectively block surface waves in a target band (Target Band). . In some embodiments, the total number of the electromagnetic band gap units 260 is 184. In other embodiments, the total number of the electromagnetic bandgap units 260 can also be adjusted according to different requirements.

第3圖係顯示根據本發明一實施例所述之通訊裝置200之部份剖面圖(可沿第2圖之一剖面線LC1)。在第3圖之實施例中,該等電磁帶隙單元260之每一者各自包括一頂面金屬片261和一連接金屬柱262,其中頂面金屬片261係經由連接金屬柱262耦接至接地面210。例如,頂面金屬片261可大致呈現一較小正方形,其可與接地面210大致互相平行;而連接金屬柱262可大致呈現一圓柱形,其可與接地面210和頂面金屬面261皆大致互相垂直。然而,本發明並不僅限於此。在其他實施例中,頂面金屬片261亦可呈現一正三角形、一圓形、一橢圓形,或是一梯形,而連接金屬柱262亦可呈現一三角柱形或一四角柱形。FIG. 3 shows a partial cross-sectional view of the communication device 200 according to an embodiment of the present invention (which can be along a cross-sectional line LC1 in FIG. 2). In the embodiment of FIG. 3, each of the electromagnetic bandgap units 260 includes a top metal sheet 261 and a connecting metal pillar 262, wherein the top metal sheet 261 is coupled to the connecting metal pillar 262 GND plane 210. For example, the top metal sheet 261 can be approximately a small square, which can be approximately parallel to the ground surface 210; and the connecting metal post 262 can be approximately a cylindrical shape, which can be connected to the ground surface 210 and the top metal surface 261. Roughly perpendicular to each other. However, the present invention is not limited to this. In other embodiments, the top metal sheet 261 may also have an equilateral triangle, a circle, an ellipse, or a trapezoid, and the connecting metal pillar 262 may also have a triangular pillar shape or a quadrangular pillar shape.

在一些實施例中,天線陣列220涵蓋介於27GHz至29GHz之間之一操作頻帶,故其可支援5G毫米波(Millimeter Wave)之寬頻操作。在操作原理方面,由該等電磁帶隙單元260所形成之帶拒濾波器之目標頻帶可等同於天線陣列220之操作頻帶,以避免不必要之表面波擴散。因此,電磁帶隙結構230可用於抑制天線陣列220之輻射場型之前後比,從而可有效提升通訊裝置200之通訊距離和空間效率。根據實際量測結果,在加入電磁帶隙結構230之包圍設計後,天線陣列220之輻射場型之前後比將下降約6dB至8dB,此已可滿足一般通訊裝置之實際應用需求。In some embodiments, the antenna array 220 covers an operating frequency band between 27 GHz and 29 GHz, so it can support 5G millimeter wave (Millimeter Wave) broadband operation. In terms of operating principles, the target frequency band of the band rejection filter formed by the electromagnetic band gap units 260 can be equivalent to the operating frequency band of the antenna array 220 to avoid unnecessary surface wave diffusion. Therefore, the electromagnetic band gap structure 230 can be used to suppress the front-to-back ratio of the radiation pattern of the antenna array 220, thereby effectively improving the communication distance and space efficiency of the communication device 200. According to actual measurement results, after adding the surrounding design of the electromagnetic band gap structure 230, the front-to-back ratio of the antenna array 220 will decrease by about 6dB to 8dB, which can already meet the practical application requirements of general communication devices.

在一些實施例中,通訊裝置200之元件尺寸可如下列所述。該等天線元件240之每一者之長度L1皆可大致等於天線陣列220之操作頻帶之0.25倍波長(λ/4)。該等天線元件240之任相鄰二者之間距D1皆大致等於天線陣列220之操作頻帶之0.5倍波長(λ/2)。該等電磁帶隙單元260之每一者之長度L2(或頂面金屬片261之長度L2)皆小於天線陣列220之操作頻帶之0.1倍波長(λ/10)。該等電磁帶隙單元260之每一者之高度H1(或頂面金屬片261之高度H1)皆小於天線陣列220之操作頻帶之0.1倍波長(λ/10)。該等電磁帶隙單元260之任相鄰二者之間距D2皆小於天線陣列220之操作頻帶之0.02倍波長(λ/50)。該等天線元件240之任一者至電磁帶隙結構230之最短距離DS皆大於天線陣列220之操作頻帶之0.25倍波長(λ/4)。以上距離之範圍係根據多次實驗結果而得出,其有助於最小化天線陣列220之輻射場型之前後比,以及最大化通訊裝置200之通訊距離和空間效率。In some embodiments, the component size of the communication device 200 may be as described below. The length L1 of each of the antenna elements 240 can be approximately equal to 0.25 times the wavelength (λ/4) of the operating frequency band of the antenna array 220. The distance D1 between any adjacent two of the antenna elements 240 is approximately equal to 0.5 times the wavelength (λ/2) of the operating frequency band of the antenna array 220. The length L2 of each of the electromagnetic band gap units 260 (or the length L2 of the top metal sheet 261) is less than 0.1 times the wavelength (λ/10) of the operating frequency band of the antenna array 220. The height H1 of each of the electromagnetic band gap units 260 (or the height H1 of the top metal sheet 261) is less than 0.1 times the wavelength (λ/10) of the operating frequency band of the antenna array 220. The distance D2 between any adjacent two of the electromagnetic band gap units 260 is less than 0.02 wavelength (λ/50) of the operating frequency band of the antenna array 220. The shortest distance DS from any one of the antenna elements 240 to the electromagnetic band gap structure 230 is greater than 0.25 times the wavelength (λ/4) of the operating frequency band of the antenna array 220. The range of the above distance is obtained based on the results of many experiments, which helps to minimize the front-to-back ratio of the radiation pattern of the antenna array 220 and maximize the communication distance and space efficiency of the communication device 200.

第4圖係顯示根據本發明一實施例所述之通訊裝置400之剖面圖。第4圖和第2、3圖相似。在第4圖之實施例中,通訊裝置400更包括一介質基板(Dielectric Substrate)480,其中介質基板480係設置於接地面210上。天線陣列220之該等天線元件240皆可設置於介質基板480上。電磁帶隙結構230之該等電磁帶隙單元260皆可穿透過介質基板480。在一些實施例中,介質基板480之介電常數(Dielectric Constant)係介於2至6之間。必須注意的是,若加入介質基板480,則前述元件尺寸和波長之對應關係可根據介質基板480之介電常數來進行調整,從而可微縮通訊裝置400之整體尺寸。第4圖之通訊裝置400之其餘特徵皆與第2、3圖之通訊裝置200類似,故此二實施例均可達成相似之操作效果。FIG. 4 is a cross-sectional view of the communication device 400 according to an embodiment of the invention. Figure 4 is similar to Figures 2 and 3. In the embodiment of FIG. 4, the communication device 400 further includes a dielectric substrate (Dielectric Substrate) 480, wherein the dielectric substrate 480 is disposed on the ground surface 210. The antenna elements 240 of the antenna array 220 can all be arranged on the dielectric substrate 480. The electromagnetic band gap units 260 of the electromagnetic band gap structure 230 can pass through the dielectric substrate 480. In some embodiments, the dielectric constant of the dielectric substrate 480 is between 2-6. It should be noted that if the dielectric substrate 480 is added, the corresponding relationship between the aforementioned element size and wavelength can be adjusted according to the dielectric constant of the dielectric substrate 480, so that the overall size of the communication device 400 can be reduced. The remaining features of the communication device 400 in Fig. 4 are similar to those of the communication device 200 in Figs. 2 and 3, so the two embodiments can achieve similar operating effects.

本發明提出一種新穎之通訊裝置,其包括圍繞天線陣列之電磁帶隙結構。與傳統設計相比,本發明至少具有可抑制天線陣列之輻射場型之前後比之優勢,故本發明很適合應用於各種各式之通訊裝置當中,以改善其通訊距離和空間效率。The present invention provides a novel communication device, which includes an electromagnetic band gap structure surrounding an antenna array. Compared with the traditional design, the present invention at least has the advantage of suppressing the front-to-back comparison of the radiation pattern of the antenna array. Therefore, the present invention is very suitable for application in various communication devices to improve their communication distance and space efficiency.

值得注意的是,以上所述之元件尺寸、元件形狀,以及頻率範圍皆非為本發明之限制條件。天線設計者可以根據不同需要調整這些設定值。本發明之通訊裝置並不僅限於第1-4圖所圖示之狀態。本發明可以僅包括第1-4圖之任何一或複數個實施例之任何一或複數項特徵。換言之,並非所有圖示之特徵均須同時實施於本發明之通訊裝置當中。It should be noted that the above-mentioned component size, component shape, and frequency range are not the limiting conditions of the present invention. The antenna designer can adjust these settings according to different needs. The communication device of the present invention is not limited to the state shown in Figs. 1-4. The present invention may only include any one or more of the features of any one or more of the embodiments shown in FIGS. 1-4. In other words, not all the features of the figures need to be implemented in the communication device of the invention at the same time.

在本說明書以及申請專利範圍中的序數,例如「第一」、「第二」、「第三」等等,彼此之間並沒有順序上的先後關係,其僅用於標示區分兩個具有相同名字之不同元件。The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., do not have a sequential relationship with each other, and they are only used to distinguish two having the same Different components of the name.

本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention is disclosed as above in the preferred embodiment, it is not intended to limit the scope of the present invention. Anyone who is familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

100、200、400~通訊裝置; 110、210~接地面; 120、220~天線陣列; 130、230~電磁帶隙結構; 240~天線元件; 250~第一對稱圖案; 260~電磁帶隙單元; 261~頂面金屬片; 262~連接金屬柱; 270~第二對稱圖案; 271~第一環形; 272~第二環形; 480~介質基板; D1、D2~間距; DS~最短距離; H1~高度; L1、L2~長度; LC1~剖面線; X~X軸; Y~Y軸; Z~Z軸。 100, 200, 400 ~ communication device; 110, 210~Grounding plane; 120, 220~antenna array; 130, 230 ~ electromagnetic band gap structure; 240~antenna element; 250~The first symmetrical pattern; 260~Electromagnetic band gap unit; 261~Top metal sheet; 262~Connect the metal column; 270~Second symmetrical pattern; 271~The first ring; 272~The second ring; 480~Dielectric substrate; D1, D2~spacing; DS~shortest distance; H1~height; L1, L2~length; LC1~hatched line; X~X axis; Y~Y axis; Z~Z axis.

第1圖係顯示根據本發明一實施例所述之通訊裝置之示意圖。 第2圖係顯示根據本發明一實施例所述之通訊裝置之俯視圖。 第3圖係顯示根據本發明一實施例所述之通訊裝置之部份剖面圖。 第4圖係顯示根據本發明一實施例所述之通訊裝置之剖面圖。 Figure 1 is a schematic diagram of a communication device according to an embodiment of the invention. Figure 2 is a top view of the communication device according to an embodiment of the invention. FIG. 3 is a partial cross-sectional view of the communication device according to an embodiment of the invention. FIG. 4 is a cross-sectional view of the communication device according to an embodiment of the invention.

100~通訊裝置; 110~接地面; 120~天線陣列; 130~電磁帶隙結構。 100~Communication device; 110~Grounding plane; 120~antenna array; 130 ~ Electromagnetic band gap structure.

Claims (17)

一種通訊裝置,包括:一接地面;一天線陣列,包括複數個天線元件;以及一電磁帶隙結構,包括共同形成矩形之複數個電磁帶隙單元,其中該等電磁帶隙單元皆耦接至該接地面;其中該天線陣列整體係由該電磁帶隙結構所包圍,其中該電磁帶隙結構並未延伸進入該等天線元件之任獨立二者之間;其中該等天線元件係排列成為一第一對稱圖案;其中該第一對稱圖案係呈現一正方形;其中該等天線元件之任一者至該電磁帶隙結構之最短距離皆大於該天線陣列之一操作頻帶之0.25倍波長。 A communication device includes: a ground plane; an antenna array including a plurality of antenna elements; and an electromagnetic band gap structure including a plurality of electromagnetic band gap units forming a rectangle together, wherein the electromagnetic band gap units are all coupled to The ground plane; wherein the antenna array is surrounded by the electromagnetic band gap structure as a whole, wherein the electromagnetic band gap structure does not extend into any independent two of the antenna elements; wherein the antenna elements are arranged into one The first symmetrical pattern; wherein the first symmetrical pattern presents a square; wherein the shortest distance from any one of the antenna elements to the electromagnetic band gap structure is greater than 0.25 times the wavelength of an operating frequency band of the antenna array. 如申請專利範圍第1項所述之通訊裝置,其中該電磁帶隙結構係用於抑制該天線陣列之輻射場型之前後比。 The communication device described in the first item of the scope of patent application, wherein the electromagnetic band gap structure is used to suppress the front-to-back ratio of the radiation pattern of the antenna array. 如申請專利範圍第1項所述之通訊裝置,其中該操作頻帶係介於27GHz至29GHz之間。 As for the communication device described in item 1 of the scope of patent application, the operating frequency band is between 27 GHz and 29 GHz. 如申請專利範圍第1項所述之通訊裝置,其中該等天線元件之每一者各自為一補釘天線。 In the communication device described in the first item of the scope of patent application, each of the antenna elements is a patch antenna. 如申請專利範圍第3項所述之通訊裝置,其中該等天線元件之每一者之長度皆大致等於該操作頻帶之0.25倍波長。 For the communication device described in item 3 of the scope of patent application, the length of each of the antenna elements is approximately equal to 0.25 times the wavelength of the operating frequency band. 如申請專利範圍第3項所述之通訊裝置,其中該等天線元件之任相鄰二者之間距皆大致等於該操作頻帶之05倍波長。 As for the communication device described in item 3 of the scope of patent application, the distance between any adjacent two of the antenna elements is approximately equal to 05 times the wavelength of the operating frequency band. 如申請專利範圍第1項所述之通訊裝置,其中該等天線元件之總數量為16。 For the communication device described in item 1 of the scope of patent application, the total number of the antenna elements is 16. 如申請專利範圍第1項所述之通訊裝置,其中該等電磁帶隙單元係排列成為一第二對稱圖案。 For the communication device described in item 1 of the scope of patent application, the electromagnetic band gap units are arranged in a second symmetrical pattern. 如申請專利範圍第8項所述之通訊裝置,其中該第二對稱圖案係呈現一空心正方形。 The communication device described in item 8 of the scope of patent application, wherein the second symmetrical pattern is a hollow square. 如申請專利範圍第8項所述之通訊裝置,其中該第二對稱圖案包括一第一環形和一第二環形,該第二環形係位於該第一環形之內部,而該等天線元件皆位於該第二環形之內部。 The communication device described in claim 8, wherein the second symmetrical pattern includes a first ring and a second ring, the second ring is located inside the first ring, and the antenna elements They are all located inside the second ring. 如申請專利範圍第1項所述之通訊裝置,其中該等電磁帶隙單元之每一者各自呈現一蘑菇形。 In the communication device described in item 1 of the scope of patent application, each of the electromagnetic bandgap units exhibits a mushroom shape. 如申請專利範圍第1項所述之通訊裝置,其中該等電磁帶隙單元之每一者各自包括一頂面金屬片和一連接金屬柱,而該頂面金屬片係經由該連接金屬柱耦接至該接地面。 The communication device described in claim 1, wherein each of the electromagnetic bandgap units includes a top metal sheet and a connecting metal pillar, and the top metal sheet is coupled via the connecting metal pillar Connect to this ground plane. 如申請專利範圍第3項所述之通訊裝置,其中該等電磁帶隙單元之每一者之長度皆小於該操作頻帶之0.1倍波長。 For the communication device described in item 3 of the scope of patent application, the length of each of the electromagnetic band gap units is less than 0.1 times the wavelength of the operating frequency band. 如申請專利範圍第3項所述之通訊裝置,其中該等電磁帶隙單元之每一者之高度皆小於該操作頻帶之0.1倍波長。 For the communication device described in item 3 of the scope of patent application, the height of each of the electromagnetic band gap units is less than 0.1 times the wavelength of the operating frequency band. 如申請專利範圍第3項所述之通訊裝置,其中該等電磁帶隙單元之任相鄰二者之間距皆小於該操作頻帶之0.02倍波長。 For the communication device described in item 3 of the scope of patent application, the distance between any adjacent two of the electromagnetic band gap units is less than 0.02 times the wavelength of the operating frequency band. 如申請專利範圍第1項所述之通訊裝置,其中該等電磁帶隙單元之總數量為184。 For the communication device described in item 1 of the scope of patent application, the total number of the electromagnetic bandgap units is 184. 如申請專利範圍第1項所述之通訊裝置,更包括:一介質基板,設置於該接地面上,其中該等電磁帶隙單元皆穿透過該介質基板。 The communication device described in item 1 of the scope of the patent application further includes: a dielectric substrate disposed on the ground plane, wherein the electromagnetic band gap units all penetrate the dielectric substrate.
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