TWI718573B - 缺陷檢測裝置及方法 - Google Patents

缺陷檢測裝置及方法 Download PDF

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Publication number
TWI718573B
TWI718573B TW108122230A TW108122230A TWI718573B TW I718573 B TWI718573 B TW I718573B TW 108122230 A TW108122230 A TW 108122230A TW 108122230 A TW108122230 A TW 108122230A TW I718573 B TWI718573 B TW I718573B
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Taiwan
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image
defect
defect detection
learning
color image
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TW108122230A
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English (en)
Chinese (zh)
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TW202014985A (zh
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宋德王
李在旻
秋淵學
李錫中
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南韓商樂人股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20112—Image segmentation details
    • G06T2207/20132—Image cropping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW108122230A 2018-10-11 2019-06-25 缺陷檢測裝置及方法 TWI718573B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180120853A KR102175286B1 (ko) 2018-10-11 2018-10-11 결함 검출 장치 및 방법
KR10-2018-0120853 2018-10-11

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TW202014985A TW202014985A (zh) 2020-04-16
TWI718573B true TWI718573B (zh) 2021-02-11

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TW108122230A TWI718573B (zh) 2018-10-11 2019-06-25 缺陷檢測裝置及方法

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KR (1) KR102175286B1 (ko)
CN (1) CN109916906B (ko)
TW (1) TWI718573B (ko)

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US10977509B2 (en) 2017-03-27 2021-04-13 Samsung Electronics Co., Ltd. Image processing method and apparatus for object detection
KR102252592B1 (ko) * 2019-08-16 2021-05-17 라온피플 주식회사 기판 불량 검사 장치 및 방법
CN110487803A (zh) * 2019-08-20 2019-11-22 Oppo（重庆）智能科技有限公司 红外发光元件的缺陷检测方法和装置
CN110763699B (zh) * 2019-10-12 2022-12-20 广州兴森快捷电路科技有限公司 线路板的内层互连缺陷的分析方法及线路板
CN110726724A (zh) * 2019-10-22 2020-01-24 北京百度网讯科技有限公司 缺陷检测方法、系统和装置
CN111008961B (zh) * 2019-11-25 2021-10-19 深圳供电局有限公司 一种输电线路设备缺陷检测方法及其系统、设备、介质
JP2021089219A (ja) * 2019-12-05 2021-06-10 東洋製罐グループホールディングス株式会社 画像検査システム、及び画像検査方法
CN113516612B (zh) * 2020-04-13 2022-06-14 阿里巴巴集团控股有限公司 数据处理方法、装置、设备和存储介质
CN111507975B (zh) * 2020-04-23 2022-02-08 西南交通大学 一种牵引变电所户外绝缘子异常检测方法
CN111754456B (zh) * 2020-05-15 2022-10-14 清华大学 基于深度学习的二维pcb外观缺陷实时自动检测技术
US11423577B2 (en) * 2020-07-08 2022-08-23 International Business Machines Corporation Printed circuit board assembly defect detection
TWI770561B (zh) * 2020-07-22 2022-07-11 鴻海精密工業股份有限公司 產品瑕疵檢測方法、電腦裝置及儲存介質
CN112085722B (zh) * 2020-09-07 2024-04-09 凌云光技术股份有限公司 一种训练样本图像获取方法及装置
CN112184689A (zh) * 2020-10-12 2021-01-05 罗建华 一种半导体器件检测方法、装置、智能终端及存储介质
KR102505484B1 (ko) * 2020-12-18 2023-03-03 한국공학대학교산학협력단 딥러닝 기반의 타이어 외관 결함 검출 방법 및 장치
CN113111828B (zh) * 2021-04-23 2022-03-18 中国科学院宁波材料技术与工程研究所 一种轴承三维缺陷检测方法及系统
KR102394093B1 (ko) * 2021-09-13 2022-05-04 오병후 헬기블레이드의 엑스레이 촬영 이미지를 이용한 불량판독방법
KR102471441B1 (ko) 2021-12-20 2022-11-28 주식회사 아이코어 딥 러닝을 기반으로 고장을 검출하는 비전 검사 시스템
CN114466183A (zh) * 2022-02-21 2022-05-10 江东电子材料有限公司 基于特征光谱的铜箔瑕疵检测方法、装置和电子设备
CN114862856B (zh) * 2022-07-07 2022-10-11 成都数之联科技股份有限公司 一种面板缺陷区域识别方法、装置、电子设备及介质
CN115115625B (zh) * 2022-08-26 2022-11-04 聊城市正晟电缆有限公司 基于图像处理的电缆生产异常检测方法
WO2024049201A1 (ko) * 2022-08-31 2024-03-07 주식회사 엘지에너지솔루션 배터리 전극 검사 장치 및 방법
KR102610783B1 (ko) * 2022-11-03 2023-12-07 시냅스이미징(주) Cad 영상을 활용한 전처리가 구현된 딥러닝 검사시스템

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JP2016212539A (ja) * 2015-05-01 2016-12-15 富士通株式会社 情報処理装置、欠陥箇所判定プログラム、および欠陥箇所判定方法
CN105894514B (zh) * 2016-04-06 2019-01-11 广东工业大学 一种基于gpu并行运算的印刷品缺陷检测方法及系统
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CN108596892B (zh) * 2018-04-23 2020-08-18 西安交通大学 一种基于改进LeNet-5模型的焊缝缺陷识别方法
CN109084957B (zh) * 2018-08-31 2024-03-19 华南理工大学 光伏太阳能晶硅电池片的缺陷检测和颜色分选方法及其系统

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TW200414488A (en) * 2002-05-17 2004-08-01 Gsi Lumonics Corp Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
US20070050712A1 (en) * 2005-08-23 2007-03-01 Hull Jonathan J Visibly-Perceptible Hot Spots in Documents
CN104363843A (zh) * 2012-04-09 2015-02-18 伊西康内外科公司 用于超声外科器械的可旋转电连接件
CN103234476A (zh) * 2013-04-01 2013-08-07 廖怀宝 物体二维轮廓识别方法
CN106530284A (zh) * 2016-10-21 2017-03-22 广州视源电子科技股份有限公司 基于图像识别的焊点类型检测和装置

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CN109916906B (zh) 2022-10-14
KR102175286B1 (ko) 2020-11-06
CN109916906A (zh) 2019-06-21
TW202014985A (zh) 2020-04-16
KR20200046137A (ko) 2020-05-07

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