TWI717065B - Touch panel - Google Patents

Touch panel Download PDF

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TWI717065B
TWI717065B TW108138111A TW108138111A TWI717065B TW I717065 B TWI717065 B TW I717065B TW 108138111 A TW108138111 A TW 108138111A TW 108138111 A TW108138111 A TW 108138111A TW I717065 B TWI717065 B TW I717065B
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touch
touch sensing
sensing
group
sensing electrodes
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TW108138111A
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Chinese (zh)
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TW202117515A (en
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陳彥華
詹永舟
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大陸商業成科技(成都)有限公司
大陸商業成光電(深圳)有限公司
英特盛科技股份有限公司
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

Touch panel includes a substrate, a plurality of touch sensing electrodes, a plurality of connecting pads, a flexible circuit board and a control chip. The touch sensing electrodes are disposed on the substrate. The touch sensing electrodes are divided into a sensing group and a dummy group. The connecting pads are disposed on the substrate, in which each sensing electrode is electrically connected with one of the connecting pads through a connecting line. The flexible circuit board includes a plurality of wire sets, and each wire set is electrically connected with a connecting pad corresponding to the touch sensing electrodes of the sensing group. The touch sensing electrodes of the sensing group are electrically connected with the control chip through the wire sets. The touch sensing electrodes of the dummy group are configured to be dummy electrodes.

Description

觸控面板Touch panel

本發明係關於觸控面板。The present invention relates to a touch panel.

一般而言,觸控面板可分為電阻式觸控面板以及電容式觸控面板。電阻式觸控面板係藉由施加壓力而產生的玻璃與電極之間產生的短路現象而感測使用者觸控的位置。電容式觸控面板則是藉由觸碰而使得電極之電容值產生變化而感測使用者觸控的位置。Generally speaking, touch panels can be classified into resistive touch panels and capacitive touch panels. The resistive touch panel senses the position of the user's touch by the short-circuit phenomenon between the glass and the electrode caused by the application of pressure. The capacitive touch panel senses the position of the user's touch by changing the capacitance value of the electrode by touching it.

然而,電容式觸控面板的觸控偵測會受到蓋板的材質與厚度影響。一般來說,電容式觸控面板的感測電極需要搭配蓋板來設計,不同的蓋板材料或不同的蓋板厚度需要搭配不同的感測電極的配置。如此一來,將大幅增加產品開發的成本,亦使產品開發的速度降低。因此,亟需一種新穎的觸控面板,可以改善上述問題。However, the touch detection of the capacitive touch panel is affected by the material and thickness of the cover. Generally speaking, the sensing electrodes of a capacitive touch panel need to be designed with a cover plate, and different cover plate materials or different cover plate thicknesses need to be matched with different sensor electrode configurations. As a result, it will significantly increase the cost of product development and reduce the speed of product development. Therefore, there is an urgent need for a novel touch panel that can improve the above problems.

本揭露之一態樣,係提供一種觸控面板,包含基板、複數個觸控感測電極、複數個連接墊、軟性電路板及控制晶片。觸控感測電極配置於基板上,觸控感測電極分為一感測組及一虛設組。連接墊配置於基板上,其中各觸控感測電極分別透過連接線與連接墊之一者電性連接。軟性電路板包含複數個導線組,各導線組分別連接對應感測組的觸控感測電極的連接墊。感測組的觸控感測電極透過導線組電性連接至控制晶片,其中虛設組的觸控感測電極配置以作為虛設電極。One aspect of this disclosure provides a touch panel, which includes a substrate, a plurality of touch sensing electrodes, a plurality of connection pads, a flexible circuit board, and a control chip. The touch sensing electrodes are arranged on the substrate, and the touch sensing electrodes are divided into a sensing group and a dummy group. The connection pads are arranged on the substrate, and each touch sensing electrode is electrically connected to one of the connection pads through a connection wire. The flexible circuit board includes a plurality of wire groups, and each wire group is respectively connected to the connection pad of the touch sensing electrode of the corresponding sensing group. The touch sensing electrodes of the sensing group are electrically connected to the control chip through the wire group, wherein the touch sensing electrodes of the dummy group are configured as dummy electrodes.

根據本揭露一或多個實施方式,軟性電路板配置以將部分的感測組的觸控感測電極互相電性連接,以形成一第一感測通道,軟性電路板配置以將另一部分的感測組的觸控感測電極互相電性連接,以形成一第二感測通道,第一感測通道不同於第二感測通道。According to one or more embodiments of the present disclosure, the flexible circuit board is configured to electrically connect part of the touch sensing electrodes of the sensing group to form a first sensing channel, and the flexible circuit board is configured to connect another part of the The touch sensing electrodes of the sensing group are electrically connected to each other to form a second sensing channel. The first sensing channel is different from the second sensing channel.

根據本揭露一或多個實施方式,各導線組包含複數條第一導線以及一第二導線,其中各第一導線分別連接對應感測組的各觸控感測電極的各連接墊,第二導線匯整相鄰的第一導線並電性連接至控制晶片。According to one or more embodiments of the present disclosure, each wire group includes a plurality of first wires and a second wire, wherein each first wire is connected to each connection pad of each touch sensing electrode of the corresponding sensing group, and the second The wires gather adjacent first wires and are electrically connected to the control chip.

根據本揭露一或多個實施方式,各觸控感測電極之間的間隔為1毫米至10毫米。According to one or more embodiments of the present disclosure, the interval between each touch sensing electrode is 1 mm to 10 mm.

根據本揭露一或多個實施方式,控制晶片配置於軟性電路板上。According to one or more embodiments of the present disclosure, the control chip is configured on the flexible circuit board.

根據本揭露一或多個實施方式,虛設組的觸控感測電極未與控制晶片電性連接。According to one or more embodiments of the present disclosure, the touch sensing electrodes of the dummy group are not electrically connected to the control chip.

根據本揭露一或多個實施方式,觸控感測電極中,感測組的各觸控感測電極與虛設組的各觸控感測電極在水平方向上交錯配置。According to one or more embodiments of the present disclosure, among the touch sensing electrodes, each touch sensing electrode of the sensing group and each touch sensing electrode of the dummy group are alternately arranged in a horizontal direction.

根據本揭露一或多個實施方式,各觸控感測電極的寬度為0.5毫米至9.99毫米。According to one or more embodiments of the present disclosure, the width of each touch sensing electrode is 0.5 mm to 9.99 mm.

根據本揭露一或多個實施方式,觸控感測電極包含氧化銦錫、奈米銀線、石墨烯或金屬網格。According to one or more embodiments of the present disclosure, the touch sensing electrode includes indium tin oxide, nano silver wire, graphene, or metal grid.

根據本揭露一或多個實施方式,各導線自各連接墊延伸至控制晶片。According to one or more embodiments of the present disclosure, each wire extends from each connection pad to the control chip.

以下揭露提供許多不同實施例,或示例,以建置所提供之標的物的不同特徵。以下敘述之成份和排列方式的特定示例是為了簡化本公開。這些當然僅是做為示例,其目的不在構成限制。舉例而言,元件的尺寸不被揭露之範圍或數值所限制,但可以取決於元件之製程條件與/或所需的特性。此外,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。為了簡單與清晰起見,不同特徵可以任意地繪示成不同大小。The following disclosure provides many different embodiments, or examples, to implement different features of the provided subject matter. The specific examples of the components and arrangements described below are for simplifying the present disclosure. These are of course only examples, and their purpose is not to constitute a limitation. For example, the size of the device is not limited by the disclosed range or value, but may depend on the process conditions and/or required characteristics of the device. In addition, the description that the first feature is formed on or above the second feature includes an embodiment where the first feature and the second feature are in direct contact, and also includes other features formed between the first feature and the second feature, so that the first feature An embodiment where the first feature and the second feature are not in direct contact. For simplicity and clarity, different features can be arbitrarily drawn in different sizes.

再者,空間相對性用語,例如「下方(beneath)」、「在…之下(below)」、「低於(lower)」、「在…之上(above)」、「高於(upper)」等,是為了易於描述圖式中所繪示的元素或特徵和其他元素或特徵的關係。空間相對性用語除了圖式中所描繪的方向外,還包含元件在使用或操作時的不同方向。儀器可以其他方式定向(旋轉90度或在其他方向),而本文所用的空間相對性描述也可以如此解讀。Furthermore, the terms of spatial relative terms, such as "beneath", "below", "lower", "above", "upper" ", etc., in order to easily describe the relationship between the elements or features depicted in the drawings and other elements or features. In addition to the directions described in the diagrams, the terms of spatial relativity also include different directions of the elements in use or operation. The instrument can be oriented in other ways (rotated 90 degrees or in other directions), and the description of spatial relativity used herein can also be interpreted in this way.

第1圖繪示根據本發明一實施例的觸控面板100的示意圖。第2圖繪示根據本發明一實施例的觸控面板100的局部放大圖。請同時參考第1圖及第2圖,觸控面板100包含基板110、觸控感測電極層120、複數個連接墊130、軟性電路板140及控制晶片150。FIG. 1 is a schematic diagram of a touch panel 100 according to an embodiment of the invention. FIG. 2 is a partial enlarged view of the touch panel 100 according to an embodiment of the invention. Please refer to FIGS. 1 and 2 at the same time. The touch panel 100 includes a substrate 110, a touch sensing electrode layer 120, a plurality of connection pads 130, a flexible circuit board 140, and a control chip 150.

觸控感測電極層120配置於基板110上,其中觸控感測電極層120包含複數個觸控感測電極121。在某些實施例中,觸控感測電極121在水平方向上排列於基板110上。在某些實施例中,觸控感測電極121包含氧化銦錫、奈米銀線、石墨烯或金屬網格。在一些實施例中,觸控感測電極121為長條形(bar type)。在某些實施例中,觸控感測電極121之間的間隔為1毫米至10毫米,例如2毫米、4毫米、6毫米或8毫米。在一些實施例中,觸控感測電極121的寬度為0.5毫米至9.99毫米,例如1毫米、3毫米、5毫米、7毫米或9毫米。The touch sensing electrode layer 120 is disposed on the substrate 110, wherein the touch sensing electrode layer 120 includes a plurality of touch sensing electrodes 121. In some embodiments, the touch sensing electrodes 121 are arranged on the substrate 110 in a horizontal direction. In some embodiments, the touch sensing electrode 121 includes indium tin oxide, nano silver wire, graphene, or metal mesh. In some embodiments, the touch sensing electrode 121 has a bar type. In some embodiments, the interval between the touch sensing electrodes 121 is 1 mm to 10 mm, for example, 2 mm, 4 mm, 6 mm, or 8 mm. In some embodiments, the width of the touch sensing electrode 121 is 0.5 mm to 9.99 mm, such as 1 mm, 3 mm, 5 mm, 7 mm, or 9 mm.

連接墊130配置於基板110上,其中各觸控感測電極121分別透過一連接線131與連接墊130之一者電性連接。在一些實施例中,連接墊130包含導電材料,例如金屬。連接墊130係作為觸控感測電極層120連接外部線路的接點,因此可以使用任何合適的導電材料。The connection pad 130 is disposed on the substrate 110, and each touch sensing electrode 121 is electrically connected to one of the connection pads 130 through a connection wire 131. In some embodiments, the connection pad 130 includes a conductive material, such as metal. The connection pad 130 serves as a contact point for connecting the touch sensing electrode layer 120 to an external circuit, so any suitable conductive material can be used.

軟性電路板140包含複數個導線組141。上述的觸控感測電極121分為感測組S及虛設組D(虛設電極)。各導線組141分別連接對應感測組S的觸控感測電極121的連接墊130。在一些實施例中,導線組141包含複數條第一導線145以及一第二導線146。各個第一導線145分別連接對應感測組S的各觸控感測電極121的各連接墊130,而第二導線146匯整相鄰的第一導線145並電性連接至控制晶片150。換句話說,第二導線146將相鄰的第一導線145彼此電性連接,並將相鄰的第一導線145電性連接至控制晶片150。The flexible circuit board 140 includes a plurality of wire groups 141. The aforementioned touch sensing electrodes 121 are divided into a sensing group S and a dummy group D (dummy electrodes). Each wire group 141 is respectively connected to the connection pad 130 of the touch sensing electrode 121 of the corresponding sensing group S. In some embodiments, the wire group 141 includes a plurality of first wires 145 and a second wire 146. Each first wire 145 is respectively connected to each connection pad 130 of each touch sensing electrode 121 of the corresponding sensing group S, and the second wire 146 gathers the adjacent first wires 145 and is electrically connected to the control chip 150. In other words, the second wire 146 electrically connects the adjacent first wires 145 to each other, and electrically connects the adjacent first wires 145 to the control chip 150.

感測組S的觸控感測電極121透過導線組141電性連接至控制晶片150。在一些實施例中,導線組141自各連接墊130延伸至控制晶片150。由於僅有感測組S的觸控感測電極121與控制晶片150電性連接,因此虛設組D的觸控感測電極121係作為虛設電極。在某些實施例中,虛設組D的觸控感測電極121亦與導線組141電性連接,但是與虛設組D的觸控感測電極121連接的導線組141不會延伸至控制晶片150,亦不會與控制晶片150電性連接。在某些實施例中,控制晶片150配置於該軟性電路板140上。在另一些實施例中,控制晶片150配置於與軟性電路板140不同的電路板上。The touch sensing electrodes 121 of the sensing group S are electrically connected to the control chip 150 through the wire group 141. In some embodiments, the wire group 141 extends from each connection pad 130 to the control chip 150. Since only the touch sensing electrodes 121 of the sensing group S are electrically connected to the control chip 150, the touch sensing electrodes 121 of the dummy group D are used as dummy electrodes. In some embodiments, the touch sensing electrodes 121 of the dummy group D are also electrically connected to the wire group 141, but the wire group 141 connected to the touch sensing electrodes 121 of the dummy group D does not extend to the control chip 150 , It will not be electrically connected to the control chip 150. In some embodiments, the control chip 150 is configured on the flexible circuit board 140. In other embodiments, the control chip 150 is configured on a circuit board different from the flexible circuit board 140.

如第2圖所示,在一些實施例中,軟性電路板140配置以將部分的感測組S的觸控感測電極121互相電性連接,以形成第一感測通道C1。此外,軟性電路板140亦配置以將另一部分的感測組S的觸控感測電極121互相電性連接,以形成第二感測通道C2。第一感測通道C1不同於第二感測通道C2。而且,在第一感測通道C1與第二感測通道C2之間具有虛設組D的觸控感測電極121構成的虛設電極作為間隔。需了解的是,第1圖及第2圖僅繪示部分數量的觸控感測電極121,觸控面板100亦可以包含超過兩個感測通道,且各感測通道之間亦具有虛設電極。As shown in FIG. 2, in some embodiments, the flexible circuit board 140 is configured to electrically connect part of the touch sensing electrodes 121 of the sensing group S to each other to form the first sensing channel C1. In addition, the flexible circuit board 140 is also configured to electrically connect the touch sensing electrodes 121 of another part of the sensing group S to each other to form a second sensing channel C2. The first sensing channel C1 is different from the second sensing channel C2. Moreover, between the first sensing channel C1 and the second sensing channel C2, there are dummy electrodes composed of the touch sensing electrodes 121 of the dummy group D as a gap. It should be understood that Figures 1 and 2 only show a partial number of touch sensing electrodes 121. The touch panel 100 may also include more than two sensing channels, and there are also dummy electrodes between each sensing channel. .

也就是說,在不改變觸控感測電極層120的情況下,可以藉由調整軟性電路板140的配置,以形成不同的感測通道,例如寬度不同的感測通道。由於可以調整感測通道的寬度,亦即可以調整感測通道包含的觸控感測電極121的數量(與控制晶片150電性連接之電極),因此亦可以藉由軟性電路板140調整虛設電極的寬度(未與控制晶片150電性連接之電極)。That is to say, without changing the touch sensing electrode layer 120, the configuration of the flexible circuit board 140 can be adjusted to form different sensing channels, such as sensing channels with different widths. Since the width of the sensing channel can be adjusted, that is, the number of touch sensing electrodes 121 (electrodes electrically connected to the control chip 150) included in the sensing channel can be adjusted, so the flexible circuit board 140 can also be used to adjust the dummy electrodes Width (the electrode not electrically connected to the control chip 150).

需了解的是,本發明所繪示之觸控感測電極121及連接墊130的數量以及配置方式皆係例示性的,可以依照需求任意調整。It should be understood that the number and configuration of the touch sensing electrodes 121 and the connection pads 130 shown in the present invention are all exemplary and can be adjusted arbitrarily according to requirements.

請參考第3圖,其繪示根據本發明一實施例的觸控面板300的剖面示意圖。觸控面板300包含第一基板310、第一觸控感測層320、第二基板330、第二觸控感測層340及蓋板350。第一基板310及第二基板330類似於第1圖的基板110,而第一觸控感測層320及第二觸控感測層340類似於第1圖的觸控感測電極層120。此外,第一觸控感測層320及第二觸控感測層340的側邊亦配置類似於軟性電路板140的軟性電路板(為了簡潔起見,第3圖未繪示軟性電路板)。在觸控面板300的架構中,第一觸控感測層320及第二觸控感測層340包含沿著不同方向延伸的觸控感測電極,例如第一觸控感測層320包含沿X方向延伸的觸控感測電極,而第二觸控感測層340包含沿Y方向延伸的觸控感測電極。Please refer to FIG. 3, which shows a schematic cross-sectional view of a touch panel 300 according to an embodiment of the present invention. The touch panel 300 includes a first substrate 310, a first touch sensing layer 320, a second substrate 330, a second touch sensing layer 340, and a cover 350. The first substrate 310 and the second substrate 330 are similar to the substrate 110 of FIG. 1, and the first touch sensing layer 320 and the second touch sensing layer 340 are similar to the touch sensing electrode layer 120 of FIG. In addition, the sides of the first touch sensing layer 320 and the second touch sensing layer 340 are also configured with a flexible circuit board similar to the flexible circuit board 140 (for brevity, the flexible circuit board is not shown in Figure 3) . In the structure of the touch panel 300, the first touch-sensing layer 320 and the second touch-sensing layer 340 include touch-sensing electrodes extending along different directions. For example, the first touch-sensing layer 320 includes The touch sensing electrodes extend in the X direction, and the second touch sensing layer 340 includes touch sensing electrodes extending in the Y direction.

蓋板350可以作為保護層,增加觸控面板300的機械強度,避免第一觸控感測層320及第二觸控感測層340受到損傷。然而,如同先前技術段落所述,蓋板350的材質及厚度會影響觸控感測的效果,因此不同厚度或材質的蓋板350需要搭配不同寬度的感測通道以及不同寬度的虛設電極。一般來說,蓋板的厚度越大,則感測通道及虛設電極的寬度需要越大。本發明的配置可以在不改變觸控感測層的情況下,任意調整感測通道以及虛設電極的寬度。換句話說,只需要改變軟性電路板的配置,即可使同一個觸控感測層適應各種不同的蓋板,大幅降低產品開發的成本與時間。The cover 350 can be used as a protective layer to increase the mechanical strength of the touch panel 300 and prevent the first touch sensing layer 320 and the second touch sensing layer 340 from being damaged. However, as described in the previous technical paragraphs, the material and thickness of the cover 350 will affect the effect of touch sensing. Therefore, the cover 350 of different thickness or material needs to be equipped with sensing channels of different widths and dummy electrodes of different widths. Generally speaking, the larger the thickness of the cover plate, the larger the width of the sensing channel and the dummy electrode needs to be. The configuration of the present invention can arbitrarily adjust the width of the sensing channel and the dummy electrode without changing the touch sensing layer. In other words, only by changing the configuration of the flexible circuit board, the same touch sensing layer can be adapted to various cover plates, which greatly reduces the cost and time of product development.

第4-6圖繪示根據本發明的一些實施例的觸控面板100的示意圖。詳細而言,第4-6圖的實施例包含相同的觸控感測層,並例示性的繪示藉由不同配置的軟性電路板,而改變感測通道C以及虛設電極D的寬度。第4圖的實施例繪示當蓋板較厚時,需要較寬的感測通道C及虛設電極D。因此,係以三個觸控感測電極121作為一個感測通道C,並以兩個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約6毫米,虛設電極D的寬度為約4毫米。4-6 show schematic diagrams of the touch panel 100 according to some embodiments of the present invention. In detail, the embodiments of FIGS. 4-6 include the same touch sensing layer, and exemplarily show that the width of the sensing channel C and the dummy electrode D is changed by using flexible circuit boards of different configurations. The embodiment in FIG. 4 shows that when the cover plate is thick, a wider sensing channel C and a dummy electrode D are required. Therefore, three touch sensing electrodes 121 are used as one sensing channel C, and two touch sensing electrodes 121 are used as dummy electrodes D. For example, the width of the sensing channel C is about 6 mm, and the width of the dummy electrode D is about 4 mm.

第5圖的實施例繪示當蓋板較薄時,需要較窄的感測通道C及虛設電極D。因此,係以兩個觸控感測電極121作為一個感測通道C,並以一個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約4毫米,虛設電極D的寬度為約2毫米。The embodiment in FIG. 5 shows that when the cover plate is thinner, a narrower sensing channel C and dummy electrode D are required. Therefore, two touch sensing electrodes 121 are used as a sensing channel C, and one touch sensing electrode 121 is used as a dummy electrode D. For example, the width of the sensing channel C is about 4 mm, and the width of the dummy electrode D is about 2 mm.

第6圖的實施例繪示將感測通道數量減少,以降低控制晶片的成本。因此,係以四個觸控感測電極121作為一個感測通道C,並以三個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約8毫米,虛設電極D的寬度為約6毫米。The embodiment in FIG. 6 shows that the number of sensing channels is reduced to reduce the cost of the control chip. Therefore, four touch sensing electrodes 121 are used as one sensing channel C, and three touch sensing electrodes 121 are used as dummy electrodes D. For example, the width of the sensing channel C is about 8 mm, and the width of the dummy electrode D is about 6 mm.

為了清楚說明的目的,第4-6圖並未繪示完整數量的觸控感測電極。在一些實施例中,觸控感測層的兩側可以為感測通道。在另一些實施例中,觸控感測層的兩側可以為虛設電極。在某些實施例中,觸控感測層的一側可以為感測通道,而另一側為虛設電極。For the purpose of clear description, Figures 4-6 do not show a complete number of touch sensing electrodes. In some embodiments, both sides of the touch sensing layer may be sensing channels. In other embodiments, the two sides of the touch sensing layer may be dummy electrodes. In some embodiments, one side of the touch sensing layer may be a sensing channel, and the other side may be a dummy electrode.

本發明藉由調整軟性電路板的導線配置,控制與控制晶片電性連接的觸控感測電極的數量,以改變感測通道以及虛設電極的寬度。因此,可以使用同一個觸控感測層搭配不同材質或厚度的蓋板。如此一來,可以大幅降低產品開發的成本,產品開發的速度亦可以提昇。The present invention controls the number of touch sensing electrodes electrically connected to the control chip by adjusting the wire configuration of the flexible circuit board, so as to change the width of the sensing channel and the dummy electrode. Therefore, the same touch sensing layer can be used with cover plates of different materials or thicknesses. In this way, the cost of product development can be greatly reduced, and the speed of product development can also be increased.

本揭露已經詳細地描述某些實施方式,但其他的實施方式也是可能的。因此,所附請求項的精神和範疇不應限於本文所描述的實施方式。This disclosure has described some embodiments in detail, but other embodiments are also possible. Therefore, the spirit and scope of the appended claims should not be limited to the embodiments described herein.

雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何熟習此技術者,在不脫離本揭露之精神與範圍內,當可作各種更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above manner, it is not intended to limit this disclosure. Anyone familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the protection scope of this disclosure The scope of the patent application attached hereafter shall prevail.

100、300:觸控面板 110:基板 120:觸控感測電極層 121:觸控感測電極 130:連接墊 131:連接線 140:軟性電路板 141:導線組 145:第一導線 146:第二導線 150:控制晶片 310:第一基板 320:第一觸控感測層 330:第二基板 340:第二觸控感測層 350:蓋板 D:虛設組 S:感測組 C:感測通道 C1:第一感測通道 C2:第二感測通道 100, 300: touch panel 110: substrate 120: Touch sensing electrode layer 121: Touch sensing electrode 130: connection pad 131: connection line 140: flexible circuit board 141: Wire Group 145: first wire 146: second wire 150: control chip 310: First substrate 320: The first touch sensing layer 330: second substrate 340: second touch sensing layer 350: cover D: Dummy group S: Sensing group C: Sensing channel C1: The first sensing channel C2: second sensing channel

為讓本揭露之上述和其他目的、特徵、優點與實施方式能更明顯易懂,所附圖式之詳細說明如下: 第1圖繪示根據本發明一實施例的觸控面板100的示意圖; 第2圖繪示根據本發明一實施例的觸控面板100的局部放大圖; 第3圖繪示根據本發明一實施例的觸控面板300的剖面示意圖;以及 第4-6圖繪示根據本發明的一些實施例的觸控面板100的示意圖。 In order to make the above and other objectives, features, advantages and implementations of this disclosure more obvious and understandable, the detailed description of the attached drawings is as follows: FIG. 1 shows a schematic diagram of a touch panel 100 according to an embodiment of the invention; FIG. 2 shows a partial enlarged view of the touch panel 100 according to an embodiment of the invention; FIG. 3 is a schematic cross-sectional view of a touch panel 300 according to an embodiment of the invention; and 4-6 show schematic diagrams of the touch panel 100 according to some embodiments of the present invention.

110:基板 110: substrate

121:觸控感測電極 121: Touch sensing electrode

130:連接墊 130: connection pad

131:連接線 131: connection line

140:軟性電路板 140: flexible circuit board

141:導線組 141: Wire Group

145:第一導線 145: first wire

146:第二導線 146: second wire

150:控制晶片 150: control chip

D:虛設組 D: Dummy group

S:感測組 S: Sensing group

C1:第一感測通道 C1: The first sensing channel

C2:第二感測通道 C2: second sensing channel

Claims (9)

一種觸控面板,包含:一基板;複數個觸控感測電極,配置於該基板上,該些觸控感測電極分為一感測組及一虛設組;複數個連接墊,配置於該基板上,其中各該觸控感測電極分別透過一連接線與該些連接墊之一者電性連接;一軟性電路板,包含複數個導線組,各該導線組分別僅連接對應該感測組的該些觸控感測電極的該些連接墊;以及一控制晶片,該感測組的該些觸控感測電極透過該些導線組電性連接至該控制晶片,其中該虛設組的該些觸控感測電極配置以作為虛設電極,並且該虛設組的該些觸控感測電極未與該控制晶片電性連接。 A touch panel includes: a substrate; a plurality of touch sensing electrodes arranged on the substrate, the touch sensing electrodes are divided into a sensing group and a dummy group; a plurality of connecting pads are arranged on the substrate On the substrate, each of the touch sensing electrodes is electrically connected to one of the connection pads through a connecting wire; a flexible circuit board includes a plurality of wire groups, and each of the wire groups is only connected to the corresponding sensing The connecting pads of the touch sensing electrodes of the group; and a control chip, the touch sensing electrodes of the sensing group are electrically connected to the control chip through the wire groups, wherein the dummy group The touch sensing electrodes are configured as dummy electrodes, and the touch sensing electrodes of the dummy group are not electrically connected to the control chip. 如請求項1所述之觸控面板,其中該軟性電路板配置以將部分的該感測組的該些觸控感測電極互相電性連接,以形成一第一感測通道,該軟性電路板配置以將另一部分的該感測組的該些觸控感測電極互相電性連接,以形成一第二感測通道,該第一感測通道不同於該第二感測通道。 The touch panel according to claim 1, wherein the flexible circuit board is configured to electrically connect part of the touch sensing electrodes of the sensing group to each other to form a first sensing channel, and the flexible circuit The board is configured to electrically connect the touch sensing electrodes of the other part of the sensing group to form a second sensing channel, and the first sensing channel is different from the second sensing channel. 如請求項1所述之觸控面板,其中各該導線組包含複數條第一導線以及一第二導線,其中各該第一導線分別連接對應該感測組的各該觸控感測電極的各該連 接墊,該第二導線匯整相鄰的該些第一導線並電性連接至該控制晶片。 The touch panel according to claim 1, wherein each of the wire groups includes a plurality of first wires and a second wire, and each of the first wires is connected to each of the touch sensing electrodes of the sensing group. Each company The pad, the second wire gathers the adjacent first wires and is electrically connected to the control chip. 如請求項1所述之觸控面板,其中各該觸控感測電極之間的間隔為1毫米至10毫米。 The touch panel according to claim 1, wherein the interval between the touch sensing electrodes is 1 mm to 10 mm. 如請求項1所述之觸控面板,其中該控制晶片配置於該軟性電路板上。 The touch panel according to claim 1, wherein the control chip is disposed on the flexible circuit board. 如請求項1所述之觸控面板,其中該些觸控感測電極中,該感測組的各該觸控感測電極與該虛設組的各該觸控感測電極在水平方向上交錯配置。 The touch panel according to claim 1, wherein among the touch sensing electrodes, each of the touch sensing electrodes of the sensing group and each of the touch sensing electrodes of the dummy group are staggered in a horizontal direction Configuration. 如請求項1所述之觸控面板,其中各該觸控感測電極的寬度為0.5毫米至9.99毫米。 The touch panel according to claim 1, wherein the width of each touch sensing electrode is 0.5 mm to 9.99 mm. 如請求項1所述之觸控面板,其中該些觸控感測電極包含氧化銦錫、奈米銀線、石墨烯或金屬網格。 The touch panel according to claim 1, wherein the touch sensing electrodes comprise indium tin oxide, nano silver wire, graphene or metal grid. 如請求項1所述之觸控面板,其中各該導線組自各該連接墊延伸至該控制晶片。 The touch panel according to claim 1, wherein each of the wire groups extends from each of the connection pads to the control chip.
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