TWI717065B - Touch panel - Google Patents
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- TWI717065B TWI717065B TW108138111A TW108138111A TWI717065B TW I717065 B TWI717065 B TW I717065B TW 108138111 A TW108138111 A TW 108138111A TW 108138111 A TW108138111 A TW 108138111A TW I717065 B TWI717065 B TW I717065B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
Description
本發明係關於觸控面板。The present invention relates to a touch panel.
一般而言,觸控面板可分為電阻式觸控面板以及電容式觸控面板。電阻式觸控面板係藉由施加壓力而產生的玻璃與電極之間產生的短路現象而感測使用者觸控的位置。電容式觸控面板則是藉由觸碰而使得電極之電容值產生變化而感測使用者觸控的位置。Generally speaking, touch panels can be classified into resistive touch panels and capacitive touch panels. The resistive touch panel senses the position of the user's touch by the short-circuit phenomenon between the glass and the electrode caused by the application of pressure. The capacitive touch panel senses the position of the user's touch by changing the capacitance value of the electrode by touching it.
然而,電容式觸控面板的觸控偵測會受到蓋板的材質與厚度影響。一般來說,電容式觸控面板的感測電極需要搭配蓋板來設計,不同的蓋板材料或不同的蓋板厚度需要搭配不同的感測電極的配置。如此一來,將大幅增加產品開發的成本,亦使產品開發的速度降低。因此,亟需一種新穎的觸控面板,可以改善上述問題。However, the touch detection of the capacitive touch panel is affected by the material and thickness of the cover. Generally speaking, the sensing electrodes of a capacitive touch panel need to be designed with a cover plate, and different cover plate materials or different cover plate thicknesses need to be matched with different sensor electrode configurations. As a result, it will significantly increase the cost of product development and reduce the speed of product development. Therefore, there is an urgent need for a novel touch panel that can improve the above problems.
本揭露之一態樣,係提供一種觸控面板,包含基板、複數個觸控感測電極、複數個連接墊、軟性電路板及控制晶片。觸控感測電極配置於基板上,觸控感測電極分為一感測組及一虛設組。連接墊配置於基板上,其中各觸控感測電極分別透過連接線與連接墊之一者電性連接。軟性電路板包含複數個導線組,各導線組分別連接對應感測組的觸控感測電極的連接墊。感測組的觸控感測電極透過導線組電性連接至控制晶片,其中虛設組的觸控感測電極配置以作為虛設電極。One aspect of this disclosure provides a touch panel, which includes a substrate, a plurality of touch sensing electrodes, a plurality of connection pads, a flexible circuit board, and a control chip. The touch sensing electrodes are arranged on the substrate, and the touch sensing electrodes are divided into a sensing group and a dummy group. The connection pads are arranged on the substrate, and each touch sensing electrode is electrically connected to one of the connection pads through a connection wire. The flexible circuit board includes a plurality of wire groups, and each wire group is respectively connected to the connection pad of the touch sensing electrode of the corresponding sensing group. The touch sensing electrodes of the sensing group are electrically connected to the control chip through the wire group, wherein the touch sensing electrodes of the dummy group are configured as dummy electrodes.
根據本揭露一或多個實施方式,軟性電路板配置以將部分的感測組的觸控感測電極互相電性連接,以形成一第一感測通道,軟性電路板配置以將另一部分的感測組的觸控感測電極互相電性連接,以形成一第二感測通道,第一感測通道不同於第二感測通道。According to one or more embodiments of the present disclosure, the flexible circuit board is configured to electrically connect part of the touch sensing electrodes of the sensing group to form a first sensing channel, and the flexible circuit board is configured to connect another part of the The touch sensing electrodes of the sensing group are electrically connected to each other to form a second sensing channel. The first sensing channel is different from the second sensing channel.
根據本揭露一或多個實施方式,各導線組包含複數條第一導線以及一第二導線,其中各第一導線分別連接對應感測組的各觸控感測電極的各連接墊,第二導線匯整相鄰的第一導線並電性連接至控制晶片。According to one or more embodiments of the present disclosure, each wire group includes a plurality of first wires and a second wire, wherein each first wire is connected to each connection pad of each touch sensing electrode of the corresponding sensing group, and the second The wires gather adjacent first wires and are electrically connected to the control chip.
根據本揭露一或多個實施方式,各觸控感測電極之間的間隔為1毫米至10毫米。According to one or more embodiments of the present disclosure, the interval between each touch sensing electrode is 1 mm to 10 mm.
根據本揭露一或多個實施方式,控制晶片配置於軟性電路板上。According to one or more embodiments of the present disclosure, the control chip is configured on the flexible circuit board.
根據本揭露一或多個實施方式,虛設組的觸控感測電極未與控制晶片電性連接。According to one or more embodiments of the present disclosure, the touch sensing electrodes of the dummy group are not electrically connected to the control chip.
根據本揭露一或多個實施方式,觸控感測電極中,感測組的各觸控感測電極與虛設組的各觸控感測電極在水平方向上交錯配置。According to one or more embodiments of the present disclosure, among the touch sensing electrodes, each touch sensing electrode of the sensing group and each touch sensing electrode of the dummy group are alternately arranged in a horizontal direction.
根據本揭露一或多個實施方式,各觸控感測電極的寬度為0.5毫米至9.99毫米。According to one or more embodiments of the present disclosure, the width of each touch sensing electrode is 0.5 mm to 9.99 mm.
根據本揭露一或多個實施方式,觸控感測電極包含氧化銦錫、奈米銀線、石墨烯或金屬網格。According to one or more embodiments of the present disclosure, the touch sensing electrode includes indium tin oxide, nano silver wire, graphene, or metal grid.
根據本揭露一或多個實施方式,各導線自各連接墊延伸至控制晶片。According to one or more embodiments of the present disclosure, each wire extends from each connection pad to the control chip.
以下揭露提供許多不同實施例,或示例,以建置所提供之標的物的不同特徵。以下敘述之成份和排列方式的特定示例是為了簡化本公開。這些當然僅是做為示例,其目的不在構成限制。舉例而言,元件的尺寸不被揭露之範圍或數值所限制,但可以取決於元件之製程條件與/或所需的特性。此外,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。為了簡單與清晰起見,不同特徵可以任意地繪示成不同大小。The following disclosure provides many different embodiments, or examples, to implement different features of the provided subject matter. The specific examples of the components and arrangements described below are for simplifying the present disclosure. These are of course only examples, and their purpose is not to constitute a limitation. For example, the size of the device is not limited by the disclosed range or value, but may depend on the process conditions and/or required characteristics of the device. In addition, the description that the first feature is formed on or above the second feature includes an embodiment where the first feature and the second feature are in direct contact, and also includes other features formed between the first feature and the second feature, so that the first feature An embodiment where the first feature and the second feature are not in direct contact. For simplicity and clarity, different features can be arbitrarily drawn in different sizes.
再者,空間相對性用語,例如「下方(beneath)」、「在…之下(below)」、「低於(lower)」、「在…之上(above)」、「高於(upper)」等,是為了易於描述圖式中所繪示的元素或特徵和其他元素或特徵的關係。空間相對性用語除了圖式中所描繪的方向外,還包含元件在使用或操作時的不同方向。儀器可以其他方式定向(旋轉90度或在其他方向),而本文所用的空間相對性描述也可以如此解讀。Furthermore, the terms of spatial relative terms, such as "beneath", "below", "lower", "above", "upper" ", etc., in order to easily describe the relationship between the elements or features depicted in the drawings and other elements or features. In addition to the directions described in the diagrams, the terms of spatial relativity also include different directions of the elements in use or operation. The instrument can be oriented in other ways (rotated 90 degrees or in other directions), and the description of spatial relativity used herein can also be interpreted in this way.
第1圖繪示根據本發明一實施例的觸控面板100的示意圖。第2圖繪示根據本發明一實施例的觸控面板100的局部放大圖。請同時參考第1圖及第2圖,觸控面板100包含基板110、觸控感測電極層120、複數個連接墊130、軟性電路板140及控制晶片150。FIG. 1 is a schematic diagram of a
觸控感測電極層120配置於基板110上,其中觸控感測電極層120包含複數個觸控感測電極121。在某些實施例中,觸控感測電極121在水平方向上排列於基板110上。在某些實施例中,觸控感測電極121包含氧化銦錫、奈米銀線、石墨烯或金屬網格。在一些實施例中,觸控感測電極121為長條形(bar type)。在某些實施例中,觸控感測電極121之間的間隔為1毫米至10毫米,例如2毫米、4毫米、6毫米或8毫米。在一些實施例中,觸控感測電極121的寬度為0.5毫米至9.99毫米,例如1毫米、3毫米、5毫米、7毫米或9毫米。The touch
連接墊130配置於基板110上,其中各觸控感測電極121分別透過一連接線131與連接墊130之一者電性連接。在一些實施例中,連接墊130包含導電材料,例如金屬。連接墊130係作為觸控感測電極層120連接外部線路的接點,因此可以使用任何合適的導電材料。The
軟性電路板140包含複數個導線組141。上述的觸控感測電極121分為感測組S及虛設組D(虛設電極)。各導線組141分別連接對應感測組S的觸控感測電極121的連接墊130。在一些實施例中,導線組141包含複數條第一導線145以及一第二導線146。各個第一導線145分別連接對應感測組S的各觸控感測電極121的各連接墊130,而第二導線146匯整相鄰的第一導線145並電性連接至控制晶片150。換句話說,第二導線146將相鄰的第一導線145彼此電性連接,並將相鄰的第一導線145電性連接至控制晶片150。The
感測組S的觸控感測電極121透過導線組141電性連接至控制晶片150。在一些實施例中,導線組141自各連接墊130延伸至控制晶片150。由於僅有感測組S的觸控感測電極121與控制晶片150電性連接,因此虛設組D的觸控感測電極121係作為虛設電極。在某些實施例中,虛設組D的觸控感測電極121亦與導線組141電性連接,但是與虛設組D的觸控感測電極121連接的導線組141不會延伸至控制晶片150,亦不會與控制晶片150電性連接。在某些實施例中,控制晶片150配置於該軟性電路板140上。在另一些實施例中,控制晶片150配置於與軟性電路板140不同的電路板上。The
如第2圖所示,在一些實施例中,軟性電路板140配置以將部分的感測組S的觸控感測電極121互相電性連接,以形成第一感測通道C1。此外,軟性電路板140亦配置以將另一部分的感測組S的觸控感測電極121互相電性連接,以形成第二感測通道C2。第一感測通道C1不同於第二感測通道C2。而且,在第一感測通道C1與第二感測通道C2之間具有虛設組D的觸控感測電極121構成的虛設電極作為間隔。需了解的是,第1圖及第2圖僅繪示部分數量的觸控感測電極121,觸控面板100亦可以包含超過兩個感測通道,且各感測通道之間亦具有虛設電極。As shown in FIG. 2, in some embodiments, the
也就是說,在不改變觸控感測電極層120的情況下,可以藉由調整軟性電路板140的配置,以形成不同的感測通道,例如寬度不同的感測通道。由於可以調整感測通道的寬度,亦即可以調整感測通道包含的觸控感測電極121的數量(與控制晶片150電性連接之電極),因此亦可以藉由軟性電路板140調整虛設電極的寬度(未與控制晶片150電性連接之電極)。That is to say, without changing the touch
需了解的是,本發明所繪示之觸控感測電極121及連接墊130的數量以及配置方式皆係例示性的,可以依照需求任意調整。It should be understood that the number and configuration of the
請參考第3圖,其繪示根據本發明一實施例的觸控面板300的剖面示意圖。觸控面板300包含第一基板310、第一觸控感測層320、第二基板330、第二觸控感測層340及蓋板350。第一基板310及第二基板330類似於第1圖的基板110,而第一觸控感測層320及第二觸控感測層340類似於第1圖的觸控感測電極層120。此外,第一觸控感測層320及第二觸控感測層340的側邊亦配置類似於軟性電路板140的軟性電路板(為了簡潔起見,第3圖未繪示軟性電路板)。在觸控面板300的架構中,第一觸控感測層320及第二觸控感測層340包含沿著不同方向延伸的觸控感測電極,例如第一觸控感測層320包含沿X方向延伸的觸控感測電極,而第二觸控感測層340包含沿Y方向延伸的觸控感測電極。Please refer to FIG. 3, which shows a schematic cross-sectional view of a
蓋板350可以作為保護層,增加觸控面板300的機械強度,避免第一觸控感測層320及第二觸控感測層340受到損傷。然而,如同先前技術段落所述,蓋板350的材質及厚度會影響觸控感測的效果,因此不同厚度或材質的蓋板350需要搭配不同寬度的感測通道以及不同寬度的虛設電極。一般來說,蓋板的厚度越大,則感測通道及虛設電極的寬度需要越大。本發明的配置可以在不改變觸控感測層的情況下,任意調整感測通道以及虛設電極的寬度。換句話說,只需要改變軟性電路板的配置,即可使同一個觸控感測層適應各種不同的蓋板,大幅降低產品開發的成本與時間。The
第4-6圖繪示根據本發明的一些實施例的觸控面板100的示意圖。詳細而言,第4-6圖的實施例包含相同的觸控感測層,並例示性的繪示藉由不同配置的軟性電路板,而改變感測通道C以及虛設電極D的寬度。第4圖的實施例繪示當蓋板較厚時,需要較寬的感測通道C及虛設電極D。因此,係以三個觸控感測電極121作為一個感測通道C,並以兩個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約6毫米,虛設電極D的寬度為約4毫米。4-6 show schematic diagrams of the
第5圖的實施例繪示當蓋板較薄時,需要較窄的感測通道C及虛設電極D。因此,係以兩個觸控感測電極121作為一個感測通道C,並以一個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約4毫米,虛設電極D的寬度為約2毫米。The embodiment in FIG. 5 shows that when the cover plate is thinner, a narrower sensing channel C and dummy electrode D are required. Therefore, two
第6圖的實施例繪示將感測通道數量減少,以降低控制晶片的成本。因此,係以四個觸控感測電極121作為一個感測通道C,並以三個觸控感測電極121作為虛設電極D。舉例來說,感測通道C的寬度為約8毫米,虛設電極D的寬度為約6毫米。The embodiment in FIG. 6 shows that the number of sensing channels is reduced to reduce the cost of the control chip. Therefore, four
為了清楚說明的目的,第4-6圖並未繪示完整數量的觸控感測電極。在一些實施例中,觸控感測層的兩側可以為感測通道。在另一些實施例中,觸控感測層的兩側可以為虛設電極。在某些實施例中,觸控感測層的一側可以為感測通道,而另一側為虛設電極。For the purpose of clear description, Figures 4-6 do not show a complete number of touch sensing electrodes. In some embodiments, both sides of the touch sensing layer may be sensing channels. In other embodiments, the two sides of the touch sensing layer may be dummy electrodes. In some embodiments, one side of the touch sensing layer may be a sensing channel, and the other side may be a dummy electrode.
本發明藉由調整軟性電路板的導線配置,控制與控制晶片電性連接的觸控感測電極的數量,以改變感測通道以及虛設電極的寬度。因此,可以使用同一個觸控感測層搭配不同材質或厚度的蓋板。如此一來,可以大幅降低產品開發的成本,產品開發的速度亦可以提昇。The present invention controls the number of touch sensing electrodes electrically connected to the control chip by adjusting the wire configuration of the flexible circuit board, so as to change the width of the sensing channel and the dummy electrode. Therefore, the same touch sensing layer can be used with cover plates of different materials or thicknesses. In this way, the cost of product development can be greatly reduced, and the speed of product development can also be increased.
本揭露已經詳細地描述某些實施方式,但其他的實施方式也是可能的。因此,所附請求項的精神和範疇不應限於本文所描述的實施方式。This disclosure has described some embodiments in detail, but other embodiments are also possible. Therefore, the spirit and scope of the appended claims should not be limited to the embodiments described herein.
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何熟習此技術者,在不脫離本揭露之精神與範圍內,當可作各種更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above manner, it is not intended to limit this disclosure. Anyone familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the protection scope of this disclosure The scope of the patent application attached hereafter shall prevail.
100、300:觸控面板 110:基板 120:觸控感測電極層 121:觸控感測電極 130:連接墊 131:連接線 140:軟性電路板 141:導線組 145:第一導線 146:第二導線 150:控制晶片 310:第一基板 320:第一觸控感測層 330:第二基板 340:第二觸控感測層 350:蓋板 D:虛設組 S:感測組 C:感測通道 C1:第一感測通道 C2:第二感測通道 100, 300: touch panel 110: substrate 120: Touch sensing electrode layer 121: Touch sensing electrode 130: connection pad 131: connection line 140: flexible circuit board 141: Wire Group 145: first wire 146: second wire 150: control chip 310: First substrate 320: The first touch sensing layer 330: second substrate 340: second touch sensing layer 350: cover D: Dummy group S: Sensing group C: Sensing channel C1: The first sensing channel C2: second sensing channel
為讓本揭露之上述和其他目的、特徵、優點與實施方式能更明顯易懂,所附圖式之詳細說明如下:
第1圖繪示根據本發明一實施例的觸控面板100的示意圖;
第2圖繪示根據本發明一實施例的觸控面板100的局部放大圖;
第3圖繪示根據本發明一實施例的觸控面板300的剖面示意圖;以及
第4-6圖繪示根據本發明的一些實施例的觸控面板100的示意圖。
In order to make the above and other objectives, features, advantages and implementations of this disclosure more obvious and understandable, the detailed description of the attached drawings is as follows:
FIG. 1 shows a schematic diagram of a
110:基板 110: substrate
121:觸控感測電極 121: Touch sensing electrode
130:連接墊 130: connection pad
131:連接線 131: connection line
140:軟性電路板 140: flexible circuit board
141:導線組 141: Wire Group
145:第一導線 145: first wire
146:第二導線 146: second wire
150:控制晶片 150: control chip
D:虛設組 D: Dummy group
S:感測組 S: Sensing group
C1:第一感測通道 C1: The first sensing channel
C2:第二感測通道 C2: second sensing channel
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