TWI711195B - Multi-layer piezoelectric ceramic element and method of manufacturing the same - Google Patents

Abstract

A method of manufacturing a multi-layer piezoelectric ceramic element includes following steps. A plurality of first trenches are formed in a sintered ceramic. The first trenches extend inward from a first side surface of the sintered ceramic. Any two neighboring first trenches are not connected with each other. A plurality of first inner electrodes are formed in the first trenches. The first inner electrodes extend from a first side surface of the sintered ceramic to a second side surface of the sintered ceramic. A plurality of second trenches are formed in a sintered ceramic. The second trenches extend inward from a second side surface of the sintered ceramic. Any two neighboring second trenches are not connected with each other. The first trenches overlap the second trenches. The first trenches and the second trenches are alternately arranged. A plurality of second inner electrodes are formed in the second trenches. A first outer electrode is formed and electrically connected with the first inner electrodes. A second outer electrode is formed and electrically connected with the second inner electrodes.

Description

Multilayer piezoelectric ceramic element and manufacturing method thereof

The invention relates to a multilayer piezoelectric ceramic element and a manufacturing method thereof, and particularly relates to a multilayer piezoelectric ceramic element formed under low-temperature processing conditions.

The multilayer piezoelectric ceramic element formed by the traditional multilayer co-firing process includes the following steps. The ceramic raw materials are mixed and ground into fine powder. The powder is molded and a ceramic green sheet is formed through a die. Afterwards, using printing or etching techniques, electrode patterns are formed on different ceramic green sheets. A plurality of ceramic green sheets with electrode patterns are stacked together and pressed together. The laminated ceramic green sheet is cut into unit substrates of the same size and sintered at high temperature.

However, the high-temperature sintering process is prone to some problems. For example, a high sintering temperature easily oxidizes the electrode material in the multilayer piezoelectric ceramic component, and the electrode material may diffuse into the ceramic, resulting in a decrease in the performance of the multilayer piezoelectric ceramic component. In addition, it is more likely to cause problems of different sizes or unstable yield of finished products.

According to various embodiments of the present invention, there is provided a method for manufacturing a multilayer piezoelectric ceramic element, including: providing a ceramic cooked embryo, the ceramic cooked embryo having a top surface, a bottom surface, a first side surface, and a second side surface, and the second side surface is opposite to The first side. A first groove is formed, extending inward from the first side surface, and two adjacent first grooves are not connected to each other. A first internal electrode is formed in the first trench, and the first internal electrode extends inward from the first side surface. A second groove is formed, extending inward from the second side surface, two adjacent second grooves are not connected to each other, and the first groove and the second groove are overlapped and arranged in a staggered manner. A second internal electrode is formed in the second trench. The first external electrode is formed to be electrically connected to the first internal electrode. The second external electrode is formed to be electrically connected to the second internal electrode.

In some embodiments, the ceramic cooked embryo comprises barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, or zirconium oxide.

In some embodiments, the step of forming the first internal electrode and the second internal electrode includes: filling electrode glue in the first groove, drying, and curing. Fill the electrode glue in the second groove, dry and solidify.

In some embodiments, the step of forming the first groove or forming the second groove includes using a cutting process, and the cutting process includes using a water jet, an ultrasonic knife, a diamond knife, a diamond wire, or a combination thereof.

In some embodiments, the ultrasonic tool includes a plurality of blades, and each blade has a planar structure, a curved surface structure, a zigzag structure, or an irregular structure.

In some embodiments, the temperature for drying the electrode glue is between 60°C and 750°C.

In some embodiments, the electrode paste includes at least one metal, and the metal is silver, copper, gold or aluminum.

Various embodiments of the present invention provide a multilayer piezoelectric ceramic element, including: a ceramic body, a first internal electrode, a second internal electrode, a first external electrode, and a second external electrode. The ceramic body has a top surface, a bottom surface, a first side surface, a second side surface, a first groove, and a second groove. The second side is opposite to the first side. The first groove extends inward from the first side surface, and two adjacent first grooves are not connected to each other. The second groove extends inward from the second side surface, two adjacent second grooves are not connected to each other, and the first groove and the second groove are overlapped and arranged in a staggered manner, wherein the first groove and the second groove The groove is formed by ultrasonic processing, and the aspect ratio of the first groove and the second groove is between 1-50. The first internal electrode is located in the first trench and fills the first trench. The second internal electrode is located in the second trench and fills the second trench. The first external electrode is disposed on the first side surface and the top surface. The second external electrode is disposed on the second side surface and the bottom surface.

In some embodiments, the first internal electrode and the second internal electrode each include a first curved surface, and the first curved surface has a radius of curvature ranging from 1×10 ⁻⁶ meters to 1 meter.

In certain embodiments, the ceramic body comprises barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, or zirconium oxide.

Through the above-mentioned embodiments, the multilayer piezoelectric ceramic element can be formed in a low temperature environment, thereby preventing the metal in the electrode colloid from diffusing into the ceramic and affecting the performance of the multilayer piezoelectric ceramic element, or avoiding oxidation of the electrode colloid in a high temperature environment. In order to make the above and other objectives, features, and advantages of the present invention more obvious and understandable, the following specifically enumerates preferred embodiments, which are described in detail in conjunction with the accompanying drawings.

The manufacture and use of this embodiment will be discussed in detail below. However, it should be understood that the present invention provides practical innovative concepts, which can be presented with a wide variety of specific content. The embodiments or examples described below are merely illustrative, and cannot limit the scope of the present invention.

In addition, in this article, in order to easily describe the relationship between a certain element or feature drawn in the diagram and other elements or features, spatial relative terms, such as "below", "below", "below" "", "above", "above" and similar terms. These spatially relative terms are intended to cover all different directions when the element is used or operated, and are not limited to the directions drawn in the drawings. The device can be oriented in other ways (rotated by 90 degrees or set in another direction), and the spatial relative descriptors used herein can be interpreted accordingly.

Various embodiments of the multilayer piezoelectric ceramic element and the manufacturing method thereof are provided below, in which the structure and properties of the multilayer piezoelectric ceramic element and the manufacturing steps of the multilayer piezoelectric ceramic element are described in detail.

FIG. 1 is a flowchart of a method 100 for manufacturing a multilayer piezoelectric ceramic element according to some embodiments. As shown in Figure 1, the method 10 includes step S11, step S12, step S13, step S14, step S15, and step S16. It is understood that additional steps may be provided before, during, or after the method 10, and some of the following steps can be replaced or deleted as additional embodiments of the manufacturing method.

Figures 2A-2F show schematic cross-sectional views of various process stages for preparing multilayer piezoelectric ceramic components according to some embodiments of the present invention. Please refer to FIG. 1 and FIG. 2A, the method 10 starts in step S11, and a ceramic cooked embryo is provided. As shown in FIG. 2A, according to some embodiments of the present invention, the ceramic preform 210 includes a top surface 210a, a bottom surface 210b, a first side surface 210c, and a second side surface 210d. The second side surface 210d is opposite to the first side surface 210c.

In some embodiments, the ceramic preforms contain piezoelectric materials. The piezoelectric materials can be, for example, barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, sodium bismuth titanate, or other multilayer piezoelectric ceramic components. Any ceramic material.

Referring to FIGS. 1 and 2B, the method 10 proceeds to step S12 to form a first trench extending inward from the first side surface, and two adjacent first trenches are not connected to each other. According to some embodiments of the present invention, as shown in FIG. 2B, a first groove 220 is formed in the ceramic cooked blank 210, and the first groove 220 extends from the first side surface 210c to the second side surface 210d. In some embodiments, the method of forming the first groove 220 includes using a cutting process, and the cutting process includes using a water jet, an ultrasonic knife, a diamond knife, a diamond wire, or a combination thereof. In some embodiments, the first trenches 220 are parallel to each other and each first trench 220 has the same depth relative to the first side surface 210c.

Referring to FIG. 1 and FIG. 2C, the method 10 proceeds to step S13 to form a first internal electrode in the first trench, and the first internal electrode extends from the first side surface to the second side surface. As shown in FIG. 2C, the electrode glue 222 is filled in the first groove 220 and dried and cured to form the first internal electrode 224. In one embodiment, the electrode glue 222 includes at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In another embodiment, the drying temperature of the electrode glue is between 60°C and 750°C, such as 100°C, 200°C, 300°C, 400°C, 500°C, 600°C, or 700°C.

If low-temperature electrode glue is used, it can be dried and cured at 60°C to 400°C. If the high temperature electrode glue is used, although the acceptable drying and curing temperature of the high temperature electrode glue is as high as 900°C or higher, it is better to control the temperature not higher than 750°C. Due to an excessively high temperature, such as 900° C., a portion of the polymer in the electrode glue will be pyrolyzed and the density of the subsequently formed electrode will decrease.

1 and 2D, the method 10 proceeds to step S14 to form a second trench extending inward from the second side surface, two adjacent second trenches are not connected to each other, and the first trench and The second grooves are overlapped and staggered. According to some embodiments of the present invention, as shown in FIG. 2D, a second groove 230 is formed in the ceramic cooked blank 210, and the second groove 230 extends from the second side surface 210d toward the first side surface 210c. In some embodiments, the method of forming the second groove 230 includes using a cutting process, and the cutting process includes using a water jet, an ultrasonic knife, a diamond knife, a diamond wire, or a combination thereof. In some embodiments, the second trenches 230 are parallel to each other and the second trench 230 is parallel to the first trench 220. In another embodiment, the second grooves 230 have the same depth relative to the second side surface 210d.

Referring to FIG. 1 and FIG. 2E, method 10 proceeds to step S15 to form a second internal electrode in the second trench. After the second trench 230 is formed, as shown in FIG. 2E, the electrode glue 232 is filled in the second trench 230 and dried and cured to form the second internal electrode 234. Two adjacent second internal electrodes 234 are not connected to each other, and the first internal electrodes 224 and the second internal electrodes 234 overlap and are arranged in a staggered manner. In some embodiments, the electrode glue 232 includes at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In some embodiments, the drying temperature of the electrode glue is between 60°C and 750°C, such as 100°C, 200°C, 300°C, 400°C, 500°C, 600°C, or 700°C.

It should be noted that if the second groove 230 is formed after the first groove 220 is formed and before the electrode glue 222 is filled, the ceramic cooked blank 210 may be broken during the process of forming the second groove 230.

Referring to FIGS. 1 and 2F, method 10 proceeds to step S16, forming a first external electrode electrically connected to the first internal electrode, and forming a second external electrode electrically connected to the second internal electrode. As shown in FIG. 2F, in some embodiments, the external electrode 242 is formed on the top surface 210a and the second side surface 210d, and the external electrode 244 is formed on the bottom surface 210b and the first side surface 210c. The external electrode 242 is electrically connected to the second electrode 234. The external electrode 244 is electrically connected to the first electrode 224. In one embodiment, the method of forming the external electrode 242 includes coating electrode glue on the top surface 210a and the second side surface 210d. The method of forming the external electrode 244 includes coating electrode glue on the bottom surface 210b and the first side surface 210c. The electrode glue contains at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate.

It is worth noting that ceramic co-firing technology is mainly used in the traditional production of multilayer piezoelectric ceramic components. However, the ceramic co-firing technology includes a high-temperature sintering process. During high-temperature sintering, the electrode colloid may diffuse into the ceramic, resulting in the performance degradation of the multilayer piezoelectric ceramic element. Through the above-mentioned method 10 provided by the present invention, a multilayer piezoelectric ceramic element can be formed in a low temperature environment, thereby preventing the metal in the electrode colloid from diffusing into the ceramic and affecting the performance of the multilayer piezoelectric ceramic element, or avoiding the use of The electrode colloid is oxidized.

Figures 3A-3G show schematic cross-sectional views of various process stages for preparing multilayer piezoelectric ceramic components according to some embodiments of the present invention, wherein the internal electrodes of the multilayer piezoelectric ceramic components have a curved or non-planar structure. Please refer to Fig. 1 and Figs. 3A-3B. Method 10 starts at step S11 to provide a ceramic cooked embryo. As shown in FIG. 3A, according to some embodiments of the present invention, the ceramic preform 310 includes a top surface 310a, a bottom surface 310b, a first side surface 310c, and a second side surface 310d. The second side surface 310d is opposite to the first side surface 310c.

In some embodiments, the ceramic preforms contain piezoelectric materials. The piezoelectric materials can be, for example, barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, sodium bismuth titanate, or other multilayer piezoelectric ceramic components. Any ceramic material.

As shown in Figure 3B, in one embodiment, specific surfaces of the ceramic cooked embryo 310 can be selectively processed. For example, the top surface 310a and the bottom surface 310b of the ceramic cooked embryo 310 are processed to form the processed top surface 312a and the processed bottom surface, respectively. 312b. For example, the processed top surface 312a and the processed bottom surface 312b may each have a radius of curvature, and the radius of curvature is between 1×10 ^-6 meters to 1 meter.

Referring to FIGS. 1, 3C and 4, the method 10 proceeds to step S12 to form a first groove extending inward from the first side surface, and two adjacent first grooves are not connected to each other. According to some embodiments of the present invention, as shown in FIG. 3C, a first groove 320 is formed in the ceramic cooked blank 310, and the first groove 320 extends from the first side surface 310c to the second side surface 310d. In one embodiment, the method of forming the first groove 320 includes using a cutting process, and the cutting process includes using a water jet, an ultrasonic knife, a diamond knife, a diamond wire, or a combination thereof. In another embodiment, the first groove 320 has a curved surface 320a, and the radius of curvature of the curved surface 320a ranges from 1×10 ⁻⁶ meters to 1 meter.

In a specific embodiment, an ultrasonic tool is used to form the grooves in the ceramic cooked blank 310. Please refer to FIG. 4. FIG. 4 shows a part of the ultrasonic processing and forming device. The ultrasonic processing and forming device includes a horn 410 and a blade 420. The horn 410 is connected to an ultrasonic generator (not shown). The ultrasonic generator generates ultrasonic vibration of a predetermined frequency and transmits it to the horn 410 and the blade 420 to cause resonance. The blade 420 is then used to process the workpiece. By adjusting the number, thickness, shape, and/or spacing between the blades 420, a groove of a specific shape can be formed in the ceramic cooked embryo 310, or the top, bottom or side surfaces of the ceramic cooked embryo 310 can be processed into Specific shape. For example, the blade 420 may have a planar structure, a curved structure, a zigzag structure, or an irregular structure.

1 and 3D, the method 10 proceeds to step S13 to form a first internal electrode in the first trench, and the first internal electrode extends from the first side to the second side. After the first trench 320 is formed, as shown in the 3D diagram, the electrode glue 322 is filled in the first trench 320 and dried and cured to form the first internal electrode 324. In one embodiment, the electrode glue 322 includes at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In another embodiment, the metal included in the electrode paste 322 is selected from the group consisting of silver, copper, gold, and aluminum. In another embodiment, the drying temperature of the electrode glue is between 60°C and 750°C, such as 100°C, 200°C, 300°C, 400°C, 500°C, 600°C, or 700°C.

1 and 3E, the method 10 proceeds to step S14 to form a second trench extending inward from the second side surface, two adjacent second trenches are not connected to each other, and the first trench is The second grooves are overlapped and staggered. According to some embodiments of the present invention, as shown in FIG. 3E, the second groove 330 is formed in the ceramic cooked blank 310, and the second groove 330 extends from the second side surface 310d toward the first side surface 310c. In some embodiments, the method of forming the second groove 330 includes using a cutting process, and the cutting process includes using a water jet, an ultrasonic knife, a diamond knife, a diamond wire, or a combination thereof. In another embodiment, the second groove 323 has a curved surface 330a, and the radius of curvature of the curved surface 330a is between 1×10 ^-6 meters to 1 meter.

Referring to FIG. 1 and FIG. 3F, the method 10 proceeds to step S15 to form a second internal electrode in the second trench. After the second trench 330 is formed, as shown in FIG. 3F, the electrode glue 332 is filled in the second trench 330 and dried and cured to form the second electrode 334. Two adjacent second electrodes 334 are not connected to each other, and the first inner electrodes 324 and the second electrodes 334 are overlapped and arranged in a staggered manner. In some embodiments, the electrode glue 332 includes at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In another embodiment, the metal included in the electrode paste 332 is selected from the group consisting of silver, copper, gold, and aluminum. In some embodiments, the drying temperature of the electrode glue is between 60°C and 750°C, such as 100°C, 200°C, 300°C, 400°C, 500°C, 600°C, or 700°C.

Referring to FIGS. 1 and 3G, the method 10 proceeds to step S16, forming a first external electrode electrically connected to the first internal electrode, and forming a second external electrode electrically connected to the second internal electrode. As shown in FIG. 3G, in some embodiments, the external electrode 342 is formed on the processed top surface 312a and the second side surface 310d, and the external electrode 344 is formed on the processed bottom surface 312b and the first side surface 310c. The external electrode 342 is electrically connected to the second electrode 334. The external electrode 344 is electrically connected to the first electrode 324. In one embodiment, forming the external electrode 342 includes coating electrode glue on the top surface 312a and the second side surface 310d. Forming the external electrode 344 includes coating electrode glue on the processed bottom surface 312b and the first side surface 310c. The electrode glue contains at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In one embodiment, the metal contained in the electrode paste is selected from the group consisting of silver, copper, gold, and aluminum.

According to another aspect of the present invention, a multilayer piezoelectric ceramic element is provided. In some embodiments, the multilayer piezoelectric ceramic element 300 includes a ceramic body 310, a first internal electrode 324, a second internal electrode 334, a first external electrode 342, and a second external electrode 344. The ceramic body 310 has a machined top surface 312a, a machined bottom surface 312b, a first side surface 310c, a second side surface 310d, a first groove 320, and a second groove 330. The second side surface 310d is opposite to the first side surface 310c. The first groove 320 extends inward from the first side surface 310c, and two adjacent first grooves 320 are not connected to each other. The second groove 330 extends inward from the second side surface 310d, and two adjacent second grooves 330 are not connected to each other. The first groove 320 and the second groove 330 overlap and are arranged in a staggered manner. The first groove 320 and the second groove 330 are formed by ultrasonic processing, and the aspect ratio of the first groove 320 and the second groove 330 is between 1 and 50, such as 2, 5, 8, 10, 15, 20, 25, 30, 35, 40 or 45. The first internal electrode 324 is located in the first trench 320 and fills the first trench 320. The second internal electrode 334 is located in the second trench 330 and fills the second trench 330. The first external electrode 342 is disposed on the first side surface 310c and the machined top surface 312a. The second external electrode 344 is disposed on the second side surface 310d and the processed bottom surface 312b. The external electrode 342 is electrically connected to the second electrode 334. The external electrode 344 is electrically connected to the first electrode 324. The first external electrode 342 and/or the second external electrode 344 include at least one metal or other conductive materials. The metal may be silver, copper, gold or aluminum, for example. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In one embodiment, the metal included in the first external electrode 342 and/or the second external electrode 344 is selected from the group consisting of silver, copper, gold, and aluminum.

Compared with traditional cutting tools, the ultrasonic processing used in this disclosure has many advantages. Ultrasonic processing provides high-precision processing capabilities, with an average error of less than 1μm, and can produce structures that are difficult to form, such as grooves with high aspect ratios. The low temperature working environment of ultrasonic processing can also make the properties of ceramics not affected by high temperature. The production speed of ultrasonic processing is fast, and it also meets the needs of mass production. In addition, by designing the shape of the ultrasonic tool, multilayer piezoelectric ceramic components with complex geometries can be manufactured. In contrast, the multilayer piezoelectric ceramic components formed by the traditional co-firing process can only be limited to simple geometric shapes.

In some embodiments, the first internal electrode 324 and the second internal electrode 334 contain metal elements (such as silver, copper, gold or aluminum), and the first internal electrode 324 and the second internal electrode 334 contain metal elements, The molar percentage of the content in the ceramic body 310 is less than 5%. In the multilayer piezoelectric ceramic component manufactured by the method 10, since the electrode does not need to be co-fired with the ceramic, the metal in the electrode will not diffuse into the ceramic of the multilayer piezoelectric ceramic component due to high temperature. Therefore, the ceramics can have the original material characteristics, and the performance and reliability of the multilayer piezoelectric ceramic components can be improved.

In some embodiments, the first internal electrode 324 includes a curved surface 324a. The second inner electrode 334 includes a curved surface 334a. The curved surfaces 324a and 334a have a radius of curvature ranging from 1×10 ^-6 meters to 1 meter.

In some embodiments, the ceramic body 310 is a ceramic cooked embryo. The ceramic body 310 includes barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, sodium bismuth titanate, or any other ceramic material that can be used as a multilayer piezoelectric ceramic element. In one embodiment, the first internal electrode 324 and the second internal electrode 334 include at least one metal or other conductive materials. The metal is silver, copper, gold or aluminum. Other conductive materials may be conductive ceramic materials such as strontium lanthanum manganate. In yet another embodiment, the ceramic body 310 may have a zigzag shape, an asymmetric shape or other irregular shapes.

As shown in FIG. 5, according to some embodiments of the present invention, a multilayer piezoelectric ceramic element 500 includes a ceramic body 510, a first internal electrode 524, a second internal electrode 534, and external electrodes 542 and 544. The ceramic body 510 includes a processed top surface 512a, a processed bottom surface 512b, a first processed side surface 512c, and a second processed side surface 512d. In one embodiment, the processed top surface 512a and the processed bottom surface 512b are zigzag shapes, and the processed top surface 512a and the processed bottom surface 512b are zigzag shapes. The processed top surface 512a includes included angles θ ₁ and θ ₂ , and the included angles θ ₁ and θ _{2 are} each between 60 ^∘ and 150 ^∘ , such as 90 ^∘ or 120 ^∘ . The processed top surface 512b includes included angles θ ₃ and θ ₄ , and the included angles θ ₃ and θ _{4 are} each between 60 ^∘ to 150 ^∘ , such as 90 ^∘ or 120 ^∘ . The first internal electrode 524 is disposed in the ceramic body 510, and the first internal electrode 524 extends from the first processing side surface 512c toward the second processing side surface 512d. The second internal electrode 534 is disposed in the ceramic body 510, and the second internal electrode 534 extends from the second processing side surface 512d toward the first processing side surface 512c. Each second internal electrode 534 and each first internal electrode 524 are alternately arranged, and the first projection area of each first internal electrode 524 on the processing bottom surface 512b overlaps with the second projection area of each second internal electrode 534 on the processing bottom surface 512b , And there is a part of the ceramic body 510 between each first internal electrode 524 and each adjacent second internal electrode 534. In an embodiment, the multilayer piezoelectric ceramic element 500 may be an actuator.

In summary, the various embodiments of the present invention provide methods for manufacturing multilayer piezoelectric ceramic components. The multilayer piezoelectric ceramic element can be formed in a low temperature environment, thereby preventing the metal in the electrode colloid from diffusing into the ceramic and affecting the performance of the multilayer piezoelectric ceramic element, or preventing the electrode colloid from oxidizing in a high temperature environment. Each embodiment of the present invention further provides a multilayer piezoelectric ceramic element. The multilayer piezoelectric ceramic element is prepared by the aforementioned method, which can control the size of the multilayer piezoelectric ceramic element and more accurately control the curvature of the multilayer piezoelectric ceramic element or its internal electrodes. Or flatness, thereby improving yield.

The feature structures of several embodiments are summarized above, so that those skilled in the art can better understand the aspects of the present invention. Those familiar with the art should understand that the present invention can be easily used as a basis for designing or modifying other processes and structures in order to implement the same purpose and/or achieve the same advantages of the embodiments described herein. Those familiar with the art should also realize that such equivalent structures do not depart from the spirit and scope of the present invention, and can make various changes, substitutions and alterations to the present invention without departing from the spirit and scope of the present invention .

10‧‧‧Methods S11, S12, S13, S14, S15, S16‧‧‧Steps 200, 300, 500‧‧‧Multilayer piezoelectric ceramic components 210, 310, 510‧‧‧Ceramic cooked blanks, ceramic main bodies 210a, 310a ‧‧‧Top surface 210b, 310b‧‧‧Bottom surface 210c, 310c‧‧‧First side surface 210d, 310d‧‧‧Second side surface 220, 320‧‧‧First groove 222, 322‧‧‧ Electrode glue 224, 324, 524‧‧‧First internal electrode 230, 330‧‧‧Second groove 232,332‧‧‧Electrode glue 234,334,524‧‧‧Second internal electrode 242,244‧‧‧External electrode 312a, 512a‧‧‧Machining top surface 312b, 512b‧‧‧Machining bottom surface 320a, 330a‧‧‧Curved surface 410‧‧‧Lamp 420‧‧‧Blade 512c‧‧‧First processing side 512d‧‧‧Second processing side θ ₁ , θ ₂ , θ ₃ , θ ₄ ‧‧‧Included angle

FIG. 1 is a flowchart of a method of manufacturing a multilayer piezoelectric ceramic element according to some embodiments. FIGS. 2A-2F and 3A-3G are schematic cross-sectional views of various process stages of a method for manufacturing a multilayer piezoelectric ceramic element according to some embodiments of the present invention. FIG. 4 is a schematic diagram of a part of an ultrasonic processing molding device according to some embodiments of the present invention. Figure 5 is a schematic cross-sectional view of a multilayer piezoelectric ceramic element according to some embodiments of the present invention.

310‧‧‧Ceramic body

310c‧‧‧First side

310d‧‧‧Second side

312a‧‧‧Machining top surface

312b‧‧‧Processing bottom surface

324‧‧‧First internal electrode

334‧‧‧Second inner electrode

Claims (9)

A method for manufacturing a multilayer piezoelectric ceramic element includes: providing a ceramic cooked blank having a top surface, a bottom surface, a first side surface, and a second side surface, the second side surface being opposite to the first side surface ; Form a plurality of first grooves extending inward from the first side surface, two adjacent first grooves are not connected to each other, and the first grooves do not penetrate the ceramic cooked embryo; forming a plurality of The first internal electrodes are in the first grooves, and the first internal electrodes extend from the first side surface toward the second side surface; a plurality of second grooves are formed, extending inward from the second side surface, and two-phase The adjacent second grooves are not connected to each other, the second grooves do not penetrate the ceramic cooked blank, and the first grooves and the second grooves are overlapped and arranged in a staggered manner, wherein the The steps of forming the first grooves or forming a plurality of second grooves include using a cutting process including using a water jet, an ultrasonic knife, a diamond knife, a diamond wire or a combination thereof; forming a plurality of second internal electrodes In the second trenches; forming a first external electrode electrically connected to the first internal electrodes; and forming a second external electrode electrically connected to the second internal electrodes. The method according to claim 1, wherein the ceramic cooked embryo comprises barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, or zirconium oxide. The method according to claim 1, wherein the step of forming the first internal electrodes and the second internal electrodes comprises: filling electrode glue in the first grooves, drying and curing; and filling electrodes Glue is dried and cured in the second grooves. The method according to claim 1, wherein the ultrasonic tool includes a plurality of blades, and each of the blades has a planar structure, an arc structure, a zigzag structure, or an irregular structure. The method according to claim 3, wherein a temperature for drying and curing the electrode glue is 60-750°C. The method according to claim 3, wherein the electrode glue includes at least one metal, and the metal is silver, copper, gold or aluminum. A multilayer piezoelectric ceramic component includes: a ceramic body, the ceramic body includes: a top surface; A bottom surface; a first side surface; a second side surface, the second side surface is opposite to the first side surface; a plurality of first grooves extending inward from the first side surface, two adjacent first grooves And a plurality of second grooves extending inwardly from the second side surface, two adjacent second grooves are not connected to each other, the first grooves and the second grooves The first grooves and the second grooves are formed by ultrasonic processing, and the aspect ratios of the first grooves and the second grooves are between 1 and 50; A plurality of first internal electrodes located in the first grooves and filling the first grooves, wherein the metal in the first internal electrode does not exist in the ceramic of the ceramic body; Two internal electrodes located in the second grooves and filling the second grooves, wherein the metal of the second internal electrode does not exist in the ceramic of the ceramic body; a first external electrode is disposed in the On the first side surface and the top surface; and a second external electrode disposed on the second side surface and the bottom surface. The multilayer piezoelectric ceramic element according to claim 7, wherein each of the first internal electrodes and the second internal electrodes includes a curved surface, and each of the curved surfaces has a radius of curvature ranging from 1 meter to 1×10 ^{− 6} meters. The multilayer piezoelectric ceramic element according to claim 7, wherein the ceramic body comprises barium titanate, lead zirconate titanate, lead lanthanum zirconate titanate, or sodium bismuth titanate.

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