TWI710583B - Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods for these resins, and compositions for protective films And UV curable resin composition - Google Patents

Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods for these resins, and compositions for protective films And UV curable resin composition Download PDF

Info

Publication number
TWI710583B
TWI710583B TW104135862A TW104135862A TWI710583B TW I710583 B TWI710583 B TW I710583B TW 104135862 A TW104135862 A TW 104135862A TW 104135862 A TW104135862 A TW 104135862A TW I710583 B TWI710583 B TW I710583B
Authority
TW
Taiwan
Prior art keywords
group
hydroxyl
meth
compound
acrylate
Prior art date
Application number
TW104135862A
Other languages
Chinese (zh)
Other versions
TW201630957A (en
Inventor
內田博
米田周平
大籏英樹
中澤恵理
鳥羽正彦
山木繁
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015059353A external-priority patent/JP6478742B2/en
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW201630957A publication Critical patent/TW201630957A/en
Application granted granted Critical
Publication of TWI710583B publication Critical patent/TWI710583B/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/83Chemically modified polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44Polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/48Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/62Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6204Polymers of olefins
    • C08G18/6208Hydrogenated polymers of conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • C08L75/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • C09D175/14Polyurethanes having carbon-to-carbon unsaturated bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

提供耐環境性、擦傷性優異、可經UV等之放射線硬化的保護膜樹脂作為金屬奈米線的保護膜。 Provide a protective film resin with excellent environmental resistance and scratch resistance, which can be cured by radiation such as UV, as a protective film for metal nanowires.

具備具有羧基的聚胺基甲酸酯骨架(A)與鍵結於前述羧基之至少一部份的含有下述式(b1)所表示之烯基氧化物開環加成部或式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B)為其特徵的含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份鍵結有聚異氰酸酯化合物(Q)或具有(甲基)丙烯醯基及異氰酸基的化合物(R)之保護膜樹脂。 It is provided with a polyurethane skeleton (A) having a carboxyl group and at least a part of the aforementioned carboxyl group, which contains an alkenyl oxide ring-opening addition portion represented by the following formula (b1) or formula (b2) The aliphatic oxide ring-opening addition part (B) of the cycloalkenyl oxide ring-opening addition part represented is the aliphatic oxide ring-opening addition part of the hydroxyl-containing polyurethane resin (B) A protective film resin in which at least a part of the polyisocyanate compound (Q) or the compound (R) having a (meth)acryloyl group and an isocyanate group is bonded.

Figure 104135862-A0202-11-0002-32
Figure 104135862-A0202-11-0002-32

(式(b1)中,n1為1~50之整數,R1、R2,各自獨立,為氫原子、碳原子數為1~16烷基、或苯基。) (In formula (b1), n 1 is an integer from 1 to 50, and R 1 and R 2 are each independently a hydrogen atom, an alkyl group with 1 to 16 carbon atoms, or a phenyl group.)

Figure 104135862-A0202-11-0002-33
Figure 104135862-A0202-11-0002-33

(式(b2)中,n2為1~10之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數為4~14的脂環式烴基之原子團。) (In formula (b2), n 2 is an integer from 1 to 10, and Z is an atomic group forming an alicyclic hydrocarbon group with 4 to 14 carbon atoms including the two carbon atoms bonded by Z.)

Description

含羥基之聚胺基甲酸酯樹脂、以其為原料之聚胺基甲酸酯樹脂、及胺基甲酸酯(甲基)丙烯酸酯樹脂、此等樹脂之製造方法、以及保護膜用組成物、及UV硬化性樹脂組成物 Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods of these resins, and compositions for protective films And UV curable resin composition

本發明係關於含羥基之聚胺基甲酸酯樹脂、及以其為原料之聚胺基甲酸酯樹脂及胺基甲酸酯(甲基)丙烯酸酯樹脂、以及此等樹脂之製造方法、以及保護膜用組成物及UV硬化性樹脂組成物。 The present invention relates to hydroxyl-containing polyurethane resins, polyurethane resins and urethane (meth)acrylate resins using them as raw materials, and methods for manufacturing these resins, And a composition for a protective film and a UV curable resin composition.

透明導電膜用在液晶顯示器(LCD)、電漿顯示器面板(PDP)、有機電致發光型顯示器、太陽電池(PV)及觸控面板(TP)之透明電極、防靜電(ESD)薄膜以及電磁波遮蔽(EMI)薄膜等之種種之領域。作為此等透明導電膜,以往利用使用ITO(氧化銦錫)者,但有銦的供給安定性低、製造費用高、欠缺柔軟性、及成膜時需要高溫之問題。因此,代替ITO之透明導電膜的探索蓬勃發展。彼等中,含有金屬奈米線的透明導電膜,由導電性、光學特性、及柔軟性優異、可以濕製程成膜、製造費 用低、成膜時不需要高溫等來看,作為ITO替代透明導電膜最佳。已知例如有含銀奈米線且具有高導電性、光學特性、柔軟性之透明導電膜(專利文獻1作為參考)。 Transparent conductive films are used in liquid crystal displays (LCD), plasma display panels (PDP), organic electroluminescent displays, transparent electrodes of solar cells (PV) and touch panels (TP), anti-static (ESD) films and electromagnetic waves Various fields such as EMI film. As such transparent conductive films, those using ITO (Indium Tin Oxide) have been used in the past, but there are problems with low supply stability of indium, high manufacturing costs, lack of flexibility, and the need for high temperatures for film formation. Therefore, the search for a transparent conductive film to replace ITO is booming. Among them, the transparent conductive film containing metal nanowires has excellent conductivity, optical properties, and flexibility, and can be formed into a film by a wet process. In terms of low temperature and no need for high temperature during film formation, it is best as ITO instead of transparent conductive film. For example, a transparent conductive film containing silver nanowires and having high conductivity, optical properties, and flexibility is known (Patent Document 1 is used as a reference).

然而,含有銀奈米線的透明導電膜,有每單位銀重量的表面積大、易與種種之化合物反應故有缺乏環境耐性的問題,且因步驟中所使用的種種之藥劑或洗淨液的影響、或長期保管暴露在空氣中之氧或水分的影響等,奈米構造體容易腐蝕、導電性易降低。又,尤其在電子材料等之用途,為了防止微粒子狀之雜質或塵或塵埃等之附著或混入基板表面,使用毛刷等的物理洗淨步驟之場合多,但經該步驟有表面受傷之問題。 However, the transparent conductive film containing silver nanowires has a large surface area per unit weight of silver, easily reacts with various compounds, and therefore has the problem of lack of environmental resistance. It is also affected by the various chemicals or detergents used in the steps. The nanostructure is prone to corrosion and the conductivity is easily reduced due to the effects of long-term storage of oxygen or moisture exposed to the air. In addition, especially in electronic materials and other applications, in order to prevent particulate impurities, dust, dust, etc. from adhering or mixing into the surface of the substrate, there are many cases where physical cleaning steps such as brushes are used, but there is a problem of surface damage after this step .

為了解決此,多嘗試於含有銀奈米線的透明導電膜的表面層合保護膜,賦予該透明導電膜環境耐性及耐擦傷性。作為含有銀奈米線的透明導電膜所使用的保護膜,目前已知使用胺基甲酸酯樹脂等的透明導電膜用的保護膜、含聚酯聚醯胺酸與環氧樹脂之各種光學材料用的保護膜、使用無機矽氧化物的保護膜等(專利文獻1~5作為參考)。 In order to solve this problem, many attempts have been made to laminate a protective film on the surface of a transparent conductive film containing silver nanowires to provide the transparent conductive film with environmental resistance and scratch resistance. As protective films used for transparent conductive films containing silver nanowires, there are known protective films for transparent conductive films using urethane resins, etc., and various optical materials containing polyester polyamides and epoxy resins. A protective film for a material, a protective film using inorganic silicon oxide, etc. (Patent Documents 1 to 5 are referenced).

〔先前技術文獻〕 [Prior technical literature] 〔專利文獻〕 〔Patent Literature〕

[專利文獻1]日本特表2010-507199號公報 [Patent Document 1] JP 2010-507199 A

[專利文獻2]日本特開2008-156546號公報 [Patent Document 2] JP 2008-156546 A

[專利文獻3]日本特開2009-205924號公報 [Patent Document 3] JP 2009-205924 A

[專利文獻4]日本特開2011-204649號公報 [Patent Document 4] Japanese Patent Application Publication No. 2011-204649

[專利文獻5]日本特開2011-102003號公報 [Patent Document 5] JP 2011-102003 A

然而,此等保護膜並非滿足上述全部特性者。又,使用作為保護膜時,若考量生產性,以非以加熱硬化而係經UV等之放射線迅速硬化為佳,若考量作為透明導電膜之樣式,表面硬度亦以硬者較佳。 However, these protective films do not satisfy all the above-mentioned characteristics. In addition, when using as a protective film, if productivity is considered, it is better not to be cured by heating but quickly cured by radiation such as UV. If considering the style of the transparent conductive film, the surface hardness is preferably hard.

本發明為有鑑於該課題而成者,其目的在於作為金屬奈米線的保護膜,提供耐環境性、擦傷性優異、可以UV等之電子線硬化的金屬奈米線用的保護膜樹脂合成所適宜之原料(含羥基之聚胺基甲酸酯樹脂)及以其為原料之保護膜用樹脂(聚胺基甲酸酯樹脂及胺基甲酸酯(甲基)丙烯酸酯樹脂)。 The present invention was made in view of this problem, and its purpose is to provide a protective film for metal nanowires that is excellent in environmental resistance, scratch resistance, and can be cured by electronic rays such as UV as a protective film for metal nanowires. Resin synthesis Suitable raw materials (polyurethane resins containing hydroxyl groups) and resins for protective films (polyurethane resins and urethane (meth)acrylate resins) using them as raw materials.

本發明之一實施形態為含羥基之聚胺基甲酸酯樹脂,特徵為具備具有羧基的聚胺基甲酸酯骨架(A)、與鍵結於前述羧基之至少一部份的含有下述式(b1)所表示之烯基氧化物開環加成部或式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B)。 One embodiment of the present invention is a hydroxyl-containing polyurethane resin, which is characterized by having a polyurethane skeleton (A) having a carboxyl group, and at least a part bonded to the aforementioned carboxyl group containing the following The aliphatic oxide ring-opening addition part (B) of the alkenyl oxide ring-opening addition part represented by the formula (b1) or the cycloalkenyl oxide ring-opening addition part represented by the formula (b2).

Figure 104135862-A0202-12-0004-3
Figure 104135862-A0202-12-0004-3

(式(b1)中,n1為1~50之整數,R1、R2,各自獨立,為氫原子、碳原子數為1~16烷基、或苯基。) (In formula (b1), n 1 is an integer from 1 to 50, and R 1 and R 2 are each independently a hydrogen atom, an alkyl group with 1 to 16 carbon atoms, or a phenyl group.)

Figure 104135862-A0202-12-0004-4
Figure 104135862-A0202-12-0004-4

(式(b2)中,n2為1~10之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數為4~14的脂環式烴基之原子團。) (In formula (b2), n 2 is an integer from 1 to 10, and Z is an atomic group forming an alicyclic hydrocarbon group with 4 to 14 carbon atoms including the two carbon atoms bonded by Z.)

上述聚胺基甲酸酯骨架(A)以基於(a1)聚異氰酸酯化合物、(a2)多元醇化合物、及(a3)具有羧基的二羥基化合物的反應生成物之聚胺基甲酸酯骨架者為宜。 The polyurethane skeleton (A) is a polyurethane skeleton based on the reaction product of (a1) a polyisocyanate compound, (a2) a polyol compound, and (a3) a dihydroxy compound having a carboxyl group Appropriate.

又,上述(a1)聚異氰酸酯化合物以異氰酸基(-NCO基)中之碳原子以外的碳原子數為6~30之脂環 式化合物者為宜。 In addition, the aforementioned (a1) polyisocyanate compound is an alicyclic ring having 6 to 30 carbon atoms other than the carbon atoms in the isocyanate group (-NCO group) The compound of formula is suitable.

又,上述(a2)多元醇化合物以聚碳酸酯多元醇、聚醚多元醇或聚丁二烯多元醇者為宜。 In addition, the polyol compound (a2) is preferably polycarbonate polyol, polyether polyol, or polybutadiene polyol.

又,上述(a3)具有羧基的二羥基化合物以具有2個選自羥基、碳原子數為1或2之羥基烷基任一的分子量200以下的羧酸或胺基羧酸者為宜。 In addition, the above-mentioned (a3) dihydroxy compound having a carboxyl group is preferably one having two carboxylic acids or amino carboxylic acids having a molecular weight of 200 or less selected from hydroxyl groups and hydroxyalkyl groups having 1 or 2 carbon atoms.

又,上述(a3)具有羧基的二羥基化合物以2,2-二羥甲基丙酸、2,2-二羥甲基丁烷酸、N,N-雙羥基乙基甘胺酸、N,N-雙羥基乙基丙胺酸所構成的群的1種或2種以上者為宜。 In addition, the above-mentioned (a3) dihydroxy compound having a carboxyl group is 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, N,N-bishydroxyethylglycine, N, One type or two or more types of the group consisting of N-bishydroxyethylalanine are suitable.

又,上述式(b1)中之n1為1~10,R1、R2各自獨立,為氫原子或甲基、或者R1、R2之至少一者為氫原子且另一者為碳原子數為1~10之烷基、或苯基者為宜。 In addition, n 1 in the above formula (b1) is 1-10, and R 1 and R 2 are each independently a hydrogen atom or a methyl group, or at least one of R 1 and R 2 is a hydrogen atom and the other is a carbon An alkyl group or phenyl group having 1 to 10 atoms is preferable.

又,上述式(b2)中之n2為1~3之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數6~12的脂環式烴基的原子團者為宜。 In addition, n 2 in the above formula (b2) is an integer of 1 to 3, and Z is preferably an atomic group that forms an alicyclic hydrocarbon group with 6 to 12 carbon atoms including two carbon atoms bonded by Z.

又,本發明之其他實施形態為聚胺基甲酸酯樹脂,特徵為上述任一含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)的至少一部份與聚異氰酸酯化合物(Q)之反應生成物。 In addition, another embodiment of the present invention is a polyurethane resin characterized by at least a part of the aliphatic oxide ring-opening addition part (B) of any of the above-mentioned hydroxyl-containing polyurethane resins Reaction product with polyisocyanate compound (Q).

上述聚異氰酸酯化合物(Q)以脂肪族聚異氰酸酯化合物或由其所衍生的封閉型異氰酸酯者為宜。 The above-mentioned polyisocyanate compound (Q) is preferably an aliphatic polyisocyanate compound or a blocked isocyanate derived therefrom.

又,上述聚異氰酸酯化合物(Q)以含有以己 內醯胺、酮肟、酚、2級胺所構成的群所選出的具有活性氫的化合物封端的異氰酸基者為宜。 In addition, the above-mentioned polyisocyanate compound (Q) may contain The isocyanate group blocked by the compound having active hydrogen selected from the group consisting of endoamide, ketoxime, phenol, and secondary amine is preferable.

又,本發明之進而其他實施形態為保護膜用組成物,特徵為含有上述任一聚胺基甲酸酯樹脂、與溶劑。 In addition, still another embodiment of the present invention is a composition for a protective film, which is characterized by containing any one of the above-mentioned polyurethane resins and a solvent.

又,本發明之進而其他實施形態為胺基甲酸酯(甲基)丙烯酸酯樹脂,特徵為上述任一含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)與具有(甲基)丙烯醯基及異氰酸基的化合物(R)之反應生成物。 Furthermore, still another embodiment of the present invention is a urethane (meth)acrylate resin characterized by the aliphatic oxide ring-opening addition portion (B) of any of the above-mentioned hydroxyl-containing polyurethane resins ) A reaction product with a compound (R) having a (meth)acryloyl group and an isocyanate group.

上述化合物(R)為1分子中含1個以上(甲基)丙烯醯基且具有1個異氰酸基者、或其異氰酸基被保護者為宜。 The above-mentioned compound (R) preferably contains one or more (meth)acrylic acid groups in one molecule and one isocyanate group, or one whose isocyanate group is protected.

又,上述化合物(R)以由2-異氰酸基乙基(甲基)丙烯酸酯、1,1-(雙丙烯醯基氧基甲基)乙基異氰酸酯、其封端體之甲基丙烯酸2-(0-[1’-甲基亞丙基胺基]羧基胺基)乙基酯、2-[(3,5-二甲基吡唑基)羰基胺基]乙基甲基丙烯酸酯所成群組中選出者為宜。 In addition, the above-mentioned compound (R) is composed of 2-isocyanatoethyl (meth)acrylate, 1,1-(bisacryloxymethyl)ethyl isocyanate, and methacrylic acid as a blocked body. 2-(0-[1'-Methylpropyleneamino]carboxyamino)ethyl ester, 2-[(3,5-dimethylpyrazolyl)carbonylamino]ethyl methacrylate The person selected from the group is appropriate.

又,本發明之進而其他實施形態為UV硬化性樹脂組成物,特徵為含有上述任一胺基甲酸酯(甲基)丙烯酸酯樹脂、與光起始劑。 In addition, still another embodiment of the present invention is a UV curable resin composition characterized by containing any one of the above-mentioned urethane (meth)acrylate resins and a photoinitiator.

又,本發明之進而其他實施形態為保護膜用組成物,特徵為含有上述任一胺基甲酸酯(甲基)丙烯酸酯樹脂或上述UV硬化性樹脂組成物。 Furthermore, still another embodiment of the present invention is a composition for a protective film characterized by containing any one of the above-mentioned urethane (meth)acrylate resins or the above-mentioned UV curable resin composition.

又,本發明之進而其他實施形態為含羥基之聚胺基甲酸酯樹脂之製造方法,特徵為使含有羧基的聚胺基甲酸酯的羧基與式(x1)所表示之烯基氧化物及式(x2)所表示之環烯基氧化物的至少一者反應。 Furthermore, still another embodiment of the present invention is a method for producing a hydroxyl-containing polyurethane resin, characterized in that the carboxyl group of the carboxyl-containing polyurethane is combined with the alkenyl oxide represented by formula (x1) And at least one of the cycloalkenyl oxides represented by formula (x2) reacts.

Figure 104135862-A0202-12-0007-5
Figure 104135862-A0202-12-0007-5

(式(x1)中,R1、R2,各自獨立,為氫原子、碳原子數為1~16之烷基、或苯基。) (In formula (x1), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or a phenyl group.)

Figure 104135862-A0202-12-0007-6
Figure 104135862-A0202-12-0007-6

(式(x2)中,Z表示與該Z鍵結的2個碳原子一起形成碳原子數為4~14的脂環式烴基之原子團。) (In formula (x2), Z represents an atomic group that forms an alicyclic hydrocarbon group with 4 to 14 carbon atoms together with the two carbon atoms bonded to Z.)

上述式(x1)所表示之烯基氧化物為環氧乙烷、環氧丙烷、或苯環氧乙烷,前述式(x2)所表示之環烯基氧化物以環氧環己烷者為宜。 The alkenyl oxide represented by the above formula (x1) is ethylene oxide, propylene oxide, or phenyloxirane, and the cycloalkenyl oxide represented by the above formula (x2) is cyclohexane oxide should.

又,本發明之進而其他實施形態為聚胺基甲酸酯樹脂之製造方法,特徵為具備使上述含羥基之聚胺基甲酸酯樹脂之製造方法所得到之含羥基之聚胺基甲酸酯樹 脂與聚異氰酸酯化合物(Q)進行反應之步驟。 Furthermore, still another embodiment of the present invention is a method for producing a polyurethane resin, which is characterized by having a hydroxyl-containing polyurethane formic acid obtained by the above-mentioned method for producing a hydroxyl-containing polyurethane resin Ester tree The step of reacting fat with polyisocyanate compound (Q).

又,本發明之進而其他實施形態為胺基甲酸酯(甲基)丙烯酸酯樹脂之製造方法,特徵為具備使上述含羥基之聚胺基甲酸酯樹脂之製造方法所得到之含羥基之聚胺基甲酸酯樹脂與具有(甲基)丙烯醯基及異氰酸基的化合物(R)進行反應之步驟。 Furthermore, still another embodiment of the present invention is a method for producing a urethane (meth)acrylate resin, which is characterized by having a hydroxyl group-containing compound obtained by the method for producing a hydroxyl group-containing polyurethane resin. A step of reacting a polyurethane resin with a compound (R) having a (meth)acryloyl group and an isocyanate group.

又,適宜組合上述各要素者亦涵蓋於本申請案專利所追求保護之發明之範圍。 In addition, the suitable combination of the above elements also covers the scope of the invention that the patent in this application seeks to protect.

根據本發明之以含羥基之聚胺基甲酸酯樹脂為原料的聚胺基甲酸酯樹脂及胺基甲酸酯(甲基)丙烯酸酯樹脂,用作為印刷有金屬油墨的配線或電極等之導電圖型的保護膜時,導電特性降低少、可作成信賴性高的導電圖型,尤其有用在銀奈米線般導電特性之信賴性低的導電圖型。 According to the present invention, polyurethane resin and urethane (meth)acrylate resin using hydroxyl-containing polyurethane resin as raw materials are used as wiring or electrodes printed with metallic ink, etc. In the case of the conductive pattern protective film, the conductive characteristics are reduced and the conductive pattern with high reliability can be made, and it is especially useful for the conductive pattern with low reliability like silver nanowire.

[圖1]合成例5之樹脂組成物的1H-NMR頻譜。 [Figure 1] 1 H-NMR spectrum of the resin composition of Synthesis Example 5.

[圖2]合成例5之樹脂組成物的IR頻譜。 [Figure 2] IR spectrum of the resin composition of Synthesis Example 5.

[圖3]表示彎曲試驗方法之圖。 [Figure 3] A diagram showing the bending test method.

[圖4]實施例1之胺基甲酸酯丙烯酸酯樹脂的1H-NMR頻譜。 [Figure 4] 1 H-NMR spectrum of the urethane acrylate resin of Example 1.

[圖5]實施例1之胺基甲酸酯丙烯酸酯樹脂的IR頻譜。 [Figure 5] IR spectrum of the urethane acrylate resin of Example 1.

以下、說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described.

第一實施形態之含羥基之聚胺基甲酸酯樹脂具備含有羧基的聚胺基甲酸酯骨架(A)及鍵結於上述羧基之至少一部份的含有下述式(b1)所表示之烯基氧化物開環加成部或式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B)。 The hydroxyl-containing polyurethane resin of the first embodiment has a polyurethane skeleton (A) containing a carboxyl group and at least a part of the carboxyl group bonded to the above-mentioned carboxyl group and contains the following formula (b1) The aliphatic oxide ring-opening addition part (B) of the alkenyl oxide ring-opening addition part or the cycloalkenyl oxide ring-opening addition part represented by formula (b2).

Figure 104135862-A0202-12-0009-7
Figure 104135862-A0202-12-0009-7

式(b1)中,n1為1~50之整數,R1、R2,各自獨立,為氫原子、碳原子數為1~16烷基、或苯基。 In formula (b1), n 1 is an integer from 1 to 50, and R 1 and R 2 are each independently a hydrogen atom, an alkyl group with 1 to 16 carbon atoms, or a phenyl group.

Figure 104135862-A0202-12-0010-8
Figure 104135862-A0202-12-0010-8

式(b2)中,n2為1~10之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數為4~14的脂環式烴基之原子團。 In formula (b2), n 2 is an integer from 1 to 10, and Z is an atomic group forming an alicyclic hydrocarbon group with 4 to 14 carbon atoms including 2 carbon atoms bonded by Z.

<具有羧基的聚胺基甲酸酯骨架(A)> <Polyurethane skeleton (A) with carboxyl group>

具有羧基的聚胺基甲酸酯骨架(A)之數平均分子量以1,000~100,000為佳、3,000~50,000更佳。在此,分子量為以膠體滲透層析法(以下記為GPC)測定的聚苯乙烯換算值。分子量未達1,000,則有損害後述聚胺基甲酸酯樹脂或胺基甲酸酯(甲基)丙烯酸酯樹脂印刷後的塗膜的延伸度、可撓性、以及強度之情形,超過100,000則除了含羥基之聚胺基甲酸酯樹脂或後述聚胺基甲酸酯樹脂或胺基甲酸酯(甲基)丙烯酸酯樹脂對溶劑的溶解性變低外、即使溶解亦黏度變得過高,故在使用面上變得大幅受限。 The number average molecular weight of the polyurethane skeleton (A) having a carboxyl group is preferably 1,000 to 100,000, more preferably 3,000 to 50,000. Here, the molecular weight is a polystyrene conversion value measured by colloid permeation chromatography (hereinafter referred to as GPC). If the molecular weight is less than 1,000, the elongation, flexibility, and strength of the coating film after printing with polyurethane resin or urethane (meth)acrylate resin described later may be impaired. If it exceeds 100,000 In addition to the low solubility of the hydroxyl-containing polyurethane resin or the polyurethane resin or urethane (meth)acrylate resin described later in the solvent, the viscosity becomes too high even if it is dissolved , So the use surface has become greatly restricted.

本說明書中在未特別限制下,GPC的測定條件如下。 In this specification, without particular limitation, the measurement conditions of GPC are as follows.

裝置名:日本分光股份公司製HPLC unit HSS-2000 Device name: HPLC unit HSS-2000 manufactured by JASCO Corporation

管柱:Shodex管柱LF-804 String: Shodex string LF-804

移動相:四氫呋喃 Mobile phase: Tetrahydrofuran

流速:1.0mL/min Flow rate: 1.0mL/min

偵測器:日本分光股份公司製RI-2031Plus Detector: RI-2031Plus manufactured by JASCO Corporation

溫度:40.0℃ Temperature: 40.0℃

試料量:樣品環管100μ公升 Sample volume: 100μL sample loop tube

試料濃度:調製成約0.1質量% Sample concentration: Prepared to about 0.1% by mass

具有羧基的聚胺基甲酸酯骨架(A)之酸價以10~140mgKOH/g為佳、15~130mgKOH/g更佳。酸價未達10mgKOH/g,則與後述脂肪族氧化物之反應點少、加成脂肪族氧化物之效果差。超過140mgKOH/g,則作為具有羧基的聚胺基甲酸酯樹脂的對溶劑之溶解性低且即使溶解亦黏度變得過高、操作性困難。 The acid value of the polyurethane skeleton (A) having a carboxyl group is preferably 10 to 140 mgKOH/g, and more preferably 15 to 130 mgKOH/g. If the acid value is less than 10 mgKOH/g, there are few reaction points with the aliphatic oxide described later, and the effect of adding the aliphatic oxide is poor. If it exceeds 140 mgKOH/g, the polyurethane resin having a carboxyl group has low solubility in solvents, and even if it is dissolved, the viscosity becomes too high, and handling is difficult.

又,本說明書中樹脂的酸價為用以下方法測定的值。 In addition, the acid value of the resin in this specification is a value measured by the following method.

於100ml三角燒瓶將試料約0.2g以精密天秤進行精秤,於其中加入乙醇/甲苯=1/2(質量比)之混合溶劑10ml進行溶解。進而,於該容器添加作為指示劑的酚酞乙醇溶液1~3滴,充分攪拌至試料均勻為止。將此以0.1N氫氧化鉀-乙醇溶液進行滴定,以指示劑的微紅色維持30秒鐘時作為中和的終點。由該結果使用下述計算式得到的值作為樹脂的酸價。 In a 100ml Erlenmeyer flask, approximately 0.2g of the sample was accurately weighed with a precision balance, and 10ml of a mixed solvent of ethanol/toluene = 1/2 (mass ratio) was added to it to dissolve. Furthermore, 1 to 3 drops of a phenolphthalein ethanol solution as an indicator are added to the container, and the mixture is sufficiently stirred until the sample is uniform. This is titrated with a 0.1N potassium hydroxide-ethanol solution, and the neutralization end point is when the reddish color of the indicator is maintained for 30 seconds. From this result, the value obtained by the following calculation formula was used as the acid value of the resin.

酸價(mgKOH/g)=〔B×f×5.611〕/S Acid value (mgKOH/g)=〔B×f×5.611〕/S

B:0.1N氫氧化鉀-乙醇溶液的使用量(ml) B: Usage amount of 0.1N potassium hydroxide-ethanol solution (ml)

f:0.1N氫氧化鉀-乙醇溶液的因子 f: Factor of 0.1N potassium hydroxide-ethanol solution

S:試料的採取量(g) S: The amount of sample taken (g)

具有羧基的聚胺基甲酸酯骨架(A)更具體地,為使用(a1)聚異氰酸酯化合物、(a2)多元醇化合物、及(a3)具有羧基的二羥基化合物作為單體合成,即具有基於(a1)聚異氰酸酯化合物、(a2)多元醇化合物、及(a3)具有羧基的二羥基化合物之反應生成物的骨架。換言之,為具有(a1)聚異氰酸酯化合物與(a3)具有羧基的二羥基化合物之反應生成單位、與具有(a2)多元醇化合物與(a3)具有羧基的二羥基化合物之反應生成單位的聚胺基甲酸酯樹脂的骨架。以下將各單體更詳細說明。 The polyurethane skeleton (A) having a carboxyl group is more specifically synthesized by using (a1) a polyisocyanate compound, (a2) a polyol compound, and (a3) a dihydroxy compound having a carboxyl group as monomers. A skeleton based on the reaction product of (a1) a polyisocyanate compound, (a2) a polyol compound, and (a3) a dihydroxy compound having a carboxyl group. In other words, it is a polyamine having a reaction production unit of (a1) a polyisocyanate compound and (a3) a dihydroxy compound having a carboxyl group, and a reaction production unit of a (a2) polyol compound and (a3) a dihydroxy compound having a carboxyl group The skeleton of the carbamate resin. Each monomer will be described in more detail below.

(a1)聚異氰酸酯化合物 (a1) Polyisocyanate compound

(a1)作為聚異氰酸酯化合物,通常使用每1分子之異氰酸基為2個之二異氰酸酯。作為聚異氰酸酯化合物,例如脂肪族聚異氰酸酯、脂環族聚異氰酸酯、芳香族聚異氰酸酯、芳香脂肪族聚異氰酸酯等。在含有羧基的聚胺基甲酸酯骨架(A)不膠體化範圍,亦可少量使用三苯基甲烷三異氰酸酯般具有3個以上異氰酸基之聚異氰酸酯。 (a1) As the polyisocyanate compound, a diisocyanate having two isocyanate groups per molecule is usually used. As the polyisocyanate compound, for example, aliphatic polyisocyanate, alicyclic polyisocyanate, aromatic polyisocyanate, araliphatic polyisocyanate, and the like. In the range where the carboxyl group-containing polyurethane skeleton (A) is not colloidal, a small amount of polyisocyanate having 3 or more isocyanate groups like triphenylmethane triisocyanate can also be used.

作為脂肪族聚異氰酸酯,例如1,3-三伸甲基二異氰酸酯、1,4-四伸甲基二異氰酸酯、1,6-六伸甲基二異氰酸酯、1,9-九伸甲基二異氰酸酯、1,10-十伸甲基二異氰酸酯、2,2,4-三甲基六伸甲基二異氰酸酯、2,4,4-三甲基 六伸甲基二異氰酸酯、賴氨酸二異氰酸酯、2,2’-二乙基醚二異氰酸酯、二聚酸二異氰酸酯等。 As the aliphatic polyisocyanate, for example, 1,3-trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate, 1,9-nonamethylene diisocyanate , 1,10-decamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethyl Hexamethylene diisocyanate, lysine diisocyanate, 2,2'-diethyl ether diisocyanate, dimer acid diisocyanate, etc.

作為脂環族聚異氰酸酯,可舉例如1,4-環己烷二異氰酸酯、1,3-雙(異氰酸酯甲基)環己烷、1,4-雙(異氰酸酯甲基)環己烷、3-異氰酸酯甲基-3,3,5-三甲基環己烷(IPDI、異佛爾酮二異氰酸酯)、雙-(4-異氰酸酯環己基)甲烷(氫化MDI)、氫化(1,3-或1,4-)苯二甲基二異氰酸酯、降冰片烷二異氰酸酯等。 Examples of the alicyclic polyisocyanate include 1,4-cyclohexane diisocyanate, 1,3-bis(isocyanatemethyl)cyclohexane, 1,4-bis(isocyanatemethyl)cyclohexane, 3- Isocyanate methyl-3,3,5-trimethylcyclohexane (IPDI, isophorone diisocyanate), bis-(4-isocyanatecyclohexyl)methane (hydrogenated MDI), hydrogenated (1,3- or 1 ,4-) Xylylene diisocyanate, norbornane diisocyanate, etc.

作為芳香族聚異氰酸酯,可舉例如2,4’-二苯基甲烷二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、1,4-伸苯基二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、(1,2、1,3、或1,4)-二甲苯二異氰酸酯、3,3’-二甲基-4,4’-二異氰酸酯聯苯基酯、3,3’-二甲基-4,4’-二異氰酸酯二苯基甲烷、1,5-伸萘基二異氰酸酯、4,4’-二苯基醚二異氰酸酯、四氯伸苯基二異氰酸酯等。 Examples of aromatic polyisocyanates include 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,4-phenylene diisocyanate, and 2,4-toluene diisocyanate , 2,6-toluene diisocyanate, (1,2,1,3, or 1,4)-xylene diisocyanate, 3,3'-dimethyl-4,4'-diisocyanate biphenyl ester, 3,3'-dimethyl-4,4'-diisocyanate diphenylmethane, 1,5-naphthylene diisocyanate, 4,4'-diphenyl ether diisocyanate, tetrachlorophenylene diisocyanate Wait.

作為芳香脂肪族聚異氰酸酯,可舉例如1,3-苯二甲基二異氰酸酯、1,4-苯二甲基二異氰酸酯、α,α,α’,α’-四甲基苯二甲基二異氰酸酯、3,3’-伸甲基二甲伸苯基(Tolylene)-4,4’-二異氰酸酯等。此等二異氰酸酯可1種單獨或2種以上組合使用。 Examples of araliphatic polyisocyanates include 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, α,α,α',α'-tetramethylxylylene diisocyanate Isocyanate, 3,3'-Tolylene-4,4'-diisocyanate, etc. These diisocyanates can be used alone or in combination of two or more.

作為(a1)聚異氰酸酯化合物,藉由使用異氰酸基(-NCO基)中之碳原子以外的碳原子數為6~30之脂環式化合物,後述實施形態之由聚胺基甲酸酯樹脂所形成的保護膜尤其在高溫高溼時之信賴性高、適用電子機器 零件的構件。 As the (a1) polyisocyanate compound, by using an alicyclic compound having 6 to 30 carbon atoms other than the carbon atoms in the isocyanate group (-NCO group), the following embodiment is made of polyurethane The protective film formed by resin has high reliability especially at high temperature and humidity, and is suitable for electronic equipment The component of the part.

上述脂環式化合物在(a1)聚異氰酸酯化合物中,相對(a1)聚異氰酸酯化合物的總量(100mol%)含有10mol%以上、較佳為20mol%、更佳為30mol%以上。 In the (a1) polyisocyanate compound, the alicyclic compound contains 10 mol% or more, preferably 20 mol%, and more preferably 30 mol% or more relative to the total amount (100 mol%) of the (a1) polyisocyanate compound.

作為上述脂環式化合物,可舉例如1,4-環己烷二異氰酸酯、異佛爾酮二異氰酸酯、伸甲基雙(4-環己基異氰酸酯)、1,3-雙(異氰酸酯甲基)環己烷、1,4-雙(異氰酸酯甲基)環己烷。 Examples of the alicyclic compound include 1,4-cyclohexane diisocyanate, isophorone diisocyanate, methylidene bis(4-cyclohexyl isocyanate), and 1,3-bis(isocyanate methyl) ring Hexane, 1,4-bis(isocyanatemethyl)cyclohexane.

(a2)多元醇化合物 (a2) Polyol compound

(a2)多元醇化合物(但,(a2)多元醇化合物中不包含後述具有羧基的(a3)二羥基化合物。)之數平均分子量通常為250~50,000,較佳為400~10,000、更佳為500~5,000。該分子量為以前述條件經GPC測定的聚苯乙烯換算值。 (a2) Polyol compound (However, (a2) polyol compound does not include the (a3) dihydroxy compound having a carboxyl group described later.) The number average molecular weight is usually 250 to 50,000, preferably 400 to 10,000, more preferably 500~5,000. This molecular weight is a polystyrene conversion value measured by GPC under the aforementioned conditions.

(a2)多元醇化合物為例如聚碳酸酯多元醇、聚醚多元醇、聚酯多元醇、聚內酯多元醇、聚丁二烯多元醇、兩末端羥基化聚矽酮、及僅於羥基含氧原子且碳原子數為18~72之多元醇化合物。此等中考量作為保護膜之耐水性、絕緣信賴性、與基材之密著性的平衡,以聚碳酸酯多元醇、聚丁二烯多元醇為佳。 (a2) Polyol compounds are, for example, polycarbonate polyols, polyether polyols, polyester polyols, polylactone polyols, polybutadiene polyols, two-terminal hydroxylated polysiloxanes, and only containing hydroxyl groups Polyol compounds with oxygen atoms and carbon atoms ranging from 18 to 72. Among these considerations, as a balance of water resistance, insulation reliability, and adhesion to the substrate, polycarbonate polyols and polybutadiene polyols are preferred.

上述聚碳酸酯多元醇,可藉由以碳原子數 3~18之二醇為原料,與碳酸酯或光氣反應而得到,例如以下的構造式(1)所表示。 The above polycarbonate polyols can be determined by the number of carbon atoms Diols of 3-18 are raw materials and are obtained by reacting with carbonate or phosgene, as represented by the following structural formula (1), for example.

Figure 104135862-A0202-12-0015-9
Figure 104135862-A0202-12-0015-9

式(1)中、R3為由對應二醇(HO-R3-OH)除去羥基的殘基,n3為正整數、較佳為2~50。 In the formula (1), R 3 is a residue obtained by removing the hydroxyl group from the corresponding diol (HO-R 3 -OH), and n 3 is a positive integer, preferably 2-50.

式(1)所表示之聚碳酸酯多元醇,具體上可藉由使用1,3-丙烷二醇、1,4-丁二醇、1,5-戊烷二醇、1,6-己二醇、3-甲基-1,5-戊烷二醇、1,8-辛烷二醇、1,3-環己烷二甲醇、1,4-環己烷二甲醇、1,9-壬烷二醇、2-甲基-1,8-辛烷二醇、1,10-癸二醇或1,2-四癸烷二醇等為原料來製造。 The polycarbonate polyol represented by the formula (1) can be specifically used by 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanedi Alcohol, 3-methyl-1,5-pentanediol, 1,8-octanediol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 1,9-nonane Alkanediol, 2-methyl-1,8-octanediol, 1,10-decanediol, 1,2-tetradecanediol, etc. are produced as raw materials.

上述聚碳酸酯多元醇可為其骨架中具有複數種伸烷基之聚碳酸酯多元醇(共聚合聚碳酸酯多元醇)。共聚合聚碳酸酯多元醇的使用,由防止具有羧基的聚胺基甲酸酯骨架(A)之結晶化觀點來看有利之情形多。又,考量對溶劑之溶解性,以併用具有分枝骨架,且分枝鏈末端具有羥基之聚碳酸酯多元醇為佳。 The above-mentioned polycarbonate polyol may be a polycarbonate polyol having a plurality of alkylene groups in its skeleton (copolymerized polycarbonate polyol). The use of the copolymerized polycarbonate polyol is advantageous in many cases from the viewpoint of preventing the crystallization of the polyurethane skeleton (A) having a carboxyl group. In addition, considering the solubility to the solvent, it is better to use a polycarbonate polyol having a branched skeleton and a hydroxyl group at the end of the branch chain in combination.

上述聚醚多元醇為將碳原子數2~12的二醇脫水縮合、或將碳原子數2~12的環氧乙烷化合物、氧雜環丁烷化合物、或者四氫呋喃化合物進行開環聚合而得到 者,例如以下的構造式(2)表示。 The above-mentioned polyether polyol is obtained by dehydration condensation of a diol having 2 to 12 carbon atoms, or ring-opening polymerization of an ethylene oxide compound, oxetane compound, or tetrahydrofuran compound having 2 to 12 carbon atoms This is represented by the following structural formula (2), for example.

Figure 104135862-A0202-12-0016-10
Figure 104135862-A0202-12-0016-10

式(2)中、R4為由對應二醇(HO-R4-OH)除去羥基的殘基,n4為正整數、較佳為4~50。上述碳原子數2~12的二醇可一種單獨使用作成單獨聚合物、亦可2種以上併用作成共聚合物。 In the formula (2), R 4 is a residue obtained by removing the hydroxyl group from the corresponding diol (HO-R 4 -OH), and n 4 is a positive integer, preferably 4-50. The above-mentioned diols having 2 to 12 carbon atoms may be used alone as a single polymer, or two or more of them may be used as a copolymer.

上述式(2)所表示之聚醚多元醇,具體上可舉例如聚乙二醇、聚丙二醇、聚-1,2-丁二醇、聚四伸甲基二醇(聚1,4-丁二醇)、聚-3-甲基四伸甲基二醇、聚新戊基二醇等之聚烷二醇。又,以提高(聚醚多元醇)之相溶性、(聚醚多元醇)之疏水性為目的,此等共聚合物亦可使用例如1,4-丁二醇-新戊基二醇等。 The polyether polyol represented by the above formula (2) specifically includes polyethylene glycol, polypropylene glycol, poly-1,2-butanediol, polytetramethylene glycol (poly1,4-butane Diol), poly-3-methyltetramethylene glycol, polyneopentyl glycol and other polyalkylene glycols. In addition, for the purpose of improving the compatibility of (polyether polyol) and the hydrophobicity of (polyether polyol), these copolymers can also use, for example, 1,4-butanediol-neopentyl glycol.

作為上述聚酯多元醇,為將二羧酸及二醇進行脫水縮合或進行二羧酸的低級醇的酯化物與二醇之酯交換反應得到者,例如以下的構造式(3)表示。 The polyester polyol is one obtained by dehydration condensation of dicarboxylic acid and diol, or transesterification reaction between an esterification product of a lower alcohol of dicarboxylic acid and diol, and is represented by the following structural formula (3), for example.

Figure 104135862-A0202-12-0016-11
Figure 104135862-A0202-12-0016-11

式(3)中、R5為由對應二醇(HO-R5-OH) 除去羥基的殘基,R6為由對應二羧酸(HOCO-R6-COOH)除去2個羧基的殘基,n5為正整數、較佳為2~50。 In formula (3), R 5 is the residue obtained by removing the hydroxyl group from the corresponding diol (HO-R 5 -OH), and R 6 is the residue obtained by removing 2 carboxyl groups from the corresponding dicarboxylic acid (HOCO-R 6 -COOH) , N 5 is a positive integer, preferably 2-50.

上述二醇(HO-R5-OH),具體上可舉例乙二醇、1,2-丙烷二醇、1,3-丙烷二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊烷二醇、1,6-己二醇、3-甲基-1,5-戊烷二醇、1,8-辛烷二醇、1,3-環己烷二甲醇、1,4-環己烷二甲醇、1,9-壬烷二醇、2-甲基-1,8-辛烷二醇、1,10-癸二醇或1,2-四癸烷二醇、2,4-二乙基-1,5-戊烷二醇、丁基乙基丙烷二醇、1,3-環己烷二甲醇、3-苯二甲基二醇、1,4-苯二甲基二醇、二乙二醇、三乙二醇、二丙二醇等。 The above diols (HO-R 5 -OH), specifically, ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol Alcohol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,8-octanediol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,10-decanediol Or 1,2-tetradecanediol, 2,4-diethyl-1,5-pentanediol, butylethylpropanediol, 1,3-cyclohexanedimethanol, 3-benzenedi Methyl glycol, 1,4-benzenedimethyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, etc.

上述二羧酸(HOCO-R6-COOH),具體上可舉例如琥珀酸、戊二酸、己二酸、壬二酸、癸二酸、癸烷二羧酸、巴拉西酸、1,4-環己烷二羧酸、六氫苯二甲酸、甲基四氫苯二甲酸、橋伸甲基四氫苯二甲酸、甲基橋伸甲基四氫苯二甲酸、氯菌酸、富馬酸、馬來酸、伊康酸、檸康酸、苯二甲酸、異苯二甲酸、對苯二甲酸、1,4-萘二羧酸、2,6-萘二羧酸。 The above-mentioned dicarboxylic acid (HOCO-R 6 -COOH), specifically, for example succinic acid, glutaric acid, adipic acid, azelaic acid, sebacic acid, decane dicarboxylic acid, palacelic acid, 1, 4-cyclohexanedicarboxylic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, bridged methyl tetrahydrophthalic acid, methyl bridged methyl tetrahydrophthalic acid, chlorosonic acid, rich Maleic acid, maleic acid, itaconic acid, citraconic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid.

上述聚內酯多元醇為藉由內酯的開環聚合物與二醇之縮合反應、或二醇與羥基烷烴酸之縮合反應而得到者,例如以下的構造式(4)表示。 The above-mentioned polylactone polyol is obtained by a condensation reaction of a ring-opening polymer of lactone and a diol, or a condensation reaction of a diol and a hydroxyalkane acid, and is represented by the following structural formula (4), for example.

Figure 104135862-A0202-12-0018-12
Figure 104135862-A0202-12-0018-12

式(4)中、R7為由對應的羥基烷烴酸(HO-R7-COOH)除去羥基及羧基的殘基,R8為由對應二醇(HO-R8-OH)除去羥基的殘基,n6為正整數、較佳為2~50。 In formula (4), R 7 is the residue obtained by removing the hydroxyl group and carboxyl group from the corresponding hydroxyalkane acid (HO-R 7 -COOH), and R 8 is the residue obtained by removing the hydroxyl group from the corresponding diol (HO-R 8 -OH). Base, n 6 is a positive integer, preferably 2-50.

上述羥基烷烴酸(HO-R7-COOH),具體上可舉例如3-羥基丁烷酸、4-羥基戊烷酸、5-羥基己烷酸(ε-己內酯)等。 Specific examples of the hydroxyalkane acid (HO-R 7 -COOH) include 3-hydroxybutanoic acid, 4-hydroxypentanoic acid, 5-hydroxyhexane acid (ε-caprolactone), and the like.

上述聚丁二烯多元醇為例如將丁二烯或異戊二烯進行陰離子聚合而聚合,經末端處理於兩末端導入羥基而得到的二醇、及將彼等雙鍵進行氫還原而得到的二醇。 The above-mentioned polybutadiene polyol is, for example, a diol obtained by subjecting butadiene or isoprene to anionic polymerization and polymerization, terminal treatment to introduce hydroxyl groups at both ends, and hydrogen reduction of their double bonds Diol.

聚丁二烯多元醇,具體上可舉例如主要具有1,4-重複單位的羥基化聚丁二烯(例如Poly bd R-45HT、Poly bd R-15HT(出光興產股份公司製))、羥基化氫化聚丁二烯(例如POLYTAIL(登錄商標)H、POLYTAIL(登錄商標)HA(三菱化學股份公司製))、主要具有1,2-重複單位的羥基化聚丁二烯(例如G-1000、G-2000,G-3000(日本曹達股份公司製))、羥基化氫化聚丁二烯(例如GI-1000、GI-2000、GI-3000(日本曹達股份公司 製))、羥基化聚異戊二烯(例如Poly IP(出光興產股份公司製))、羥基化氫化聚異戊二烯(例如EPOL(登錄商標、出光興產股份公司製))。 Specific examples of polybutadiene polyols include hydroxylated polybutadienes mainly having 1,4-repeating units (for example, Poly bd R-45HT, Poly bd R-15HT (manufactured by Idemitsu Kosan Co., Ltd.)), Hydroxylated hydrogenated polybutadiene (for example, POLYTAIL (registered trademark) H, POLYTAIL (registered trademark) HA (manufactured by Mitsubishi Chemical Corporation)), hydroxylated polybutadiene (for example, G- 1000, G-2000, G-3000 (manufactured by Soda Co., Ltd.), hydroxylated hydrogenated polybutadiene (such as GI-1000, GI-2000, GI-3000 (made by Soda Co., Ltd.) )), hydroxylated polyisoprene (for example, Poly IP (manufactured by Idemitsu Kosan Co., Ltd.), and hydroxylated hydrogenated polyisoprene (for example, EPOL (registered trademark, manufactured by Idemitsu Kosan Co., Ltd.)).

上述兩末端羥基化聚矽酮,例如用以下的構造式(5)表示。 The above-mentioned two-terminal hydroxylated silicone is represented by the following structural formula (5), for example.

Figure 104135862-A0202-12-0019-13
Figure 104135862-A0202-12-0019-13

式(5)中、R9獨立為碳原子數2~50的脂肪族烴二價殘基或芳香族烴二價殘基,n7為正整數、較佳為2~50。此等可含醚基,而複數個R10,各自獨立,為碳原子數1~12的脂肪族烴基或芳香族烴基。 In the formula (5), R 9 is independently an aliphatic hydrocarbon divalent residue or aromatic hydrocarbon divalent residue having 2-50 carbon atoms, and n 7 is a positive integer, preferably 2-50. These may contain ether groups, and a plurality of R 10 , independently of each other, are aliphatic hydrocarbon groups or aromatic hydrocarbon groups having 1 to 12 carbon atoms.

上述兩末端羥基化聚矽酮之市售品,可舉例如信越化學工業股份公司製「X-22-160AS、KF6001、KF6002、KF-6003」等。上述「僅於羥基含有氧原子且碳原子數為18~72之多元醇化合物」,具體上可舉例如具有二聚酸氫化的骨架之二醇化合物,其市售品,可舉例如Cognis公司製「SOVERMOL(登錄商標)908」等。 Examples of commercially available products of the above-mentioned two-terminal hydroxylated silicone include "X-22-160AS, KF6001, KF6002, KF-6003" manufactured by Shin-Etsu Chemical Co., Ltd. and the like. The above-mentioned "polyol compound containing oxygen atoms only in the hydroxyl group and having carbon atoms of 18 to 72" specifically includes, for example, a diol compound having a skeleton hydrogenated by a dimer acid, and its commercially available products include, for example, Cognis "SOVERMOL (registered trademark) 908" etc.

又,在不損及本發明之效果範圍,作為(a2)多元醇化合物,亦可使用不具有重複單位的分子量300以下的二醇。如此之低分子量二醇,具體上可舉例如乙二醇、1,2-丙烷二醇、1,3-丙烷二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊烷二醇、1,6-己二醇、3-甲基 -1,5-戊烷二醇、1,8-辛烷二醇、1,3-環己烷二甲醇、1,4-環己烷二甲醇、1,9-壬烷二醇、2-甲基-1,8-辛烷二醇、1,10-癸二醇、1,2-四癸烷二醇、2,4-二乙基-1,5-戊烷二醇、丁基乙基丙烷二醇、1,3-環己烷二甲醇、1,3-苯二甲基二醇、1,4-苯二甲基二醇、二乙二醇、三乙二醇、或二丙二醇等。 In addition, as long as the effect of the present invention is not impaired, as the (a2) polyol compound, a diol having a molecular weight of 300 or less that does not have a repeating unit can also be used. Such low molecular weight diols specifically include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1, 4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 3-methyl -1,5-pentanediol, 1,8-octanediol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 1,9-nonanediol, 2- Methyl-1,8-octanediol, 1,10-decanediol, 1,2-tetradecanediol, 2,4-diethyl-1,5-pentanediol, butyl ethyl Propanediol, 1,3-cyclohexanedimethanol, 1,3-benzenedimethylene glycol, 1,4-benzenedimethylene glycol, diethylene glycol, triethylene glycol, or dipropylene glycol Wait.

(a3)具有羧基的二羥基化合物 (a3) Dihydroxy compound with carboxyl group

作為(a3)具有羧基的二羥基化合物,為具有2個選自羥基、碳原子數為1或2之羥基烷基任一的分子量200以下的羧酸或胺基羧酸,在可控制交聯點上為佳。具體可舉例如2,2-二羥甲基丙酸、2,2-二羥甲基丁烷酸、N,N-雙羥基乙基甘胺酸、N,N-雙羥基乙基丙胺酸等,其中,由對溶劑之溶解度來看,以2,2-二羥甲基丙酸、2,2-二羥甲基丁烷酸特別佳。此等(a3)含有羧基的二羥基化合物可1種單獨或2種以上組合使用。 (A3) A dihydroxy compound having a carboxyl group is a carboxylic acid or an amino carboxylic acid having a molecular weight of 200 or less selected from a hydroxyl group and a hydroxyalkyl group having 1 or 2 carbon atoms, and is capable of controlling crosslinking Point is better. Specific examples include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, N,N-bishydroxyethylglycine, N,N-bishydroxyethylalanine, etc. Among them, from the standpoint of solubility in solvents, 2,2-dimethylolpropionic acid and 2,2-dimethylolbutanoic acid are particularly preferred. These (a3) carboxyl group-containing dihydroxy compounds can be used alone or in combination of two or more.

前述具備具有羧基的聚胺基甲酸酯骨架(A)的聚胺基甲酸酯樹脂雖可僅以上述3成分((a1)、(a2)及(a3))合成,但以對該聚胺基甲酸酯更賦予自由基聚合性或陽離子聚合性為目的、或者抑制聚胺基甲酸酯末端的異氰酸基或羥基的殘基的影響為目的,可再與(a4)單羥基化合物及/或(a5)單異氰酸酯化合物反應來合成。 The aforementioned polyurethane resin having a polyurethane skeleton (A) having a carboxyl group can be synthesized using only the above three components ((a1), (a2), and (a3)), but it is Urethane is for the purpose of imparting radical polymerizability or cationic polymerizability, or for the purpose of suppressing the influence of the isocyanate group or the residue of the hydroxyl group at the end of the polyurethane, and can be combined with (a4) monohydroxyl Compound and/or (a5) monoisocyanate compound are reacted to synthesize.

(a4)單羥基化合物 (a4) Monohydroxy compound

(a4)單羥基化合物,可舉例如2-羥基乙基(甲基)丙烯酸酯、羥基丙基(甲基)丙烯酸酯、羥基丁基(甲基)丙烯酸酯、環己烷二甲醇單(甲基)丙烯酸酯、前述各(甲基)丙烯酸酯的己內酯或氧化伸烷基加成物、甘油二(甲基)丙烯酸酯、三羥甲基二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二三羥甲基丙烷三(甲基)丙烯酸酯、烯丙基醇、烯丙氧基乙醇等之具有自由基聚合性雙鍵的化合物、乙醇酸、羥基特戊酸等具有羧酸的化合物。 (a4) Monohydroxy compound, for example 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, cyclohexanedimethanol mono(meth)acrylate Base) acrylate, caprolactone or alkylene oxide adducts of the aforementioned (meth)acrylates, glycerol di(meth)acrylate, trimethylol di(meth)acrylate, pentaerythritol tri( Meth) acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, allyl alcohol, allyloxyethanol, etc. have radically polymerizable double bonds Compounds, glycolic acid, hydroxypivalic acid, and other compounds having carboxylic acids.

(a4)單羥基化合物可1種單獨或2種以上組合使用。又,此等化合物中,以2-羥基乙基(甲基)丙烯酸酯、羥基丙基(甲基)丙烯酸酯、羥基丁基(甲基)丙烯酸酯、烯丙基醇、乙醇酸、羥基特戊酸為佳、2-羥基乙基(甲基)丙烯酸酯及4-羥基丁基(甲基)丙烯酸酯更佳。 (a4) The monohydroxy compound can be used alone or in combination of two or more. In addition, among these compounds, 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, allyl alcohol, glycolic acid, hydroxy Valeric acid is preferred, and 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are more preferred.

此外,(a4)單羥基化合物,可舉例如甲醇、乙醇、n-丙醇、異丙醇、n-丁醇、異丁醇、sec-丁醇、t-丁醇、戊基醇、己基醇、辛基醇等。 In addition, (a4) monohydroxy compounds include, for example, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, t-butanol, amyl alcohol, and hexyl alcohol , Octyl alcohol, etc.

(a5)單異氰酸酯化合物 (a5) Monoisocyanate compound

(a5)單異氰酸酯化合物,可舉例如(甲基)丙烯醯基氧基乙基異氰酸酯、二異氰酸酯化合物之2-羥基乙基(甲基)丙烯酸酯、羥基丙基(甲基)丙烯酸酯、羥基丁 基(甲基)丙烯酸酯、環己烷二甲醇單(甲基)丙烯酸酯、前述各(甲基)丙烯酸酯的己內酯或氧化伸烷基加成物、甘油二(甲基)丙烯酸酯、三羥甲基二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二三羥甲基丙烷三(甲基)丙烯酸酯、烯丙基醇、烯丙氧基乙醇的單加成體等之自由基性碳-碳雙鍵化合物。 (a5) Monoisocyanate compound, for example (meth)acryloyloxyethyl isocyanate, 2-hydroxyethyl (meth)acrylate of diisocyanate compound, hydroxypropyl (meth)acrylate, hydroxyl Ding Alkyl (meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, caprolactone or alkylene oxide adducts of the aforementioned (meth)acrylates, glycerol di(meth)acrylate , Trimethylol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, allyl alcohol , Radical carbon-carbon double bond compounds such as monoadducts of allyloxyethanol.

又,以抑制末端羥基殘基的影響為目的使用的單異氰酸酯羥基化合物,可舉例如苯基異氰酸酯、己基異氰酸酯、十二烷基異氰酸酯等。 In addition, the monoisocyanate hydroxy compound used for the purpose of suppressing the influence of the terminal hydroxy residue includes, for example, phenyl isocyanate, hexyl isocyanate, and dodecyl isocyanate.

前述具備具有羧基的聚胺基甲酸酯骨架(A)的聚胺基甲酸酯樹脂,可藉由二丁基錫二月桂酸酯般習知胺基甲酸酯化觸媒之存在下或不存在下,使用適當的有機溶劑,使上述(a1)聚異氰酸酯化合物、(a2)多元醇化合物、(a3)具有羧基的二羥基化合物、及因應必要的(a4)單羥基化合物或(a5)單異氰酸酯化合物反應來合成,但在無觸媒進行反應者,不需考量最終錫等之混入而佳。 The aforementioned polyurethane resin having a polyurethane skeleton (A) having a carboxyl group can be used in the presence or absence of a conventional urethane catalyst like dibutyltin dilaurate Next, use an appropriate organic solvent to make the above (a1) polyisocyanate compound, (a2) polyol compound, (a3) dihydroxy compound having a carboxyl group, and (a4) monohydroxy compound or (a5) monoisocyanate as necessary The compound is synthesized by reaction, but if the reaction is carried out without a catalyst, it is better not to consider the final tin etc. mixing.

上述有機溶劑為與異氰酸酯化合物之反應性低者則不特別限定,但以不含胺等之鹼性官能基,且沸點110℃以上、較佳為150℃以上、更佳為200℃以上之溶劑為佳。如此之溶劑,可舉例如甲苯、二甲苯、乙基苯、硝基苯、環己烷、異佛爾酮、二乙二醇二甲基醚、乙二醇二乙基醚、乙二醇單甲基醚單乙酸酯、丙二醇單甲基醚單乙 酸酯、丙二醇單乙基醚單乙酸酯、二丙二醇單甲基醚單乙酸酯、二乙二醇單乙基醚單乙酸酯、甲氧基丙酸甲基酯、甲氧基丙酸乙基酯、乙氧基丙酸甲基酯、乙氧基丙酸乙基酯、乙酸乙基酯、乙酸n-丁基酯、乙酸異戊基酯、乳酸乙基酯、丙酮、甲基乙基酮、環己酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、γ-丁內酯、二甲基亞碸、氯仿及二氯甲烷等。 The above organic solvent is not particularly limited if its reactivity with isocyanate compounds is low, but it does not contain basic functional groups such as amines and has a boiling point of 110°C or higher, preferably 150°C or higher, and more preferably 200°C or higher Better. Such solvents include, for example, toluene, xylene, ethylbenzene, nitrobenzene, cyclohexane, isophorone, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol mono Methyl ether monoacetate, propylene glycol monomethyl ether monoethyl Ester, propylene glycol monoethyl ether monoacetate, dipropylene glycol monomethyl ether monoacetate, diethylene glycol monoethyl ether monoacetate, methyl methoxypropionate, methoxypropane Acetic acid ethyl ester, ethoxy propionic acid methyl ester, ethoxy propionic acid ethyl ester, ethyl acetate, n-butyl acetate, isoamyl acetate, ethyl lactate, acetone, methyl Ethyl ketone, cyclohexanone, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, γ-butyrolactone, dimethyl sulfoxide, Chloroform and dichloromethane etc.

又,若考量對生成之聚胺基甲酸酯樹脂的溶解性低的有機溶劑不佳、及電子材料用途中將聚胺基甲酸酯作為油墨之原料,此等中尤以丙二醇單甲基醚單乙酸酯、丙二醇單乙基醚單乙酸酯、二丙二醇單甲基醚單乙酸酯、二乙二醇單乙基醚單乙酸酯、γ-丁內酯等為佳。 In addition, considering the poor solubility of organic solvents to the resulting polyurethane resin, and the use of polyurethane as a raw material for inks in electronic material applications, propylene glycol monomethyl is particularly preferred. Ether monoacetate, propylene glycol monoethyl ether monoacetate, dipropylene glycol monomethyl ether monoacetate, diethylene glycol monoethyl ether monoacetate, γ-butyrolactone, etc. are preferred.

進行原料添加的順序不特別限制,通常先添加(a2)多元醇化合物及(a3)具有羧基的二羥基化合物,溶於溶劑後,在20~150℃、更佳為60~120℃邊滴加(a1)聚異氰酸酯化合物,之後,在30~160℃、更佳為50~130℃使此等反應。 The order of adding raw materials is not particularly limited. Usually, (a2) polyol compound and (a3) dihydroxy compound with carboxyl group are added first, dissolved in a solvent, and then added dropwise at 20~150℃, more preferably 60~120℃ (a1) The polyisocyanate compound is then reacted at 30 to 160°C, more preferably 50 to 130°C.

原料的添加莫耳比,因應目的聚胺基甲酸酯樹脂的分子量及酸價來調節,但於聚胺基甲酸酯樹脂導入(a4)單羥基化合物時,為了使聚胺基甲酸酯分子末端成為異氰酸基,需要使用比(a2)多元醇化合物及(a3)具有羧基的二羥基化合物多量的(a1)聚異氰酸酯化合物(使異氰酸基比羥基的合計過量)。 The molar ratio of the raw materials is adjusted according to the molecular weight and acid value of the polyurethane resin. However, when the (a4) monohydroxy compound is introduced into the polyurethane resin, The molecular terminal becomes an isocyanate group, and it is necessary to use (a1) a polyisocyanate compound in a larger amount than (a2) a polyol compound and (a3) a dihydroxy compound having a carboxyl group (to make the isocyanate group exceed the total amount of hydroxyl groups).

具體上此等添加莫耳比,(a1)聚異氰酸酯 化合物的異氰酸基:((a2)多元醇化合物的羥基+(a3)具有羧基的二羥基化合物的羥基)為0.5~1.5:1、較佳為0.8~1.2:1、更佳為0.95~1.05。 Specifically, these molar ratios are added, (a1) polyisocyanate The isocyanate group of the compound: ((a2) the hydroxyl group of the polyol compound + (a3) the hydroxyl group of the dihydroxy compound having a carboxyl group) is 0.5~1.5:1, preferably 0.8~1.2:1, more preferably 0.95~ 1.05.

又,(a2)多元醇化合物的羥基:(a3)具有羧基的二羥基化合物的羥基為1:0.1~30、較佳為1:0.3~10。 In addition, (a2) the hydroxyl group of the polyol compound: (a3) the hydroxyl group of the dihydroxy compound having a carboxyl group is 1:0.1-30, preferably 1:0.3-10.

使用(a4)單羥基化合物時,以相較於((a2)多元醇化合物+(a3)具有羧基的二羥基化合物)之莫耳數,(a1)聚異氰酸酯化合物的莫耳數為過量,且相對異氰酸基的過量莫耳數,使用(a4)單羥基化合物0.5~1.5倍莫耳量、較佳為0.8~1.2倍莫耳量為佳。 When using (a4) a monohydroxy compound, the molar number of (a1) polyisocyanate compound is excessive compared to the molar number of ((a2) polyol compound + (a3) dihydroxy compound having a carboxyl group), and Relative to the excess molar number of isocyanate groups, it is better to use (a4) monohydroxy compound 0.5 to 1.5 times molar amount, preferably 0.8 to 1.2 times molar amount.

使用(a5)單異氰酸酯化合物時,相較於(a1)聚異氰酸酯化合物的莫耳數,使((a2)多元醇化合物+(a3)具有羧基的二羥基化合物)之莫耳數為過量,以相對羥基的過量莫耳數,使用0.5~1.5倍莫耳量、較佳為0.8~1.2倍莫耳量為佳。 When (a5) a monoisocyanate compound is used, the number of moles of ((a2) polyol compound + (a3) dihydroxy compound having a carboxyl group) is excessive compared to the number of moles of (a1) polyisocyanate compound, so that Relative to the excess molar number of the hydroxyl group, 0.5 to 1.5 times the molar amount, preferably 0.8 to 1.2 times the molar amount is preferably used.

為了使(a4)單羥基化合物導入具有羧基的聚胺基甲酸酯骨架(A),在(a2)多元醇化合物及(a3)具有羧基的二羥基化合物與(a1)聚異氰酸酯化合物之反應快結束的時點,為了使具有羧基的聚胺基甲酸酯骨架(A)之兩末端殘存之異氰酸基與(a4)單羥基化合物反應,反應溶液中在20~150℃、更佳為70~120℃滴下(a4)單羥基化合物,之後在同溫度保持後使反應結束。 In order to introduce (a4) the monohydroxy compound into the carboxyl-containing polyurethane skeleton (A), (a2) the polyol compound and (a3) the dihydroxy compound having the carboxyl group react quickly with (a1) the polyisocyanate compound At the end, in order to react the remaining isocyanate groups at both ends of the polyurethane skeleton (A) having carboxyl groups with the (a4) monohydroxy compound, the reaction solution should be at 20 to 150°C, more preferably 70 The (a4) monohydroxy compound is dropped at ~120°C, and then the reaction is completed after maintaining the same temperature.

為使(a5)單異氰酸酯化合物導入具有羧基 的聚胺基甲酸酯骨架(A),在(a2)多元醇化合物及(a3)具有羧基的二羥基化合物與(a1)聚異氰酸酯化合物之反應快結束的時點,為了使(A)聚胺基甲酸酯骨架之兩末端殘存之羥基與(a5)單異氰酸酯化合物反應,反應溶液中在20~150℃、更佳為50~120℃滴下(a5)單異氰酸酯化合物,之後在同溫度保持後使反應結束。 In order to introduce (a5) monoisocyanate compound with carboxyl group The polyurethane skeleton (A) of (a2) polyol compound and (a3) the reaction of the dihydroxy compound with carboxyl group and (a1) polyisocyanate compound is about to end, in order to make (A) polyamine The hydroxyl groups remaining at both ends of the carbamic acid ester skeleton react with the (a5) monoisocyanate compound, and the (a5) monoisocyanate compound is dropped in the reaction solution at 20 to 150°C, more preferably 50 to 120°C, and then maintained at the same temperature End the reaction.

(B)脂肪族氧化物開環加成部 (B) Aliphatic oxide ring-opening addition part

(B)脂肪族氧化物開環加成部可藉由使前述具備具有羧基的聚胺基甲酸酯骨架(A)的聚胺基甲酸酯樹脂所含有的羧基(-COOH)與含有下述式(x1)所表示之烯基氧化物或式(x2)所表示之環烯基氧化物的脂肪族氧化物反應而得到。 (B) The aliphatic oxide ring-opening addition part can be obtained by combining the carboxyl group (-COOH) contained in the polyurethane resin having the polyurethane skeleton (A) having a carboxyl group with the following It is obtained by reacting the alkenyl oxide represented by the formula (x1) or the aliphatic oxide of the cycloalkenyl oxide represented by the formula (x2).

Figure 104135862-A0202-12-0025-14
Figure 104135862-A0202-12-0025-14

式(x1)中,R1、R2,各自獨立,為氫原子、碳原子數為1~16之烷基、或苯基。由容易取得的觀點而言,以R1、R2,各自獨立,為氫原子或甲基、或者R1、R2之至少一者為氫原子且另一者為碳原子數為1~10之烷基、或苯基者為佳。具體上,上述式(x1)所表示之烯基氧化物,可舉例如環氧乙烷、環氧丙烷、環氧丁烷、苯環氧乙烷。 In formula (x1), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or a phenyl group. From the viewpoint of easy acquisition, R 1 and R 2 are each independently a hydrogen atom or a methyl group, or at least one of R 1 and R 2 is a hydrogen atom and the other has a carbon atom number of 1-10 The alkyl group or phenyl group is preferred. Specifically, the alkenyl oxide represented by the above formula (x1) includes, for example, ethylene oxide, propylene oxide, butylene oxide, and styrene oxide.

Figure 104135862-A0202-12-0026-15
Figure 104135862-A0202-12-0026-15

式(x2)中,Z為碳原子數為2~12的單環式脂肪族烴基或複環式脂肪族烴基,且形成包含該Z鍵結的2個碳原子之碳原子數為4~14的脂環構造。由容易取得點,以碳原子數為6~12的脂環構造者為佳。具體上,上述式(x2)所表示之環烯基氧化物,可舉例如環氧環己烷、環辛烯氧化物、環十二烯氧化物、二環戊二烯之單氧化物等之環烯基氧化物。 In formula (x2), Z is a monocyclic aliphatic hydrocarbon group with 2-12 carbon atoms or a bicyclic aliphatic hydrocarbon group, and the formation of 2 carbon atoms including the Z bond has 4-14 carbon atoms的alicyclic structure. In terms of easy accessibility, an alicyclic structure with 6 to 12 carbon atoms is preferred. Specifically, the cycloalkenyl oxide represented by the above formula (x2) includes, for example, epoxycyclohexane, cyclooctene oxide, cyclododecene oxide, and dicyclopentadiene monooxide. Cycloalkenyl oxide.

前述具有羧基的聚胺基甲酸酯骨架(A)與上述脂肪族氧化物進行反應之條件方面,為於合成具有羧基的聚胺基甲酸酯骨架(A)的溶液中,加入促進環氧基與羧酸的反應之觸媒,在50℃~160℃、更佳為80~140℃進行加熱使其反應。反應溫度過低則有速度變得過慢,反應溫度過高則有膠體化之虞。反應時間為2~48小時、較佳為3~24小時、更佳為4~12小時。 Regarding the conditions for the reaction of the polyurethane skeleton (A) having a carboxyl group with the aliphatic oxide, the solution for synthesizing the polyurethane skeleton (A) having a carboxyl group is added to promote epoxy The catalyst for the reaction between the radical and the carboxylic acid is heated at 50°C to 160°C, more preferably 80 to 140°C for the reaction. When the reaction temperature is too low, the speed may become too slow, and when the reaction temperature is too high, there is a risk of colloidization. The reaction time is 2 to 48 hours, preferably 3 to 24 hours, more preferably 4 to 12 hours.

具有羧基的聚胺基甲酸酯骨架(A)與上述脂肪族氧化物的使用量方面,相對於具有羧基的聚胺基甲酸酯骨架(A)中之羧基而言,脂肪族氧化物的環氧基成為0.5當量~50當量之量為佳、0.7當量~20當量較佳、1當 量~10當量再更佳。上述當量比0.5低則生成之羥基濃度變低,與異氰酸基之反應點變低而不佳。上述當量超過50當量則有樹脂本身吸溼率降低等之負面影響。 Regarding the usage amount of the polyurethane skeleton (A) having a carboxyl group and the above-mentioned aliphatic oxide, relative to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group, the aliphatic oxide is The epoxy group becomes 0.5 equivalent to 50 equivalents, preferably 0.7 equivalents to 20 equivalents, 1 equivalent The amount is better than 10 equivalents. If the above equivalent is lower than 0.5, the concentration of generated hydroxyl groups will be lower, and the reaction point with isocyanate groups will be lower and unfavorable. If the above equivalent exceeds 50 equivalents, there will be negative effects such as a decrease in the moisture absorption rate of the resin itself.

前述具有羧基的聚胺基甲酸酯骨架(A)與含有上述式(x1)所表示之烯基氧化物或式(x2)所表示之環烯基氧化物的至少一者之脂肪族氧化物反應而得到的含羥基之聚胺基甲酸酯樹脂,亦可含有一部份未反應的羧基。藉由具有未反應的羧基而亦有與基材或金屬配線之密著性提升的情形。使未反應的羧基的量相對於原本的羧基的量,為50%以下、較佳為20%以下、更佳為10%以下之方式進行反應,可得到酸價為0~50mg-KOH/g、較佳為0~30mg-KOH/g、更佳為0~10mg-KOH/g之含羥基之聚胺基甲酸酯樹脂。得到的含羥基之聚胺基甲酸酯樹脂為以式(p1)或式(p2)所表示之構造。 The aforementioned polyurethane skeleton (A) having a carboxyl group and an aliphatic oxide containing at least one of the alkenyl oxide represented by the above formula (x1) or the cycloalkenyl oxide represented by the formula (x2) The hydroxyl-containing polyurethane resin obtained by the reaction may also contain a part of unreacted carboxyl groups. By having an unreacted carboxyl group, the adhesion to the substrate or metal wiring may be improved. The amount of unreacted carboxyl groups is 50% or less, preferably 20% or less, and more preferably 10% or less with respect to the original carboxyl groups, and the acid value is 0-50mg-KOH/g. , Preferably 0~30mg-KOH/g, more preferably 0~10mg-KOH/g hydroxyl-containing polyurethane resin. The obtained hydroxyl-containing polyurethane resin has a structure represented by formula (p1) or formula (p2).

Figure 104135862-A0202-12-0027-16
Figure 104135862-A0202-12-0027-16

Figure 104135862-A0202-12-0028-17
Figure 104135862-A0202-12-0028-17

式中R1、R2、Z、n1、n2同前述式(b1)或式(b2)中之同符號者。更佳的n1為1~10之整數,更佳的n2為1~3之整數。又,含羥基之聚胺基甲酸酯樹脂如式(p1)或式(p2)所表示般,雖然具有聚胺基甲酸酯骨架(A)中之羧基鍵結有整數個以括弧表示的單位之構造,但不需全部的羧基鍵結有以括弧表示的單位。即、鍵結於各羧基的以括弧表示的單位數不需相同,亦可如上述具有未被鍵結的未反應的羧基。因為無法確認鍵結於各羧基的以括弧表示的單位數,故在後述實施例算出平均值。藉由相對於具有羧基的聚胺基甲酸酯骨架(A)中之羧基而言,脂肪族氧化物的環氧基成為0.5當量~50當量之量進行反應,n1及n2的平均值理論上可為0.5~50,但實際上為比理論值小的值。n1之較佳平均值為0.4~10,以0.5~5更佳。n2的較佳平均值為0.4~10,以0.5~5更佳。 In the formula, R 1 , R 2 , Z, n 1 , and n 2 have the same symbols as in the aforementioned formula (b1) or formula (b2). More preferably n 1 is an integer from 1 to 10, and more preferably n 2 is an integer from 1 to 3. In addition, the hydroxyl-containing polyurethane resin is as represented by formula (p1) or formula (p2), although the carboxyl group in the polyurethane skeleton (A) is bonded with an integer number of parentheses. The structure of the unit, but it is not necessary that all the carboxyl groups are bonded with the units shown in parentheses. That is, the number of units shown in parentheses bonded to each carboxyl group does not need to be the same, and may have an unreacted carboxyl group that is not bonded as described above. Since the number of units shown in parentheses bonded to each carboxyl group could not be confirmed, the average value was calculated in the examples described later. The epoxy group of the aliphatic oxide is reacted in an amount of 0.5 to 50 equivalents relative to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group, the average value of n 1 and n 2 Theoretically, it can be 0.5-50, but it is actually a value smaller than the theoretical value. The preferable average value of n 1 is 0.4-10, more preferably 0.5-5. The preferred average value of n 2 is 0.4-10, more preferably 0.5-5.

因為如此得到的含羥基之聚胺基甲酸酯樹脂具有羥基,故測定羥基濃度作為羥基價而可測定官能基數。羥基價較佳範圍方面,在原本的胺基甲酸酯樹脂具有 末端羥基時亦包含其,為10~140mg-KOH/g、更佳為20~140mg-KOH/g、再佳為30~140mg-KOH/g。 Since the hydroxyl-containing polyurethane resin thus obtained has a hydroxyl group, the number of functional groups can be measured by measuring the concentration of the hydroxyl group as the hydroxyl value. In terms of the preferred range of hydroxyl valence, the original urethane resin has It is also included when the terminal hydroxyl group is 10~140mg-KOH/g, more preferably 20~140mg-KOH/g, still more preferably 30~140mg-KOH/g.

又,上述反應可在惰性氣體或空氣環境進行,但在環氧乙烷般易燃性高的化合物的場合,需要在惰性氣體環境下進行,又,因為沸點亦非常低,故需在加壓下進行反應。 In addition, the above reaction can be carried out in an inert gas or air environment, but in the case of a compound with high flammability like ethylene oxide, it needs to be carried out in an inert gas environment. Moreover, because the boiling point is also very low, it needs to be under pressure. Under the reaction.

反應觸媒方面,具有羧基的聚胺基甲酸酯骨架(A)所含有的羧基雖亦可作為觸媒,但以更提高反應速度或聚合度之目的,可添加鹼性化合物。鹼性化合物,可舉例如例如3級胺、膦化合物、4級氫氧化銨。更具體地,3級胺可舉例如三乙基胺、三丁基胺、三辛基胺、DBU(登錄商標)(1,8-二氮雜雙環[5,4,0]十一烯-7)、DBN(1,5-二氮雜雙環[4,3,0]壬烯-5)、2,4,6-參二甲基胺基甲基酚等。膦化合物,可舉例如三苯基膦、三苯基亞磷酸鹽、三甲基膦、三甲基亞磷酸鹽等。4級氫氧化銨,可舉例如四甲基氫氧化銨。此等使用量,添加過少則無添加效果,過多則得到的聚胺基甲酸酯樹脂的電絕緣性降低,故相對於具有羧基的聚胺基甲酸酯骨架(A)與脂肪族氧化物的合計質量,使用0.1~5質量%、更佳為0.5~3質量%。 Regarding the reaction catalyst, although the carboxyl group contained in the polyurethane skeleton (A) having a carboxyl group can also be used as a catalyst, a basic compound may be added for the purpose of further increasing the reaction rate or the degree of polymerization. Examples of basic compounds include tertiary amines, phosphine compounds, and tertiary ammonium hydroxide. More specifically, the tertiary amine includes, for example, triethylamine, tributylamine, trioctylamine, DBU (registered trademark) (1,8-diazabicyclo[5,4,0]undecene- 7), DBN (1,5-diazabicyclo[4,3,0]nonene-5), 2,4,6-dimethylaminomethylphenol, etc. The phosphine compound includes, for example, triphenylphosphine, triphenylphosphite, trimethylphosphine, and trimethylphosphite. The quaternary ammonium hydroxide includes, for example, tetramethylammonium hydroxide. Too little of these usage amounts will have no effect, and too much will reduce the electrical insulation of the resulting polyurethane resin. Therefore, it has a carboxyl group-containing polyurethane skeleton (A) and aliphatic oxide. The total mass of the product is 0.1~5 mass%, more preferably 0.5~3 mass%.

第一實施形態之具備具有羧基的聚胺基甲酸酯骨架(A)的含羥基之聚胺基甲酸酯樹脂,可用作為含有以金、銀、銅、鋁所構成的群所選出的元素構成的金屬粒子及/或含上述元素之金屬氧化物粒子(以下、將此等 一併稱為金屬成分)的組成物(例如油墨用)之黏合劑。金屬粒子或金屬氧化物粒子的體積平均粒徑,例如0.01μm~100μm的範圍、更佳為0.02~50μm、更佳為0.1~10μm。粒子形狀可使用球狀、平板狀、針狀等種種者。雖亦可使用線狀者,但該場合線徑平均以1nm以上500nm以下為佳、5nm以上200nm以下更佳、5nm以上100nm以下再佳、10nm以上100nm以下特別佳。又,金屬奈米線之長軸的長度的平均,以1μm以上100μm以下為佳、1μm以上50μm以下更佳、2μm以上50μm以下再佳、5μm以上30μm以下特別佳。線以徑粗度的平均及長軸長度的平均符合上述範圍,且長寬比之平均在10以上為佳、100以上較佳、200以上再更佳。在此,長寬比為金屬奈米線徑之平均粗度近似b、長軸平均長度近似a時,以a/b求出的值。a及b可使用掃描電子顯微鏡測定。將含該金屬成分及黏合劑之組成物以網版印刷法、凹板印刷法、噴墨法等之印刷法於基材上形成印刷圖型,對該印刷圖型進行熱處理、光照射或微波加熱,生成金屬的燒結體,藉此可形成導電圖型。 The hydroxyl-containing polyurethane resin having a polyurethane skeleton (A) having a carboxyl group according to the first embodiment can be used as an element containing selected elements from the group consisting of gold, silver, copper, and aluminum Metal particles and/or metal oxide particles containing the above-mentioned elements (hereinafter, these It is collectively referred to as a metal component) as a binder for the composition (for example, ink). The volume average particle diameter of the metal particles or metal oxide particles is, for example, in the range of 0.01 μm to 100 μm, more preferably 0.02 to 50 μm, more preferably 0.1 to 10 μm. Various particle shapes such as spherical, flat, and needle shapes can be used. Although linear ones can also be used, the average wire diameter in this case is preferably 1 nm or more and 500 nm or less, more preferably 5 nm or more and 200 nm or less, more preferably 5 nm or more and 100 nm or less, and particularly preferably 10 nm or more and 100 nm or less. In addition, the average length of the long axis of the metal nanowire is preferably 1 μm or more and 100 μm or less, more preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 50 μm or less, and particularly preferably 5 μm or more and 30 μm or less. The average diameter of the wire and the average length of the major axis conform to the above range, and the average aspect ratio is preferably 10 or more, preferably 100 or more, and even more preferably 200 or more. Here, the aspect ratio is a value calculated as a/b when the average thickness of the metal nanowire diameter is approximately b and the average long axis length is approximately a. A and b can be measured by scanning electron microscope. The composition containing the metal component and the adhesive is formed on a substrate with a printing method such as screen printing, gravure printing, inkjet method, etc., and the printed pattern is subjected to heat treatment, light irradiation or microwave Heating produces a metal sintered body, thereby forming a conductive pattern.

印刷上述含金屬成分及黏合劑之組成物的基材,可舉例如聚醯亞胺薄膜、聚酯薄膜。尤其聚醯亞胺薄膜,具有電絕緣性或耐熱性優異,且印刷性本身具有可藉由對基板進行電暈處理、電漿處理等之表面處理來改良之優點,但一般在與樹脂之密著性上若不設置接著層則難以改善。又藉由設置接著層,而有損害耐熱性、絕緣性之 虞。而本實施形態之含羥基之聚胺基甲酸酯樹脂因為對聚醯亞胺薄膜亦具有良好的接著性,故可使表面不具有密著層的聚醯亞胺薄膜用作為基材。 The substrate on which the composition containing the metal component and the adhesive is printed includes, for example, a polyimide film and a polyester film. In particular, polyimide film has excellent electrical insulation or heat resistance, and the printability itself has the advantage that it can be improved by surface treatment such as corona treatment and plasma treatment on the substrate, but it is generally dense with resin It is difficult to improve the adhesion if no adhesive layer is provided. Moreover, by providing the adhesive layer, the heat resistance and insulation are damaged Yu. Since the hydroxyl-containing polyurethane resin of this embodiment also has good adhesion to the polyimide film, a polyimide film without an adhesion layer on the surface can be used as a substrate.

第一實施形態之含羥基之聚胺基甲酸酯樹脂用作為上述組成物用之黏合劑時,即使在使用對苯二甲酸乙二醇酯或聚碳酸酯等之樹脂作為基材時,即使以比一般黏合劑相對低溫進行熱處理仍可表現高導電性且具有對上述基材之密著性優異的特性。 When the hydroxyl-containing polyurethane resin of the first embodiment is used as a binder for the above composition, even when a resin such as ethylene terephthalate or polycarbonate is used as a base material, Heat treatment at a relatively low temperature than general adhesives can still exhibit high conductivity and have excellent adhesion to the above-mentioned substrate.

<鍵結有聚異氰酸酯化合物(Q)的聚胺基甲酸酯樹脂> <Polyurethane resin bonded with polyisocyanate compound (Q)>

第二實施形態之聚胺基甲酸酯樹脂為如以上得到的藉由使具備具有羧基的聚胺基甲酸酯骨架(A)、與鍵結於上述羧基之至少一部份的含有上述式(b1)所表示之烯基氧化物開環加成部或式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B)的含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份與聚異氰酸酯化合物(Q)反應而得到的聚異氰酸酯化合物(Q)與含羥基之聚胺基甲酸酯樹脂之反應生成物。在此,脂肪族氧化物開環加成部(B)之至少一部份係指烯基氧化物開環加成部(b1)及環烯基氧化物開環加成部(b2)之至少一者的開環加成部(B)之一部份。上述反應的結果,生成含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)的至少一部份與聚異氰酸酯化合物(Q)之反應生成物的聚胺基甲酸酯樹脂(以後、稱為 聚胺基甲酸酯樹脂。)。 The polyurethane resin of the second embodiment is obtained as described above by having a polyurethane skeleton (A) having a carboxyl group and at least a part of the carboxyl group bonded to the above-mentioned formula The aliphatic oxide ring-opening addition part (B) of the alkenyl oxide ring-opening addition part represented by the formula (b2) or the cycloalkenyl oxide ring-opening addition part represented by the formula (b2) The polyisocyanate compound (Q) obtained by reacting at least a part of the aliphatic oxide ring-opening addition part (B) of the polyurethane resin with the polyisocyanate compound (Q) and the hydroxyl-containing polyurethane The reaction product of acid ester resin. Here, at least a part of the aliphatic oxide ring-opening addition part (B) refers to at least the alkenyl oxide ring-opening addition part (b1) and the cycloalkenyl oxide ring-opening addition part (b2) One part of the open-loop bonus (B). As a result of the above reaction, at least a part of the aliphatic oxide ring-opening addition part (B) of the hydroxyl-containing polyurethane resin and the reaction product of the polyisocyanate compound (Q) are produced. Acid ester resin (hereinafter referred to as Polyurethane resin. ).

又,相對含羥基之聚胺基甲酸酯樹脂中之羥基,聚異氰酸酯化合物(Q)中之異氰酸基以等當量反應為佳,但聚異氰酸酯化合物(Q)中之異氰酸基的當量偏差-20%~+20%程度以內則可使用。 In addition, the isocyanate group in the polyisocyanate compound (Q) is preferably reacted in an equivalent amount relative to the hydroxyl group in the hydroxy-containing polyurethane resin, but the isocyanate group in the polyisocyanate compound (Q) is It can be used within the equivalent deviation of -20%~+20%.

如此之聚異氰酸酯化合物(Q),可舉例如脂肪族聚異氰酸酯化合物、脂環族聚異氰酸酯化合物、芳香族聚異氰酸酯化合物、芳香脂肪族聚異氰酸酯化合物等。 Such polyisocyanate compounds (Q) include, for example, aliphatic polyisocyanate compounds, alicyclic polyisocyanate compounds, aromatic polyisocyanate compounds, and aromatic aliphatic polyisocyanate compounds.

作為脂肪族聚異氰酸酯化合物,可舉例如1,4-四伸甲基二異氰酸酯、1,6-六伸甲基二異氰酸酯、2,2,4-三甲基六伸甲基二異氰酸酯、2,4,4-三甲基六伸甲基二異氰酸酯、賴氨酸二異氰酸酯、二聚酸二異氰酸酯等。 As the aliphatic polyisocyanate compound, for example, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2, 4,4-Trimethylhexamethylene diisocyanate, lysine diisocyanate, dimer acid diisocyanate, etc.

作為脂環族聚異氰酸酯化合物,可舉例如1,3-雙(異氰酸酯甲基)環己烷、1,4-雙(異氰酸酯甲基)環己烷、3-異氰酸酯甲基-3,3,5-三甲基環己烷(IPDI、異佛爾酮二異氰酸酯)、雙-(4-異氰酸酯環己基)甲烷(氫化MDI)、降冰片烷二異氰酸酯等。 Examples of the alicyclic polyisocyanate compound include 1,3-bis(isocyanatemethyl)cyclohexane, 1,4-bis(isocyanatemethyl)cyclohexane, and 3-isocyanatemethyl-3,3,5 -Trimethylcyclohexane (IPDI, isophorone diisocyanate), bis-(4-isocyanate cyclohexyl) methane (hydrogenated MDI), norbornane diisocyanate, etc.

作為芳香族聚異氰酸酯化合物,可舉例如2,4’-二苯基甲烷二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、1,4-伸苯基二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、3,3’-二甲基-4,4’-二異氰酸酯聯苯基、3,3’-二甲基-4,4’-二異氰酸酯二苯基甲烷、1,5-伸萘基二異氰酸酯等。 Examples of aromatic polyisocyanate compounds include 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,4-phenylene diisocyanate, 2,4-toluene diisocyanate Isocyanate, 2,6-toluene diisocyanate, 3,3'-dimethyl-4,4'-diisocyanate biphenyl, 3,3'-dimethyl-4,4'-diisocyanate diphenylmethane , 1,5-naphthylene diisocyanate, etc.

作為芳香脂肪族聚異氰酸酯化合物,可舉例 如1,3-苯二甲基二異氰酸酯、1,4-苯二甲基二異氰酸酯、α,α,α’,α’-四甲基苯二甲基二異氰酸酯等。 As the aromatic aliphatic polyisocyanate compound, for example Such as 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, α,α,α',α'-tetramethylxylylene diisocyanate, etc.

又,作為上述以外之聚異氰酸酯化合物(Q),可舉例如異氰酸酯化合物與含活性氫基之化合物之反應而成的異氰酸基末端化合物、此等化合物的反應物(例如加成物型聚異氰酸酯、或脲甲酸酯化反應、碳二醯亞胺化反應、縮脲二酮化反應、異氰尿酸酯化反應、酮亞胺化反應、縮二脲化反應等而成的異氰酸酯改性體等)、或此等混合物等。 Moreover, as the polyisocyanate compound (Q) other than the above, for example, an isocyanate group terminal compound formed by the reaction of an isocyanate compound and an active hydrogen group-containing compound, and a reactant of these compounds (for example, an adduct type poly Isocyanate, or allophanate reaction, carbodiimide reaction, uretdionization reaction, isocyanuration reaction, ketimination reaction, biuretization reaction, etc. Sex body, etc.), or these mixtures, etc.

此等聚異氰酸酯化合物(Q)可單獨使用或2種以上併用。 These polyisocyanate compounds (Q) can be used alone or in combination of two or more kinds.

又,此等聚異氰酸酯化合物(Q)可為原料聚異氰酸酯化合物中相對於原料多元醇化合物的羥基殘留過量異氰酸酯而反應所得的預聚物。 In addition, these polyisocyanate compounds (Q) may be prepolymers obtained by reacting excess isocyanate remaining in the raw polyisocyanate compound with respect to the hydroxyl group of the raw polyol compound.

用以得到該預聚物的多元醇化合物為含有2個以上對異氰酸基具有反應性之羥基的化合物,具體上例如丙烯酸多元醇、聚酯多元醇、聚醚多元醇、環氧多元醇等。 The polyol compound used to obtain the prepolymer is a compound containing two or more hydroxyl groups reactive to isocyanate groups, specifically, for example, acrylic polyol, polyester polyol, polyether polyol, epoxy polyol Wait.

丙烯酸多元醇,可舉例如一分子中具有1個以上之活性氫(羥基)的聚合性單體與可與其共聚合的單體的共聚合物。 The acrylic polyol includes, for example, a copolymer of a polymerizable monomer having at least one active hydrogen (hydroxyl group) in one molecule and a monomer copolymerizable therewith.

一分子中具有1個以上之活性氫的聚合性單體,可舉例如丙烯酸-2-羥基乙基酯、丙烯酸-2-羥基丙基酯、丙烯酸-2-羥基丁基等之丙烯酸羥基酯類、甲基丙烯 酸-2-羥基乙基酯、甲基丙烯酸-2-羥基丙基酯、甲基丙烯酸-2-羥基丁基酯等之甲基丙烯酸羥基酯類、甘油的丙烯酸單酯或者甲基丙烯酸單酯、三羥甲基丙烷的丙烯酸單酯或者甲基丙烯酸單酯、或此等羥基進行ε-己內酯開環聚合而得到的單體等。 A polymerizable monomer having one or more active hydrogens in one molecule, for example, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, etc. Methacrylic 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate and other hydroxy methacrylates, glycerol monoacrylate or methacrylate monoester , Monoacrylate or methacrylate of trimethylolpropane, or monomers obtained by ring-opening polymerization of ε-caprolactone of these hydroxyl groups.

可與上述聚合性單體共聚合之單體,可舉例如丙烯酸甲基酯、丙烯酸乙基酯、丙烯酸異丙基酯、丙烯酸-n-丁基酯、丙烯酸-2-乙基己基酯等之丙烯酸酯類、甲基丙烯酸甲基酯、甲基丙烯酸乙基酯、甲基丙烯酸異丙基酯、甲基丙烯酸-n-丁基酯、甲基丙烯酸異丁基酯、甲基丙烯酸-n-己基酯、甲基丙烯酸環己基酯、甲基丙烯酸月桂基酯、甲基丙烯酸縮水甘油酯等之甲基丙烯酸酯類、丙烯酸、甲基丙烯酸、馬來酸、伊康酸等之不飽和羧酸類、丙烯醯胺、N-羥甲基丙烯醯胺、二丙酮丙烯醯胺等之不飽和醯胺類、苯乙烯、乙烯基甲苯、乙酸乙烯基酯、丙烯腈等。 The monomers that can be copolymerized with the above polymerizable monomers include, for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, -n-butyl acrylate, 2-ethylhexyl acrylate, etc. Acrylic esters, methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, -n-butyl methacrylate, isobutyl methacrylate, -n- methacrylate Methacrylates such as hexyl ester, cyclohexyl methacrylate, lauryl methacrylate, glycidyl methacrylate, etc., unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, and itaconic acid , Unsaturated amides such as acrylamide, N-methylol acrylamide, diacetone acrylamide, styrene, vinyl toluene, vinyl acetate, acrylonitrile, etc.

聚酯多元醇,可舉例如縮合聚酯多元醇、聚碳酸酯多元醇、聚內酯多元醇等。 Examples of polyester polyols include condensation polyester polyols, polycarbonate polyols, and polylactone polyols.

縮合聚酯多元醇,可舉例如乙二醇、丙二醇、1,3-丙烷二醇、1,4-丁二醇、1,5-戊烷二醇、3-甲基-1,5-戊烷二醇、1,6-己二醇、新戊基二醇、丁基乙基丙烷二醇、二乙二醇、三乙二醇、四乙二醇、聚乙二醇、二丙二醇、三丙二醇等之二醇類、與琥珀酸、己二酸、壬二酸、癸二酸、十二烷二羧酸、無水馬來酸、富馬酸、1,3- 環戊烷二羧酸、1,4-環己烷二羧酸、對苯二甲酸、異苯二甲酸、苯二甲酸、萘二羧酸等之二羧酸的反應物。 Condensed polyester polyols, for example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentane Alkyl glycol, 1,6-hexanediol, neopentyl glycol, butyl ethyl propane glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, dipropylene glycol, three Diols such as propylene glycol, and succinic acid, adipic acid, azelaic acid, sebacic acid, dodecane dicarboxylic acid, anhydrous maleic acid, fumaric acid, 1,3- Cyclopentane dicarboxylic acid, 1,4-cyclohexane dicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, naphthalene dicarboxylic acid and other dicarboxylic acid reactants.

具體上如聚乙烯己二酸酯二醇、聚丁烯己二酸酯二醇、聚六伸甲基己二酸酯二醇、聚新戊烯基己二酸酯二醇、聚乙烯丙烯己二酸酯二醇、聚乙烯丁烯己二酸酯二醇、聚丁烯六伸甲基己二酸酯二醇、聚(聚四伸甲基醚)己二酸酯二醇等之己二酸酯系縮合聚酯二醇、聚乙烯壬二酸酯二醇、聚丁烯壬二酸酯二醇等之壬二酸酯系縮合聚酯二醇等。 Specifically, such as polyethylene adipate diol, polybutene adipate diol, polyhexamethylene adipate diol, polyneopentenyl adipate diol, polyethylene propylene diol Diester diol, polyethylene butene adipate diol, polybutene hexamethylene adipate diol, poly(polytetramethylene ether) adipate diol, etc. Azelaate-based condensed polyester diol, such as ester-based condensed polyester diol, polyethylene azelate diol, polybutene azelate diol, etc.

聚碳酸酯多元醇,可舉例如乙二醇、丙二醇、1,3-丙烷二醇、1,4-丁二醇、1,5-戊烷二醇、3-甲基-1,5-戊烷二醇、1,6-己二醇、新戊基二醇、丁基乙基丙烷二醇、二乙二醇、三乙二醇、四乙二醇、聚乙二醇、二丙二醇、三丙二醇等之二醇類、與二甲基碳酸酯等之二烷基碳酸酯的反應物等。具體上如聚四伸甲基碳酸酯二醇、聚3-甲基五伸甲基碳酸酯二醇、聚六伸甲基碳酸酯二醇等。 Polycarbonate polyols, for example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentane Alkyl glycol, 1,6-hexanediol, neopentyl glycol, butyl ethyl propane glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, dipropylene glycol, three Diols such as propylene glycol, reactants with dialkyl carbonates such as dimethyl carbonate, etc. Specifically, such as polytetramethylene carbonate diol, poly 3-methyl pentamethylene carbonate diol, polyhexamethylene carbonate diol and the like.

聚內酯多元醇,可舉例如ε-己內酯、γ-丁內酯、γ-戊內酯及此等2種以上之混合物的開環聚合物等。具體上如聚己內酯二醇等。 The polylactone polyol includes, for example, ε-caprolactone, γ-butyrolactone, γ-valerolactone, and ring-opening polymers of a mixture of two or more of these. Specifically, such as polycaprolactone diol and the like.

聚醚多元醇,可舉例如以乙二醇、丙二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇、二乙二醇、新戊基二醇、兒茶酚、對苯二酚、雙酚A等之含2個以上活性氫原子之化合物作為起始劑,使環氧乙烷、環氧丙烷、環氧丁烷、苯環氧乙烷、表氯醇、四氫呋喃、環己烯等之單體 進行加成聚合的反應物。為使2種以上單體進行加成聚合的反應物的場合,可為封端加成、隨機加成或兩者之混合系。具體上如聚乙二醇、聚丙二醇、聚四伸甲基醚二醇等。 Polyether polyols include, for example, ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, neopentyl glycol, Catechol, hydroquinone, bisphenol A and other compounds containing more than 2 active hydrogen atoms are used as initiators to make ethylene oxide, propylene oxide, butylene oxide, phenylethylene oxide, and Monomers of chlorohydrin, tetrahydrofuran, cyclohexene, etc. The reactant for addition polymerization. When it is a reactant for addition polymerization of two or more monomers, it may be an end-capping addition, a random addition, or a mixed system of the two. Specifically, such as polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol and the like.

環氧多元醇,可舉例如酚醛清漆型、β-甲基環氧氯丙烷型、環狀環氧乙烷型、縮水甘油基醚型、二醇醚型、脂肪族不飽和化合物的環氧型、環氧化脂肪酸酯型、多元羧酸酯型、胺基縮水甘油基型、鹵素化型、間苯二酚型等之環氧多元醇。 Examples of epoxy polyols include novolac type, β-methylepichlorohydrin type, cyclic ethylene oxide type, glycidyl ether type, glycol ether type, and epoxy type of aliphatic unsaturated compound. , Epoxidized fatty acid ester type, polycarboxylic acid ester type, aminoglycidyl type, halogenated type, resorcinol type and other epoxy polyols.

聚異氰酸酯化合物(Q)雖具有複數異氰酸基即可,但此等異氰酸基中至少1個可以具活性氫之化合物封端。 The polyisocyanate compound (Q) may have a plurality of isocyanate groups, but at least one of these isocyanate groups may be blocked by a compound having active hydrogen.

封端異氰酸基的化合物,可舉例如使用習知封端劑、例如甲醇、乙醇、n-丙醇、異丙醇、n-丁醇、sec-丁醇、tert-丁醇等之醇類、酚、甲酚、硝基酚、氯酚、間苯二酚等之酚類、苯硫醇等之硫醇類、ε-己內醯胺等之己內醯胺類、乙基氨基甲酸酯等之氨基甲酸酯類、乙醯基丙酮等之酮-烯醇類、甲基乙基酮肟等之酮肟類、二異丙基胺、三唑、3,5-二甲基吡唑等之2級胺類、亞硫酸氫鈉等將前述聚異氰酸酯化合物或彼等改性體、預聚物封端的化合物。此等中,由己內醯胺、酮肟、酚、2級胺所構成的群所選出的具有活性氫之化合物,在室溫之安定性與在高溫保護基脫離後進行硬化之速度的平衡觀點為佳。 Examples of compounds that block isocyanate groups include alcohols using conventional blocking agents such as methanol, ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, tert-butanol, etc. Phenols, phenols, cresols, nitrophenols, chlorophenols, resorcinols and other phenols, mercaptans such as benzene mercaptan, caprolactams such as ε-caprolactam, ethylaminomethyl Carbamates such as esters, ketone-enols such as acetylacetone, ketoximes such as methyl ethyl ketoxime, diisopropylamine, triazole, 3,5-dimethylpyridine Secondary amines such as azoles, sodium bisulfite, and other compounds that block the aforementioned polyisocyanate compounds or their modified products and prepolymers. Among these, a compound with active hydrogen selected from the group consisting of caprolactam, ketoxime, phenol, and secondary amine is a balance between the stability at room temperature and the rate of hardening after the high temperature protective group is released Better.

又,為了促進此等聚異氰酸酯化合物(Q)與 含羥基之聚胺基甲酸酯樹脂之胺基甲酸酯化反應,亦可使用二丁基錫月桂酸酯般硬化促進觸媒。 Also, in order to promote these polyisocyanate compounds (Q) and For the urethane reaction of hydroxyl-containing polyurethane resins, dibutyltin laurate-like hardening accelerators can also be used.

作為如此之硬化促進觸媒,除錫化合物以外,可使用DBU般強鹼胺與酚、羧酸化合物之鹽或特殊胺化合物、乙醯基丙酮金屬錯合物或鉍或鋁或鋯錯合物等之非錫系化合物。 As such a hardening accelerator, in addition to tin compounds, salts of strong basic amines like DBU and phenol, carboxylic acid compounds or special amine compounds, acetone acetone metal complexes or bismuth, aluminum or zirconium complexes can be used And other non-tin compounds.

硬化促進觸媒用的錫化合物,可舉例如例如日東化成股份公司製的NEOSTANN U-100、NEOSTANN U-130、NEOSTANN U-200等、Air Products製的Dabco(登錄商標)T-12、Dabco T-120、Dabco T-125等。 Examples of tin compounds for hardening accelerating catalysts include, for example, NEOSTANN U-100, NEOSTANN U-130, NEOSTANN U-200 manufactured by Nitto Chemical Co., Ltd., and Dabco (registered trademark) T-12, Dabco T manufactured by Air Products. -120, Dabco T-125, etc.

硬化促進觸媒用的非錫化合物,可舉例如例如San-Apro股份公司製的U-CAT SA 1、U-CAT SA 102、U-CAT SA 102-50等、楠本化成股份公司製的K-KAT(登錄商標)348、K-KATXC-C227、K-KATXK-628等、日本化成產業股份公司製的Nasemu鋁、Nasemu鉻、Nasemu第二鈷等。 Examples of non-tin compounds used as hardening accelerators include U-CAT SA 1, U-CAT SA 102, U-CAT SA 102-50 manufactured by San-Apro Co., Ltd., and K-CAT SA 102-50 manufactured by Kusei Kasei Co., Ltd. KAT (registered trademark) 348, K-KATXC-C227, K-KATXK-628, etc., Nasemu aluminum manufactured by Nippon Kasei Sangyo Co., Ltd., Nasemu chromium, Nasemu second cobalt, etc.

將本實施形態之聚胺基甲酸酯樹脂溶於適當的溶劑,因應必要搭配硬化促進觸媒與印刷或塗佈用的添加材,可作成保護膜油墨(保護膜用組成物)。聚胺基甲酸酯樹脂可為含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份、即脂肪族氧化物開環加成部(B)之烯基氧化物開環加成部(b1)及環烯基氧化物開環加成部(b2)之至少一者,與聚異氰酸酯化合物(Q)反應而得到者之1種、或2種類以上之混合物。後 者之場合,可為前述具有具羧基的聚胺基甲酸酯骨架(A)與包含鍵結於前述羧基的至少一部份的以式(b1)所表示之烯基氧化物開環加成部的脂肪族氧化物開環加成部(B1)之含羥基之聚胺基甲酸酯樹脂與聚異氰酸酯化合物(Q)之反應生成物、具有包含鍵結於前述羧基的至少一部份的以式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B2)之含羥基之聚胺基甲酸酯樹脂與聚異氰酸酯化合物(Q)之反應生成物的混合物。 The polyurethane resin of this embodiment is dissolved in an appropriate solvent, and if necessary, a hardening acceleration catalyst and additives for printing or coating can be used to form a protective film ink (composition for protective film). The polyurethane resin may be at least a part of the aliphatic oxide ring-opening addition part (B) of the hydroxyl-containing polyurethane resin, that is, the aliphatic oxide ring-opening addition part (B) At least one of the alkenyl oxide ring-opening addition part (b1) and the cycloalkenyl oxide ring-opening addition part (b2) of ), which is obtained by reacting with the polyisocyanate compound (Q), or 2 A mixture of more than species. Rear In this case, it may be the ring-opening addition of the aforementioned polyurethane skeleton (A) having a carboxyl group and an alkenyl oxide represented by formula (b1) containing at least a part of the aforementioned carboxyl group. The reaction product of the hydroxyl-containing polyurethane resin of the aliphatic oxide ring-opening addition part (B1) and the polyisocyanate compound (Q), which has at least a part that is bonded to the aforementioned carboxyl group Between the aliphatic oxide ring-opening addition part (B2) of the cycloalkenyl oxide ring-opening addition part represented by formula (b2) and the polyisocyanate compound (Q) A mixture of reaction products.

保護膜油墨可使用的溶劑,可直接使用含羥基之聚胺基甲酸酯樹脂的合成使用的溶劑、或可添加調整黏度或印刷性用的其他溶劑。又,亦可使用其他溶劑。使用其他溶劑時,在添加新溶劑前後可將反應溶劑餾去、取代溶劑。 The solvent that can be used for the protective film ink can be directly used for the synthesis of hydroxyl-containing polyurethane resin, or other solvents for adjusting viscosity or printability can be added. In addition, other solvents can also be used. When using other solvents, the reaction solvent can be distilled off before and after adding a new solvent to replace the solvent.

但,考量操作繁雜性或能源成本,以直接使用含羥基之聚胺基甲酸酯樹脂的合成所使用的溶劑為佳。 However, considering the complexity of the operation or the energy cost, it is better to directly use the solvent used in the synthesis of the hydroxyl-containing polyurethane resin.

調整黏度或印刷性用時可使用的溶劑雖因印刷樣式而異,為與異氰酸酯化合物反應性低者則不特別限定,以不含胺等之鹼性官能基且沸點為60℃以上、較佳為110℃以上之溶劑為佳。如此之溶劑,可舉例如甲苯、二甲苯、乙基苯、硝基苯、環己烷、異佛爾酮、二乙二醇二甲基醚、乙二醇二乙基醚、乙二醇單甲基醚單乙酸酯、丙二醇單甲基醚單乙酸酯、丙二醇單乙基醚單乙酸酯、二丙二醇單甲基醚單乙酸酯、二乙二醇單乙基醚單乙酸酯、甲氧基丙酸甲基酯、甲氧基丙酸乙基酯、乙氧基丙酸甲基 酯、乙氧基丙酸乙基酯、乙酸乙基酯、乙酸n-丁基酯、乙酸異戊基酯、乳酸乙基酯、丙酮、甲基乙基酮、環己酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、γ-丁內酯、二甲基亞碸、氯仿及二氯甲烷等。 Solvents that can be used to adjust viscosity or printability vary depending on the printing style, but are not particularly limited if they have low reactivity with isocyanate compounds. They do not contain basic functional groups such as amines and have a boiling point of 60°C or higher. A solvent above 110°C is preferred. Such solvents include, for example, toluene, xylene, ethylbenzene, nitrobenzene, cyclohexane, isophorone, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol mono Methyl ether monoacetate, propylene glycol monomethyl ether monoacetate, propylene glycol monoethyl ether monoacetate, dipropylene glycol monomethyl ether monoacetate, diethylene glycol monoethyl ether monoacetic acid Ester, methyl methoxypropionate, ethyl methoxypropionate, methyl ethoxypropionate Ester, ethyl ethoxypropionate, ethyl acetate, n-butyl acetate, isoamyl acetate, ethyl lactate, acetone, methyl ethyl ketone, cyclohexanone, N,N- Dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, γ-butyrolactone, dimethyl sulfoxide, chloroform and dichloromethane, etc.

又使用前述異氰酸酯的封端化合物作為聚異氰酸酯化合物(Q)時,與異氰酸酯反應之甲醇、乙醇、異丙醇、環己醇、苄基醇等亦可用作為溶劑。 When the aforementioned isocyanate-terminated compound is used as the polyisocyanate compound (Q), methanol, ethanol, isopropanol, cyclohexanol, benzyl alcohol, etc. that react with isocyanate can also be used as a solvent.

保護膜油墨中之固體成分濃度雖因期望膜厚或印刷方法而異,但以20~90質量%為佳、30質量%~80質量%更佳。 Although the solid content concentration in the protective film ink varies depending on the desired film thickness or printing method, it is preferably 20 to 90% by mass, and more preferably 30 to 80% by mass.

調合的保護膜油墨,以網版印刷法、凹板印刷法、噴墨法等之印刷法於有導電圖型之基材上形成印刷圖型,該印刷圖型因應必要於將溶劑餾去後進行加熱處理、光照射或微波加熱,使硬化而作成導電圖型的保護膜。 The blended protective film ink is used to form a printed pattern on a substrate with a conductive pattern by printing methods such as screen printing, gravure printing, and inkjet printing. The printed pattern is necessary after the solvent is distilled off. Carry out heat treatment, light irradiation or microwave heating to harden to form a conductive pattern protective film.

形成有上述導電圖型之基材,可舉例如聚醯亞胺薄膜、聚酯薄膜、ZEONOR(登錄商標)薄膜、聚碳酸酯薄膜。 The substrate on which the above-mentioned conductive pattern is formed includes, for example, a polyimide film, a polyester film, a ZEONOR (registered trademark) film, and a polycarbonate film.

導電圖型方面,可舉例如使銀或銅等之金屬及/或金屬氧化物的粒子、奈米線、奈米管等油墨化後,於基材上形成印刷圖型,將該印刷圖型導體化者。尤其使用銀奈米粒子油墨或銀奈米線油墨,製作透明導電圖型時,因為銀每單位質量之表面積大且微細配線等在高溫高溼時之絕緣信賴性低,故可以上述實施形態之保護膜樹脂 保護。 In terms of conductive patterns, for example, the particles of metals such as silver or copper and/or metal oxides, nanowires, nanotubes, etc. are formed into ink, and then a printed pattern is formed on the substrate to form the printed pattern. Conductor. Especially when silver nanoparticle ink or silver nanowire ink is used to make transparent conductive patterns, because the surface area per unit mass of silver is large and the insulation reliability of fine wiring is low at high temperature and humidity, the above embodiment can be used. Protective film resin protection.

<鍵結有具有(甲基)丙烯醯基及異氰酸基的化合物(R)的胺基甲酸酯(甲基)丙烯酸酯樹脂> <Urethane (meth)acrylate resin to which a compound (R) having a (meth)acryloyl group and an isocyanate group is bonded>

第三實施形態之胺基甲酸酯(甲基)丙烯酸酯樹脂,為具備上述具有羧基的聚胺基甲酸酯骨架(A)、與鍵結於上述羧基之至少一部份的含有以上述式(b1)所表示之烯基氧化物開環加成部或以式(b2)所表示之環烯基氧化物開環加成部的脂肪族氧化物開環加成部(B)的含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份與具有(甲基)丙烯醯基及異氰酸基的化合物(R)反應而得到的含羥基之聚胺基甲酸酯樹脂與具有(甲基)丙烯醯基及異氰酸基的化合物(R)之反應生成物。化合物(R)為以1分子中含1個以上(甲基)丙烯醯基且具有1個異氰酸基者、或該異氰酸基被保護者為宜。在此,脂肪族氧化物開環加成部(B)之至少一部份係指烯基氧化物開環加成部(b1)及環烯基氧化物開環加成部(b2)之至少一者。上述反應的結果,生成於含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份鍵結有具有(甲基)丙烯醯基及異氰酸基的化合物(R)的胺基甲酸酯(甲基)丙烯酸酯樹脂(以後、稱胺基甲酸酯(甲基)丙烯酸酯樹脂。)。 The urethane (meth)acrylate resin of the third embodiment has the polyurethane skeleton (A) having the carboxyl group, and at least a part bonded to the carboxyl group contains the The aliphatic oxide ring-opening addition part (B) of the alkenyl oxide ring-opening addition part represented by formula (b1) or the cycloalkenyl oxide ring-opening addition part represented by formula (b2) It is obtained by reacting at least a part of the aliphatic oxide ring-opening addition part (B) of a hydroxyl-based polyurethane resin with a compound (R) having a (meth)acryloyl group and an isocyanate group A reaction product of a hydroxyl-containing polyurethane resin and a compound (R) having a (meth)acryloyl group and an isocyanate group. The compound (R) preferably contains one or more (meth)acrylic acid groups in one molecule and one isocyanate group, or a protected isocyanate group. Here, at least a part of the aliphatic oxide ring-opening addition part (B) refers to at least the alkenyl oxide ring-opening addition part (b1) and the cycloalkenyl oxide ring-opening addition part (b2) One. As a result of the above reaction, at least a part of the aliphatic oxide ring-opening addition part (B) formed in the hydroxyl-containing polyurethane resin is bonded with a (meth)acrylic acid group and an isocyanic acid The urethane (meth)acrylate resin of the compound (R) (hereinafter, referred to as urethane (meth)acrylate resin).

又,本說明書中,(甲基)丙烯酸酯係指丙烯酸酯或甲基丙烯酸酯、(甲基)丙烯醯基係指丙烯醯基 或甲基丙烯醯基、(甲基)丙烯酸係指丙烯酸或甲基丙烯酸。 In addition, in this specification, (meth)acrylate means acrylate or methacrylate, and (meth)acryloyl means acryloyl Or methacrylic acid group, (meth)acrylic acid means acrylic acid or methacrylic acid.

化合物(R)之具體例方面,有2-異氰酸基乙基(甲基)丙烯酸酯、1,1-(雙丙烯醯基氧基甲基)乙基異氰酸酯、具有該異氰酸基的保護基之封端體甲基丙烯酸2-(0-[1’-甲基亞丙基胺基]羧基胺基)乙基酯、2-[(3,5-二甲基吡唑基)羰基胺基]乙基甲基丙烯酸酯等。此等化合物可單獨使用或2種以上併用。 Specific examples of the compound (R) include 2-isocyanatoethyl (meth)acrylate, 1,1-(bisacryloxymethyl)ethyl isocyanate, and those having the isocyanate group The blocking form of the protecting group 2-(0-[1'-methylpropyleneamino]carboxyamino)ethyl methacrylate, 2-[(3,5-dimethylpyrazolyl)carbonyl Amino] ethyl methacrylate and the like. These compounds can be used alone or in combination of two or more kinds.

含羥基之聚胺基甲酸酯樹脂與化合物(R)之反應為羥基與異氰酸基之反應、即胺基甲酸酯化反應,故可直接使用目前為止使用的溶劑,或可取代為其他溶劑進行反應。 The reaction between the hydroxyl-containing polyurethane resin and the compound (R) is the reaction between the hydroxyl group and the isocyanate group, that is, the urethane reaction, so the solvent used so far can be used directly, or it can be substituted with Other solvents perform the reaction.

又,因應必要以預先加入胺基甲酸酯化反應的促進觸媒為佳、若事前添加亦可將其直接使用。 Furthermore, if necessary, it is better to add a catalyst for promoting the urethane reaction in advance, and it can be used as it is if it is added beforehand.

又,因生成物中之化合物(R)之未反應分少者為佳,故以異氰酸基與羥基為等量或者羥基稍過量為佳。 In addition, since the unreacted component of the compound (R) in the product is better, the isocyanate group and the hydroxyl group are the same amount or the hydroxyl group is slightly excessive.

(UV硬化性樹脂組成物) (UV curable resin composition)

上述胺基甲酸酯(甲基)丙烯酸酯樹脂中,藉由加入光起始劑、與因應必要之具有其他自由基聚合性基之單體類、更佳為單官能及多官能丙烯酸酯,可得到UV硬化性樹脂組成物。該單體類之添加量,相對胺基甲酸酯(甲基)丙烯酸酯樹脂100質量份,為50~300質量份、較佳 為80~200質量份。又,作成無溶劑的UV硬化性樹脂組成物時,可添加其他在常溫為液體的(聚)丙烯酸酯化合物,使目前為止使用的溶劑餾去後,使化合物(R)進行反應。 In the above-mentioned urethane (meth)acrylate resin, by adding a photoinitiator, and if necessary, monomers having other radical polymerizable groups, more preferably monofunctional and polyfunctional acrylates, A UV curable resin composition can be obtained. The addition amount of the monomers is 50~300 parts by mass relative to 100 parts by mass of the urethane (meth)acrylate resin, preferably It is 80 to 200 parts by mass. In addition, when preparing a solvent-free UV curable resin composition, another (poly)acrylate compound that is liquid at room temperature may be added, and the solvent used so far may be distilled off, and the compound (R) may be reacted.

UV硬化性樹脂組成物所搭配的光起始劑的搭配量雖未特別限定,相對於胺基甲酸酯(甲基)丙烯酸酯樹脂(含有具有其他自由基聚合性基的單體類之場合,為胺基甲酸酯(甲基)丙烯酸酯樹脂與具有其他自由基聚合性基的單體類之總和)100質量份,為0.5~15質量份、較佳為1~10質量份者。比15質量份多則UV硬化後殘留大量的光起始劑、成為污染之原因。又,未達0.5質量份,則有無法以UV照射進行充分反應,硬化不足且黏著力未降低而產生黏著(Pick-up)問題等之虞。 Although the amount of the photoinitiator used in the UV curable resin composition is not particularly limited, it is relative to the case of a urethane (meth)acrylate resin (containing monomers with other radical polymerizable groups) , Is the sum of urethane (meth)acrylate resin and monomers having other radical polymerizable groups) 100 parts by mass, 0.5-15 parts by mass, preferably 1-10 parts by mass. If it is more than 15 parts by mass, a large amount of photoinitiator remains after UV curing, which causes contamination. In addition, if it is less than 0.5 parts by mass, it may not be able to react sufficiently by UV irradiation, the curing may be insufficient, and the adhesive force may not decrease, which may cause pick-up problems.

光起始劑方面,雖不特別限定,但由對紫外線之反應性高觀點,宜使用光自由基起始劑。光自由基起始劑,可舉例如苯乙酮、苯丙酮、二苯甲酮、呫噸酮、芴、苯甲醛、蒽醌、三苯基胺、咔唑、3-甲基苯乙酮、4-甲基苯乙酮、3-戊基苯乙酮、2,2-二乙氧基苯乙酮、4-甲氧基苯乙酮、3-溴苯乙酮、4-烯丙基苯乙酮、p-二乙醯基苯、3-甲氧基二苯甲酮、4-甲基二苯甲酮、4-氯二苯甲酮、4,4’-二甲氧基二苯甲酮、4-氯-4’-苄基二苯甲酮、3-氯呫噸酮、3,9-二氯呫噸酮、3-氯-8-壬基呫噸酮、安息香、安息香甲基醚、安息香丁基醚、雙(4-二甲基胺基苯基)酮、苄基甲氧基縮酮、2-氯硫基呫噸酮、2,2-二甲氧 基-1,2-二苯基乙烷-1-酮(IRGACURE(登錄商標)651、BASF Japan製)、1-羥基-環己基-苯基-酮(IRGACURE(登錄商標)184、BASF Japan製)、2-羥基-2-甲基-1-苯基-丙烷-1-酮(DAROCUR(登錄商標)1173、BASF Japan製)、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮(IRGACURE(登錄商標)2959、BASF Japan製)、2-甲基-1-[4-(甲基硫基)苯基]-2-嗎啉基丙烷-1-酮(IRGACURE(登錄商標)907、BASF Japan製)、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1(IRGACURE(登錄商標)369、BASF Japan製)、2-(4-甲基苄基)-2-二甲基胺基-1-(4-嗎啉-4-基-苯基)-丁烷-1-酮(IRGACURE(登錄商標)379、BASF Japan製)、二苯甲醯基等。 The photoinitiator is not particularly limited, but it is preferable to use a photoradical initiator from the viewpoint of high reactivity to ultraviolet rays. Examples of photo-radical initiators include acetophenone, phenylacetone, benzophenone, xanthone, fluorene, benzaldehyde, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, 4-methylacetophenone, 3-pentylacetophenone, 2,2-diethoxyacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylbenzene Ethyl ketone, p-diacetylbenzene, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4,4'-dimethoxybenzophenone Ketones, 4-chloro-4'-benzylbenzophenone, 3-chloroxanthone, 3,9-dichloroxanthone, 3-chloro-8-nonylxanthone, benzoin, benzoin methyl Ether, benzoin butyl ether, bis(4-dimethylaminophenyl) ketone, benzyl methoxy ketal, 2-chlorothioxanthone, 2,2-dimethoxy -1,2-Diphenylethane-1-one (IRGACURE (registered trademark) 651, manufactured by BASF Japan), 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE (registered trademark) 184, manufactured by BASF Japan ), 2-hydroxy-2-methyl-1-phenyl-propane-1-one (DAROCUR (registered trademark) 1173, made by BASF Japan), 1-[4-(2-hydroxyethoxy)-phenyl ]-2-Hydroxy-2-methyl-1-propane-1-one (IRGACURE (registered trademark) 2959, manufactured by BASF Japan), 2-methyl-1-[4-(methylthio)phenyl] -2-morpholinopropane-1-one (IRGACURE (registered trademark) 907, manufactured by BASF Japan), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanol Ketone-1 (IRGACURE (registered trademark) 369, manufactured by BASF Japan), 2-(4-methylbenzyl)-2-dimethylamino-1-(4-morpholin-4-yl-phenyl) -Butan-1-one (IRGACURE (registered trademark) 379, manufactured by BASF Japan), dibenzyl and the like.

此等中,以α-羥基酮化合物(例如安息香、安息香甲基醚、安息香丁基醚、1-羥基-環己基-苯基-酮等)、苯基酮衍生物(例如苯乙酮、苯丙酮、二苯甲酮、3-甲基苯乙酮、4-甲基苯乙酮、3-戊基苯乙酮、2,2-二乙氧基苯乙酮、4-甲氧基苯乙酮、3-溴苯乙酮、4-烯丙基苯乙酮、3-甲氧基二苯甲酮、4-甲基二苯甲酮、4-氯二苯甲酮、4,4’-二甲氧基二苯甲酮、4-氯-4’-苄基二苯甲酮、雙(4-二甲基胺基苯基)酮等)為佳。 Among these, α-hydroxy ketone compounds (such as benzoin, benzoin methyl ether, benzoin butyl ether, 1-hydroxy-cyclohexyl-phenyl-ketone, etc.), phenyl ketone derivatives (such as acetophenone, benzene Acetone, benzophenone, 3-methylacetophenone, 4-methylacetophenone, 3-pentylacetophenone, 2,2-diethoxyacetophenone, 4-methoxyacetophenone Ketone, 3-bromoacetophenone, 4-allylacetophenone, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4,4'- Dimethoxybenzophenone, 4-chloro-4'-benzylbenzophenone, bis(4-dimethylaminophenyl) ketone, etc.) are preferred.

進一步,作為可抑制硬化物表面之氧阻礙的起始劑種,可使用分子內具有2個以上光分解性基之光自由基起始劑或分子內具有3個以上芳香環之奪氫型光自由 基起始劑。作為分子內具有2個以上光分解性基之光自由基起始劑,可舉例如2-羥基-1-[4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基]-2-甲基-丙烷-1-酮(IRGACURE(登錄商標)127、BASF Japan製)、1-〔4-(4-苯甲醯基苯基硫)苯基〕-2-甲基-2-(4-甲基苯基磺醯基)丙烷-1-酮(商品名ESURE1001M)、甲基苯甲醯基甲酸酯(SPEEDCURE(登錄商標)MBF LAMBSON製)O-乙氧基亞胺基-1-苯基丙烷-1-酮(SPEEDCURE(登錄商標)PDO LAMBSON製)、寡[2-羥基-2-甲基-[4-(1-甲基乙烯基)苯基]丙酮(商品名ESCURE KIP150 LAMBERTI製)等。作為分子內具有3個以上芳香環之奪氫型光自由基起始劑,可舉例如1,2-辛烷二酮、1-[4-(苯基硫基)-,2-(O-苯甲醯基肟)]、乙酮,1-〔9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基〕-1-(0-乙醯基肟)、4-苯甲醯基-4’甲基二苯基硫化物、4-苯基二苯甲酮、4,4’,4”-(六甲基三胺基)三苯基甲烷等。 Furthermore, as a kind of initiator that can suppress oxygen inhibition on the surface of the hardened product, a photoradical initiator having 2 or more photodegradable groups in the molecule or a hydrogen abstraction type light having 3 or more aromatic rings in the molecule can be used. free Base initiator. As the photoradical initiator having two or more photodegradable groups in the molecule, for example, 2-hydroxy-1-[4-[4-(2-hydroxy-2-methyl-propanyl)-benzyl Yl)phenyl)-2-methyl-propan-1-one (IRGACURE (registered trademark) 127, manufactured by BASF Japan), 1-[4-(4-benzylphenylthio)phenyl]-2 -Methyl-2-(4-methylphenylsulfonyl)propan-1-one (trade name ESURE1001M), methylbenzyl formate (manufactured by SPEEDCURE (registered trademark) MBF LAMBSON) O-B Oxyimino-1-phenylpropan-1-one (manufactured by SPEEDCURE (registered trademark) PDO LAMBSON), oligo[2-hydroxy-2-methyl-[4-(1-methylvinyl)phenyl ] Acetone (trade name Escure KIP150 LAMBERTI), etc. Examples of hydrogen abstraction type photoradical initiators having 3 or more aromatic rings in the molecule include 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O- Benzoyl oxime)], ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]-1-(0-acetyl Oxime), 4-benzyl-4'methyldiphenyl sulfide, 4-phenylbenzophenone, 4,4',4"-(hexamethyltriamino)triphenylmethane, etc. .

又,亦可使用以深部硬化性改善為特徵之光自由基起始劑。以深部硬化性改善為特徵之光自由基起始劑方面,可舉例如2,4,6-三甲基苯甲醯基-二苯基-膦氧化物(DAROCUR(登錄商標)TPO、BASF Japan製)、雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物(IRGACURE(登錄商標)819、BASF Japan製)、雙(2,6-二甲基苯甲醯基)-2,4,4-三甲基-戊基膦氧化物等之醯基膦氧化物系光自由基起始劑。 In addition, photo-radical initiators characterized by improved deep-part hardenability can also be used. Examples of photo-radical initiators characterized by improved deep hardening properties include 2,4,6-trimethylbenzyl-diphenyl-phosphine oxide (DAROCUR (registered trademark) TPO, BASF Japan Made), bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide (IRGACURE (registered trademark) 819, BASF Japan make), bis(2,6-dimethylbenzyl) Yl)-2,4,4-trimethyl-pentylphosphine oxide and other phosphine oxide-based photo-radical initiators.

光自由基起始劑方面,在本發明之硬化性組成物的硬化性與儲藏安定性之平衡點,以1-羥基-環己基-苯基-酮(IRGACURE(登錄商標)184、BASF Japan製)、2-羥基-2-甲基-1-苯基-丙烷-1-酮(DAROCUR(登錄商標)1173、BASF Japan製)、雙(4-二甲基胺基苯基)酮、2-羥基-1-[4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基]-2-甲基-丙烷-1-酮(IRGACURE(登錄商標)127、BASF Japan製)、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1(IRGACURE(登錄商標)369、BASF Japan製)、2-(4-甲基苄基)-2-二甲基胺基-1-(4-嗎啉-4-基-苯基)-丁烷-1-酮(IRGACURE(登錄商標)379、BASF Japan製)、2,4,6-三甲基苯甲醯基-二苯基-膦氧化物(DAROCUR(登錄商標)TPO、BASF Japan製)、雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物(IRGACURE(登錄商標)819、BASF Japan製)、雙(2,6-二甲基苯甲醯基)-2,4,4-三甲基-戊基膦氧化物更佳。 Regarding the photo-radical initiator, the balance between the curability and storage stability of the curable composition of the present invention is based on 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE (registered trademark) 184, BASF Japan ), 2-hydroxy-2-methyl-1-phenyl-propane-1-one (DAROCUR (registered trademark) 1173, made by BASF Japan), bis(4-dimethylaminophenyl) ketone, 2- Hydroxy-1-[4-[4-(2-hydroxy-2-methyl-propanyl)-benzyl]phenyl]-2-methyl-propane-1-one (IRGACURE (registered trademark) 127, BASF Japan made), 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1 (IRGACURE (registered trademark) 369, BASF Japan made), 2-( 4-methylbenzyl)-2-dimethylamino-1-(4-morpholin-4-yl-phenyl)-butan-1-one (IRGACURE (registered trademark) 379, manufactured by BASF Japan) , 2,4,6-trimethylbenzyl-diphenyl-phosphine oxide (DAROCUR (registered trademark) TPO, made by BASF Japan), bis(2,4,6-trimethylbenzyl) )-Phenylphosphine oxide (IRGACURE (registered trademark) 819, made by BASF Japan), bis(2,6-dimethylbenzyl)-2,4,4-trimethyl-pentylphosphine oxide Better.

此等光自由基起始劑可單獨、或2種以上混合使用,亦可與其他化合物組合使用。 These photo-radical initiators can be used alone or in a mixture of two or more, and can also be used in combination with other compounds.

與其他化合物之組合,具體上可舉例如與4,4’-雙(二甲基胺基)二苯甲酮、4,4’-雙(二乙基胺基)二苯甲酮、二乙醇甲基胺、二甲基乙醇胺、三乙醇胺、乙基-4-二甲基胺基苯甲酸酯、2-乙基己基-4-二甲基胺基苯甲酸酯等之胺的組合、進而組合其與二苯基碘鎓氯化物等之碘鎓鹽者、與亞甲基藍等之色素及胺組合者等。 In combination with other compounds, specific examples include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, diethanol Combinations of amines such as methylamine, dimethylethanolamine, triethanolamine, ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4-dimethylaminobenzoate, etc., Furthermore, it is combined with iodonium salts such as diphenyl iodonium chloride, and those combined with dyes and amines such as methylene blue.

又,使用前述光自由基起始劑時,因應必要,亦可添加對苯二酚、對苯二酚單甲基醚、苯醌、對叔丁基鄰苯二酚等之聚合禁止劑類。 In addition, when using the aforementioned photoradical initiator, polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, benzoquinone, and p-tert-butylcatechol may be added as necessary.

又,於UV硬化性樹脂組成物亦可搭配光增感劑。光增感劑方面,可舉例如三乙基胺、三-n-丁基膦等。 In addition, a photosensitizer can also be combined with the UV curable resin composition. As for the photosensitizer, for example, triethylamine, tri-n-butylphosphine and the like can be mentioned.

又,可於UV硬化性樹脂組成物中混合熱硬化起始劑。熱硬化起始劑,可使用偶氮系、過氧化物系等之以往習知者。 In addition, a thermosetting initiator may be mixed with the UV curable resin composition. As the thermosetting initiator, conventionally known ones such as azo-based and peroxide-based can be used.

又,以UV進行樹脂層之聚合時,一般適量添加光聚合起始劑,且可因應必要適量添加光增感劑。該光聚合起始劑方面,可舉例如苯乙酮、二苯甲酮、安息香、苯甲醯基苯甲酸酯、硫雜蒽酮類等。光增感劑方面,可舉例如三乙基胺、三-n-丁基膦等。 In addition, when the resin layer is polymerized by UV, a photopolymerization initiator is generally added in an appropriate amount, and a photosensitizer can be added in an appropriate amount as necessary. Examples of the photopolymerization initiator include acetophenone, benzophenone, benzoin, benzoyl benzoate, and thioxanthones. As for the photosensitizer, for example, triethylamine, tri-n-butylphosphine and the like can be mentioned.

UV硬化性樹脂組成物的黏度或印刷性調整可使用的溶劑雖因印刷樣式而異,但為與化合物(R)之反應性低者則不特別限定,以不含胺等之鹼性官能基,且沸點為50℃以上、較佳為110℃以上之溶劑為佳。如此之溶劑,可舉例如甲苯、二甲苯、乙基苯、硝基苯、環己烷、異佛爾酮、二乙二醇二甲基醚、乙二醇二乙基醚、乙二醇單甲基醚單乙酸酯、丙二醇單甲基醚單乙酸酯、丙二醇單乙基醚單乙酸酯、二丙二醇單甲基醚單乙酸酯、二乙二醇單乙基醚單乙酸酯、甲氧基丙酸甲基酯、甲氧基丙酸乙基酯、乙氧基丙酸甲基酯、乙氧基丙酸乙基酯、乙酸乙基 酯、乙酸n-丁基酯、乙酸異戊基酯、乳酸乙基酯、丙酮、甲基乙基酮、環己酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、γ-丁內酯、二甲基亞碸及氯仿等。 Solvents that can be used to adjust the viscosity or printability of the UV curable resin composition vary depending on the printing style, but are not particularly limited if they have low reactivity with the compound (R), and do not contain basic functional groups such as amines. , And a solvent with a boiling point above 50°C, preferably above 110°C is preferred. Such solvents include, for example, toluene, xylene, ethylbenzene, nitrobenzene, cyclohexane, isophorone, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol mono Methyl ether monoacetate, propylene glycol monomethyl ether monoacetate, propylene glycol monoethyl ether monoacetate, dipropylene glycol monomethyl ether monoacetate, diethylene glycol monoethyl ether monoacetic acid Ester, methyl methoxypropionate, ethyl methoxypropionate, methyl ethoxypropionate, ethyl ethoxypropionate, ethyl acetate Ester, n-butyl acetate, isoamyl acetate, ethyl lactate, acetone, methyl ethyl ketone, cyclohexanone, N,N-dimethylformamide, N,N-dimethyl Acetamide, N-methylpyrrolidone, γ-butyrolactone, dimethyl sulfoxide and chloroform, etc.

以黏度降低所致之作業性的提高、成形體物性之改良等為目的,於UV硬化性樹脂組成物亦可併用具有其他自由基聚合性基的單體類。 For the purpose of improving the workability due to the decrease in viscosity and improving the physical properties of the molded body, the UV curable resin composition can also be used in combination with monomers having other radical polymerizable groups.

前述自由基聚合性基方面,可舉例如(甲基)丙烯醯基、乙烯基等。其中以具有與本發明使用之紫外線交聯性基同樣之(甲基)丙烯醯基者為佳。 With respect to the aforementioned radically polymerizable group, for example, a (meth)acryloyl group and a vinyl group can be mentioned. Among them, those having the same (meth)acrylic acid group as the ultraviolet crosslinkable group used in the present invention are preferred.

前述單體的具體例方面,可舉例如(甲基)丙烯酸酯系單體、苯乙烯系單體、(甲基)丙烯腈、乙烯基酯系單體、N-乙烯基吡咯啶酮、(甲基)丙烯醯胺系單體、共軛二烯系單體、乙烯基酮系單體、鹵素化乙烯基.鹵素化亞乙烯基系單體、(甲基)烯丙基酯系單體、多官能單體等。(甲基)烯丙基係指烯丙基或甲基烯丙基。 Specific examples of the aforementioned monomers include (meth)acrylate-based monomers, styrene-based monomers, (meth)acrylonitrile, vinyl ester-based monomers, N-vinylpyrrolidone, ( Meth)acrylamide monomers, conjugated diene monomers, vinyl ketone monomers, halogenated vinyl groups. Halogenated vinylidene monomers, (meth)allyl ester monomers, polyfunctional monomers, etc. (Meth)allyl means allyl or methallyl.

(甲基)丙烯酸酯系單體方面,可舉例如(甲基)丙烯酸甲基酯、(甲基)丙烯酸乙基酯、(甲基)丙烯酸n-丙基酯、(甲基)丙烯酸異丙基酯、(甲基)丙烯酸n-丁基酯、(甲基)丙烯酸異丁基酯、(甲基)丙烯酸tert-丁基酯、(甲基)丙烯酸n-戊基酯、(甲基)丙烯酸n-己基酯、(甲基)丙烯酸環己基酯、(甲基)丙烯酸n-庚基酯、(甲基)丙烯酸n-辛基酯、(甲基)丙烯酸異辛基酯、(甲基)丙烯酸2-乙基己基 酯、(甲基)丙烯酸壬基酯、(甲基)丙烯酸異壬基酯、(甲基)丙烯酸癸基酯、(甲基)丙烯酸異癸基、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸月桂基酯、(甲基)丙烯酸硬脂醯基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸苯基酯、(甲基)丙烯酸甲苯基、(甲基)丙烯酸苄基酯、(甲基)丙烯酸2-甲氧基乙基酯、(甲基)丙烯酸3-甲氧基丁基酯、(甲基)丙烯酸2-羥基乙基酯、(甲基)丙烯酸2-羥基丙基酯、(甲基)丙烯酸硬脂醯基酯、(甲基)丙烯酸縮水甘油基酯、(甲基)丙烯酸2-胺基乙基酯、γ-(甲基丙烯醯氧基丙基)三甲氧基矽烷、(甲基)丙烯酸的環氧乙烷加成物、(甲基)丙烯酸三氟甲基甲基酯、(甲基)丙烯酸2-三氟甲基乙基酯、(甲基)丙烯酸2-全氟乙基乙基酯、(甲基)丙烯酸2-全氟乙基-2-全氟丁基乙基酯、(甲基)丙烯酸2-全氟乙基酯、(甲基)丙烯酸全氟甲基酯、(甲基)丙烯酸二全氟甲基甲基酯、(甲基)丙烯酸2-全氟甲基-2-全氟乙基乙基酯、(甲基)丙烯酸2-全氟己基乙基酯、(甲基)丙烯酸2-全氟癸基乙基酯、(甲基)丙烯酸2-全氟十六基乙基酯等。 In terms of (meth)acrylate monomers, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate Base ester, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, (meth) N-hexyl acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, (meth) )2-ethylhexyl acrylate Ester, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, Lauryl (meth)acrylate, stearyl (meth)acrylate, tridecyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, (meth)acrylate Base) benzyl acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (methyl) ) 2-hydroxypropyl acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-aminoethyl (meth)acrylate, γ-(methacrylic acid) (Oxypropyl) trimethoxysilane, (meth)acrylic acid ethylene oxide adduct, (meth)acrylic acid trifluoromethyl methyl ester, (meth)acrylic acid 2-trifluoromethyl ethyl Ester, 2-perfluoroethyl ethyl (meth)acrylate, 2-perfluoroethyl-2-perfluorobutyl ethyl (meth)acrylate, 2-perfluoroethyl (meth)acrylate Ester, perfluoromethyl (meth)acrylate, diperfluoromethyl methyl (meth)acrylate, 2-perfluoromethyl-2-perfluoroethyl ethyl (meth)acrylate, ( 2-perfluorohexylethyl meth)acrylate, 2-perfluorodecylethyl (meth)acrylate, 2-perfluorohexadecylethyl (meth)acrylate, etc.

苯乙烯系單體方面,可舉例如苯乙烯、α-甲基苯乙烯等。 As for the styrene-based monomer, for example, styrene, α-methylstyrene, and the like can be mentioned.

乙烯基酯系單體方面,可舉例如乙酸乙烯基酯、丙酸乙烯基酯、酪酸乙烯基酯等。 Examples of vinyl ester monomers include vinyl acetate, vinyl propionate, and vinyl butyrate.

(甲基)丙烯醯胺系單體方面,可舉例如 (甲基)丙烯醯胺、N,N-二甲基丙烯醯胺等。 For (meth)acrylamide-based monomers, for example (Meth)acrylamide, N,N-dimethylacrylamide, etc.

共軛二烯系單體方面,可舉例如丁二烯、異戊二烯等。乙烯基酮系單體方面,可舉例如甲基乙烯基酮等。 With regard to conjugated diene-based monomers, for example, butadiene, isoprene, etc. may be mentioned. With regard to vinyl ketone monomers, for example, methyl vinyl ketone and the like can be mentioned.

鹵素化乙烯.偏鹵素乙烯系單體方面,可舉例如氯乙烯、溴乙烯、碘乙烯、偏氯乙烯、偏溴乙烯等。 Halogenated ethylene. The vinylidene halide monomers include, for example, vinyl chloride, vinyl bromide, vinyl iodide, vinylidene chloride, and vinylidene bromide.

多官能單體方面,可舉例如三羥甲基丙烷三丙烯酸酯、新戊基二醇聚丙氧基二丙烯酸酯、新戊基二醇二丙烯酸酯、三羥甲基丙烷聚乙氧基三丙烯酸酯、雙酚F聚乙氧基二丙烯酸酯、雙酚A聚乙氧基二丙烯酸酯、二季戊四醇聚己內酯六丙烯酸酯、參(羥基乙基)異氰尿酸酯聚己內酯三丙烯酸酯、三環癸烷二羥甲基二丙烯酸酯2-(2-丙烯醯基氧基-1,1-二甲基)-5-乙基-5-丙烯醯基氧基甲基-1,3-二噁烷、四溴雙酚A二乙氧基二丙烯酸酯、4,4-二巰基二苯基硫化物二甲基丙烯酸酯、聚四乙二醇二丙烯酸酯、1,9-壬烷二醇二丙烯酸酯、1,6-己烷二丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、二三羥甲基丙烷四丙烯酸酯、四羥甲基甲烷四丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇單羥基五丙烯酸酯、二季戊四醇六丙烯酸酯、1,4-丁二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、市售的寡酯丙烯酸酯或芳香族系、脂肪族系等之胺基甲酸酯丙烯酸酯(寡聚物)等。 In terms of multifunctional monomers, for example, trimethylolpropane triacrylate, neopentyl glycol polypropoxy diacrylate, neopentyl glycol diacrylate, trimethylol propane polyethoxy triacrylate Ester, bisphenol F polyethoxy diacrylate, bisphenol A polyethoxy diacrylate, dipentaerythritol polycaprolactone hexaacrylate, ginseng (hydroxyethyl) isocyanurate polycaprolactone three Acrylate, tricyclodecane dimethylol diacrylate 2-(2-propenyloxy-1,1-dimethyl)-5-ethyl-5-propenyloxymethyl-1 ,3-Dioxane, tetrabromobisphenol A diethoxy diacrylate, 4,4-dimercapto diphenyl sulfide dimethacrylate, polyethylene glycol diacrylate, 1,9- Nonanediol diacrylate, 1,6-hexane diacrylate, dimethylol tricyclodecane diacrylate, ditrimethylolpropane tetraacrylate, tetramethylolmethane tetraacrylate, pentaerythritol Triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxy pentaacrylate, dipentaerythritol hexaacrylate, 1,4-butanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate or Aromatic and aliphatic urethane acrylate (oligomer), etc.

亦可使用令環氧樹脂與(甲基)丙烯酸反應的所謂環氧基(甲基)丙烯酸酯樹脂。 It is also possible to use a so-called epoxy (meth)acrylate resin in which an epoxy resin and (meth)acrylic acid are reacted.

(保護膜油墨(保護膜用組成物)) (Protective film ink (composition for protective film))

將上述胺基甲酸酯(甲基)丙烯酸酯樹脂或上述UV硬化性樹脂組成物溶於適當的溶劑,並因應必要搭配其他(聚)(甲基)丙烯酸酯化合物與光或熱硬化劑與印刷或塗佈用的添加材,作成保護膜油墨(保護膜用組成物)。 Dissolve the above-mentioned urethane (meth)acrylate resin or the above-mentioned UV curable resin composition in an appropriate solvent, and mix with other (poly)(meth)acrylate compounds and light or thermal hardeners as necessary. Additives for printing or coating to make protective film ink (composition for protective film).

保護膜油墨可使用的溶劑,可直接使用上述含羥基之聚胺基甲酸酯樹脂的合成中使用的溶劑,或亦可添加調整黏度或印刷性用之其他溶劑。又,亦可使用其他溶劑。使用其他溶劑時,可於添加新溶劑前後將反應溶劑餾去,進行溶劑取代。但,考量操作繁雜性或能源成本,以直接使用含羥基之聚胺基甲酸酯樹脂的合成所使用的溶劑為佳。 The solvent that can be used in the protective film ink can be the solvent used in the synthesis of the above-mentioned hydroxyl-containing polyurethane resin, or other solvents for adjusting the viscosity or printability can also be added. In addition, other solvents can also be used. When other solvents are used, the reaction solvent can be distilled off before and after adding a new solvent to replace the solvent. However, considering the complexity of the operation or the energy cost, it is better to directly use the solvent used in the synthesis of the hydroxyl-containing polyurethane resin.

保護膜油墨中之固體成分濃度因期望膜厚或印刷方法而異,以20~90質量%為佳、30質量%~80質量%更佳。 The solid content concentration in the protective film ink differs depending on the desired film thickness or printing method, but 20 to 90% by mass is preferable, and 30 to 80% by mass is more preferable.

以上述胺基甲酸酯(甲基)丙烯酸酯樹脂或UV硬化性樹脂組成物調合的保護膜油墨,藉由網版印刷法、凹板印刷法、噴墨法等之印刷法,於有導電圖型的基材上形成印刷圖型,並使該印刷圖型在因應必要餾去溶劑後,進行加熱處理、光照射或微波加熱,使其硬化而作成導電圖型的保護膜。 The protective film ink blended with the above-mentioned urethane (meth)acrylate resin or UV curable resin composition is electrically conductive by printing methods such as screen printing, gravure printing, and inkjet printing. A printed pattern is formed on the patterned base material, and the printed pattern is subjected to heat treatment, light irradiation or microwave heating after the solvent is distilled off as necessary to harden it to form a conductive pattern protective film.

上述有導電圖型的基材,可舉例如聚醯亞胺薄膜、聚酯薄膜、ZEONOR(登錄商標)薄膜、聚碳酸酯 薄膜。 The above-mentioned conductive patterned substrates include, for example, polyimide film, polyester film, ZEONOR (registered trademark) film, polycarbonate film.

導電圖型方面,為將銀或銅等之金屬及/或金屬氧化物的粒子、奈米線、奈米管等油墨化,於基材上形成印刷圖型,將該印刷圖型導體化者。尤其使用銀奈米粒子油墨或銀奈米線油墨來製作透明導電圖型時,銀每單位質量之表面積大、微細配線等在高溫高溼時之絕緣信賴性低,故可以上述實施形態之保護膜樹脂有效保護。 In terms of conductive pattern, it is used to form a printed pattern on a substrate by converting silver or copper and other metals and/or metal oxide particles, nanowires, nanotubes, etc. into ink, and then making the printed pattern conductive . Especially when silver nanoparticle ink or silver nanowire ink is used to make transparent conductive patterns, the surface area per unit mass of silver is large, and the insulation reliability of fine wiring at high temperature and high humidity is low, so it can be protected by the above embodiment The membrane resin effectively protects.

[實施例] [Example]

以下、說明本發明之實施例,此等實施例僅為說明本發明之較佳例示,並不限制本發明。 Hereinafter, embodiments of the present invention will be described. These embodiments are only preferred examples for describing the present invention and do not limit the present invention.

又,羥基價測定如以下進行。 In addition, the hydroxyl value measurement is performed as follows.

於200ml茄型燒瓶以精密天秤進行精秤試料約2.0g程度,於其中使用移液器加入乙醯基化試藥5ml。以裝設有戴氏冷卻管在調節為95℃~100℃的油浴進行1小時加熱。放冷後使用純水1ml,使液體接觸燒瓶壁面進行清洗,並將燒瓶充分震動,再以戴氏冷卻管在調節為5℃~100℃的油浴進行10分鐘加熱。放冷後、以乙醇5ml清洗燒瓶壁。加入酚酞溶液數滴作為指示劑,以0.5mol/L氫氧化鉀乙醇溶液進行滴定,以指示劑的淡紅色持續約30秒鐘時作為終點。又,以不加入試料進行上述試驗作為空白試驗。由結果使用下述計算式得到的值為樹脂的羥基價。 In a 200ml eggplant type flask, a precision balance is used to accurately weigh about 2.0g of the sample, and 5ml of the acetylated reagent is added to it using a pipette. It is heated for 1 hour in an oil bath adjusted to 95°C~100°C with Dai's cooling tube. After leaving to cool, use 1ml of pure water to make the liquid contact the wall of the flask for cleaning, shake the flask sufficiently, and then heat it for 10 minutes in an oil bath adjusted to 5°C~100°C with a Dai's cooling tube. After allowing to cool, wash the walls of the flask with 5 ml of ethanol. Add a few drops of phenolphthalein solution as an indicator, titrate with 0.5mol/L potassium hydroxide ethanol solution, and take the light red of the indicator lasting for about 30 seconds as the end point. In addition, the above test was performed without adding a sample as a blank test. The value obtained from the result using the following calculation formula is the hydroxyl value of the resin.

羥基價(mg-KOH/g)=[(B-C)×f×28.05]/S+D Hydroxyl value (mg-KOH/g)=[(B-C)×f×28.05]/S+D

B:空白試驗使用的0.5mol/L氫氧化鉀-乙醇溶液的量(ml) B: The amount of 0.5mol/L potassium hydroxide-ethanol solution used in the blank test (ml)

C:滴定使用的0.5mol/L氫氧化鉀-乙醇溶液的量(ml) C: The amount of 0.5mol/L potassium hydroxide-ethanol solution used in titration (ml)

f:0.5mol/L氫氧化鉀-乙醇溶液的因子 f: Factor of 0.5mol/L potassium hydroxide-ethanol solution

S:試料的採取量(g) S: The amount of sample taken (g)

D:酸價 D: acid value

又,乙醯基化試藥係使用將無水乙酸25g加入100ml的褐色量瓶,並加入吡啶而成為100ml者。 In addition, the acetylation reagent system used a brown measuring flask in which 25 g of anhydrous acetic acid was added to a 100 ml, and pyridine was added to obtain 100 ml.

.具有羧基的聚胺基甲酸酯骨架(A)之合成例 . Synthesis example of polyurethane skeleton (A) with carboxyl group [合成例1] [Synthesis Example 1]

於具備攪拌裝置、溫度計、電容器的2L三口燒瓶中,添加作為多元醇化合物的C-1015N(股份公司Kuraray製、聚碳酸酯二醇、原料二醇莫耳比:1,9-壬烷二醇/2-甲基-1,8-辛烷二醇=15/85、分子量964)211g、作為具有羧基的二羥基化合物的2,2-二羥甲基丁烷酸(日本化成股份公司製)40.0g、及作為溶劑的γ-丁內酯(三菱化學股份公司製)379g,在90℃將前述2,2-二羥甲基丁烷酸溶解。 In a 2L three-necked flask equipped with a stirring device, a thermometer, and a capacitor, add C-1015N (manufactured by Kuraray Co., Ltd., polycarbonate diol, raw material diol: 1,9-nonane diol) as a polyol compound /2-Methyl-1,8-octanediol = 15/85, molecular weight 964) 211 g, 2,2-dimethylolbutanoic acid (manufactured by Nippon Kasei Co., Ltd.) as a dihydroxy compound having a carboxyl group 40.0 g and 379 g of γ-butyrolactone (manufactured by Mitsubishi Chemical Corporation) as a solvent, and the aforementioned 2,2-dimethylolbutanoic acid was dissolved at 90°C.

反應液的溫度降至70℃,以滴下漏斗將作為聚異氰酸酯化合物的Desmodur(登錄商標)-W(伸甲基雙(4-環己基異氰酸酯)、住化拜耳聚氨酯股份公司製)128g花費30分鐘滴下。滴下完畢後、進行80℃、1小 時、接著100℃、1小時、接著120℃、2小時反應,異氰酸酯幾乎消失一事以IR確認後,再於120℃進行1.5小時反應。得到的含羧基之聚胺基甲酸酯的數平均分子量為34100、其固體成分之酸價為40.2mg-KOH/g。 The temperature of the reaction solution was lowered to 70°C, and 128 g of Desmodur (registered trademark)-W (Methylene bis(4-cyclohexyl isocyanate), manufactured by Sumika Bayer Polyurethane Co., Ltd.), which is a polyisocyanate compound, was poured in a dropping funnel for 30 minutes dropping. After dripping, proceed to 80℃ for 1 hour When the reaction was performed at 100°C for 1 hour, and then at 120°C for 2 hours, it was confirmed by IR that the isocyanate had almost disappeared, and then the reaction was carried out at 120°C for 1.5 hours. The number average molecular weight of the obtained carboxyl group-containing polyurethane was 34,100, and the acid value of its solid content was 40.2 mg-KOH/g.

<生成物的鑑定> <Identification of products>

於甲醇10g中滴下上述合成後的反應液1g,靜置後以傾析槽除去上清液。再度重複3次添加甲醇10g並靜置.除去上清液,最後將剩下部分減壓濃縮,得到固形狀的樹脂。得到的樹脂的鑑定使用1H-NMR測定(JEOL製JNM-EX270、溶於氘代氯仿進行測定)、IR測定(Nicolet6700、塗佈於AgCl板進行測定)實施,得到的樹脂確認為含有羧基的聚胺基甲酸酯骨架(A)。 1 g of the reaction liquid after the above synthesis was dropped into 10 g of methanol, and after standing still, the supernatant was removed in a decantation tank. Repeat 3 times to add 10g of methanol and let it stand. The supernatant is removed, and finally the remaining part is concentrated under reduced pressure to obtain a solid resin. The identification of the obtained resin was carried out using 1 H-NMR measurement (JNM-EX270 manufactured by JEOL, dissolved in deuterated chloroform for measurement) and IR measurement (Nicolet 6700, coated on AgCl plate for measurement), and the obtained resin was confirmed to contain carboxyl groups Polyurethane skeleton (A).

[合成例2] [Synthesis Example 2]

使用與合成例1同樣的裝置,使用作為多元醇化合物的GI-1000(日本曹達股份公司製、氫化兩末端羥基化聚丁二烯(1,2-骨架90%)、分子量1729)212g、作為具有羧基的二羥基化合物的2,2-二羥甲基丁烷酸(日本化成股份公司製)63.3g、作為溶劑的二乙二醇單乙基醚乙酸酯(股份公司Daicel製)398g、及作為聚異氰酸酯化合物的Desmodur(登錄商標)-I(異佛爾酮二異氰酸酯)、住化拜耳聚氨酯股份公司製)122g,與合成例1同樣地進行反應。得到的含羧基之聚胺基甲酸酯的數平均分子量為 10600、其固體成分之酸價為59.8mg-KOH/g。 Using the same apparatus as in Synthesis Example 1, 212 g of GI-1000 (manufactured by Soda Co., Ltd., hydrogenated two-terminal hydroxylated polybutadiene (1,2-skeleton 90%), molecular weight 1729) as a polyol compound was used as 63.3 g of 2,2-dimethylolbutanoic acid (manufactured by Nippon Kasei Co., Ltd.) of a dihydroxy compound having a carboxyl group, 398 g of diethylene glycol monoethyl ether acetate (manufactured by Daicel Co., Ltd.) as a solvent, And 122 g of Desmodur (registered trademark)-I (isophorone diisocyanate), manufactured by Sumika Bayer Polyurethane Co., Ltd., which is a polyisocyanate compound, was reacted in the same manner as in Synthesis Example 1. The number average molecular weight of the obtained carboxyl-containing polyurethane is 10600. The acid value of its solid content is 59.8mg-KOH/g.

[合成例3] [Synthesis Example 3]

使用與合成例1同樣的裝置,作為多元醇化合物的分子量1000的PTXG-1000(1,4-丁二醇-新戊基二醇的聚醚共聚合物(旭化成纖維股份公司製)117g、作為具有羧基的二羥基化合物的2,2-二羥甲基丁烷酸(日本化成股份公司製)64.1g、作為溶劑的二乙二醇單乙基醚單乙酸酯(股份公司Daicel製)304g、及作為聚異氰酸酯化合物的Dcsmodur(登錄商標)-I(異佛爾酮二異氰酸酯、住化拜耳聚氨酯股份公司製)122g,與合成例1同樣地進行反應。得到的含羧基之聚胺基甲酸酯的數平均分子量為6120、其固體成分之酸價為79.8mg-KOH/g。 Using the same device as in Synthesis Example 1, 117 g of PTXG-1000 (1,4-butanediol-neopentyl glycol polyether copolymer (manufactured by Asahi Kasei Fiber Co., Ltd.) as a polyol compound with a molecular weight of 1000 was used as 64.1 g of 2,2-dimethylolbutanoic acid (manufactured by Nippon Kasei Co., Ltd.) of a dihydroxy compound having a carboxyl group, 304 g of diethylene glycol monoethyl ether monoacetate (manufactured by Daicel Co., Ltd.) as a solvent And 122 g of Dcsmodur (registered trademark)-I (isophorone diisocyanate, manufactured by Sumika Bayer Polyurethane Co., Ltd.) as a polyisocyanate compound, and reacted in the same manner as in Synthesis Example 1. The obtained carboxyl-containing polyurethane The number average molecular weight of the acid ester is 6120, and the acid value of its solid content is 79.8 mg-KOH/g.

[合成例4] [Synthesis Example 4]

使用與合成例1同樣的裝置,使用作為多元醇化合物的Kuraray多元醇C-1090(股份公司Kuraray製、聚碳酸酯二醇、原料二醇莫耳比:3-甲基-1,5-戊烷二醇+1,6-己二醇原料90:10、分子量992)206g、作為具有羧基的二羥基化合物的2,2-二羥甲基丁烷酸(日本化成股份公司製)63.4g、作為溶劑的二乙二醇單乙基醚乙酸酯(股份公司Daiccl製)400g、及作為聚異氰酸酯化合物的NBDI(降冰片烷二異氰酸酯、Mitsui Chemicals,Fine Co.,Ltd.製)131g,與合成例1同樣地進行反應。得到的含羧基之聚胺 基甲酸酯的數平均分子量為6570、其固體成分之酸價為60.6mg-KOH/g。 The same device as in Synthesis Example 1 was used, and Kuraray polyol C-1090 (manufactured by Kuraray Co., Ltd., polycarbonate diol, raw material diol molar ratio: 3-methyl-1,5-pentane) was used as a polyol compound Alkanediol+1,6-hexanediol raw material 90:10, molecular weight 992) 206g, 2,2-dimethylolbutanoic acid (manufactured by Nippon Kasei Co., Ltd.) 63.4g as a dihydroxy compound having a carboxyl group, 400 g of diethylene glycol monoethyl ether acetate (manufactured by Daiccl Co., Ltd.) as a solvent and 131 g of NBDI (norbornane diisocyanate, manufactured by Mitsui Chemicals, Fine Co., Ltd.) as a polyisocyanate compound, and In Synthesis Example 1, the reaction was carried out in the same manner. Carboxyl-containing polyamine The number average molecular weight of the carbamate is 6570, and the acid value of its solid content is 60.6 mg-KOH/g.

.具備具有羧基的聚胺基甲酸酯骨架(A)、與含有鍵結於前述羧基的至少一部份的烯基氧化物開環加成部(b1)或環烯基氧化物開環加成部(b2)之脂肪族氧化物開環加成部(B)的含羥基之聚胺基甲酸酯樹脂的合成例 . Possess a polyurethane skeleton (A) having a carboxyl group, and an alkenyl oxide ring-opening addition portion (b1) or cycloalkenyl oxide that contains at least a part of the aforementioned carboxyl group. Synthesis example of hydroxyl-containing polyurethane resin of part (b2) of aliphatic oxide ring-opening addition part (B)

[合成例5] [Synthesis Example 5]

將合成例1所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價40.2mg-KOH/g)100g移至300ml的高壓滅菌鍋,氮氣體取代後,在氮氣體壓0.5MPa下升溫至80℃,將環氧乙烷(三菱化學股份公司製)4.73g透過質量流量控制器導入高壓滅菌鍋,升溫至120℃進行6小時反應。環氧乙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為3。得到的樹脂組成物(以下、稱樹脂組成物1)之固體成分的數平均分子量為22700、酸價為0.2mg-KOH/g、羥基價為37.1mg-KOH/g、固體成分濃度為52質量%。 Transfer 100 g of the solution (solid content 50% by mass, acid value 40.2 mg-KOH/g) of the polyurethane skeleton (A) having carboxyl groups obtained in Synthesis Example 1 to a 300 ml autoclave, nitrogen gas After replacement, the temperature was raised to 80°C under a nitrogen gas pressure of 0.5 MPa, 4.73 g of ethylene oxide (manufactured by Mitsubishi Chemical Corporation) was introduced into the autoclave through a mass flow controller, and the temperature was raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of ethylene oxide (epoxy) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 3. The obtained resin composition (hereinafter referred to as resin composition 1) has a number average molecular weight of 22700, an acid value of 0.2 mg-KOH/g, a hydroxyl value of 37.1 mg-KOH/g, and a solid content concentration of 52 mass. %.

<生成物的鑑定> <Identification of products>

於甲醇10g中滴下上述合成後的反應液1g,靜置後除去上清液。再度重複3次添加甲醇、靜置.上清液除 去,最後將剩下部分減壓濃縮,得到液狀的樹脂。得到的樹脂的鑑定使用1H-NMR測定、IR測定實施,NMR測定中之2.4ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認得到的樹脂為環氧乙烷接枝的聚胺基甲酸酯樹脂。又,確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧乙烷(式(b1)中之n1)之平均值為2.5。圖1、2各自為合成例5所得到之樹脂組成物1的1H-NMR頻譜、IR頻譜。 1 g of the reaction solution after the above synthesis was dropped into 10 g of methanol, and after standing still, the supernatant was removed. Repeat 3 times to add methanol and let stand. The supernatant was removed, and finally the remaining part was concentrated under reduced pressure to obtain a liquid resin. The identification of the obtained resin was carried out using 1 H-NMR measurement and IR measurement. In the NMR measurement, the proton peak of epoxy ring opening was confirmed near 2.4 ppm, and the peak of CH-OH stretching near 1040 cm -1 was confirmed by IR measurement. The increase in the strength and the peak strength of the OH stretching vibration near 3300 cm -1 confirmed that the obtained resin is a polyurethane resin grafted with ethylene oxide. Also, confirm that the ethylene oxide reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm in the NMR measurement and the proton ratio of 2.5 ppm to 5.0 ppm (in formula (b1) The average value of n 1 ) is 2.5. FIGS. 1 and 2 are the 1 H-NMR spectrum and IR spectrum of the resin composition 1 obtained in Synthesis Example 5, respectively.

[合成例6] [Synthesis Example 6]

將合成例1所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價40.2mg-KOH/g)100g移至300ml的高壓滅菌鍋,進行氮氣體取代後,將環氧丙烷(購自東京化成股份公司)8.32g以幫浦導入高壓滅菌鍋,以氮氣體壓0.5MPa,升溫至120℃進行6小時反應。環氧丙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為4。得到的樹脂組成物(以下、稱樹脂組成物2)之固體成分的數平均分子量為28000、酸價幾乎為零,羥基價為38.4mg-KOH/g、固體成分濃度為54質量%。 Transfer 100 g of the solution (solid content 50% by mass, acid value 40.2 mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 1 to a 300 ml autoclave, and perform nitrogen After the gas substitution, 8.32 g of propylene oxide (purchased from Tokyo Chemical Industry Co., Ltd.) was pumped into the autoclave, and the pressure was 0.5 MPa with nitrogen gas, and the temperature was raised to 120° C. for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of propylene oxide (epoxy group) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 4. The obtained resin composition (hereinafter, referred to as resin composition 2) had a number average molecular weight of solid content of 28,000, an acid value of almost zero, a hydroxyl value of 38.4 mg-KOH/g, and a solid content concentration of 54% by mass.

<生成物的鑑定> <Identification of products>

將與合成例5同樣地精製得到的固形狀的樹脂的鑑定以1H-NMR測定、IR測定實施,NMR測定中之2.4ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為環氧丙烷接枝的聚胺基甲酸酯樹脂。確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧丙烷(式(b1)中之n1)之平均值為1.6。 The identification of the solid resin obtained in the same manner as in Synthesis Example 5 was carried out by 1 H-NMR measurement and IR measurement. In the NMR measurement, the proton peak of epoxy ring opening was confirmed near 2.4 ppm. 1040cm -1 peak intensity increases the peak intensity of the CH-OH stretching and close to the OH stretching vibration near 3300cm -1, confirming propylene oxide-grafted polyurethane resin. Confirm that the propylene oxide reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm and the proton ratio of 2.5 ppm to 5.0 ppm in the NMR measurement (n 1 in formula (b1) The average value of) is 1.6.

[合成例7] [Synthesis Example 7]

將合成例2所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價59.8mg-KOH/g)100g移至300ml的高壓滅菌鍋,進行氮氣體取代後,以氮氣體壓0.5MPa升溫至80℃,將環氧乙烷9.52g透過質量流量控制器導入高壓滅菌鍋,升溫至120℃進行6小時反應。環氧乙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為4。得到的樹脂組成物(以下、稱樹脂組成物3)之固體成分的數平均分子量為11400、酸價為0.2mg-KOH/g、羥基價為57.2mg-KOH/g、固體成分濃度為53質量%。 Transfer 100 g of the solution (solid content 50% by mass, acid value 59.8 mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 2 to a 300 ml autoclave, and perform nitrogen After the gas is replaced, the temperature is raised to 80°C with a nitrogen gas pressure of 0.5 MPa, 9.52 g of ethylene oxide is introduced into the autoclave through the mass flow controller, and the temperature is raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of ethylene oxide (epoxy group) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 4. The number average molecular weight of the solid content of the obtained resin composition (hereinafter referred to as resin composition 3) is 11400, the acid value is 0.2mg-KOH/g, the hydroxyl value is 57.2mg-KOH/g, and the solid content concentration is 53 mass. %.

<生成物的鑑定> <Identification of products>

將與合成例5同樣地精製得到的液狀的樹脂的鑑定以1H-NMR測定、IR測定實施,NMR測定中之2.4ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為環氧乙烷接枝的聚胺基甲酸酯樹脂。又,確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧乙烷(式(b1)中之n1)之平均值為3.4。 The identification of the liquid resin refined in the same manner as in Synthesis Example 5 was carried out by 1 H-NMR measurement and IR measurement. In the NMR measurement, the proton peak of epoxy ring opening was confirmed near 2.4 ppm. The measurement was performed by IR. 1040cm -1 peak intensity increases the peak intensity of the CH-OH stretching vibration of OH stretching and close to the vicinity of 3300cm -1, as confirmed grafted ethylene oxide polyurethane resin. Also, confirm that the ethylene oxide reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm in the NMR measurement and the proton ratio of 2.5 ppm to 5.0 ppm (in formula (b1) The average value of n 1 ) is 3.4.

[合成例8] [Synthesis Example 8]

將合成例3所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價79.8mg-KOH/g)100g移至300ml的高壓滅菌鍋,進行氮氣體取代後,以氮氣體壓0.5MPa升溫至80℃,將環氧乙烷12.8g透過質量流量控制器導入高壓滅菌鍋,升溫至120℃進行6小時反應。環氧乙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為4。得到的樹脂組成物(以下、稱樹脂組成物4)之固體成分的數平均分子量為7400、酸價為0.5mg-KOH/g、羥基價為73.6mg-KOH/g、固體成分濃度為56質量%。 Transfer 100 g of the solution (solid content 50% by mass, acid value 79.8 mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 3 to a 300 ml autoclave, and perform nitrogen After the gas is replaced, the temperature is raised to 80°C with a nitrogen gas pressure of 0.5 MPa, 12.8 g of ethylene oxide is introduced into the autoclave through the mass flow controller, and the temperature is raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of ethylene oxide (epoxy group) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 4. The number average molecular weight of the solid content of the obtained resin composition (hereinafter referred to as resin composition 4) is 7400, the acid value is 0.5 mg-KOH/g, the hydroxyl value is 73.6 mg-KOH/g, and the solid content concentration is 56 mass. %.

<生成物的鑑定> <Identification of products>

以合成例5同樣地精製得到的液狀的樹脂的鑑定使用1H-NMR測定、IR測定實施,NMR測定中之2.4ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為環氧乙烷接枝的聚胺基甲酸酯樹脂。又,確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧乙烷(式(b1)中之n1)之平均值為3.7。 The identification of the liquid resin obtained in the same manner as in Synthesis Example 5 was carried out using 1 H-NMR measurement and IR measurement. The proton peak of epoxy ring opening was confirmed in the vicinity of 2.4 ppm in the NMR measurement. It was measured by IR from 1040 cm and increase the peak intensity of the CH-OH stretching cm -1 peak intensity of the OH stretching vibration near 3300 cm -1, it was confirmed for the ethylene oxide-grafted polyurethane resin. Also, confirm that the ethylene oxide reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm in the NMR measurement and the proton ratio of 2.5 ppm to 5.0 ppm (in formula (b1) The average value of n 1 ) is 3.7.

[合成例9] [Synthesis Example 9]

將合成例4所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價60.6mg-KOH/g)100g移至300ml的高壓滅菌鍋,進行氮氣體取代後,以氮氣體壓0.5MPa升溫至80℃,將環氧乙烷9.73g透過質量流量控制器導入高壓滅菌鍋,升溫至120℃進行6小時反應。環氧乙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為4。得到的樹脂組成物(以下、稱樹脂組成物5)之固體成分的數平均分子量為8900、酸價為0.1mg-KOH/g、羥基價為60.1mg-KOH/g、固體成分濃度為54質量%。 Transfer 100 g of the solution (solid content 50% by mass, acid value 60.6 mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 4 to a 300 ml autoclave, and perform nitrogen After the gas is replaced, the temperature is raised to 80°C with a nitrogen gas pressure of 0.5 MPa, 9.73 g of ethylene oxide is introduced into the autoclave through the mass flow controller, and the temperature is raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of ethylene oxide (epoxy group) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 4. The number average molecular weight of the solid content of the obtained resin composition (hereinafter referred to as resin composition 5) is 8900, the acid value is 0.1 mg-KOH/g, the hydroxyl value is 60.1 mg-KOH/g, and the solid content concentration is 54 mass. %.

<生成物的鑑定> <Identification of products>

以合成例5同樣地精製得到的液狀的樹脂的鑑定使用1H-NMR測定、IR測定實施,NMR測定中之2.4ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為環氧乙烷接枝的聚胺基甲酸酯樹脂。又,確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧乙烷(式(b1)中之n1)之平均值為3.6。 The identification of the liquid resin obtained in the same manner as in Synthesis Example 5 was carried out using 1 H-NMR measurement and IR measurement. In the NMR measurement, the proton peak of the epoxy ring opening was confirmed at around 2.4 ppm. The measurement by IR was 1040 cm and increase the peak intensity of the CH-OH stretching cm -1 peak intensity of the OH stretching vibration near 3300 cm -1, it was confirmed for the ethylene oxide-grafted polyurethane resin. Also, confirm that the ethylene oxide reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm in the NMR measurement and the proton ratio of 2.5 ppm to 5.0 ppm (in formula (b1) The average value of n 1 ) is 3.6.

[合成例10] [Synthesis Example 10]

於合成例1所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價40.2mg-KOH/g)100g中,加入環氧環己烷(購自和光純藥股份公司)3.52g、作為觸媒之三苯基膦(北興化學工業股份公司製)0.05g,並移至300ml的高壓滅菌鍋,進行氮氣體取代後,以氮氣體壓0.5MPa,升溫至120℃進行6小時反應。環氧環己烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的添加莫耳比((Epoxy)/(Acid))為1。得到的樹脂組成物(以下、稱樹脂組成物6)之固體成分的數平均分子量為30100、酸價為4.5mg-KOH/g、羥基價為32.3mg-KOH/g、 固體成分濃度為52質量%。 To 100 g of the solution (solid content 50% by mass, acid value 40.2 mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 1, was added cyclohexane epoxy (purchased From Wako Pure Chemicals Co., Ltd.) 3.52g, as a catalyst, triphenylphosphine (made by Beixing Chemical Industry Co., Ltd.) 0.05g, transferred to a 300ml autoclave, replaced with nitrogen gas, and pressure 0.5MPa with nitrogen gas , The temperature was raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of epoxycyclohexane (epoxy group) to the carboxyl group in the polyurethane skeleton (A) having a carboxyl group in this reaction is 1. The obtained resin composition (hereinafter referred to as resin composition 6) has a number average molecular weight of 30,100, an acid value of 4.5 mg-KOH/g, and a hydroxyl value of 32.3 mg-KOH/g, The solid content concentration was 52% by mass.

<生成物的鑑定> <Identification of products>

以合成例5同樣地精製得到的液狀的樹脂的鑑定使用1H-NMR測定、IR測定來實施,NMR測定中之3.1ppm附近確認到環氧環開環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為環氧環己烷接枝的聚胺基甲酸酯樹脂。又,確認由NMR測定中之0.8ppm~2.5ppm之質子比與2.5ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的環氧環己烷(式(b2)中之n2)之平均值為0.6。 The identification of the liquid resin obtained in the same manner as in Synthesis Example 5 was carried out using 1 H-NMR measurement and IR measurement. In the NMR measurement, the proton peak of the epoxy ring opening was confirmed near 3.1 ppm, and it was measured by IR. increase in the peak intensity of the peak intensity of the CH-OH stretching vibration of OH stretching and close to the vicinity of 3300cm -1 1040cm -1, as confirmed polyurethane resin graft-epoxycyclohexane. Also, it was confirmed that the epoxy cyclohexane reacted with the carboxyl group in the urethane resin calculated from the proton ratio of 0.8 ppm to 2.5 ppm and the proton ratio of 2.5 ppm to 5.0 ppm in the NMR measurement (formula (b2) The average value of n 2 ) is 0.6.

[合成例11] [Synthesis Example 11]

於合成例1所得到之具有羧基的聚胺基甲酸酯骨架(A)之溶液(固體成分濃度50質量%、酸價40.2mg-KOH/g)100g中,加入苯環氧乙烷(購自東京化成股份公司)4.30g、作為觸媒之三苯基膦(北興化學工業股份公司製)0.05g,並移至300ml的高壓滅菌鍋,進行氮氣體取代後,以氮氣體壓0.5MPa,升溫至120℃進行6小時反應。苯環氧乙烷(環氧基)相對於該反應中之具有羧基的聚胺基甲酸酯骨架(A)中之羧基的莫耳比((Epoxy)/(Acid))為1。得到的樹脂組成物(以下、稱樹脂組成物7)之固體成分的數平均分子量為28100、酸價為 1.6mg-KOH/g、羥基價為35.3mg-KOH/g、固體成分濃度為53質量%。 To 100 g of the solution (solid content 50% by mass, acid value 40.2mg-KOH/g) of the polyurethane skeleton (A) having a carboxyl group obtained in Synthesis Example 1, phenyloxirane (purchased From Tokyo Kasei Co., Ltd.) 4.30g, as a catalyst of triphenylphosphine (made by Beixing Chemical Industry Co., Ltd.) 0.05g, transferred to a 300ml autoclave, replaced with nitrogen gas, and then pressurized with nitrogen gas at 0.5MPa, The temperature was raised to 120°C for 6 hours of reaction. The molar ratio ((Epoxy)/(Acid)) of the phenyloxirane (epoxy group) to the carboxyl group in the carboxyl-containing polyurethane skeleton (A) in the reaction is 1. The obtained resin composition (hereinafter referred to as resin composition 7) has a number average molecular weight of 28,100 and an acid value of 1.6 mg-KOH/g, a hydroxyl value of 35.3 mg-KOH/g, and a solid content concentration of 53% by mass.

<生成物的鑑定> <Identification of products>

以合成例5同樣地精製得到的液狀的樹脂的鑑定使用1H-NMR測定、IR測定來實施,於NMR測定中之7.3ppm附近確認到來自苯環的質子波峰,以IR測定,由1040cm-1附近的CH-OH伸縮之波峰強度及3300cm-1附近的OH伸縮振動之波峰強度的增加,確認為苯環氧乙烷接枝的聚胺基甲酸酯樹脂。又,確認NMR測定中之7.0ppm~7.5ppm的質子比(來自氘代氯仿的波峰除外)與0.8ppm~5.0ppm中之質子比算出的與胺基甲酸酯樹脂中之羧基反應的苯環氧乙烷(式(b1)中之n1)之平均值為0.8。 The identification of the liquid resin obtained in the same manner as in Synthesis Example 5 was carried out using 1 H-NMR measurement and IR measurement. The proton peak derived from the benzene ring was confirmed in the vicinity of 7.3 ppm in the NMR measurement. It was measured by IR and measured from 1040 cm and increase the peak intensity of the CH-OH stretching cm -1 peak intensity of the OH stretching vibration near 3300 cm -1, it was confirmed benzene ethylene oxide-grafted polyurethane resin. Also, confirm the benzene ring that reacts with the carboxyl group in the urethane resin calculated from the proton ratio of 7.0 ppm to 7.5 ppm (excluding the peak derived from deuterated chloroform) and the proton ratio of 0.8 ppm to 5.0 ppm in the NMR measurement The average value of oxyethane (n 1 in formula (b1)) is 0.8.

<銀奈米線的塗佈膜之製作> <Production of Coated Film of Silver Nanowire>

將銀奈米線0.125g(線平均徑約40nm、平均長度約10μm、皆為以SEM任意觀察的100個銀奈米線之數平均值)分散於乙醇50g(0.25質量%),使該溶液於Lumirror 125U98(股)(東麗股份公司製)以Drop-coat塗佈0.05g,進行6小時風乾,堆積上述銀奈米線。 0.125g of silver nanowires (the average wire diameter is about 40nm, the average length is about 10μm, and the average value of 100 silver nanowires randomly observed by SEM) is dispersed in 50g (0.25% by mass) of ethanol to make the solution A drop-coat of 0.05 g was applied to Lumirror 125U98 (shares) (manufactured by Toray Co., Ltd.) and air-dried for 6 hours to deposit the silver nanowire.

接著,使用NovaCentrix公司製的氙氣照射裝置Pulse Forge3300,脈衝光之照射條件為以光源驅動電壓600V、照射時間60μ秒照射1次脈衝光,製作評估用的 透明導電圖型。得到的透明導電圖型的表面電阻為約100Ω/□。又,表面電阻為使用非接觸式電阻測定器(Napuson股份公司製EC-80P)進行測定。 Next, a xenon irradiation device Pulse Forge 3300 manufactured by NovaCentrix was used. The pulsed light irradiation conditions were as follows: a pulsed light was irradiated with a light source drive voltage of 600V and an irradiation time of 60 μs to produce an evaluation Transparent conductive pattern. The surface resistance of the obtained transparent conductive pattern was about 100Ω/□. In addition, the surface resistance was measured using a non-contact resistance measuring device (EC-80P manufactured by Napuson Co., Ltd.).

.含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)之至少一部份鍵結有聚異氰酸酯化合物(Q)的聚胺基甲酸酯樹脂的合成及評估 . Synthesis and evaluation of a polyurethane resin in which at least a part of the aliphatic oxide ring-opening addition part (B) of a hydroxyl-containing polyurethane resin is bonded with a polyisocyanate compound (Q)

Figure 104135862-A0202-12-0063-18
Figure 104135862-A0202-12-0063-18

Figure 104135862-A0202-12-0064-19
Figure 104135862-A0202-12-0064-19

.實施例1~10、比較例1~2<保護膜樹脂之評估> . Examples 1 to 10, Comparative Examples 1 to 2 <Evaluation of protective film resin>

如表1,使用聚異氰酸酯化合物(Q)(Desmodur(登錄商標)BL4265SN、DURANATE(登錄商標)SBB-70P、DURANATE(登錄商標)17B-60P)、封閉型異氰酸酯(Desmodur(登錄商標)-I)、Dabco T-12觸媒(二丁基錫二月桂酸酯、DBTDL),以表2的搭配混合後,使用自轉.公轉真空混合機 去泡練太郎ARV-310(股份公司THINKY製)充分混合(以自轉500旋轉、公轉1500旋轉進行5分鐘),製作塗佈用的油墨(實施例1~10)。 As shown in Table 1, using polyisocyanate compound (Q) (Desmodur (registered trademark) BL4265SN, DURANATE (registered trademark) SBB-70P, DURANATE (registered trademark) 17B-60P), blocked isocyanate (Desmodur (registered trademark)-I) , Dabco T-12 catalyst (Dibutyltin dilaurate, DBTDL), after mixing with the collocation in Table 2, use rotation. Revolving Vacuum Mixer Defoaming Nintaro ARV-310 (manufactured by THINKY Co., Ltd.) thoroughly mixed (500 rotations and 1,500 rotations for 5 minutes) to prepare coating inks (Examples 1-10).

將得到的油墨以棒塗佈機,塗佈於Lumirror(登錄商標)125U98(東麗股份公司製)上塗佈有表面電阻成為約100Ω的銀奈米線塗佈膜,風乾後120℃、1小時,使樹脂硬化。比較例1為未被覆油墨,比較例2為使用市售的保護膜樹脂(JELCON IN-10C:十條化工股份公司製保護膜樹脂、以UV照射硬化(使用鹵素燈,在室溫照射200mj/cm2))。 The obtained ink was applied to Lumirror (registered trademark) 125U98 (manufactured by Toray Co., Ltd.) with a bar coater. A silver nanowire coating film with a surface resistance of approximately 100Ω was applied. After air drying, it was dried at 120°C, 1 Hours to harden the resin. Comparative example 1 is not coated with ink, and comparative example 2 is to use a commercially available protective film resin (JELCON IN-10C: protective film resin made by Jujo Chemical Co., Ltd., cured by UV irradiation (using a halogen lamp, 200mj/cm at room temperature) 2 )).

<彎曲的評估> <Assessment of bending>

基材上堆積銀奈米線後,將塗佈實施例1~10的油墨(形成保護膜)的硬化前之薄膜切為10cm×5cm,將塗佈面朝上,以120℃、1小時進行硬化(比較例2為在室溫以UV照射)。將硬化後的薄膜載置於基台表面(基準面),如圖3所示般,測定薄膜端部的彎曲。 After depositing the silver nanowires on the substrate, cut the film before curing after applying the inks of Examples 1 to 10 (to form a protective film) into 10cm×5cm, with the coated side facing up, and perform it at 120°C for 1 hour Hardening (Comparative Example 2 is UV irradiation at room temperature). The cured film was placed on the surface (reference surface) of the base, and as shown in Fig. 3, the bending of the film end was measured.

<密著性評估> <Adhesion Evaluation>

使用附有新的刀片之美工刀,以1mm間隔於上述硬化後的薄膜上切割11條後,改變90°方向,再切11條,形成100個1mm方形的正方形。黏貼玻璃紙膠帶使其附著於經切割的印刷面,將玻璃紙膠帶上以橡皮擦磨擦使膠帶附著在塗膜。使膠帶附著後過1~2分鐘後,抓取膠帶端維持與印刷面直角,瞬間剝離,且依據舊JIS K5400判定。結果如表2。 Using a utility knife with a new blade, cut 11 strips on the cured film at 1 mm intervals, change the direction of 90°, and cut 11 more strips to form 100 squares of 1 mm square. Paste cellophane tape to adhere to the cut printing surface, rub the cellophane tape with an eraser to make the tape adhere to the coating film. After 1 to 2 minutes have passed after the tape is attached, grab the end of the tape to maintain a right angle to the printed surface and peel off instantly, and it is judged according to the old JIS K5400. The results are shown in Table 2.

<信賴性試驗> <Reliability Test>

在100℃的高溫槽、調節為85℃、相對溼度85%的恆溫恆溼槽中,置入具有表2成分之塗佈膜,並測定500小時經過前後的表面電阻。得到的結果如表2。又,表面電阻為使用非接觸式電阻測定器(Napuson股份公司製EC-80P)進行測定。 In a high temperature tank at 100°C, a constant temperature and humidity tank adjusted to 85°C and a relative humidity of 85%, the coating film with the ingredients in Table 2 was placed, and the surface resistance before and after 500 hours was measured. The results obtained are shown in Table 2. In addition, the surface resistance was measured using a non-contact resistance measuring device (EC-80P manufactured by Napuson Co., Ltd.).

.含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)與具有(甲基)丙烯醯基及異氰酸基的化合物(R)反應而得到的胺基甲酸酯(甲基)丙烯酸酯樹脂的合成及評估 . A urethane formic acid obtained by reacting the aliphatic oxide ring-opening addition part (B) of a hydroxyl-containing polyurethane resin with a compound (R) having a (meth)acryloyl group and an isocyanate group Synthesis and evaluation of ester (meth)acrylate resin

(實施例11) (Example 11)

於合成例5所得到之含羥基之聚胺基甲酸酯樹脂溶液 (樹脂組成物1)50g(固體成分濃度52質量%、羥基價37.1mg-KOH/g)中,將Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)2.67g、三苯基膦0.20g添加至裝設有戴氏冷卻管的200ml燒瓶,不特地進行氮氣體取代等,在90℃進行6小時反應,以IR確認幾乎全部異氰酸酯消失。得到的樹脂的鑑定使用1H-NMR測定、IR測定來實施,確認到在NMR測定樹脂組成物1的1H-NMR頻譜(圖1)中未見到的6.1ppm與5.8ppm中之來自甲基丙烯醯基的波峰,由IR測定樹脂組成物1的IR頻譜(圖2)來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大一事,確認了甲基丙烯醯基的導入。得到固體成分濃度54質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。圖4、5各自表示實施例11之胺基甲酸酯丙烯酸酯樹脂的1H-NMR頻譜、IR頻譜。 In 50 g of the hydroxyl-containing polyurethane resin solution (resin composition 1) obtained in Synthesis Example 5 (solid content 52% by mass, hydroxyl value 37.1 mg-KOH/g), Karenz (registered trademark) 2.67 g of MOI (2-methacryloxyethyl isocyanate manufactured by Showa Denko Co., Ltd.) and 0.20 g of triphenylphosphine were added to a 200-ml flask equipped with a Dai's cooling tube, and nitrogen gas substitution was not performed. The reaction was carried out at 90°C for 6 hours, and it was confirmed by IR that almost all the isocyanate had disappeared. The identification of the obtained resin was carried out using 1 H-NMR measurement and IR measurement, and it was confirmed that the 6.1 ppm and 5.8 ppm of the 1 H-NMR spectrum of the resin composition 1 (Figure 1) that were not seen in the NMR measurement were derived from the The peak of the acryloyl group was measured by IR. The IR spectrum of the resin composition 1 (Figure 2) The peak of 3400 cm -1 derived from the NH stretching of the urethane bond increased, confirming the introduction of the methacryloyl group . A novel urethane acrylate resin with a solid content concentration of 54% by mass was obtained. 4 and 5 each show the 1 H-NMR spectrum and the IR spectrum of the urethane acrylate resin of Example 11.

(實施例12) (Example 12)

與實施例11同樣地,使合成例6所得到之含羥基之樹脂溶液(樹脂組成物2)50g(固體成分濃度54質量%、羥基價38.4mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)2.87g反應,得到固體成分濃度56質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。以NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確 認了甲基丙烯醯基的導入。 As in Example 11, 50 g of the hydroxyl-containing resin solution (resin composition 2) obtained in Synthesis Example 6 (solid content 54% by mass, hydroxyl value 38.4 mg-KOH/g) and Karenz (registered trademark) MOI (Showa Denko Corporation 2-methacryloxyethyl isocyanate) 2.87 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 56% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks at 3400 cm -1 derived from the NH stretch of the urethane bond measured by IR increased. Import of base.

(實施例13) (Example 13)

與實施例1同樣地,使合成例7所得到之含羥基之樹脂溶液(樹脂組成物3)50g(固體成分濃度53質量%、羥基價57.2mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)4.19g反應,得到固體成分濃度56質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確認了甲基丙烯醯基的導入。 As in Example 1, 50 g of the hydroxyl-containing resin solution (resin composition 3) obtained in Synthesis Example 7 (solid content 53% by mass, hydroxyl value 57.2 mg-KOH/g) and Karenz (registered trademark) MOI (Showa Denko Corporation 2-methacryloxyethyl isocyanate) 4.19 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 56% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks of 3400 cm -1 derived from the NH stretching of the urethane bond by IR measurement increased. Import of base.

(實施例14) (Example 14)

與實施例11同樣地,使合成例8所得到之含羥基之樹脂溶液(樹脂組成物4)50g(固體成分濃度56質量%、羥基價73.6mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)5.70g反應,得到固體成分濃度60質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確認了甲基丙烯醯基的導入。 As in Example 11, 50 g of the hydroxyl-containing resin solution (resin composition 4) obtained in Synthesis Example 8 (solid content 56% by mass, hydroxyl value 73.6 mg-KOH/g) and Karenz (registered trademark) MOI (Showa Denko Co., Ltd. 2-methacryloxyethyl isocyanate) 5.70 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 60% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks of 3400 cm -1 derived from the NH stretching of the urethane bond by IR measurement increased. Import of base.

(實施例15) (Example 15)

與實施例11同樣地,使合成例9所得到之含羥基之樹脂溶液(樹脂組成物5)50g(固體成分濃度54質量%、羥基價60.1mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)4.49g反應,得到固體成分濃度58質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確認了甲基丙烯醯基的導入。 As in Example 11, 50 g of the hydroxyl-containing resin solution (resin composition 5) obtained in Synthesis Example 9 (solid content 54% by mass, hydroxyl value 60.1 mg-KOH/g) and Karenz (registered trademark) MOI (Showa Denko Corporation 2-methacryloxyethyl isocyanate) 4.49 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 58% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks of 3400 cm -1 derived from the NH stretching of the urethane bond by IR measurement increased. Import of base.

(實施例16) (Example 16)

與實施例11同樣地,使合成例10所得到之含羥基之樹脂溶液(樹脂組成物6)50g(固體成分濃度52質量%、羥基價32.3mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)2.32g反應,得到固體成分濃度54質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確認了甲基丙烯醯基的導入。 As in Example 11, 50 g of the hydroxyl-containing resin solution (resin composition 6) obtained in Synthesis Example 10 (solid content 52% by mass, hydroxyl value 32.3 mg-KOH/g) and Karenz (registered trademark) MOI (Showa Denko Corporation 2-methacryloxyethyl isocyanate) 2.32 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 54% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks of 3400 cm -1 derived from the NH stretching of the urethane bond by IR measurement increased. Import of base.

(實施例17) (Example 17)

與實施例11同樣地,使合成例11所得到之含羥基之 樹脂溶液(樹脂組成物7)50g(固體成分濃度53質量%、羥基價35.3mg-KOH/g)與Karenz(登錄商標)MOI(昭和電工股份公司製2-甲基丙烯醯基氧基乙基異氰酸酯)2.59g反應,得到固體成分濃度55質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NMR測定在6.1ppm與5.8ppm確認到來自甲基丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大之事確認了甲基丙烯醯基的導入。 As in Example 11, 50 g of the hydroxyl-containing resin solution (resin composition 7) obtained in Synthesis Example 11 (solid content 53% by mass, hydroxyl value 35.3 mg-KOH/g) and Karenz (registered trademark) MOI (2-Methacryloxyethyl isocyanate manufactured by Showa Denko Co., Ltd.) 2.59 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 55% by mass. The peaks derived from the methacrylic acid group were confirmed by NMR measurement at 6.1 ppm and 5.8 ppm, and the peaks of 3400 cm -1 derived from the NH stretching of the urethane bond by IR measurement increased. Import of base.

(實施例18) (Example 18)

與實施例11同樣地,使合成例8所得到之含羥基之樹脂溶液(樹脂組成物4)30g(固體成分濃度56質量%、羥基價73.6mg-KOH/g)與Karenz(登錄商標)AOI(昭和電工股份公司製2-丙烯醯基氧基乙基異氰酸酯)3.10g反應,得到固體成分濃度60質量%的新穎的胺基甲酸酯丙烯酸酯樹脂。由NNMR測定在6.1ppm與5.8ppm確認到來自丙烯醯基的波峰,由IR測定之來自胺基甲酸酯鍵的NH伸縮之3400cm-1的波峰增大一事確認丙烯醯基的導入。 In the same manner as in Example 11, 30 g of the hydroxyl-containing resin solution (resin composition 4) obtained in Synthesis Example 8 (solid content 56% by mass, hydroxyl value 73.6 mg-KOH/g) and Karenz (registered trademark) AOI (2-acryloxyethyl isocyanate manufactured by Showa Denko Co., Ltd.) 3.10 g was reacted to obtain a novel urethane acrylate resin with a solid content concentration of 60% by mass. The peaks derived from the acrylic group were confirmed at 6.1 ppm and 5.8 ppm by NNMR measurement, and the introduction of the acrylic group was confirmed that the peak at 3400 cm -1 derived from the NH stretch of the urethane bond increased by the IR measurement.

<保護膜樹脂的評估> <Evaluation of protective film resin>

以使用表3的實施例19~28所示之胺基甲酸酯丙烯酸酯樹脂、聚丙烯酸、光起始劑的搭配,使用自轉.公轉真空混合機 去泡練太郎ARV-310(股份公司THINKY 製)充分混合(以自轉500旋轉、公轉1500旋轉進行5分鐘),製作塗佈用的油墨(保護膜用組成物)。 Use the combination of urethane acrylate resin, polyacrylic acid, and photoinitiator shown in Examples 19-28 in Table 3, and use rotation. Revolution Vacuum Mixer Go to Soak Nintaro ARV-310 (THINKY Co., Ltd. (Preparation) Fully mixing (rotation 500 rotation, revolution 1500 rotation for 5 minutes), the ink for coating (protective film composition) is produced.

Figure 104135862-A0202-12-0072-20
Figure 104135862-A0202-12-0072-20

將得到的油墨以棒塗佈機,塗佈於前述Lumirror 125U98(股)東麗製上塗佈表面電阻成為約100Ω/□的上述銀奈米線塗佈膜上,風乾後、使用NovaCentrix公司製的氙氣照射裝置Pulse Forge(登錄商標)3300,脈衝光的照射條件為以光源的驅動電壓150V、照射時間500μ秒、1Hz照射脈衝光10次,使樹脂硬化。比較例3為無保護膜(保護膜),比較例4為取代本發明之保護膜用組成物而使用市售品(JELCON IN-10.C:十條化工股份公司製保護膜樹脂)作為保護膜。使用三豐製高精度數顯千分尺MDH-25M 293-100測定的實施例19~28、比較例4中之硬化膜的厚度為約20μm。 The obtained ink was coated with a bar coater on the aforementioned silver nanowire coated film made by Lumirror 125U98 (stock) Toray, the surface resistance of which was about 100Ω/□, and after air-dried, it was made by NovaCentrix. Xenon irradiation device Pulse Forge (registered trademark) 3300, pulsed light irradiation conditions are the driving voltage of the light source 150V, irradiation time 500μsec, 1Hz pulse light irradiation 10 times to harden the resin. Comparative Example 3 is without a protective film (protective film), and Comparative Example 4 uses a commercially available product (JELCON IN-10.C: protective film resin manufactured by Jujo Chemical Co., Ltd.) as a protective film instead of the protective film composition of the present invention . The thickness of the cured film in Examples 19 to 28 and Comparative Example 4 measured using Mitutoyo's high-precision digital micrometer MDH-25M 293-100 was about 20 μm.

<密著性評估> <Adhesion Evaluation>

使用附有新的刀片之美工刀,以1mm間隔在上述薄膜絕緣圖型切割11條後,改變90°方向,再切11條,形成100個1mm方形的正方形。使玻璃紙膠帶附著於經切割的印刷面而黏貼,並使玻璃紙膠帶上以橡皮擦磨擦,將膠帶附著於塗膜。使膠帶附著後經1~2分鐘後,抓取膠帶端並與印刷面維持直角,瞬間剝離,依據舊JIS K5400進行判定。結果如表4所示。 Using a utility knife with a new blade, cut 11 pieces of the above-mentioned film insulation pattern at 1mm intervals, change the direction of 90°, and then cut 11 pieces to form 100 1mm squares. The cellophane tape is attached to the cut printing surface and pasted, and the cellophane tape is rubbed with an eraser to attach the tape to the coating film. After 1 to 2 minutes after the tape is attached, grab the end of the tape and maintain it at a right angle to the printed surface, and then peel off instantly. The judgment is based on the old JIS K5400. The results are shown in Table 4.

Figure 104135862-A0202-12-0074-21
Figure 104135862-A0202-12-0074-21

<信賴性試驗> <Reliability Test>

於100℃的高溫槽、調節為85℃-相對溼度85%的恆溫恆溼槽置入表3的塗佈膜,測定500小時經過前後的表面電阻之結果如表4所示。又,表面電阻為使用非羧觸式電阻測定器(Napuson股份公司製EC-80P)進行測定。 The coating film of Table 3 was placed in a high temperature tank of 100°C and a constant temperature and humidity chamber adjusted to 85°C-85% relative humidity, and the results of measuring the surface resistance before and after 500 hours are shown in Table 4. In addition, the surface resistance was measured using a non-carboxy contact resistance measuring device (EC-80P manufactured by Napuson Co., Ltd.).

由表4可知實施例19~28與比較例4雖然在密著性皆得到良好的結果,但信賴性與比較例3、4相比,實施例19~28為良好。 It can be seen from Table 4 that although Examples 19 to 28 and Comparative Example 4 have good results in adhesion, compared with Comparative Examples 3 and 4, Examples 19 to 28 have good reliability.

Claims (19)

一種含羥基之聚胺基甲酸酯樹脂,其特徵係由具有羧基的聚胺基甲酸酯骨架(A)、與鍵結於前述羧基之至少一部份的選自下述式(b1)所表示之烯基氧化物(alkene oxides)開環加成部或式(b2)所表示之環烯基氧化物(Cycloalkene oxide)開環加成部的脂肪族氧化物開環加成部(B)所構成,
Figure 104135862-A0305-02-0079-1
(式(b1)中,n1為1~50之整數,R1、R2,各自獨立,為氫原子、碳原子數為1~16烷基、或苯基)
Figure 104135862-A0305-02-0079-2
(式(b2)中,n2為1~10之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數為4~14的脂環式烴基之原子團)且前述具有羧基的聚胺基甲酸酯骨架(A)為基於(a1)聚異氰酸酯化合物、(a2)聚碳酸酯多元醇或聚丁 二烯多元醇、及(a3)具有羧基的二羥基化合物的反應生成物之聚胺基甲酸酯骨架。
A hydroxyl-containing polyurethane resin characterized by a polyurethane skeleton (A) having a carboxyl group, and at least a part of the carboxyl group bonded to at least a part selected from the following formula (b1) The alkene oxide (alkene oxides) ring-opening addition part or the cycloalkene oxide (Cycloalkene oxide) represented by the formula (b2) ring-opening addition part of the aliphatic oxide ring-opening addition part (B ),
Figure 104135862-A0305-02-0079-1
(In formula (b1), n 1 is an integer from 1 to 50, and R 1 and R 2 are each independently a hydrogen atom, an alkyl group with 1 to 16 carbon atoms, or a phenyl group)
Figure 104135862-A0305-02-0079-2
(In formula (b2), n 2 is an integer from 1 to 10, and Z is an atomic group forming an alicyclic hydrocarbon group with 4 to 14 carbon atoms including the two carbon atoms bonded by Z) and the aforementioned having a carboxyl group Polyurethane skeleton (A) is based on (a1) polyisocyanate compound, (a2) polycarbonate polyol or polybutadiene polyol, and (a3) a reaction product of a dihydroxy compound having a carboxyl group Polyurethane skeleton.
如請求項1記載之含羥基之聚胺基甲酸酯樹脂,其中,前述(a1)聚異氰酸酯化合物為異氰酸基(isocyanato group、-NCO基)中之碳原子以外的碳原子數為6~30之脂環式化合物。 The hydroxyl-containing polyurethane resin according to claim 1, wherein the (a1) polyisocyanate compound is the number of carbon atoms other than the carbon atoms in the isocyanato group (-NCO group) of 6 ~30 alicyclic compounds. 如請求項2記載之含羥基之聚胺基甲酸酯樹脂,其中,前述(a3)具有羧基的二羥基化合物為具有2個選自羥基、碳原子數為1或2之羥基烷基任一的分子量200以下的羧酸或胺基羧酸。 The hydroxyl-containing polyurethane resin according to claim 2, wherein the aforementioned (a3) dihydroxy compound having a carboxyl group is any one having two hydroxyalkyl groups selected from hydroxyl groups and having 1 or 2 carbon atoms A carboxylic acid or amino carboxylic acid with a molecular weight of 200 or less. 如請求項3記載之含羥基之聚胺基甲酸酯樹脂,其中,前述(a3)具有羧基的二羥基化合物為2,2-二羥甲基丙酸、2,2-二羥甲基丁烷酸、N,N-雙羥基乙基甘胺酸、N,N-雙羥基乙基丙胺酸所構成的群之1種或2種以上。 The hydroxyl-containing polyurethane resin according to claim 3, wherein the (a3) dihydroxy compound having a carboxyl group is 2,2-dimethylolpropionic acid, 2,2-dimethylolbutane One or more of the group consisting of alkanoic acid, N,N-bishydroxyethylglycine, and N,N-bishydroxyethylalanine. 如請求項1記載之含羥基之聚胺基甲酸酯樹脂,其中,前述式(b1)中之n1為1~10,R1、R2各自獨立,為氫原子或甲基、或者R1、R2之至少一者為氫原子且另一者為碳原子數為1~10之烷基、或苯基。 The hydroxyl-containing polyurethane resin according to claim 1, wherein n 1 in the aforementioned formula (b1) is 1 to 10, and R 1 and R 2 are independent of each other and are a hydrogen atom, a methyl group, or R 1. At least one of R 2 is a hydrogen atom and the other is an alkyl group with 1 to 10 carbon atoms or a phenyl group. 如請求項1記載之含羥基之聚胺基甲酸酯樹脂,其中,前述式(b2)中之n2為1~3之整數,Z為形成包含該Z鍵結的2個碳原子之碳原子數6~12的脂環式烴基的原子團。 The hydroxyl-containing polyurethane resin according to claim 1, wherein n 2 in the aforementioned formula (b2) is an integer of 1 to 3, and Z is a carbon forming two carbon atoms including the Z bond The atomic group of an alicyclic hydrocarbon group with 6 to 12 atoms. 一種聚胺基甲酸酯樹脂,其為請求項1~6中任1 項記載之含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)的至少一部份與聚異氰酸酯化合物(Q)之反應生成物。 A polyurethane resin, which is any 1 of claims 1 to 6 The reaction product of at least a part of the aliphatic oxide ring-opening addition part (B) of the hydroxyl-containing polyurethane resin described in the item and the polyisocyanate compound (Q). 如請求項7記載之聚胺基甲酸酯樹脂,其中,前述聚異氰酸酯化合物(Q)為脂肪族聚異氰酸酯化合物或由其所衍生的封閉型異氰酸酯。 The polyurethane resin according to claim 7, wherein the polyisocyanate compound (Q) is an aliphatic polyisocyanate compound or a blocked isocyanate derived therefrom. 如請求項7記載之聚胺基甲酸酯樹脂,其中,前述聚異氰酸酯化合物(Q)含有以由己內醯胺、酮肟、酚、2級胺所構成的群所選出的具有活性氫的化合物封端的異氰酸基。 The polyurethane resin according to claim 7, wherein the polyisocyanate compound (Q) contains a compound having active hydrogen selected from the group consisting of caprolactam, ketoxime, phenol, and secondary amine Blocked isocyanate groups. 一種保護膜用組成物,其特徵係含有請求項7~9中任1項記載之聚胺基甲酸酯樹脂與溶劑。 A composition for a protective film characterized by containing the polyurethane resin described in any one of claims 7 to 9 and a solvent. 一種胺基甲酸酯(甲基)丙烯酸酯樹脂,其為請求項1~6中任1項記載之含羥基之聚胺基甲酸酯樹脂的脂肪族氧化物開環加成部(B)與具有(甲基)丙烯醯基及異氰酸基的化合物(R)之反應生成物。 A urethane (meth)acrylate resin, which is an aliphatic oxide ring-opening addition part (B) of a hydroxyl-containing polyurethane resin described in any one of claims 1 to 6 The reaction product with a compound (R) having a (meth)acryloyl group and an isocyanate group. 如請求項11記載之胺基甲酸酯(甲基)丙烯酸酯樹脂,其中,化合物(R)為1分子中含有1個以上(甲基)丙烯醯基且具有1個異氰酸基者、或其異氰酸基被保護者。 The urethane (meth)acrylate resin according to claim 11, wherein the compound (R) contains one or more (meth)acrylic groups in one molecule and one isocyanate group, Or its isocyanate group is protected. 如請求項11記載之胺基甲酸酯(甲基)丙烯酸酯樹脂,其中,化合物(R)選自2-異氰酸基乙基(甲基)丙烯酸酯、1,1-(雙丙烯醯基氧基甲基)乙基異氰酸酯、其封端體之甲基丙烯酸2-(0-[1’-甲基亞丙基胺基]羧 基胺基)乙基、2-[(3,5-二甲基吡唑基)羰基胺基]乙基甲基丙烯酸酯所成群組。 The urethane (meth)acrylate resin according to claim 11, wherein the compound (R) is selected from 2-isocyanatoethyl (meth)acrylate, 1,1-(bisacrylic acid) 2-(0-[1'-methylpropyleneamino]carboxy Group amino) ethyl, 2-[(3,5-dimethylpyrazolyl) carbonylamino] ethyl methacrylate group. 一種UV硬化性樹脂組成物,其特徵係含有請求項11~13中任1項記載之胺基甲酸酯(甲基)丙烯酸酯樹脂、與光起始劑。 A UV curable resin composition characterized by containing the urethane (meth)acrylate resin described in any one of Claims 11 to 13, and a photoinitiator. 一種保護膜用組成物,其特徵係含有請求項11~13中任1項記載之胺基甲酸酯(甲基)丙烯酸酯樹脂或請求項14記載之UV硬化性樹脂組成物。 A composition for a protective film characterized by containing the urethane (meth)acrylate resin described in any one of claims 11 to 13 or the UV curable resin composition described in claim 14. 一種請求項1記載之含羥基之聚胺基甲酸酯樹脂之製造方法,其特徵係使含有羧基的聚胺基甲酸酯的羧基與式(x1)所表示之烯基氧化物及式(x2)所表示之環烯基氧化物的至少一者反應,
Figure 104135862-A0305-02-0082-3
(式(x1)中,R1、R2,各自獨立,為氫原子、碳原子數為1~16之烷基、或苯基)
Figure 104135862-A0305-02-0082-4
(式(x2)中,Z表示與該Z鍵結的2個碳原子一起形成碳原子數為4~14的脂環式烴基之原子團)。
A method for producing a hydroxyl-containing polyurethane resin described in claim 1, characterized by combining the carboxyl group of the carboxyl-containing polyurethane with the alkenyl oxide represented by the formula (x1) and the formula ( x2) reaction of at least one of the cycloalkenyl oxides represented,
Figure 104135862-A0305-02-0082-3
(In formula (x1), R 1 and R 2 are each independently a hydrogen atom, an alkyl group with 1 to 16 carbon atoms, or a phenyl group)
Figure 104135862-A0305-02-0082-4
(In formula (x2), Z represents an atomic group that forms an alicyclic hydrocarbon group with 4 to 14 carbon atoms together with the two carbon atoms bonded to Z).
如請求項16記載之含羥基之聚胺基甲酸酯樹脂之製造方法,其中前述式(x1)所表示之烯基氧化物為環氧乙烷、環氧丙烷、或苯環氧乙烷(styrene oxide),且前述式(x2)所表示之環烯基氧化物為環氧環己烷(Cyclohexene oxide)。 The method for producing a hydroxyl-containing polyurethane resin as described in claim 16, wherein the alkenyl oxide represented by the aforementioned formula (x1) is ethylene oxide, propylene oxide, or styrene oxide ( styrene oxide), and the cycloalkenyl oxide represented by the aforementioned formula (x2) is cyclohexene oxide. 一種聚胺基甲酸酯樹脂之製造方法,其特徵係具備使以請求項16或17記載之含羥基之聚胺基甲酸酯樹脂之製造方法所得到之含羥基之聚胺基甲酸酯樹脂與聚異氰酸酯化合物(Q)反應之步驟。 A method for producing a polyurethane resin, characterized by comprising a hydroxyl-containing polyurethane obtained by the method for producing a hydroxyl-containing polyurethane resin described in claim 16 or 17 The step of reacting the resin with the polyisocyanate compound (Q). 一種胺基甲酸酯(甲基)丙烯酸酯樹脂之製造方法,其特徵係具備使以請求項16或17記載之含羥基之聚胺基甲酸酯樹脂之製造方法所得到之含羥基之聚胺基甲酸酯樹脂與具有(甲基)丙烯醯基及異氰酸基的化合物(R)反應之步驟。 A method for producing a urethane (meth)acrylate resin, which is characterized by having a hydroxyl-containing polycarbonate obtained by the method for producing a hydroxyl-containing polyurethane resin described in claim 16 or 17. The step of reacting a urethane resin with a compound (R) having a (meth)acryloyl group and an isocyanate group.
TW104135862A 2014-10-30 2015-10-30 Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods for these resins, and compositions for protective films And UV curable resin composition TWI710583B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2014221958 2014-10-30
JP2014-221958 2014-10-30
JP2014-263954 2014-12-26
JP2014263954 2014-12-26
JP2015059353A JP6478742B2 (en) 2015-03-23 2015-03-23 Urethane (meth) acrylate resin, UV curable resin composition, composition for overcoat, and method for producing urethane (meth) acrylate resin
JP2015-059353 2015-03-23

Publications (2)

Publication Number Publication Date
TW201630957A TW201630957A (en) 2016-09-01
TWI710583B true TWI710583B (en) 2020-11-21

Family

ID=55857589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104135862A TWI710583B (en) 2014-10-30 2015-10-30 Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods for these resins, and compositions for protective films And UV curable resin composition

Country Status (4)

Country Link
KR (1) KR101894749B1 (en)
CN (1) CN107148435B (en)
TW (1) TWI710583B (en)
WO (1) WO2016068254A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220070198A (en) * 2019-07-31 2022-05-30 오사카 유키가가쿠고교 가부시키가이샤 Curable resin composition, and elastomer and sheet
JPWO2021075383A1 (en) * 2019-10-17 2021-04-22
CN112724915B (en) * 2020-12-29 2022-06-14 韦尔通(厦门)科技股份有限公司 Reactive polyurethane hot melt adhesive with multiple curing modes and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844657A (en) * 2006-11-02 2008-11-16 Toyo Ink Mfg Co Photosensitive resin and cured resin thereof, and process for manufacturing photosensitive resin
CN104093572A (en) * 2012-01-31 2014-10-08 富士胶片株式会社 Resin composition for laser-engravable flexographic printing plate, original plate for laser-engravable flexographic printing plate and method for production thereof, and flexographic printing plate and method for production thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837142B2 (en) * 1996-11-14 1998-12-14 大成化工株式会社 Room temperature curable aqueous resin composition which is an aqueous acrylic-urethane composite and coating agent or ink using the same
JP2001033960A (en) * 1999-07-16 2001-02-09 Kansai Paint Co Ltd Photosensitive resin composition for photoresist and resist pattern forming method
JP2001159815A (en) * 1999-12-03 2001-06-12 Nippon Kayaku Co Ltd Photosensitive resin composition and photosensitive film using same
JP4503199B2 (en) * 2001-04-12 2010-07-14 岡本化学工業株式会社 Photosensitive composition for photosensitive lithographic printing plate
CN101589473B (en) 2006-10-12 2011-10-05 凯博瑞奥斯技术公司 Nanowire-based transparent conductors and applications thereof
JP5298428B2 (en) 2006-12-26 2013-09-25 Jnc株式会社 Thermosetting resin composition and cured film
JP2009205924A (en) 2008-02-27 2009-09-10 Kuraray Co Ltd Transparent conductive film, transparent conductive member, and silver nano wire dispersion solution and manufacturing method of transparent conductive film
JP5445042B2 (en) 2009-11-11 2014-03-19 東レ株式会社 Conductive laminate and touch panel using the same
JP5600457B2 (en) 2010-03-26 2014-10-01 パナソニック株式会社 Base material with transparent conductive film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844657A (en) * 2006-11-02 2008-11-16 Toyo Ink Mfg Co Photosensitive resin and cured resin thereof, and process for manufacturing photosensitive resin
CN104093572A (en) * 2012-01-31 2014-10-08 富士胶片株式会社 Resin composition for laser-engravable flexographic printing plate, original plate for laser-engravable flexographic printing plate and method for production thereof, and flexographic printing plate and method for production thereof

Also Published As

Publication number Publication date
CN107148435A (en) 2017-09-08
KR101894749B1 (en) 2018-09-04
KR20170033405A (en) 2017-03-24
WO2016068254A1 (en) 2016-05-06
CN107148435B (en) 2020-10-13
TW201630957A (en) 2016-09-01

Similar Documents

Publication Publication Date Title
US11154902B2 (en) Transparent conductive substrate and method for producing same
TWI654239B (en) Photosensitive conductive paste, conductive film, circuit and touch panel
TWI537137B (en) Decorative hard coat film and decorative hard coat adhesive film
WO2020255458A1 (en) Transparent electroconductive film laminate and method for processing same
TWI710583B (en) Hydroxyl-containing polyurethane resins, polyurethane resins using them as raw materials, and urethane (meth)acrylate resins, manufacturing methods for these resins, and compositions for protective films And UV curable resin composition
US20220371310A1 (en) Transparent conducting film laminate and processing method thereof
JP6994455B2 (en) Binder resin for conductive composition, composition for forming conductive pattern containing this, and polyurethane
JP6478742B2 (en) Urethane (meth) acrylate resin, UV curable resin composition, composition for overcoat, and method for producing urethane (meth) acrylate resin
US10995235B2 (en) Composition for forming protective film for electroconductive pattern, protective film for electroconductive pattern, method for producing protective film, and method for producing transparent electroconductive film
TWI541281B (en) A thermosetting resin composition, a hardened product thereof, and a printed circuit board using the same
TW201543503A (en) Photosensitive conductive paste, conductive thin film, electrical circuit and touch panel
JP6664212B2 (en) Polyurethane resin, composition for overcoat, and method for producing polyurethane resin
JP2009084350A (en) Actinic ray-curing resin composition, ink and laminate coated therewith
TW201539483A (en) Photosensitive conductive paste, conductive thin film, electrical circuit and touch panel
JP6669443B2 (en) Resin composition for protective film of conductive pattern using metal nanowire and transparent conductive substrate
JP2016222847A5 (en)
JP6592328B2 (en) Polyurethane resin, method for producing polyurethane resin, and resin composition
US11203659B2 (en) Method for producing polyurethane, epoxy carboxylate composition, polyurethane, and polyurethane resin composition
JP2010195878A (en) Active light ray-curable resin composition, ink, and laminate
JP4240289B2 (en) Actinic ray curable resin composition, ink, and laminate coated with the same
KR20200073029A (en) A process for producing an ultraviolet curable adhesive resin composition containing an adhesion promoting agent and an ultraviolet curable adhesive resin composition thereof
JP2020084039A (en) Urethan (meth)acrylate
TW201014891A (en) An adhesion promoter and a method of manufacturing thereof