TWI710443B - Cutting mat, cutting apparatus, and cutting method for optical film - Google Patents

Cutting mat, cutting apparatus, and cutting method for optical film Download PDF

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Publication number
TWI710443B
TWI710443B TW108105223A TW108105223A TWI710443B TW I710443 B TWI710443 B TW I710443B TW 108105223 A TW108105223 A TW 108105223A TW 108105223 A TW108105223 A TW 108105223A TW I710443 B TWI710443 B TW I710443B
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cutting
optical film
magnetic elements
pad
mat
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TW108105223A
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Chinese (zh)
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TW202031442A (en
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能木直安
林惠菁
徐志文
陳姿如
楊以權
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住華科技股份有限公司
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Priority to TW108105223A priority Critical patent/TWI710443B/en
Priority to CN201911167300.8A priority patent/CN111571694B/en
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Publication of TWI710443B publication Critical patent/TWI710443B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work

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  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polarising Elements (AREA)

Abstract

A cutting apparatus is provided and includes a cutting mat, at least one second magnetic element and a cutting tool. The cutting mat is configured to support an optical film, and the cutting mat includes at least one accommodating groove and at least one first magnetic element disposed in the accommodating groove. The second magnetic element is configured to act with the first magnetic element to generate a magnetic attraction force so as to secure the optical film on the cutting mat. The cutting tool is configured to cut the optical film.

Description

切割墊、切割設備以及光學膜的切割方法Cutting mat, cutting equipment and optical film cutting method

本揭露係關於一種切割設備,特別係關於一種利用磁性元件進行固定之切割設備。The present disclosure relates to a cutting device, and particularly to a cutting device that uses magnetic elements for fixing.

偏光板為廣泛應用於液晶顯示器之光學元件,隨著液晶顯示器的應用越來越廣,例如,手機、穿戴式裝置等,對偏光板品質的要求也越來越高。Polarizers are optical components that are widely used in liquid crystal displays. With the increasing application of liquid crystal displays, such as mobile phones, wearable devices, etc., the requirements for the quality of polarizers are also increasing.

偏光板在製成後通常需經裁切以貼合至各種尺寸的顯示器。此外,由於各種光學膜材的來料尺寸與成品所需的尺寸相差甚大,因此在偏光板的製作過程中,亦會對光學膜材進行裁切,以調整膜材大小。然而,光學膜材的裁切過程中需要穩固地固定光學膜材,若光學膜材固定不當,則可能會干擾光學膜材的後續製程,甚至是造成光學膜片的損傷。After being manufactured, the polarizing plate usually needs to be cut to fit to various sizes of displays. In addition, due to the large difference between the incoming size of various optical film materials and the required size of the finished product, the optical film materials are also cut during the production process of the polarizer to adjust the film material size. However, the optical film material needs to be firmly fixed during the cutting process of the optical film material. If the optical film material is improperly fixed, it may interfere with the subsequent manufacturing process of the optical film material and even cause damage to the optical film.

因此,如何設計出可穩定地固定光學膜材以進行切割的切割設備,便是現今值得探討與解決之課題。Therefore, how to design a cutting device that can stably fix the optical film for cutting is a topic worthy of discussion and solution.

有鑑於此,本揭露提出一種切割設備,以解決上述之問題。In view of this, the present disclosure proposes a cutting device to solve the above-mentioned problems.

本揭露提供了一種切割墊,配置以承載一光學膜,切割墊包括至少一容置槽、以及至少一第一磁性元件,設置於容置槽內。當切割墊承載光學膜時,第一磁性元件與一第二磁性元件產生一磁吸力,以固定光學膜於切割墊上。The present disclosure provides a cutting pad configured to carry an optical film. The cutting pad includes at least one accommodating groove and at least one first magnetic element, which is arranged in the accommodating groove. When the cutting pad carries the optical film, the first magnetic element and the second magnetic element generate a magnetic attraction to fix the optical film on the cutting pad.

根據本揭露一些實施例,本揭露提供了一種切割設備,包括一切割墊、至少一個第二磁性元件以及一切割刀具。切割墊是配置以承載一光學膜,並且切割墊包括至少一容置槽、以及至少一第一磁性元件設置於容置槽內。第二磁性元件是配置以與第一磁性元件產生一磁吸力,以固定光學膜於切割墊上。切割刀具是配置以切割光學膜。According to some embodiments of the present disclosure, the present disclosure provides a cutting device including a cutting pad, at least one second magnetic element, and a cutting tool. The cutting pad is configured to carry an optical film, and the cutting pad includes at least one containing groove and at least one first magnetic element disposed in the containing groove. The second magnetic element is configured to generate a magnetic attraction with the first magnetic element to fix the optical film on the cutting pad. The cutting tool is configured to cut the optical film.

本揭露提供一種光學膜的切割方法,包括:設置一光學膜於一切割墊上,其中切割墊設置有複數個第一磁性元件;設置複數個第二磁性元件,配置以與這些第一磁性元件產生一磁吸力,以使光學膜固定於切割墊上;以及藉由一切割刀具切割光學膜。The present disclosure provides a method for cutting an optical film, including: arranging an optical film on a cutting pad, wherein the cutting pad is provided with a plurality of first magnetic elements; arranging a plurality of second magnetic elements, configured to produce A magnetic attraction is used to fix the optical film on the cutting mat; and the optical film is cut by a cutting tool.

本揭露提供一種切割設備以及切割墊,其中切割墊是配置以承載一光學膜,並且切割設備可包含複數個第一磁性元件以及複數個第二磁性元件。這些第一磁性元件設置於切割墊內,並且相對應之第二磁性元件設置於光學膜上並且與第一磁性元件產生磁吸力,以將光學膜固定於切割墊上。因此,在切割設備切割光學膜的過程中,前述磁性元件可以穩固地固定光學膜,以提高切割刀具的切割精確度,使得光學膜的切口更平整。The present disclosure provides a cutting device and a cutting pad, wherein the cutting pad is configured to carry an optical film, and the cutting device may include a plurality of first magnetic elements and a plurality of second magnetic elements. The first magnetic elements are arranged in the cutting mat, and the corresponding second magnetic elements are arranged on the optical film and generate a magnetic attraction with the first magnetic element to fix the optical film on the cutting mat. Therefore, in the process of cutting the optical film by the cutting device, the aforementioned magnetic element can firmly fix the optical film, so as to improve the cutting accuracy of the cutting tool and make the cut of the optical film more flat.

為了讓本揭露之目的、特徵、及優點能更明顯易懂,下文特舉實施例,並配合所附圖示做詳細說明。其中,實施例中的各元件之配置係為說明之用,並非用以限制本揭露。且實施例中圖式標號之部分重複,係為了簡化說明,並非意指不同實施例之間的關聯性。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本揭露。In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, the following embodiments are specially cited and are illustrated in detail with accompanying drawings. Wherein, the configuration of each element in the embodiment is for illustrative purposes, and is not intended to limit the disclosure. In addition, part of the repetition of the drawing symbols in the embodiments is for simplifying the description, and does not mean the relevance between different embodiments. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the disclosure.

必需了解的是,為特別描述或圖示之元件可以此技術人士所熟知之各種形式存在。此外,當某層在其它層或基板「上」時,有可能是指「直接」在其它層或基板上,或指某層在其它層或基板上,或指其它層或基板之間夾設其它層。It must be understood that the elements specifically described or illustrated can exist in various forms well known to those skilled in the art. In addition, when a layer is "on" other layers or substrates, it may mean "directly" on other layers or substrates, or that a layer is on other layers or substrates, or that it is sandwiched between other layers or substrates. Other layers.

此外,實施例中可能使用相對性的用語,例如「較低」或「底部」及「較高」或「頂部」,以描述圖示的一個元件對於另一元件的相對關係。能理解的是,如果將圖示的裝置翻轉使其上下顛倒,則所敘述在「較低」側的元件將會成為在「較高」側的元件。In addition, the embodiments may use relative terms, such as “lower” or “bottom” and “higher” or “top” to describe the relative relationship between one element of the illustration and another element. It can be understood that if the illustrated device is turned upside down, the elements described on the "lower" side will become elements on the "higher" side.

在此,「約」、「大約」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內。在此給定的數量為大約的數量,意即在沒有特定說明的情況下,仍可隱含「約」、「大約」之含義。Here, the terms "about" and "approximately" usually mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, which means that the meaning of "about" and "approximately" can still be implied without specific instructions.

請參考第1圖,第1圖為根據本揭露一實施例之一切割設備50之示意圖。如第1圖所示,切割設備50可包括一工作站台60、一切割刀具70以及一切割墊100。其中,一光學膜10係運送至切割設備50以進行切割,例如可藉由一送料單元(圖中未表示)運送至切割設備50。在一實施例中,光學膜10之形狀可為捲狀或片狀。Please refer to FIG. 1, which is a schematic diagram of a cutting device 50 according to an embodiment of the present disclosure. As shown in FIG. 1, the cutting device 50 may include a work station 60, a cutting knife 70 and a cutting mat 100. Among them, an optical film 10 is transported to the cutting device 50 for cutting, for example, can be transported to the cutting device 50 by a feeding unit (not shown in the figure). In an embodiment, the shape of the optical film 10 may be a roll or a sheet.

於此實施例中,切割墊100是配置以承載所述光學膜10。再者,工作站台60上可具有一夾持機構610,例如包含兩個夾持件611,配置以夾持切割墊100的一邊緣,並且夾持件611是配置以驅動切割墊100以及光學膜10沿著X軸方向移動至切割刀具70下方以進行切割。其中,工作站台60可具有一驅動馬達(圖中未表示),配置以控制夾持件611沿著各自的滑軌(圖中未表示)沿X軸方向移動,但夾持件611的驅動方式不限於此實施例。In this embodiment, the cutting pad 100 is configured to carry the optical film 10. Furthermore, the workstation table 60 may have a clamping mechanism 610, for example, including two clamping members 611 configured to clamp an edge of the cutting mat 100, and the clamping member 611 is configured to drive the cutting mat 100 and the optical film 10 moves along the X-axis direction below the cutting tool 70 to perform cutting. Among them, the workstation 60 may have a drive motor (not shown in the figure), which is configured to control the clamping member 611 to move along the X-axis along respective sliding rails (not shown in the diagram), but the driving mode of the clamping member 611 It is not limited to this embodiment.

切割刀具70是配置以切割光學膜10,並且於此實施例中,切割刀具70為一片狀刀具,配置以沿著光學膜10之一第一軸向(短軸方向)或一第二軸向(長軸方向)切割光學膜10。在第1圖中,切割刀具70是配置以沿著光學膜10的第一軸向(Y軸方向)切割光學膜10。The cutting knife 70 is configured to cut the optical film 10, and in this embodiment, the cutting knife 70 is a sheet-shaped knife, and is configured to be along a first axis (minor axis direction) or a second axis of the optical film 10 The optical film 10 is cut in the direction (long axis direction). In FIG. 1, the cutting blade 70 is arranged to cut the optical film 10 along the first axis (Y-axis direction) of the optical film 10.

在切割刀具70完成切割光學膜10之程序後,夾持機構610便會將光學膜10驅動至工作站台60的位置P1(如第1圖所示),以進行下一階段程序。After the cutting tool 70 completes the process of cutting the optical film 10, the clamping mechanism 610 drives the optical film 10 to the position P1 of the workstation table 60 (as shown in FIG. 1) to proceed to the next stage of the process.

在一實施例中,光學膜10可唯一單層或多層膜,例如可包含對光學之增益、配向、補償、轉向、直交、擴散、保護、防黏、耐刮、抗眩、反射抑制、高折射率等有所助益的膜,例如,可為偏光膜、離型膜、廣視角膜、增亮膜、反射膜、保護膜、具有控制視角補償或雙折射(birefraction)等特性的配向液晶膜、硬塗膜、抗反射膜、防黏膜、擴散膜、防眩膜等各種表面經處理的膜或上述之組合,但不限於此。In an embodiment, the optical film 10 may be a single-layer or multi-layer film, for example, may include optical gain, alignment, compensation, steering, orthogonality, diffusion, protection, anti-sticking, scratch resistance, anti-glare, reflection suppression, high Refractive index and other helpful films, for example, can be polarizing film, release film, wide viewing angle film, brightness enhancement film, reflective film, protective film, oriented liquid crystal with characteristics such as controlled viewing angle compensation or birefraction Films, hard coating films, anti-reflective films, anti-adhesive films, diffusion films, anti-glare films and other films with various surface treatments or combinations of the above, but not limited to these.

請參考第2圖,第2圖為根據本揭露一實施例之光學膜10的結構示意圖。光學膜10包括第一保護層11、第一覆蓋層12、偏光層13、第二覆蓋層14、黏膠層15及第二保護層16。偏光層13形成於第一覆蓋層12與第二覆蓋層14之間。第一保護層11設置於第一覆蓋層12上。黏膠層15設置於第二覆蓋層14與第二保護層16之間,用以於後續黏合至一液晶面板(圖未示)之上。在一實施例中,本發明實施例之光學膜10可為單層膜或為多層膜。例如,光學膜10可包含前述數個層結構之至少一層。Please refer to FIG. 2. FIG. 2 is a schematic diagram of the structure of the optical film 10 according to an embodiment of the present disclosure. The optical film 10 includes a first protective layer 11, a first covering layer 12, a polarizing layer 13, a second covering layer 14, an adhesive layer 15 and a second protective layer 16. The polarizing layer 13 is formed between the first covering layer 12 and the second covering layer 14. The first protective layer 11 is disposed on the first covering layer 12. The adhesive layer 15 is disposed between the second covering layer 14 and the second protective layer 16 for subsequent bonding to a liquid crystal panel (not shown). In one embodiment, the optical film 10 of the embodiment of the present invention may be a single-layer film or a multilayer film. For example, the optical film 10 may include at least one layer of the foregoing several layer structures.

第一覆蓋層12及第二覆蓋層14的材料可選自於由三醋酸纖維素(Triacetate Cellulose, TAC)、聚甲基丙烯酸甲酯(Polymethylmethacrylate, PMMA)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚丙稀(Polypropylene, PP)、環烯烴聚合物(Cyclo Olefin Polymer, COP)、聚碳酸酯(Polycarbonate, PC)或上述之任意組合所組成的一族群。The materials of the first covering layer 12 and the second covering layer 14 can be selected from triacetate cellulose (Triacetate Cellulose, TAC), polymethylmethacrylate (PMMA), polyethylene terephthalate ( Polyethylene Terephthalate (PET), Polypropylene (PP), Cyclo Olefin Polymer (COP), Polycarbonate (PC), or any combination of the above.

偏光層13可為吸附配向之二色性色素之聚乙烯醇(polyvinyl alcohol, PVA)薄膜或由液晶材料摻附具吸收染料分子所形成。聚乙烯醇可藉由皂化聚乙酸乙烯酯而形成。在一些實施例中,聚乙酸乙烯酯可為乙酸乙烯酯之單聚物或乙酸乙烯酯及其它單體之共聚物等。上述其它單體可為不飽和羧酸類、烯烴類、不飽和磺酸類或乙烯基醚類等。在另一些實施例中,聚乙烯醇可為經改質的聚乙烯醇,例如,經醛類改質的聚乙烯甲醛、聚乙烯乙醛或聚乙烯丁醛等。The polarizing layer 13 can be a polyvinyl alcohol (PVA) film that absorbs and aligns dichroic pigments or is formed by liquid crystal materials doped with absorbing dye molecules. Polyvinyl alcohol can be formed by saponifying polyvinyl acetate. In some embodiments, polyvinyl acetate may be a monomer of vinyl acetate or a copolymer of vinyl acetate and other monomers. The above-mentioned other monomers may be unsaturated carboxylic acids, olefins, unsaturated sulfonic acids, vinyl ethers, and the like. In other embodiments, the polyvinyl alcohol may be modified polyvinyl alcohol, for example, polyvinyl formaldehyde, polyvinyl acetaldehyde, or polyvinyl butyral modified by aldehydes.

第一保護層11可由聚酯樹脂、烯烴樹脂、乙酸纖維素樹脂、聚碳酸酯樹脂、丙烯酸樹脂、聚對苯二甲酸丁二酯(polyethylene terephthalate, PET)、聚乙烯(polyethylene, PE)或聚丙烯(Polypropylene, PP)、環烯烴樹脂或上述之組合,其中聚酯樹脂例如是聚對苯二甲酸乙二酯或聚萘二甲酸乙二酯,而丙烯酸樹脂例如是聚甲基丙烯酸甲酯(PMMA)。The first protective layer 11 can be made of polyester resin, olefin resin, cellulose acetate resin, polycarbonate resin, acrylic resin, polybutylene terephthalate (PET), polyethylene (PE) or poly Polypropylene (PP), cycloolefin resin or a combination of the above, wherein the polyester resin is for example polyethylene terephthalate or polyethylene naphthalate, and the acrylic resin is for example polymethyl methacrylate ( PMMA).

黏膠層15可由例如是(甲基)丙烯酸共聚物之材料製成,例如是可包含但不限於官能基的材料,如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯等材料。The adhesive layer 15 may be made of materials such as (meth)acrylic copolymers, such as materials that may contain but not limited to functional groups, such as methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Base) butyl acrylate, 2-ethylhexyl (meth)acrylate and other materials.

第二保護層16例如是離型層,其可例如是表面塗有離型劑的聚對苯二甲酸乙二醇酯薄膜,其中離型劑例如是但不限於矽樹脂。如此,第二保護層16容易自黏膠層15上撕除,以露出黏膠層15,使裁切後的光學膜10透過黏膠層15黏合至液晶面板(圖未示)。The second protective layer 16 is, for example, a release layer, which can be, for example, a polyethylene terephthalate film coated with a release agent, where the release agent is, for example, but not limited to, silicone resin. In this way, the second protective layer 16 is easily torn off from the adhesive layer 15 to expose the adhesive layer 15 so that the cut optical film 10 is bonded to the liquid crystal panel through the adhesive layer 15 (not shown).

請參考第3圖與第4圖,第3圖為根據本揭露一實施例之切割墊100以及光學膜10之上視圖,並且第4圖為本揭露一實施例之切割墊100以及光學膜10之側視圖。如第3圖與第4圖所示,光學膜10是設置於切割墊100上,並且切割墊100可包含一第一底板110以及一第二底板120,其中第一底板110是設置於第二底板120與光學膜10之間。Please refer to FIGS. 3 and 4. FIG. 3 is a top view of the cutting pad 100 and the optical film 10 according to an embodiment of the present disclosure, and FIG. 4 is a top view of the cutting pad 100 and the optical film 10 according to an embodiment of the present disclosure The side view. As shown in FIGS. 3 and 4, the optical film 10 is disposed on the cutting mat 100, and the cutting mat 100 may include a first base plate 110 and a second base plate 120, wherein the first base plate 110 is disposed on the second base plate. Between the bottom plate 120 and the optical film 10.

於此實施例中,如第4圖所示,切割墊100的第一底板110可形成至少四個容置槽ATS,並且切割設備50可更包含至少四個第一磁性元件30以及四個第二磁性元件40。其中,該些第一磁性元件30是分別設置於該些容置槽ATS中。第一磁性元件30與第二磁性元件40可為磁鐵,例如可選自鐵(Fe)、鈷(Co)、鎳(Ni)、不銹鋼、坡莫合金(permalloy)等材料及其任意組合,其中的不銹鋼例如為SUS430。In this embodiment, as shown in FIG. 4, the first bottom plate 110 of the cutting mat 100 may form at least four receiving slots ATS, and the cutting device 50 may further include at least four first magnetic elements 30 and four second magnetic elements 30 Two magnetic element 40. Wherein, the first magnetic elements 30 are respectively disposed in the accommodating grooves ATS. The first magnetic element 30 and the second magnetic element 40 can be magnets, for example, can be selected from materials such as iron (Fe), cobalt (Co), nickel (Ni), stainless steel, permalloy, and any combination thereof. The stainless steel is, for example, SUS430.

在切割墊100承載光學膜10時,該些第二磁性元件40是設置於光學膜10上並且對應於該些第一磁性元件30。如第3、4圖所示,該些第一磁性元件30與該些第二磁性元件40是設置鄰近於光學膜10的四個角落。When the cutting pad 100 carries the optical film 10, the second magnetic elements 40 are disposed on the optical film 10 and correspond to the first magnetic elements 30. As shown in FIGS. 3 and 4, the first magnetic elements 30 and the second magnetic elements 40 are arranged adjacent to the four corners of the optical film 10.

於是,該些第一磁性元件30與該些第二磁性元件40會產生一磁吸力,以使光學膜10穩固地固定於切割墊100上,以利於進行切割程序。Therefore, the first magnetic elements 30 and the second magnetic elements 40 generate a magnetic attraction force, so that the optical film 10 is firmly fixed on the cutting mat 100 to facilitate the cutting process.

值得注意的是,第一底板110具有一承載面111,抵接於光學膜10,並且第一磁性元件30的高度是等於或略低於承載面111,以確保光學膜10平坦地設置於承載面111上。It is worth noting that the first bottom plate 110 has a bearing surface 111 abutting on the optical film 10, and the height of the first magnetic element 30 is equal to or slightly lower than the bearing surface 111 to ensure that the optical film 10 is flatly arranged on the bearing surface 111面111上.

另外,容置槽ATS以及第一磁性元件30的設置位置不限於此實施例,例如容置槽ATS也可形成於第二底板120,配置以容置第一磁性元件30。In addition, the placement positions of the receiving slot ATS and the first magnetic element 30 are not limited to this embodiment. For example, the receiving slot ATS can also be formed on the second bottom plate 120 and configured to receive the first magnetic element 30.

於本揭露之一些實施例中,該些第一磁性元件30以及第二磁性元件40可利用防刮材質進行包覆,例如以無塵棉布包覆,以避免第一磁性元件30或第二磁性元件40對光學膜10的表面造成刮傷。In some embodiments of the present disclosure, the first magnetic element 30 and the second magnetic element 40 can be covered with a scratch-resistant material, such as a dust-free cotton cloth, to avoid the first magnetic element 30 or the second magnetic element. The element 40 causes scratches on the surface of the optical film 10.

於此實施例中,第一底板110或第二底板120的厚度可為0.05至2 mm,並且第一底板110較第二底板120軟,其中第一底板110的硬度可為40至80(依據JIS-K6253標準)。舉例來說,第一底板110與第二底板120的材料可為熱可塑性樹脂可包括纖維素樹脂(例如,三醋酸纖維素(triacetate cellulose,TAC)或二醋酸纖維素(diacetate cellulose,DAC))、丙烯酸樹脂(例如,聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA)、聚酯樹脂(例如,聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)或聚萘二甲酸乙二酯)、烯烴樹脂、聚碳酸酯樹脂、環烯烴樹脂、定向拉伸性聚丙烯(oriented-polypropylene,OPP)、聚乙烯(polyethylene,PE)、聚丙烯(polypropylene,PP)、環烯烴聚合物(cyclic olefin polymer,COP)、環烯烴共聚合物(cyclic olefin copolymer,COC)或前述之組合。再者,於其他實施例中,也可包含(甲基)丙烯酸系、胺基甲酸酯系、丙烯酸胺基甲酸酯系、環氧系、聚矽氧系等熱硬化性樹脂或紫外線硬化型樹脂。In this embodiment, the thickness of the first bottom plate 110 or the second bottom plate 120 may be 0.05 to 2 mm, and the first bottom plate 110 is softer than the second bottom plate 120, and the hardness of the first bottom plate 110 may be 40 to 80 (according to JIS-K6253 standard). For example, the material of the first bottom plate 110 and the second bottom plate 120 may be thermoplastic resin, which may include cellulose resin (for example, triacetate cellulose (TAC) or diacetate cellulose (DAC)) , Acrylic resin (for example, poly(methyl methacrylate), PMMA), polyester resin (for example, polyethylene terephthalate (PET) or polyethylene naphthalate) ), olefin resin, polycarbonate resin, cycloolefin resin, oriented-polypropylene (OPP), polyethylene (PE), polypropylene (PP), cyclic olefin polymer (cyclic olefin polymer (COP), cyclic olefin copolymer (COC) or a combination of the foregoing. Furthermore, in other embodiments, it may also include (meth)acrylic, urethane, and acrylic Thermosetting resins such as urethane-based, epoxy-based, and silicone-based resins or UV-curing resins.

接著,請同時參考第1圖、第3圖以及第5圖。第5圖為根據本揭露實施例之切割設備50的一旋轉機構旋轉切割墊100之示意圖。當第一磁性元件30以及第二磁性元件40穩固地將光學膜10固定於切割墊100上時,切割刀具70可沿著第3圖中之虛線L1切割光學膜10,使光學膜10的左右兩側切割出兩個邊料部10b。Next, please refer to Figure 1, Figure 3, and Figure 5 at the same time. FIG. 5 is a schematic diagram of a rotating mechanism of the cutting device 50 rotating the cutting mat 100 according to an embodiment of the disclosure. When the first magnetic element 30 and the second magnetic element 40 firmly fix the optical film 10 on the cutting mat 100, the cutting tool 70 can cut the optical film 10 along the dashed line L1 in Figure 3 so that the left and right sides of the optical film 10 Two side material parts 10b are cut on both sides.

其中,邊料部10b於X軸方向上的寬度可約為1cm。在某些實施例中,邊料部10b的寬度可縮小至5~10mm。再者,當切割刀具70切割光學膜10的精確度提高時,邊料部10b的寬度可為0。相較於在周圍以膠帶固定光學膜10而造成邊料部10b之寬度大於或等於膠帶寬度的傳統固定方式,本發明可縮小邊料部10b的寬度,減少邊料部10b之浪費。Wherein, the width of the edge material portion 10b in the X-axis direction may be about 1 cm. In some embodiments, the width of the margin portion 10b can be reduced to 5-10 mm. Furthermore, when the accuracy of cutting the optical film 10 by the cutting tool 70 is improved, the width of the margin portion 10b may be zero. Compared with the traditional fixing method in which the optical film 10 is fixed with adhesive tape around the periphery and the width of the margin portion 10b is greater than or equal to the width of the tape, the present invention can reduce the width of the margin portion 10b and reduce the waste of the margin portion 10b.

在切割刀具70沿著虛線L1切割完光學膜10後,如第5圖所示,工作站台60的旋轉機構620可配置以旋轉切割墊100。於此實施例中,旋轉機構620可為四個滾輪621,配置以接觸切割墊100之底面,因此當滾輪621旋轉時,便可驅動切割墊100繞一旋轉方向R1旋轉,以使切割墊100以及光學膜10的長軸方向平行於切割刀具70。於是,切割刀具70便可繼續沿著第3圖中的虛線L2切割光學膜10,以獲得六個矩形的主體部10a。After the cutting tool 70 finishes cutting the optical film 10 along the broken line L1, as shown in FIG. 5, the rotating mechanism 620 of the workstation table 60 can be configured to rotate the cutting mat 100. In this embodiment, the rotating mechanism 620 may be four rollers 621, which are configured to contact the bottom surface of the cutting mat 100. Therefore, when the roller 621 rotates, the cutting mat 100 can be driven to rotate in a rotation direction R1 to make the cutting mat 100 And the long axis direction of the optical film 10 is parallel to the cutting blade 70. Then, the cutting tool 70 can continue to cut the optical film 10 along the broken line L2 in FIG. 3 to obtain six rectangular main body portions 10a.

值得注意的是,當旋轉機構620旋轉切割墊100時,前述夾持件611可縮回工作站台60內,例如沿著Z軸方向縮回並低於工作站台60之一工作面601,以避免夾持件611干涉切割墊100之旋轉。It is worth noting that when the rotating mechanism 620 rotates the cutting mat 100, the aforementioned clamping member 611 can be retracted into the workstation table 60, for example, retracted along the Z-axis direction and lower than one of the working surfaces 601 of the workstation table 60 to avoid The clamp 611 interferes with the rotation of the cutting mat 100.

另外,在其他實施例中,切割刀具70可為一網格狀刀具,可同時沿著虛線L1以及虛線L2將光學膜10切割為複數個主體部10a,其中主體部10a可為一矩形片體。因此,於此實施例中,工作站台60中便可省略旋轉機構620。In addition, in other embodiments, the cutting tool 70 may be a grid-shaped tool, and the optical film 10 can be cut into a plurality of main body portions 10a along the dotted line L1 and the dotted line L2 at the same time, wherein the main body portion 10a may be a rectangular piece. . Therefore, in this embodiment, the rotating mechanism 620 can be omitted from the workstation 60.

在其他實施例中,切割刀具70可為一非矩形刀具,本發明不以此為限。In other embodiments, the cutting tool 70 may be a non-rectangular tool, and the invention is not limited thereto.

第6圖為根據本揭露另一實施例之第二底板120以及光學膜10之側視圖。於此實施例中,切割墊100可省略第一底板110。如第6圖所示,容置槽ATS是形成於第二底板120,並且第二底板120可具有一第一表面1201。其中,該些第一磁性元件30是設置於容置槽ATS內且鄰近於第一表面1201。FIG. 6 is a side view of the second substrate 120 and the optical film 10 according to another embodiment of the disclosure. In this embodiment, the cutting pad 100 can omit the first bottom plate 110. As shown in FIG. 6, the receiving groove ATS is formed on the second bottom plate 120, and the second bottom plate 120 may have a first surface 1201. Among them, the first magnetic elements 30 are disposed in the accommodating groove ATS and adjacent to the first surface 1201.

於此實施例中,可多設置兩個第一磁性元件30以及第二磁性元件40,對應於第3圖中位於中間的兩個主體部10a,因此可以更穩固地固定光學膜10於第二底板120上。In this embodiment, two more first magnetic elements 30 and second magnetic elements 40 can be provided, corresponding to the two main body portions 10a in the middle in Figure 3, so that the optical film 10 can be more firmly fixed to the second On the bottom plate 120.

請參考第7圖,第7圖為根據本揭露另一實施例之第二底板120以及光學膜10之側視圖。此實施例與第6圖之實施例相似,差異在於,此實施例中的第二底板120具有第一表面1201以及相對之一第二表面1202,並且容置槽ATS以及該些第一磁性元件30是鄰近於第二表面1202設置。於此實施例中,因為第一磁性元件30是鄰近於第二表面1202設置,可更避免第一磁性元件30對光學膜10造成傷害,例如刮傷。Please refer to FIG. 7, which is a side view of the second substrate 120 and the optical film 10 according to another embodiment of the disclosure. This embodiment is similar to the embodiment in FIG. 6, but the difference is that the second bottom plate 120 in this embodiment has a first surface 1201 and an opposite second surface 1202, and accommodates the slot ATS and the first magnetic elements 30 is disposed adjacent to the second surface 1202. In this embodiment, because the first magnetic element 30 is disposed adjacent to the second surface 1202, it can further prevent the first magnetic element 30 from causing damage to the optical film 10, such as scratches.

請參考第8圖,第8圖為根據本揭露另一實施例之第二底板120、光學膜10以及一控制裝置80之示意圖。此實施例與第7圖之實施例相似,差異在於,此實施例中的切割設備50可更包含一控制裝置80,並且該些第一磁性元件30A為電磁鐵。控制裝置80是配置以控制一部分或全部之第一磁性元件30A導電,以產生電磁力吸引相對應之第二磁性元件40,進而固定光學膜10。Please refer to FIG. 8, which is a schematic diagram of the second substrate 120, the optical film 10, and a control device 80 according to another embodiment of the present disclosure. This embodiment is similar to the embodiment in FIG. 7 except that the cutting device 50 in this embodiment may further include a control device 80, and the first magnetic elements 30A are electromagnets. The control device 80 is configured to control a part or all of the first magnetic element 30A to conduct electricity so as to generate electromagnetic force to attract the corresponding second magnetic element 40 to fix the optical film 10.

請參考第9圖,第9圖為根據本揭露另一實施例之切割墊100以及光學膜10之上視圖。於此實施例中,切割刀具70是可沿著虛線L1以及虛線L2將光學膜10切割為複數個主體部10a,並且可設置複數個第一、第二磁性元件,對應於該些主體部10a,以固定光學膜10。如第9圖所示,光學膜10可切割為九個主體部10a,並且切割設備50可設置九個第二磁性元件40,分別對應於該些主體部10a之位置,並且第一磁性元件(圖中未表示)對應於第二磁性元件40設置於切割墊100中。Please refer to FIG. 9, which is a top view of the cutting pad 100 and the optical film 10 according to another embodiment of the present disclosure. In this embodiment, the cutting tool 70 can cut the optical film 10 into a plurality of main body portions 10a along the broken line L1 and the broken line L2, and a plurality of first and second magnetic elements can be provided, corresponding to the main body portions 10a. , To fix the optical film 10. As shown in Fig. 9, the optical film 10 can be cut into nine main body parts 10a, and the cutting device 50 can be provided with nine second magnetic elements 40 corresponding to the positions of the main body parts 10a, and the first magnetic element ( (Not shown in the figure) corresponding to the second magnetic element 40 is provided in the cutting mat 100.

藉由此實施例之磁性元件的配置,可以使光學膜10更穩固地設置於切割墊100上,並且使切口更為平整。With the configuration of the magnetic element in this embodiment, the optical film 10 can be more stably placed on the cutting pad 100, and the cut can be made flatter.

第10圖為根據本揭露一實施例之光學膜的切割方法200的流程圖。在步驟202中,將一光學膜10設置於一切割墊100上,如第1圖所示。其中,如第3圖所示,切割墊100可包含第一底板110以及第二表面1202,並且複數個第一磁性元件30設置於第一底板110內。FIG. 10 is a flowchart of a method 200 for cutting an optical film according to an embodiment of the disclosure. In step 202, an optical film 10 is placed on a cutting pad 100, as shown in FIG. Wherein, as shown in FIG. 3, the cutting pad 100 may include a first bottom plate 110 and a second surface 1202, and a plurality of first magnetic elements 30 are disposed in the first bottom plate 110.

在步驟204中,如第3圖與第4圖所示,將複數個第二磁性元件40設置於光學膜10上,使得該些第二磁性元件40與相對應之該些第一磁性元件30產生一磁吸力,以使光學膜10定位於切割墊100上。其中,光學膜10是位於第一磁性元件30與第二磁性元件40之間。In step 204, as shown in FIGS. 3 and 4, a plurality of second magnetic elements 40 are disposed on the optical film 10, so that the second magnetic elements 40 and the corresponding first magnetic elements 30 A magnetic attraction force is generated to position the optical film 10 on the cutting pad 100. The optical film 10 is located between the first magnetic element 30 and the second magnetic element 40.

在步驟206中,藉由一切割刀具70切割光學膜10。在一些實施例中,切割刀具70可為一片狀刀具,並且切割光學膜10的步驟可更包含:(a)切割刀具70沿著平行於光學膜10之第一軸向切割光學膜10,例如沿著第3圖中的虛線L1進行切割;(b)藉由旋轉機構620旋轉切割墊100以及所承載之光學膜10;以及(c)切割刀具70沿著平行於光學膜10之第二軸向切割光學膜10,例如沿著第3圖中的虛線L2進行切割。其中,第一軸向是不平行於第二軸向。In step 206, the optical film 10 is cut by a cutting tool 70. In some embodiments, the cutting knife 70 may be a sheet-shaped knife, and the step of cutting the optical film 10 may further include: (a) the cutting knife 70 cuts the optical film 10 along a first axis parallel to the optical film 10, For example, cutting along the dotted line L1 in Figure 3; (b) rotating the cutting mat 100 and the optical film 10 carried by the rotating mechanism 620; and (c) cutting the cutter 70 along the second parallel to the optical film 10 The optical film 10 is cut in the axial direction, for example, along the broken line L2 in FIG. 3. Wherein, the first axis is not parallel to the second axis.

在其他實施例中,切割刀具70可為一網格狀刀具,並且切割刀具70可同時沿著第3圖中的虛線L1以及虛線L2將光學膜10切割為複數個主體部10a,以完成切割步驟。In other embodiments, the cutting tool 70 can be a grid-shaped tool, and the cutting tool 70 can simultaneously cut the optical film 10 into a plurality of body portions 10a along the dashed line L1 and the dashed line L2 in Figure 3 to complete the cutting step.

本揭露提供一種切割設備以及切割墊,其中切割墊是配置以承載一光學膜,並且切割設備可包含複數個第一磁性元件以及複數個第二磁性元件。該些第一磁性元件設置於切割墊內,並且相對應之第二磁性元件設置於光學膜上並且與第一磁性元件產生磁吸力,以將光學膜固定於切割墊上。因此,在切割設備切割光學膜的過程中,前述磁性元件可以穩固地固定光學膜,以提高切割刀具的切割精確度,使得光學膜的切口更平整。The present disclosure provides a cutting device and a cutting pad, wherein the cutting pad is configured to carry an optical film, and the cutting device may include a plurality of first magnetic elements and a plurality of second magnetic elements. The first magnetic elements are arranged in the cutting mat, and the corresponding second magnetic elements are arranged on the optical film and generate magnetic attraction with the first magnetic element to fix the optical film on the cutting mat. Therefore, in the process of cutting the optical film by the cutting device, the aforementioned magnetic element can firmly fix the optical film, so as to improve the cutting accuracy of the cutting tool and make the cut of the optical film more flat.

雖然本揭露的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作更動、替代與潤飾。此外,本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此,本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the manufacturing process, machinery, manufacturing, material composition, device, method, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content from this disclosure. It is understood that the current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of this disclosure includes the above-mentioned manufacturing processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes each patent application scope and a combination of embodiments.

10:光學膜10a:主體部10b:邊料部11:第一保護層12:第一覆蓋層13:偏光層14:第二覆蓋層15:黏膠層16:第二保護層30、30A:第一磁性元件40:第二磁性元件50:切割設備60:工作站台601:工作面610:夾持機構611:夾持件620:旋轉機構621:滾輪70:切割刀具80:控制裝置100:切割墊110:第一底板111:承載面120:第二底板1201:第一表面1202:第二表面200:切割方法202、204、206:步驟ATS:容置槽L1:虛線L2:虛線P1:位置R1:旋轉方向X:X軸Y:Y軸Z:Z軸10: Optical film 10a: Main part 10b: Side material part 11: First protective layer 12: First cover layer 13: Polarizing layer 14: Second cover layer 15: Adhesive layer 16: Second protective layer 30, 30A: The first magnetic element 40: the second magnetic element 50: cutting equipment 60: workstation table 601: working surface 610: clamping mechanism 611: clamping piece 620: rotating mechanism 621: roller 70: cutting tool 80: control device 100: cutting Pad 110: first bottom plate 111: bearing surface 120: second bottom plate 1201: first surface 1202: second surface 200: cutting methods 202, 204, 206: step ATS: containing groove L1: dotted line L2: dotted line P1: position R1: Rotation direction X: X axis Y: Y axis Z: Z axis

本揭露可藉由之後的詳細說明並配合圖示而得到清楚的了解。要強調的是,按照業界的標準做法,各種特徵並沒有按比例繪製,並且僅用於說明之目的。事實上,為了能夠清楚的說明,因此各種特徵的尺寸可能會任意地放大或者縮小。 第1圖為根據本揭露一實施例之一切割設備之示意圖。 第2圖為根據本揭露一實施例之光學膜的結構示意圖。 第3圖為根據本揭露一實施例之切割墊以及光學膜之上視圖。 第4圖為本揭露一實施例之切割墊以及光學膜之側視圖。 第5圖為根據本揭露實施例之切割設備的一旋轉機構旋轉切割墊之示意圖。 第6圖為根據本揭露另一實施例之第二底板以及光學膜之側視圖。 第7圖為根據本揭露另一實施例之第二底板以及光學膜之側視圖。 第8圖為根據本揭露另一實施例之第二底板、光學膜以及一控制裝置之示意圖。 第9圖為根據本揭露另一實施例之切割墊以及光學膜之上視圖。 第10圖為根據本揭露一實施例之光學膜的切割方法的流程圖。This disclosure can be clearly understood by following the detailed description and the illustrations. It should be emphasized that in accordance with industry standard practices, the various features are not drawn to scale and are used for illustrative purposes only. In fact, in order to be able to explain clearly, the size of various features may be arbitrarily enlarged or reduced. Figure 1 is a schematic diagram of a cutting device according to an embodiment of the disclosure. FIG. 2 is a schematic diagram of the structure of an optical film according to an embodiment of the disclosure. FIG. 3 is a top view of a cutting pad and an optical film according to an embodiment of the disclosure. FIG. 4 is a side view of the cutting pad and the optical film according to an embodiment of the disclosure. Fig. 5 is a schematic diagram of a rotating mechanism of a cutting device rotating a cutting mat according to an embodiment of the disclosure. FIG. 6 is a side view of the second substrate and the optical film according to another embodiment of the disclosure. FIG. 7 is a side view of the second substrate and the optical film according to another embodiment of the disclosure. FIG. 8 is a schematic diagram of a second substrate, an optical film, and a control device according to another embodiment of the disclosure. FIG. 9 is a top view of a cutting pad and an optical film according to another embodiment of the disclosure. FIG. 10 is a flowchart of an optical film cutting method according to an embodiment of the disclosure.

10:光學膜 10: Optical film

50:切割設備 50: cutting equipment

60:工作站台 60: workstation

610:夾持機構 610: clamping mechanism

611:夾持件 611: clamp

70:切割刀具 70: Cutting tool

100:切割墊 100: cutting mat

P1:位置 P1: location

X:X軸 X: X axis

Y:Y軸 Y: Y axis

Z:Z軸 Z: Z axis

Claims (13)

一種切割墊,配置以承載一光學膜,該切割墊包括:至少一容置槽;以及至少一第一磁性元件,設置於該容置槽內,其中該第一磁性元件的高度等於或略低於該切割墊之一承載面,其中該光學膜為一連續片體,該光學膜之多個側邊分別對應且鄰近於該切割墊之多個側邊,並且該承載面平坦地抵接於該光學膜之底面;其中當該切割墊承載該光學膜時,該第一磁性元件與一第二磁性元件產生一磁吸力,以固定該光學膜於該切割墊上。 A cutting pad configured to carry an optical film, the cutting pad comprising: at least one accommodating groove; and at least one first magnetic element arranged in the accommodating groove, wherein the height of the first magnetic element is equal to or slightly lower On a supporting surface of the cutting mat, wherein the optical film is a continuous sheet, the sides of the optical film are corresponding to and adjacent to the sides of the cutting mat, and the supporting surface is flat against The bottom surface of the optical film; wherein when the cutting pad carries the optical film, the first magnetic element and a second magnetic element generate a magnetic attraction to fix the optical film on the cutting pad. 如申請專利範圍第1項之切割墊,其中該切割墊的材料包含三醋酸纖維素(TAC)、二醋酸纖維素(DAC)、聚甲基丙烯酸甲酯(PMMA)、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯、烯烴樹脂、聚碳酸酯樹脂(PC)、環烯烴樹脂、定向拉伸性聚丙烯(OPP)、聚乙烯(PE)、聚丙烯(PP)、環烯烴聚合物(COP)、環烯烴共聚合物(COC)、胺基甲酸酯(PU)、丙烯酸胺基甲酸酯、環氧樹脂、聚矽氧樹脂、或上述之任意組合。 For example, the cutting mat of the first item of the scope of patent application, wherein the material of the cutting mat includes cellulose triacetate (TAC), cellulose diacetate (DAC), polymethylmethacrylate (PMMA), polyethylene terephthalate Diester (PET), polyethylene naphthalate, olefin resin, polycarbonate resin (PC), cycloolefin resin, oriented stretchable polypropylene (OPP), polyethylene (PE), polypropylene (PP) , Cyclic olefin polymer (COP), cyclic olefin copolymer (COC), urethane (PU), acrylic urethane, epoxy resin, silicone resin, or any combination of the above. 一種切割設備,包括:一切割墊,配置以承載一光學膜,該切割墊包括:複數個容置槽;以及複數個第一磁性元件,分別設置於該些容置槽中; 複數個第二磁性元件,配置以與該些第一磁性元件產生一磁吸力,以固定該光學膜於該切割墊上;以及一切割刀具,配置以將該光學膜切割為複數個主體部,其中該些第一磁性元件是分別對應於該些主體部之位置設置;其中該光學膜為一連續片體,該光學膜之多個側邊分別對應且鄰近於該切割墊之多個側邊,並且該切割墊之一承載面平坦地抵接於該光學膜之底面。 A cutting device includes: a cutting pad configured to carry an optical film, the cutting pad including: a plurality of accommodating grooves; and a plurality of first magnetic elements, respectively arranged in the accommodating grooves; A plurality of second magnetic elements are configured to generate a magnetic attraction with the first magnetic elements to fix the optical film on the cutting mat; and a cutting tool is configured to cut the optical film into a plurality of main body parts, wherein The first magnetic elements are respectively arranged corresponding to the positions of the main body parts; wherein the optical film is a continuous sheet, and the sides of the optical film are respectively corresponding to and adjacent to the sides of the cutting pad, And a bearing surface of the cutting pad flatly abuts against the bottom surface of the optical film. 如申請專利範圍第3項之切割設備,其中該些第一磁性元件中的四個,對應於該光學膜之四個角落設置。 For example, the cutting device of item 3 of the scope of patent application, wherein four of the first magnetic elements are arranged corresponding to the four corners of the optical film. 如申請專利範圍第3項之切割設備,其中該切割墊具有一第一表面以及相對之一第二表面,並且該些第一磁性元件鄰近於該第一表面或該第二表面。 For example, the cutting device of the third item of the scope of patent application, wherein the cutting pad has a first surface and an opposite second surface, and the first magnetic elements are adjacent to the first surface or the second surface. 如申請專利範圍第3項之切割設備,其中該切割墊包含一第一底板以及一第二底板,該第一底板設置於該第二底板與該光學膜之間,且該些第一磁性元件設置於該第一底板或該第二底板。 For example, the cutting device of item 3 of the scope of patent application, wherein the cutting pad includes a first base plate and a second base plate, the first base plate is disposed between the second base plate and the optical film, and the first magnetic elements Set on the first bottom plate or the second bottom plate. 如申請專利範圍第3項之切割設備,其中該切割刀具為一片狀刀具,配置以沿著該光學膜之一第一軸向或一第二軸向切割該光學膜,或該切割刀具為一網格狀刀具,配置以將該光學膜切割為複數個主體部。 For example, the cutting device of item 3 of the scope of patent application, wherein the cutting tool is a piece-shaped tool configured to cut the optical film along a first axis or a second axis of the optical film, or the cutting tool is A mesh cutter is configured to cut the optical film into a plurality of main body parts. 如申請專利範圍第3項之切割設備,其中該切割設備包含一控制裝置,並且該控制裝置配置以控制至少一部分的該些第一磁性元件導電以產生電磁力。 For example, the cutting device of the third item of the scope of patent application, wherein the cutting device includes a control device, and the control device is configured to control the conduction of at least a part of the first magnetic elements to generate electromagnetic force. 一種光學膜的切割方法,包括:設置一光學膜於一切割墊上,其中該切割墊設置有複數個第一磁性元件,其中該光學膜為一連續片體,該光學膜之多個側邊分別對應且鄰近於該切割墊之多個側邊,並且該切割墊之一承載面平坦地抵接於該光學膜之底面;設置複數個第二磁性元件,配置以與該些第一磁性元件產生一磁吸力,以使該光學膜固定於該切割墊上;以及藉由一切割刀具切割該光學膜,以將該光學膜切割為複數個主體部,其中該些第一磁性元件是分別對應於該些主體部之位置設置。 A method for cutting an optical film includes: disposing an optical film on a cutting mat, wherein the cutting mat is provided with a plurality of first magnetic elements, wherein the optical film is a continuous sheet, and the sides of the optical film are respectively Corresponding to and adjacent to a plurality of sides of the cutting pad, and a bearing surface of the cutting pad flatly abuts against the bottom surface of the optical film; a plurality of second magnetic elements are arranged to be configured to interact with the first magnetic elements A magnetic attraction is used to fix the optical film on the cutting mat; and the optical film is cut by a cutting tool to cut the optical film into a plurality of main body parts, wherein the first magnetic elements are respectively corresponding to the The position of the main body is set. 如申請專利範圍第9項之光學膜的切割方法,其中藉由該切割刀具切割該光學膜之步驟包含:沿著平行於該光學膜之一第一軸向切割該光學膜,其中該切割刀具為一片狀刀具。 For example, the method for cutting the optical film of claim 9, wherein the step of cutting the optical film by the cutting tool includes: cutting the optical film along a first axis parallel to the optical film, wherein the cutting tool It is a piece of knife. 如申請專利範圍第10項之光學膜的切割方法,其中藉由該切割刀具切割該光學膜之步驟更包含:藉由一旋轉機構旋轉該光學膜;以及 沿著平行於該光學膜之一第二軸向切割該光學膜,其中該第一軸向不平行於該第二軸向。 For example, the optical film cutting method of claim 10, wherein the step of cutting the optical film by the cutting tool further includes: rotating the optical film by a rotating mechanism; and The optical film is cut along a second axis parallel to the optical film, wherein the first axis is not parallel to the second axis. 如申請專利範圍第9項之光學膜的切割方法,其中該切割刀具為一網格狀刀具。 For example, the optical film cutting method of item 9 of the scope of patent application, wherein the cutting tool is a grid-shaped tool. 如申請專利範圍第9項之光學膜的切割方法,其中該切割墊不具有用以容置該光學膜之容置槽。 For example, the optical film cutting method of item 9 of the scope of patent application, wherein the cutting pad does not have a receiving groove for receiving the optical film.
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