TWI710443B - Cutting mat, cutting apparatus, and cutting method for optical film - Google Patents

Abstract

A cutting apparatus is provided and includes a cutting mat, at least one second magnetic element and a cutting tool. The cutting mat is configured to support an optical film, and the cutting mat includes at least one accommodating groove and at least one first magnetic element disposed in the accommodating groove. The second magnetic element is configured to act with the first magnetic element to generate a magnetic attraction force so as to secure the optical film on the cutting mat. The cutting tool is configured to cut the optical film.

Description

Cutting mat, cutting equipment and optical film cutting method

The present disclosure relates to a cutting device, and particularly to a cutting device that uses magnetic elements for fixing.

Polarizers are optical components that are widely used in liquid crystal displays. With the increasing application of liquid crystal displays, such as mobile phones, wearable devices, etc., the requirements for the quality of polarizers are also increasing.

After being manufactured, the polarizing plate usually needs to be cut to fit to various sizes of displays. In addition, due to the large difference between the incoming size of various optical film materials and the required size of the finished product, the optical film materials are also cut during the production process of the polarizer to adjust the film material size. However, the optical film material needs to be firmly fixed during the cutting process of the optical film material. If the optical film material is improperly fixed, it may interfere with the subsequent manufacturing process of the optical film material and even cause damage to the optical film.

Therefore, how to design a cutting device that can stably fix the optical film for cutting is a topic worthy of discussion and solution.

In view of this, the present disclosure proposes a cutting device to solve the above-mentioned problems.

The present disclosure provides a cutting pad configured to carry an optical film. The cutting pad includes at least one accommodating groove and at least one first magnetic element, which is arranged in the accommodating groove. When the cutting pad carries the optical film, the first magnetic element and the second magnetic element generate a magnetic attraction to fix the optical film on the cutting pad.

According to some embodiments of the present disclosure, the present disclosure provides a cutting device including a cutting pad, at least one second magnetic element, and a cutting tool. The cutting pad is configured to carry an optical film, and the cutting pad includes at least one containing groove and at least one first magnetic element disposed in the containing groove. The second magnetic element is configured to generate a magnetic attraction with the first magnetic element to fix the optical film on the cutting pad. The cutting tool is configured to cut the optical film.

The present disclosure provides a method for cutting an optical film, including: arranging an optical film on a cutting pad, wherein the cutting pad is provided with a plurality of first magnetic elements; arranging a plurality of second magnetic elements, configured to produce A magnetic attraction is used to fix the optical film on the cutting mat; and the optical film is cut by a cutting tool.

The present disclosure provides a cutting device and a cutting pad, wherein the cutting pad is configured to carry an optical film, and the cutting device may include a plurality of first magnetic elements and a plurality of second magnetic elements. The first magnetic elements are arranged in the cutting mat, and the corresponding second magnetic elements are arranged on the optical film and generate a magnetic attraction with the first magnetic element to fix the optical film on the cutting mat. Therefore, in the process of cutting the optical film by the cutting device, the aforementioned magnetic element can firmly fix the optical film, so as to improve the cutting accuracy of the cutting tool and make the cut of the optical film more flat.

In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, the following embodiments are specially cited and are illustrated in detail with accompanying drawings. Wherein, the configuration of each element in the embodiment is for illustrative purposes, and is not intended to limit the disclosure. In addition, part of the repetition of the drawing symbols in the embodiments is for simplifying the description, and does not mean the relevance between different embodiments. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the disclosure.

It must be understood that the elements specifically described or illustrated can exist in various forms well known to those skilled in the art. In addition, when a layer is "on" other layers or substrates, it may mean "directly" on other layers or substrates, or that a layer is on other layers or substrates, or that it is sandwiched between other layers or substrates. Other layers.

In addition, the embodiments may use relative terms, such as “lower” or “bottom” and “higher” or “top” to describe the relative relationship between one element of the illustration and another element. It can be understood that if the illustrated device is turned upside down, the elements described on the "lower" side will become elements on the "higher" side.

Here, the terms "about" and "approximately" usually mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, which means that the meaning of "about" and "approximately" can still be implied without specific instructions.

Please refer to FIG. 1, which is a schematic diagram of a cutting device 50 according to an embodiment of the present disclosure. As shown in FIG. 1, the cutting device 50 may include a work station 60, a cutting knife 70 and a cutting mat 100. Among them, an optical film 10 is transported to the cutting device 50 for cutting, for example, can be transported to the cutting device 50 by a feeding unit (not shown in the figure). In an embodiment, the shape of the optical film 10 may be a roll or a sheet.

In this embodiment, the cutting pad 100 is configured to carry the optical film 10. Furthermore, the workstation table 60 may have a clamping mechanism 610, for example, including two clamping members 611 configured to clamp an edge of the cutting mat 100, and the clamping member 611 is configured to drive the cutting mat 100 and the optical film 10 moves along the X-axis direction below the cutting tool 70 to perform cutting. Among them, the workstation 60 may have a drive motor (not shown in the figure), which is configured to control the clamping member 611 to move along the X-axis along respective sliding rails (not shown in the diagram), but the driving mode of the clamping member 611 It is not limited to this embodiment.

The cutting knife 70 is configured to cut the optical film 10, and in this embodiment, the cutting knife 70 is a sheet-shaped knife, and is configured to be along a first axis (minor axis direction) or a second axis of the optical film 10 The optical film 10 is cut in the direction (long axis direction). In FIG. 1, the cutting blade 70 is arranged to cut the optical film 10 along the first axis (Y-axis direction) of the optical film 10.

After the cutting tool 70 completes the process of cutting the optical film 10, the clamping mechanism 610 drives the optical film 10 to the position P1 of the workstation table 60 (as shown in FIG. 1) to proceed to the next stage of the process.

In an embodiment, the optical film 10 may be a single-layer or multi-layer film, for example, may include optical gain, alignment, compensation, steering, orthogonality, diffusion, protection, anti-sticking, scratch resistance, anti-glare, reflection suppression, high Refractive index and other helpful films, for example, can be polarizing film, release film, wide viewing angle film, brightness enhancement film, reflective film, protective film, oriented liquid crystal with characteristics such as controlled viewing angle compensation or birefraction Films, hard coating films, anti-reflective films, anti-adhesive films, diffusion films, anti-glare films and other films with various surface treatments or combinations of the above, but not limited to these.

Please refer to FIG. 2. FIG. 2 is a schematic diagram of the structure of the optical film 10 according to an embodiment of the present disclosure. The optical film 10 includes a first protective layer 11, a first covering layer 12, a polarizing layer 13, a second covering layer 14, an adhesive layer 15 and a second protective layer 16. The polarizing layer 13 is formed between the first covering layer 12 and the second covering layer 14. The first protective layer 11 is disposed on the first covering layer 12. The adhesive layer 15 is disposed between the second covering layer 14 and the second protective layer 16 for subsequent bonding to a liquid crystal panel (not shown). In one embodiment, the optical film 10 of the embodiment of the present invention may be a single-layer film or a multilayer film. For example, the optical film 10 may include at least one layer of the foregoing several layer structures.

The materials of the first covering layer 12 and the second covering layer 14 can be selected from triacetate cellulose (Triacetate Cellulose, TAC), polymethylmethacrylate (PMMA), polyethylene terephthalate ( Polyethylene Terephthalate (PET), Polypropylene (PP), Cyclo Olefin Polymer (COP), Polycarbonate (PC), or any combination of the above.

The polarizing layer 13 can be a polyvinyl alcohol (PVA) film that absorbs and aligns dichroic pigments or is formed by liquid crystal materials doped with absorbing dye molecules. Polyvinyl alcohol can be formed by saponifying polyvinyl acetate. In some embodiments, polyvinyl acetate may be a monomer of vinyl acetate or a copolymer of vinyl acetate and other monomers. The above-mentioned other monomers may be unsaturated carboxylic acids, olefins, unsaturated sulfonic acids, vinyl ethers, and the like. In other embodiments, the polyvinyl alcohol may be modified polyvinyl alcohol, for example, polyvinyl formaldehyde, polyvinyl acetaldehyde, or polyvinyl butyral modified by aldehydes.

The first protective layer 11 can be made of polyester resin, olefin resin, cellulose acetate resin, polycarbonate resin, acrylic resin, polybutylene terephthalate (PET), polyethylene (PE) or poly Polypropylene (PP), cycloolefin resin or a combination of the above, wherein the polyester resin is for example polyethylene terephthalate or polyethylene naphthalate, and the acrylic resin is for example polymethyl methacrylate ( PMMA).

The adhesive layer 15 may be made of materials such as (meth)acrylic copolymers, such as materials that may contain but not limited to functional groups, such as methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Base) butyl acrylate, 2-ethylhexyl (meth)acrylate and other materials.

The second protective layer 16 is, for example, a release layer, which can be, for example, a polyethylene terephthalate film coated with a release agent, where the release agent is, for example, but not limited to, silicone resin. In this way, the second protective layer 16 is easily torn off from the adhesive layer 15 to expose the adhesive layer 15 so that the cut optical film 10 is bonded to the liquid crystal panel through the adhesive layer 15 (not shown).

Please refer to FIGS. 3 and 4. FIG. 3 is a top view of the cutting pad 100 and the optical film 10 according to an embodiment of the present disclosure, and FIG. 4 is a top view of the cutting pad 100 and the optical film 10 according to an embodiment of the present disclosure The side view. As shown in FIGS. 3 and 4, the optical film 10 is disposed on the cutting mat 100, and the cutting mat 100 may include a first base plate 110 and a second base plate 120, wherein the first base plate 110 is disposed on the second base plate. Between the bottom plate 120 and the optical film 10.

In this embodiment, as shown in FIG. 4, the first bottom plate 110 of the cutting mat 100 may form at least four receiving slots ATS, and the cutting device 50 may further include at least four first magnetic elements 30 and four second magnetic elements 30 Two magnetic element 40. Wherein, the first magnetic elements 30 are respectively disposed in the accommodating grooves ATS. The first magnetic element 30 and the second magnetic element 40 can be magnets, for example, can be selected from materials such as iron (Fe), cobalt (Co), nickel (Ni), stainless steel, permalloy, and any combination thereof. The stainless steel is, for example, SUS430.

When the cutting pad 100 carries the optical film 10, the second magnetic elements 40 are disposed on the optical film 10 and correspond to the first magnetic elements 30. As shown in FIGS. 3 and 4, the first magnetic elements 30 and the second magnetic elements 40 are arranged adjacent to the four corners of the optical film 10.

Therefore, the first magnetic elements 30 and the second magnetic elements 40 generate a magnetic attraction force, so that the optical film 10 is firmly fixed on the cutting mat 100 to facilitate the cutting process.

It is worth noting that the first bottom plate 110 has a bearing surface 111 abutting on the optical film 10, and the height of the first magnetic element 30 is equal to or slightly lower than the bearing surface 111 to ensure that the optical film 10 is flatly arranged on the bearing surface 111面111上.

In addition, the placement positions of the receiving slot ATS and the first magnetic element 30 are not limited to this embodiment. For example, the receiving slot ATS can also be formed on the second bottom plate 120 and configured to receive the first magnetic element 30.

In some embodiments of the present disclosure, the first magnetic element 30 and the second magnetic element 40 can be covered with a scratch-resistant material, such as a dust-free cotton cloth, to avoid the first magnetic element 30 or the second magnetic element. The element 40 causes scratches on the surface of the optical film 10.

In this embodiment, the thickness of the first bottom plate 110 or the second bottom plate 120 may be 0.05 to 2 mm, and the first bottom plate 110 is softer than the second bottom plate 120, and the hardness of the first bottom plate 110 may be 40 to 80 (according to JIS-K6253 standard). For example, the material of the first bottom plate 110 and the second bottom plate 120 may be thermoplastic resin, which may include cellulose resin (for example, triacetate cellulose (TAC) or diacetate cellulose (DAC)) , Acrylic resin (for example, poly(methyl methacrylate), PMMA), polyester resin (for example, polyethylene terephthalate (PET) or polyethylene naphthalate) ), olefin resin, polycarbonate resin, cycloolefin resin, oriented-polypropylene (OPP), polyethylene (PE), polypropylene (PP), cyclic olefin polymer (cyclic olefin polymer (COP), cyclic olefin copolymer (COC) or a combination of the foregoing. Furthermore, in other embodiments, it may also include (meth)acrylic, urethane, and acrylic Thermosetting resins such as urethane-based, epoxy-based, and silicone-based resins or UV-curing resins.

Next, please refer to Figure 1, Figure 3, and Figure 5 at the same time. FIG. 5 is a schematic diagram of a rotating mechanism of the cutting device 50 rotating the cutting mat 100 according to an embodiment of the disclosure. When the first magnetic element 30 and the second magnetic element 40 firmly fix the optical film 10 on the cutting mat 100, the cutting tool 70 can cut the optical film 10 along the dashed line L1 in Figure 3 so that the left and right sides of the optical film 10 Two side material parts 10b are cut on both sides.

Wherein, the width of the edge material portion 10b in the X-axis direction may be about 1 cm. In some embodiments, the width of the margin portion 10b can be reduced to 5-10 mm. Furthermore, when the accuracy of cutting the optical film 10 by the cutting tool 70 is improved, the width of the margin portion 10b may be zero. Compared with the traditional fixing method in which the optical film 10 is fixed with adhesive tape around the periphery and the width of the margin portion 10b is greater than or equal to the width of the tape, the present invention can reduce the width of the margin portion 10b and reduce the waste of the margin portion 10b.

After the cutting tool 70 finishes cutting the optical film 10 along the broken line L1, as shown in FIG. 5, the rotating mechanism 620 of the workstation table 60 can be configured to rotate the cutting mat 100. In this embodiment, the rotating mechanism 620 may be four rollers 621, which are configured to contact the bottom surface of the cutting mat 100. Therefore, when the roller 621 rotates, the cutting mat 100 can be driven to rotate in a rotation direction R1 to make the cutting mat 100 And the long axis direction of the optical film 10 is parallel to the cutting blade 70. Then, the cutting tool 70 can continue to cut the optical film 10 along the broken line L2 in FIG. 3 to obtain six rectangular main body portions 10a.

It is worth noting that when the rotating mechanism 620 rotates the cutting mat 100, the aforementioned clamping member 611 can be retracted into the workstation table 60, for example, retracted along the Z-axis direction and lower than one of the working surfaces 601 of the workstation table 60 to avoid The clamp 611 interferes with the rotation of the cutting mat 100.

In addition, in other embodiments, the cutting tool 70 may be a grid-shaped tool, and the optical film 10 can be cut into a plurality of main body portions 10a along the dotted line L1 and the dotted line L2 at the same time, wherein the main body portion 10a may be a rectangular piece. . Therefore, in this embodiment, the rotating mechanism 620 can be omitted from the workstation 60.

In other embodiments, the cutting tool 70 may be a non-rectangular tool, and the invention is not limited thereto.

FIG. 6 is a side view of the second substrate 120 and the optical film 10 according to another embodiment of the disclosure. In this embodiment, the cutting pad 100 can omit the first bottom plate 110. As shown in FIG. 6, the receiving groove ATS is formed on the second bottom plate 120, and the second bottom plate 120 may have a first surface 1201. Among them, the first magnetic elements 30 are disposed in the accommodating groove ATS and adjacent to the first surface 1201.

In this embodiment, two more first magnetic elements 30 and second magnetic elements 40 can be provided, corresponding to the two main body portions 10a in the middle in Figure 3, so that the optical film 10 can be more firmly fixed to the second On the bottom plate 120.

Please refer to FIG. 7, which is a side view of the second substrate 120 and the optical film 10 according to another embodiment of the disclosure. This embodiment is similar to the embodiment in FIG. 6, but the difference is that the second bottom plate 120 in this embodiment has a first surface 1201 and an opposite second surface 1202, and accommodates the slot ATS and the first magnetic elements 30 is disposed adjacent to the second surface 1202. In this embodiment, because the first magnetic element 30 is disposed adjacent to the second surface 1202, it can further prevent the first magnetic element 30 from causing damage to the optical film 10, such as scratches.

Please refer to FIG. 8, which is a schematic diagram of the second substrate 120, the optical film 10, and a control device 80 according to another embodiment of the present disclosure. This embodiment is similar to the embodiment in FIG. 7 except that the cutting device 50 in this embodiment may further include a control device 80, and the first magnetic elements 30A are electromagnets. The control device 80 is configured to control a part or all of the first magnetic element 30A to conduct electricity so as to generate electromagnetic force to attract the corresponding second magnetic element 40 to fix the optical film 10.

Please refer to FIG. 9, which is a top view of the cutting pad 100 and the optical film 10 according to another embodiment of the present disclosure. In this embodiment, the cutting tool 70 can cut the optical film 10 into a plurality of main body portions 10a along the broken line L1 and the broken line L2, and a plurality of first and second magnetic elements can be provided, corresponding to the main body portions 10a. , To fix the optical film 10. As shown in Fig. 9, the optical film 10 can be cut into nine main body parts 10a, and the cutting device 50 can be provided with nine second magnetic elements 40 corresponding to the positions of the main body parts 10a, and the first magnetic element ( (Not shown in the figure) corresponding to the second magnetic element 40 is provided in the cutting mat 100.

With the configuration of the magnetic element in this embodiment, the optical film 10 can be more stably placed on the cutting pad 100, and the cut can be made flatter.

FIG. 10 is a flowchart of a method 200 for cutting an optical film according to an embodiment of the disclosure. In step 202, an optical film 10 is placed on a cutting pad 100, as shown in FIG. Wherein, as shown in FIG. 3, the cutting pad 100 may include a first bottom plate 110 and a second surface 1202, and a plurality of first magnetic elements 30 are disposed in the first bottom plate 110.

In step 204, as shown in FIGS. 3 and 4, a plurality of second magnetic elements 40 are disposed on the optical film 10, so that the second magnetic elements 40 and the corresponding first magnetic elements 30 A magnetic attraction force is generated to position the optical film 10 on the cutting pad 100. The optical film 10 is located between the first magnetic element 30 and the second magnetic element 40.

In step 206, the optical film 10 is cut by a cutting tool 70. In some embodiments, the cutting knife 70 may be a sheet-shaped knife, and the step of cutting the optical film 10 may further include: (a) the cutting knife 70 cuts the optical film 10 along a first axis parallel to the optical film 10, For example, cutting along the dotted line L1 in Figure 3; (b) rotating the cutting mat 100 and the optical film 10 carried by the rotating mechanism 620; and (c) cutting the cutter 70 along the second parallel to the optical film 10 The optical film 10 is cut in the axial direction, for example, along the broken line L2 in FIG. 3. Wherein, the first axis is not parallel to the second axis.

In other embodiments, the cutting tool 70 can be a grid-shaped tool, and the cutting tool 70 can simultaneously cut the optical film 10 into a plurality of body portions 10a along the dashed line L1 and the dashed line L2 in Figure 3 to complete the cutting step.

The present disclosure provides a cutting device and a cutting pad, wherein the cutting pad is configured to carry an optical film, and the cutting device may include a plurality of first magnetic elements and a plurality of second magnetic elements. The first magnetic elements are arranged in the cutting mat, and the corresponding second magnetic elements are arranged on the optical film and generate magnetic attraction with the first magnetic element to fix the optical film on the cutting mat. Therefore, in the process of cutting the optical film by the cutting device, the aforementioned magnetic element can firmly fix the optical film, so as to improve the cutting accuracy of the cutting tool and make the cut of the optical film more flat.

Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the manufacturing process, machinery, manufacturing, material composition, device, method, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content from this disclosure. It is understood that the current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of this disclosure includes the above-mentioned manufacturing processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes each patent application scope and a combination of embodiments.

10: Optical film 10a: Main part 10b: Side material part 11: First protective layer 12: First cover layer 13: Polarizing layer 14: Second cover layer 15: Adhesive layer 16: Second protective layer 30, 30A: The first magnetic element 40: the second magnetic element 50: cutting equipment 60: workstation table 601: working surface 610: clamping mechanism 611: clamping piece 620: rotating mechanism 621: roller 70: cutting tool 80: control device 100: cutting Pad 110: first bottom plate 111: bearing surface 120: second bottom plate 1201: first surface 1202: second surface 200: cutting methods 202, 204, 206: step ATS: containing groove L1: dotted line L2: dotted line P1: position R1: Rotation direction X: X axis Y: Y axis Z: Z axis

This disclosure can be clearly understood by following the detailed description and the illustrations. It should be emphasized that in accordance with industry standard practices, the various features are not drawn to scale and are used for illustrative purposes only. In fact, in order to be able to explain clearly, the size of various features may be arbitrarily enlarged or reduced. Figure 1 is a schematic diagram of a cutting device according to an embodiment of the disclosure. FIG. 2 is a schematic diagram of the structure of an optical film according to an embodiment of the disclosure. FIG. 3 is a top view of a cutting pad and an optical film according to an embodiment of the disclosure. FIG. 4 is a side view of the cutting pad and the optical film according to an embodiment of the disclosure. Fig. 5 is a schematic diagram of a rotating mechanism of a cutting device rotating a cutting mat according to an embodiment of the disclosure. FIG. 6 is a side view of the second substrate and the optical film according to another embodiment of the disclosure. FIG. 7 is a side view of the second substrate and the optical film according to another embodiment of the disclosure. FIG. 8 is a schematic diagram of a second substrate, an optical film, and a control device according to another embodiment of the disclosure. FIG. 9 is a top view of a cutting pad and an optical film according to another embodiment of the disclosure. FIG. 10 is a flowchart of an optical film cutting method according to an embodiment of the disclosure.

10: Optical film

50: cutting equipment

60: workstation

610: clamping mechanism

611: clamp

70: Cutting tool

100: cutting mat

P1: location

X: X axis

Y: Y axis

Z: Z axis

Claims (13)

A cutting pad configured to carry an optical film, the cutting pad comprising: at least one accommodating groove; and at least one first magnetic element arranged in the accommodating groove, wherein the height of the first magnetic element is equal to or slightly lower On a supporting surface of the cutting mat, wherein the optical film is a continuous sheet, the sides of the optical film are corresponding to and adjacent to the sides of the cutting mat, and the supporting surface is flat against The bottom surface of the optical film; wherein when the cutting pad carries the optical film, the first magnetic element and a second magnetic element generate a magnetic attraction to fix the optical film on the cutting pad. For example, the cutting mat of the first item of the scope of patent application, wherein the material of the cutting mat includes cellulose triacetate (TAC), cellulose diacetate (DAC), polymethylmethacrylate (PMMA), polyethylene terephthalate Diester (PET), polyethylene naphthalate, olefin resin, polycarbonate resin (PC), cycloolefin resin, oriented stretchable polypropylene (OPP), polyethylene (PE), polypropylene (PP) , Cyclic olefin polymer (COP), cyclic olefin copolymer (COC), urethane (PU), acrylic urethane, epoxy resin, silicone resin, or any combination of the above. A cutting device includes: a cutting pad configured to carry an optical film, the cutting pad including: a plurality of accommodating grooves; and a plurality of first magnetic elements, respectively arranged in the accommodating grooves; A plurality of second magnetic elements are configured to generate a magnetic attraction with the first magnetic elements to fix the optical film on the cutting mat; and a cutting tool is configured to cut the optical film into a plurality of main body parts, wherein The first magnetic elements are respectively arranged corresponding to the positions of the main body parts; wherein the optical film is a continuous sheet, and the sides of the optical film are respectively corresponding to and adjacent to the sides of the cutting pad, And a bearing surface of the cutting pad flatly abuts against the bottom surface of the optical film. For example, the cutting device of item 3 of the scope of patent application, wherein four of the first magnetic elements are arranged corresponding to the four corners of the optical film. For example, the cutting device of the third item of the scope of patent application, wherein the cutting pad has a first surface and an opposite second surface, and the first magnetic elements are adjacent to the first surface or the second surface. For example, the cutting device of item 3 of the scope of patent application, wherein the cutting pad includes a first base plate and a second base plate, the first base plate is disposed between the second base plate and the optical film, and the first magnetic elements Set on the first bottom plate or the second bottom plate. For example, the cutting device of item 3 of the scope of patent application, wherein the cutting tool is a piece-shaped tool configured to cut the optical film along a first axis or a second axis of the optical film, or the cutting tool is A mesh cutter is configured to cut the optical film into a plurality of main body parts. For example, the cutting device of the third item of the scope of patent application, wherein the cutting device includes a control device, and the control device is configured to control the conduction of at least a part of the first magnetic elements to generate electromagnetic force. A method for cutting an optical film includes: disposing an optical film on a cutting mat, wherein the cutting mat is provided with a plurality of first magnetic elements, wherein the optical film is a continuous sheet, and the sides of the optical film are respectively Corresponding to and adjacent to a plurality of sides of the cutting pad, and a bearing surface of the cutting pad flatly abuts against the bottom surface of the optical film; a plurality of second magnetic elements are arranged to be configured to interact with the first magnetic elements A magnetic attraction is used to fix the optical film on the cutting mat; and the optical film is cut by a cutting tool to cut the optical film into a plurality of main body parts, wherein the first magnetic elements are respectively corresponding to the The position of the main body is set. For example, the method for cutting the optical film of claim 9, wherein the step of cutting the optical film by the cutting tool includes: cutting the optical film along a first axis parallel to the optical film, wherein the cutting tool It is a piece of knife. For example, the optical film cutting method of claim 10, wherein the step of cutting the optical film by the cutting tool further includes: rotating the optical film by a rotating mechanism; and The optical film is cut along a second axis parallel to the optical film, wherein the first axis is not parallel to the second axis. For example, the optical film cutting method of item 9 of the scope of patent application, wherein the cutting tool is a grid-shaped tool. For example, the optical film cutting method of item 9 of the scope of patent application, wherein the cutting pad does not have a receiving groove for receiving the optical film.

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