TWI710416B - Method for using laser to sinter and coat polymer material on metal surface - Google Patents

Method for using laser to sinter and coat polymer material on metal surface Download PDF

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TWI710416B
TWI710416B TW108125657A TW108125657A TWI710416B TW I710416 B TWI710416 B TW I710416B TW 108125657 A TW108125657 A TW 108125657A TW 108125657 A TW108125657 A TW 108125657A TW I710416 B TWI710416 B TW I710416B
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polymer material
material powder
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TW202103822A (en
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陳天青
宋寰欣
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精鐳光電科技股份有限公司
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Abstract

本創作揭露一種利用雷射將高分子材料燒結披覆於金屬表面的方法,其包含:a. 透過球磨機將複數高分子材料粉末之粒徑研磨至40-90μm;b. 以雷射源聚焦掃描一金屬基材,於該金屬基材表面上產生複數微結構,其中,雷射之脈衝頻率係為 0.5-0.75kHz;及c. 透過鋪粉系統,將該等高分子材料粉末鋪展於該金屬基材表面,並以雷射作為熱輻射光源,直接照射於鋪有該等高分子材料粉末之該金屬基材上進行燒結。This creation discloses a method of using a laser to sinter and coat a polymer material on a metal surface, which includes: a. Grind the particle size of the polymer material powder to 40-90μm through a ball mill; b. Focus and scan with a laser source A metal substrate, generating a plurality of microstructures on the surface of the metal substrate, wherein the pulse frequency of the laser is 0.5-0.75kHz; and c. spreading the polymer material powder on the metal through a powder spreading system The surface of the substrate is directly irradiated on the metal substrate covered with the polymer powders for sintering by using a laser as a heat radiation source.

Description

利用雷射將高分子材料燒結披覆於金屬表面的方法Method for using laser to sinter and coat polymer material on metal surface

本創作係屬於高分子材料燒結之領域,尤其是一種利用雷射將高分子材料燒結披覆於金屬表面,並提高高分子材料於金屬表面之附著性的方法This creation belongs to the field of polymer material sintering, especially a method of using laser to sinter and coat polymer materials on metal surfaces and improve the adhesion of polymer materials to metal surfaces.

按,隨著智慧製造,綠色能源與環保議題等持續發酵,智慧製造,太陽能,綠色照明,電動車等產業便開始重視功率模組管理方面的發展,其製造工藝漸漸朝向高功率,體積小與薄型化發展。因此,為了能同時兼具向輕薄短小與運輸方便,高密度,高功率,高傳輸速度與高效率等需求,封裝技術與相對應的封裝材料之散熱效能則是不可被忽視之問題 。According to, with the continuous fermentation of smart manufacturing, green energy and environmental protection issues, smart manufacturing, solar energy, green lighting, electric vehicles and other industries have begun to pay attention to the development of power module management, and their manufacturing processes are gradually moving toward high power, small size and Thinning development. Therefore, in order to simultaneously meet the requirements of lightness, thinness, shortness and convenient transportation, high density, high power, high transmission speed and high efficiency, the heat dissipation efficiency of packaging technology and corresponding packaging materials is a problem that cannot be ignored.

並且,由於選擇性雷射燒結對於高分子材料,金屬,陶瓷以及複合材料具有可快速成型製造的優勢.因此常見的導熱材料種類如金屬材料,陶瓷材料以及高分子材料,而金屬材料和陶瓷材料基於散熱之考量將面臨下列問題: 1.     金屬材料的耐化學腐蝕性與電絕緣性差,無法滿足電絕緣場合和化學腐蝕場合的散熱需求。 2.     無機陶瓷材料雖然絕緣性好,但加工成型成本高,抗衝擊性差。 另一方面雖然石墨材料導熱優良,但是絕緣性和機械性質差。 Moreover, because selective laser sintering has the advantage of rapid prototyping and manufacturing for polymer materials, metals, ceramics and composite materials. Therefore, common types of thermal conductive materials such as metal materials, ceramic materials and polymer materials, and metal materials and ceramic materials based on heat dissipation considerations will face the following problems: 1. Metal materials have poor chemical resistance and electrical insulation, which cannot meet the heat dissipation requirements of electrical insulation and chemical corrosion occasions. 2. Although inorganic ceramic materials have good insulation properties, they have high processing costs and poor impact resistance. On the other hand, although graphite materials have excellent thermal conductivity, they have poor insulation and mechanical properties.

因此,上述的導熱材料都各自因為自身的性能使得在微電子封裝、電器絕緣、LED照明方面等工業技術發展上受到侷限,而高分子材料則是具有良好的機械性質與抗疲勞性能,卓越的電絕緣性與耐化學腐蝕性,重量輕而被廣泛的應用。Therefore, the above-mentioned thermally conductive materials are limited in the development of industrial technologies such as microelectronic packaging, electrical insulation, and LED lighting due to their own properties, while polymer materials have good mechanical properties and fatigue resistance, and are excellent Electrical insulation and chemical resistance, light weight and widely used.

高分子材料中又以熱塑性塑膠最具有發展性,其中最具代表性的為聚醯胺俗稱尼龍(Nylon),英文名稱Polyamide(簡稱PA),是分子主鏈上含有重複醯胺基團—[NHCO]—的熱塑性樹脂總稱,其係廣泛應用於汽車和電子行業,以替代金屬,目的是製造更輕、更便宜的零組件。同時,尼龍為高分子材料中具有高的Tg 玻璃轉化溫度~220 oC,高熔點溫度~250 oC與低的熱膨脹係數2.7~7.2×10 -5/K並且具有耐高溫與優異的耐化學腐蝕性與高絕緣性。但是,就散熱性質考量,尼龍之導熱係數約0.29k/W/(m.K)實不具有良好的散熱能力,因此,產業多以混合金屬,陶瓷或是碳材粉末的製作為解決方法。 Among the polymer materials, thermoplastics have the most development. The most representative one is polyamide, commonly known as nylon (Nylon), and its English name is Polyamide (PA), which contains repeating amide groups on the main chain of the molecule—[ NHCO]—The general term for thermoplastic resins, which are widely used in the automotive and electronic industries to replace metals, with the goal of making lighter and cheaper components. At the same time, nylon is a polymer material with high Tg glass transition temperature ~ 220 o C, high melting point temperature ~ 250 o C and low thermal expansion coefficient 2.7 ~ 7.2×10 -5 /K, and has high temperature resistance and excellent chemical resistance. Corrosion and high insulation. However, considering the heat dissipation properties, the thermal conductivity of nylon is about 0.29k/W/(m.K) and does not have a good heat dissipation capacity. Therefore, the industry mostly uses mixed metal, ceramic or carbon powder production as a solution.

然而,為了將高分子材料披覆於金屬基材上,兩著之間的結合往往因為熔點溫度相差太大,導致結合時往往兩個材料的結合強度不佳,致使高分子材料與金屬材料之間的附著性極差。另一方面,高分子材料由於本身對於光纖雷射的吸收率低,因此,大多是透過CO 2雷射進行燒結,但是, CO 2雷射傳輸介質為空氣,僅能直線傳輸,必須依賴反射鏡改變傳輸方向,因此,易受外界環境影響,需要經常對反射鏡進行維護與保養。 However, in order to coat the polymer material on the metal substrate, the bonding between the two materials is often due to the large difference in melting point temperature. As a result, the bonding strength of the two materials is often poor when combined, resulting in the difference between the polymer material and the metal material. The adhesion between them is extremely poor. On the other hand, polymer materials have a low absorption rate for fiber lasers, so most of them are sintered through CO 2 lasers. However, the transmission medium of CO 2 lasers is air, which can only be transmitted in a straight line and must rely on mirrors. Change the transmission direction, therefore, it is susceptible to the influence of the external environment, and the reflector needs to be maintained and maintained frequently.

有鑑於此,本發明人感其未臻完善而竭其心智苦心研究,並憑其從事該項產業多年之累積經驗,進而提供一種利用雷射將高分子材料燒結披覆於金屬表面的方法,以期可以改善上述習知技術之缺失。In view of this, the inventor felt that it was not perfect and exhausted his mind and painstaking research. Based on his accumulated experience in this industry for many years, he provided a method for sintering and coating polymer materials on metal surfaces by laser. In order to improve the lack of the above-mentioned conventional technology.

本發明之一目的,旨在提供一種利用雷射將高分子材料燒結披覆於金屬表面的方法,以提升高分子材料在燒結披覆於金屬表面時之附著性。One objective of the present invention is to provide a method for sintering and coating polymer materials on metal surfaces by using lasers to improve the adhesion of polymer materials when sintering and coating on metal surfaces.

於是,本創作揭露一種利用雷射將高分子材料燒結披覆於金屬表面的方法,其包含:a. 透過球磨機將複數高分子材料粉末之粒徑研磨至40-90μm;b. 以雷射源聚焦掃描一金屬基材,於該金屬基材表面上產生複數微結構,其中,雷射之脈衝頻率係為 0.5-0.75kHz;及c. 透過鋪粉系統,將該等高分子材料粉末鋪展於該金屬基材表面,並以雷射作為熱輻射光源,直接照射於鋪有該等高分子材料粉末之該金屬基材上進行燒結。Therefore, this creation discloses a method of using lasers to sinter and coat polymer materials on metal surfaces, which includes: a. Grinding the particle size of the polymer powders to 40-90μm through a ball mill; b. Using a laser source Focus and scan a metal substrate to produce multiple microstructures on the surface of the metal substrate. The pulse frequency of the laser is 0.5-0.75kHz; and c. Spread the polymer material powder on The surface of the metal substrate uses a laser as a heat radiation source to directly irradiate the metal substrate covered with the polymer material powders for sintering.

較佳者,該等高分子材料粉末之材質係為聚乳酸(PLA)、樹脂(ABS)、聚醯胺(尼龍)-6、聚醯胺(PA)66(Nylon-66)、聚乙烯醇(PVA)、聚苯乙烯(PS)、壓克力(PMMA) 之其中之一。Preferably, the material of the polymer powder is polylactic acid (PLA), resin (ABS), polyamide (nylon)-6, polyamide (PA) 66 (Nylon-66), polyvinyl alcohol (PVA), polystyrene (PS), acrylic (PMMA) one of them.

較佳者,該等高分子材料粉末之材質係為尼龍基混合銅、鋁、鋅、金、銀、鐵和鎳之其中之一,而形成之混合高分子材料粉末。Preferably, the material of the polymer material powder is a nylon-based mixed polymer material powder formed by mixing one of copper, aluminum, zinc, gold, silver, iron, and nickel.

較佳者,該等高分子材料粉末之材質係為尼龍基混合氧化鋁、氮化鋁、氮化矽、碳化矽、氧化鎂和二氧化矽之其中之一,而形成之混合高分子材料粉末。Preferably, the material of the polymer material powder is one of nylon-based mixed alumina, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, and silicon dioxide to form a mixed polymer material powder .

較佳者,該等微結構係為間隔排列,且該等微結構間之距離為1mm。Preferably, the microstructures are arranged at intervals, and the distance between the microstructures is 1mm.

較佳者,該金屬基材之材質係為鐵基、鎳基、鈷基、鉻基、鉬基、鋁基和銅基金屬之一或其合金材料。Preferably, the material of the metal substrate is one of iron-based, nickel-based, cobalt-based, chromium-based, molybdenum-based, aluminum-based, and copper-based metals, or an alloy material thereof.

較佳者,雷射之波長範圍係為400 nm~11000nm。Preferably, the wavelength range of the laser is 400 nm to 11000 nm.

較佳者,該高分子材料粉末燒結完成後厚度係為0.2-10 mm。Preferably, the thickness of the polymer material powder after sintering is 0.2-10 mm.

如此一來,透過本發明所提供之方法,就能利用雷射將高分子材料逐層燒結披覆於金屬基材上且不容易脫落,進而提升高分子材料之附著性,以滿足各種產業於金屬材料表面披覆高分子材料的需求。In this way, through the method provided by the present invention, the polymer material can be sintered and coated on the metal substrate layer by layer by laser without being easy to fall off, thereby improving the adhesion of the polymer material to meet the requirements of various industries. The surface of metal materials needs to be coated with polymer materials.

為使 貴審查委員能清楚了解本發明之內容,謹以下列說明搭配圖式,敬請參閱。In order to enable your reviewer to understand the content of the present invention clearly, please refer to the following description and drawings.

請參閱第1圖至第3圖,其係為本創作較佳實施例之步驟圖、雷射燒結裝置示意圖和金屬基材與高分子材料粉末燒結後示意圖。如圖所示,本創作揭露一種利用雷射將高分子材料燒結披覆於金屬表面的方法,其係先透過球磨機將複數高分子材料粉末3之粒徑研磨至40-90μm(步驟S01),其中,該等高分子材料粉末3之材質係為聚乳酸(PLA)、樹脂(ABS)、聚醯胺(尼龍)-6、聚醯胺(PA)66(Nylon-66)、聚乙烯醇(PVA)、聚苯乙烯(PS)、壓克力(PMMA)或是尼龍基混合銅、鋁、鋅、金、銀、鐵、鎳、氧化鋁、氮化鋁、氮化矽、碳化矽、氧化鎂和二氧化矽之其中之一,而在本實施例中係以尼龍作為示例,但並不以此為限,且在本實施例中所使用之雷射係以光纖雷射作為實驗基礎,但亦可以為CO 2雷射,並不以為限。 Please refer to Figures 1 to 3, which are the steps of the creation of the preferred embodiment, the schematic diagram of the laser sintering device, and the schematic diagram of the metal substrate and polymer powder after sintering. As shown in the figure, this creation discloses a method of using a laser to sinter and coat a polymer material on a metal surface. It first grinds the particle size of the polymer material powder 3 to 40-90 μm through a ball mill (step S01). Among them, the material of the polymer powder 3 is polylactic acid (PLA), resin (ABS), polyamide (nylon)-6, polyamide (PA) 66 (Nylon-66), polyvinyl alcohol ( PVA), polystyrene (PS), acrylic (PMMA) or nylon based mixed copper, aluminum, zinc, gold, silver, iron, nickel, aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, oxide One of magnesium and silicon dioxide. In this embodiment, nylon is used as an example, but it is not limited to this. The laser used in this embodiment is based on an optical fiber laser. However, it can also be a CO 2 laser and is not limited.

接著,再以雷射源1透過光纖2傳輸聚焦掃描一金屬基材4,於該金屬基材4表面上產生複數微結構41(步驟S02),其中,在本實施例中,該等微結構41係為間隔排列,且該等微結構41間之距離d為1mm,如第3圖所示,而所使用的光纖雷射之脈衝頻率係為 0.5-0.75kHz,脈衝寬度750μs,波長範圍係為400 nm~11000nm,功率150W,掃描速度20mm/s,掃瞄範圍100mm × 100mm。並且,該金屬基材4之材質可為鐵基、鎳基、鈷基、鉻基、鉬基、鋁基和銅基金屬之一或其合金材料,在本實施例中係利用不銹鋼作為示例,但並不以此為限。Then, the laser source 1 is transmitted through the optical fiber 2 to focus and scan a metal substrate 4 to produce a plurality of microstructures 41 on the surface of the metal substrate 4 (step S02). In this embodiment, the microstructures 41 is arranged at intervals, and the distance d between the microstructures 41 is 1mm, as shown in Figure 3. The pulse frequency of the fiber laser used is 0.5-0.75kHz, the pulse width is 750μs, and the wavelength range is It is 400 nm~11000nm, power 150W, scanning speed 20mm/s, scanning range 100mm × 100mm. Moreover, the material of the metal substrate 4 can be one of iron-based, nickel-based, cobalt-based, chromium-based, molybdenum-based, aluminum-based, and copper-based metals or alloy materials thereof. In this embodiment, stainless steel is used as an example, but Not limited to this.

最後,透過鋪粉系統,將該等高分子材料粉末3鋪展於該金屬基材4表面,並以光纖雷射作為熱輻射光源,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結(步驟S03),而該高分子材料粉末3燒結完成後厚度t可達0.2-10 mm。Finally, through the powder spreading system, the polymer material powder 3 is spread on the surface of the metal substrate 4, and an optical fiber laser is used as a heat radiation source to directly irradiate the metal substrate on which the polymer material powder 3 is spread. Sintering is performed on the material 4 (step S03), and the thickness t of the polymer material powder 3 can reach 0.2-10 mm after sintering.

以下係提供多個不同之實施例,並請配合參閱第4圖及下表1,其係為本創作較佳實施例之各實施例中雷射表面處理產生之微結構光學影像和各實施例之附著面積數據表。The following provides a number of different embodiments, and please refer to Figure 4 and Table 1 below, which are the microstructured optical images produced by the laser surface treatment in the various embodiments of the preferred embodiments and the various embodiments The attached area data sheet.

實施例1Example 1

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.04375 kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(a)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm, 脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 0.04375 kHz, pulse width 750μs, and scanning range of 100×100 mm 2 , the stainless steel metal substrate 4 is surface-treated, and these microstructures 41 are generated on the surface, as shown in part (a) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例2Example 2

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.0875kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(b)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 0.0875kHz, pulse width 750μs, and scanning range of 100×100 mm 2, the surface treatment of the metal base material 4 of stainless steel will produce these microstructures 41 on the surface, as shown in part (b) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例3Example 3

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.175kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(c)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 0.175kHz, pulse width of 750μs, and scanning range of 100×100 mm 2, the surface treatment of the metal base material 4 of stainless steel will produce these microstructures 41 on the surface, as shown in part (c) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例4Example 4

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.25kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(d)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 0.25kHz, pulse width 750μs, and scanning range of 100×100 mm 2 , the stainless steel metal substrate 4 is surface treated, and the microstructures 41 are generated on the surface, as shown in part (d) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例5Example 5

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.5kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(e)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the condition of 0.5kHz, pulse width of 750μs, and scanning range of 100×100 mm 2, the surface treatment of the metal substrate 4 of stainless steel will produce the microstructures 41 on the surface, as shown in part (e) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例6Example 6

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 0.75kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(f)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 0.75kHz, pulse width 750μs, and scanning range of 100×100 mm 2 , the metal substrate 4 of stainless steel is surface treated, and the microstructures 41 are generated on the surface, as shown in part (f) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation light source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 condition of the scanning range, for direct exposure to 4 covered with powder of such polymer material of the metal substrate 3 Sintering, and the sintering thickness t is set to 1 mm.

實施例7Example 7

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 1kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(g)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 1kHz, pulse width 750μs, and scanning range of 100×100 mm 2 , the metal substrate 4 of stainless steel is surface treated, and these microstructures 41 are generated on the surface, as shown in part (g) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 range of scanning conditions, direct exposure to the sintering covered with polymer material powder 4 such that the metal substrate 3 , And the sintering thickness t is set to 1 mm.

實施例8Example 8

本實施例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,再以光纖雷射功率150W,掃描速度20mm/s,掃描間距1mm,脈衝頻率 2kHz,脈衝寬度750μs,掃瞄範圍100×100 mm 2之條件下對不銹鋼之該金屬基材4進行表面處理,而於表面產生該等微結構41,就如第4圖之(h)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於經表面處理之後的該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度t係設定為1 mm。 The detailed experimental procedure of this embodiment is to first grind the particle size of the polymer material powder 3 of nylon to 40-90μm through a ball mill, and then use a fiber laser power of 150W, a scanning speed of 20mm/s, a scanning distance of 1mm, and a pulse frequency Under the conditions of 2kHz, pulse width 750μs, and scanning range of 100×100 mm 2 , the stainless steel metal substrate 4 is surface treated, and these microstructures 41 are generated on the surface, as shown in part (h) of Figure 4 As shown, the polymer material powder 3 is spread on the surface-treated metal substrate 4 through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation source, and the scanning speed is 70 mm / s, scanning pitch 0.025mm, 0.75KHz pulse frequency, pulse width of 500μs, 100 × 100 mm 2 range of scanning conditions, direct exposure to the sintering covered with polymer material powder 4 such that the metal substrate 3 , And the sintering thickness t is set to 1 mm.

對照例Control example

本對照例之詳細實驗步驟為先透過球磨機將尼龍之該等高分子材料粉末3之粒徑研磨至40-90μm,而並不針對不銹鋼之該金屬基材4表面做任何處理,就如第4圖之(i)部分所示,之後透過鋪粉系統,將該等高分子材料粉末3鋪展於沒有任何處理之該金屬基材4之上,再以光纖雷射20-100W作為熱輻射光源,且在掃描速度70 mm/s,掃描間距0.025mm,脈衝頻率 0.75kHz, 脈衝寬度500μs,掃瞄範圍100×100 mm 2之條件下,直接照射於鋪有該等高分子材料粉末3之該金屬基材4上進行燒結,而燒結厚度係設定為1 mm。 The detailed experimental procedure of this comparative example is to first grind the particle size of the polymer material powder 3 of nylon to 40-90 μm through a ball mill, and no treatment is performed on the surface of the metal substrate 4 of stainless steel, as in the fourth As shown in part (i) of the figure, the polymer material powder 3 is spread on the metal substrate 4 without any treatment through the powder spreading system, and then the optical fiber laser 20-100W is used as the heat radiation source. And under the conditions of a scanning speed of 70 mm/s, a scanning distance of 0.025 mm, a pulse frequency of 0.75 kHz, a pulse width of 500 μs, and a scanning range of 100×100 mm 2 , it is directly irradiated on the metal covered with the polymer powder 3 Sintering is performed on the substrate 4, and the sintering thickness is set to 1 mm.

表1 組別 脈衝頻率 脈衝寬度 雷射功率 掃描速度 掃描間距 附著面積 實施例 1 0.04375 kHz 750μs 150 W 20mm/s 1mm 0% 實施例 2 0.0875 kHz 750μs 150 W 20mm/s 1mm 0% 實施例 3 0.175 kHz 750μs 150 W 20mm/s 1mm 0% 實施例 4 0.25 kHz 750μs 150 W 20mm/s 1mm 0% 實施例 5 0.5 kHz 750μs 150 W 20mm/s 1mm 66% 實施例 6 0.75 kHz 750μs 150 W 20mm/s 1mm 90% 實施例 7 1.0 kHz 750μs 150 W 20mm/s 1mm 0% 實施例 8 2.0 kHz 750μs 150 W 20mm/s 1mm 0% 對照例 - - - - - 0% Table 1 Group Pulse frequency Pulse Width Laser power Scan speed Scan pitch Attachment area Example 1 0.04375 kHz 750μs 150 W 20mm/s 1mm 0% Example 2 0.0875 kHz 750μs 150 W 20mm/s 1mm 0% Example 3 0.175 kHz 750μs 150 W 20mm/s 1mm 0% Example 4 0.25 kHz 750μs 150 W 20mm/s 1mm 0% Example 5 0.5 kHz 750μs 150 W 20mm/s 1mm 66% Example 6 0.75 kHz 750μs 150 W 20mm/s 1mm 90% Example 7 1.0 kHz 750μs 150 W 20mm/s 1mm 0% Example 8 2.0 kHz 750μs 150 W 20mm/s 1mm 0% Control example - - - - - 0%

從上述之數據中可以看出依照實施例5和實施例6的實驗步驟所做出之燒結披覆製程在高分子之附著性上有顯著地提升,亦即當該金屬基材4正在產生該等微結構41之過程中,光纖雷射之脈衝頻率必須在0.5~0.75kHz之間,該等高分子材料粉末3才能有效地附著在該金屬基材4上,而由此數據表也可以證明在本發明所提供之條件下已解決習知雷射之缺陷,確實能提升高分子在金屬上之附著性,且厚度還能夠到達1 mm以上,以顯示本發明所提供之方法具有其優異性。From the above data, it can be seen that the sintering coating process made according to the experimental steps of Example 5 and Example 6 has a significant improvement in the adhesion of the polymer, that is, when the metal substrate 4 is producing the In the process of waiting for the microstructure 41, the pulse frequency of the fiber laser must be between 0.5 and 0.75 kHz, so that the polymer material powder 3 can be effectively attached to the metal substrate 4, and the data sheet can also prove Under the conditions provided by the present invention, the defects of conventional lasers have been solved, and the adhesion of polymers to metals can be improved, and the thickness can reach more than 1 mm, which shows that the method provided by the present invention has its advantages .

惟,以上所述者,僅為本發明之較佳實施例而已,並非用以限定本創作實施之範圍;故在不脫離本發明之精神與範圍下所作之均等變化與修飾,皆應涵蓋於本發明之專利範圍內。However, the above are only the preferred embodiments of the present invention, and are not used to limit the scope of implementation of this creation; therefore, the equivalent changes and modifications made without departing from the spirit and scope of the present invention should be covered in Within the scope of the patent of the present invention.

1:雷射源 2:光纖 3:高分子材料粉末 4:金屬基材 41:微結構 S01~S03:步驟 d:間距 t:厚度 1: Laser source 2: optical fiber 3: Polymer material powder 4: Metal substrate 41: Microstructure S01~S03: steps d: spacing t: thickness

第1圖,為本創作較佳實施例之步驟圖。 第2圖,為本創作較佳實施例之雷射燒結裝置示意圖。 第3圖,為本創作較佳實施例之金屬基材與高分子材料粉末燒結後示意圖。 第4圖,為本創作較佳實施例之各實施例中雷射表面處理產生之微結構光學影像。 Figure 1 is a diagram of the steps of creating a preferred embodiment. Figure 2 is a schematic diagram of a laser sintering device according to a preferred embodiment of the creation. Figure 3 is a schematic diagram of the sintered metal substrate and polymer powder of the preferred embodiment of the creation. Figure 4 is the optical image of the microstructure produced by the laser surface treatment in each embodiment of the creation of the preferred embodiment.

S01~S03:步驟 S01~S03: steps

Claims (9)

一種利用雷射將高分子材料燒結披覆於金屬表面的方法,其包含:a.透過球磨機將複數高分子材料粉末之粒徑研磨至40-90μm;b.以雷射源聚焦掃描一金屬基材,於該金屬基材表面上產生複數微結構,其中,雷射之脈衝頻率係為0.5-0.75kHz,脈衝寬度750μs,雷射功率150W,掃描速度20mm/s,掃描間距1mm;及c.透過鋪粉系統,將該等高分子材料粉末鋪展於該金屬基材表面,並以雷射20-100W作為熱輻射光源,且在脈衝寬度500μs,掃描速度70mm/s,掃描間距0.025mm,脈衝頻率0.75kHz之條件下,直接照射於鋪有該等高分子材料粉末之該金屬基材上進行燒結。 A method for sintering and coating a polymer material on a metal surface using a laser, which comprises: a. Grinding the particle size of a plurality of polymer material powders to 40-90 μm through a ball mill; b. Focusing and scanning a metal substrate with a laser source Material, multiple microstructures are produced on the surface of the metal substrate, wherein the pulse frequency of the laser is 0.5-0.75kHz, the pulse width is 750μs, the laser power is 150W, the scanning speed is 20mm/s, and the scanning interval is 1mm; and c. Spread the polymer material powder on the surface of the metal substrate through the powder spreading system, and use a laser 20-100W as the heat radiation source, and the pulse width is 500μs, the scanning speed is 70mm/s, and the scanning distance is 0.025mm. Under the condition of frequency 0.75kHz, directly irradiate the metal substrate covered with the polymer material powder for sintering. 如申請專利範圍第1項所述之方法,其中,該等高分子材料粉末之材質係為聚乳酸(PLA)、樹脂(ABS)、聚醯胺(尼龍)-6、聚醯胺(PA)66(Nylon-66)、聚乙烯醇(PVA)、聚苯乙烯(PS)、壓克力(PMMA)之其中之一。 Such as the method described in item 1 of the scope of patent application, wherein the material of the polymer material powder is polylactic acid (PLA), resin (ABS), polyamide (nylon)-6, polyamide (PA) 66 (Nylon-66), polyvinyl alcohol (PVA), polystyrene (PS), acrylic (PMMA) one of them. 如申請專利範圍第1項所述之方法,其中,該等高分子材料粉末之材質係為尼龍基混合銅、鋁、鋅、金、銀、鐵和鎳之其中之一,而形成之混合高分子材料粉末。 For example, the method described in item 1 of the scope of patent application, wherein the material of the polymer material powder is nylon-based mixed with one of copper, aluminum, zinc, gold, silver, iron, and nickel, and the resulting mixture is high Molecular material powder. 如申請專利範圍第1項所述之方法,其中,該等高分子材料粉末之材質係為尼龍基混合金剛石、石墨、碳纖維和石墨稀之其中之一,而形成之混合高分子材料粉末。 For the method described in item 1 of the scope of patent application, wherein the material of the polymer material powder is one of nylon-based mixed diamond, graphite, carbon fiber and graphene to form a mixed polymer material powder. 如申請專利範圍第1項所述之方法,其中,該等高分子材料粉末之材質係為尼龍基混合氧化鋁、氮化鋁、氮化矽、碳化矽、氧化鎂和二氧化矽之其中之一,而形成之混和高分子材料粉末。 Such as the method described in item 1 of the scope of patent application, wherein the material of the polymer material powder is nylon-based mixed alumina, aluminum nitride, silicon nitride, silicon carbide, magnesium oxide, and silicon dioxide. One, and the mixed polymer material powder is formed. 如申請專利範圍第1至5項中任一項所述之方法,其中,該等微結構係為間隔排列,且該等微結構間之距離為1mm。 The method according to any one of items 1 to 5 in the scope of patent application, wherein the microstructures are arranged at intervals, and the distance between the microstructures is 1mm. 如申請專利範圍第6項所述之方法,其中,該金屬基材之材質係為鐵基、鎳基、鈷基、鉻基、鉬基、鋁基和銅基金屬之一或其合金材料。 According to the method described in item 6 of the scope of patent application, wherein the material of the metal substrate is one of iron-based, nickel-based, cobalt-based, chromium-based, molybdenum-based, aluminum-based, and copper-based metals or alloy materials thereof. 如申請專利範圍第7項所述之方法,其中,雷射之波長範圍係為400nm~11000nm。 The method described in item 7 of the scope of patent application, wherein the wavelength range of the laser is 400nm~11000nm. 如申請專利範圍第8項所述之方法,其中,該高分子材料粉末燒結完成後厚度係為0.2-10mm。 The method described in item 8 of the scope of patent application, wherein the thickness of the polymer material powder after sintering is 0.2-10mm.
TW108125657A 2019-07-19 2019-07-19 Method for using laser to sinter and coat polymer material on metal surface TWI710416B (en)

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JP2003327849A (en) * 2002-04-05 2003-11-19 Degussa Ag Thermoplastic polymer powder and method for covering metal support and coated metal support
CN102380711A (en) * 2010-09-01 2012-03-21 中国科学院光电研究院 Selective sintering laser processing system
TW201345645A (en) * 2011-11-29 2013-11-16 Polyplastics Co Method for manufacturing metallic component, and composite molded article
TWI564099B (en) * 2014-12-24 2017-01-01 財團法人工業技術研究院 Composite beam generator and powder melting or sintering method using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327849A (en) * 2002-04-05 2003-11-19 Degussa Ag Thermoplastic polymer powder and method for covering metal support and coated metal support
CN102380711A (en) * 2010-09-01 2012-03-21 中国科学院光电研究院 Selective sintering laser processing system
TW201345645A (en) * 2011-11-29 2013-11-16 Polyplastics Co Method for manufacturing metallic component, and composite molded article
TWI564099B (en) * 2014-12-24 2017-01-01 財團法人工業技術研究院 Composite beam generator and powder melting or sintering method using the same

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