TWI709770B - Method for manufacturing optical member with resin film - Google Patents

Method for manufacturing optical member with resin film Download PDF

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TWI709770B
TWI709770B TW105141812A TW105141812A TWI709770B TW I709770 B TWI709770 B TW I709770B TW 105141812 A TW105141812 A TW 105141812A TW 105141812 A TW105141812 A TW 105141812A TW I709770 B TWI709770 B TW I709770B
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adhesive layer
resin film
optical member
meth
film
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TW105141812A
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Chinese (zh)
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TW201727290A (en
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中川弘也
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日商住友化學股份有限公司
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • G02B5/3041Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks
    • G02B5/305Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks including organic materials, e.g. polymeric layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Adhesive Tapes (AREA)
  • Polarising Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a method for manufacturing an optical member with a resin film, that the optical member is obtained by sticking a resin film to an optical member with an adhesive layer interposed therebetween and has good adhesion between the adhesive layer and the optical member.
The method for manufacturing optical member with resin film comprises: a coating step of applying an adhesive composition onto an elongated resin film to form a coating layer; a drying step of obtaining a resin film having an adhesive layer by introducing the film into the drying means to dry the coating layer while continuously transporting the resin film after the coating step; a smoothing treatment step of pressing a specular mold against the outer surface of the adhesive layer while continuously transporting the resin film having an adhesive layer; a sticking step of laminating a long optical member on the outer surface of the adhesive layer while continuously transporting the resin film after the smoothing treatment step and pressing the laminate from above and below.

Description

附樹脂膜之光學構件的製造方法 Manufacturing method of optical component with resin film

本發明係關於一種附樹脂膜之光學構件的製造方法,該附樹脂膜之光學構件係透過黏著劑層而在光學構件貼合樹脂膜所成者。 The present invention relates to a method for manufacturing an optical member with a resin film, which is obtained by bonding a resin film to the optical member through an adhesive layer.

以偏光板為代表之各種光學構件,係有透過黏著劑層而貼合至其他構件來使用之情形(例如專利文獻1)。因此,光學構件有以在其一面預先設置有黏著劑層而成之附黏著劑層之光學構件的形態在市場流通之情形。在此黏著劑層的外表面,一般係暫時貼附著用於保護該面之可剝離的隔離膜(separate film)(亦稱為「剝離膜」)。 Various optical members typified by a polarizing plate are sometimes used by being bonded to other members through an adhesive layer (for example, Patent Document 1). Therefore, an optical member may be distributed in the market in the form of an optical member with an adhesive layer formed by preliminarily providing an adhesive layer on one surface. On the outer surface of the adhesive layer, a peelable separate film (also called a "release film") is generally temporarily attached to protect the surface.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開第2008-275722號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-275722

針對為了使光學構件貼合至其他構件而使 用之上述黏著劑層,係要求對光學構件有良好的密接性。當為了使光學構件貼合至其他構件而使用之黏著劑層的密接性不充分時,將光學構件與其他構件透過黏著劑層而貼合成之複合構件的耐久性以及信賴性會降低。 For bonding optical components to other components The aforementioned adhesive layer is required to have good adhesion to optical components. When the adhesiveness of the adhesive layer used for bonding the optical member to another member is insufficient, the durability and reliability of the composite member formed by pasting the optical member and the other member through the adhesive layer will decrease.

本發明之目的係提供一種附樹脂膜之光學構件的製造方法,該附樹脂膜之光學構件係例如具備上述隔離膜之附黏著劑層之光學構件般,是透過黏著劑層而在光學構件貼合樹脂膜所成者,其中的黏著劑層與光學構件之密接性良好。 The object of the present invention is to provide a method for manufacturing an optical member with a resin film. The optical member with a resin film is attached to the optical member through the adhesive layer, such as an optical member with an adhesive layer of the above-mentioned release film. In the case of a composite resin film, the adhesive layer and the optical member have good adhesion.

本發明係提供如下所示之附樹脂膜之光學構件的製造方法。 The present invention provides a method of manufacturing an optical member with a resin film as shown below.

[1]一種附樹脂膜之光學構件的製造方法,係包含下述步驟:塗佈步驟,係在長條狀的樹脂膜上塗佈黏著劑組成物而形成塗佈層;乾燥步驟,係藉由將前述塗佈步驟後之膜一邊連續運送一邊導入乾燥手段使前述塗佈層乾燥,而得到具有黏著劑層之樹脂膜;平滑化處理步驟,係將前述具有黏著劑層之樹脂膜一邊連續運送,一邊在該黏著劑層的外表面按壓鏡面模具;以及貼合步驟,係將前述平滑化處理步驟後之前述樹脂膜一邊繼續連續運送,一邊在該黏著劑層的外表面積層長條 的光學構件,並且從上下按壓此積層體。 [1] A method for manufacturing an optical member with a resin film, which includes the following steps: a coating step, which is to coat an adhesive composition on a long resin film to form a coating layer; and a drying step, which is The film after the aforementioned coating step is continuously conveyed while introducing a drying means to dry the aforementioned coating layer to obtain a resin film with an adhesive layer; the smoothing step is to continue the aforementioned resin film with an adhesive layer During transportation, while pressing the mirror mold on the outer surface of the adhesive layer; and in the laminating step, the resin film after the smoothing treatment step is continuously transported while being stripped on the outer surface of the adhesive layer , And press this laminate from above and below.

[2]如[1]所記載之製造方法,其更包含下述步驟:熟化步驟,係將由前述貼合步驟所得到之附樹脂膜之光學構件捲繞成輥狀,以輥狀態進行前述黏著劑層的熟化。 [2] The manufacturing method as described in [1], which further includes the following step: an aging step, which is to wind the optical member with a resin film obtained in the aforementioned bonding step into a roll, and perform the aforementioned bonding in a roll state The maturation of the agent layer.

[3]如[1]或[2]所記載之製造方法,其中,在前述平滑化處理步驟中,與鏡面模具相接之黏著劑層之溫度係未達前述黏著劑組成物的玻璃轉移溫度。 [3] The manufacturing method as described in [1] or [2], wherein, in the smoothing treatment step, the temperature of the adhesive layer in contact with the mirror mold is lower than the glass transition temperature of the adhesive composition .

[4]如[1]至[3]中任一項所記載之製造方法,其更包含下述步驟:表面活性化步驟,係在前述貼合步驟之前,對於前述光學構件的與前述黏著劑層的貼合面進行能量照射。 [4] The manufacturing method as described in any one of [1] to [3], further comprising the following step: a surface activation step, which is prior to the bonding step, for the optical member and the adhesive The bonding surface of the layer is irradiated with energy.

[5]如[1]至[4]中任一項所記載之製造方法,其中,前述光學構件的與前述黏著劑層外表面相接之表面係包含(甲基)丙烯酸系樹脂。 [5] The production method according to any one of [1] to [4], wherein the surface of the optical member that is in contact with the outer surface of the adhesive layer contains (meth)acrylic resin.

[6]如[1]至[5]中任一項所記載之製造方法,其中,前述光學構件係偏光板。 [6] The manufacturing method according to any one of [1] to [5], wherein the optical member is a polarizing plate.

[7]如[1]至[6]中任一項所記載之製造方法,其中,前述樹脂膜係隔離膜。 [7] The manufacturing method according to any one of [1] to [6], wherein the resin film-based separator.

根據本發明之製造方法,可提供使黏著劑層與光學構件之密接性良好的附樹脂膜之光學構件。 According to the manufacturing method of the present invention, it is possible to provide an optical member with a resin film that improves the adhesion between the adhesive layer and the optical member.

1‧‧‧第1饋送輥 1‧‧‧The first feed roller

2‧‧‧第2饋送輥 2‧‧‧The second feed roller

3‧‧‧捲繞輥 3‧‧‧Winding roller

10‧‧‧樹脂膜 10‧‧‧Resin film

11‧‧‧塗佈層 11‧‧‧Coating layer

12‧‧‧黏著劑層(能量照射前) 12‧‧‧Adhesive layer (before energy irradiation)

13‧‧‧黏著劑層(平滑化處理後) 13‧‧‧Adhesive layer (after smoothing treatment)

15‧‧‧具有塗佈層之樹脂膜 15‧‧‧Resin film with coating layer

20‧‧‧具有黏著劑層(平滑化處理前)之樹脂膜 20‧‧‧Resin film with adhesive layer (before smoothing treatment)

25‧‧‧附黏著劑層之樹脂膜 25‧‧‧Resin film with adhesive layer

30‧‧‧光學構件 30‧‧‧Optical components

40‧‧‧附樹脂膜之光學構件 40‧‧‧Optical components with resin film

50‧‧‧塗佈裝置 50‧‧‧Coating device

60‧‧‧塗佈用輥 60‧‧‧Coating roller

70‧‧‧乾燥手段 70‧‧‧Drying means

80‧‧‧平滑化處理裝置 80‧‧‧Smoothing device

90‧‧‧貼合輥 90‧‧‧Laminating Roll

第1圖係表示本發明之附樹脂膜之光學構件的製造方法以及其使用之製造裝置之一例的概略圖。 Fig. 1 is a schematic diagram showing an example of a method of manufacturing an optical member with a resin film of the present invention and a manufacturing apparatus used for the method.

第2圖係表示具有塗佈層(乾燥前)之樹脂膜之一例的概略剖面圖。 Fig. 2 is a schematic cross-sectional view showing an example of a resin film having a coating layer (before drying).

第3圖係表示具有黏著劑層(平滑化處理前)之樹脂膜之一例的概略剖面圖。 Fig. 3 is a schematic cross-sectional view showing an example of a resin film having an adhesive layer (before smoothing treatment).

第4圖係表示附黏著劑層之樹脂膜之一例的概略剖面圖。 Fig. 4 is a schematic cross-sectional view showing an example of a resin film with an adhesive layer.

第5圖係表示附樹脂膜之光學構件之一例的概略剖面圖。 Fig. 5 is a schematic cross-sectional view showing an example of an optical member with a resin film.

本發明之附樹脂膜之光學構件的製造方法,係包含下述步驟:塗佈步驟,係在長條狀的樹脂膜上塗佈黏著劑組成物而形成塗佈層;乾燥步驟,係藉由將塗佈步驟後之膜一邊連續運送一邊導入乾燥手段使塗佈層乾燥,而得到具有黏著劑層之樹脂膜;平滑化處理步驟,係將具有前述黏著劑層之樹脂膜一邊連續運送,一邊在該黏著劑層的外表面按壓鏡面模具;以及貼合步驟,係將前述平滑化處理步驟後之前述樹脂膜一邊繼續連續運送,一邊在該黏著劑層的外表面積層長條的光學構件,並且從上下按壓此積層體。 The method of manufacturing an optical member with a resin film of the present invention includes the following steps: a coating step, which is to coat an adhesive composition on a long resin film to form a coating layer; and the drying step is to The film after the coating step is continuously transported while introducing a drying means to dry the coating layer to obtain a resin film with an adhesive layer; the smoothing treatment step is to continuously transport the resin film with the aforementioned adhesive layer Pressing the mirror mold on the outer surface of the adhesive layer; and the laminating step, the resin film after the smoothing treatment step is continuously transported while layering a long optical member on the outer surface of the adhesive layer, And press the laminated body from above and below.

本發明之附樹脂膜之光學構件的製造方法,可更包含上述步驟以外的其他步驟。以下,一邊參照第1圖至第5圖,一邊針對各步驟進行說明。再者,在下述中,亦將貼合於光學構件之屬於膜中間物之「具有黏著劑層之樹脂膜」稱為「附黏著劑層之樹脂膜」。 The method of manufacturing an optical member with a resin film of the present invention may further include steps other than the above-mentioned steps. Hereinafter, each step will be described with reference to FIGS. 1 to 5. Furthermore, in the following, the "resin film with an adhesive layer" which is a film intermediate that is bonded to the optical member is also referred to as the "resin film with an adhesive layer".

[塗佈步驟] [Coating Step]

本步驟係藉由塗佈裝置50在樹脂膜10上塗佈黏著劑組成物來形成塗佈層11,而得到具有塗佈層11之樹脂膜15的步驟(參照第1圖以及第2圖)。 This step is a step of forming the coating layer 11 by applying the adhesive composition on the resin film 10 by the coating device 50 to obtain the resin film 15 having the coating layer 11 (refer to Figures 1 and 2) .

(1)樹脂膜 (1) Resin film

樹脂膜10通常為熱可塑性樹脂膜,較佳為具有透光性之(更佳為光學透明的)熱可塑性樹脂膜。熱可塑性樹脂之具體例係包含:如鏈狀聚烯烴系樹脂(聚乙烯系樹脂、聚丙烯系樹脂等)、環狀聚烯烴系樹脂(降莰烯(norbornene)樹脂等)等聚烯烴系樹脂;如聚氟乙烯(Polyvinyl fluoride)、聚二氟亞乙烯(Polyvinylidene fluoride)、聚氟化乙烯(Polyethylene fluoride)等氟化聚烯烴系樹脂;如聚對酞酸乙二酯系樹脂、聚萘二甲酸乙二酯系樹脂等聚酯系樹脂;如甲基丙烯酸甲酯系樹脂等(甲基)丙烯酸系樹脂;如三乙醯基纖維素[TAC]、二乙醯基纖維素之乙酸纖維素系樹脂等纖維素系樹脂;聚碳酸酯系樹脂;聚乙烯醇系樹脂;聚乙酸乙烯酯系樹脂;聚芳酯系樹脂;聚醯亞胺系樹脂;聚苯乙烯系樹脂;聚醯胺系樹脂;聚醚碸系樹脂;聚碸系樹脂;以及該等之混合物、共聚物。此外,本說明書中,所謂「(甲 基)丙烯酸」係意指丙烯酸及/或甲基丙烯酸,在記載(甲基)丙烯酸酯等時之「(甲基)」亦為同樣的意旨。 The resin film 10 is generally a thermoplastic resin film, preferably a thermoplastic resin film having light transmittance (more preferably an optically transparent) thermoplastic resin film. Specific examples of thermoplastic resins include polyolefin resins such as chain polyolefin resins (polyethylene resins, polypropylene resins, etc.), cyclic polyolefin resins (norbornene resins, etc.) ; Such as polyvinyl fluoride (Polyvinyl fluoride), polyvinylidene fluoride (Polyvinylidene fluoride), polyvinyl fluoride (Polyethylene fluoride) and other fluorinated polyolefin resin; Polyester resins such as ethylene formate resins; (meth)acrylic resins such as methyl methacrylate resins; such as triacetyl cellulose [TAC], cellulose acetate of diacetyl cellulose Cellulose resins such as resins; polycarbonate resins; polyvinyl alcohol resins; polyvinyl acetate resins; polyarylate resins; polyimide resins; polystyrene resins; polyamide resins Resins; Polyether-based resins; Poly-based resins; and mixtures and copolymers of these. In addition, in this manual, the so-called "(甲 "Acrylic acid" means acrylic acid and/or methacrylic acid, and "(meth)" when describing (meth)acrylate etc. also has the same meaning.

樹脂膜10之厚度係例如為5至200μm左右,較佳為10至150μm,更佳為15至100μm。 The thickness of the resin film 10 is, for example, about 5 to 200 μm, preferably 10 to 150 μm, and more preferably 15 to 100 μm.

在本發明之製造方法中所製造之屬於膜中間物的附黏著劑層之樹脂膜,例如可為附黏著劑層之隔離膜。此時,樹脂膜10可為已對積層有黏著劑層之側的表面施行脫模處理之隔離膜。脫模處理之例為聚矽氧(silicone)處理、長鏈烷基處理、氟處理等。 The resin film with the adhesive layer of the intermediate film produced in the manufacturing method of the present invention may be, for example, an adhesive layer-attached release film. At this time, the resin film 10 may be a release film that has been subjected to mold release treatment on the surface on the side where the adhesive layer is laminated. Examples of mold release treatments are silicone treatment, long-chain alkyl treatment, fluorine treatment, etc.

再者,樹脂膜10亦可為隔離膜以外之光學構件。作為隔離膜以外之光學構件的樹脂膜10,係可為單層結構,亦可為多層結構。作為光學構件之樹脂膜10的具體例,係包含:偏光膜;光學補償膜(相位差膜等)、光擴散膜(片),反射膜(片)等光學機能性膜;偏光膜用保護膜;偏光板等。 Furthermore, the resin film 10 may be an optical member other than the isolation film. The resin film 10, which is an optical member other than the isolation film, may have a single-layer structure or a multilayer structure. Specific examples of the resin film 10 as an optical member include: polarizing film; optical compensation film (retardation film, etc.), light diffusion film (sheet), reflective film (sheet), and other optical functional films; polarizing film protective film ; Polarizing plate etc.

(2)黏著劑組成物 (2) Adhesive composition

塗佈至樹脂膜10之黏著劑組成物,可列舉例如:(甲基)丙烯酸系黏著劑組成物、胺甲酸乙酯(urethane)系黏著劑組成物、聚矽氧系黏著劑組成物、聚酯系黏著劑組成物、聚醯胺系黏著劑組成物、聚醚系黏著劑組成物、氟系黏著劑組成物、橡膠系黏著劑組成物等。其中,從透明性、黏著力、信賴性、重製性等之觀點而言,較佳為使用將(甲基)丙烯酸系樹脂作為基底聚合物(base polymer)之(甲基)丙烯酸系黏著劑。 The adhesive composition applied to the resin film 10 includes, for example, (meth)acrylic adhesive composition, urethane adhesive composition, silicone adhesive composition, and polysiloxane adhesive composition. Ester-based adhesive composition, polyamide-based adhesive composition, polyether-based adhesive composition, fluorine-based adhesive composition, rubber-based adhesive composition, etc. Among them, from the viewpoints of transparency, adhesion, reliability, reproducibility, etc., it is preferable to use a (meth)acrylic adhesive that uses a (meth)acrylic resin as a base polymer. .

(2-1)基底聚合物 (2-1) Base polymer

可適合使用作為(甲基)丙烯酸系黏著劑組成物之基底聚合物的(甲基)丙烯酸系樹脂的具體例,係下述(甲基)丙烯酸系樹脂(A-1),

Figure 105141812-A0202-12-0007-1
Specific examples of (meth)acrylic resins that can be suitably used as the base polymer of the (meth)acrylic adhesive composition are the following (meth)acrylic resins (A-1),
Figure 105141812-A0202-12-0007-1

該(甲基)丙烯酸系樹脂(A-1)係將源自上述式(I)表示之(甲基)丙烯酸酯之結構單元作為主成分(亦即含有50重量%以上)的聚合物。 The (meth)acrylic resin (A-1) is a polymer having a structural unit derived from the (meth)acrylate represented by the above formula (I) as a main component (that is, containing 50% by weight or more).

在上述式(I)中,R1表示氫原子或甲基,R2表示可經碳數1至10之烷氧基取代之碳數1至14之烷基、或可經碳數1至10之烷氧基取代之碳數7至21之芳烷基。R2較佳為可經碳數1至10之烷氧基取代之碳數1至14之烷基。 In the above formula (I), R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group with 1 to 14 carbons which may be substituted by an alkoxy group with 1 to 10 carbons, or an alkyl group with 1 to 14 carbons which may be substituted with 1 to 10 carbons. The alkoxy substituted aralkyl group of 7 to 21 carbons. R 2 is preferably an alkyl group having 1 to 14 carbons which may be substituted by an alkoxy group having 1 to 10 carbons.

式(I)表示之(甲基)丙烯酸酯之具體例,係包含:如丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸正丁酯、丙烯酸正辛酯、丙烯酸月桂酯等直鏈狀之丙烯酸烷基酯;如丙烯酸異丁酯、丙烯酸2-乙基己酯、丙烯酸異辛酯等分枝狀之丙烯酸烷基酯;如甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸正丁酯、甲基丙烯酸正辛酯、甲基丙烯酸月桂酯等直鏈狀之甲基丙烯酸烷基酯;甲基丙烯酸異丁酯、甲基丙烯酸2-乙基己酯、甲基 丙烯酸異辛酯等分枝狀之甲基丙烯酸烷基酯等。 Specific examples of the (meth)acrylate represented by the formula (I) include linear ones such as methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate, n-octyl acrylate, lauryl acrylate, etc. Alkyl acrylate; branched alkyl acrylate such as isobutyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, etc.; such as methyl methacrylate, ethyl methacrylate, propyl methacrylate Ester, n-butyl methacrylate, n-octyl methacrylate, lauryl methacrylate and other linear alkyl methacrylates; isobutyl methacrylate, 2-ethylhexyl methacrylate, methyl Branched alkyl methacrylates such as isooctyl acrylate, etc.

R2為經烷氧基取代之烷基時,亦即R2為烷氧基烷基時的式(I)表示之(甲基)丙烯酸酯的具體例,係包含:丙烯酸2-甲氧基乙酯、丙烯酸乙氧基甲酯、甲基丙烯酸2-甲氧基乙酯、甲基丙烯酸乙氧基甲酯等。R2為碳數7至21之芳烷基時的式(I)表示之(甲基)丙烯酸酯的具體例,係包含:丙烯酸苄酯、甲基丙烯酸苄酯等。 When R 2 is an alkyl group substituted by an alkoxy group, that is, when R 2 is an alkoxy alkyl group, a specific example of the (meth)acrylate represented by formula (I) includes: 2-methoxy acrylate Ethyl ester, ethoxymethyl acrylate, 2-methoxyethyl methacrylate, ethoxymethyl methacrylate, etc. Specific examples of the (meth)acrylate represented by formula (I) when R 2 is an aralkyl group having 7 to 21 carbon atoms include benzyl acrylate, benzyl methacrylate, and the like.

式(I)表示之(甲基)丙烯酸酯,可僅單獨使用1種,亦可併用2種以上。其中,(甲基)丙烯酸酯較佳為包含丙烯酸正丁酯。(甲基)丙烯酸系樹脂(A-1),在構成其之全單體中,較佳為含有丙烯酸正丁酯50重量%以上。當然,除了丙烯酸正丁酯以外,亦可併用其外之式(I)表示之(甲基)丙烯酸酯。 The (meth)acrylate represented by formula (I) may be used alone or in combination of two or more kinds. Among them, the (meth)acrylate preferably contains n-butyl acrylate. The (meth)acrylic resin (A-1) preferably contains 50% by weight or more of n-butyl acrylate in all monomers constituting it. Of course, in addition to n-butyl acrylate, the (meth)acrylate represented by formula (I) may also be used in combination.

(甲基)丙烯酸系樹脂(A-1),通常為上述式(I)之(甲基)丙烯酸酯與以具有極性官能基之單體為代表之至少1種其他單體的共聚物。具有極性官能基之單體,較佳為具有極性官能基之(甲基)丙烯酸系化合物。極性官能基係可列舉:遊離羧基、羥基、胺基、以環氧基為代表之雜環基等。 The (meth)acrylic resin (A-1) is usually a copolymer of the (meth)acrylate of the above formula (I) and at least one other monomer represented by a monomer having a polar functional group. The monomer having a polar functional group is preferably a (meth)acrylic compound having a polar functional group. Examples of the polar functional group system include free carboxyl groups, hydroxyl groups, amino groups, and heterocyclic groups represented by epoxy groups.

具有極性官能基之單體之具體例,係包含:如(甲基)丙烯酸、(甲基)丙烯酸β-羧基乙酯等具有遊離羧基的單體;如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-(2-羥基乙氧基)乙酯、(甲基)丙烯酸2-或3-氯-2-羥基丙 酯、二乙二醇單(甲基)丙烯酸酯等具有羥基之單體;如丙烯醯基嗎福林、乙烯基己內醯胺、N-乙烯基-2-吡咯啶酮、乙烯基吡啶、(甲基)丙烯酸四氫呋喃甲酯、己內酯改質丙烯酸四氫呋喃甲酯、(甲基)丙烯酸3,4-環氧環己基甲酯(3,4-epoxycyclohexylmethyl(meth)acrylate)、(甲基)丙烯酸環氧丙酯(glycidyl(meth)acrylate)、2,5-二氫呋喃等具有雜環基之單體;如(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸二甲基胺基丙酯等具有與雜環不同之胺基之單體等。具有極性官能基之單體,可僅單獨使用1種,亦可併用2種以上。 Specific examples of monomers with polar functional groups include: monomers with free carboxyl groups such as (meth)acrylic acid, β-carboxyethyl (meth)acrylate, etc.; such as 2-hydroxyethyl (meth)acrylate , 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-(2-hydroxyethoxy)ethyl (meth)acrylate, 2- or 3 (meth)acrylate -Chloro-2-hydroxypropane Esters, diethylene glycol mono(meth)acrylates and other monomers with hydroxyl groups; such as propylene mopholin, vinyl caprolactam, N-vinyl-2-pyrrolidone, vinyl pyridine, (Meth) tetrahydrofuran methyl acrylate, caprolactone modified tetrahydrofuran methyl acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate (meth)acrylate, (methyl) Monomers with heterocyclic groups such as glycidyl(meth)acrylate and 2,5-dihydrofuran; such as aminoethyl (meth)acrylate, N,N-di(meth)acrylate Monomers such as methylaminoethyl, dimethylaminopropyl (meth)acrylate and the like having an amino group different from the heterocyclic ring. The monomer having a polar functional group may be used alone or in combination of two or more kinds.

上述中,從(甲基)丙烯酸系樹脂(A-1)之反應性之觀點而言,構成(甲基)丙烯酸系樹脂(A-1)之含有極性官能基之單體之一,較佳為使用具有羥基之單體。除了具有羥基之單體以外,有效的是併用其他具有極性官能基之單體,例如具有遊離羧基之單體。 Among the above, from the viewpoint of the reactivity of the (meth)acrylic resin (A-1), one of the monomers containing a polar functional group constituting the (meth)acrylic resin (A-1), preferably To use monomers with hydroxyl groups. In addition to monomers with hydroxyl groups, it is effective to use other monomers with polar functional groups, such as monomers with free carboxyl groups.

(甲基)丙烯酸系樹脂(A-1)亦可更包含源自下述單體之結構單元:在分子內具有1個烯烴性雙鍵及至少1個芳香環之單體(惟,排除相當於上述式(I)表示之單體及上述具有極性官能基之單體)。其較佳例可列舉如具有芳香環之(甲基)丙烯酸系化合物。具有芳香環之(甲基)丙烯酸系化合物之較佳例為具有芳氧基烷基之(甲基)丙烯酸酯,

Figure 105141812-A0202-12-0010-2
The (meth)acrylic resin (A-1) may further contain structural units derived from the following monomers: monomers having one olefinic double bond and at least one aromatic ring in the molecule (except for the equivalent The monomer represented by the above formula (I) and the above monomer having a polar functional group). Preferred examples thereof include (meth)acrylic compounds having an aromatic ring. A preferable example of the (meth)acrylic compound having an aromatic ring is (meth)acrylate having an aryloxyalkyl group,
Figure 105141812-A0202-12-0010-2

例如上述式(II)表示之含有苯氧基乙基之(甲基)丙烯酸酯。 For example, the phenoxyethyl-containing (meth)acrylate represented by the above formula (II).

在上述式(II)中,R3表示氫原子或甲基,n表示1至8之整數,R4表示氫原子、烷基、芳烷基或芳基。R4為烷基時,其碳數可為1至9左右,若為芳烷基時,其碳數可為7至11左右,又若為芳基時,其碳數可為6至10左右。 In the above formula (II), R 3 represents a hydrogen atom or a methyl group, n represents an integer of 1 to 8, and R 4 represents a hydrogen atom, an alkyl group, an aralkyl group or an aryl group. When R 4 is an alkyl group, its carbon number can be about 1 to 9, if it is an aralkyl group, its carbon number can be about 7 to 11, and if it is an aryl group, its carbon number can be about 6 to 10 .

式(II)中,構成R4之碳數1至9之烷基可列舉甲基、丁基、壬基等,碳數7至11之芳烷基可列舉苄基、苯乙基、萘甲基等,碳數6至10之芳基可列舉苯基、甲苯基、萘基等。 In the formula (II), the alkyl group having 1 to 9 carbon atoms constituting R 4 includes methyl, butyl, nonyl, etc., and the aralkyl group having 7 to 11 carbon atoms includes benzyl, phenethyl, and naphthyl. Examples of aryl groups having 6 to 10 carbon atoms include phenyl, tolyl, and naphthyl.

式(II)表示之含有苯氧基乙基之(甲基)丙烯酸酯的具體例,係包含:(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸2-(2-苯氧基乙氧基)乙酯、環氧乙烷改質壬基酚之(甲基)丙烯酸酯、(甲基)丙烯酸2-(鄰-苯基苯氧基)乙酯等。含有苯氧基乙基之(甲基)丙烯酸酯,可僅1種單獨使用,亦可併用2種以上。其中,含有苯氧基乙基之(甲基)丙烯酸酯,較佳為包含(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸2-(鄰-苯基苯氧基)乙酯及/或(甲基)丙烯酸2-(2-苯氧基乙氧基)乙酯。 Specific examples of (meth)acrylate containing phenoxyethyl represented by formula (II) include: 2-phenoxyethyl (meth)acrylate, 2-(2-benzene) (meth)acrylate Oxyethoxy) ethyl ester, ethylene oxide modified nonylphenol (meth)acrylate, (meth)acrylate 2-(o-phenylphenoxy)ethyl, etc. The (meth)acrylate containing a phenoxyethyl group may be used alone or in combination of two or more kinds. Among them, the (meth)acrylate containing phenoxyethyl group preferably contains 2-phenoxyethyl (meth)acrylate and 2-(o-phenylphenoxy)ethyl (meth)acrylate. Ester and/or 2-(2-phenoxyethoxy)ethyl (meth)acrylate.

(甲基)丙烯酸系樹脂(A-1)中,以其固形份全 體量為基準,源自上述式(I)表示之(甲基)丙烯酸酯之結構單元較佳為可以60至99.9重量%之比例含有,更佳為可以80至99.6重量%之比例含有;源自具有極性官能基之單體之結構單元較佳為可以0.1至20重量%之比例含有,更佳為可以0.4至10重量%之比例含有;源自在分子內具有1個烯烴性雙鍵及至少1個芳香環之單體的結構單元較佳為可以0至40重量%之比例含有,更佳為可以6至12重量%之比例含有。 In (meth)acrylic resin (A-1), its solid content is all Based on the volume, the structural unit derived from the (meth)acrylate represented by the above formula (I) may preferably be contained in a proportion of 60 to 99.9% by weight, more preferably in a proportion of 80 to 99.6% by weight; source The structural unit from a monomer having a polar functional group may preferably be contained in a proportion of 0.1 to 20% by weight, more preferably in a proportion of 0.4 to 10% by weight; derived from having one olefinic double bond in the molecule and The structural unit of the monomer having at least one aromatic ring may preferably be contained in a ratio of 0 to 40% by weight, more preferably 6 to 12% by weight.

(甲基)丙烯酸系樹脂(A-1)可含有源自「式(I)表示之(甲基)丙烯酸酯、具有極性官能基之單體、以及在分子內具有1個烯烴性雙鍵及至少1個芳香環之單體」以外的單體(以下,亦稱為「其他單體」)的結構單元。其他單體之具體例係包含:源自在分子內具有脂環式結構之(甲基)丙烯酸酯之結構單元、源自苯乙烯系單體之結構單元、源自乙烯系單體之結構單元、源自在分子內具有複數個(甲基)丙烯醯基單體的結構單元、源自(甲基)丙烯醯胺單體之結構單元等。其他單體可僅1種單獨使用,亦可併用2種以上。 The (meth)acrylic resin (A-1) may contain a (meth)acrylate derived from the formula (I), a monomer having a polar functional group, and an olefinic double bond and A structural unit of a monomer other than "a monomer having at least one aromatic ring" (hereinafter, also referred to as "other monomer"). Specific examples of other monomers include: structural units derived from (meth)acrylates having an alicyclic structure in the molecule, structural units derived from styrene monomers, and structural units derived from vinyl monomers , Derived from structural units having multiple (meth)acrylic acid monomers in the molecule, structural units derived from (meth)acrylic acid amine monomers, etc. The other monomers may be used alone or in combination of two or more.

脂環式結構之碳數通常為5以上,較佳為5至7左右。具有脂環式結構之(甲基)丙烯酸酯的具體例,係包含:(甲基)丙烯酸異莰酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸環十二酯、(甲基)丙烯酸甲基環己酯、(甲基)丙烯酸三甲基環己酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸環己基苯酯、α-乙氧基丙 烯酸環己酯等。 The carbon number of the alicyclic structure is usually 5 or more, preferably about 5-7. Specific examples of (meth)acrylates having an alicyclic structure include: isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentyl (meth)acrylate, (meth) )Cyclododecyl acrylate, methylcyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, cyclohexyl (meth)acrylate Phenyl ester, α-ethoxy propyl Cyclohexyl enoate, etc.

苯乙烯系單體之具體例,係包含:如苯乙烯;甲基苯乙烯、二甲基苯乙烯、三甲基苯乙烯、乙基苯乙烯、二乙基苯乙烯、三乙基苯乙烯、丙基苯乙烯、丁基苯乙烯、己基苯乙烯、庚基苯乙烯、辛基苯乙烯等烷基苯乙烯;如氟苯乙烯、氯苯乙烯、溴苯乙烯、二溴苯乙烯、碘苯乙烯等鹵化苯乙烯;硝基苯乙烯、乙醯基苯乙烯、甲氧基苯乙烯、二乙烯基苯等。 Specific examples of styrene monomers include: styrene; methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, triethyl styrene, Alkyl styrenes such as propyl styrene, butyl styrene, hexyl styrene, heptyl styrene, and octyl styrene; such as fluorostyrene, chlorostyrene, bromostyrene, dibromostyrene, iodostyrene Such as halogenated styrene; nitrostyrene, acetoxystyrene, methoxystyrene, divinylbenzene, etc.

乙烯系單體之具體例,係包含:乙酸乙烯酯、丙酸乙烯酯、酪酸乙烯酯、2-乙基己酸乙烯酯、月桂酸乙烯酯等脂肪酸乙烯酯;如氯化乙烯、溴化乙烯等鹵化乙烯;如二氯亞乙烯(vinylidene chloride)等鹵化亞乙烯;如乙烯基吡啶、乙烯基吡咯啶酮、乙烯基咔唑等含氮芳香族乙烯;如丁二烯、異戊二烯、氯丁二烯等共軛二烯單體;丙烯腈、甲基丙烯腈等。 Specific examples of vinyl monomers include: vinyl acetate, vinyl propionate, vinyl butyrate, vinyl 2-ethylhexanoate, vinyl laurate and other fatty acid vinyl esters; such as vinyl chloride and vinyl bromide Such as halogenated vinyl; such as vinylidene chloride (vinylidene chloride) and other halogenated vinylidene; such as vinyl pyridine, vinyl pyrrolidone, vinyl carbazole and other nitrogen-containing aromatic vinyl; such as butadiene, isoprene, Conjugated diene monomers such as chloroprene; acrylonitrile, methacrylonitrile, etc.

在分子內具有複數個(甲基)丙烯醯基之單體之具體例,係包含:如1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯等在分子內具有2個(甲基)丙烯醯基之單體;三羥甲基丙烷三(甲基)丙烯酸酯等在分子內具有3個(甲基)丙烯醯基之單體等。 Specific examples of monomers having a plurality of (meth)acrylic acid groups in the molecule include: 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(methyl) ) Acrylate, 1,9-nonanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate ) Acrylate, tripropylene glycol di(meth)acrylate, etc. have 2 (meth)acrylic acid monomers in the molecule; trimethylolpropane tri(meth)acrylate, etc. have 3 in the molecule (Meth) acrylic monomers, etc.

(甲基)丙烯醯胺化合物之具體例,係包含: N-羥甲基(甲基)丙烯醯胺、N-(2-羥基乙基)(甲基)丙烯醯胺、N-(3-羥基丙基)(甲基)丙烯醯胺、N-(4-羥基丁基)(甲基)丙烯醯胺、N-(5-羥基戊基)(甲基)丙烯醯胺、N-(6-羥基己基)(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-(3-二甲基胺基丙基)(甲基)丙烯醯胺、N-(1,1-二甲基-3-側氧基丁基)(甲基)丙烯醯胺、N-[2-(2-側氧基-1-咪唑啶基)乙基](甲基)丙烯醯胺、2-丙烯醯基胺基-2-甲基-1-丙熿酸、N-(甲氧基甲基)丙烯醯胺、N-(乙氧基甲基)(甲基)丙烯醯胺、N-(丙氧基甲基)(甲基)丙烯醯胺、N-(1-甲基乙氧基甲基)(甲基)丙烯醯胺、N-(1-甲基丙氧基甲基)(甲基)丙烯醯胺、N-(2-甲基丙氧基甲基)(甲基)丙烯醯胺[別名:N-(異丁氧基甲基)(甲基)丙烯醯胺]、N-(丁氧基甲基)(甲基)丙烯醯胺、N-(1,1-二甲基乙氧基甲基)(甲基)丙烯醯胺、N-(2-甲氧基乙基)(甲基)丙烯醯胺、N-(2-乙氧基乙基)(甲基)丙烯醯胺、N-(2-丙氧基乙基)(甲基)丙烯醯胺、N-[2-(1-甲基乙氧基)乙基](甲基)丙烯醯胺、N-[2-(1-甲基丙氧基)乙基](甲基)丙烯醯胺、N-[2-(2-甲基丙氧基)乙基](甲基)丙烯醯胺[別名:N-(2-異丁氧基乙基)(甲基)丙烯醯胺]、N-(2-丁氧基乙基)(甲基)丙烯醯胺、N-[2-(1,1-二甲基乙氧基)乙基](甲基)丙烯醯胺等。 Specific examples of (meth)acrylamide compounds include: N-hydroxymethyl(meth)acrylamide, N-(2-hydroxyethyl)(meth)acrylamide, N-(3-hydroxypropyl)(meth)acrylamide, N-( 4-hydroxybutyl)(meth)acrylamide, N-(5-hydroxypentyl)(meth)acrylamide, N-(6-hydroxyhexyl)(meth)acrylamide, N,N -Dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N-(3-dimethylamino) Propyl)(meth)acrylamide, N-(1,1-dimethyl-3-oxobutyl)(meth)acrylamide, N-[2-(2-oxo- 1-imidazolidinyl) ethyl) (meth) acrylamide, 2-propenylamino-2-methyl-1-propionic acid, N-(methoxymethyl) acrylamide, N -(Ethoxymethyl)(meth)acrylamide, N-(propoxymethyl)(meth)acrylamide, N-(1-methylethoxymethyl)(methyl) Allylamide, N-(1-methylpropoxymethyl)(meth)acrylamide, N-(2-methylpropoxymethyl)(meth)acrylamide [alias: N- (Isobutoxymethyl)(meth)acrylamide), N-(butoxymethyl)(meth)acrylamide, N-(1,1-dimethylethoxymethyl) (Meth)acrylamide, N-(2-methoxyethyl)(meth)acrylamide, N-(2-ethoxyethyl)(meth)acrylamide, N-(2 -Propoxyethyl)(meth)acrylamide, N-[2-(1-methylethoxy)ethyl](meth)acrylamide, N-[2-(1-methyl Propoxy)ethyl](meth)acrylamide, N-[2-(2-methylpropoxy)ethyl](meth)acrylamide [alias: N-(2-isobutoxy) Ethyl)(meth)acrylamide], N-(2-butoxyethyl)(meth)acrylamide, N-[2-(1,1-dimethylethoxy)ethyl Group] (meth)acrylamide and the like.

(甲基)丙烯酸系樹脂(A-1)中,以其固形份全體量為基準,其他單體通常是以0至20重量%之比例含有,較佳為以0至10重量%之比例含有。 In the (meth)acrylic resin (A-1), based on the total amount of solid content, other monomers are usually contained in a proportion of 0 to 20% by weight, preferably in a proportion of 0 to 10% by weight .

從黏著劑層與光學構件之密接性之觀點而言,(甲基)丙烯酸系樹脂(A-1)係以依據凝膠滲透層析法(GPC)並以標準聚乙烯換算之重量平均分子量(Mw)為50萬以上為佳,更佳為60萬以上。(甲基)丙烯酸系樹脂(A-1)之Mw通常為170萬以下。 From the viewpoint of the adhesion between the adhesive layer and the optical member, the (meth)acrylic resin (A-1) is based on the weight average molecular weight (GPC) converted to standard polyethylene ( Mw) is preferably 500,000 or more, more preferably 600,000 or more. The Mw of the (meth)acrylic resin (A-1) is usually 1.7 million or less.

(甲基)丙烯酸系黏著劑組成物之基底聚合物,可含有2種以上之(甲基)丙烯酸系樹脂(A-1)。再者,該基底聚合物,除了可含有(甲基)丙烯酸系樹脂(A-1)以外,亦可含有與此不同之(甲基)丙烯酸系樹脂,例如具有源自式(I)之(甲基)丙烯酸酯之結構單元且不具有極性官能基之(甲基)丙烯酸系樹脂(A-2)、或以源自上述式(I)表示之(甲基)丙烯酸酯之結構單元作為主成分且Mw為0.5萬至12萬範圍之(甲基)丙烯酸系樹脂(A-3)等。 The base polymer of the (meth)acrylic adhesive composition may contain two or more (meth)acrylic resins (A-1). Furthermore, the base polymer may not only contain (meth)acrylic resin (A-1), but may also contain (meth)acrylic resins different from this, such as (meth)acrylic resins derived from formula (I) (Meth)acrylic resin (A-2) which is a structural unit of meth)acrylate and does not have a polar functional group, or a structural unit derived from (meth)acrylate represented by the above formula (I) as the main (Meth)acrylic resin (A-3) etc. whose composition and Mw are in the range of 5,000 to 120,000.

(2-2)交聯劑 (2-2) Crosslinking agent

黏著劑組成物可更含有交聯劑(B)。交聯劑,係與如(甲基)丙烯酸系樹脂等基底聚合物中的特別是源自含有極性官能基之單體之結構單元進行反應,而使基底聚合物交聯之化合物。具體而言,可例示異氰酸酯系化合物、環氧系化合物、氮丙啶(aziridine)系化合物、金屬螯合物系化合物等。該等中,異氰酸酯系化合物、環氧系化合物以及氮丙啶系化合物,係在分子內具有至少2個可與基底聚合物中之極性官能基反應之官能基。交聯劑(B),可僅1種單獨使用,亦可併用2種以上。 The adhesive composition may further contain a crosslinking agent (B). The crosslinking agent is a compound that reacts with the structural unit of the base polymer such as (meth)acrylic resin, especially derived from a monomer containing a polar functional group, to crosslink the base polymer. Specifically, isocyanate-based compounds, epoxy-based compounds, aziridine-based compounds, metal chelate-based compounds, and the like can be exemplified. Among these, isocyanate-based compounds, epoxy-based compounds, and aziridine-based compounds have at least two functional groups in the molecule that can react with polar functional groups in the base polymer. The crosslinking agent (B) may be used alone or in combination of two or more kinds.

異氰酸酯系化合物,係在分子內具有至少2 個異氰酸酯基(-NCO)之化合物。異氰酸酯系化合物之具體例,係包含:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、二甲苯二異氰酸酯、氫化二甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、萘二異氰酸酯、三苯基甲烷三異氰酸酯等。再者,使該等異氰酸酯化合物與如甘油、三羥甲基丙烷等多元醇反應而成之加成物,或是使異氰酸酯化合物成為二倍體、三倍體等者,係亦可為交聯劑(B)。 Isocyanate compounds, which have at least 2 in the molecule One isocyanate group (-NCO) compound. Specific examples of isocyanate compounds include: toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylene diisocyanate, hydrogenated xylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenyl Methane diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, etc. Furthermore, the adducts formed by reacting these isocyanate compounds with polyols such as glycerin and trimethylolpropane, or the isocyanate compounds into diploid, triploid, etc., can also be cross-linked剂(B).

環氧系化合物,係在分子內具有至少2個環氧基之化合物。環氧系化合物之具體例,係包含:雙酚A型之環氧樹脂、乙二醇二環氧丙基醚、聚乙二醇二環氧丙基醚、丙三醇二環氧丙基醚、丙三醇三環氧丙基醚、1,6-己二醇二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、N,N-二環氧丙基苯胺、N,N,N’,N’-四環氧丙基-間苯二甲胺、1,3-雙(N,N’-二環氧丙基胺基甲基)環己烷等。 Epoxy compounds are compounds having at least two epoxy groups in the molecule. Specific examples of epoxy compounds include: bisphenol A type epoxy resin, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether , Glycerol triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, N,N-diglycidyl aniline, N, N,N',N'-tetraepoxypropyl-m-xylylenediamine, 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane, etc.

氮丙啶系化合物,係在分子內具有至少2個亦被稱為伸乙亞胺之由1個氮原子與2個碳原子所構成之3員環的骨架之化合物。氮丙啶系化合物之具體例,係包含:二苯基甲烷-4,4’-雙(1-氮丙啶甲醯胺)、甲苯-2,4-雙(1-氮丙啶甲醯胺)、三乙烯三聚氰胺、異酞醯基雙-1-(2-甲基氮丙啶)、參-1-氮丙啶基膦氧化物、六亞甲基-1,6-雙(1-氮丙啶甲醯胺)、三羥甲基丙烷-參-β-氮丙啶基丙酸酯、四羥甲基甲烷-參-β-氮丙啶基丙酸酯等。 The aziridine-based compound is a compound having at least two 3-membered ring skeletons, also called ethyleneimine, composed of one nitrogen atom and two carbon atoms in the molecule. Specific examples of aziridine compounds include: diphenylmethane-4,4'-bis(1-aziridine carboxamide), toluene-2,4-bis(1-aziridine carboxamide) ), triethylene melamine, isophthaloyl bis-1-(2-methylaziridine), ginseng-1-aziridinyl phosphine oxide, hexamethylene-1,6-bis(1-nitrogen Propidium methamide), trimethylolpropane-ginseng-β-aziridinyl propionate, tetramethylolmethane-ginseng-β-aziridinyl propionate, etc.

金屬螯合物化合物之具體例係包含:對於 鋁、鐵、銅、鋅、錫、鈦、鎳、銻、鎂、釩、鉻及鋯等多價金屬配位乙醯丙酮、乙醯乙酸乙酯而成之化合物等。 Specific examples of metal chelate compounds include: Aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, zirconium and other polyvalent metals coordinated with acetone and ethyl acetate.

相對於基底聚合物(使用2種以上時為該等之合計)之固形份100重量份,交聯劑(B)通常以0.05至5重量份之比例含有,較佳為以0.1至5重量份之比例含有。交聯劑(B)之含量為0.05重量份以上時,黏著劑層之耐久性有提升之傾向。 The crosslinking agent (B) is usually contained in a proportion of 0.05 to 5 parts by weight, preferably 0.1 to 5 parts by weight relative to 100 parts by weight of the solid content of the base polymer (when two or more are used in total) The ratio contains. When the content of the crosslinking agent (B) is 0.05 parts by weight or more, the durability of the adhesive layer tends to be improved.

(2-3)離子性化合物 (2-3) Ionic compounds

黏著劑組成物,可更含有離子性化合物(C)作為抗靜電劑。離子性化合物(C)係例如為具有無機陽離子或有機陽離子與無機陰離子或有機陰離子之化合物。 The adhesive composition may further contain an ionic compound (C) as an antistatic agent. The ionic compound (C) is, for example, a compound having an inorganic cation or organic cation and an inorganic anion or organic anion.

無機陽離子可列舉例如:如鋰陽離子[Li+]、鈉陽離子[Na+]、鉀陽離子[K+]等鹼金屬離子,以及如鈹陽離子[Be2+]、鎂陽離子[Mg2+]、鈣陽離子[Ca2+]等鹼土金屬離子等。 Examples of inorganic cations include alkali metal ions such as lithium cation [Li + ], sodium cation [Na + ], potassium cation [K + ], and beryllium cation [Be 2+ ], magnesium cation [Mg 2+ ], Alkaline earth metal ions such as calcium cation [Ca 2+ ], etc.

有機陽離子可列舉例如:咪唑鎓陽離子、吡啶鎓陽離子、吡咯啶鎓陽離子、銨陽離子、鋶陽離子、鏻陽離子等。 Examples of organic cations include imidazolium cations, pyridinium cations, pyrrolidinium cations, ammonium cations, sulfonium cations, and phosphonium cations.

上述陽離子成分中,有機陽離子成分係在黏著劑組成物中之相溶性優異。有機陽離子成分中,吡啶鎓陽離子及咪唑鎓陽離子係以抗靜電性之觀點而言為有利。 Among the above-mentioned cationic components, the organic cationic component has excellent compatibility in the adhesive composition. Among the organic cation components, pyridinium cations and imidazolium cations are advantageous from the viewpoint of antistatic properties.

無機陰離子可列舉例如:氯陰離子[Cl-]、溴陰離子[Br-]、碘陰離子[I-]、四氯鋁酸鹽陰離子[AlCl4 -]、七 氯二鋁酸鹽陰離子[Al2Cl7 -]、四氟硼酸鹽陰離子[BF4 -]、六氟磷酸鹽陰離子[PF6 -]、過氯酸鹽陰離子[ClO4 --]、硝酸鹽陰離子[NO3 -]、六氟砷酸鹽陰離子[AsF6 -]、六氟銻酸鹽陰離子[SbF6 -]、六氟鈮酸鹽陰離子[NbF6 -]、六氟鉭酸鹽陰離子[TaF6 -]、二氰亞胺陰離子[(CN)2N-]等。 Examples thereof include inorganic anions: chlorine anions [Cl -], bromine anion [Br -], iodide anion [I -], tetrachloroaluminate anion [AlCl 4 -], heptachlorodialuminate anion [Al 2 Cl 7--], tetrafluoroborate anion [BF 4 -], hexafluorophosphate anions [PF 6 -], perchlorate anion [ClO 4 - -], nitrate anion [NO 3 -], hexafluoro arsenic anions [AsF 6 -], hexafluoroantimonate anion [SbF 6 -], hexafluoro niobate anions [NbF 6 -], six tantalum fluoride anions [TaF 6 -], dicyanimide anion [(CN) 2 N -] and the like.

有機陰離子可列舉例如:乙酸鹽陰離子[CH3COO-]、三氟乙酸鹽陰離子[CF3COO-]、甲烷磺酸鹽陰離子[CH3SO3 -]、三氟甲烷磺酸鹽陰離子[CF3SO3 -]、對甲苯磺酸鹽陰離子[p-CH3C6H4SO3 -]、雙(氟磺醯基)醯亞胺陰離子[(FSO2)2N-]、雙(三氟甲烷磺醯基)醯亞胺陰離子[(CF3SO2)2N-]、參(三氟甲烷磺醯基)甲烷化物(Methanide)陰離子[(CF3SO2)3C-]、二甲基亞膦酸鹽(dimethylphosphinate)陰離子[(CH3)2POO-]、(聚)氫氟酸氟化物陰離子[F(HF)n -](n為1至3左右)、硫氰酸鹽陰離子[SCN-]、全氟丁烷磺酸鹽陰離子[C4F9SO3 -]、雙(五氟乙烷磺醯基)醯亞胺陰離子[(C2F5SO2)2N-]、全氟丁酸鹽陰離子[C3F7COO-]、(三氟甲烷磺醯基)(三氟甲烷羰基)醯亞胺陰離子[(CF3SO2)(CF3CO)N-]、全氟丙烷-1,3-二磺酸鹽陰離子[-O3S(CF2)3SO3 -]、碳酸鹽陰離子[CO3 2-]等。上述陰離子成分中,含氟原子之陰離子成分係以抗靜電性之觀點而言為有利。 Examples thereof include an organic anion: acetate anion [CH 3 COO -], trifluoroacetate anion [CF 3 COO -], methanesulfonate anion [CH 3 SO 3 -], trifluoromethanesulfonate anion [CF 3 SO 3 -], p-toluenesulfonate anion [p-CH 3 C 6 H 4 SO 3 -], bis (sulfo-fluoro-acyl) acyl imide anion [(FSO 2) 2 N - ], bis (C fluoro methanesulfonamide acyl) acyl imide anion [(CF 3 SO 2) 2 N -], reference (trifluoromethane sulfonic acyl) methanide (methanide) anion [(CF 3 SO 2) 3 C -], two methylsulfinyl phosphonate (dimethylphosphinate) anion [(CH 3) 2 POO - ], ( poly) hydrofluoric acid fluoride anion [F (HF) n -] (n is about 1 to 3), thiocyanate anion [SCN -], perfluorobutanesulfonate anion [C 4 F 9 SO 3 - ], bis (pentafluoroethane sulfonic acyl) acyl imide anion [(C 2 F 5 SO 2 ) 2 N - ], perfluoro butyrate anion [C 3 F 7 COO -] , ( trifluoromethane sulfonic acyl) (trifluoromethane-carbonyl) acyl imide anion [(CF 3 SO 2) ( CF 3 CO) N -] , perfluoro-1,3-disulfonate anion [- O 3 S (CF 2 ) 3 SO 3 -], the anion carbonate [CO 3 2-] and the like. Among the above-mentioned anion components, the anion component containing a fluorine atom is advantageous from the viewpoint of antistatic properties.

離子性化合物(C)之具體例,可從上述陽離子成分與陰離子成分之組合適當地選擇。具有有機陽離子之離子性化合物(C)之例子,係依有機陽離子的結構分類並 列示如下述者:吡啶鎓鹽:六氟磷酸N-己基吡啶鎓、六氟磷酸N-辛基吡啶鎓、六氟磷酸N-辛基-4-甲基吡啶鎓、六氟磷酸N-丁基-4-甲基吡啶鎓、六氟磷酸四丁基銨、雙(氟磺醯基)醯亞胺N-癸基吡啶鎓、雙(氟磺醯基)醯亞胺N-十二烷基吡啶鎓、雙(氟磺醯基)醯亞胺N-十四烷基吡啶鎓、雙(氟磺醯基)醯亞胺N-十六烷基吡啶鎓、雙(氟磺醯基)醯亞胺N-十二烷基-4-甲基吡啶鎓、雙(氟磺醯基)醯亞胺N-十四烷基-4-甲基吡啶鎓、雙(氟磺醯基)醯亞胺N-十六烷基-4-甲基吡啶鎓、雙(氟磺醯基)醯亞胺N-苄基-2-甲基吡啶鎓、雙(氟磺醯基)醯亞胺N-苄基-4-甲基吡啶鎓、雙(三氟甲烷磺醯基)醯亞胺N-己基吡啶鎓、雙(三氟甲烷磺醯基)醯亞胺N-辛基吡啶鎓、雙(三氟甲烷磺醯基)醯亞胺N-辛基-4-甲基吡啶鎓、雙(三氟甲烷磺醯基)醯亞胺N-丁基-4-甲基吡啶鎓。 Specific examples of the ionic compound (C) can be appropriately selected from the combination of the above-mentioned cationic component and anionic component. Examples of ionic compounds (C) with organic cations are classified according to the structure of organic cations and Listed as follows: pyridinium salts: N-hexylpyridinium hexafluorophosphate, N-octylpyridinium hexafluorophosphate, N-octyl-4-methylpyridinium hexafluorophosphate, N-butyl hexafluorophosphate 4-methylpyridinium, tetrabutylammonium hexafluorophosphate, bis(fluorosulfonyl)imide N-decylpyridinium, bis(fluorosulfonyl)imide N-dodecyl Pyridinium, bis(fluorosulfonyl)imide N-tetradecylpyridinium, bis(fluorosulfonyl)imide N-hexadecylpyridinium, bis(fluorosulfonyl)imide Amine N-dodecyl-4-methylpyridinium, bis(fluorosulfonyl) imide N-tetradecyl-4-methylpyridinium, bis(fluorosulfonyl) imide N -Hexadecyl-4-methylpyridinium, bis(fluorosulfonyl)imid N-benzyl-2-methylpyridinium, bis(fluorosulfonyl)imid N-benzyl- 4-methylpyridinium, bis(trifluoromethanesulfonyl)imide N-hexylpyridinium, bis(trifluoromethanesulfonyl)imide N-octylpyridinium, bis(trifluoromethanesulfonyl) (Acetyl)imidine N-octyl-4-methylpyridinium, bis(trifluoromethanesulfonyl)imidine N-butyl-4-methylpyridinium.

咪唑鎓鹽:六氟磷酸1-乙基-3-甲基咪唑鎓、對甲苯磺酸1-乙基-3-甲基咪唑鎓、雙(氟磺醯基)醯亞胺1-乙基-3-甲基咪唑鎓、 雙(三氟甲烷磺醯基)醯亞胺1-乙基-3-甲基咪唑鎓、甲烷磺酸1-丁基-3-甲基咪唑鎓、雙(氟磺醯基)醯亞胺1-丁基-3-甲基咪唑鎓。 Imidazolium salt: 1-ethyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium p-toluenesulfonate, bis(fluorosulfonyl)imide 1-ethyl- 3-methylimidazolium, Bis(trifluoromethanesulfonyl)imide 1-ethyl-3-methylimidazolium, 1-butyl-3-methylimidazolium methanesulfonate, bis(fluorosulfonyl)imide 1 -Butyl-3-methylimidazolium.

吡咯啶鎓鹽:六氟磷酸N-丁基-N-甲基吡咯啶鎓、雙(氟磺醯基)醯亞胺N-丁基-N-甲基吡咯啶鎓、雙(三氟甲烷磺醯基)醯亞胺N-丁基-N-甲基吡咯啶鎓。 Pyrrolidinium salt: N-butyl-N-methylpyrrolidinium hexafluorophosphate, bis(fluorosulfonyl)imine N-butyl-N-methylpyrrolidinium, bis(trifluoromethanesulfon) (Amino)amido N-butyl-N-methylpyrrolidinium.

4級銨鹽:對甲苯磺酸四丁基銨、雙(三氟甲烷磺醯基)醯亞胺(2-羥基乙基)三甲基銨、二甲基亞膦酸(2-羥基乙基)三甲基銨。 Quaternary ammonium salt: tetrabutylammonium p-toluenesulfonate, bis(trifluoromethanesulfonyl) imide (2-hydroxyethyl) trimethylammonium, dimethyl phosphonite (2-hydroxyethyl) ) Trimethylammonium.

再者,若要列舉具有無機陽離子之離子性化合物(C)之例子,則有下述者:溴化鋰、碘化鋰、四氟硼酸鋰、六氟磷酸鋰、硫氰酸鋰、過氯酸鋰、三氟甲烷磺酸鋰、雙(氟磺醯基)醯亞胺鋰、雙(三氟甲烷磺醯基)醯亞胺鋰、雙(五氟乙烷磺醯基)醯亞胺鋰、參(三氟甲烷磺醯基)甲烷化鋰、 對甲苯磺酸鋰、六氟磷酸鈉、雙(氟磺醯基)醯亞胺鈉、雙(三氟甲烷磺醯基)醯亞胺鈉、對甲苯磺酸鈉、六氟磷酸鉀、雙(氟磺醯基)醯亞胺鉀、雙(三氟甲烷磺醯基)醯亞胺鉀、對甲苯磺酸鉀。 Furthermore, if an ionic compound (C) with an inorganic cation is to be cited, there are the following: lithium bromide, lithium iodide, lithium tetrafluoroborate, lithium hexafluorophosphate, lithium thiocyanate, lithium perchlorate, trifluoro Lithium methanesulfonate, lithium bis(fluorosulfonyl) imide, lithium bis(trifluoromethanesulfonyl) imide, lithium bis(pentafluoroethanesulfonyl) imide, ginseng (trifluoromethanesulfonyl) lithium Methanesulfonyl) lithium methanide, Lithium p-toluenesulfonate, sodium hexafluorophosphate, sodium bis(fluorosulfonyl) imide, sodium bis(trifluoromethanesulfonyl) imide, sodium p-toluenesulfonate, potassium hexafluorophosphate, bis( Potassium fluorosulfonyl)imidate, potassium bis(trifluoromethanesulfonyl)imidate, potassium p-toluenesulfonate.

從抗靜電性之持續性之觀點而言,離子性化合物(C)為具有30℃以上的熔點,更佳為35℃以上的熔點。另一方面,從與基底聚合物之相溶性之觀點而言,離子性化合物(C)較佳為具有90℃以下的熔點,更佳為70℃以下的熔點,又更佳為未達50℃的熔點。 From the viewpoint of continuity of antistatic properties, the ionic compound (C) has a melting point of 30°C or higher, more preferably a melting point of 35°C or higher. On the other hand, from the viewpoint of compatibility with the base polymer, the ionic compound (C) preferably has a melting point of 90°C or less, more preferably a melting point of 70°C or less, and still more preferably less than 50°C The melting point.

相對於基底聚合物(使用2種以上時為該等之合計)之固形份100重量份,離子性化合物(C)較佳為以0.2至8重量份之比例調配,更佳為以0.2至5重量份之比例調配。離子性化合物(C)的含量為0.2重量份以上時,對抗靜電性的提升為有利,含量為8重量份以下時,對黏著劑層的耐久性提升為有利。 The ionic compound (C) is preferably formulated in a ratio of 0.2 to 8 parts by weight, more preferably 0.2 to 5 parts by weight relative to 100 parts by weight of the solid content of the base polymer (when two or more are used in total) The proportion of parts by weight is deployed. When the content of the ionic compound (C) is 0.2 parts by weight or more, it is advantageous to improve the antistatic properties, and when the content is 8 parts by weight or less, it is advantageous to improve the durability of the adhesive layer.

(2-4)矽烷化合物 (2-4) Silane compounds

當附黏著劑層之樹脂膜的黏著劑層貼合於由玻璃所構成之光學構件時,為了使黏著劑層與玻璃之密接性提升,黏著劑組成物可更含有矽烷化合物(D)。 When the adhesive layer of the resin film of the adhesive layer is attached to an optical member made of glass, in order to improve the adhesion between the adhesive layer and the glass, the adhesive composition may further contain a silane compound (D).

矽烷化合物(D)可列舉例如:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基參(2-甲氧基乙氧基)矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-甲基丙烯醯基氧基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基二甲氧基甲基矽烷、3-環氧丙氧基丙基乙氧基二甲基矽烷等。亦可使用2種以上之矽烷化合物。 Examples of the silane compound (D) include vinyl trimethoxy silane, vinyl triethoxy silane, vinyl ginseng (2-methoxyethoxy) silane, and N-(2-aminoethyl)- 3-Aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Glycidoxy propyl trimethoxy silane, 3-glycidoxy propyl methyl dimethoxy silane, 2-(3,4-epoxycyclohexyl) ethyl trimethoxy silane, 3- Chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ring Oxypropoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyldimethoxymethylsilane, 3-glycidoxypropoxy Propyl ethoxy dimethyl silane and so on. Two or more silane compounds can also be used.

矽烷化合物(D)亦可為聚矽氧寡聚物(silicone oligomer)類。聚矽氧寡聚物可列舉例如下述者:3-巰基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-巰基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-巰基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-巰基丙基三乙氧基矽烷-四乙氧基矽烷共聚物等含有巰基丙基之共聚物;巰基甲基三甲氧基矽烷-四甲氧基矽烷共聚物、巰基甲基三甲氧基矽烷-四乙氧基矽烷共聚物、巰基甲基三乙氧基矽烷-四甲氧基矽烷共聚物、巰基甲基三乙氧基矽烷-四乙氧基矽烷共聚物 等含有巰基甲基之共聚物;3-環氧丙氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-環氧丙氧基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-環氧丙氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等含有3-環氧丙氧基丙基之共聚物;3-甲基丙烯醯基氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、 3-甲基丙烯醯基氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-甲基丙烯醯基氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等含有甲基丙烯醯基氧基丙基之共聚物;3-丙烯醯基氧基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-丙烯醯基氧基丙基甲基二乙氧基矽烷-四甲氧基矽 烷共聚物、3-丙烯醯基氧基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等含有丙烯醯基氧基丙基之共聚物;乙烯基三甲氧基矽烷-四甲氧基矽烷共聚物、乙烯基三甲氧基矽烷-四乙氧基矽烷共聚物、乙烯基三乙氧基矽烷-四甲氧基矽烷共聚物、乙烯基三乙氧基矽烷-四乙氧基矽烷共聚物、乙烯基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、乙烯基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、乙烯基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、乙烯基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等含有乙烯基之共聚物;3-胺基丙基三甲氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基三甲氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基三乙氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基三乙氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基甲基二甲氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基甲基二甲氧基矽烷-四乙氧基矽烷共聚物、3-胺基丙基甲基二乙氧基矽烷-四甲氧基矽烷共聚物、3-胺基丙基甲基二乙氧基矽烷-四乙氧基矽烷共聚物等含有胺基之共聚物等。 The silane compound (D) can also be a silicone oligomer. Examples of the polysiloxane oligomer include the following: 3-mercaptopropyltrimethoxysilane-tetramethoxysilane copolymer, 3-mercaptopropyltrimethoxysilane-tetraethoxysilane copolymer, 3 -Mercaptopropyltriethoxysilane-tetramethoxysilane copolymer, 3-mercaptopropyltriethoxysilane-tetraethoxysilane copolymer and other copolymers containing mercaptopropyl; mercaptomethyltrimethoxy Methoxysilane-tetramethoxysilane copolymer, mercaptomethyltrimethoxysilane-tetraethoxysilane copolymer, mercaptomethyltriethoxysilane-tetramethoxysilane copolymer, mercaptomethyltriethoxy Silane-tetraethoxy silane copolymer Copolymers containing mercaptomethyl groups; 3-glycidoxypropyltrimethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropyltrimethoxysilane-tetraethoxysilane Copolymer, 3-glycidoxypropyltriethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropyltriethoxysilane-tetraethoxysilane copolymer, 3 -Glycidoxypropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropylmethyldimethoxysilane-tetraethoxysilane copolymer, 3 -Glycidoxypropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3-glycidoxypropylmethyldiethoxysilane-tetraethoxysilane copolymer, etc. Copolymer of 3-glycidoxypropyl; 3-methacryloxypropyl trimethoxysilane-tetramethoxysilane copolymer, 3-methacryloxypropyl trimethoxy Silane-tetraethoxysilane copolymer, 3-methacryloxypropyltriethoxysilane-tetramethoxysilane copolymer, 3-methacryloxypropyltriethoxysilane-tetraethoxysilane copolymer, 3-methacryloxypropylmethyldimethoxysilane-tetramethoxysilane copolymer Compound, 3-methacryloxypropylmethyldimethoxysilane-tetraethoxysilane copolymer, 3-methacryloxypropylmethyldiethoxysilane-tetramethyl Oxysilane copolymer, 3-methacryloxypropylmethyldiethoxysilane-tetraethoxysilane copolymer and other copolymers containing methacryloxypropyl; 3-propylene Acrylicoxypropyl trimethoxysilane-tetramethoxysilane copolymer, 3-propenyloxypropyl trimethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropyl Triethoxysilane-tetramethoxysilane copolymer, 3-propenyloxypropyltriethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropylmethyldimethyldimethyl Oxysilane-tetramethoxysilane copolymer, 3-propenyloxypropylmethyldimethoxysilane-tetraethoxysilane copolymer, 3-propenyloxypropylmethyldiethyl Oxysilane-tetramethoxysilane Alkyl copolymers, 3-propenyloxypropylmethyl diethoxysilane-tetraethoxysilane copolymers and other copolymers containing acrylicyloxypropyl; vinyl trimethoxysilane-tetramethyl Oxysilane copolymer, vinyl trimethoxysilane-tetraethoxysilane copolymer, vinyl triethoxysilane-tetramethoxysilane copolymer, vinyl triethoxysilane-tetraethoxysilane copolymer Copolymer, vinyl methyl dimethoxy silane-tetramethoxy silane copolymer, vinyl methyl dimethoxy silane-tetraethoxy silane copolymer, vinyl methyl diethoxy silane-tetra Methoxysilane copolymer, vinyl methyl diethoxysilane-tetraethoxysilane copolymer and other copolymers containing vinyl groups; 3-aminopropyl trimethoxysilane-tetramethoxysilane copolymer , 3-Aminopropyltrimethoxysilane-tetraethoxysilane copolymer, 3-aminopropyltriethoxysilane-tetramethoxysilane copolymer, 3-aminopropyltriethoxy Silane-tetraethoxysilane copolymer, 3-aminopropylmethyldimethoxysilane-tetramethoxysilane copolymer, 3-aminopropylmethyldimethoxysilane-tetraethoxy Silane copolymer, 3-aminopropylmethyldiethoxysilane-tetramethoxysilane copolymer, 3-aminopropylmethyldiethoxysilane-tetraethoxysilane copolymer, etc. Contain amines Base copolymer, etc.

相對於基底聚合物(使用2種以上時為該等之合計)之固形份100重量份,矽烷化合物(D)通常以0.01 至10重量份之比例含有,較佳為以0.05至5重量份之比例含有。矽烷化合物(D)之含量為0.01重量份以上時,可容易得到黏著劑層與玻璃之密接性提升效果。再者,含量為10重量份以下時,可抑制矽烷化合物(D)從黏著劑層滲出。 Relative to 100 parts by weight of the solid content of the base polymer (when two or more types are used, the total amount), the silane compound (D) is usually 0.01 It is contained in a ratio of to 10 parts by weight, preferably in a ratio of 0.05 to 5 parts by weight. When the content of the silane compound (D) is 0.01 parts by weight or more, the adhesion improvement effect between the adhesive layer and the glass can be easily obtained. Furthermore, when the content is 10 parts by weight or less, the silane compound (D) can be suppressed from exuding from the adhesive layer.

(2-5)其他成分 (2-5) Other ingredients

黏著劑組成物可含有交聯觸媒、耐候安定劑、增黏劑(tackifier)、可塑劑、軟化劑、染料、顏料、無機填料、光散亂性微粒子、黏著賦予劑等添加劑。 The adhesive composition may contain additives such as crosslinking catalysts, weathering stabilizers, tackifiers, plasticizers, softeners, dyes, pigments, inorganic fillers, light scattering particles, and adhesion imparting agents.

另外,亦可在黏著劑組成物中調配紫外線硬化性化合物並形成黏著劑層後照射紫外線使其硬化,而製成更硬之黏著劑層。 In addition, an ultraviolet curable compound may be blended into the adhesive composition to form an adhesive layer and then irradiated with ultraviolet rays to harden it to form a harder adhesive layer.

黏著劑組成物,通常藉由使其含有有機溶劑而調製作為溶解或分散有調配成分之黏著劑液。有機溶劑較佳為依據基底聚合物之種類來選擇。有機溶劑之具體例,係包含:如甲苯、二甲苯等芳香族系烴;如己烷、庚烷、戊烷等脂肪族系烴;如甲基乙基酮、甲基異丁基酮等酮類;如乙酸乙酯、乙酸丁酯等酯類。黏著劑液中之基底聚合物之濃度通常為3至20重量%。 The adhesive composition is usually prepared as an adhesive liquid in which the compounding components are dissolved or dispersed by containing an organic solvent. The organic solvent is preferably selected according to the type of the base polymer. Specific examples of organic solvents include: aromatic hydrocarbons such as toluene and xylene; aliphatic hydrocarbons such as hexane, heptane, and pentane; ketones such as methyl ethyl ketone and methyl isobutyl ketone Class; such as ethyl acetate, butyl acetate and other esters. The concentration of the base polymer in the adhesive liquid is usually 3 to 20% by weight.

(3)黏著劑組成物之塗佈 (3) Coating of adhesive composition

對樹脂膜10使用塗佈裝置50塗佈黏著劑組成物的方法並無特別限制,例如可使用:狹縫式模具(slot die)法、反轉凹版塗佈法、微凹版法、浸漬法、輥塗佈法、柔版印刷法等。由黏著劑組成物所構成之塗佈層11之厚度,係以 使附黏著劑層之樹脂膜25的黏著劑層13之厚度成為後述範圍之方式進行調整。 The method of applying the adhesive composition to the resin film 10 using the coating device 50 is not particularly limited. For example, a slot die method, a reverse gravure method, a microgravure method, a dipping method, Roll coating method, flexographic printing method, etc. The thickness of the coating layer 11 formed by the adhesive composition is It is adjusted so that the thickness of the adhesive layer 13 of the resin film 25 of an adhesive layer may become the range mentioned later.

如第1圖所示,更具體而言,塗佈步驟係可為在從第1饋送輥1連續捲出之長條樹脂膜10的一面上連續塗佈黏著劑組成物之步驟。此時,如第1圖所示,亦可將樹脂膜10一邊迴繞在塗佈用輥60一邊塗佈黏著劑組成物。 As shown in FIG. 1, more specifically, the coating step may be a step of continuously coating the adhesive composition on one side of the long resin film 10 continuously rolled out from the first feed roller 1. At this time, as shown in FIG. 1, the adhesive composition may be applied while winding the resin film 10 around the application roller 60.

以使樹脂膜10與黏著劑層之密接性提升為目的,亦可對於樹脂膜10之塗佈面施行如電暈處理、電漿處理(plasma treatment)、紫外線照射處理、火燄處理、皂化處理、底塗層形成處理等表面處理。 For the purpose of improving the adhesion between the resin film 10 and the adhesive layer, the coating surface of the resin film 10 may also be subjected to corona treatment, plasma treatment, ultraviolet radiation treatment, flame treatment, saponification treatment, Surface treatment such as primer formation treatment.

[乾燥步驟] [Drying step]

本步驟係使具有塗佈層11之樹脂膜15的塗佈層11乾燥(溶劑揮發),得到具有黏著劑層12之樹脂膜20的步驟(參照第1圖以及第3圖)。參照第1圖,乾燥步驟可藉由將由塗佈步驟所得之具有塗佈層11之長條樹脂膜15繼續連續運送並通過(導入)乾燥手段70來實施。 This step is a step of drying the coating layer 11 of the resin film 15 having the coating layer 11 (solvent volatilization) to obtain the resin film 20 having the adhesive layer 12 (refer to Figs. 1 and 3). 1, the drying step can be performed by continuously conveying the long resin film 15 with the coating layer 11 obtained in the coating step and passing (introducing) the drying means 70.

乾燥手段70只要是可將溶劑揮發之手段則無特別限制,例如為乾燥爐(加熱爐)。乾燥爐中,除了包含加熱手段之外,亦可更包含減壓手段。供給至乾燥爐內之熱風之風量、乾燥爐內之溫度以及壓力等乾燥條件,可在考量塗佈層11所含有之溶劑種類、或平滑性、結露等乾燥後之面狀態而適切地設定。乾燥溫度(例如乾燥爐內之溫度)通常為50至120℃,較佳為60至110℃。 The drying means 70 is not particularly limited as long as it can volatilize the solvent, and is, for example, a drying furnace (heating furnace). In addition to heating means, the drying furnace may further include pressure reducing means. Drying conditions such as the amount of hot air supplied to the drying oven, the temperature and pressure in the drying oven, etc. can be appropriately set in consideration of the type of solvent contained in the coating layer 11, or the state of the dried surface such as smoothness and condensation. The drying temperature (for example, the temperature in the drying furnace) is usually 50 to 120°C, preferably 60 to 110°C.

[平滑化處理步驟] [Smoothing processing steps]

本步驟係在具有黏著劑層12之樹脂膜20的黏著劑層12的外表面藉由按壓鏡面模具而使該面平滑化之步驟(參照第1圖以及第4圖)。經由本步驟,連續製造屬於「附樹脂膜之光學構件之中間物」的具有黏著劑層13(平滑化處理後)之附黏著劑層之樹脂膜25。藉由該平滑化處理,可改善黏著劑層13對光學構件之密接性。本發明的特徴之一,係將由塗佈層11乾燥而得之黏著劑層12不是供給至熟化步驟(不使黏著劑之硬化反應充分地進行),而是供給至平滑化處理之特點。藉此,可得到更值得記載之密接性提升效果。 This step is a step of smoothing the surface of the adhesive layer 12 of the resin film 20 having the adhesive layer 12 by pressing a mirror mold (refer to FIG. 1 and FIG. 4). Through this step, the resin film 25 with the adhesive layer with the adhesive layer 13 (after the smoothing process) belonging to the "intermediate of the optical member with the resin film" is continuously manufactured. By this smoothing treatment, the adhesion of the adhesive layer 13 to the optical member can be improved. One of the features of the present invention is that the adhesive layer 12 obtained by drying the coating layer 11 is not supplied to the maturation step (the curing reaction of the adhesive is not sufficiently advanced), but is a characteristic of the smoothing process. In this way, a more memorable effect of improving adhesion can be obtained.

上述平滑化處理,係可藉由將經由乾燥步驟所得之具有黏著劑層12之長條樹脂膜20繼續連續運送並使其通過平滑化處理裝置80而實施。在平滑化處理裝置80內,鏡面模具係被按壓在黏著劑層12的外表面。此時,與鏡面模具相接之黏著劑層12的溫度,較佳為未達黏著劑層組成物之玻璃轉移溫度。藉由使溫度未達玻璃轉移溫度,在將黏著劑層12從鏡面模具剝離時可防止黏著劑組成物附著在鏡面模具表面。黏著劑層12的溫度,可藉由控制平滑化處理裝置80內之環境溫度、或鏡面模具之表面溫度來調整。為了防止黏著劑層表面以及鏡面模具表面的結露,較佳為使平滑化處理裝置80內成為乾燥空氣或氮等不含有水分之環境。鏡面模具之按壓強度,只要是可轉印鏡面模具之表面形狀的強度即可而無特別限定,可依據黏著 劑層12之硬化進行程度而適當地調整。 The above-mentioned smoothing treatment can be implemented by continuously conveying the long resin film 20 with the adhesive layer 12 obtained through the drying step and passing it through the smoothing treatment device 80. In the smoothing processing device 80, the mirror mold is pressed against the outer surface of the adhesive layer 12. At this time, the temperature of the adhesive layer 12 in contact with the mirror mold is preferably lower than the glass transition temperature of the adhesive layer composition. By keeping the temperature below the glass transition temperature, the adhesive composition can be prevented from adhering to the surface of the mirror mold when the adhesive layer 12 is peeled from the mirror mold. The temperature of the adhesive layer 12 can be adjusted by controlling the ambient temperature in the smoothing processing device 80 or the surface temperature of the mirror mold. In order to prevent condensation on the surface of the adhesive layer and the surface of the mirror mold, it is preferable to make the inside of the smoothing treatment device 80 an environment that does not contain moisture such as dry air or nitrogen. The pressing strength of the mirror mold is not particularly limited as long as it can transfer the surface shape of the mirror mold. It can be based on the adhesion The degree of hardening of the agent layer 12 is appropriately adjusted.

鏡面模具,只要表面形狀為鏡面即可,整體形狀並無特別限定,可為平板狀,亦可為圓柱狀或圓筒狀之輥。由連續生產性之觀點而言,較佳為屬於圓柱狀或圓筒狀之模具的鏡面輥。鏡面輥中,較佳為可藉由輥內部之冷媒而控制表面溫度的冷卻輥。 As long as the surface shape of the mirror mold is a mirror surface, the overall shape is not particularly limited, and it may be a flat plate, or a cylindrical or cylindrical roller. From the viewpoint of continuous productivity, a mirror roller belonging to a cylindrical or cylindrical mold is preferable. Among the mirror rollers, a cooling roller whose surface temperature can be controlled by the refrigerant inside the roller is preferable.

鏡面模具之基材材質並無特別地限制,可從金屬、玻璃、碳、樹脂、或該等之複合物來適當地選擇。從加工性等之觀點而言,較佳為使用金屬。從成本之觀點而言,適用之金屬材料可列舉鋁、鐵、或以鋁或鐵為主體之合金等。從與黏著劑層之脫模性之觀點而言,較佳為使用氟系樹脂。在鏡面模具之表面,為了使其與黏著劑層容易分離,亦可施行脫模處理。脫模處理之例為氟處理等。 The substrate material of the mirror mold is not particularly limited, and can be appropriately selected from metal, glass, carbon, resin, or a composite of these. From the viewpoint of workability and the like, it is preferable to use metal. From a cost point of view, suitable metal materials include aluminum, iron, or alloys mainly composed of aluminum or iron. From the viewpoint of the releasability from the adhesive layer, it is preferable to use a fluorine-based resin. On the surface of the mirror mold, in order to make it easy to separate from the adhesive layer, mold release treatment can also be applied. Examples of mold release treatment are fluorine treatment and the like.

在平滑化處理裝置80內,鏡面模具之表面形狀轉印至黏著劑層12的外表面後,從具有黏著劑層13之樹脂膜25剝離鏡面模具。就剝離方法而言,並無特別限制,例如鏡面模具為鏡面輥時,較適用之方法為:在具有黏著劑層13之樹脂膜25與鏡面模具之分離點設置軋輥等壓合裝置,以該壓合裝置為支點,從鏡面模具將具有黏著劑層13之樹脂膜25予以剝離的方法。藉此,可將到達上述支點之樹脂膜25有效率且安定地予以剝離。 In the smoothing processing device 80, after the surface shape of the mirror mold is transferred to the outer surface of the adhesive layer 12, the mirror mold is peeled off from the resin film 25 having the adhesive layer 13. There are no special restrictions on the peeling method. For example, when the mirror mold is a mirror roller, a more suitable method is to install a pressing device such as a roller at the separation point between the resin film 25 with the adhesive layer 13 and the mirror mold, and The pressing device is a method of peeling the resin film 25 with the adhesive layer 13 from the mirror mold. Thereby, the resin film 25 which reached the said fulcrum can be peeled efficiently and stably.

經由平滑化處理步驟所得之附黏著劑層的樹脂膜25所具有之黏著劑層13之厚度,係例如為10至45μm,較佳為10至35μm。黏著劑層13之厚度為45μm 以下時,有利於其與光學構件之密接性。再者,其厚度為10μm以上時,黏著劑層13對於光學構件尺寸變化之追蹤性為良好。 The thickness of the adhesive layer 13 of the adhesive layer-attached resin film 25 obtained through the smoothing treatment step is, for example, 10 to 45 μm, preferably 10 to 35 μm. The thickness of the adhesive layer 13 is 45μm In the following cases, it is beneficial to the adhesion between the optical member and the optical member. Furthermore, when the thickness is 10 μm or more, the adhesive layer 13 has good tracking properties to the dimensional change of the optical member.

[貼合步驟] [Fitting steps]

本步驟係在附黏著劑層之樹脂膜25的黏著劑層13之外表面貼合光學構件30,得到附樹脂膜之光學構件40之步驟(參照第1圖以及第5圖)。如第5圖所示,附樹脂膜之光學構件40,係將附黏著劑層之樹脂膜25透過該黏著劑層13而積層貼合至光學構件30的表面者。依據本發明,可製造黏著劑層13與光學構件30之密接性良好的附樹脂膜之光學構件40。 This step is a step of bonding the optical member 30 to the outer surface of the adhesive layer 13 of the resin film 25 with the adhesive layer to obtain the optical member 40 with the resin film (refer to Figs. 1 and 5). As shown in FIG. 5, the optical member 40 with a resin film is obtained by laminating and bonding the resin film 25 with an adhesive layer through the adhesive layer 13 to the surface of the optical member 30. According to the present invention, it is possible to manufacture the optical member 40 with a resin film having good adhesion between the adhesive layer 13 and the optical member 30.

具體而言,貼合步驟可如下述般進行實施。在將經由平滑化處理步驟所得之長條狀之附黏著劑層之樹脂膜25繼續連續運送的同時,從第2饋送輥2將長條光學構件30一邊捲出一邊連續運送,在附黏著劑層之樹脂膜25之黏著劑層13的外表面(平滑化處理面)積層光學構件30,而製成積層體。將此積層體藉由使用一對貼合輥90等從上下方進行按壓,而連續製造附樹脂膜之光學構件40。從黏著劑層13與光學構件30之密接性之觀點而言,經由平滑化處理步驟所得之附黏著劑層之樹脂膜25,較佳為不暫時捲取為輥狀或施行其他處理,而是直接供給至與光學構件30貼合之步驟。 Specifically, the bonding step can be implemented as follows. While the long-length adhesive layer-attached resin film 25 obtained through the smoothing process is continuously transported, the long optical member 30 is continuously transported while being unrolled from the second feed roller 2, and the adhesive layer is attached. The optical member 30 is laminated on the outer surface (smoothing treatment surface) of the adhesive layer 13 of the resin film 25 to form a laminated body. This laminated body is pressed from above and below using a pair of bonding rolls 90 and the like to continuously manufacture the optical member 40 with a resin film. From the viewpoint of the adhesion between the adhesive layer 13 and the optical member 30, the adhesive layer-attached resin film 25 obtained through the smoothing treatment step is preferably not temporarily wound into a roll shape or subjected to other treatments, but It is directly supplied to the step of bonding with the optical member 30.

第1圖係表示在光學構件30的單面貼合附黏著劑層之樹脂膜25之例,惟亦可在光學構件30的雙面 貼合附黏著劑層之樹脂膜25。在光學構件30的雙面貼合附黏著劑層之樹脂膜25時,雙面之附黏著劑層之樹脂膜25可為同時貼合,亦可階段性貼合。 Figure 1 shows an example of bonding the adhesive layer-attached resin film 25 on one side of the optical member 30, but it can also be on both sides of the optical member 30 The resin film 25 with the adhesive layer is attached. When the resin film 25 with the adhesive layer is attached on both sides of the optical member 30, the resin film 25 with the adhesive layer on both sides may be attached at the same time or may be attached step by step.

光學構件30,可為單層或多層結構之光學膜等。光學膜之具體例係包含:偏光膜;光學補償膜(相位差膜等)、光擴散膜(片)、反射膜(片)等光學機能性膜;偏光膜用保護膜;偏光板;玻璃膜(包含玻璃片及玻璃基板);隔離膜;保護膜用之基材膜等。光學構件30較佳為偏光板。此外,當附黏著劑層之樹脂膜25為附黏著劑層之隔離膜且光學構件30為隔離膜時,則得到雙面附隔離膜之黏著劑層(黏著劑片)作為附樹脂膜之光學構件40。再者,當附黏著劑層之樹脂膜25為附黏著劑層之隔離膜且光學構件30為保護膜用之基材膜時,則得到附隔離膜之保護膜作為附樹脂膜之光學構件40。 The optical member 30 may be a single-layer or multi-layer optical film. Specific examples of optical films include: polarizing films; optical compensation films (phase difference films, etc.), light diffusion films (sheets), reflective films (sheets) and other optical functional films; protective films for polarizing films; polarizing plates; glass films (Including glass sheet and glass substrate); isolation film; base film for protective film, etc. The optical member 30 is preferably a polarizing plate. In addition, when the adhesive layer-attached resin film 25 is an adhesive layer-attached isolation film and the optical member 30 is an isolation film, an adhesive layer (adhesive sheet) with a double-sided isolation film is obtained as the optical resin film attached. Component 40. Furthermore, when the adhesive layer-attached resin film 25 is an adhesive layer-attached isolation film and the optical member 30 is a base film for a protective film, the isolation film-attached protective film is obtained as the resin film-attached optical member 40 .

此外,保護膜(亦稱為「表面保護膜」),係以保護光學構件表面免於損傷或污損為目的而暫時貼附於光學構件之可剝離膜,通常,是由包含熱可塑性樹脂之基材膜與積層於其上之黏著劑層所構成。 In addition, a protective film (also referred to as a "surface protective film") is a peelable film temporarily attached to an optical member for the purpose of protecting the surface of the optical member from damage or contamination. Usually, it is made of a thermoplastic resin It is composed of a base film and an adhesive layer laminated on it.

在光學構件30的與黏著劑層13外表面相接之表面的材質,並無特別限制,但若為即使在已進行通常實施之對該表面之電暈處理等能量照射處理後,黏著劑層13與光學構件30間仍未得到充分的密接性之表面材質時,本發明所述之製造方法係特別有效。在未進行平滑化處理時會難以獲得與黏著劑層13之充分密接性之光學構 件30的表面,係可舉例如包含(甲基)丙烯酸系樹脂之(典型上為由該樹脂所構成之)表面等。光學構件30為偏光板時,如此之表面係多數為由被貼合至偏光膜之保護膜、或光學補償膜(相位差膜等)所形成。 The material of the surface of the optical member 30 that is in contact with the outer surface of the adhesive layer 13 is not particularly limited. However, if it is even after the usual corona treatment or other energy irradiation treatment on the surface, the adhesive layer When a surface material with sufficient adhesion between 13 and the optical member 30 is not yet obtained, the manufacturing method of the present invention is particularly effective. If the smoothing process is not performed, it is difficult to obtain an optical structure with sufficient adhesion to the adhesive layer 13 The surface of the member 30 may be, for example, a surface containing (meth)acrylic resin (typically composed of the resin). When the optical member 30 is a polarizing plate, such a surface is mostly formed by a protective film bonded to a polarizing film or an optical compensation film (phase difference film, etc.).

偏光板可為在偏光膜之至少一面透過接著劑層而貼合保護膜者。該保護膜,亦可兼具有作為如相位差膜等光學補償膜的機能。偏光板,亦可為在偏光膜之至少一面積層有由硬化性樹脂所形成之硬化樹脂層者。再者,亦可在偏光膜上或保護膜或者是硬化樹脂層上透過接著劑層或黏著劑層而積層有例如相位差膜、亮度提升膜等其他光學機能性膜。 The polarizing plate may be a protective film attached to at least one side of the polarizing film through the adhesive layer. The protective film may also have a function as an optical compensation film such as a retardation film. The polarizing plate may also have a cured resin layer formed of a curable resin on at least one area of the polarizing film. In addition, other optically functional films such as retardation film and brightness enhancement film may be laminated on the polarizing film, protective film, or cured resin layer through the adhesive layer or adhesive layer.

偏光膜係具有從入射之自然光取出直線偏光之功能的膜,較佳例係使碘或二色性染料等二色性色素吸附配向於經單軸延伸之聚乙烯醇系樹脂膜者。偏光膜之厚度並無特別限制,通常為2至35μm。 The polarizing film is a film having a function of extracting linearly polarized light from incident natural light, and a preferred example is one that adsorbs and aligns a dichroic dye such as iodine or a dichroic dye to a uniaxially stretched polyvinyl alcohol resin film. The thickness of the polarizing film is not particularly limited, and is usually 2 to 35 μm.

保護膜可為具有透光性之(較佳為光學透明的)熱可塑性樹脂膜。熱可塑性樹脂之具體例,係包含:如鏈狀聚烯烴系樹脂(聚丙烯系樹脂等)、環狀聚烯烴系樹脂(降莰烯樹脂等)等聚烯烴系樹脂;聚酯系樹脂(聚對酞酸乙二酯等);(甲基)丙烯酸系樹脂(甲基丙烯酸甲酯系樹脂等);纖維素系樹脂(如三乙醯基纖維素、二乙醯基纖維素等乙酸纖維素系樹脂等);聚碳酸酯系樹脂;聚乙烯醇系樹脂;聚乙酸乙烯酯系樹脂;聚芳酯系樹脂;聚苯乙烯系樹脂;聚醚碸系樹脂;聚碸系樹脂;聚醯胺系樹脂;聚醯亞 胺系樹脂;以及該等之混合物、共聚物。保護膜之厚度,例如為5至200μm左右,較佳為10至150μm,更佳為15至100μm。 The protective film may be a light-transmitting (preferably optically transparent) thermoplastic resin film. Specific examples of thermoplastic resins include: polyolefin resins such as chain polyolefin resins (polypropylene resins, etc.), cyclic polyolefin resins (norbornene resins, etc.); polyester resins (poly Ethylene terephthalate, etc.); (meth)acrylic resins (methyl methacrylate resins, etc.); cellulose resins (such as triacetyl cellulose, diacetyl cellulose and other cellulose acetate Series resins, etc.); polycarbonate series resins; polyvinyl alcohol series resins; polyvinyl acetate series resins; polyarylate series resins; polystyrene series resins; polyether series resins; polysulfide series resins; polyamides Resin; Polyamide Amine resins; and their mixtures and copolymers. The thickness of the protective film is, for example, about 5 to 200 μm, preferably 10 to 150 μm, and more preferably 15 to 100 μm.

硬化樹脂層,係由熱硬化性樹脂或活性能量線硬化性樹脂等硬化性樹脂所形成。硬化性樹脂,可為包含熱聚合性化合物者,亦可為包含陽離子聚合性化合物者,又可為包含自由基聚合性化合物者,並且又可為包含該等複數種類者。硬化樹脂層之厚度係例如為0.1至10μm左右,較佳為1至5μm。 The curable resin layer is formed of curable resin such as thermosetting resin or active energy ray curable resin. The curable resin may include a thermopolymerizable compound, or a cation polymerizable compound, or a radical polymerizable compound, and may include these plural types. The thickness of the hardened resin layer is, for example, about 0.1 to 10 μm, preferably 1 to 5 μm.

在偏光膜之雙面貼合有保護膜時,該等保護膜可為由同種熱可塑性樹脂所構成者,亦可為由不同種熱可塑性樹脂所構成者。再者,厚度可相同,亦可不同。在偏光膜之雙面積層有硬化樹脂層時,該等硬化樹脂層可為由同種硬化性樹脂所形成者,亦可為由不同種硬化性樹脂所形成者。再者,厚度可相同,亦可不同。保護膜及硬化樹脂層,可具有如硬塗層、防眩層、抗反射層、光擴散層、抗靜電層、防污層、導電層等表面處理層(塗佈層)。在偏光膜之單面貼合有保護膜時或積層有硬化樹脂層時,附黏著劑層之樹脂膜25的黏著劑層13係可直接貼合於偏光膜面。 When protective films are attached to both sides of the polarizing film, the protective films may be made of the same kind of thermoplastic resin, or may be made of different kinds of thermoplastic resins. Furthermore, the thickness may be the same or different. When the two-area layer of the polarizing film has a hardened resin layer, the hardened resin layers may be made of the same kind of hardening resin, or may be made of different kinds of hardening resins. Furthermore, the thickness may be the same or different. The protective film and the hardened resin layer may have surface treatment layers (coating layers) such as a hard coat layer, an anti-glare layer, an anti-reflection layer, a light diffusion layer, an antistatic layer, an antifouling layer, and a conductive layer. When a protective film is attached to one side of the polarizing film or a hardened resin layer is laminated, the adhesive layer 13 of the resin film 25 with the adhesive layer can be directly attached to the surface of the polarizing film.

相位差膜係顯示光學異向性之光學膜,其可為下述膜:能夠使用於上述保護膜之由樹脂等所構成的熱可塑性樹脂膜之單軸或二軸延伸膜;藉由對熱可塑性樹脂膜塗布、配向液晶性化合物而展現光學異向性之膜;或 藉由對熱可塑性樹脂膜塗布無機層狀化合物而展現光學異向性之膜。 The retardation film is an optical film showing optical anisotropy, which can be the following film: a uniaxially or biaxially stretched film of a thermoplastic resin film composed of resin or the like that can be used in the protective film; Plastic resin film coating, aligning liquid crystal compounds to exhibit optical anisotropy; or A film exhibiting optical anisotropy by coating an inorganic layered compound on a thermoplastic resin film.

保護膜(或相位差膜等),可透過接著劑層而貼合於偏光膜。形成接著劑層之接著劑,係可使用水系接著劑、活性能量線硬化性接著劑或熱硬化性接著劑,較佳為水系接著劑、活性能量線硬化性接著劑。 The protective film (or retardation film, etc.) can be attached to the polarizing film through the adhesive layer. As the adhesive for forming the adhesive layer, a water-based adhesive, an active energy ray-curable adhesive or a thermosetting adhesive can be used, and a water-based adhesive or an active energy ray-curable adhesive is preferable.

水系接著劑,可列舉如包含聚乙烯醇系樹脂水溶液之接著劑、水系二液型胺甲酸乙酯系乳液接著劑等。其中較佳為使用包含聚乙烯醇系樹脂水溶液之水系接著劑。就聚乙烯醇系樹脂而言,除了可使用將屬於乙酸乙烯酯之均聚物的聚乙酸乙烯酯予以皂化處理而得之乙烯醇均聚物之外,亦可使用將乙酸乙烯酯以及可與其共聚合之其他單體的共聚物予以皂化處理而得之聚乙烯醇系共聚物、或將該等之羥基予以部分性改質而成之改質聚乙烯醇系聚合物等。水系接著劑係包含:醛化合物(乙二醛等)、環氧化合物、三聚氰胺系化合物、羥甲基化合物、異氰酸酯化合物,胺化合物、多價金屬鹽等交聯劑。 Examples of water-based adhesives include adhesives containing polyvinyl alcohol-based resin aqueous solutions, water-based two-component urethane emulsion adhesives, and the like. Among them, it is preferable to use an aqueous adhesive containing a polyvinyl alcohol-based resin aqueous solution. Regarding polyvinyl alcohol resins, in addition to vinyl alcohol homopolymers obtained by saponifying polyvinyl acetate which is a homopolymer of vinyl acetate, it is also possible to use vinyl acetate and those with Copolymerized copolymers of other monomers are saponified to obtain polyvinyl alcohol-based copolymers, or modified polyvinyl alcohol-based polymers obtained by partially modifying the hydroxyl groups. The water-based adhesive system includes crosslinking agents such as aldehyde compounds (glyoxal, etc.), epoxy compounds, melamine compounds, methylol compounds, isocyanate compounds, amine compounds, and polyvalent metal salts.

使用水系接著劑時,較佳係在將偏光膜與保護膜貼合後,實施用以將水系接著劑中所含有之水除去之乾燥步驟。乾燥步驟後,可設置例如於20至45℃左右之溫度進行熟化之熟化步驟。 When a water-based adhesive is used, it is preferable to perform a drying step to remove water contained in the water-based adhesive after bonding the polarizing film and the protective film. After the drying step, a aging step may be set for aging at a temperature of about 20 to 45°C.

上述活性能量線硬化性接著劑係意指可藉由照射如紫外線、可見光線、X射線,電子射線等活性能量線而硬化之接著劑,可列舉例如:包含聚合性化合物及 光聚合起始劑之硬化性組成物、包含光反應性樹脂之硬化性組成物、包含黏著劑樹脂及光反應性交聯劑之硬化性組成物等。較佳為紫外線硬化性接著劑。聚合性化合物可列舉:如光硬化性環氧系單體、光硬化性(甲基)丙烯酸系單體、光硬化性胺甲酸乙酯系單體等光聚合性單體、或源自光聚合性單體之寡聚物。光聚合起始劑可列舉如:包含會因照射活性能量線而產生如中性自由基、陰離子自由基、陽離子自由基等活性種的物質者。包含聚合性化合物及光聚合起始劑之活性能量線硬化性接著劑,較佳係可使用下述組成物:包含光硬化性環氧系單體及光陽離子聚合起始劑之硬化性組成物;包含光硬化性(甲基)丙烯酸系單體及光自由基聚合起始劑之硬化性組成物;或包含光硬化性環氧系單體、光硬化性(甲基)丙烯酸系單體、光陽離子聚合起始劑及光自由基聚合起始劑之硬化性組成物。 The above-mentioned active energy ray-curable adhesive means an adhesive that can be cured by irradiating active energy rays such as ultraviolet rays, visible rays, X-rays, electron rays, etc., and examples include: polymerizable compounds and A curable composition of a photopolymerization initiator, a curable composition of a photoreactive resin, a curable composition of an adhesive resin and a photoreactive crosslinking agent, etc. Preferably, it is an ultraviolet curable adhesive. Examples of polymerizable compounds include photopolymerizable monomers such as photocurable epoxy monomers, photocurable (meth)acrylic monomers, and photocurable urethane monomers, or photopolymerizable monomers derived from photopolymerization. Oligomers of sexual monomers. Examples of the photopolymerization initiator include those that contain active species such as neutral radicals, anionic radicals, and cationic radicals due to irradiation with active energy rays. The active energy ray curable adhesive containing a polymerizable compound and a photopolymerization initiator, preferably the following composition can be used: a curable composition containing a photocurable epoxy monomer and a photocationic polymerization initiator ; A curable composition containing a photocurable (meth)acrylic monomer and a photo-radical polymerization initiator; or a photocurable epoxy monomer, a photocurable (meth)acrylic monomer, Curable composition of photocationic polymerization initiator and photoradical polymerization initiator.

使用活性能量線硬化性接著劑時,在將偏光膜與保護膜貼合後,視需要進行乾燥步驟(惟,活性能量線硬化性接著劑可為實質上不含有溶劑成分之無溶劑型接著劑),繼而實施藉由照射活性能量線而使活性能量線硬化性接著劑硬化之硬化步驟。活性能量線的光源並無特別限定,較佳為在波長400nm以下具有發光分布的紫外線,具體而言,可使用低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、化學燈、黑光燈、微波激發水銀燈、金屬鹵化物燈等。 When using an active energy ray curable adhesive, after bonding the polarizing film and the protective film, a drying step is carried out if necessary (However, the active energy ray curable adhesive may be a solvent-free adhesive that does not substantially contain solvent components ), and then implement the curing step of curing the active energy ray curable adhesive by irradiating the active energy rays. The light source of the active energy ray is not particularly limited. It is preferably ultraviolet light having a luminous distribution at a wavelength of 400 nm or less. Specifically, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, chemical lamps, black light lamps, microwaves Exciting mercury lamps, metal halide lamps, etc.

在貼合保護膜前,為了提升接著性,亦可 在偏光膜及保護膜之至少任一者的貼合面施行如電暈處理、電漿處理、紫外線照射處理、火燄處理、皂化處理、底塗層形成處理等表面活性化處理。 Before laminating the protective film, in order to improve the adhesion, you can also Surface activation treatments such as corona treatment, plasma treatment, ultraviolet irradiation treatment, flame treatment, saponification treatment, and undercoat layer formation treatment are performed on the bonding surface of at least any one of the polarizing film and the protective film.

在偏光膜之雙面貼合有保護膜時,用於貼合該等保護膜之接著劑係可為同種接著劑,亦可為不同種接著劑。 When the protective film is attached to both sides of the polarizing film, the adhesive system used for attaching the protective film may be the same type of adhesive or different types of adhesives.

[其他步驟] [Other steps]

本發明之製造方法可更包含表面活性化步驟,其係對於光學構件30之與黏著劑層13的貼合面進行能量照射。從黏著劑層13與光學構件30之密接性之觀點而言,從「在表面活性化步驟進行能量照射」至「在貼合步驟將上述積層體使用一對貼合輥90等進行按壓」為止之時間,較佳為5秒以下。上述能量照射處理係例如可為電暈處理、電漿處理、紫外線照射處理等。其中,電暈處理係由於密接性之提升效果以及設備之簡便性而為較適用。 The manufacturing method of the present invention may further include a surface activation step in which energy irradiation is performed on the bonding surface of the optical member 30 and the adhesive layer 13. From the viewpoint of the adhesiveness of the adhesive layer 13 and the optical member 30, from "energy irradiation in the surface activation step" to "pressing the above-mentioned laminate with a pair of bonding rollers 90 etc. in the bonding step" The time is preferably 5 seconds or less. The energy irradiation treatment system may be, for example, corona treatment, plasma treatment, ultraviolet irradiation treatment, or the like. Among them, corona treatment is more suitable due to the improvement effect of adhesion and the simplicity of the equipment.

本發明之製造方法可包含捲繞步驟,其係藉由將經由貼合步驟而得之長條狀之附樹脂膜之光學構件40捲掛於捲繞輥3而以輥狀捲取成膜輥(參照第1圖)。再者,本發明之製造方法亦可包含熟化步驟,其係以捲繞步驟後之輥狀態進行黏著劑層13之熟化(熟成)。藉由實施熟化步驟,可促進黏著劑層13之硬化反應,並使黏著劑層13的黏著力提高。再者,藉由使黏著劑層13以密接於光學構件30之狀態進行熟化(黏著劑之硬化反應),而改善與光學構件30之相互作用(包含化學反應)、以及黏著劑對光 學構件30之潤濕性,故可更加提高黏著劑層13與光學構件30之密接性。熟化溫度係例如為20至45℃。 The manufacturing method of the present invention may include a winding step by winding the long optical member 40 with a resin film obtained through the laminating step on the winding roller 3 to wind the film forming roller in a roll shape (Refer to Figure 1). Furthermore, the manufacturing method of the present invention may also include a curing step, which is to perform curing (ageing) of the adhesive layer 13 in the roll state after the winding step. By implementing the curing step, the curing reaction of the adhesive layer 13 can be promoted, and the adhesive force of the adhesive layer 13 can be improved. Furthermore, by curing the adhesive layer 13 in a state in which it is in close contact with the optical member 30 (curing reaction of the adhesive), the interaction with the optical member 30 (including chemical reaction) and the light exposure of the adhesive are improved. The wettability of the academic member 30 can further improve the adhesion between the adhesive layer 13 and the optical member 30. The aging temperature is, for example, 20 to 45°C.

再者,本發明之製造方法亦可包含取代步驟,其係將在貼合步驟中之在附黏著劑層之樹脂膜25的黏著劑層13上所貼合的光學構件30(此光學構件亦稱為「第1光學構件」),以其他光學構件(此光學構件亦稱為「第2光學構件」)取代。 Furthermore, the manufacturing method of the present invention may also include a substitution step, which is to bond the optical member 30 (this optical member is also attached to the adhesive layer 13 of the adhesive layer-attached resin film 25 in the bonding step) It is referred to as the "first optical member"), and is replaced by another optical member (this optical member is also referred to as the "second optical member").

具體而言,例如當附黏著劑層之樹脂膜25為附黏著劑層之隔離膜且第1光學構件為隔離膜時,取代步驟可包含下述步驟:剝離步驟,其係將屬於第1光學構件之隔離膜予以剝離除去;以及貼合步驟(第2貼合步驟),其係繼而在附黏著劑層之樹脂膜25之黏著劑層13將例如偏光板等第2光學構件予以貼合。剝離步驟後,在第2貼合步驟前,亦可在黏著劑層13及第2光學構件之貼合面的至少任一者施行電暈處理、電漿處理、紫外線照射處理、火燄處理、皂化處理、底塗層形成處理等表面處理。 Specifically, for example, when the adhesive layer-attached resin film 25 is an adhesive layer-attached isolation film and the first optical member is an isolation film, the replacement step may include the following step: a peeling step, which will belong to the first optical component The separation film of the component is peeled and removed; and the bonding step (the second bonding step), which is followed by bonding a second optical member such as a polarizing plate to the adhesive layer 13 of the resin film 25 with the adhesive layer. After the peeling step, before the second bonding step, at least any one of the adhesive layer 13 and the bonding surface of the second optical member may be subjected to corona treatment, plasma treatment, ultraviolet irradiation treatment, flame treatment, and saponification Surface treatment such as treatment, primer formation treatment, etc.

如上所述,依據本發明,可提高附黏著劑層之樹脂膜25的黏著劑層13與光學構件30(第1光學構件)之密接性,係起因於以在乾燥步驟後之黏著劑層12的硬化反應未充分進行之狀態實施平滑化處理步驟,並且亦可提高取代第1光學構件之第2光學構件與黏著劑層13之密接性。 As described above, according to the present invention, the adhesion between the adhesive layer 13 of the resin film 25 of the adhesive layer and the optical member 30 (first optical member) can be improved, which is caused by the adhesive layer 12 after the drying step. The smoothing treatment step is performed in a state where the curing reaction of the resin is not sufficiently advanced, and the adhesion between the second optical member that replaces the first optical member and the adhesive layer 13 can also be improved.

再者,本發明之製造方法可包含下述步驟:如樹脂膜10為隔離膜時之情形般,將經由貼合步驟而 得之附樹脂膜之光學構件40的樹脂膜10剝離除去,並在露出之黏著劑層13的外表面貼合與光學構件30不同的光學構件之步驟。例如,當附黏著劑層之樹脂膜25為附黏著劑層之隔離膜且光學構件30為保護膜用之基材膜時,雖然得到附隔離膜之保護膜來作為附樹脂膜之光學構件40,但藉由從該保護膜剝離除去隔離膜,並在露出之黏著劑層13的外表面貼合偏光板,即可得到附保護膜之偏光板。 Furthermore, the manufacturing method of the present invention may include the following steps: as in the case when the resin film 10 is an isolating film, the bonding step The resin film 10 of the obtained optical member 40 with a resin film is peeled and removed, and an optical member different from the optical member 30 is bonded to the outer surface of the exposed adhesive layer 13. For example, when the adhesive layer-attached resin film 25 is an adhesive layer-attached isolation film and the optical member 30 is a base film for a protective film, although the isolation film-attached protective film is obtained as the resin film-attached optical member 40 However, by peeling and removing the isolation film from the protective film, and attaching a polarizing plate to the outer surface of the exposed adhesive layer 13, a polarizing plate with a protective film can be obtained.

1‧‧‧第1饋送輥 1‧‧‧The first feed roller

2‧‧‧第2饋送輥 2‧‧‧The second feed roller

3‧‧‧捲繞輥 3‧‧‧Winding roller

10‧‧‧樹脂膜 10‧‧‧Resin film

15‧‧‧具有塗佈層之樹脂膜 15‧‧‧Resin film with coating layer

20‧‧‧具有黏著劑層(平滑化處理前)之樹脂膜 20‧‧‧Resin film with adhesive layer (before smoothing treatment)

25‧‧‧附黏著劑層之樹脂膜 25‧‧‧Resin film with adhesive layer

30‧‧‧光學構件 30‧‧‧Optical components

40‧‧‧附樹脂膜之光學構件 40‧‧‧Optical components with resin film

50‧‧‧塗佈裝置 50‧‧‧Coating device

60‧‧‧塗佈用輥 60‧‧‧Coating roller

70‧‧‧乾燥手段 70‧‧‧Drying means

80‧‧‧平滑化處理裝置 80‧‧‧Smoothing device

90‧‧‧貼合輥 90‧‧‧Laminating Roll

Claims (7)

一種附樹脂膜之光學構件的製造方法,係包含下述步驟:塗佈步驟,係在長條狀的樹脂膜上塗佈黏著劑組成物而形成塗佈層;乾燥步驟,係藉由將前述塗佈步驟後之膜一邊連續運送一邊導入乾燥手段使前述塗佈層乾燥,而得到具有黏著劑層之樹脂膜;平滑化處理步驟,係將前述具有黏著劑層之樹脂膜一邊連續運送,一邊在該黏著劑層的外表面按壓表面經氟處理之鏡面模具;以及貼合步驟,係將前述平滑化處理步驟後之前述樹脂膜一邊繼續連續運送,一邊在該黏著劑層的外表面積層長條的光學構件,並且從上下按壓此積層體。 A method for manufacturing an optical component with a resin film includes the following steps: a coating step, which is to coat an adhesive composition on a long resin film to form a coating layer; and a drying step, to After the coating step, the film is continuously transported while introducing a drying means to dry the coating layer to obtain a resin film with an adhesive layer; the smoothing treatment step is to continuously transport the aforementioned resin film with an adhesive layer Press the fluorine-treated mirror surface mold on the outer surface of the adhesive layer; and the laminating step is to continuously transport the resin film after the smoothing treatment step while growing on the outer surface of the adhesive layer Strip the optical member, and press this laminate from above and below. 如申請專利範圍第1項所述之製造方法,其更包含下述步驟:熟化步驟,係將由前述貼合步驟得到之附樹脂膜之光學構件捲繞成輥狀,以輥狀態進行前述黏著劑層的熟化。 The manufacturing method described in claim 1 further includes the following steps: the curing step is to wind the optical member with the resin film obtained in the aforementioned bonding step into a roll shape, and apply the aforementioned adhesive in the roll state Layer maturation. 如申請專利範圍第1或2項所述之製造方法,其中,在前述平滑化處理步驟中,與鏡面模具相接之黏著劑層之溫度係未達前述黏著劑組成物的玻璃轉移溫度。 The manufacturing method described in item 1 or 2 of the scope of patent application, wherein in the aforementioned smoothing treatment step, the temperature of the adhesive layer in contact with the mirror mold is lower than the glass transition temperature of the aforementioned adhesive composition. 如申請專利範圍第1或2項所述之製造方法,其更包含下述步驟: 表面活性化步驟,係在前述貼合步驟之前,對於前述光學構件的與前述黏著劑層的貼合面進行能量照射。 For example, the manufacturing method described in item 1 or 2 of the scope of patent application further includes the following steps: The surface activation step is performed before the bonding step to perform energy irradiation on the bonding surface of the optical member and the adhesive layer. 如申請專利範圍第1或2項所述之製造方法,其中,前述光學構件的與前述黏著劑層外表面相接之表面係包含(甲基)丙烯酸系樹脂。 According to the manufacturing method described in claim 1 or 2, wherein the surface of the optical member in contact with the outer surface of the adhesive layer contains (meth)acrylic resin. 如申請專利範圍第1或2項所述之製造方法,其中,前述光學構件係偏光板。 According to the manufacturing method described in item 1 or 2 of the scope of patent application, the aforementioned optical member is a polarizing plate. 如申請專利範圍第1或2項所述之製造方法,其中,前述樹脂膜係隔離膜(separate film)。 The manufacturing method described in item 1 or 2 of the scope of patent application, wherein the aforementioned resin film is a separate film.
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