TWI708136B - CPU cooling module - Google Patents
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- TWI708136B TWI708136B TW108132622A TW108132622A TWI708136B TW I708136 B TWI708136 B TW I708136B TW 108132622 A TW108132622 A TW 108132622A TW 108132622 A TW108132622 A TW 108132622A TW I708136 B TWI708136 B TW I708136B
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Abstract
一種CPU散熱模組,包含一CPU安裝架、一第一散熱塊,及數鎖固螺栓。該CPU安裝架包括一底座,及一與該底座連接的頂蓋,該頂蓋可相對於該底座在一打開位置與一閉合位置之間變換,該頂蓋具有數螺孔。該第一散熱塊位於該頂蓋上方,並具有一第一頂面,及一第一底面。該第一散熱塊形成有數從該第一頂面延伸至該第一底面並分別對應於該等螺孔的穿孔。每一鎖固螺栓穿過各別的穿孔至與各別的螺孔可拆卸地螺接。A CPU heat dissipation module includes a CPU mounting frame, a first heat dissipation block, and several locking bolts. The CPU mounting frame includes a base and a top cover connected with the base. The top cover can be changed between an open position and a closed position relative to the base, and the top cover has several screw holes. The first heat dissipation block is located above the top cover and has a first top surface and a first bottom surface. The first heat dissipation block is formed with a number of through holes extending from the first top surface to the first bottom surface and respectively corresponding to the screw holes. Each locking bolt passes through a respective perforation to be detachably screwed with a respective screw hole.
Description
本發明是有關於一種散熱模組,特別是指一種CPU散熱模組。 The invention relates to a heat dissipation module, in particular to a CPU heat dissipation module.
如圖1所示,習知在電腦主機內將一散熱塊1固定在一主機板2上的方式,通常是在該散熱塊1上安裝一帶有數組扣合機構301的支架3,以利用該等扣合機構301去分別扣卡於該主機板2的數卡孔201,而使該熱散塊1的底面可與該主機板2上的一中央處理器4接觸,以對該中央處理器4進行散熱,然而,該等扣合機構301是利用迫撐的技術手段來扣卡於該主機板2的卡孔201,其固定效果並非十分良好,而且,若該主機板2在使用一段時間後產生變形的情形,也會對該等扣合機構301的固定效果產生影響,如此,即會造成該散熱塊1與該中央處理器4接觸不良,而影響散熱效果。此外,若為了增加散熱效果,而使該散熱塊1的厚度變厚,則該等扣合機構301的長度往往也需配合變長,唯,過長的扣合機構301,不僅在扣合的操作上不易落實,也會對固定的效果產生影響。
As shown in Figure 1, the conventional method of fixing a
因此,本發明之目的,即在提供一種能夠克服先前技術的至少一個缺點的CPU散熱模組。 Therefore, the purpose of the present invention is to provide a CPU heat dissipation module that can overcome at least one of the disadvantages of the prior art.
於是,本發明CPU散熱模組,包含一CPU安裝架、一第一散熱塊,及數鎖固螺栓。 Therefore, the CPU heat dissipation module of the present invention includes a CPU mounting frame, a first heat dissipation block, and several locking bolts.
該CPU安裝架包括一底座,及一與該底座連接的頂蓋,該頂蓋可相對於該底座在一打開位置與一閉合位置之間變換,該頂蓋具有數螺孔。 The CPU mounting frame includes a base and a top cover connected with the base. The top cover can be changed between an open position and a closed position relative to the base, and the top cover has several screw holes.
該第一散熱塊位於該頂蓋上方,並具有一第一頂面,及一第一底面,該第一散熱塊形成有數從該第一頂面延伸至該第一底面並分別對應於該等螺孔的穿孔。 The first heat dissipation block is located above the top cover and has a first top surface and a first bottom surface. The first heat dissipation block is formed with a number extending from the first top surface to the first bottom surface and respectively corresponding to the Perforation of screw holes.
該等鎖固螺栓分別對應於該等穿孔,每一鎖固螺栓穿過各別的穿孔至與各別的螺孔可拆卸地螺接。 The locking bolts respectively correspond to the perforations, and each locking bolt passes through the respective perforations to be detachably screwed with the respective screw holes.
本發明之功效在於:利用該等鎖固螺栓穿過該第一散熱塊的穿孔至與該CUP安裝架的頂蓋的螺孔螺接,可對該第一散熱塊產生良好的固定效果,而將該第一散熱塊穩固地固定於頂蓋上,此外,即便在一主機板使用一段時間後產生變形的情形下,也不會影響該等鎖固螺栓鎖固於該頂蓋所產生的固定效果,本發明可確保該第一散熱塊與一央中處理器穩固地接觸,而對該央中處理器產生良好的散熱效果。 The effect of the present invention is that by using the locking bolts to pass through the through holes of the first heat dissipation block to be screwed with the screw holes of the top cover of the CUP mounting frame, a good fixing effect can be produced for the first heat dissipation block, and The first heat sink is firmly fixed on the top cover. In addition, even if a motherboard is deformed after a period of use, it will not affect the fixing of the locking bolts to the top cover. As a result, the present invention can ensure that the first heat sink is firmly in contact with a central processor, and has a good heat dissipation effect on the central processor.
100:CPU散熱模組 100: CPU cooling module
10:CPU安裝架 10: CPU mounting frame
11:底座 11: Base
12:頂蓋 12: Top cover
121:螺孔 121: screw hole
20:第一散熱塊 20: The first heat sink
21:芯部 21: Core
211:第一頂面 211: First Top Surface
212:第一底面 212: first bottom
213:第一周面 213: First week
214:第一插孔 214: First jack
215:側插孔 215: side jack
22:第一鰭片部 22: The first fin
23:第二鰭片部 23: second fin
24:穿孔 24: Piercing
30:鎖固螺栓 30: Locking bolt
40:第二散熱塊 40: second heat sink
41:芯部 41: Core
411:第二底面 411: second bottom
412:第二插孔 412: second jack
413:第二插孔 413: second jack
50:熱管 50: heat pipe
51:蒸發段 51: Evaporation section
52:凝結段 52: Condensation section
X:第一方向 X: first direction
Y:第二方向 Y: second direction
Z:厚度方向 Z: thickness direction
200:主機板 200: Motherboard
210:處理器插槽 210: processor socket
220:中央處理器 220: Central Processing Unit
221:散熱片 221: heat sink
300:散熱風扇 300: cooling fan
1:散熱塊 1: heat sink
2:主機板 2: Motherboard
201:卡孔 201: card hole
3:支架 3: bracket
301:扣合機構 301: Fastening mechanism
4:中央處理器 4: central processing unit
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一分解立體圖,說明習知的一散熱塊固定於一主機板上的方式;圖2是本發明的CPU散熱模組的一第一實施例設置於一主機板的一不完整的分解立體圖,說明該第一實施例的一CPU安裝架的一頂蓋在一閉合位置;圖3是圖2的一組合側視圖;圖4是該CPU安裝架搭配一處理器插槽與一中央處理器設置於該主機板上的一不完整的組合立體圖,說明該CPU安裝架的頂蓋在一打開位置;圖5該第一實施例的一第一散熱塊的一俯視圖;圖6是一類似於圖3的視圖,說明該第一散熱塊上可視需求另外安裝一散熱風扇;圖7是本發明的CPU散熱模組的一第二實施例組的一局部分解立體圖;圖8是圖7的一組合側視圖;圖9是一類似於圖8的視圖,說明該第二實施例的一第二散熱塊上可視需求另外安裝該散熱風扇;及 圖10是本發明的CPU散熱模組的一第三實施例組的一組合側視圖。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is an exploded perspective view illustrating the conventional method of fixing a heat sink on a motherboard; FIG. 2 is An incomplete exploded perspective view of a first embodiment of the CPU heat dissipation module of the present invention disposed on a motherboard, illustrating that a top cover of a CPU mounting frame of the first embodiment is in a closed position; FIG. 3 is a diagram 2 is a combined side view; Figure 4 is an incomplete combined perspective view of the CPU mounting frame with a processor socket and a central processing unit set on the motherboard, illustrating that the top cover of the CPU mounting frame is opened Location; Figure 5 is a top view of a first heat dissipation block of the first embodiment; Figure 6 is a view similar to Figure 3, illustrating that the first heat dissipation block may be installed on the additional cooling fan; Figure 7 is the present invention A partial exploded perspective view of a second embodiment group of the CPU heat dissipation module; Fig. 8 is a combined side view of Fig. 7; Fig. 9 is a view similar to Fig. 8 illustrating a second embodiment of the second embodiment The cooling fan may be additionally installed on the cooling block if required; and 10 is a combined side view of a third embodiment group of the CPU heat dissipation module of the present invention.
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.
參閱圖2、3、4,為本發明CPU散熱模組100的一第一實施例,該門鎖100適用於設置於一主機板200上,並可與一處理器插槽210及一中央處理器220配合使用。該CPU散熱模組100包含一CPU安裝架10、一第一散熱塊20,及四鎖固螺栓30。
Refer to Figures 2, 3, and 4, which are a first embodiment of the CPU
該CPU安裝架10包括一底座11,及一與該底座11連接的頂蓋12,該頂蓋12可相對於該底座10在一打開位置(見圖4)與一閉合位置(見圖2)之間變換,該頂蓋12具有四螺孔121。可以理解的是,在本第一實施例的其他變化例中,該等螺孔121的數目也可以為二個、三個或多於四個。此外,在本第一實施例中,該處理器插槽210是設置於該底座11,該中央處理器220是安裝於該處理器插槽210,並具有一位於頂端的散熱片221,當該頂蓋12在該閉合位置時,可使該中央處理器220與該處理器插槽210穩固地結合。
The
如圖2、3、5所示,該第一散熱塊20位於該頂蓋11上方,並包括一沿一厚度方向Z延伸的芯部21、數個兩兩相對地設置於該芯部21的第一鰭片部22,及數個兩兩相對地設置於該芯部21的第二鰭片部23。
As shown in Figures 2, 3, and 5, the first
該芯部21具有一第一頂面211、一第一底面212,及一連接於該第一頂面211與該第一底面212之間的第一外周面213。
The
該等第一鰭片部22從該第一外周面213沿一第一方向X朝外延伸,且該等第一鰭片部22在一相交於該第一方向X的第二方向Y上間隔排列,該等第二鰭片部23從該第一外周面213沿該第二方向Y朝外延伸,且該等第二鰭片部23在該第一方向X上間隔排列。在本第一實施例中,該第二方向Y垂直於該第一方向X。
The
該第一散熱塊20並形成有四穿孔24。在本第一實施例中,每一穿孔24從該第一頂面211延伸至該第一底面212並貫穿該第一外周面213。可以理解的是,在本第一實施例的其他變化例中,該等穿孔24的數目也可以為二個、三個或多於四個。
The first
該等鎖固螺栓30分別對應於該等穿孔24,每一鎖固螺栓30可穿過各別的穿孔24至與各別的螺孔121可拆卸地螺接。可以理解的是,在本第一實施例的其他變化例中,該等鎖固螺栓30的數目也可以為二個、三個或多於四個。
The locking
藉此,如圖2、3所示,當本發明進行組裝時,可先將該第一散熱塊20擺置於該CUP安裝架10上,此時,該芯部21的第一底面212可與該央中處理器220的散熱片221的頂面接觸,接著,可將每一鎖固螺栓30穿過各別的穿孔24至與各別的螺孔121螺接,而將該第一散熱塊20穩固地固定於該CUP安裝架10的頂蓋12上,如此,即可迫使該芯部21的第一底面212與該央中處理器220的散熱片221的頂面穩固地接觸,而讓該央中處理器220的廢熱可有效地傳送至該第一散熱塊20進行散熱。
Thereby, as shown in FIGS. 2 and 3, when the present invention is assembled, the
經由以上的說明,可再將本發明的優點歸納如下: Based on the above description, the advantages of the present invention can be summarized as follows:
一、本發明可利用該等鎖固螺栓30穿過該第一散熱塊20的穿孔24至與該CUP安裝架10的頂蓋12的螺孔121螺接,而將該第一散熱塊20穩固地固定於頂蓋12上,相較於習知技術,該等鎖固螺栓30與該等螺孔121螺接可對該第一散熱塊20產生良好的固定效果,而且,即便該主機板200在使用一段時間後產生變形的情形,也不會對該等鎖固螺栓30鎖固於該頂蓋12所產生的固定效果產生影響,如此,即可確保該第一散熱塊20與該央中處理器220穩固地接觸,使該第一散熱塊20對該央中處理器220產生良好的散熱效果。
1. In the present invention, the locking
二、相較於習知技術,本發明若為了增加散熱效果,而使該第一散熱塊20的厚度變厚,即便該等鎖固螺鎖30也會隨之
變長,但是,該等鎖固螺鎖30的鎖固操作還是一樣容易進行,並不會被影響,而且,該等鎖固螺栓30鎖固於該頂蓋12所產生的固定效果也不會因此而受影響。
2. Compared with the conventional technology, if the present invention makes the thickness of the first
可以理解的是,如圖6所示,在該第一實施例的其他變化例中,若該中央處理器220(見圖2)的發熱功率較大,也可以在該第一散熱塊20上增設一散熱風扇300,以增加散熱效果。
It is understandable that, as shown in FIG. 6, in other variations of the first embodiment, if the heating power of the central processing unit 220 (see FIG. 2) is relatively large, it can also be installed on the first heat sink 20 A cooling
參閱圖7、8,為本發明之一第二實施例,該第二實施例是類似於該第一實施例,該第二實施例與該第一實施例的差異在於:
該CPU散熱模組100還包含一第二散熱塊40,及一連接於該第一、二散熱塊20、40之間的熱管50。
Referring to Figures 7 and 8, it is a second embodiment of the present invention. The second embodiment is similar to the first embodiment. The difference between the second embodiment and the first embodiment is:
The CPU
該第一熱散塊20的芯部21的第一頂面211形成有一第一插孔214。
A
該二散熱塊40包括一芯部41,該芯部41具有一與該第一頂面211接觸的第二底面411,該第二底面411形成有一第二插孔412。可以理解理的是,在本第二實施例中,該二散熱塊40是以相同於該第一散熱塊20的形狀構造作表示,但是,並不以此為限。
The two heat dissipation blocks 40 include a
該熱管50包括一插置於該第一插孔214的蒸發段51,及一插置於該第二插孔412的凝結段52。該熱管50呈筆直狀。
The
如此,該第二實施例除了可達到與上述該第一實施例相同的目的與功效之外,從該央中處理器220傳送至該第一散熱塊20的廢熱,可再經由該熱管50傳送至該第二散熱塊40進行散熱,增加散熱效果。
In this way, the second embodiment can achieve the same purpose and effect as the above-mentioned first embodiment. The waste heat transferred from the
可以理解的是,如圖9所示,在該第二實施例的其他變化例中,若該中央處理器220(見圖2)的發熱功率較大,也可以在該第二散熱塊40上增設該散熱風扇300,以增加散熱效果。
It is understandable that, as shown in FIG. 9, in other variations of the second embodiment, if the heating power of the central processing unit 220 (see FIG. 2) is relatively large, it can also be installed on the
參閱圖10,為本發明之一第三實施例,該第三實施例是類似於該第二實施例,該第三實施例與該第二實施例的差異在於:
該第一熱散塊20的芯部21的第一周面213形成有一側插孔215。
Refer to FIG. 10, which is a third embodiment of the present invention. The third embodiment is similar to the second embodiment. The difference between the third embodiment and the second embodiment is:
The first
在該第一熱散塊20上方空間有限的情形下,該二散熱塊40是豎立地設置於該第一熱散塊20的旁側,該芯部41的第二底面411朝向該第一周面213,該第二底面411形成有一第二插孔413。
When the space above the first
該熱管50的蒸發段51插置於該側插孔215,該凝結段52插置於該第二插孔413。
The
可以理解的是,若有需要,該第一、二熱散塊20、40上也可增設該散熱風扇300。
It can be understood that, if necessary, the
如此,該第三實施例也可達到與上述該第二實施例相同的目的與功效。 In this way, the third embodiment can also achieve the same purpose and effect as the above-mentioned second embodiment.
綜上所述,本發明的CPU散熱模組,不僅可對該第一散熱塊產生良好的固定效果,並可使該第一散熱塊對該央中處理器產生良好的散熱效果,所以確實能達成本發明的目的。 In summary, the CPU heat dissipation module of the present invention can not only produce a good fixing effect on the first heat dissipation block, but also make the first heat dissipation block have a good heat dissipation effect on the central processor, so it can indeed To achieve the purpose of the invention.
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.
100:CPU散熱模組 100: CPU cooling module
10:CPU安裝架 10: CPU mounting frame
11:底座 11: Base
12:頂蓋 12: Top cover
121:螺孔 121: screw hole
20:第一散熱塊 20: The first heat sink
21:芯部 21: Core
211:第一頂面 211: First Top Surface
212:第一底面 212: first bottom
213:第一周面 213: First week
22:第一鰭片部 22: The first fin
23:第二鰭片部 23: second fin
24:穿孔 24: Piercing
30:鎖固螺栓 30: Locking bolt
X:第一方向 X: first direction
Y:第二方向 Y: second direction
Z:厚度方向 Z: thickness direction
200:主機板 200: Motherboard
220:中央處理器 220: Central Processing Unit
221:散熱片 221: heat sink
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TW108132622A TWI708136B (en) | 2019-09-10 | 2019-09-10 | CPU cooling module |
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TW108132622A TWI708136B (en) | 2019-09-10 | 2019-09-10 | CPU cooling module |
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TWI708136B true TWI708136B (en) | 2020-10-21 |
TW202111476A TW202111476A (en) | 2021-03-16 |
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Application Number | Title | Priority Date | Filing Date |
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TW108132622A TWI708136B (en) | 2019-09-10 | 2019-09-10 | CPU cooling module |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200907650A (en) * | 2007-08-08 | 2009-02-16 | Forcecon Technology Co Ltd | Heat dissipating device with composite heat dissipating efficiency |
TWM379887U (en) * | 2009-10-22 | 2010-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TWI332145B (en) * | 2007-05-04 | 2010-10-21 | Foxconn Tech Co Ltd | Heat dissipation device |
TWM465602U (en) * | 2013-05-22 | 2013-11-11 | Tai Sol Electronics Co Ltd | Heat dissipating apparatus |
-
2019
- 2019-09-10 TW TW108132622A patent/TWI708136B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI332145B (en) * | 2007-05-04 | 2010-10-21 | Foxconn Tech Co Ltd | Heat dissipation device |
TW200907650A (en) * | 2007-08-08 | 2009-02-16 | Forcecon Technology Co Ltd | Heat dissipating device with composite heat dissipating efficiency |
TWM379887U (en) * | 2009-10-22 | 2010-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TWM465602U (en) * | 2013-05-22 | 2013-11-11 | Tai Sol Electronics Co Ltd | Heat dissipating apparatus |
Also Published As
Publication number | Publication date |
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TW202111476A (en) | 2021-03-16 |
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