TWI707610B - Keyboard circuit board capable of preventing chemical erosion - Google Patents
Keyboard circuit board capable of preventing chemical erosion Download PDFInfo
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- TWI707610B TWI707610B TW107132580A TW107132580A TWI707610B TW I707610 B TWI707610 B TW I707610B TW 107132580 A TW107132580 A TW 107132580A TW 107132580 A TW107132580 A TW 107132580A TW I707610 B TWI707610 B TW I707610B
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Abstract
Description
本發明係提供一種印刷電路板,尤指一種可減緩化學侵蝕影響的鍵盤電路板。 The present invention provides a printed circuit board, especially a keyboard circuit board that can reduce the influence of chemical corrosion.
鍵盤電路板需經硫化測試合格始符合廠商要求,然而印刷電路板內的導線,例如銀質導線,易在測試過程中因硫化物污染。導線一旦受到硫化物侵蝕,其訊號傳輸功能便會大受影響,印刷電路板即失去實際作用。因此,如何設計一種能在通過硫化測試仍保持電性傳導效能的新型鍵盤電路板,即為相關產業的重點發展課題之一。 The keyboard circuit board must pass the vulcanization test to meet the manufacturer's requirements, but the wires in the printed circuit board, such as silver wires, are easily contaminated by sulfide during the test. Once the wire is corroded by sulfide, its signal transmission function will be greatly affected, and the printed circuit board will lose its actual function. Therefore, how to design a new type of keyboard circuit board that can maintain electrical conductivity after passing the vulcanization test is one of the key development topics of related industries.
本發明係提供一種可減緩化學侵蝕影響的鍵盤電路板,以解決上述之問題。 The present invention provides a keyboard circuit board that can reduce the influence of chemical corrosion to solve the above-mentioned problems.
本發明之申請專利範圍係揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導電層、一保護層以及一阻隔層。該導電層位於該基板上。部份之該保護層位於該基板上,且另一部份之該保護層覆蓋該導電層。該阻隔層具有相對的一第一表面與一第二表面。該第一表面連接該導電層,且 該第二表面連接該保護層,用來防止化學物質滲入該導電層與該保護層之間的一縫隙。 The scope of patent application of the present invention discloses a keyboard circuit board that can reduce the influence of chemical corrosion, which includes a substrate, a conductive layer, a protective layer, and a barrier layer. The conductive layer is located on the substrate. A part of the protective layer is on the substrate, and another part of the protective layer covers the conductive layer. The barrier layer has a first surface and a second surface opposite to each other. The first surface is connected to the conductive layer, and The second surface is connected to the protective layer to prevent chemical substances from penetrating into a gap between the conductive layer and the protective layer.
本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一保護層、一分隔層以及一阻隔層。該保護層位於該基板上。部份之該分隔層位於該基板上,且另一部份之該分隔層覆蓋該保護層。該阻隔層具有相對的一第一表面與一第二表面。該第一表面連接該保護層,且該第二表面連接該分隔層,用來防止化學物質滲入該保護層與該分隔層之間的一縫隙。 The scope of the patent application of the present invention also discloses a keyboard circuit board that can reduce the influence of chemical corrosion, which includes a substrate, a protective layer, a separation layer and a barrier layer. The protective layer is located on the substrate. Part of the separation layer is on the substrate, and another part of the separation layer covers the protective layer. The barrier layer has a first surface and a second surface opposite to each other. The first surface is connected to the protective layer, and the second surface is connected to the separation layer to prevent chemical substances from penetrating into a gap between the protective layer and the separation layer.
本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導線以及一阻隔層。該基板具有一外緣。該導線形成於該基板上。該阻隔層設置在該基板,且位於該外緣和該導線之間,用來阻擋化學物質自該外緣進入該基板而觸及該導線。 The patent application scope of the present invention also discloses a keyboard circuit board that can reduce the effects of chemical corrosion, which includes a substrate, a wire, and a barrier layer. The substrate has an outer edge. The wire is formed on the substrate. The barrier layer is disposed on the substrate and located between the outer edge and the wire, and is used to block chemical substances from entering the substrate from the outer edge to touch the wire.
本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導線、一保護層、一覆蓋層以及一阻隔層。該導線形成於該基板上。該保護層設置在部份之該導線。部份之該覆蓋層位於該導線上,且另一部份之該覆蓋層覆蓋該保護層。該阻隔層連續性地覆蓋在該覆蓋層與該保護層,用來防止化學物質滲入該保護層與該覆蓋層之間的一縫隙。 The patent application scope of the present invention also discloses a keyboard circuit board that can reduce the effects of chemical corrosion, which includes a substrate, a wire, a protective layer, a covering layer, and a barrier layer. The wire is formed on the substrate. The protective layer is arranged on part of the wire. A part of the covering layer is on the wire, and another part of the covering layer covers the protective layer. The barrier layer continuously covers the covering layer and the protective layer to prevent chemical substances from penetrating into a gap between the protective layer and the covering layer.
本發明之鍵盤電路板根據導線與導電層、保護層、分隔層和/或覆蓋層的相對位置關係,將阻隔層設置在裸露導線與外界相通的途徑上。雖然導電層與保護層之堆疊、或保護層與分隔層之堆疊、或保護層與覆蓋層之堆疊已封 閉裸露導線與外界相通途徑,化學物質仍可能會經由些許縫隙觸及導線,故本發明的鍵盤電路板利用阻隔層提供多重防護,可以有效阻擋化學氣體滲入侵蝕導線。 In the keyboard circuit board of the present invention, according to the relative positional relationship between the wire and the conductive layer, the protective layer, the separation layer and/or the covering layer, the barrier layer is arranged on the way that the bare wire communicates with the outside. Although the stack of conductive layer and protective layer, or the stack of protective layer and separation layer, or the stack of protective layer and cover layer has been sealed If the exposed wires communicate with the outside, chemical substances may still touch the wires through some gaps. Therefore, the keyboard circuit board of the present invention uses barrier layers to provide multiple protections, which can effectively prevent chemical gases from penetrating and corroding the wires.
10、10’、10”:鍵盤電路板 10, 10’, 10”: keyboard circuit board
12:基板 12: substrate
14:導電層 14: conductive layer
16、16’:保護層 16, 16’: protective layer
18:絕緣層 18: Insulation layer
20、20’:阻隔層 20, 20’: barrier layer
201、201’:阻隔層的第一表面 201, 201’: the first surface of the barrier layer
202、202’:阻隔層的第二表面 202, 202’: the second surface of the barrier layer
22:導線 22: Wire
24:縫隙 24: gap
50、50’:鍵盤電路板 50, 50’: keyboard circuit board
52:基板 52: substrate
54:保護層 54: protective layer
56:分隔層 56: Separation layer
58、58’:阻隔層 58, 58’: barrier layer
581、581’:阻隔層的第一表面 581, 581’: the first surface of the barrier layer
582、582’:阻隔層的第二表面 582, 582’: The second surface of the barrier layer
60:導線 60: Wire
62:縫隙 62: Gap
70:鍵盤電路板 70: keyboard circuit board
72:基板 72: substrate
74:導線 74: Wire
76:保護層 76: protective layer
78:覆蓋層 78: Overlay
80:阻隔層 80: barrier layer
82:分隔層 82: Separation layer
84:縫隙 84: Gap
90:鍵盤電路板 90: keyboard circuit board
92:基板 92: substrate
94:導線 94: Wire
96:阻隔層 96: barrier layer
98:遮蔽層 98: Masking layer
100:填充材料 100: filling material
102:基板外緣 102: outer edge of substrate
104:孔洞 104: Hole
106:開關 106: switch
A-A’:剖面線 A-A’: Section line
B-B’:剖面線 B-B’: Section line
C:區域 C: area
D-D’:剖面線 D-D’: Section line
第1圖為本發明實施例之鍵盤電路板之外觀示意圖。 Figure 1 is a schematic diagram of the appearance of a keyboard circuit board according to an embodiment of the present invention.
第2圖為本發明第一實施例之鍵盤電路板之局部剖視圖。 Figure 2 is a partial cross-sectional view of the keyboard circuit board of the first embodiment of the present invention.
第3圖為本發明第二實施例之鍵盤電路板之局部剖視圖。 Figure 3 is a partial cross-sectional view of the keyboard circuit board of the second embodiment of the present invention.
第4圖為本發明第三實施例之鍵盤電路板之局部剖視圖。 Figure 4 is a partial cross-sectional view of the keyboard circuit board of the third embodiment of the present invention.
第5圖為本發明第四實施例之鍵盤電路板之局部剖視圖。 Figure 5 is a partial cross-sectional view of the keyboard circuit board of the fourth embodiment of the present invention.
第6圖為本發明第五實施例之鍵盤電路板之局部剖視圖。 Figure 6 is a partial cross-sectional view of the keyboard circuit board of the fifth embodiment of the present invention.
第7圖為本發明第六實施例之鍵盤電路板之局部剖視圖。 Figure 7 is a partial cross-sectional view of the keyboard circuit board of the sixth embodiment of the present invention.
第8圖為本發明另一實施例之鍵盤電路板之外觀示意圖。 FIG. 8 is a schematic diagram of the appearance of a keyboard circuit board according to another embodiment of the present invention.
第9圖為第8圖所示區域之部份放大結構圖。 Figure 9 is a partial enlarged structure diagram of the area shown in Figure 8.
第10圖為第8圖所示鍵盤電路板之局部剖視圖。 Figure 10 is a partial cross-sectional view of the keyboard circuit board shown in Figure 8.
請參閱第1圖與第2圖,第1圖為本發明實施例之鍵盤電路板10之外觀示意圖,第2圖為本發明第一實施例之鍵盤電路板10沿第1圖所示剖面線A-A’之局部示意圖。鍵盤電路板10一般應用於筆記型電腦的薄型鍵盤內。鍵盤電路板10經由特殊製程設計,使其內部導線在硫化測試後不易受到侵蝕破壞。第一實施例的鍵盤電路板10可包含基板12、導電層14、保護層16、絕緣層18、阻隔層20以及導線22。如第2圖所示,導線22形成在基板12上。導電層14位於部份的導
線22上;保護層16則部份位於導線22、且另一部份覆蓋於導電層14上。因此,導電層14與保護層16係經由導線22設置在基板12。
Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the appearance of the
如第2圖所示,導電層14與保護層16在其交會處沒有完整遮蔽導線22,意即導電層14和保護層16之間形成縫隙24,裸露出部份的導線22。為了避免裸露導線22在硫化測試時受到侵蝕,阻隔層20設置在導電層14和保護層16之間。阻隔層20通常為銀質材料,具有傳導特性,故可將絕緣層18設置在導電層14與阻隔層20之間,使阻隔層20無法直接接觸導電層14,避免短路。換句話說,阻隔層20的第一表面201(上表面)可通過絕緣層18連接於導電層14,和第一表面201相對的第二表面202(下表面)則連接保護層16。阻隔層20可與化學物質(例如硫化物)作用,減少或阻擋化學物質滲入導電層14與保護層16之間縫隙24而觸及導線22。
As shown in FIG. 2, the
請參閱第3圖,第3圖為本發明第二實施例之鍵盤電路板10’沿第1圖所示剖面線A-A’之局部示意圖。第二實施例中,與第一實施例具有相同編號之元件具有相同的結構與功能,於此不再重複說明。第一實施例的鍵盤電路板10將絕緣層18與阻隔層20設置在相互堆疊的導電層14與保護層16之間。與前揭實施例不同的是,第二實施例的鍵盤電路板10’將阻隔層20’設置在導電層14與保護層16之間的交會處,意即阻隔層20’直接覆蓋導線22的裸露部份。阻隔層20’之第一表面201’(側表面)直接連接導電層14,第二表面202’(另一側表面)連接保護層16。因此,阻隔層20’能有效防止化學物質經由縫隙24觸及導線22。阻隔層20’可為紫外線塗層(ultraviolet coating)。
Please refer to FIG. 3, which is a partial schematic diagram of the keyboard circuit board 10' of the second embodiment of the present invention along the section line A-A' shown in FIG. In the second embodiment, the elements with the same number as the first embodiment have the same structure and function, and the description is not repeated here. In the
請參閱第4圖,第4圖為本發明第三實施例之鍵盤電路板10”沿第1圖
所示剖面線A-A’之局部示意圖。鍵盤電路板10”可包含基板12、導電層14、保護層16’以及導線22。導線22形成在基板12上。導電層14設置於部份的基板12,保護層16’係部份位於基板12,且另一部份覆蓋導電層14。由於導電層14堆疊導線22生成之段差,導電層14與保護層16的交會處有部份裸露的導線22。因此,保護層16’之位於導電層14上的部份區段可延伸其長度,意即增加保護層16’和導電層14重疊的接觸面積,減少或阻擋化學物質滲入縫隙24侵蝕導線22。
Please refer to FIG. 4, which is the first view of the
請參閱第5圖,第5圖為本發明第四實施例之鍵盤電路板50沿第1圖所示剖面線B-B’之局部示意圖。鍵盤電路板50可包含有基板52、保護層54、分隔層56、阻隔層58以及導線60。導線60形成於基板52。保護層54設置在部份的導線60上。分隔層56的一部份設置在導線60上,另一部份覆蓋於保護層54。因此,保護層54與分隔層56係經由導線60設置在基板52。阻隔層58位於保護層54和分隔層56之間交疊的位置。保護層54及分隔層56皆由非導電材質製作,故阻隔層58可直接觸及保護層54與分隔層56。換句話說,阻隔層58的第一表面581(下表面)連接保護層54,與第一表面581相對之第二表面582(上表面)連接分隔層56。阻隔層58止阻擋化學物質滲入保護層54與分隔層56之間的縫隙62,防止化學物質接觸裸露的導線60。
Please refer to FIG. 5. FIG. 5 is a partial schematic diagram of the
請參閱第6圖,第6圖為本發明第五實施例之鍵盤電路板50’沿第1圖所示剖面線B-B’之局部示意圖。第五實施例中,與第四實施例具有相同編號之元件具有相同的結構與功能,於此不再重複說明。第四實施例的鍵盤電路板50將阻隔層58設置在相互堆疊的保護層54與分隔層56之間。與前揭實施例不同的是,第五實施例的鍵盤電路板50’將阻隔層58’設置在保護層54與分隔層56之間的水平交會處,意即阻隔層58’直接覆蓋導線60的裸露部份。阻隔層58’之第一表面
581’(側表面)直接連接保護層54,第二表面582’(另一側表面)連接分隔層56。因此,阻隔層58’能有效防止化學物質經由縫隙62觸及導線60。阻隔層58’可為紫外線塗層(ultraviolet coating)。
Please refer to FIG. 6, which is a partial schematic diagram of the keyboard circuit board 50' of the fifth embodiment of the present invention along the section line B-B' shown in FIG. In the fifth embodiment, the elements with the same number as the fourth embodiment have the same structure and function, and the description will not be repeated here. In the
請參閱第7圖,第7圖為本發明第六實施例之鍵盤電路板70沿第1圖所示剖面線B-B’之局部示意圖。鍵盤電路板70可包含有基板72、導線74、保護層76、覆蓋層78、阻隔層80以及分隔層82。導線74形成於基板72之表面(不限於上表面或下表面)。保護層76設置在部份的導線74上。覆蓋層78係部份位於導線74上,且另一部份覆蓋於保護層76。分隔層82選擇性地設置在覆蓋層78與導線74及保護層76之間,因此分隔層82可以部份貼附導線74,且另一部份貼附保護層76。基板72與保護層76因交疊而有高度段落,故保護層76與覆蓋層78之間會形成縫隙84。導線74會經由縫隙而部份裸露。
Please refer to FIG. 7, which is a partial schematic diagram of the
為了避免化學物質從保護層76與覆蓋層78之間縫隙84滲入,鍵盤電路板70係將阻隔層80連續性地覆蓋在覆蓋層78和保護層76上,意即縫隙84與外界相同的途徑已為阻隔層80與保護層76之交疊、及覆蓋層78與保護層76之交疊而閉合。因此,鍵盤電路板70的阻隔層80能有效減少或防止化學物質滲入縫隙84而侵蝕導線74。
In order to prevent chemical substances from penetrating from the
請參閱第8圖至第10圖,第8圖為本發明另一實施例之鍵盤電路板90之外觀示意圖,第9圖為第8圖所示區域C之部份放大結構圖,第10圖為第8圖所示鍵盤電路板80沿剖面線D-D’之局部示意圖。鍵盤電路板90可包含有基板92、導線94、阻隔層96、遮蔽層98以及填充材料100。導線94形成於基板92上。阻隔層96設置在基板92、且位於導線94和基板92的外緣102之間。較佳實施態樣下,
鍵盤電路板90可具有多個阻隔層96,分設在導線94之數個相對側、或是設置在導線94周圍易受化學物質侵蝕的特定側。遮蔽層98位於導線94與阻隔層96的上方。填充材料100填充在基板92和遮蔽層98之間的縫隙。鍵盤電路板90具有孔洞104。鍵盤電路板90進行硫化測試時,穿越孔洞104的化學物質會對開關106及相關導線94造成威脅。
Please refer to Figs. 8-10. Fig. 8 is a schematic diagram of the appearance of a
如第9圖與第10圖所示,阻隔層96圍繞在導線94的周圍,作為阻擋化學物質進入外緣102後的屏障。阻隔層96的高度、寬度與形狀不限於此實施例所示,端視設計需求而定。阻隔層96既能止擋化學物質,同時間也能與化學物質作用以消耗其單位氣體含量。從第9圖可看出,阻隔層96靠近外緣102的一側受化學物質侵蝕而發生質變(以網格狀花紋表示之),阻隔層96靠近導線94的另一側不受化學物質影響,故能有效避免化學物質自外緣102進入基板92而侵蝕導線94或開關106。
As shown in FIGS. 9 and 10, the
綜上所述,本發明的鍵盤電路板根據導線與導電層、保護層、分隔層和/或覆蓋層的相對位置關係,將阻隔層設置在裸露導線與外界相通的途徑上。雖然導電層與保護層之堆疊、或保護層與分隔層之堆疊、或保護層與覆蓋層之堆疊已封閉裸露導線與外界相通途徑,化學物質仍可能會經由些許縫隙觸及導線,故本發明的鍵盤電路板利用阻隔層提供多重防護,可以有效阻擋化學氣體滲入侵蝕導線。 To sum up, the keyboard circuit board of the present invention arranges the barrier layer on the path through which the exposed wires communicate with the outside according to the relative positional relationship between the wires and the conductive layer, the protective layer, the separation layer and/or the covering layer. Although the stack of the conductive layer and the protective layer, or the stack of the protective layer and the separation layer, or the stack of the protective layer and the cover layer has closed the exposed wire from communicating with the outside, the chemical substance may still touch the wire through some gaps, so the present invention The keyboard circuit board uses a barrier layer to provide multiple protections, which can effectively prevent chemical gases from penetrating and corroding wires.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.
10:鍵盤電路板 10: Keyboard circuit board
12:基板 12: substrate
14:導電層 14: conductive layer
16:保護層 16: protective layer
18:絕緣層 18: Insulation layer
20:阻隔層 20: barrier layer
201:阻隔層的第一表面 201: The first surface of the barrier layer
202:阻隔層的第二表面 202: The second surface of the barrier layer
22:導線 22: Wire
24:縫隙 24: gap
Claims (13)
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TW107132580A TWI707610B (en) | 2018-09-17 | 2018-09-17 | Keyboard circuit board capable of preventing chemical erosion |
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TW107132580A TWI707610B (en) | 2018-09-17 | 2018-09-17 | Keyboard circuit board capable of preventing chemical erosion |
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TWI707610B true TWI707610B (en) | 2020-10-11 |
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Citations (1)
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TW477446U (en) * | 2000-07-19 | 2002-02-21 | Mitac Technology Corp | Waterproof keyboard |
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Publication number | Priority date | Publication date | Assignee | Title |
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TW477446U (en) * | 2000-07-19 | 2002-02-21 | Mitac Technology Corp | Waterproof keyboard |
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