TWI707610B - Keyboard circuit board capable of preventing chemical erosion - Google Patents

Keyboard circuit board capable of preventing chemical erosion Download PDF

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TWI707610B
TWI707610B TW107132580A TW107132580A TWI707610B TW I707610 B TWI707610 B TW I707610B TW 107132580 A TW107132580 A TW 107132580A TW 107132580 A TW107132580 A TW 107132580A TW I707610 B TWI707610 B TW I707610B
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layer
circuit board
substrate
keyboard circuit
wire
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TW107132580A
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TW202014060A (en
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廖本煇
林欽宏
羅義童
謝德勳
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達方電子股份有限公司
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Abstract

A keyboard circuit board capable of preventing chemical erosion can include a substrate, a conduction layer, a protection layer and an isolation layer. The conduction layer is formed on the substrate. A part of the protection layer is disposed on the substrate, and the other part of the protection layer is disposed on the conduction layer. The isolation layer has a first surface and a second surface opposite to each other. The first surface is connected to the conduction layer, and the second surface is connected to the protection layer, so as to prevent chemical substance from leaking into a gap between the conduction layer and the protection layer.

Description

可減緩化學侵蝕影響的鍵盤電路板 Keyboard circuit board capable of mitigating the influence of chemical corrosion

本發明係提供一種印刷電路板,尤指一種可減緩化學侵蝕影響的鍵盤電路板。 The present invention provides a printed circuit board, especially a keyboard circuit board that can reduce the influence of chemical corrosion.

鍵盤電路板需經硫化測試合格始符合廠商要求,然而印刷電路板內的導線,例如銀質導線,易在測試過程中因硫化物污染。導線一旦受到硫化物侵蝕,其訊號傳輸功能便會大受影響,印刷電路板即失去實際作用。因此,如何設計一種能在通過硫化測試仍保持電性傳導效能的新型鍵盤電路板,即為相關產業的重點發展課題之一。 The keyboard circuit board must pass the vulcanization test to meet the manufacturer's requirements, but the wires in the printed circuit board, such as silver wires, are easily contaminated by sulfide during the test. Once the wire is corroded by sulfide, its signal transmission function will be greatly affected, and the printed circuit board will lose its actual function. Therefore, how to design a new type of keyboard circuit board that can maintain electrical conductivity after passing the vulcanization test is one of the key development topics of related industries.

本發明係提供一種可減緩化學侵蝕影響的鍵盤電路板,以解決上述之問題。 The present invention provides a keyboard circuit board that can reduce the influence of chemical corrosion to solve the above-mentioned problems.

本發明之申請專利範圍係揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導電層、一保護層以及一阻隔層。該導電層位於該基板上。部份之該保護層位於該基板上,且另一部份之該保護層覆蓋該導電層。該阻隔層具有相對的一第一表面與一第二表面。該第一表面連接該導電層,且 該第二表面連接該保護層,用來防止化學物質滲入該導電層與該保護層之間的一縫隙。 The scope of patent application of the present invention discloses a keyboard circuit board that can reduce the influence of chemical corrosion, which includes a substrate, a conductive layer, a protective layer, and a barrier layer. The conductive layer is located on the substrate. A part of the protective layer is on the substrate, and another part of the protective layer covers the conductive layer. The barrier layer has a first surface and a second surface opposite to each other. The first surface is connected to the conductive layer, and The second surface is connected to the protective layer to prevent chemical substances from penetrating into a gap between the conductive layer and the protective layer.

本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一保護層、一分隔層以及一阻隔層。該保護層位於該基板上。部份之該分隔層位於該基板上,且另一部份之該分隔層覆蓋該保護層。該阻隔層具有相對的一第一表面與一第二表面。該第一表面連接該保護層,且該第二表面連接該分隔層,用來防止化學物質滲入該保護層與該分隔層之間的一縫隙。 The scope of the patent application of the present invention also discloses a keyboard circuit board that can reduce the influence of chemical corrosion, which includes a substrate, a protective layer, a separation layer and a barrier layer. The protective layer is located on the substrate. Part of the separation layer is on the substrate, and another part of the separation layer covers the protective layer. The barrier layer has a first surface and a second surface opposite to each other. The first surface is connected to the protective layer, and the second surface is connected to the separation layer to prevent chemical substances from penetrating into a gap between the protective layer and the separation layer.

本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導線以及一阻隔層。該基板具有一外緣。該導線形成於該基板上。該阻隔層設置在該基板,且位於該外緣和該導線之間,用來阻擋化學物質自該外緣進入該基板而觸及該導線。 The patent application scope of the present invention also discloses a keyboard circuit board that can reduce the effects of chemical corrosion, which includes a substrate, a wire, and a barrier layer. The substrate has an outer edge. The wire is formed on the substrate. The barrier layer is disposed on the substrate and located between the outer edge and the wire, and is used to block chemical substances from entering the substrate from the outer edge to touch the wire.

本發明之申請專利範圍另揭露一種可減緩化學侵蝕影響的鍵盤電路板,其包含有一基板、一導線、一保護層、一覆蓋層以及一阻隔層。該導線形成於該基板上。該保護層設置在部份之該導線。部份之該覆蓋層位於該導線上,且另一部份之該覆蓋層覆蓋該保護層。該阻隔層連續性地覆蓋在該覆蓋層與該保護層,用來防止化學物質滲入該保護層與該覆蓋層之間的一縫隙。 The patent application scope of the present invention also discloses a keyboard circuit board that can reduce the effects of chemical corrosion, which includes a substrate, a wire, a protective layer, a covering layer, and a barrier layer. The wire is formed on the substrate. The protective layer is arranged on part of the wire. A part of the covering layer is on the wire, and another part of the covering layer covers the protective layer. The barrier layer continuously covers the covering layer and the protective layer to prevent chemical substances from penetrating into a gap between the protective layer and the covering layer.

本發明之鍵盤電路板根據導線與導電層、保護層、分隔層和/或覆蓋層的相對位置關係,將阻隔層設置在裸露導線與外界相通的途徑上。雖然導電層與保護層之堆疊、或保護層與分隔層之堆疊、或保護層與覆蓋層之堆疊已封 閉裸露導線與外界相通途徑,化學物質仍可能會經由些許縫隙觸及導線,故本發明的鍵盤電路板利用阻隔層提供多重防護,可以有效阻擋化學氣體滲入侵蝕導線。 In the keyboard circuit board of the present invention, according to the relative positional relationship between the wire and the conductive layer, the protective layer, the separation layer and/or the covering layer, the barrier layer is arranged on the way that the bare wire communicates with the outside. Although the stack of conductive layer and protective layer, or the stack of protective layer and separation layer, or the stack of protective layer and cover layer has been sealed If the exposed wires communicate with the outside, chemical substances may still touch the wires through some gaps. Therefore, the keyboard circuit board of the present invention uses barrier layers to provide multiple protections, which can effectively prevent chemical gases from penetrating and corroding the wires.

10、10’、10”:鍵盤電路板 10, 10’, 10”: keyboard circuit board

12:基板 12: substrate

14:導電層 14: conductive layer

16、16’:保護層 16, 16’: protective layer

18:絕緣層 18: Insulation layer

20、20’:阻隔層 20, 20’: barrier layer

201、201’:阻隔層的第一表面 201, 201’: the first surface of the barrier layer

202、202’:阻隔層的第二表面 202, 202’: the second surface of the barrier layer

22:導線 22: Wire

24:縫隙 24: gap

50、50’:鍵盤電路板 50, 50’: keyboard circuit board

52:基板 52: substrate

54:保護層 54: protective layer

56:分隔層 56: Separation layer

58、58’:阻隔層 58, 58’: barrier layer

581、581’:阻隔層的第一表面 581, 581’: the first surface of the barrier layer

582、582’:阻隔層的第二表面 582, 582’: The second surface of the barrier layer

60:導線 60: Wire

62:縫隙 62: Gap

70:鍵盤電路板 70: keyboard circuit board

72:基板 72: substrate

74:導線 74: Wire

76:保護層 76: protective layer

78:覆蓋層 78: Overlay

80:阻隔層 80: barrier layer

82:分隔層 82: Separation layer

84:縫隙 84: Gap

90:鍵盤電路板 90: keyboard circuit board

92:基板 92: substrate

94:導線 94: Wire

96:阻隔層 96: barrier layer

98:遮蔽層 98: Masking layer

100:填充材料 100: filling material

102:基板外緣 102: outer edge of substrate

104:孔洞 104: Hole

106:開關 106: switch

A-A’:剖面線 A-A’: Section line

B-B’:剖面線 B-B’: Section line

C:區域 C: area

D-D’:剖面線 D-D’: Section line

第1圖為本發明實施例之鍵盤電路板之外觀示意圖。 Figure 1 is a schematic diagram of the appearance of a keyboard circuit board according to an embodiment of the present invention.

第2圖為本發明第一實施例之鍵盤電路板之局部剖視圖。 Figure 2 is a partial cross-sectional view of the keyboard circuit board of the first embodiment of the present invention.

第3圖為本發明第二實施例之鍵盤電路板之局部剖視圖。 Figure 3 is a partial cross-sectional view of the keyboard circuit board of the second embodiment of the present invention.

第4圖為本發明第三實施例之鍵盤電路板之局部剖視圖。 Figure 4 is a partial cross-sectional view of the keyboard circuit board of the third embodiment of the present invention.

第5圖為本發明第四實施例之鍵盤電路板之局部剖視圖。 Figure 5 is a partial cross-sectional view of the keyboard circuit board of the fourth embodiment of the present invention.

第6圖為本發明第五實施例之鍵盤電路板之局部剖視圖。 Figure 6 is a partial cross-sectional view of the keyboard circuit board of the fifth embodiment of the present invention.

第7圖為本發明第六實施例之鍵盤電路板之局部剖視圖。 Figure 7 is a partial cross-sectional view of the keyboard circuit board of the sixth embodiment of the present invention.

第8圖為本發明另一實施例之鍵盤電路板之外觀示意圖。 FIG. 8 is a schematic diagram of the appearance of a keyboard circuit board according to another embodiment of the present invention.

第9圖為第8圖所示區域之部份放大結構圖。 Figure 9 is a partial enlarged structure diagram of the area shown in Figure 8.

第10圖為第8圖所示鍵盤電路板之局部剖視圖。 Figure 10 is a partial cross-sectional view of the keyboard circuit board shown in Figure 8.

請參閱第1圖與第2圖,第1圖為本發明實施例之鍵盤電路板10之外觀示意圖,第2圖為本發明第一實施例之鍵盤電路板10沿第1圖所示剖面線A-A’之局部示意圖。鍵盤電路板10一般應用於筆記型電腦的薄型鍵盤內。鍵盤電路板10經由特殊製程設計,使其內部導線在硫化測試後不易受到侵蝕破壞。第一實施例的鍵盤電路板10可包含基板12、導電層14、保護層16、絕緣層18、阻隔層20以及導線22。如第2圖所示,導線22形成在基板12上。導電層14位於部份的導 線22上;保護層16則部份位於導線22、且另一部份覆蓋於導電層14上。因此,導電層14與保護層16係經由導線22設置在基板12。 Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the appearance of the keyboard circuit board 10 of the embodiment of the present invention, and Figure 2 is the keyboard circuit board 10 of the first embodiment of the present invention along the section line shown in Figure 1 A-A' partial schematic diagram. The keyboard circuit board 10 is generally used in a thin keyboard of a notebook computer. The keyboard circuit board 10 is designed through a special manufacturing process so that its internal wires are not easily damaged by corrosion after the vulcanization test. The keyboard circuit board 10 of the first embodiment may include a substrate 12, a conductive layer 14, a protective layer 16, an insulating layer 18, a barrier layer 20 and wires 22. As shown in FIG. 2, the wires 22 are formed on the substrate 12. The conductive layer 14 is located in part of the conductive On the wire 22; the protective layer 16 is partly located on the wire 22, and the other part is covered on the conductive layer 14. Therefore, the conductive layer 14 and the protective layer 16 are provided on the substrate 12 via the wires 22.

如第2圖所示,導電層14與保護層16在其交會處沒有完整遮蔽導線22,意即導電層14和保護層16之間形成縫隙24,裸露出部份的導線22。為了避免裸露導線22在硫化測試時受到侵蝕,阻隔層20設置在導電層14和保護層16之間。阻隔層20通常為銀質材料,具有傳導特性,故可將絕緣層18設置在導電層14與阻隔層20之間,使阻隔層20無法直接接觸導電層14,避免短路。換句話說,阻隔層20的第一表面201(上表面)可通過絕緣層18連接於導電層14,和第一表面201相對的第二表面202(下表面)則連接保護層16。阻隔層20可與化學物質(例如硫化物)作用,減少或阻擋化學物質滲入導電層14與保護層16之間縫隙24而觸及導線22。 As shown in FIG. 2, the conductive layer 14 and the protective layer 16 do not completely shield the wires 22 at their intersections, which means that a gap 24 is formed between the conductive layer 14 and the protective layer 16, and part of the wires 22 are exposed. In order to prevent the exposed wires 22 from being corroded during the vulcanization test, the barrier layer 20 is disposed between the conductive layer 14 and the protective layer 16. The barrier layer 20 is usually a silver material with conductive properties. Therefore, the insulating layer 18 can be disposed between the conductive layer 14 and the barrier layer 20 so that the barrier layer 20 cannot directly contact the conductive layer 14 to avoid short circuits. In other words, the first surface 201 (upper surface) of the barrier layer 20 can be connected to the conductive layer 14 through the insulating layer 18, and the second surface 202 (lower surface) opposite to the first surface 201 can be connected to the protective layer 16. The barrier layer 20 can interact with chemical substances (such as sulfides) to reduce or prevent chemical substances from penetrating into the gap 24 between the conductive layer 14 and the protective layer 16 to reach the wire 22.

請參閱第3圖,第3圖為本發明第二實施例之鍵盤電路板10’沿第1圖所示剖面線A-A’之局部示意圖。第二實施例中,與第一實施例具有相同編號之元件具有相同的結構與功能,於此不再重複說明。第一實施例的鍵盤電路板10將絕緣層18與阻隔層20設置在相互堆疊的導電層14與保護層16之間。與前揭實施例不同的是,第二實施例的鍵盤電路板10’將阻隔層20’設置在導電層14與保護層16之間的交會處,意即阻隔層20’直接覆蓋導線22的裸露部份。阻隔層20’之第一表面201’(側表面)直接連接導電層14,第二表面202’(另一側表面)連接保護層16。因此,阻隔層20’能有效防止化學物質經由縫隙24觸及導線22。阻隔層20’可為紫外線塗層(ultraviolet coating)。 Please refer to FIG. 3, which is a partial schematic diagram of the keyboard circuit board 10' of the second embodiment of the present invention along the section line A-A' shown in FIG. In the second embodiment, the elements with the same number as the first embodiment have the same structure and function, and the description is not repeated here. In the keyboard circuit board 10 of the first embodiment, the insulating layer 18 and the barrier layer 20 are disposed between the conductive layer 14 and the protective layer 16 stacked on each other. Different from the previous embodiment, the keyboard circuit board 10' of the second embodiment has a barrier layer 20' disposed at the intersection between the conductive layer 14 and the protective layer 16, which means that the barrier layer 20' directly covers the conductor 22 The bare part. The first surface 201' (side surface) of the barrier layer 20' is directly connected to the conductive layer 14, and the second surface 202' (the other side surface) is connected to the protective layer 16. Therefore, the barrier layer 20' can effectively prevent chemical substances from contacting the wires 22 through the gap 24. The barrier layer 20' may be an ultraviolet coating (ultraviolet coating).

請參閱第4圖,第4圖為本發明第三實施例之鍵盤電路板10”沿第1圖 所示剖面線A-A’之局部示意圖。鍵盤電路板10”可包含基板12、導電層14、保護層16’以及導線22。導線22形成在基板12上。導電層14設置於部份的基板12,保護層16’係部份位於基板12,且另一部份覆蓋導電層14。由於導電層14堆疊導線22生成之段差,導電層14與保護層16的交會處有部份裸露的導線22。因此,保護層16’之位於導電層14上的部份區段可延伸其長度,意即增加保護層16’和導電層14重疊的接觸面積,減少或阻擋化學物質滲入縫隙24侵蝕導線22。 Please refer to FIG. 4, which is the first view of the keyboard circuit board 10" along the third embodiment of the present invention A partial schematic diagram of the section line A-A' shown. The keyboard circuit board 10" may include a substrate 12, a conductive layer 14, a protective layer 16', and a wire 22. The wire 22 is formed on the substrate 12. The conductive layer 14 is disposed on part of the substrate 12, and the protective layer 16' is partly located on the substrate 12, and the other part covers the conductive layer 14. Due to the step difference generated by the conductive layer 14 stacking the wires 22, there is a part of the exposed wires 22 at the intersection of the conductive layer 14 and the protective layer 16. Therefore, the protective layer 16' is located in the conductive layer Part of the section on the layer 14 can extend its length, which means to increase the contact area between the protective layer 16 ′ and the conductive layer 14 to reduce or prevent the penetration of chemical substances into the gap 24 to corrode the wire 22.

請參閱第5圖,第5圖為本發明第四實施例之鍵盤電路板50沿第1圖所示剖面線B-B’之局部示意圖。鍵盤電路板50可包含有基板52、保護層54、分隔層56、阻隔層58以及導線60。導線60形成於基板52。保護層54設置在部份的導線60上。分隔層56的一部份設置在導線60上,另一部份覆蓋於保護層54。因此,保護層54與分隔層56係經由導線60設置在基板52。阻隔層58位於保護層54和分隔層56之間交疊的位置。保護層54及分隔層56皆由非導電材質製作,故阻隔層58可直接觸及保護層54與分隔層56。換句話說,阻隔層58的第一表面581(下表面)連接保護層54,與第一表面581相對之第二表面582(上表面)連接分隔層56。阻隔層58止阻擋化學物質滲入保護層54與分隔層56之間的縫隙62,防止化學物質接觸裸露的導線60。 Please refer to FIG. 5. FIG. 5 is a partial schematic diagram of the keyboard circuit board 50 of the fourth embodiment of the present invention along the section line B-B' shown in FIG. The keyboard circuit board 50 may include a substrate 52, a protective layer 54, a separation layer 56, a barrier layer 58 and wires 60. The wire 60 is formed on the substrate 52. The protective layer 54 is provided on part of the wire 60. A part of the separation layer 56 is disposed on the wire 60 and the other part is covered on the protective layer 54. Therefore, the protective layer 54 and the separation layer 56 are provided on the substrate 52 via the wires 60. The barrier layer 58 is located at a position where the protective layer 54 and the separation layer 56 overlap. The protection layer 54 and the separation layer 56 are made of non-conductive materials, so the barrier layer 58 can directly contact the protection layer 54 and the separation layer 56. In other words, the first surface 581 (lower surface) of the barrier layer 58 is connected to the protective layer 54, and the second surface 582 (upper surface) opposite to the first surface 581 is connected to the separating layer 56. The barrier layer 58 prevents chemical substances from penetrating into the gap 62 between the protective layer 54 and the separation layer 56, and prevents chemical substances from contacting the exposed wires 60.

請參閱第6圖,第6圖為本發明第五實施例之鍵盤電路板50’沿第1圖所示剖面線B-B’之局部示意圖。第五實施例中,與第四實施例具有相同編號之元件具有相同的結構與功能,於此不再重複說明。第四實施例的鍵盤電路板50將阻隔層58設置在相互堆疊的保護層54與分隔層56之間。與前揭實施例不同的是,第五實施例的鍵盤電路板50’將阻隔層58’設置在保護層54與分隔層56之間的水平交會處,意即阻隔層58’直接覆蓋導線60的裸露部份。阻隔層58’之第一表面 581’(側表面)直接連接保護層54,第二表面582’(另一側表面)連接分隔層56。因此,阻隔層58’能有效防止化學物質經由縫隙62觸及導線60。阻隔層58’可為紫外線塗層(ultraviolet coating)。 Please refer to FIG. 6, which is a partial schematic diagram of the keyboard circuit board 50' of the fifth embodiment of the present invention along the section line B-B' shown in FIG. In the fifth embodiment, the elements with the same number as the fourth embodiment have the same structure and function, and the description will not be repeated here. In the keyboard circuit board 50 of the fourth embodiment, the barrier layer 58 is disposed between the protective layer 54 and the separation layer 56 stacked on each other. Different from the previous embodiment, the keyboard circuit board 50' of the fifth embodiment has the barrier layer 58' arranged at the horizontal intersection between the protective layer 54 and the separation layer 56, which means that the barrier layer 58' directly covers the wires 60 The bare part. The first surface of barrier layer 58' The 581' (side surface) is directly connected to the protective layer 54, and the second surface 582' (the other side surface) is connected to the separation layer 56. Therefore, the barrier layer 58' can effectively prevent chemical substances from reaching the wire 60 through the gap 62. The barrier layer 58' may be an ultraviolet coating (ultraviolet coating).

請參閱第7圖,第7圖為本發明第六實施例之鍵盤電路板70沿第1圖所示剖面線B-B’之局部示意圖。鍵盤電路板70可包含有基板72、導線74、保護層76、覆蓋層78、阻隔層80以及分隔層82。導線74形成於基板72之表面(不限於上表面或下表面)。保護層76設置在部份的導線74上。覆蓋層78係部份位於導線74上,且另一部份覆蓋於保護層76。分隔層82選擇性地設置在覆蓋層78與導線74及保護層76之間,因此分隔層82可以部份貼附導線74,且另一部份貼附保護層76。基板72與保護層76因交疊而有高度段落,故保護層76與覆蓋層78之間會形成縫隙84。導線74會經由縫隙而部份裸露。 Please refer to FIG. 7, which is a partial schematic diagram of the keyboard circuit board 70 of the sixth embodiment of the present invention along the section line B-B' shown in FIG. 1. The keyboard circuit board 70 may include a substrate 72, wires 74, a protective layer 76, a cover layer 78, a barrier layer 80, and a separation layer 82. The wire 74 is formed on the surface of the substrate 72 (not limited to the upper surface or the lower surface). The protective layer 76 is provided on part of the wire 74. The covering layer 78 is partly located on the wire 74 and the other part is covering the protective layer 76. The separation layer 82 is selectively disposed between the cover layer 78 and the wires 74 and the protective layer 76, so the separation layer 82 can partially attach the wires 74 and the other portion of the protective layer 76. Since the substrate 72 and the protective layer 76 overlap, there is a height section, so a gap 84 is formed between the protective layer 76 and the covering layer 78. The wire 74 is partially exposed through the gap.

為了避免化學物質從保護層76與覆蓋層78之間縫隙84滲入,鍵盤電路板70係將阻隔層80連續性地覆蓋在覆蓋層78和保護層76上,意即縫隙84與外界相同的途徑已為阻隔層80與保護層76之交疊、及覆蓋層78與保護層76之交疊而閉合。因此,鍵盤電路板70的阻隔層80能有效減少或防止化學物質滲入縫隙84而侵蝕導線74。 In order to prevent chemical substances from penetrating from the gap 84 between the protective layer 76 and the cover layer 78, the keyboard circuit board 70 continuously covers the barrier layer 80 on the cover layer 78 and the protective layer 76, which means that the gap 84 is in the same way as the outside. It has been closed for the overlap of the barrier layer 80 and the protective layer 76 and the overlap of the cover layer 78 and the protective layer 76. Therefore, the barrier layer 80 of the keyboard circuit board 70 can effectively reduce or prevent chemical substances from penetrating into the gap 84 and corroding the wires 74.

請參閱第8圖至第10圖,第8圖為本發明另一實施例之鍵盤電路板90之外觀示意圖,第9圖為第8圖所示區域C之部份放大結構圖,第10圖為第8圖所示鍵盤電路板80沿剖面線D-D’之局部示意圖。鍵盤電路板90可包含有基板92、導線94、阻隔層96、遮蔽層98以及填充材料100。導線94形成於基板92上。阻隔層96設置在基板92、且位於導線94和基板92的外緣102之間。較佳實施態樣下, 鍵盤電路板90可具有多個阻隔層96,分設在導線94之數個相對側、或是設置在導線94周圍易受化學物質侵蝕的特定側。遮蔽層98位於導線94與阻隔層96的上方。填充材料100填充在基板92和遮蔽層98之間的縫隙。鍵盤電路板90具有孔洞104。鍵盤電路板90進行硫化測試時,穿越孔洞104的化學物質會對開關106及相關導線94造成威脅。 Please refer to Figs. 8-10. Fig. 8 is a schematic diagram of the appearance of a keyboard circuit board 90 according to another embodiment of the present invention. Fig. 9 is a partial enlarged structural view of area C shown in Fig. 8, and Fig. 10 It is a partial schematic diagram of the keyboard circuit board 80 shown in FIG. 8 along the section line D-D'. The keyboard circuit board 90 may include a substrate 92, wires 94, a barrier layer 96, a shielding layer 98 and a filling material 100. The wire 94 is formed on the substrate 92. The barrier layer 96 is disposed on the substrate 92 and between the wire 94 and the outer edge 102 of the substrate 92. Under the preferred implementation, The keyboard circuit board 90 may have a plurality of barrier layers 96, which are separately arranged on several opposite sides of the wires 94, or arranged on specific sides around the wires 94 that are easily corroded by chemicals. The shielding layer 98 is located above the wire 94 and the barrier layer 96. The filling material 100 fills the gap between the substrate 92 and the shielding layer 98. The keyboard circuit board 90 has a hole 104. When the keyboard circuit board 90 is undergoing a vulcanization test, the chemicals passing through the hole 104 will threaten the switch 106 and the related wires 94.

如第9圖與第10圖所示,阻隔層96圍繞在導線94的周圍,作為阻擋化學物質進入外緣102後的屏障。阻隔層96的高度、寬度與形狀不限於此實施例所示,端視設計需求而定。阻隔層96既能止擋化學物質,同時間也能與化學物質作用以消耗其單位氣體含量。從第9圖可看出,阻隔層96靠近外緣102的一側受化學物質侵蝕而發生質變(以網格狀花紋表示之),阻隔層96靠近導線94的另一側不受化學物質影響,故能有效避免化學物質自外緣102進入基板92而侵蝕導線94或開關106。 As shown in FIGS. 9 and 10, the barrier layer 96 surrounds the wire 94 as a barrier to prevent chemical substances from entering the outer edge 102. The height, width, and shape of the barrier layer 96 are not limited to those shown in this embodiment, and depend on design requirements. The barrier layer 96 can not only stop the chemical substance, but also interact with the chemical substance at the same time to consume its unit gas content. It can be seen from Figure 9 that the side of the barrier layer 96 close to the outer edge 102 is corroded by chemical substances and undergoes qualitative change (indicated by a grid pattern), and the other side of the barrier layer 96 close to the wire 94 is not affected by the chemical substances Therefore, it can effectively prevent chemicals from entering the substrate 92 from the outer edge 102 to corrode the wire 94 or the switch 106.

綜上所述,本發明的鍵盤電路板根據導線與導電層、保護層、分隔層和/或覆蓋層的相對位置關係,將阻隔層設置在裸露導線與外界相通的途徑上。雖然導電層與保護層之堆疊、或保護層與分隔層之堆疊、或保護層與覆蓋層之堆疊已封閉裸露導線與外界相通途徑,化學物質仍可能會經由些許縫隙觸及導線,故本發明的鍵盤電路板利用阻隔層提供多重防護,可以有效阻擋化學氣體滲入侵蝕導線。 To sum up, the keyboard circuit board of the present invention arranges the barrier layer on the path through which the exposed wires communicate with the outside according to the relative positional relationship between the wires and the conductive layer, the protective layer, the separation layer and/or the covering layer. Although the stack of the conductive layer and the protective layer, or the stack of the protective layer and the separation layer, or the stack of the protective layer and the cover layer has closed the exposed wire from communicating with the outside, the chemical substance may still touch the wire through some gaps, so the present invention The keyboard circuit board uses a barrier layer to provide multiple protections, which can effectively prevent chemical gases from penetrating and corroding wires.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

10:鍵盤電路板 10: Keyboard circuit board

12:基板 12: substrate

14:導電層 14: conductive layer

16:保護層 16: protective layer

18:絕緣層 18: Insulation layer

20:阻隔層 20: barrier layer

201:阻隔層的第一表面 201: The first surface of the barrier layer

202:阻隔層的第二表面 202: The second surface of the barrier layer

22:導線 22: Wire

24:縫隙 24: gap

Claims (13)

一種可減緩化學侵蝕影響的鍵盤電路板,其包含有:一基板;一導電層,位於該基板上;一保護層,部份之該保護層位於該基板上,且另一部份之該保護層覆蓋該導電層;以及一阻隔層,具有相對的一第一表面與一第二表面,該第一表面連接該導電層,且該第二表面連接該保護層,防止化學物質滲入該導電層與該保護層之間的一縫隙。 A keyboard circuit board capable of mitigating the effects of chemical corrosion, comprising: a substrate; a conductive layer on the substrate; a protection layer, part of the protection layer is on the substrate, and another part of the protection A layer covering the conductive layer; and a barrier layer having a first surface and a second surface opposite to each other, the first surface is connected to the conductive layer, and the second surface is connected to the protective layer to prevent chemicals from penetrating into the conductive layer A gap with the protective layer. 如請求項1所述之鍵盤電路板,另包含有:一導線,形成於該基板,該導電層與該保護層經由該導線設置在該基板上,該阻隔層係防止該化學物質觸及該導線。 The keyboard circuit board of claim 1, further comprising: a wire formed on the substrate, the conductive layer and the protective layer are disposed on the substrate via the wire, and the barrier layer prevents the chemical substance from touching the wire . 如請求項1所述之鍵盤電路板,另包含有:一絕緣層,設置在該導電層與該阻隔層之間。 The keyboard circuit board according to claim 1, further comprising: an insulating layer disposed between the conductive layer and the barrier layer. 如請求項3所述之鍵盤電路板,其中該阻隔層具有傳導特性,該絕緣層置於該導電層與該阻隔層之間以避免短路。 The keyboard circuit board according to claim 3, wherein the barrier layer has conductive properties, and the insulating layer is placed between the conductive layer and the barrier layer to avoid short circuits. 如請求項1所述之鍵盤電路板,其中該阻隔層係與該化學物質作用,減少該化學物質滲入該縫隙的劑量。 The keyboard circuit board according to claim 1, wherein the barrier layer acts on the chemical substance to reduce the amount of the chemical substance that penetrates into the gap. 一種可減緩化學侵蝕影響的鍵盤電路板,其包含有:一基板;一保護層,位於該基板上;一分隔層,部份之該分隔層位於該基板上,且另一部份之該分隔層覆蓋該保護層;以及一阻隔層,具有相對的一第一表面與一第二表面,該第一表面連接該保護層,且該第二表面連接該分隔層,防止化學物質滲入該保護層與該分隔層之間的一縫隙。 A keyboard circuit board capable of mitigating the effects of chemical erosion, comprising: a substrate; a protective layer on the substrate; a separation layer, part of the separation layer is on the substrate, and another part of the separation A layer covering the protective layer; and a barrier layer having a first surface and a second surface opposite to each other, the first surface is connected to the protective layer, and the second surface is connected to the separation layer to prevent chemical substances from penetrating into the protective layer A gap between the separation layer. 如請求項6所述之鍵盤電路板,另包含有:一導線,形成於該基板,該保護層與該分隔層經由該導線設置在該基板上,該阻隔層係防止該化學物質觸及該導線。 The keyboard circuit board according to claim 6, further comprising: a wire formed on the substrate, the protective layer and the separation layer are disposed on the substrate via the wire, and the barrier layer prevents the chemical substance from touching the wire . 如請求項6所述之鍵盤電路板,其中該保護層與該分隔層由非導電材質製作。 The keyboard circuit board according to claim 6, wherein the protective layer and the separation layer are made of non-conductive materials. 一種可減緩化學侵蝕影響的鍵盤電路板,其包含有:一基板,具有一外緣;一導線,形成於該基板上;以及一阻隔層,設置在該基板,且位於該外緣和該導線之間,阻擋化學物質自該外緣進入該基板而觸及該導線。 A keyboard circuit board capable of mitigating the effects of chemical corrosion, comprising: a substrate having an outer edge; a wire formed on the substrate; and a barrier layer disposed on the substrate and located between the outer edge and the wire In between, the chemical substance is prevented from entering the substrate from the outer edge to touch the wire. 如請求項9所述之鍵盤電路板,其中該鍵盤電路板另包含至少二阻隔層,分別位於該導線之二相對側。 The keyboard circuit board according to claim 9, wherein the keyboard circuit board further includes at least two barrier layers, respectively located on two opposite sides of the wire. 如請求項9所述之鍵盤電路板,另包含有:一遮蔽層,位於該導線與該阻隔層之上方;以及一填充材料,設置在該基板與該遮蔽層之間的一縫隙。 The keyboard circuit board according to claim 9, further comprising: a shielding layer located above the wire and the barrier layer; and a filling material provided in a gap between the substrate and the shielding layer. 一種可減緩化學侵蝕影響的鍵盤電路板,其包含有:一基板;一導線,形成於該基板上;一保護層,設置在部份之該導線上;一覆蓋層,部份之該覆蓋層位於該導線上,且另一部份之該覆蓋層覆蓋該保護層;以及一阻隔層,連續性地覆蓋在該覆蓋層與該保護層,防止化學物質滲入該保護層與該覆蓋層之間的一縫隙。 A keyboard circuit board capable of mitigating the effects of chemical corrosion, comprising: a substrate; a wire formed on the substrate; a protective layer arranged on a part of the wire; a covering layer and a part of the covering layer The covering layer is located on the wire and another part of the covering layer covers the protective layer; and a barrier layer continuously covers the covering layer and the protective layer to prevent chemical substances from penetrating between the protective layer and the covering layer Of a gap. 如請求項12所述之鍵盤電路板,另包含有:一分隔層,設置在該導線與該覆蓋層之間。 The keyboard circuit board according to claim 12 further includes: a separation layer arranged between the wire and the covering layer.
TW107132580A 2018-09-17 2018-09-17 Keyboard circuit board capable of preventing chemical erosion TWI707610B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW477446U (en) * 2000-07-19 2002-02-21 Mitac Technology Corp Waterproof keyboard

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW477446U (en) * 2000-07-19 2002-02-21 Mitac Technology Corp Waterproof keyboard

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