TWI707229B - Test method for built-in memory of computer device - Google Patents

Abstract

A test method for a built-in memory of a computer device includes: testing the built-in memory by a test function of a basic input/output system (BIOS) of the computer device to create a data file; perfroming an analysis application by a testing device to analyze the data file; and according to analyzing the data file, determining whether a malfunction memory chip exists in the built-in memory. The data file includes tested datas of memory chips in the built-in memory.

Description

Method for detecting built-in memory of computer device

The present disclosure relates to a detection method, especially to a detection method for testing the built-in memory.

Basic input/output system (basic input/output system: BIOS) is an interface used to communicate between computer hardware and the operating system. Especially when the computer is turned on, the BIOS is used to correctly initialize the hardware devices in the computer, so that these hardware devices can be used normally after the operating system is enabled.

When a malfunctioning hardware device in the computer prevents the computer from turning on normally, the BIOS will sound a warning sound to notify the user. Computer testing personnel then use special debugging BIOS to test the computer to find out the problem, which includes many steps and manual replacement of hardware.

In order to solve the above problems, some aspects of the present disclosure are to provide a detection method for detecting the built-in memory in a computer device, wherein the detection method includes: using a basic input/output system in the computer device system, BIOS) to test the built-in memory to create a data file; run an analysis program through the test device to analyze the data file; and based on the analysis of the data file, determine whether there is abnormal memory in the built-in memory Wafer. The data file contains multiple test data of multiple memory chips in the built-in memory.

The following is a detailed description of embodiments in conjunction with the accompanying drawings, but the specific embodiments described are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention, and the description of structural operations is not intended to limit its execution. The order, any structure of recombination of components, to produce a device with equal effect, is the scope covered by the disclosure of the embodiments of the present invention.

Refer to Figure 1. FIG. 1 is a schematic diagram of a computer system 10 according to some embodiments of the present disclosure. In some embodiments, the computer system 10 is used to execute the test method shown in FIG. 2 and FIG. 3, and the test method will be discussed later with reference to FIG. 2 and FIG. 3.

As shown in FIG. 1, the computer system 10 includes a computer device 100 and a test device 100A. The testing device 100A is coupled to the computer device 100. In some embodiments, the computer device 100 includes a motherboard 120 and a basic input/output system (BIOS) device 140. In some embodiments, the BIOS device 140 is built into the motherboard 120. In some embodiments, the motherboard 120 further includes a built-in memory 122, a test port 124, and a speaker 126.

In some embodiments, the testing device 100A is coupled to the motherboard 120 in the computer device 100. In some embodiments, the testing device 100A is coupled to the testing port 124 in the motherboard 120. In some embodiments, the BIOS device 140 is connected to the test port 124 in the motherboard 120.

In some embodiments, the computer device 100 is a personal computer. In normal use, the computer device 100 is turned on by enabling the motherboard 120 by the BIOS device 140. If there is a malfunctioning component in the motherboard 120 (for example, the malfunctioning built-in memory 122), the computer device 100 fails to turn on. In some embodiments, if the components on the motherboard 120 are defective (for example, the capacitor on the circuit board is damaged), the components will not function properly and the computer device 100 will fail to turn on. In other embodiments, the components on the motherboard 120 are not installed correctly (for example, the solder is cracked), which will cause the components to function abnormally and cause the computer device 100 to fail to turn on.

In some embodiments, if the computer device 100 fails to turn on, the test device 100A is used to couple to the computer device 100, and the computer device 100 is turned on by the test device 100A. In other words, when the computer device 100 is in normal use, the test device 100A does not need to be turned on.

In some embodiments, the testing device 100A tests the computer device 100 through the testing port 124. The testing device 100A is a device that can execute a program, such as another computer device.

In some embodiments, the motherboard 120 further includes a plurality of slots for installing a central processing unit, a graphics card, a hard disk drive, etc. (not shown). In some embodiments, the motherboard 120 is composed of a circuit and the components on the motherboard 120 are connected by the circuit.

In some embodiments, the built-in memory 122 is used to store the program codes used when the computer device 100 is turned on. The built-in memory 122 is a hardware component (on board memory) directly installed on the motherboard 120. The built-in memory 122 is directly electrically welded on the motherboard 120, which has the characteristic that it cannot be easily replaced manually. To repair the built-in memory 122 on the motherboard 120, it takes a lot of time and work cost to dissolve the solder of the built-in memory 122 soldered on the motherboard 120, and then solder the new memory back to the motherboard. 120. In other embodiments, the built-in memory 122 includes dual channels. Each channel contains multiple memory chips. In some embodiments, the memory chip is a dynamic random access memory (DRAM) chip, such as double data rate synchronous dynamic random access memory (DDR SDRAM). Wafer. The above-mentioned configuration of the built-in memory 122 is for example purposes only, and various configurations of the built-in memory 122 are within the scope of the content of this disclosure. For example, the built-in memory 122 includes three or more channels.

In some embodiments, the test port 124 is an input/output port (I/O port), which is used to debug possible errors in the motherboard 120. The test port 124 includes a plurality of I/O pins. In some embodiments, the test port 124 is a general purpose input output (GPIO) port, which includes a plurality of GPIO pins for receiving and/or outputting signals, such as receiving clock signals. In some embodiments, with the GPIO pins, the user can freely control the motherboard 120 with existing or customized programs.

In some embodiments, the BIOS device 140 is used as a firmware interface. When the computer device 100 is turned on, the BIOS device 140 is used to execute a power on self test (POST), which is also called a power on self test. When the BIOS device 140 executes POST, the BIOS device 140 detects the devices on the computer device 100 to ensure the normal operation of each device. In other embodiments, when there is a malfunctioning device on the computer device 100, the BIOS device 140 is used to generate a warning signal, for example, the speaker 126 generates a warning sound. In other words, when the computer device 100 cannot be successfully turned on, the BIOS system 140 will generate a warning signal to notify the user.

In some embodiments, the BIOS system 140 is further used to load an operating system (OS) or an initial program loader (IPL) stored in the motherboard 120 after the computer device 100 is successfully turned on.

In some embodiments, the BIOS system 140 includes a built-in detection function code 142. The built-in detection function program code 142 is used to store a detection function program. In some embodiments, the testing device 100A is used to enable the testing function program in the built-in testing function code 142, and the testing function program is used to check whether there is a memory chip that is malfunctioning in the built-in memory 122. When the detection function program is executed, a data file D of information about the built-in memory 122 is created. When the test function program is executed, the test device 100A retrieves the data file D through the test port 124. The data file D contains the measurement data of each memory chip in the built-in memory 122. In some embodiments, the data file D is in a plain text format, such as a .txt format.

Refer to Figure 2. FIG. 2 is a flowchart of a detection method 200 for the computer system 10 in FIG. 1 according to some embodiments of the present disclosure. For the purpose of simplification and clarity, the inspection method 200 will be discussed with reference to the component numbers shown in Figure 1. As shown in Fig. 2, the detection method 200 includes operations S201, S202, S203, and S204. Because the built-in memory 122 cannot be easily replaced manually, the detection method 200 is used to perform detection without replacing the built-in memory 122.

In operation S201, the detection function program in the BIOS device 140 is activated by the test device 100A. The testing device 100A enables the testing function program to be executed through the testing port 124.

In operation S202, the detection function program tests the built-in memory 122 on the motherboard 120, and retrieves detection information of the built-in memory 122. Then, a data file D is created based on the detection information of the built-in memory 122.

In some embodiments, when the test function program tests the built-in memory 122, each memory chip in each channel in the built-in memory 122 is tested. In some embodiments, the reaction voltage of the memory chip is tested and recorded as part of the data file D. In some embodiments, the reaction voltage of the memory chip is the voltage across the memory chip itself under normal operating voltage. For example, in the write mode (WRITE), the memory chip reflects its own cross pressure. Or for example, in the read mode (READ), the memory chip reflects its own cross pressure.

In some embodiments, each memory chip is tested multiple times under different test conditions. For example, the test function program uses nine different test conditions to test each memory chip, so each memory chip has 9 measurement data. .

In operation S203, the test device 100A reads the data file D through the test port 124, and starts an analysis program stored in the test device 100A.

In some embodiments, the analysis program is stored in the BIOS device 140, and the test device 100A is used to enable the analysis program to execute the functions of the program. The location where the above analysis program is stored is for illustration only. Various devices used to store and execute analysis programs are within the consideration and scope of this disclosure document.

In operation S204, the data file D is analyzed by the analysis program to check the status of each memory chip in the built-in memory 122.

The detection method 200 shown in FIG. 2 is only an example, but the disclosure document is not limited to this. Various detection methods 200 are within the scope of this disclosure document.

Refer to Figure 3. FIG. 3 is a detailed flowchart of the detection method 200 in FIG. 2 according to some embodiments of the present disclosure. As shown in FIG. 3, the detection method 300 includes operations S301, S302, S303, S304, S305, S306, S307, S308, S309, 310, and S311. In some embodiments, the testing method 300 is a detailed flowchart of operation S204. In order to understand the present disclosure in a better way, the testing method 300 will be discussed in conjunction with the embodiments in FIG. 1 and FIG. 2, but the present disclosure is not limited thereto.

In operation S301, the testing device 100A executes an analysis program to find the first character string among a plurality of character strings in the data file D. In some embodiments, if the data file D includes the first string representation, it means that the data file D indicates that the built-in memory 122 has a memory chip that is not functioning properly.

In operation S302, it is determined whether the first character string is found in the data file D. As shown in Figure 3, if the first character string is not found, operation S303 is executed. Conversely, if the first character string is found, operation S304 is executed.

In operation S303, the analysis program does not find the first string, and the test device 100A uses a display device (not shown) to display that the built-in memory 122 of the computer device 100 does not have a memory chip with abnormal functions. In some embodiments, the testing device 100A itself has a display screen to display the test results.

In operation S304, the memory information listed after the first string is searched according to the found first string. The memory information listed after the first string is the measurement data of the memory chip. After the measurement data of the memory chip is found, the measurement data of the memory chip is compared with a preset value. In some embodiments, the preset value represents the electrical margin of the memory chip, and is used to indicate the boundary of the physical characteristics (such as response voltage) of the memory chip during operation or under test.

In operation S305, it is determined whether the measurement data of each memory chip is greater than a preset value. As shown in FIG. 3, if the measurement data of the memory chip is not greater than the preset value, operation S306 is executed. If the measurement data of the memory chip is greater than the preset value, operation S307 is executed.

In operation S307, when the measurement data of the memory chip is greater than the preset value, the memory chips are classified as normal memory chips, and the measurement data of these normal memory chips are established in the first part of the analysis program. One data area.

In operation S306, when the measurement data of the memory chip is not greater than the preset value, the memory chips are classified as possible abnormal memory chips, and the measurement data of these possibly abnormal memory chips are established in The second data area in the analysis program.

In some embodiments, a single memory chip obtains multiple sets of measurement data after multiple sets of test conditions are tested in operation S204. In operation S308, count the number of measurement data of the memory chips that may be abnormal that are not greater than a preset value, and determine whether the number of times is greater than a preset number. For example, in operation S305, a memory chip has 9 sets of measurement data, of which at least one set of measurement data is not greater than a preset value. Therefore, the memory chip is classified as a memory chip that may be abnormal, and the operation In S308, 5 of the 9 sets of measurement data in the memory chip are not greater than the preset value, so the number of times the memory chip is greater than the preset value is recorded as 5 times, and it is determined whether the 5 times are greater than the preset number. If the number of times recorded by the memory chip is greater than the preset number, it is determined that the memory chip is a malfunctioning memory chip. If the number of times recorded by the memory chip is not greater than the preset number, it is determined that the memory chip is a functional memory chip. In other words, when a memory chip is to be judged to be malfunctioning, the memory chip must have abnormal measurement data exceeding a predetermined number of times.

As shown in FIG. 3, if the number of times recorded by the memory chip is greater than the preset number, operation S309 is executed. If the number of records of all possible abnormal memory chips is not greater than the preset number, operation S311 is executed.

In operation S309, according to a location file of the built-in memory 122, the physical locations of the malfunctioning memory chip in the built-in memory 122 are respectively searched.

In operation S310, the memory chips are repaired according to the physical location. When the position of the malfunctioning memory chip is determined, the memory chip is unsoldered away from the built-in memory 122. In some embodiments, the new memory chip is re-soldered back to the internal memory 122 to maintain the number of memory chips in the internal memory 122.

In some related technologies, when testing the memory of a computer, a tester first replaces the BIOS in the computer, replaces it with a debugging BIOS specially used for testing the computer, and then tests the computer according to the functions in the debugging BIOS. After the test is over, replace the original BIOS back to the computer. Testers must spend the time cost of replacing hardware devices to achieve the purpose of testing.

Compared with the above-mentioned related technology, based on the content of the present disclosure, the computer device 100 can be tested by the detection function program on the BIOS device 140 without replacing the BIOS device 140, and then by the analysis program in the test device 100A , You can directly find the memory chip in question, narrowing the scope of debugging, from the entire built-in memory 122 to a single memory chip in the channel in the built-in memory. Therefore, the time of replacing the hardware manually is saved, and the efficiency of the test is improved. For example, the process of desoldering and electric welding the built-in memory 122 and the BIOS device 140 is reduced.

In operation S311, the state of the built-in memory 122 is recorded. After operation S303, because the memory is not damaged, the built-in memory 122 is recorded as requiring no maintenance. After operation S307, the memory chips classified as normal are recorded as not requiring maintenance. After operation S308, the number of times that the memory chips are recorded does not exceed the preset number of times, so it is recorded that the memory chips do not require maintenance. After the operation S310, because the memory chips with abnormal functions are repaired, the memory chips are recorded as repaired.

The above description of the test method 300 includes exemplary operations, but these operations of the test method 300 need not be executed in the order shown. The sequence of the operations of the test method 300 can be changed, or the operations can be performed simultaneously, partially performed simultaneously, or omitted under appropriate circumstances, all within the spirit and scope of the embodiments of the present disclosure. For example, after operation S309, the computer device 100 generates different sounds or indicator lights according to the position of the memory chip that is not functioning properly to indicate the location of the memory chip that is not functioning properly. Or for example, operation S311 may be omitted.

Refer to Figure 4A and Figure 4B. FIG. 4A is a schematic diagram of a data file 400A according to some embodiments of the present disclosure. FIG. 4B is a schematic diagram of a location file 400B according to some embodiments of the present disclosure. In order to understand the present disclosure in a better way, FIGS. 4A and 4B will be discussed in conjunction with the embodiments of FIGS. 1 to 3, but the present disclosure is not limited thereto.

In some embodiments, the data file 400A is part of the data file D. The data file 400A is a part of the data file D that includes the first string and the measurement data of the built-in memory 122. As shown in FIG. 4A, the dashed frame 401 indicates the first string in the data file 400A. In this example, the first string is "Measure Eye Width, per BYTE, at ALL (2D) Timing Points-RandBitMask=0x3". In operation S301, when the analysis program finds the first string, the information listed after the first string is the measurement data of the built-in memory 122.

As shown in FIG. 4A, the dashed frame 402 indicates the measurement data in the data file 400A that is not greater than the preset value. In this example, the default value is "5-5", and the measurement data in the dashed box 402 is not greater than "5-5". In operations S304 and S305, the data file 400A indicates that the memory chip 6 (Byte6) in channel 1 of the built-in memory 122 is a possible abnormal memory chip. Other memory chips are classified as functional memory chips because they have no measurement data that is not greater than the preset value.

Continue to refer to Figure 4A. The dashed box 402 contains 9 sets of measurement data, which are not greater than the preset value. In operation S308, 9 times of the measurement data of the memory chip 6 of the channel 1 are not greater than the preset value, so the number of times is recorded as 9. Then compare with the preset number of times. In this example, the preset number of times is 6, and the number of times recorded by the memory chip 6 of channel 1 is greater than 6, so the memory chip 6 of channel 1 is classified as a memory chip with abnormal functions.

Refer to Figure 4B. The location file 400B contains channel and location information of the memory chip. The dashed frame 403 and the dashed frame 404 indicate that the malfunctioning memory chip 6 (Byte 6) obtained in the data file 400A corresponds to the physical location in the location file 400B. In this example, the location of the memory chip 6 is "CHIP U4102". In operation S310, the memory chip located at this position in the built-in memory 122 is repaired according to the "CHIP U4102" indicated by 400B.

The data file 400A and the location file 400B in FIGS. 4A and 4B are for illustrative purposes only. Various data files 400A and location files 400B are within the consideration and scope of this disclosure.

In some embodiments, the present disclosure provides a detection method for detecting the built-in memory in a computer device, where the detection method includes: testing the built-in memory to create a data file through the detection function of the BIOS in the computer device; Analyze the data file by executing the analysis program by the test device; and determine whether there is a memory chip with abnormal function in the built-in memory based on the analysis data file. The data file contains multiple test data of multiple memory chips in the built-in memory.

Although the embodiment of the present invention has been disclosed as above, it is not intended to limit the embodiment of the present invention. Anyone familiar with the art can make some changes and modifications without departing from the spirit and scope of the embodiment of the present invention. Therefore, The protection scope of the embodiments of the present invention shall be defined as the scope of the patent application attached hereafter.

10: Computer system 100: Computer device 100A: Test device 120: Motherboard 122: Built-in memory 124: test port 126: Horn 140: BIOS device 142: Built-in detection function code D: Data file 200, 300: Methods S201, S202, S203, S204, S301, S302, S303, S304, S305, S306, S307, S307, S308, S309, S310, S311: Operation 400A: Data file 400B: Location file 401, 402, 403, 404: dotted frame

The present disclosure can be understood more fully by reading the following detailed description of the embodiments, with reference to the accompanying drawings as follows: Figure 1 is a schematic diagram of a computer system drawn according to some embodiments of the present disclosure; Figure 2 is a basis Some embodiments of this disclosure show a flowchart of the detection method used in the computer system in Figure 1; Figure 3 is a detail of the detection method shown in Figure 2 according to some embodiments of this disclosure Flow chart; Figure 4A is a schematic diagram of a data file according to some embodiments of the present disclosure; and Figure 4B is a schematic diagram of a location file according to some embodiments of the present disclosure.

300: method

S301, S302, S303, S304, S305, S306, S307, S308, S309, S310, S311: Operation

Claims (6)

A detection method for detecting a built-in memory in a computer device, wherein the detection method includes: using a detection function of a basic input/output system (BIOS) in the computer device, Test the built-in memory to create a data file; run an analysis program by a test device to analyze the data file; and based on the analysis of the data file, determine whether there is a memory that is malfunctioning in the built-in memory Chip, wherein the data file includes a plurality of test data of a plurality of memory chips in the built-in memory, wherein testing the built-in memory to create the data file includes: respectively the memories in the built-in memory The chip executes a plurality of tests to generate the test data, wherein the tests are executed to measure a reaction voltage of the memory chips, and the reaction voltage of the memory chips is recorded as the test data. The detection method according to claim 1, further comprising: repairing the memory chip if there is a memory chip with abnormal function in the built-in memory. The detection method according to claim 1, wherein by the The test device executes the analysis program to analyze the data file including: searching for a first character string in the data file; comparing the test data with a preset value according to the first character string; and separately counting the memories The measured data of the chip is less than the predetermined value by an amount. The detection method according to claim 3, wherein determining whether there is a malfunctioning memory chip in the built-in memory includes: the number of measured data of the memory chips is less than the preset value And a predetermined number of times; and the memory chips corresponding to more than the predicted number of times are judged to be malfunctioning. The detection method according to claim 4, further comprising: according to a location file of the built-in memory, respectively searching for a position of the malfunctioning memory chips in the built-in memory; and according to the Desoldering the memory chips at the positions of the memory chips. The detection method according to claim 1, further comprising: if there is no malfunctioning memory chip in the built-in memory, the test device shows that the built-in memory of the computer device is functional.

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